KR101603343B1 - Substrate transportation and processing apparatus - Google Patents

Substrate transportation and processing apparatus Download PDF

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Publication number
KR101603343B1
KR101603343B1 KR1020090093227A KR20090093227A KR101603343B1 KR 101603343 B1 KR101603343 B1 KR 101603343B1 KR 1020090093227 A KR1020090093227 A KR 1020090093227A KR 20090093227 A KR20090093227 A KR 20090093227A KR 101603343 B1 KR101603343 B1 KR 101603343B1
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South Korea
Prior art keywords
substrate
processed
nozzle
member
processing liquid
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KR1020090093227A
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Korean (ko)
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KR20100042587A (en
Inventor
요시하루 오타
기미오 모토다
겐야 시노자키
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도쿄엘렉트론가부시키가이샤
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Priority to JP2008267622A priority Critical patent/JP4787872B2/en
Priority to JPJP-P-2008-267622 priority
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100042587A publication Critical patent/KR20100042587A/en
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Publication of KR101603343B1 publication Critical patent/KR101603343B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

Abstract

The present invention provides a substrate transport processing apparatus that supplies a process liquid to a substrate to be processed to perform a coating process, thereby ensuring substrate transport accuracy and suppressing occurrence of process defects.
The present invention relates to a method for manufacturing a semiconductor device, which comprises a floating stage (22) for floating a substrate (G) at a different height by injection or injection of a gas and suction, A processing liquid supply nozzle 23 for supplying a processing liquid from the sphere to the substrate to be processed and a substrate carrier provided so as to be movable along a guide rail 25 disposed parallel to left and right sides of the floating stage 22 A substrate holding member (24) provided on the substrate carrier (50) for sucking and holding the side edge portion of the preprocessed substrate (G) to be freely detached from the lower side; And a support member 51 disposed at the same position as the nozzle orifice of the substrate holding member 24 and supporting the substrate carrier 50 at a position immediately below the substrate holding member 24. [

Description

[0001] Substrate transportation and processing apparatus [

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate transfer processing apparatus, and more particularly, to a substrate transfer processing apparatus that performs a coating process by supplying a resist solution onto a substrate to be processed such as an LCD glass substrate.

For example, a flat panel display (FPD) is manufactured by forming a predetermined film on a substrate to be processed such as a glass substrate, applying a photoresist (hereinafter referred to as a resist) as a treatment liquid to form a resist film, A circuit pattern is formed by a so-called photolithography process in which a resist film is exposed in correspondence with a circuit pattern and the resist film is developed.

Recently, in this photolithography process, in order to improve the throughput, the target substrate is transported (in a parallel transportation state) in a substantially horizontal posture, and each process such as resist coating, drying, heating, In many cases.

As a configuration of the transfer apparatus, floating transfer, in which a substrate is raised on a stage in a substantially horizontal posture and is transported in a predetermined direction, is attracting attention in order to prevent transfer to a resist application surface by a substrate support member (support pin or the like) .

Such an apparatus configuration for floating transfer is disclosed in Patent Literature 1 in the case of a resist coating apparatus. As shown in Fig. 7, the resist coating apparatus 200 is a system in which a gas is injected from a plurality of gas injection openings formed on the upper surface to float the LCD substrate (liquid crystal display substrate) G And a stage 201. The slider 203 is connected to the left and right ends of the substrate G and is connected to the slider 203. The slider 203 includes a guide rail 202 attached to both sides of the stage 201, And a substrate holding portion 203a for holding and holding the substrate holding portion 203a.

The resist coating apparatus 200 further includes a resist nozzle 204 for supplying a resist solution onto the surface of the LCD substrate G that is lifted and transported on the stage 201, And further comprises a cleaning unit 205.

