JPH052177A - Liquid crystal manufacturing device - Google Patents

Abstract

PURPOSE:To securely fix TABs to all liquid crystal panels by performing adequate fitting control, TAB by TAB, even when the number of TABs increases as the liquid crystal panels become large. CONSTITUTION:The liquid crystal module manufacturing device consists of a setting station 100 which sets the liquid crystal panel at a reference position on the suction part jig of a conveyance body, a temporary press fitting station 300 which fix plural TABs at the specific positions of the liquid crystal panel in order temporarily, a main press fitting station 500 which fixes the TABs of the liquid crystal panel finally at the same time, and a station 700 which takes the liquid crystal out after the TABs are already fixed; and the press fitting head of the main press fitting station is divided into parts as many as the TABs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal module manufacturing apparatus, and more particularly to a TAB mounting apparatus for a liquid crystal panel.

[0002]

2. Description of the Related Art As shown in FIG. 2, a liquid crystal panel 10 has a structure in which an upper glass plate 12 and a lower glass plate 1 are arranged one above the other.
4 are formed with pixel electrodes aligned in the X-axis and Y-axis directions, and signal input connection terminals 16 are connected to the X and Y sections of each pixel electrode on the periphery of the mating surfaces of the upper and lower glass plates. Are provided on the mating surfaces of the upper and lower glass plates at a predetermined pitch. A TAB (Tape Au) in which the connection terminal 21 is provided on the connection terminal via an anisotropic adhesive sheet
Heated by applying heat and pressure from a plurality of TABs 20 arranged side by side with a heating and pressurizing member called a hitter chip, which is called a "tomated bonding" and having flexible films 20 each having a size of several centimeters square. The connection terminals 16 and 21 are connected by crimping. The TAB 20 is a signal electrode or drive electrode drive circuit 2 including a wiring 22 and a connection terminal 21 which are printed and printed on a flexible film by a usual method and an LSI.
3 is stacked, and the anisotropic adhesive sheet is made by molding a resin in which metal particles such as solder, copper and gold are dispersed into a film shape, and heating the overlapped portions as described above. When the pressure is applied, the pressing force is increased between the connection terminal 16 protruding on the lower plate glass 14 and the connection terminal 21 protruding on the TAB surface, and the metal particles dispersed between the resins are mutually discharged. They are in contact with each other to obtain electrical conduction.

In order to properly perform the joining using such means, it is necessary to accurately control the heat and pressure applied to the joining portion and the positions of the upper and lower terminals. Recently, as the applications of liquid crystal panels have expanded, the liquid crystal panels have been required to be larger and have higher densities. Accordingly, the number of connection terminals has become extremely large, and the terminals are required to have a small terminal interval. The density of TA is an external connector
The number of B is also increasing, and various problems occur in its mounting.

That is, as the size of the liquid crystal panel increases, T
The length of the heater chip that heat-bonds the AB also becomes long, making it difficult to maintain temperature uniformity and linearity over the entire length. Furthermore, there are variations in parts due to uneven film thickness. It was difficult to apply uniform heat and pressure to all the TABs using one heater chip, and it was difficult to join the terminals accurately.

A glass plate 12 placed on the liquid crystal
When the line U around the lower plate glass and the line L around the lower plate glass 14 are not arranged exactly in parallel, the widths of the terminal portions are different at both ends of the liquid crystal panel, and if the line L is the setting criterion of the liquid crystal panel. However, there is a possibility that a part of the heater chip in the crimping process may get on the upper glass and damage the panel or fail in joining.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems in manufacturing the conventional liquid crystal panel described above,
It provides a means for making an accurate connection.

[0007]

In order to solve the above-mentioned problems, the present invention sets the length of the heater chip of the manufacturing apparatus to TA.
It is divided into a plurality of crimping head portions having a size slightly exceeding the length of B, and each crimping head portion of each heater chip is provided with an independent power source, expansion transmission mechanism, and horizontal adjusting means so that fine adjustment can be performed. To address the above problems. Further, in manufacturing, the liquid crystal panel is positioned by using the end portion of the glass placed on the upper side, thereby avoiding the problem caused by the rotational displacement of the upper and lower glass. An object of the present invention is to mount a plurality of respective crimping head portions on one fixed substrate (setting plate) and replace the fixed substrate so that the plurality of crimping heads can be exchanged at once, and different standards can be set. It will be possible to easily deal with the manufacturing of the liquid crystal panel. Further, another object of the present invention is to provide a device capable of accurately and easily aligning the terminal portion of the liquid crystal panel with the TAB. It is an object of the present invention to shorten the TAB pressure bonding work time and increase the productivity.

