JP5349770B2 - Coating apparatus and coating method - Google Patents

Description

  The present invention relates to a coating apparatus and a coating method.

  A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

As a device for applying a resist film on the surface of a substrate, a coating device for fixing a slit nozzle and applying a resist to a glass substrate that moves under the slit nozzle is known. Among these, a coating apparatus that floats and moves a substrate is known. In order to apply the resist so that the thickness is uniform on the substrate, it is necessary to keep the distance between the surface of the substrate and the tip of the nozzle for discharging the resist constant. If this distance is not kept constant at different locations on the substrate, the resist film thickness may be uneven. As a technique for avoiding such film thickness unevenness of the resist, for example, in Patent Document 1, a plate thickness sensor for measuring the plate thickness of the substrate is provided, and the substrate surface and the nozzle are determined based on the values measured by the plate thickness sensor. A method for adjusting the distance to the tip is described.
JP 2006-253216 A

  However, in the method described in Patent Document 1, since the distance between the substrate surface and the nozzle tip itself is not measured, an error may occur with respect to the actual distance. For this reason, the variation in the distance between the substrate surface and the nozzle tip may not be sufficiently avoided, and the film thickness of the resist may be uneven.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus and a coating method capable of making the thickness of a liquid material applied to a substrate more uniform.

  In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that has a nozzle that applies a liquid material to the surface of the substrate while being transported by the substrate transport unit. And a non-contact sensor that calculates a distance between the surface of the substrate and the tip of the nozzle.

  According to the present invention, the non-contact sensor that calculates the distance between the surface of the substrate and the tip of the nozzle is provided in the coating apparatus that applies the liquid material from the nozzle to the surface of the substrate while transporting the substrate. The distance between the actual surface of the substrate and the tip of the nozzle can be measured. Thereby, the thickness of the liquid applied to the substrate can be made more uniform.

In the coating apparatus, the substrate transport unit includes a coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the non-contact sensor is transported to the coating processing region. The distance between the surface of the substrate and the tip of the nozzle is calculated.
According to the present invention, the substrate transport unit has a coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the distance between the surface of the substrate transported to the coating processing region and the tip of the nozzle Therefore, the distance can be calculated in the vicinity of the substrate to which the liquid material is applied. Thereby, an accurate distance can be calculated.

The coating apparatus is characterized in that the non-contact sensor is provided on the surface side of the substrate.
According to the present invention, since the non-contact sensor is provided on the surface side of the substrate, that is, the surface side on which the liquid material is applied, a more accurate distance can be calculated.

In the coating apparatus, the non-contact sensor is provided in the coating unit.
According to the present invention, since the non-contact sensor is provided in the application part, it is easy to grasp the position of the surface of the substrate and the tip of the nozzle.

The coating apparatus is provided with a nozzle support portion that supports the nozzle, and the non-contact sensor is provided integrally with the nozzle support portion.
According to the present invention, since the nozzle support part for supporting the nozzle is provided and the non-contact sensor is provided integrally with the nozzle support part, for example, even when the nozzle moves, it is non-contact. The sensor moves integrally with the nozzle. For this reason, the position of a non-contact sensor becomes difficult to shift | deviate largely with respect to the position of a nozzle. Thereby, a more accurate calculation result can be obtained.

In the coating apparatus, a plurality of the non-contact sensors are provided, the nozzle has a nozzle opening that is long in one direction, and the plurality of non-contact sensors are along the longitudinal direction of the nozzle opening. It is arranged.
According to the present invention, a plurality of non-contact sensors are provided, the nozzle has a nozzle opening that is long in one direction, and the plurality of non-contact sensors are arranged along the longitudinal direction of the nozzle opening. The distance between the surface of the substrate and the tip of the nozzle can be calculated over the entire area where the body is discharged. Thereby, a detailed calculation result can be obtained.

