JP5017041B2 - Component mounting method and apparatus - Google Patents

Description

  The present invention relates to a component mounting apparatus and method for mounting a component by crimping the component on a component mounting region of a substrate having a component mounting region at the edge thereof, particularly a substrate represented by a liquid crystal glass panel substrate or a plasma display panel substrate. .

  Conventionally, a substrate such as a liquid crystal display (LCD) panel or a plasma display panel (PDP) substrate (hereinafter referred to as a “panel substrate”), a component such as an electronic component, a mechanical component, or an optical component, a flexible printed circuit board (FPC). A display device is manufactured by mounting a substrate such as a substrate) or semiconductor package components such as COG (Chip On Glass), COF (Chip On Film), IC chip, and TCP (Tape Carrier Package). It has been broken.

  In a component mounting apparatus for such a panel substrate (for example, a liquid crystal display substrate), for each terminal portion (component mounting region) formed at the two edge portions of the panel substrate 1 held by the component holding device. An ACF adhering apparatus for performing an ACF adhering process for adhering an anisotropic conductive film (ACF) sheet, and a component pre-crimping process in which a component such as TCP is temporarily crimped by a crimping unit via the ACF sheet at each terminal portion. The component temporary crimping device for performing the process, the final crimping device for performing the final crimping process for mounting the component temporarily crimped on the terminal portion by pressurizing and mounting via the ACF sheet, and the panel substrate from the lower surface side There is provided a substrate transfer device that holds and sequentially transfers the devices so that the work can be performed. In the conventional component mounting line having such a configuration, the components are mounted on the respective terminal portions of the panel substrate by performing predetermined processes in each device while sequentially conveying the panel substrate by the substrate conveying device. .

  The panel substrates handled in such a conventional component mounting apparatus are handled in various sizes such as a panel substrate for a mobile phone to a panel substrate for a personal computer. On the other hand, higher mounting accuracy is required for component mounting apparatuses. For example, in the case of a large panel substrate, in a state where the lower surface of the panel substrate is held by the substrate holding device, the edge portion may bend and the terminal portion may not be accurately recognized. Various improvements have been made in the past to improve such problems (see, for example, Patent Document 1).

Japanese Patent No. 3777768

  In recent years, an improvement in mounting accuracy has been desired more and more, and a mounting position accuracy (for example, ± 3 μm / 3σ, etc.) at a level that has not been considered a problem in conventional component mounting apparatuses is being demanded. Depending on how the components held in the crimping unit for component temporary crimping are recognized and the terminal part of the panel board held in the board holding device, the high mounting position accuracy may not be satisfied. obtain. For example, if the component held by the crimping unit is positioned at the recognition height position and recognized, then it is lowered to the mounting height position and mounting is performed based on the recognition result. Since the height position and the mounting height position are different, the moving accuracy of the lifting device of the crimping unit may affect the position accuracy at the mounting height position. The same applies to the substrate holding device that holds the panel substrate. In such a case, high mounting position accuracy may not be satisfied.

  Further, in component mounting on such a panel substrate, it is desired to improve efficiency while ensuring high mounting accuracy. From the viewpoint of efficiency, for example, one substrate holding device is equipped with two stages so that two panel substrates can be held, and further equipped with a plurality of crimping units for temporarily crimping components to the panel substrate. By adopting this configuration, it is desirable to shorten the time required for mounting components per panel board.

  However, if a plurality of device configurations are used in this way, for example, the movement accuracy of the lifting device of each crimping unit will be different for each crimping unit, and the recognized height position and the mounting height position will be different. The variation in positional accuracy caused by this will be further expanded. The same applies to the increase in variation in positional accuracy due to the provision of a plurality of stages.

  Accordingly, an object of the present invention is to provide a component mounting method and apparatus capable of improving the mounting position accuracy in component mounting on a substrate having a component mounting region at the edge thereof, in order to solve the above-described problem. There is to do.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, in the component mounting method for mounting a component in the component mounting region disposed at the edge of the substrate,
The edge portion of the substrate whose lower surface is held by the substrate holding device is disposed on or above the edge support base, and the upper surface of the edge portion disposed on or above the edge support base is a component. A board recognition process for recognizing a mark for confirming a component mounting position provided on the upper surface of the edge portion after positioning at a mounting height position;
A component recognition step of positioning the lower surface of the component held by the mounting head at the component mounting height position and recognizing a position confirmation mark provided on the lower surface of the component;
The lower surface of the upper surface and the component of the edge portion is positioned at the component mounting height based on the result of the recognition of the board recognition step and the component recognizing process, the component in the component mounting region of the edge A mounting process for mounting by crimping,
After carrying out the substrate recognition step, the edge support base is lowered, and then the substrate held by the substrate holding device is horizontally moved to retreat from the edge support base or above,
Then, carry out the part recognition process,
After the component held by the mounting head is retracted upward from the component mounting height position , the substrate is horizontally moved by the substrate holding device, and the edge is disposed above the edge support base. , raises the edge support base is supporting the lower surface of the edge is lowered the component held by the mounting head is retracted upwards, carrying out the mounting step, the component mounting method provide.

According to the second aspect of the present invention, in the component mounting method for mounting the component in the component mounting region disposed at the edge of the substrate,
The edge portion of the substrate whose lower surface is held by the substrate holding device is disposed on or above the edge support base, and the upper surface of the edge portion disposed on or above the edge support base is a component. A board recognition process for recognizing a mark for confirming a component mounting position provided on the upper surface of the edge portion after positioning at a mounting height position;
A component recognition step of positioning the lower surface of the component held by the mounting head at the component mounting height position and recognizing a position confirmation mark provided on the lower surface of the component;
The lower surface of the upper surface and the component of the edge portion is positioned at the component mounting height based on the result of the recognition of the board recognition step and the component recognizing process, the component in the component mounting region of the edge A mounting process for mounting by crimping,
After performing the substrate recognition step, the substrate held by the substrate holding device is withdrawn from the edge support base or above, and the edge support base is lowered,
Then, carry out the part recognition process,
The edge of the substrate is placed on the edge support by the substrate holding device,
In a state where the component held by the mounting head is positioned at the component mounting height position, the substrate holding device and the edge support base are raised synchronously, and the upper surface of the edge is raised to the component. by positioning the mounting height position, carrying out the mounting step, to provide a component mounting method.

