KR102383924B1 - Device for mounting electric component - Google Patents

Abstract

An object of the present invention is to provide an electronic component mounting device that can be flexibly supported while suppressing the size and complexity of the device even when the anisotropic conductive film is adhered to either the display panel side or the electronic component side.
An electronic component mounting device according to an embodiment includes an adhesive device for adhering an anisotropic conductive film to a display panel or electronic component, and a display panel or electronic component to which the anisotropic conductive film is adhered and the other side through the anisotropic conductive film. A pressure bonding apparatus; a main pressure bonding apparatus for main pressure bonding of the press-bonded display panel and electronic components; a display panel conveying apparatus for selectively conveying the display panel to the bonding apparatus and the pressure bonding apparatus; An electronic component conveying apparatus selectively conveyed to the apparatus is provided.

Description

Electronic component mounting device {DEVICE FOR MOUNTING ELECTRIC COMPONENT}

The present invention relates to an electronic component mounting apparatus.

DESCRIPTION OF RELATED ART In the manufacturing process of a liquid crystal display or organic electroluminescent display, the panel assembly process of mounting film-type electronic components, such as COF (Chip on Film) and FPC (Flexible Printed Circuit), on a display panel formed of glass or resin is known.

In this panel assembly process, first, a plurality of leads formed on a display panel and a plurality of leads formed on an electronic component are mounted via an anisotropic conductive film (ACF).

In addition, in small display panels used in mobile devices such as smartphones, in recent years, electronic components such as COF mounted on the display panel are further mounted with other electronic components such as FPCs via the ACF.

In such an assembly process, in the past, an aspect in which electronic components were mounted through an ACF adhered to a display panel was mainstream.

However, in recent years, due to the diversification of the mounting mode as described above, not only the display panel but also the ACF adhesion aspect, such as the aspect in which the ACF is attached to the COF or FPC, the aspect where the ACF is attached to the COF mounted on the display panel, etc. is diversifying.

Therefore, a mounting apparatus capable of flexibly responding to such a diversified ACF adhesion mode has been demanded.

[Patent Document 1] Japanese Patent Laid-Open No. 2006-135082

An object of the present invention is to provide an electronic component mounting device that can be flexibly supported while suppressing the size and complexity of the device even when the anisotropic conductive film is adhered to either the display panel side or the electronic component side.

The mounting apparatus of this embodiment is an electronic component mounting apparatus which mounts an electronic component through an anisotropic conductive film on a display panel,

an adhesive device for adhering the anisotropic conductive film to the display panel or the electronic component;

a pressure bonding device for press-bonding the display panel or the electronic component to which the anisotropic conductive film is adhered by the bonding device and the other side through the anisotropic conductive film;

a main crimping device for main crimping the display panel and the electronic component press-bonded by the crimping device;

a first display panel transport device for selectively transporting the display panel to the bonding device and the pressure bonding device;

A 1st electronic component conveyance apparatus which selectively conveys the said electronic component to the said adhesion|attachment apparatus and the said pressure bonding apparatus is provided.

According to the present invention, even when the anisotropic conductive film is adhered to either one of the display panel side and the electronic component side, it is possible to respond flexibly while suppressing the enlargement and complexity of the device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the schematic structure of the mounting apparatus of embodiment.
It is a front view which shows the structure of the bonding apparatus with which the mounting apparatus of embodiment is equipped.
3 is a schematic diagram showing a display panel and an electronic component to be mounted by the mounting apparatus according to the embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment (henceforth "embodiment") of this invention is demonstrated with reference to FIGS. In addition, as the drawings are schematic, the relationship between thickness and planar dimensions, the position and size of each component, etc. do not pass as a convenient expression for easy understanding of the structure and may be different from reality.

Fig. 1 is a plan view showing the configuration of a mounting apparatus 1 of the present embodiment, Fig. 2 is a front view showing the configuration of a bonding apparatus included in the mounting apparatus 1, and Fig. 3 is a mounting apparatus 1 of the present embodiment. It is a schematic diagram showing the mounting form of the display panel and the electronic component to be mounted.

As shown in FIG. 1 , the mounting device 1 mounts the electronic component W on the display panel P through the anisotropic conductive film F, and includes an adhesive device 10 and a pressure bonding device 20 . ( 80), the second electronic component conveying device 90, the first display panel reversing device 100, the second display panel reversing device 110, the first electronic component reversing device 120, the second electronic component reversing device ( 130 ), an electronic component rotating device 140 , a discharge unit 150 , and a control device 160 .

First, the bonding device 10 adheres the anisotropic conductive film F to the display panel P or the electronic component W. The pressure bonding device 20 is the display panel P or the electronic component W to which the anisotropic conductive film F is adhered and the other side (anisotropic conductive film F among the display panel P and the electronic component W). This non-bonded side] is press-bonded by the adhesive force of the anisotropic conductive film (F). The main crimping apparatus 30 performs main crimping of the press-bonded display panel P and the electronic component W. As shown in FIG. These bonding apparatus 10, the pressure bonding apparatus 20, and the main compression bonding apparatus 30 are arranged in a line in a horizontal direction in this order and are comprised. In the present embodiment, the direction along the arrangement direction is the X direction, and the direction orthogonal to the X direction and the horizontal direction is the Y direction. Let the device 30 side be the downstream side.

With respect to the bonding apparatus 10, the pressure bonding apparatus 20, and the main pressure bonding apparatus 30 arranged in this way, the first display panel is on the front side in the direction (Y direction) orthogonal to the arrangement direction (X direction). The conveying apparatus 60 and the second display panel conveying apparatus 70 are arranged along the X direction, and inside, the first electronic component conveying apparatus 80 and the second electronic component conveying apparatus 90 are arranged along the X direction. are placed

The display panel supply part 40 is arrange|positioned at the edge part upstream in which the bonding apparatus 10 in the 1st display panel conveyance apparatus 60 is located.

The electronic component supply part 50 is arrange|positioned in the edge part upstream in which the bonding apparatus 10 in the 1st electronic component conveyance apparatus 80 is located.

The discharge part 150 is arrange|positioned on the downstream side of the edge part in which the main crimping|compression-bonding apparatus 30 in the 2nd display panel conveying apparatus 70 is located.