In the resist coating apparatus 200 having such a configuration, when the resist solution is applied to the substrate G, the substrate G floats over the stage 201, and the substrate G is held by the substrate holding unit 203a. Both the left and right ends are adsorbed and held. Subsequently, the substrate G is moved in the X direction by slidingly moving the slider 203 to which the substrate holding portion 203a is connected along the guide rail 202. [

When the substrate G moves under the resist nozzle 204, a resist solution is supplied in a strip form from a slit-shaped nozzle opening (not shown), and the resist solution is applied onto the surface to be processed of the substrate G do.

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-237097

The substrate holding portion 203a connected to the slider 203 protrudes horizontally from the slider 203 toward the substrate G in order to minimize the adverse effects caused by the conveying accuracy of the guide rail 202 And the substrate G is attracted and held on the upper surface of the tip portion.

However, in such a structure, the height positional accuracy of the substrate holding portion 203a is liable to be lowered, and there is a fear that the substrate G is shaken. In addition, there is a problem that fluctuations in the film thickness locally occur due to the shaking of the substrate G, and defects such as uneven coating occur.

The present invention has been accomplished under the circumstances as described above, and it is an object of the present invention to provide a substrate transfer processing apparatus which performs a coating process by supplying a process liquid to a substrate to be processed, the substrate transfer accuracy being ensured, And it is an object of the present invention to provide a transfer processing apparatus.

In order to solve the above problems, a substrate transfer processing apparatus according to the present invention is a substrate transfer processing apparatus for supplying a process liquid to a substrate to be processed to perform a coating process, A processing liquid supply nozzle for supplying a processing liquid onto the substrate to be processed from a nozzle opening formed in a slit shape in the substrate width direction and disposed above the floating stage; A pair of substrate carriers provided in a plate shape on the inside of the guide rail toward the substrate carrying direction and the floating stage so as to be movable along a guide rail disposed in parallel with the substrate carrier; (Front) a substrate to be suction-held so that the side edge portion of the substrate to be processed can be detached from below And a holding member which is disposed at the same position as at least a nozzle opening of the processing liquid supply nozzle in a substrate conveying direction and which is located at a position immediately below the substrate holding member on the left and right sides of the guide rail, Wherein the support member supports a position directly below the substrate holding member when the substrate to be processed passes directly under the processing liquid supply nozzle so that the substrate to be processed And a distance dimension between the nozzle hole of the processing liquid supply nozzle is kept constant.

With this configuration, it is possible to always keep the distance between the nozzle orifice and the substrate surface at the time of supplying the process liquid, when the substrate to be processed passes under the process liquid supply nozzle. As a result, local film thickness fluctuations do not occur, the resist film thickness can be made uniform, and the occurrence of processing defects can be suppressed.

It is preferable that the supporting member has a rotating member that freely rotates in the substrate carrying direction by being brought into contact with the lower surface of the substrate carrier.

Thus, the load (resistance) given to the substrate carrier can be reduced by the contact of the support member with the substrate carrier via the rotary member.

It is preferable that a plurality of the support members are provided along the substrate transfer direction, and the substrate carrier is supported by the plurality of support members at a position immediately below the substrate holding member.

By thus supporting the substrate carrier with the plurality of support members, the force for supporting the substrate carrier can be dispersed.

In addition, it is preferable that, at both left and right sides of the floating stage, the substrate carrier is provided continuously from the rail side toward the floating stage in a plate shape, and the substrate holding member is provided on the leading end portion where the substrate carrier is continuously connected.

By maintaining the edge portion of the substrate in the vicinity of the floating stage in this way, it is possible to improve the accuracy of supporting the substrate carrier by the supporting member without being affected by the conveying accuracy by the guide rail.

A control means for performing drive control of the elevating means; and distance detecting means for obtaining a distance dimension between the nozzle hole of the processing liquid supply nozzle and the substrate to be processed, , The control means preferably elevates and moves the support member by the elevating means such that the distance dimension between the nozzle orifice and the substrate to be processed obtained by the distance detecting means is not within the predetermined range .