According to the third aspect of the present invention, in the component mounting apparatus for mounting the component in the component mounting region disposed at the edge of the substrate,
A mounting head for holding the component and mounting the component on the component mounting region of the substrate;
A head lifting device for lifting and lowering the mounting head;
A substrate holding device comprising: a stage on which the lower surface of the substrate is placed and held; a stage lifting device that lifts and lowers the stage; and a horizontal movement device that horizontally moves the stage;
An edge support base disposed opposite to the mounting head and on which the edge of the substrate is disposed;
An edge support base lifting device for lifting and lowering the edge support base;
An imaging device that captures an image of a component mounting position confirmation mark provided on the upper surface of the edge portion of the substrate and a position confirmation mark provided on the lower surface of the component held by the mounting head;
In the state where the board holding device and the edge support stand lifting device are controlled, and the upper surface of the edge portion arranged on or above the edge support stand is positioned at the component mounting height position. The image recognition device is controlled to pick up an image of a component mounting position confirmation mark provided on the upper surface of the edge, and the substrate recognition operation for recognizing the mark and the head lifting device are controlled to In a state where the lower surface of the component held by the mounting head is positioned at the component mounting height position, the image pickup device is controlled to capture an image of the position confirmation mark provided on the lower surface of the component, Component recognition operation for recognizing the component, mounting operation for crimping the substrate and the component at the component mounting height position based on the result of each recognition, the substrate recognition operation, and the component recognition Operation and In the process of performing any one of the mounting operations, a support height position for supporting the edge at the component mounting height position, and a height position below the support height position. A control device for performing an ascending operation or a descending operation of the edge support table by the edge support table lifting device ,
The controller raises at least the stage elevating device and the edge support platform elevating device synchronously when the substrate and the component are pressure-bonded, and the edge portion is placed on the edge support platform. at disposed state, by raising the substrate, the upper surface of the edge is positioned to the component mounting height, to provide a component mounting apparatus.

According to the fourth aspect of the present invention, the control device may be configured to position the upper surface of the edge portion at the component mounting height position based on the thickness information of the edge portion of the board. A component mounting apparatus according to a third aspect for controlling a support platform lifting apparatus.

According to the fifth aspect of the present invention, the substrate holding device includes a plurality of the stages and the stage elevating device,
Furthermore, the component mounting apparatus as described in a 3rd aspect or a 4th aspect provided with the said some mounting head and the said head raising / lowering apparatus is provided.

  According to the present invention, the component mounting position confirmation mark is recognized while the upper surface of the edge of the substrate held by the substrate holding device is positioned at the component mounting height position, and the mark is held by the mounting head. The component position confirmation mark is recognized in a state where the lower surface of the component is positioned at the component mounting height position, and the component is mounted at the component mounting height position based on each recognition result. That is, substrate recognition and component recognition are performed at the component mounting height position. Therefore, it is possible to prevent variations in the mounting position accuracy caused by the movement accuracy of the lifting device of the mounting head or the substrate holding device due to the difference between the recognition height position and the mounting height position as in the past. . Further, the substrate recognition is performed in a state where the edge portion of the substrate is arranged on the edge support base. In this way, even when the edge of the substrate is bent as in a large substrate, the substrate is bent by placing the edge of the substrate on the edge support. And the upper surface of the edge portion can be reliably positioned at the component mounting height position. In addition, in the process of performing any of the board recognition operation, component recognition operation, and mounting operation, the support height position that supports the edge at the component mounting height position, and the support height position For example, when the edge of the board is positioned at the component mounting height position, the edge support is moved to the lower position. By performing an operation such as lowering, the movement path of each member for recognition processing can be simplified. In addition, it is possible to simplify the retreat operation after the component recognition process or the board recognition process is performed at each component mounting height position and the movement path of each member in the mounting process. For example, when retreating the edge located at the component mounting height position, the movement path can be simplified, for example, the edge support base is lowered and then the edge is horizontally moved to retreat. Can be planned. Since the edge support base can be moved up and down in this way, the movement path of the substrate is simplified, and accumulation of hysteresis errors that the moving device such as the substrate holding device and / or the head lifting device holding the components has is accumulated. Can be reduced. Therefore, it is possible to provide a component mounting method and apparatus capable of improving the mounting position accuracy in component mounting on a substrate having a component mounting region at its edge.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(Embodiment)
In describing a component mounting apparatus and a component mounting method according to an embodiment of the present invention, first, the form of the panel substrate 1 handled in these component mounting apparatuses and methods and the panel substrate 1 are applied. An outline of the mounting process will be described with reference to FIGS. 1A, 1B, and 1C.

  First, as shown in FIG. 1A, a substrate handled in this embodiment is a substrate (hereinafter referred to as “panel substrate”) 1 typified by a liquid crystal display (LCD) panel substrate, a plasma display panel (PDP) substrate, or the like. There is a terminal portion 2 in which a component mounting region R1 on which a component is mounted is disposed at the edges of two sides adjacent to each other in a square shape. In addition, such a panel substrate 1 generally has a rectangular shape, and each terminal portion 2 includes a long side terminal portion (terminal portion on the back side in FIG. 1A) and a short side terminal portion. (Terminal portion on the near side in the drawing in FIG. 1A). In addition, a plurality of terminal electrodes 2a are formed in each terminal portion 2, and each component is mounted and electrically connected to these terminal electrodes 2a. Further, the area inside the edge of the panel substrate 1 is a display area in which images such as images and character information are displayed. The panel substrate 1 is mainly made of a glass material, and has been reduced in thickness so that the thickness becomes, for example, 0.5 mm or less.

