JP2007311774A - Different kind adhesive tape sticking method, bonding method using the same, and devices for these - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a different kind adhesive tape sticking method capable of suppressing the enlargement of a device and making two kinds of adhesive tapes for a chip component and for an FPC stick to each region of a glass substrate in a short takt time and at sufficient precision. <P>SOLUTION: By using a first transfer unit 6 provided with two transfer hands 15A and 15B and a first movable table 17A provided with two adsorption tables 17a and 17b, the sticking adhesive tape for the chip component is stuck to the glass substrate 9. Then, the glass substrate 9 is transferred to the first movable table 17A by shifting the position of the first movable table 17A with only the sticking position of the adhesive tape for an FPC. Thus, simultaneous parallel attachment operations to the glass substrate 9 of the two kinds of adhesive tapes are performed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a dissimilar adhesive tape attaching method for attaching an adhesive tape such as a different anisotropic conductive tape to a substrate such as a display panel, a bonding method using the same, and an apparatus thereof.

  As a method for mounting an electronic component on a substrate such as a display panel, a method using an adhesive tape such as an anisotropic conductive tape is known. In this method, an electronic component is aligned from above the adhesive tape affixed to a predetermined position on the substrate electrode, and after mounting, it is pressed and heated for a predetermined time, and the electronic component is fixed to the substrate by curing the adhesive tape. In addition, the bonding electrode of the electronic component is electrically connected to the electrode of the substrate. The adhesive tape is supplied in the form of a laminated tape in which a tape-like adhesive material is adhered to one side of the base tape. Adhesion of the adhesive tape to the substrate is carried out by cutting the continuous adhesive tape into a predetermined size and pressurizing and heating the cut adhesive tape to a predetermined position on the substrate.

  In recent years, small devices such as mobile phones and PDAs (Personal Digital Assistants) of portable terminals have been required to be small and light while mounting a liquid crystal panel as a display panel. Therefore, on the liquid crystal glass substrate, surface mount type electronic components, LSI (Large Scale Integrated Circuit), and lightweight FPC (Flexible Printed Circuit) capable of using space in a small casing are mounted. As a device for mounting such different types of mounting components on a liquid crystal glass substrate using an adhesive tape, a mounting device and a mounting method as in Patent Document 1 are known.

JP 2001-358177 A

  When mounting a chip component and an FPC on a glass substrate as in Patent Document 1, the adhesive tape to be attached to the glass substrate is a single adhesive tape that covers the entire area where the chip component and the FPC are mounted. And a method of adhering to the glass substrate (see FIG. 6A) and a method of adhering different adhesive tapes to the glass substrate depending on the area of the chip component mounting location and the FPC mounting location (FIG. 6B). See). FIG. 6C shows a state where the chip component and the FPC are mounted on the glass substrate.

  When the adhesive tape is applied so as to cover the entire area of the electronic component to be mounted as shown in FIG. 6 (a), the adhesive tape has the same characteristics. If it is going to do, condition setting will become very difficult.

  Here, the bonding conditions are the conditions of the applied pressure, heating force, and thermocompression bonding time for fixing the electronic component to the substrate by curing the adhesive tape and conducting the bonding electrode of the electronic component to the electrode of the substrate. is there.

  Moreover, since the kind of adhesive tape that can be used is limited to a special type in order to satisfy the joining condition of both members, the adhesive tape that has been conventionally used exclusively for chip parts or FPC cannot be used. In particular, when FPC is thermocompression bonded to a glass substrate, it takes into account damage such as film elongation due to the temperature when the adhesive tape is heated, and is relatively low temperature and long time (for example, at an adhesive tape temperature of 160 ° C. for about 10 seconds). ) To cure the adhesive tape. On the other hand, when mounting chip parts, the adhesive tape is cured by heating at a higher temperature for a shorter time than the FPC heating conditions (for example, at an adhesive tape temperature of 210 ° C. for 5 seconds) in consideration of shortening the tact time. Is desirable.

  Therefore, it is extremely difficult to set conditions for thermocompression bonding of both the chip component and the FPC with the same adhesive tape without quality problems. Also, if adhesive tape covering the entire area is pasted together, the material cost will be increased due to the increased amount of adhesive tape that will be wasted, and corrosion will occur due to the increase in the uncured portion of the adhesive tape. There is a possibility that it will increase and there will be a quality problem.

  When a different type of adhesive tape is applied to the area of each electronic component to be mounted as shown in FIG. 6B, the optimum characteristics of the adhesive tape can be used for each component. In order to perform such sticking, a method of sequentially sticking two kinds of adhesive tapes as shown in FIG. 22A by arranging them one by one and moving one positioning table can be considered. However, in the apparatus of FIG. 22 (a), since the sticking operation is a continuous operation performed sequentially for each adhesive tape, there is a problem that the tact time becomes long, the stroke of the positioning table becomes long, and the apparatus becomes large. There is a problem.

  Also, as shown in FIG. 22 (b), the first adhesive tape attaching unit 1 in which two types of adhesive tapes are arranged side by side and the second adhesive tape in which two types of adhesive tapes are arranged side by side. A method of applying two types of different adhesive tapes simultaneously using the unit 2 can also be considered. However, although the tact time can be shortened, there are problems such as high equipment costs and large equipment.

  Further, in order to improve the accuracy of the adhesive tape application position, the substrate position is usually aligned immediately before application of the adhesive tape. In this case, however, there is a problem that the tact time becomes longer due to the continuous operation.

  Therefore, the present invention can attach two types of adhesive tapes for chip components and FPC to a glass substrate in each region with a short tact time and with high accuracy, and without increasing the size of the apparatus and reducing the equipment cost. It is an object of the present invention to provide a method for applying different types of adhesive tape, a bonding method using the same, and an apparatus for the same that can be made inexpensively.

