TW200746331A - Method and apparatus for joining different kinds of adhesive tapes and bonding using the same - Google Patents

Method and apparatus for joining different kinds of adhesive tapes and bonding using the same

Info

Publication number
TW200746331A
TW200746331A TW096113270A TW96113270A TW200746331A TW 200746331 A TW200746331 A TW 200746331A TW 096113270 A TW096113270 A TW 096113270A TW 96113270 A TW96113270 A TW 96113270A TW 200746331 A TW200746331 A TW 200746331A
Authority
TW
Taiwan
Prior art keywords
adhesive tapes
bonding
same
different kinds
glass substrate
Prior art date
Application number
TW096113270A
Other languages
Chinese (zh)
Inventor
Yasushi Tamura
Satoru Naraba
Yoshihiro Kinoshita
Takuji Obayashi
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200746331A publication Critical patent/TW200746331A/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Abstract

After adhering the adhesive tapes for chip parts on the glass substrate by using the first transferring unit having two transferring hands and the first movable table having two sucking tables, only the adhering position of the adhesive tape for FPC is shifted to the location of the first movable table and the glass substrate is transferred to the first movable table so that the operation of simultaneous parallel adhering of the two kinds of sdhesive tapes on the glass substrate is conducted.
TW096113270A 2006-04-17 2007-04-16 Method and apparatus for joining different kinds of adhesive tapes and bonding using the same TW200746331A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006113250 2006-04-17
JP2007101648A JP2007311774A (en) 2006-04-17 2007-04-09 Different kind adhesive tape sticking method, bonding method using the same, and devices for these

Publications (1)

Publication Number Publication Date
TW200746331A true TW200746331A (en) 2007-12-16

Family

ID=38817618

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113270A TW200746331A (en) 2006-04-17 2007-04-16 Method and apparatus for joining different kinds of adhesive tapes and bonding using the same

Country Status (4)

Country Link
JP (1) JP2007311774A (en)
KR (1) KR20070102945A (en)
CN (1) CN101060772B (en)
TW (1) TW200746331A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864878B1 (en) * 2008-01-31 2008-10-22 세광테크 주식회사 Apparatus for transforting pannel
JP2012182358A (en) * 2011-03-02 2012-09-20 Hitachi High-Technologies Corp Apparatus and method for assembling fpd module
KR102022472B1 (en) * 2014-07-04 2019-09-18 한화정밀기계 주식회사 Tape adhesion apparatus
KR102131019B1 (en) 2019-04-19 2020-07-07 주식회사 한길엔씨티 Transfer of tape fabrics and coating surface drying system
KR102131030B1 (en) 2019-04-19 2020-07-07 주식회사 한길엔씨티 Transfer apparatus for tape fabrics
CN112566485B (en) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 Mounting device for electronic component

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2393305Y (en) * 1999-07-09 2000-08-23 黄秋逢 Automatic adhesive-tape applicating machine
JP4289102B2 (en) * 2003-09-26 2009-07-01 パナソニック株式会社 Assembling apparatus, assembling method, and terminal cleaning apparatus
JP4848627B2 (en) * 2004-09-27 2011-12-28 パナソニック株式会社 Display panel assembling apparatus and assembling method

Also Published As

Publication number Publication date
KR20070102945A (en) 2007-10-22
CN101060772A (en) 2007-10-24
CN101060772B (en) 2010-06-02
JP2007311774A (en) 2007-11-29

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