TW201615445A - Removal method, removal device, and printing system - Google Patents

Removal method, removal device, and printing system Download PDF

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Publication number
TW201615445A
TW201615445A TW104126141A TW104126141A TW201615445A TW 201615445 A TW201615445 A TW 201615445A TW 104126141 A TW104126141 A TW 104126141A TW 104126141 A TW104126141 A TW 104126141A TW 201615445 A TW201615445 A TW 201615445A
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TW
Taiwan
Prior art keywords
transfer
plate
transfer body
printing cloth
printing
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TW104126141A
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Chinese (zh)
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TWI596018B (en
Inventor
上野博之
南茂樹
上代和男
富藤幸雄
川越理史
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斯克林集團公司
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Publication of TW201615445A publication Critical patent/TW201615445A/en
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Publication of TWI596018B publication Critical patent/TWI596018B/en

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Abstract

The present invention is an attachment removal technology in which attachment attached to a print cloth or baseboard type of panel shaped objects is nicely removed, and a printing system which utilizes the removal technology. The removal method is to remove attachment that is attached to a main surface of the panel shaped object and comprises: a transfer step in which a transfer body is tightly pressed against one main surface of the panel shaped object and the attachment is transferred to the transfer body, and a peeling step in which the transfer body tightly pressed against one main surface of the panel shaped object is peeled off and the attachment is removed from the main surface of the panel shaped object.

Description

除去方法、除去裝置及印刷系統 Removal method, removal device, and printing system

本發明係關於一種除去附著於印刷布或基板等板狀體之一主面之附著物之除去技術、以及使用該除去技術之印刷系統。 The present invention relates to a technique for removing an adhering matter attached to one main surface of a plate-like body such as a printing cloth or a substrate, and a printing system using the same.

為對半導體晶圓、液晶顯示裝置用玻璃基板、電漿顯示器用玻璃基板、磁碟或光碟用之玻璃或陶瓷基板、有機EL用玻璃基板、太陽電池用玻璃基板或矽基板、以及撓性基板及印刷基板等適於電子機器之基板形成圖案層,提出使用有印刷布等板狀體之印刷技術(例如,日本專利特開2013-184382號公報)。 A glass substrate for a semiconductor wafer, a liquid crystal display device, a glass substrate for a plasma display, a glass or ceramic substrate for a magnetic disk or an optical disk, a glass substrate for an organic EL, a glass substrate or a ruthenium substrate for a solar cell, and a flexible substrate A patterning layer for a substrate suitable for an electronic device such as a printed circuit board is used, and a printing technique using a plate-like body such as a printing cloth is proposed (for example, Japanese Laid-Open Patent Publication No. 2013-184382).

於該印刷技術中,使具有與應形成於基板之圖案相反之圖案、即反轉圖案之版抵壓於塗佈有塗佈層之印刷布而接觸,藉此使印刷布上之塗佈層圖案化而於印刷布上形成具有上述反轉圖案之圖案層(圖案化處理)。繼而,使該印刷布抵壓於基板而接觸,藉此將上述圖案層轉印至基板(轉印處理)。再者,專利文獻1記載之裝置中,於同一裝置內連續執行上述圖案化處理與上述轉印處理而進行印刷處理,但亦可將進行圖案化處理之裝置與進行轉印處理之裝置並排設置而進行印刷處理(=圖案化處理+轉印處理)。 In the printing technique, a plate having a pattern opposite to a pattern to be formed on a substrate, that is, a pattern of a reverse pattern is brought into contact with a printing cloth coated with a coating layer, thereby bringing a coating layer on the printing cloth. A pattern layer (patterning process) having the above-described reverse pattern is formed on the printing cloth by patterning. Then, the printing cloth is brought into contact with the substrate to be transferred, whereby the pattern layer is transferred to the substrate (transfer processing). Further, in the device described in Patent Document 1, the patterning process and the transfer process are continuously performed in the same apparatus to perform the printing process, but the device for performing the patterning process and the device for performing the transfer process may be arranged side by side. The printing process (=patterning process + transfer process) is performed.

於如此使用印刷布之印刷技術中,於轉印處理時將擔載於印刷 布之圖案層轉印至基板,但有因轉印不良而使圖案層之一部分殘留於印刷布上之情形。又,即便良好地進行轉印,於設計上亦有塗佈液之一部分殘留於印刷布上之情形。塗佈層向印刷布之形成較多使用狹縫噴嘴進行,從而有如下情形:於塗佈之始端部分或末端部分、進而於噴嘴邊緣部,塗佈層之膜厚變得不均勻。因此,提出有如以下使用圖10所說明般,將平面尺寸較版或基板之平面尺寸大一圈之塗佈層塗佈於印刷布上,且於塗佈層之中央部分形成圖案層。因此,若根據該提案進行印刷處理,則於印刷布上呈邊框狀殘留有塗佈層之一部分。藉此,為再利用印刷布,較理想為除去殘留於印刷布之附著物,從而期望確立適合於該除去之技術。又,此種技術之確立不僅於使用印刷布之印刷技術中,而且於除去附著於基板表面之附著物之基板處理技術中亦受到期望。 In the printing technique in which the printing cloth is used, it is carried on the printing process during the transfer process. The pattern layer of the cloth is transferred to the substrate, but one of the pattern layers remains on the printing cloth due to poor transfer. Moreover, even if the transfer is performed favorably, there is a case where a part of the coating liquid remains on the printing cloth. The formation of the coating layer to the printing cloth is often carried out using a slit nozzle, and the film thickness of the coating layer becomes uneven at the beginning end portion or the end portion of the coating and further at the nozzle edge portion. Therefore, it has been proposed to apply a coating layer having a planar size larger than the plane size of the plate or the substrate to the printing cloth as described below with reference to Fig. 10, and to form a pattern layer in the central portion of the coating layer. Therefore, when the printing process is performed according to the proposal, one portion of the coating layer remains on the printed cloth in a frame shape. Therefore, in order to reuse the printing cloth, it is preferable to remove the adhering matter remaining on the printing cloth, and it is desirable to establish a technique suitable for the removal. Moreover, the establishment of such a technique is expected not only in the printing technique using a printing cloth but also in a substrate processing technique for removing adhering substances adhering to the surface of the substrate.

本發明係鑒於上述課題而完成者,其目的在於提供一種良好地除去附著於印刷布或基板等板狀體之附著物之除去技術、以及使用該除去技術之印刷系統。 The present invention has been made in view of the above problems, and an object of the invention is to provide a removal technique for removing adhering substances attached to a plate-like body such as a printing cloth or a substrate, and a printing system using the removal technique.

本發明之第1態樣係一種除去方法,其係除去附著於板狀體之一主面之附著物者,其特徵在於包括:轉印步驟,其係使轉印體密接於板狀體之一主面而將附著物轉印至轉印體;及剝離步驟,其係將密接於板狀體之一主面之轉印體自板狀體剝離,而自板狀體之一主面除去附著物。 A first aspect of the present invention is a method for removing an adhering matter attached to one main surface of a plate-like body, characterized by comprising: a transfer step of adhering the transfer body to the plate-like body Transferring the deposit to the transfer body on one main surface; and a peeling step of peeling off the transfer body adhered to one of the main faces of the plate-shaped body from the plate-like body, and removing from one main surface of the plate-shaped body Attachment.

又,本發明之第2態樣係一種除去裝置,其係除去附著於板狀體之一主面之附著物者,其特徵在於:於使轉印體密接於板狀體之一主面而將附著物轉印至轉印體之後,將轉印體自板狀體剝離而自板狀體之一主面除去附著物。 Further, a second aspect of the present invention is a removing device for removing an adhering matter attached to one main surface of a plate-like body, wherein the transfer body is adhered to one main surface of the plate-shaped body. After the deposit is transferred to the transfer body, the transfer body is peeled off from the plate-like body to remove the deposit from one of the main faces of the plate-like body.

進而,本發明之第3態樣之特徵在於包含:塗佈裝置,其將塗佈液塗佈於印刷布而形成塗佈層;印刷裝置,其使形成於印刷布之塗佈 層圖案化而形成圖案層之後,將圖案層轉印至基板;除去裝置,其使轉印體密接於用於將圖案層轉印至基板後之印刷布而將附著於印刷布之附著物轉印至轉印體之後,將轉印體自印刷布剝離而除去附著物;及搬送裝置,其將形成有塗佈層之印刷布搬送至印刷裝置,將已用於將圖案層轉印至基板之印刷布搬送至除去裝置,且將除去附著物後之印刷布搬送至塗佈裝置以供印刷布之再利用。 Further, a third aspect of the present invention provides a coating apparatus comprising: applying a coating liquid to a printing cloth to form a coating layer; and a printing apparatus for coating the printing cloth. After the layer is patterned to form a pattern layer, the pattern layer is transferred to the substrate; and the removing device is configured to adhere the transfer body to the printing cloth for transferring the pattern layer to the substrate to transfer the adhering matter attached to the printing cloth. After printing on the transfer body, the transfer body is peeled off from the printing cloth to remove the deposit; and the transfer device transports the printing cloth on which the coating layer is formed to the printing device, and has been used to transfer the pattern layer to the substrate. The printing cloth is transported to the removing device, and the printed cloth from which the deposit has been removed is transferred to the coating device for reuse of the printing cloth.

根據本發明,為自板狀體之一主面除去附著物,將轉印體密接於該一主面,藉此將附著物轉印至轉印體。其後,使轉印體擔載附著物並自板狀體剝離。以此方式自板狀體之一主面有效率地除去附著物。 According to the invention, the deposit is removed from the main surface of one of the plate-like bodies, and the transfer body is adhered to the one main surface, whereby the deposit is transferred to the transfer body. Thereafter, the transfer body is loaded with the adherend and peeled off from the plate-like body. In this way, the attachment is efficiently removed from one of the main faces of the plate.

1A‧‧‧除去裝置 1A‧‧‧Removal device

1B‧‧‧除去裝置 1B‧‧‧Removal device

1C‧‧‧除去裝置 1C‧‧‧ Removal device

2‧‧‧主框架 2‧‧‧ main frame

3‧‧‧平台區塊 3‧‧‧ Platform Block

4‧‧‧上平台區塊 4‧‧‧Upper platform block

5‧‧‧上部吸附區塊 5‧‧‧Upper adsorption block

6‧‧‧下平台區塊 6‧‧‧ Lower platform block

11‧‧‧主框架 11‧‧‧Main frame

21‧‧‧基座框架 21‧‧‧Base frame

22‧‧‧上平台支持框架 22‧‧‧Upper Platform Support Framework

23‧‧‧上平台支持框架 23‧‧‧Upper Platform Support Framework

30‧‧‧平台 30‧‧‧ platform

31‧‧‧水平平台部 31‧‧‧Horizontal Platform Division

32‧‧‧楔形平台部 32‧‧‧Wedge Platform Department

33‧‧‧初始剝離單元 33‧‧‧Initial stripping unit

34‧‧‧輥單元 34‧‧‧roll unit

40‧‧‧上平台組件 40‧‧‧Upper platform components

41‧‧‧上平台 41‧‧‧Upper platform

41a‧‧‧(上平台之)下表面 41a‧‧‧ (on the platform) lower surface

42‧‧‧加強框架 42‧‧‧Strengthening the framework

43‧‧‧梁狀構造體 43‧‧‧ beam-shaped structures

44‧‧‧上部吸附單元 44‧‧‧Upper adsorption unit

45‧‧‧支持柱 45‧‧‧Support column

46‧‧‧支持柱 46‧‧‧Support column

47‧‧‧升降機構 47‧‧‧ Lifting mechanism

50‧‧‧支持框架 50‧‧‧Support framework

51‧‧‧第1吸附單元 51‧‧‧1st adsorption unit

52‧‧‧第2吸附單元 52‧‧‧2nd adsorption unit

53‧‧‧第3吸附單元 53‧‧‧3rd adsorption unit

54‧‧‧第4吸附單元 54‧‧‧4th adsorption unit

61‧‧‧下平台 61‧‧‧Under platform

61a‧‧‧(下平台之)上表面 61a‧‧‧ (lower platform) upper surface

62‧‧‧升降手單元 62‧‧‧ Lifting hand unit

63‧‧‧升降手單元 63‧‧‧ Lifting unit

64‧‧‧轉印輥單元 64‧‧‧Transfer roller unit

100‧‧‧印刷系統 100‧‧‧Printing system

201‧‧‧轉印裝置 201‧‧‧Transfer device

202‧‧‧轉印裝置 202‧‧‧Transfer device

203‧‧‧轉印裝置 203‧‧‧Transfer device

204‧‧‧轉印裝置 204‧‧‧Transfer device

241‧‧‧基板用預對準相機 241‧‧‧Pre-aligned camera for substrates

242‧‧‧基板用預對準相機 242‧‧‧Pre-aligned camera for substrates

243‧‧‧基板用預對準相機 243‧‧‧Pre-aligned camera for substrates

244‧‧‧印刷布用預對準相機 244‧‧‧Pre-aligned camera for printing cloth

245‧‧‧印刷布用預對準相機 245‧‧‧Pre-aligned camera for printing cloth

246‧‧‧印刷布用預對準相機 246‧‧‧Pre-aligned camera for printing cloth

301‧‧‧剝離裝置 301‧‧‧ peeling device

302‧‧‧剝離裝置 302‧‧‧ peeling device

303‧‧‧剝離裝置 303‧‧‧ peeling device

304‧‧‧剝離裝置 304‧‧‧ peeling device

310‧‧‧(水平平台部之)上表面 310‧‧‧ (on the horizontal platform) upper surface

311‧‧‧槽 311‧‧‧ slot

312‧‧‧槽 312‧‧‧ slot

320‧‧‧(楔形平台部之)上表面 320‧‧‧ (on the wedge platform) upper surface

331‧‧‧按壓構件 331‧‧‧ Pressing members

332‧‧‧支持臂 332‧‧‧Support arm

333‧‧‧導軌 333‧‧‧rail

334‧‧‧柱構件 334‧‧‧column components

335‧‧‧升降機構 335‧‧‧ Lifting mechanism

336‧‧‧基座部 336‧‧‧Base section

337‧‧‧位置調整機構 337‧‧‧Location adjustment agency

340‧‧‧剝離輥 340‧‧‧ peeling roller

341‧‧‧滑塊 341‧‧‧ Slider

342‧‧‧滑塊 342‧‧‧ Slider

343‧‧‧下部角型材 343‧‧‧lower angle profiles

344‧‧‧升降機構 344‧‧‧ Lifting mechanism

345‧‧‧上部角型材 345‧‧‧Upper corner profiles

346‧‧‧支承輥 346‧‧‧Support roll

351‧‧‧導軌 351‧‧‧rail

352‧‧‧導軌 352‧‧‧rail

353‧‧‧馬達 353‧‧‧Motor

401‧‧‧搬送裝置 401‧‧‧Transporting device

402‧‧‧搬送部 402‧‧‧Transportation Department

403‧‧‧印刷布交接部 403‧‧‧Printing cloth handover department

404‧‧‧轉印板交接部 404‧‧‧Transfer board junction

405‧‧‧版交接部 405‧‧ version of the handover department

406‧‧‧基板交接部 406‧‧‧Substrate interface

407‧‧‧移動部 407‧‧‧Mobile Department

408‧‧‧旋轉部 408‧‧‧Rotating Department

421‧‧‧加強肋 421‧‧‧Strengthened ribs

422‧‧‧加強肋 422‧‧‧Strengthened ribs

441‧‧‧支持框架 441‧‧‧Support framework

442‧‧‧管 442‧‧‧ tube

443‧‧‧吸附墊 443‧‧‧Adsorption pad

444‧‧‧滑塊 444‧‧‧ Slider

445‧‧‧導軌 445‧‧‧rails

446‧‧‧基座板 446‧‧‧Base plate

447‧‧‧升降機構 447‧‧‧ Lifting mechanism

451‧‧‧導軌 451‧‧‧rail

461‧‧‧導軌 461‧‧‧rails

481‧‧‧基座板 481‧‧‧Base plate

482‧‧‧上平台區塊支持機構 482‧‧‧Upper Platform Block Support Agency

500‧‧‧控制裝置 500‧‧‧Control device

501‧‧‧CPU 501‧‧‧CPU

502‧‧‧馬達控制部 502‧‧‧Motor Control Department

503‧‧‧閥控制部 503‧‧‧Valve Control Department

504‧‧‧負壓供給部 504‧‧‧Negative pressure supply department

505‧‧‧圖像處理部 505‧‧‧Image Processing Department

506‧‧‧氣體供給部 506‧‧‧Gas Supply Department

517‧‧‧吸附墊 517‧‧‧Adsorption pad

522‧‧‧柱構件 522‧‧‧column components

523‧‧‧柱構件 523‧‧‧column components

524‧‧‧板構件 524‧‧‧Board components

525‧‧‧升降機構 525‧‧‧ Lifting mechanism

526‧‧‧墊支持構件 526‧‧‧pad support members

527‧‧‧吸附墊 527‧‧‧Adsorption pad

527a‧‧‧吸附部 527a‧‧‧Adsorption Department

527b‧‧‧伸縮部 527b‧‧‧Flexing Department

537‧‧‧吸附墊 537‧‧‧Adsorption pad

547‧‧‧吸附墊 547‧‧‧Adsorption pad

601‧‧‧轉印/剝離裝置 601‧‧‧Transfer/peeling device

601‧‧‧對準平台 601‧‧ Alignment platform

602‧‧‧支柱 602‧‧‧ pillar

603‧‧‧平台支持板 603‧‧‧ Platform Support Board

611‧‧‧開口窗 611‧‧‧Open window

612‧‧‧槽 612‧‧‧ slot

613‧‧‧止動構件 613‧‧‧stop member

621‧‧‧支柱 621‧‧‧ pillar

622‧‧‧支柱 622‧‧‧ pillar

623‧‧‧滑動基座 623‧‧‧Sliding base

624‧‧‧升降機構 624‧‧‧ Lifting mechanism

625‧‧‧手 625‧‧‧ hands

625a‧‧‧手上表面 625a‧‧‧Hand surface

625b‧‧‧吸附孔 625b‧‧‧Adsorption holes

626‧‧‧導軌 626‧‧‧rail

627‧‧‧滑塊 627‧‧‧Slider

628‧‧‧升降機構 628‧‧‧ Lifting mechanism

641‧‧‧轉印輥 641‧‧‧Transfer roller

642‧‧‧支持框架 642‧‧‧Support framework

643‧‧‧支承輥 643‧‧‧Support roller

644‧‧‧升降機構 644‧‧‧ Lifting mechanism

644a‧‧‧基座部 644a‧‧‧Base Department

644b‧‧‧支持腳 644b‧‧‧Support feet

645‧‧‧下部框架 645‧‧‧lower frame

646‧‧‧導軌 646‧‧‧rail

647‧‧‧移動機構 647‧‧‧Mobile agencies

710‧‧‧清洗裝置 710‧‧‧cleaning device

711‧‧‧清洗輥 711‧‧‧cleaning roller

712‧‧‧乾燥部 712‧‧‧Drying Department

720‧‧‧清洗裝置 720‧‧‧cleaning device

730‧‧‧清洗裝置 730‧‧‧cleaning device

731‧‧‧清洗罩 731‧‧‧cleaning cover

732‧‧‧傾斜輥 732‧‧‧inclined roller

733‧‧‧預濕部 733‧‧‧Pre-wet

734‧‧‧藥液處理部 734‧‧‧Drug treatment department

735‧‧‧沖洗部 735‧‧‧Washing Department

800‧‧‧塗佈裝置 800‧‧‧ Coating device

810‧‧‧印刷布保持部 810‧‧‧Printing cloth maintenance department

820‧‧‧托架 820‧‧‧ bracket

830‧‧‧狹縫噴嘴 830‧‧‧Slit nozzle

840‧‧‧噴嘴支持部 840‧‧‧Nozzle Support

850‧‧‧升降機構 850‧‧‧ Lifting mechanism

860‧‧‧移行軌道 860‧‧‧moving track

870‧‧‧線性馬達 870‧‧‧linear motor

871‧‧‧固定子 871‧‧‧ fixer

872‧‧‧移動子 872‧‧‧Moving child

880‧‧‧線性編碼器 880‧‧‧linear encoder

2011‧‧‧轉印板保持部(第1轉印體保持部) 2011‧‧‧Transfer plate holding portion (first transfer body holding portion)

2012‧‧‧印刷布保持部(第1板狀體保持部) 2012‧‧‧Printing cloth holding unit (first plate-shaped body holding unit)

2013‧‧‧(第1)升降驅動部 2013‧‧‧(1) Lifting and Driving Department

3011‧‧‧轉印板保持部(第2轉印體保持部) 3011‧‧‧Transfer plate holding portion (second transfer body holding portion)

3012‧‧‧印刷布保持部(第2板狀體保持部) 3012‧‧‧Printing cloth holding portion (second plate-shaped body holding portion)

3013‧‧‧(第2)升降驅動部 3013‧‧‧(2nd) Lifting and Driving Department

4071‧‧‧輥 4071‧‧‧roll

6011‧‧‧轉印板保持部(轉印體保持部) 6011‧‧‧Transfer plate holding portion (transfer body holding portion)

6012‧‧‧印刷布保持部(板狀體保持部) 6012‧‧‧Printing cloth holding part (plate-shaped body holding part)

6013‧‧‧升降驅動部 6013‧‧‧ Lifting and driving department

6211‧‧‧導軌 6211‧‧‧rail

6221‧‧‧導軌 6221‧‧‧rails

7331‧‧‧淋浴噴嘴 7331‧‧‧ Shower nozzle

7341‧‧‧二流體噴嘴 7341‧‧‧Two fluid nozzle

735‧‧‧淋浴噴嘴 735‧‧‧ Shower nozzle

AB‧‧‧密接體 AB‧‧‧Block

AL1‧‧‧第1裝置排 AL1‧‧‧1st device row

AL2‧‧‧第2裝置排 AL2‧‧‧2nd device row

AL3‧‧‧第3裝置排 AL3‧‧‧3rd device row

AR‧‧‧有效區域 AR‧‧‧Active area

BL‧‧‧印刷布 BL‧‧‧Printed cloth

BL0‧‧‧印刷布 BL0‧‧‧Printed cloth

BLi‧‧‧印刷布 BLi‧‧‧Printed cloth

CL‧‧‧塗佈層 CL‧‧‧ coating layer

CP‧‧‧密接位置 CP‧‧‧ close position

E‧‧‧脊線部 E‧‧‧ ridge line

G‧‧‧間隔 G‧‧‧ interval

HB‧‧‧印刷布用手 HB‧‧‧Printed cloth with hand

HS‧‧‧基板用手 HS‧‧‧ substrate with hand

PL‧‧‧圖案層 PL‧‧‧ pattern layer

PP‧‧‧版 PP‧‧ version

PP0‧‧‧版 PP0‧‧ version

PPi‧‧‧版 PPi‧‧ version

PTB‧‧‧印刷布搬送路徑 PTB‧‧‧Printing cloth transport path

PTP‧‧‧版搬送路徑 PTP‧‧ version version of the transport path

PTT‧‧‧轉印板搬送路徑 PTT‧‧‧Transfer plate transport path

PTS‧‧‧基板搬送路徑 PTS‧‧‧ substrate transport path

RI‧‧‧殘留墨水(附著物) RI‧‧‧Residual ink (attachment)

SB‧‧‧基板 SB‧‧‧ substrate

SF‧‧‧(印刷布BL之)表面 SF‧‧‧ (printed cloth BL) surface

SP‧‧‧處理空間 SP‧‧ ‧ processing space

TP‧‧‧轉印板 TP‧‧·transfer plate

TP0‧‧‧轉印板 TP0‧‧‧Transfer board

TPi‧‧‧轉印板 TPi‧‧Transfer board

TR‧‧‧轉印輥(轉印體) TR‧‧·Transfer roller (transfer body)

WK‧‧‧工件(密接體) WK‧‧‧ workpiece (closed body)

Z‧‧‧鉛垂軸方向 Z‧‧‧Down axis direction

圖1係表示本發明之除去裝置之第1實施形態之俯視圖。 Fig. 1 is a plan view showing a first embodiment of the removing device of the present invention.

圖2係表示圖1所示之除去裝置之控制系統之方塊圖。 Figure 2 is a block diagram showing the control system of the removing device shown in Figure 1.

圖3係表示圖1所示之除去裝置之動作之圖。 Fig. 3 is a view showing the operation of the removing device shown in Fig. 1.

圖4係表示本發明之除去裝置之第2實施形態之俯視圖。 Fig. 4 is a plan view showing a second embodiment of the removing device of the present invention.

圖5係表示圖4所示之除去裝置之動作之圖。 Fig. 5 is a view showing the operation of the removing device shown in Fig. 4.

圖6A~圖6D係表示本發明之除去裝置之第3實施形態之圖。 6A to 6D are views showing a third embodiment of the removing device of the present invention.

圖7係表示配備本發明之除去裝置之第4實施形態之印刷系統之一例之圖。 Fig. 7 is a view showing an example of a printing system equipped with a fourth embodiment of the removing device of the present invention.

圖8係表示圖7所示之除去裝置之控制系統之方塊圖。 Figure 8 is a block diagram showing the control system of the removing device shown in Figure 7.

圖9係表示配備於圖7所示之印刷系統中之塗佈裝置之一例之立體圖。 Fig. 9 is a perspective view showing an example of a coating device provided in the printing system shown in Fig. 7.

圖10係模式性表示印刷布、塗佈層、版、基板及有效區域之位置關係之圖。 Fig. 10 is a view schematically showing the positional relationship of a printing cloth, a coating layer, a plate, a substrate, and an effective area.

圖11係表示配備於圖7所示之印刷系統中之轉印裝置之一例之立體圖。 Fig. 11 is a perspective view showing an example of a transfer device provided in the printing system shown in Fig. 7.

圖12係表示下平台區塊之構造之立體圖。 Figure 12 is a perspective view showing the construction of the lower platform block.

圖13係表示升降手單元之構造之圖。 Fig. 13 is a view showing the configuration of the lifter unit.

圖14係表示轉印輥單元之構造之圖。 Fig. 14 is a view showing the configuration of a transfer roller unit.

圖15係表示上平台組件之構造之圖。 Figure 15 is a diagram showing the construction of the upper platform assembly.

圖16A~圖16C係模式性表示處理之各階段之裝置各部之位置關係之圖。 16A to 16C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖17A~圖17C係模式性表示處理之各階段之裝置各部之位置關係之圖。 17A to 17C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖18A、圖18B係模式性表示處理之各階段之裝置各部之位置關係之圖。 18A and 18B are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖19A~圖19C係模式性表示處理之各階段之裝置各部之位置關係之圖。 19A to 19C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖20A~圖20C係模式性表示處理之各階段之裝置各部之位置關係之圖。 20A to 20C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖21A~圖21C係模式性表示處理之各階段之裝置各部之位置關係之圖。 21A to 21C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖22A~圖22C係模式性表示處理之各階段之裝置各部之位置關係之圖。 22A to 22C are diagrams schematically showing the positional relationship of each unit of the apparatus at each stage of the process.

圖23係表示配備於圖7所示之印刷系統中之剝離裝置之一例之立體圖。 Fig. 23 is a perspective view showing an example of a peeling device provided in the printing system shown in Fig. 7.

圖24係表示剝離裝置之主要構成之立體圖。 Fig. 24 is a perspective view showing the main configuration of the peeling device.

圖25係表示初始剝離單元之構造及各部之位置關係之側視圖。 Fig. 25 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective portions.

圖26A~圖26D係表示剝離處理中之各階段之各部之位置關係之圖。 26A to 26D are views showing the positional relationship of each part in each stage in the peeling process.