The present invention has the following configuration in order to achieve the above object.
1st invention transfers the position which receives a glass substrate from a 1st transfer unit, the position which affixes an adhesive tape on the received glass substrate, and the glass substrate on which the adhesive tape was affixed to a 2nd transfer unit. A first movable table having a pair of first and second suction tables movable to a position, a first head for thermocompression bonding the supplied first adhesive tape and second adhesive tape to a glass substrate, and a first head A heterogeneous adhesive tape affixing method for affixing the different first and second adhesive tapes to a glass substrate by a heterogeneous adhesive tape affixing device including an adhesive tape affixing unit having two heads,
Transferring the glass substrate to the first suction table of the first movable table by the first transfer unit;
After transferring the glass substrate to the first suction table, the step of moving the first movable table to a position where the first adhesive tape is applied;
Affixing a first adhesive tape with a first head on the glass substrate at the affixing position;
The glass substrate to which the first adhesive tape is attached is transferred from the first suction table to the second suction table, and the next glass substrate is in a position to receive the glass substrate from the first transfer unit. Transferring to the first suction table;
Moving the first movable table so that both glass substrates are positioned at the application position of the first and second adhesive tapes;
For each glass substrate, applying the first adhesive tape with the first head and applying the second adhesive tape with the second head at the same time;
Transferring the glass substrate on which both adhesive tapes are pasted from the second suction table to the second transfer unit;
It is characterized by providing.

  (Operation / Effect) According to the first invention, the first transfer unit transfers the glass substrate to the first suction table of the first movable table, attaches the first adhesive tape to the glass substrate, and then attaches the glass substrate. Transfer from the first suction table of the first movable table to the second suction table. At this time, the transfer position is adjusted (offset). Separately or simultaneously, the next glass substrate is transferred from the first transfer unit to the first suction table of the first movable table. Thereby, the tact time which affixes a different kind of adhesive tape can be shortened. In addition, by transferring the glass substrate position of the second suction table offset from the first suction table, the first adhesive tape and the second adhesive tape with different application positions can be applied simultaneously, so that the minimum space is required. The tact time is greatly reduced and the production efficiency is increased with the minimum equipment cost.

  In addition, this configuration is a method of transferring two glass substrates from a substrate supply unit at the same time and applying two adhesive tapes at the same time, which is a general application method when only one type of adhesive tape is applied. It is possible to cope with the change of the software only with the device configuration. As a result, it is possible to cope with either by selecting data for the operation pattern.

According to a second invention, in the first method invention,
Before the step of transferring the glass substrate to the first suction table, the position of the alignment mark attached to the glass substrate while the glass substrate is taken out from the pallet for transporting the glass substrate and transported to the temporary placement table is further determined. Recognizing steps,
Based on the recognition result of the position of the alignment mark, correcting the position of the glass substrate and delivering the glass substrate to the temporary table;
Transporting the glass substrate transferred to the temporary table to the delivery position to the adhesive tape application unit by the first transfer unit;
It is provided with.

  (Operation / Effect) According to this method, the glass substrate conveyed from the pallet is aligned before being transferred to the temporary table. That is, immediately before the first adhesive tape and the second adhesive tape are pasted, the pasting operation can be performed without aligning the glass substrate, so that the tact time can be shortened.

A third invention is a bonding method for mounting an LSI and a flexible printed circuit on a glass substrate using the first or second method invention,
Mounting LSI on one of the first and second adhesive tapes affixed to the glass substrate and mounting a flexible printed circuit on the other;
Crimping LSI and Flexible Printed Circuit mounted on the glass substrate;
It is provided with.

  (Operation / Effect) According to this method, the tact time for mounting LSIs and Flexible Printed Circuits (hereinafter, appropriately referred to as “FPC”) having different materials and shapes can be shortened.

4th invention delivers the position which receives a glass substrate from a 1st transfer unit, the position which affixes an adhesive tape on the received glass substrate, and the glass substrate on which the adhesive tape was affixed to a 2nd transfer unit. A first movable table having a pair of first and second suction tables movable to a position, a first head for thermocompression bonding the supplied first adhesive tape and second adhesive tape to a glass substrate, and a first head An adhesive tape applying apparatus for attaching different first and second adhesive tapes to a glass substrate, comprising an adhesive tape applying unit having two heads,
After the glass substrate is transferred to the first suction table of the first movable table by the first transfer unit, the first movable table is moved to the application position of the first adhesive tape,
The first adhesive tape is pasted on the glass substrate at the pasting position with the first head,
The glass substrate to which the first adhesive tape is attached is transferred from the first suction table to the second suction table, and the next glass substrate is in a position to receive the glass substrate from the first transfer unit. Is transferred to the first suction table,
Moving the first movable table so that both glass substrates are located at the application position of the first and second adhesive tapes,
Attaching the first adhesive tape with the first head and the second adhesive tape with the second head simultaneously to each glass substrate,
The glass substrate on which both adhesive tapes are pasted from the second suction table is configured to be transferred to the second transfer unit.

In addition, in this structure, the conveyance means which takes out a glass substrate from the palette for glass substrate conveyance further, and conveys it to a temporary placing stand,
A position detecting means for detecting an alignment mark provided on the glass substrate,
Before the glass substrate is transferred to the first suction table, the position detecting unit detects the position of the alignment mark attached to the glass substrate while the glass substrate is transported from the pallet to the temporary placement table by the transport unit. And
Based on the result, correct the position of the glass substrate and deliver the glass substrate to the temporary table,
It is preferable that the glass substrate transferred to the temporary table is transported to the delivery position to the adhesive tape applying unit by the first transfer unit.

  (Operation / Effect) According to this configuration, the second method invention can be suitably realized.

A sixth invention is a bonding apparatus for mounting an LSI and a flexible printed circuit on a glass substrate including the fourth or fifth method invention,
Mounting means for mounting an LSI on one of the first and second adhesive tapes affixed to the glass substrate and a flexible printed circuit on the other;
A crimping unit for crimping the LSI and Flexible Printed Circuit mounted on the glass substrate;
It is provided with.

  (Operation and Effect) According to this configuration, the third method invention can be suitably realized.

