200914145 九、發明說明 【發明所屬之技術領域] 本發明是關於塗佈裝置。本案是根據於2007年7月6 日在日本所申請的日本特願2007-178360號案來主張優先 權，在此引用其內容。 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上，形成 有配線圖案或電極圖案等的細微圖案。一般來說這種圖案 ’是用例如光微影技術等的方法所形成。在光微影技術中 ’分別進行：在玻璃基板上形成光阻膜的步驟、將該光阻 膜進行圖案曝光的步驟、及之後將該光阻膜予以顯像的步 驟。 已知的作爲在基板上塗佈光阻膜的塗佈裝置，是例如 將狹縫噴嘴固定，對於移動於該狹縫噴嘴下的每一枚玻璃 基板塗佈光阻劑。爲了不會因爲基板而讓光阻膜的厚度產 生誤差，而需要調整狹縫噴嘴。例如在專利文獻1所記載 的方法，是藉由狹縫噴嘴來進行模擬噴散（預備吐出動作） ’來將從狹縫噴嘴所吐出的光阻劑的吐出量調整爲定量。 藉由該方法，將光阻劑預備性地吐出到，具有圓筒型的模 擬噴散面的底塗輥子的上端，並且使底塗輥子旋轉而使被 吐出區域移動。而在底塗輥子的下端配置有用來將光阻劑 溶解的溶劑，一邊進行模擬噴散一邊洗淨模擬噴散面。 200914145 [專利文獻1] 日本特開2005-236092號公報 【發明內容】 [發明欲解決的課題] 可是在專利文獻1所記載的方法，在模擬噴散面的構 造上’需要大量的用來洗淨該模擬噴散面的溶劑。 鑑於以上的情形，本發明的目的是要提供一種塗佈裝 置’可將用來洗淨預備吐出面的洗淨液的使用量予以控制 [用以解決課題的手段] 爲了達成上述目的，本發明的塗佈裝置，具有：使基 板浮起來進行搬運的基板搬運部、對於藉由上述基板搬運 部所搬運中的上述基板來塗佈液狀體的塗佈部、以及具有 :當上述塗佈部的預備吐出動作時從上述塗佈部塗佈上述 液狀體的大致平面的預備吐出面，的預備吐出部。 藉由本發明，具有：使基板浮起來進行搬運的基板搬 運部、對於藉由基板搬運部所搬運中的基板來塗佈液狀體 的塗佈部、以及具有，當塗佈部的預備吐出動作時從塗佈 部塗佈液狀體的大致平面的預備吐出面的預備吐出部；並 沒有大量配置洗淨液，就可以進行預備吐出。 上述塗佈裝置，在上述預備吐出部的附近，設置有： 用來將上述塗佈部所具備的噴嘴予以洗淨的噴嘴洗淨機構 -5- 200914145 、及用來防止上述噴嘴乾燥的乾燥防止機構的至少其中一 方。 在本發明，當在預備吐出部的附近設置有：用來將塗 佈部所具備的噴嘴予以洗淨的噴嘴洗淨機構、及用來防止 噴嘴乾燥的乾燥防止機構的至少其中一方時，則當進行預 備吐出時可以保持噴嘴的吐出狀態。 上述塗佈裝置，具有管理部，該管理部是聯合設有·· 上述預備吐出部、上述噴嘴洗淨機構、與上述乾燥防止機 構。 在本發明，將具有管理部，該管理部是聯合設有：預 備吐出部、噴嘴洗淨機構、與乾燥防止機構時，則可整合 進行：預備吐出動作、噴嘴洗淨動作、乾燥防止動作。藉 此，能有效率地保持噴嘴的吐出狀態。 上述塗佈裝置，上述預備吐出部具有板狀構件，將該 板狀構件的其中一面用作爲上述預備吐出面。 在本發明，當預備吐出部具有板狀構件，將該板狀構 件的其中一面用作爲預備吐出面時，則可不移動被吐出區 域而進行預備吐出動作。藉此，則不需要大型的移動機構 ，而能將預備吐出部小型化。 上述塗佈裝置，是將上述預備吐出面，配置在：從俯 視方向觀察與上述基板搬運部重疊的位置。 在本發明’當將預備吐出面，配置在··從俯視方向觀 察與基板搬運部重疊的位置時，則可將塗佈裝置全體的外 型尺寸縮小。 -6- 200914145 在上述塗佈裝置，上述預備吐出面，也可配置於上述 基板搬運部的側方。 在本發明，當預備吐出面，配置於基板搬運部的側方 時，與將預備吐出面，配置在從俯視方向觀察與基板搬運 部重疊的位置的方式相比，更容易進行維修。而例如可以 讓預備吐出面的高度位置與基板的高度位置大致相等。藉 此，則可在更接近實際吐出動作的環境的狀態來進行預備 吐出動作。 在上述塗佈裝置，上述預備吐出面，也可配置於上述 基板搬運部的基板搬運方向側方。 在本發明，當預備吐出面配置於基板搬運部的基板搬 運方向側方時，塗佈部更容易接達。 上述塗佈裝置，具有：使上述塗佈部與上述預備吐出 面能夠相對移動的移動機構。 在本發明，當具有可讓塗佈部與預備吐出部相對移動 的移動機構時，則能容易使塗佈部在其與預備吐出面之間 移動。 上述塗佈裝置，在上述預備吐出部，設置有：用來洗 淨上述預備吐出面的預備吐出面洗淨機構。 在本發明，當在預備吐出部，設置有：用來洗淨預備 吐出面的預備吐出面洗淨機構時。則例如進行過預備吐出 之後，就可以洗淨預備吐出面。藉此，則可在該預備吐出 面反覆進行預備吐出動作。 上述塗佈裝置，上述預備吐出面洗淨機構，具有：用 200914145 來將洗淨液供給到上述預備吐出面的洗淨液供給部、以及 將上述洗淨液與上述預備吐出面的上述液狀體一同予以刮 除的刮除部。 在本發明，如果預備吐出面洗淨機構，具有：用來將 洗淨液供給到預備吐出面的洗淨液供給部、以及將洗淨液 與預備吐出面的液狀體一同予以刮除的刮除部的話，則能 盡量減少洗淨液的使用量，且能有效率地洗淨預備吐出面 【實施方式】 以下根據圖面來說明本發明的實施方式。 第1圖是本實施方式的塗佈裝置i的立體圖。 參考該圖面，來說明本發明的塗佈裝置1的主要構造 〇 如第1圖所示’本實施方式的塗佈裝置1，是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置，是 以：基板搬運邰2、塗佈部3、管理部4，爲主要構成元件 。該塗佈裝置1，是藉由基板搬運部2使基板浮起來進行 搬運，且藉由塗佈部3將光阻劑塗佈於該基板上，藉由管 理部4來管理塗佈部3的狀態。 第2圖是塗佈裝置1的正視圖，第3圖是塗佈裝置1 的俯視圖，第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。 200914145 (基板搬運部） 首先來說明基板搬運部2的構造。 基板搬運部2具有：基板搬入區域20、塗佈處理區域 21、基板搬出區域22、搬運機構23、以及支承這些構造 的框架部24。在該基板搬運部2，是藉由搬運機構23將 基板S依序搬運到基板搬入區域20、塗佈處理區域21、 及基板搬出區域22。基板搬入區域20、塗佈處理區域21 、及基板搬出區域22，是以該順序從基板搬運方向的上游 側排列到下游側。搬運機構2 3，爲了要涵蓋基板搬入區域 20、塗佈處理區域2 1、及基板搬出區域22的各部分，而 設置在該各部分的其中一側。 以下在說明塗佈裝置1的構造時，爲了容易表示，使 用XYZ座標來說明圖中的方向。將基板搬運部2的長軸 方向也就是基板的搬運方向記爲X方向。將從俯視方向觀 察與X方向（基板搬運方向）垂直相交的方向記爲γ方向。 將與包含X方向軸及Y方向軸的平面垂直的方向記爲Z 方向。分別在X方向、Y方向及Z方向，圖中箭頭的方向 爲+方向，與箭頭的方向相反的方向爲-方向。 基板搬入區域2 0，是將從裝置外部搬運過來的基板S 予以搬入的部位，具有：搬入側台2 5、與升降機構2 6。 搬入側台2 5，設置在框架部2 4的上部，是例如由 S U S等所構成的從俯視方向觀察爲矩形的板狀構件。該搬 入側台2 5 ’其X方向爲長軸。在搬入側台2 5，分別設有 複數的空氣噴出孔25a、與複數的升降銷出沒孔25b。該 200914145 空氣噴出孔25a及升降銷出沒孔25b，是設置成貫穿搬入 側台2 5。 空氣噴出孔25a，是將空氣噴出到搬入側台25的台表 面2 5 c上的孔，例如在搬入側台2 5之中基板S通過的區 域配置成從俯視方向觀察爲矩陣狀。該空氣噴出孔2 5 a連 接著沒有圖示的空氣供給源。在該搬入側台2 5，藉由從空 氣噴出孔25a所噴出的空氣而能使基板s朝+Z方向浮起 〇 升降銷出沒孔25b，是設置在搬入側台25之中基板S 搬入的區域。該升降銷出沒孔25b，讓供給到台表面25c 的空氣不會漏出。 在該搬入側台25之中的Y方向的兩端部，各設置有 —個校準裝置25d。校準裝置25d，是將搬入到搬入側台 25的基板S予以定位的裝置。各校準裝置25d具有：長 孔部、與設在該長孔部內的定位構件（沒有圖示），將搬入 到搬入側台2 5的基板從兩側機械性地予以夾持。 升降機構26，是設置在搬入側台25的基板搬入位置 的背面側。該升降機構26具有：升降構件26a、與複數的 升降銷26b。升降構件26a，連接於沒有圖示的驅動機構 ，藉由該驅動機構的驅動而讓升降構件2 6 a朝Z方向移動 。複數的升降銷26b，從升降構件26a的上面部朝向搬入 側台25豎立設置。各升降銷26b，是配置在··從俯視方向 觀察分別與上述升降銷出沒孔2 5 b重疊的位置。藉由讓升 降構件26a朝Z方向移動’則各升降銷26b會從升降銷出 -10- 200914145 沒孔25b出沒於台表面25c上。各升降銷26b的+Z方向 的端部是設置成分別與Z方向上的位置一致，而能將從裝 置外部搬運過來的基板S保持爲水平的狀態。 塗佈處理區域2 1，是進行光阻劑的塗佈處理的部位， 設置有：將基板S浮起支承的處理台27。 處理台27，是以例如硬質氧化鋁膜爲主成分的光吸收 材料來覆蓋台表面27c的從俯視方向觀察爲矩形的板狀構 件，是設置在相對於搬入側台2 5的+X方向側。在處理台 之中以光吸收材料覆蓋的部位（反射抑制部），會抑制雷 射光等的光線反射。該處理台27，Y方向爲長軸。處理台 27的Y方向的尺寸，與搬入側台25的Y方向尺寸大致相 同。在處理台27設置有：複數的空氣噴出孔27a、與複數 的空氣吸引孔27b。在處理台27，在X方向及Y方向將 該空氣噴出孔27a與空氣吸引孔27b交互地排列成從俯視 方向觀察爲矩陣狀，設置成讓一個空氣噴出孔27a與一個 空氣吸引孔27b鄰接。這些空氣噴出孔27a及空氣吸引孔 27b，設置成貫穿處理台27。 在空氣噴出孔27a，連接著沒有圖示的空氣供給源。 在該空氣供給源，設置有：用來將從空氣噴出孔27a噴出 的空氣的壓力或流量予以調節的沒有圖示的調節機構。在 該空氣吸引孔27b，連接著沒有圖示的泵浦。藉由調整泵 浦的吸引力，則能夠將供給到處理台2 7的空氣的吸引壓 力予以調節。 在處理台27，空氣噴出孔27a的間距，是相較於設置 -11 - 200914145 在搬入側台2 5的空氣噴出孔2 5 a的間距更狹窄’與搬 側台2 5相比，將空氣噴出孔2 7 a設置得較緊密。因此 與其他的台部相比，在該處理台27能以較高精確度來 節基板的浮起量，基板的浮起量例如可控制爲1 以 ，而5 Ομιη以下較佳。 基板搬出區域22，是用來將塗佈有光阻劑的基板 搬出到裝置外部的部位，具有：搬出側台2 8、與升降機 29。該搬出側台28，設置在相對於處理台27的+Χ方向 ，由與設置在基板搬入區域2 0的搬入側台2 5大致相同 材質、尺寸所構成。與搬入側台25同樣地，在搬出側 28設置有：空氣噴出孔28a及升降銷出沒孔28b。升降 構2 9，設置在搬出側台2 8的基板搬出位置的背面側， 如以框架部24來支承。升降機構29的升降構件29a及 降銷29b，與設置在基板搬入區域20的升降機構26的 部位爲相同的構造。該升降機構29，當將搬出側台28 的基板S搬出到外部裝置時，能藉由基板S交接用的升 銷29b來將基板S抬起。 搬運機構23，具有：搬運機23a、真空襯墊23b、 道23 c。搬運機23 a的構造是在內部設置有例如線性馬 ，藉由驅動該線性馬達，讓搬運機23a可於軌道23 e上 動。 該搬運機23a是配置成：在俯視方向觀察讓預定的 分23 d重疊於基板S的-Y方向端部。與該基板S重疊 部分23 d，是設置在：較當使基板S浮起時的基板背面 入 ϊ 調 下 S 構 側 的 台 機 例 升 各 上 降 軌 達 移 部 的 的 -12- 200914145 高度位置更低的位置。 真空襯墊23b，是有複數個排列在搬運機23a之中與 上述基板S重疊的部分23d。該真空襯墊23b，具有用來 真空吸附基板S的吸附面，配置成讓該吸附面朝向上方。 真空襯墊23b，藉由讓吸附面吸附住基板S的背面端部， 則可保持住該基板S。各真空襯墊23b，其從搬運機23a 的上面部起算的高度位置是可調節的，例如可因應基板S 的浮起量而將真空襯墊23b的高度位置上下調整。軌道 23c是在：搬入側台25、處理台27、及搬出側台28的側 方涵蓋各台部地延伸著，藉由滑動於該軌道2 3 c而能讓搬 運機23a沿著該各台部移動。 (塗佈部） 接著來說明塗佈部3的構造。 塗佈部3，是用來在基板S上塗佈光阻劑的部分，具 有：門型框架3 1、與噴嘴3 2。 門型框架3 1，具有：支柱構件3 1 a、與架橋構件3 1 b ，是設置成在Y方向跨越處理台27。支柱構件31a，在處 理台2 7的Y方向側各設置有一個，各支柱構件3 1 a分別 支承於框架部2 4的Y方向側的兩側面。各支柱構件3 1 a ，是設置成讓其上端部的高度位置一致。架橋構件3 1 b， 是架橋於各支柱構件3 1 a的上端部之間，相對於該支柱構 件31a可進丨了升降。 該門型框架31是連接於移動機構31c，可朝X方向 -13- 200914145 移動。藉由該移動機構31c讓門型框架31可在其與管理 部4之間移動。也就是說，設置於門型框架3 1的噴嘴3 2 可在其與管理部4之間移動。而該門型框架31，藉由沒有 圖示的移動機構讓其也可朝Z方向移動。 噴嘴32’是作成其中一方向爲長軸的長條狀，是設置 在門型框架3 1的架橋構件3 ! b的_z方向側的面部。在該 噴嘴32之中的-Z方向的前端，沿著本身的長軸方向設置 有狹縫狀的開口部32a’從該開口部32a將光阻劑吐出。 噴嘴32 ’其開口部32a的長軸方向與γ方向平行，並且 該開口部32a配置成與處理台27相對向。開口部32a的 長軸方向的尺寸是較所搬運的基板S的Y方向的尺寸更小 ’而不會將光阻劑塗佈到基板S的周邊區域。在噴嘴3 2 的內部設置有使光阻劑流通到開口部3 2 a的沒有圖示的流 通路’該流通路連接著沒有圖示的光阻劑供給源。該光阻 劑供給源例如具有沒有圖示的泵浦，藉由以該栗浦將光阻 劑推擠到開口部3 2 a ’而從開口部3 2 a將光阻劑吐出。在 支柱構件31a設置有沒有圖示的移動機構，藉由該移動機 構’讓在架橋構件31b所保持的噴嘴32可朝Z方向移動 。而也可在架橋構件31b上安裝：用來將噴嘴32的開口 部32a ’也就是噴嘴32的前端以及與該噴嘴前端相對向的 相對向面之間的Z方向上的距離予以測定的感應器3 3。 (管理部） 來說明管理部4的構造。 -14 - 200914145 管理部4，是爲了讓吐出到基板S的光阻劑（液狀體） 的吐出量爲定量而將噴嘴3 2進行管理的部位，是設置在 :基板搬運部2之中的相對於塗佈部3的-X方向側（基板 搬運方向的上游側）。該管理部4，具有：作爲預備吐出部 的預備吐出機構41、用來防止噴嘴乾燥的作爲乾燥防止機 構的浸漬槽42、作爲噴嘴洗淨機構的噴嘴洗淨裝置43、 將這些構造予以收容的收容部44、以及用來保持該收容部 的保持構件45。保持構件45與移動機構45a連接。藉由 該移動機構45a讓收容部44可朝X方向移動。 第5圖是顯示管理部4的收容構件44內的構造的剖 面圖。 