JPH11242236A - Pcb press-fixing device for liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform thermocompression bonding in a state of surely electrically connecting both leads without generating a slippage between a TCP(tape carrier package) and a PCB(printed circuit board) by completely press-fixing the TCP and the PCB at a position where a panel assembly and the PCB are positioned and overlapped. SOLUTION: In a carrying unit 13, the PCB 5a is mounted to the PCB mounting part 17 in a positioned state and the panel assembly 1 is mounted to a panel mounting part 18. When the carrying unit 13 is moved to a bonding station 12, the position of the panel assembly 1 is detected by a television camera provided in the carrying unit 13 and the position of the PCB (5a) is detected by the television camera 51 provided in the bonding station 12. The panel assembly 1 is turned to the state of being positioned to the PCB (5a) by position- adjusting the panel holding base (30) of the panel mounting part 18 in a θ direction, an X axis direction and a Y axis direction and they are mutually overlapped and subjected to thermocompression bonding at the position by a bonding edge 62.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal panel constituting a liquid crystal display, wherein one of a pair of upper and lower transparent substrates is provided with a TCP (Tape Carrier Pack).
age) and ACF (Anisotropic
PCB (Print Circuit B) with Conductive Film attached
The present invention relates to a liquid crystal panel PCB crimping apparatus for connecting a PCB to a panel assembly by crimping a connection between a TCP lead and a PCB lead in a state where the PCB and the PCB are aligned with each other.

[0002]

2. Description of the Related Art A liquid crystal panel constituting a liquid crystal display is composed of a panel body in which liquid crystal is sealed between a pair of transparent substrates, and a TCP on which a driver IC is mounted is made of TAB (Tape Au).
A panel assembly is formed by mounting tomate dBonding, and a TCP in this panel assembly is assembled in a state in which a lead on the PCB is connected to a lead on the outer side. Here, in the panel assembly, a TCP is mounted on at least one long side and one short side around the panel main body with a TAB, and a PCB is mounted on each side where the TCP is mounted.

Here, a TCP mounted on a long side portion and a PCB connected to the TCP are provided with a large number of leads at minute pitch intervals. When assembling a PCB to a panel assembly, these TCPs are used. Each lead and each lead of the PCB must be securely connected electrically. Therefore, TCP on the long side is A
It is fixed by pressing it to the PCB using CF, and pressurizing and curing it in a heated state. Here, the ACF is composed of conductive particles dispersed in a binder resin having an electrical insulating property. Conductive particles are TCP lead and PCB
And the binder resin is for fixing the TCP and the PCB. On the other hand, some of the short side TCP leads are connected to the leads by the same method as described above. However, if the pitch interval between the leads is large to some extent, the leads are connected to the PCB leads by soldering or the like. You can also.

[0004] The PCB must be assembled to the panel assembly in a precisely positioned manner. In particular, since the long side PCB and the TCP connected thereto are provided with leads at very fine pitch intervals,
It is necessary to superimpose these PCB and TCP connected via F with extremely strict positioning. The panel assembly and the PCB are individually adjusted in position on a predetermined table and overlapped.
For this position adjustment, a predetermined reference position is set on the table, and when the PCB is placed on the table by means such as vacuum suction, the table is adjusted by image recognition means or the like so as to match this reference position. The panel assembly is placed on the table, and then the panel assembly is adjusted in position in the same manner, and then placed on a table, so that the panel assembly and the PCB are overlapped in a state where they are accurately aligned. It is also possible to place the PCB at a predetermined position on the table, adjust the position of the panel assembly based on the PCB, and then superimpose the panel assembly on the PCB.

[0005]

By the way, after the panel assembly and the PCB are overlapped, they are thermocompression-bonded by a crimping means. In this thermocompression bonding, the lower surface of the table is brought into contact with a receiving base and the table is crimped from above. This is performed by lowering the blade. Therefore, the crimping station is provided with a crimping blade and a cradle on the upper and lower sides. Meanwhile, panel assembly and PC
The alignment between the P and B is performed by detecting the positions of the PCB and the panel assembly.
Generally, position detection is performed based on an alignment mark provided on the CB. For this purpose, a television camera is installed, and this television camera is arranged at a portion where the panel assembly and the PCB overlap. Further, the position adjustment of the panel assembly performed after the position detection is also performed at the upper position of the table. Therefore, at a position above the table, it is necessary to provide at least a vacuum suction means and a position detection means having a position adjustment mechanism. For this reason, when the panel assembly and the PCB are to be aligned and overlapped with each other at the crimping station, a mechanism for this purpose may interfere with a crimping mechanism disposed at the crimping station, particularly with a crimping blade.