The seventh invention is a sticking device for different types of adhesive tapes for attaching different types of adhesive tapes to a glass substrate.
Transport means for transporting the glass substrate from the pallet to a temporary table;
Position detecting means for detecting alignment marks provided on the glass substrate;
A substrate supply unit comprising:
There are suction tables at both ends of the movable table and the arm rotatably connected to the vertical rotation shaft of the movable table, and the glass substrate is held by alignment based on the detection result of the position detection means, A first movable table configured to move both suction tables across the adhesive tape application position;
An adhesive tape application unit for attaching different types of adhesive tape to the glass substrate at the application position;
A first transfer unit for transferring a glass substrate from the temporary table to a first movable table;
A crimping unit for crimping different mounting members for each part to which the adhesive tape is attached;
While aligning the glass substrate based on the detection result of the position detection means, a second movable table that moves across the loading / unloading position and the crimping position of the crimping unit,
A second transfer unit for transferring the glass substrate on which the adhesive tape has been pasted on the first movable table to the second movable table;
A third transfer unit that transports the glass substrate on which the mounting member is crimped to the next process;
The unprocessed glass substrate transported by the first transfer unit is transferred to and aligned with one suction table at the delivery position, and the first movable table is moved to the adhesive tape application position to be a predetermined position of the glass substrate. Affix the adhesive tape to the
After the pasting, the arm is rotated to move the glass substrate to a different adhesive tape pasting position, and the untreated glass substrate transported by the first transfer unit is transferred to the other suction table for alignment. Move both suction tables to the adhesive tape application position,
Adhesive tape is applied to both glass substrates with the adhesive tape application unit.
After the pasting is finished, the arm is rotated and the glass substrate on which the two types of adhesive tapes are pasted is transferred to the second movable table by the second transfer unit,
Furthermore, the glass substrate on which the untreated glass substrate conveyed by the first transfer unit is transferred and aligned on the suction table on which the glass substrate is unloaded by rotating the arm, and one type of adhesive tape is attached. , Move both suction tables to the adhesive tape application position,
Adhesive tape is applied to both glass substrates by an adhesive tape application unit. These processes are repeated.

  (Operation / Effect) According to this configuration, a predetermined adhesive tape can be applied in order to the adhesive tape application portion of the glass substrate while rotating the arm on the first movable table about the vertical rotation axis. In addition, the glass substrate with two types of adhesive tapes is transferred to the second movable table by the second transfer unit, and the untreated glass substrate is transferred to the suction table that is opened after the movement. Each of the glass substrate to which the adhesive tape has been applied and the untreated glass substrate can be simultaneously moved to the adhesive tape application position. Therefore, since the number of times of delivery of the glass substrate can be reduced as compared with the first invention apparatus, work efficiency can be improved.

  Further, in this configuration, the suction table is configured to be movable along the longitudinal direction of the arm and to be held so as to be rotatable about a vertical axis perpendicular to the arm (Claim 8), Preferably, the suction table is configured to be movable back and forth along an axis that is horizontally orthogonal to the arm. According to this configuration, the suction table can be moved back and forth and right and left on a horizontal plane, so that the fine adjustment of the alignment to the adhesive tape application position can be performed with high accuracy.

A tenth invention is a bonding apparatus for mounting an LSI and a Flexible Printed Circuit on a glass substrate including the seventh method invention,
Mounting means for mounting an LSI on one of the first and second adhesive tapes affixed to the glass substrate and a flexible printed circuit on the other;
A crimping unit for crimping the LSI and Flexible Printed Circuit mounted on the glass substrate;
It is provided with.

  (Operation / Effect) According to this configuration, the tact time for mounting LSI and FPC having different materials and shapes can be shortened.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a bonding apparatus (hereinafter referred to as “mounting apparatus” as appropriate) in which an adhesive tape attaching unit 3 according to an embodiment of the present invention is incorporated.

  1, first to fourth transfer units 6, 21, 33, and 34 for transferring a glass substrate 9 (hereinafter simply referred to as “substrate”) are provided.

  Transfer of the substrate 9 from the substrate supply unit 2 to the adhesive tape applying unit 3 and transfer and alignment of the substrate 9 from the first suction table 17a of the first movable table 17A to the second suction table 17b (hereinafter referred to as appropriate) The “offset transfer” is performed using the first transfer unit 6. Further, the transfer of the substrate 9 from the adhesive tape applying unit 3 to the temporary pressure bonding unit 4 is performed using the second transfer unit 21.

  The substrate supply unit 2 includes a pallet 10 in which a plurality of substrates 9 before mounting the chip component 7 and the FPC 8 which are mounting members are arranged at regular intervals, and a conveying unit 12 which conveys the substrate 9 on the pallet 10 to the temporary placement table 11. And a camera 13 for recognizing the position of the alignment mark on the substrate 9 for placing the substrate 9 on the temporary placement table 11. The conveying means 12 is configured to be movable in two horizontal axes (X, Y), up and down (Z), and rotation (θ). The temporary placement table 11 includes a first suction unit 11a and a second suction unit 11b that hold the substrate 9 by suction. The camera 13 corresponds to the position detection means of the present invention.

  The first transfer unit 6 includes a rail 14A disposed in the longitudinal direction of the apparatus base 1, first transfer hands 15A and 15B that travel along the rail 14A, and the first transfer hand 15A and 15B, holding plates 16a and 16b that are attached so as to be able to move up and down and suck and hold the substrate 9; a position for receiving the substrate 9 from the temporary placement table 11 of the substrate supply unit 2; and a first movable table of the adhesive tape applying unit 3 It is movable between the substrate 9 transfer position with 17A.

  The second transfer unit 21 includes a rail 14B disposed in the longitudinal direction of the apparatus base 1 and second transfer hands 15C and 15D that travel along the rail 14B. The first movable table 17A is movable between the substrate 9 delivery position and the second movable table 17B of the temporary crimping unit 4 between the delivery positions. The first movable table 17A includes a first suction table 17a and a second suction table 17b. The second movable table 17B is composed of a suction table 17c.

  As shown in FIG. 7, the stop positions on the rail 14A when the first transfer hands 15A and 15B are transferred to the substrate 9 are such that the holding plates 16a and 16b of the first transfer hands 15A and 15B are the substrates. The position A for receiving the substrate 9 from the temporary table 11 of the supply unit 2 and the holding plates 16a and 16b of the first transfer hands 15A and 15B shown in FIGS. 9 and 10 are the first suction table 17a of the first movable table 17A. A position C for delivering the substrate 9 to the second suction table 17b, and a position B for receiving the substrate 9 from the first suction table 17a of the first movable table 17A by the holding plate 16b of the first transfer hand 15B shown in FIG. It is composed of

  Further, the stop positions of the second transfer hands 15C and 15D on the rail 14B are the position D at which the second transfer hand 15C shown in FIG. 11 receives the substrate 9 from the second suction table 17b of the first movable table 17A. The second transfer hand 15C shown in FIG. 7 includes a position E for delivering the substrate 9 to the suction table 17c of the second movable table 17B of the temporary pressure bonding unit 4.

  When one type of adhesive tape is applied with this apparatus configuration, the following two positions are added. One is a position where the second transfer hands 15C and 15D simultaneously receive the substrate 9 from the first suction table 17a and the second suction table 17b of the first movable table 17A, and the other is the second transfer hand. 15D is a position for delivering the substrate 9 to the suction table 17c of the second movable table 17B of the provisional pressure bonding unit 4.