In addition, the first display panel inversion device 100 is disposed between the display panel supply unit 40 and the first display panel transport device 60 . A second display panel inverting device 110 is disposed between the first display panel transport device 60 and the second display panel transport device 70 .

Moreover, in the position between the electronic component supply part 50 and the 1st electronic component conveyance apparatus 80, the 1st electronic component inversion apparatus 120 is arrange|positioned. The 2nd electronic component reversing apparatus 130 and the electronic component rotating apparatus 140 are arrange|positioned at the position between the 1st electronic component conveyance apparatus 80 and the 2nd electronic component conveyance apparatus 90. As shown in FIG.

Here, the mounting mode of the display panel P and the electronic component W will be described with reference to FIG. 3 . As the display panel P, a display panel made of glass or a resin such as a liquid crystal display panel (Liquid Crystal Display: LCD) or an organic EL panel (Organic LED Display: OLED) can be used. In addition, as an electronic component, film-type electronic components, such as FPC (Flexible printed circuits) and COF (Chip on Film), can be used.

FIG. 3A is a view illustrating a case in which the display panel P and the electronic component W are pressed through the anisotropic conductive film F attached to the display panel P. Referring to FIG. FIG. 3B is a view illustrating a case in which the display panel P and the electronic component W are pressed through the anisotropic conductive film F attached to the electronic component W. Referring to FIG. FIG. 3C is an embodiment in which an electronic component W2 such as an FPC is pressed against an electronic component W1 such as a COF mounted on the display panel P, and of the electronic component W1, the display panel P ) through the anisotropic conductive film (F) adhered to the opposite side to the mounted side, the electronic component (W1) and the electronic component (W2) are compressed. FIG. 3D shows an aspect in which an electronic component W2 such as an FPC is pressed against an electronic component W1 such as a COF mounted on the display panel P, and an anisotropic conductive film adhered to the electronic component W2 Through (F), the electronic component W1 and the electronic component W2 are pressed against the surface opposite to the surface mounted on the display panel P of the electronic component W1. FIG. 3E is a mode in which an electronic component W2 such as an FPC is pressed against an electronic component W1 such as a COF mounted on the display panel P, and of the electronic component W1, the display panel P ) through the anisotropic conductive film (F) adhered to the mounted surface, the electronic component (W1) and the electronic component (W2) is compressed. FIG. 3F is an example of pressing an electronic component W2 such as an FPC with respect to an electronic component W1 such as a COF mounted on the display panel P, and an anisotropic conductive film adhered to the electronic component W2 It is an aspect in which the electronic component W1 and the electronic component W2 are crimped|bonded to the surface mounted on the display panel P of the electronic component W1 via (F).

As described above, there are various aspects of the mounting aspect of the display panel P and the electronic component W, and the aspect of directly mounting the electronic component W on the display panel P [FIG. 3(A), In addition to (B)], aspects in which the electronic component W2 is indirectly mounted through the electronic component W1 mounted on the display panel P [FIG. 3(C), (D), (E), (F) )] also exist. Therefore, in this specification, not only the display panel P but also the display panel P on which the electronic component W1 is mounted shall be called the display panel P.

Below, the structure of the mounting apparatus 1 of this embodiment is demonstrated in detail.

1 and 2 , the bonding apparatus 10 includes a pair of stages 11A and 11B arranged in parallel in the X direction, and a display panel P supported by the stages 11A and 11B. Alternatively, an adhesive unit 12 for adhering the anisotropic conductive film F to the electronic component W is provided. In addition, in FIG. 1, the places where the stages 11A, 11B, 32A, 32B, the panel stage 22, and the conveyance arm 61 are to be moved are shown with a dotted line, In each apparatus which comprises the mounting apparatus 1, The display panel P and the electronic component W are indicated by a solid line and a dashed-dotted line.

Each of the stages 11A and 11B is supported so as to be movable in the Y-direction by the Y-direction driving unit 11a. As a result, the stages 11A and 11B are movable between the first display panel transport device 60 and the first electronic component transport device 80 . That is, it becomes possible to move between the position L at the 1st display panel conveying apparatus 60 side shown by the solid line in FIG. 1, and the position M at the 1st electronic component conveyance apparatus 80 side shown by the dotted line. The stages 11A and 11B transfer the display panel P to and from the first display panel transport device 60 at the position L, and transfer the display panel P to the first electronic component transport device 80 at the position M. The electronic component W can be transmitted between them.

Further, the stages 11A and 11B include an X-direction drive unit 11b and a rotation (θ) direction drive unit 11c, and position adjustment is possible in the X direction and in the rotational direction in the horizontal plane as well.

On these stages 11A, 11B, the display panel P and the electronic component W are comprised so that two each can be arrange|positioned, respectively. In addition, the stages 11A and 11B are configured to be interchangeable, and when the display panel P is supported, the stages 11A and 11B for the display panel P are mounted, and the electronic component W is supported. At this time, the stages 11A and 11B for the electronic component W are mounted.

The bonding unit 12 is supported by a door-shaped frame 13 arranged along the X direction at a substantially intermediate position between the first display panel conveying apparatus 60 and the first electronic component conveying apparatus 80 . do. In more detail, on the lower surface of the horizontal part 13a in the frame 13, the X-direction drive part 14 is provided. The bonding unit 12 is supported by the X-direction driving unit 14 so that its main body 12a is suspended. Accordingly, the bonding unit 12 can move to each position for bonding the anisotropic conductive films F of the electronic component W or the display panels P in total supported on the stages 11A and 11B. there is.

A compression head 12b, a supply reel 12c, a collection nozzle 12d, and a conveyance part 12e are provided in the body part 12a of the bonding unit 12. As shown in FIG. The crimping head 12b is provided in the lower center of the main body 12a, and includes a crimping tool 12b1 and a pressure driving unit 12b2 such as an air cylinder.

The supply reel 12c is provided in the upper right of the crimping head 12b. On the supply reel 12c, a tape-shaped anisotropic conductive film F is wound integrally with a release paper, and the anisotropic conductive film F can be sequentially released and supplied together with the release paper.