圖27A~圖27D係表示剝離處理中之各階段之各部之位置關係之圖。 27A to 27D are views showing the positional relationship of each part in each stage in the peeling process.

圖28係表示將用於墨水除去之轉印板進行清洗之清洗裝置之概況之側視圖。 Fig. 28 is a side view showing an outline of a cleaning apparatus for cleaning a transfer sheet for ink removal.

<第1實施形態> <First embodiment>

圖1係表示本發明之除去裝置之第1實施形態之俯視圖。又,圖2係表示圖1所示之除去裝置之控制系統之方塊圖。進而,圖3係表示圖1所示之除去裝置之動作之圖,於該圖中圖示有動作流程及動作之模式圖。再者,為統一地表示各圖中之方向,如圖1所示設定XYZ正交座標軸。此處,XY平面表示水平面,Z軸表示鉛垂軸。更詳細而言,(+Z)方向表示鉛垂上方。又,包含物品(印刷布及除去用轉印板)之搬入搬出之自外部向裝置之出入係沿Y軸方向進行。 Fig. 1 is a plan view showing a first embodiment of the removing device of the present invention. 2 is a block diagram showing a control system of the removing device shown in FIG. 1. Further, Fig. 3 is a view showing the operation of the removing device shown in Fig. 1, and a schematic diagram showing the operation flow and the operation is shown in the figure. Furthermore, in order to uniformly represent the directions in the respective drawings, the XYZ orthogonal coordinate axes are set as shown in FIG. Here, the XY plane represents a horizontal plane, and the Z axis represents a vertical axis. In more detail, the (+Z) direction indicates the vertical upper side. Moreover, the entry and exit of the article (printing cloth and transfer transfer plate) from the outside into the apparatus is performed in the Y-axis direction.

於專利文獻1記載之裝置中,使用於一主面擔載有將塗佈墨水等塗佈材料而成之塗佈層之印刷布,於基板上形成圖案層,即進行印刷處理。即,使印刷布上之塗佈層圖案化而形成圖案層之後,將該圖案層轉印至基板。因此,有如下情形:在用於將圖案層轉印至基板後之印刷布之表面,塗佈材料部分地殘留,附著於該印刷布。因此,本發明之除去裝置係藉由執行與上述裝置所執行之轉印動作及剝離動作類似之動作而使印刷布上附著之附著物移動至除去用之轉印板,藉此自印刷布上除去附著物。 In the apparatus described in Patent Document 1, a printing sheet in which a coating layer obtained by applying a coating material such as ink is carried on one main surface, and a pattern layer is formed on the substrate, that is, a printing process is performed. That is, after the coating layer on the printing cloth is patterned to form a pattern layer, the pattern layer is transferred to the substrate. Therefore, there is a case where the coating material partially remains on the surface of the printing cloth after the pattern layer is transferred to the substrate, and adheres to the printing cloth. Therefore, the removal device of the present invention moves the adhering matter attached to the printing cloth to the transfer plate for removal by performing an operation similar to the transfer operation and the peeling operation performed by the above-described device, thereby self-printing the cloth. Remove the attachments.

以下,一面參照圖1~圖3一面對本發明之除去裝置之第1實施形態進行詳細敍述。第1實施形態及以下說明之實施形態中進行處理之印刷布BL係於玻璃板或透明樹脂板之表面形成有包含矽橡膠之較薄之彈性層的板狀體。繼而,為明確除去動作,適當地將處於在彈性層之表面SF附著有附著物之狀態之印刷布BL稱為「印刷布BLi」,另一方面,將藉由除去裝置而除去附著物後之印刷布BL稱為「印刷布BL0」。又,第1實施形態等中進行處理之轉印板TP係具有與印刷布 BL相同之平面尺寸之玻璃板,轉印板TP之表面張力低於印刷布BL之表面SF之表面張力,且具有較印刷布BL之表面SF更高之潤濕性。關於該轉印板TP,亦與印刷布BL同樣地,適當地將處於附著有附著物之狀態之轉印板稱為「轉印板TPi」,另一方面,將未附著有附著物之轉印板稱為「轉印板TP0」。 Hereinafter, a first embodiment of the removing device of the present invention will be described in detail with reference to Figs. 1 to 3 . The printing cloth BL processed in the first embodiment and the embodiment described below is a plate-like body in which a thin elastic layer of enamel rubber is formed on the surface of a glass plate or a transparent resin plate. Then, in order to clarify the removal operation, the printing cloth BL in a state in which the adhering matter adheres to the surface SF of the elastic layer is appropriately referred to as "printing cloth BLi", and the attachment is removed by the removing device. The printed cloth BL is referred to as "printed cloth BL0". Further, the transfer sheet TP which is processed in the first embodiment or the like has a printing cloth The glass plate of the same planar size of BL has a surface tension lower than that of the surface SF of the printing cloth BL, and has a higher wettability than the surface SF of the printing cloth BL. In the same manner as the printing cloth BL, the transfer plate in the state in which the adhering matter adheres is appropriately referred to as a "transfer plate TPi", and the transfer is not attached. The plate is called "transfer plate TP0".

除去裝置1A包含進行轉印處理之轉印裝置201、進行剝離處理之剝離裝置301、以及搬送印刷布BL及轉印板TP之搬送裝置401。於轉印裝置201中,如圖3之右上部所示,2個保持部2011、2012配置成於鉛垂軸方向Z上相互接近及分開自如。該等中配置於上方側之保持部2011係將轉印板TP朝下方保持之轉印板保持部,藉由設置於轉印板保持部2011之鉛垂下表面之吸附機構(省略圖示)而將轉印板TP吸附並保持。另一個保持部2012係將印刷布BL以使附著有附著物(此處為藉由向基板形成圖案層而殘留於印刷布BL之表面SF之墨水RI)之表面SF朝轉印板保持部2011之狀態保持之印刷布保持部,藉由設置於印刷布保持部2012之鉛垂上表面之吸附機構(省略圖示)而將印刷布BL吸附並保持。於該等保持部2011、2012連結有以馬達為驅動源之升降驅動部2013(圖2),若升降驅動部2013依照來自控制除去裝置1A之控制裝置500之動作指令而作動,如圖3之右上部所示般轉印板保持部2011向印刷布保持部2012降下,則印刷布BL與轉印板TP相互密接而形成密接體AB(參照圖3之右中央部)。此時,利用上述表面張力之差異而將附著物RI轉印至轉印板TP。再者,於本實施形態中,以僅轉印板保持部2011升降而相對於印刷布保持部2012接近及分開之方式構成,但亦可以僅印刷布保持部2012升降、或使兩保持部2011、2012相互朝相反方向升降之方式構成。關於該點,於以下說明之剝離裝置301或以後說明之轉印/剝離裝置中亦相同。 The removal device 1A includes a transfer device 201 that performs a transfer process, a peeling device 301 that performs a peeling process, and a transfer device 401 that transports the printing cloth BL and the transfer sheet TP. In the transfer device 201, as shown in the upper right portion of FIG. 3, the two holding portions 2011 and 2012 are disposed so as to be close to each other and freely separable in the vertical axis direction Z. The holding portion 2011 disposed on the upper side is a transfer plate holding portion that holds the transfer plate TP downward, and is provided by an adsorption mechanism (not shown) provided on the vertical lower surface of the transfer plate holding portion 2011. The transfer plate TP is adsorbed and held. The other holding portion 2012 is such that the printing cloth BL is attached to the surface SF of the attached material (here, the ink RI remaining on the surface SF of the printing cloth BL by forming the pattern layer on the substrate) toward the transfer sheet holding portion 2011. The printing cloth holding portion held in the state is sucked and held by the suction mechanism (not shown) provided on the vertical upper surface of the printing cloth holding portion 2012. The elevation drive unit 2013 (FIG. 2) that uses a motor as a drive source is connected to the holding units 2011 and 2012, and the elevation drive unit 2013 is actuated in accordance with an operation command from the control device 500 of the control removal device 1A, as shown in FIG. When the transfer sheet holding portion 2011 is lowered toward the printing cloth holding portion 2012 in the upper right portion, the printing cloth BL and the transfer sheet TP are in close contact with each other to form the close contact body AB (see the right central portion in FIG. 3). At this time, the deposit RI is transferred to the transfer sheet TP by the difference in surface tension described above. In the present embodiment, only the transfer sheet holding portion 2011 is moved up and down with respect to the printing cloth holding portion 2012. However, only the printing cloth holding portion 2012 may be lifted or lowered, or the two holding portions 2011 may be provided. 2012 is configured to move up and down in opposite directions. This point is also the same in the peeling device 301 described below or the transfer/disbonding device described later.

於剝離裝置301中,如圖3之右中央部及右下部所示,2個保持部 3011、3012配置成於鉛垂軸方向Z上相互接近及分開自如。該等中配置於上方側之保持部3011係構成為可自上方保持密接體AB之轉印板TP之轉印板保持部,藉由設置於轉印板保持部3011之鉛垂下表面之吸附機構(省略圖示)而將轉印板TP吸附並保持。另一個保持部3012係自下方保持密接體AB之印刷布BL之印刷布保持部,藉由設置於印刷布保持部3012之鉛垂上表面之吸附機構(省略圖示)而將印刷布BL吸附並保持。於該等保持部3011、3012連結有以馬達為驅動源之升降驅動部3013(圖2),若升降驅動部3013依照來自控制裝置500之動作指令而作動,如圖3之右下部所示般轉印板保持部3011向印刷布保持部3012降下,則與密接體AB之轉印板TP抵接並進行吸附保持。繼而,若轉印板保持部3011於保持有轉印板TP之狀態下上升,則轉印板TP自印刷布BL剝離,附著物RI自印刷布BL完全移動至轉印板TP而被除去。 In the peeling device 301, as shown in the right central portion and the lower right portion of FIG. 3, two holding portions 3011 and 3012 are arranged to be close to each other and freely separated in the vertical axis direction Z. The holding portion 3011 disposed on the upper side is configured as a transfer plate holding portion that can hold the transfer plate TP of the adhesion body AB from above, and the adsorption mechanism provided on the vertical lower surface of the transfer plate holding portion 3011 The transfer plate TP is adsorbed and held (not shown). The other holding portion 3012 is a printing cloth holding portion that holds the printing cloth BL of the adhesive body AB from below, and the printing cloth BL is adsorbed by an adsorption mechanism (not shown) provided on the vertical upper surface of the printing cloth holding portion 3012. And kept. The elevation drive unit 3013 (FIG. 2) that uses a motor as a drive source is coupled to the holding portions 3011 and 3012, and the elevation drive unit 3013 operates in accordance with an operation command from the control device 500, as shown in the lower right portion of FIG. When the transfer sheet holding portion 3011 is lowered toward the printing cloth holding portion 3012, the transfer sheet holding portion 3011 is brought into contact with the transfer sheet TP of the close contact AB to be adsorbed and held. Then, when the transfer sheet holding portion 3011 is raised in a state in which the transfer sheet TP is held, the transfer sheet TP is peeled off from the printing sheet BL, and the attached matter RI is completely moved from the printing sheet BL to the transfer sheet TP to be removed.

搬送裝置401具備:搬送部402,其包含搬送機器人等搬送機構;印刷布交接部403,其於裝置外部與搬送部402之間進行印刷布BL之交接;及轉印板交接部404,其於裝置外部與搬送部402之間進行轉印板TP之交接。而且,搬送部402可依照來自控制裝置500之動作指令而執行以下搬送,即,(1)將自裝置外部提供至印刷布交接部403之印刷布BLi搬入至轉印裝置201;(2)將自裝置外部提供至轉印板交接部404之轉印板TP0搬入至轉印裝置201;(3)將於轉印裝置201中製作之密接體AB(參照圖3)搬送至剝離裝置301;(4)將藉由剝離裝置301剝離後之印刷布BL0搬出至印刷布交接部403;(5)將藉由剝離裝置301剝離後之轉印板TPi搬出至轉印板交接部 404。 The conveying device 401 includes a conveying unit 402 including a conveying mechanism such as a conveying robot, a printing cloth delivery unit 403 that transfers the printing cloth BL between the outside of the apparatus and the conveying unit 402, and a transfer sheet delivery unit 404. The transfer plate TP is transferred between the outside of the apparatus and the transfer unit 402. Further, the conveyance unit 402 can perform the following conveyance in accordance with an operation command from the control device 500, that is, (1) carry the printing cloth BLi supplied from the outside of the apparatus to the printing cloth delivery unit 403 to the transfer device 201; (2) The transfer plate TP0 supplied from the outside of the device to the transfer plate delivery portion 404 is carried into the transfer device 201; (3) the adhesion body AB (see FIG. 3) produced in the transfer device 201 is transported to the peeling device 301; 4) The printed cloth BL0 peeled off by the peeling device 301 is carried out to the printing cloth delivery portion 403; (5) the transfer sheet TPi peeled off by the peeling device 301 is carried out to the transfer sheet intersection portion 404.

如上所述般構成之除去裝置1A之各部係藉由控制裝置500而控制。如圖2所示,控制裝置500具備管理裝置整體之動作之CPU(Central Processing Unit,中央處理單元)501、控制設置於各部之馬達之馬達控制部502、控制設置於各部之控制閥類之閥控制部503、及產生供給至吸附機構之負壓之負壓供給部504。再者,於可利用自外部供給之負壓之情形時,控制裝置500亦可不具備負壓供給部504。 Each part of the removal device 1A configured as described above is controlled by the control device 500. As shown in FIG. 2, the control device 500 includes a CPU (Central Processing Unit) 501 that manages the entire operation of the device, a motor control unit 502 that controls the motors provided in the respective units, and a valve that controls the control valves provided in each unit. The control unit 503 and a negative pressure supply unit 504 that generates a negative pressure supplied to the adsorption mechanism. Further, when the negative pressure supplied from the outside is available, the control device 500 may not include the negative pressure supply unit 504.

其次,對藉由如上所述般構成之除去裝置1A自印刷布BLi除去作為附著物之一例之殘留墨水RI的除去處理進行說明。該除去裝置1A中,如圖3所示,CPU501依照預先記憶於控制裝置500所配備之記憶體(省略圖示)中之除去程式而控制裝置各部,執行除去處理。自裝置外部將印刷布BLi載置於印刷布交接部403後,搬送部402之手(省略圖示)接收該印刷布BLi。繼而,搬送部402將印刷布BLi搬入至轉印裝置201,且如圖3之右上部所示般以使印刷布BLi之表面SF、即附著有殘留墨水RI之一主面朝轉印板保持部2011之狀態載置於印刷布保持部2012(步驟S11)。繼而,藉由印刷布保持部2012之吸附機構吸附保持印刷布BLi。 Next, the removal process of removing the residual ink RI as an example of the deposit from the printing cloth BLi by the removal device 1A configured as described above will be described. In the removal device 1A, as shown in FIG. 3, the CPU 501 controls the respective devices in accordance with the removal program stored in the memory (not shown) provided in the control device 500 in advance, and performs the removal processing. The printing cloth BLi is placed on the printing cloth delivery unit 403 from the outside of the apparatus, and the hand (not shown) of the conveying unit 402 receives the printing cloth BLi. Then, the conveyance unit 402 carries the printing cloth BLi to the transfer device 201, and as shown in the upper right portion of FIG. 3, the surface SF of the printing cloth BLi, that is, the main surface to which the residual ink RI is attached, is held toward the transfer sheet. The state of the part 2011 is placed on the printing cloth holding unit 2012 (step S11). Then, the printing cloth BLi is adsorbed and held by the suction mechanism of the printing cloth holding portion 2012.

又,搬送部402之手接收預先自裝置外部提供至轉印板交接部404之轉印板TP0,且搬入至轉印裝置201(步驟S12)。於該時間點,轉印板保持部2011於鉛垂軸方向Z上充分地分開印刷布保持部2012。繼而,如圖3之右上部所示,以與已吸附保持於印刷布保持部2012上之印刷布BLi之表面SF整體重疊之方式定位轉印板TP0,且於該狀態下藉由轉印板保持部2011之吸附機構而吸附保持。再者,於本實施形態中,以印刷布BLi及轉印板TP0之順序搬入至轉印裝置201,但亦可將該順序調換,或者亦可以如下方式構成,即,預先準備印刷布專用手與轉印板專用手,藉由使兩者同時地動作而同時進行上述搬入動作及 以下說明之搬出動作。 Moreover, the hand of the conveyance unit 402 receives the transfer plate TP0 supplied from the outside of the apparatus to the transfer sheet delivery unit 404, and carries it to the transfer device 201 (step S12). At this point of time, the transfer sheet holding portion 2011 sufficiently separates the printing cloth holding portion 2012 in the vertical axis direction Z. Then, as shown in the upper right portion of FIG. 3, the transfer plate TP0 is positioned so as to overlap integrally with the surface SF of the printing cloth BLi that has been adsorbed and held on the printing cloth holding portion 2012, and in this state, by the transfer plate The adsorption mechanism of the holding unit 2011 is adsorbed and held. In the present embodiment, the transfer device BLi and the transfer plate TP0 are loaded into the transfer device 201 in this order. However, the order may be reversed or may be configured as follows: And the hand for the transfer plate, while performing the above-described carry-in operation by simultaneously operating both of them The moving out operation will be described below.

繼而,藉由升降驅動部2013使轉印板保持部2011降下,使印刷布BL與轉印板TP相互密接而形成密接體AB(參照圖3之右中央部),藉此將作為附著物之殘留墨水RI轉印至轉印板TP(步驟S13)。再者,自密接體AB之形成經過一定時間後,解除轉印板保持部2011之吸附機構對轉印板TP之吸附,其後藉由升降驅動部2013使轉印板保持部2011上升而分開密接體AB。 Then, the transfer plate holding portion 2011 is lowered by the elevation drive unit 2013, and the printing cloth BL and the transfer plate TP are in close contact with each other to form the adhesion body AB (see the right central portion in FIG. 3), thereby serving as a deposit. The residual ink RI is transferred to the transfer sheet TP (step S13). Further, after a certain period of time has elapsed since the formation of the self-adhesive body AB, the suction mechanism of the transfer plate holding portion 2011 is released from the transfer plate TP, and then the transfer plate holding portion 2011 is raised by the elevation drive unit 2013. Close contact AB.

於下一步驟S14中,解除印刷布保持部2012之吸附機構對密接體AB之吸附保持,其後藉由搬送部402之手將密接體AB搬送至剝離裝置301,且將密接體AB之印刷布BL載置於印刷布保持部3012(步驟S14)。繼而,藉由印刷布保持部3012之吸附機構吸附印刷布BL,且保持密接體AB。 In the next step S14, the suction mechanism of the printing cloth holding unit 2012 is released from the suction body AB, and then the adhesion body AB is conveyed to the peeling device 301 by the hand of the conveying unit 402, and the printing of the adhesive body AB is performed. The cloth BL is placed on the printing cloth holding portion 3012 (step S14). Then, the printing cloth BL is sucked by the suction mechanism of the printing cloth holding portion 3012, and the adhesion body AB is held.

為將以此方式搬入至剝離裝置301之密接體AB分離為印刷布BL與轉印板TP,藉由升降驅動部3013使轉印板保持部3011降下而抵接於密接體AB之轉印板TP。繼而,藉由轉印板保持部3011之吸附機構吸附保持轉印板TP,且維持該保持狀態地藉由升降驅動部3013使轉印板保持部3011上升。藉此,自印刷布BL剝離轉印板TP(步驟S15)。此時,殘留墨水RI以附著於轉印板TP之狀態與轉印板TP一併向上方移動,密接體AB被分離為轉印板TPi、與除去殘留墨水RI後之印刷布BL0。 The transfer body AB that has been carried into the peeling device 301 in this manner is separated into the printing cloth BL and the transfer plate TP, and the transfer plate holding portion 3011 is lowered by the elevation driving portion 3013 to abut the transfer plate of the bonding body AB. TP. Then, the transfer plate TP is sucked and held by the suction mechanism of the transfer-plate holding portion 3011, and the transfer-plate holding portion 3011 is raised by the elevation drive unit 3013 while maintaining the held state. Thereby, the transfer sheet TP is peeled off from the printing cloth BL (step S15). At this time, the residual ink RI moves upward together with the transfer plate TP in a state of adhering to the transfer plate TP, and the adherend AB is separated into the transfer plate TPi and the printed cloth BL0 from which the residual ink RI is removed.

將該等中之印刷布BL0藉由搬送部402而搬出至印刷布交接部403(步驟S16),其後將轉印板TPi藉由搬送部402而搬出至轉印板交接部404(步驟S17)。當然,搬出順序並不限定於此,可將搬出順序調換,亦可構成為將兩者同時搬出。關於該點,於第2實施形態中亦相同。再者,如此搬出之印刷布BL0直接被搬送至塗佈裝置(於印刷布BL0之表面SF塗佈墨水而形成塗佈層之裝置)進行再利用。另一方 面,轉印板TPi被搬送至轉印板清洗裝置(省略圖示)而接受清洗步驟。關於該清洗步驟之一例,將於以下詳述。 The printing cloth BL0 in the middle is carried out to the printing cloth delivery unit 403 by the conveying unit 402 (step S16), and then the transfer sheet TPi is carried out to the transfer sheet delivery unit 404 by the conveying unit 402 (step S17). ). Of course, the order of carrying out is not limited to this, and the order of carrying out may be reversed, or both may be carried out at the same time. This point is also the same in the second embodiment. In addition, the printing cloth BL0 thus carried out is directly conveyed to a coating device (an apparatus which applies an ink on the surface SF of the printing cloth BL0 to form a coating layer) and reuses it. The other side On the surface, the transfer plate TPi is conveyed to a transfer plate cleaning device (not shown) to receive a cleaning step. An example of this washing step will be described in detail below.

如以上般,於本實施形態中,使轉印板TP密接於附著有殘留墨水RI之印刷布之一主面而將殘留墨水RI轉印至轉印板TP(轉印步驟)之後,使轉印板TP於擔載有殘留墨水RI之狀態下自印刷布BL剝離,從而自印刷布BL之表面SF除去殘留墨水RI(剝離步驟)。因此,可有效率地進行殘留墨水RI自印刷布BL之除去。 As described above, in the present embodiment, the transfer sheet TP is adhered to one main surface of the printing cloth to which the residual ink RI is adhered, and the residual ink RI is transferred to the transfer sheet TP (transfer step), and then the transfer is performed. The printing plate TP is peeled off from the printing cloth BL while the residual ink RI is being carried, and the residual ink RI is removed from the surface SF of the printing cloth BL (peeling step). Therefore, the removal of the residual ink RI from the printing cloth BL can be efficiently performed.

又,由於以使用轉印板TP之乾式方式除去殘留墨水RI,故而亦可取得以下之作用效果。作為自印刷布BL除去附著物之方法,可利用例如日本專利特開平9-155306號公報或日本專利特開2006-41439號公報等中記載之清洗方法。即,一面藉由滾子搬送(輥搬送)而搬送印刷布一面對印刷布之表面供給水或藥液等處理液而進行所謂濕式清洗。該情形時,印刷布之表面部分即矽橡膠層因處理液而膨潤之可能性較大,而無法將除去附著物(濕式清洗)後之印刷布直接再利用,必須於塗佈墨水等塗佈材料之前調整印刷布之表面狀態。因此,必須另外設置具備加熱板之烘烤裝置或具備減壓腔之乾燥裝置,從而不可避免地造成除去裝置之大型化及高成本化。又,於將濕式清洗與烘烤處理(或乾燥處理)組合之除去裝置中,於每次印刷布之再利用均會產生矽橡膠層之膨潤與收縮,從而矽橡膠層之劣化劇烈,導致運轉費用之增大。相對於此,於本實施形態中,藉由基於利用表面張力之差異之物理作用之轉印技術而謀求附著物之除去,故而無需追加設置烘烤裝置或乾燥裝置等,而且可不使印刷布之表面狀態顯著變化地除去附著物。其結果,可以小型且低成本地重複使用印刷布。 Moreover, since the residual ink RI is removed by the dry method using the transfer plate TP, the following effects can be obtained. As a method of removing the deposit from the printing cloth BL, for example, a cleaning method described in JP-A-H09-155306 or JP-A-2006-41439 can be used. In other words, the printing cloth is conveyed by roller conveyance (roll conveyance), and a so-called wet cleaning is performed by supplying a treatment liquid such as water or a chemical liquid to the surface of the printing cloth. In this case, the surface portion of the printing cloth, that is, the enamel rubber layer is likely to swell due to the treatment liquid, and the printing cloth after removing the adhering matter (wet cleaning) cannot be directly reused, and it is necessary to apply the coating ink or the like. Adjust the surface condition of the printed cloth before the cloth material. Therefore, it is necessary to additionally provide a baking device having a heating plate or a drying device having a decompression chamber, which inevitably causes an increase in size and cost of the removal device. Moreover, in the apparatus for removing the wet cleaning and the baking treatment (or the drying treatment), the squeezing and shrinking of the ruthenium rubber layer occurs every time the printing cloth is reused, so that the deterioration of the ruthenium rubber layer is severe, resulting in severe deterioration. The increase in operating costs. On the other hand, in the present embodiment, since the deposit is removed by the transfer technique based on the physical action of the difference in surface tension, it is not necessary to additionally provide a baking device, a drying device, or the like, and the printing cloth can be omitted. The surface state is markedly changed to remove the deposits. As a result, the printed cloth can be reused in a small and low cost.

如上所述,於第1實施形態中,轉印板TP及印刷布BL分別相當於本發明之「轉印體」及「板狀體」之一例。而且,轉印板保持部2011、3011分別相當於本發明之「第1轉印體保持部」及「第2轉印體 保持部」之一例。又,印刷布保持部2012、3012分別相當於本發明之「第1板狀體保持部」及「第2板狀體保持部」之一例。又,升降驅動部2013、3013分別相當於本發明之「第1驅動部」及「第2驅動部」之一例。又,步驟S13及S15分別相當於本發明之「轉印步驟」及「剝離步驟」之一例。 As described above, in the first embodiment, the transfer plate TP and the printing cloth BL correspond to an example of the "transfer body" and the "plate-like body" of the present invention, respectively. Further, the transfer plate holding portions 2011 and 3011 correspond to the "first transfer body holding portion" and the "second transfer member" of the present invention, respectively. An example of a holding unit. In addition, the printing cloth holding units 2012 and 3012 are respectively an example of the "first plate-shaped body holding portion" and the "second plate-shaped body holding portion" of the present invention. Further, the elevation drive units 2013 and 3013 correspond to an example of the "first drive unit" and the "second drive unit" of the present invention, respectively. Further, steps S13 and S15 correspond to an example of the "transfer step" and the "peeling step" of the present invention, respectively.

<第2實施形態> <Second embodiment>

圖4係表示本發明之除去裝置之第2實施形態之俯視圖。又,圖5係表示圖4所示之除去裝置之動作之圖,於該圖中圖示有動作流程及動作之模式圖。本第2實施形態與第1實施形態較大之不同點在於,代替設置轉印裝置201及剝離裝置301而設置有於同一裝置內進行轉印步驟與剝離步驟之轉印/剝離裝置601,其他構成基本上與第1實施形態相同。以下,以不同點為中心進行說明,對於相同構成標註相同符號而省略說明。 Fig. 4 is a plan view showing a second embodiment of the removing device of the present invention. 5 is a view showing the operation of the removing device shown in FIG. 4, and a schematic diagram showing the operation flow and the operation is shown in the drawing. The second embodiment differs greatly from the first embodiment in that a transfer/disbonding device 601 that performs a transfer step and a peeling step in the same device is provided instead of the transfer device 201 and the peeling device 301. The configuration is basically the same as that of the first embodiment. In the following description, the same reference numerals will be given to the same components, and description thereof will be omitted.