In view of the above, in the prior art, the panel assembly and the PCB are relatively positioned and superimposed at a stage before the crimping station, and then are carried into the crimping station. For this reason, it is necessary to prevent the relative displacement between the panel assembly and the PCB during the transportation. As a mechanism for preventing the displacement, a panel assembly and a PCB are generally temporarily press-bonded. For this, the panel assembly and PC
A temporary crimping means is attached to a mechanism for superimposing a panel assembly on a PCB, which is installed in a station for positioning and superimposing the panel assembly B on the PCB.
B, and by applying a predetermined pressing force by the temporary press-fitting means, the panel assembly and the PCB are held in a bonded state by the adhesive action of the ACF. However, provision of such a temporary crimping means not only complicates the structure but also increases the number of steps of temporary crimping, so that there is a problem that the processing efficiency is deteriorated due to an increase in man-hours. In addition, since it is only temporary crimping, the panel assembly and PC are
It cannot be said that there is no possibility that B is misaligned.

The present invention has been made in view of the above points, and an object of the present invention is to make TCP and P at a position where a panel assembly is aligned with a PCB and overlapped.
By completely crimping CB, TCP and PCB
Therefore, it is possible to perform pressure bonding in a state in which both the leads are securely connected electrically without causing a displacement between the two leads.

[0008]

In order to achieve the above object, the present invention provides a panel assembly comprising a laminate of upper and lower transparent substrates, and a plurality of TCPs mounted on at least two sides of one transparent substrate, A PCB with ACF attached
In a device for crimping each other while connecting leads of TCP and PCB, a transport unit which can reciprocate at least between a loading / unloading station for mounting the PCB and the panel assembly and a crimping station provided with a crimping means is provided. The transport unit is provided with a PCB mounting portion for mounting the PCB in a state where the PCB is positioned at a predetermined position, and a vertically moving means for the PCB mounting portion. Up and down moving means, and the panel assembly mounted on the PCB
Position adjusting means for aligning the position of the PCB with the CB; further, a position detecting means of the panel assembly is provided in the transport unit; and a position detecting means of the PCB mounted on the PCB mounting portion is provided in the crimping station. The feature is that it is arranged to be arranged.

As the position adjusting mechanism of the panel mounting portion, it is only necessary to provide a direction perpendicular to the transport direction of the transport unit and a rotation direction in the horizontal direction, but it is also possible to finely adjust the transport direction of the transport unit. Is preferred. P
In order to stably hold the PCB and the panel assembly at the CB mounting table and the panel mounting section, respectively, a means such as a mechanical clamp may be used. However, it is preferable to provide vacuum suction means for suction holding. This is advantageous in terms of simplification of the configuration and the like. As the position detecting means, a panel photographing television camera for detecting from a lower side the position of an alignment mark provided on the TCP of the panel assembly mounted on the panel mounting portion is provided on the transport unit side, and is provided at the crimping station. Can be configured to provide a television camera for photographing a PCB for detecting the position of the alignment mark of the PCB from above.

[0010]

An embodiment of the present invention will be described below with reference to the drawings. First, in FIGS. 1 and 2, reference numeral 1 denotes a panel assembly, and reference numerals 5a and 5b denote PCBs, respectively. The panel assembly 1 is one in which liquid crystal is sealed between a pair of upper and lower transparent substrates 2 and 3. The transparent substrate 2 side has one long side and one short side protruding from the other transparent substrate 3 by a predetermined width, and the surface on which the transparent substrate 2 protrudes has a long side and a short side. Are equipped with a required number of TCPs 4a and 4b, respectively. The TCPs 4a and 4b are each formed by mounting a driver IC on a flexible board, and the input and output lead patterns are formed on the flexible board at a minute pitch. The pitch interval between the leads of the long side TCP 4a is smaller than the pitch interval of the leads of the short side TCP 4b.