  With respect to the panel substrate 1 having such a structure, the component mounting method according to the present embodiment uses an ACF sheet as a bonding member to the terminal electrode 2a of each terminal portion 2 in the ACF adhering step, which is an example of the bonding member arranging step. 3 is attached (see FIG. 1B), and then, for example, a TCP 4 is crimped as a component via the ACF sheet 3 in a component temporary crimping step and a main crimping step which are an example of a component placement step (or component mounting step). Mounting (see FIG. 1C), that is, performing an outer lead bonding process. In the present specification, “crimping” includes not only the final pressing performed in the main pressing step but also the temporary pressing in the component temporary pressing step. In this embodiment, the TCP 4 is exemplified as a component to be mounted on the panel substrate 1, but the component to be mounted may be an IC chip, an FPC substrate, or a COF substrate.

  Next, FIG. 2 is a schematic plan view showing a configuration of a component mounting line 100 which is an example of a component mounting apparatus that performs such an outer lead bonding process.

  As shown in FIG. 2, the component mounting line 100 includes an ACF adhering device 20 that performs an ACF adhering process on the panel substrate 1 and a TCP 4 or the like on the panel substrate 1 on which the ACF sheet 3 is adhered. The component temporary crimping apparatus 30 for performing the component temporary crimping process of the component, and the main crimping process for performing the final crimping process of performing the final crimping and mounting of the TCP 4 temporarily crimped to the terminal portions 2 on the long side and the short side of the panel substrate 1. The apparatus 40 and the board | substrate conveyance apparatus 50 which conveys the panel board | substrate 1 between each apparatus are provided. Each device is provided with a panel substrate holding device having two stages for holding the panel substrate 1, and in the state where two panel substrates 1 having a predetermined size or less are simultaneously held. It is possible to carry out this process. Moreover, in the component mounting line 100 of this embodiment, both component temporary crimping and component permanent crimping are performed as an example of component mounting.

  The ACF adhering apparatus 20 includes two crimping units 23 that cut the tape-like ACF sheet 3 fed from the tape supply unit 21 to the tape collecting unit 22 into a predetermined length and affix it to the terminal portion 2 of the panel substrate 1. And a substrate holding device that transfers and holds the panel substrate 1 conveyed from the substrate conveying device 50 and positions the terminal portion 2 of the held panel substrate 1 and the crimping unit 23. A panel substrate holding device 24 is provided. The panel substrate holding device 24 has a function of moving the held panel substrate 1 in the X-axis direction or the Y-axis direction (XY movement function) and a plane (horizontal plane) including the X-axis direction and the Y-axis direction. 1 has a function of rotating the panel substrate 1 (θ rotation function) and a function of moving the panel substrate 1 up and down in the Z-axis direction (lifting function). The terminal portion 2 on the short side can be aligned with each crimping unit 23. Further, the ACF adhering apparatus 20 is provided with two recognition cameras 26 for recognizing the positions of the terminal portions 2 of the panel substrate 1 in order to perform such alignment. Further, the ACF attaching operation by each crimping unit 23 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported by a backup tool (an example of an edge support base) 25 from below. In FIG. 2, the X-axis direction and the Y-axis direction are substantially along the surface of the panel substrate 1, the transport direction of the panel substrate 1 is the X-axis direction, and the direction orthogonal to the X-axis direction is Y. It is an axial direction, and the illustrated vertical direction is the Z-axis direction.

  The component temporary press-bonding device 30 includes a TCP supply cassette unit (not shown) that supplies a plurality of TCPs 4 housed in a cassette, and a TCP 4 supplied from the TCP supply cassette unit via an ACF sheet 3. A plurality of temporary crimping heads (an example of a mounting head) 32 that temporarily crimps the terminal electrode 2a and the panel substrate 1 are transferred and held, and the terminal portions 2 of the held panel substrate 1 and the temporary crimping heads 32 are held. And a panel substrate holding device 33 for performing positioning. The component pre-crimping device 30 is provided with four pre-crimp heads 32, and each of the pre-crimp heads 32 is rotatably arranged evenly on a concentric circle, and is located on the circumference in the upper position of FIG. A so-called rotary system is adopted in which the respective temporary crimping heads 32 are sequentially arranged at the TCP supply position and the temporary crimping position which is a lower position. The component temporary crimping apparatus 30 includes two recognition cameras 34 for recognizing the position of the TCP 4 sucked and held by the terminal portion 2 and the temporary crimping head 32 of the panel substrate 1, and the temporary crimping head at the TCP supply position. And a pre-center camera 36 for recognizing the holding posture of the TCP 4 held by suction. The panel substrate holding device 33 has an XY movement function, a θ rotation function, and a lifting function. The component temporary crimping operation by each temporary crimping head 32 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported by a backup tool (an example of an edge support base) 35 from below.

  The main crimping apparatus 40 heats the terminal 4 on the long side and the short side of the panel substrate 1 while pressing the TCP 4 in a state of being temporarily press-bonded via the ACF sheet 3. A plurality of pressure-bonding heads 41, which are examples of mounting heads that perform the main pressure bonding, that is, heat pressure bonding (mounting), on each terminal electrode 2a, and the panel substrate 1 to be transferred are held, and the held panel substrate 1 A panel substrate holding device 43 that aligns each TCP 4 temporarily crimped to the terminal portion 2 and each crimping head 41 is provided. The panel substrate holding device 43 has an XY movement function, a θ rotation function, and an elevation function. Further, in order to perform such alignment, two recognition cameras 44 for recognizing the positions of the two panel substrates 1 are provided. The main crimping operation by the crimping head 41 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported from the lower surface side thereof by the backup tool 42 (an example of an edge support base).