[0008]

EXAMPLE FIG. 2 shows the appearance of a liquid crystal panel. The liquid crystal panel 10 includes glass plates 12 and 14 each having two pixel electrodes.
Connection terminals 16 for supplying signals to the pixel electrodes are arranged at regular intervals on the back surface of the upper glass plate 12 and on the periphery of the matching surface of the lower glass plate 14. The TAB 20 is provided with a signal electrode or a drive electrode drive circuit 23 having a function of selectively driving a connection terminal 21, a wiring 22, and a pixel electrode provided on a flexible film by a normal printed wiring method. In the temporary pressure bonding station 300 described later, a positioning hole 24 for holding the TAB jig arm 331 and a positioning mark 25 for aligning the connection terminal 16 and the connection terminal 21 are provided. To connect the TAB 20 to the connection terminal 16, the TAB is arranged on the lower plate glass 14 so that the connection terminals 16 and 21 are aligned with each other, and a resin in which fine particles of metal such as solder, gold and copper are dispersed is formed into a film between them. This is performed by interposing the anisotropic adhesive sheet described above and pressing the connection terminal portion while applying heat.

FIG. 1 is a plan view showing an embodiment of a liquid crystal panel manufacturing apparatus 1 according to the present invention, FIG. 3 is a front view thereof, and FIGS.
00 is a right side view showing the 00 part and a temporary pressing station 300 part is a left side view. The manufacturing apparatus 30 arranges the liquid crystal panel 10 on the liquid crystal panel suction portion jig 42 of the carrier 40 at an accurate position, then suction-holds the set station 100, which serves to determine the reference position, and the lower plate glass 14 of the liquid crystal panel. On the bed 32, there are a temporary pressure bonding station 300 for placing the TAB 20 on the upper surface for temporary pressure bonding, a final pressure bonding station 500 for reliably pressing the temporarily bonded TAB, and a take-out station 700 for taking out the liquid crystal panel with the TAB attached. A rail 60 that guides the carrier 40 and the carrier 50 is provided in the. The carrier 40 functions to carry the liquid crystal panel from the set station to the main pressure bonding station, and in the temporary pressure bonding station, the connection terminal 16 corresponding to TAB is used.
Is sequentially stepped under the temporary pressure bonding head 360 of the temporary pressure bonding head structure 340. The standard-positioned liquid crystal panel is conveyed to the main pressure bonding station, and then held at the processing position by the main pressure bonding receiver base 600 and the liquid crystal panel receiving jig 610. The carrier 40 passes the liquid crystal panel to the liquid crystal panel receiving jig and then returns to the set station. At the TAB portion on the liquid crystal panel held by the jig 610, the heater chip of each main pressure bonding head 580 descends to complete the mounting by heating and pressing. The liquid crystal panel to which the TAB is attached is carried by the carrier 50 to the take-out station 700 and taken out from the manufacturing apparatus.

Each station will be described in detail below. [Set Station 100] A liquid crystal panel suction section jig 42 is provided on the carrier 40 so as to be movable in the Y-axis direction. The set station 100 is provided with an X-axis and Y-axis butting gauge 120. The abutment pin 1 for contacting the peripheral surface U of the upper plate glass 12 of the liquid crystal panel 10 to position the liquid crystal panel is attached to the abutment gauge.
40 is provided. The shape of the butting pin may be any structure as long as it does not interfere with the peripheral surface L of the lower glass plate 14 of the liquid crystal panel and contacts the surface U so as not to damage the connection terminals 16 on the lower glass plate. Can be adopted.
The reference positioning is performed by lightly mounting the liquid crystal panel on the jig for the liquid crystal panel suction part of the carrier and moving the carrier along the X-axis and the Y-axis, and the accurate reference position is the peripheral surface of the upper plate glass. After being determined by U, the liquid crystal panel suction portion jig sucks the liquid crystal panel to prevent the shift of the reference position of the liquid crystal panel in the subsequent process. The liquid crystal panel suction section jig 42 of the carrier 40 can be moved up and down by a minute distance by the action of the jig cylinder 43, so that the carrier 42 does not rise and hinder the movement when the carrier moves. In the processing step (1), the liquid crystal panel 10 is lowered to make the liquid crystal panel 10 stand still on the temporary pressure receiving base 380 or the main pressure receiving base 600 (see FIG. 10). In the main pressure bonding station 500, the liquid crystal panel is delivered to the main pressure bonding receiving base and the support suction unit 614.