如該圖所示，預備吐出機構4 1、浸漬槽42、及噴嘴 洗淨裝置43，是以該順序朝-X方向側排列。該預備吐出 機構41、浸漬槽42、及噴嘴洗淨裝置43的Y方向的各尺 寸，是較上述門型框架3 1的支柱構件3 1 a之間的距離更 小，上述門型框架31是跨越各部分來接達。 預備吐出機構4 1，是預備性地將光阻劑吐出的部分， 是具有：預備吐出板41a、及預備吐出面洗淨單元41b。 該預備吐出機構41設置成最接近噴嘴32’在進行預備吐 出動作之後，能立刻移往塗佈動作。浸漬槽42 ’是在內部 儲存有稀釋劑等的溶劑的液體槽。噴嘴洗淨裝置4 3 ’是用 來將噴嘴3 2的開口部3 2 a附近予以沖洗的裝置，是具有 :朝Y方向移動的沒有圖不的洗淨機構、以及使該洗淨機 構移動的沒有圖示的移動機構。該移動機構’設置在較洗 -15- 200914145 淨機構更靠-X方向側。噴嘴洗淨裝置43，藉由設置有移 動機構的部分，與預備吐出機構41及浸漬槽42相比，其 X方向的尺寸較大。而當然針對預備吐出機構4 1、浸漬槽 42、噴嘴洗淨裝置43的配置方式，並不限於本實施方式 的配置方式，也可以用其他的配置方式。 第6圖是顯示預備吐出機構41的構造的俯視圖。 預備吐出板41a，是例如由石材等的材料所構成的板 狀構件，其長軸方向（Y方向）與噴嘴32的長軸方向一致。 該預備吐出板4 1 a之中的+ Z方向側的面部爲吐出光阻劑 的預備吐出面41c。該預備吐出面41c形成爲平坦狀，是 平行於圖中的XY平面。 預備吐出面洗淨單元41b’是用來洗淨預備吐出面 4 1 c的部位，是設置成可藉由沒有圖示的移動機構讓其朝 Y方向移動。該預備吐出面洗淨單元41b，如第7圖所示 ，具有：洗淨液供給部4 1 e、及刮板（刮除部）4 1 f。洗淨液 供給部4 1 e是用來將洗淨液供給到預備吐出面4 1 c，刮板 41f是與洗淨液一起滑動於預備吐出面41c。刮板41f，是 相對於預備吐出面4 1 c傾斜預定的角度例如4 5度左右。 接著來說明如上述構造的塗佈裝置1的動作。 第8圖〜第11圖，是顯示塗佈裝置1的動作過程的 俯視圖。參考各圖來說明將光阻劑塗佈在基板S的動作。 在該動作，將基板S搬入到基板搬入區域20，使該基板s 浮起而進行搬運，且在塗佈處理區域2 1塗佈光阻劑，將 已塗佈好該光阻劑的基板S從基板搬出區域22搬出。第 -16- 200914145 8圖〜第1 1圖僅以虛線顯示門型框架3〗的輪 判斷噴嘴32及處理台27的構造。以下來說明 細動作。 在將基板搬入到基板搬入區域20之前，信 待機。具體來說，在搬入側台25的基板搬入彳 向側配置搬運機23a，將真空襯墊23b的高度 基板的浮起高度位置，並且從搬入側台2 5的 25a、處理台27的空氣噴出孔27a、空氣吸引 出側台28的空氣噴出孔28a分別將空氣噴出 爲將空氣供給到讓基板浮起於各台部表面的程 在該狀態，例如藉由沒有圖示的搬運臂等 所示，若從外部將基板S搬運到基板搬入位置 圖所示的升降構件26a朝+Z方向移動，將如: 的升降銷26b從升降銷出沒孔25b突出到台赛200914145 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a coating apparatus. This case is based on the Japanese Patent Application No. 2007-178360 filed on July 6, 2007 in Japan, and its content is hereby incorporated by reference. [Prior Art] A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern 'is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed separately. A known coating device for applying a photoresist film on a substrate is, for example, a slit nozzle fixed to apply a photoresist to each of the glass substrates moved under the slit nozzle. In order not to cause an error in the thickness of the photoresist film due to the substrate, it is necessary to adjust the slit nozzle. For example, in the method described in Patent Document 1, the discharge amount (prepared discharge operation) is performed by the slit nozzle to adjust the discharge amount of the photoresist discharged from the slit nozzle to a predetermined amount. By this method, the photoresist is preliminarily discharged to the upper end of the primer roller having the cylindrical dummy discharge surface, and the primer roller is rotated to move the discharge region. On the lower end of the primer roller, a solvent for dissolving the photoresist is disposed, and the simulated sprayed surface is washed while performing simulated discharge. [Problem to be Solved by the Invention] However, in the method described in Patent Document 1, a large amount of washing is required for the structure of the simulated scattering surface. Clean the solvent of the simulated spray surface. In view of the above circumstances, an object of the present invention is to provide a coating apparatus which can control the amount of use of a cleaning liquid for washing a preliminary discharge surface [means for solving the problem], in order to achieve the above object, the present invention The coating device includes: a substrate transporting unit that transports the substrate and transports the substrate, a coating unit that applies the liquid material to the substrate that is transported by the substrate transporting unit, and the coating unit; In the preliminary discharge operation, the preliminary discharge portion of the substantially planar preliminary discharge surface of the liquid material is applied from the coating portion. According to the present invention, there is provided a substrate transporting unit that transports a substrate and transports the substrate, a coating portion that applies a liquid material to the substrate that is transported by the substrate transporting unit, and a preliminary discharge operation of the coating unit. At this time, the preliminary discharge portion of the preliminary discharge surface of the liquid material is applied from the coating portion; and the cleaning liquid is not disposed in a large amount, and the preliminary discharge can be performed. In the coating apparatus, in the vicinity of the preliminary discharge unit, a nozzle cleaning mechanism-5-200914145 for cleaning the nozzle provided in the coating unit, and drying prevention for preventing the nozzle from drying are provided. At least one of the institutions. In the present invention, when at least one of a nozzle cleaning mechanism for cleaning the nozzle provided in the application portion and a drying prevention mechanism for preventing the nozzle from being dried is provided in the vicinity of the preliminary discharge portion, The discharge state of the nozzle can be maintained when the preliminary discharge is performed. The coating device includes a management unit that is provided in combination with the preliminary discharge unit, the nozzle cleaning mechanism, and the drying prevention mechanism. According to the present invention, the management unit is provided in combination with the preparation of the discharge unit, the nozzle cleaning mechanism, and the drying prevention mechanism, and the preliminary discharge operation, the nozzle cleaning operation, and the drying prevention operation are integrated. Thereby, the discharge state of the nozzle can be maintained efficiently. In the above coating apparatus, the preliminary discharge unit has a plate-like member, and one of the plate-shaped members is used as the preliminary discharge surface. In the present invention, when the preliminary discharge portion has a plate-like member and one of the plate-like members is used as the preliminary discharge surface, the preliminary discharge operation can be performed without moving the discharged portion. Thereby, the large-sized moving mechanism is not required, and the preliminary discharge unit can be miniaturized. In the above coating apparatus, the preliminary discharge surface is disposed at a position overlapping the substrate conveyance portion as viewed from a plan view. In the present invention, when the preliminary discharge surface is disposed at a position overlapping the substrate conveyance portion from the plan view, the outer dimensions of the entire coating apparatus can be reduced. -6- 200914145 In the above coating