1311633 • . (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於在液晶顯不器（LCD )等所使用的基板 塗佈阻劑液等的塗佈液後，在減壓狀態對該塗佈液實施乾 燥處理的減壓乾燥裝置。 【先前技術】 βΙ 製造液晶顯示器（LCD)時，爲了在LCD用的玻璃 製基板（以下’簡稱LCD基板）上形成電極圖案，故使 用光微影技術。利用光微影術形成圖案時，係按照先在玻 璃製LCD基板上塗佈阻劑液而形成阻劑膜，繼之，以對 應於電路圖案的方式將阻劑膜曝光，然後，進行顯影處理 的順序來進行。 在光微影技術中，爲了對塗佈有阻劑液的LCD基板 ’使阻劑液乾燥，故將其搬入加熱裝置，以進行預先烘烤 Φ 處理’然而，在加熱裝置中，一般來說爲了避免LCD基 板與加熱板的直接接觸，LCD基板係介由突設於加熱板上 的銷（pin)而配置於加熱板上。因此，會有銷的痕跡轉 印於阻劑膜的問題。於是，爲了防止此種轉印，故有提案 先將塗佈於基板的阻劑液在減壓狀態下進行乾燥，然後， 再進行利用加熱裝置的乾燥，以避免急劇乾燥的技術（參 照例如專利文獻1 )。 就進行此種減壓乾燥處理的裝置而言，可使用具備： 由上部處理室及下部處理室所構成的處理室、和設置於處 -5- (2) 1311633 理室內且載置有LCD基板的載置台、和將處理室內加以 排氣以進行減壓的減壓機構之裝置（例如參照專利文獻2 、3 )。該減壓乾燥裝置係在密接有上部處理室及下部處 理室的狀態下進行減壓乾燥處理，且在L C D基板的搬入 搬出之際’用起重機（crane )使上部處理室上昇，以將 處理室打開’接著’再用適當的驅動機構使載置台上昇之 構成。 φ 又’由於在該減壓乾燥裝置中，係利用動作器（ actuator)或機器人把持，而將處理前的LCD基板搬送到 載置台上’並且將處理後的LCD基板從載置台上搬送下 來，因此，爲了使利用動作器或機器人進行的把持變得比 較容易’ LCD基板係藉由其端部支持於載置台上所突設的 銷，而載置於載置台上。 〔專利文獻1〕日本特開2000 — 106341號公報 〔專利文獻1〕日本特開2000 — 181079號公報 Φ 〔專利文獻1〕日本特開2〇〇4_241702號公報 【發明內容】 〔發明所欲解決之課題〕 LCD基板傾向大型化’最近，甚至出現一邊爲2m的 巨大構成’伴隨之，上述減壓乾燥裝置也明顯的大型化。 所以，上述減壓乾燥裝置在LCD基板的搬入搬出時，必 須使重量明顯較重的上部處理室上昇，這在安全上會出現 問題。更且，使此種重量明顯較重的上部處理室昇降時， -6- (3) 1311633 上部處理室在昇降動作時所產生的振動會變大，該振動會 傳達到與上述減壓乾燥裝置接近配置之用來塗佈阻劑液的 塗佈裝置，因而有導致阻劑液的膜厚不均勻的虞慮。 而且，當LCD基板大型化時，僅藉由設置於其端部 的銷將難以支持L C D基板，所以在L C D基板的中央部也 必須設置銷。結果，這些銷的痕跡轉印於阻劑膜的可能性 變大，減壓乾燥處理本身會變得沒有意義。 φ 本發明係有鑑於此種問題而開發者，其目的在於即使 基板大型化，亦可提供一種安全性優良，同時可抑制振動 的產生，且可確實地防止產生於塗佈於基板之塗佈液的轉 印之減壓乾燥裝置。 〔用以解決課題之手段〕 爲了解決上述課題，本發明提供一種減壓乾燥裝置， 係在基板塗佈塗佈液後，於減壓狀態對該塗佈液施以乾燥 • 處理，其特徵爲具備：處理室，係在側壁部具有供基板搬 入的搬入口及供基板搬出的搬出口，且將從上述搬入口搬 入的基板以大致水平狀態收容；和閘構件，係將上述處理 室的上述搬入口及搬出口加以開關；和減壓機構，係在藉 由上述閘構件封閉上述搬入口及搬出口的狀態下，將上述 處理室內減壓；和搬送機構，係將基板以大致水平狀態搬 送，從上述搬入口搬入上述處理室內，並且在利用上述減 壓機構進行減壓乾燥處理後，以大致水平狀態搬送，而從 上述搬出口搬出上述處理室外；和基板支持構件，係在上 (4) 1311633 述處理室內可將基板均勻地支持，而不是局部地支持。此 外，也包含搬入口及搬出口爲同一個的情形。 本發明中，理想的情況是，上述搬送機構具備：內側 搬送部，係在上述處理室內搬送基板；和搬入側搬送部， 係在上述處理室外將基板從上述搬入口搬入，而搬送至上 述內側搬送部；和搬出側搬送部，係在上述處理室外將從 上述內側搬送部搬送到的基板從上述搬出口搬出，並且， φ 上述內側搬送部具有以可旋轉的方式設置於基板之搬送方 向的複數滑輪構件、和搭掛於此等滑輪構件的輸送帶，且 藉由伴隨上述滑輪構件的旋轉所形成之上述輸送帶的作動 ，將基板進行輸送帶搬送，並且，上述輸送帶係在支持基 板的狀態下停止，且具有上述基板支持構件的功能。此時 ，以又具備：將作動中的上述輸送帶加以清潔的清潔機構 爲佳。 或者，本發明中，理想的情況是，上述搬送機構具備 Φ :內側搬送部，係在上述處理室內搬送基板；和搬入側搬 送部，係在上述處理室外將基板從上述搬入口搬入，而搬 送至上述內側搬送部；和搬出側搬送部，係在上述處理室 外將從上述內側搬送部搬送到的基板從上述搬出口搬出， 並且，上述內側搬送部具有以可旋轉的方式設置於基板之 搬送方向的複數內側滾筒構件，且藉由此等內側滾筒構件 的旋轉將基板進行滾筒搬送，並且，複數的上述內側滾筒 構件具有其一部分或全部可以正反轉交替旋轉，而使基板 擺動且均勻地支持的上述基板支持構件之功能。此時，理 -8- (5) 1311633 想的情況是’上述內側滾筒構件係以跨涉基板的大致整體 寬度而接觸的方式形成’或者，上述內側滾筒構件係以對 基板在寬度方向保持間隔且在複數位置接觸的方式形成， 且相鄰的內側滾筒構件彼此與基板接觸之寬度方向位置係 不同的方式構成。 再者’此時’理想的情況是，上述搬入側搬送部具有 以可旋轉的方式設置於基板之搬送方向的複數外側滾筒構 • 件’且藉由此等外側滾筒構件的旋轉進行滾筒搬送，而將 基板從至少上述搬入口搬入’使之到達上述內側搬送部爲 止， 理想的情況是’上述內側搬送部係將藉由上述搬入側 搬送部所到達的基板，搬送至完全收容於上述處理室內爲 止，並且，理想的情況是，上述搬入側搬送部係以靠近在 基板上塗佈上述塗佈液之塗佈裝置的方式設置，且利用上 述外側滾筒構件的旋轉，接承從上述塗佈裝置以大致水平 • 狀態搬送而到達的基板，以此方式進行滾筒搬送。 此時’理想的情況是，上述內側搬送部係以使收容於 上述處理室內的基板，至少通過上述搬送口，而到達上述 搬入側搬送部爲止的方式進行搬送，並且，上述搬出側搬 送部具有以可旋轉的方式設置於基板之搬送方向的複數外 側滾筒構件，且利用上述外側滾筒構件的旋轉，將藉由上 述內側搬送部而到達的基板，從上述搬出口搬出，直到完 全露出上述處理室外爲止，以此方式進行滾筒搬送。 又’本發明中，上述閘構件係以沿著上述處理室的上 -9- (6) 1311633 述側壁部移動’用以開關上 〔發明之效果〕 如上述的說明，根據本 壁部設置搬入口及搬出口， 水平狀態移動，來進行搬入 構成，所以可將搬入口及搬 φ 稍微大於基板厚度的程度。 能方面，與以往的減壓乾燥 開關處理室之搬入口及搬出 ，如上述將基板以大致水平 壓乾燥裝置所設置的載置台 因此，即使基板大型化，也 同時可抑制閘構件之開關動 生的振動。更且，由於基板 • 均勻地支持，所以不論基板 塗佈於基板之塗佈液所產生 述搬入口及搬出口爲佳。 發明’由於係以在處理室的側 且利用搬送機構使基板以大致 口及搬出口之搬入搬出的方式 出口的高度設定成極小，爲僅 因此，在發揮開關處理室的功 裝置中的處理室相比較，可將 口的閘構件大幅輕量化。而且 狀態搬送，不需要像習知之減 那樣使基板的搬送裝置昇降。 可充分地確保裝置的安全性， 作及搬送機構之搬送動作所產 支持構件係在處理室內將基板 的大小爲何，皆可確實地防止 的轉印。 【實施方式】 以下，參照附圖，具體 第1圖係進行LCD基 理後之阻劑膜之顯影處理之 略平面圖。 阻劑塗佈·顯影處理系 說明本發明之實施型態。 板之阻劑膜的形成、及曝光處 阻劑塗佈•顯影處理系統的槪 統100具備：載置有用以收容 -10- (7) 1311633 複數LCD基板g之匣盒C的匣盒站1;對LCD基板G實 施包括阻劑塗佈及顯影之一連串處理的處理站2 ;和在與 曝光裝置4之間進行LCD基板G之遞送的界面站3，且 處理站1和界面站3係分別配置於處理站2的兩側。此外 ’在第1圖中，將阻劑塗佈•顯影處理系統1 〇〇的長度方 向設爲X方向，將平面上與X方向垂直相交的方向設爲 Y方向。 φ 匣盒站1具備可將匣盒c並列載置於Y方向的載置 台9、和在與處理站2之間進行LCD基板G之搬入搬出 的搬送裝置11，並且，在載置台9與外部之間進行匣盒c 的搬送。設置於搬送裝置11的搬送機械臂Ua可移動於 沿著匣盒C之配列方向的Y方向而設置的搬送路徑1〇上 ，且在匣盒C與處理站2之間進行LCD基板G的搬入搬 出。 處理站2具有基本上延伸於X方向之LCD基板G搬 φ 送用的平行兩列搬送線A、B。在搬送線a上，從匣盒站 1側朝向界面站3 ’依序配列有揉擦洗淨單元（s C R ) 2 1 、第1熱處理單元區段26、阻劑塗佈單元23、第2熱處 理單元區段27。 在搬送線B上’從界面站3朝向匣盒站〗側，依序配 列有第2熱處理單元區段27、顯影單元（DEV) 24、i線 UV照射單元（i-UV ) 25、第3熱處理單元區段28。在揉 擦洗淨單元21上的一部分，設有準分子UV照射單元（ e-UV) 22。此外’準分子UV照射單元22係在揉擦洗淨 -11- (8) 1311633 實施前，爲去除LCD基板G的有機物而設置者，i線UV 照射單元2 5係用以進行顯影的脫色處理而設置者。 在揉擦洗淨單元21中，LCD基板G係以大致水平姿 勢一邊搬送，一邊進行洗淨處理及乾燥處理。在顯影單元 24中，LCD基板G係以大致水平姿勢一邊搬送，一邊逐 次進行顯影液塗佈、沖洗、乾燥處理。在此等揉擦洗淨單 元21及顯影單元24中，LCD基板G的搬送係藉由例如 # 滾筒搬送或輸送帶搬送來進行，LCD基板G的搬入口及 搬出口係設置於相對向的短邊。又，LCD基板G對i線 UV照射單元25的搬送，係藉由與顯影單元24之搬送機 構同樣的搬送機構連續進行者。 如後詳細地說明，阻劑塗佈單元23具備：阻劑塗佈 裝置（CT ) 23a，係一邊將LCD基板G以大致水平姿勢 搬送，一邊供給阻劑液而形成塗佈膜；和減壓乾燥裝置（ VD ) 23b，係令LCD基板G曝露於減壓環境中，藉以使 ® 形成於LCD基板G上之塗佈膜所含的揮發成分蒸發，以 使塗佈膜乾燥。 第1熱處理單元區段26具有由對LCD基板G實施熱 處理之熱處理單元積層而構成的兩個熱處理方塊（TB) 3 1、3 2，熱處理單元方塊3 1係設置於揉擦洗淨單元2 1側 ，熱處理單元方塊3 2則設置於阻劑塗佈單元2 3側。在這 兩個熱處理單元方塊31、32之間’設有第1搬送裝置33 〇 熱處理單元方塊31具有：進行LCD基板G之遞送的 -12- (9) 1311633 傳遞單元（pass unit)、對LCD基板G進仃脫水烘烤處 理的兩個脫水烘烤單元、對L C D基板G實施排水化處理 的附著單元（adhesion unit )從下方依序積層的構成。此 外，熱處理單元方塊32具有：進行LCD基板G之遞送的 傳遞單元（pass unit)、將LCD基板G予以冷卻的兩個 冷卻單元、對LCD基板G實施排水化處理的附著單元（ adhesion unit)從下方依序積層的構成。 ϋ 第1搬送裝置33係進行：經由傳遞單元從揉擦洗淨 單元21接取LCD基板G、上述熱處理單元間之LCD基板 G的搬入搬出、以及經由傳遞單元將LCD基板G遞送至 阻劑塗佈單元23。 第1搬送裝置33係可上下移動、前後移動、旋轉移 動，且也可對熱處理單元方塊31、32的任一單元進行存 取。 第2熱處理單元區段27具有對LCD基板G實施熱處 Φ 理之熱處理單元積層而構成的兩個熱處理方塊（TB) 34 、3 5 ’熱處理單元方塊3 4係設置於阻劑塗佈單元2 3側， 熱處理單元方塊35則設置於顯影單元24側。並且，在兩 個熱處理單元方塊34、35之間，設有第2搬送裝置36。 熱處理單元方塊34係爲從下方依序積層有進行LCD 基板G之遞送的傳遞單元、對LCD基板G進行預先烘烤 處理的三個預先烘烤單元之構成。又，熱處理單元方塊 35係爲從下方依序積層有進行LCD基板G之遞送的傳遞 單元、將LCD基板G加以冷卻的冷卻單元、對LCD基板 -13- (10) 1311633 G進行預先烘烤處理的兩個預先烘烤單元之構成 第2搬送裝置3 6進行：經由傳遞單元從阻 元23接取LCD基板G、在上述熱處理單元間將 G搬入搬出、經由傳遞單元對顯影單元24遞送 G、以及對後述界面站3之基板遞送部的增設· EXT _ COL ) 44遞送及接取LCD基板G。此外 送裝置36具有與第1搬送裝置33相同的構造， φ 處理單元方塊34、35之任一單元進行存取。 第3熱處理單元區段28具有：對LCD基板 處理之熱處理單元積層而構成的兩個熱處理單 TB) 37、38，熱處理單元方塊37係設置於顯j 側，熱處理單元方塊3 8則設置於匣盒站1側。 兩個熱處理單元方塊37、38之間’設有第3搬 〇 熱處理單元方塊37具有進行LCD基板G之 Φ 遞單元、對L C D基板G進行後烘烤處理的三個 元從下方依序積層的構成。又’熱處理單元方塊 對LCD基板G進行後烘烤處理的後烘烤單元、 基板G的遞送及冷卻的傳遞·冷卻單元、再者 烤單元從下方依序積層的構成。 第3搬送裝置3 9進行：經由傳遞單元從1 射單元25接取LCD基板G、在上述熱處理單 LCD基板G的搬入搬出、經由傳遞·冷卻單元業 遞送LCD基板G。此外’第3搬送裝置39亦 劑塗佈單 LCD基板 LCD基板 冷卻站（ ，第2搬 亦可對熱 G實施熱 元方塊（ 杉單元24 並且，在 送裝置39 遞送的傳 '後烘烤單 ,38具有 進行LCD 兩個後烘 線UV照 元間進行 ί匣盒站1 L有與第1 -14- (11) 1311633 搬送裝置3 3相同的構造，亦可對熱處理單元: 之任一單元進行存取。 處理站2係如上所述以構成兩列搬送線A ，且成爲基本的處理順序的方式，配置有各處 送裝置。在搬送線 A、B間設有空間40， shuttle) 41係以可往復移動的方式設置於該g 動器（shuttle ) 41係以可保持LCD基板G的 • 且在搬送線A、B間進行LCD基板G的遞送 G相對於梭動器4 1的遞送係可利用第1至第 33、36、39來進行。 界面站3具有：在處理站2和曝光裝置 LCD基板G之搬入搬出的搬送裝置42;和配 的緩衝站（BUF ) 43 ;和作爲具備冷卻功能之 的增設·冷卻站44，並且字幕器（TITLER) 裝置（EE )被積層於上下的外部裝置方塊45 Φ 置42鄰接而設置。搬送裝置42具備搬送機相 由該搬送機械臂42a可在處理站2和曝光裝置 LCD基板G的搬入搬出。 在以上述方式構成的阻劑塗佈·顯影處理 ’首先，配置於匣盒站1之載置台9的匣盒 基板G，係藉由搬送裝置11直接被搬入處理 子UV照射單元22，進行揉擦前處理。接著， 被搬送裝置11搬入揉擦洗淨單元21，進行揉 擦洗淨後，LCD基板G係藉由例如滾筒搬送 方塊37、38 t、B的方式 理單元及搬 而梭動器（ g間4 0。梭 方式構成， 。：L C D基板 3搬送裝置 4之間進行 置緩衝匣盒 基板遞送部 與周邊曝光 係與搬送裝 I臂4 2 a，藉 4之間進行 系統1 0 0中 C內的LCD 站2的準分 LCD基板G 擦洗淨。揉 ，搬出到屬 -15- (12) 1311633 於第1熱處理單元區段26之熱處理單元方塊31的傳遞單 元。 配置於熱處理單元方塊31之傳遞單元的LCD基板G ，先被搬送到熱處理單元方塊31的脫水烘烤單元’進行 加熱處理。接著’ LCD基板G被搬送到熱處理單元方塊 3 2的冷卻單元進行冷卻後，爲了提筒阻劑的固定性，搬 送至熱處理單元方塊31之附著單兀及熱處理單兀方塊32 之附著單元的任一者，在此利用Η M D S進行排水化處理。 然後，L C D基板G被搬送至冷卻單元加以冷卻，接著， 搬送到熱處理單元方塊32的傳遞單元。進行此一連串處 理時之LCD基板G的搬送處理，全部皆利用第1搬送裝 置3 3進行。 配置於熱處理單元方塊32之傳遞單元的LCD基板G ，係藉由設置於該傳遞單元的例如滾筒搬送機構等的基板 搬送機構，搬入阻劑塗佈單元2 3內。如後述詳細的說明 所示，在阻劑塗佈裝置23a中，將LCD基板G以水平姿 勢一邊搬送，一邊供給阻劑液而形成塗佈膜，然後，利用 減壓乾燥裝置23b對塗佈膜實施減壓乾燥處理。接著，藉 由後述之搬送機構7的搬出側搬送部7c，再藉由設置於 減壓乾燥裝置（VD) 23b的基板搬送機械臂等，LCD基 板G從阻劑塗佈單元23被搬送而遞送到屬於第2熱處理 單元區段27之熱處理單元方塊34的傳遞單元。 配置於熱處理單元方塊34之傳遞單元的LCD基板G ，係藉由第2搬送裝置36被搬送至熱處理單元方塊34之 -16 - (13) 1311633 預先烘烤單元及熱處理單元方塊3 5之預先烘烤單元的任 一者，進行預先烘烤處理’然後’搬送至熱處理單元方塊 3 5的清潔單元，冷卻至預定溫度。接著’ LCD基板G利 用第2搬送裝置36被搬送至熱處理單元方塊35的傳遞單 元。 然後，LCD基板G係藉由第2搬送裝置36搬送至界 面站3的增設.冷卻站44 ’且依據需要藉由界面站3的 φ 搬送裝置42搬送至外部裝置方塊45的周邊曝光裝置（ EE )，以實施用以去除阻劑膜之外周部（不要部分）的 曝光處理。繼之，LCD基板G被搬送裝置42搬送到曝光 裝置4，且對LCD基板G上的阻劑膜以預定圖案實施曝 光處理。此外，會有LCD基板G暫時被收容於緩衝站43 上的緩衝匣盒，然後，再搬送至曝光裝置4的情形。 曝光結束後，LCD基板G係藉由界面站3的搬送裝 置42，搬入外部裝置方塊45的上段字幕器（TITLER)， # 在LCD基板G上記載預定資訊後，將其載置於增設•冷 卻站44。接著，LCD基板G係藉由第2搬送裝置36，從 增設·冷卻站44搬送至屬於第2熱處理單元區段27之熱 處理單元方塊35的傳遞單元。 搬送到熱處理單元方塊35之傳遞單元的LCD基板G ，係藉由從該傳遞單元延長至顯影單元24的搬送機構例 如滾筒搬送，搬入顯影單元24。在顯影單元24中，例如 在以水平姿勢搬送中之LCD基板G的表面上盛滿顯像液 ，使暫時停止搬送的LCD基板傾斜預定角度，使表面上 -17- (14) 1311633 « l 的顯影液流下來，接著，於該狀態下，將沖洗液供給 面上，將顯影液沖洗掉。然後，使LCD基板G回到 姿勢，再開始進行搬送，並將乾燥用氮氣或空氣吹到 基板G，藉以使LCD基板乾燥。 顯影處理結束後，LCD基板G藉由連續的搬送 例如滾筒搬送，從顯影單元24搬送至i線UV照射 25，實施脫色處理。繼之，LCD基板G藉由i線UV # 單元25的滾筒搬送機構，被搬出至屬於第3熱處理 區塊28之熱處理單元區域37的傳遞單元。 配置於熱處理單元方塊37之傳遞單元的LCD基 ，係藉由第3搬送裝置39搬送至熱處理單元方塊37 烘烤單元及熱處理單元方塊3 8之後供烤單元的任一 進行後烘烤處理，然後，搬送至熱處理單元方塊38 遞·冷卻單元，冷卻至預定溫度後，再利用匣盒站1 送裝置11，收容在配置於匣盒站1的預定匣盒C。 ® 繼之，詳細說明關於阻劑塗佈單元23。第2圖 示阻劑塗佈單元23的平面圖，第3圖係表示作爲阻 佈單元23之構成要素之本發明的減壓乾燥裝置23b 面圖，第4圖係其正面圖。 如第2圖所示，阻劑塗佈裝置23 a具有··用以 LCD基板G的平台12;和在平台12上將LCD基板 送於X方向的基板搬送機構1 3 ;和將阻劑液供給至 送於平台12上之LCD基板G表面的阻劑噴嘴14; 以洗淨阻劑噴嘴1 4等的噴嘴洗淨單元1 5。 至表 水平 LCD 機構 單元 照射 單元 板G 之後 者， 的傳 的搬 係表 劑塗 之平 支持 G搬 被搬 和用 -18- (15) 1311633 . 平台1 2上係以設有用以將預定的氣體朝上方噴射的 _ 多數氣體噴射口 1 6 ’且藉由從氣體噴射口 1 6噴射的氣體 ’可使L C D基板G從平台1 2的表面浮起至預定的高度所 . 構成。 基板搬送機構13具有：以挟著平台12延伸於X方 向的方式配置的導軌（guide) 52a、52b;和可沿著導軌 52a' 52b往復移動的滑塊（slider) 50;和設置於該滑塊 # 5 0 ’且用以保持LCD基板G的一部分之吸附墊等的基板 保持構件（未圖示）。基板搬送機構1 3係將藉由氣體噴 射口 1 5所噴射的氣體而浮起的LCD基板G利用基板保持 構件加以保持，並在該保持狀態下使滑塊5 0沿著導軌 52a、52b移動，藉以搬送於X方向所構成，並且基板保 持構件係以可控制LCD基板G的保持及保持的解決的方 式構成。 阻劑噴嘴1 4係配置於平台1 2的上方，其將阻劑液朝 ® 下吐出成Y方向長形的大致帶狀。阻劑噴嘴14係以與用 以保持該阻劑噴嘴14的支柱構件54，可同時移動於X方 向且可上下昇降的方式構成，且可在LCD基板G供給阻 劑液的位置和在噴嘴洗淨單元1 5進行洗淨處理等的各位 置之間移動。 阻劑洗淨單元】5係保持於支柱構件5 5且配置於平台 12的上方。