  The substrate transfer device 50 includes a panel holding unit 51 that holds the lower surface of the panel substrate 1 by vacuum suction means (not shown) so as to be releasable, a lifting unit (not shown) that moves the panel holding unit 51 up and down, and a panel A moving device 53 is provided that moves the holding unit 51 and the elevating unit along the X-axis direction in the drawing to transfer the panel substrate 1 between the devices. Moreover, in the board | substrate conveyance apparatus 50, the panel holding | maintenance part 51 is separately arrange | positioned between each process, ie, between each apparatus, and the conveyance for delivery of the panel board | substrate 1 between apparatuses is mutually independent. It is possible to do. In the present embodiment, the case where the panel holding unit 51 holds the panel substrate 1 by vacuum suction means will be described as an example. However, instead of such a case, a panel having mechanical chuck means is provided. The panel substrate 1 may be held by the holding unit.

  Further, the component mounting line 100 is provided with a control device 19 that performs overall operation control of the respective devices 20, 30, 40, and 50 while associating them with each other's operations. The control device 19 sequentially controls the conveyance of the panel substrate 1 from the upstream device to the downstream device while performing individual operation control in each device, and the components for the plurality of panel substrates 1 are controlled. Mounting operation is performed. Note that the control method of the control device 19 may be a case where a centralized control method is adopted, or each device is individually provided and exchanges a transport control signal of the panel substrate 1 between the devices. It may be a case where a control method is performed.

  Next, a component mounting operation in the component mounting line 100 having such a configuration will be described. In addition, each operation | movement demonstrated below is controlled by the control apparatus 19, and is performed.

  First, the panel substrate 1 is carried into the component mounting line 100 shown in FIG. The carried-in panel substrate 1 is held by the panel holding unit 51 of the substrate transfer device 50 and is transferred in the X-axis direction in the drawing by the moving device 53 in the holding state, and the panel substrate holding device 24 of the ACF adhering device 20 is transferred. Placed on top. When the lower surface of the panel substrate 1 placed on the panel substrate holding device 24 is sucked and held, the suction holding by the panel holding portion 51 of the substrate transfer device 50 is released. The details of the method for placing (holding) the panel substrate 1 will be described later.

  Next, the XY movement of the panel substrate 1 held by the panel substrate holding device 24 is performed to align the long-side terminal portion 2 with the crimping unit 23, and then the crimping unit 23 is lowered. Then, the ACF sheet 3 is attached to the terminal portion 2 on the long side (ACF attaching step). In this positioned state, since the long side terminal portion 2 is directly supported by the backup tool 25 from the lower surface side, the ACF sheet 3 can be reliably adhered. . Thereafter, θ rotation of the respective stages 61 and 62 is performed by the panel substrate holding device 24 to align the terminal portion 2 on the short side and the crimping unit 23, and the ACF sheet 3 is moved by the crimping unit 23. Affixed to the terminal portion 2 on the short side. When the ACF adhering process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 24 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Is passed on. Thereafter, the panel substrate 1 with the ACF sheet 3 attached thereto is conveyed to the component provisional pressure bonding device 30 by the substrate conveying device 50.

  In the substrate temporary crimping device 30, the panel substrate 1 transported by the substrate transport device 50 is placed on the panel substrate holding device 33 and delivered. On the other hand, the TCP 4 is supplied to the temporary press-bonding head 32 positioned at the TCP supply position, and the TCP 4 is sucked and held by the temporary press-bonding head 32. Thereafter, each temporary pressure bonding head 32 is rotated and the temporary pressure bonding head 32 holding the TCP 4 by suction is positioned at the temporary pressure bonding position. At the same time, various movements of the panel substrate 1 are performed by the panel substrate holding device 33, thereby aligning the terminal electrode 2 a of the terminal portion 2 on the long side 2 and the provisional pressure bonding head 32. When the pressure-bonding head 32 is lowered, the TCP 4 is temporarily pressure-bonded to the terminal electrode 2 a via the ACF sheet 3. Similar operations are sequentially repeated, and the TCP 4 is temporarily crimped to each terminal electrode 2a (component temporary crimping step). When the TCP 4 temporary crimping to the long side terminal portion 2 is completed, the panel substrate holding device 33 rotates the panel substrate 1 by θ, and the short side terminal portion 2 and the temporary crimping head 32 are aligned. In other words, the TCP 4 is temporarily crimped to the terminal electrodes 2a of the terminal portion 2 on the short side. When the component temporary press-bonding process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 33 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Is passed on. Thereafter, the substrate transport apparatus 50 transports the panel substrate 1 in a state where the TCP 4 is temporarily press-bonded to the main press-bonding apparatus 40.

  In the main crimping device 40, the panel substrate 1 transported by the substrate transport device 50 is placed on the panel substrate holding device 43 and delivered. Thereafter, after the long-side terminal portion 2 of the panel substrate 1 is placed on the backup tool 42 by the panel substrate holding device 43, the respective thermocompression bonding heads 41 are lowered so that each of the temporary attachment states is in a temporarily attached state. The TCP 4 is heated while being pressed against each terminal electrode 2a through the ACF sheet 3, and the TCP 4 is mounted by thermocompression bonding (main pressure bonding step). The TCP 4 is pressed by the thermocompression bonding head 41 through a protective tape (not shown) so that dirt or the like does not adhere to the pressing surface of the thermocompression bonding head 41. Further, the ACF sheet 3 is thermally cured by applying heat to the ACF sheet 3 from the thermocompression bonding head 41. When the main crimping process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 43 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Delivered. Thereafter, the panel board 1 with the respective TCPs 4 mounted thereon is carried by the board carrying device 50 and carried out of the component mounting line 100. In the component mounting line 100, a plurality of panel substrates 1 are sequentially transported by the substrate transport device 50, and a predetermined process is performed in each device, whereby an outer lead bonding process is performed.

