JP6675356B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting device.

  2. Description of the Related Art A display device such as a liquid crystal display or an organic EL display includes an array process for forming circuits and signal lines on a glass plate, a cell process for forming a panel as a substrate constituting a display region, and driving outside a display region in the panel. It is manufactured through a module process for mounting a driver IC for the device.

  As a method for mounting a driver IC, a method using a flexible film-shaped electronic component on which a driver IC such as a COF (chip on film) is mounted has been conventionally used. This is a method in which a terminal of an electronic component is crimped and connected to an electrode formed by being exposed in a direction parallel to a display surface from a periphery of a display area of a panel (see Patent Document 1).

  For connection of such electronic components, an anisotropic conductive film (ACF: Anisotropic Conductive Film), which secures the conductivity between the electrode and the terminal by heat compression, is used.

Japanese Patent No. 2971180

  In recent years, display devices have been increasing in screen size, while there has been a strong demand for suppressing the overall size of the display device. For this reason, the width other than the display area is made as narrow as possible. That is, it is necessary to reduce the width of a bezel, which is a frame or an edge around a display area of a product such as a television, a display, and a smartphone. When the width of the bezel is narrow as described above, there is also an advantage that, when a large screen is realized by combining a plurality of display devices, boundaries between the display devices are less noticeable.

  A substrate constituting a panel of a display device is a substrate in which a pair of glass plates are bonded. Then, an electrode forming portion (hereinafter simply referred to as an “electrode forming portion”), which is a crimping portion of an electronic component, at a peripheral portion of the panel, breaks an edge of one glass plate to expose the other glass plate. Part. When the width of such an electrode forming portion is large, the width of the bezel becomes large. For this reason, it is necessary to make the width of the electrode formation portion very short, and it has been difficult to secure conductivity by COF pressure bonding.

  The present invention has been proposed in order to solve the above-described problems, and mounts an electronic component on an electrode provided on a side surface of a substrate and can secure a conductive connection. It is intended to provide a device.

In order to achieve the above object, an electronic component mounting apparatus according to the present invention includes a holding unit configured to hold a flat substrate having a display area and having electrodes on side surfaces by exposing the electrodes and holding the flat substrate. And an attaching portion for attaching an electronic component along the side surface of the substrate to the electrode of the substrate, wherein the holding portion has a pair of pressing portions sandwiching an opposing flat surface of the substrate. The sticking unit includes a crimping unit that is driven in a direction to contact and separate from the side surface of the substrate and presses the electronic component against the side surface , and a heating unit that heats the crimping unit.

At least one of the previous SL pair of pressing portions may have a non-slip member in contact with the substrate. At least one of the pair of pressing parts may be provided with an auxiliary heating part near a side surface of the substrate. At least one of the pair of holding portions may have a suction pad in contact with the substrate.

  One of the pair of pressing portions is a movable-side pressing member that moves in a direction of coming into contact with and separating from the substrate, and the other of the pair of pressing portions is a fixed-side pressing member that supports the substrate in a fixed position after holding the substrate. Is also good.

The fixed-side press and the movable-side press may include a suction pad that is in contact with the substrate, and a suction force of the fixed-side press on the substrate may be larger than a suction force of the movable-side press on the substrate.

  The table has a table that supports the substrate in a horizontal state, the sticking unit has an advance / retreat mechanism that moves the pressure bonding unit in a horizontal direction with respect to the table, and the holding unit includes the table and the sticking unit. And may be arranged between them.

  The electronic device may include a delivery device that is rotatably provided so that the electronic component in a horizontal state is in a vertical state, and that passes the electronic component to the crimping portion.

  A temporary crimping device having the holding portion, the sticking portion, the crimping portion and the heating portion, and a main crimping device having the holding portion, the sticking portion, the crimping portion and the heating portion; The holding unit of the crimping device may hold the substrate at a higher pressure than the holding unit of the temporary crimping device.

  According to the present invention, an electronic component is mounted on an electrode provided on a side surface of a substrate to enable conductive connection.

FIG. 2 is a perspective view illustrating a substrate and an electronic component attached according to the embodiment. FIG. 2 is a partial side view illustrating a basic configuration of the electronic component mounting apparatus according to the embodiment. It is a partial side view showing the temporary press-fit device of an embodiment. FIG. 4 is a perspective view of the embodiment of FIG. 3. FIG. 4 is a partial side view illustrating an imaging unit of the embodiment in FIG. 3. FIG. 4 is a partially transparent perspective view showing an imaging unit of the embodiment in FIG. 3. FIG. 4 is a partial side view showing temporary crimping of the embodiment of FIG. 3. FIG. 2 is a partial cross-sectional side view showing the main crimping device of the embodiment. FIG. 9 is a perspective view showing the final pressure bonding head of the embodiment in FIG. 8. FIG. 9 is a partial cross-sectional side view showing the final pressure bonding of the embodiment of FIG. 8. It is a block diagram showing a control device of an embodiment.

  An embodiment of the present invention (hereinafter, referred to as the present embodiment) will be specifically described with reference to the drawings.

[Implementation target]
With reference to FIG. 1, a substrate 1 and an electronic component 2 that are attached to each other in this embodiment will be described. The substrate 1 is a plate-shaped member having an electrode 11 on a side surface. The substrate 1 can be, for example, a substantially rectangular parallelepiped liquid crystal panel that has undergone an array process and a cell process. The electrode 11 is a conductive member formed on the side surface of the substrate 1 and extending in the thickness direction of the substrate 1 (up and down (vertical) direction when the substrate 1 is horizontal as shown in FIG. 1).