噴嘴洗淨單元15具有：假分配（dummy d i s p e n s e ) 5 7，係在將沖洗液供給至L C D基板G目1〗’先使 阻劑液從阻劑噴嘴1 4吐出；和噴嘴浴（n 0 z z 1 e b a 1 h ) 5 8 -19 - (16) 1311633 ，係}1¾•阻劑吐出口保持在溶劑的蒸氣環境，使阻劑噴嘴 14的阻劑吐出口不至於乾燥；和噴嘴洗淨機構59，係將 附著於阻劑噴嘴1 4之阻劑吐出口附近的阻劑加以去除。 如第3圖、第4圖所示’減壓乾燥裝置23b具有：可 收容L C D基板G的處理室6 ;和將L C D基板G搬入處理 室6內及將LCD基板G搬出處理室6外的搬送機構7。 處理室6係形成薄型的箱狀，其可將Lcd基板G以 Φ 大致水平狀態收容’且在X方向相向的側面部，分別具 有可供LCD基板G通過之延伸於Y方向的縫隙狀或長方 形搬入口 61、搬出口 62。此外，在處理室6之X方向相 向的側面部，分別設有用以開闔搬入口 6 1、搬出口 6 2的 閘構件63、64。閘構件63、64分別具有與搬入口 61及 搬出口 62對應且延伸於Y方向的帶狀或長方形，其係沿 著處理室6的側面部移動，並且藉由例如昇降而開闔（參 照第4圖的虛線）搬入口 61及搬出口 62。若將此種帶狀 # 閘構件63、64沿著具有搬入口 61及搬出口 62之處理室 6的側面部昇降的話，即可處理室6在開闔動作時所需的 空間可縮小，所以與以往具有上下處理室的減壓乾燥裝置 相比較，可達成裝置本體之實質的省空間化。此外’處理 室6的上面部69係以可拆除供維修用的方式設置。 在處理室6的底面部，與該處理室6內連通的排氣管 6 6係具有例如預定間隔的而設有複數條，且排氣管6 6係 與排氣裝置6 7連接。並且’在利用閘構件6 3、6 4將搬入 口 6 1及搬出口 62封閉而將處理室6內密封的狀態下’使 -20- (17) 1311633 排氣裝置67作動’藉此方式，可將處理室1內減壓至預 定値。排氣管66及排氣裝置67係構成用以將處理室6內 減壓，以使收容於處理室6內之LCD基板G的阻劑液乾 燥的減壓機構。 搬送機構7係將L C D基板G以大致水平狀態搬送， 將其從搬入口 61搬入處理室6內，再從搬出口 62搬到處 理室6外。搬送機構7具有：在處理室6內搬送LCD基 • 板G的內側搬送部7 a ;和在處理室6外將L C D基板G從 搬入口 6 1搬入，搬送到內側搬送部7 a的搬入側搬送部 7b;和在處理室6外將從內側搬送部7a搬送到的LCD基 板G從搬出口 62搬出的搬出側搬送部7c。 內部搬送部7a係在處理室6內於X方向以大致水平 狀態隔著間隔的方式設有複數滑輪構件和輸送帶，在此係 指分別設置於搬入口 6 1側端部及搬出口 6 2側端部的大致 圓柱狀滑輪構件7〇a、70b和搭掛在此等滑輪構件70a、 ® 7〇b的輸送帶71。滑輪構件7〇a、70b係以分別延伸於γ 方向的方式形成，且輸送帶71的上面係以位於搬入口 61 及搬出口 62之高度範圍內的方式，可旋轉地支持於處理 室6之例如Υ方向相向的側面部。滑輪構件7 0 a、7 0 b中 的至少任一者例如滑輪構件7 的旋轉軸係與馬達等的驅 動源72連接，藉由使驅動源72驅動，即可使滑輪構件 7〇b驅動旋轉，且輸送帶71會作動，在此同時，滑輪構 件7 0a也會跟著旋轉，因此，載置於輸送帶71上的LCD 基板G可搬送於X方向。此外’於此’先將驅動源72設 -21 - (18) 1311633 置於處理室6之Y方向側面部的外側，且利用密封構件 8 0將旋轉軸與處理室6之Υ方向側面部的間隙加以密封 ，以阻止滑輪構件70b的旋轉。 輸送帶7 1係由脲酯系材料或鐵氟龍（登錄商標）系材 料形成無端狀，其與LCD基板G之Y方向的寬度具有大 致相等的寬度。藉此，輸送帶71載置LCD基板G時係以 跨涉LCD基板G之Y方向的大致整體寬度而接觸的方式 φ 構成。此外，滑輪構件70a、70b間的間隔係設定成大於 LCD基板G的X方向長度，因此，輸送帶71係以利用減 壓機構之減壓乾燥處理時，將LCD基板G的背面跨涉大 致整面而接觸的方式構成。 滑輪構件70a、70b係分別在Y方向兩端部具有突出 於徑向外側的大徑部73，輸送帶7 1係配置於滑輪構件 70a、70b的大徑部73、73間且定位於Y方向。因此，可 防止輸送帶71在作動中的蛇行。 # 於處理室6內，在滑輪構件70a、70b偏靠搬入口 61 及搬出口 62側，分別設有大致圓柱狀的引導用滾筒構件 74a、74b，引導用滾筒構件74a ' 74b係以其上端與輸送 帶71的上面大致相同高度、或稍微高於輸送帶71上面的 方式，可旋轉地支持於與處理室6之例如Y方向相向的 側面部。引導用滾筒構件74a係用以將後述之搬入側搬送 部7b上的LCD基板G確實地引導至輸送帶71上，引導 用滾筒構件74b係用以將輸送帶71上的LCD基板G確實 地引導至後述的搬出側搬送部7c上。 -22- (19) 1311633 在輸送帶71內的空隙’用以埋設該空隙的充塡構件 6 5係以沒有與輸送帶7 1接觸的方式，裝設於例如γ方向 相向的側面部。依此，處理室6內的容積變小，可利用減 壓機構將處理室6內迅速地減壓。 當LCD基板G爲大型時’或者滑輪構件7〇a、70b間 的間隔較大時’理想的情況係在滑輪構件70a、70b間， 設置一個或複數個延伸於Y方向之用以防止輸送帶71彎 # 折的輔助用滾筒構件75，以支持輸送帶71。此外，當作 用於滑輪構件70a、70b之輸送帶71的張力較大時，則如 第5圖所示（第5圖係表示構成減壓乾燥裝置之內側搬送 部的主要部分之圖），以事先設有分別抵接於滑輪構件 7 0 a之X方向前側部及滑輪構件7 0 b之X方向後側部的抵 接構件8 1 ’以防止滑輪構件70a、70b的變形爲佳。抵接 構件8 1係以例如不會防礙滑輪構件70a ' 70b之旋轉的方 式具有滾筒機構所構成，且安裝於處理室6內之Y方向 Φ 相向的側面部。 搬入側搬送部7b及搬出側搬送部7c係以分別挾著具 有搬入口 61及搬出口 62的側面部，與內側搬送部7a相 向的方式設置於處理室6外，且具有在X方向於大致水 平保持間隔而設置的複數個例如兩個大致圓柱狀外側滾筒 構件76a、76b。外側滾筒構件76a、76b係分別以其上端 與輸送帶71的上面大致相同高度的方式，且與藉由阻劑 塗佈裝置23a之滑塊50所搬送之LCD基板G的背面大致 相同高度的方式，藉由支持構件（未圖示）可旋轉地支持 -23- (20) 1311633 。在此，外側滾筒構件76 a、76b中之—者或兩者係 轉軸連接於馬達等的驅動源（未圖示），使驅動源驅 旋轉’藉以使LCD基板G搬送於X方向的方式構成 此構成’不需要動作器（actu at 0Γ)或機械人之類的 搬送機構’即可從阻劑塗佈裝置23a接取LCD基板 如本實施型態之阻劑塗佈裝置2 3 a所示，阻劑塗佈裝 使LCD基板G呈大致水平且直線狀移動之所謂平流 # 尤其有效。 外側滾筒構件7 6 a、7 6 b分別具有小徑的旋轉軸 和在該旋轉軸77於Y方向保持間隔而設有複數的大 接部78 ’以LCD基板G通過時，抵接部78與LCD G接觸’以支持該LCD基板G的方式形成。再者， 之外側滾筒構件76a和外側滾筒構件76b，係以抵接: 之Y方向位置相異的方式構成，藉此構成，可分散 基板G與抵接部78接觸而對阻劑膜造成的影響，且 ^ 止抵接部7 8的痕跡轉印在阻劑膜。此外，引導用滾 件7 4a、74b亦與外側滾筒構件76a同樣地，具有小 旋轉軸和在該旋轉軸於Y方向保持間隔而設有複數 徑抵接邰’且引導用滾筒構件7 4 a、7 4 b與外側滾筒 76a，係以抵接構件之γ方向位置相異的方式構成。 引導用滾筒構件74a、74b '外側滾筒構件76a也可 助用滾筒構件75那樣形成跨涉LCD基板G之Y方 大致整體寬度而連接的形狀。 在處理室6的滑輪構件70a與引導用滾筒74a之 以旋 動而 。藉 複雜 G。 置在 式時 77 ' 徑抵 基板 相鄰 部78 LCD 可防 筒構 徑的 的大 構件 又， 像輔 向的 間， -24- (21) 1311633 以及滑輪構件70b和引導用滾筒74b之間，朝 氣的氮氣供給部82係以延伸於Y方向的方式 供給部8 2係藉由將氮氣供給至減壓的處理室 處理室6內快速地昇壓，同時得以抑制L C D : 劑膜與外部的空氣接觸。又，在處理室6內；ί 側面部，爲了將附著於輸送帶7 1的塵埃等排 氣管83係以通過輸送帶71內而延伸於Υ方 φ 置，且該局部排氣管83係與排氣裝置（未圖 在此，雖然將局部排氣管設置於輸送帶71的 號83位置），但亦可設置於輸送帶71的表面 如第4圖之符號84位置）。此時，就微粒對 事先在局部排氣管84配備電離器（ionizer)， 71的表面除電而構成爲佳，且局部排氣管84 以可在輸送帶作動時作動，輸送帶71停止時 進行控制爲佳。局部排氣管83 (及84 )和連 # 氣管83 (及84)的排氣裝置，係構成清潔輸ί 潔機構。 就以上述方式構成之阻劑塗佈單元23之 的處理步驟加以說明。首先，令滑塊5 0於平！ 理單元方塊3 2側端部等待預備，在平台1 2上 可使LCD基板G浮起至預定高度的狀態。繼 置於熱處理單元方塊32的滾筒搬送機構，將 搬入平台12而遞送至滑塊50。因此，LCD基 台1 2上以大致水平姿勢保持浮起。 上方供給氮 設置。氮氣 6內，而將 S板G的阻 L Y方向的 出，局部排 向的方式設 示）連接。 背面側（符 側（參照例 策而言，以 可將輸送帶 及電離器係 停止的方式 接於局部排 帶7 1的清 L C D基板G 4 1 2之熱處 於各部形成 之，利用設 L C D基板G 板G可在平 -25- (22) 1311633 接著，使滑塊50以預定的速度朝減壓乾燥裝置23b 側滑動。以因此，L C D基板G朝減壓乾燥裝置2 3 b被浮 起搬送，當其通過阻劑噴嘴時1 4的下方時，阻劑液從阻 劑噴嘴14被供給至表面，而形成阻劑膜。形成有阻劑膜 的LCD基板G，透過滑塊50被搬送至平台12的減壓乾 燥裝置23b側端部，更具體而言，被搬送至藉由搬入側搬 送部7b之驅動源而旋轉驅動的外側滾筒構件76a或76b 上，在此，解除滑塊5 0所形成的保持。 藉由解除滑塊50所形成的保持，LCD基板G被載置 於搬入側搬送部7b的外側滾筒構件76a或76b上。在此 ，藉由令搬入側搬送部7b的外側滾筒構件76a或76b旋 轉驅動，LCD基板G即可從阻劑塗佈裝置23a遞送到搬 入側搬送部7b，至少從搬入口 6 1搬入而搬送到達內部搬 送部7a的輸送帶71上爲止。此時，藉由使滑輪構件70b 旋轉驅動，使輸送帶71作動，到達輸送帶71上的LCD 基板G，即可從搬入側搬送部7b被遞送至內側搬送部7a ，且搬送於輸送帶71上而收容於處理室6內。LCD基板 G收容於處理室6內，以大致整面載置於輸送帶71上後 ，停止輸送帶71的作動，接著，利用閘構件63、64將搬 入口 61及搬出口 62塞住，以密封處理室6內。 接著，使排氣裝置6 7作動以將處理室6內減壓至預 定値。依此，形成於L C D基板G表面的阻劑膜變乾燥。 本實施型態中，輸送帶71在減壓乾燥處理時係將LCD基 板G大致整面地接觸而均勻地支持，更且，不需使用動 -26- (23) 1311633 作器類型或機器人類型等把持LCD基板G來進行搬 搬送機構，即可將LCD基板G從阻劑塗佈裝置遞送 壓乾燥裝置，且由於不需像習知之減壓乾燥裝置那樣 提重銷（lift pin )等來支持LCD基板G，所以不會 阻劑膜留下提重銷等所形成之部分轉印痕之虞。亦即 送帶71在減壓乾燥處理時具有將LCD基板G均勻地 ，而不是局部地支持之基板支持構件的功能。 令排氣裝置67作動預定時間，使阻劑膜乾燥後 止排氣裝置6 7。繼之，利用氮氣供給部8 2將氮氣供 處理室6內，同時，使閘構件63、64退開，以打開 口 61及搬出口 62，使處理室6內昇壓。接著，再次 送帶71作動，使LCD基板G至少通過搬出口 62, 送到藉由搬出側搬送部7 c之驅動源而旋轉驅動的外 筒構件76a或76b上。 此時，使搬出側送部7c的外側滾筒構件76a或 旋轉驅動，LCD基板G即可從內側搬送部7a被遞送 出側搬送部7C。接著’從搬出口 62搬出至完全露出 室6外爲止，在外側滾筒構件76a、76b上進行搬送 後，遞送至熱處理單元方塊34的傳遞單元。 本實施型態係以在處理室6的側壁部分別設置搬 61及搬出口 62，且利用搬送機構7令LCD基板以大 平形態移動’以進行來自搬入口 61及搬出口 6 2的搬 出的方式構成’故可將搬入口 61及搬出口 62的高度 成極小，爲稍微大於基板厚度的程度。亦即，可將搬 送的 至減 利用 有在 ，輸 支持 ，停 給至 搬入 令輸 被搬 側滾 76b 到搬 處理 ，然 入口 致水 入搬 設定 入口 -27- (24) 1311633 6 1及搬出口 6 2形成縫隙狀。所以，在發揮開關處理室的 功能方面，與以往的減壓乾燥裝置中的處理室相比較，可 將用以開關處理室6之搬入口 61及搬出口 62的閘構件 63、64大幅輕量化。而且’搬送機構7係將LCD基板G 以大致水平狀態進行輸送帶搬送或滾筒搬送，所以不需像 以往的減壓乾燥裝置所設置的載置台那樣令基板的搬送機 構昇降。因此，即使基板大型化，亦可充分確保裝置的安 全性，同時可抑制因閘構件6 3、6 4的開關動作及搬送機 構7的搬送動作所產生的振動。 此外’搬入側搬送部7b及搬出側搬送部7c亦可與內 側搬送部7 a同樣’以具有滑輪構件和輸送帶的輸送帶搬 送機構構成。 繼之’說明本發明之其他實施型態的減壓乾燥裝置。 第6圖係表示本發明之其他實施型態的減壓乾燥裝置之平 面圖，第7圖係其正面圖。 減壓乾燥裝置23c係將減壓乾燥裝置2；3b的內側搬送 部7a加以變更’且在與減壓乾燥裝置23b相同的部位附 上相同符號以省略說明。減壓乾燥裝置2 3 c的內側搬送部 7 d具有複數設置於X方向之大致圓柱狀的內側滾筒構件 79。內側滾筒構件79係分別以其上端與上述搬入側搬送 部7 b及搬出側搬送部7 c的上端大致相同高度的方式，可 旋轉地支持於例如處理室6之Y方向相向的側面部。 複數內側滾筒構件7 9中的一部分或全部係藉由其旋 轉軸與馬達等的驅動源72連接，使驅動源72驅動而旋轉 -28- (25) 1311633 ，以此方式’ L C D基板G可在內側滾筒構件7 9上被搬送 於X方向。在此’內側滾筒構件7 9的一部分或全部係以 可藉由交流馬達等的驅動源7 2正反轉自如的旋轉的方式 構成。此外’內側滾筒構件7 9係以分別與L C D基板G在 Y方向的大致整體寬度接觸的方式形成，然而，亦可與外 側滾筒構件76a、76b同樣以與LCD基板G在Y方向保持 間隔且於複數位置接觸的方式形成，且以相鄰的內側滾筒 φ 構件79彼此間與LCD基板G接觸的Y方向位置係不同 的方式構成亦可。 在內側搬送部7d的下側，用以防止因排氣裝置67的 作動而在LCD基板G作用直接的吸引力的板狀或盤狀的 底座6 8係裝設於例如處理室6之Y方向相向的側面部。 就以上述方式構成之減壓乾燥裝置23c之內側搬送部 7d的LCD基板G的處理步驟加以說明。首先，從阻劑塗 佈裝置23a遞送且藉由搬入側搬送部7b所搬送的LCD基 ♦ 板G，在到達與驅動源7 2連接的內側滾筒構件7 9上時， 利用驅動源72使內側滾筒構件79旋轉驅動，即可使LCD 基板G從搬入側搬送部7b遞送到內側搬送部7d，搬送於 複數的內側滾筒構件7 9上，然後，完全搬入處理室6內 。繼之，停止內側滾筒構件7 9的旋轉’利用閘構件6 3、 64將搬入口 61及搬出口 6 2閉塞，以將處理室6內密封1311633 • . (1) In the present invention, the coating liquid of a resist liquid or the like is applied to a substrate used for a liquid crystal display (LCD) or the like, and the coating is applied under reduced pressure. A vacuum drying apparatus that performs a drying treatment on the cloth liquid. [Prior Art] When a liquid crystal display (LCD) is manufactured, a photolithography technique is used in order to form an electrode pattern on a glass substrate (hereinafter referred to as an "LCD substrate" for LCD). When the pattern is formed by photolithography, a resist film is formed by first applying a resist liquid on a glass LCD substrate, and then the resist film is exposed in a manner corresponding to the circuit pattern, and then developed. The order is to proceed. In the photolithography technique, in order to dry the resist liquid on the LCD substrate coated with the resist liquid, it is carried into the heating device to perform the pre-baking Φ treatment. However, in the heating device, generally speaking, In order to avoid direct contact between the LCD substrate and the heating plate, the LCD substrate is disposed on the heating plate via a pin protruding from the heating plate. Therefore, there is a problem that the trace of the pin is printed on the resist film. Therefore, in order to prevent such transfer, it is proposed to first dry the resist liquid applied to the substrate under reduced pressure, and then dry it by a heating device to avoid rapid drying (see, for example, a patent) Literature 1). In the apparatus for performing such a reduced-pressure drying process, a processing chamber including an upper processing chamber and a lower processing chamber, and an LCD substrate mounted in the chamber -5-(2) 1311633 can be used. The mounting table and the apparatus for decompressing the pressure in the processing chamber to reduce the pressure (for example, refer to Patent Documents 2 and 3). The vacuum drying apparatus performs a vacuum drying process in a state where the upper processing chamber and the lower processing chamber are in close contact with each other, and when the LCD substrate is loaded and unloaded, the upper processing chamber is raised by a crane to open the processing chamber. Open the 'Next' and then use the appropriate drive mechanism to raise the stage. φ "In the vacuum drying apparatus, the LCD substrate before processing is transferred to the mounting table by the actuator (or actuator) or the robot is held", and the processed LCD substrate is transported from the mounting table. Therefore, in order to make the grip by the actuator or the robot relatively easy, the LCD substrate is placed on the mounting table by supporting the pin protruding from the mounting table at its end. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-110079 (Patent Document 1) JP-A-2000-181079 (Patent Document 1) JP-A-2002-241702 [Abstract] [Invented] Problem] The LCD substrate tends to increase in size. Recently, there has been a large-scale structure of 2 m, and the vacuum drying device has been significantly enlarged. Therefore, in the above-described vacuum drying apparatus, when the LCD substrate is carried in and out, it is necessary to raise the upper processing chamber having a relatively heavy weight, which causes a problem in safety. Moreover, when the upper processing chamber having such a heavy weight is lifted and lowered, the vibration generated by the upper processing chamber of the -6-(3) 1311633 during the lifting operation is increased, and the vibration is transmitted to the vacuum drying apparatus described above. The coating device for applying the resist liquid is disposed close to the arrangement, and thus there is a concern that the film thickness of the resist liquid is not uniform. Further, when the LCD substrate is enlarged, it is difficult to support the L C D substrate only by the pin provided at the end portion thereof, and therefore it is necessary to provide a pin at the center portion of the L C D substrate. As a result, the possibility that the traces of these pins are transferred to the resist film becomes large, and the vacuum drying process itself becomes meaningless. φ The present invention has been made in view of such a problem, and an object of the present invention is to provide an excellent safety, and to suppress generation of vibration, and to reliably prevent application to coating on a substrate, even if the substrate is increased in size. A vacuum drying device for transferring liquid. [Means for Solving the Problems] In order to solve the above problems, the present invention provides a vacuum drying apparatus which applies a drying treatment to a coating liquid after a coating liquid is applied to a substrate, and is characterized in that The processing chamber includes a transfer port for carrying in the substrate and a transfer port for carrying out the substrate, and the substrate carried in from the transfer port is housed in a substantially horizontal state; and the shutter member is configured to be the above-described processing chamber And a pressure-reducing mechanism that decompresses the processing chamber while the opening and closing ports are closed by the shutter member; and the conveying mechanism transports the substrate in a substantially horizontal state And moving into the processing chamber from the transfer port, and performing a vacuum drying process by the pressure reducing mechanism, and then transporting it in a substantially horizontal state, and carrying out the processing chamber from the transfer port; and the substrate supporting member is attached thereto (4) 1311633 The processing chamber can support the substrate evenly, rather than locally. In addition, it also includes the case where the entrance and the exit are the same. In the present invention, it is preferable that the transport mechanism includes an inner transport unit that transports the substrate in the processing chamber, and a carry-in transport unit that carries the substrate from the transfer port to the inside of the processing chamber and transports the substrate to the inner side. The transport unit and the carry-out transport unit carry out the substrate transported from the inner transport unit in the processing chamber from the transport port, and the inner transport unit φ is rotatably provided in the transport direction of the substrate. a plurality of pulley members and a conveyor belt that is hung on the pulley members, and the substrate is conveyed by the operation of the conveyor belt formed by the rotation of the pulley member, and the conveyor belt is attached to the support substrate The state is stopped and has the function of the above-described substrate supporting member. In this case, it is preferable to have a cleaning mechanism for cleaning the above-mentioned conveyor belt in operation. In the present invention, it is preferable that the transport mechanism includes Φ: an inner transport unit that transports the substrate in the processing chamber, and a transport-side transport unit that transports the substrate from the transport inlet in the processing chamber and transports the substrate The inside conveyance unit and the carry-out transport unit are carried out from the transfer port by the substrate conveyed from the inner transfer unit in the processing chamber, and the inner transfer unit is rotatably provided on the substrate. a plurality of inner roller members in the direction, and the substrate is subjected to roller conveyance by rotation of the inner roller member, and a plurality of the inner roller members have a part or all of which can be alternately rotated in the forward and reverse directions, thereby causing the substrate to swing and uniformly The function of the above-mentioned substrate supporting member is supported. At this time, it is assumed that the inner roller member is formed to be in contact with the substantially entire width of the substrate, or the inner roller member is spaced apart from the substrate in the width direction. The contact is formed at a plurality of positions, and the adjacent inner roller members are configured to be different from each other in the width direction of the substrate. In addition, it is preferable that the loading-side conveying unit has a plurality of outer drum members ′ that are rotatably provided in the conveying direction of the substrate, and the drum is conveyed by the rotation of the outer drum member. In the case where the substrate is carried into at least the above-described transfer port, the inner transfer portion is preferably transported to the inside of the processing chamber by the substrate that has been transferred by the transfer-side transfer unit. In addition, it is preferable that the loading-side conveying unit is provided so as to be close to the coating device that applies the coating liquid on the substrate, and is connected to the coating device by the rotation of the outer roller member. The substrate that has been transported in a substantially horizontal state is transported by the roller in this manner. In this case, it is preferable that the inner transport unit transports the substrate accommodated in the processing chamber so as to reach the transport-side transport unit through at least the transport port, and the carry-out transport unit has a plurality of outer roller members rotatably disposed in a conveying direction of the substrate, and the substrate reached by the inner conveying portion is carried out from the delivery port by the rotation of the outer roller member until the entire processing chamber is completely exposed The drum conveyance is performed in this way. Further, in the present invention, the shutter member is moved along the upper side -9-(6) 1311633 of the processing chamber to be used for the switch. [Effect of the invention] As described above, the loading is carried out according to the wall portion. Since the port and the outlet are moved in a horizontal state to carry out the loading, the inlet and the moving φ can be slightly larger than the thickness of the substrate. In terms of energy, the loading and unloading of the conventional vacuum drying switch processing chamber is as described above. The substrate is placed on the mounting table provided by the substantially horizontal pressure drying device. Therefore, even if the substrate is enlarged, the switching of the shutter member can be suppressed. Vibration. Further, since the substrate is uniformly supported, it is preferable that the transfer port and the transfer port are formed by the application liquid on which the substrate is applied to the substrate. In the invention, the height of the outlet such that the substrate is carried in and out of the substantially port and the outlet by the transfer mechanism is set to be extremely small, and therefore, the processing chamber in the work device of the switch processing chamber is used only. In comparison, the gate member can be greatly reduced in weight. Further, in the state transfer, it is not necessary to raise and lower the substrate transfer device as is conventionally known. The safety of the device can be sufficiently ensured, and the support member produced by the transport operation of the transport mechanism can be reliably prevented from being transferred by the size of the substrate in the processing chamber. [Embodiment] Hereinafter, referring to the drawings, the first embodiment is a schematic plan view showing a development process of a resist film after LCD. The resist coating and development