TWI607293B - Method for transferring printed wiring board to be exposed and transfer device - Google Patents

Description

Transfer method and transfer device of printed wiring board to be exposed

The present invention relates to a transfer wiring board which is required to be subjected to exposure processing in various processes of a printed wiring board, while being transferred to the exposure apparatus side by a transfer machine, and returning the exposed printed wiring board to the original position. Method and transfer device.

The printed wiring board on which the electronic components are mounted is manufactured through various processing steps. However, even if only the exposure step is focused, it is necessary to perform the injection into the exposure machine, the positioning of the printed wiring board in the exposure machine, exposure, and exposure. The discharge of the printed wiring board, and optionally the maintenance steps of the machine constituting each of these steps, must also be performed. On the other hand, even if the printed wiring board is used alone, the size or shape thereof is various, and if it is desired to perform exposure in accordance with these, it is necessary to increase the entire apparatus constituting the step. In other words, when it is necessary to expose both sides of the printed wiring board or the exposure of the printed wiring board body to be changed in various manners, it is necessary to prepare a transport path in response to this.

In general, the transport (input or discharge) device that is also used in the above-described exposure step has been proposed by the applicant to date, but mainly uses a roller conveyor that uses a plurality of rollers that are driven synchronously. The reason for this is that the printed wiring board in the middle of the process, not to mention the occurrence of scratches, and the adhesion of dust must be avoided as much as possible. Therefore, it is preferable to carry it in a "point contact state" on a plurality of rollers that are rotating. On the other hand, since the roller is rotated, it takes a certain time to carry out the conveyance of the printed wiring board.

On the other hand, since the exposure process itself is performed by irradiating the light-resistant solder on the printed wiring board with light of the reaction image data, the processing is terminated at a time much shorter than the time required for the transfer. In other words, in the exposure step, the actual situation is that the time taken for the printed wiring board to put in and discharge the material to the exposure machine is much higher than the time required for the exposure.

Therefore, in the various operations of such a printed wiring board, Patent Document 1 proposes a "substrate operation system, which is required to be small, has excellent convenience, and is versatile, and is obtained. An invention that satisfies the problem of at least several of the requirements of the substrate operation system.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-135114

The invention proposed in Patent Document 1 relates to an assembly of an electronic circuit, that is, an operator who mounts a circuit component such as an electronic component on a circuit board such as a printed wiring board, but the package operation includes "a plurality of types" For example, a solder printing operation for printing a cream solder on a circuit board, an adhesive coating operation for applying a bonding agent to a circuit board, a circuit component mounting operation for mounting a circuit component on a circuit board, and a circuit substrate on which a circuit component is mounted by heating A welding operation for welding, an inspection operation for inspecting at least one of the operations of the respective operations, and the like, and a general circuit component assembly line is included in the substrate working machine for performing the pair of circuit substrates. Solder printing machine, adhesive coating machine, component mounting machine, reflow furnace, The description is made by the inspection machine or the like (paragraph 0002 of Patent Document 1).

In addition, the invention of the patent document 1 is based on the fact that in the conventional construction line, the work machine is disposed at intervals, and is configured such that the work machine is adjusted to the convenience of adjustment and maintenance of each work machine. Each of the working machines is connected by a conveyor or the like. This type of manufacturing line has a limit in improving the space efficiency, and it is desired to have a small-sized substrate working system. Further, in the above-described configuration line, When it is necessary to change the production line, since it is necessary to move the one-to-one substrate working machine one by one, it is expected to be small from the viewpoint of the production line change, and it is expected to be a kind of rapid production line. The convenience of the change operation or the versatility of the substrate operation system which can expand the range of the configuration of the production line. Further, as described above, the substrate operation system is also expected to have excellent convenience in adjustment and maintenance. (Paragraph 0003 of Patent Document 1) is a "substrate operating system for performing a predetermined circuit board operation on a circuit board constituting an electronic circuit for supporting circuit components," The invention relates to a plurality of pairs of substrate working devices for performing a predetermined operation on a circuit substrate on at least a part of a circuit board located in a working area of the self, and at least one of the plurality of pair of substrate working devices is capable of extending along A movable device for moving the device track in the direction in which the transfer direction of the circuit board intersects (paragraph 0005 of Patent Document 1).

As a result of the above, the invention described in Patent Document 1 can be used as the means for the work such as adjustment as described in the paragraph 0007 of the patent document, as long as it can be detached from the arrangement of the device. The effect of moving, the convenience of its system is improved.

However, if the technique proposed in Patent Document 1 is applied to the above-mentioned "exposure step", if only "the device that is the object of the adjustment or the like can be moved away from the device arrangement", the following cannot be satisfied. Requirements.

(1) It is possible to supply (input) a printed wiring board efficiently and efficiently to one exposure machine, and to perform exposure far below this time in a transfer time of a printed wiring board that takes a long time.

(2) The unexposed printed wiring board is allowed to stand until it can be exposed without being attached to scratches or dust.

(3) The above (1) and (2) can be further developed in the case where the exposure machine has a plurality of stages or when it is necessary to expose both sides of the printed wiring board.

(4) As a transfer device for the exposure machine, all the requirements of small size, excellent convenience, and variability can be achieved.

Therefore, the inventors of the present invention have finally completed the present invention on how to carry out various studies on how the transfer of the exposure board to the exposure machine can achieve the above requirements (1) to (4).

That is, an object of the present invention is to provide a standby structure for an unexposed printed wiring board, an input to an exposure machine, and an exposure completion printing, without changing the overall configuration even if the size and shape of the printed wiring board are changed. Transfer method and transfer device for discharge of wiring board.