  Next, in the component mounting line 100, the structure of the component temporary press-bonding apparatus 30 in which the component temporary press-bonding process which is an example of a component mounting process is performed is demonstrated in detail. In this description, a schematic side view of the component provisional pressure bonding device 30 viewed from the Y-axis direction is shown in FIG. 3, and a schematic side view viewed from the X-axis direction is shown in FIG.

  As shown in FIGS. 2, 3, and 4, the component pre-crimping device 30 is equipped with, for example, four pre-crimp heads 32 arranged at equal intervals on a concentric circumference. The head rotating device 71 is configured such that each temporary press-bonding head 32 is rotated on a concentric circumference so that each temporary press-bonding head 32 is sequentially positioned at the TCP supply position and the temporary press-bonding position. Yes. Each temporary pressure-bonding head 32 includes a suction nozzle 72 that sucks and holds the upper surface of the TCP 4 so as to be releasable, and a nozzle lifting device (an example of a head lifting device) 73 that lifts and lowers the suction nozzle 72. In the temporary press-bonding head 32, the TCP 4 can be individually sucked and held and / or the suction nozzle 72 can be raised and lowered individually.

  The panel substrate holding device 33 includes a first stage 61 and a second stage 62 that are arranged adjacent to each other along the X-axis direction and that individually place and hold the panel substrate 1. On the mounting surface of the panel substrate 1 which is the upper surface of the first stage 61 and the second stage 62, for example, suction means (not shown) for sucking and holding the mounted panel substrate 1 is provided.

  Further, the panel substrate holding device 33 includes θ rotation devices 63 and 64 for rotating and moving the first and second stages 61 and 62 in a horizontal plane (that is, θ rotation with the Z axis as a rotation axis), and first and second stages. Elevating devices (an example of a stage elevating device) 65 and 66 that individually raise and lower the two stages 61 and 62, the first and second stages, the θ rotating devices 63 and 64, and the elevating devices 65 and 66 are integrally integrated with the Y axis. A Y-axis moving device 67 that moves forward and backward along the direction and an X-axis moving device 68 that moves integrally in the X-axis direction are similarly provided. In the present embodiment, the X-axis moving device 68 and the Y-axis moving device 67 constitute a horizontal moving device.

  Further, the component temporary press-bonding device 30 is provided with a terminal portion 2 that is formed of a member having an elongated shape along the Y-axis direction and is an edge portion of the panel substrate 1 held by the panel substrate holding device 33. A backup stage (an example of an edge support base) 81 for supporting, and a support height position for supporting the terminal portion 2 at a component mounting height position described later and a height position below the backup stage 81 And an elevating device (an example of an edge support base elevating device) 82 for elevating and lowering. The backup stage 81 is formed of, for example, a transparent member such as a glass material, and the terminal portion 2 of the panel substrate 1 disposed on the upper surface thereof can be viewed from below.

  The component temporary crimping apparatus 30 further includes two recognition cameras (imaging) that capture an image of the lower surface, which is the mounting side surface of the terminal portion 2 of the panel substrate 1 and the TCP 4, and recognize the position and holding posture. An example device 34) is provided. Each recognition camera 34 is disposed below the backup stage 81, and images of the terminal portion 2 and the TCP 4 of the panel substrate 1 are captured through the backup stage 81 formed of a transparent member, and the captured images are captured. Is transmitted to the control device 19, and the control device 19 performs the recognition process.

  A plurality of terminal electrodes 2 a are formed on the upper surface of the terminal portion 2 of the panel substrate 1. For example, the image is taken by the recognition camera 34 using these terminal electrodes 2 a as marks for confirming the component mounting position. In addition, since the edge part of the panel board | substrate 1 is formed with the glass material, it is possible to image the terminal electrode 2a with the recognition camera 34 from the downward side. In addition, an electrode pattern (not shown) bonded to the terminal electrode 2a of the panel substrate 1 is formed on the lower surface, which is the surface of the TCP 4 mounted on the panel substrate 1, and an image of this electrode pattern is recognized. By picking up an image with the camera 34, it is possible to perform recognition processing such as the holding posture of the TCP 4 by the suction nozzle 71. In addition, it may be a case where a mark for component mounting position confirmation is formed separately from the terminal electrode 2a on the terminal portion 2 of the panel substrate 1, and an image of this mark is captured. In addition, a part recognition mark may be formed on the lower surface of the TCP 4 and an image of this mark may be captured for TCP 4 position recognition.

  Since the component temporary press-bonding device 30 has such a configuration, for example, the panel substrate 1 is held on the first stage 61 and another panel substrate 1 is also held on the second stage 62. Are moved by the θ rotating devices 63 and 64, moved up and down by the lifting devices 65 and 66, and XY moved by the Y-axis moving device 67 and the X-axis moving device 68, respectively. 81 can be aligned with the terminal portion 2 of each panel substrate 1.

  Next, in the component temporary crimping apparatus 30 provided in the component mounting line 100 of the present embodiment, the operation of temporarily crimping the TCP 4 to the terminal portion 2 of the panel substrate 1 including the method of recognition processing of the TCP 4 and the panel substrate 1 is described below. Explained. Each operation control described below is performed by the control device 19. In the following description, a flowchart of the procedure of the recognition process and the temporary press-bonding operation is shown in FIG. 5, and schematic explanatory views showing states in the respective procedures are shown in FIGS. 6A to 6G. In the following description, a procedure for temporarily pressing the TCP held by the temporary pressing head 32 to the panel substrate 1 held by the first stage 61 of the component temporary pressing apparatus 30 will be described. To do.