In the coating apparatus, a plurality of the non-contact sensors are provided, and at least one of the plurality of non-contact sensors is formed on the substrate at a central portion in a direction orthogonal to the transport direction of the substrates. The distance between the surface and the nozzle tip is calculated.
According to the present invention, a plurality of non-contact sensors are provided, and at least one of the plurality of non-contact sensors is a distance between the surface of the central substrate in the direction orthogonal to the transport direction of the substrate and the nozzle tip. For example, the distance becomes constant by comparing the calculation result of the distance between the surface of the substrate and the tip of the nozzle in this central portion with the calculation result of the non-contact sensor provided at another position. It can be determined whether or not.

In the coating apparatus, a plurality of the non-contact sensors are provided, and at least one of the plurality of non-contact sensors is provided on an end of the substrate in a direction orthogonal to the transport direction of the substrate. The distance between the surface and the nozzle tip is calculated.
According to the present invention, a plurality of non-contact sensors are provided, and at least one of the plurality of non-contact sensors is a distance between the surface of the substrate at the end of the substrate perpendicular to the transport direction and the nozzle tip. For example, the distance becomes constant by comparing the calculation result of the distance between the surface of the substrate and the tip of the nozzle at this end with the calculation result of the non-contact sensor provided at another position. It can be determined whether or not.

In the coating apparatus, the non-contact sensor is a laser sensor.
According to the present invention, since the non-contact sensor is a laser sensor, it is possible to perform measurement with a simple configuration and a small error. Other examples of such non-contact sensors include optical sensors other than laser sensors, electrostatic capacitance sensors, and magnetic sensors. In the case of using a laser sensor, for example, the position of the substrate surface can be detected by making a laser beam incident on the substrate and detecting the reflected light.

The coating apparatus is characterized in that the laser light emission direction is inclined with respect to the normal direction of the substrate surface of the substrate.
According to the present invention, since the laser sensor is provided such that the emission direction of the laser beam is inclined with respect to the normal direction of the substrate surface of the substrate, the emission light and the reflected light do not interfere with each other. Accurate measurement is possible.

In the coating apparatus, the substrate transport unit includes a coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the coating processing region includes a laser beam from the laser sensor. Is provided with a reflection suppressing portion that suppresses reflection toward the laser sensor.
According to the present invention, the substrate transport unit has the coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the laser light from the laser sensor is reflected toward the laser sensor in the coating processing region. Therefore, it is possible to prevent the laser beam reflected in the coating processing region from being erroneously recognized as the laser beam reflected from the surface of the substrate.

In the coating apparatus, the reflection suppressing portion is made of a material containing hard alumite.
According to the present invention, since the reflection suppressing portion is made of a material containing hard alumite, it is possible to suppress the reflection of the laser beam without hindering the design of the coating processing region.

  A coating method according to the present invention is a coating method in which a liquid is applied to the surface of a substrate by a nozzle while the substrate is levitated and conveyed by jetting gas toward the substrate, and a non-contact sensor The distance between the surface of the substrate and the tip of the nozzle is calculated, and the distance is adjusted to be a predetermined value based on the calculation result.

  According to the present invention, the distance between the surface of the substrate and the tip of the nozzle is calculated by a non-contact sensor, and the distance between the surface of the substrate and the tip of the nozzle is adjusted to be a predetermined value based on the calculation result. Therefore, the distance can be adjusted based on the distance between the actual surface of the substrate and the tip of the nozzle. Thereby, the thickness of the liquid applied to the substrate can be made more uniform.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to obtain the coating device and the coating method which can make more uniform the thickness of the liquid body apply | coated to a board | substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

  Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

The substrate carry-in area 20 is a portion for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25 and a lift mechanism 26.
The carry-in stage 25 is provided on the upper portion of the frame portion 24, and is a rectangular plate-like member made of, for example, SUS in a plan view. The carry-in stage 25 has a long X direction. The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection holes 25 a and the lifting pin retracting holes 25 b are provided so as to penetrate the carry-in stage 25.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in side stage 25. For example, the air ejection holes 25a are arranged in a matrix in a plan view in a region of the carry-in stage 25 through which the substrate S passes. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25b is provided in an area of the loading side stage 25 where the substrate S is loaded. The elevating pin retracting hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member provided in the long hole, and mechanically holds the substrate loaded into the loading stage 25 from both sides.