The recovery nozzle 12d is supplied from the supply reel 12c and sucks the release paper remaining after the anisotropic conductive film F is pressed to the display panel P or the electronic component W by the compression head 12b. It is a return nozzle. The collection nozzle 12d is provided adjacent to the left side of the supply reel 12c, is connected to a vacuum pump (not shown), and is capable of recovering the sucked release paper to a recovery unit (not shown).

The conveyance part 12e is equipped with a pair of guide roller 12e1 provided on both sides of the crimping tool 12b1, and the conveyance roller 12e2 arrange|positioned below the collection|recovery nozzle 12d. Thereby, the anisotropic conductive film F unwound from the supply reel 12c can be conveyed to the lower side of the crimping|compression-bonding tool 12b1.

The pressure bonding apparatus 20 pressure-bonds the electronic component W to the display panel P using the adhesive force of the anisotropic conductive film F. As shown in FIG. 1 , the pressure bonding apparatus 20 includes the pressure bonding head 21 , the panel stage 22 , the components conveying unit 23 , the second electronic component conveying apparatus 90 , and the electronic component rotating apparatus. It is composed of (140). The pressure bonding head 21 is disposed so as to be able to move up and down at a substantially intermediate position between the first display panel conveying apparatus 60 and the first electronic component conveying apparatus 80 . The pressure bonding head 21 is a member that heats and presses the electronic component W to the display panel P through the anisotropic conductive film F, and includes a heating unit and a pressure driving unit (not shown).

The panel stage 22 is a stage that supports the display panel P. The panel stage 22 includes a first display panel transport device 60 , a components transport unit 23 , and a second display panel transport device for the display panel P supported by an XY-direction drive unit (not shown). It can be moved between (70). Specifically, in FIG. 1 , the receiving position G of the display panel P from the first display panel conveying apparatus 60 indicated by a solid line on the first display panel conveying apparatus 60 side, and the components conveying unit 23 . It becomes possible to move to the pressure-bonding position H shown by the dotted line on the side, and the delivery position K of the display panel P with respect to the second display panel conveying apparatus 70 side shown by the dotted line on the second display panel conveying apparatus 70 side.

The components conveyance part 23 is equipped with the stage 23a which arrange|positions the electronic component W, and the Y-direction drive part 23b which moves the stage 23a to a Y direction. The components conveyance part 23 drives the Y-direction drive part 23b, and moves the stage 23a in which the electronic component W was arrange|positioned under the pressure bonding head 21. As shown in FIG.

The main crimping apparatus 30 heats and presses the electronic component W press-bonded to the display panel P to perform main crimping. The main crimping apparatus 30 is equipped with the main crimping|compression-bonding head unit 31 and a pair of stages 32A, 32B. On the stages 32A and 32B, two display panels P (hereinafter simply referred to as "display panels P") to which the electronic components W are press-bonded are arranged two each.

The main pressure bonding head unit 31 is arrange|positioned at the substantially intermediate position of the 2nd display panel conveyance apparatus 70 and the 2nd electronic component conveyance apparatus 90 in the Y direction. The main crimping head unit 31 is provided with four main crimping heads 31a arranged along the X direction. A backup tool (not shown) is disposed directly below each main crimping head 31a. Thereby, when the main crimping|compression-bonding is performed by the main crimping|compression-bonding head 31a, the lower surface of the display panel P is supported by a backup tool. In each of the four main compression heads 31a, a heating unit (not shown) for heating the main compression head 31a and a pressure driving unit (not shown) for applying a pressing force to the main compression head 31a are separately provided. These four main crimping heads 31a perform main crimping of the electronic component W press-bonded to the display panel P supported by the stages 32A and 32B.

The stages 32A and 32B are respectively provided so as to be movable in the Y direction by a Y-direction driving unit (not shown). Accordingly, the display panel P is transferred between the second display panel transport device 70 and the second display panel transport device 70 at the position N on the side of the second display panel transport device 70 indicated by the solid line, and the main crimping head unit shown by the dotted line The display panel P can be supplied to the main crimping position Q on the (31) side.

The display panel supply unit 40 supplies the display panel P conveyed from the previous process to the first display panel conveying apparatus 60 . The display panel supply unit 40 includes a mounting table 41 for arranging the display panel P conveyed from the previous step, and a relay unit for transmitting the display panel P to the first display panel conveying device 60 ( 42 , and a conveying unit 43 for conveying the display panel P from the mounting table 41 to the relay station 42 . The mounting table 41 and the relay station 42 are configured such that two display panels P can be arranged side by side at a predetermined interval in the X direction, respectively.

The conveyance part 43 is equipped with the conveyance arm 43a which adsorb|sucks and holds the display panel P from above, and the X-direction drive part 43b which moves the conveyance arm 43a in the X direction. The conveyance arm 43a is comprised with a pair of arms so that the display panel P arrange|positioned side by side with a predetermined space|interval can be hold|maintained simultaneously.

Here, in the relay stand 42, the adhesiveness of the anisotropic conductive film F is improved with respect to a site (hereinafter referred to as a "mounting site") on which the electronic component W in the display panel P is mounted. A processing device 42a that performs processing is provided incidentally. The relay station 42 is installed to be movable in the X-direction by an X-direction driving unit (not shown). On the movement locus of the mounting site in the display panel P due to the X-direction movement of the relay stand 42 , the processing device 42a is disposed to face the mounting site. Accordingly, the processing can be performed by sequentially facing the mounting portion of the display panel P to the processing device 42a by the X-direction movement of the relay station 42 . The process which improves the adhesiveness of the anisotropic conductive film F is washing|cleaning or a roughening process, for example, It can be performed by rubbing with a brush, or irradiating plasma. In the present embodiment, a brush is used. Accordingly, the processing device 42a includes a rotary brush having a cylindrical shape and slidingly contacting the mounting portion, and a driving unit (both not shown) for rotating the rotary brush about an axis along the Y direction.

The electronic component supply part 50 supplies the electronic component W accommodated in the tray T to the 1st electronic component conveyance apparatus 80. The electronic component supply unit 50 supplies a tray T in which the electronic component W is accommodated, and the electronic component W is taken out and an empty tray T is discharged. A relay station 51 for delivering the electronic component W to the first electronic component conveying device 80 , and a transfer unit (not shown) for transferring the electronic component W accommodated in the tray T to the relay station 51 . to provide The relay stand 51 is configured such that two electronic components W can be arranged side by side at predetermined intervals in the X direction. A transfer unit (not shown) adsorbs the electronic components W one by one from the tray T, takes them out, and transfers them to the relay stand 51 .