第2實施形態之除去裝置1B中,與搬送裝置401鄰接地配置有轉印/剝離裝置601。於該轉印/剝離裝置601中,如圖5之右上部所示,2個保持部6011、6012配置成於鉛垂軸方向Z上相互接近及分開自如。該等中配置於上方側之保持部6011係將轉印板TP朝下方保持之轉印板保持部,藉由設置於轉印板保持部6011之鉛垂下表面之吸附機構(省略圖示)而將轉印板TP吸附並保持。另一個保持部6012係將印刷布BL以使附著有殘留墨水RI之表面SF朝轉印板保持部6011之狀態保持之印刷布保持部,藉由設置於印刷布保持部6012之鉛垂上表面之吸附機構(省略圖示)而將印刷布BL吸附並保持。於轉印板保持部6011連結有以馬達為驅動源之升降驅動部6013,升降驅動部依照來自控制裝置500之動作指令而作動,如圖5之右上部所示般轉印板保持部6011向印刷布保持部6012降下,或如圖5之右下部所示般轉印板保持部6011向與印刷布保持部6012相反側上升。再者,於本實施形態中,升降驅動部 6013僅連結於轉印板保持部6011,但亦可以如下方式構成,即,升降驅動部6013僅連結於印刷布保持部6012而使印刷布保持部6012升降,或連結於兩保持部6011、6012而使兩保持部6011、6012升降。 In the removal device 1B of the second embodiment, a transfer/disbonding device 601 is disposed adjacent to the transfer device 401. In the transfer/disbonding device 601, as shown in the upper right portion of FIG. 5, the two holding portions 6011 and 6012 are disposed so as to be close to each other and freely separable in the vertical axis direction Z. The holding portion 6011 disposed on the upper side is a transfer plate holding portion that holds the transfer plate TP downward, and is provided by an adsorption mechanism (not shown) provided on the vertical lower surface of the transfer plate holding portion 6011. The transfer plate TP is adsorbed and held. The other holding portion 6012 is a printing cloth holding portion that holds the printing cloth BL in a state in which the surface SF to which the residual ink RI is adhered to the transfer sheet holding portion 6011, and is provided on the vertical upper surface of the printing cloth holding portion 6012. The printing cloth BL is sucked and held by the suction mechanism (not shown). An elevation drive unit 6013 that uses a motor as a drive source is coupled to the transfer plate holding unit 6011, and the elevation drive unit is actuated in accordance with an operation command from the control device 500. The transfer plate holding unit 6011 is oriented as shown in the upper right portion of FIG. The printing cloth holding portion 6012 is lowered, or the transfer plate holding portion 6011 is raised toward the opposite side of the printing cloth holding portion 6012 as shown in the lower right portion of FIG. Furthermore, in the present embodiment, the elevation drive unit 6013 is only connected to the transfer sheet holding portion 6011. However, the lift driving unit 6013 may be connected to the printing cloth holding portion 6012 to raise and lower the printing cloth holding portion 6012 or to the two holding portions 6011 and 6012. The two holding portions 6011 and 6012 are raised and lowered.

其次,對利用如上所述般構成之除去裝置1B之殘留墨水RI之除去處理進行說明。於該除去裝置1B中,如圖5所示,CPU501依照預先記憶於控制裝置500所配備之記憶體(省略圖示)中之除去程式而控制裝置各部,執行除去處理。於該除去裝置1B中,亦與第1實施形態同樣地,藉由搬送部402將印刷布BLi自印刷布交接部403搬入至轉印/剝離裝置601(步驟S21)並且將轉印板TP0自轉印板交接部404搬入至轉印/剝離裝置601(步驟S22)。再者,如圖5之右上部所示,以此方式搬入之印刷布BLi及轉印板TP0以於鉛垂軸方向Z上相互隔開並對向之方式定位,且分別吸附保持於印刷布保持部6012及轉印板保持部6011。再者,於本實施形態中,以印刷布BLi及轉印板TP0之順序搬入至轉印/剝離裝置601,但亦可將該順序調換,或者亦可以如下方式構成,即,預先準備印刷布專用手與轉印板專用手,藉由使兩者同時地動作而同時進行上述搬入動作及以下說明之搬出動作。 Next, the removal process of the residual ink RI by the removal device 1B configured as described above will be described. In the removal device 1B, as shown in FIG. 5, the CPU 501 controls the respective devices in accordance with the removal program stored in the memory (not shown) provided in the control device 500 in advance, and performs the removal processing. In the removal device 1B, the printing cloth BLi is carried from the printing cloth delivery unit 403 to the transfer/discharging device 601 by the conveying unit 402 (step S21) and the transfer plate TP0 is rotated. The plate delivery portion 404 is carried into the transfer/disbonding device 601 (step S22). Further, as shown in the upper right portion of FIG. 5, the printing cloth BLi and the transfer plate TP0 carried in this manner are spaced apart from each other in the vertical axis direction Z and positioned in a manner to be adsorbed and held on the printing cloth. The holding portion 6012 and the transfer sheet holding portion 6011. Further, in the present embodiment, the transfer cloth BLi and the transfer plate TP0 are carried in the order of the transfer/disbonding device 601. However, the order may be reversed or may be configured as follows: The special hand and the hand for the transfer plate are simultaneously operated by the two operations, and the above-described carry-in operation and the carry-out operation described below are simultaneously performed.

繼而,如圖5之右中部所示,藉由升降驅動部6013使轉印板保持部6011降下,使印刷布BLi與轉印板TP0相互密接而將殘留墨水RI轉印至轉印板TP(步驟S23)。以此方式完成轉印步驟後,藉由升降驅動部3013使轉印板保持部3011上升,將轉印板TP自印刷布BL剝離(步驟S24)。此時,殘留墨水RI在附著於轉印板TP之狀態下與轉印板TP一併向上方移動,從而分離為轉印板TPi與除去殘留墨水RI後之印刷布BL0。 Then, as shown in the right middle portion of FIG. 5, the transfer plate holding portion 6011 is lowered by the elevation driving portion 6013, and the printing cloth BLi and the transfer plate TP0 are brought into close contact with each other to transfer the residual ink RI to the transfer plate TP ( Step S23). After the transfer step is completed in this manner, the transfer plate holding portion 3011 is raised by the elevation drive unit 3013, and the transfer plate TP is peeled off from the printing cloth BL (step S24). At this time, the residual ink RI moves upward together with the transfer plate TP while being attached to the transfer plate TP, and is separated into the transfer sheet TPi and the printed cloth BL0 from which the residual ink RI is removed.

分離完成後藉由搬送部402將印刷布BL0搬出至印刷布交接部403(步驟S25),進而將轉印板TPi搬出至轉印板交接部404(步驟S26)。 After the separation is completed, the printing cloth BL0 is carried out to the printing cloth delivery unit 403 by the conveyance unit 402 (step S25), and the transfer sheet TPi is further carried out to the transfer sheet delivery unit 404 (step S26).

如以上般,於本實施形態中,亦於使轉印板TP0密接於印刷布 BLi之表面SF而將殘留墨水RI轉印至轉印板TP(轉印步驟)之後,使轉印板TP於擔載有殘留墨水RI之狀態下自印刷布BL剝離,從而自印刷布BL之表面SF除去殘留墨水RI(剝離步驟)。因此,可取得與第1實施形態相同之作用效果。而且,於第2實施形態中,於轉印/剝離裝置601中連續地執行轉印步驟及剝離步驟,故而與第1實施形態相比可使除去裝置之構成簡化。 As described above, in the present embodiment, the transfer sheet TP0 is also adhered to the printing cloth. After the residual ink RI is transferred to the transfer plate TP (transfer step) on the surface SF of the BLi, the transfer plate TP is peeled off from the printing cloth BL in a state where the residual ink RI is carried, thereby being printed from the printing cloth BL. The surface SF removes residual ink RI (peeling step). Therefore, the same operational effects as those of the first embodiment can be obtained. Further, in the second embodiment, since the transfer step and the peeling step are continuously performed in the transfer/peeling device 601, the configuration of the removing device can be simplified as compared with the first embodiment.

如上所述,於第2實施形態中,轉印板保持部6011、印刷布保持部6012及升降驅動部6013分別相當於本發明之「轉印體保持部」、「板狀體保持部」及「驅動部」之一例。 As described above, in the second embodiment, the transfer sheet holding portion 6011, the printing cloth holding portion 6012, and the elevation driving portion 6013 correspond to the "transfer body holding portion" and the "plate-shaped body holding portion" of the present invention, respectively. An example of the "driver".

<第3實施形態> <Third embodiment>

於第1實施形態及第2實施形態中,使用轉印板TP作為本發明之「轉印體」,但亦可代替轉印板TP而使用圓筒或圓柱形狀之轉印輥(或轉印鼓)。以下,一面參照圖6A~圖6D一面對本發明之第3實施形態進行說明。 In the first embodiment and the second embodiment, the transfer plate TP is used as the "transfer body" of the present invention, but a cylindrical or cylindrical transfer roller (or transfer) may be used instead of the transfer plate TP. drum). Hereinafter, a third embodiment of the present invention will be described with reference to Figs. 6A to 6D.

圖6A~圖6D係表示本發明之除去裝置之第3實施形態之圖,圖6A係第3實施形態之除去裝置之側視圖,圖6B~圖6D係模式性表示該除去裝置之動作之圖。於該除去裝置1C中,將複數之輥4071隔開特定間隔沿X方向配置,藉由該等輥4071而構成使印刷布BL於X方向移動之移動部407。於該移動部407中,馬達等驅動源依照來自控制裝置500之移動指令而作動,複數之輥4071朝特定方向(於圖6A~圖6D之紙面上為逆時針方向)旋轉。藉此,藉由滾子搬送(輥搬送)以將表面SF附著有殘留墨水RI之印刷布BLi之表面SF朝鉛垂上方之姿勢沿X方向移動印刷布BLi。 6A to 6D are views showing a third embodiment of the removing device of the present invention, Fig. 6A is a side view of the removing device of the third embodiment, and Figs. 6B to 6D are diagrams schematically showing the operation of the removing device. . In the removal device 1C, a plurality of rollers 4071 are arranged in the X direction at a predetermined interval, and the rollers 4071 constitute a moving portion 407 for moving the printing cloth BL in the X direction. In the moving unit 407, a driving source such as a motor is actuated in accordance with a movement command from the control device 500, and a plurality of rollers 4071 rotate in a specific direction (counterclockwise on the paper surface of FIGS. 6A to 6D). Thereby, the printing cloth BLi is moved in the X direction by the roller conveyance (roll conveyance) so that the surface SF of the printing cloth BLi in which the residual ink RI adheres to the surface SF is vertically upward.

又,於複數之輥4071中位於密接位置CP之一輥4071之鉛垂上方,隔開與印刷布BLi之厚度相同或稍窄之間隔而旋轉自如地配置有轉印輥TR。該轉印輥TR係由其表面張力低於印刷布BL之表面SF之表 面張力、且具有較印刷布BL之表面SF更高之潤濕性的材料而形成,於Y方向上具有印刷布BLi之Y方向寬度以上之寬度,並且具有超出印刷布BLi之X方向長度之周長。又,該轉印輥TR連接於馬達等旋轉部408,旋轉部408接收來自控制裝置500之旋轉指令而作動,藉此轉印輥TR朝與印刷布BLi之移動從動之方向(於圖6A~圖6D之紙面上為順時針方向)旋轉。因此,於密接位置CP,印刷布BLi被轉印輥TR與輥40711夾入,且於該狀態下相對於轉印輥TR而於X方向移動。如此,與密接位置CP對應之輥4071作為轉印輥TR之支承輥而發揮功能,使轉印輥TR之周面與印刷布BLi之表面密接,從而將印刷布BLi上之殘留墨水RI轉印至轉印輥TR(轉印步驟)。如上所述,於第3實施形態中,使轉印輥TR之周面與印刷布BLi之表面密接之區域具有於Y方向延伸之線狀形狀,若如圖6B所示般藉由執行移動步驟而使殘留墨水RI移動至密接位置CP,則於該密接位置CP被轉印至轉印輥TR。 Further, in the plurality of rollers 4071, the transfer roller TR is rotatably disposed at a position vertically equal to or slightly narrower than the thickness of one of the rollers B07 of the close contact position CP. The transfer roller TR is made of a surface whose surface tension is lower than the surface SF of the printing cloth BL. It is formed of a material having a surface tension and a higher wettability than the surface SF of the printing cloth BL, and has a width in the Y direction of the printing cloth BLi in the Y direction width or more, and has a length exceeding the X direction of the printing cloth BLi. perimeter. Further, the transfer roller TR is connected to a rotating portion 408 such as a motor, and the rotating portion 408 receives a rotation command from the control device 500, whereby the transfer roller TR moves in a direction of movement from the printing cloth BLi (FIG. 6A). ~ The paper surface of Figure 6D is rotated clockwise). Therefore, at the adhesion position CP, the printing cloth BLi is sandwiched by the transfer roller TR and the roller 40711, and is moved in the X direction with respect to the transfer roller TR in this state. In this manner, the roller 4071 corresponding to the adhesion position CP functions as a backup roller of the transfer roller TR, and the peripheral surface of the transfer roller TR is in close contact with the surface of the printing cloth BLi, thereby transferring the residual ink RI on the printing cloth BLi. To the transfer roller TR (transfer step). As described above, in the third embodiment, the region in which the peripheral surface of the transfer roller TR is in close contact with the surface of the printing cloth BLi has a linear shape extending in the Y direction, and the moving step is performed as shown in FIG. 6B. When the residual ink RI is moved to the close contact position CP, the adhesion position CP is transferred to the transfer roller TR.

而且,繼該轉印步驟之後執行剝離步驟。即,藉由轉印輥TR之旋轉及印刷布BL之移動之進行,如圖6C所示,於相對於密接位置CP為(+X)方向側,轉印輥TR之周面一面擔載殘留墨水RI一面自印刷布BL剝離(剝離步驟)。藉此,分離為轉印輥TR之周面與除去殘留墨水RI後之印刷布BL0。 Moreover, the stripping step is performed after the transfer step. In other words, as the rotation of the transfer roller TR and the movement of the printing cloth BL progress, as shown in FIG. 6C, the peripheral surface of the transfer roller TR remains on the (+X) direction side with respect to the adhesion position CP. The ink RI is peeled off from the printing cloth BL (peeling step). Thereby, the peripheral surface of the transfer roller TR and the printed cloth BL0 after the residual ink RI is removed are separated.

如此,於第3實施形態中,藉由印刷布BL之X方向移動與轉印輥TR之旋轉而連續地進行沿X方向之印刷布BL對於周面部位之轉印步驟與剝離步驟。而且,於印刷布BL之末端部(-X方向側端部)通過密接位置CP之時間點,殘留墨水RI全部被轉印至轉印輥TR之周面。再者,於本實施形態中,為將轉印至轉印輥TR周面之殘留墨水RI自轉印輥TR之周面除去,對於下一印刷布BL亦進行相同之除去處理,而於轉印輥TR之附近設置有清洗裝置710。 As described above, in the third embodiment, the transfer step and the peeling step of the printing cloth BL in the X direction with respect to the peripheral surface portion are continuously performed by the movement of the printing cloth BL in the X direction and the rotation of the transfer roller TR. Further, at the time point when the end portion (the end portion on the −X direction side) of the printing cloth BL passes through the adhesion position CP, the residual ink RI is all transferred to the circumferential surface of the transfer roller TR. Further, in the present embodiment, the residual ink RI transferred to the peripheral surface of the transfer roller TR is removed from the peripheral surface of the transfer roller TR, and the same printing process is performed on the next printing cloth BL. A cleaning device 710 is provided in the vicinity of the roller TR.

該清洗裝置710具有清洗輥711與乾燥部712,且相對於轉印輥TR 接近及分開自如地設置。而且,如圖6D所示,若清洗裝置710依照來自控制裝置500之動作指令而相對於轉印輥TR進行接近移動,則清洗輥711抵接於轉印輥TR之周面而將轉印至該周面之殘留墨水RI除去、回收。再者,雖省略向圖6A~圖6D之圖示,但為除去殘留墨水RI而對清洗輥711之周面供給清洗液。因此,於本實施形態中,以利用乾燥部712使被清洗液潤濕之轉印輥TR之周面乾燥之方式構成。再者,於進行殘留墨水RI向轉印輥TR周面轉印之期間(圖6B及圖6C),控制裝置500係使清洗裝置710自轉印輥TR之周面退避,但亦可以始終抵接之方式構成。於如上所述般使清洗裝置710始終抵接於轉印輥TR之周面之情形時,亦可以轉印輥TR之周面成為印刷布BLi之X方向長度以下之方式構成轉印輥TR,藉此可謀求除去裝置1C之小型化。 The cleaning device 710 has a cleaning roller 711 and a drying portion 712 with respect to the transfer roller TR Close and separate settings. Further, as shown in FIG. 6D, when the cleaning device 710 moves close to the transfer roller TR in accordance with an operation command from the control device 500, the cleaning roller 711 abuts against the circumferential surface of the transfer roller TR and is transferred to The residual ink RI on the peripheral surface is removed and recovered. Further, although the illustrations of FIGS. 6A to 6D are omitted, the cleaning liquid is supplied to the circumferential surface of the cleaning roller 711 in order to remove the residual ink RI. Therefore, in the present embodiment, the peripheral surface of the transfer roller TR wetted by the cleaning liquid is dried by the drying unit 712. Further, during the period in which the residual ink RI is transferred onto the peripheral surface of the transfer roller TR (FIGS. 6B and 6C), the control device 500 retracts the cleaning device 710 from the peripheral surface of the transfer roller TR, but may always abut The way it is structured. When the cleaning device 710 is always in contact with the circumferential surface of the transfer roller TR as described above, the transfer roller TR may be configured such that the circumferential surface of the transfer roller TR is equal to or less than the length of the printing cloth BLi in the X direction. Thereby, it is possible to reduce the size of the apparatus 1C.

如以上般,於第3實施形態中,使用轉印輥TR作為本發明之「轉印體」,且與第1實施形態或第2實施形態同樣地,在將殘留墨水RI轉印至轉印輥TR(轉印步驟)之後,使轉印輥TR於擔載有殘留墨水RI之狀態下自印刷布BL剝離,從而自印刷布BL之表面SF除去殘留墨水RI(剝離步驟)。因此,可有效率地進行殘留墨水RI自印刷布BL之除去。 As described above, in the third embodiment, the transfer roller TR is used as the "transfer body" of the present invention, and the residual ink RI is transferred to the transfer as in the first embodiment or the second embodiment. After the roller TR (transfer step), the transfer roller TR is peeled off from the printing cloth BL while the residual ink RI is being carried, and the residual ink RI is removed from the surface SF of the printing cloth BL (peeling step). Therefore, the removal of the residual ink RI from the printing cloth BL can be efficiently performed.

又,利用清洗裝置710進行轉印輥TR之周面清洗,故而可重複地連續進行對印刷布BL之除去步驟。因此,可提高除去裝置1C之工作效率。 Further, since the cleaning of the peripheral surface of the transfer roller TR is performed by the cleaning device 710, the step of removing the printing cloth BL can be continuously performed repeatedly. Therefore, the work efficiency of the removal device 1C can be improved.

<第4實施形態> <Fourth embodiment>

於上述第1實施形態~第3實施形態中,獨立地設置有除去裝置1A~1C,但亦可以如下方式構成,即,將本發明之除去裝置組入印刷系統中,而執行(1)於印刷布BL上形成塗佈層之塗佈處理;(2)使塗佈層圖案化而形成圖案層之後將該圖案層轉印至基板之印刷處理;及(3)自用於將圖案層轉印至基板後之印刷布除去殘留墨水之除去處 理。以下,一面參照圖7~圖15、圖16A~圖16C、圖17A~圖17C、圖18A、圖18B、圖19A~圖19C、圖20A~圖20C、圖21A~圖21C、圖22A~圖22C、圖23~圖25、圖26A~圖26D、圖27A~圖27D、及圖28,一面針對印刷系統100之一例,於說明系統之概略構成及構成之配置佈局之後詳細敍述各部之構成。 In the first to third embodiments, the removal devices 1A to 1C are separately provided. However, the removal device of the present invention may be incorporated in the printing system to perform (1) a coating process for forming a coating layer on the printing cloth BL; (2) a printing process of patterning the coating layer to form a pattern layer, and then transferring the pattern layer to the substrate; and (3) transferring the pattern layer Remove the residual ink from the printed cloth behind the substrate Reason. Hereinafter, reference is made to FIGS. 7 to 15 , FIGS. 16A to 16C , FIGS. 17A to 17C , FIGS. 18A , 18B , 19A to 19C , 20A to 20C , 21A to 21C , and 22A to FIG . 22C, FIG. 23 to FIG. 25, FIG. 26A to FIG. 26D, FIG. 27A to FIG. 27D, and FIG. 28, the configuration of each unit will be described in detail after describing the schematic configuration of the system and the arrangement layout of the configuration of the printing system 100.

<<印刷系統之構成及佈局>> <<The composition and layout of the printing system>>

圖7係表示配備本發明之除去裝置之第4實施形態之印刷系統之一例之圖。又,圖8係表示圖7所示之除去裝置之控制系統之方塊圖。該印刷系統100包含用以執行上述塗佈處理之塗佈裝置800、用以執行上述印刷處理中使塗佈層圖案化之圖案化處理之轉印裝置202及剝離裝置302、用以執行上述印刷處理中將圖案層轉印至基板之轉印處理之轉印裝置203及剝離裝置303、以及用以執行上述除去處理之轉印裝置204及剝離裝置304。 Fig. 7 is a view showing an example of a printing system equipped with a fourth embodiment of the removing device of the present invention. Further, Fig. 8 is a block diagram showing a control system of the removing device shown in Fig. 7. The printing system 100 includes a coating device 800 for performing the coating process, a transfer device 202 and a peeling device 302 for performing a patterning process for patterning a coating layer in the printing process, to perform the printing. The transfer device 203 and the peeling device 303 for transferring the pattern layer to the substrate during the process, and the transfer device 204 and the peeling device 304 for performing the above-described removal process.

轉印裝置202及剝離裝置302排列於X方向上而形成圖案化處理用之第1裝置排AL1。又,轉印裝置203及剝離裝置303排列於Y方向上而形成轉印處理用之第2裝置排AL2。進而,轉印裝置204、剝離裝置304及塗佈裝置800排列於X方向上而形成除去處理及塗佈處理用之第3裝置排AL3。而且,如圖7所示,第1裝置排AL1與第3裝置排AL3於Y方向上隔開且平行地配置,並且於第1裝置排AL1及第3裝置排AL3之(+X)方向側配置有第2裝置排AL2,從而沿環狀之印刷布搬送路徑PTB自如地循環搬送印刷布BL。 The transfer device 202 and the peeling device 302 are arranged in the X direction to form the first device row AL1 for patterning processing. Further, the transfer device 203 and the peeling device 303 are arranged in the Y direction to form the second device row AL2 for transfer processing. Further, the transfer device 204, the peeling device 304, and the coating device 800 are arranged in the X direction to form the third device row AL3 for the removal process and the coating process. Further, as shown in FIG. 7, the first device row AL1 and the third device row AL3 are arranged in parallel in the Y direction and are arranged in parallel, and are on the (+X) direction side of the first device row AL1 and the third device row AL3. The second device row AL2 is disposed, and the printing cloth BL is circulated and conveyed freely along the ring-shaped printing cloth transport path PTB.

於第1裝置排AL1(=轉印裝置202+剝離裝置302)之(+Y)方向側,配置有清洗版PP之版清洗裝置720,從而沿環狀之版搬送路徑PTP自如地搬送用於圖案化處理之版PP。再者,圖7中之「PPi」及「PP0」表示搬送至版清洗裝置720之前後之版,版PPi係指用於圖案化處理而於表面附著有墨水之版,版PP0係指經版清洗裝置720清洗而再利用於 圖案化處理之版。 On the (+Y) direction side of the first device row AL1 (=transfer device 202+peeling device 302), a cleaning plate PP cleaning device 720 is disposed, and is transported freely along the ring-shaped plate transport path PTP for Patterned version of PP. In addition, "PPi" and "PP0" in Fig. 7 indicate the version before and after being transported to the plate cleaning device 720, and the plate PPi is a plate for patterning and having ink adhered on the surface, and the version PP0 is a warp version. The cleaning device 720 is cleaned and reused Patterned version.

又,於第3裝置排AL3(=轉印裝置204+剝離裝置304+塗佈裝置800)之(-Y)方向側,配置有清洗轉印板TP之轉印板清洗裝置730,從而沿環狀之轉印板搬送路徑PTT自如地搬送用於除去處理之轉印板TP。 Further, on the (-Y) direction side of the third device row AL3 (=transfer device 204+peeling device 304+coating device 800), a transfer plate cleaning device 730 for cleaning the transfer plate TP is disposed so as to be along the ring The transfer sheet transfer path PTT of the shape transfers the transfer sheet TP for removal processing.

圖7中之虛線PTS表示為利用第2裝置排AL2(=轉印裝置203+剝離裝置303)進行轉印處理而搬送基板SB之路徑、即基板搬送路徑。 The broken line PTS in FIG. 7 indicates a path for transporting the substrate SB by the transfer processing by the second device row AL2 (=transfer device 203+peeling device 303), that is, the substrate transport path.

又,於印刷系統100中,為搬送印刷布BL、版PP、基板SB及轉印板TP而設置有搬送裝置401。搬送裝置401包含複數之搬送部402、複數之印刷布交接部403、複數之轉印板交接部404、複數之版交接部405及複數之基板交接部406,且配置於印刷布搬送路徑PTB、版搬送路徑PTP、轉印板搬送路徑PTT及基板搬送路徑PTS上。 Further, in the printing system 100, a conveying device 401 is provided to convey the printing cloth BL, the plate PP, the substrate SB, and the transfer plate TP. The conveying device 401 includes a plurality of conveying units 402, a plurality of printing cloth delivery units 403, a plurality of transfer sheet delivery units 404, a plurality of plate delivery portions 405, and a plurality of substrate delivery portions 406, and are disposed on the printing cloth transport path PTB, The plate transport path PTP, the transfer plate transport path PTT, and the substrate transport path PTS.

該印刷系統100中,印刷布BL以使表面SF(形成有塗佈層或圖案層,且於轉印處理後附著有殘留墨水之印刷布BL之一主面)始終朝鉛垂上方、即朝(+Z)方向之狀態接受各種處理。因此,於印刷布搬送路徑PTB以外之搬送路徑PTP、PTT、PTS中之至少與印刷布搬送路徑PTB重疊之路徑部分,版PP、基板SB及轉印板TP係以使要接觸印刷布BL之一主面朝鉛垂下方、即朝(-Z)方向之狀態搬送。因此,於印刷系統100中,對搬送版PP、基板SB或轉印板TP之搬送部402之一部分配備有使手(省略圖示)翻轉之翻轉機構,從而可使版PP、基板SB或轉印板TP之主面翻轉。因此,於圖7中,對具有翻轉機構之搬送部402標註雙層圓形記號,另一方面,對不具有翻轉機構之搬送部402標註圓形記號以將兩者加以區別。 In the printing system 100, the printing cloth BL is such that the surface SF (the main surface of one of the printing cloths BL on which the coating layer or the pattern layer is formed and the residual ink adheres after the transfer process) is always vertically upward, that is, The state of the (+Z) direction accepts various processes. Therefore, the plate PP, the substrate SB, and the transfer plate TP are made to contact the printing cloth BL at a path portion of at least the transport path PTP, PTT, and PTS that overlaps the printing cloth transport path PTB except the printing cloth transport path PTB. The main surface is conveyed in a state of being vertically downward, that is, in the (-Z) direction. Therefore, in the printing system 100, one of the conveying portions 402 of the conveying plate PP, the substrate SB, or the transfer plate TP is provided with an inverting mechanism that reverses the hand (not shown), so that the plate PP, the substrate SB or the rotation can be made. The main surface of the printing plate TP is flipped. Therefore, in FIG. 7, the conveyance part 402 which has a reversing mechanism is marked with the double-layer circular mark, and the conveyance part 402 which does not have the reversing mechanism is marked with the circular mark to distinguish the both.