treatment will be described in the embodiment of the present invention. The formation of the resist film of the board and the exposure of the resist coating/developing system 100 include: a cassette station 1 for storing a cassette C for storing a 10- (7) 1311633 plural LCD substrate g a processing station 2 including a series of processes of resist coating and development is applied to the LCD substrate G; and an interface station 3 for performing delivery of the LCD substrate G with the exposure device 4, and the processing station 1 and the interface station 3 are respectively They are arranged on both sides of the processing station 2. Further, in Fig. 1, the length direction of the resist application/development processing system 1 is set to the X direction, and the direction perpendicular to the X direction on the plane is referred to as the Y direction. The φ 匣 box station 1 includes a mounting table 9 in which the cassette c is placed in parallel in the Y direction, and a transport device 11 that carries in and out the LCD substrate G between the processing station 2, and the mounting table 9 and the outside. The transfer of the cassette c is carried out between. The transport robot arm Ua provided in the transport device 11 is movable on the transport path 1A provided in the Y direction along the arrangement direction of the cassette C, and the LCD substrate G is carried in between the cassette C and the processing station 2. Move out. The processing station 2 has parallel two-column transport lines A and B which are substantially extended in the X direction and which are transported by the LCD substrate G. On the transport line a, the scrubbing unit (s CR ) 2 1 , the first heat treatment unit section 26 , the resist coating unit 23 , and the second are arranged in order from the cassette station 1 side toward the interface station 3 ′. Heat treatment unit section 27. On the transport line B, the second heat treatment unit section 27, the developing unit (DEV) 24, the i-line UV irradiation unit (i-UV) 25, and the third are arranged in this order from the interface station 3 toward the cassette station side. Heat treatment unit section 28. A part of the scrub cleaning unit 21 is provided with an excimer UV irradiation unit (e-UV) 22. Further, the 'excimer UV irradiation unit 22 is provided for removing the organic matter of the LCD substrate G before the implementation of the scrubbing -11-(8) 1311633, and the i-line UV irradiation unit 25 is used for the decoloring treatment for development. And the setter. In the rubbing cleaning unit 21, the LCD substrate G is conveyed while being conveyed in a substantially horizontal posture, and is subjected to a washing process and a drying process. In the developing unit 24, the LCD substrate G is conveyed in a substantially horizontal posture, and the developer application, the rinsing, and the drying process are sequentially performed. In the rubbing cleaning unit 21 and the developing unit 24, the conveyance of the LCD substrate G is performed by, for example, #roll conveyance or conveyance belt conveyance, and the entrance and exit of the LCD substrate G are set to be relatively short. side. Further, the conveyance of the i-ray UV irradiation unit 25 by the LCD substrate G is continuously performed by the same conveyance mechanism as that of the conveyance mechanism of the development unit 24. As will be described in detail later, the resist application unit 23 includes a resist application device (CT) 23a that supplies a resist liquid while the LCD substrate G is conveyed in a substantially horizontal posture to form a coating film; The drying device (VD) 23b exposes the LCD substrate G to a reduced pressure environment, whereby the volatile components contained in the coating film formed on the LCD substrate G are evaporated to dry the coating film. The first heat treatment unit section 26 has two heat treatment blocks (TB) 3 1 and 3 2 which are formed by laminating heat treatment units for heat-treating the LCD substrate G, and the heat treatment unit blocks 31 are disposed on the scrubbing cleaning unit 2 1 On the side, the heat treatment unit block 3 2 is disposed on the side of the resist coating unit 23. Between the two heat treatment unit blocks 31, 32, a first conveying device 33 is provided. The heat treatment unit block 31 has a -12-(9) 1311633 pass unit for performing the delivery of the LCD substrate G, and a pair of LCDs. The substrate G is subjected to two dehydration baking units in which the dehydration baking treatment is performed, and an adhesion unit that performs drainage treatment on the LCD substrate G is sequentially laminated from below. Further, the heat treatment unit block 32 has a pass unit for performing the delivery of the LCD substrate G, two cooling units for cooling the LCD substrate G, and an adhesion unit for performing the drainage treatment on the LCD substrate G. The composition of the layers in the order below. ϋ The first transfer device 33 performs the process of loading and receiving the LCD substrate G from the wipe cleaning unit 21 via the transfer unit 21, and the LCD substrate G between the heat treatment units, and delivering the LCD substrate G to the resist coating via the transfer unit. Cloth unit 23. The first conveying device 33 can move up and down, back and forth, and rotate, and can also access any of the heat treatment unit blocks 31 and 32. The second heat treatment unit section 27 has two heat treatment blocks (TB) 34 and 3 5 ' heat treatment unit blocks 34 which are formed by laminating heat treatment units for performing heat treatment on the LCD substrate G. The heat treatment unit blocks 34 are disposed on the resist coating unit 2 On the 3 side, the heat treatment unit block 35 is disposed on the developing unit 24 side. Further, a second conveying device 36 is provided between the two heat treatment unit blocks 34 and 35. The heat treatment unit block 34 is a structure in which a transfer unit that performs the delivery of the LCD substrate G and three pre-baking units that pre-bake the LCD substrate G are sequentially stacked from below. Further, the heat treatment unit block 35 is a transfer unit that sequentially transports the LCD substrate G from below, a cooling unit that cools the LCD substrate G, and pre-bakes the LCD substrate-13-(10) 1311633 G. The second transfer device 36 is configured to receive the LCD substrate G from the resistor 23 via the transfer unit, carry the G into and out of the heat treatment unit, and deliver the G to the developing unit 24 via the transfer unit. And the addition/EXT_COL of 44 to the substrate delivery portion of the interface station 3 to be described later is delivered and the LCD substrate G is picked up. The delivery device 36 has the same structure as the first transfer device 33, and any one of the φ processing unit blocks 34, 35 is accessed. The third heat treatment unit section 28 has two heat treatment sheets TB) 37 and 38 formed by laminating heat treatment units for processing the LCD substrate, the heat treatment unit block 37 is disposed on the display j side, and the heat treatment unit block 38 is disposed on the 匣Box station 1 side. Between the two heat treatment unit blocks 37 and 38, a third transfer heat treatment unit block 37 is provided, and the three elements for performing the post-baking treatment of the LCD substrate G and the post-baking treatment for the LCD substrate G are sequentially stacked from below. Composition. Further, the heat treatment unit block is configured by post-baking unit for post-baking the LCD substrate G, transfer/cooling of the substrate G, and cooling and cooling unit, which are sequentially stacked from below. The third transfer device 39 performs the process of taking in the LCD substrate G from the first radiation unit 25 via the transfer unit, loading and unloading the heat-treated single LCD substrate G, and delivering the LCD substrate G via the transfer/cooling unit. Further, the 'third transfer device 39 is also applied to the single LCD substrate LCD substrate cooling station (the second transfer can also perform the heat element block on the heat G (the cedar unit 24 and the transfer post-delivery delivery device 39) , 38 has the LCD two post-drying line UV photo between the 匣 匣 box station 1 L has the same structure as the 1 -14- (11) 1311633 transport device 3 3, can also be used for the heat treatment unit: any unit The processing station 2 is configured such that the two rows of transport lines A form a two-stage transport line A as described above, and each of the transport units is disposed. A space 40 is provided between the transport lines A and B. The shuttle is disposed in a reciprocable manner to maintain the LCD substrate G and deliver the delivery of the LCD substrate G to the shuttle 41 between the transport lines A, B. The interface station 3 can be carried out by using the first to the 33rd, 36th, and 39th. The interface station 3 includes: a transfer device 42 that carries in and out of the processing station 2 and the exposure device LCD substrate G; and a buffering station (BUF) 43; An additional cooling/cooling station 44 having a cooling function, and a subtitle (TITLER) device (EE) is The upper and lower external device blocks 45 Φ 42 are disposed adjacent to each other. The transport device 42 includes a transporter, and the transport robot 42a can carry in and out the processing station 2 and the exposure device LCD substrate G. First, the cassette substrate G placed on the mounting table 9 of the cassette station 1 is directly carried into the processing unit UV irradiation unit 22 by the transfer device 11 to perform pre-scrapping processing. The conveyance device 11 is carried into the rubbing cleaning unit 21, and after the scrubbing cleaning, the LCD substrate G is transported by means of, for example, the drum transporting blocks 37, 38 t, and B, and the shuttle (g is 40). In the shuttle system configuration, the buffer substrate transfer unit and the peripheral exposure system and the transport I arm 4 2 a are disposed between the LCD substrate 3 transfer device 4, and the LCD station in the system 1 0 0 is performed between the 4 2, the sub-divided LCD substrate G is scrubbed. 