  A plurality of electrodes 11 are arranged side by side on one long side 1a side and one short side 1b side of the substrate 1 with a space therebetween. The plurality of electrodes 11 are arranged as a plurality of electrode groups. Each electrode 11 is connected to an internal circuit via a signal line. A plurality of alignment marks 12 are provided on the side surface of the substrate 1. The alignment mark 12 is a member having a specific shape that is used for alignment between an electronic component 2 and an electrode group, which will be described later, by being imaged. A pair of alignment marks 12 is provided for each electrode group with a plurality of electrodes 11 interposed therebetween.

  Although not shown, the substrate 1 is placed on a table and moved and positioned in a horizontal direction. The table is an XYθ table that is displaced in the X and Y directions orthogonal to the horizontal plane and in the θ direction with the horizontal plane as a rotation plane. The substrate 1 is placed on a table with a surface on which a display area is formed (hereinafter, referred to as a “display surface”) in a horizontal state. That is, the table supports the substrate 1 in a horizontal state.

  The electronic component 2 is connected to the electrode 11 via a tape-shaped anisotropic conductive film. The anisotropic conductive film is a film obtained by dispersing metal particles in a thermosetting resin to form a film. The anisotropic conductive film achieves surface-direction insulation and thickness-direction conductivity by pressing the terminal of the electronic component 2 against the electrode 11 while heating. Note that the electronic component 2 of the present embodiment has a rectangular shape and has a driver IC mounted thereon. In the following description, when the electronic component 2 is attached to the long side 1a of the substrate 1, the direction along the long side 1a is defined as the width direction of the electronic component 2, and when attached to the short side 1b, the direction along the short side 1b is defined. The width direction is the electronic component 2.

  A plurality of alignment marks 22 are also provided on the surface of the electronic component 2 that is pressed against the electrode 11. The alignment mark 22 is a member having a specific shape that is used for alignment with the electrode 11 by being imaged. The alignment mark 22 of each electronic component 2 is provided at a position corresponding to a pair of alignment marks 12 provided for each electrode group of the substrate 1.

[Basic configuration]
Next, a basic configuration of the electronic component mounting apparatus 100 will be described with reference to FIG. The electronic component mounting apparatus 100 includes a holding unit 200 and a sticking unit 300. The holding unit 200 is a component that holds the substrate 1 in the vicinity of a side surface on which the electronic component 2 is pressed. The holding section 200 has a pair of holding sections 210. The holding portion 210 is a member that sandwiches the opposing flat surface of the substrate 1. The holding section 210 is arranged vertically above and below the substrate 1. The upper holding portion 210 is a movable-side holding member 211 that moves in a direction of coming into contact with and separating from the substrate 1. The lower presser 210 is a fixed presser 212 that supports the substrate 1 at a fixed position.

  The attaching unit 300 is a device that attaches the electronic component 2 to the electrode 11 of the substrate 1 held by the holding unit 200 in a direction orthogonal to a plane (display surface) of the substrate 1. The attaching section 300 has a crimping section 310 and a heating section 320. The crimping unit 310 is a device that is provided so as to be movable in the direction in which it comes into contact with and separates from the substrate 1 in the horizontal direction, and presses the electronic component 2 against the side surface of the substrate 1. The heating unit 320 is a member that heats the contact surface of the crimping unit 310 with the electronic component 2.

  The electronic component mounting apparatus 100 having the basic configuration as described above includes an apparatus configured as the temporary bonding apparatus 110 and an apparatus configured as the final bonding apparatus 120. Hereinafter, each device will be described. In the following description, the movable-side press of the temporary crimping device 110 will be described as 211A, the fixed-side press will be described as 212A, and the movable-side press of the main crimping device 120 will be described as 211B and the fixed-side press will be described as 212B.

[Temporary crimping device]
The temporary crimping device 110 is a device for temporarily crimping the electronic component 2 to the side surface of the substrate 1 as shown in FIGS. Temporary pressure bonding refers to attaching the electronic component 2 to the side surface of the substrate 1 by applying heat and pressure in a state where the positions of the electronic component 2 and the electrode 11 are aligned and utilizing the adhesiveness of the anisotropic conductive film. In this state, the board 1 and the electronic component 2 are not electrically connected. This is performed by thermocompression bonding with a relatively weak force and a low temperature. For example, several kilograms are heated and pressed at about 150 ° C. Thereby, it is possible to perform the pasting to a precise position, although weak, in a short time. However, in the temporary crimping, since the positioning accuracy with respect to the electrode 11 is required, it is preferable that the electronic components 2 are attached one by one.

  The crimping section 310 of the temporary crimping device 110 has a temporary crimping head 311 as shown in FIG. As shown in FIG. 4, the temporary pressure bonding head 311 is a substantially rectangular parallelepiped block-shaped member. The temporary pressure bonding head 311 is provided with a pressing portion 311 a protruding in a band shape extending in the width direction of the electronic component 2 on a surface facing the side surface of the substrate 1. The pressing portion 311a has a flat pressing surface facing the side surface of the substrate 1.

  A suction hole 311b is formed in the pressing surface. The suction hole 311b is connected to a decompression device having a pipe, a pump, a valve, and the like (not shown), and forms a vacuum chuck by decompression by the decompression device. The length in the width direction of the pressing portion 311a is set to be 1.0 times or more and less than 2.0 times the width of one electronic component 2. More preferably, the width is set to be longer than the width of one electronic component 2 but shorter than 1.5 times the width of one electronic component 2. That is, the width of the pressing portion 311a is a length suitable for attaching the electronic components 2 one by one.

  The heating unit 320 is built in the temporary pressure bonding head 311. As the heating unit 320, for example, a heater that generates heat by applying a voltage is used. The heater is embedded in the temporary pressure bonding head 311 at a length equal to or greater than the width of the pressure unit 311a on the back of the pressure unit 311a.