如上所述般佈局之印刷系統100之各部藉由控制裝置500而控制。如圖8所示,控制裝置500具備管理系統整體之動作之CPU501、控制設置於各裝置中之馬達之馬達控制部502、控制設置於各裝置中 之控制閥類之閥控制部503、產生供給至各裝置之負壓之負壓供給部504、對由相機拍攝之圖像實施圖像處理之圖像處理部505、及供給乾燥空氣或惰性氣體等氣體之氣體供給部506。再者,此處藉由控制裝置500直接控制系統各部,但當然亦可以如下方式構成,即,由個別之控制裝置而控制各裝置,並且主機藉由通信而控制各控制裝置。 The various portions of the printing system 100 arranged as described above are controlled by the control device 500. As shown in FIG. 8, the control device 500 includes a CPU 501 that manages the operation of the entire system, a motor control unit 502 that controls motors provided in each device, and control settings in each device. The valve control unit 503 of the control valve type, the negative pressure supply unit 504 that generates the negative pressure supplied to each device, the image processing unit 505 that performs image processing on the image captured by the camera, and the supply of dry air or inert gas A gas supply unit 506 such as a gas. Furthermore, the control unit 500 directly controls the various parts of the system. However, it is naturally also possible to control the respective units by the individual control units, and the main unit controls the respective control units by communication.

其次,對構成印刷系統100之各裝置進行說明。 Next, each device constituting the printing system 100 will be described.

<<塗佈裝置>> <<Coating device>>

圖9係表示配備於圖7所示之印刷系統中之塗佈裝置之一例之立體圖。該塗佈裝置800具備用以吸附保持印刷布BL之印刷布保持部810。於該印刷布保持部810,隔開適當之間隔而設置有省略圖示之複數之頂起銷。該等頂起銷於印刷布BL之搬入、搬出時,將印刷布BL自其下方支持,使其自印刷布保持部810之表面向上方上升。 Fig. 9 is a perspective view showing an example of a coating device provided in the printing system shown in Fig. 7. The coating device 800 includes a printing cloth holding portion 810 for sucking and holding the printing cloth BL. In the printing cloth holding portion 810, a plurality of jacking pins (not shown) are provided at appropriate intervals. When the push-up pins are carried in and out of the printing cloth BL, the printing cloth BL is supported from below, and is lifted upward from the surface of the printing cloth holding portion 810.

於印刷布保持部810之上方,設置有自該印刷布保持部810之兩側部分大致水平地架設之托架820。該托架820具備用以支持狹縫噴嘴830之噴嘴支持部840、及支持該噴嘴支持部840之兩端之左右一對升降機構850。又,於印刷布保持部810之兩端部,配設有於大致水平方向上平行地延伸之一對移行軌道860。該等移行軌道860導引托架820之兩端部,藉此使托架820於圖9所示之Y方向上往復移動。 Above the printing cloth holding portion 810, a bracket 820 that is substantially horizontally stretched from both side portions of the printing cloth holding portion 810 is provided. The bracket 820 includes a nozzle support portion 840 for supporting the slit nozzle 830, and a pair of right and left lift mechanisms 850 that support both ends of the nozzle support portion 840. Further, at both end portions of the printing cloth holding portion 810, a pair of traveling rails 860 extending in parallel in a substantially horizontal direction are disposed. The traveling rails 860 guide both ends of the bracket 820, thereby causing the bracket 820 to reciprocate in the Y direction shown in FIG.

於印刷布保持部810及托架820之兩側部分,沿印刷布保持部810之兩側之緣側配設有分別具備固定子871與移動子872之一對線性馬達870。又,於印刷布保持部810及托架820之兩側部分,固設有分別具備刻度尺部與檢測件之一對線性編碼器880。該線性編碼器880檢測托架820之位置。 A pair of linear motors 870 each having a fixed stator 871 and a movable member 872 are disposed on both side edges of the printing cloth holding portion 810 on both sides of the printing cloth holding portion 810 and the bracket 820. Further, a pair of linear encoders 880 each having a scale portion and a detecting member are provided on both sides of the printing cloth holding portion 810 and the bracket 820. The linear encoder 880 detects the position of the carriage 820.

如此構成之塗佈裝置800中,在托架820於Y方向上往路移動之期間自狹縫噴嘴830連續地噴出墨水,對印刷布BL之表面SF供給墨水而形成塗佈層。再者,於本實施形態中,將狹縫噴嘴830之墨水噴出口 之X方向寬度設定為較印刷布BL之寬度更短,且較圖案層之寬度更長,塗佈裝置800於圖10所示之位置關係下對塗佈層進行塗佈。 In the coating apparatus 800 configured as described above, ink is continuously ejected from the slit nozzle 830 while the carriage 820 is moving in the Y direction, and ink is supplied to the surface SF of the printing cloth BL to form a coating layer. Furthermore, in the present embodiment, the ink ejection port of the slit nozzle 830 is used. The X-direction width is set to be shorter than the width of the printing cloth BL, and is longer than the width of the pattern layer, and the coating device 800 coats the coating layer in the positional relationship shown in FIG.

圖10係模式性表示印刷布、塗佈層、版、基板及有效區域之位置關係之圖。塗佈裝置800係以成為圖10所示之位置關係之方式於印刷布BL之表面SF形成塗佈層CL。即,於印刷布BL中,將塗佈層CL塗佈於其中央部分,但周緣部成為未塗佈有墨水之空白部分。再者,該圖中之符號「AR」表示藉由版PP使塗佈層CL圖案化所得之圖案層有效地轉印至基板SB且作為元件而發揮功能之有效區域。於本實施形態中,有效區域AR較塗佈層CL更窄,藉由進行轉印步驟及剝離步驟,自塗佈層CL除去有效區域AR後之邊框形狀之區域(以下稱為「殘留區域」)RR殘留於印刷布BL之表面SF。如此設置殘留區域RR之原因在於,事實上難以將塗佈層CL整體以均勻之膜厚進行塗佈。即,其原因在於,僅使用塗佈層CL之膜厚均勻之中央區域而形成圖案層。藉此,可形成良好之圖案層,且可良好地進行向基板SB之圖案層形成。 Fig. 10 is a view schematically showing the positional relationship of a printing cloth, a coating layer, a plate, a substrate, and an effective area. The coating device 800 forms the coating layer CL on the surface SF of the printing cloth BL so as to have a positional relationship as shown in FIG. That is, in the printing cloth BL, the coating layer CL is applied to the central portion thereof, but the peripheral portion becomes a blank portion to which the ink is not applied. In addition, the symbol "AR" in the figure indicates an effective region in which the pattern layer obtained by patterning the coating layer CL by the plate PP is efficiently transferred to the substrate SB and functions as an element. In the present embodiment, the effective region AR is narrower than the coating layer CL, and the region of the frame shape after the effective region AR is removed from the coating layer CL by performing the transfer step and the peeling step (hereinafter referred to as "residual region") RR remains on the surface SF of the printing cloth BL. The reason why the residual region RR is set in this way is that it is actually difficult to coat the entire coating layer CL with a uniform film thickness. That is, the reason is that the pattern layer is formed using only the central region of the coating layer CL having a uniform film thickness. Thereby, a good pattern layer can be formed, and the pattern layer formation to the substrate SB can be performed favorably.

<<轉印裝置>> <<Transfer device>>

於印刷系統100中,設置有3種轉印裝置202、203、204,但該等基本上具有相同構成。因此,對轉印裝置203進行說明,省略關於轉印裝置202、204之說明。 In the printing system 100, three types of transfer devices 202, 203, and 204 are provided, but these basically have the same configuration. Therefore, the transfer device 203 will be described, and the description of the transfer devices 202 and 204 will be omitted.

圖11係表示配備於圖7所示之印刷系統中之轉印裝置之一例之立體圖。再者,於該圖中,為顯示裝置之內部構成而示出除去外部防護罩後之狀態。該轉印裝置203中,基板SB及印刷布BL之搬入搬出係沿Y軸方向進行。 Fig. 11 is a perspective view showing an example of a transfer device provided in the printing system shown in Fig. 7. Further, in the figure, the state in which the outer shield is removed after the internal configuration of the display device is shown. In the transfer device 203, the loading and unloading of the substrate SB and the printing cloth BL is performed in the Y-axis direction.

該轉印裝置203具有於主框架2安裝有上平台區塊4及下平台區塊6之構造。於圖11中,為明示各區塊之區別,對上平台區塊4附以間距稀疏之點,又,對下平台區塊6附以間距更密集之點。 The transfer device 203 has a configuration in which the upper frame block 4 and the lower platform block 6 are mounted to the main frame 2. In FIG. 11, in order to clarify the difference between the blocks, the upper platform block 4 is provided with a sparsely spaced point, and the lower platform block 6 is further densely spaced.

轉印裝置203為如下裝置:藉由使由下平台區塊6所保持之印刷布BL、與由上平台區塊4所保持之基板SB相互抵接而使印刷布BL與基板SB密接,從而將印刷布BL上之圖案層轉印至基板SB。 The transfer device 203 is a device that closes the printed cloth BL and the substrate SB by abutting the printed cloth BL held by the lower land block 6 and the substrate SB held by the upper land block 4, thereby The pattern layer on the printing cloth BL is transferred to the substrate SB.

轉印裝置203之下平台區塊6係由主框架2之基座框架21支持。另一方面,上平台區塊4安裝於以自X方向夾隔下平台區塊6之方式自基座框架21立設且於Y方向延伸之1對上平台支持框架22、23。 The platform block 6 below the transfer device 203 is supported by the base frame 21 of the main frame 2. On the other hand, the upper platform block 4 is attached to a pair of upper platform support frames 22, 23 which are erected from the base frame 21 and which extend in the Y direction so as to sandwich the platform block 6 from the X direction.

又,於主框架2,安裝有用以進行搬入至裝置之基板SB與印刷布BL之位置檢測之預對準相機。具體而言,用以於不同之3個部位檢測沿Y軸方向搬入至裝置之基板SB之邊緣的3台基板用預對準相機241、242、243分別安裝於自上平台支持框架22、23立設之吊桿。同樣地,用以於不同之3個部位檢測沿Y軸方向搬入至裝置之印刷布BL之邊緣的3台印刷布用預對準相機244、245、246分別安裝於自上平台支持框架22、23立設之吊桿。再者,於圖11中,未顯示位於上平台區塊4之背後之1台印刷布用預對準相機246。 Further, a pre-alignment camera for detecting the position of the substrate SB and the printing cloth BL loaded into the apparatus is attached to the main frame 2. Specifically, three substrate pre-alignment cameras 241, 242, and 243 for detecting the edges of the substrate SB loaded into the device in the Y-axis direction at three different portions are attached to the upper platform support frames 22, 23, respectively. Set up the boom. Similarly, three pre-aligned cameras 244, 245, and 246 for printing cloth for detecting the edges of the printing cloth BL that are carried in the Y-axis direction to the device in the Y-axis direction are respectively mounted on the upper platform support frame 22, 23 erected booms. Further, in Fig. 11, a pre-aligned camera 246 for printing cloth located behind the upper deck block 4 is not shown.

圖12係表示下平台區塊之構造之立體圖。下平台區塊6中,於中央部開口之板狀之對準平台601之四角,於鉛垂軸方向(Z方向)分別立設有支柱602,由該等支柱602支持平台支持板603。雖省略圖示,但於對準平台601之下部,設置有具有以於鉛垂軸方向Z延伸之旋轉軸為旋轉中心之旋轉方向(以下,稱為「θ方向」)、X方向及Y方向之3自由度之例如交叉滾子軸承等對準平台支持機構(省略圖示),對準平台601經由該對準平台支持機構而安裝於基座框架21。因此,藉由對準平台支持機構之作動,對準平台601可相對於基座框架21而於X方向、Y方向及θ方向在特定之範圍移動。 Figure 12 is a perspective view showing the construction of the lower platform block. In the lower deck block 6, at the four corners of the plate-shaped alignment platform 601 which is open at the center, pillars 602 are respectively provided in the vertical axis direction (Z direction), and the pillars 602 are supported by the pillars 602. Although not shown in the drawings, a rotation direction (hereinafter referred to as "θ direction"), an X direction, and a Y direction having a rotation axis extending in the vertical axis direction Z as a rotation center is provided in a lower portion of the alignment stage 601. The three degrees of freedom, such as a crossed roller bearing, are aligned with the platform support mechanism (not shown), and the alignment stage 601 is attached to the base frame 21 via the alignment platform support mechanism. Therefore, the alignment platform 601 can be moved in a specific range in the X direction, the Y direction, and the θ direction with respect to the base frame 21 by the action of the alignment platform supporting mechanism.

於平台支持板603之上部,配置有上表面成為與水平面大致一致之平面且於中央部形成有開口窗611之環狀矩形之下平台61。於下平台61之上表面載置印刷布BL,且下平台61保持該印刷布BL。 On the upper portion of the platform support plate 603, an annular rectangular lower platform 61 having an upper surface that is substantially coincident with a horizontal plane and an open window 611 formed at a central portion thereof is disposed. The printing cloth BL is placed on the upper surface of the lower stage 61, and the lower stage 61 holds the printing cloth BL.

開口窗611之開口尺寸必須大於印刷布BL之表面區域中之作為圖案形成區域有效地發揮功能之中央部之有效區域AR(參照圖10)的平面尺寸。即,在印刷布BL載置於下平台61時,必須使印刷布BL下表面中之與有效區域AR對應之區域整體面向開口窗611,且有效區域AR之下方為完全敞開之狀態。又,由圖案形成材料所形成之塗佈層係以至少覆蓋有效區域AR整體之方式而形成。 The opening size of the opening window 611 must be larger than the plane size of the effective area AR (refer to FIG. 10) of the central portion which functions as the pattern forming region in the surface area of the printing cloth BL. That is, when the printing cloth BL is placed on the lower stage 61, it is necessary to make the entire area of the lower surface of the printing cloth BL corresponding to the effective area AR face the opening window 611, and the lower side of the effective area AR is completely open. Further, the coating layer formed of the pattern forming material is formed to cover at least the entire effective region AR.

於下平台61之上表面61a,以分別沿著開口窗611之周緣各邊之方式設置有複數之槽612,各槽612經由未圖示之控制閥而與控制裝置500之負壓供給部504連接。各槽612係配置於較印刷布BL之平面尺寸更小之平面尺寸之區域內。而且,如圖中一點鏈線所示,印刷布BL係以覆蓋該等槽612全部之方式載置於下平台61。又,為使以上成為可能,於下平台上表面61a適當配置印刷布BL之位置限制用之止動構件613。 On the upper surface 61a of the lower stage 61, a plurality of grooves 612 are provided along the respective sides of the opening window 611, and each groove 612 is connected to the negative pressure supply portion 504 of the control device 500 via a control valve (not shown). connection. Each of the grooves 612 is disposed in a region of a planar size smaller than the plane size of the printed cloth BL. Further, as shown by the one-dot chain line, the printing cloth BL is placed on the lower stage 61 so as to cover all of the grooves 612. Moreover, in order to make the above possible, the stopper member 613 for position limitation of the printing cloth BL is arrange|positioned suitably on the lower stage upper surface 61a.

藉由對各槽612供給負壓而使各槽612作為真空吸附槽發揮功能,以此方式將印刷布BL之周緣部之四邊吸附保持於下平台61之上表面61a。藉由以相互獨立之複數之槽612構成真空吸附槽,即便因某些原因而於一部分槽產生真空破壞,亦可維持其他槽對印刷布BL之吸附,故而可確實地保持印刷布BL。又,可以較設置單獨之槽之情形更強之吸附力吸附印刷布BL。 By supplying a negative pressure to each of the grooves 612 and causing each of the grooves 612 to function as a vacuum suction groove, the four sides of the peripheral edge portion of the printing cloth BL are adsorbed and held on the upper surface 61a of the lower stage 61. By forming the vacuum suction grooves in the plurality of grooves 612 which are independent of each other, even if vacuum breakage occurs in a part of the grooves for some reason, the adsorption of the other grooves on the printing cloth BL can be maintained, so that the printing cloth BL can be surely held. Further, the printing cloth BL can be adsorbed by a stronger adsorption force than in the case where a separate groove is provided.

於下平台61之開口窗611之下方,設置有用以使印刷布BL沿Z軸方向上下移動之升降手單元62、63、及自下方抵接於印刷布BL並上推之轉印輥單元64。 Below the opening window 611 of the lower stage 61, lifting hand units 62, 63 for moving the printing cloth BL up and down in the Z-axis direction, and a transfer roller unit 64 for abutting against the printing cloth BL and pushing up from below are provided. .

圖13係表示升降手單元之構造之圖。2個升降手單元62、63之構造相同,故而此處對一升降手單元62之構造進行說明。升降手單元62包含自基座框架21沿Z方向立設之2根支柱621、622,且板狀之滑動基座623可上下移動地安裝於該等支柱621、622。更具體而言,於2根支 柱621、622分別安裝有於鉛垂軸方向(Z方向)延伸之導軌6211、6221,安裝於滑動基座623之背面、即(+Y)側主面之未圖示之滑塊滑動自如地安裝於導軌6211、6221。而且,具備例如馬達及滾珠螺桿機構等適當之驅動機構之升降機構624根據來自控制裝置500之控制指令而使滑動基座623上下移動。 Fig. 13 is a view showing the configuration of the lifter unit. Since the structure of the two lifter units 62 and 63 is the same, the structure of the lifter unit 62 will be described here. The lifter unit 62 includes two pillars 621 and 622 that are erected from the base frame 21 in the Z direction, and the plate-shaped slide base 623 is attached to the pillars 621 and 622 so as to be movable up and down. More specifically, in 2 branches Each of the pillars 621 and 622 is attached to a guide rail 6211 and 6221 extending in the vertical axis direction (Z direction), and a slider (not shown) that is attached to the back surface of the slide base 623, that is, the (+Y) side main surface, is slidably and slidably It is mounted on the guide rails 6211 and 6221. Further, the elevating mechanism 624 including an appropriate drive mechanism such as a motor and a ball screw mechanism moves the slide base 623 up and down in accordance with a control command from the control device 500.

於滑動基座623,上下移動自如地安裝有複數根(本例中為4根)手625。各手625之構造除基座部分之形狀根據配設位置而不同之點以外基本上相同。各手625固定於滑塊627,該滑塊627滑動自如地卡合於沿鉛垂軸方向(Z方向)安裝於滑動基座623之正面、即(-Y)側主面之導軌626。滑塊627與安裝於滑動基座623之背面之具備例如無桿汽缸等適當之驅動機構之升降機構628連結,且藉由該升降機構628之作動而相對於滑動基座623沿上下方向移動。於各手625分別設置有獨立之升降機構628,可使各手625個別地上下移動。 A plurality of (four in this example) hands 625 are attached to the slide base 623 so as to be movable up and down. The configuration of each hand 625 is substantially the same except that the shape of the base portion differs depending on the arrangement position. Each hand 625 is fixed to a slider 627 that is slidably engaged with a guide rail 626 that is attached to the front surface of the slide base 623, that is, the (-Y) side main surface, in the vertical axis direction (Z direction). The slider 627 is coupled to an elevating mechanism 628 provided with a suitable driving mechanism such as a rodless cylinder attached to the back surface of the slide base 623, and is moved in the vertical direction with respect to the slide base 623 by the movement of the elevating mechanism 628. Each of the hands 625 is provided with an independent lifting mechanism 628, so that the hands 625 can be individually moved up and down.

即,升降手單元62中,藉由升降機構624使滑動基座623上下移動而可使各手625一體地升降,並且藉由各升降機構628獨立地作動而可使各手625個別地升降。 That is, in the lifter unit 62, the lift base 623 moves the slide base 623 up and down, so that the hands 625 can be integrally moved up and down, and the respective lifters 628 can be independently moved to move the hands 625 individually.

手625之上表面625a被加工成以Y方向為長度方向之細長之平面狀,該上表面625a抵接於印刷布BL之下表面而可支持印刷布BL。又,於上表面625a,設置有經由未圖示之配管及控制閥而與設置於控制裝置500之負壓供給部504連通之吸附孔625b。藉此,視需要對吸附孔625b供給來自負壓供給部504之負壓,可將印刷布BL吸附保持於手625之上表面625a。因此,可防止以手625支持印刷布BL時之滑移。 The upper surface 625a of the hand 625 is processed into an elongated planar shape having a longitudinal direction in the Y direction, and the upper surface 625a abuts against the lower surface of the printing cloth BL to support the printing cloth BL. Further, the upper surface 625a is provided with an adsorption hole 625b that communicates with the negative pressure supply unit 504 provided in the control device 500 via a pipe (not shown) and a control valve. Thereby, the negative pressure from the negative pressure supply unit 504 is supplied to the adsorption hole 625b as needed, and the printing cloth BL can be adsorbed and held on the upper surface 625a of the hand 625. Therefore, the slip when the printing cloth BL is supported by the hand 625 can be prevented.

又,對吸附孔625b,視需要自控制裝置500之氣體供給部506經由未圖示之配管及控制閥而供給適當之氣體,例如乾燥空氣或惰性氣體等。即,藉由利用控制裝置500控制之控制閥之開關而將來自負壓供給部504之負壓及來自氣體供給部506之氣體選擇性地供給至吸附孔 625b。 Further, the adsorption hole 625b is supplied with an appropriate gas such as dry air or an inert gas from the gas supply unit 506 of the control device 500 via a piping and a control valve (not shown). That is, the negative pressure from the negative pressure supply unit 504 and the gas from the gas supply unit 506 are selectively supplied to the adsorption holes by the switching of the control valve controlled by the control device 500. 625b.

於將來自氣體供給部506之氣體供給至吸附孔625b時,自吸附孔625b噴出少量之氣體。藉此,於印刷布BL之下表面與手上表面625a之間形成微小之間隙,手625成為自下方支持印刷布BL且與印刷布BL下表面隔開之狀態。因此,可一面藉由各手625支持印刷布BL,一面使印刷布BL相對於各手625不產生滑動摩擦地沿水平方向移動。再者,亦可於手上表面625a,與吸附孔625b不同地另外設置氣體噴出孔。 When the gas from the gas supply unit 506 is supplied to the adsorption hole 625b, a small amount of gas is ejected from the adsorption hole 625b. Thereby, a slight gap is formed between the lower surface of the printing cloth BL and the hand surface 625a, and the hand 625 is in a state of supporting the printing cloth BL from below and being spaced apart from the lower surface of the printing cloth BL. Therefore, the printing cloth BL can be moved in the horizontal direction without causing sliding friction with respect to the respective hands 625 while the printing cloth BL is supported by the respective hands 625. Further, a gas ejection hole may be separately provided on the hand surface 625a unlike the adsorption hole 625b.

返回至圖12,於下平台區塊6中,具有如上所述之構成之升降手單元62、63以使手625朝內且於Y方向上相對向之方式對向配置。於各手625下降至最低位置之狀態下,手上表面625a位於較下平台上表面61a向下方、即(-Z)方向大幅後退之位置。另一方面,於各手625上升至最高位置之狀態下,各手625之前端成為自下平台61之開口窗611向上方突出之狀態,手上表面625a到達至較下平台上表面61a向上方、即(+Z)方向突出之位置。 Returning to Fig. 12, in the lower deck block 6, the lifter units 62, 63 having the above configuration are disposed such that the hands 625 face inward and face each other in the Y direction. In a state where each hand 625 is lowered to the lowest position, the hand surface 625a is located at a position where the upper surface 61a of the lower stage is downward, that is, the position is largely retreated in the (-Z) direction. On the other hand, in a state where each hand 625 is raised to the highest position, the front end of each hand 625 is in a state of protruding upward from the opening window 611 of the lower stage 61, and the hand surface 625a reaches the upper surface 61a of the lower stage. , that is, the position in the (+Z) direction.

又,自上方觀察時,於兩升降手單元62、63之相互對向之手625之前端彼此之間設置有一定之間隔,從而其等不會接觸。又,如下所述,轉印輥單元64利用該間隙而於X方向移動。 Further, when viewed from above, the front ends of the opposing hand 625 of the two lift hand units 62, 63 are spaced apart from each other so that they do not contact each other. Further, as described below, the transfer roller unit 64 moves in the X direction by the gap.

圖14係表示轉印輥單元之構造之圖。轉印輥單元64包含:轉印輥641,其係於Y方向延伸之圓筒狀之輥構件;支持框架642,其沿該轉印輥641之下方於Y方向延伸且由其兩端部將轉印輥641旋轉自如地支持;及升降機構644,其包含適當之驅動機構且使支持框架642沿Z方向上下移動。轉印輥641並未與旋轉驅動機構連接而是自由旋轉。又,於支持框架642,設置有自下方抵接於轉印輥641之表面而防止轉印輥641彎曲之支承輥643。 Fig. 14 is a view showing the configuration of a transfer roller unit. The transfer roller unit 64 includes a transfer roller 641 that is a cylindrical roller member that extends in the Y direction, and a support frame 642 that extends in the Y direction below the transfer roller 641 and is bounded at both ends thereof. The transfer roller 641 is rotatably supported; and the elevating mechanism 644 includes an appropriate drive mechanism and moves the support frame 642 up and down in the Z direction. The transfer roller 641 is not rotatably connected to the rotary drive mechanism. Further, the support frame 642 is provided with a support roller 643 that abuts against the surface of the transfer roller 641 from below to prevent the transfer roller 641 from being bent.

轉印輥641之Y方向上之長度短於下平台61之開口窗611之四邊中 之沿Y方向之邊之長度、即開口窗611之Y方向上之開口尺寸,且長於保持於下述上平台時之基板SB之沿Y方向之長度。印刷布BL中作為圖案形成區域而有效之有效區域AR之長度當然為基板SB之長度以下,故而於Y方向上轉印輥641較有效區域AR更長。 The length of the transfer roller 641 in the Y direction is shorter than the four sides of the opening window 611 of the lower stage 61 The length of the side in the Y direction, that is, the opening size in the Y direction of the opening window 611, is longer than the length of the substrate SB in the Y direction when held on the upper stage described below. The length of the effective area AR which is effective as the pattern forming region in the printing cloth BL is of course less than the length of the substrate SB, so that the transfer roller 641 is longer than the effective area AR in the Y direction.

升降機構644包含基座部644a、及自該基座部644a向上方延伸且與支持框架642之Y方向上之中央附近連結之支持腳644b。支持腳644b藉由馬達或汽缸等適當之驅動機構而可相對於基座部644a上下移動。基座部644a滑動自如地安裝於在X方向延伸設置之導軌646,進而連結於具備例如馬達及滾珠螺桿機構等適當之驅動機構之移動機構647。導軌646安裝於在X方向延伸設置且固定於基座框架21之下部框架645之上表面。藉由移動機構647作動,轉印輥641、支持框架642及升降機構644一體地沿X方向移行。 The elevating mechanism 644 includes a base portion 644a and a support leg 644b extending upward from the base portion 644a and connected to the vicinity of the center of the support frame 642 in the Y direction. The support leg 644b is movable up and down with respect to the base portion 644a by a suitable drive mechanism such as a motor or a cylinder. The base portion 644a is slidably attached to the guide rail 646 extending in the X direction, and is further coupled to a moving mechanism 647 including a suitable drive mechanism such as a motor and a ball screw mechanism. The guide rail 646 is attached to an upper surface of the frame 645 extending in the X direction and fixed to the lower frame of the base frame 21. By the movement mechanism 647, the transfer roller 641, the support frame 642, and the elevating mechanism 644 integrally move in the X direction.