  First, as shown in FIG. 3 and FIG. 6A, the panel substrate holding device 33 is moved up and down by the lifting device 65 and moved horizontally by the X-axis moving device 68 and the Y-axis moving device 67. The upper surface of the terminal portion 2 of the held panel substrate 1 is positioned at the component mounting height position H0. At the same time, as shown in FIG. 6B, the backup stage 81 is raised by the lifting device 82 to support the terminal portion 2 of the panel board 1 positioned at the component mounting height position H0 from the lower surface side. (Step S1 in FIG. 5). At this time, in the case where the terminal portion 2 of the panel substrate 1 is bent such that it hangs downward, it is lifted so as to be lifted by the backup stage 81 by such a deflection amount. It can be corrected by correcting the deflection. At this time, the lower surface is not supported by the backup stage 81 when the position of the panel substrate 1 is recognized unless the downward sag of the terminal portion 2 of the panel substrate 1 adversely affects the position recognition of the panel substrate 1. May be. That is, the panel substrate 1 may be recognized in a state where the terminal unit 2 is disposed without supporting the backup stage 81.

  Next, as shown in FIG. 6B, recognition processing of the panel substrate 1 is performed. Specifically, the terminal electrode 2a formed on the upper surface of the terminal portion 2 supported by the backup stage 81 and having the upper surface positioned at the component mounting height position H0 is used as a component mounting position confirmation mark. Then, an image is taken from below by the recognition camera 34. The mark image data captured by the recognition camera 34 through the terminal unit 2 and the backup stage 81 is input to the control device 19, and recognition processing by image processing is performed (step S2).

  When the recognition process of the panel substrate 1 is performed, as shown in FIG. 6C, the lifting and lowering operation by the lifting and lowering device 65 and the horizontal movement by the X-axis and Y-axis moving devices 68 and 67 are performed. The panel substrate 1 is retracted from the component mounting height position H0 (step S3). At the same time, the backup stage 81 is lowered by the lifting device 82.

  Next, as shown in FIG. 6D, the lower surface (component mounting side surface) of the TCP 4 that is sucked and held by the suction nozzle 72 of the temporary pressure-bonding head 32 positioned above the backup stage 81 is moved by the nozzle lifting device 73. As the suction nozzle 72 is moved downward, it is positioned at the component mounting height position H0 (step S4). After being positioned at the component mounting height position H 0, an image of the lower surface of the TCP 4 is taken through the backup stage 81 by the recognition camera 34. The captured TCP4 image data is subjected to recognition processing by image processing in the control device 19 (step S5).

  When the TCP4 recognition process is performed, as shown in FIG. 6E, the suction nozzle 72 is raised by the nozzle lifting device 73, and the TCP4 is retreated upward from the component mounting height position H0 (step S6).

  Next, as shown in FIG. 3 and FIG. 6F, the panel substrate 1 in the retracted state is again brought into the backup stage by the lifting operation by the lifting device 65 and the horizontal movement by the X-axis and Y-axis moving devices 68 and 67. The component mounting height position H0 above 81 is positioned. At the same time, as shown in FIG. 6G, the backup stage 81 is raised by the lifting device 82 to support the terminal portion 2 of the panel substrate 1. Further, the suction nozzle 72 in the retracted state is lowered by the nozzle lifting device 73, whereby the TCP 4 is again positioned at the component mounting height position H0 (step S8). Thus, when both the terminal portion 2 of the panel substrate 1 and the TCP 4 are positioned at the component mounting height position H 0, the electrode pattern formed on the lower surface of the TCP 4 becomes the terminal electrode 2 a of the terminal portion 2 of the panel substrate 1. Then, it is brought into a state where it is contacted via the ACF sheet 3 and temporarily pressed (step S8). At the time of this temporary pressure bonding, a minute position adjustment of the mounting position is performed based on the recognition processing result of the panel substrate 1 and the TCP 4.

  According to the component temporary press-bonding method of the present embodiment, the recognition process of the TCP 4 held by the temporary press-bonding head 32 is the height position at which the temporary press-bonding process of the TCP 4 to the terminal portion 2 of the panel substrate 1 is actually performed. This is performed at the component mounting height position H0. Furthermore, the recognition process of the panel substrate 1 held by the first stage 61 is performed in a state where the terminal portion 2 is positioned at the component mounting height position H0. Accordingly, it is possible to eliminate variations in position accuracy caused by the difference between the recognition processing height position and the component mounting height position. In particular, in a configuration in which a plurality of temporary crimping heads 32 are provided as in the component temporary crimping apparatus 30 of the present embodiment and a plurality of stages 61 and 62 are further provided, the raising and lowering operations of the respective temporary crimping heads 32 are performed. The difference between the recognition processing height position and the component mounting height position is due to variations in the movement accuracy of the nozzle lifting device 73 that performs the movement and variations in the movement accuracy of the lifting devices 65 and 66 that perform the lifting operation of the stages 61 and 62. There is a tendency that the resulting variation in positional accuracy increases. However, as in the present embodiment, the TCP4 recognition process and the panel substrate 1 recognition process are performed at the component mounting height position H0, so that the positional accuracy variation due to the movement accuracy of such a lifting device or the like can be reduced. Occurrence can be prevented. Therefore, it is possible to perform the temporary pressure bonding of TCP with high positional accuracy.

  In addition, this embodiment is not limited only to the above aspects, Various other aspects can be adopted. For example, the flow chart of FIG. 7 shows the procedure of the first modification of the component temporary press-bonding process of the present embodiment. Furthermore, the model explanatory drawing of the procedure is shown to FIG. 8A and 8B. In addition, in each step of the flowchart of FIG. 7, the same step as the step of the flowchart of FIG.

  In the component temporary press-bonding process of the first modification, after performing steps S1 and S2 of FIG. 7 to perform the recognition process of the panel substrate 1, the panel substrate 1 is moved in the horizontal direction without being moved in the vertical direction. Thus, the retreating movement of the panel substrate 1 is performed. Note that when the backup stage 81 supports the lower surface of the panel substrate 1 when the panel substrate 1 is recognized and photographed, the backup stage 81 is moved up and down before the horizontal movement of the panel substrate 1 is performed. A downward movement is performed by 82. By performing the lowering operation of the backup stage 81 in this way, the retreat movement operation of the panel substrate holding device 33 after the recognition of the panel substrate 1 is simply performed, that is, the retreat movement route of the panel substrate 1 is made a simple route. be able to. By simplifying the retreat movement path of the panel substrate 1 by the panel substrate holding device 33 in this way, accumulation of hysteresis errors that the moving device such as the panel substrate holding device 33 has can be reduced, and the position in the movement control is reduced. Reproducibility is improved. Thereafter, TCP4 recognition processing is performed in steps S4 and S5 of FIG.

