JP2005134013A - Device and method for manufacturing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for manufacturing a substrate capable of evenly heat-treating paste applied to the substrate and shortening a heat treating time. <P>SOLUTION: A conveying roller 11 for conveying the substrate P, a heater for irradiating the substrate P conveyed by the conveying roller 11, with far infrared ray an air supply port 13 blowing air in a heat-treating furnace 10, and exhaust ports 15A, 15B arranged in a plane approximately parallel to a conveying passage formed of the conveying roller 11 with the air supply port 13 positioned thereon are provided in the heat-treating furnace 10 for heat-treating the paste applied to the substrate P. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate manufacturing apparatus and method in which a structure is formed by applying a paste.

  Plasma display panel (PDP) substrate, fluorescent display tube (VFD) anode substrate, plasma addressed liquid crystal display (PALC) plasma switching substrate, field emission display (FED) substrate, electroluminescence (EL) substrate Substrates for display devices, such as thick film wiring boards, electronic devices for thermal printer heads and image sensors, etc., are coated with various pastes on a plate such as a glass plate or a ceramic plate in a required pattern. The layers are formed, and then the thick film paste is heat-treated to form various structures.

  FIG. 1 is a schematic configuration diagram showing a conventional manufacturing apparatus for such a substrate.

  The conventional manufacturing apparatus of FIG. 1 performs drying of a thick film paste formed on a substrate P by irradiating infrared rays in a drying furnace 1, and the drying furnace 1 includes three drying areas 1A. , 1B, 1C are provided along the conveyance path of the substrate P, heaters 1Aa, 1Ba, 1Ca are attached to the ceilings of the drying areas 1A, 1B, 1C, and dampers 1Ab, 1Bb, 1Cb are attached. The air supply duct 2 is connected via the filters 1Ac, 1Bc, 1Cc.

  The transport of the substrate P in the drying furnace 1 is performed by a so-called walking beam method using a fixed beam 3 and a walking beam 4 arranged on the floor surface of the drying furnace 1.

  That is, the substrate P is moved in the transport direction (from the right to the left in the figure) while being lifted by the transport pins 4A of the walking beam 4 at the ascending position, and the walking beam 4 is lowered, so that the walking beam 4 It is placed and supported on the fixed pin 3A of the fixed beam 3 from above the conveying pin 4A.

  In this way, the substrate P is sequentially moved through the three drying areas 1A, 1B, and 1C of the drying furnace 1, while being irradiated from the heaters 1Aa, 1Ba, and 1Ca, and the air supply duct 2, respectively. The thick film paste applied to the surface is dried by the air blown into the drying furnace 1 through the dampers 1Ab, 1Bb, 1Cb and the filters 1Ac, 1Bc, 1Cc and exhausted from below the drying furnace 1. (For example, refer to Patent Document 1).

  However, in the conventional substrate manufacturing apparatus having the above-described configuration, the drying air is blown from above toward the surface of the substrate P on which the thick film paste is applied, and then exhausted from below the drying furnace 1. Because of this configuration, air is directly applied to the thick film paste applied to the substrate P, thereby causing uneven drying due to air contact unevenness and promoting surface drying of the thick film paste. As a result, the solvent inside the paste is hardly released to the outside, and the drying time is rather long.

  Furthermore, since the conventional substrate manufacturing apparatus transports the substrate P in the drying furnace 1 by the walking beam method, the transport pin 3A of the fixed beam 3 and the transport pin 4A of the walking beam 4 are in contact with the substrate P. Therefore, there is a problem that a temperature difference is generated at the contact portion, and thus uneven drying occurs between the fixed beam 3 and the portion not in contact with the walking beam 4. ing.

  Furthermore, since the conventional substrate manufacturing apparatus is configured such that the surface of the substrate P to which the thick film paste is applied is directly irradiated with infrared rays from above, there is a slight variation in the irradiance of the infrared rays. Even if it occurs, there is a problem that uneven drying occurs.

  In order to prevent the occurrence of uneven drying due to the difference in infrared irradiance, it is necessary to dispose the planar heaters without any gaps and precisely control the drive of each heater. However, this causes a problem that the manufacturing cost increases.

JP 2003-185338 A

  One object of the present invention is to solve at least one of the problems of the conventional substrate manufacturing apparatus as described above.

  In order to achieve the above object, the substrate manufacturing apparatus according to the first invention (the invention described in claim 1) forms a required structure by heat-treating the paste applied on the substrate in a heat treatment furnace. A substrate manufacturing apparatus for manufacturing a substrate, a transport member for transporting the substrate in a heat treatment furnace, a heating member for irradiating far infrared rays to the substrate transported by the transport member, and the heat treatment furnace An air supply member for supplying air, and the air supply member is substantially parallel to an air supply port for blowing air into the heat treatment furnace and a conveyance path where the air supply port is located and formed by the conveyance member. It has the exhaust port arrange | positioned in a plane, It is characterized by the above-mentioned.