詳情將於以後敍述,該轉印裝置203中,使轉印輥641抵接於保持在下平台61之印刷布BL並將印刷布BL部分地上推,藉此,使印刷布BL抵接於保持在上平台且與印刷布BL接近對向配置之基板SB。 As will be described later, in the transfer device 203, the transfer roller 641 is brought into contact with the printing cloth BL held by the lower stage 61, and the printing cloth BL is partially pushed up, whereby the printing cloth BL is brought into contact with and held by The substrate SB is disposed on the upper platform and adjacent to the printing cloth BL.

升降機構644通過升降手單元62、63之相互對向之手625所形成之間隙而移行。又,各手625之上表面625a可向(-Z)方向後退至較轉印輥單元64之支持框架642之下表面更下方。因此,藉由升降機構644於該狀態下移行,轉印輥單元64之支持框架642通過各手625之上表面625a之上方,從而避免轉印輥單元64與手625碰撞。 The elevating mechanism 644 is moved by the gap formed by the opposing hand 625 of the lifter units 62, 63. Further, the upper surface 625a of each hand 625 can be retracted in the (-Z) direction to be lower than the lower surface of the support frame 642 of the transfer roller unit 64. Therefore, by the elevating mechanism 644 moving in this state, the support frame 642 of the transfer roller unit 64 passes over the upper surface 625a of each hand 625, thereby preventing the transfer roller unit 64 from colliding with the hand 625.

其次,對上平台區塊4之構造進行說明。如圖11所示,上平台區塊4具備作為於X方向延伸之構造體之上平台組件40、自上平台支持框架22、23分別立設且分別支持上平台組件40之X方向兩端部之1對支持柱45、46、及具備例如馬達及滾珠螺桿機構等適當之驅動機構且使上平台組件40整體沿Z方向升降移動之升降機構47。 Next, the structure of the upper platform block 4 will be described. As shown in FIG. 11, the upper platform block 4 is provided with a platform upper assembly platform 40 extending in the X direction, and is erected from the upper platform support frames 22, 23, respectively, and supports the X-direction end portions of the upper platform assembly 40, respectively. The pair of support columns 45, 46 and an elevating mechanism 47 having an appropriate drive mechanism such as a motor and a ball screw mechanism and moving the upper platform assembly 40 as a whole in the Z direction.

圖15係表示上平台組件之構造之圖。上平台組件40具備於下表 面保持基板SB之上平台41、設置於上平台41之上部之加強框架42、與加強框架42結合且沿X方向水平延伸之梁狀構造體43、及安裝於上平台41之上部吸附單元44。如圖15所示,上平台組件40具有相對於包含其外形上之中心之XZ平面及YZ平面分別大致對稱之形狀。 Figure 15 is a diagram showing the construction of the upper platform assembly. The upper platform assembly 40 is provided in the following table a surface 41 above the substrate SB, a reinforcing frame 42 disposed on the upper portion of the upper platform 41, a beam-like structure 43 coupled to the reinforcing frame 42 and extending horizontally in the X direction, and an adsorption unit 44 mounted on the upper portion of the upper platform 41 . As shown in Fig. 15, the upper platform assembly 40 has a shape that is substantially symmetrical with respect to the XZ plane and the YZ plane including the center of its shape, respectively.

上平台41為較要保持之基板SB之平面尺寸稍小之平板狀構件,且保持為水平姿勢之其下表面41a成為使基板SB抵接且予以保持之保持平面。保持平面要求較高之平面度,故而作為其材料較佳為石英玻璃或不鏽鋼板。又,於保持平面設置有用以安裝下述上部吸附單元44之吸附墊之貫通孔。 The upper stage 41 is a flat member having a slightly smaller planar size than the substrate SB to be held, and the lower surface 41a held in a horizontal posture serves as a holding plane for abutting and holding the substrate SB. The plane is required to have a high degree of flatness, so that the material thereof is preferably quartz glass or stainless steel. Further, a through hole for attaching the adsorption pad of the upper adsorption unit 44 described below is provided on the holding surface.

加強框架42包含沿Z方向延伸設置於上平台41之上表面之加強肋之組合,如圖所示,為防止上平台41之彎曲以維持其下表面(保持平面)41a之平面度,而將與YZ平面平行之加強肋421、及與XZ平面平行之加強肋422分別適當複數組合。加強肋421、422例如可由金屬板構成。 The reinforcing frame 42 includes a combination of reinforcing ribs extending in the Z direction on the upper surface of the upper platform 41, as shown, in order to prevent the upper platform 41 from being bent to maintain the flatness of the lower surface (holding plane) 41a thereof, The reinforcing ribs 421 parallel to the YZ plane and the reinforcing ribs 422 parallel to the XZ plane are respectively combined as appropriate. The reinforcing ribs 421, 422 may be composed of, for example, a metal plate.

又,梁狀構造體43為將複數之金屬板組合而形成之以X方向為長度方向之構造體,其兩端部支持於支持柱45、46且可上下移動。具體而言,於支持柱45、46分別設置有於Z方向延伸之導軌451、461,另一方面,於與其對向之梁狀構造體43之(+Y)側主面安裝有未圖示之滑塊,該等係滑動自如地卡合。而且,如圖11所示,梁狀構造體43與支持柱46係藉由升降機構47而連結,藉由升降機構47作動,梁狀構造體43於維持水平姿勢之狀態下沿鉛垂軸方向(Z方向)移動。上平台41經由加強框架42而與構造體43一體地結合,故而藉由升降機構47之作動,上平台41在將保持平面41a保持為水平之狀態下上下移動。 Further, the beam-like structure 43 is a structure in which a plurality of metal plates are combined and formed in the longitudinal direction in the X direction, and both end portions thereof are supported by the support columns 45 and 46 and are movable up and down. Specifically, the support columns 45 and 46 are respectively provided with guide rails 451 and 461 extending in the Z direction, and on the other hand, the (+Y) side main surface of the beam-shaped structure 43 opposite thereto is attached to the main surface. The sliders are slidably engaged. Further, as shown in FIG. 11, the beam-like structure 43 and the support post 46 are connected by the elevating mechanism 47, and the elevating mechanism 47 is actuated, and the beam-like structure 43 is in the vertical axis direction while maintaining the horizontal posture. (Z direction) moves. The upper stage 41 is integrally coupled to the structure 43 via the reinforcing frame 42. Therefore, the upper stage 41 moves up and down while holding the holding plane 41a horizontal by the lifting mechanism 47.

再者,加強框架42及梁狀構造體43之構造並不限定於圖示者。此處,將與YZ平面平行之板狀構件及與XZ平面平行之板狀構件加以組合而獲得必要之強度,但亦可將金屬板或角型材構件等適當組合成 除此以外之形狀。形成為此種構造之目的在於輕量地構成上平台組件40。為減小各部之彎曲,亦考慮增加上平台41之厚度或使梁狀構造體43成為實心體,但如此會導致上平台組件40整體之質量變大。 Further, the structure of the reinforcing frame 42 and the beam-like structure 43 is not limited to those shown in the drawings. Here, the plate-like member parallel to the YZ plane and the plate-shaped member parallel to the XZ plane are combined to obtain the necessary strength, but a metal plate or an angle profile member or the like may be appropriately combined. Other shapes. The purpose of forming such a configuration is to lightly construct the upper platform assembly 40. In order to reduce the bending of the respective portions, it is also considered to increase the thickness of the upper platform 41 or to make the beam-like structure 43 a solid body, but this will result in an increase in the mass of the upper platform assembly 40 as a whole.

若配置於裝置之上部之構造物之重量變大,則用以支持其或使其移動之機構需要進一步之強度及耐久性,裝置整體亦會變得非常大且重。更現實為藉由板材等之組合而獲得必要之強度,並且謀求構造物整體之輕量化。 If the weight of the structure disposed on the upper portion of the device becomes large, the mechanism for supporting or moving it needs further strength and durability, and the device as a whole becomes very large and heavy. More realistically, it is necessary to obtain the necessary strength by a combination of sheets and the like, and to reduce the weight of the entire structure.

又,於由加強框架42所包圍之上平台41之上部,安裝有1對上部吸附單元44。於圖15上部示出向上方取出一上部吸附單元44之狀態。上部吸附單元44中,於自支持框架441向下方延伸之複數之管442之下端分別安裝有例如橡膠製之吸附墊443。各管442之上端側經由未圖示之配管及控制閥而連接於控制裝置500之負壓供給部504。支持框架441形成為不會干擾構成加強框架42之肋421、422之形狀。 Further, a pair of upper adsorption units 44 are attached to the upper portion of the upper platform 41 surrounded by the reinforcing frame 42. The upper portion of Fig. 15 shows a state in which an upper adsorption unit 44 is taken upward. In the upper adsorption unit 44, for example, a rubber adsorption pad 443 is attached to the lower end of a plurality of tubes 442 extending downward from the support frame 441. The upper end side of each tube 442 is connected to the negative pressure supply unit 504 of the control device 500 via a pipe (not shown) and a control valve. The support frame 441 is formed so as not to interfere with the shape of the ribs 421, 422 constituting the reinforcing frame 42.

支持框架441經由1對滑塊444及與其卡合之1對導軌445,而沿鉛垂軸方向移動自如地受支持於基座板446。又,基座板446與支持框架441藉由具有例如馬達及滾珠螺桿機構等適當之驅動機構之升降機構447而結合。藉由升降機構447之作動,支持框架441相對於基座板446升降,且管442及吸附墊443與其一體地升降。 The support frame 441 is movably supported by the base plate 446 in the vertical axis direction via the pair of sliders 444 and the pair of guide rails 445 that are engaged therewith. Further, the base plate 446 and the support frame 441 are coupled by an elevating mechanism 447 having a suitable drive mechanism such as a motor and a ball screw mechanism. By the action of the lifting mechanism 447, the support frame 441 is lifted and lowered with respect to the base plate 446, and the tube 442 and the adsorption pad 443 are lifted and lowered integrally therewith.

藉由將基座板446固定於上平台41而將上部吸附單元44安裝於上平台41。於該狀態下,各管442之下端及吸附墊443插通於設置在上平台41之未圖示之貫通孔。而且,藉由升降機構447之作動,吸附墊443於吸附位置與退避位置之間升降移動,該吸附位置係吸附墊443之下表面突出至較上平台41之下表面(保持平面)41a更下方,該退避位置係吸附墊443之下表面退避至上平台41之貫通孔之內部(上方)。又,在吸附墊443之下表面定位於與上平台41之保持平面41a大致同一高度時,上平台41與吸附墊443協動,從而可將基板SB保持於保持平面 41a。 The upper adsorption unit 44 is attached to the upper stage 41 by fixing the base plate 446 to the upper stage 41. In this state, the lower end of each tube 442 and the suction pad 443 are inserted into a through hole (not shown) provided in the upper stage 41. Moreover, by the action of the lifting mechanism 447, the adsorption pad 443 is moved up and down between the adsorption position and the retracted position, and the adsorption position is such that the lower surface of the adsorption pad 443 protrudes below the lower surface (holding plane) 41a of the upper stage 41. The retracted position is such that the lower surface of the adsorption pad 443 is retracted to the inside (upper side) of the through hole of the upper stage 41. Moreover, when the lower surface of the adsorption pad 443 is positioned at substantially the same height as the holding plane 41a of the upper stage 41, the upper stage 41 cooperates with the adsorption pad 443, so that the substrate SB can be held in the holding plane. 41a.

返回至圖11,如上所述般構成之上平台組件40係設置於基座板481上。更詳細而言,支持柱45、46分別立設於基座板481,上平台組件40可升降地安裝於該支持柱45、46。基座板481藉由安裝於上平台支持框架22、23且具備例如交叉滾子軸承等適當之可動機構之上平台區塊支持機構482予以支持。 Returning to Fig. 11, the upper platform assembly 40 is configured to be disposed on the base plate 481 as described above. In more detail, the support columns 45, 46 are respectively erected on the base plate 481, and the upper platform assembly 40 is detachably mounted to the support posts 45, 46. The base plate 481 is supported by a platform block support mechanism 482 mounted on the upper platform support frames 22, 23 and provided with a suitable movable mechanism such as a crossed roller bearing.

因此,上平台組件40整體可相對於主框架2而水平移動。具體而言,基座板481藉由上平台區塊支持機構482之作動,而於水平面即XY平面內水平移動。與支持柱45、46之各者對應地設置之1對基座板481可相互獨立地移動,伴隨該等之移動,上平台組件40可相對於主框架2而於X方向、Y方向及θ方向在特定之範圍移動。 Therefore, the upper platform assembly 40 as a whole can be moved horizontally with respect to the main frame 2. Specifically, the base plate 481 is horizontally moved in the horizontal plane, that is, in the XY plane, by the action of the upper platform block supporting mechanism 482. A pair of base plates 481 disposed corresponding to each of the support columns 45, 46 are movable independently of each other, and with the movements, the upper platform assembly 40 can be in the X direction, the Y direction, and θ with respect to the main frame 2. The direction moves within a specific range.

其次,對如上所述般構成之轉印裝置203之轉印處理進行說明。於該轉印處理中,被保持於上平台41之基板SB與被保持於下平台61之印刷布BL隔開微小之間隙而接近對向配置。而且,轉印輥641一面抵接於印刷布BL之下表面並將印刷布BL局部地向上方上推,一面沿印刷布BL之下表面移動。被上推之印刷布BL首先與基板SB局部地抵接,且抵接部分伴隨輥移動而逐漸擴大,最終與基板SB之整體抵接。藉此,使印刷布BL與基板SB密接而將印刷布BL上之圖案層轉印至基板SB。 Next, the transfer process of the transfer device 203 configured as described above will be described. In the transfer process, the substrate SB held by the upper stage 41 and the printing cloth BL held by the lower stage 61 are spaced apart from each other by a slight gap. Further, the transfer roller 641 abuts against the lower surface of the printing cloth BL and partially pushes up the printing cloth BL upward, and moves along the lower surface of the printing cloth BL. The printed cloth BL that has been pushed up first partially abuts on the substrate SB, and the abutting portion gradually expands with the movement of the roller, and finally abuts against the entirety of the substrate SB. Thereby, the printing cloth BL is adhered to the substrate SB, and the pattern layer on the printing cloth BL is transferred to the substrate SB.

圖16~圖16C、圖17A~圖17C、圖18A、圖18B、圖19A~圖19C、圖20A~圖20C、圖21A~圖21C、圖22A~圖22C係模式性表示處理之各階段之裝置各部之位置關係之圖。以下,一面參照該等圖式一面說明轉印處理中之各部之動作。再者,為將處理之各階段之各部之關係容易理解地予以顯示,有省略與該階段之處理無直接關係之構成或應對其標註之符號之圖示的情況。 16 to 16C, 17A to 17C, 18A, 18B, 19A to 19C, 20A to 20C, 21A to 21C, and 22A to 22C are schematic representations of various stages of processing. A diagram of the positional relationship of the various parts of the device. Hereinafter, the operation of each part in the transfer process will be described with reference to the drawings. In addition, in order to make the relationship of each part of each stage of a process easy to understand, the structure which is not directly related to the process of this stage, or the illustration of the code|symbol which it is attached is abbreviate|omitted.

該轉印處理中,對於已初始化之轉印裝置203,首先將基板SB沿 圖7之基板搬送路徑PTS搬入並定置於上平台41。其次,將擔載有藉由版PP而圖案化之圖案層之印刷布BL沿圖7之印刷布搬送路徑PTB搬入並定置於下平台61。基板SB係使接受圖案層之轉印之被轉印面朝下地被搬入,又,印刷布BL係使圖案層朝上地被搬入。 In the transfer process, for the initialized transfer device 203, the substrate SB is first placed along The substrate transport path PTS of FIG. 7 is carried in and placed on the upper stage 41. Next, the printing cloth BL carrying the pattern layer patterned by the plate PP is carried in the printing cloth transport path PTB of FIG. 7 and placed on the lower stage 61. The substrate SB is carried in such a manner that the transfer surface on which the transfer of the pattern layer is received is moved downward, and the printing cloth BL is carried in such that the pattern layer is placed upward.

圖16A~圖16C表示將基板SB搬入至裝置到定置於上平台41為止之過程。如圖16A所示,於初始狀態下,上平台41向上方退避,從而與下平台61之間隔變大,兩平台之間形成有較大之處理空間SP。又,各手625退避至較下平台61之上表面更下方。轉印輥641位於面向下平台61之開口窗611之位置中最靠(-X)方向之位置,且為於鉛垂軸方向(Z方向)上退避至較下平台61之上表面更下方之位置。與負壓供給部504連接之各控制閥已被關閉。 16A to 16C show the process of loading the substrate SB into the apparatus to be placed on the upper stage 41. As shown in Fig. 16A, in the initial state, the upper stage 41 is retracted upward, so that the interval from the lower stage 61 becomes larger, and a larger processing space SP is formed between the two stages. Further, each hand 625 is retracted below the upper surface of the lower stage 61. The transfer roller 641 is located at the most (-X) direction of the position facing the opening window 611 of the lower stage 61, and is retracted to a lower direction than the upper surface of the lower stage 61 in the vertical axis direction (Z direction). position. The respective control valves connected to the negative pressure supply portion 504 have been closed.

於該狀態下,將載置於搬送部402之基板用手HS上之基板SB預先計測其厚度之後,自(-Y)方向朝(+Y)方向搬入至處理空間SP。此時,手625及轉印輥641退避至下方,藉此可容易地進行搬入作業。將基板SB定位於特定之位置後,上平台41如箭頭所示般降下。 In this state, the substrate SB placed on the substrate hand HS of the transport unit 402 is measured in advance, and then moved into the processing space SP from the (-Y) direction in the (+Y) direction. At this time, the hand 625 and the transfer roller 641 are retracted to the lower side, whereby the carrying operation can be easily performed. After the substrate SB is positioned at a specific position, the upper stage 41 is lowered as indicated by the arrow.

若上平台41降下至與基板SB接近之特定之位置,則如圖16B所示,設置於上平台41之吸附墊443突出至上平台41之下表面即較保持平面41a更下方,且抵接於基板SB之上表面。藉由將與吸附墊443相連之控制閥打開,利用吸附墊443吸附基板SB之上表面而保持基板SB。繼而,使吸附墊443於持續吸附之狀態下上升,藉此將基板SB自基板用手HS上提。於該時間點,基板用手HS向裝置外移動。 If the upper platform 41 is lowered to a specific position close to the substrate SB, as shown in FIG. 16B, the adsorption pad 443 disposed on the upper stage 41 protrudes to the lower surface of the upper stage 41, that is, below the holding plane 41a, and abuts on The upper surface of the substrate SB. The substrate SB is held by the adsorption pad 443 adsorbing the upper surface of the substrate SB by opening the control valve connected to the adsorption pad 443. Then, the adsorption pad 443 is raised in a state of continuous adsorption, whereby the substrate SB is lifted from the substrate by the hand HS. At this point in time, the substrate is moved outward by the device HS.

最後,如圖16C所示,吸附墊443之下表面上升至與保持平面41a同一高度或較其稍高之位置,藉此,以基板SB之上表面密接於上平台41之保持平面41a之狀態而保持。亦可為如下之構成:於上平台41之下表面設置吸附槽或吸附孔,藉由該等而吸附基板SB。如此,基板SB之保持完成。 Finally, as shown in FIG. 16C, the lower surface of the adsorption pad 443 rises to the same height as or slightly higher than the holding plane 41a, whereby the upper surface of the substrate SB is in close contact with the holding plane 41a of the upper stage 41. And keep it. It is also possible to adopt a configuration in which an adsorption groove or an adsorption hole is provided on the lower surface of the upper stage 41, and the substrate SB is adsorbed by the above. Thus, the holding of the substrate SB is completed.

圖17A~17C、圖18A及圖18B表示於基板SB搬入後將印刷布BL搬入到保持於下平台61為止之過程。若由上平台41對基板SB之保持完成,則如圖17A所示,使上平台41上升,再次形成較大之處理空間SP,並且使各手625上升至較下平台61之上表面61a更上方。此時,使各手625之上表面625a全部成為同一高度。 FIGS. 17A to 17C and FIGS. 18A and 18B show a process in which the printing cloth BL is carried into the lower stage 61 after the substrate SB is carried in. When the holding of the substrate SB by the upper stage 41 is completed, as shown in Fig. 17A, the upper stage 41 is raised, the larger processing space SP is formed again, and the hands 625 are raised to the upper surface 61a of the lower stage 61. Above. At this time, the upper surfaces 625a of the respective hands 625 are all at the same height.

於該狀態下,如圖17B所示,接受將於上表面形成有圖案層PL之印刷布BL載置於搬送部402之印刷布用手HB且搬入至處理空間SP。印刷布BL於搬入之前先計測其厚度。印刷布用手HB較理想為具有於Y方向延伸之爪部之叉型者,以便可不干擾手625地通過其等之間隙進入。 In this state, as shown in FIG. 17B, the printing cloth BL on which the printing layer BL having the pattern layer PL formed on the upper surface is received is placed on the printing cloth by the hand HB and carried into the processing space SP. The printed cloth BL is measured for its thickness before being carried in. The printing cloth by hand HB is preferably a fork type having a claw extending in the Y direction so as to be able to enter through the gap of the hand 625 without interfering with the hand 625.

藉由印刷布用手HB進入後降下或手625上升,手625之上表面625a抵接於印刷布BL之下表面,如圖17C所示,此後印刷布BL由手625支持。藉由對設置於手625之吸附孔625b(圖13)供給負壓,可更確實地支持。如此,印刷布BL自印刷布用手HB被交付至手625,且印刷布用手HB可向裝置外排出。 The upper surface 625a of the hand 625 abuts against the lower surface of the printing cloth BL by the printing cloth by hand HB, and the upper surface 625a of the hand 625 abuts against the lower surface of the printing cloth BL, as shown in Fig. 17C, after which the printing cloth BL is supported by the hand 625. By supplying a negative pressure to the adsorption hole 625b (Fig. 13) provided in the hand 625, it can be more reliably supported. Thus, the printing cloth BL is delivered from the printing cloth by hand HB to the hand 625, and the printing cloth can be discharged to the outside of the apparatus by the hand HB.

其後,如圖18A所示,使手625於各手625之上表面625a之高度一致之狀態下降下,最後,使手上表面625a成為與下平台61之上表面61a相同之高度。藉此,印刷布BL四邊之周緣部抵接於下平台61之上表面61a。 Thereafter, as shown in Fig. 18A, the hand 625 is lowered in a state where the height of the upper surface 625a of each hand 625 is uniform, and finally, the hand surface 625a is made the same height as the upper surface 61a of the lower stage 61. Thereby, the peripheral edge portion of the four sides of the printing cloth BL abuts against the upper surface 61a of the lower stage 61.

此時,如圖18B所示,對設置於下平台上表面61a之真空吸附槽612供給負壓,而吸附保持印刷布BL。伴隨於此,利用手625之吸附解除。藉此,印刷布BL成為其四邊之周緣部藉由下平台61吸附保持之狀態。圖18B中,為明示利用手625之吸附保持解除之情況,而使印刷布BL與手625隔開,但實際上維持印刷布BL之下表面抵接於手上表面625a之狀態。 At this time, as shown in FIG. 18B, the vacuum suction groove 612 provided on the upper surface 61a of the lower stage is supplied with a negative pressure, and the printing cloth BL is adsorbed and held. Accompanying this, the adsorption by the hand 625 is released. Thereby, the printing cloth BL is in a state in which the peripheral portion of the four sides is suction-held by the lower stage 61. In Fig. 18B, the printing cloth BL is separated from the hand 625 in order to clearly show that the suction holding of the hand 625 is released, but the state in which the lower surface of the printing cloth BL is in contact with the hand surface 625a is actually maintained.

假設於該狀態下使手625分開,則認為印刷布BL會因自重而中央 部向下方彎曲,整體成為向下凸起之形狀。藉由將手625維持為與下平台上表面61a相同之高度,而可抑制此種彎曲,將印刷布BL維持為平面狀態。如此,印刷布BL成為其周緣部藉由下平台61吸附保持,並且中央部藉由手625輔助地支持之狀態,從而印刷布BL之保持完成。 Assuming that the hand 625 is separated in this state, it is considered that the printed cloth BL is centered by its own weight. The portion is bent downward, and the whole shape becomes a downward convex shape. By maintaining the hand 625 at the same height as the lower stage upper surface 61a, such bending can be suppressed, and the printing cloth BL can be maintained in a planar state. In this manner, the printing cloth BL is in a state in which the peripheral portion thereof is sucked and held by the lower stage 61, and the center portion is supported by the hand 625, whereby the holding of the printing cloth BL is completed.

基板SB與印刷布BL之搬入順序亦可與上述相反。但,於印刷布BL搬入之後搬入基板SB之情形時,於基板SB搬入時有異物落下至印刷布BL上而污染圖案層PL或產生缺陷之虞。藉由如上所述般將基板SB定置於上平台41之後將印刷布BL定置於下平台61,可預先避免上述問題。 The order in which the substrate SB and the printing cloth BL are carried in may be reversed from the above. However, when the substrate SB is carried in after the printing cloth BL is carried in, when the substrate SB is carried in, foreign matter falls onto the printing cloth BL to contaminate the pattern layer PL or cause defects. By positioning the substrate SB on the lower stage 61 after the substrate SB is placed on the upper stage 41 as described above, the above problem can be avoided in advance.

以此方式將基板SB及印刷布BL分別定置於上下平台後,繼而進行基板SB及印刷布BL之預對準處理。進而,以使兩者隔開預先設定之間隙而對向之方式進行間隙調整。 In this manner, the substrate SB and the printing cloth BL are respectively placed on the upper and lower stages, and then the pre-alignment processing of the substrate SB and the printing cloth BL is performed. Further, the gap is adjusted so as to be spaced apart from each other by a predetermined gap.

圖19A~圖19C係表示間隙調整處理及對準處理之過程之圖。其中,圖19C所示之精密對準處理僅於轉印裝置203中執行,於其他轉印裝置202、204中不執行。其原因在於,於塗佈層上形成圖案層之精度或將轉印板TP對印刷布BL進行轉印之精度低於將圖案層轉印至基板SB之精度。 19A to 19C are views showing a process of a gap adjustment process and an alignment process. Here, the precise alignment processing shown in FIG. 19C is performed only in the transfer device 203, and is not performed in the other transfer devices 202, 204. The reason for this is that the accuracy of forming the pattern layer on the coating layer or the transfer of the transfer sheet TP to the printing cloth BL is lower than the precision of transferring the pattern layer to the substrate SB.

如上所述,基板SB或印刷布BL係自外部之裝置被搬入,於其交付時可能引起位置偏移。預對準處理係用以將保持於上平台41之基板SB、及保持於下平台61之印刷布BL之各者概略定位於適合以後之處理之位置的處理。 As described above, the substrate SB or the printing cloth BL is carried in from the external device, and may cause a positional shift when it is delivered. The pre-alignment processing is for roughly positioning each of the substrate SB held by the upper stage 41 and the printing cloth BL held by the lower stage 61 at a position suitable for the subsequent processing.

圖19A係模式性表示用以執行預對準之構成之配置之側視圖。如上所述,於本實施形態中,於裝置上部設置有共6台預對準相機241~246。其中,3台相機241~243係用以檢測保持於上平台41之基板SB之外緣之基板用預對準相機。又,其他3台相機244~246係用以檢測 印刷布BL之外緣之印刷布用預對準相機。再者,此處雖於方便上將預對準相機241~243稱為「基板用預對準相機」,但該等可用於基板SB之位置對準及基板SB之位置對準之任一者,又,其處理內容亦相同。 Fig. 19A is a side view schematically showing a configuration for performing pre-alignment. As described above, in the present embodiment, a total of six pre-aligned cameras 241 to 246 are provided on the upper portion of the apparatus. Among them, the three cameras 241 to 243 are used to detect a substrate pre-alignment camera held on the outer edge of the substrate SB of the upper stage 41. In addition, the other three cameras 244~246 are used to detect A pre-aligned camera for printing cloth on the outer edge of the printed cloth BL. In addition, although the pre-aligned cameras 241 to 243 are referred to as "pre-alignment cameras for substrates" for convenience, these can be used for any of the alignment of the substrate SB and the alignment of the substrate SB. And, the processing content is the same.