  Further, the temporary crimping device 110 has a positioning mechanism for positioning the electrode 11 of the substrate 1 and the electronic component 2. The positioning mechanism includes an advance / retreat mechanism 312, an elevating mechanism 313, and a rotating mechanism 314 (see FIG. 11). The reciprocating mechanism 312 is a mechanism that drives the temporary pressure bonding head 311 in a direction of coming and coming from the side surface of the substrate 1. That is, the advance / retreat mechanism 312 moves the crimping unit 300 forward / backward relative to the table in the horizontal direction. Thereby, the electronic component 2 can be crimped to the side surface of the substrate 1 in a horizontal state. As the advance / retreat mechanism 312, for example, an air cylinder can be used. Preferably, a drive cylinder that moves the temporary pressure bonding head 311 and an adjustment cylinder that adjusts the pressing force may be combined.

  The elevating mechanism 313 is a mechanism that drives the temporary pressure bonding head 311 in the thickness direction of the substrate 1. As the elevating mechanism 313, for example, a ball screw, an air cylinder, or the like can be used. The rotating mechanism 314 is a mechanism for displacing the temporary pressure bonding head 311 in the θ direction about an axis parallel to the advancing / retreating direction indicated by a dashed line in FIG. As the rotating mechanism 314, for example, a motor or a combination of a motor and a gear mechanism can be used.

  The positioning mechanism further has an imaging unit 315 as shown in FIG. The imaging unit 315 has an upper imaging device 315A and a lower imaging device 315B. The imaging device 315A is a camera that images the alignment mark 12 on the side surface of the substrate 1 as shown in FIG. The imaging devices 315A are arranged in a pair in the side direction of the substrate 1. The pair of imaging devices 315A are arranged at intervals such that the pair of alignment marks 12 enter the respective visual field ranges. The imaging device 315 </ b> A is arranged with a space allowing the temporary pressure bonding head 311 to enter between the temporary pressure bonding head 311 and the side surface of the substrate 1 when the temporary pressure bonding head 311 is raised by the lifting mechanism 313.

  The imaging device 315B is a camera that images the alignment mark 22 of the electronic component 2 as shown in FIG. The imaging devices 315B are arranged in a pair in the width direction of the electronic component 2. The pair of imaging devices 315B are arranged at intervals such that the pair of alignment marks 22 enter the respective visual field ranges. The imaging device 315B can be moved independently of the temporary pressure bonding head 311 in the width direction of the temporary pressure bonding head 311 (horizontal direction orthogonal to the direction of movement of the temporary pressure bonding head 311) by a first horizontal moving mechanism (not shown). Is provided.

  Further, as shown in FIG. 3, the temporary crimping device 110 has a delivery device 500 that passes the electronic component 2 to the temporary crimping head 311 of the crimping unit 300. The delivery device 500 receives the electronic component 2 punched out of the carrier tape by a punching device (not shown) by suction, transports, and rotates the electronic component 2 so that the electronic component 2 is transferred to the temporary pressure bonding head 311 in the vertical direction. To hold. Thereby, the electronic component 2 can be set in a direction in which the electronic component 2 can be pressed against the side surface of the substrate 1 in a horizontal state. In addition, the tape-shaped anisotropic conductive film is attached to the electronic component 2 punched by the punching device before being delivered to the delivery device 500.

  Further, the temporary crimping device 110 has a second horizontal movement mechanism, not shown. The second horizontal movement mechanism moves the temporary pressure bonding head 311, the imaging device 315 </ b> A, and the imaging device 315 </ b> B that can move in the width direction of the temporary pressure bonding head 311 independently of the temporary pressure bonding head 311, in the width direction of the temporary pressure bonding head 311. This is a mechanism that moves together along.

[Main crimping device]
As shown in FIGS. 8 to 10, the final pressure bonding device 120 is a device for permanently pressing the temporarily pressed electronic component 2 to the side surface of the substrate 1. The term “compression bonding” means that the electronic component 2 and the electrode 11 are electrically connected by an anisotropic conductive film, and that the electronic component 2 is fixed to the substrate 1 by thermosetting the anisotropic conductive film. This is performed by thermocompression bonding with a relatively strong force and a high temperature. For example, several tens of kg are heated and pressed at 300 ° C. Thereby, the electronic component 2 and the electrode 11 are electrically connected by the anisotropic conductive film, and the substrate 1 and the electronic component 2 are completely fixed. In addition, since the final compression is performed on the electronic component 2 that has already been provisionally compression-bonded to the electrode 11, a plurality of pieces can be simultaneously compression-bonded simultaneously.

  As shown in FIG. 8, the crimping section 310 of the final crimping apparatus 120 has a final crimping head 316. As shown in FIG. 9, the pressure bonding head 316 is a member having a substantially rectangular parallelepiped shape, and a surface protruding in a side direction of the substrate 1 in a side direction of the substrate 1 on a surface opposed to a side surface of the substrate 1 indicated by a dotted line in the drawing. A pressure part 316a is provided. The pressing portion 316a has a flat pressing surface facing the side surface of the substrate 1. The length of the pressing portion 316a in the side direction of the substrate 1 is at least 1.0 times the width of one electronic component 2. More preferably, the width is set to 2.0 times or more the width of one electronic component 2. That is, the width of the pressing portion 316a is a length suitable for attaching two or more electronic components 2 at a time.

  The heating unit 320 is built in the final pressure bonding head 316. As the heating unit 320, for example, a heater that generates heat by applying a voltage is used. The heater is embedded in the main pressure bonding head 316 at a length equal to or longer than the pressure unit 316a at the back of the pressure unit 316a.