揉, carried out to the -15-(12) 1311633 in the heat treatment unit block 31 of the first heat treatment unit section 26. The transfer unit disposed in the heat treatment unit block 31 LCD substrate G, first moved to heat The dehydration baking unit of the unit cell 31 performs heat treatment. Then, the LCD panel G is transported to the cooling unit of the heat treatment unit block 32 for cooling, and then transferred to the heat treatment unit block 31 for the fixing property of the barrel resist. Any one of the attachment unit to which the single crucible and the heat treatment unit 32 are attached is subjected to drainage treatment by Η MDS. Then, the LCD substrate G is transported to the cooling unit for cooling, and then transferred to the heat treatment unit block 32 for transfer. unit. The transport processing of the LCD substrate G during the series of processes is performed by the first transport device 33. The LCD substrate G disposed in the transfer unit of the heat treatment unit block 32 is carried into the resist application unit 23 by a substrate transfer mechanism such as a drum transport mechanism provided in the transfer unit. As described in detail later, in the resist application device 23a, the liquid crystal substrate G is transported while being horizontally placed, and a resist liquid is supplied to form a coating film, and then the coating film is applied by the vacuum drying device 23b. The vacuum drying treatment was carried out. Then, the liquid crystal substrate G is transported from the resist coating unit 23 by the substrate transport robot or the like provided in the vacuum drying device (VD) 23b by the carry-out side transport unit 7c of the transport mechanism 7 to be described later. The transfer unit to the heat treatment unit block 34 belonging to the second heat treatment unit section 27. The LCD substrate G disposed in the transfer unit of the heat treatment unit block 34 is transported to the heat treatment unit block 34 by the second transfer device 36 - 13 - 13 13313 33 Pre-baking unit and heat treatment unit block 3 5 pre-baked Any of the baking units is subjected to a prebaking treatment 'and then' to the cleaning unit of the heat treatment unit block 35, and is cooled to a predetermined temperature. Then, the LCD panel G is transported to the transfer unit of the heat treatment unit block 35 by the second transfer device 36. Then, the LCD substrate G is transported to the interface station 3 by the second transfer device 36. The cooling station 44' is transported to the peripheral exposure unit (EE) of the external unit block 45 by the φ transport unit 42 of the interface station 3 as needed to perform exposure processing for removing the outer peripheral portion (the unnecessary portion) of the resist film. Then, the LCD substrate G is transported to the exposure device 4 by the transport device 42, and the resist film on the LCD substrate G is subjected to an exposure process in a predetermined pattern. Further, there is a case where the LCD substrate G is temporarily accommodated in the buffer cassette on the buffer station 43, and then transported to the exposure device 4. After the exposure is completed, the LCD substrate G is carried into the upper captioner (TITLER) of the external device block 45 by the transfer device 42 of the interface station 3, and the predetermined information is recorded on the LCD substrate G, and then placed on the add-on/cooling. Station 44. Then, the LCD substrate G is transported from the additional/cooling station 44 to the transfer unit of the heat treatment unit block 35 belonging to the second heat treatment unit section 27 by the second transfer device 36. The LCD substrate G conveyed to the transfer unit of the heat treatment unit block 35 is carried into the developing unit 24 by, for example, roller conveyance by a transfer mechanism extending from the transfer unit to the developing unit 24. In the developing unit 24, for example, the surface of the LCD substrate G conveyed in a horizontal posture is filled with the developing liquid, and the LCD substrate temporarily stopped is tilted by a predetermined angle so that the developer on the surface is -17-(14) 1311633 « l Flowing down, then, in this state, the rinse liquid is supplied to the surface, and the developer is washed away. Then, the LCD substrate G is returned to the posture, and the conveyance is started again, and the drying is performed by blowing nitrogen or air onto the substrate G, whereby the LCD substrate is dried. After the development processing is completed, the LCD substrate G is conveyed from the developing unit 24 to the i-line UV irradiation 25 by continuous conveyance, for example, drum conveyance, to perform decoloring processing. Then, the LCD substrate G is carried out to the transfer unit of the heat treatment unit region 37 belonging to the third heat treatment block 28 by the drum conveyance mechanism of the i-line UV # unit 25. The LCD substrate disposed in the transfer unit of the heat treatment unit block 37 is transported by the third transfer device 39 to the heat treatment unit block 37, the baking unit and the heat treatment unit block 38, and then subjected to any post-baking treatment of the baking unit, and then After being transferred to the heat treatment unit block 38, the cooling unit is cooled to a predetermined temperature, and then stored in the predetermined cassette C disposed in the cassette station 1 by the cassette station 1 feeding device 11. ® Next, the resist coating unit 23 will be described in detail. Fig. 2 is a plan view showing the resist application unit 23, and Fig. 3 is a plan view showing the reduced-pressure drying device 23b of the present invention as a constituent element of the blocking unit 23, and Fig. 4 is a front view thereof. As shown in Fig. 2, the resist coating device 23a has a platform 12 for the LCD substrate G; and a substrate transfer mechanism 13 for feeding the LCD substrate to the X direction on the stage 12; and a resist liquid The resist nozzle 14 is supplied to the surface of the LCD substrate G on the stage 12; the unit 15 is cleaned by washing the nozzle of the resist nozzle 14 or the like. After the horizontal LCD unit is irradiated to the unit board G, the transfer of the transfer agent is applied to the G-transport and the -18- (15) 1311633 is used. The platform 1 2 is provided with a plurality of gas injection ports 16 6 ' for injecting a predetermined gas upward, and the gas projected from the gas injection port 16 can float the LCD substrate G from the surface of the platform 1 2 From the height to the predetermined height. Composition. The substrate transfer mechanism 13 has guides 52a and 52b that are disposed to extend in the X direction next to the stage 12, and sliders 50 that are reciprocally movable along the guide rails 52a' to 52b; and are disposed on the slider Block #5 0 ' and a substrate holding member (not shown) for holding a suction pad or the like of a part of the LCD substrate G. The substrate transfer mechanism 13 holds the LCD substrate G floating by the gas ejected from the gas ejection port 15 by the substrate holding member, and moves the slider 50 along the guide rails 52a and 52b in the held state. The substrate holding member is configured to be transported in the X direction, and the substrate holding member is configured to control the holding and holding of the LCD substrate G. The resist nozzles 14 are disposed above the stage 1 2, and discharge the resist liquid toward the under ® into a substantially strip shape elongated in the Y direction. The resist nozzle 14 is configured to be movable in the X direction at the same time as the pillar member 54 for holding the resist nozzle 14 and can be lifted up and down, and can be provided at the position where the