  Furthermore, the substrate manufacturing apparatus according to the second invention (the invention according to claim 12) has the required structure by heat-treating the paste applied on the substrate in a heat treatment furnace in order to achieve the object. A substrate manufacturing apparatus for manufacturing a formed substrate, a transport member for transporting the substrate in a heat treatment furnace, a heating member for irradiating far infrared rays to the substrate transported by the transport member, and the heat treatment furnace A plurality of roller members having an outer peripheral surface that is continuous in the width direction of the conveyance path formed by the conveyance member, and is arranged in parallel in the conveyance direction of the conveyance path. It is characterized by being configured.

  Furthermore, in the substrate manufacturing method according to the third invention (the invention described in claim 16), in order to achieve the above object, a required structure is obtained by heat-treating the paste applied on the substrate in a heat treatment furnace. A substrate manufacturing method for manufacturing a formed substrate, wherein in the heat treatment furnace, air is blown into a heat treatment furnace from an air supply port during a step of irradiating far infrared rays from a heating member onto the substrate. Is exhausted from an exhaust port disposed in a plane substantially parallel to the substrate and where the air supply port is located.

  Furthermore, in order to achieve the above object, the substrate manufacturing apparatus according to the fourth invention (the invention described in claim 29) heats the paste applied on the substrate in a heat treatment furnace to obtain a required structure. A substrate manufacturing method for manufacturing a formed substrate, wherein the substrate is transported by a plurality of roller members having an outer peripheral surface continuous in a width direction of a transport path and arranged in parallel in the transport direction in the heat treatment furnace. It is characterized by that.

  A substrate manufacturing apparatus according to the present invention irradiates a far-infrared ray on a transport roller that transports a substrate coated with a paste in a heat treatment furnace to form a required structure, and a substrate transported by the transport roller. Implementation comprising a heater, an air supply port for blowing air into the heat treatment furnace, and an exhaust port disposed in a plane substantially parallel to the transport path in which the air supply port is located and formed by the transport rollers The mode is the best mode for carrying out the invention.

  Then, by the substrate manufacturing apparatus according to this embodiment, in the process of irradiating far infrared rays from the heater to the substrate in the heat treatment furnace, air is blown out from the air supply port into the heat treatment furnace, and the air is blown to the substrate. A substrate manufacturing method is performed in which the air is exhausted from an exhaust port disposed in a plane that is substantially parallel and has an air supply port.

  According to the substrate manufacturing apparatus according to this embodiment, when heat treatment is performed by irradiating a far-infrared ray from the heater to the substrate on which the paste has been applied in the heat treatment furnace, the air supply port enters the heat treatment furnace. Air is blown out, and the air blown into the heat treatment furnace is discharged to the outside through the exhaust port.

  At this time, since the exhaust port is arranged in a plane substantially parallel to the substrate and the air supply port is positioned, an air flow substantially parallel to the substrate from the air supply port toward the exhaust port is provided. Is formed.

  As a result, the air blown out from the air supply port is not blown directly onto the paste applied to the substrate, and the air blown into the heat treatment furnace is blown directly onto the substrate as in the conventional case, thereby causing unevenness in heat treatment. It is possible to solve the problems such as generation and prolonged heat treatment time due to the surface drying of the paste, so that uniform heat treatment can be performed over the entire surface of the substrate and the heat treatment time can be shortened. It becomes like this.

  The present invention is not limited to the manufacture of front substrates and rear substrates in which a dielectric layer, a phosphor layer, and barrier ribs are formed on the surface of a plasma display panel using a thick film paste, as well as an anode substrate for a fluorescent display tube (VFD), Plasma addressed liquid crystal display (PALC) plasma switching substrates, field emission display (FED) substrates, electroluminescence (EL) substrates and other display device substrates, thick film wiring substrates, thermal printer heads and image sensors The present invention can be applied to the manufacture of various substrates such as electronic device substrates.

  FIG. 2 shows a first example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 2 is a schematic configuration diagram showing an arrangement configuration in the heat treatment furnace 10 of the substrate manufacturing apparatus at a position where the conveyance path extends in a direction perpendicular to the paper surface.

  In FIG. 2, the transport roller 11 is positioned above the floor (not shown) in the heat treatment furnace 10 in a direction in which the rotation shaft 11A is orthogonal to the transport direction of the substrate P (the left-right direction in FIG. 2). It is arranged so as to extend horizontally.

  A heater 12 that irradiates far-infrared rays on the ceiling of the heat treatment furnace 10 above the conveyance path formed by the conveyance roller 11 has a heater surface parallel to the substrate P conveyed on the conveyance roller 11. It is attached to become.

  An air supply port 13 is provided in a portion located in the center of the heater 12 in a direction orthogonal to the conveyance path formed by the conveyance roller 11, and an FFU (fan filter unit) 14 is provided in the air supply port 13. An air supply duct (not shown) is connected via the.

  Further, in a direction (width direction) orthogonal to the conveyance path formed by the conveyance roller 11, exhaust ports 15A connected to an exhaust pump (not shown) are provided at both side positions (left and right positions in FIG. 2) of the heater 12, respectively. 15B is provided.