如圖11及圖19A所示,基板用預對準相機241、242係於X方向以大致相同位置且於Y方向使位置互不相同而設置,且自上方分別拍攝基板SB之(-X)側外緣部。上平台41形成為較基板SB稍小之平面尺寸,故而可自上方拍攝延伸至較上平台41之端部更外側之基板SB(或基板SB)之(-X)側外緣部。又,圖中雖未顯示,但於圖19A紙面之近前側設置有另外1台基板用預對準相機243,該相機243自上方拍攝基板SB(或基板SB)之(-Y)側外緣部。 As shown in FIG. 11 and FIG. 19A, the substrate pre-alignment cameras 241 and 242 are disposed at substantially the same position in the X direction and are different in position in the Y direction, and the substrate SB is photographed from above (-X). Side outer edge. The upper stage 41 is formed to have a slightly smaller planar size than the substrate SB, so that the (-X) side outer edge portion of the substrate SB (or the substrate SB) extending beyond the end portion of the upper stage 41 can be photographed from above. Further, although not shown in the drawing, another substrate pre-alignment camera 243 is provided on the near side of the paper surface of FIG. 19A, and the camera 243 photographs the (-Y) side outer edge of the substrate SB (or the substrate SB) from above. unit.

另一方面,印刷布用預對準相機244、246係於X方向以大致相同位置且於Y方向使位置互不相同而設置,且自上方分別拍攝載置於下平台61上之印刷布BL之(+X)側外緣部。又,於圖19A紙面之近前側設置有另外1台印刷布用預對準相機245,該相機245自上方拍攝印刷布BL之(-Y)側外緣部。 On the other hand, the pre-aligned cameras 244 and 246 for printing cloth are disposed at substantially the same position in the X direction and the positions are different from each other in the Y direction, and the printed cloths BL placed on the lower stage 61 are respectively photographed from above. The (+X) side outer edge portion. Further, on the near side of the paper surface of Fig. 19A, another pre-aligned camera 245 for printing cloth is provided, and the camera 245 photographs the (-Y) side outer edge portion of the printing cloth BL from above.

根據該等預對準相機241~246之拍攝結果而分別掌握基板SB及印刷布BL之位置。繼而,視需要藉由使上平台區塊支持機構482及對準平台支持機構作動,而將基板SB及印刷布BL分別定位於預先設定之目標位置。 The positions of the substrate SB and the printed cloth BL are respectively grasped based on the photographing results of the pre-aligned cameras 241 to 246. Then, the substrate SB and the printing cloth BL are respectively positioned at predetermined target positions by actuating the upper platform block supporting mechanism 482 and the alignment platform supporting mechanism as needed.

再者,於使印刷布BL與下平台61一併水平移動時,如圖19A所示,較佳為各手625之上表面625a與印刷布BL之下表面稍微隔開。為實現此目的,可預先使自氣體供給部506供給之氣體自手625之吸附孔625b噴出。該情形於下述之精密對準處理中亦相同。 Further, when the printing cloth BL is horizontally moved together with the lower stage 61, as shown in Fig. 19A, it is preferable that the upper surface 625a of each hand 625 is slightly spaced from the lower surface of the printing cloth BL. To achieve this, the gas supplied from the gas supply unit 506 can be ejected from the adsorption hole 625b of the hand 625 in advance. This case is also the same in the precision alignment process described below.

又,對於薄型或大型且易產生彎曲之基板SB,為使處理變得容易,例如有將基板SB以於背面抵接有板狀之支持構件之狀態供於處 理之情形。此種情形時,即便支持構件為較基板SB大型者,亦只要設為容易檢測基板SB之外緣部之位置之構成,例如由透明材料構成支持構件,或於支持構件部分地設置透明之窗或貫通孔等,便可進行與上述相同之預對準處理。 Moreover, in order to facilitate the processing of the substrate SB which is thin or large and which is easy to be bent, for example, the substrate SB is provided in a state in which the back surface is in contact with the plate-shaped supporting member. The situation. In this case, even if the support member is larger than the substrate SB, the configuration is such that the position of the outer edge portion of the substrate SB is easily detected. For example, the support member is made of a transparent material, or a transparent window is partially provided for the support member. Or the through hole or the like, the same pre-alignment process as described above can be performed.

其次,如圖19B所示,使保持基板SB之上平台41相對於保持印刷布BL之下平台61而降下,使基板SB與印刷布BL之間隔G與預先設定之設定值一致。此時,考慮事先計測之基板SB及印刷布BL之厚度。即,以參考基板SB及印刷布BL之厚度後使兩者之間隙成為特定值之方式調整上平台41與下平台61之間隔。作為此處之間隙值G,可設為例如300μm左右。 Next, as shown in Fig. 19B, the stage 41 above the holding substrate SB is lowered with respect to the stage 61 holding the printing cloth BL, and the interval G between the substrate SB and the printing cloth BL is made to coincide with a preset setting value. At this time, the thickness of the substrate SB and the printed cloth BL measured in advance is considered. In other words, the interval between the upper stage 41 and the lower stage 61 is adjusted so that the gap between the substrate SB and the printed cloth BL is set to a specific value. The gap value G here can be, for example, about 300 μm.

關於基板SB及印刷布BL之厚度,除因製造上之尺寸偏差而引起之個體差異以外,即便為同一零件,亦要考慮例如因膨潤而引起之厚度之變化,故而較理想為每次使用時進行計測。又,關於間隙G,可以基板SB之下表面與印刷布BL之上表面之間而定義,又,亦可以基板SB之下表面與擔載於印刷布BL之圖案形成材料之圖案層PL之上表面之間而定義。只要圖案層PL之厚度於塗佈階段得以嚴格管理,則於技術上兩定義等效。 Regarding the thickness of the substrate SB and the printing cloth BL, in addition to the individual difference caused by the dimensional deviation in manufacturing, even if the same part is used, for example, the thickness change due to swelling is considered, so that it is preferable to use it every time. Take measurements. Further, the gap G may be defined between the lower surface of the substrate SB and the upper surface of the printing cloth BL, or may be the surface below the substrate SB and the pattern layer PL of the pattern forming material carried on the printing cloth BL. Defined between the surfaces. As long as the thickness of the pattern layer PL is strictly managed during the coating stage, it is technically equivalent to the definition.

以此方式將基板SB與印刷布BL隔開間隙G而對向配置後,繼而藉由使轉印輥641抵接於印刷布BL之下表面並且沿X方向移行,而使基板SB與印刷布BL密接。藉此,將印刷布BL上之圖案層PL轉印至基板SB。 In this manner, the substrate SB and the printing cloth BL are disposed opposite to each other with a gap G therebetween, and then the substrate SB and the printing cloth are made by abutting the transfer roller 641 against the lower surface of the printing cloth BL and moving in the X direction. BL is connected. Thereby, the pattern layer PL on the printing cloth BL is transferred to the substrate SB.

圖20A~圖20C表示轉印處理之過程。具體而言,如圖20A所示,使轉印輥641上升至印刷布BL之正下方位置,並且於在X方向上轉印輥641之中心線與基板SB之端部大致相同之位置、或較其向(-X)方向稍微偏離之位置配置轉印輥641。於該狀態下,如圖20B所示,使轉印輥641進一步上升而抵接於印刷布BL之下表面,且將該抵接之 位置之印刷布BL局所地向上方上推。藉此,將印刷布BL(更嚴格而言為擔載於印刷布BL之圖案層PL)以特定之按壓力按壓於基板SB之下表面。轉印輥641於Y方向上較基板SB(及有效區域AR)更長,故而基板SB之下表面中的自Y方向之一端至另一端之沿Y方向之細長之區域與印刷布BL抵接。 20A to 20C show the process of the transfer process. Specifically, as shown in FIG. 20A, the transfer roller 641 is raised to a position directly below the printing cloth BL, and the center line of the transfer roller 641 in the X direction is substantially the same as the end of the substrate SB, or The transfer roller 641 is disposed at a position slightly offset from the (-X) direction. In this state, as shown in FIG. 20B, the transfer roller 641 is further raised to abut against the lower surface of the printing cloth BL, and the abutting The position of the printed cloth BL is pushed upwards. Thereby, the printing cloth BL (more strictly, the pattern layer PL carried on the printing cloth BL) is pressed against the lower surface of the substrate SB with a specific pressing force. The transfer roller 641 is longer in the Y direction than the substrate SB (and the effective area AR), so that the elongated region in the Y direction from one end of the Y direction to the other end of the lower surface of the substrate SB is in contact with the printing cloth BL. .

藉由在如此般轉印輥641按壓印刷布BL之狀態下升降機構644朝(+X)方向移行,而使印刷布BL之上推位置向(+X)方向移動。此時,為防止手625與轉印輥641接觸,如圖20C所示,與轉印輥641之X方向距離成為特定值以下之手625向下方至少退避至該手625之上表面625a成為較支持框架642之下表面低之位置。 By moving the elevating mechanism 644 in the (+X) direction while the printing cloth BL is pressed as described above, the pushing position of the printing cloth BL is moved in the (+X) direction. At this time, in order to prevent the hand 625 from coming into contact with the transfer roller 641, as shown in FIG. 20C, the hand 625 whose distance from the transfer roller 641 in the X direction becomes a specific value or less is at least retracted downward to the upper surface 625a of the hand 625. Supports the low position of the lower surface of the frame 642.

由於利用手625之吸附已被解除,故而不會隨著手625之降下而將印刷布BL向下方下拉。又,藉由將開始降下之時序與轉印輥641之移行同步地適當進行管理,亦可防止失去利用手625之支持之印刷布BL因自重而向下方垂下。 Since the suction by the hand 625 has been released, the printing cloth BL is not pulled downward as the hand 625 is lowered. Further, by appropriately managing the timing at which the start of the lowering is synchronized with the movement of the transfer roller 641, it is possible to prevent the printed cloth BL that has lost support by the hand 625 from hanging down due to its own weight.

圖21A~圖21C表示轉印輥641之移行過程。由於暫時抵接之基板SB與印刷布BL經由圖案層PL而密接之狀態得以維持,故而如圖21A所示,隨著轉印輥641之移行,基板SB與印刷布BL密接之區域逐漸向(+X)方向擴大。此時,如圖21A所示,隨著轉印輥641接近而使手625依序降下。 21A to 21C show the transition process of the transfer roller 641. Since the state in which the temporarily abutted substrate SB and the printing cloth BL are in close contact via the pattern layer PL is maintained, as shown in FIG. 21A, as the transfer roller 641 moves, the region in which the substrate SB is in close contact with the printing cloth BL gradually becomes ( +X) The direction is expanded. At this time, as shown in FIG. 21A, the hand 625 is sequentially lowered as the transfer roller 641 approaches.

如此,最後如圖21B所示,所有手625降下,轉印輥641到達至下平台61下方之(+X)側端部。於該時間點,轉印輥641到達基板SB之(+X)側端部之大致正下方或較其稍靠(+X)側之位置,從而基板SB之下表面全部抵接於印刷布BL上之圖案層PL。 Thus, finally, as shown in FIG. 21B, all the hands 625 are lowered, and the transfer roller 641 reaches the (+X) side end portion below the lower stage 61. At this point of time, the transfer roller 641 reaches a position substantially directly below the (+X) side end of the substrate SB or slightly closer to the (+X) side, so that the lower surface of the substrate SB abuts against the printing cloth BL. The pattern layer PL on it.

於轉印輥641維持固定之高度移行之期間,印刷布BL下表面中之由轉印輥641按壓之區域之面積為固定。因此,藉由升降機構644一面賦予固定之荷重一面將轉印輥641壓抵於印刷布BL,而將基板SB與印 刷布BL一面於其等之間夾隔圖案形成材料之圖案層PL一面以固定之按壓力相互按壓。藉此,可良好地進行自基板SB向印刷布BL之圖案轉印。 While the transfer roller 641 maintains a fixed height transition, the area of the lower surface of the printing cloth BL pressed by the transfer roller 641 is fixed. Therefore, the transfer roller 641 is pressed against the printing cloth BL by the lifting mechanism 644 while imparting a fixed load, and the substrate SB and the printing are pressed. The brush cloth BL presses the pattern layer PL of the pattern forming material between them at a fixed pressing force. Thereby, the pattern transfer from the substrate SB to the printing cloth BL can be favorably performed.

再者,於圖案層PL之轉印時,較理想為可有效地利用基板SB之表面區域之整體,但於基板SB之周緣部不可避免地產生因損傷或搬送時與手之接觸等而無法有效利用之區域。如圖21B所示,於將基板SB之端部區域以外之中央部分設為有效區域AR時,較理想為至少於有效區域AR內轉印輥641之按壓力及移行速度為固定。因此,必須使轉印輥641之Y方向長度較該方向上之有效區域AR之長度更長。又,於X方向上,較理想為自較有效區域AR之(-X)方向之端部更靠(-X)側位置開始轉印輥641之移行,且維持固定速度直至至少到達有效區域AR之(+X)方向之端部。與基板SB之有效區域AR對向之印刷布BL之表面區域成為印刷布BL側之有效區域AR。 Further, in the transfer of the pattern layer PL, it is preferable that the entire surface area of the substrate SB can be effectively utilized, but in the peripheral portion of the substrate SB, contact with the hand due to damage or transportation is inevitably caused. Effective use of the area. As shown in FIG. 21B, when the central portion other than the end portion of the substrate SB is the effective region AR, it is preferable that the pressing force and the traveling speed of the transfer roller 641 are fixed at least in the effective region AR. Therefore, it is necessary to make the length of the transfer roller 641 in the Y direction longer than the length of the effective area AR in this direction. Further, in the X direction, it is preferable that the transfer roller 641 is moved from the (-X) side position from the end portion of the (X) direction of the more effective area AR, and the fixed speed is maintained until at least the effective area AR is reached. The end of the (+X) direction. The surface area of the printing cloth BL opposed to the effective area AR of the substrate SB becomes the effective area AR on the side of the printing cloth BL.

如此,轉印輥641到達(+X)側端部後,停止轉印輥641之移行,並且如圖21C所示,使轉印輥641向下方退避。藉此,轉印輥641自印刷布BL下表面分開,從而轉印處理結束。 When the transfer roller 641 reaches the (+X) side end portion, the transfer roller 641 is stopped, and as shown in FIG. 21C, the transfer roller 641 is retracted downward. Thereby, the transfer roller 641 is separated from the lower surface of the printing cloth BL, so that the transfer process is completed.

如此般轉印處理結束後,進行基板SB與印刷布BL之密接體之搬出。圖22A~圖22C表示版及印刷布之搬出之過程。首先,如圖22A所示,使轉印處理時已降下之各手625再次上升,將上表面625a定位於成為與下平台61之上表面61a同一高度之位置。於該狀態下,解除上平台41之吸附墊443對基板SB之吸附。藉此,解除上平台41對基板SB之保持,從而基板SB與印刷布BL經由圖案形成材料之圖案層PL而一體化之密接體留在下平台61上。密接體之中央部藉由手625而支持。 After the transfer processing is completed as described above, the adhesion between the substrate SB and the printing cloth BL is carried out. 22A to 22C show the process of removing the plate and the printing cloth. First, as shown in Fig. 22A, the hands 625 which have been lowered during the transfer process are raised again, and the upper surface 625a is positioned at the same height as the upper surface 61a of the lower stage 61. In this state, the adsorption of the substrate SB by the adsorption pad 443 of the upper stage 41 is released. Thereby, the holding of the substrate SB by the upper stage 41 is released, and the bonded body in which the substrate SB and the printing cloth BL are integrated via the pattern layer PL of the pattern forming material is left on the lower stage 61. The central portion of the closet is supported by hand 625.

繼而,如圖22B所示,使上平台41上升而形成較大之處理空間SP,解除利用下平台61之槽612之吸附,並且使手625進一步上升且向較下平台61更上方移動。此時,較佳為藉由手625吸附保持密接體。 Then, as shown in FIG. 22B, the upper stage 41 is raised to form a large processing space SP, the suction by the groove 612 of the lower stage 61 is released, and the hand 625 is further raised and moved upward from the lower stage 61. At this time, it is preferable to adsorb and hold the adherend by the hand 625.

以此方式可進行自外部之出入。因此,如圖22C所示,自外部接納搬送部402之印刷布用手HB,進行與搬入時相反之動作,藉此將密接有基板SB之狀態之印刷布BL搬出至外部,且搬送至剝離裝置303。繼而,若藉由剝離裝置303將基板SB自印刷布BL剝離,則於基板SB上形成圖案層。 In this way, it is possible to make an entry from the outside. Therefore, as shown in FIG. 22C, the printing cloth from the outside receiving conveyance unit 402 is operated by the hand HB, and the printing cloth BL in a state in which the substrate SB is in close contact is carried out to the outside, and is conveyed to the peeling. Device 303. Then, when the substrate SB is peeled off from the printing cloth BL by the peeling device 303, a pattern layer is formed on the substrate SB.

<<剝離裝置>> <<Peeling device>>

印刷系統100中,設置有3種剝離裝置302、303、304,但該等基本上具有同一構成。因此,對轉印裝置303進行說明,省略關於轉印裝置302、304之說明。 In the printing system 100, three kinds of peeling devices 302, 303, and 304 are provided, but these basically have the same configuration. Therefore, the transfer device 303 will be described, and the description about the transfer devices 302 and 304 will be omitted.

圖23係表示配備於圖7所示之印刷系統中之剝離裝置之一例之立體圖。剝離裝置303係用以使以主面彼此相互密接之狀態被搬入之密接體剝離之裝置。該剝離裝置303具有在安裝於殼體之主框架11上分別固定有平台區塊3及上部吸附區塊5之構造。圖23中為顯示裝置之內部構造而省略殼體之圖示。 Fig. 23 is a perspective view showing an example of a peeling device provided in the printing system shown in Fig. 7. The peeling device 303 is a device for peeling off the bonded body in which the main surfaces are in close contact with each other. The peeling device 303 has a structure in which the land block 3 and the upper suction block 5 are respectively fixed to the main frame 11 attached to the casing. In Fig. 23, the internal structure of the display device is omitted, and the illustration of the housing is omitted.

平台區塊3具有用以載置由基板SB與印刷布BL密接而成之密接體(以下,稱為「工件」)之平台30,平台30具備上表面為大致水平之平面之水平平台部31、及上表面為相對於水平面具有數度(例如2度左右)之傾斜之平面之楔形平台部32。於平台30之楔形平台部32側即(-Y)側之端部附近設置有初始剝離單元33。又,以橫跨水平平台部31之方式設置有輥單元34。 The platform block 3 has a platform 30 on which a close-contact body (hereinafter referred to as a "workpiece") in which the substrate SB and the printing cloth BL are in close contact with each other, and the platform 30 has a horizontal platform portion 31 whose upper surface is a substantially horizontal plane. And the upper surface is a wedge-shaped platform portion 32 having a plane that is inclined by several degrees (for example, about 2 degrees) with respect to the horizontal plane. An initial peeling unit 33 is provided in the vicinity of the end portion of the platform 30 on the side of the wedge-shaped platform portion 32, that is, on the (-Y) side. Further, the roller unit 34 is provided so as to straddle the horizontal platform portion 31.

另一方面,上部吸附區塊5具備自主框架11立設並且以覆蓋平台區塊3之上部之方式設置之支持框架50、以及安裝於該支持框架50之第1吸附單元51、第2吸附單元52、第3吸附單元53及第4吸附單元54。該等吸附單元51~54依序排列於(+Y)方向上。 On the other hand, the upper adsorption block 5 is provided with a support frame 50 in which the autonomous frame 11 is erected and provided to cover the upper portion of the platform block 3, and the first adsorption unit 51 and the second adsorption unit attached to the support frame 50. 52. The third adsorption unit 53 and the fourth adsorption unit 54. The adsorption units 51 to 54 are sequentially arranged in the (+Y) direction.

圖24係表示剝離裝置之主要構成之立體圖。更具體而言,圖24表示剝離裝置303之各構成中之平台30、輥單元34及第2吸附單元52之 構造。平台30具備上表面310為大致水平面之水平平台部31、及上表面320為楔形面之楔形平台部32。水平平台部31之上表面310具有較要載置之工件之平面尺寸稍大之平面尺寸。 Fig. 24 is a perspective view showing the main configuration of the peeling device. More specifically, FIG. 24 shows the platform 30, the roller unit 34, and the second adsorption unit 52 in each configuration of the peeling device 303. structure. The platform 30 has a horizontal platform portion 31 whose upper surface 310 is a substantially horizontal surface, and a wedge-shaped platform portion 32 whose upper surface 320 is a wedge-shaped surface. The upper surface 310 of the horizontal platform portion 31 has a planar size slightly larger than the planar size of the workpiece to be placed.

楔形平台部32與水平平台部31之(-Y)側端部密接而設置,其上表面320於與水平平台部31相接之部分位於與水平平台部31之上表面310相同之高度(Z方向位置),另一方面,隨著自水平平台部31向(-Y)方向分開而朝下方即(-Z)方向後退。因此,關於平台30整體,水平平台部31之上表面310之水平面與楔形平台部32之上表面320之楔形面連續,且其等連接之脊線部E成為於X方向延伸之直線狀。 The wedge-shaped platform portion 32 is disposed in close contact with the (-Y)-side end portion of the horizontal platform portion 31, and the portion of the upper surface 320 that is in contact with the horizontal platform portion 31 is located at the same height as the upper surface 310 of the horizontal platform portion 31 (Z On the other hand, as the horizontal platform portion 31 is separated from the (-Y) direction, it is moved backward toward the (-Z) direction. Therefore, with respect to the entire platform 30, the horizontal surface of the upper surface 310 of the horizontal platform portion 31 is continuous with the wedge-shaped surface of the upper surface 320 of the wedge-shaped platform portion 32, and the ridge portion E of the equal connection is formed in a straight line extending in the X direction.

又,於水平平台部31之上表面310刻設有格子狀之槽。更具體而言,於水平平台部31之上表面310之中央部設置有格子狀之槽311,並且以包圍形成有該槽311之區域之方式且以成為矩形中之楔形平台部32側之1邊除外之大致字型之方式,於水平平台部31之上表面310周緣部設置有槽312。該等槽311、312係經由控制閥而連接於負壓供給部504(圖8),具有作為藉由被供給負壓而吸附保持載置於平台30之工件之吸附槽之功能。2種槽311、312於平台上並未相連,又,經由相互獨立之控制閥而連接於負壓供給部504,故而除可使用兩種槽進行吸附以外,亦可僅使用一種槽進行吸附。 Further, a lattice-shaped groove is formed in the upper surface 310 of the horizontal platform portion 31. More specifically, a lattice-shaped groove 311 is provided in a central portion of the upper surface 310 of the horizontal platform portion 31, and is surrounded by a region in which the groove 311 is formed and which is a side of the wedge-shaped land portion 32 in a rectangular shape. Except for the margin In the manner of a font, a groove 312 is provided in a peripheral portion of the upper surface 310 of the horizontal platform portion 31. The grooves 311 and 312 are connected to the negative pressure supply unit 504 ( FIG. 8 ) via a control valve, and have a function as a suction tank that sucks and holds the workpiece placed on the stage 30 by being supplied with a negative pressure. The two types of grooves 311 and 312 are not connected to the platform, and are connected to the negative pressure supply unit 504 via independent control valves. Therefore, in addition to the two types of grooves, the adsorption can be performed using only one type of groove.

以橫跨如此構成之平台30之方式設置有輥單元34。具體而言,沿水平平台部31之X方向兩端部,於Y方向延伸設置有1對導軌351、352,該等導軌351、352固定於主框架11。繼而,相對於導軌351、352而滑動自如地安裝有輥單元34。 A roller unit 34 is provided across the platform 30 thus constructed. Specifically, a pair of guide rails 351 and 352 are extended in the Y direction along both end portions of the horizontal platform portion 31 in the X direction, and the guide rails 351 and 352 are fixed to the main frame 11. Then, the roller unit 34 is slidably attached to the guide rails 351 and 352.

輥單元34具備分別與導軌351、352滑動自如地卡合之滑塊341、342,且以將該等滑塊341、342相連之方式橫跨平台30上部而設置有於X方向延伸設置之下部角型材343。於下部角型材343,經由適當之升降機構344而升降自如地安裝有上部角型材345。而且,於X方向延 伸設置之圓柱狀之剝離輥340旋轉自如地安裝於上部角型材345。 The roller unit 34 includes sliders 341 and 342 that are slidably engaged with the guide rails 351 and 352, respectively, and is disposed to extend across the upper portion of the platform 30 so as to connect the sliders 341 and 342. Angle profile 343. The upper corner profile 345 is attached to the lower corner profile 343 by a suitable lifting mechanism 344. Moreover, extending in the X direction A cylindrical peeling roller 340 that is stretched is rotatably attached to the upper corner profile 345.

若上部角型材345藉由升降機構344而向下方即(-Z)方向下降,則剝離輥340之下表面抵接於載置在平台30之工件之上表面。另一方面,於上部角型材345藉由升降機構344而定位於上方即(+Z)方向之位置之狀態下,剝離輥340成為向上方分開工件之上表面之狀態。於上部角型材345,旋轉自如地安裝有用以抑制剝離輥340彎曲之支承輥346,並且適當設置有用以防止上部角型材345自身彎曲之肋。剝離輥340及支承輥346不具有驅動源,該等自由旋轉。 When the upper corner profile 345 is lowered downward (-Z) by the elevating mechanism 344, the lower surface of the peeling roller 340 abuts against the upper surface of the workpiece placed on the stage 30. On the other hand, in a state in which the upper corner profile 345 is positioned above the (+Z) direction by the elevating mechanism 344, the peeling roller 340 is in a state of separating the upper surface of the workpiece upward. To the upper corner profile 345, a support roller 346 for suppressing the bending of the peeling roller 340 is rotatably attached, and a rib for preventing the upper corner profile 345 from bending itself is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a driving source, and the free rotation.

輥單元34可藉由安裝於主框架11之馬達353而於Y方向移動。更具體而言,下部角型材343連結於作為將馬達353之旋轉運動轉換為直線運動之轉換機構之例如滾珠螺桿機構354,若馬達353旋轉,則下部角型材343沿導軌351、352於Y方向移動,藉此,輥單元34於Y方向移動。將剝離輥340隨著輥單元34移動之可動範圍設為於(-Y)方向上行進至水平平台部31之(-Y)側端部之附近,於(+Y)方向上行進至較水平平台部31之(+Y)側端部更外側即更靠(+Y)側之位置。 The roller unit 34 is movable in the Y direction by the motor 353 attached to the main frame 11. More specifically, the lower corner profile 343 is coupled to, for example, a ball screw mechanism 354 that is a conversion mechanism that converts the rotational motion of the motor 353 into a linear motion. When the motor 353 rotates, the lower corner profile 343 is along the guide rails 351 and 352 in the Y direction. Movement, whereby the roller unit 34 moves in the Y direction. The movable range in which the peeling roller 340 moves along with the roller unit 34 is set to travel in the (-Y) direction to the vicinity of the (-Y)-side end portion of the horizontal platform portion 31, and travels to a higher level in the (+Y) direction. The (+Y) side end portion of the platform portion 31 is located further outward than the (+Y) side.