  Next, in step S61 of FIG. 7, with the TCP 4 positioned at the component mounting height position H0 where the recognition processing has been performed, the panel substrate 1 that has been retracted is moved in the horizontal direction as shown in FIG. 8A. Is moved again to the component mounting height position H 0 between the TCP 4 and the backup stage 81. At this time, since the terminal portion 2 of the panel substrate 1 is bent slightly to hang down, the upper surface of the terminal portion 2 and the TCP 4 are not in contact with each other. Thereafter, the backup stage 81 is raised to support the terminal portion 2 of the panel substrate 1 and further lifted to lift the terminal portion 2 (step S71), thereby being positioned at the component mounting height position H0. TCP4 is temporarily pressure-bonded to the terminal portion 2 (step S8).

  In the component temporary press-bonding method of the first modification example, since the TCP4 recognition process is performed, the temporary press-bond process is performed while the TCP4 is not moved and remains in the component mounting height position H0. In addition, it is possible to perform the temporary pressure bonding process of the TCP 4 with higher positional accuracy. Further, in the first modification, since the panel substrate 1 is moved only by the horizontal movement using the presence of the deflection generated in the panel substrate 1, the large-sized panel substrate 1 that is relatively easily bent is generated. It is preferable to apply such a method.

  Next, the component temporary press-bonding method according to the modified example 2 will be described using the flowchart shown in FIG. 9 and the schematic explanatory views of FIGS. 10A to 10C. Also in the flowchart of FIG. 9, the same steps as those in FIG.

  In the component temporary press-bonding method according to the second modification, steps S1 to S5 in FIG. 9 are performed, and the panel substrate 1 recognition process and the TCP4 recognition process are performed. Thereafter, as shown in FIGS. 10A and 10B, the terminal portion 2 of the panel board 1 that has been retracted is placed below the component mounting height position H0 while the TCP 4 is positioned at the component mounting height position H0. And placed on the backup stage 81 (step S62).

  Next, as shown in FIG. 10C, the ascending operation of the first stage 61 by the elevating device 65 and the ascending operation of the backup stage 81 by the elevating device 82 are at least synchronized when the panel substrate 1 and the TCP 4 are temporarily bonded. Thus, the terminal portion 2 of the panel substrate 1 is positioned at the component mounting height position H0 (step S72). As a result, at the component mounting height position H0, the TCP 4 is temporarily pressure-bonded to the terminal portion 2 of the panel substrate 1 (step S8).

  In the component temporary press-bonding method of Modification 2 as described above, the two lifting devices 82 are disposed in a state where the terminal portion 2 of the panel substrate 1 is arranged on the backup stage 81 and the deflection of the panel substrate 1 is reliably corrected. , 65 are synchronized and the entire panel substrate 1 is raised, so that the terminal portion 2 can be reliably positioned at the component mounting height position H0. Therefore, it is possible to ensure high mounting position accuracy. If the deflection of the panel substrate 1 does not adversely affect the mounting operation accuracy of the temporary crimping between the panel substrate 1 and the TCP 4, the backup stage 81 is mounted after the panel substrate 1 is disposed at the TCP 4 mounting position. The panel substrate 1 and the TCP 4 may be temporarily pressure-bonded by raising.

  For example, when considering a device configuration in which the backup stage cannot move up and down, after performing the component recognition process at the component mounting height position, the panel substrate that has been retracted when mounting TCP on the panel substrate is replaced with the component mounting height. In order to position it at the vertical position, it is necessary to raise the TCP once and retract it from the component mounting height position. However, in the component temporary press-bonding method of Modification 2, the backup stage 81 is moved up and down, so that the TCP 4 is not retracted from the component mounting height position after performing the component recognition process at the component mounting height position. In order to perform the mounting process, the panel substrate 1 can be positioned at the component mounting height position. That is, after performing the component recognition process, it is not always necessary to perform the lifting / lowering operation of the temporary crimping head 32 holding the TCP 4 in order to perform the mounting process, or it is necessary to perform a significant lifting / lowering operation even if the lifting / lowering operation is performed. There is no. Accordingly, it is possible to reduce the accumulation of hysteresis errors that the moving device such as the head lifting device has.

  Moreover, in the said embodiment, although the components temporary crimping | compression-bonding apparatus 30 demonstrated as an example the structure equipped with the two stages 61 and 62 and equipped with several temporary crimping heads 32, a stage and temporary crimping | compression-bonding were demonstrated. Even in a configuration in which only one head is provided, the effect of applying the component temporary pressing method according to the present embodiment can be obtained.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