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 10 on the transport path in the transport direction (perpendicular to the paper surface in FIG. 2) by driving the transport roller 11.

  The substrate P is supported on the transport roller 11 with the surface on which the thick film paste is applied facing upward, and the substrate 12 transported by the transport roller 11 is irradiated with far infrared rays from above by the heater 12. Is done.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 13 into the heat treatment furnace 10 via the FFU 14.

  Then, the air blown out from the air supply port 13 is sucked by exhaust pumps (not shown) from the exhaust ports 15A and 15B arranged on both sides of the heater 12 and exhausted to the outside. Left and right air flows along the heater surface of the heater 12 are formed in the direction of the exhaust ports 15A and 15B.

  Thus, in the heat treatment furnace 10, the air blown from the air supply port 13 flows in parallel with the heater surface of the heater 12, so that it is not directly blown onto the thick film paste applied to the substrate P. .

  At this time, the amount of air blown from the air supply port 13 is reduced to the minimum necessary, so that the air blown from the air supply port 13 directly contacts the thick film paste applied to the substrate P. Further, the amount of exhaust from the exhaust ports 15A and 15B is added to the amount of air blown from the air supply port 13, at least the amount of solvent discharged from the thick film paste by heat treatment of the substrate P. By setting the amount, the solvent can be surely discharged to shorten the heat treatment time of the substrate P, and the solvent discharged from the thick film paste can be prevented from adhering in the heat treatment furnace 10.

  As described above, according to the above-described substrate manufacturing apparatus, heat generation unevenness caused by direct blowing of air blown into the heat treatment furnace directly onto the thick film paste of the substrate P, or heat treatment time due to surface drying, as in the past. For example, even when a thick paste of several tens of μm or more is formed on the substrate P, the uniform heat treatment can be performed over the entire surface of the substrate P, and the heat treatment can be performed. Time can be shortened.

  FIG. 3 shows a second example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 3 is a schematic configuration diagram showing an arrangement configuration in the heat treatment furnace 20 of the substrate manufacturing apparatus at a position where the conveyance path extends in a direction perpendicular to the paper surface.

  In FIG. 3, the transport roller 11 is positioned above the floor (not shown) in the heat treatment furnace 20 in a direction in which the rotation shaft 11 </ b> A is orthogonal to the transport direction of the substrate P (the left-right direction in FIG. 3). It is arranged so as to extend horizontally.

  These configurations are the same as those of the first embodiment described above, and are denoted by the same reference numerals.

  A heater 22 that performs far-infrared irradiation on the ceiling of the heat treatment furnace 20 above the conveyance path formed by the conveyance roller 11 has a heater surface parallel to the substrate P that is conveyed on the conveyance roller 11. It is attached as follows.

  Then, in the direction perpendicular to the conveyance path formed by the conveyance roller 11, the blowing direction is set to one side portion of the heater 22 (in this example, the left side portion in FIG. 3) with the heater surface of the heater 22. An air supply port 23 directed in a parallel direction is provided, and an air supply duct is connected to the air supply port 23 via an FFU (not shown).

  Further, an exhaust port 25 connected to an exhaust pump (not shown) is provided in a side portion opposite to the heater 22 (in this example, the right side portion in FIG. 3).

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 20 in the transport direction (perpendicular to the paper surface in FIG. 3) on the transport path by driving the transport roller 11.

  The substrate P is supported on the transport roller 11 with the surface on which the thick film paste is applied facing upward, and far infrared rays are irradiated from above by the heater 22 on the substrate P transported by the transport roller 11. Is done.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 23 into the heat treatment furnace 20.

  The air blown out from the air supply port 23 is sucked from the exhaust port 25 by an exhaust pump (not shown) and exhausted to the outside, whereby the heater 22 of the heater 22 moves from the air supply port 23 toward the exhaust port 25. An air flow along the surface is formed.

  In this manner, air is blown into the heat treatment furnace 20 from the air supply port 23 in a direction parallel to the heater surface of the heater 22 and flows parallel to the heater surface of the heater 22, thereby being applied to the substrate P. It is not sprayed directly on the thick film paste.

  At this time, the amount of air blown out from the air supply port 23 is reduced to the minimum necessary, so that the air blown out from the air supply port 23 comes into direct contact with the thick film paste applied to the substrate P. Further, the amount of exhaust from the exhaust port 25 is prevented by adding the amount of air discharged from the air supply port 23 to at least the amount of solvent discharged from the thick film paste by the heat treatment of the substrate P. By doing so, the solvent can be surely discharged to shorten the heat treatment time of the substrate P, and the solvent discharged from the thick film paste is prevented from adhering in the heat treatment furnace 20.

  As described above, according to the above-described substrate manufacturing apparatus, heat generation unevenness caused by direct blowing of air blown into the heat treatment furnace directly onto the thick film paste of the substrate P, or heat treatment time due to surface drying, as in the past. For example, even when a thick paste of several tens of μm or more is formed on the substrate P, the uniform heat treatment can be performed over the entire surface of the substrate P, and the heat treatment can be performed. Time can be shortened.