apparatus, the preliminary discharge surface may be disposed on the side of the substrate conveyance unit. In the present invention, when the preliminary discharge surface is disposed on the side of the substrate conveyance portion, it is easier to perform maintenance than to arrange the preliminary discharge surface to be disposed at a position overlapping the substrate conveyance portion in a plan view. For example, the height position of the preliminary discharge surface can be made substantially equal to the height position of the substrate. As a result, the preliminary discharge operation can be performed in a state closer to the environment in which the actual discharge operation is performed. In the above coating apparatus, the preliminary discharge surface may be disposed on the side of the substrate conveyance portion in the substrate conveyance direction. In the present invention, when the preliminary discharge surface is disposed on the side of the substrate conveyance portion in the substrate conveyance direction, the application portion is more easily accessed. The coating device includes a moving mechanism that relatively moves the application portion and the preliminary discharge surface. In the present invention, when the moving mechanism is provided to allow the application portion to move relative to the preliminary discharge portion, the application portion can be easily moved between the application portion and the preliminary discharge surface. In the above coating apparatus, the preliminary discharge unit is provided with a preliminary discharge surface cleaning mechanism for cleaning the preliminary discharge surface. In the present invention, when the preliminary discharge portion is used, the preliminary discharge surface cleaning mechanism for cleaning the preliminary discharge surface is provided. Then, for example, after the preliminary discharge has been performed, the preliminary discharge surface can be washed. Thereby, the preliminary discharge operation can be repeatedly performed on the preliminary discharge surface. In the above-described coating apparatus, the preliminary discharge surface cleaning mechanism includes: a cleaning liquid supply unit that supplies the cleaning liquid to the preliminary discharge surface by using 200914145; and the liquid state that is the cleaning liquid and the preliminary discharge surface. The scraping part that is scraped together. In the present invention, the preliminary discharge surface cleaning mechanism includes a cleaning liquid supply unit for supplying the cleaning liquid to the preliminary discharge surface, and the cleaning liquid is scraped together with the liquid material of the preliminary discharge surface. When the scraping portion is used, the amount of the cleaning liquid can be reduced as much as possible, and the preliminary discharge surface can be efficiently washed. [Embodiment] Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a perspective view of a coating device i of the present embodiment. The main structure of the coating apparatus 1 of the present invention will be described with reference to the drawings. The coating apparatus 1 of the present embodiment is, for example, coated with a photoresist on a glass substrate used for a liquid crystal panel or the like. The coating device is a substrate transfer cassette 2, a coating unit 3, and a management unit 4, and is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. 200914145 (Substrate conveying unit) First, the structure of the board conveying unit 2 will be described. The substrate transporting unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate carry-in region 20, the coating processing region 21, and the substrate carry-out region 22 by the transport mechanism 23. The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 23 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22. Hereinafter, in explaining the structure of the coating apparatus 1, the directions in the drawings will be described using XYZ coordinates for ease of display. The direction of the long axis of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) observed from the plan view is referred to as the γ direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction. The substrate loading area 20 is a portion into which the substrate S conveyed from the outside of the apparatus is carried, and has a loading side table 25 and an elevating mechanism 26. The loading side table 25 is provided on the upper portion of the frame portion 24, and is, for example, a plate-like member which is formed of S U S or the like and which is rectangular in plan view. The moving side table 2 5 ' has a long axis in the X direction. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of lifting pin insertion holes 25b. The 200914145 air ejection hole 25a and the lift pin exit hole 25b are provided so as to penetrate through the loading side table 25. The air ejection hole 25a is a hole for ejecting air to the table surface 25c of the loading side table 25. For example, the area where the substrate S passes through the loading side table 25 is arranged in a matrix shape as seen from a plan view. The air ejection hole 25 5 a is connected to an air supply source (not shown). In the loading-side table 25, the substrate s is floated in the +Z direction by the air ejected from the air ejection hole 25a, and the lifting/unloading hole 25b is provided in the loading-side table 25, and the substrate S is placed in the loading-side table 25. region. The lift pin exits the hole 25b so that the air supplied to the table surface 25c does not leak. A calibration device 25d is provided at each of both end portions of the loading side table 25 in the Y direction. The calibration device 25d is a device for positioning the substrate S carried into the loading side table 25. Each of the aligning devices 25d has a long hole portion and a positioning member (not shown) provided in the long hole portion, and the substrate carried into the loading side table 25 is mechanically sandwiched from both sides. The elevating mechanism 26 is provided on the back side of the substrate loading position of the loading side table 25. The elevating mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The elevating member 26a is connected to a drive mechanism (not shown), and the elevating member 26a is moved in the Z direction by the