The PCB 5a is for connecting to the TCP 4a mounted on the long side of the panel assembly 1, and the PCB 5b is for connecting to the TCP 4b mounted on the short side. TCP4b on short side and PCB
Since the lead between the lead 5b and the lead 5b is not so extremely small, the lead can be connected by soldering. On the other hand, since the leads are formed at an extremely fine pitch between the PCB 5a and the TCP 4a, the leads cannot be connected by soldering.
Are electrically connected via The ACF 6 is obtained by uniformly dispersing fine conductive particles in a binder resin. The ACF 6 is attached to the PCB 5a in advance, and the TCP is used.
When the PCBs 4a are stacked and pressed under heating, the leads of the PCB 5a are electrically connected to the leads of the TCP 4a via conductive particles, and are also fixed by the adhesive force of the binder resin, so that the PCB 5a is connected to the panel assembly 1. Is done. As described above, the PCBs 5 are mounted on the TCPs 4a and 4b mounted on the long side and the short side of the panel assembly 1, respectively.
The liquid crystal panel 7 is formed by connecting a and 5b. The connection between the TCP 4b and the PCB 5b does not necessarily have to be made by soldering, and the short side is also connected to the ACF.
It may be configured to be connected via a.

Therefore, FIGS. 3 to 5 show P using an ACF.
1 shows a configuration of a CB crimping apparatus. Here, the PCB 5a is connected to the long side of the panel assembly 1, but the same configuration can be applied to the short side. First, in FIG. 2, reference numeral 10 denotes an ACF attaching station, 11
Denotes a loading / unloading station, and 12 denotes a crimping station. The loading / unloading station 11 is provided with a transfer means T for vacuum-sucking the PCB 5a and the panel assembly 1 to perform loading / unloading. Here, the PCB 5a and the panel assembly 1 are transferred by independent transfer means. In addition, ACF attaching station 10 has A
A CF attaching mechanism S is provided. Therefore, first, the PCB 5a is supplied at the loading / unloading station 11, and
Move to CF sticking station 10
ACF 6 is attached to 5a. When the attachment of the ACF 6 is completed, the process proceeds to the loading / unloading station 11, where
The panel assembly 1 is carried in. Further, the PCB 5a to which the ACF 6 has been attached and the panel assembly 1 are transferred to the crimping station 12, and the panel assembly 1 is attached to the PC.
They are superposed in a state where they are aligned with B5a, and are thermocompression-bonded using the compression mechanism P.

Reference numeral 13 denotes a transport unit. The transport unit 13 has a transport base 13a.
Is guided by the guide rails 14 and the station 10
Move between ~ 12. A transport motor 15 and a screw shaft 16 are provided to linearly move the transport unit 13 along the guide rail 14. The screw shaft 16 is inserted through a nut 13b provided on the transport base 13a. Therefore, by operating the transport motor 15 and rotating the screw shaft 16, the transport unit 13 is moved from the loading / unloading station 11 to the AC as shown by the arrow in FIG.
The transfer from the crimping station 12 to the F paste station 10, from the ACF paste station 10 to the crimping station 12 via the carry-in / carry-out station 11, and from the crimp station 12 to the carry-in / carry-out station 11. The transport unit 13 includes a PCB mounting section 17 and a panel mounting section 18.
And a drive mechanism for them. The PCB 5a is mounted on the PCB mounting portion 17, and the panel assembly 1 is mounted on the panel mounting portion 18.

As shown in FIGS. 4 and 5, the PCB mounting portion 17 is formed of a plate-like member,
It has a PCB holding base 20 provided with a vacuum suction hole 20a capable of sucking and holding a, and the PCB 5a is placed on the PCB holding base 20 in a state of being strictly positioned at a predetermined position. Here, the PCB 5a in the PCB holding table 20
The positioning and holding can be performed not only by vacuum suction but also by a clamp or the like. PCB holder 20
Can be moved up and down by a predetermined stroke.
For this purpose, a pair of arms 21
a and 21b are connected to each other, and the transfer base 1
3a is a vertical moving means, for example, a lifting cylinder 22
Is mounted, and a rod 22a of the lifting / lowering cylinder 22 is provided so as to be connected to one arm 21a. Although illustration is omitted in the other arm 21b,
A vertical guide means including a guide rod and a slide guide is provided. Therefore, by expanding and contracting the cylinder 22, the PCB holding table 20 moves up and down by a predetermined stroke.