[Temporary Crimping Station 300] FIGS. 6 and 7
FIG. 4A is a side view and a plan view of the TAB adjustment structure 320, respectively. The temporary pressure bonding station 300 is provided on the liquid crystal panel 10.
The TAB 20 is accurately placed on the connection terminal 16 of the connection terminal 1 and the connection terminal 1 is moved to the main pressure bonding station 500 thereafter.
6 and the connection terminal 21 is a station for temporarily fixing them so that the positions of the TAB and the connection terminals 1 are not changed.
6. A TAB adjusting structure that is carried on the upper surface of the glass plate 12 and determines the accurate positional relationship between the connection terminal and the upper glass plate 12, and the TAB accurately arranged.
Is temporarily fixed to the liquid crystal panel. The temporary pressure bonding head structure has basically the same configuration except that the number of the main pressure bonding heads 580 and the number of the main pressure bonding heads 580 of the main pressure bonding station described later are different. The liquid crystal panel 10 placed on the carrier 40 and positioned for reference is moved below the temporary pressure bonding station 300. After the movement, the suction jig 42 descends and the lower surface of the end portion of the liquid crystal panel on the TAB20 crimping side comes into contact with the temporary crimp receiving base 380, so that an appropriate pressure is applied to the joining surface and the temporary fixing is appropriately performed. At the same time, it resists the pressure applied from above and prevents the lower glass sheet 14 from being damaged during pressurization.

The TAB adjusting structure 320 has a TAB stage base 322 on which a TAB arm 330 holding the TAB 20 is mounted at the TAB loading position, and the TAB stage base is quickly pressed by the high-speed actuator 321 to temporarily press the head structure 340. It is moved to the temporary stop position below. On the TAB stage base 322, fine adjustment means for accurately positioning the TAB 20 on the connection terminal 16 is provided. The XY table 323 is means for moving the TAB arm in the X-axis direction and the Y-axis direction by the Y-axis motor 324 and the X-axis motor 329, respectively, and the svey table base 325 is placed thereon. A sub-table 326 is provided on the sub-table base and has a θ drive shaft 3 driven by a θ drive motor 328.
27 rotates the TAB arm on the XY plane.
The TAB 20 is the TAB of the TAB arm 330 at the loading position.
TAB set plate 3 using the set guide pin 333 as a guide
32 is loaded on the TAB holding base 335.
It is held by the TAB retainer 334 attached to the. The TAB arm on which the TAB is loaded is driven by the high speed actuator 321 to move the temporary pressure bonding head structure 34.
Move quickly below 0. When the TAB arm is located under the temporary pressure bonding head structure, a positioning signal based on the positioning mark on the lower plate glass 14 and the TAB positioning mark 25 is output from the left and right biaxial optical position detecting device 350, and the Y axis is positioned. The motor 324, the X-axis motor 329, and the Θ drive motor 328 are controlled to position the TAB at a correct position. At this time, the TAB jig arm 331 rotates clockwise around the TAB arm jig shaft 336 by the driving means 337, so that the tip portion of the TAB comes into flat contact with the lower plate glass 14 and the connecting terminal 21 portion is Connection terminal 16
The alignment operation is performed while lightly contacting the anisotropic adhesive sheet portion interposed above. At this time, the TAB is lightly bent by the rotational movement of the TAB arm, but the portion with the positioning mark is substantially flush with the surface of the lower plate glass.