By adopting such a configuration having a feedback function, the distance dimension between the nozzle orifice and the substrate surface can be more precisely controlled.

According to the present invention, it is possible to obtain a substrate transport processing apparatus capable of ensuring substrate transport accuracy and suppressing occurrence of processing defects in a substrate transport processing apparatus that performs a coating process by supplying a process liquid to a substrate to be processed.

Best Mode for Carrying Out the Invention Hereinafter, the best mode for carrying out the invention will be described in detail with reference to the accompanying drawings. Here, the case where the substrate transfer processing apparatus of the present invention is applied to the resist coating unit CT in the resist coating and developing apparatus will be described. Fig. 1 is a schematic plan view of the resist coating and developing treatment apparatus 100. Fig.

First, the operation flow of the resist coating and developing treatment apparatus 100 will be briefly described.

The substrate G in the cassette C placed on the placement table 12 of the cassette station 1 is transferred to the transfer arm 11a of the transfer apparatus 11 , Is transferred to the upstream end of the transfer line A of the processing station 2 and further transported onto the transfer line A and is subjected to removal processing of the organic substances contained in the substrate G by the excimer UV irradiation unit (e-UV) . The substrate G having been subjected to the removal of organic substances from the excimer UV irradiation unit (e-UV) 13 is conveyed onto the conveying line A and subjected to scrub cleaning treatment with a scrub cleaning unit (SCR) Drying treatment is carried out.

The substrate G having been subjected to the scrub cleaning process and the drying process in the scrub cleaning unit (SCR) 14 is conveyed over the conveying line A and heated by the dehydration baking unit (DH) do. The substrate G having been subjected to the dehydration heating treatment to the dehydration bake unit (DH) 15 is conveyed onto the conveying line A, and the hydrophobic treatment is performed on the admission unit (AD) 16. The substrate G on which the hydrophobic treatment to the adhering unit (AD) 16 has been completed is conveyed onto the conveying line A and cooled to the cooling unit (COL) 17.

The substrate G cooled by the cooling unit (COL) 17 is transported over the transfer line A, and a resist film is formed by the resist coating unit (CT) 20. Since the resist coating apparatus (20) of the present invention is applied to the substrate transport processing apparatus of the present invention, its construction will be described later in detail.

The substrate G on which the predetermined resist film is formed by the resist coating unit (CT) 20 is transported over the transporting line A and exposed to the reduced pressure atmosphere by the reduced pressure drying unit (DP) 21, .

The substrate G on which the resist film is dried by the reduced-pressure drying unit (DP) 21 is conveyed onto the conveying line A, pre-baked by the pre-baking unit (HT) 18, The contained solvent is removed. The pre-bake processing of the substrate G is carried out while being carried on the transfer line A. The substrate G on which the heat treatment to the prebake unit (HT) 18 has been completed is conveyed onto the conveying line A and cooled to the cooling unit (COL) 19.

The substrate G cooled by the cooling unit COL 19 is conveyed to the downstream side end on the conveying line A and then conveyed to the rotary stage (RS) 44 by the conveying arm 43 of the interface station 4, .

Next, the substrate G is transferred to the peripheral exposure apparatus EE of the external device block 90 by the transfer arm 43, and the peripheral portion (unnecessary portion) of the resist film is transferred to the peripheral exposure apparatus EE An exposure process for removing the photoresist is performed.

Subsequently, the substrate G is transferred to the exposure apparatus 9 by the transfer arm 43, and the resist film is exposed to a predetermined pattern.

On the other hand, the substrate G is temporarily stored in the buffer cassette on the rotary stage (RS) 44, and thereafter, may be transported to the exposure apparatus 9. [ The substrate G having undergone the exposure processing is transported to the titler TITLER of the external device block 90 by the transport arm 43 and predetermined information is recorded in the titler TITLER.