Next, the panel mounting portion 18 is mounted on the panel holder 3.
The panel holder 30 is formed of a plate having a vacuum suction hole 30a at a required position, and the panel assembly 1 is held in a state of being placed on the panel holder 30. I have. Here, the size of the panel holding base 30 is considerably smaller than the size of the panel assembly 1, and is set to the minimum outer dimension without impairing the stability of the panel assembly 1. A shaft 31 is attached to the lower surface of the panel holder 30, and the shaft 31 is rotatably supported by a bearing 32 a provided on a lifting table 32. A driven gear 31a is mounted on the shaft 31, and a driven gear 33a provided on an output shaft of a θ drive motor 33 mounted on the elevating table 32 meshes with the driven gear 31a. Therefore, when the θ drive motor 33 is operated, the shaft 31 is rotated by the engagement between the drive gear 33a and the driven gear 31a, and as a result, the panel holder 30 is rotated in the horizontal direction.
As a result, the position of the panel holder 30 is adjusted in the rotation direction, that is, in the θ direction.

Reference numeral 34 denotes an X-axis table. The X-axis table 34 is provided with a lifting cylinder 35.
The rod 35 a of the lifting cylinder 35 is connected to the lifting table 32. Further, in addition to the lifting cylinder 35, a guide rod 36a suspended from the lifting table 32 is provided.
One or a plurality of vertical guide means including a slide guide 36b installed on the X-axis table 34 are provided. As a result, when the lifting cylinder 35 is operated, the panel holder 30 provided on the lifting table 32 so as to be position-adjustable in the θ direction moves up and down between an ascending position and a descending position. Is formed.

The position of the X-axis table 34 can be adjusted in the X-axis direction, that is, in the transport direction of the transport unit 13.
For this purpose, the X-axis table 34 is mounted on the Y-axis table 37 so as to be movable in the X-axis direction. This X
The drive mechanism of the shaft table 34 uses a feed screw mechanism. The feed screw mechanism is provided with an X-axis
Axis guide 38, X-axis motor 39, and X-axis motor 3
9 and a screw shaft 40 connected to the X-axis table 34.
Are guided by the X-axis guide 38 and the screw shaft 40
Is provided.

The Y-axis table 37 is used to adjust the position in the Y-axis direction, that is, in the direction orthogonal to the transport direction of the transport unit 13, and, like the drive mechanism of the X-axis table 34, the transport base 13a. Y guide 42 provided on the
It has a shaft motor 43 and a screw shaft 44 connected to the Y-axis motor 43, and a nut 45 is provided on the lower surface of the Y-axis table 37. The screw shaft 44 is inserted into the nut 45, and when the Y-axis motor 43 is operated, the position of the Y-axis table 37 can be adjusted in the Y-axis direction.

As described above, the panel holder 30 is installed on the elevating table 32 so as to be adjustable in the θ direction, and the elevating table 32 is installed on the X-axis table 34 so as to be adjustable in the X-axis direction. The axis table 34 is set on the Y axis table 37, and the θ drive motors 33, 39, 4 are respectively provided.
3, the panel holding table 30 is finely driven.
Position adjusting means for adjusting the position of the panel assembly 1 mounted thereon is configured. The position adjustment of the panel assembly 1 is performed on a transport base 13a constituting the transport unit 13. Since the transfer base 13a is also provided with the PCB holding table 20 constituting the PCB mounting section 17, the panel assembly 1 can be positioned with respect to the PCB 5a set on the PCB holding table 20. Become.

In order to align the panel assembly 1 with the PCB 5a, the position of the panel assembly 1 and the position of the PCB 5a are detected by image recognition means using a television camera. Here, the panel assembly 1 and the PCB 5a are provided with alignment marks at required locations. The alignment marks are also provided on the transparent substrate 2 constituting the panel assembly 1, but the alignment marks provided on the transparent substrate 2 are TCP4
a, 4b, which are used for position detection when the TCPs 4a, 4b are mounted.
When a and 4b are mounted, they are covered and hidden. Therefore, as shown in FIGS. 1 and 2, the position is adjusted based on the alignment mark M1 provided on the TCP 4a and the alignment mark M2 provided on the PCB 5a. PCB
5a has two alignment marks M near both ends thereof.
2, two alignment marks M2 are detected. On the other hand, since a plurality of TCPs 4a are mounted on the panel assembly 1, the alignment marks M1 provided on the TCPs 4a at both ends are detected.