  FIG. 4 shows a third example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 4 is a schematic configuration diagram showing the arrangement configuration in the heat treatment furnace 30 of the substrate manufacturing apparatus at a position where the conveyance path extends parallel to the paper surface.

  4, in a position above a floor surface (not shown) in the heat treatment furnace 30, a transport roller 31 has a rotation axis 31A in a direction perpendicular to the transport direction of the substrate P (relative to the paper surface of FIG. 4). (Vertical direction) and extend horizontally.

  A heater 32 that irradiates far-infrared rays on the ceiling of the heat treatment furnace 30 above the conveyance path formed by the conveyance roller 31 has a heater surface parallel to the substrate P conveyed on the conveyance roller 31. It is attached as follows.

  Then, in the transport direction of the transport path formed by the transport rollers 31, the blowing direction is directed to a position downstream of the heater 32 (in this example, the left side in FIG. 4) in a direction parallel to the heater surface of the heater 32. An air supply port 33 is provided, and an air supply duct is connected to the air supply port 33 via an FFU (not shown).

  Further, an exhaust port 35 connected to an exhaust pump (not shown) is provided on the upstream side of the heater 32 (in this example, the right side in FIG. 4).

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 30 on the transport path in the transport direction (right to left in FIG. 3) by driving the transport roller 31.

  The substrate P is supported on the transport roller 31 with the surface on which the thick film paste is applied facing upward, and irradiation of far infrared rays is performed by the heater 32 on the substrate P transported by the transport roller 31 from above. Is done.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 33 into the heat treatment furnace 30.

  The air blown out from the air supply port 33 is sucked from the exhaust port 35 by an exhaust pump (not shown) and exhausted to the outside, whereby the heater 32 of the heater 32 moves from the air supply port 33 toward the exhaust port 35. An air flow that flows from the downstream side to the upstream side of the conveyance path along the surface is formed.

  Thus, air is applied to the substrate P by being blown into the heat treatment furnace 30 from the air supply port 33 in a direction parallel to the heater surface of the heater 32 and flowing parallel to the heater surface of the heater 32. It is not sprayed directly on the thick film paste.

  At this time, the amount of air blown from the air supply port 33 is reduced to the minimum necessary, so that the air blown from the air supply port 33 directly contacts the thick film paste applied to the substrate P. Further, the amount of exhaust from the exhaust port 35 is prevented by adding the amount of air discharged from the air supply port 33 to at least the amount of solvent discharged from the thick film paste by the heat treatment of the substrate P. By doing so, the solvent can be surely discharged to shorten the heat treatment time of the substrate P, and the solvent discharged from the thick film paste is prevented from adhering to the heat treatment furnace 30.

  As described above, according to the above-described substrate manufacturing apparatus, heat generation unevenness caused by direct blowing of air blown into the heat treatment furnace directly onto the thick film paste of the substrate P, or heat treatment time due to surface drying, as in the past. For example, even when a thick paste of several tens of μm or more is formed on the substrate P, the uniform heat treatment can be performed over the entire surface of the substrate P, and the heat treatment can be performed. Time can be shortened.

  5 and 6 show a fourth example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 5 is a schematic configuration diagram showing the arrangement configuration in the heat treatment furnace 40 of the substrate manufacturing apparatus at a position where the conveyance path extends in a direction perpendicular to the paper surface, and FIG. 6 shows the conveyance in the heat treatment furnace 40. It is a top view which shows arrangement | positioning of the conveyance roller which forms a path | route.

  5 and 6, the transport roller 41 is positioned above the floor (not shown) in the heat treatment furnace 40 in a direction in which the rotation shaft 41A is orthogonal to the transport direction of the substrate P (FIGS. 5 and 6). In the horizontal direction).

  The transport roller 41 is formed into a shaft shape whose roller surface is continuous over the width direction of the transport path (a direction orthogonal to the transport direction of the substrate P), and the width direction with respect to the substrate P It touches over the whole area.

  A heater 12 that irradiates far infrared rays on the ceiling portion of the heat treatment furnace 40 above the conveyance path formed by the conveyance roller 41 has a heater surface parallel to the substrate P conveyed on the conveyance roller 41. It is attached to become.

  An air supply port 13 is provided in a portion located in the center of the heater 12 in a direction orthogonal to the conveyance path formed by the conveyance roller 41, and an air supply duct (not shown) is connected to the air supply port 13 via the FFU 14. Is connected.

  Further, exhaust ports 15A and 15B connected to exhaust pumps (not shown) are provided at positions on both sides of the heater 12 (left and right positions in FIG. 5) in a direction orthogonal to the transport path formed by the transport rollers 41, respectively. ing.

  The configurations of the heater 12, the heater 12, the air supply port 13, the FFU 14, and the exhaust ports 15A and 15B are the same as those in the first embodiment described above, and are denoted by the same reference numerals.