  An advance / retreat mechanism 317 is connected to the final pressure bonding head 316 (see FIG. 11). The reciprocating mechanism 317 is a mechanism that drives the main pressure bonding head 316 in a direction of coming into contact with and separating from the side surface of the substrate 1. That is, the advance / retreat mechanism 317 moves the crimping section 300 forward / backward relative to the table in the horizontal direction. Thereby, the electronic component 2 can be crimped to the side surface of the substrate 1 in a horizontal state. As the advance / retreat mechanism 317, for example, an air cylinder can be used. Preferably, a drive cylinder for moving the final pressure bonding head 316 and an adjusting cylinder for adjusting the pressing force may be combined.

  Further, the attraction force of the fixed-side presser 212B of the main crimping device 120 to the substrate 1 is set to be larger than the attraction force of the movable-side presser 211B to the substrate 1. More specifically, the movable-side presser 211B has a non-slip member 211a that comes into contact with the substrate 1. As the non-slip member 211a, a sheet-shaped member having flexibility such as rubber or gel and having a large surface friction coefficient is used.

  The fixed-side presser 212B has a suction pad 212a in contact with the substrate 1. The suction pad 212a is a bowl-shaped elastic body, and is a member that suction-holds the pressed member. The suction pads 212a are arranged in a plurality of rows on the support surface of the substrate 1 of the fixed-side presser 212. Each suction pad 212a communicates with a suction hole (not shown) provided in the fixed-side presser 212B. The suction hole is connected to a decompression device having a pipe, a pump, a valve, and the like, and forms a vacuum chuck by decompression by the decompression device.

  The fixed-side presser 212 has an auxiliary heating unit 212c. The auxiliary heating unit 212c is a member that is provided near the side surface of the substrate 1 supported by the fixed-side presser 212B and performs heating in addition to heating of the heating unit 320 of the final pressure bonding head 316. As the auxiliary heating unit 212c, a heater that generates heat by applying a voltage is used.

  Further, the final crimping device 120 has a buffer device 330. The buffer device 330 includes a cushion sheet 331, a supply reel 332, and a collection reel 333. The cushion sheet 331 is a sheet having a cushioning property interposed between the electronic component 2 and the final pressure bonding head 316. Further, the cushion sheet 331 prevents the anisotropic conductive film from adhering to the final pressure bonding head when the anisotropic conductive film is heat-pressed. The supply reel 332 is a reel on which the cushion sheet 331 is wound and which sends out the cushion sheet 331 by rotation. The collection reel 333 is a reel that winds and collects the cushion sheet 331.

[Control device]
The control device 400 is a device that controls each part of the electronic component mounting apparatus 100. The control device 400 can be constituted by, for example, a dedicated electronic circuit or a computer operated by a predetermined program. In other words, an XYθ table, an advance / retreat mechanism 312 for the temporary pressure bonding head 311, a positioning mechanism including a lifting / lowering mechanism 313, and a rotating mechanism 314, an advance / retreat mechanism 317 for the final pressure bonding head 316, a heating section 320 of the attaching section 300, and the temporary pressure bonding apparatus 110. As for the control of the imaging unit 315, the first horizontal moving mechanism, the second horizontal moving mechanism, the vacuum chuck, the delivery device 500, the buffer device 330, and the like, the control contents are programmed, and the processing by the PLC, CPU, and the like is performed. It is executed by the device and can correspond to various mounting specifications.

  The contents to be specifically controlled include the position and direction of the substrate 1, the position and pressure of the temporary pressure bonding head 311, the position and pressure of the main pressure bonding head 316, the position and imaging timing of the imaging unit 315, and the heating temperature of the heating unit 320. , The suction timing of the vacuum chuck, the position of the delivery device 500, and the sending and collecting of the buffer device 330.

  The configuration of the control device 400 for executing the operation of each unit as described above will be described with reference to FIG. 11 which is a virtual functional block diagram. That is, the control device 400 includes the mechanism control unit 40, the position recognition unit 41, the positioning unit 42, the storage unit 43, the setting unit 44, and the input / output control unit 45.

  The mechanism control unit 40 drives the XYθ table, the advance / retreat mechanism 312 of the temporary pressure bonding head 311, the elevating mechanism 313, the rotating mechanism 314, the forward / backward mechanism 317 of the final pressure bonding head 316, the heating unit 320, the temporary pressure bonding device 110, and the imaging unit 315. And a processing unit that controls the drive sources of the first horizontal mechanism and the second horizontal mechanism, the valves and pumps of the vacuum chuck, the drive sources of the delivery device 500 and the buffer device 330, and the like.

  The position recognition unit 41 recognizes the position of the alignment mark based on the image captured by the imaging unit 315. The positioning unit 42 recognizes the deviation between the two based on the position of the alignment mark recognized by the position recognition unit 41, and causes the mechanism control unit 40 to position the substrate 1 and the electronic component 2 so that the deviation is corrected. To instruct.

  The storage unit 43 is a configuration unit that stores information necessary for control of the present embodiment. The setting unit 44 is a processing unit that sets information input from the outside in the storage unit 43. For example, a heating temperature, a pressure for pressing, and the like can be set. The input / output control unit 45 is an interface that controls signal conversion and input / output with each unit to be controlled.

  Further, the input device 46 and the output device 47 are connected to the control device 400. The input device 46 is an input unit such as a switch, a touch panel, a keyboard, and a mouse for an operator to operate the electronic component mounting apparatus 100 via the control device 400. The above-mentioned heating temperature, pressure for pressing and the like can be set by inputting from the input device 46.