  The first movable table 17A is configured to be movable in two horizontal axes (X, Y) and a rotation (θ) direction. The first suction table 17a and the second suction table 17b of the first movable table 17A are configured to be individually movable in the vertical (Z) direction.

  Further, the suction table 17c of the second movable table 17B is configured to be movable in the horizontal biaxial (X, Y) direction, the rotation (θ) direction, and the vertical (Z) direction. The distance in the X direction between the first suction table 17a and the second suction table 17b of the first movable table 17A is the distance between the holding plates 16a and 16b of the first transfer hands 15A and 15B and the first head of the adhesive tape application unit 3. The distance between 19a and the second head 19b is set to be the same.

  The stop position of the first movable table 17A is the position F for receiving the substrate 9 from the holding plates 16a and 16b of the first transfer hands 15A and 15B shown in FIGS. 8 and 9, and the first adhesive tape 18a shown in FIG. A position G that is offset by the difference between the sticking position and the sticking position of the second adhesive tape 18b, a position H where the first adhesive tape 18a and the second adhesive tape 18b are stuck in the adhesive tape sticking unit 3 shown in FIG. 7, and FIG. And a position I for delivering the substrate 9 to the second transfer hand 15C shown in FIG. The position F in FIG. 9 and the position G in FIG. 10 are positions moved by X1 and Y1 shown in FIG. This movement is performed when the substrate 9 is transferred to the first movable table 17A from the holding plate 16b of the first transfer hand 15B. The first adhesive tape 18a and the second adhesive tape 18b can be simultaneously attached to the predetermined positions by the adhesive tape applying unit 3 on the substrates 9 respectively held by suction on the table 17b.

  The adhesive tape attaching unit 3 includes a first head 19a for attaching the first adhesive tape 18a for the chip component 7 to the substrate 9, a second head 19b for attaching the second adhesive tape 18b for the FPC 8, and the first adhesive tape 18a. The first adhesive tape supply mechanism 20a and the second adhesive tape supply mechanism 20b for supplying the second adhesive tape 18b. FIG. 6B shows a pasting location 22a where the first adhesive tape 18a is pasted and a pasting location 22b where the second adhesive tape 18b is pasted.

  On the first adhesive tape 18a and the second adhesive tape 18b, an adhesive for joining electronic components is attached in a tape shape to one side of the base tape.

  Below the first head 19a and the second head 19b, a backup 23 is fixedly installed to support the substrate 9 when the adhesive tape is applied and pressed.

  The substrate 9 is sucked and held so that the application location 22a of the first adhesive tape 18a for the chip component 7 extends forward (Y direction) from the first suction table 17a of the first movable table 17A. Similarly, the substrate 9 is sucked and held so that the application location 22b of the second adhesive tape 18b for the FPC 8 extends forward (Y direction) from the second suction table 17b of the first movable table 17A.

  The temporary pressure bonding unit 4 includes a suction table 17c of a second movable table 17B that sucks and holds the substrate 9 conveyed from the adhesive tape applying unit 3 in a horizontal posture, and a temporary pressure bonding for temporarily pressing the chip component 7 and the FPC 8 to the substrate 9. A head 25 and a two-field camera 31 having a recognition field of view in two vertical directions for aligning the substrate 9 with the chip component 7 and the FPC 8 at the time of provisional pressure bonding are provided.

  The second suction table 17B is configured to be movable in two horizontal axes (X, Y), up and down (Z), and rotation (θ). The temporary press-bonding head 25 is movable up and down, and a suction hole for sucking and holding the chip component 7 and the FPC 8 is provided at the lower end thereof, and is connected to a vacuum source through an intake pipe (not shown).

  The chip component 7 and the FPC 8 are supplied to the temporary press-bonding head 25 using a chip slider 27. The conveying means 32 sequentially takes out the chip components 7 one by one from the chip pallet 28 in which the plurality of chip components 7 are arranged at regular intervals. The extracted chip component 7 is transferred to the chip slider 27. Further, the conveying means 32 sequentially takes out the FPCs 8 one by one from the FPC pallet 29 in which the plurality of FPCs 8 are arranged and arranged at regular intervals. The taken out FPC 8 is transferred to the chip slider 27. The chip slurder 27 conveys the chip component 7 and the FPC 8 to the temporary pressure bonding head 25 along the guide rail 30 extending from the temporary pressure bonding unit 4.

  The third transfer unit 33 transfers the substrate 9 on which the chip component 7 and the FPC 8 are temporarily bonded by the temporary pressure bonding unit 4 to the third movable table 17 </ b> D of the main pressure bonding unit 5. The substrate 9 transferred to the third movable table 17D moves in the horizontal biaxial (X, Y) direction and the vertical (Z) direction, and the third head 19c and the fourth head 19d are lowered to heat and heat. Pressure is applied. When heating and pressurization are performed for a predetermined time, the third head 19c and the fourth head 19d are raised, and the third movable table 17D is moved to the position where the substrate 9 is transferred to the fourth transfer unit 34. When the third movable table 17 </ b> D arrives at the transfer position of the substrate 9, the substrate 9 is transferred to the carry-out stage 35 by the fourth transfer unit 34.

  Next, the operations of the substrate supply unit 2, the first transfer unit 6, the second transfer unit 21, and the first movable table 17A will be described using the operation flowcharts of FIGS.

  FIG. 2 is an operation flowchart of the substrate supply unit 2.

  First, the substrates 9 arranged and arranged on the pallet 10 at regular intervals are taken out of the pallet 10 by the conveying means 12 (step S01). The transport unit 12 sucks and holds the substrate 9 and transports it to the first suction unit 11 a of the temporary placement table 11. When carrying, the camera 13 passes the upper part of the camera 13, and the camera 13 recognizes the alignment mark on the substrate (step S02). When the substrate 9 arrives on the first suction portion 11a of the temporary placement table 11, the transfer means 12 performs alignment in the X, Y, and θ directions and transfers the substrate 9 to the first suction portion 11a of the temporary placement table 11 ( Step S03).

  Next, the presence signal TX1 of the substrate 9 is sent to the first transfer unit 6 (step S04), and the arrival signal TX2 of the first transfer unit 6 is waited (step S05). When the first transfer unit 6 arrives, the holding plate 16a of the first transfer hand 15A descends, sucks and holds the substrate 9 on the first suction portion 11a of the temporary placement table 11, and the delivery is completed (step S06). . When the delivery of the substrate 9 is completed, the process returns to step S01.