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 40 on the transport path in the transport direction (the direction perpendicular to the paper surface in FIG. 5 and the upward direction in FIG. 6) by driving the transport roller 41.

  The substrate P is supported on the transport roller 41 with the surface on which the thick film paste is applied facing upward, and the substrate 12 transported by the transport roller 41 is irradiated with far infrared rays from above by the heater 12. Is done.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 13 into the heat treatment furnace 40 via the FFU 14.

  Then, the air blown out from the air supply port 13 is sucked by exhaust pumps (not shown) from the exhaust ports 15A and 15B arranged on both sides of the heater 12 and exhausted to the outside. Left and right air flows along the heater surface of the heater 12 are formed in the direction of the exhaust ports 15A and 15B.

  Thus, in the heat treatment furnace 40, the air blown from the air supply port 13 flows in parallel with the heater surface of the heater 12, so that it is not directly blown onto the thick film paste applied to the substrate P. .

  When such a heat treatment is performed, the roller surface of the transport roller 41 is in contact with the substrate P in the entire width direction (direction orthogonal to the transport direction of the substrate P). Further, the movement of the substrate P in the transport direction accompanying the rotation of the transport roller 41 causes the roller surface of the transport roller 41 to be in uniform contact with the entire surface of the substrate P.

  As described above, according to the above-described substrate manufacturing apparatus, heat treatment unevenness due to the air blown into the heat treatment furnace being directly blown onto the thick film paste of the substrate P, and heat treatment time extension due to surface drying, etc. When the substrate P is transported in the heat treatment furnace 40 as compared with the case where the substrate P is transported by the conventional walking beam method, the roller surface of the transport transport roller 41 is eliminated. Is uniformly brought into contact with the entire surface of the substrate P, thereby preventing a local temperature difference from being generated in the substrate P during the heat treatment in the heat treatment furnace 40, whereby, for example, several tens of μm or more are applied to the substrate P. Even when the thick film paste is formed, uniform heat treatment can be performed over the entire surface of the substrate P.

  In the above description, an example in which the substrate manufacturing apparatus has the same heater, air supply port, and exhaust port configuration as in the first embodiment has been described. The same configuration as in the second or third embodiment may be used.

  7 and 8 show a fifth example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 7 is a schematic configuration diagram showing the arrangement configuration in the heat treatment furnace 50 of the substrate manufacturing apparatus at a position where the conveyance path extends in a direction perpendicular to the paper surface, and FIG. 8 shows the conveyance in the heat treatment furnace 50. It is the top view which looked at the path from the upper part.

  7 and 8, the transport roller 51 is positioned above the floor (not shown) in the heat treatment furnace 50 in a direction in which the rotation shaft 51A is orthogonal to the transport direction of the substrate P (FIGS. 7 and 8). In the horizontal direction) and at equal intervals in the transport direction.

  At a height position between the mounting position of the transport roller 51 and the floor surface of the heat treatment furnace 50, a plurality of positions are provided facing each portion between the transport rollers 51 arranged at equal intervals in the transport direction. The planar heaters 52 are horizontally arranged in a direction (left and right direction in FIGS. 7 and 8) orthogonal to the transport direction of the substrate P with the heater surface facing upward.

  In the ceiling portion of the heat treatment furnace 50 above the conveyance path formed by the conveyance roller 51, an air supply port 53 is provided at a position facing the central portion of the conveyance path in a direction orthogonal to the conveyance path formed by the conveyance roller 51. An air supply duct (not shown) is connected to the air supply port 53 via the FFU 54.

  Further, exhaust ports 55A and 55B connected to exhaust pumps (not shown) are provided at positions facing both side positions (left and right positions in FIG. 7) of the conveyance path formed by the conveyance rollers 51, respectively.

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 50 in the transport direction (the direction perpendicular to the paper surface in FIG. 7 and the upward direction in FIG. 8) on the transport path by driving the transport roller 51.

  The substrate P is supported on the transport roller 51 with the surface on which the thick film paste is applied facing upward, and the substrate 52 transported by the transport roller 51 is irradiated with far infrared rays from below by the heater 52. Is done.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 53 into the heat treatment furnace 50 through the FFU 54.

  The air blown out from the air supply port 53 is sucked by exhaust pumps (not shown) from the exhaust ports 55A and 55B arranged on both sides of the heater 52 and exhausted to the outside. Left and right air flows parallel to the transport surface of the transport path are formed in the direction of the respective exhaust ports 55A and 55B.

  Thus, in the heat treatment furnace 50, the air blown out from the air supply port 53 flows in parallel with the transport surface of the transport path, so that the thick film paste applied to the substrate P transported on the transport path is formed. It is not sprayed directly.