Here, in the relay stand 51 , similarly to the mounting table 41 of the display panel supply unit 40 , the anisotropic conductive film F is attached to the mounting portion of the electronic component W with the display panel P . A processing device 51a for performing a process for improving the adhesiveness of the substrate is provided incidentally.

Accordingly, similarly to the mounting table 41, the relay unit 51 is installed so as to be movable in the X direction by an X-direction driving unit (not shown). The processing apparatus 51a shall be provided with a plasma irradiation part (not shown). The processing by the processing device 51a can be performed in the same manner as the mounting table 41 .

The first display panel conveying apparatus 60 includes a mounting table 41 of the display panel supply unit 40 , stages 11A and 11B of the bonding apparatus 10 , and a panel stage 22 of the press bonding apparatus 20 ( The display panel P is transferred to the position G). The first display panel transport device 60 has the same configuration as the transport unit 43 . That is, the first display panel transport device 60 includes a transport arm 61 having a pair of arms for adsorbing and holding the two display panels P from above, and moving the transport arm 61 in the X direction. and an X-direction driving unit 62 . The X-direction driving unit 62 moves the conveying arm 61 to the relay stage 42 and the panel stage 22 (position) positioned at the receiving position of the display panel P from the first display panel conveying apparatus 60 . G) can be moved between Accordingly, the first display panel transport apparatus 60 transfers the display panel P from the relay station 42 to the stages 11A and 11B, and from the relay station 42 to the panel stage 22 (position G). In this way, it can be transferred from the stages 11A and 11B to the panel stage 22 (position G).

The second display panel conveying apparatus 70 is disposed with respect to the panel stage 22 (position K) of the pressure bonding apparatus 20 , the stages 32A and 32B (position N) of the main pressure bonding apparatus, and the discharge unit 150 . The display panel P is transferred. The second display panel transport device 70, similarly to the first display panel transport device 60, includes a transport arm 71 having a pair of arms for adsorbing and holding the two display panels P from above; An X-direction driving unit 72 for moving the conveying arm 71 in the X-direction is provided. The X-direction driving unit 72 moves the conveying arm 71 to the panel stage 22 (position K) and the discharge unit ( 150) can be moved between Accordingly, the second display panel transport device 70 transfers the display panel P from the panel stage 22 (position K) to the stages 32A, 32B (position N) and from the stages 32A and 32B. It is designed to be transferred to the discharge unit 150 . In addition, the discharge unit 150 is disposed adjacent to the main crimping device 30 on the opposite side to the crimping device 20 .

The 1st electronic component conveyance apparatus 80 is with respect to the relay stand 51 of the electronic component supply part 50, stage 11A, 11B of the bonding apparatus 10, and the electronic component rotation apparatus 140 which will be described in detail later. The display panel P is transferred. The first electronic component conveying apparatus 80, similarly to the first display panel conveying apparatus 60, includes: a conveying arm 81 having a pair of arms for adsorbing and holding the two electronic components W from above; An X-direction driving unit 82 for moving the conveying arm 81 in the X-direction is provided. The X-direction drive part 82 can move the conveyance arm 81 between the relay stand 51 and the electronic component rotating device 140 . Thereby, the 1st electronic component conveyance apparatus 80 transfers the electronic component W from the relay stand 51 to stages 11A and 11B, and from the relay stand 51 to the electronic component rotating apparatus 140 and the stage ( 11A, 11B) to the electronic component rotating device 140 can be transferred.

The 2nd electronic component conveyance apparatus 90 conveys the electronic component W from the electronic component rotation apparatus 140 to the components conveyance part 23 of the pressure bonding apparatus 20. The 2nd electronic component conveyance apparatus 90 is equipped with the conveyance arm 91 which adsorb|sucks and holds the electronic components W one by one from upper side, and the X-direction drive part 92 which moves the conveyance arm 91 in the X direction. do. The X-direction drive part 92 can move the conveyance arm 91 between the electronic component rotating apparatus 140 and the components conveyance part 23. Thereby, the 2nd electronic component conveyance apparatus 90 can transfer the electronic component W from the electronic component rotating apparatus 140 to the stage 23a of the components conveyance part 23.

The first display panel reversing device 100 , the second display panel reversing device 110 , the first electronic component reversing device 120 , and the second electronic component reversing device 130 are, respectively, the display panel P or the electronic component. It is a reversing device which reverses the front and back of the component W. The first display panel inverting device 100 is installed to correspond to the relay station 42 of the display panel supply unit 40 , and the second display panel inverting device 110 includes a panel stage ( 22) corresponding to the delivery position K of the display panel P with respect to the second display panel transport device 70 . In addition, the first electronic component reversing device 120 is installed to correspond to the relay station 51 of the electronic component supply unit 50 , and the second electronic component reversing device 130 is to the electronic component rotating device 140 . installed correspondingly. Since these inverting devices 100, 110, 120, and 130 have a common configuration, only the configuration of the first display panel inverting device 100 will be described, and the configuration of the other inverting devices 110, 120, and 130 will be described. omit

The first display panel inverting device 100 includes a pair of left and right holding parts 101 and 101 for individually adsorbing and holding the display panel P, and the holding parts 101 and 101 about an axis along the Y direction. The rotation driving unit 102 and 102 for rotating, the lifting driving unit 103 for vertically moving the holding units 101 and 101 together with the rotation driving unit 102 and 102 , and the holding units 101 and 101 with the rotation driving unit 102 . , 102 ) and a Y-direction driving unit 104 for moving in the Y-direction together with the lifting driving unit 103 . The Y-direction drive unit 104 is configured to move the holding units 101 and 101 to a position on the relay platform 42 and a position to be evacuated on the relay station 42 .

When the display panel P supplied from the display panel supply unit 40 requires front and rear inversion, the first display panel inversion device 100 operates as follows.