In order to solve the above-described problems, the first embodiment of the present invention is described with reference to the symbols used in the description of the embodiments to be described later, that is, "a method of transferring a printed wiring board to be exposed, which is to be exposed. The plurality of printed wiring boards are sequentially transferred to the exposure stage 210 of the exposure machine 200, and the first printing printed wiring board that is received by the suction head 20 is sucked by the adsorption head 31 and lifted. The adsorption head 31 is moved to the exposure stage 210 while being held or rotated, and is removed. When the surface of the exposure stage 210 is exposed, the adsorption head 31 is returned to the receiving conveyance path 20, and The second printed wiring board received here is lifted and rotated, and the second printed wiring board is transferred to the exposure stage 210 side by the adsorption head 31, and the first exposure is completed by the adsorption head 31. After the sheet printed wiring board is lifted up, the adsorption head 31 is rotated and moved downward, whereby the second printed wiring board is removed to the exposure stage 210, and the adsorption head 31 that sucks the first printed wiring board is returned. When the third printed wiring board is lifted up and rotated, and the exposed first printed wiring board is removed to the receiving conveyance path 20, the first printed wiring board is removed. After the first printed wiring board is fed to the next region of the transport path 20, the third printed wiring board is driven by the adsorption head 31 to drive the second printed wiring board after the exposure is completed. Removed onto the exposure stage 210, by repeating the above actions, continuously Lighthouse printed wiring board 210 of the transfer of the printed wiring board and the discharge exposure is completed. "

According to the transfer method of the first aspect of the invention, it is possible to efficiently transfer the printed wiring board coated with or attached with the solder resist to the exposure stage 210 of the exposure machine 200, and efficiently use the transfer or discharge of the printed wiring board. The exposure of the exposure machine 200 to the printed wiring board is efficiently performed at the time and time. Further, the exposure machine 200 pulls the exposure stage 210 therein to perform exposure processing on the printing wiring board on the exposure stage 210.

The transfer method of the first invention is specifically implemented by the transfer device 100 according to the fourth invention, the fifth invention, and the embodiment to be described later, but has the following (A) to (C) The three basic ideas.

(A) The movement of the printed wiring board between the transfer path 20 and the exposure stage 210 is performed by a linear reciprocating movement of the adsorption head 31 constituting the rotary transfer machine 30.

(B) The adsorption head 31 can carry or carry a piggy-back and then transfer the printed wiring board with both the front load and the back load.

(C) The conveyance path 20 is received, and when the reciprocating head 31 is moved back and forth, the exposure of the printed wiring board is performed, and the next printed wiring board is received or standbyd.

The transfer method of the first invention is realized by the transfer device 100 shown in FIGS. 1 to 8 , 15 , and 16 as will be described later, but before the transfer method is described, reference is made to 1 to 3 showing an embodiment show an external production line of the transfer device 100.

As shown in FIG. 1, the transfer device 100 has an exposure stage 210 for performing an actual exposure operation on the left side of the exposure machine 200 disposed on the right side of the figure. The exposure stage 210 is provided with a receiving printing on the left side of the maintenance area 60. The wiring board or the transport path 20 that carries it out is taken. On the upper side of the transport path 20, a rotary transfer machine 30, also shown in FIG. 2, is provided, and the adsorption head 31 constituting the rotary transfer machine 30 can be transported between the exposure stage 210 and the receiving transport path 20. The rail 33 moves between the exposure stage 210 and the receiving conveyance path 20.

The adsorption head 31 is also shown in FIG. 2, and can be rotated up and down with respect to the transport rail 33 by the rotary elevator 32, and can be rotated by itself. As shown in FIG. 12, which is a schematic view from the right side of the diagram of FIG. A plurality of adsorption pads 34. Of course, each of the adsorption pads 34 performs adsorption of the printed wiring board by, for example, a negative pressure, and whether or not any of the adsorption pads 34 is subjected to a negative pressure is determined based on the size of the printed wiring board.

Next, in order to transfer the printed wiring board to the exposure stage 210 by the transfer device 100 having the above external production line, according to the transfer method of claim 1, the adsorption head 31 is first used. The first printed wiring board received on the transport path 20 is sucked and lifted, and the adsorption head 31 is held in its state or rotatably transferred and detached to the exposure stage 210.

The operation during this period will be specifically described using FIG. 9, FIG. 11, and FIG. 13 of the schematic diagram as follows. Up to this point, as shown in FIGS. 9(a) and 9(b), the first printed wiring board is sucked by the adsorption head 31 and lifted up, by holding the adsorption head 31 in its state (without rotation) or By rotating it, as shown in FIGS. 9(b) and 13(b), the printed wiring board is transferred to the exposure stage 210.

In this case, if the printed wiring board is the first sheet, since the wiring board is not printed on the exposure stage 210, the adsorption head 31 is printed in the non-rotating state of FIGS. 11(a), (b), and (c). The state of the board is previously transferred to the exposure stage 210. After the second printed wiring board, if there is no printed wiring board in the exposure stage 210, the adsorption head 31 rotates as indicated by the arrow in Fig. 11(c), and the printed wiring board in the front load is as shown in Fig. 11 ( d) The back load is shown and the third printed wiring board is preloaded.

That is, the reason why the adsorption head 31 is maintained in its state, that is, the state in which the printed wiring board is previously loaded, is transferred to the exposure stage 210, because it is assumed that the exposure stage 210 does not have a printed wiring board, and Therefore, when the adsorption head 31 is rotated, that is, the printed wiring board in the front load is changed to the back load and transferred to the exposure stage 210, it is assumed that the exposure stage 210 has a printed wiring board. Of course, the difference in these actions is controlled by the signal from the detector, which is disposed on the adsorption head 31 itself, the exposure stage 210, and the receiving conveyance path 20 to detect the presence of the printed wiring board.

Then, in the first printed wiring board, the exposure head 31 is returned to the receiving conveyance path 20 while the surface of the exposure stage 210 is being exposed, and the second printed wiring board received here is lifted up. And rotating the adsorption head 31, that is, the printed wiring board is back-loaded as shown in the figure. The state shown in 11(d). Then, the second printed wiring board is transferred to the exposure stage 210 side by the adsorption head 31, and the first printing wiring is completed by the adsorption head 31, that is, the front-load exposure is completed. board. Thereafter, the adsorption head 31 is rotated, and the second printed wiring board in the back load is changed to the front load state and moved downward, whereby the second printed wiring board in the front load state is removed to the exposure. On the platform 210.