FIG. 8 shows this state. The liquid crystal panel 10 is located on the temporary pressure receiving base 380,
On the other hand, the TAB 20 is held on a TAB set plate 332 by a vacuum pad 338 arranged on the TAB set plate 332 with the TAB set guide pin 333 as a guide and provided at the tip of the TAB retainer 334. As the TAB jig arm 331 rotates, the connection terminal 21 portion of the TAB is pressed onto the lower plate glass 14. Positioning mark 25
It can be understood that the portion is almost flush with the surface of the lower plate glass. In this state, the heater block 589 of the temporary pressure bonding head 360 is pushed down by the operation of the driving means 582, and heating and pressurization is performed for about 1 to 2 seconds, and the TAB 20 is lightly bonded onto the connection terminal 16. When one TAB 20 is temporarily fixed, the TAB adjusting structure 320 is quickly returned to the TAB loading position by the high speed actuator 321, and the next TAB is loaded. The carrier 40 is the TAB 20.
Since one step is advanced, the liquid crystal panel 10 becomes the next TAB.
The receiving position is moved so as to be below the temporary pressure bonding head 360, and the temporary fixing is performed as in the above. The required number of TAs
When B is temporarily fixed on the lower plate glass 14, the liquid crystal panel is moved to the next main-bonding station 500.

[Main Crimping Station 500] The main crimping station 500 comprises a main crimping head structure 540, a main crimping receiving base 600, and a liquid crystal panel receiving jig 610. A setting plate 560, on which a predetermined number of main pressure bonding heads 580 are mounted at a predetermined interval, is attached to the main pressure bonding head structure 540, and a base positioning pin 520 is attached.
It is attached by using as a guide. FIG. 9 shows the main pressure bonding head 58 attached to the setting plate 560.
It is a partial cross-sectional view showing the structure of 0, head case 581
A drive means 582 attached to the drive means and a booster mechanism for transmitting the operation of the drive means to the rotary gear 588 as a rotary motion to vertically move the rack plate 587 attached to the sliding plate,
Cross roller table 586 mounted on rack plate
A mechanism for adjusting the inclination of the roller guide fixing base 585 that guides the table, and a TA attached to the lower part of the cross table.
Heater block 5 with a length slightly longer than the length of B20
It consists of 89 and. The drive means 582 is the main pressure bonding head 58.
It has a pen cylinder structure thinner than 0 width and is adjusted to a predetermined pressure by a regulator in advance. The operation of the drive means 582 is transmitted to the pinion with increasing pressure via the piston rod-pin-cam groove, and moves the rack plate 587 up and down. The roller guide fixing base 585 is configured to rotate about the parallel pin 584, and the inclination amount thereof is freely adjusted by rotating the eccentric cam 583. By adjusting the inclination of the roller guide fixing base 585, the bottom surface (heater chip portion) of the heater block 589 provided under the cross roller table 586 is managed in parallel. A cartridge heater 590 is provided in the heater block 589 to heat the heater block to a required temperature, and the temperature of the heater block is detected by a thermocouple 591 and controlled to an appropriate temperature by a control means (not shown).

FIG. 10 is a view showing the relationship between the carrier 40 and the liquid crystal panel receiving jig 610 in the main pressure bonding station 500. Liquid crystal panel adsorption part jig 42 of carrier 40
Is configured to move up and down by a small amount by the jig cylinder 43, and a support suction portion 614 is provided at the tip of the liquid crystal panel receiving arm 612 of the liquid crystal panel receiving jig 610. It is designed to hold by suction. TAB20 at the temporary pressure bonding station 300
The liquid crystal panel suction part jig 42 on which the liquid crystal panel 10 attached with the liquid crystal panel 10 is lifted and moves away from the temporary pressure receiving base 380, and is moved below the main pressure bonding station 500 by the movement of the carrier 40 in the X-axis direction. . Here, the liquid crystal panel suction jig 42 descends, and when the liquid crystal panel comes into contact with the upper end of the main pressure-bonding receiving base 600 and the upper end of the liquid crystal panel receiving jig arm 612, the liquid crystal panel receiving jig arm sucks the liquid crystal panel, The liquid crystal panel suction unit jig releases the suction, and the liquid crystal panel is supported and held at a predetermined position of the main pressure bonding station by the main pressure receiving base and the suction supporting unit 614. After that, the liquid crystal panel suction section jig further descends, and after returning from the liquid crystal panel, returns to the set station 100.