  The lift mechanism 26 is provided on the back side of the substrate loading position of the loading stage 25. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . Reflection of light such as laser light is suppressed at a portion (reflection suppressing portion) covered with the light absorbing material in the processing stage 27. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a and a plurality of air suction holes 27b. In the processing stage 27, the air ejection holes 27a and the air suction holes 27b are alternately arranged in a matrix in a plan view in the X direction and the Y direction, and one air ejection hole 27a and one air suction hole 27b are arranged. Are provided adjacent to each other. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27.

  An air supply source (not shown) is connected to the air ejection hole 27a. This air supply source is provided with an adjustment mechanism (not shown) for adjusting the pressure and flow rate of the air ejected from the air ejection hole 27a. A pump (not shown) is connected to the air suction hole 27b. By adjusting the suction force of the pump, the suction pressure of the air supplied to the processing stage 27 can be adjusted.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The substrate carry-out area 22 is a part where the substrate S coated with resist is carried out of the apparatus, and includes a carry-out stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. The lift mechanism 29 is provided on the back side of the substrate carry-out position of the carry-out stage 28 and is supported by the frame unit 24, for example. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided in the substrate carry-in area 20. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

  The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven. The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. . The rail 23c extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyor 23a slides along the respective stages by sliding on the rail 23c. Can move.

(Applying part)
Next, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31, a nozzle 32, and a laser sensor 33.
The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a. The bridging member 31 b is a nozzle support portion that supports the nozzle 32.

  The portal frame 31 is connected to a moving mechanism 31c and is movable in the X direction. The portal frame 31 is movable between the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the portal frame 31 can move between the management unit 4. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. .

  The laser sensor 33 is a non-contact sensor that measures the distance (application gap) in the Z direction between the opening 32 a of the nozzle 32, that is, the tip of the nozzle 32 and the substrate S. A plurality of, for example, two laser sensors 33 are provided along the longitudinal direction of the bridging member 31b on the surface on the −Z direction side of the bridging member 31b, and each laser sensor 33 has a nozzle 32 via the bridging member 31b. It is fixed integrally with. The two laser sensors 33 are respectively arranged upstream of the nozzle 32 in the substrate transport direction (−X direction side).

FIG. 5 is a diagram illustrating a configuration of the side surface side in the longitudinal direction of the nozzle of the application unit 3.
As shown in the figure, each laser sensor 33 has a laser emitting portion 33a for emitting laser light and a laser light receiving portion 33b for receiving laser light.

  The laser emitting portion 33a has a light source such as a semiconductor laser, for example, and is attached to a bridging member 31b that supports the nozzle 32 so that the laser light is inclined with respect to a direction perpendicular to the substrate surface of the substrate S. ing. The laser emitting portion 33a is disposed on the resist coating surface side of the substrate S, and the resist coating surface is irradiated with laser light.

  The laser receiving unit 33b is a photoelectric element that receives laser light and converts it into an electrical signal, and is provided on the optical path of reflected light that is emitted from the laser emitting unit 33a and reflected by the resist coating surface of the substrate S in the nozzle 32. It has been. The position in the Z direction of the laser receiving part 33b is equal to the position in the Z direction of the laser emitting part 33a.

  The laser light receiving unit 33b is connected to a signal processing unit (not shown). In the signal processing unit, the distance in the Z direction between the laser emitting unit 33a and the laser receiving unit 33b and the substrate S is measured based on the electrical signal from the laser receiving unit 33b. The distance (application gap) h between the substrate S is calculated.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged onto the substrate S is constant. (Upstream in the substrate transport direction). The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, and a nozzle cleaning device 43.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The dimensions of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the columnar members 31a of the portal frame 31, and the portal frame 31 straddles each part. It can be accessed at.