First, the holding units 101 and 101 are moved to a position on the relay station 42 . At this position, the display panel P of 2 sheets conveyed by the conveyance part 43 is received from the upper surface of the holding|maintenance parts 101 and 101. As shown in FIG. After the display panel P is adsorbed and held by the holding units 101 and 101 , the holding units 101 and 101 are inverted front to back, that is, 180° inverted by the rotation driving units 102 , 102 . Accordingly, the display panel P is inverted. Thereafter, the holding units 101 and 101 are lowered by the lift driving unit 103 , and the display panel P is disposed on the relay stand 42 . Finally, the holding units 101 and 101 are evacuated on the relay stand 42 by the Y-direction driving unit 104 . For the above-described operation, the same is true for the other inverting devices 110 , 120 , 130 .

The electronic component rotating apparatus 140 is an apparatus which rotates the direction of the electronic component W conveyed from the bonding apparatus 10 to the pressure bonding apparatus 20 180 degrees within a horizontal plane. The electronic component rotating apparatus 140 also serves as a relay station for the electronic component W conveyed from the bonding apparatus 10 to the pressure bonding apparatus 20 . The electronic component rotating device 140 includes a mounting table 141 on which two electronic components W can be arranged side by side at a predetermined interval in the X direction, and the mounting table 141 is rotatable at an arbitrary angle in a horizontal plane. A non-rotating drive unit is provided. Accordingly, the electronic component rotating device 140 rotates the mounting table 141 on which the electronic component W is disposed by 180° when rotation in the direction of the electronic component W is required. can be rotated 180°.

The discharge part 150 is a relay part for conveying the display panel P (display panel P with electronic component W attached) which the main compression bonding has been completed to a post process. As described above, in the X direction, the discharge unit 150 is disposed adjacent to the main crimping device 30 on the opposite side to the crimping device 20 . The discharge unit 150 includes a mounting table 151 on which two display panels P can be arranged side by side at a predetermined interval in the X direction.

The control device 160 includes a bonding device 10 , a pressure bonding device 20 , a main compression bonding device 30 , a display panel supply unit 40 , an electronic component supply unit 50 , and a first display panel conveying device 60 . , second display panel conveying apparatus 70 , first electronic component conveying apparatus 80 , second electronic component conveying apparatus 90 , first display panel inverting apparatus 100 , second display panel inverting apparatus 110 . , the first electronic component reversing device 120 , the second electronic component reversing device 130 , and the electronic component rotating device 140 control each operation.

Next, the operation of the mounting apparatus 1 of the present embodiment will be described.

In addition, in this embodiment, the aspect in which the electronic component W is not mounted on the display panel P, ie, the aspect of FIG. 3(A) or (B) is mainly demonstrated. In addition, the following operations are executed based on the control of the control device 160 .

First, on the mounting table 41 of the display panel supply unit 40 , the two display panels P conveyed from the previous step are adsorbed and held by the conveying arm 43a of the conveying unit 43 , and the relay stand (42) is transferred to the phase. At this time, when inversion of the front and back of the display panel P is required, for example, the surface on which the electronic component W is mounted in the display panel P conveyed to the mounting table 41 faces downward, the display panel (P) is transferred to the relay station 42 after being inverted by the first display panel inverting device 100 .

When the display panel P is transmitted to the relay stand 42 , a process for improving adhesion with the anisotropic conductive film F is performed by the processing device 42a.

On the other hand, in the tray (T), the mounting portion mounted through the anisotropic conductive film (F) of the electronic component (W) is placed inside the mounting device (1), with the mounted side facing up, the electronic component (W) This is stored. In the electronic component supply unit 50 , the electronic components W accommodated in the tray T are taken out one by one by a transfer unit (not shown), and the two electronic components W are delivered to the relay unit 51 . At this time, when the front and back of the electronic component W is required, for example, the surface mounted on the display panel P of the electronic component W accommodated in the tray T faces downward, the electronic component W ) is transferred to the relay station 51 after being reversed by the first electronic component reversing device 120 .

When the electronic component W is transmitted to the relay stand 51, the processing apparatus 51a will perform the process of improving the adhesiveness with the anisotropic conductive film F.

Thereafter, the display panel P is transported from the relay station 42 by the first display panel transport device 60 , and the electronic component W is transferred to the relay station 51 by the first electronic part transport device 80 . However, when the anisotropic conductive film F is adhered to the display panel P and when the anisotropic conductive film F is adhered to the electronic component W, the following operations are selectively performed.

First, the case where the anisotropic conductive film F is adhered to the display panel P will be described. [FIG. 3(A)]

In this case, the first display panel transport device 60 transfers the display panel P on the relay stand 42 to the stages 11A and 11B of the bonding device 10 positioned at the position L indicated by the solid line in FIG. 1 . ), it is conveyed so that the mounting site to which the anisotropic conductive film F of the display panel P is adhered is located inside. In addition, since the relay stage 42 has two stages 11A and 11B for one, the first display panel transport device 60 transfers the display panels P two at a time to the two stages 11A and 11B. ) is controlled to alternately convey.

On the other hand, the 1st electronic component conveying apparatus 80 conveys the electronic component W on the relay stand 51 to the mounting table 141 of the electronic component rotating apparatus 140 through the bonding apparatus 10. controlled to do

Here, when the display panel P is conveyed and arranged on the stages 11A and 11B, the stages 11A and 11B are attached to the bonding device of the anisotropic conductive film F by the bonding unit 12 to the display panel P ) is moved so that the mounting part is located. In this state, the bonding unit 12 is moved onto each display panel P on the stages 11A and 11B by the X-direction driving unit 14 (refer to FIG. 3 ), and the respective display panels P are mounted. Controlled to adhere the anisotropic conductive film (F) to the site. When the adhesion of the anisotropic conductive film F is completed, the stages 11A and 11B are positioned at a position L for transferring the display panel P between the first display panel transport device 60 and the first display panel transport device 60, indicated by a solid line in FIG. 1 . is moved to

Thereafter, the display panel P on the stages 11A and 11B is transferred to the panel stage 22 of the press bonding apparatus 20 positioned at the position G indicated by the solid line in FIG. 1 by the first display panel conveying apparatus 60 . ) is returned to

On the other hand, the electronic component W conveyed to the mounting table 141 is rotated 180 degrees in the horizontal direction by the electronic component rotating device 140 . That is, in the electronic component W conveyed to the mounting table 141 , the portion to be mounted through the anisotropic conductive film F becomes the inside of the mounting device 1 , and the mounted portion is located inside the mounting device 1 . In order to set it as the front side (display panel side), it is rotated 180 degrees. In addition, when the electronic component W is accommodated in the tray T with the part mounted through the anisotropic conductive film F of the electronic component W in front of the mounting device 1, the electronic component The rotating device 140 does nothing. Then, the electronic component W on the mounting table 141 is conveyed by the 2nd electronic component conveyance apparatus 90 to the stage 23a of the components conveyance part 23 in the pressure bonding apparatus 20. .