The liquid crystal panel 10 to which the TAB 20 is temporarily fixed at the temporary pressure bonding station 300 is
00, and is transferred to the main pressure-bonding receiving base 600 and the liquid crystal panel receiving jig 610, where each main pressure-bonding head 580 is independently controlled, and the heater block 589 is pressed onto each TAB. The main crimping of all TABs is performed at the same time. The time of main pressure bonding is about 20 ~
It takes about 30 seconds and the temperature and pressure are controlled to desired conditions. Main pressure bonding head 580 corresponding to each TAB20
Are heated by the eccentric cam 583.
The level of 89 is controlled, and the pressure is driven by the driving means 58.
It is controlled by detecting the pressure of the pneumatic pressure supplied to 2 and controlling the pressure. Further, the temperature of the heater block is detected by the thermocouple 591 and controlled to a desired temperature. When the main pressure bonding is completed, the liquid crystal panel suction portion jig 52 of the carrier 50 that has moved below the liquid crystal panel 10.
, The liquid crystal panel is transferred onto the TAB crimping section jig and held by suction, and is driven by the TAB crimping section jig driving device 54 to be carried to the take-out station 700.

[Taking-out Station 700] The liquid crystal panel 10 carried to the taking-out station 700 is taken out of the manufacturing apparatus 30 after the adsorption is released, and the TAB attaching process to the liquid crystal panel is completed.

[0018]

According to the present invention, the main pressure bonding head is attached to each TA.
The head is divided according to B, and each head is provided with an independent levelness adjusting function and a pressurizing force and heating temperature controlling function. Therefore, even if the number of TABs increases as the size of the liquid crystal panel increases, Appropriate mounting control is performed for each TAB,
The TAB can be securely attached to all the liquid crystal panels, which improves productivity. By preparing each setting plate with a number of main pressure bonding heads according to the standard of the liquid crystal panel, it becomes easy to replace the main pressure bonding heads with different arrangements, and it is possible to quickly respond to the production of a wide variety of products. be able to. Since the reference position of the liquid crystal panel is determined by the peripheral portion of the upper glass, even if the peripheral edge of the upper glass is not parallel to the peripheral edge of the lower glass,
Since one end of the heater chip does not ride on the upper glass, each TAB can be securely attached without damaging the liquid crystal panel to improve productivity, and the heater chip may run on the upper glass. Since it is eliminated, the depth of the terminal portion of the liquid crystal panel can be shortened, and the liquid crystal panel can be downsized and the mounting efficiency can be improved. The TAB adjustment structure is moved by the high-speed actuator between the TAB loading position and the bottom of the temporary crimping head, so that the time required for temporarily fixing each TAB can be shortened, and when mounting a large number of TABs, The time can be greatly reduced. At the temporary crimping station,
In aligning the connection terminals of the TAB and the connection terminals of the liquid crystal panel, the positioning marks of the TAB are kept on the same plane as the positioning marks of the liquid crystal panel.
When the optical position is detected, the positioning mark is not blurred, and the matching accuracy of the connection terminals can be kept high, which contributes to the improvement of the product yield. According to the present invention, it is possible to achieve the remarkable effects as described above by coping with the increase in size of the liquid crystal panel.

[Brief description of drawings]

FIG. 1 is a plan view of a liquid crystal module manufacturing apparatus according to the present invention.

FIG. 2 is a plan view showing a configuration of a liquid crystal panel and a TAB.

FIG. 3 is a front view of a liquid crystal module manufacturing apparatus.

FIG. 4 is a right side view showing the vicinity of a main pressure bonding station of the liquid crystal module manufacturing apparatus.

FIG. 5 is a left side view showing the vicinity of a temporary pressure bonding station of the liquid crystal module manufacturing apparatus.

FIG. 6 is a side view of a TAB adjustment structure.

FIG. 7 is a plan view of a TAB adjustment structure.

FIG. 8 is a diagram showing a matching method between a TAB and a liquid crystal panel.

FIG. 9 is a diagram showing a structure of a main pressure bonding head.

FIG. 10 is a diagram showing a relationship between a liquid crystal panel receiving jig and a carrier in the vicinity of a main pressure bonding station.