  FIG. 3 is an operation flowchart of the first transfer unit 6.

  First, the first transfer unit 6 on the rail 14A moves to the position A on the temporary placement table 11 of the substrate supply unit 2 that is the receiving position of the substrate 9 (step S11). When arriving at position A, an arrival signal TX2 is sent to the substrate supply unit 2 (step S12). The presence signal TX1 of the substrate 9 is confirmed (step S13), and the holding plate 16a of the first transfer hand 15A is lowered to suck and hold the substrate 9 (step S14).

  Next, after raising the holding plate 16a of the first transfer hand 15A, the first transfer unit 6 is a position that is a transfer position between the first suction table 17a of the first movable table 17A and the first transfer hand 15A. Move to C (step S15). When the position C is reached, a substrate transfer preparation completion signal TX3 is sent to the first movable table 17A (step S16). When the first movable table 17A arrives at the position F that is the receiving position for the substrate 9 (step S17), the first suction table 17a of the first movable table 17A is lifted and the substrate is held by suction on the first transfer hand 15A. 9 is transferred to the first suction table 17a of the first movable table 17A (step S18).

  Next, after the first suction table 17a of the first movable table 17A is lowered, the first transfer unit 6 moves to a position A on the temporary placement table 11 of the substrate supply unit 2 that is a receiving position of the substrate 9 ( Step S19). When arriving at the position A, an arrival signal TX2 is sent to the substrate supply unit 2 (step S20). The presence signal TX1 of the substrate 9 is confirmed (step S21), and the holding plate 16a of the first transfer hand 15A is lowered to suck and hold the substrate 9a (the substrate 9a indicates the substrate 9 that has been transported next) ( Step S22).

  Next, after raising the holding plate 16a of the first transfer hand 15A, the first transfer unit 6 is a position that is a transfer position between the first suction table 17a of the first movable table 17A and the first transfer hand 15B. Move to B (step S23). When the position B is reached, a substrate transfer preparation completion signal TX5 is sent to the first movable table 17A (step S24). When the first movable table 17A arrives at the position F, which is the transfer position of the substrate 9 (step S25), the first suction table 17a of the first movable table 17A is raised, and the holding plate 16b of the first transfer hand 15B is The substrate 9 to which the first adhesive tape 18a is held by suction on the first movable table 17a is sucked and held on the holding plate 16b (step S26).

  Next, after the first suction table 17a of the first movable table 17A is lowered, the first transfer unit 6 is a transfer position between the first suction table 17a of the first movable table 17A and the first transfer hand 15A. Move to position C (step S27).

  Next, the first suction table 17a of the first movable table 17A is raised, and the next substrate 9a is transferred from the first transfer hand 15A to the first suction table 17a of the first movable table 17A (step S28). Next, after the first suction table 17a of the first movable table 17A is lowered, a table shift signal TX6 is sent to the first movable table 17A (step S29).

  Next, the first movable table 17A is moved to a position G, which is a position offset by X1 and Y1 which are the differences between the X and Y directions between the reference reference position of the first adhesive tape 18a and the reference reference position of the second adhesive tape 18b. Move (step S30). After the movement to the position G is completed, the second suction table 17b of the first movable table 17A rises, and the first adhesive tape 18a is attached from the first transfer hand 15B to the second suction table 17b of the first movable table 17A. The substrate 9 is transferred (step S31).

  Next, after the second suction table 17b of the first movable table 17A is lowered, the first transfer unit 6 moves to the position A and continues the operation from step S19.

  FIG. 4 is a flowchart for explaining the operation of the first movable table 17A.

  First, the first movable table A17A moves to the position F where the first suction table 17a of the first movable table 17A receives the substrate 9 from the first transfer hand 15A (step S31). When arriving at the position F, the arrival signal TX8 of the first movable table 17A is sent to the first transfer hand 15A (step S32). When the arrival signal TX3 of the first transfer hand 15A is confirmed (step S33), the first suction table 17a of the first movable table 17A is raised and the substrate 9 is moved from the first transfer hand 15A to the first of the first movable table 17A. It is delivered to the suction table 17a (step S34).

  Next, after the first suction table 17a is lowered, the first movable table 17A moves to the position H that is the first adhesive tape application position of the adhesive tape application unit 3 (step S35). When the first movable table 17A arrives at the position H, the substrate 9 held on the first suction table 17a has already been aligned in the X, Y, and θ directions by the substrate supply unit 2, so that the substrate 9 Without performing the alignment operation, after the first suction table 17a is lowered and the substrate 9 is held by the backup 23, the first head 19a is lowered and the first adhesive tape 18a is applied to the predetermined attachment location 22a of the substrate 9. Pasting (step S36). The sticking time is set for a predetermined time according to the characteristics of the first adhesive tape 18a.

  When the application of the first adhesive tape 18a to the substrate 9 is completed, the first movable table 17A is transferred from the first suction table 17a to the first transfer hand 15B at a position where the substrate 9 to which the first adhesive tape 18a is attached is delivered. Move to a certain position F (step S37). When the first movable table 17A arrives at the position F, the arrival signal TX8 of the first movable table 17A is sent to the first transfer hand 15A (step S38). When the arrival signal TX5 of the first transfer unit 6 is confirmed (step S39), the first suction table 17a is raised and the substrate 9 is transferred from the first suction table 17a to the first transfer hand 15B (step S40).

  Next, after the first suction table 17a is lowered, the position C is a position where the first transfer unit 6 delivers the next substrate 9a from the first transfer hand 15A to the first suction table 17a of the first movable table 17A. (Step S41). When the movement to the position C is completed, the first suction table 17a of the first movable table 17A is raised, and the substrate 9a is transferred from the first transfer hand 15A to the first suction table 17a (step S42).

  Next, after the first suction table 17a is lowered, when the table offset signal TX6 from the first transfer unit 6 is confirmed (step S43), the first movable table 17A has the second reference position of the first adhesive tape 18a and the second reference position. It moves to position G, which is a position offset by X1, Y1, which is the difference between the X and Y directions of the reference position of the adhesive tape 18b, and sends an offset completion signal TX7 to the first transfer hand 15A (step S44). . When the movement to the position G is completed, the second suction table 17b of the first movable table 17A is raised, and the substrate 9 on which the first adhesive tape 18a is attached is received from the first transfer hand 15B (step S45). When the delivery is completed, after the second suction table 17b is lowered, the first movable table 17A moves to the position H that is the first adhesive tape application position of the adhesive tape application unit 3 (step S46).