  The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary ejection mechanism 41 is provided closest to the nozzle 32 so that the preliminary ejection mechanism 41 can move to the coating operation immediately after performing the preliminary ejection operation. The dip tank 42 is a liquid tank in which thinner, resist, and the like are stored. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction and a moving mechanism (not shown) that moves the cleaning mechanism. This moving mechanism is provided on the −X direction side of the cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided.

  The arrangement of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used.

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
6-9 is a top view which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 20, a resist is applied in the coating treatment region 21 while the substrate S is floated and conveyed, and the substrate S coated with the resist is carried out from the substrate carry-out region 22. . In FIGS. 6 to 9, only the outlines of the portal frame 31 and the management unit 4 are indicated by broken lines, so that the configuration of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is matched with the flying height position of the substrate, and the loading side stage 25 is also positioned. The air is ejected or sucked from the air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out stage 28, so that the air floats to the surface of each stage. Leave as supplied.

  In this state, for example, when the substrate S is transferred from the outside to the substrate carry-in position shown in FIG. 6 by a transfer arm (not shown), the elevating member 26a is moved in the + Z direction to move the elevating pin 26b from the elevating pin retracting hole 25b. Project to the surface 25c. And the board | substrate S is lifted by the raising / lowering pin 26b, and the said board | substrate S is received.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment member 25d aligns the substrate S, and the vacuum pad 23b of the transfer device 23a disposed on the −Y direction side of the substrate loading position is used as the substrate. Vacuum adsorption is performed on the end portion of S in the −Y direction. FIG. 6 shows a state in which the −Y direction side end portion of the substrate S is adsorbed.

  After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transport machine 23a is moved to the processing stage 27 along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small. In the processing stage 27, air suction is performed by the air suction hole 27b in addition to air ejection by the air ejection hole 27a, and the flying height is adjusted with higher accuracy.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

  Before the resist R is applied to the substrate S, the distance (application gap) in the Z direction between the substrate S and the tip of the nozzle 32 is calculated by the two laser sensors 33 attached to the bridging member 31b. Based on the calculation result, the application gap is adjusted by a moving mechanism provided in the support member 31a so that the application gap becomes a predetermined value set in advance. When calculating the coating gap, laser light is emitted from the laser emitting portion 33a toward the substrate S, and the laser light is reflected from the surface of the substrate S and enters the laser light receiving portion 33b. Since the stage surface 27c of the processing stage 27 is covered with hard alumite that is a light absorbing material, the laser light is not reflected by the stage surface 27c, and only the light reflected by the surface of the substrate S is incident on the laser light receiving portion 33b. It will be incident. .

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Then, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transport arm, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 10, the portal frame 31 is moved in the −X direction to the position of the management unit 4 by the moving mechanism 31 c.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted to allow the nozzle 32 to access the nozzle cleaning device 43. The nozzle cleaning device 43 discharges a cleaning liquid such as thinner toward the vicinity of the opening 32a of the nozzle 32, and discharges nitrogen gas to the opening 32a of the nozzle 32 simultaneously with the thinner as necessary, while not cleaning the cleaning mechanism (not shown). The nozzle 32 is cleaned by scanning in the longitudinal direction of the nozzle 32.

  After cleaning the nozzle 32, the nozzle 32 is accessed to the preliminary discharge unit 42. In the preliminary discharge unit 42, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary discharge surface, and the nozzle 32 is moved in the −X direction. The resist R is preliminarily discharged from the opening 32a.

  After the preliminary discharge, the portal frame 31 is returned to the original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a thinner or resist vapor atmosphere stored in the dip tank 42.