Next, the case where the anisotropic conductive film F is adhered to the electronic component W will be described. [FIG. 3(B)]

In this case, the first display panel conveying device 60 passes the display panel P on the relay stand 42 through the bonding device 10 and is a pressure bonding device positioned at a position G indicated by a solid line in FIG. 1 . Controlled to be conveyed to the panel stage 22 of (20). On the other hand, the 1st electronic component conveyance apparatus 80 transfers the electronic component W on the relay stand 51 to the stage 11A, 11B of the bonding apparatus 10 located at the position M shown by the dotted line in FIG. Controlled to be conveyed onto the phase.

Here, the operation performed by the bonding apparatus 10 and the operation performed by the electronic component rotating apparatus 140 are the same as in the case of bonding the anisotropic conductive film F to the display panel P. Although description is abbreviate|omitted, in the mounting apparatus in embodiment of this invention, the anisotropic conductive film F adhere|attached to the electronic component W, and the anisotropic conductive film F adhere|attached to the display panel P have the same precision. A portion to which the anisotropic conductive film F of the electronic component W is adhered is positioned and disposed inside the stages 11A and 11B of the bonding device 10 so as to be adhered to each other.

When the adhesion of the anisotropic conductive film F to the electronic component W is completed, the electronic component W is placed on the mounting table 141 of the electronic component rotating device 140 by the first electronic component conveying device 80 . is conveyed, and the direction in the horizontal direction is rotated by 180° by the electronic component rotating device 140 as described above. Then, the electronic component W on the mounting table 141 is conveyed by the 2nd electronic component conveyance apparatus 90 to the stage 23a of the components conveyance part 23 in the pressure bonding apparatus 20. do.

When the display panel P is conveyed to the panel stage 22 (position G) of the pressure bonding apparatus 20 and the electronic component W is conveyed to the stage 23a of the components conveyance part 23, a pressure bonding apparatus Compression bonding according to (20) is performed. First, the stage 23a of the components conveying unit 23 is moved under the pressure bonding head 21 , and the electronic component W on the stage 23a is located below the pressure bonding head 21 . In this state, the pressure bonding head 21 is lowered, and the electronic component W on the stage 23a is adsorbed and held by the pressure bonding head 21 . The pressure bonding head 21 is raised after adsorbing and holding the electronic component W. Then, after the stage 23a is evacuated to the position shown by the solid line in FIG. 1, the panel stage 22 is moved to the press-bonding position H shown by the dotted line in FIG. In this pressure bonding position H, the display panel P and the electronic component W are pressure-bonded through the anisotropic conductive film F by the pressure bonding head 21 . When the pressure bonding is completed, the pressure bonding head 21 is lifted by releasing the suction holding of the electronic component (W). The panel stage 22 is moved to the replacement position K, indicated by the dotted line in FIG. 1 .

When the panel stage 22 is moved to the delivery position K, the display panel P is transferred to the stage of the delivery position N shown by the solid line in FIG. 1 of the main crimping apparatus 30 by the second display panel carrying device 70 . It is returned to (32A, 32B). In addition, since the panel stage 22 is one, but the stages 32A and 32B are two, the second display panel transport device 70 carries the display panels P two at a time, two stages 11A and 11B. ) is controlled to alternately convey.

Here, when the display panel P on which the pressure bonding has been completed needs to be inverted before the main pressure bonding is performed, the display panel P on the panel stage 22 positioned at the delivery position is provided with a second display panel reversing device ( 110) is reversed. In this case, the display panel P is conveyed by the second display panel conveying apparatus 70 from the second display panel inverting apparatus 110 .

When the display panel P is conveyed to the stages 32A and 32B, the main crimping apparatus 30 performs the main crimping. That is, the stages 32A and 32B are moved to the main crimping position Q indicated by the dotted line in FIG. 1 , and the mounting portion of the display panel P is positioned on a backup tool (not shown) of the main crimping head unit 31 . Then, the main compression bonding is performed by the main compression bonding head 31a by a predetermined time, predetermined temperature, and a pressing force. When the main compression bonding is completed, the stages 32A and 32B move to a position N of transfer with the second display panel conveying device 70 , which is indicated by a solid line in FIG. 1 .

When the stages 32A and 32B are moved to the delivery position N, the display panel P on the stages 32A and 32B is transferred to the mounting table 151 of the discharge unit 150 by the second display panel conveying device 70 . ) and provided to the post-process.

By repeating this operation|movement, the mounting of the electronic component W with respect to the some display panel P is performed.

According to the mounting apparatus 1 of this embodiment mentioned above, the 1st display panel conveying apparatus 60 which selectively conveys the display panel P to the adhesion|attachment apparatus 10 and the pressure bonding apparatus 20, and an electronic component The 1st electronic component conveyance apparatus 80 which selectively conveys (W) to the adhesion|attachment apparatus 10 and the pressure bonding apparatus 20 is provided.

Therefore, in mounting the electronic component W through the anisotropic conductive film F on the display panel P, when the anisotropic conductive film F is adhered to the display panel P, the electronic component W In the case of adhesion to the , it becomes possible to respond flexibly to all. Moreover, the 1st display panel conveying apparatus 60 and the 1st electronic component conveying apparatus 80 are comprised so that the display panel P and the electronic component W may be conveyed to the common bonding apparatus 10, and display Since it is not necessary to provide the dedicated bonding apparatus 10 for each of the panel P and the electronic component W, it can suppress that the mounting apparatus 1 enlarges and becomes complicated.