其次,對第2吸附單元52之構成進行說明。再者,第1至第4吸附單元51~54均具有同一構造,此處代表性地對第2吸附單元52之構造進行說明。第2吸附單元52具有於X方向延伸設置且固定於支持框架50之梁構件521,於該梁構件521,在X方向上使位置互不相同地安裝有向鉛垂下方即(-Z)方向延伸之1對柱構件522、523。於柱構件522、523,經由圖中被擋住之導軌而升降自如地安裝有板構件524,板構件524藉由包含馬達及轉換機構(例如滾珠螺桿機構)之升降機構525而受升降驅動。 Next, the configuration of the second adsorption unit 52 will be described. In addition, each of the first to fourth adsorption units 51 to 54 has the same structure, and the structure of the second adsorption unit 52 will be representatively described. The second adsorption unit 52 has a beam member 521 that is extended in the X direction and is fixed to the support frame 50, and the beam member 521 is attached to the vertical direction (-Z) direction in the X direction. One pair of column members 522, 523 are extended. The column members 522 and 523 are attached to the plate members 524 so as to be lifted and lowered by the guide rails blocked in the drawing. The plate members 524 are driven by the lifting mechanism 525 including a motor and a switching mechanism (for example, a ball screw mechanism).

於板構件524之下部安裝有於X方向延伸之棒狀之墊支持構件526,於該墊支持構件526之下表面,在X方向上等間隔地排列有複數之吸附墊527。圖24中顯示使第2吸附單元52移動至較實際位置更上方 之狀態,於藉由升降機構525而使板構件524向下方移動時,吸附墊527可下降至與水平平台部31之上表面310極其接近之位置,於在平台30載置有工件之狀態下會抵接於該工件之上表面。對各吸附墊527賦予來自負壓供給部504之負壓,而將工件之上表面吸附保持。 A rod-shaped pad supporting member 526 extending in the X direction is attached to a lower portion of the plate member 524, and a plurality of adsorption pads 527 are arranged at equal intervals in the X direction on the lower surface of the pad supporting member 526. Figure 24 shows moving the second adsorption unit 52 to a position higher than the actual position. In a state where the plate member 524 is moved downward by the elevating mechanism 525, the suction pad 527 can be lowered to a position extremely close to the upper surface 310 of the horizontal platform portion 31, in a state where the workpiece is placed on the platform 30. Will abut the upper surface of the workpiece. Each of the adsorption pads 527 is given a negative pressure from the negative pressure supply portion 504, and the upper surface of the workpiece is adsorbed and held.

圖25係表示初始剝離單元之構造及各部之位置關係之側視圖。首先,一面參照圖23及圖25一面說明初始剝離單元33之構造。初始剝離單元33係於楔形平台部32之上方具有在X方向延伸設置之棒狀之按壓構件331,按壓構件331由支持臂332支持。支持臂332經由於鉛垂軸方向延伸設置之導軌333而升降自如地安裝於柱構件334,且藉由升降機構335之作動,支持臂332相對於柱構件334上下移動。柱構件334由安裝於主框架11之基座部336支持,且可藉由位置調整機構337而於特定之範圍內調整基座部336上之柱構件334之Y方向位置。 Fig. 25 is a side view showing the structure of the initial peeling unit and the positional relationship of the respective portions. First, the structure of the initial peeling unit 33 will be described with reference to FIGS. 23 and 25. The initial peeling unit 33 is a rod-shaped pressing member 331 extending in the X direction above the wedge-shaped platform portion 32, and the pressing member 331 is supported by the support arm 332. The support arm 332 is attached to the column member 334 by a guide rail 333 extending in the vertical axis direction, and is supported by the elevating mechanism 335 to move the support arm 332 up and down with respect to the column member 334. The column member 334 is supported by the base portion 336 attached to the main frame 11, and the position of the column member 334 on the base portion 336 in the Y direction can be adjusted within a specific range by the position adjustment mechanism 337.

將剝離對象物即工件WK(=基板SB+印刷布BL)載置於由水平平台部31及楔形平台部32構成之平台30。 The workpiece WK (=substrate SB+printing cloth BL), which is a peeling target, is placed on the platform 30 composed of the horizontal platform portion 31 and the wedge-shaped platform portion 32.

於工件WK中,印刷布BL具有較基板SB更大之平面尺寸,且基板SB密接於印刷布BL之大致中央部。工件WK係使印刷布BL在下且基板SB在上地被載置於平台30。此時,如圖25所示,以使工件WK中之基板SB之(-Y)側端部成為水平平台部31與楔形平台部32之交界之脊線部E之大致上方、更詳細而言為較脊線部E稍向(-Y)側偏移之位置之方式將工件WK載置於平台30。因此,於(-Y)方向上較基板SB更外側之印刷布BL以突出至楔形平台部32上方之方式配置,從而於印刷布BL之下表面與楔形平台部32之上表面320之間產生間隙。印刷布BL之下表面與楔形平台部32之上表面320所成之角θ為與楔形平台部32之楔形角相同之數度(於本實施形態中為2度)左右。 In the workpiece WK, the printing cloth BL has a larger planar size than the substrate SB, and the substrate SB is in close contact with the substantially central portion of the printing cloth BL. The workpiece WK is placed on the platform 30 with the printing cloth BL on the bottom and the substrate SB on the upper side. At this time, as shown in FIG. 25, the (-Y) side end portion of the substrate SB in the workpiece WK is substantially above the ridge line portion E at the boundary between the horizontal land portion 31 and the wedge-shaped land portion 32, and more specifically, The workpiece WK is placed on the stage 30 in such a manner that the ridge portion E is slightly displaced toward the (-Y) side. Therefore, the printing cloth BL which is outside the substrate SB in the (-Y) direction is disposed to protrude above the wedge-shaped land portion 32, thereby being generated between the lower surface of the printing cloth BL and the upper surface 320 of the wedge-shaped land portion 32. gap. The angle θ between the lower surface of the printed cloth BL and the upper surface 320 of the wedge-shaped land portion 32 is about the same as the wedge angle of the wedge-shaped land portion 32 (2 degrees in the present embodiment).

於水平平台部31設置有吸附槽311、312,吸附保持印刷布BL之下表面。其中,吸附槽311吸附與基板SB之下部接觸之印刷布BL之下 表面,另一方面,吸附槽312吸附較基板SB更外側之印刷布BL之下表面。吸附槽311、312可相互獨立地將吸附打開、關閉,且可一併使用2種吸附槽311、312而強力地吸附印刷布BL。另一方面,藉由僅使用外側之吸附槽312進行吸附,對有效地形成有圖案之印刷布BL之中央部不進行吸附,而可防止因吸附引起之印刷布BL之彎曲所導致的圖案損傷。如此,藉由獨立地控制對中央部之吸附槽311與周緣部之吸附槽312之負壓供給,可根據目的而切換印刷布BL之吸附保持之態樣。 The horizontal platform portion 31 is provided with adsorption grooves 311, 312 for adsorbing and holding the lower surface of the printing cloth BL. Wherein, the adsorption groove 311 is adsorbed under the printing cloth BL which is in contact with the lower portion of the substrate SB. On the other hand, the adsorption groove 312 adsorbs the lower surface of the printing cloth BL which is outside the substrate SB. The adsorption grooves 311 and 312 can open and close the adsorption independently of each other, and the two types of adsorption grooves 311 and 312 can be used together to strongly adsorb the printing cloth BL. On the other hand, by using only the outer adsorption groove 312 for adsorption, the central portion of the printing cloth BL on which the pattern is effectively formed is not adsorbed, and pattern damage due to bending of the printing cloth BL due to adsorption can be prevented. . By independently controlling the supply of the negative pressure to the adsorption grooves 311 of the center portion and the adsorption grooves 312 of the peripheral portion, the adsorption and holding of the printing cloth BL can be switched depending on the purpose.

如上所述,在吸附保持於平台30之工件WK之上方,配置有第1至第4吸附單元51~54及輥單元34之剝離輥340。如上所述,於第2吸附單元52之下部,在X方向上排列設置有複數之吸附墊527。更詳細而言,吸附墊527包含:吸附部527a,其係由例如橡膠或矽樹脂等具有柔軟性及彈性之材料一體形成,其下表面抵接於工件WK之上表面(更具體而言為基板SB之上表面)且吸附工件WK;及伸縮部527b,其具有朝上下方向(Z方向)之伸縮性。設置於其他吸附單元51、53及54之吸附墊亦為同一構造,以下藉由對設置於該等各吸附單元51、53及54之吸附墊分別標註符號517、537及547而相互區別。 As described above, the first to fourth adsorption units 51 to 54 and the separation roller 340 of the roller unit 34 are disposed above the workpiece WK adsorbed and held by the stage 30. As described above, a plurality of adsorption pads 527 are arranged in the X direction in the lower portion of the second adsorption unit 52. More specifically, the adsorption pad 527 includes an adsorption portion 527a integrally formed of a material having flexibility and elasticity such as rubber or silicone resin, and a lower surface abutting on the upper surface of the workpiece WK (more specifically, The upper surface of the substrate SB is attached to the workpiece WK; and the elasticized portion 527b has elasticity in the vertical direction (Z direction). The adsorption pads provided in the other adsorption units 51, 53 and 54 are also of the same structure, and the adsorption pads provided on the adsorption units 51, 53 and 54 are respectively distinguished from each other by the reference numerals 517, 537 and 547.

第1吸附單元51設置於水平平台部31之(-Y)側端部之上方,於下降時吸附基板SB之(-Y)側端部之上表面。另一方面,第4吸附單元54設置於載置在平台30之基板SB之(+Y)側端部之上方,於下降時吸附基板SB之(+Y)側端部之上表面。第2吸附單元52及第3吸附單元53適當地分散配置於該等之間,例如可使吸附墊517~547於Y方向上成為大致等間隔。於該等吸附單元51~54之間,可相互獨立地執行朝上下方向之移動及吸附之打開及關閉。 The first adsorption unit 51 is provided above the (-Y) side end portion of the horizontal platform portion 31, and adsorbs the upper surface of the (-Y) side end portion of the substrate SB when descending. On the other hand, the fourth adsorption unit 54 is provided above the (+Y) side end portion of the substrate SB placed on the stage 30, and adsorbs the upper surface of the (+Y) side end portion of the substrate SB when descending. The second adsorption unit 52 and the third adsorption unit 53 are appropriately dispersed and disposed therebetween. For example, the adsorption pads 517 to 547 can be formed at substantially equal intervals in the Y direction. The movement in the up and down direction and the opening and closing of the adsorption can be performed independently of each other between the adsorption units 51 to 54.

剝離輥340於上下方向移動而相對於基板SB進行接近、分開移動,並且藉由於Y方向移動而沿基板SB水平移動。於剝離輥340下降 之狀態下,抵接於基板SB之上表面而一面轉動一面水平移動。移動至最靠(-Y)側時之剝離輥340之位置為最靠第1吸附單元51之吸附墊517之(+Y)側的位置。為實現向此種接近位置之配置,關於第1吸附單元51,將與圖24所示之第2吸附單元52同一構造者如圖23所示般與其他第2至第4吸附單元52~54朝向相反方向而安裝於支持框架50。 The peeling roller 340 moves in the up and down direction to move closer to the substrate SB, and moves horizontally along the substrate SB by moving in the Y direction. Falling on the peeling roller 340 In this state, it abuts on the upper surface of the substrate SB and moves horizontally while rotating. The position of the peeling roller 340 when moving to the most (-Y) side is the position on the (+Y) side of the adsorption pad 517 of the first adsorption unit 51. In order to realize the arrangement of such a close position, the first adsorption unit 51 is the same as the second adsorption unit 52 shown in FIG. 24, and the other second to fourth adsorption units 52 to 54 are as shown in FIG. Mounted to the support frame 50 in the opposite direction.

初始剝離單元33係以使按壓構件331位於突出至楔形平台部32上方之印刷布BL之上方的方式調整其Y方向位置。繼而,支持臂332下降,藉此按壓構件331之下端下降而按壓印刷布BL之上表面。此時,按壓構件331之前端由彈性構件形成,以使按壓構件331不會損傷印刷布BL。 The initial peeling unit 33 adjusts the Y-direction position such that the pressing member 331 is positioned above the printing cloth BL that protrudes above the wedge-shaped land portion 32. Then, the support arm 332 is lowered, whereby the lower end of the pressing member 331 is lowered to press the upper surface of the printing cloth BL. At this time, the front end of the pressing member 331 is formed of an elastic member so that the pressing member 331 does not damage the printing cloth BL.

其次,一面參照圖26A~圖26D及圖27A~圖27D一面對如上所述般構成之剝離裝置303之剝離動作進行說明。該等圖式係表示剝離處理中之各階段之各部之位置關係之圖,且係模式性表示處理之進行狀況者。該剝離處理係藉由CPU501執行預先記憶之處理程式而控制各部來進行。 Next, the peeling operation of the peeling device 303 configured as described above will be described with reference to FIGS. 26A to 26D and FIGS. 27A to 27D. These figures are diagrams showing the positional relationship of each part of each stage in the peeling process, and are diagrammatically indicating the progress of the process. This stripping process is performed by the CPU 501 executing the processing program stored in advance to control each unit.

首先,藉由配置於轉印裝置203與剝離裝置303之間之搬送部402而將工件WK載入至平台30上之上述位置後,使裝置初始化而將裝置各部設定為特定之初始狀態。於初始狀態下,工件WK由吸附槽311、312之一者或兩者吸附保持,初始剝離單元33之按壓構件331、輥單元34之剝離輥340、第1至第4吸附單元51~54之吸附墊517~547均與工件WK隔開。又,剝離輥340於其可動範圍位於最靠(-Y)側之位置。 First, the workpiece WK is loaded onto the position on the stage 30 by the conveyance unit 402 disposed between the transfer device 203 and the peeling device 303, and then the device is initialized to set the respective portions of the device to a specific initial state. In the initial state, the workpiece WK is adsorbed and held by one or both of the adsorption grooves 311, 312, the pressing member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the first to fourth adsorption units 51 to 54. The adsorption pads 517 to 547 are all spaced apart from the workpiece WK. Further, the peeling roller 340 is located at the most (-Y) side of the movable range.

自該狀態,使第1吸附單元51及剝離輥340下降而分別抵接於工件WK之上表面。此時,如圖26A所示,第1吸附單元51之吸附墊517吸附基板SB之(-Y)側端部之上表面,剝離輥340於其(+Y)側鄰接位置抵接於基板SB之上表面。圖26A中標註於按壓構件331附近之向下箭頭係指按壓構件331於下一步驟中自圖中所示之狀態沿該箭頭方向移 動。於以下圖中亦相同。 From this state, the first adsorption unit 51 and the peeling roller 340 are lowered to abut against the upper surface of the workpiece WK. At this time, as shown in FIG. 26A, the adsorption pad 517 of the first adsorption unit 51 adsorbs the upper surface of the (-Y) side end portion of the substrate SB, and the peeling roller 340 abuts on the substrate SB at the (+Y) side adjacent position. Above the surface. The downward arrow indicated in the vicinity of the pressing member 331 in Fig. 26A means that the pressing member 331 is moved in the direction of the arrow from the state shown in the figure in the next step. move. The same is true in the following figures.

其次,使初始剝離單元33作動,使按壓構件331下降而按壓印刷布BL端部。印刷布BL之端部突出於楔形平台部32之上方,從而於其下表面與楔形平台32之上表面320之間具有間隙。因此,如圖26B所示,藉由按壓構件331將印刷布BL之端部向下方按壓,印刷布BL之端部沿楔形平台部32之楔形面向下方彎曲。其結果,由第1吸附單元51吸附保持之基板SB之端部與印刷布BL之間分開而開始剝離。按壓構件331形成為於X方向延伸之棒狀,且其X方向長度設定為較印刷布BL更長。因此,按壓構件331抵接於印刷布BL之抵接區域自印刷布BL之(-X)側端部呈直線狀延伸至(+X)側端部。藉此,可使印刷布BL呈柱面狀彎曲,且可使基板SB與印刷布BL已剝離之剝離區域與尚未剝離之未剝離區域之交界線(以下,稱為「剝離交界線」)成為直線狀。 Next, the initial peeling unit 33 is actuated to lower the pressing member 331 and press the end portion of the printing cloth BL. The end of the printed cloth BL protrudes above the wedge-shaped land portion 32 so as to have a gap between the lower surface thereof and the upper surface 320 of the wedge-shaped platform 32. Therefore, as shown in FIG. 26B, the end portion of the printing cloth BL is pressed downward by the pressing member 331, and the end portion of the printing cloth BL is bent downward along the wedge-shaped surface of the wedge-shaped land portion 32. As a result, the end portion of the substrate SB adsorbed and held by the first adsorption unit 51 is separated from the printing cloth BL to start peeling. The pressing member 331 is formed in a rod shape extending in the X direction, and its length in the X direction is set to be longer than the printing cloth BL. Therefore, the abutting region where the pressing member 331 abuts against the printing cloth BL linearly extends from the (-X) side end portion of the printing cloth BL to the (+X) side end portion. Thereby, the printing cloth BL can be bent in a cylindrical shape, and the boundary between the peeling region where the substrate SB and the printing cloth BL has been peeled off and the unpeeled region which has not been peeled off (hereinafter referred to as "peeling boundary line") can be obtained. Straight.

自該狀態,使第1吸附單元51開始上升,並且與其同步地使剝離輥340朝(+Y)方向移動。具體而言,在藉由第1吸附單元51之上升而向(+Y)方向移動之剝離交界線到達剝離輥340正下方之時序,開始剝離輥340之移動。藉此,剝離輥340抵接於基板SB之區域向(+Y)方向移動。此後,第1吸附單元51向上方即(+Z)方向以固定速度移動,且剝離輥340向(+Y)方向以固定速度移動。 From this state, the first adsorption unit 51 starts to rise, and the peeling roller 340 is moved in the (+Y) direction in synchronization with this. Specifically, the peeling boundary line that moves in the (+Y) direction by the rise of the first adsorption unit 51 reaches the timing immediately below the peeling roller 340, and the movement of the peeling roller 340 is started. Thereby, the peeling roller 340 moves in the (+Y) direction in contact with the region of the substrate SB. Thereafter, the first adsorption unit 51 moves at a fixed speed upward in the (+Z) direction, and the peeling roller 340 moves at a fixed speed in the (+Y) direction.

如圖26C所示,藉由保持基板SB之端部之第1吸附單元51上升而將基板SB上提,從而與印刷布BL之剝離朝(+Y)方向進行,且因使剝離輥340進行抵接,故不會超出剝離輥340之抵接區域進行剝離。藉由使剝離輥340一面抵接於基板SB一面以固定速度向(+Y)方向移動,可將剝離之進行速度維持為固定。即,剝離交界線成為沿輥延伸設置方向即X方向之一直線,而且以固定速度向(+Y)方向進行。藉此,可確實地防止因剝離之進行速度之變動產生之應力集中所導致之圖案損 傷。 As shown in FIG. 26C, the substrate SB is lifted by raising the first adsorption unit 51 at the end of the substrate SB, and the peeling from the printing cloth BL is performed in the (+Y) direction, and the peeling roller 340 is performed. Since it abuts, it does not peel off beyond the contact area of the peeling roll 340. By moving the peeling roller 340 to the (+Y) direction at a fixed speed while abutting against the substrate SB, the peeling speed can be maintained constant. In other words, the peeling boundary line is a straight line in the X direction along the direction in which the roll extends, and is performed in the (+Y) direction at a constant speed. Thereby, it is possible to reliably prevent the pattern loss caused by the stress concentration caused by the change in the speed of the peeling. hurt.

繼而,將用於以下處理之內部控制參數N之值設定為2。然後,等待剝離輥340通過第N個吸附位置。第N個吸附位置係基板SB上表面中之第N個吸附單元(N=1~4)之正下方位置,且係受到該第N個吸附單元之吸附之位置。 Then, the value of the internal control parameter N used for the following processing is set to 2. Then, the peeling roller 340 is waited for the Nth adsorption position. The Nth adsorption position is a position immediately below the Nth adsorption unit (N=1 to 4) in the upper surface of the substrate SB, and is subjected to adsorption by the Nth adsorption unit.

此處,由於N=2,故而於剝離輥340通過第2吸附位置、即第2吸附單元52之正下方位置之前進行等待。若剝離輥340通過第2吸附位置,則第2吸附單元52開始下降,藉由第2吸附單元52之吸附墊527而捕捉基板SB。 Here, since N=2, the peeling roller 340 waits before passing through the second adsorption position, that is, the position immediately below the second adsorption unit 52. When the peeling roller 340 passes the second adsorption position, the second adsorption unit 52 starts to descend, and the substrate SB is captured by the adsorption pad 527 of the second adsorption unit 52.

如圖26D所示,由於剝離輥340已通過,故而於第2吸附單元52之正下方位置,基板SB成為自印刷布BL剝離而朝上方隆起之狀態。藉由對由具有伸縮性之彈性構件構成之吸附墊527賦予負壓並使其靠近基板SB,可於吸附墊527之下表面抵接於基板SB之上表面之時間點捕捉基板SB並予以吸附。亦可為於使吸附墊527下降至特定位置之後,等待被上提之基板SB之態樣。於任一情形時,均可藉由使吸附墊具有柔軟性而防止吸附之失敗。 As shown in FIG. 26D, since the peeling roller 340 has passed, the substrate SB is peeled off from the printing cloth BL and is raised upward as it is located immediately below the second adsorption unit 52. By applying a negative pressure to the adsorption pad 527 composed of the elastic member having elasticity and bringing it closer to the substrate SB, the substrate SB can be captured and adsorbed at a time point when the lower surface of the adsorption pad 527 abuts the upper surface of the substrate SB. . It is also possible to wait for the substrate SB to be lifted after the adsorption pad 527 is lowered to a specific position. In either case, the failure of adsorption can be prevented by making the adsorption pad soft.

於開始基板SB之吸附之後,將第2吸附單元52之移動轉變為上升。藉此,如圖27A所示,剝離之進行速度依然由剝離輥340控制,並且用於剝離之將基板SB上提之主體自第1吸附單元51接續至第2吸附單元52。又,剝離後之基板SB自僅由第1吸附單元51保持切換為由第1吸附單元51與第2吸附單元52保持,從而保持部位增加。再者,於各吸附單元51~54上升時,以使剝離後之基板SB之姿勢成為大致平面之方式維持各吸附單元51~54間之Z方向上之相對位置。 After the adsorption of the substrate SB is started, the movement of the second adsorption unit 52 is changed to rise. Thereby, as shown in FIG. 27A, the peeling progress speed is still controlled by the peeling roller 340, and the main body for lifting the substrate SB for peeling is connected from the first adsorption unit 51 to the second adsorption unit 52. Moreover, the substrate SB after peeling is switched from being held by only the first adsorption unit 51 to be held by the first adsorption unit 51 and the second adsorption unit 52, and the holding portion is increased. In addition, when each of the adsorption units 51 to 54 is raised, the relative position in the Z direction between the adsorption units 51 to 54 is maintained so that the posture of the substrate SB after peeling is substantially flat.

繼而,將控制參數N之值加1,處理成為返回至步驟S107之循環處理直至參數N成為4為止。因此,於下一循環中,於剝離輥340通過第3吸附單元53正下方之第3吸附位置之時間點,開始第3吸附單元53 之下降,如圖27B所示,用於剝離之將基板SB上提之主體自第2吸附單元52移行至第3吸附單元53。於進而下一循環中,於剝離輥340通過第4吸附位置之後第4吸附單元54下降,將基板SB上提。藉由變更步驟S110中之N之上限值,即便於吸附單元之數與上述不同之情形時亦可應對。 Then, the value of the control parameter N is incremented by 1, and the process returns to the loop process of step S107 until the parameter N becomes 4. Therefore, in the next cycle, the third adsorption unit 53 is started at the time point when the peeling roller 340 passes through the third adsorption position immediately below the third adsorption unit 53. As shown in FIG. 27B, the main body for lifting the substrate SB for peeling is transferred from the second adsorption unit 52 to the third adsorption unit 53. In the next cycle, after the peeling roller 340 passes through the fourth adsorption position, the fourth adsorption unit 54 is lowered to lift the substrate SB. By changing the upper limit of N in step S110, it is possible to cope even when the number of adsorption units is different from the above.

藉由如此利用第4吸附單元54上提基板SB,而如圖27C所示般基板SB整體自印刷布BL被拉離。因此,使第4吸附單元54上升之後,使剝離輥340移動至較平台30更靠(+Y)側且使其移動停止。而且,如圖27D所示,使各吸附單元51~54全部上升至相同高度後停止。又,使初始剝離單元33之按壓構件331分開印刷布BL,移動至較印刷布BL之上表面更上方且較印刷布BL之(-Y)側端部更靠(-Y)側之退避位置(步驟S114)。其後,解除利用吸附槽對印刷布BL之吸附保持,將分離之基板SB及印刷布BL搬出至裝置外,藉此剝離處理完成。 By lifting the substrate SB by the fourth adsorption unit 54 as described above, the entire substrate SB is pulled away from the printing cloth BL as shown in Fig. 27C. Therefore, after the fourth adsorption unit 54 is raised, the peeling roller 340 is moved to the (+Y) side of the platform 30 and the movement is stopped. Further, as shown in Fig. 27D, all the adsorption units 51 to 54 are raised to the same height and then stopped. Further, the pressing member 331 of the initial peeling unit 33 is separated from the printing cloth BL, and moved to a position further above the upper surface of the printing cloth BL and closer to the (-Y) side than the (-Y) side end portion of the printing cloth BL. (Step S114). Thereafter, the suction and holding of the printing cloth BL by the adsorption tank are released, and the separated substrate SB and the printing cloth BL are carried out to the outside of the apparatus, whereby the peeling process is completed.

使各吸附單元51~54之高度相同之原因在於,藉由將剝離後之基板SB與印刷布BL平行地保持,而使外部機器人或由操作員插入之取出用手之出入、與印刷布BL及基板SB之交接變得容易。 The reason why the heights of the respective adsorption units 51 to 54 are the same is that the external robot or the take-out by the operator is taken out by the operator and the printed cloth BL by holding the peeled substrate SB in parallel with the printing cloth BL. The transfer to the substrate SB is easy.

<<清洗裝置>> <<Cleaning device>>

於印刷系統100中,為清洗用於圖案化處理後之版PPi且將其供於再利用,而設置有版用清洗裝置720,並且為清洗用於自印刷布BL除去殘留墨水RI後之轉印板TPi且將其供於再利用,而設置有轉印板用清洗裝置730。該等具有與日本專利特開平9-155306號公報或日本專利特開2006-41439號公報等中記載之清洗裝置相同之構成。因此,對清洗裝置730進行說明而省略對清洗裝置720之說明。圖28係表示清洗用於墨水除去後之轉印板之清洗裝置之概況之側視圖。於該清洗裝置730中,清洗罩731之內部空間藉由2塊間隔壁而分隔成3個處理空間。於各間隔壁,以相對於水平面(XY平面)傾斜之姿勢形成有開口,以便 可供轉印板TP通過。又,以通過各開口並貫通處理空間之方式隔開特定之間隔而於X方向配置有複數之傾斜輥732,藉由滾子搬送(輥搬送)而可依序於3個處理空間內移動轉印板TP。 In the printing system 100, in order to clean the plate PPi used for the patterning process and supply it for reuse, a plate cleaning device 720 is provided, and the cleaning is performed for removing the residual ink RI from the printing cloth BL. The printing plate TPi is provided for reuse, and a transfer plate cleaning device 730 is provided. The configuration is the same as that of the cleaning device described in Japanese Laid-Open Patent Publication No. Hei 9-155306 or Japanese Patent Laid-Open No. Hei. No. 2006-41439. Therefore, the cleaning device 730 will be described, and the description of the cleaning device 720 will be omitted. Figure 28 is a side view showing an outline of a cleaning apparatus for cleaning a transfer sheet for ink removal. In the cleaning device 730, the internal space of the cleaning cover 731 is divided into three processing spaces by two partition walls. Openings are formed in each of the partition walls in a posture inclined with respect to a horizontal plane (XY plane) so that The transfer plate TP is available for passage. Further, a plurality of inclined rolls 732 are arranged in the X direction at a predetermined interval so as to penetrate the processing space through the respective openings, and can be moved in three processing spaces in sequence by roller conveyance (roll conveyance). Printing plate TP.