  Next, when the first movable table 17A arrives at the position H, the first suction table 17a and the second suction table 17b are lowered and the substrate 9a and the substrate 9 are held by the backup 23, and then the first head 19a is lowered and the substrate is moved. The operation of attaching the first adhesive tape 18a to the predetermined application location 22a on 9a and the operation of lowering the second head 19b and applying the second adhesive tape 18b to the predetermined application location 22b on the substrate 9 (step S47) are performed simultaneously. Done. Since the next substrate 9a held on the first suction table 17a has already been aligned in the X, Y, and θ directions by the substrate supply unit 2, the substrate 9a is aligned on the first suction table 17a. There is no need. Further, the substrate 9 on which the first adhesive tape held on the second suction table 17b is attached is in the X and Y directions of the reference reference position of the first adhesive tape 18a and the reference reference position of the second adhesive tape 18b. Since the difference is offset by X1 and Y1, there is no need to perform the alignment operation of the substrate 9. The pasting time is performed for a predetermined time according to the characteristics of the first adhesive tape 18a and the second adhesive tape 18b.

  When the first adhesive tape 18a is attached to the substrate 9a and the second adhesive tape 18b is attached to the substrate 9, the first movable table 17A is moved from the second suction table 17b of the first movable table 17A to the second transfer unit 21. The second transfer hand 15C is moved to a position I that is a position for delivering the substrate 9 (step S48). When the first movable table 17A arrives at the position I, the arrival signal TX9 of the first movable table 17A is sent to the second transfer unit 21 (step S49). Thereafter, when the arrival signal TX10 of the second transfer unit 21 is confirmed (step S50), the second suction table 17b of the first movable table 17A rises to the first transfer hand 15C of the second transfer unit 21. The substrate 9 to which the adhesive tape 18a and the second adhesive tape 18b are attached is delivered (step S51).

  Next, after the second suction table 17b of the first movable table 17A is lowered, the first movable table 17A moves the substrate 9a on which the first adhesive tape 18a is attached from the first suction table 17a to the first transfer hand 15B. It moves to position F, which is a delivery position (step S52), and continues the operation from step S38.

  FIG. 5 is a flowchart for explaining the operation of the second transfer unit 21.

  First, in the second transfer unit 21, the second suction table 17b of the first movable table 17A and the first adhesive tape 18a and the second adhesive tape 18b of the second transfer hand 15C of the second transfer unit 21 are attached. The substrate 9 is moved to a position D where the substrate 9 is delivered (step S61). When arriving at the position D, the arrival signal TX10 of the second transfer unit 21 is sent to the first movable table 17A (step S62). When the arrival signal TX9 of the first movable table 17A is confirmed (step S64), the second suction table 17b of the first movable table 17A is raised, and the first adhesive tape 18a is transferred from the second suction table 17b to the second transfer hand 15C. The substrate 9 on which the second adhesive tape 18b is attached is transferred (step S65).

  Next, after the second suction table 17b of the first movable table 17A is lowered, the second transfer unit 21 is a substrate 9 of the second transfer hand 15C and the suction table 17c of the second movable table 17B of the temporary crimping unit 4. Move to position E, which is a delivery position (step S66). When arriving at position E, the suction table 17c of the second movable table 17B of the temporary press-bonding unit 4 is raised and the substrate 9 is received from the second transfer hand 15C of the second transfer unit 21 (step S67). Next, after the suction table 17c is lowered, the second transfer hand 15C moves to the position D (step S61), and prepares for the next transfer of the substrate 9a. In the temporary pressure bonding unit 4, the alignment operation and temporary bonding of the chip component 7 and the alignment operation and temporary bonding of the FPC 8 to the substrate 9 to which the first adhesive tape 18a and the second adhesive tape 18b are attached are started.

  In this way, the substrate 9 on which the first adhesive tape held on the second suction table 17b of the first movable table 17A is attached is the reference reference position of the first adhesive tape 18a and the reference reference position of the second adhesive tape 18b. By offsetting X1 and Y1, which is the difference between the X and Y directions, two types of adhesive tape can be applied in parallel and the tact time can be greatly reduced with minimum space and minimum equipment costs. Is possible.

  Further, since it is not necessary to align the substrate 9 in the adhesive tape attaching unit 3 every time the first adhesive tape 18a and the second adhesive tape 18b are attached to the substrate 9, the tact time can be shortened. Further, two types of commonly used adhesive tapes can be applied to the substrate 9 at the same time, and the conventional pasting method and the pasting method according to the present invention can be selected by data selection only by changing the software without changing the configuration of the device. It is possible to switch easily.

  The present invention can also be carried out by being modified into the following forms.

  (1) In the above embodiment, the arm 37 having the first and second suction tables 17a and 17b at both ends moves between the receiving position transfer position (loading / unloading position) and the adhesive tape attaching position (XY axis direction in the figure). However, it may be configured as follows.

  The suction table 17a, 17b at both ends is coupled to be rotatable about a longitudinal rotation axis P provided on the movable table of the first movable table 17A, and the longitudinal direction (X direction) of the arm 37 and the horizontal orthogonal direction (Y direction). ) Along the arm (on the XY plane in the figure) and may be configured to be rotatable in the θ direction.

  The operation of applying two types of adhesive tapes using this component device will be described with reference to the operation explanatory diagrams of FIGS.

  First, as shown in FIG. 12, the glass substrate 9 sucked and held by the suction plates 16a and 16b of the first transfer hand 15A or 15B provided in the first transfer unit 6 is transferred to the first movable table 17A. Move to position.

  When the glass substrate 9 is delivered, a control unit (not shown) aligns the glass substrate 9 based on the position information of the alignment mark recognized by the camera 13.

  When the alignment is completed, as shown in FIG. 13, the first movable table 17 </ b> A is moved horizontally, and the glass substrate 9 is moved to the adhesive tape application position of the adhesive tape application unit 3.

  The adhesive tape is affixed to the adhesive tape application location 22a for chip components on the glass substrate at the affixing position. When pasting is completed, the arm 37 rotates clockwise around the rotation axis in the drawing, as shown in FIG. At this time, the suction table 17b at the other end of the arm 37 moves to the receiving position (loading position) of the unprocessed glass substrate 9 to be processed next.