  As described above, according to the above-described substrate manufacturing apparatus, heat treatment unevenness due to the air blown into the heat treatment furnace being directly blown onto the thick film paste of the substrate P, and heat treatment time extension due to surface drying, etc. In addition to the above problem, the heater 52 disposed on the lower side of the transport roller 51 is further from the lower side than the substrate P transported on the transport path with the surface on which the thick film paste is applied facing upward. Since the infrared irradiation is performed, the far-infrared radiation is indirectly irradiated to the thick film paste, so that even if the irradiation with the far-infrared radiation by the heater 52 is uneven, the uneven irradiation is reduced. Thus, the occurrence of unevenness in heat treatment as in the conventional case where far-infrared rays are directly irradiated onto the thick film paste is suppressed.

  As a result, even when, for example, a thick film paste of several tens of μm or more is formed on the substrate P, a uniform heat treatment can be performed over the entire surface of the substrate P.

  Furthermore, when directly irradiating far-infrared rays to the thick film paste of the substrate P, for example, in order to prevent the occurrence of unevenness in heat treatment, for example, a planar heater is arranged without gaps so that each heater is highly accurate. It is necessary to take measures such as controlling or widening the distance between the heater and the substrate P. However, according to the above-described substrate manufacturing apparatus, the planar heater can be arranged without a gap, or the distance between the heater and the substrate P can be increased. Measures such as widening are not necessary, and energy can be saved by reducing the number of heaters and the number of control points for controlling these heaters.

  In the above description, the example in which the air supply port and the exhaust port of the substrate manufacturing apparatus are arranged in the same manner as in the first embodiment has been described. The same arrangement as in the third embodiment may be used.

  9 and 10 show a sixth example of the embodiment of the substrate manufacturing apparatus according to the present invention.

  FIG. 9 is a schematic configuration diagram showing the arrangement configuration in the heat treatment furnace 60 of the substrate manufacturing apparatus at a position where the conveyance path extends in a direction perpendicular to the paper surface, and FIG. 10 shows the conveyance in the heat treatment furnace 60. It is the top view which looked at the path from the upper part.

  9 and 10, the transport roller 51 is positioned above the floor (not shown) in the heat treatment furnace 60 in a direction in which the rotation shaft 51 </ b> A is orthogonal to the transport direction of the substrate P (FIGS. 9 and 10). In the horizontal direction) and at equal intervals in the transport direction.

  At the height position between the mounting position of the transport roller 51 and the floor surface of the heat treatment furnace 60, the horizontal direction is set at a position facing each portion between the transport rollers 51 arranged at equal intervals in the transport direction. A plurality of pipe-shaped ceramic heaters 62 extending in the same direction are arranged at equal intervals in a direction orthogonal to the transport direction of the substrate P (the left-right direction in FIGS. 9 and 10).

  In the ceiling portion of the heat treatment furnace 60 above the conveyance path formed by the conveyance roller 51, an air supply port is provided at a position facing the central portion of the conveyance path in a direction orthogonal to the conveyance path formed by the conveyance roller 51. 53 is provided, and an air supply duct (not shown) is connected to the air supply port 53 via the FFU 54.

  Further, exhaust ports 55 </ b> A and 55 </ b> B connected to exhaust pumps (not shown) are provided at positions facing both side positions (left and right positions in FIG. 9) of the conveyance path formed by the conveyance rollers 51.

  The substrate manufacturing apparatus transports the substrate P carried into the heat treatment furnace 60 in the transport direction (the direction perpendicular to the paper surface in FIG. 9 and the upward direction in FIG. 10) on the transport path by driving the transport roller 51.

  The substrate P is supported on the transport roller 51 with the surface on which the thick film paste is applied facing upward. From the lower side of the substrate P transported by the transport roller 51, a far infrared ray is applied by the ceramic heater 62. Irradiation is performed.

  At the same time, air supplied from an air supply duct (not shown) is blown out from the air supply port 53 into the heat treatment furnace 60 through the FFU 54.

  The air blown out from the air supply port 53 is sucked from the exhaust ports 55A and 55B by an unillustrated exhaust pump and exhausted to the outside. As a result, the air supply ports 53 are connected to the respective exhaust ports 55A and 55B. In the direction, left and right air flows parallel to the transport surface of the transport path are formed.

  Thus, in the heat treatment furnace 60, the air blown out from the air supply port 53 flows in parallel with the transport surface of the transport path, whereby the thick film paste applied to the substrate P transported on the transport path. It is not sprayed directly.

  As described above, according to the above-described substrate manufacturing apparatus, problems such as the occurrence of heat treatment unevenness due to the air blown into the heat treatment furnace being directly blown onto the thick film paste of the substrate P, and the extension of the heat treatment time due to surface drying, etc. And the far infrared ray from below by the ceramic heater 62 disposed below the transport roller 51 with respect to the substrate P transported on the transport path with the surface coated with the thick film paste facing upward. Therefore, even if far-infrared irradiation by the ceramic heater 62 is uneven, the irradiation unevenness is reduced. Occurrence of unevenness of heat treatment as in the case where far-infrared rays are directly applied to the thick film paste as in the past is suppressed.

  As a result, even when, for example, a thick film paste of several tens of μm or more is formed on the substrate P, a uniform heat treatment can be performed over the entire surface of the substrate P.