[Explanation of symbols]

10 LCD panel 12 Top glass 14 Lower plate glass 16 connection terminals 20 TAB 21 Connection terminal 30 Manufacturing equipment 32 beds 40 carrier 42 LCD panel suction jig 50 carrier 52 LCD panel suction jig 60 rails 100 set stations 140 butting pin 300 Temporary crimping station 320 TAB adjustment structure 340 Temporary Crimping Head Structure 360 temporary press head 380 Temporary crimp receiving base 500-crimping station 520 Mounting base positioning pin 540 main pressure bonding head structure 560 main pressure bonding head mounting base 580 main pressure bonding head 610 LCD panel receiving jig 700 take-off station

Claims (8)

[Claims] 1. A set station for setting a liquid crystal panel at a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs to a predetermined position of a liquid crystal panel, and a plurality of temporary TABs. The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
Attach the crimping head in the main crimping station.
A liquid crystal module manufacturing apparatus characterized in that it is divided into the same number as AB. 2. A set station for setting a liquid crystal panel at a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs to a predetermined position on the liquid crystal panel, and a plurality of TABs temporarily The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
The main pressure bonding head in the main pressure bonding station is divided into the same number as the number of TABs attached to the liquid crystal panel, and each head is provided with means for adjusting the levelness of an independent heater block, pressure generation means, and pressure transmission mechanism. A liquid crystal module manufacturing device characterized by the above. 3. The liquid crystal module manufacturing apparatus according to claim 2, wherein the length of the divided heater block of the main pressure bonding head is substantially longer than the length of TAB. 4. A set station for setting a liquid crystal panel at a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs at a predetermined position on the liquid crystal panel, and a plurality of TABs for temporary use. The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
T attached to the liquid crystal panel at the main pressure bonding station
The main pressure-bonding head, which was divided into the same number as AB and provided with a means for adjusting the horizontalness of the independent heater block, a pressure generating means, and a pressure transmission mechanism, was mounted on the setting plate at predetermined intervals. Liquid crystal module manufacturing equipment characterized by. 5. The liquid crystal module manufacturing apparatus according to claim 4, wherein the setting plate has a hole penetrating with a setting plate positioning pin provided on the main pressure bonding head structure. 6. A set station for setting a liquid crystal panel to a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs to a predetermined position on the liquid crystal panel, and a plurality of TABs temporarily The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
The temporary pressure bonding station includes a TAB adjustment structure and a temporary pressure bonding head. The TAB adjustment structure includes a high-speed actuator that moves at high speed from the TAB loading position to the temporary pressure bonding position, and a liquid crystal panel that is provided separately from the high-speed actuator. A liquid crystal module manufacturing apparatus, comprising an X-axis drive motor, a Y-axis drive motor, and a Θ drive motor that perform the above-mentioned matching. 7. A set station for setting a liquid crystal panel at a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs to a predetermined position of a liquid crystal panel, and a plurality of temporary TABs. The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
The temporary pressure bonding station includes a TAB adjustment structure and a temporary pressure bonding head. The TAB adjustment structure includes a high-speed actuator that moves at high speed from the TAB loading position to the temporary pressure bonding position, and a liquid crystal panel that is provided separately from the high-speed actuator. Is provided with an X-axis drive motor, a Y-axis drive motor, and a Θ drive motor that perform the alignment of the TAB arm and a TAB arm adjusted by the same. The tip of the TAB arm is configured to rotate downward, and the tip portion of the TAB is An apparatus for manufacturing a liquid crystal module, wherein the TAB is aligned by making flat contact with a plane on which the connection terminals of the liquid crystal panel are arranged. 8. A set station for setting a liquid crystal panel at a reference position on a suction jig of a carrier, a temporary pressure bonding station for temporarily temporarily fixing a plurality of TABs to a predetermined position of a liquid crystal panel, and a plurality of TABs for temporary use. The main crimping station for simultaneously crimping the TAB of the stopped liquid crystal panel and the TA
A liquid crystal module manufacturing apparatus comprising a take-out station for taking out the liquid crystal panel after the installation of B is completed.
The liquid crystal module manufacturing apparatus is characterized in that the reference positioning at the set station is performed with reference to the peripheral edge of the upper glass of the liquid crystal panel.