resist liquid is supplied to the LCD substrate G and at the nozzle. The clean unit 15 moves between positions such as a washing process. The resist cleaning unit 5 is held by the pillar member 55 and disposed above the stage 12. The nozzle cleaning unit 15 has a dummy dispense 517, and supplies the rinsing liquid to the LCD substrate G1 to first discharge the resist liquid from the resist nozzle 14; and the nozzle bath (n 0 zz) 1 eba 1 h ) 5 8 -19 - (16) 1311633 , system} 13⁄4 • The resist discharge port is maintained in a solvent vapor environment so that the resist discharge port of the resist nozzle 14 is not dried; and the nozzle cleaning mechanism 59 The resist added to the vicinity of the resist discharge port of the resist nozzle 14 is removed. As shown in FIGS. 3 and 4, the vacuum drying apparatus 23b has a processing chamber 6 in which the LCD substrate G can be accommodated, and a transfer in which the LCD substrate G is carried into the processing chamber 6 and the LCD substrate G is carried out of the processing chamber 6. Agency 7. The processing chamber 6 is formed in a thin box shape, and the Lcd substrate G can be accommodated in a substantially horizontal state of Φ and a side surface portion facing in the X direction, respectively having slits or rectangles extending through the Y direction through the LCD substrate G. The entrance 61 and the exit 62 are moved. Further, in the side portions facing the X direction of the processing chamber 6, the shutter members 63 and 64 for opening the inlet 6 1 and the opening 6 2 are provided, respectively. Each of the shutter members 63 and 64 has a strip shape or a rectangular shape extending in the Y direction corresponding to the carry-in port 61 and the carry-out port 62, and is moved along the side surface portion of the processing chamber 6, and is opened by, for example, lifting (see In the dotted line of Fig. 4, the inlet 61 and the outlet 62 are moved. When the strip-shaped shutter members 63 and 64 are moved up and down along the side surface portion of the processing chamber 6 having the inlet 61 and the outlet 62, the space required for the processing chamber 6 during the opening operation can be reduced. Compared with the conventional vacuum drying apparatus having the upper and lower processing chambers, the substantial space saving of the apparatus body can be achieved. Further, the upper surface portion 69 of the processing chamber 6 is provided in a detachable manner for maintenance. In the bottom surface portion of the processing chamber 6, the exhaust pipe 66 communicating with the inside of the processing chamber 6 is provided with, for example, a predetermined interval, and a plurality of exhaust pipes 66 are connected to the exhaust device 67. Further, 'the -20-(17) 1311633 exhaust device 67 is actuated by closing the transfer port 6 1 and the transfer port 62 by the shutter members 63, 64 and sealing the inside of the process chamber 6. The inside of the processing chamber 1 can be depressurized to a predetermined enthalpy. The exhaust pipe 66 and the exhaust unit 67 constitute a pressure reducing mechanism for decompressing the inside of the processing chamber 6 to dry the resist liquid of the LCD substrate G accommodated in the processing chamber 6. The transport mechanism 7 transports the L C D substrate G in a substantially horizontal state, carries it into the processing chamber 6 from the carry-in port 61, and then moves it from the carry-out port 62 to the outside of the processing chamber 6. The transport mechanism 7 has an inner transport portion 7a that transports the LCD substrate G in the processing chamber 6, and a liquid crystal substrate G that is carried out from the transport inlet 6 1 outside the processing chamber 6, and is transported to the transport side of the inner transport portion 7a. The conveyance unit 7b and the carry-out side conveyance unit 7c that is carried out from the carry-out port 62 by the LCD substrate G conveyed from the inner conveyance unit 7a outside the processing chamber 6. The internal transfer unit 7a is provided with a plurality of pulley members and a conveyor belt in a substantially horizontal state in the processing chamber 6 so as to be spaced apart from each other in the horizontal direction. Here, the internal transfer unit 7a is provided at the end portion of the carry-in port 6 1 and the transfer port 6 2 . The substantially cylindrical pulley members 7a, 70b at the side end portions and the conveyor belt 71 that are hung on the pulley members 70a, ® 7b. The pulley members 7A and 70b are formed to extend in the γ direction, respectively, and the upper surface of the conveyor belt 71 is rotatably supported by the processing chamber 6 so as to be within the height range of the inlet 61 and the outlet 62. For example, the side faces facing each other in the direction of the 。. At least one of the pulley members 70a, 70b, for example, the rotation axis of the pulley member 7 is connected to a drive source 72 such as a motor, and by driving the drive source 72, the pulley member 7b can be driven to rotate. Further, the conveyor belt 71 is actuated, and at the same time, the pulley member 70a is also rotated, so that the LCD substrate G placed on the conveyor belt 71 can be conveyed in the X direction. Further, the driving source 72 is set to 21 - (18) 1311633 on the outer side of the side portion of the processing chamber 6 in the Y direction, and the rotating shaft and the side surface of the processing chamber 6 are separated by the sealing member 80. The gap is sealed to prevent rotation of the pulley member 70b. The conveyor belt 71 is formed of a urethane-based material or a Teflon (registered trademark) material in an endless shape, and has a width substantially equal to the width of the LCD substrate G in the Y direction. Thereby, when the LCD panel G is placed on the conveyance belt 71, it is formed so as to be in contact with the substantially entire width of the LCD substrate G in the Y direction. Further, the interval between the pulley members 70a and 70b is set to be larger than the length of the LCD substrate G in the X direction. Therefore, when the conveyor belt 71 is subjected to the vacuum drying treatment by the pressure reducing mechanism, the back surface of the LCD substrate G is substantially covered. It consists of a face-to-face approach. Each of the pulley members 70a and 70b has a large diameter portion 73 that protrudes outward in the radial direction at both end portions in the Y direction, and the conveyor belt 71 is disposed between the large diameter portions 73 and 73 of the pulley members 70a and 70b and positioned in the Y direction. . Therefore, the meandering of the conveyor belt 71 during the operation can be prevented. In the processing chamber 6, the pulley members 70a and 70b are provided with the substantially cylindrical guide roller members 74a and 74b on the side of the transfer inlet 61 and the outlet 62, respectively, and the guide roller members 74a' to 74b are attached to the upper end thereof. The side surface portion facing the Y-direction of the processing chamber 6 is rotatably supported at substantially the same height as the upper surface of the conveyor belt 71 or slightly above the upper surface of the conveyor belt 71. The guide roller member 74a is used to reliably guide the LCD substrate G on the carry-in side transport portion 7b, which will be described later, to the transport belt 71, and the guide roller member 74b is used to reliably guide the LCD substrate G on the transport belt 71. It is to the carry-out side conveyance part 7c mentioned later. -22-(19) 1311633 The gap ’ in the conveyor belt 71 is used to mount the entanglement member 65 for burying the gap, for example, so as not to be in contact with the conveyor belt 71, for example, on the side surface portion in the γ direction. Accordingly, the volume in the processing chamber 6 becomes small, and the inside of the processing chamber 6 can be quickly decompressed by the pressure reducing mechanism. When the LCD substrate G is large, or when the interval between the pulley members 7〇a, 70b is large, the ideal condition is between the pulley members 70a and 70b, and one or a plurality of extending in the Y direction are provided to prevent the conveyor belt. 71 bend # folding auxiliary roller member 75 to support the conveyor belt 71. In addition, when the tension of the conveyor belt 71 used for the pulley members 70a and 70b is large, as shown in Fig. 5 (the fifth diagram shows a main part of the inner conveying portion constituting the vacuum drying apparatus), The abutting members 8 1 ′ that are respectively in contact with the X-direction front side portion of the pulley member 70 a and the X-direction rear side portion of the pulley member 7 0 b are provided in advance to prevent deformation of the pulley members 70 a and 70 b. The abutting member 81 is provided with a roller mechanism in such a manner as not to hinder the rotation of the pulley members 70a to 70b, and