Here, the alignment mark M1 of the TCP 4a is provided on the lower surface side. Therefore, this T
The two television cameras 50, 50 for photographing the two alignment marks M1 provided on the CP 4a
Is fixedly mounted on the transport base 13a. On the other hand, P
The two alignment marks M2 provided on the CB 5a are formed on the upper surface side.
The TV camera 51 for photographing 2 is not provided in the transport unit 13 but is provided at a predetermined location of the crimping station 12.
However, a crimping blade 62 constituting the crimping means 60 moves up and down at or near the position of the alignment mark M2, as will be described later.
In order to avoid interference with the television camera 51, the television camera 51 can be displaced between an operation position for photographing the alignment mark M2 by an appropriate driving means and a retracted position outside the movable range of the pressing blade 62.

At a predetermined position of the crimping station 12,
A crimping means 60 that constitutes a crimping mechanism P is provided along the transport path of the transport unit 13 by the guide rail 14. The crimping means 60 includes a fixed receiving table 61 and a movable crimping blade 62. The crimping blade 62 has a built-in heater and is heated to a predetermined temperature state by the heater. The receiving table 61 and the crimping blade 62 have a length at least corresponding to the long side of the panel assembly 1. The crimping blade 62 is attached to an elevating block 63 driven up and down by a cylinder, a motor, or the like (not shown). I have. On the other hand, the height position of the receiving table 61 is lower than the height position of the PCB holding table 20 provided in the transfer unit 13 during transfer by a predetermined dimension.

The structure of the liquid crystal panel PCB crimping device is as described above. Next, the operation of connecting the panel assembly 1 to the PCB 5a using this device will be described with reference to FIGS. .

First, the transport unit 13 is located at the loading / unloading station 11. And this transport unit 1
PCB holding table 2 constituting PCB mounting section 17 in 3
The PCB 5a is placed on the “0”. Here, the PCB holding table 2
0 has a fixed relationship with the transport base 13a constituting the transport unit 13 except in the vertical direction, so that by positioning the transport unit 13 at a predetermined position, the PC
The B holding base 20 is arranged at a predetermined position. P
The CB 5a is placed on the PCB holding table 20 by the transfer means T, and the PCB 5a is placed so as to be at a predetermined position. For this purpose, preferably, a television camera 70 for detecting the alignment mark M2 of the PCB 5a is installed at the loading / unloading station 11, and the PCB holding table 2 is provided.
The position of the PCB 5a placed on the control board 0 is controlled. Here, the adjustment of the position of the PCB 5a is for adjusting the position of the PCB 5a with respect to the pressure bonding blade 62 in the pressure bonding step and for accurately bringing the pressure bonding blade 62 into contact with a predetermined position. PC
When the B5a is placed on the PCB holding table 20, the PCB 5a is sucked and held by the vacuum suction holes 20a. As a result, it is held so as not to be misaligned during transportation or the like, and its flatness is ensured.

When the PCB 5a is positioned on the transport unit 13 at the loading / unloading station 11 and is placed on the PCB loading section 17, the transport unit 13 is once moved to the ACF attaching station 10 and the PCB 5a is moved.
ACF6 is pasted on. For this purpose, the ACF attaching station 10 is provided with an ACF attaching mechanism S. Specifically, as shown in FIG. 3, the ACF attaching mechanism S is provided with a supply reel 72 and a take-up reel 73 on the elevating block 71, and between the supply reel 72 and the take-up reel 73. A guide roller 75 is provided at an appropriate position to draw the tape 74 around. Here, the tape 74 is made of a material in which ACF6 is attached to a backing material via a release material,
With the portion of the CF 6 cut at a predetermined position, the tape 74 is rolled while being pressed against the PCB 5 a by the pressing roller 76, so that the ACF 6 is attached to the PCB 5 a, and the mount is collected on the take-up reel 73. When the ACF 6 is carried in a state where the ACF 6 is pasted on the PCB 5a in advance, it is not necessary to provide the ACF pasting station 10.