Here, the adsorption head 31 that is adsorbed, that is, the back-loaded first printed wiring board, is returned to the receiving conveyance path 20 that receives the third printed wiring board, and the third printed wiring board is lifted up, that is, The front load is illustrated in Fig. 14(a). Next, the adsorption head 31 is rotated, and the first printed wiring board in which the exposure is completed and in the back-load state is changed to the front load state, and then the image is removed to the receiving conveyance path 20.

The first printed wiring board that has been removed to the receiving transport path 20 is sent to the next area by the receiving transport path 20 as illustrated in FIG. 14(b). During this period, the adsorption of the adsorption head 31 is performed to perform the adsorption of the second printed wiring board on which the exposure of the exposure stage 210 is completed, that is, the load is changed to the back state after the front load, and the foregoing The three printed wiring boards are changed to the front load state and then removed to the exposure stage 210.

By repeating the above operation, the discharge of the printed wiring board in which the plurality of printed wiring boards are transferred to the exposure stage 210 and the exposure is completed can be continuously and continuously reduced.

Therefore, in the transfer method of the request item 1, even if the size and shape of the printed wiring board are changed, it is not necessary to change the overall configuration, and the standby of the unexposed printed wiring board, the input to the exposure machine, and the exposure can be efficiently performed. The discharge of the printed wiring board is completed.

More specifically, according to the transfer method of the first aspect of the invention, while the previous printed wiring board is placed or exposed to the exposure machine 200, the back of the printed wiring board is selected by the adsorption head 31 or The front loading is carried out while the printing head is moved by the adsorption head 31 Since the exposure stage 210 is prepared for transfer, (1) it is possible to efficiently and efficiently supply (inject) the printed wiring board to one exposure machine, and to perform the transfer time of the printed wiring board for a long time. At this time, since the transfer is performed after the backing or transfer of the printed wiring board by the adsorption head 31, (2) the unexposed printed wiring board can be attached without scratches or dust. In the case of standby until it can be exposed.

In order to solve the problem, the method of the transfer method according to the second aspect of the present invention is directed to the transfer method of the first aspect of the invention, wherein the reversing machine 40 is disposed in the next region of the transport path 20 Further, the second receiving conveyance path 20, the adsorption head 31, and the exposure machine 200 are disposed in the next region of the reversing machine 40, and the reversing machine 40 reverses the printed wiring board whose surface has been exposed, and the back surface is the upper side. Thereafter, the second receiving transport path 20 and the adsorption head 31 are transferred to the exposure stage 210" of the second exposure machine 200.

The transfer method according to the second aspect of the present invention is specifically realized by the transfer device 100 shown in FIG. 16, but the transfer device 100 is configured such that the reversing machine 40 is disposed next to the transfer transport path 20. In the region, the second receiving transport path 20, the adsorption head 31, and the exposure machine 200 are disposed in the next region of the reversing machine 40.

Next, the transfer method of the second invention is a printed wiring board in which the surface (1st side) has been exposed by the reversing machine 40 (for example, the first printed wiring board described in the above-described transfer method of the first invention) The back side (2nd side) of the printed wiring board which has not been exposed is turned upside down, and is sent to the second receiving conveyance path 20.

Next, the printed wiring board fed to the second receiving transport path 20 is transferred to the exposure stage 210 of the second exposure machine 200 by the adsorption head 31 (second) and exposed. Thereafter, the printed wiring board is returned to the second receiving conveyance path 20, and is sent out to the next area from there.

Therefore, the transfer method of the second invention can effectively utilize the second exposure machine 200 in addition to the functions similar to those of the transfer method of the first invention.

More specifically, in the transfer method of the second aspect of the invention, since the second exposure machine 200 prepared is effectively utilized, and exposure of both the front and back sides of the printed wiring board can be performed in a short time, (1) An effective and efficient supply (input) of a printed wiring board to an exposure machine while performing an exposure that is much lower than the time during which the printed wiring board takes a long time - (2) will not be exposed The printed wiring board can stand by until it can be exposed without the presence of scratches or dust. (3) The above (1) can be further developed in the case where there are a plurality of exposure machines or when both sides of the printed wiring board must be exposed. (2).

In order to solve the above problems, the method of the transfer method according to the third aspect of the invention is directed to the transfer method of the first aspect of the invention, which is the following: "The reversing machine disposed in the next region of the receiving transport path 20 40. After receiving and reversing the printed wiring board on the surface of the transport path 20, the printed wiring board having the back side of the upper side is returned to the receiving transport path 20, and the printing is performed by the adsorption head 31. The back side of the wiring board is transferred to the exposure stage 210 for performing Exposure of the back side of the printed wiring board.

In the transfer method of the third invention, the reversing machine 40 described in the second aspect of the invention is used. However, in the second invention, the second exposure machine 200, the receiving conveyance path 20, and the rotation are necessary. The rotary transfer machine 30 of the elevator 32 is not required. Instead, the reversing machine 40 here must function to return the reversed printed wiring board to the receiving conveyance path 20 again, thereby feeding the printed wiring board whose surface has been exposed to the exposure stage 210, and performing the printing. Exposure of the back of the wiring board.

Therefore, in the transfer method of the third aspect of the invention, the printed wiring board on which the surface of the transport path 20 has been exposed is received by the reversing machine 40, and the printed wiring board having the back side is returned to the upper side. Undertake the transport road 20. Next, the back surface of the printed wiring board is adsorbed by the adsorption head 31 and transferred to the exposure stage 210, whereby the back surface of the printed wiring board is exposed.

Therefore, in addition to the same function as the transfer method of the first invention, the transfer method of the third invention can perform exposure of both the front and back sides of the printed wiring board by one exposure machine 200.

Further, in order to solve the above problems, the means for transferring the fourth invention is: "A transfer device 100 for a printed wiring board to be exposed, which sequentially transfers a plurality of printed wiring boards to be exposed to an exposure machine. An exposure stage 210 of 200, comprising: a transfer path 20, the printed wiring board is received in a horizontal state, and the second area is also carried out; and the rotary transfer machine 30 is provided with the adsorption head 31. The adsorption head 31 is suspended from a conveyance rail 33 that extends from the receiving conveyance path 20 to the exposure stage 210, and is rotated and raised by the rotary elevator 32 to perform adsorption and release of the printed wiring board.