FIG. 1 is an external view of a panel substrate handled in a component mounting line according to an embodiment of the present invention. External view of panel board handled by component mounting line of this embodiment (ACF sheet attached state) External view of the panel board handled in the component mounting line of this embodiment (TCP temporary press-bonded state) Schematic plan view of the component mounting line of this embodiment Schematic side view of the component temporary crimping device as seen from the Y-axis direction Schematic side view of the component temporary crimping machine viewed from the X-axis direction The flowchart which shows the procedure of the component temporary crimping method of this embodiment. Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S1) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S2) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S3) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S5) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S6) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S7) Schematic explanatory diagram of the procedure of the flowchart of FIG. 5 (step S8) The flowchart which shows the procedure of the component temporary crimping method of the modification 1 of this embodiment. Schematic explanatory diagram of the procedure of the flowchart of FIG. 7 (step S61) Schematic explanatory diagram of the procedure of the flowchart of FIG. 7 (step S71) The flowchart which shows the procedure of the component temporary crimping method of the modification 2 of this embodiment. Schematic explanatory diagram of the procedure of the flowchart of FIG. 9 (step S5) Schematic explanatory diagram of the procedure of the flowchart of FIG. 9 (step S62) Schematic explanatory diagram of the procedure of the flowchart of FIG. 9 (step S72)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel substrate 2 Terminal part 2a Terminal electrode 3 ACF sheet 4 TCP
DESCRIPTION OF SYMBOLS 19 Control apparatus 20 ACF sticking apparatus 21 Tape supply part 22 Tape collection | recovery part 23 Crimp unit 24 Panel board holding apparatus 25 Backup tool 30 Component temporary crimping apparatus 32 Crimping head 33 Panel board holding apparatus 40 Main crimping apparatus 41 Crimping head 42 Backup tool 43 Panel substrate holding device 50 Substrate transport device 51 Panel holding unit 53 Moving device 61 First stage 62 Second stage 63, 64 θ rotating device 65, 66 Lifting device 67 Y axis moving device 68 X axis moving device 71 Head rotating device 72 Adsorption nozzle 73 Nozzle lifting device 81 Backup stage 82 Lifting device 100 Component mounting line

Claims (5)

In a component mounting method for mounting a component in a component mounting area arranged at the edge of the board,
The edge portion of the substrate whose lower surface is held by the substrate holding device is disposed on or above the edge support base, and the upper surface of the edge portion disposed on or above the edge support base is a component. A board recognition process for recognizing a mark for confirming a component mounting position provided on the upper surface of the edge portion after positioning at a mounting height position;
A component recognition step of positioning the lower surface of the component held by the mounting head at the component mounting height position and recognizing a position confirmation mark provided on the lower surface of the component;
The lower surface of the upper surface and the component of the edge portion is positioned at the component mounting height based on the result of the recognition of the board recognition step and the component recognizing process, the component in the component mounting region of the edge A mounting process for mounting by crimping,
After carrying out the substrate recognition step, the edge support base is lowered, and then the substrate held by the substrate holding device is horizontally moved to retreat from the edge support base or above,
Then, carry out the part recognition process,
After the component held by the mounting head is retracted upward from the component mounting height position , the substrate is horizontally moved by the substrate holding device, and the edge is disposed above the edge support base. , raises the edge support base is supporting the lower surface of the edge is lowered the component held by the mounting head is retracted upwards, carrying out the mounting step, the component mounting method. In a component mounting method for mounting a component in a component mounting area arranged at the edge of the board,
The edge portion of the substrate whose lower surface is held by the substrate holding device is disposed on or above the edge support base, and the upper surface of the edge portion disposed on or above the edge support base is a component. A board recognition process for recognizing a mark for confirming a component mounting position provided on the upper surface of the edge portion after positioning at a mounting height position;
A component recognition step of positioning the lower surface of the component held by the mounting head at the component mounting height position and recognizing a position confirmation mark provided on the lower surface of the component;
The lower surface of the upper surface and the component of the edge portion is positioned at the component mounting height based on the result of the recognition of the board recognition step and the component recognizing process, the component in the component mounting region of the edge A mounting process for mounting by crimping,
After performing the substrate recognition step, the substrate held by the substrate holding device is withdrawn from the edge support base or above, and the edge support base is lowered,
Then, carry out the part recognition process,
The edge of the substrate is placed on the edge support by the substrate holding device,
In a state where the component held by the mounting head is positioned at the component mounting height position, the substrate holding device and the edge support base are raised synchronously, and the upper surface of the edge is raised to the component. by positioning the mounting height position, carrying out the mounting step, the component mounting method. In a component mounting apparatus that mounts components in a component mounting area arranged at the edge of a board,
A mounting head for holding the component and mounting the component on the component mounting region of the substrate;
A head lifting device for lifting and lowering the mounting head;
A substrate holding device comprising: a stage on which the lower surface of the substrate is placed and held; a stage lifting device that lifts and lowers the stage; and a horizontal movement device that horizontally moves the stage;
An edge support base disposed opposite to the mounting head and on which the edge of the substrate is disposed;
An edge support base lifting device for lifting and lowering the edge support base;
An imaging device that captures an image of a component mounting position confirmation mark provided on the upper surface of the edge portion of the substrate and a position confirmation mark provided on the lower surface of the component held by the mounting head;
In the state where the board holding device and the edge support stand lifting device are controlled, and the upper surface of the edge portion arranged on or above the edge support stand is positioned at the component mounting height position. The image recognition device is controlled to pick up an image of a component mounting position confirmation mark provided on the upper surface of the edge, and the substrate recognition operation for recognizing the mark and the head lifting device are controlled to In a state where the lower surface of the component held by the mounting head is positioned at the component mounting height position, the image pickup device is controlled to capture an image of the position confirmation mark provided on the lower surface of the component, Component recognition operation for recognizing the component, mounting operation for crimping the substrate and the component at the component mounting height position based on the result of each recognition, the substrate recognition operation, and the component recognition Operation and In the process of performing any one of the mounting operations, a support height position for supporting the edge at the component mounting height position, and a height position below the support height position. A control device that causes the edge support base to be raised or lowered by the edge support base lifting device ,
The controller raises at least the stage elevating device and the edge support platform elevating device synchronously when the substrate and the component are pressure-bonded, and the edge portion is placed on the edge support platform. at disposed state, by raising the substrate, the upper surface of the edge is positioned to the component mounting height, the component mounting apparatus. The control device, based on the thickness information of the edge of the substrate, as to position the upper surface of the edge to the component mounting height, to control the edge support stand lifting device, according to claim 3. The component mounting apparatus according to 3 . The substrate holding device includes a plurality of the stages and the stage lifting device,
The component mounting apparatus according to claim 3 , further comprising a plurality of the mounting heads and the head lifting device.

Images