  Furthermore, when directly irradiating far-infrared rays to the thick film paste of the substrate P, in order to prevent the occurrence of unevenness in heat treatment, for example, a planar heater is arranged without gaps so that each heater is highly accurate. However, according to the substrate manufacturing apparatus, the planar heater is arranged without a gap, or the distance between the heater and the substrate P is increased. Therefore, energy saving can be achieved by using pipe-shaped heaters and reducing the number of control points for controlling these heaters.

  In the above description, the example in which the air supply port and the exhaust port of the substrate manufacturing apparatus are arranged in the same manner as in the first embodiment has been described. The same arrangement as in the third embodiment may be used.

It is a schematic block diagram which shows a prior art example. 1 is a front view showing a first embodiment of the present invention. It is a front view which shows 2nd Example of this invention. It is a side view which shows 3rd Example of this invention. It is a front view which shows 4th Example of this invention. It is a top view which shows the structure of the conveyance roller of the example. It is a front view which shows 5th Example of this invention. It is a top view which shows arrangement | positioning of the conveyance roller and heater of the example. It is a front view which shows 6th Example of this invention. It is a top view which shows arrangement | positioning of the conveyance roller and heater of the example.

Explanation of symbols

10, 20, 30, 40, 50, 60 ... heat treatment furnace 11, 31, 41, 51 ... conveying roller (conveying member)
11A, 31A, 41A, 51A ... rotating shaft 12, 22, 32, 52 ... heater (heating member)
62… Ceramic heater (heating member)
13, 23, 33, 53 ... Air supply port 15A, 15B, 25, 35, 55A, 55B
… Exhaust port P… Substrate

Claims (32)