According to the fourth aspect of the invention, the transfer device 100 can be embodied in the transfer method of the first invention and the third invention described above. The transfer device 100 is provided in the drawing as shown in FIG. The left side of the exposure stage 210 on the left side of the exposure machine 200 shown on the right side is provided on the left side of the exposure stage 210, and the transport wiring board 20 is placed to receive the printed wiring board or the transport path 20 which is carried out. The rotary transfer machine 30, which is also shown in FIG. 2, is disposed on the upper side of the transport path 20, and the adsorption head 31 constituting the rotary transfer machine 30 can pass through the transfer rail provided between the exposure stage 210 and the receiving transport path 20. 33 moves between the exposure stage 210 and the receiving conveyance path 20.

The adsorption head 31 constituting the rotary transfer machine 30 is also shown in Fig. 2, and can be moved up and down with respect to the transfer rail 33 constituting the rotary transfer machine 30 by the rotary elevator 32, and can also be rotated by itself. 2(a) to (c) are schematic views showing the schematic view when viewed from the right, and the cross section is a polygonal shape, that is, a so-called box type. Further, as shown in Figs. 12(a) to 12(c), the adsorption head 31 projects the adsorption portions of the plurality of adsorption pads 34 by the same amount on the side surface of the tank, and the respective front ends of the adsorption portions constitute and constitute the adsorption head 31. The sides are parallel.

Therefore, the front end of the adsorption portion of each adsorption pad 34 has four faces, and as shown in Fig. 11(a), one surface is parallel to the printed wiring board on the transport path 20 or the exposure table 210, as long as When the adsorption pad 34 is sucked or stopped, the adsorption (front load) or release of the printed wiring board on the conveyance path 20 or the exposure stage 210 can be performed. Further, since the adsorption head 31 can be rotated, as shown in FIGS. 11(a) to 11(d), for example, the printed wiring board can be rotated by 180° before being loaded, and can be held on the upper side (back load). In the printed wiring board, since the upper side adsorption surface is at the lower side, the next printed wiring board is prepared in advance. Of course, each of the adsorption pads 34 performs adsorption of the printed wiring board by, for example, a negative pressure, and whether or not the suction pad 34 is subjected to a negative pressure is determined by the size of the printed wiring board.

As shown in FIGS. 2 to 5, the rotary elevator 32 for moving the above-described adsorption head 31 up and down and rotating is arranged such that the rotation axis of the adsorption head 31 is parallel to the support surfaces of the exposure stage 210 and the receiving conveyance path 20. The adsorption head 31 is supported, and the rotary elevator 32 is assembled to be vertically movable and reciprocally movable by a conveyance rail 33 to be described later and a frame supporting the same. That is, the rotary elevator 32 reciprocates the adsorption head 31 between the exposure stage 210 and the receiving conveyance path 20 as shown in FIG. 9(a), and as shown in FIG. 10, the relative exposure stage 210 or the receiving conveyance The road 20 is moved up and down, and the rotation of the adsorption head 31 as shown by an arrow shown in Fig. 11(c) is performed.

The transfer rail 33 of the rotary elevator 32 described above is assembled by assembling a frame as shown in FIGS. 1 to 3, and the adsorption head 31 and the rotary elevator 32 that drives the adsorption head 31 are disposed on the exposure stage 210 and the receiving conveyance path 20. The support is supported to reciprocate while maintaining the maintenance area 60. The maintenance area 60 is secured in the transfer device 100 by the transfer rail 33 so that the maintenance worker can enter the maintenance area 60 without being obstructed by, for example, the surroundings of the maintenance area 60. The maintenance of the rotary transfer machine 30 constituted by the exposure machine 200, the receiving conveyance path 20, the adsorption head 31, the rotary elevator 32, and the like.

According to the transfer device 100 of the fourth aspect of the present invention, the transfer method of the first invention and the third invention can be specifically implemented, and the maintenance area 60 can be secured while being small and highly functional. It is not necessary to change the overall configuration of the size and shape of the printed wiring board, and it is possible to efficiently perform standby of the unexposed printed wiring board, input to the exposure machine, and discharge of the printed wiring board after exposure.

In other words, according to the transfer device 100 of the fourth invention,

(1) It is possible to supply (input) a printed wiring board efficiently and efficiently to one exposure machine, and to perform a time much lower than the time during the transfer time of the printed wiring board that takes a long time. Light.

(2) The unexposed printed wiring board is placed on standby until it can be exposed without any scratches or dust.

(3) The above (1) and (2) can be further developed in the case where there are a plurality of exposure machines or when it is necessary to expose both sides of the printed wiring board.

(4) As a transfer device for the exposure machine, it is possible to achieve all the requirements of being small, convenient, and versatile.

In order to solve the problem, the fifth aspect of the present invention is directed to the transfer device 100 according to the fourth aspect of the present invention, further comprising the following aspect: "The second printed area of the transport path 20 is provided with a printed wiring board that is received therefrom. The reverse rotation of the watch back 40".

As shown in FIGS. 1 to 3, the reversing machine 40 used in the transfer device 100 of the fifth invention has a feed surface on which the upper and lower surfaces are formed so as to be able to sandwich the printed wiring board therebetween. 41. The printed wiring board sandwiched between the holding rollers 41 is fed in the rotating direction so that the lower rollers rotate opposite to each other.

Further, the reversing machine 40 has a drive unit 42 for rotating the upper and lower holding rollers 41 in a state of maintaining the parallel state as shown by, for example, the imaginary line in FIG. The reverse of the printed wiring board received between the holding rollers 41 is performed. In other words, the reversing machine 40 is configured such that the unexposed surface of the printed wiring board, that is, the back side (2nd side) is the upper side, after receiving the printed wiring board on the surface (1st side) from which the receiving conveyance path 20 is fed. The method is reversed to prepare for the back exposure in the next step.