Moreover, when the control apparatus 160 adhere|attaches the anisotropic conductive film F to the display panel P, it conveys the display panel P to the bonding apparatus 10, and anisotropic conductive by the bonding apparatus 10. The first display panel conveying apparatus 60 is controlled so as to convey the display panel P to which the film F is adhered to the pressure bonding apparatus 10 , and the electronic component W is transferred to the bonding apparatus 10 . The first electronic component conveying apparatus 80 is controlled so as to be conveyed to the pressure bonding apparatus 20 without passing through, and when the anisotropic conductive film F is adhered to the electronic component W, the electronic component W is attached to the bonding apparatus ( 10) and controlling the first electronic component conveying apparatus 80 to convey the electronic component W to which the anisotropic conductive film F is adhered by the bonding apparatus 10 to the pressure bonding apparatus 20; In addition, it was made to control the 1st display panel conveying apparatus 60 so that the display panel P may be conveyed to the pressure bonding apparatus 20 without passing through the bonding apparatus 10.

Accordingly, even when the anisotropic conductive film F is adhered to either of the display panel P and the electronic component W, it is possible to easily cope with the case.

In addition, a second electronic component reversing device 130 for inverting the electronic component W conveyed from the bonding device 10 to the pressure bonding device 20 is provided, and the anisotropic conductive film ( The electronic component (W) to which F) was adhered was reversed back and forth to be conveyed to the press bonding device (20).

Accordingly, even when pressure bonding is performed with the electronic component W facing down with respect to the display panel P, the electronic component W is used using the bonding device 10 in common with the display panel P. It becomes possible to adhere|attach the anisotropic conductive film F to ), and also by this, the enlargement and complexity of the mounting apparatus 1 can be suppressed.

In addition, an electronic component rotating device 140 that rotates the direction of the electronic component W conveyed to the pressure bonding apparatus 20 in a horizontal plane is installed to the electronic component W conveyed by the pressure bonding apparatus 20 . The mounting site|part with the display panel P in in was made to face the display panel P side conveyed by the pressure bonding apparatus 20.

Thereby, the mounting site|part of the electronic component W accommodated in the tray T with the display panel P in the electronic component W conveyed to the pressure bonding apparatus 20 is the pressure bonding apparatus 20 ), it becomes possible to align in the direction required for pressure bonding even if it is a state which is not in the display panel P side conveyed. For this reason, it becomes possible to adhere|attach the anisotropic conductive film F to the electronic component W using the bonding apparatus 10 common with the display panel P, and this also increases the size of the mounting apparatus 1 and It is possible to mount flexible electronic components while suppressing complexity.

In addition, the bonding apparatus 10, the pressure bonding apparatus 20, and the main pressure bonding apparatus 30 are arranged in a line, and one side (front side) of the direction (orthogonal) intersecting (orthogonal) to this arrangement direction (X direction) ), the first display panel transporting device 60 and the second display panel transporting device 70 are disposed, and the first electronic component transporting device 80 and the second electronic parts transporting device ( 90) was placed.

By comprising in this way, it becomes possible to isolate|separate the conveyance path|route of the display panel P conveyed by the common bonding apparatus 10, and the conveyance path|route of the electronic component W, without intersecting. For this reason, the structure of the conveyance path|route of the display panel P and the conveyance path|route of the electronic component W can be simplified, and also by this, enlargement and suppression of complexity of the mounting apparatus 1 can be aimed at.

In addition, the stages 11A and 11B of the bonding apparatus 10 were configured to be movable between the first display panel conveying apparatus 60 and the first electronic component conveying apparatus 80 by the Y-direction driving unit 11a.

By configuring in this way, even if the conveyance direction of the display panel P and the electronic component W by the 1st display panel conveying apparatus 60 and the 1st electronic component conveying apparatus 80 is only one direction (X direction), It becomes possible to convey the display panel P and the electronic component W with respect to the common bonding apparatus 10, and suppression of the enlargement and complexity of the mounting apparatus 1 can be aimed also by this.

The adhesiveness of the anisotropic conductive film F is improved to the site|part to which the anisotropic conductive film F in the display panel P conveyed by the 1st display panel conveying apparatus 60 is adhere|attached to the bonding apparatus 10. At the site to which the anisotropic conductive film F in the electronic component W conveyed to the bonding apparatus 10 by the processing apparatus 42a which performs the process to be made, and the 1st electronic component conveyance apparatus 80 is adhere|attached , a treatment device 51a for performing a treatment for improving the adhesion of the anisotropic conductive film is provided. In addition, the processing apparatuses 42a and 51a are configured to include a rotating brush for rubbing a portion to which the anisotropic conductive film F in the display panel P and the electronic component W is adhered, or a plasma irradiation unit for irradiating plasma. was done with

Thereby, it becomes possible to roughen and clean the site|part to which the anisotropic conductive film F in the display panel P or the electronic component W is adhere|attached, and the adhesiveness of the anisotropic conductive film F improves. This makes it possible to perform reliable mounting.

As mentioned above, although embodiment of this invention was described, this embodiment is shown as an example, and limiting the scope of the invention is not intended. These novel embodiments described above can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments are included in the invention described in the claims while being included in the scope and summary of the invention.

In the description of the embodiment of the present invention, the first electronic component conveying device 80 transfers the electronic component W from the relay station 51 to the stages 11A and 11B of the bonding apparatus 10, the relay station ( 51 ) to the mounting table 141 of the electronic component rotating device 140 , and from the stages 11A and 11B to the mounting table 141 , and by the second electronic component conveying device 90 , the electronic component W is transferred from the mounting table 141 to the stage 23a of the components conveying unit 23, the first electronic component conveying device 80 also transfers by the second electronic component conveying device 90, also good

In the former described above, the electronic component W is transferred from the electronic component rotating device 140 to the stage while the electronic component W is transferred from the relay stand 51 to the stages 11A and 11B. Since it can transfer to (23a), the mounting efficiency of the electronic component W can be improved. In the latter, since the 2nd electronic component conveyance apparatus 90 can be abbreviate|omitted, cost saving and size saving are expectable.

In addition, although the aspect in which the electronic component W is not mounted on the display panel P, that is, the aspect of FIG. 3(A) or (B), has been mainly described, another aspect, that is, FIG. 3(C) It goes without saying that the aspect of -(F) is also applicable.