is attached to the side surface portion of the processing chamber 6 in which the Y direction Φ faces. The loading-side conveying unit 7b and the unloading-side conveying unit 7c are provided outside the processing chamber 6 so as to face the side surface portion having the inlet 61 and the outlet 62, respectively, and have a substantially X direction. A plurality of, for example, two substantially cylindrical outer roller members 76a, 76b are provided horizontally at intervals. The outer roller members 76a and 76b are formed at substantially the same height as the upper end of the conveyor belt 71 and at substantially the same height as the back surface of the LCD substrate G conveyed by the slider 50 of the resist coating device 23a. -23-(20) 1311633 is rotatably supported by a support member (not shown). Here, either or both of the outer roller members 76a and 76b are connected to a drive source (not shown) such as a motor, and the drive source is rotated to form the LCD substrate G in the X direction. In this configuration, the liquid crystal substrate can be taken from the resist coating device 23a without requiring an actuator (actuator) or a transport mechanism such as a robot, as shown in the resist application device 2 3 a of the present embodiment. The so-called flat flow # which makes the LCD substrate G move substantially horizontally and linearly is particularly effective. Each of the outer roller members 716a, 7 6b has a small diameter rotating shaft and a plurality of large connecting portions 78' are provided at intervals of the rotating shaft 77 in the Y direction, and the abutting portion 78 is passed through the LCD substrate G. The LCD G contact 'is formed in such a manner as to support the LCD substrate G. Further, the outer roller member 76a and the outer roller member 76b are configured to be different in position in the Y direction, and the dispersible substrate G is in contact with the abutting portion 78 to cause a resist film. The effect is that the trace of the abutting portion 78 is transferred to the resist film. Further, similarly to the outer roller member 76a, the guiding rollers 7 4a and 74b have a small rotating shaft and a plurality of diameter abutting ports ′′ and a guiding roller member 7 4 a in the Y direction. The outer roller 76a and the outer roller 76a are configured to have different positions in the γ direction of the abutting member. The guide roller members 74a and 74b' the outer roller member 76a can also be formed in a shape that is connected across substantially the entire width of the Y side of the LCD substrate G as in the case of the roller member 75. The pulley member 70a of the processing chamber 6 and the guiding roller 74a are rotated. Borrow complex G. When placed in the 77' diameter, the adjacent portion of the substrate 78, the LCD can prevent the large diameter of the cylinder, and the auxiliary direction, -24- (21) 1311633, and between the pulley member 70b and the guiding roller 74b. The argon gas supply unit 82 is configured to extend the pressure in the Y direction, and the supply unit 82 is rapidly pressurized by supplying nitrogen gas to the processing chamber 6 for decompression, while suppressing the LCD: the film and the outside air. contact. Further, in the processing chamber 6, the side portion is formed so as to extend the exhaust pipe 83 such as dust adhering to the conveyor belt 7 1 through the inside of the conveyor belt 71, and the partial exhaust pipe 83 is attached. The exhaust device (not shown here, although the partial exhaust pipe is disposed at the position 83 of the conveyor belt 71), may be provided on the surface of the conveyor belt 71 as shown by the symbol 84 in Fig. 4). At this time, it is preferable that the particle pair is previously provided with an ionizer, 71 on the surface of the local exhaust pipe 84, and the partial exhaust pipe 84 is actuated when the conveyor belt is actuated, and the conveyor belt 71 is stopped. Control is better. The local exhaust pipes 83 (and 84) and the exhaust devices of the air pipes 83 (and 84) constitute a cleaning and cleaning mechanism. The processing steps of the resist coating unit 23 constructed as described above will be described. First, let the slider 50 be flat! The side of the block 3 2 is waiting for preparation, and the LCD substrate G can be floated to a predetermined height on the stage 12. The drum transport mechanism, which is placed in the heat treatment unit block 32, is carried into the platform 12 and delivered to the slider 50. Therefore, the LCD base 12 is kept floating in a substantially horizontal posture. The upper supply of nitrogen is set. In the case of the nitrogen gas 6, the S plate G is blocked in the L Y direction, and the partial discharge is provided in a manner of connection. The back side (the side of the symbol (refer to the example, the heat of the clear LCD substrate G 4 1 2 that is connected to the partial strip 7 1 so that the conveyor belt and the ionizer are stopped) is formed in each part, and the LCD substrate is used. The G plate G can be slid at -25 to 1311633, and the slider 50 is slid toward the decompression drying device 23b side at a predetermined speed. Therefore, the LCD substrate G is floated toward the decompression drying device 2 3 b. When it passes under the resist nozzle, the resist liquid is supplied from the resist nozzle 14 to the surface to form a resist film. The LCD substrate G on which the resist film is formed is transported through the slider 50 to The end portion of the stage 12 of the reduced-pressure drying device 23b is more specifically conveyed to the outer drum member 76a or 76b that is rotationally driven by the driving source of the loading-side conveying portion 7b. Here, the slider 50 is released. By the release of the slider 50, the LCD substrate G is placed on the outer roller member 76a or 76b of the carry-in side transport portion 7b. Here, the outer side of the carry-in side transport portion 7b is placed. The roller member 76a or 76b is rotationally driven, and the LCD substrate G can be coated from a resist. The conveyance belt 7 is delivered to the carry-in side conveyance unit 7b, and is carried in at least from the conveyance port 6 1 and conveyed to the conveyance belt 71 of the internal conveyance unit 7a. At this time, the belt member 70b is rotationally driven to move the conveyor belt 71 to reach The LCD substrate G on the transport belt 71 can be transported from the carry-in side transport portion 7b to the inner transport portion 7a, and can be transported to the transport belt 71 and housed in the processing chamber 6. The LCD substrate G is housed in the processing chamber 6. After being placed on the conveyor belt 71 substantially on the entire surface, the operation of the conveyor belt 71 is stopped, and then the gates 63 and 64 are plugged to close the inlet 61 and the outlet 62 to seal the inside of the processing chamber 6. The gas device 67 is actuated to decompress the inside of the processing chamber 6 to a predetermined crucible. Accordingly, the resist film formed on the surface of the LCD substrate G becomes dry. In the present embodiment, the conveyor belt 71 is subjected to a vacuum drying treatment. The LCD substrate G is uniformly supported in contact with the entire surface, and the LCD substrate G can be mounted without holding the LCD substrate G by using the movable type, the robot type, or the robot type. Delivering a pressure drying device from a resist coating device, and It is not necessary to lift the lift pin or the like as in the conventional vacuum drying device to support the LCD substrate G, so that the resist film does not leave a part of the transfer mark formed by the lifting pin or the like. The vacuum drying process has a function of uniformly or not partially supporting the substrate supporting member of the LCD substrate G. The exhaust device 67 is actuated for a predetermined time to dry the resist film and then stop the exhaust device 67. Nitrogen gas is supplied into the processing chamber 6 by the nitrogen gas supply unit 8 2, and the shutter members 63 and 64 are retracted to open the port 61 and the outlet 62 to pressurize the inside of the processing chamber 6. Then, the tape 71 is again moved, and the LCD substrate G is sent to the outer tube member 76a or 76b that is rotationally driven by the driving source of the carry-out side conveying unit 7c through at least the outlet 62. At this time, the outer roller member 76a of the carry-out side feed portion 7c is rotationally driven, and the LCD substrate G can be delivered to the side transport portion 7C from the inner transport portion 7a. Then, it is carried out from the outlet 62 to the outside of the completely exposed chamber 6, and is conveyed to the outer drum members 76a and 76b, and then delivered to the transfer unit of the heat treatment unit block 34. In the present embodiment, the transport 61 and the transfer port 62 are provided in the side wall portion of the processing chamber 6, and the