  The output device 47 is an output unit such as a display, a lamp, or a meter that makes information for confirming the state of the device visible to an operator. The above-mentioned heating temperature, pressure for pressing and the like are displayed on the output device 47.

[motion]
The operation of the present embodiment as described above will be described below with reference to the drawings.
(basic action)
First, the basic operation of the electronic component mounting apparatus 100 will be described with reference to FIG. First, the substrate 1 is placed horizontally on an XYθ table (not shown) at a carry-in position (not shown). The substrate 1 placed on the XYθ table is moved by the movement of the XYθ table so that the side of the substrate 1 having the side surface on which the electronic component 2 is mounted is positioned between the movable holder 211 and the fixed holder 212. . At this time, the XYθ table moves the substrate 1 between the movable-side presser 211 and the fixed-side presser 212 at a height higher than the fixed-side presser 212, and then lowers the substrate 1 to fix the lower surface of the substrate 1 It is brought into contact with the side presser 212. In this state, by lowering the movable-side presser 211, the vicinity of the edge of the substrate 1 is sandwiched between the movable-side presser 211 and the fixed-side presser 212.

  Then, the press-bonding unit 310 heated by the heating unit 320 presses the electronic component 2 against the electrode 11 on the side surface of the substrate 1 and heat-presses it. Thereby, the electronic component 2 is attached to the side surface of the substrate 1 in a direction orthogonal to the plane of the substrate 1 while ensuring conductivity with the electrode 11. The details of the operation of the thermocompression bonding in the temporary compression bonding and the thermocompression bonding in the final compression bonding will be described below.

(Temporary crimping)
Next, the operation of the temporary crimping by the temporary crimping device 110 will be described with reference to FIGS. First, as shown in FIG. 3, an XYθ table (not shown) positions the substrate 1 between the movable-side presser 211A and the fixed-side presser 212A of the temporary crimping device 110. That is, the holding unit 200 is arranged between the XYθ table and the sticking unit 300. Then, the movable-side presser 211A descends to clamp the vicinity of the side surface of the substrate 1 with the fixed-side presser 212A. This operation is the same as the basic operation described above.

  At this time, it is preferable to press a position as close to the side as possible so that the substrate 1 is not distorted. However, if the electronic component 2 is warped too close to the side surface, the electronic component 2 may interfere with the fixed-side presser 212A. The length d1 of the substrate 1 protruding from the pressing portion 210, that is, the distance protruding in the horizontal direction from the end of the fixed-side pressing portion 212A is preferably 5 mm to 8 mm.

  The temporary pressure bonding head 311 of the pressure bonding section 310 is heated by the heating section 320. On the other hand, the delivery device 500 is punched out by a punching device (not shown), a tape-shaped anisotropic conductive film is adhered thereto, and holds the electronic component 2 supplied in a horizontal state by vacuum suction. After transferring the electronic component 2 to the delivery position to the temporary pressure bonding head 311 while keeping the electronic component 2 in a horizontal state, the delivery device 500 stands by while rotating the electronic component 2 by 90 degrees so as to be in the vertical state. Then, as shown in FIG. 3, the temporary pressure bonding head 311 is lowered, and the electronic component 2 held in a vertical state by the delivery device 500 is sucked by the vacuum chuck as shown in FIG. It is held by suction in the hole 311b. At this time, the imaging device 315B is retracted in the width direction of the temporary pressure bonding head 311 by the first horizontal movement mechanism, and does not interfere with the delivery device 500.

  The temporary pressure bonding head 311 once moves to the raised position shown in FIG. 3 and the delivery device 500 retreats to a supply position (not shown) of the electronic component 2 so as to receive the next electronic component 2. The part 2 is lowered again to the received height. In parallel with or after the temporary compression head 311 is lowered, the lower imaging device 315B in the imaging unit 315 horizontally moves to a position facing the temporary compression head 311 as shown in FIGS. The alignment mark 22 of the electronic component 2 held by the temporary pressure bonding head 311 is imaged. The position recognition unit 41 recognizes the position of the alignment mark of the electronic component 2 from the captured image.

  On the other hand, the upper imaging device 315A in the imaging unit 315 images the alignment mark 12 on the side surface of the substrate 1 as shown in FIGS. The position recognition unit 41 recognizes the position of the alignment mark 12 on the side surface of the substrate 1 from the captured image.

  The positioning unit 42 is moved by the positioning mechanism so that the gap between the alignment mark 12 on the side surface of the substrate 1 and the alignment mark 22 of the electronic component 2 is corrected. Adjust the position of. Further, the provisional pressure bonding head 311 is raised to move the pressurizing portion 311a that has sucked the electronic component 2 to a position where the alignment mark 22 of the electronic component 2 matches the alignment mark 12 on the side surface of the substrate 1. The alignment may be performed so that the positional relationship between the electrode 11 of the substrate 1 and the terminal of the electronic component 2 is matched. Therefore, the alignment is performed so that the alignment marks 12 and 22 are aligned. is there. It is not always necessary to perform alignment so that the positions of the alignment marks 12 and 22 match each other.

  Then, as shown in FIG. 7, the mechanism control unit 40 moves the temporary pressure bonding head 311 to the side surface of the substrate 1 and heat-presses the electronic component 2 via the anisotropic conductive film. The temperature at this time may be about 150 ° C. The pressure may be several kilograms.