drive of the drive mechanism. The plurality of lift pins 26b are erected from the upper surface portion of the elevating member 26a toward the carry-in side table 25. Each of the lift pins 26b is disposed at a position overlapping with the lift pin exit hole 25b, as viewed from a plan view. By moving the lifting member 26a in the Z direction, the lift pins 26b are ejected from the lift pins. -10-200914145 The holes 25b are not present on the table surface 25c. The end portions of the respective lift pins 26b in the +Z direction are provided so as to be aligned with the positions in the Z direction, and the substrate S conveyed from the outside of the device can be kept horizontal. The coating treatment region 21 is a portion where the coating treatment of the photoresist is performed, and a processing table 27 that floats and supports the substrate S is provided. The processing table 27 is a plate-shaped member that is rectangular in plan view when the light-absorbing material having a hard aluminum oxide film as a main component is applied to cover the land surface 27c, and is provided on the +X direction side with respect to the loading side table 25 . A portion (reflection suppressing portion) covered with the light absorbing material in the processing table suppresses reflection of light such as laser light. The processing table 27 has a long axis in the Y direction. The size of the processing table 27 in the Y direction is substantially the same as the size of the loading side table 25 in the Y direction. The processing table 27 is provided with a plurality of air ejection holes 27a and a plurality of air suction holes 27b. In the processing table 27, the air ejection holes 27a and the air suction holes 27b are alternately arranged in the X direction and the Y direction so as to be arranged in a matrix shape in plan view, and one air ejection hole 27a is provided adjacent to one air suction hole 27b. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. An air supply source (not shown) is connected to the air ejection hole 27a. The air supply source is provided with an adjustment mechanism (not shown) for adjusting the pressure or flow rate of the air ejected from the air ejection hole 27a. A pump (not shown) is connected to the air suction hole 27b. By adjusting the suction force of the pump, the suction pressure of the air supplied to the processing table 27 can be adjusted. In the processing table 27, the pitch of the air ejection holes 27a is narrower than the distance between the air ejection holes 25 5 a of the loading side table 25 compared with the setting -11 - 200914145 'the air is compared with the moving side table 2 5 The ejection holes 27 7 a are set tightly. Therefore, compared with other stages, the processing table 27 can adjust the amount of floating of the substrate with a high degree of precision, and the amount of floating of the substrate can be controlled, for example, to 1 or less, and preferably 5 Å or less. The substrate carry-out area 22 is a portion for carrying out the substrate coated with the photoresist to the outside of the apparatus, and has a carry-out side table 28 and an elevator 29. The carry-out side table 28 is provided in the +Χ direction with respect to the processing table 27, and is composed of substantially the same material and size as the loading side table 25 provided in the substrate loading area 20. Similarly to the loading side table 25, the unloading side 28 is provided with an air ejection hole 28a and a lift pin exit hole 28b. The lifting mechanism 29 is provided on the back side of the substrate carrying-out position of the carry-out side table 28, and is supported by the frame portion 24. The elevating member 29a and the lowering pin 29b of the elevating mechanism 29 have the same structure as the portion of the elevating mechanism 26 provided in the substrate loading area 20. When the substrate S of the carry-out side table 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pin 29b for the transfer of the substrate S. The transport mechanism 23 has a transporter 23a, a vacuum pad 23b, and a track 23c. The carrier 23a is constructed such that a linear horse is provided inside, and the linear motor is driven to move the carrier 23a to the rail 23e. The transporter 23a is disposed so as to overlap the end portion in the -Y direction of the substrate S when the predetermined portion 23d is observed in a plan view. The overlap portion 23d with the substrate S is disposed at a height of -12-200914145 which is lower than the upper portion of the lower side of the substrate when the substrate S is lifted up and the S-frame is lowered. Lower position. The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23b can hold the substrate S by allowing the adsorption surface to adsorb the rear end portion of the substrate S. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends over the side of the loading side table 25, the processing table 27, and the unloading side table 28, and slides the rail 2 3 c to allow the transporter 23a to follow the respective stages. Department moves. (Coating portion) Next, the structure of the coating portion 3 will be described. The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 3 1 and a nozzle 32. The portal frame 3 1 has a strut member 3 1 a and a bridging member 3 1 b that are disposed to span the processing table 27 in the Y direction. Each of the pillar members 31a is provided on the Y-direction side of the treatment table 27, and each of the pillar members 31a is supported by both side faces of the frame portion 24 on the Y-direction side. Each of the strut members 3 1 a is disposed such that the height positions of the upper end portions thereof coincide. The bridging members 3 1 b are bridged between the upper end portions of the respective strut members 31a, and are movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction -13 - 200914145. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 3 2 provided to the portal frame 3 1 is movable between it and the management portion 4. The door frame 31 can also be moved in the Z direction by a moving mechanism (not shown). The nozzle 32' is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the _z direction side of the bridge member 3!b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a' is provided along the long axis direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. The nozzle 32' has a long axis direction parallel to the γ direction of the opening 32a, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the longitudinal direction is smaller than the dimension of the substrate S to be transported in the Y direction, and the photoresist is not applied to the peripheral region of the substrate S. Inside the nozzle 3 2, a flow path (not shown) through which the photoresist flows to the opening 3 2 a is provided. This flow path is connected to a photoresist supply source (not shown). The photoresist supply source has, for example, a pump (not shown), and the photoresist is discharged from the opening 3 2 a by pushing the photoresist to the opening 3 2 a ' with the pump. The strut member 31a is provided with a moving mechanism (not shown), and the moving mechanism "moves" the nozzle 32 held by the bridging member 31b in the Z direction. Alternatively, an inductor for measuring the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip end of the nozzle 32 and the opposing surface facing the tip end of the nozzle may be attached to the bridge member 31b. 3 3. (Management Unit) The structure of the management unit 4 will be described. -14 - 200914145 The management unit 4 is a portion that manages the nozzles 3 2 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is provided in the substrate transport unit 2 The side of the application portion 3 on the -X direction (the upstream side in the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41 as a preliminary discharge unit, a immersion tank 42 as a drying prevention mechanism for preventing nozzle drying, and a nozzle cleaning device 43 as a nozzle cleaning mechanism, and accommodates these structures. The accommodating portion 44 and the holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a. Fig. 5 is a cross-sectional view showing the structure inside the housing member 44 of the management unit 4. As shown in the figure, the preliminary discharge mechanism 4 1 , the immersion tank 42 , and the nozzle cleaning device 43 are arranged side by side in the -X direction. The sizes of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the pillar members 31a of the door frame 31, and the door frame 31 is Access across all parts. The preliminary discharge mechanism 4 1 is a portion that preliminarily discharges the photoresist, and has a preliminary discharge plate 41a and a preliminary discharge surface cleaning unit 41b. The preliminary discharge mechanism 41 is disposed so that the nozzle 32' closest to the nozzle 32' can immediately move to the coating operation after the preliminary discharge operation. The dipping tank 42' is a liquid tank in which a solvent such as a diluent is stored inside. The nozzle cleaning device 4 3 ′ is a device for rinsing the vicinity of the opening 3 2 a of the nozzle 3 2 , and has a cleaning mechanism that moves in the Y direction and moves the cleaning mechanism. A moving mechanism not shown. The moving mechanism is disposed on the side of the -X direction of the washing mechanism -15-200914145. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42 by the portion in which the moving mechanism is provided. Of course, the arrangement of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used. Fig. 6 is a plan view showing the structure of the preliminary discharge mechanism 41. The preliminary discharge plate 41a is a plate-like member made of a material such as stone or the like, and its longitudinal direction (Y direction) coincides with the longitudinal direction of the nozzle 32. The surface on the +Z direction side of the preliminary discharge plate 4 1 a is a preliminary discharge surface 41c from which a photoresist is discharged. The preliminary discharge surface 41c is formed in a flat shape and is parallel to the XY plane in the drawing. The preliminary discharge surface cleaning unit 41b' is a portion for washing the preliminary discharge surface 41c, and is provided so as to be movable in the Y direction by a moving mechanism (not shown). As shown in Fig. 7, the preliminary discharge surface cleaning unit 41b has a cleaning liquid supply unit 4 1 e and a squeegee (scraping unit) 4 1 f. The cleaning liquid supply unit 4 1 e is for supplying the cleaning liquid to the preliminary discharge surface 4 1 c, and the squeegee 41f is slid together with the cleaning liquid to the preliminary discharge surface 41c. The squeegee 41f is inclined at a predetermined angle with respect to the preliminary discharge surface 4 1 c by, for example, about 45 degrees. Next, the operation of the coating apparatus 1 having the above configuration will be described. Figs. 8 to 11 are plan views showing the operation of the coating device 1. The action of applying a photoresist to the substrate S will be described with reference to the respective drawings. In this operation, the substrate S is carried into the substrate carrying-in region 20, the substrate s is floated and transported, and a photoresist is applied to the coating processing region 21 to apply the substrate S to which the photoresist has been applied. It is carried out from the substrate carry-out area 22. -16- 200914145 8 to 11 1 shows the structure of the nozzle 32 and the processing table 27 of the door frame 3 in a broken line. The following is a detailed description of the fine action. The signal stands by until the substrate is carried into the substrate loading area 20. Specifically, the transporter 23a is disposed on the substrate loading side of the loading side table 25, and the floating height position of the height of the vacuum pad 23b is ejected from the air of the loading side table 25a and the processing table 27. The hole 27a and the air ejection hole 28a of the air suction side table 28 respectively eject air to supply a state in which the substrate is floated on the surface of each of the table portions, for example, by a transfer arm or the like (not shown). When the substrate S is transported from the outside to the lift member 26a shown in the substrate loading position map in the +Z direction, the lift pin 26b such as: protrudes from the lift pin exit hole 25b to the stage race.