When the ACF 6 is pasted on the PCB 5a, the transport unit 13 is again brought into the loading / unloading station 11
Then, the panel assembly 1 is placed on the panel holding base 30 constituting the panel placement section 18 provided in the transport unit 13 and fixed by vacuum suction. Here, the panel holding base 30 is disposed above the PCB holding base 20 constituting the PCB mounting portion 17 by a predetermined distance, and therefore, the panel assembly 1 is different from the PCB 5a already mounted on the transport unit 13. It is placed on the panel holder 30 in a non-contact state. Here, when the panel assembly 1 is mounted on the panel holding base 30, it is not necessary to perform particularly accurate positioning.

When the PCB 5a to which the ACF 6 is attached and the panel assembly 1 are placed on the transport unit 13, the PCB 5a is moved to the crimping station 12 without performing relative positioning, and the PCB is moved to the crimping station 12.
Positioning and superposition of 5a and panel assembly 1 and thermocompression bonding are performed. For this, the crimping station 1
2 is provided with a television camera 51 for detecting the alignment mark M2 of the PCB 5a, and the television camera 51 detects the position of the PCB 5a. A television camera 50 is also provided on the transport base 13a, and the television camera 50 photographs an alignment mark M1 of the TCP 4a mounted on the panel assembly 1.

When the PCB 5a is placed on the PCB holding table 20, the positioning of the crimping means 60 with respect to the crimping blade 62 has already been performed. Therefore, the position of the panel assembly 1 is adjusted with reference to the PCB 5a. For this purpose, FIG.
As shown in (1), the displacement of the position of the alignment marks M1, M2 photographed by the television cameras 50 and 51 is detected, and a drive signal corresponding to the displacement is input to the servo circuit.
By driving the θ drive motors 33, 39, and 43, the positions of the panel assembly 1 in the θ direction, the Y-axis direction, and the X-axis direction are adjusted. Here, the panel assembly 1 is displaced from the PCB 5a by a predetermined distance .DELTA.Y in the Y-axis direction so that the PCB holder 20 does not enter the field of view of the television camera 50 for detecting the alignment mark M1 of the panel assembly 1. Positioning is performed in the state of being placed at the position.

When the alignment is completed, as shown in FIG. 7, the panel assembly 1 is moved in the Y-axis direction to
The PCB holding table 20 is lowered to a position where the PCB holding table 20 comes into contact with the receiving table 61 by operating the cylinder 22 while being positioned above the CB 5a. Further, the television camera 51 is displaced from the operating position to the retracted position. From this state, as shown in FIG. 8, the panel assembly 1 is moved down by the elevating cylinder 35 so that the panel assembly 1 is
Overlay on 5a.

As described above, the panel assembly 1 mounted on the panel holding base 30 is superimposed on the PCB 5a mounted on the PCB holding base 20 in the PCB mounting section 17, and this superposition is performed. At this position, as shown in FIG. 9, the pressing blade 62 heated to a predetermined temperature state by the heater is lowered and brought into contact with the panel assembly 1 at a predetermined position.
Thermocompression bonding is performed with B5a. Thus, by performing the position adjustment of the panel assembly 1 and performing the thermocompression bonding at the position where the panel assembly 1 is superimposed on the PCB 5a, no relative displacement occurs. Therefore, by heating and pressurizing the ACF 6, the lead in the TCP 4a of the panel assembly 1 and the lead on the PCB 5a side are surely electrically connected via the conductive particles.

A mechanism for adjusting the position of the panel assembly 1 is provided in the transport unit 13, and
Is adjusted on the lower side, the TV camera 50 needs to be displaced between the operating position and the retracted position, but the pressure blade 62 does not interfere with the position adjusting mechanism of the panel assembly 1 at all. As a result, the panel assembly 1 and the PCB 5a can be aligned and superimposed at the position of the crimping station 12, and the crimping can be performed with extremely high precision. Further, since the temporary crimping is not performed, the number of steps is reduced by that much, and therefore, the speeding up and efficiency of this processing are achieved.

As described above, the panel assembly 1 and P
When the thermocompression bonding with the CB 5 a is completed, the press blade 62 is raised, and when the PCB holding table 20 and the panel holding table 30 are raised, the PCB holding table 20 is separated from the receiving table 61. Further, since the PCB 5a is fixed to the panel assembly 1, the PCB 5a is raised with the rise of the panel holding base 30.
a rises from the PCB holding table 20. Then, the transfer unit 13 is moved to the loading / unloading station 11, and is taken out by a vacuum suction means or the like, and a new PCB 5a is placed on the PCB holding table 20 in the PCB placing section 17, so that the next press bonding is performed. The process starts.