The substrate G on which the predetermined information has been recorded by the titler TITLER is conveyed onto the conveying line B and the developer coating, rinsing and drying processing are successively carried out in the developing unit (DEV) 30.

The substrate G on which the developing solution application processing, rinsing processing and drying processing to the developing unit (DEV) 30 has been completed is conveyed onto the conveying line B, and the post bake processing (HT) The solvent and moisture contained in the resist film are removed and the pattern is brought into close contact with the substrate G. [ The post-baking process of the substrate G is carried out while being conveyed onto the conveying line B by the roller conveying mechanism.

On the other hand, an i-line UV irradiation unit for performing a decoloring treatment of the developer may be provided between the developing unit (DEV) 30 and the post-baking unit (HT) The substrate G on which the heat treatment to the post bake unit (HT) 31 has been completed is conveyed onto the conveying line B and cooled to the cooling unit (COL) 32.

The substrate G cooled by the cooling unit (COL) 32 is conveyed onto the conveying line B and inspected by the inspection unit (IP) 35. The board G having passed the inspection is accommodated in a predetermined cassette C placed on the placement table 12 by the transfer arm 11a of the transfer device 11 installed in the cassette station 1. [

Next, a resist coating unit (CT) 20, which is a substrate processing apparatus of an ordinary type, to which the substrate processing apparatus of the present invention is applied, will be described.

Fig. 2 is a schematic perspective view showing a main part of the resist coating unit (CT) 20, Fig. 3 is a schematic sectional view along a direction orthogonal to the substrate transportation direction, Figs. 4 and 5 are cross- 6 is a schematic sectional view along the moving direction of the substrate G showing a state in which the resist solution is supplied (discharged) onto the substrate G in the resist coating unit (CT) 20. As shown in Fig.

As shown in the figure, the resist coating unit (CT) 20 includes a floating stage 22 for floating the substrate G at a different height by injection or injection of gas or suction, And a resist supply nozzle 23 (process liquid supply nozzle) for supplying a resist liquid R as a treatment liquid in strip form to the surface of the substrate G.

As shown in Fig. 3, sliders 26 are provided on left and right sides of the lifting stage 22 so as to be slidable along guide rails 25 arranged parallel to each other. The slider 26 is arranged on both left and right sides of the conveying path, and a substrate carrier 50 is fixed on the upper surface of the slider 26 in a plate-like manner toward the substrate conveying direction and the lifting stage 22. That is, with the movement of the slider 26, the substrate carrier 50 is configured to move along the guide rail 25.

The driving source of the slider 26 is realized by, for example, a linear motor. In this case, as shown in Fig. 3, a linear motor stator 27 is installed along the guide rail 25, for example. On the other hand, as shown in Figs. 2 and 3, the substrate carrier 50 is formed with three plate-shaped linear motor rotors 50a which are downwardly covered with a side portion of the slider 26. As shown in Fig. As shown in Fig. 3, the tip end portion of the linear motor rotor 50a is arranged to be fitted to the linear motor stator 27, and the linear motor rotor 50a (that is, (50) is moved along the guide rail (25) together with the slider (26).

The left and right side edge portions of the substrate G are detachably mounted on the front end portions of the substrate carrier 50 provided on both the left and right sides in the substrate transfer direction with the floating stage 22 interposed therebetween and extending to the floating stage 22, Shaped adsorption pad 24 (substrate holding member) for sucking and retaining the adsorbing pad 24 so as to be able to perform the adsorption. The suction pad 24 is formed of, for example, synthetic rubber, and a plurality of suction holes (not shown) of a predetermined shape (for example, an elongated hole shape) are formed on the upper surface thereof.

The suction hole is connected to a vacuum tube 61 via a seal (not shown) formed in the suction pad 24, and is operated to suck by the operation of the vacuum device 62. Therefore, when the side edge portion of the substrate G is placed on the adsorption pad 24, the vacuum device 62 operates, and the entire upper surface of the adsorption pad 24 becomes the adsorption surface, Adsorbed and retained.