  Next, the vacuum chuck of the temporary pressure bonding head 311 is released, and the temporary pressure bonding head 311 is separated from the substrate 1. Further, when another electronic component 2 is mounted on the side surface of the substrate 1, the above operation is repeated while the holding by the holding unit 200 is continued, and the electronic component 2 is sequentially mounted on each electrode group on the side surface of the substrate 1. . At this time, the temporary pressure bonding head 311 and the imaging unit 315 (the imaging devices 315A and 315B) move integrally along the side of the substrate 1 by a horizontal driving unit (not shown). When the mounting of the electronic components 2 on all the electrode groups on the side surface of the substrate 1 is completed, the movable-side presser 211A rises to release the substrate 1. By such an operation, a plurality of electronic components 2 are attached to the electrodes 11 provided on one side surface of the substrate 1. The substrate 1 is moved to the main crimping device 120 using the XYθ table. At this time, the substrate 1 is conveyed by being raised to a height position where the electronic component 2 temporarily crimped does not interfere with the fixed-side presser 212A. Accordingly, the movable-side presser 211A is lifted to a height position where the raised substrate 1 does not come into contact with the movable-side presser 211A and released.

(Final pressure bonding)
Next, the operation of the final pressure bonding of the final pressure bonding apparatus 120 will be described with reference to FIGS. First, as shown in FIG. 8, an XYθ table (not shown) positions the substrate 1 to which the electronic component 2 has been temporarily press-bonded between the movable-side presser 211B and the fixed-side presser 212B of the main press-fitting device 120. That is, the holding unit 200 is arranged between the XYθ table and the sticking unit 300. At this time, the movable-side presser 211B is separated from the fixed-side presser 212B so as to form a space through which the board 1 to which the electronic component 2 is temporarily pressed can pass therebetween. The XYθ table (not shown) holds the board 1 at a height such that the electronic component 2 temporarily crimped on the board 1 does not interfere with the fixed-side presser 212B, and holds the board 1 with the movable-side presser 211B. The substrate 1 is moved into the space between the pressers 212B, and then the substrate 1 is lowered to bring the lower surface of the substrate 1 into contact with the fixed-side presser 212B for positioning. Thereafter, the movable-side presser 211B descends to clamp the vicinity of the side surface of the substrate 1 with the fixed-side presser 212B.

  At this time, as shown by the two-dot chain line in FIG. 10, even in the case where the substrate 1 is not distorted and the electronic component 2 is warped (warp toward the center of the substrate 1) as in the case of the temporary crimping, the electron To prevent the component 2 from interfering with the holding unit 200, the length d2 protruding from the pressing unit 210 of the substrate 1, that is, the distance protruding in the horizontal direction from the end of the fixed-side pressing unit 212B is 5 mm to 8 mm. Is preferred.

  Even if the electronic component 2 is warped toward the center of the substrate 1, the side portion of the substrate 1 to which the electronic component 2 is temporarily pressed is made to enter between the movable-side presser 211B and the fixed-side presser 212B. At this time, the edge of the substrate 1 is projected from the fixed-side presser 212B by an extra amount in anticipation of the warpage of the electronic component 2, and in this state, the lower surface of the substrate 1 is lowered to a height in contact with the fixed-side presser 212B. The substrate 1 may be moved back so that the amount of protrusion of the edge of the substrate 1 from the fixed-side presser 212B becomes a predetermined amount. Alternatively, the lower surface of the substrate 1 is lowered to a height close to the fixed holding member 212B, and in this state, the substrate 1 is moved back so that the amount of protrusion of the edge portion of the substrate 1 becomes a predetermined amount of protrusion. Alternatively, the lower surface of the substrate 1 may be brought into contact with the fixed-side presser 212B.

  By operating in this manner, even when the electronic component 2 temporarily crimped to the substrate 1 is warped, the electronic component 2 temporarily crimped when the substrate 1 is lowered toward the fixed-side presser 212B. It is possible to prevent the component 2 from being bent by interfering with the fixed-side presser 212B, the temporary crimping portion being peeled off and falling off due to the reaction force of the bending, and the terminal being damaged by the bending.

  When the substrate 1 is pulled back, the warped electronic component 2 may come into contact with the fixed-side presser 212B depending on the distance to be pulled back. However, since the warped electronic component 2 is formed of a flexible film-shaped member, even if a force acts in a direction to eliminate the warp, there is almost no possibility that the temporary crimping portion is peeled off. Therefore, the length of the edge of the substrate 1 protruding from the holding unit 200 can be minimized.

  In the fixed-side presser 212, the lower surface of the substrate 1 is suction-held by the suction pad 212a by a vacuum chuck. The upper surface of the substrate 1 is pressed by the non-slip member 211a. Then, while the main bonding head 316 of the bonding section 310 is being heated by the heating section 320, the main bonding head 316 moves to the side surface of the substrate 1 and heat-presses the electronic component 2. At this time, the board 1 and the electronic component 2 are preheated by the auxiliary heating unit 212c. The heating temperature of the heating section 320 is, for example, about 300 ° C., and the heating temperature of the auxiliary heating section 212c is, for example, about 100 ° C.

  In addition, a cushion sheet 331 is interposed between the final pressure bonding head 316 and the electronic component 2 as shown in FIG. Anisotropic conductive films contain very small conductive particles of 3-5 microns. In the present embodiment, since pressure is applied across the cushion sheet 331, minute unevenness and inclination of the pressing surface of the main pressure bonding head 316 are absorbed, and pressure is uniformly applied. In addition, heat for heating can be made uniform. When the cushion sheet 331 is used several times to several tens of times, it is wound up and a new part is used for pressurization.

  After the final pressure bonding, the final pressure bonding head 316 separates from the substrate 1 as shown in FIG. Furthermore, the movable-side presser 211B moves up to release the substrate 1. At this time, the substrate 1 is being sucked by the vacuum chuck via the suction pad 212a of the fixed-side presser 212B. For this reason, even if the substrate 1 remains on the fixed-side presser 212B and the substrate 1 is stuck to the non-slip member 211a of the movable-side presser 211B due to the attraction force caused by the material, the substrate 1 is raised with the rise of the movable-side presser 211B. Is prevented from rising.