藉由升降銷2 6b將基板S抬起，進行該基板S 。而從校準裝置25d的長孔使定位構件突出於 〇 在接收基板S之後，使升降構件2 6 a下 26b收容於升降銷出沒孔25b內。由於在台表 有空氣層，所以基板S藉由該空氣而保持爲相 2 5 c浮起的狀態。當基板s到達空氣層的表面 準裝置25d的定位構件來進行基板S的定位， 入位置的-Y方向側處配置的搬運機23a的真空 空吸附於基板S的· Y方向側端部。在第8圖 廓，而容易 各部分的詳 色塗佈裝置1 位置的-Y方 位置定位在 空氣噴出孔 孔27b及搬 或吸引，成 度的狀態。 ，如第8圖 丨，則使第2 第2圖所不 E面 25c。而 的交接動作 '台表面25c 降將升降銷 面2 5 c形成 對於台表面 時，藉由校 將在基板搬 襯墊23b真 顯示了吸附 -17- 200914145 住基板S的-Y方向側端部的狀態。在藉由真空襯塾2 3 b 吸附住基板s的-Y方向側端部之後，使搬運機23a沿著 軌道2 3 c移動。由於基板S爲浮起的狀態’所以即使搬運 機23a的驅動力較小，基板S也能沿著軌道23C順利移動 〇 一旦基板S的搬運方向前端到達噴嘴32的開口部32a 的位置，如第9圖所示，則從噴嘴32的開口部32a朝向 基板S吐出光阻劑。光阻劑的吐出動作，是使噴嘴3 2的 位置固定，藉由搬運機23 a —邊搬運基板S —邊來進行。 伴隨著基板S的移動，則如第1 〇圖所示在基板s上 塗佈光阻膜R。藉由讓基板S通過，吐出光阻劑的開口部 3 2a下面，而在基板S的預定區域形成光阻膜R。 形成了光阻膜R的基板S，是藉由搬運機23a將其朝 向搬出側台2 8搬運。在搬出側台2 8，在相對於台表面 2 8c浮起的狀態，如第1 1圖所示將基板S搬運到基板搬出 位置。 一旦基板S到達基板搬出位置，則解除真空襯墊23b 的吸附，使升降機構29的升降構件29a朝向+Z方向移動 。然後，升降銷29b從升降銷出沒孔28b朝向基板S的背 面突出，藉由升降銷2 9b將基板S抬起。在該狀態，例如 在搬出側台2 8的+X方向側處設置的外部的搬運臂，會接 達於搬出側台2 8，而接收基板S。在將基板S交接到搬運 臂之後’將搬運機23 a再回到搬入側台25的基板搬入位 置’待機直到要搬運下個基板S。 -18- 200914145 在尙未要搬運下個基板S的期間，在塗佈部3，進行 用來保持噴嘴32的吐出狀態的預備吐出動作。如第1 2圖 所示，使門型框架3 1朝-X方向移動到管理部4的位置。 在使門型框架3 1移動到管理部4的位置之後，如第 1 4圖所示，調整門型框架3 1的位置將噴嘴3 2接達到噴嘴 洗淨裝置43。在噴嘴洗淨裝置43，朝向噴嘴32的開口部 32a附近而吐出稀釋液等的洗淨液，並且因應需要將氮氣 與稀釋劑同時吐出到噴嘴3 2的開口部3 2 a，且同時藉由將 管理部4朝向噴嘴3 2的長軸方向掃描，將附著在噴嘴3 2 的光阻劑除去。 在洗淨好噴嘴3 2之後，如第14圖所示，將該噴嘴3 2 接達到浸漬槽42內。在浸漬槽42，藉由將噴嘴32的開口 部32a暴露於：儲存於浸漬槽42的溶劑（稀釋劑）的蒸氣環 境中，來防止噴嘴3 2乾燥。而該乾燥防止處理，不需要 在每次預備吐出動作都進行，也可跳過該處理程序而移往 下個處理。 在進行過噴嘴32的乾燥防止處理之後（在沒有接達到 浸漬槽42的情況則是在洗淨過噴嘴32後），如第1 4圖所 示，將該噴嘴32接達到預備吐出機構41。在預備吐出機 構41，會一邊將開口部32&與預備吐出面之間的距離予以 測定，一邊將噴嘴32的開口部32a移動到Z方向上的預 定位置，一邊使噴嘴32朝-X方向移動，一邊從開口部 3 2a朝向預備吐出面41c預備吐出光阻劑R。 在預備吐出動作之後，藉由預備吐出面洗淨單元41b -19- 200914145 將預備吐出面4 1 c予以洗淨。具體來說，是使刮板4 1 f抵 接於預備吐出面4 1 c，一邊從洗淨液供給部4 1 e供給洗淨 液，一邊使預備吐出面洗淨單元4 1 b朝向預備吐出面4 1 c 的+ Y方向或-Y方向掃描。藉由洗淨液從預備吐出面41c 除去光阻劑，並且藉由刮板4 1 f將該除去的光阻劑及洗淨 液刮除到預備吐出面4 1 c的外側。 在與預備吐出面洗淨單元4 1 b的開始洗淨動作大致相 同的時機，將門型框架31回到原來位置。當要搬運下個 基板S時，如第1 3圖所示，藉由沒有圖示的移動機構， 使噴嘴32移動到Z方向上的預定位置。藉由對基板S反 覆進行塗佈光阻膜R的塗佈動作與預備吐出動作，則在基 板S形成良質的光阻膜R。 藉由本實施方式，具有：使基板S浮起來進行搬運的 基板搬運部2、對於藉由基板搬運部2所搬運中的基板S 來塗佈液狀體的塗佈部3、以及具有，當塗佈部3的預備 吐出動作時從塗佈部3塗佈液狀體的大致平面的預備吐出 面4 1 c的預備吐出機構4 1 ;並沒有大量配置洗淨液，就可 以進行預備吐出。該預備吐出機構4 1具有由板狀構件所 構成的預備吐出板4 1 a，將該預備吐出板4 1 a的其中一面 用作爲預備吐出面4 1 c，則可不移動該預備吐出板4 1 a的 被吐出區域而進行預備吐出動作。藉此，則不需要大型的 移動機構，而能將預備吐出機構4 1小型化。而預備吐出 面4 1 c是配置在從俯視方向觀察與基板搬運部3重疊的位 置，所以可將塗佈裝置1全體的外型尺寸縮小。 -20- 200914145 藉由本實施方式，如第5圖所示，設置有管理部4, 該管理部4，是在預備吐出機構4 1的附近聯合設有：用來 進行噴嘴3 2的洗淨的噴嘴洗淨裝置4 3、及用來防止噴嘴 32乾燥的浸漬槽42，所以能將預備吐出動作、噴嘴32的 洗淨動作、噴嘴3 2的乾燥防止動作予以整合進行。藉此 ’能有效率地維持噴嘴3 2的吐出狀態。 藉由本實施方式，如第6圖所示，是在預備吐出機構 41設置有：用來洗淨預備吐出面41c的預備吐出面洗淨單 元4 1 b，所以例如在進行過預備吐出動作之後，就可以將 預備吐出面4 1 c洗淨。藉此，則在該預備吐出面4 1 c能反 覆進行預備吐出動作。而如第7圖所示，該預備吐出面洗 淨單元4 1 b，是具有：將洗淨液供給到預備吐出面4 1 c的 洗淨液供給部4 1 e、及將洗淨液、與預備吐出面4 1 c的液 狀體一同予以刮除的刮板4 1 f，所以能盡量減少洗淨液的 使用量，能有效率地洗淨預備吐出面4 1 c。 本發明的技術範圍並不限於上述實施方式，在不脫離 本發明主旨的範圍可以作適當變更。 在上述實施方式，雖然舉例說明將管理部4配置在從 俯視方向觀察與基板搬運部2重疊的位置，而並不限於此 ’例如如第1 5圖所示，也可將管理部4配置在+X方向的 側方4a。如該圖所示，也可將其配置在基板搬運部2的Y 方向的側方4 b、4 c。 針對塗佈裝置1的全體構造，在上述實施方式，雖然 是將搬運機構2 3配置在各台部的-Y方向側’而並不限於 -21 - 200914145 此。例如，也可將搬運機構23配置在各台部的+Y方向側 。而如第16圖所示，也可在各台部的-Υ方向側配置上述 搬運機構23(搬運機23a、真空襯墊23b、軌道23〇，在 + Y方向側配置與該搬運機構23爲相同構造的搬運機構 53(搬運機53a、真空襯墊53b、軌道53c)，而能以搬運機 構23與搬運機構53來搬運不同的基板。例如，如該圖所 示’在搬運機構23搬運基板S1，在搬運機構53搬運基 板S2。在該情況，則能以搬運機構23與搬運機構53來 交互搬運基板，讓生產能力提升。而在要將具有上述基板 S、S 1、S 2的一半程度的面積的基板進行搬運的情況，例 如以搬運機構23與搬運機構53各保持一枚，藉由使搬運 機構23與搬運機構53朝+X方向一同行進，則能同時搬 運兩枚基板。藉由這種構造，則能讓生產能力提升。 在上述實施方式，雖然當進行預備吐出時將預備吐出 面41c的位置固定，藉由移動機構31c使噴嘴32朝X方 向移動’而並不限於此，只要噴嘴32與預備吐出面41c 是相對移動’則用其他動作也可以。例如，使噴嘴3 2固 定’使收容著預備吐出板4 1 a的收容構件44移動也可以 ’分別使噴嘴32及收容構件44移動也可以。 在上述實施方式，雖然將預備吐出板41a的+Z方向 側的面作爲預備吐出面4 1 c，而並不限於此，預備吐出面 4 1 c只要是大致平面，用其他的構造也可以。例如，不設 置預備吐出板4 1 a，將收容著管理部4的各構成元件的收 容構件的底面上作爲預備吐出面，直接對該收容構件的底 -22- 200914145 面上進行預備吐出也可以。 在上述實施方式，將噴嘴洗淨裝置4 3、浸漬槽42、 及預備吐出機構41的各部分統整配置爲管理部4’而並不 限於此，即使將該各部分分別配置也可以。例如僅將預備 吐出機構4 1設置在噴嘴32附近，將噴嘴洗淨裝置43及 浸漬槽4 2配置在管理部4內也可以。在該情況，例如連 續進行複數次預備吐出動作，在該每經過複數次吐出動作 則進行噴嘴3 2的洗淨、乾燥防止處理。藉此則能迅速地 進行預備吐出動作。 【圖式簡單說明】 第1圖是顯示本發明的一種實施方式的塗佈裝置的構 造的立體圖。 第2圖是顯示本發明的上述實施方式的塗佈裝置的構 造的正視圖。 第3圖是顯示本發明的上述實施方式的塗佈裝置的構 造的俯視圖。 第4圖是顯示本發明的上述實施方式的塗佈裝置的構 造的側視圖。 第5圖是顯示本發明的上述實施方式的塗佈裝置的局 部構造的剖面圖。 第6圖是顯示本發明的上述實施方式的塗佈裝置的局 部構造的俯視圖。 弟7圖疋:顯不本發明的上述實施方式的塗佈裝置的局 -23- 200914145 部構造的剖面圖。 第8圖是本發明的上述實施方式的塗佈裝置的動作的 顯示圖。 第9圖7E本發明的上述實施方式的塗佈裝置的動作的 顯不圖。 第1 0圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第11圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第12圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第13圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第14圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第15圖是顯示本發明的另一實施方式的塗佈裝置的 其他構造的俯視簡圖。 ‘ 第16圖是顯示本發明的另一實施方式的塗佈裝置的 其他構造的俯視圖。 【主要元件符號說明】 1 :塗佈裝置 2 :基板搬運部 3 :塗佈部 -24- 200914145 4 :管理部 2 1 :塗佈處理區域 23 :搬運機構 2 7 :處理台 3 1 :門型框架 3 2 :噴嘴 4 1 :預備吐出機構 4 1 a :預備吐出板 43 :噴嘴洗淨機構 43c :預備吐出面 5 :基板 R :光阻膜 -25The substrate S is lifted by the lift pins 26b to carry out the substrate S. On the other hand, the positioning member protrudes from the long hole of the aligning device 25d, and after the receiving substrate S is received, the elevating member 26 a lower portion 26b is housed in the elevating pin exit hole 25b. Since there is an air layer on the stage, the substrate S is maintained in a state in which the phase is floated by the air. When the substrate s reaches the positioning member of the surface of the air layer device 25d to position the substrate S, the vacuum of the carrier 23a disposed at the -Y direction side of the entry position is adsorbed to the Y-direction side end portion of the substrate S. In Fig. 8, it is easy to position the -Y side of the position of the detailed coating device 1 in each part in the air ejection hole 27b and the state of being moved or sucked. As shown in Fig. 8, the second surface is not the second surface 25c. However, the transfer operation 'the table surface 25c is lowered when the lift pin surface 2 5 c is formed on the table surface, and the substrate is placed on the substrate transfer pad 23b to show the adsorption - 17- 200914145. status. After the end portion of the substrate s in the -Y direction is adsorbed by the vacuum lining 2 3 b, the carrier 23a is moved along the rail 2 3 c. Since the substrate S is in a floating state, even if the driving force of the conveyor 23a is small, the substrate S can smoothly move along the rail 23C, and the leading end of the substrate S in the conveyance direction reaches the position of the opening 32a of the nozzle 32, such as As shown in Fig. 9, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 3 2 and transporting the substrate S while transporting the substrate 23 a. With the movement of the substrate S, the photoresist film R is applied onto the substrate s as shown in Fig. 1 . By passing the substrate S, the lower surface of the opening portion 3 2a of the photoresist is discharged, and the photoresist film