Then, the reversing machine 40 has only one exposure machine 200 as shown in FIG. In the case of the transfer device 100 for performing the exposure on the back side of the printed wiring board, the printed wiring board having the back surface on the back side is reversed and returned to the receiving and conveying path 20 by the reversing machine 40. By the above method, it is possible to prepare the exposure of one exposure machine 200 to the back side. Further, as shown in FIG. 15, when the exposure machine 200 has one of the left and right sides of the receiving conveyance path 20, the surface of the printing wiring board is exposed on one exposure machine 200, and the printed wiring board is printed on the other exposure machine 200. In the case of the back side exposure, the reversing machine 40 returns the printed wiring board having the back side to the upper side to the receiving conveyance path 20 by the reversing function, and the above-described method enables two exposures. The machine 200 prepares for exposure of both sides of the front and back.

Further, in the case where the transfer device 100 illustrated in FIG. 1 exposes only the surface of the printed wiring board, the reversing machine 40 has a printed wiring board having the upper side of the back side different from the receiving transport path 20 A transfer path is sent out, and only the preparation of the subsequent work steps is performed. On the other hand, in the transfer device 100 illustrated in Fig. 16, when the two exposure machines 200 are disposed via the reversing machine 40, the reversing machine 40 sends the printed wiring board having the back side to the upper side to the next time. A region is placed on the transport path 20 to prepare for the second exposure operation.

Therefore, in the transfer device 100 according to the fifth aspect of the invention, in addition to the functions similar to those of the fourth aspect of the invention, the reverse rotation of the printed wiring board can be performed in the line by the reversing machine 40.

As described above, the main feature of the composition of the transfer method of the present invention is: "A transfer method of a printed wiring board to be exposed is to sequentially transfer a plurality of printed wiring boards to be exposed to the exposure machine 200. The exposure stage 210 is characterized in that the first printing printed wiring board that is received by the suction conveyance path 20 is sucked by the adsorption head 31 and lifted. The adsorption head 31 is moved to the exposure stage 210 while being held or rotated, and is removed. When the surface of the exposure stage 210 is exposed, the adsorption head 31 is returned to the receiving conveyance path 20, and The second printed wiring board received here is lifted and rotated, and the second printed wiring board is transferred to the exposure stage 210 side by the adsorption head 31, and the first exposure is completed by the adsorption head 31. After the sheet printed wiring board is lifted up, the adsorption head 31 is rotated and moved downward, whereby the second printed wiring board is removed to the exposure stage 210, and the adsorption head 31 that sucks the first printed wiring board is returned. When the third printed wiring board is lifted up and rotated, and the exposed first printed wiring board is removed to the receiving conveyance path 20, the first printed wiring board is removed. After the first printed wiring board is fed to the next region of the transport path 20, the third printed wiring board is driven by the adsorption head 31 to drive the second printed wiring board after the exposure is completed. Removed onto the exposure stage 210, by repeating the above actions, continuously By performing the transfer of the printed wiring board to the exposure stage 210 and the discharge of the printed wiring board after the exposure is completed, it is possible to provide an overall configuration without changing the overall configuration even if the size and shape of the printed wiring board are changed. The standby of the printed wiring board, the input to the exposure machine, and the transfer method of exposing the discharge of the printed wiring board.

Moreover, the main feature of the configuration of the transfer device 100 of the present invention is: "A transfer device 100 for a printed wiring board to be exposed is a sequence in which a plurality of printed wiring boards to be exposed are sequentially transferred to the exposure machine 200. The stage 210 includes a receiving transport path 20, the printed wiring board is received in a horizontal state, and is sequentially transferred to the exposure stage 210 of the exposure machine 200, and the rotary transfer machine 30 is provided with the adsorption head 31. The adsorption head 31 is suspended from the delivery path The transport rail 33 extending to the exposure stage 210 is rotated and lifted by the rotary elevator 32 to perform adsorption and release of the printed wiring board, thereby providing no need to change the size and shape of the printed wiring board. By changing the overall configuration, it is possible to efficiently carry out the standby of the unexposed printed wiring board, the input to the exposure machine, and the transfer device 100 that exposes the discharge of the printed wiring board.

In other words, both the above transfer method and the transfer device 100 can achieve the following effects:

(1) It is possible to efficiently and efficiently supply (inject) a printed wiring board to one exposure machine, and perform exposure much shorter than the time during which the printed wiring board takes a long time.

(2) The unexposed printed wiring board is placed on standby until it can be exposed without any scratches or dust.

(3) The above (1) and (2) can be further developed in the case where there are a plurality of exposure machines or when it is necessary to expose both sides of the printed wiring board.

(4) As a transfer device for the exposure machine, it is possible to achieve all the requirements of being small, convenient, and versatile.

100‧‧‧Transfer device

10‧‧‧ moving into the conveyor

11‧‧‧Input machine

12‧‧‧Clean roller

13‧‧‧Rack trolley

20‧‧‧Accepting the transport route

30‧‧‧Rotary Transfer Machine

31‧‧‧Adsorption head

32‧‧‧Rotary lifts

33‧‧‧Transportation

34‧‧‧Adsorption pad

40‧‧‧Reversal machine

41‧‧‧Clamping roller

42‧‧‧ drive machine

50‧‧‧Drainage route

51‧‧‧ pick up machine

60‧‧‧Maintenance area

200‧‧‧Exposure machine

210‧‧‧ exposure station

W(n)1‧‧‧nth printed wiring board with the surface (1st side) as the upper side

W(n)2‧‧‧nth printed wiring board with the back side (2nd side) as the upper side

1 is a plan view showing the positional relationship between the transfer device 100 of the present invention and the transfer device 100 and the exposure machine 200.

Figure 2 is a front view of Figure 1.

3 is a side view of the transfer device 100.

4 is a view showing a receiving transport path 20 and a rotary transfer machine 30 constituting the transfer device 100, And a diagram of the exposure machine 200, (a) is a top view, and (b) is a front view.

FIG. 5 is a side view showing the positional relationship between the receiving conveyance path 20 and the rotary transfer machine 30 constituting the transfer device 100 and the display and the transfer rail 33.

Fig. 6 is a view showing a reversing machine 40 constituting the transfer device 100, wherein (a) is a plan view and (b) is a side view.