  When the movable-side presser 211B has finished ascending, the suction of the suction pad 212a is released, and the substrate 1 on which the electronic component 2 has been completely pressed is transported to the next step by an XYθ table (not shown). For example, when the electronic component 2 is mounted on the long side of the substrate 1 and then the electronic component 2 is mounted on the short side, the substrate 1 is transported to the temporary crimping device 110 for the short side.

  Note that performing the preliminary pressure bonding and the main pressure bonding separately as described above has the following meaning. That is, in the temporary crimping, since it is necessary to attach the electronic component 2 to an accurate position, a positioning mechanism is required, and the configuration is complicated. If a strong pressure and a high temperature are required, the size of the apparatus becomes very large. On the other hand, although a high pressure and a high temperature are required for the final pressure bonding, the configuration is simple, and the apparatus does not need to be excessively large. For this reason, the temporary crimping device 110 for performing accurate bonding and the main crimping device 120 for performing bonding at high pressure and high temperature are separately configured. As described above, since the final bonding apparatus 120 performs the bonding at a higher pressure than the temporary bonding apparatus 110, the holding unit 200 of the final bonding apparatus 120 is attached to the temporary bonding apparatus 110 so that the substrate 1 does not shift. The substrate 1 is held at a higher pressure than the holding unit 200. For example, the pressure for holding the substrate 1 by the movable-side press 211B and the fixed-side press 212B is larger than the pressure for holding the substrate 1 by the movable-side press 211A and the fixed-side press 212A.

[Effects]
(1) The electronic component mounting apparatus 100 of the present embodiment includes a holding unit 200 that holds a flat substrate 1 having an electrode 11 on a side surface while exposing the electrode 11, and a substrate 1 held by the holding unit 200. And a sticking section 300 for sticking the electronic component 2 to the electrode 11 in a direction perpendicular to the plane of the substrate 1. The attaching section 300 includes a crimping section 310 for pressing the electronic component 2 against the side surface of the substrate 1, and a heating section 320 for heating a contact portion with the crimping section 310.

  For this reason, in a state where the electronic component 2 is held by the holding portion 200, the electronic component 2 can be heat-pressed by the pressing portion 310 to the exposed electrode 11 on the side surface of the substrate 1. A conductive connection is made possible.

(2) The holding section 200 has a pair of holding sections 210 that sandwich the opposing plane of the substrate 1. For this reason, the electronic component 2 can be adhered while holding the substrate 1 in a fixed posture by being sandwiched by the holding portions 210. In other words, even when an electronic component is crimped from above to the exposed surface of the horizontal electrode whose lower surface is supported, even if there is no backup member, flatness is maintained without distortion. Pasting can be performed.

(3) At least one of the pair of holding parts 210 has a non-slip member 211a that comes into contact with the substrate 1. For this reason, even when a force is applied in a direction intersecting the direction sandwiched by the pressing portions 210 during the pressure bonding by the pressure bonding portion 310, the substrate 1 is stabilized without slipping.

(4) At least one of the pair of holding parts 210 is provided with an auxiliary heating part 212 c near the side surface of the substrate 1. For this reason, a heating temperature required for the final pressure bonding can be secured. That is, even when the electronic component is not pressed from above and below and can not be heated, as in the case where the electronic component is pressed from above on the horizontal electrode exposed surface whose lower surface is supported, it is possible to perform high-temperature press bonding.

(5) At least one of the pair of holding portions 210 has a suction pad 212a that is in contact with the substrate 1. For this reason, even when a force is applied in a direction intersecting the direction sandwiched by the pressing portions 210 during the pressing by the pressing portion 310, the substrate 1 can be more firmly fixed and prevented from moving.

(6) One of the pair of pressing portions 210 is a movable-side pressing portion 211 that moves in a direction of coming into contact with and separating from the substrate 1, and the other of the pair of pressing portions 210 is a fixed-side pressing portion 212 that supports the substrate 1 in a fixed position. It is. In this manner, by supporting one of the substrates 1 at a fixed position, stable holding is possible.

(7) The attraction force of the fixed-side presser 212 to the substrate 1 is larger than the attraction force of the movable-side presser 211 to the substrate 1. Therefore, when the movable-side presser 211 is separated after the electronic component 2 is pressed and attached, the substrate 1 is prevented from moving together with the movable-side presser 211 due to the attraction force of the fixed-side presser 212. In particular, in the fixed-side presser 212, detachment can be prevented by sucking and holding by the suction pad.

(8) The attaching section 300 has a positioning mechanism for positioning the electrode 11 of the substrate 1 and the electronic component 2. Therefore, the electronic component 2 can be accurately attached to the electrode 11 on the side surface of the substrate 1.

(9) The crimping section 310 has a main crimping head for attaching a plurality of electronic components 2 to the substrate 1 at a time. By sticking a plurality of electronic components 2 at a time in this manner, efficient manufacturing becomes possible. For example, when the electronic components 2 are pasted one by one with high precision by temporary crimping, a plurality of boards can be pasted together in full crimping. In particular, in the final press bonding, since the press bonding is performed at a high pressure and temperature, it takes time for each time. However, by performing the plural presses simultaneously, the manufacturing time can be reduced.

[Other embodiments]
The present invention is not limited to the above embodiment, but includes the following aspects. For example, while the holding unit 200 holds the substrate 1 in a horizontal state, the holding unit 200 may hold the substrate 1 in an upright state, and the crimping unit may crimp the electronic component 2 from the side surface of the substrate 1. The substrate 1 may be a flat plate having an electrode on a side surface. For example, it is not limited to a liquid crystal panel, and may be an organic EL panel.