  As shown in FIG. 15, the suction table 17 b moves in the XY direction and the θ direction at the receiving position to perform alignment for receiving the glass substrate 9. When the alignment is completed, the glass substrate 9 is transferred to the suction table 17b, and the arm 37 is rotated so that the arm 37 is parallel to the backup 23 as shown in FIG.

  When the arm 37 is parallel, the suction tables 17a and 17b are rotated so that the adhesive tape-attached end of the glass substrate 9 faces the backup 23 as shown in FIG. At this time, the suction table 17a is moved back and forth with respect to the horizontal orthogonal axis of the arm 37 so that the FPC adhesive tape application location 22b is aligned at the adhesive tape application position.

  When the alignment of both the suction tables 17a and 17b is completed, as shown in FIG. 18, the first movable table 17A further moves horizontally, and both the glass substrates 9 are moved to the adhesive tape attaching position. At this position, different types of adhesive tapes are simultaneously attached to the respective glass substrates 9.

  When the application of the adhesive tape is completed, the arm 37 rotates as shown in FIG. At this time, as shown in FIG. 20, the first suction table 17a moves to a delivery position (carrying-out position) to the second transfer hand 15C provided with the second transfer unit 21. Here, the glass substrate 9 is aligned and delivered to the second transfer hand 15C.

  Thereafter, the arm 37 is rotated to move the first suction table 17a to a position for receiving the next unprocessed glass substrate 9, as shown in FIG. 21, and the second suction table 17b is moved to the next FPC adhesive tape. Move the unit to the unit where it will be pasted.

  When the first suction table 17a receives the unprocessed glass substrate 9, the processes shown in FIGS. 12 to 21 are repeated.

  According to this configuration, a predetermined adhesive tape can be applied in order to the adhesive tape application portion of the glass substrate 9 while rotating the arm 37 on the first movable table about the rotation axis P. Further, the glass substrate 9 with two types of adhesive tapes is transferred to the second movable table 17B by the second transfer unit 21, and the untreated glass substrate 9 is transferred to the second suction table 17b after the movement. It is possible to move each of the glass substrate 9 and the unprocessed glass substrate 9 that are mounted and adhered to one type of adhesive tape at the same time. Therefore, since the number of times of delivery of the glass substrate 9 can be reduced as compared with the above-described embodiment apparatus, work efficiency can be improved.

  (2) The apparatus of the above embodiment was the temporary pressure bonding unit 4 for bonding the adhesive tape to the chip component 7 or the FPC 8 in an uncured state in the next configuration of the adhesive tape applying unit 3, but the polymerization of the adhesive was completed. Thus, it can be applied as a main pressure bonding unit for completely fixing the chip component 7 and the like.

It is a perspective view of the mounting apparatus of one embodiment of the present invention. It is a flowchart which shows operation | movement of a board | substrate supply unit. 4 is a flowchart showing the operation of the first transfer unit 6. It is a flowchart which shows operation | movement of the 1st movable table 17A. 7 is a flowchart showing the operation of the second transfer unit 21. It is explanatory drawing which shows operation | movement of the sticking position of an adhesive tape. It is a figure explaining stop position A of the 1st transfer unit 6, stop position H of the 1st movable table 17A, and stop position E of the 2nd transfer unit 21. It is a figure explaining the stop position B of the 1st transfer unit 6, and the stop position F of the 1st movable table 17A. It is a figure explaining the stop position C of the 1st transfer unit 6, and the stop position F of the 1st movable table 17A. It is a figure explaining the stop position C of the 1st transfer unit 6, and the stop position G of the 1st movable table 17A. It is a figure explaining stop position D of the 2nd transfer unit 21, and stop position I of the 1st movable table 17A. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a modification apparatus. It is a figure explaining the adhesive tape sticking operation | movement of a conventional apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Device base 2 Substrate supply unit 3 Adhesive tape sticking unit 4 Temporary pressure bonding unit 5 Main pressure bonding unit 6 1st transfer unit 7 Chip component 8 FPC
9 Substrate 9a Substrate 10 Pallet 11 Temporary placing table 11a First suction part 11b Second suction part 12 Transport means 13 Camera 14A Rail 14B Rail 15A First transfer hand 15B First transfer hand 15C Second transfer hand 15D Second Transfer hand 16a Holding plate 16b Holding plate 17A First movable table 17a First suction table 17b Second suction table 17B Second movable table 17c Suction table 17D Third movable table 18a First adhesive tape 18b Second adhesive tape 19a First Head 19b 2nd head 19c 3rd head 19d 4th head 20a 1st adhesive tape supply mechanism 20b 2nd adhesive tape supply mechanism 21 2nd transfer unit 22a Pasting location 22b Pasting location 23 Backup 25 Temporary pressure bonding head 27 Chip slider 28 Chip Pallet 29 FPC pallet 30 Guide rail 31 Two-field camera 32 Conveying means 33 Third transfer unit 34 Fourth transfer unit 35 Unloading stage TX1 Board presence signal TX2 Position A arrival signal TX3 Position C arrival signal TX5 Position B arrival signal TX6 Table offset signal TX7 Position G arrival signal TX8 Position F arrival signal TX9 Position I arrival signal TX10 Position D arrival signal

Claims (10)