Support members 51 having rollers 51a (rotating members) that rotate freely in the substrate conveying direction are provided on the left and right sides of the floating stage 22 on the inner side of the guide rails 25, respectively. 3, the support member 51 is located immediately below the absorption pad 24 in the Y direction when passing through the substrate carrier 50, and the upper end of the roller 51a is located on the substrate carrier 50, So that the substrate carrier 50 is supported while the roller 51a is rotated.

The support member 51 is disposed at the same position as the nozzle orifice of the resist supply nozzle 23 in the substrate transport direction (X direction) as shown in Fig. 4, and as shown in Fig. 3, 24 to support the substrate carrier 50 at a position immediately below.

On the other hand, if the support member 51 is disposed at the same position as the nozzle orifice of the resist supply nozzle 23 in the substrate transport direction, the load applied to the support member 51 is dispersed, It is also possible to provide a plurality of groups (three groups on one side in the figure) along the substrate transport direction.

With this configuration, at the time when the substrate G to be transported passes directly under the resist supply nozzle 23, that is, at the time point when the resist R is supplied from the nozzle opening to the substrate surface, And the distance dimension between the outer and inner circumferential surfaces is always maintained at a predetermined value.

Since the suction pad 24 is provided on the leading end portion connected to the float stage 22 as described above, the influence of the conveyance accuracy of the guide rail 25 and the slider 26 can be reduced, The accuracy of supporting the substrate carrier 50 by the member 51 can be improved.

The resist coating unit (CT) 20 has a function of fine-tuning the height position of the adsorption pad 24 and maintaining the distance dimension between the nozzle orifice and the substrate surface at a predetermined value with higher precision.

That is, below the support member 51, an elevating device 52 (elevating means) for elevating and lowering the supporting member 51 is provided. On the other hand, the elevating device 52 (elevating means) is constituted by, for example, a piezoelectric actuator, and the driving control is performed by the control section 60 (control means).

A sensor 53 for detecting the distance between the nozzle orifice and the substrate G is provided on the left and right sides of the nozzle orifice and a detection signal is inputted to the control unit 60. [ The control unit 60 obtains the distance dimension between the nozzle orifice and the substrate G based on the inputted signal (that is, the distance detecting means is constituted by the sensor 53 and the control unit 60) It is judged whether or not it is within the range of the set value (predetermined value). If the detected distance dimension is not within the predetermined range, the elevation device 52 is driven so that the support member 51 is moved up and down, the height position of the adsorption pad 24 is changed, So that the distance dimension between the sphere and the substrate surface is adjusted.

The substrate carrier 50 is formed of, for example, aluminum or the like so that the front end of the substrate carrier 50 provided with the adsorption pad 24 can be moved up and down in accordance with the ascending / , Thickness dimension, and the like are set.

2 and 6, the lifting stage 22 is provided with a plurality of lift pins 28a, for example, four lifting pins 28a for receiving the substrate G carried by a carrier arm (not shown) A coating area 22b for keeping the gaps between the resist supply nozzle 23 and the substrate G at a predetermined distance, for example, 100 to 150 占 퐉, a lift area 22b for holding the substrate G, There is provided a take-out region 22c having four lift pins 28b as many as possible.

Air is jetted from the plurality of jetting holes 29a formed on the surface of the floatation stage 22 so that the substrate G has a height of about 100 to 150 mu m As shown in FIG. In the coating region 22b, a plurality of injection holes 29a and suction holes 29b are formed in a zigzag pattern on the surface of the floating stage 22, for example, At the same time, the substrate G is attracted from the suction hole 29b to float to a position of about 50 mu m in height.