  Further, when mounting the electronic component 2 on the side surfaces of a plurality of sides such as a long side and a short side on the substrate 1, the temporary crimping and the final crimping are performed on the side of one side, and then the side of the next side is formed. Alternatively, temporary crimping and final crimping may be performed. Alternatively, after performing temporary crimping on the side surfaces of all sides on which the electronic component 2 is mounted, the electronic component 2 may be sequentially crimped on each side where the electronic component 2 is temporarily crimped. Crimping may be performed.

  Further, the length d1 and d2 for projecting the substrate 1 from the holding portion 210 is preferably 5 mm to 8 mm because the size of the warp generated in the electronic component 2 such as a COF having a general size is about 5 mm to 8 mm. When the lengths d1 and d2 are smaller than 5 mm, there is a possibility that the electronic component 2 may interfere with the holding portion 210, and when the lengths d1 and d2 exceed 8 mm, the substrate 1 is likely to be distorted. However, the present invention is not limited to such a length, and a length is set according to the size of the electronic component 2 so that the electronic component 2 does not interfere with the holding portion 210 and the substrate 1 is not distorted. I just need.

  In addition, the table (XYθ table) on which the substrate 1 is placed is moved to the temporary crimping device 110 and the final crimping device 120, and the substrate 1 is positioned with respect to each holding unit 200. It is not limited. For example, an XYθ stage may be separately provided for the temporary crimping device 110 and the final crimping device 120. In this case, a transfer device for the substrate 1 that transfers the substrate 1 between the respective XYθ stages may be disposed between the temporary compression device 110 and the final compression device 120.

  In addition, the final pressure bonding head 316 has a length that allows a plurality of electronic components 2 to be pressure-bonded collectively, but is not limited thereto. For example, a plurality of permanent bonding heads 316 formed to have a length corresponding to the width of one of the electronic components 2 may be arranged side by side according to the mounting interval of the electronic components 2.

  As described above, the embodiment of the present invention and the modification of each unit have been described. However, the embodiment and the modification of each unit are presented as examples, and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims.

DESCRIPTION OF SYMBOLS 1 Substrate 1a Long side 1b Short side 11 Electrode 12,22 Alignment mark 100 Electronic component mounting apparatus 110 Temporary crimping apparatus 120 Main crimping apparatus 200 Holding section 210 Holding section 211, 211A, 211B Movable side holding 211a Non-slip members 212, 212A, 212B Fixed side presser 212a Suction pad 212c Auxiliary heating unit 300 Pasting unit 310 Crimping unit 311 Temporary crimping head 311a Pressurizing unit 311b Suction hole 312, 317 Advancing / retracting mechanism 313 Elevating mechanism 314 Rotating mechanism 315 Imaging section 315A, 315B Imaging apparatus 316 Crimping head 316a Pressurizing unit 320 Heating unit 330 Buffering device 331 Cushion sheet 332 Supply reel 333 Recovery reel 400 Control device 40 Mechanism control unit 41 Position recognition unit 42 Positioning unit 43 Storage unit 44 Setting unit 45 Input / output control unit 46 Input device 4 7 Output device 500 Delivery device

Claims (9)

A holding portion for holding a flat substrate having a display area and having electrodes on side surfaces, exposing and holding the electrodes,
For an electrode of the substrate held by the holding unit, a sticking unit that sticks an electronic component along the side surface of the substrate,
Has,
The holding portion has a pair of pressing portions sandwiching the opposing plane of the substrate,
The sticking unit,
A crimping portion driven in a direction to come into contact with and separate from the side surface of the substrate , and pressing the electronic component against the side surface,
A heating unit for heating the crimping unit,
An electronic component mounting apparatus comprising: The pair of at least one of the holding portion, an electronic component mounting apparatus according to claim 1, wherein a slip preventing member in contact with the substrate. The pair of at least one of the holding portion, an electronic component mounting apparatus according to claim 1 or claim 2, wherein the auxiliary heating unit in the vicinity of the side surface of the substrate is provided. Wherein at least one of the pair of pressing portions, the electronic component mounting apparatus according to any one of claims 1 to 3, characterized in that it has a suction pad in contact with the substrate. One of the pair of pressing portions is a movable-side pressing member that moves in a direction of coming into contact with and separating from the substrate,
The other of the pair of pressing portions, the electronic component mounting apparatus according to any one of claims 1 to 4, characterized in that a stationary retainer for supporting said substrate in a fixed position. The fixed side presser and the movable side presser include a suction pad in contact with the substrate,
6. The electronic component mounting apparatus according to claim 5 , wherein a suction force of the fixed-side press on the substrate is larger than a suction force of the movable-side press on the substrate. Having a table that supports the substrate in a horizontal state,
The sticking portion has an advance / retreat mechanism for moving the crimping portion forward / backward in the horizontal direction with respect to the table,
The holding portion, an electronic component mounting apparatus according to any one of claims 1 to 6, characterized in that it is arranged between the table sticking portion. The electronic component mounting apparatus according to claim 7 , further comprising a delivery device that is rotatably provided so that the electronic component in a horizontal state is in a vertical state, and that passes the electronic component to the crimping portion. The holding unit, the attaching unit, a temporary crimping device having the crimping unit and the heating unit,
The main bonding device having the holding unit, the attaching unit, the pressing unit and the heating unit,
Has,
Wherein the holding portion of the crimping device, the electronic component mounting apparatus according to any one of claims 1 to 8, characterized in that for holding the substrate at a pressure higher than the holding portion of the temporary pressure bonding device.

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