A position where the glass substrate is received from the first transfer unit, a position where the adhesive tape is applied to the received glass substrate, and a position where the glass substrate attached with the adhesive tape is transferred to the second transfer unit. A first movable table having a pair of first and second suction tables, and a first head and a second head for bonding the supplied first adhesive tape and second adhesive tape to a glass substrate by thermocompression bonding A dissimilar adhesive tape affixing method for affixing the different first and second adhesive tapes to a glass substrate by a dissimilar adhesive tape affixing device including a tape affixing unit,
Transferring the glass substrate to the first suction table of the first movable table by the first transfer unit;
After transferring the glass substrate to the first suction table, the step of moving the first movable table to a position where the first adhesive tape is applied;
Affixing a first adhesive tape with a first head on the glass substrate at the affixing position;
The glass substrate to which the first adhesive tape is attached is transferred from the first suction table to the second suction table, and the next glass substrate is in a position to receive the glass substrate from the first transfer unit. Transferring to the first suction table;
Moving the first movable table so that both glass substrates are positioned at the application position of the first and second adhesive tapes;
For each glass substrate, applying the first adhesive tape with the first head and applying the second adhesive tape with the second head at the same time;
Transferring the glass substrate on which both adhesive tapes are pasted from the second suction table to the second transfer unit;
A method for applying a different type of adhesive tape, comprising: In the sticking method of the different type adhesive tape according to claim 1,
Before the step of transferring the glass substrate to the first suction table, the position of the alignment mark attached to the glass substrate while the glass substrate is taken out from the pallet for transporting the glass substrate and transported to the temporary placement table is further determined. Recognizing steps,
Based on the recognition result of the position of the alignment mark, correcting the position of the glass substrate and delivering the glass substrate to the temporary table;
Transporting the glass substrate transferred to the temporary table to the delivery position to the adhesive tape application unit by the first transfer unit;
A method for applying a different type of adhesive tape, comprising: A bonding method for mounting an LSI and a flexible printed circuit on a glass substrate using the method for applying a different type of adhesive tape according to claim 1 or 2,
Mounting LSI on one of the first and second adhesive tapes affixed to the glass substrate and mounting a flexible printed circuit on the other;
Crimping LSI and Flexible Printed Circuit mounted on the glass substrate;
A bonding method characterized by comprising: A position where the glass substrate is received from the first transfer unit, a position where the adhesive tape is applied to the received glass substrate, and a position where the glass substrate attached with the adhesive tape is transferred to the second transfer unit. A first movable table having a pair of first and second suction tables, and a first head and a second head for bonding the supplied first adhesive tape and second adhesive tape to a glass substrate by thermocompression bonding An adhesive tape application device that includes a tape application unit and attaches different first and second adhesive tapes to a glass substrate,
After the glass substrate is transferred to the first suction table of the first movable table by the first transfer unit, the first movable table is moved to the application position of the first adhesive tape,
The first adhesive tape is pasted on the glass substrate at the pasting position with the first head,
The glass substrate to which the first adhesive tape is attached is transferred from the first suction table to the second suction table, and the next glass substrate is in a position to receive the glass substrate from the first transfer unit. Is transferred to the first suction table,
Moving the first movable table so that both glass substrates are located at the application position of the first and second adhesive tapes,
Attaching the first adhesive tape with the first head and the second adhesive tape with the second head simultaneously to each glass substrate,
An apparatus for applying a different type of adhesive tape, wherein the glass substrate having both adhesive tapes attached from the second suction table is transferred to a second transfer unit. In the sticking device of the different type adhesive tape according to claim 4,
Further, a conveying means for taking out the glass substrate from the pallet for conveying the glass substrate and conveying it to the temporary table,
A position detecting means for detecting an alignment mark provided on the glass substrate,
Before the glass substrate is transferred to the first suction table, the position detecting unit detects the position of the alignment mark attached to the glass substrate while the glass substrate is transported from the pallet to the temporary placement table by the transport unit. And
Based on the result, correct the position of the glass substrate and deliver the glass substrate to the temporary table,
An apparatus for applying a different type of adhesive tape, wherein the glass substrate transferred to the temporary table is transported to a delivery position to the adhesive tape application unit by the first transfer unit. A bonding apparatus for mounting an LSI and a Flexible Printed Circuit on a glass substrate including the dissimilar adhesive tape sticking apparatus according to claim 4 or 5,
Mounting means for mounting an LSI on one of the first and second adhesive tapes affixed to the glass substrate and a flexible printed circuit on the other;
A crimping unit for crimping the LSI and Flexible Printed Circuit mounted on the glass substrate;
A bonding apparatus comprising: In a different type adhesive tape application device that attaches different types of adhesive tape to glass substrates,
Transport means for transporting the glass substrate from the pallet to a temporary table;
Position detecting means for detecting alignment marks provided on the glass substrate;
A substrate supply unit comprising:
There are suction tables at both ends of the movable table and the arm rotatably connected to the vertical rotation shaft of the movable table, and the glass substrate is held by alignment based on the detection result of the position detection means, A first movable table configured to move both suction tables across the adhesive tape application position;
An adhesive tape application unit for attaching different types of adhesive tape to the glass substrate at the application position;
A first transfer unit for transferring a glass substrate from the temporary table to a first movable table;
A crimping unit for crimping different mounting members for each part to which the adhesive tape is attached;
While aligning the glass substrate based on the detection result of the position detection means, a second movable table that moves across the loading / unloading position and the crimping position of the crimping unit,
A second transfer unit for transferring the glass substrate on which the adhesive tape has been pasted on the first movable table to the second movable table;
A third transfer unit that transports the glass substrate on which the mounting member is crimped to the next process;
The unprocessed glass substrate transported by the first transfer unit is transferred to and aligned with one suction table at the delivery position, and the first movable table is moved to the adhesive tape application position to be a predetermined position of the glass substrate. Affix the adhesive tape to the
After the pasting, the arm is rotated to move the glass substrate to a different adhesive tape pasting position, and the untreated glass substrate transported by the first transfer unit is transferred to the other suction table for alignment. Move both suction tables to the adhesive tape application position,
Adhesive tape is applied to both glass substrates with the adhesive tape application unit.
After the pasting is finished, the arm is rotated and the glass substrate on which the two types of adhesive tapes are pasted is transferred to the second movable table by the second transfer unit,
Furthermore, the glass substrate on which the untreated glass substrate conveyed by the first transfer unit is transferred and aligned on the suction table on which the glass substrate is unloaded by rotating the arm, and one type of adhesive tape is attached. , Move both suction tables to the adhesive tape application position,
An adhesive tape application unit for applying different types of adhesive tape, wherein the adhesive tape is applied to both glass substrates by an adhesive tape application unit. In the sticking device of the different type | mold adhesive tape of Claim 7,
The adhering table is configured to be movable along the longitudinal direction of the arm and is held rotatably about a vertical axis perpendicular to the arm. In the sticking device of the different type | mold adhesive tape of Claim 8,
The adhering table is configured to be movable back and forth along an axis that is horizontally orthogonal to the arm. A bonding apparatus for mounting an LSI and a Flexible Printed Circuit on a glass substrate including the dissimilar adhesive tape applying apparatus according to any one of claims 7 to 9,
Mounting means for mounting an LSI on one of the first and second adhesive tapes affixed to the glass substrate and a flexible printed circuit on the other;
A crimping unit for crimping the LSI and Flexible Printed Circuit mounted on the glass substrate;
A bonding apparatus comprising:

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