[0033]

As described above, according to the present invention, the TCP and the PCB are completely press-bonded at the position where the panel assembly is aligned with the PCB and overlapped. Without any deviation
It is possible to obtain an effect such as being able to perform pressure bonding in a state where both leads are securely connected electrically.

[Brief description of the drawings]

FIG. 1 is a plan view of a liquid crystal panel in which a PCB is incorporated in a panel assembly.

FIG. 2 is an enlarged view of a main part showing a panel assembly and a PCB separated from each other.

FIG. 3 is an overall configuration diagram of a liquid crystal panel PCB pressure bonding apparatus.

FIG. 4 is a side view of the transport unit.

FIG. 5 is a plan view of the transport unit in a state where the panel assembly and the PCB are mounted.

FIG. 6 is an operation explanatory view showing a state where the panel assembly and the PCB are aligned.

FIG. 7 is an operation explanatory view showing a transition state from the position alignment of the panel assembly and the PCB to the overlapping thereof.

FIG. 8 is an operation explanatory view showing a state where the panel assembly and the PCB are overlapped.

FIG. 9 is an operation explanatory view showing a pressure bonding step.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Panel assembly 2, 3 Transparent substrate 4a, 4b TCP 5a, 5b
PCB 6 ACF 7 Liquid crystal panel 10 ACF attaching station 11 Loading / unloading station 12 Crimping station 13 Transport unit 13a Transport base 17 PC
B mounting part 18 Panel mounting part 20 PC
B holding table 22 Cylinder 30 Panel holding table 32 Lifting table 33 θ drive motor 34 X-axis table 35 Lifting cylinder 37 Y-axis table 39 X-axis motor 43 Y-axis motor 50, 51
TV camera 60 Crimping means 61 Cradle 62 Crimping blade

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hideki Nomoto 3-16-3 Higashi, Shibuya-ku, Tokyo Inside Hitachi Electronics Engineering Co., Ltd. (72) Inventor Go Wada 3-3-1-3 Higashi, Shibuya-ku, Tokyo Hitachi Electronics Engineering Co., Ltd.

Claims (5)

[Claims] 1. A panel assembly comprising a laminated body of upper and lower transparent substrates, a plurality of TCPs mounted on at least two sides of one transparent substrate, and a PCB on which an ACF is attached,
In a device for crimping each other while connecting leads of TCP and PCB, a transport unit which can reciprocate at least between a loading / unloading station for mounting the PCB and the panel assembly and a crimping station provided with a crimping means is provided. The transport unit is provided with a PCB mounting portion for mounting the PCB in a state where the PCB is positioned at a predetermined position, and a vertically moving means for the PCB mounting portion. Up and down moving means, and the panel assembly mounted on the PCB
Position adjusting means for aligning the position of the PCB with the CB; further, a position detecting means of the panel assembly is provided in the transport unit; and a position detecting means of the PCB mounted on the PCB mounting portion is provided in the crimping station. What is claimed is: 1. A liquid crystal panel PCB crimping apparatus characterized by being arranged. 2. The apparatus according to claim 1, wherein the position adjusting unit of the panel mounting unit is configured to be capable of adjusting a position in a transport direction of the transport unit, a direction orthogonal to the transport direction, and a direction of rotating in the horizontal direction. 2. The liquid crystal panel PCB bonding apparatus according to claim 1, wherein: 3. The liquid crystal panel PCB bonding apparatus according to claim 1, wherein the PCB mounting table and the panel mounting section are provided with vacuum suction means for sucking and holding the PCB and the panel assembly, respectively. . 4. The position detecting means on the side of the transport unit is provided with a T of a panel assembly mounted on the panel mounting portion.
A panel photographing television camera for detecting the position of the alignment mark provided on the CP from below is mounted, and a PCB photographing television for detecting the position of the alignment mark of the PCB from above is mounted on the crimping station. 2. The apparatus according to claim 1, wherein a camera is provided. 5. The television camera for photographing a PCB is disposed at a predetermined operating position when detecting an alignment mark of the PCB, and when the crimping blade constituting the crimping means operates, the television camera for photographing the crimping blade. The PCB bonding apparatus for a liquid crystal panel according to claim 4, wherein the apparatus can be retracted from a movement locus.