FIG. 7 is a plan view of the reversing machine 40.

Fig. 8 is a view showing a receiving conveyance path 20 constituting the transfer device 100, wherein (a) is a plan view, (b) is a front view, and (c) is a side view.

Fig. 9 is a view showing a state in which the front side of the transfer head 31 is transferred to the exposure stage 210 by the adsorption head 31 of the transfer transfer machine 30, and (a) shows the outline of the movement of the adsorption head 31. In the front view, (b) is a schematic front view showing a state in which the printed wiring board is transferred from the receiving conveyance path 20 to the exposure stage 210.

Fig. 10 is a view showing a state in which the printed wiring board is loaded and carried by the suction head 31 on the receiving conveyance path 20, and (a) shows the printed wiring board on the receiving conveyance path 20 by the adsorption head 31. (b) shows a schematic front view of the printed wiring board carrying the printed wiring board in the front loading, and (c) shows the printed wiring board in the front loading. A schematic front view of the state in which the next printed wiring board is preloaded.

Fig. 11 is a view showing a state in which the front and back of the printed wiring board are carried by the adsorption head 31 on the receiving conveyance path 20 as viewed from the side of the adsorption head 31, and (a) shows the transfer path by the adsorption head 31. (b) is a schematic side view showing the case where the printed wiring board is preloaded, (b) is a schematic side view showing the case where the printed wiring board is loaded, and (c) shows the moment before the printed wiring board in the front loading is carried. A schematic front view of the printed wiring board case, (d) shows that the printed wiring board in the front load is carried A schematic front view of the state in which the next printed wiring board is preloaded.

Fig. 12 is a view schematically showing a modification of the adsorption head 31 in a state viewed from the side, and (a) shows a schematic side view in which the adsorption pad 34 protrudes only from the upper and lower sides of the adsorption head 31 having a quadrangular cross section, and (b) A schematic side view showing the adsorption pad 34 protruding from three sides of the adsorption head 31 having a triangular cross section is shown, and (c) is a schematic side view showing the adsorption pad 34 protruding from the upper, lower, left and right sides of the adsorption head 31 having a quadrangular cross section.

FIG. 13 is a schematic plan view showing a schematic diagram of the transfer device 100 of the present invention and a transfer method, and (a) is a schematic plan view showing a state in which the printed wiring board is received by the loading conveyor 10 onto the receiving conveyance path 20 ( b) A schematic plan view of a state in which the printed wiring board is transferred to the exposure stage 210 and placed on the transport conveyor 10 to be transported to the printed wiring board on the transport path 20 next.

Fig. 14 is a view showing a schematic display of the transfer device 100 and a transfer method. (a) The exposed printed wiring board is received from the exposure stage 210 onto the receiving conveyance path 20 and carried on the back, and the second printing is carried out. The wiring board is further a schematic plan view in which the third printed wiring board is prepared on the loading conveyor 10, and (b) the printed wiring board is reversed and transferred to the next step by the reversing machine 40, and The two printed wiring boards are transferred to the exposure stage 210, and the third printed wiring board is carried forward, and a schematic plan view of the state in which the printed wiring board on the transport path 20 is transported next to the transport conveyor 10 is prepared.

Fig. 15 is a plan view showing the transfer device 100 of another embodiment, in which the exposure machine 200 is disposed on both sides of a receiving conveyance path 20.

16 is a plan view of the transfer device 100 of another embodiment, in which the exposure machine 200 is disposed before and after a reversing machine 40.

Each configuration of the invention will be implemented as described above for the embodiment shown in the drawings, i.e., transfer device 100 as described. In this case, in the description of the transfer device 100 of this embodiment, the above-described transfer methods will be described substantially by explaining the operation and function of the transfer device 100. Therefore, the transfer method is omitted here.

Further, the embodiment of the transfer device 100 includes the first embodiment shown in FIGS. 1 to 8, the second embodiment shown in FIG. 15, and the third embodiment shown in FIG. 16. Description of each embodiment.

Example 1

In the transfer device 100 of the first embodiment, the printed wiring board coated with or coated with, for example, a photoresist can be continuously transferred to the exposure stage 210 of the exposure machine 200, and the transfer or discharge of the printed wiring board can be efficiently utilized. The exposure of the exposure machine 200 to the printed wiring board is efficiently performed while taking time, and as shown in FIGS. 1 to 3, the exposure stage 210 can be placed in and out from the left side of the exposure machine 200 provided on the right side of the drawing. The exposure transporting path 200 is disposed on the left side of the maintenance unit 60 to receive the printed wiring board or carry it out.

On the upper side of the transport path 20, a rotary transfer machine 30, also shown in FIG. 2, is provided, and the adsorption head 31 constituting the rotary transfer machine 30 can be transported between the exposure stage 210 and the receiving transport path 20. The rail 33 moves between the exposure stage 210 and the receiving conveyance path 20. Further, in the transfer device 100, a reversing machine 40 that performs the reversal of the exposure printed wiring board is provided in the next region of the receiving transport path 20.

Further, in the transfer device 100 of the present embodiment, the transport conveyor 10 for feeding the printed wiring board coated or attached with the photoresist is carried on the receiving transport path 20, and is stored in each of the drawings. A plurality of printed wiring boards of the rack trolley shown by symbol 13 are transmitted through the input machine 11 The cleaning roller 12 is carried into the loading conveyor 10. The rack carriage 13 is conveyed in a state in which a plurality of printed wiring boards are erected in an upright state as shown, for example, on the left side of FIG. 2, and the printed wiring boards which are slanted upright are fed into the cleaning by the input machine 11 while being leveled. Each of the printed wiring boards received by the cleaning roller 12 is fed to the receiving and conveying path 20 by the cleaning roller 12 while removing dust.

Thus, the input machine 11 and the cleaning roller 12 and the like constitute a series of loading conveyors 10, which are disposed on the opposite side of the exposure conveyor 200 from the receiving conveyor 20 as shown in FIG. 1, and are disposed and conveyed as shown in FIG. The direction in which the roads 20 are carried out is parallel and is in the front of the receiving conveyance path 20, and is provided in each of the two receiving conveyance paths 20 as shown in Fig. 16 .