Connection areas 22d and 22e connecting gaps between the carry-in area 22a and the application area 22b and between the application area 22b and the carry-out area 22c, respectively, are provided have. A plurality of injection holes 29a and a suction hole 29b are formed in these joint regions 22d and 22e and the substrate G is gradually lowered or raised by adjusting the injection amount and the suction amount of the gas, .

The resist supply nozzle 23 is fixed to a door frame (not shown) extending above the floating stage 22 and is provided with a resist solution R supplied by a supply pipe 23a connected to a resist tank ) On the surface of the substrate G in a strip shape.

Next, the operation mode of the resist coating unit (CT) 20 configured as described above will be described.

When the substrate G cooled by the cooling unit COL 17 is carried onto the loading region 22a of the floating stage 22 by the unillustrated carrying arm, the lift pin 28a is moved upward, . Thereafter, the transfer arm retreats from the upper side of the floating stage 22 to the outside.

The lift pins 28a are lowered while the substrate G is lifted to a position of about 100 to 150 mu m in height by the air ejected from the surface of the loading region 22a, In this state, the vacuum apparatus 62 is operated to adsorb and hold the substrate G by the adsorption pad 24. At this time, the substrate G is held in a horizontal position at a height of about 100 to 150 mu m above the carry-in region 22a of the floating stage 22.

Subsequently, the linear motor 27 (moving mechanism) is driven to transport the substrate G to the application region 22b. In the coating region 22b, the substrate G floats up to a position of about 50 mu m in height due to the balance of ejection and suction of air from the surface of the floating stage 22. [

At this time, since the support member 51 supports directly below the adsorption pad 24 which holds and holds the substrate G, the substrate G is held on the float stage 22 at a height of about 50 mu m above the application area 22b of the resist supply nozzle 23 and holds a predetermined gap S (100 to 150 mu m) between the resist supply nozzles 23. [

The control unit 60 calculates the distance dimension of the gap S at that time based on the detection result from the sensor 53 provided in the vicinity of the nozzle opening of the resist supply nozzle 23, The lift control device 52 controls the elevation device 52 to move up and down to fine-tune the height position of the adsorption pad 24. Thus, the distance between the nozzle orifice of the resist supply nozzle 23 and the substrate surface is always controlled to be a predetermined value with high accuracy.

In this state, the resist film R is uniformly formed on the surface of the substrate G by feeding (discharging) the resist solution R from the resist supply nozzle 23 in a strip shape and moving the substrate G .

When the substrate G on which the resist film is formed is moved to the carry-out region 22c, the substrate G floats up to a position of about 100 to 150 mu m in height by the air ejected from the surface of the carry-out region 22c, The vacuum apparatus is stopped and the suction holding of the substrate G is released. Then, the lift pin 28b rises to move the substrate G to the upper receiving position. In this state, a transfer arm (not shown) receives the substrate G and transfers the substrate G to the vacuum drying apparatus (DP) 21 in the next step.

As described above, according to the embodiment of the present invention, when the substrate G passes under the resist supply nozzle 23, immediately below the adsorption pad 24 for adsorbing and holding the side edge portions on the left and right sides of the substrate, And the substrate carrier carrier 50 is supported by the support member 51. Therefore, the height position of the adsorption pad 24, that is, the height position of the substrate G can be maintained with high precision.

That is, the distance dimension between the nozzle orifice and the substrate surface at the time of supplying the resist liquid R is always kept at a predetermined value. As a result, local film thickness fluctuations do not occur, Occurrence of processing defects can be suppressed.

The distance S between the nozzle orifice and the substrate surface is detected using the sensor 53 and the height position of the adsorption pad 24 is finely adjusted by raising and lowering the support member 51 based on the detection result, The distance dimension between the nozzle orifice and the substrate surface can be controlled with high accuracy.

On the other hand, in the above embodiment, the support member 51 is free to rotate in the substrate transport direction In the form having the roller 51a, However, the present invention is not limited to this, and it may be a different shape (for example, a sphere or the like) as long as the member is rotatable in the substrate conveying direction.