A substrate manufacturing apparatus for manufacturing a substrate on which a required structure is formed by heat-treating a paste applied on the substrate in a heat treatment furnace,
A transport member that transports the substrate in a heat treatment furnace, a heating member that irradiates far infrared rays to the substrate transported by the transport member, and an air supply member that supplies air into the heat treatment furnace,
The air supply member has an air supply port for blowing air into the heat treatment furnace, and an exhaust port disposed in a plane substantially parallel to the conveyance path where the air supply port is located and formed by the conveyance member. The board | substrate manufacturing apparatus characterized by the above-mentioned.   The air supply port of the air supply member is disposed at a position facing the center portion in the width direction of the transport path formed by the transport member, and the exhaust port is positioned at a position facing both side portions in the width direction of the transport path. The board | substrate manufacturing apparatus of Claim 1 arrange | positioned.   The air supply port of the air supply member is disposed at a position facing one side portion in the width direction of the transport path formed by the transport member, and the exhaust port is disposed at a position facing the other side portion. The substrate manufacturing apparatus according to claim 1.   The air supply port of the air supply member is disposed at a position facing one of the downstream side and upstream side portions of the transport path formed by the transport member, and the exhaust port faces the other side portion. The board | substrate manufacturing apparatus of Claim 1 arrange | positioned in the position which carries out.   The air supply port of the air supply member is disposed at a position facing a downstream portion of the transport path formed by the transport member, and the exhaust port is disposed at a position facing an upstream portion of the transport path. Item 5. The substrate manufacturing apparatus according to Item 4.   The said conveyance member is comprised by arranging the several roller member which has an outer peripheral surface which continues in the width direction of the conveyance path formed with this conveyance member in parallel in the conveyance direction of a conveyance path. Board manufacturing equipment.   The board | substrate manufacturing apparatus of Claim 1 with which the said heating member is arrange | positioned with respect to the conveyance member at the opposite side to the side by which the surface where the paste of the board | substrate conveyed by this conveyance member is apply | coated is located.   The board | substrate manufacturing apparatus of Claim 7 with which the said heating member is arrange | positioned in the downward position of the conveyance member.   The transport member is constituted by a plurality of roller members having a rotation axis extending in a direction perpendicular to the substrate transport direction and arranged in parallel in the transport direction, and the heating member is disposed between the roller members. The board | substrate manufacturing apparatus of Claim 7 respectively arrange | positioned in the position which opposes.   The substrate manufacturing apparatus according to claim 9, wherein the heating member includes a plurality of heaters each having a planar heater surface and arranged along the axial direction of the roller member.   The substrate manufacturing apparatus according to claim 9, wherein the heating member includes a plurality of pipe-shaped heaters each having an axial direction arranged in parallel with the axial direction of the roller member. A substrate manufacturing apparatus for manufacturing a substrate on which a required structure is formed by heat-treating a paste applied on the substrate in a heat treatment furnace,
A transport member that transports the substrate in a heat treatment furnace, a heating member that irradiates far infrared rays to the substrate transported by the transport member, and an air supply member that supplies air into the heat treatment furnace,
The conveyance member is configured by a plurality of roller members having outer peripheral surfaces continuous in the width direction of a conveyance path formed by the conveyance member arranged in parallel in the conveyance direction of the conveyance path. Board manufacturing equipment.   The board | substrate manufacturing apparatus of Claim 12 with which the said heating member is arrange | positioned in the downward position of the conveyance member.   The transport member is constituted by a plurality of roller members having a rotation axis extending in a direction perpendicular to the substrate transport direction and arranged in parallel in the transport direction, and the heating member is disposed between the roller members. The board | substrate manufacturing apparatus of Claim 12 each arrange | positioned in the position which opposes.   The substrate manufacturing apparatus according to claim 12, wherein the heating member includes a plurality of pipe-shaped heaters each having an axial direction arranged in parallel with the axial direction of the roller member. A substrate manufacturing method for manufacturing a substrate on which a required structure is formed by heat-treating a paste applied on the substrate in a heat treatment furnace,
In the heat treatment furnace, during the step of irradiating the substrate with far infrared rays from the heating member, air is blown out from the air supply port into the heat treatment furnace, and the air is substantially parallel to the substrate and the air supply port is positioned. A substrate manufacturing method comprising exhausting air from an exhaust port disposed in a plane.   The air is blown out from an air supply port arranged at a position facing the substantially central portion of the substrate, and air exhausted from the air supply port is opposed to the side portions on both sides in the width direction of the substrate. The board | substrate manufacturing method of Claim 16 performed from the exhaust port each arrange | positioned in the position to perform.   The air is blown out from an air supply port arranged at a position facing one side portion in the width direction of the substrate, and the air discharged from the air supply port is opposed to the other side portion. The board | substrate manufacturing method of Claim 16 performed from the exhaust port arrange | positioned in the position which carries out.   The air is blown out from an air supply port arranged at a position facing one of the downstream side and the upstream side of the transfer path for transferring the substrate in the heat treatment furnace, and blown out from the supply port. The substrate manufacturing method according to claim 16, wherein the air is exhausted from an exhaust port disposed at a position facing the other side portion.   The air is blown out from an air supply port disposed at a position facing a downstream portion of the transfer path for transferring the substrate in the heat treatment furnace, and the air discharged from the supply port is exhausted. The substrate manufacturing method according to claim 19, wherein the method is performed from an exhaust port disposed at a position facing the upstream portion.   The substrate manufacturing method according to claim 16, wherein in the heat treatment furnace, the substrate is transported by a plurality of roller members having an outer peripheral surface continuous in the width direction of the transport path and arranged in parallel in the transport direction.   The board | substrate manufacturing method of Claim 16 which irradiates a far-infrared ray with respect to the said board | substrate from the heating member arrange | positioned on the opposite side to the side by which the surface where the paste of this board | substrate is apply | coated is located.   The board | substrate manufacturing method of Claim 22 which irradiates a far infrared ray with respect to the said board | substrate from the heating member arrange | positioned under the conveyance member which conveys a board | substrate.   The transport member for transporting the substrate in the heat treatment furnace is constituted by a plurality of roller members having a rotation axis extending in a direction perpendicular to the transport direction of the substrate and arranged in parallel at intervals in the transport direction. The substrate manufacturing method according to claim 22, wherein far-infrared rays are irradiated from heating members respectively arranged at positions facing portions between the roller members constituting the conveying member.   25. Substrate manufacture according to claim 24, wherein the substrate is irradiated with far infrared rays from a heating member comprising a plurality of heaters each having a planar heater surface and arranged along the axial direction of the roller member. Method.   25. The substrate manufacturing method according to claim 24, wherein far-infrared radiation is applied to the substrate from a heating member configured by a plurality of pipe-shaped heaters each having an axial direction arranged parallel to the axial direction of the roller member.   The substrate manufacturing method according to claim 16, wherein an exhaust amount from the exhaust port is set to a value larger by a required amount than an air amount blown into the heat treatment furnace from the intake port.   28. The substrate manufacturing method according to claim 27, wherein the required amount is substantially the same as the amount of the solvent discharged from the paste applied to the substrate by heating. A substrate manufacturing method for manufacturing a substrate on which a required structure is formed by heat-treating a paste applied on the substrate in a heat treatment furnace,
In the said heat processing furnace, a board | substrate is conveyed by the several roller member which has the outer peripheral surface continuous in the width direction of a conveyance path, and was arranged in parallel by the conveyance direction.   30. The substrate manufacturing method according to claim 29, wherein far-infrared radiation is applied to the substrate from a heating member disposed below a transport member that transports the substrate.   The transport member for transporting the substrate in the heat treatment furnace is constituted by a plurality of roller members having a rotation axis extending in a direction perpendicular to the transport direction of the substrate and arranged in parallel at intervals in the transport direction. 30. The substrate manufacturing method according to claim 29, wherein far-infrared rays are irradiated from heating members respectively disposed at positions facing portions between the roller members constituting the conveying member.   30. The substrate manufacturing method according to claim 29, wherein the substrate is irradiated with far-infrared rays from a heating member constituted by a plurality of pipe-shaped heaters each having an axial direction arranged parallel to the axial direction of the roller member.

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