On the other hand, as shown in FIG. 1, the transfer device 100 of the present embodiment is provided with a discharge conveyance path 50 and an access machine 51 on the delivery side of the receiving conveyance path 20 or the reversing machine 40 attached thereto. The discharge conveyance path 50 and the pick-up machine 51 feed the printed wiring board which has been exposed on one side or both sides to the next step, and the accumulation of the above-described rack carriage 13 is performed.

Next, as shown in FIGS. 4 and 5, the receiving transport path 20 constituting the transfer device 100 has two types of roller conveyors for performing vertical and horizontal transport of the printed wiring board. These roller conveyors are independent of each other. The method of independently moving vertically or horizontally moves up and down. Of course, at the appropriate place of the roller conveyor, there is a stopper which is positioned in the longitudinal and lateral directions of the printed wiring board which is independently fed and appropriately moved in and out of the transport surface.

The receiving conveyance path 20 of the present embodiment includes a rotary transfer machine 30 provided at a portion above the receiving conveyance path 20. The rotary transfer machine 30 includes a transfer rail 33 extending from the receiving conveyance path 20 to the exposure stage 210, a rotary elevator 32 suspended from the transfer rail 33, and a suction head 31 for performing adsorption and release of the printed wiring board. The adsorption head 31 of this embodiment is shown in Fig. 4(b). As shown in Fig. 5, there are a plurality of adsorption pads 34 which are slightly protruded from the surface of the adsorption head 31 and which are attracted to the printed wiring board by negative pressure air. The kinetic energy of each adsorption pad 34 is appropriately determined by the size of the printed wiring board. set up.

As for the adsorption head 31 constituting the rotary transfer machine 30, various forms as shown in Figs. 12(a) to (c) can be considered from a direction orthogonal to the rotation axis of the adsorption head 31. In the embodiment shown in Fig. 12(a), the end surface shape in the direction orthogonal to the rotation axis of the adsorption head 31 is a quadrangle, and only the four end faces parallel to the rotation axis of the adsorption head 31 are shown. The adsorption pad 34 is protruded from the upper side and the lower side, and these two surfaces are used as the adsorption surface, which is the shape adopted in the present embodiment. In such a configuration, even if the printed wiring board adsorbed by each of the adsorption pads 34 is larger than the size of the adsorption head 31, the printed wiring boards can be adsorbed without interfering with each other.

In the embodiment shown in Fig. 12(b), the end surface shape in the direction orthogonal to the rotation axis of the adsorption head 31 is formed in a triangular shape, and the adsorption pads are integrally formed from the three side faces parallel to the rotation axis of the adsorption head 31. 34 stands out, and these are comprehensive as the adsorption surface. In the embodiment shown in Fig. 12(c), the end surface shape in the direction orthogonal to the rotation axis of the adsorption head 31 is quadrangular, and the respective adsorption is performed from the four side faces parallel to the rotation axis of the adsorption head 31. The pad 34 is protruded and these are comprehensively used as the adsorption faces. In this case, when the printed wiring board which is adsorbed by each of the adsorption pads 34 is out of the size of the adsorption head 31, it is not possible to adsorb the printed wiring boards without interfering with each other, but it is possible to obtain The increase in the number of adsorption faces.

As shown in FIG. 4(b), for example, as shown in FIG. 4(b), the adsorption head 31 can be disposed with a majority of the adsorption pad 34 or a pipe opposite thereto, and the adsorption pad 34 is not formed on the side of the adsorption head 31. The protrusions other than the front end portion do not damage the surface of the printed wiring board.

The adsorption head 31 is reciprocated by the relative transfer rail 33 of the rotary elevator 32, and can be reciprocated between the transfer path 20 and the exposure stage 210, for example, as shown in FIG. The rotation operation can perform a rotation operation as shown in FIGS. 10 and 11, that is, a carry or a piggy-back. Further, the rotary elevator 32 is configured to be able to perform such operations.

The reversing machine 40 is used when the front and back of the printed wiring board are reversed, that is, when the printing of one of the printed wiring boards is performed on the front and back sides of the printed wiring board, for example, in the case of claim 1 This is not required for the transfer method. Further, the reversing machine 40 is of course used when the pick-up machine 51 of the discharge conveyance path 50 has to be taken in a state in which only a plurality of sheet printed wiring boards are reversed.

As shown in FIGS. 6 and 7, the reversing machine 40 of the present embodiment has a feeding surface on which the upper and lower surfaces are formed so that the printed wiring board can be sandwiched between the upper and lower holding rollers 41, and the holding rollers are sandwiched. The 41 printed wiring boards are fed in the rotational direction such that the respective grip rollers 41 rotate opposite to each other.

Further, the reversing machine 40 has a drive unit 42 for rotating the upper and lower holding rollers 41 in a state of maintaining the parallel state as shown by, for example, the imaginary line in FIG. The reverse of the printed wiring board received between the holding rollers 41 is performed. In other words, the reversing machine 40 is configured such that the unexposed surface of the printed wiring board, that is, the back side (2nd side) is the upper side, after receiving the printed wiring board on the surface (1st side) from which the receiving conveyance path 20 is fed. The method is reversed to prepare for the back exposure in the next step.

Next, the reversing machine 40, when there is only one exposure machine 200 as shown in FIG. 1, and as a transfer device 100 for performing exposure on the back side of the printed wiring board, The printed wiring board whose back side is the upper side is returned to the receiving conveyance path 20 by the reversing machine 40, so that the exposure of one exposure machine 200 to the back surface can be prepared. Further, as shown in FIG. 15, when the exposure machine 200 has one of the left and right sides of the receiving conveyance path 20, the surface of the printing wiring board is exposed on one exposure machine 200, and the printed wiring board is printed on the other exposure machine 200. In the case of the back side exposure, the reversing machine 40 returns the printed wiring board having the back side to the upper side to the receiving conveyance path 20 by the reversing function, and the above-described method enables two exposures. The machine 200 prepares for exposure of both sides of the front and back.