  Thus, according to this embodiment, in the coating apparatus 1 that applies a resist to the substrate S while transporting the substrate S, the laser sensor 33 that calculates the distance between the surface of the substrate S and the tip of the nozzle 32 is provided. Since it is provided, the actual distance between the surface of the substrate S and the tip of the nozzle 32 can be measured. Thereby, the distribution of the thickness of the resist applied to the substrate S can be made uniform.

  Further, according to the present embodiment, the laser sensor 33 measures the distance between the surface of the substrate S transported to the coating processing region 21 and the tip of the nozzle 32, so that the distance in the vicinity of the substrate S on which the resist is applied. Can be calculated. Thereby, an accurate distance can be calculated. Further, since the laser sensor 33 is provided on the resist coating surface side of the substrate S, a more accurate distance can be calculated.

  Further, according to the present embodiment, since the laser sensor 33 is provided integrally with the bridging member 31b that supports the nozzle 32, for example, even if the nozzle 32 moves in the Z direction or the X direction, the laser The sensor 33 moves integrally with the nozzle 32. For this reason, it is difficult for the position of the laser sensor 33 to be greatly displaced from the position of the nozzle 32. Thereby, a more accurate calculation result can be obtained.

  In addition, according to the present embodiment, since the laser sensors 33 are arranged along the longitudinal direction of the opening 32a of the nozzle 32, the entire region of the substrate S where the resist is discharged is formed on the substrate S. The distance between the surface and the tip of the nozzle 32 can be calculated. Thereby, a detailed calculation result can be obtained. In addition, by arranging the laser sensor 33 along the longitudinal direction of the opening 32a of the nozzle 32, for example, when the nozzle 32 is attached to the bridging member 31b with an inclination, the inclination of the nozzle 32 can be corrected. . When there is a difference of a certain value or more between the measured values of the plurality of laser sensors 33 arranged along the longitudinal direction, the inclination of the nozzle 32 is adjusted so that the measured values are the same.

  Further, according to the present embodiment, the distance between the surface of the substrate S at the Y-direction end and the tip of the nozzle 32 is calculated. For example, the distance between the surface of the substrate S and the nozzle 32 at the center of the Y-direction Is compared with the calculation result of the distance between the surface of the substrate S and the tip of the nozzle 32 at the end in the Y direction to easily determine whether or not the distance is constant. be able to.

  Further, according to the present embodiment, the laser sensor 33 is provided so that the emission direction of the laser light is inclined with respect to the normal direction of the substrate surface of the substrate S. Accurate measurement is possible without interference. Further, since the coating processing region 21 is provided with a reflection suppressing unit that suppresses the reflection of the laser beam from the laser emitting unit 33a of the laser sensor 33 toward the laser light receiving unit 33b. It is possible to prevent the reflected laser light from being erroneously recognized as the laser light reflected on the surface of the base S plate.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above embodiment, the laser sensor 33 is disposed on the resist coating surface side of the substrate S, but the present invention is not limited to this. For example, the laser sensor 33 may be disposed on the back side of the resist coating surface of the substrate S, for example, on the stage surface of the processing stage 27. In this case, since the laser sensor 33 is provided near the substrate S, it is possible to obtain a more effective measurement result with less error.

  In the above embodiment, the laser sensors 33 are arranged one by one at the center in the longitudinal direction of the nozzle 32 and at both ends in the longitudinal direction. However, the present invention is not limited to this. For example, only one may be disposed at the center in the longitudinal direction of the nozzle 32, or one may be disposed at both ends in the longitudinal direction of the nozzle 32 and not disposed at the center. Further, the laser sensor 33 may be attached to the portal frame 31 instead of the nozzle 32, and the position and number of the laser sensors 33 can be appropriately changed.

  In the above embodiment, the configuration in which the laser beam from the laser emitting unit 33a is obliquely incident on the surface of the substrate S has been described. However, the present invention is not limited to this. For example, the laser beam from the laser emitting unit 33a is used. A configuration may be adopted in which the light is incident perpendicular to the surface of the substrate S. In this case, for example, the distance can be measured by causing the laser beam incident on the substrate S and the laser beam reflected by the substrate S to interfere with each other.