Alternatively, the support member 51 is not limited to the configuration in which the rotation member rotates freely in the substrate transfer direction, and the support member 51 and the substrate carrier 50 may be slidably in contact with the lower surface.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic plan view of a resist coating and developing apparatus equipped with a resist coating unit as a substrate transport processing apparatus of the present invention. FIG.

2 is a schematic perspective view showing a main part of the resist coating unit.

3 is a schematic cross-sectional view along the direction orthogonal to the substrate transport direction in the resist coating unit of FIG.

4 is a schematic sectional view taken along the line D-D in Fig.

Fig. 5 is a diagram showing another form of a schematic cross-sectional view taken along the line D-D in Fig.

FIG. 6 is a schematic cross-sectional view showing a state in which a resist solution is supplied (discharged) onto a substrate in the resist coating unit according to the moving direction of the substrate. FIG.

Fig. 7 is a view for explaining a conventional apparatus for floating the substrate.

[Description of Symbols]

20 Resist Coating Unit (Substrate Transport Processor)

22 lifting stage

23 Resist Supply Nozzles (Process Liquid Supply Nozzles)

24 adsorption pad (substrate holding member)

25 Guide rail

50 substrate carrier

51 support member

51a roller (rotating member)

52 Lifting device (lifting device)

53 sensor (distance detecting means)

60 control unit (control means, distance detection means)

100 Resist application and development processing device

G substrate (substrate to be processed)

R resist liquid (treatment liquid)

Claims (5)

  1. In a substrate transfer processing apparatus for performing a coating process by supplying a process liquid to a substrate to be processed,
    A floating stage for floating the substrate at a different height by injection or injection of gas or suction,
    A processing liquid supply nozzle which is disposed above the floating stage and supplies a processing liquid onto the substrate to be processed from a nozzle opening formed in a slit shape in the substrate width direction,
    A pair of substrate carriers provided in a plate shape on the inside of the guide rail toward the substrate carrying direction and the floating stage so as to be movable along guide rails arranged in parallel on left and right sides of the floating stage,
    A substrate holding member provided on a front end portion of the substrate carrier and sucking and holding the side edge portion of the front side target substrate so as to be detachable from below,
    A support for supporting the lower surface of the substrate carrier at a position immediately below the substrate holding member on the inner side of the guide rail on both left and right sides of the floating stage, at least at the same position as the nozzle sphere of the processing liquid supply nozzle in the substrate transfer direction, Member,
    Wherein the supporting member supports a position directly under the substrate holding member when the substrate to be processed passes directly under the processing liquid supply nozzle so that the distance between the substrate to be processed and the nozzle opening of the processing liquid supply nozzle Wherein the distance between the substrate and the substrate is maintained constant.
  2. The substrate transport processing apparatus according to claim 1, wherein the support member has a rotating member that freely rotates in a substrate transport direction by being brought into contact with a lower surface of the substrate carrier.
  3. The substrate processing apparatus according to claim 1 or 2, wherein a plurality of the support members are provided along the substrate transport direction,
    Wherein the substrate carrier is supported by the plurality of support members at a position immediately below the substrate holding member.
  4. The substrate transport processing apparatus according to claim 1 or 2, wherein the support member is provided with elevating means for moving the support member up and down.
  5. The apparatus according to claim 1 or 2, further comprising: an elevating means for elevating and lowering the supporting member; a control means for performing drive control of the elevating means; and a control means for controlling a distance between the nozzle hole of the processing liquid supply nozzle and the substrate to be processed And a distance detection means
    The control means elevates and moves the support member by the elevating means so as to be within the predetermined range when the distance dimension between the nozzle orifice obtained by the distance detecting means and the substrate to be processed is not within the predetermined range And the substrate transporting device.
KR1020090093227A 2008-10-16 2009-09-30 Substrate transportation and processing apparatus KR101603343B1 (en)

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