Further, in the case where the transfer device 100 illustrated in FIG. 1 exposes only the surface of the printed wiring board, the reversing machine 40 has a printed wiring board having the upper side of the back side different from the receiving transport path 20 A transport path is sent out, and only the preparation for screen printing or exposure work is performed. On the other hand, in the transfer device 100 illustrated in Fig. 16, when the two exposure machines 200 are disposed via the reversing machine 40, the reversing machine 40 sends the printed wiring board having the back side to the upper side to the next time. A region is placed on the transport path 20 to prepare for the second exposure operation.

Example 2

15 is a plan view showing the transfer device 100 of the second embodiment. However, the transfer device 100 of the second embodiment is provided with two exposure machines 200 symmetrically disposed on the left and right sides of a receiving conveyance path 20. Of course, when the both sides of each of the printed wiring boards are exposed, the above-described reversing machine 40 returns to a receiving transport path 20 as described in the first embodiment.

In the transfer device 100 configured as described above, the time taken for receiving, positioning, rotating, transferring, unloading, and the like of the plurality of printed wiring boards of the transport path 20 is performed by the two exposure machines 200. The exposure operation of one or both sides of each printed wiring board is continuously performed without delay. Moreover, as long as the transfer device 100 of the second embodiment has the reversing machine 40, and only needs to be in one When the exposure machine 200 exposes the surface of the printed wiring board and exposes the back surface of the printed wiring board by the other exposure machine 200, it is possible to achieve all the requirements such as small size, excellent convenience, and variability.

Example 3

16 is a plan view showing the transfer device 100 of the third embodiment. However, in the transfer device 100 of the third embodiment, the two transfer transport paths 20 are arranged in series via a reversing machine 40, and each of the transfer paths is arranged. Two exposure machines 200 are disposed on the same side of 20, respectively. Further, each of the carry-in conveyors 10 is provided on the opposite side of each exposure machine 200 from each of the receiving and conveying paths 20.

The transfer device 100 of the third embodiment is suitable for performing exposure of the front and back sides of each printed wiring board, and is suitable for performing surface exposure of the printed wiring board by, for example, the exposure machine 200 on the lower side of the figure. 40. The exposed printed wiring board is reversed and fed into the second receiving conveyance path 20, and then exposed on the back side. The other configuration is the same as that of the first embodiment, but it is necessary to have two exposure machines 200 and two receiving conveyance paths 20 and one of the reversing machines 40 located between the receiving conveyance paths 20.

100‧‧‧Transfer device

10‧‧‧ moving into the conveyor

11‧‧‧Input machine

12‧‧‧Clean roller

13‧‧‧Rack trolley

20‧‧‧Accepting the transport route

30‧‧‧Rotary Transfer Machine

31‧‧‧Adsorption head

33‧‧‧Transportation

34‧‧‧Adsorption pad

60‧‧‧Maintenance area

200‧‧‧Exposure machine

210‧‧‧ exposure station

Claims (5)

A method for transferring a printed wiring board to be exposed is to sequentially transfer a plurality of printed wiring boards to be exposed to an exposure stage 210 of the exposure machine 200, wherein the adsorption head 31 is adsorbed and received by the adsorption head 20. The first printed wiring board is lifted up, the adsorption head 31 is held in its state or rotated, and transferred to the exposure stage 210 and detached. The exposure head 31 is made to be exposed during the exposure of the surface of the exposure stage 210. Returning to the receiving conveyance path 20, the second printed wiring board received here is lifted and rotated, and the second printed wiring board is transferred to the exposure stage 210 side by the adsorption head 31. After the adsorption head 31 lifts up the exposed first printed wiring board, the adsorption head 31 is rotated and then moved downward, thereby removing the second printed wiring board onto the exposure stage 210, so that the adsorption is performed. The adsorption head 31 of one printed wiring board is returned to the receiving conveyance path 20 that receives the third printed wiring board, and the third printed wiring board is lifted up and rotated to remove the exposed first printed wiring board. To the receiving conveyance path 20, the first printed wiring board The third printed wiring board is removed to the exposure stage 210 by driving the adsorption head 31 to drive the second printed wiring board after the exposure is completed. Then, by repeating the above operation, the discharge of the printed wiring board to the exposure stage 210 and the discharge of the printed wiring board after the exposure are continuously performed. The transfer method of the printed wiring board to be exposed according to the first aspect of the patent application, wherein the reversing machine 40 is disposed in a second region of the receiving transport path 20, and the second receiving transport path 20, the adsorption head 31, and The exposure machine 200 is disposed in the next area of the reversing machine 40, and the reversing machine 40 reverses the printed wiring board whose surface has been exposed to the upper side. Thereafter, the second receiving transport path 20 and the adsorption head 31 are transferred to the exposure stage 210 of the second exposure machine 200. The method for transferring a printed wiring board to be exposed according to the first aspect of the patent application, wherein the surface of the receiving transport path 20 is exposed by the reversing machine 40 disposed in the next region of the receiving transport path 20 After the printed wiring board is reversed, the printed wiring board having the back surface is returned to the receiving and conveying path 20, and the back surface of the printed wiring board is sucked by the adsorption head 31 and transferred to the exposure stage 210. Exposure of the back side of the printed wiring board. A transfer device 100 for a printed wiring board to be exposed is a plurality of printed wiring boards to be exposed to be sequentially transferred to an exposure stage 210 of the exposure machine 200, and is characterized in that: a receiving transfer path 20 is provided, and the printed wiring is provided The plate is received in a horizontal state, and the second region is also carried out; and the rotary transfer machine 30 includes: a suction head 31 having a plurality of faces and having adsorption pads respectively on the plurality of faces, the adsorption head 31 The transport rail 33 that extends from the receiving transport path 20 to the exposure stage 210 is rotated and lifted by the rotary elevator 32 to perform adsorption and release of the printed wiring board. The transfer device 100 of the printed wiring board to be exposed according to the fourth aspect of the patent application, wherein the second region of the receiving transport path 20 is provided with a reversing machine 40 for reversing the front and back of the printed wiring board received therefrom. .