於該等處理空間中,分別設置有預濕部733、藥液處理部734及沖洗部735。該等中於轉印板TPi之搬送方向上位於最上游側之預濕部733自淋浴噴嘴7331將水或特定之藥液供給至轉印板TPi以使轉印板TPi預濕。又,與預濕部733之(+X)方向側鄰接之藥液處理部734自二流體噴嘴7341對通過預濕部733之轉印板TPi供給清洗用之藥液而實施清洗處理。進而,與藥液處理部734之(+X)方向側鄰接之沖洗部735自淋浴噴嘴7351對通過藥液處理部734之轉印板TPi供給水等沖洗液,而沖去清洗用之藥液。再者,於搬送中,轉印板TPi相對於水平面傾斜,故而供給至轉印板TPi之液體會隨時向重力方向下側流下。如此,對轉印板TPi進行濕式清洗而將轉印於該轉印板TPi之殘留墨水RI清洗除去,且將其作為轉印板TP0而再利用。再者,為強制地使轉印板TP0乾燥,亦可於沖洗部735之(+X)方向側設置乾燥部。如以上般,於上述印刷系統100中,由轉印裝置204、剝離裝置304、及配置於轉印裝置204與剝離裝置304之間之搬送部402而構成本發明之「除去裝置」。即,藉由轉印裝置204使轉印板TP密接於附著有殘留墨水RI之印刷布BLi之表面SF而形成密接體(工件WK),此時將殘留墨水RI轉印至轉印板TP。繼而,密接體藉由搬送部402而搬送至剝離裝置304,且藉由該剝離裝置304將轉印板TP於擔載有殘留墨水RI之狀態下自印刷布BL剝離,從而自印刷布BL之表面SF除去殘留墨水RI。因此,與第1實施形態同樣地,可有效率地進行殘留墨水RI自印刷布BL之除去。 The pre-wet portion 733, the chemical solution processing portion 734, and the rinse portion 735 are provided in the processing spaces. The pre-wet portion 733 located on the most upstream side in the transport direction of the transfer plate TPi supplies water or a specific chemical solution from the shower nozzle 7331 to the transfer plate TPi to pre-wet the transfer plate TPi. In addition, the chemical solution processing unit 734 adjacent to the (+X) direction side of the pre-wet portion 733 supplies the cleaning liquid to the transfer plate TPi passing through the pre-moist unit 733 from the two-fluid nozzle 7341, and performs a cleaning process. Further, the rinsing unit 735 adjacent to the (+X) direction side of the chemical processing unit 734 supplies the rinsing liquid such as water to the transfer plate TPi passing through the chemical processing unit 734 from the shower nozzle 7351, and flushes the cleaning liquid. . Further, during the conveyance, the transfer plate TPi is inclined with respect to the horizontal plane, so that the liquid supplied to the transfer plate TPi flows down to the lower side in the direction of gravity. In this manner, the transfer sheet TPi is wet-cleaned, and the residual ink RI transferred to the transfer sheet TPi is cleaned and removed, and reused as the transfer sheet TP0. Further, in order to forcibly dry the transfer sheet TP0, a drying portion may be provided on the (+X) direction side of the rinse portion 735. As described above, in the printing system 100 described above, the transfer device 204, the peeling device 304, and the transport unit 402 disposed between the transfer device 204 and the peeling device 304 constitute the "removal device" of the present invention. In other words, the transfer sheet TP is brought into close contact with the surface SF of the printing cloth BLi to which the residual ink RI is adhered to form a close contact (work WK), and at this time, the residual ink RI is transferred to the transfer sheet TP. Then, the adhesion body is conveyed to the peeling device 304 by the conveyance unit 402, and the transfer sheet TP is peeled off from the printing cloth BL in a state where the residual ink RI is carried by the peeling device 304, thereby being printed from the printing cloth BL. The surface SF removes the residual ink RI. Therefore, similarly to the first embodiment, the residual ink RI can be efficiently removed from the printing cloth BL.

又,如圖7所示,於上述印刷系統100中,一面將印刷布BL沿環狀之印刷布搬送路徑PTB搬送,一面藉由配置於該印刷布搬送路徑 PTB上之轉印裝置202~204、剝離裝置302~304及塗佈裝置800重複進行塗佈處理、印刷處理及除去處理,藉此可量產出形成有具有所需之圖案(版PP之反轉圖案)之圖案層PL之基板SB。又,按照處理順序將該等裝置沿印刷布搬送路徑PTB配置成環狀。即,將塗佈裝置800、轉印裝置202、剝離裝置302、轉印裝置203、剝離裝置303、轉印裝置204、及剝離裝置304依此順序於印刷布搬送路徑PTB上配置成環狀。藉由採用此種配置佈局而可抑制印刷系統100之佔有面積、即所謂印刷系統100之佔據面積。 Further, as shown in FIG. 7, in the printing system 100, the printing cloth BL is conveyed along the circular printing cloth transport path PTB while being disposed on the printing cloth transport path. The transfer devices 202 to 204, the peeling devices 302 to 304, and the coating device 800 on the PTB are repeatedly subjected to a coating process, a printing process, and a removal process, whereby a desired pattern (the reverse of the PP) is formed in a quantity. The substrate SB of the pattern layer PL of the transfer pattern). Further, the devices are arranged in a ring shape along the printing cloth transport path PTB in the order of processing. In other words, the coating device 800, the transfer device 202, the peeling device 302, the transfer device 203, the peeling device 303, the transfer device 204, and the peeling device 304 are arranged in a ring shape on the printing cloth transport path PTB in this order. By adopting such a configuration layout, the occupied area of the printing system 100, that is, the occupied area of the so-called printing system 100 can be suppressed.

如此於印刷系統100中,配置於印刷布搬送路徑PTB上之搬送部402作為本發明之「第1搬送部」、「第2搬送部」及「第3搬送部」而發揮功能。又,藉由轉印裝置202及剝離裝置302進行使印刷布BL上之塗佈層CL圖案化而形成圖案層之圖案化處理,進而藉由轉印裝置203及剝離裝置303將上述圖案層轉印至基板SB而於基板SB形成圖案層。即,轉印裝置202、203及剝離裝置302、303之組合作為本發明之「印刷裝置」而發揮功能。然而,印刷裝置之構成並不限定於此。例如亦可代替轉印裝置203及剝離裝置303而使用專利文獻1中記載之裝置進行圖案化處理。又,亦可代替轉印裝置203及剝離裝置303而使用專利文獻1中記載之裝置進行轉印處理。 In the printing system 100, the transport unit 402 disposed on the printing cloth transport path PTB functions as the "first transport unit", the "second transport unit", and the "third transport unit" of the present invention. Further, the transfer device 202 and the peeling device 302 perform patterning processing for patterning the coating layer CL on the printing cloth BL to form a pattern layer, and further transfer the pattern layer by the transfer device 203 and the peeling device 303. A pattern layer is formed on the substrate SB by printing onto the substrate SB. That is, the combination of the transfer devices 202 and 203 and the peeling devices 302 and 303 functions as the "printing device" of the present invention. However, the configuration of the printing apparatus is not limited to this. For example, instead of the transfer device 203 and the peeling device 303, the device described in Patent Document 1 may be used for patterning. Further, instead of the transfer device 203 and the peeling device 303, the transfer process may be performed using the device described in Patent Document 1.

又,於上述印刷系統100中,設為沿環狀之版搬送路徑PTP搬送版PP且可再利用版PP之構成,但亦可構成為針對每一圖案化處理將新的版PP搬入至轉印裝置202。又,設為沿環狀之轉印板搬送路徑PTT搬送轉印板TP且可再利用轉印板TP之構成,但亦可構成為針對每一除去處理將新的轉印板TP搬入至轉印裝置204。 Further, in the printing system 100 described above, the configuration is such that the plate PP is transported along the ring-shaped plate transport path PTP and the reusable plate PP is used. However, the new plate PP may be moved to the turn for each patterning process. Printing device 202. Further, although the transfer plate TP is transported along the annular transfer sheet transport path PTT and the transfer plate TP can be reused, the new transfer plate TP can be moved to the transfer for each removal process. Printing device 204.

又,作為上述印刷系統100中之「除去裝置」,亦可使用圖1所示之除去裝置1A、圖4所示之除去裝置1B或圖6所示之除去裝置1C。 Further, as the "removal device" in the printing system 100, the removing device 1A shown in Fig. 1, the removing device 1B shown in Fig. 4, or the removing device 1C shown in Fig. 6 can be used.

<其他> <Other>

再者,本發明並不限定於上述實施形態,可於不脫離其主旨之範圍內進行除上述以外之各種變更。例如,於上述第1實施形態、第2實施形態及第4實施形態中,轉印板TP被真空吸附保持,但保持之態樣為任意而並不限定於此。 The present invention is not limited to the above-described embodiments, and various modifications other than the above may be made without departing from the spirit and scope of the invention. For example, in the first embodiment, the second embodiment, and the fourth embodiment, the transfer plate TP is vacuum-sucked and held, but the aspect of the transfer plate TP is arbitrary, and is not limited thereto.

又,於上述第3實施形態中,一面使轉印輥TR於特定位置旋轉一面使印刷布BL於X方向移動,但亦可構成為一方面將印刷布BL保持於特定位置,另一方面使轉印輥TR一面旋轉一面於X方向移動。總之,只要構成為使印刷布BL相對於轉印輥TR相對地在相當於本發明之「第1方向」之X方向上移動即相對移動即可。再者,於第3實施形態中,Y方向相當於本發明之「第2方向」。 Further, in the third embodiment, the printing cloth BL is moved in the X direction while the transfer roller TR is rotated at a specific position. However, the printing cloth BL may be held at a specific position on the one hand, and the printing cloth BL may be held at a specific position. The transfer roller TR moves in the X direction while rotating. In short, the printing cloth BL may be moved relative to the transfer roller TR in the X direction corresponding to the "first direction" of the present invention. Further, in the third embodiment, the Y direction corresponds to the "second direction" of the present invention.

又,於上述實施形態中,將印刷布BL設為本發明之「板狀體」之一例,又,將印刷布BL上之殘留墨水RI設為本發明之「附著物」,但本發明之應用對象並不限定於此,例如對於將附著於基板之物質藉由轉印板TP或轉印輥TR等轉印體除去之除去裝置亦可應用本發明。 Further, in the above-described embodiment, the printing cloth BL is an example of the "plate-like body" of the present invention, and the residual ink RI on the printing cloth BL is referred to as the "attachment" of the present invention. The application target is not limited thereto, and the present invention can also be applied to, for example, a removal device that removes a substance adhering to a substrate by a transfer body such as a transfer plate TP or a transfer roller TR.

又,於上述實施形態中,將轉印板TP或轉印輥TR藉由其表面張力低於印刷布BL之表面SF之表面張力、且具有較印刷布BL之表面SF高之潤濕性的材料而形成,但亦可僅將與印刷布BL密接之密接部位以表面張力低於印刷布BL之表面SF之表面張力之方式構成。即,只要構成為轉印板TP或轉印輥TR等轉印體中之至少與印刷布BL或基板等板狀體之一主面密接之密接部位之表面張力低於板狀體之一主面之表面張力即可。 Further, in the above embodiment, the transfer plate TP or the transfer roller TR has a surface tension lower than the surface tension of the surface SF of the printing cloth BL and has a higher wettability than the surface SF of the printing cloth BL. The material is formed, but only the adhesion portion that is in close contact with the printing cloth BL may be configured such that the surface tension is lower than the surface tension of the surface SF of the printing cloth BL. In other words, the surface tension of at least the adhesive portion of the transfer sheet such as the transfer sheet TP or the transfer roller TR that is in close contact with one of the main surfaces of the printing sheet BL or the substrate is lower than that of the plate-shaped body. The surface tension of the surface can be.

本發明可較佳地應用於將附著於印刷布或基板等板狀體之附著物除去之除去技術、以及使用該除去技術之印刷系統。 The present invention can be preferably applied to a technique for removing an adhering matter attached to a plate-like body such as a printing cloth or a substrate, and a printing system using the removing technique.

201‧‧‧轉印裝置 201‧‧‧Transfer device

301‧‧‧剝離裝置 301‧‧‧ peeling device

2011‧‧‧轉印板保持部(第1轉印體保持部) 2011‧‧‧Transfer plate holding portion (first transfer body holding portion)

2012‧‧‧印刷布保持部(第1板狀體保持部) 2012‧‧‧Printing cloth holding unit (first plate-shaped body holding unit)

3011‧‧‧轉印板保持部(第2轉印體保持部) 3011‧‧‧Transfer plate holding portion (second transfer body holding portion)

3012‧‧‧印刷布保持部(第2板狀體保持部) 3012‧‧‧Printing cloth holding portion (second plate-shaped body holding portion)

AB‧‧‧密接體 AB‧‧‧Block

BL‧‧‧印刷布 BL‧‧‧Printed cloth

BL0‧‧‧印刷布 BL0‧‧‧Printed cloth

BLi‧‧‧印刷布 BLi‧‧‧Printed cloth

RI‧‧‧殘留墨水(附著物) RI‧‧‧Residual ink (attachment)

SF‧‧‧(印刷布之)表面 SF‧‧‧ (printed cloth) surface

TP‧‧‧轉印板 TP‧‧·transfer plate

TP0‧‧‧轉印板 TP0‧‧‧Transfer board

TPi‧‧‧轉印板 TPi‧‧Transfer board

Claims (14)

一種除去方法,其係將附著於板狀體之一主面之附著物除去者,其特徵在於包括:轉印步驟,其係使轉印體密接於上述板狀體之一主面而將上述附著物轉印至上述轉印體;及剝離步驟,其係將密接於上述板狀體之一主面之上述轉印體自上述板狀體剝離,而自上述板狀體之一主面除去上述附著物。 A removal method for removing an adhering matter attached to one main surface of a plate-shaped body, comprising: a transfer step of adhering a transfer body to one main surface of the plate-like body to The deposit is transferred to the transfer body; and the peeling step is performed by peeling the transfer body that is in close contact with one of the main surfaces of the plate-shaped body from the plate-like body, and removing the main surface from one of the plate-shaped bodies The above attachments. 如請求項1之除去方法,其中上述轉印體中至少密接於上述板狀體之一主面之密接部位之表面張力低於上述板狀體之一主面之表面張力。 The method of removing claim 1, wherein a surface tension of at least the adhesion portion of the transfer body that is in close contact with one of the main faces of the plate-like body is lower than a surface tension of one of the main faces of the plate-like body. 如請求項1或2之除去方法,其中上述轉印體具有可與上述板狀體之一主面整體密接之一主面,上述轉印步驟係使上述板狀體之一主面整體與上述轉印體之一主面密接之步驟,上述剝離步驟係於藉由上述轉印步驟使上述板狀體之一主面整體與上述轉印體之一主面密接而將上述附著物轉印至上述轉印體之一主面之後,將上述轉印體自上述板狀體剝離之步驟。 The method of claim 1 or 2, wherein the transfer body has a main surface that is in close contact with one of the main faces of the plate-like body, and the transfer step is such that one of the main faces of the plate-like body is as described above a step of adhering one main surface of the transfer body to the peeling step by transferring the entire main surface of one of the plate-shaped bodies to one main surface of the transfer body by the transfer step, thereby transferring the attached matter to After the main surface of one of the transfer bodies, the transfer body is peeled off from the plate-shaped body. 如請求項3之除去方法,其進而包括清洗步驟,該清洗步驟係將自上述板狀體剝離之上述轉印體進行清洗而將上述附著物自上述轉印體除去,且將接受過上述清洗步驟之上述轉印體進行再利用。 The method of removing claim 3, further comprising a washing step of washing the transfer body peeled from the plate-like body to remove the deposit from the transfer body, and receiving the cleaning The above transfer body of the step is reused. 如請求項1或2之除去方法,其包括移動步驟,該移動步驟係於與上述板狀體之一主面平行之第1方向上使上述板狀體相對於上述轉印體進行相對移動, 上述轉印體被加工成圓筒或圓柱形狀,且於與上述板狀體之一主面平行且與上述第1方向正交之第2方向上具有可與上述板狀體之一面抵接之周面,上述轉印步驟為如下步驟,即,藉由在使上述轉印體之周面與上述板狀體之一面抵接之狀態下使上述轉印體隨著上述板狀體朝上述第1方向之相對移動而旋轉,而於上述轉印體之周面與上述板狀體之一面密接之密接位置進行上述附著物向上述轉印體之轉印,上述剝離步驟係藉由上述板狀體朝上述第1方向之相對移動與上述轉印體之旋轉,使轉印至上述轉印體之周面之上述附著物自上述板狀體分開而剝離之步驟。 The method of removing claim 1 or 2, comprising: a moving step of relatively moving the plate-like body relative to the transfer body in a first direction parallel to a main surface of the plate-like body; The transfer body is processed into a cylindrical or cylindrical shape, and is in contact with one of the plate-like bodies in a second direction parallel to one main surface of the plate-shaped body and orthogonal to the first direction. In the circumferential surface, the transfer step is such that the transfer body is brought into contact with the plate-like body in a state in which the peripheral surface of the transfer body is brought into contact with one surface of the plate-shaped body. The first direction of the transfer body rotates relative to each other, and the attachment surface is transferred to the transfer body at a position where the peripheral surface of the transfer body is in close contact with the one surface of the plate-shaped body. The peeling step is performed by the plate shape. The relative movement of the body in the first direction and the rotation of the transfer body are performed so that the deposit transferred to the peripheral surface of the transfer body is separated from the plate-like body and peeled off. 如請求項5之除去方法,其進而包括清洗步驟,該清洗步驟係於上述轉印體之周面中附著上述附著物之周面部位自上述板狀體分開之後、且於藉由上述板狀體朝上述第1方向之相對移動與上述轉印體之旋轉而再次與上述板狀體之一面抵接之前,清洗上述周面部位而將上述附著物自上述轉印體除去。 The method of removing the claim 5, further comprising a washing step of separating the peripheral surface portion to which the attached matter adheres from the peripheral surface of the transfer body from the plate-shaped body, and by the plate shape Before the relative movement of the body in the first direction and the rotation of the transfer body are again brought into contact with one surface of the plate-shaped body, the peripheral surface portion is washed and the attached material is removed from the transfer body. 一種除去裝置,其係將附著於板狀體之一主面之附著物除去者,其特徵在於:於使轉印體密接於上述板狀體之一主面而將上述附著物轉印至上述轉印體之後,將上述轉印體自上述板狀體剝離而自上述板狀體之一主面除去上述附著物。 A removing device for removing an adhering matter attached to one main surface of a plate-like body, wherein the transfer body is adhered to one main surface of the plate-shaped body to transfer the deposit to the above After the transfer body, the transfer body is peeled off from the plate-like body to remove the deposit from one main surface of the plate-shaped body. 如請求項7之除去裝置,其包含:轉印裝置,其包含第1轉印體保持部、第1板狀體保持部及第1驅動部,上述第1轉印體保持部保持上述轉印體,上述第1板狀體保持部以使上述板狀體之一主面與被保持於上述第1轉印體保持部之上述轉印體相面對之方式保持上述板狀體,上述第1驅動 部驅動上述第1轉印體保持部及上述第1板狀體保持部之至少一者而使其等相互接近,藉此使上述轉印體密接於上述板狀體之一主面而形成密接體;且藉由上述密接體之形成而使上述附著物轉印至上述轉印體;剝離裝置,其包含第2轉印體保持部、第2板狀體保持部及第2驅動部,上述第2轉印體保持部保持構成上述密接體之上述轉印體,上述第2板狀體保持部保持構成上述密接體之上述板狀體,上述第2驅動部驅動上述第2轉印體保持部及上述第2板狀體保持部之至少一者而使其等相互分開,從而使密接於上述板狀體之一主面之上述轉印體自上述板狀體剝離;且藉由上述轉印體自上述板狀體剝離而自上述板狀體之一主面除去上述附著物;及搬送裝置,其將上述密接體自上述轉印裝置搬送至上述剝離裝置。 The removal device of claim 7, comprising: a transfer device including a first transfer body holding portion, a first plate-shaped body holding portion, and a first driving portion, wherein the first transfer body holding portion holds the transfer The first plate-shaped body holding portion holds the plate-like body such that one of the main faces of the plate-like body faces the transfer body held by the first transfer body holding portion, and the first 1 drive At least one of the first transfer body holding portion and the first plate-shaped body holding portion is driven to be close to each other, whereby the transfer body is adhered to one main surface of the plate-like body to form an adhesion And the transfer material is transferred to the transfer body by the formation of the contact body; and the peeling device includes the second transfer body holding portion, the second plate-shaped body holding portion, and the second driving portion, The second transfer body holding portion holds the transfer body constituting the adherend, the second plate-shaped body holding portion holds the plate-like body constituting the adherend, and the second drive unit drives the second transfer body to hold At least one of the second plate-shaped body holding portion and the second plate-shaped body holding portion are separated from each other, and the transfer body that is in close contact with one of the main surfaces of the plate-shaped body is peeled off from the plate-shaped body; The printed body is peeled off from the plate-like body to remove the deposit from one main surface of the plate-shaped body, and a transfer device that transports the adhered body from the transfer device to the peeling device. 如請求項7之除去裝置,其包含:轉印體保持部,其保持上述轉印體;板狀體保持部,其以使上述板狀體之一主面與被保持於上述轉印體保持部之上述轉印體相面對之方式保持上述板狀體;及驅動部,其驅動上述轉印體保持部及上述板狀體保持部之至少一者而使上述板狀體保持部及上述轉印體保持部相互接近及分開;上述驅動部藉由使上述板狀體保持部及上述轉印體保持部相互接近而使上述板狀體之一主面密接於上述轉印體,從而將上述附著物轉印至上述轉印體,上述驅動部藉由使上述板狀體保持部及上述轉印體保持部相互分開而使上述轉印體自上述板狀體剝離,從而自上述板狀體之一主面除去上述附著物。 The removal device of claim 7, comprising: a transfer body holding portion that holds the transfer body; and a plate-shaped body holding portion that holds one of the main faces of the plate-like body and is held by the transfer body The plate-shaped body is held by the transfer body facing each other, and the driving unit drives at least one of the transfer body holding portion and the plate-shaped body holding portion to cause the plate-shaped body holding portion and the The transfer body holding portions are adjacent to and separated from each other, and the driving portion is configured such that one of the plate-shaped body main surfaces is in close contact with the transfer body by bringing the plate-shaped body holding portion and the transfer body holding portion closer to each other. The deposit is transferred to the transfer body, and the drive unit separates the plate-shaped body holding portion and the transfer body holding portion from each other, thereby peeling the transfer body from the plate-like body. One of the main faces of the body removes the above deposits. 如請求項7之除去裝置,其包含:移動部,其於與上述板狀體之一主面平行之第1方向上使上述板狀體相對於上述轉印體而相對移動;及旋轉部,其使上述轉印體旋轉;上述轉印體被加工成圓筒或圓柱形狀,其於與上述板狀體之一主面平行且與上述第1方向正交之第2方向上具有可與上述板狀體之一面抵接之周面,於使上述轉印體之周面與上述板狀體之一面抵接之狀態下,上述移動部使上述板狀體於上述第1方向進行相對移動並且上述旋轉部使上述轉印體旋轉,藉此進行上述附著物自上述板狀體向上述轉印體之周面之轉印、與經轉印至上述轉印體之周面之上述附著物自上述板狀體之剝離,從而自上述板狀體之一主面除去上述附著物。 The removing device of claim 7, comprising: a moving portion that relatively moves the plate-like body with respect to the transfer body in a first direction parallel to one main surface of the plate-like body; and a rotating portion The transfer body is rotated, and the transfer body is processed into a cylindrical or cylindrical shape, and is provided in a second direction parallel to one main surface of the plate-shaped body and orthogonal to the first direction. In a state in which the peripheral surface of the plate-shaped body abuts on the surface of the transfer body and the one surface of the plate-shaped body, the moving portion moves the plate-like body relative to each other in the first direction. The rotating unit rotates the transfer body to transfer the attached material from the plate-shaped body to the peripheral surface of the transfer body and the attached matter transferred to the peripheral surface of the transfer body. The peeling of the plate-like body removes the deposit from one main surface of the plate-shaped body. 如請求項7至10中任一項之除去裝置,其進而包含清洗裝置,該清洗裝置將上述轉印體進行清洗而除去轉印於上述轉印體之上述附著物。 The removal device according to any one of claims 7 to 10, further comprising a cleaning device that removes the deposit transferred to the transfer body by washing the transfer body. 一種印刷系統,其特徵在於包含:塗佈裝置,其將塗佈液塗佈於印刷布而形成塗佈層;印刷裝置,其使形成於上述印刷布之上述塗佈層圖案化而形成圖案層之後,將上述圖案層轉印至基板;除去裝置,其使轉印體密接於用於將上述圖案層轉印至上述基板後之上述印刷布,而將附著於上述印刷布之附著物轉印至上述轉印體之後,將上述轉印體自上述印刷布剝離而除去上述附著物;及搬送裝置,其將形成有上述塗佈層之上述印刷布搬送至上述印刷裝置,將已用於將上述圖案層轉印至上述基板之上述印刷 布搬送至上述除去裝置,且將除去上述附著物後之上述印刷布搬送至上述塗佈裝置以供印刷布之再利用。 A printing system comprising: a coating device that applies a coating liquid to a printing cloth to form a coating layer; and a printing device that patterns the coating layer formed on the printing cloth to form a pattern layer Thereafter, the pattern layer is transferred to the substrate, and the removing device is attached to the printing cloth for transferring the pattern layer to the substrate, and the attached matter attached to the printing cloth is transferred. After the transfer body is removed, the transfer body is peeled off from the printing cloth to remove the deposit; and the transfer device transports the printing cloth on which the coating layer is formed to the printing device, and is used for Transfer of the above pattern layer to the above substrate The cloth is conveyed to the removal device, and the printed cloth from which the deposit is removed is transferred to the coating device for reuse of the printing cloth. 如請求項12之印刷系統,其中上述塗佈裝置、上述印刷裝置及上述除去裝置配置成環狀,上述搬送裝置係沿將上述塗佈裝置、上述印刷裝置及上述除去裝置呈環狀相連之印刷布搬送路徑而循環搬送上述印刷布。 The printing system according to claim 12, wherein the coating device, the printing device, and the removing device are arranged in a ring shape, and the conveying device is printed in a ring shape along the coating device, the printing device, and the removing device. The cloth transport path is used to circulate and transport the printed cloth. 如請求項13之印刷系統,其中上述搬送裝置包含:第1搬送部,其搬送形成有上述塗佈層之上述印刷布;第2搬送部,其搬送已用於將上述圖案層轉印至上述基板之上述印刷布;及第3搬送部,其搬送除去上述附著物後之上述印刷布;且上述第1搬送部、上述第2搬送部及上述第3搬送部配置於上述印刷布搬送路徑。 The printing system according to claim 13, wherein the conveying device includes: a first conveying unit that conveys the printing cloth on which the coating layer is formed; and a second conveying unit that transfers the pattern layer to the above The printing cloth of the substrate; and the third conveying unit that conveys the printed cloth after the deposit is removed; and the first conveying unit, the second conveying unit, and the third conveying unit are disposed on the printing cloth conveying path.
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