R is formed in a predetermined region of the substrate S. The substrate S on which the photoresist film R is formed is transported toward the carry-out side table 28 by the transporter 23a. The substrate S is transported to the substrate carry-out position as shown in Fig. 1 in a state where the carry-out side table 2, 8 is floated with respect to the table surface 28c. When the substrate S reaches the substrate carrying-out position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. Then, the lift pin 29b protrudes from the lift pin exit hole 28b toward the back surface of the substrate S, and the substrate S is lifted by the lift pin 29b. In this state, for example, the external transfer arm provided at the +X direction side of the carry-out side table 28 is received by the carry-out side stand 2, and the substrate S is received. After the substrate S is transferred to the transport arm, the carrier 23a is returned to the substrate loading position of the loading side table to stand by until the next substrate S is to be transported. -18- 200914145 During the period in which the next substrate S is not to be transported, the application unit 3 performs a preliminary discharge operation for holding the discharge state of the nozzles 32. As shown in Fig. 2, the portal frame 3 1 is moved to the position of the management unit 4 in the -X direction. After the door frame 3 1 is moved to the position of the management unit 4, as shown in Fig. 4, the position of the door frame 3 1 is adjusted to connect the nozzle 3 2 to the nozzle cleaning device 43. In the nozzle cleaning device 43, the cleaning liquid such as the diluent is discharged toward the vicinity of the opening 32a of the nozzle 32, and if necessary, the nitrogen gas and the diluent are simultaneously discharged to the opening 3 2 a of the nozzle 3 2 while The management unit 4 scans in the longitudinal direction of the nozzle 3 2 and removes the photoresist adhering to the nozzle 3 2 . After the nozzle 3 2 is cleaned, as shown in Fig. 14, the nozzle 3 2 is connected to the dipping tank 42. In the dipping tank 42, the nozzle 32 is prevented from drying by exposing the opening portion 32a of the nozzle 32 to a vapor atmosphere of a solvent (diluent) stored in the dipping tank 42. On the other hand, the drying prevention processing does not need to be performed every time the preliminary discharge operation is performed, and the processing can be skipped and moved to the next processing. After the drying prevention process of the nozzle 32 is performed (after the immersion tank 42 is not connected, the nozzle 32 is cleaned), as shown in Fig. 14, the nozzle 32 is connected to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while the distance between the opening 32 & and the preliminary discharge surface is measured, and the nozzle 32 is moved in the -X direction. The photoresist R is prepared to be discharged from the opening portion 3 2a toward the preliminary discharge surface 41c. After the preliminary discharge operation, the preliminary discharge surface 41c is washed by the preliminary discharge surface cleaning unit 41b-19-200914145. Specifically, when the squeegee 4 1 f is brought into contact with the preliminary discharge surface 4 1 c, the cleaning liquid is supplied from the cleaning liquid supply unit 4 1 e, and the preliminary discharge surface cleaning unit 4 1 b is discharged toward the preliminary discharge. Scan in the +Y direction or the -Y direction of the face 4 1 c. The photoresist is removed from the preliminary discharge surface 41c by the cleaning liquid, and the removed photoresist and the cleaning liquid are scraped off to the outside of the preliminary discharge surface 4 1 c by the squeegee 4 1 f. At the same timing as the start of the cleaning operation of the preliminary discharge surface cleaning unit 4 1 b, the portal frame 31 is returned to the original position. When the next substrate S is to be transported, as shown in Fig. 13, the nozzle 32 is moved to a predetermined position in the Z direction by a moving mechanism (not shown). By applying the coating operation of the photoresist film R and the preliminary discharge operation to the substrate S, a favorable photoresist film R is formed on the substrate S. According to the present embodiment, the substrate transport unit 2 that transports the substrate S and transports the coated portion 3 that applies the liquid material to the substrate S that is transported by the substrate transport unit 2, and the coated portion 3 At the time of the preliminary discharge operation of the cloth portion 3, the preliminary discharge mechanism 4 1 of the substantially planar preliminary discharge surface 4 1 c of the liquid material is applied from the application portion 3; and the cleaning liquid is not disposed in a large amount, and the preliminary discharge can be performed. The preliminary discharge mechanism 4 1 has a preliminary discharge plate 4 1 a formed of a plate-like member, and one of the preliminary discharge plates 4 1 a is used as the preliminary discharge surface 4 1 c, so that the preliminary discharge plate 4 1 is not moved. The pre-discharge operation is performed in the spouted area of a. Thereby, the large-sized moving mechanism is not required, and the preliminary discharge mechanism 41 can be downsized. On the other hand, the preliminary discharge surface 4 1 c is disposed at a position overlapping the substrate conveyance unit 3 as viewed in plan view, so that the overall size of the coating apparatus 1 can be reduced. -20- 200914145 According to the present embodiment, as shown in Fig. 5, a management unit 4 is provided which is provided in the vicinity of the preliminary discharge mechanism 4 1 for cleaning the nozzle 3 2 . Since the nozzle cleaning device 43 and the immersion tank 42 for preventing the nozzle 32 from drying are integrated, the preliminary discharge operation, the cleaning operation of the nozzle 32, and the drying prevention operation of the nozzle 32 can be integrated. Thereby, the discharge state of the nozzle 3 2 can be maintained efficiently. According to the present embodiment, as shown in FIG. 6, the preliminary discharge mechanism 41 is provided with a preliminary discharge surface cleaning unit 41b for cleaning the preliminary discharge surface 41c. Therefore, for example, after the preliminary discharge operation is performed, It is possible to wash the preliminary discharge surface 4 1 c. Thereby, the preliminary discharge operation can be performed on the preliminary discharge surface 4 1 c. As shown in Fig. 7, the preliminary discharge surface cleaning unit 4 1 b has a cleaning liquid supply unit 4 1 e for supplying the cleaning liquid to the preliminary discharge surface 4 1 c, and a cleaning liquid, Since the squeegee 4 1 f is scraped off together with the liquid material of the preliminary discharge surface 4 1 c, the amount of the cleaning liquid can be reduced as much as possible, and the preliminary discharge surface 4 1 c can be efficiently washed. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention. In the above-described embodiment, the management unit 4 is disposed at a position overlapping the substrate transport unit 2 as viewed from a plan view, and is not limited thereto. For example, as shown in FIG. 5, the management unit 4 may be disposed. +4 side of the X direction. As shown in the figure, the side portions 4 b and 4 c in the Y direction of the board conveying portion 2 may be disposed. In the above-described embodiment, the entire structure of the coating apparatus 1 is such that the transport mechanism 23 is disposed on the -Y direction side of each of the stages, and is not limited to -21 - 200914145. For example, the transport mechanism 23 may be disposed on the +Y direction side of each of the stages. On the other hand, as shown in Fig. 16, the transport mechanism 23 (the transporter 23a, the vacuum cushion 23b, and the rail 23〇) may be disposed on the side of the cymbal direction, and the transport mechanism 23 may be disposed on the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum cushion 53b, and the rail 53c) having the same structure can transport different substrates by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the substrate is transported at the transport mechanism 23. In S1, the substrate S2 is transported by the transport mechanism 53. In this case, the substrate can be transported by the transport mechanism 23 and the transport mechanism 53 to increase the throughput, and half of the substrates S, S1, and S2 are to be provided. When the substrate of the area is transported, for example, the transport mechanism 23 and the transport mechanism 53 are each held one by one, and the transport mechanism 23 and the transport mechanism 53 are moved in the +X direction, so that the two substrates can be transported at the same time. With this configuration, the productivity can be improved. In the above embodiment, the position of the preliminary discharge surface 41c is fixed when the preliminary discharge is performed, and the nozzle 32 is moved in the X direction by the moving mechanism 31c. As long as the nozzle 32 and the preliminary discharge surface 41c move relative to each other, other operations may be used. For example, by fixing the nozzle 3 2 to move the housing member 44 accommodating the preliminary discharge plate 4 1 a, the nozzle 32 and the housing may be respectively replaced. In the above-described embodiment, the surface on the +Z direction side of the preliminary discharge plate 41a is used as the preliminary discharge surface 4 1 c, and the present invention is not limited thereto, and the preliminary discharge surface 4 1 c is substantially flat. For example, the preliminary ejection plate 4 1 a is not provided, and the bottom surface of the housing member accommodating each component of the management unit 4 is used as a preliminary ejection surface, and the bottom surface of the housing member is directly used. In the above embodiment, the nozzle cleaning device 4 3, the immersion tank 42, and the respective portions of the preliminary discharge mechanism 41 are arranged in a unified manner as the management unit 4', and the present invention is not limited thereto. For example, only the preliminary discharge mechanism 4 1 may be disposed in the vicinity of the nozzle 32, and the nozzle cleaning device 43 and the immersion tank 4 2 may be disposed in the management unit 4. In this case, an example may be used. The preliminary discharge operation is performed in a plurality of times, and the cleaning and drying prevention processing of the nozzles 3 are performed every time the plurality of discharge operations are performed. This allows the preliminary discharge operation to be performed quickly. [Simplified illustration] Fig. 1 is A perspective view showing a configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front view showing a configuration of a coating apparatus according to the above-described embodiment of the present invention. Fig. 3 is a view showing the coating of the above-described embodiment of the present invention. 4 is a side view showing a structure of a coating apparatus according to the above-described embodiment of the present invention. Fig. 5 is a cross-sectional view showing a partial structure of a coating apparatus according to the above-described embodiment of the present invention. Fig. 6 is a plan view showing a partial structure of a coating apparatus according to the above embodiment of the present invention. Fig. 7 is a cross-sectional view showing the structure of the -23-200914145 portion of the coating apparatus of the above-described embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 9 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 10 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 11 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 12 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 13 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 14 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 15 is a schematic plan view showing another structure of a coating apparatus according to another embodiment of the present invention. Fig. 16 is a plan view showing another configuration of a coating apparatus according to another embodiment of the present invention. [Description of main component symbols] 1 : Coating apparatus 2 : Substrate conveying section 3 : Coating section - 24 - 200914145 4 : Management section 2 1 : Coating processing zone 23 : Transporting mechanism 2 7 : Processing station 3 1 : Gate type Frame 3 2 : Nozzle 4 1 : Pre-discharge mechanism 4 1 a : Pre-discharge plate 43 : Nozzle cleaning mechanism 43 c : Pre-discharge surface 5 : Substrate R : Photoresist film - 25