LCD substrate is moved in a large flat shape by the transport mechanism 7 to carry out the carry-out from the carry-in 61 and the carry-out 6 2 . Therefore, the height of the carry-in port 61 and the carry-out port 62 can be made extremely small, and is slightly larger than the thickness of the substrate. In other words, the transfer can be reduced to the use of the transfer, and the support can be stopped until the transfer is carried out to the transfer side roll 76b to the transfer process. However, the inlet water supply and transfer setting inlet -27-(24) 1311633 6 1 and The outlet 6 2 forms a slit shape. Therefore, in terms of the function of the switch processing chamber, the shutter members 63 and 64 for switching the inlet 61 and the outlet 62 of the processing chamber 6 can be significantly lighter than the processing chamber in the conventional vacuum drying apparatus. . Further, the transport mechanism 7 transports the LCD substrate G to the transport belt or the drum in a substantially horizontal state. Therefore, the transport mechanism of the substrate is not required to be lifted and lowered as in the mounting table provided in the conventional vacuum drying apparatus. Therefore, even if the size of the substrate is increased, the safety of the device can be sufficiently ensured, and the vibration generated by the switching operation of the shutter members 63 and 64 and the conveying operation of the transport mechanism 7 can be suppressed. Further, the loading-side conveying unit 7b and the carrying-out conveying unit 7c may be constituted by a belt conveying mechanism having a pulley member and a conveying belt, similarly to the inner conveying unit 7a. Next, a vacuum drying apparatus according to another embodiment of the present invention will be described. Fig. 6 is a plan view showing a vacuum drying apparatus according to another embodiment of the present invention, and Fig. 7 is a front view thereof. The vacuum drying device 23c changes the inner conveying portion 7a of the vacuum drying device 2; 3b, and the same portions as those of the reduced-pressure drying device 23b are denoted by the same reference numerals to omit the description. The inner conveying portion 7d of the reduced-pressure drying device 213c has a substantially cylindrical inner roller member 79 provided in the X direction. The inner roller member 79 is rotatably supported, for example, at a side surface portion of the processing chamber 6 facing the Y direction, so that the upper end thereof has substantially the same height as the upper end of the carry-in side transport portion 7b and the carry-in side transport portion 7c. A part or all of the plurality of inner roller members 79 are connected to a driving source 72 of a motor or the like by a rotating shaft thereof, and the driving source 72 is driven to rotate -28-(25) 1311633, in such a manner that the LCD substrate G can be The inner roller member 791 is conveyed in the X direction. Here, a part or all of the inner roller member 7.9 is configured to be rotatable in a reversible manner by a drive source 7 such as an AC motor. Further, the 'inner roller member 197 is formed to be in contact with the substantially entire width of the LCD substrate G in the Y direction. However, the outer roller members 76a and 76b may be spaced apart from the LCD substrate G in the Y direction. The plural position contact is formed, and the adjacent inner roller φ members 79 may be configured to have different positional positions in the Y direction in contact with the LCD substrate G. On the lower side of the inner conveying portion 7d, a plate-like or disk-shaped base 618 for preventing a direct suction force from acting on the LCD substrate G due to the operation of the exhaust device 67 is attached to, for example, the Y direction of the processing chamber 6. Opposite side sections. The processing procedure of the LCD substrate G of the inner conveying portion 7d of the vacuum drying device 23c configured as described above will be described. First, the LCD substrate board G, which is delivered from the resist application device 23a and transported by the carry-in side transport unit 7b, reaches the inner roller member 79 connected to the drive source 72, and is internally driven by the drive source 72. When the roller member 79 is rotationally driven, the LCD substrate G can be transported from the carry-in side transport portion 7b to the inner transport portion 7d, transported to the plurality of inner roller members 79, and then completely carried into the processing chamber 6. Then, the rotation of the inner roller member 719 is stopped, and the carry-in port 61 and the carry-out port 6 2 are closed by the shutter members 63, 64 to seal the inside of the process chamber 6.
Q 繼之，令排氣裝置67作動’以將處理室6內減壓至 預定値，並使形成於LCD基板G表面的阻劑膜乾燥。此 -29- (26) 1311633 時，藉由驅動源7 2使複數內側滾筒構件7 9中的一部分或 全部正反轉交替地旋轉，LCD基板G即可一邊擺動’一 邊支持於複數的內側滾筒構件7 9。亦即’複數的內側滾 筒構件79在減壓乾燥處理時具有將LCD基板均勻地支持 ，而不是局部地支持之基板支持構件的功能。因此’可防 止在L C D基板G的阻劑膜，附著內側滾筒構件7 9所產生 的轉印痕。 φ 令排氣裝置67作動預定時間’使阻劑膜乾燥後’停 止排氣裝置67。接著，藉由氮氣供給部82將氮氣供給至 處理室6內，同時使閘構件6 3、6 4退開，將搬入口 61及 搬出口 62打開，將處理室6內昇壓。接著，藉由再次使 內側滾筒構件79旋轉，使LCD基板G至少通過搬出口 62，搬送到藉由搬出側搬送部7c的驅動源所旋轉驅動的 外側滾筒構件7 6 a或7 6 b上爲止。 •〔產業上利用之可能性〕 根據本發明，特別適用於基板爲大型的情況，但是， 並不限定於LCD基板，可廣泛適用於其他基板，例如塗 佈於LCD基板的彩色濾光片基板或半導體晶圓等的塗佈 液之減壓乾燥處理。 【圖式簡單說明】 第1圖係對LCD基板進行阻劑膜的形成、以及曝光 處理後之阻劑膜的顯影處理之阻劑塗佈•顯影處理系統的 -30- (27) 1311633 槪略平面圖。 第2圖係表示阻劑塗佈單元的平面圖。 第3圖係表示阻劑塗佈單元之構成要素之本發明之減 壓乾燥裝置的平面圖。 第4圖係表示減壓乾燥裝置的正面圖。 第5圖係表示構成減壓乾燥裝置之內側搬送部的主要 部位之圖。 φ 第6圖係表示本發明之其他實施型態之減壓乾燥裝置 的平面圖。 第7圖係表示其他實施型態之減壓乾燥裝置的正面圖 【主要元件符號說明】 6 :處理室 7 :搬送機構 0 7 a、7 d :內側搬送部 7b :搬入側搬送部 7c :搬出側搬送部 2 3 a :阻劑塗佈裝置 23b、23c:減壓乾燥裝置 61 :搬入口 62 :搬出口 63、64 :閘構件 66 : 排氣管 -31 - (28) 1311633 67 :排氣裝置 70a、70b :滑輪構件 7 1 :輸送帶（基板支持構件） 76a、76b :外側滾筒構件 79 :內側滾筒構件（基板支持構件） 83、84 :局部排氣管 G : L C D基板Q, the exhaust device 67 is actuated to decompress the inside of the processing chamber 6 to a predetermined crucible, and the resist film formed on the surface of the LCD substrate G is dried. In the case of -29-(26) 1311633, a part or all of the plurality of inner roller members 79 are alternately rotated in the forward and reverse directions by the driving source 72, and the LCD substrate G can be supported while being supported by the plurality of inner rollers. Member 7 9. That is, the plural inner roller members 79 have a function of uniformly supporting the LCD substrate instead of the partially supported substrate supporting member during the vacuum drying treatment. Therefore, the resist film formed on the L C D substrate G can be prevented from adhering to the transfer marks generated by the inner roller member 79. φ causes the exhaust unit 67 to operate for a predetermined time 'after drying the resist film', and stops the exhaust unit 67. Then, nitrogen gas is supplied into the processing chamber 6 by the nitrogen gas supply unit 82, and the gate members 633 and 64 are retracted, and the inlet 61 and the outlet 62 are opened to raise the pressure in the processing chamber 6. Then, by rotating the inner roller member 79 again, the LCD substrate G is transported to the outer roller member 7 6 a or 7 6 b that is rotationally driven by the drive source of the carry-out side transport portion 7c at least through the carry-out port 62. . [Effect of Industrial Use] According to the present invention, it is particularly suitable for a case where the substrate is large. However, the present invention is not limited to the LCD substrate, and can be widely applied to other substrates, such as a color filter substrate applied to an LCD substrate. Or a vacuum drying treatment of a coating liquid such as a semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a resist coating coating and development processing system for forming a resist film on an LCD substrate and developing a resist film after exposure processing -30-(27) 1311633 Floor plan. Fig. 2 is a plan view showing a resist coating unit. Fig. 3 is a plan view showing the pressure reducing and drying apparatus of the present invention which is a constituent of the resist coating unit. Fig. 4 is a front view showing the vacuum drying apparatus. Fig. 5 is a view showing a main part constituting the inner conveying portion of the vacuum drying apparatus. Fig. 6 is a plan view showing a vacuum drying apparatus according to another embodiment of the present invention. Fig. 7 is a front view showing a vacuum drying apparatus of another embodiment. [Explanation of main components and symbols] 6 : Processing chamber 7 : conveying mechanism 0 7 a, 7 d : inner conveying portion 7b : carrying-in conveying portion 7c : carrying out Side transfer unit 2 3 a : Resist application device 23b, 23c: Vacuum drying device 61: Carry-in port 62: Carry-out port 63, 64: Gate member 66: Exhaust pipe - 31 - (28) 1311633 67 : Exhaust Devices 70a, 70b: pulley member 7 1 : conveyor belt (substrate support member) 76a, 76b: outer roller member 79: inner roller member (substrate support member) 83, 84: local exhaust pipe G: LCD substrate
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