Also in these cases, at the time of the direction of the front and back of the display panel P conveyed from a previous process, the direction of the front and back of the electronic component W accommodated in the tray T, and the time of main crimping by the main crimping|compression-bonding apparatus 30 According to the direction of the front and back of the display panel P, the first display panel inverting device 100 , the second display panel inverting device 110 , the first electronic component inverting device 120 , and the second electronic component inverting device selectively Front and back inversion of the display panel P or the electronic component W may be performed using an inversion device such as 130 .

Further, in the above embodiment, the processing device 42a of the display panel P is provided with a rotating brush, and the processing device 51a of the electronic component W is provided with a plasma irradiation unit, but the present invention is not limited thereto. Instead, the processing apparatus 42a may be provided with a plasma irradiation unit, and the processing apparatus 51a may be provided with a rotating brush, or both processing apparatuses 42a and 51a may be provided with a rotating brush and a plasma irradiation unit. The point is, if a process for improving the adhesion of the anisotropic conductive film F can be performed on the portion to which the anisotropic conductive film F is adhered in the display panel P or the electronic component W, the configuration is not limited.

1: mounting device 10: adhesive device
11A, 11B: Stage 11a: Y-direction drive unit
12: adhesive unit 20: pressure bonding device
21: pressure bonding head 22: panel stage
23: parts transfer unit 30: main crimping device
31: main crimping head unit 32A, 32B: stage
40: display panel supply unit 50: electronic component supply unit
60: first display panel transport device 70: second display panel transport device
80: first electronic component conveying device 90: second electronic component conveying device
100: first display panel inverting device 110: second display panel inverting device
120: first electronic component reversing device 130: second electronic component reversing device
140: electronic component rotating device 150: discharge unit
160: control unit P: display panel
W: Electronic component F: Anisotropic conductive film
T: tray

Claims (9)

An electronic component mounting device for mounting electronic components on a display panel through an anisotropic conductive film, comprising:
an adhesive device for adhering the anisotropic conductive film to the display panel or the electronic component;
A pressure bonding device for press-bonding the display panel or the electronic component to which the anisotropic conductive film is adhered by the bonding device and the side to which the anisotropic conductive film is not adhered among the display panel and the electronic component through the anisotropic conductive film Wow,
a main crimping device for main crimping the display panel and the electronic component press-bonded by the crimping device;
a first display panel transport device for selectively transporting the display panel to the bonding device and the pressure bonding device;
a first electronic component conveying device for selectively conveying the electronic component to the bonding device and the pressure bonding device;
A control device for controlling the first display panel transport device and the first electronic component transport device
to provide
The control device is
When the anisotropic conductive film is adhered to the display panel, the first display panel is transported to the bonding device, and the display panel to which the anisotropic conductive film is adhered by the bonding device is transported to the pressure bonding device. controlling the display panel conveying apparatus and controlling the first electronic component conveying apparatus to convey the electronic component to the pressure bonding apparatus without passing through the bonding apparatus;
When adhering the anisotropic conductive film to the electronic component, the first electronic component is conveyed to the bonding device, and the electronic component to which the anisotropic conductive film is adhered by the bonding device is conveyed to the pressure bonding device. An electronic component mounting apparatus characterized by controlling the electronic component conveying apparatus and controlling the first display panel conveying apparatus so that the display panel is conveyed to the pressure bonding apparatus without passing through the bonding apparatus. The method according to claim 1, wherein the bonding device, the pressure bonding device, and the main compression bonding device are arranged in a line,
the first display panel transport device is disposed on one side intersecting the arrangement directions of the bonding device, the pressure bonding device and the main compression bonding device with respect to the bonding device;
The electronic component mounting apparatus according to claim 1, wherein the first electronic component transport device is disposed on the other side intersecting the arrangement direction with respect to the bonding device. An electronic component mounting device for mounting electronic components on a display panel through an anisotropic conductive film, comprising:
an adhesive device for adhering the anisotropic conductive film to the display panel or the electronic component;
A pressure bonding device for press-bonding the display panel or the electronic component to which the anisotropic conductive film is adhered by the bonding device and the side to which the anisotropic conductive film is not adhered among the display panel and the electronic component through the anisotropic conductive film Wow,
a main crimping device for main crimping the display panel and the electronic component press-bonded by the crimping device;
a first display panel transport device for selectively transporting the display panel to the bonding device and the pressure bonding device;
A first electronic component conveying device for selectively conveying the electronic component to the bonding device and the pressure bonding device
to provide
The bonding device, the pressure bonding device, and the main compression bonding device are arranged in a line,
the first display panel transport device is disposed on one side intersecting the arrangement directions of the bonding device, the pressure bonding device and the main compression bonding device with respect to the bonding device;
the first electronic component transport device is disposed on the other side intersecting the arrangement direction with respect to the bonding device;
The bonding device includes a stage supporting the display panel or the electronic component to which the anisotropic conductive film is adhered,
wherein the stage is movably installed in a direction intersecting the arrangement direction so as to transfer the display panel or the electronic component between the first display panel conveying apparatus and the first electronic component conveying apparatus A device for mounting electronic components. 4. The method according to any one of claims 1 to 3,
180° front and back of the display panel or the electronic component reversing device, reversing
An electronic component mounting apparatus comprising a. 4. The method according to any one of claims 1 to 3,
The electronic component mounting apparatus characterized by providing the electronic component rotating apparatus which rotates the direction of the said electronic component conveyed to the said pressure bonding apparatus in a horizontal plane. 4. The method according to any one of claims 1 to 3,
The electrons conveyed to the bonding device by the first electronic component conveying device to a portion where the anisotropic conductive film is adhered on the display panel conveyed by the first display panel conveying device to the bonding device, or by the first electronic component conveying device to the bonding device. The processing apparatus which performs the process which improves the adhesiveness of the said anisotropic conductive film to the site|part to which the said anisotropic conductive film in a component is adhere|attached
An electronic component mounting apparatus comprising a. 7. The method of claim 6,
The processing device is
a rotating brush that is in sliding contact with the part;
a driving unit that rotates the brush
An electronic component mounting apparatus comprising a. delete delete

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