  In the above-described embodiment, the configuration in which the laser sensor 33 is provided integrally with the bridging member 31b that supports the nozzle 32 has been described as an example. However, the configuration is not limited thereto, and for example, the laser sensor 33 and the bridging member 31b are bridged. The member 31b may be provided separately instead of being integrated. Further, the laser sensor 33 may be provided integrally with the nozzle 32 or may be provided separately from the nozzle 32. In the above embodiment, the laser sensor 33 is provided in the application unit 3. However, the present invention is not limited to this, and may be provided in a place other than the application unit 3.

  About the whole structure of the coating device 1, although it was set as the structure which arrange | positions the conveyance mechanism 23 in the -Y direction side of each stage in the said embodiment, it is not restricted to this. For example, the transport mechanism 23 may be arranged on the + Y direction side of each stage. As shown in FIG. 12, the transport mechanism 23 (transport machine 23a, vacuum pad 23b, rail 23c) is arranged on the −Y direction side of each stage, and the same as the transport mechanism 23 on the + Y direction side. The transport mechanism 53 (the transport machine 53a, the vacuum pad 53b, and the rail 53c) having the configuration described above may be arranged so that different substrates can be transported by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the transport mechanism 23 transports the substrate S1, and the transport mechanism 53 transports the substrate S2. In this case, since the substrate can be alternately conveyed by the conveyance mechanism 23 and the conveyance mechanism 53, the throughput is improved. When transporting a substrate having an area about half that of the above-described substrates S, S1, and S2, for example, the transport mechanism 23 and the transport mechanism 53 hold the substrates one by one, and the transport mechanism 23 and the transport mechanism 53 are connected. By translating in the + X direction, two substrates can be transported simultaneously. With such a configuration, throughput can be improved.

  In the above embodiment, an example in which the laser sensor 33 is mounted as a non-contact sensor in order to calculate the distance between the opening 32a of the nozzle 32 and the surface of the substrate S has been described. No. For example, an optical sensor other than the laser sensor 33 may be mounted, or of course, different types of non-contact sensors such as a capacitance sensor may be mounted.

The perspective view which shows the structure of the coating device which concerns on this embodiment. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment. FIG. FIG. FIG. FIG. FIG. The top view which shows the other structure of the coating device which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coating apparatus 2 ... Board | substrate conveyance part 3 ... Application | coating part 4 ... Management part 21 ... Application | coating process area 23 ... Conveyance mechanism 27 ... Processing stage 31 ... Portal frame 31b ... Bridging member (nozzle support part) 32 ... Nozzle 32a ... Opening Part (nozzle tip) 33 ... Laser sensor 33a ... Laser emitting part 33b ... Laser light receiving part S ... Substrate R ... Resist film

Claims (4)

A coating apparatus comprising: a substrate transport unit that floats and transports a substrate; and an application unit that includes a nozzle that applies a liquid material to the surface of the substrate while being transported by the substrate transport unit,
A non-contact sensor for calculating a distance between the surface of the substrate and the tip of the nozzle is provided;
The substrate transport unit has a coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the non-contact sensor includes the surface of the substrate and the nozzle transported to the coating processing region. To calculate the distance from the tip,
The non-contact sensor is provided on the surface side of the substrate,
Further comprising a nozzle support for supporting the nozzle, the non-contact sensor is provided integrally with the nozzle support,
A plurality of the non-contact sensors are provided, the nozzle has a nozzle opening that is long in one direction, and the plurality of non-contact sensors are arranged along the longitudinal direction of the nozzle opening,
At least one of the plurality of non-contact sensors is for calculating a distance between the surface of the substrate at a central portion in a direction orthogonal to the transport direction of the substrate and the tip of the nozzle,
At least one of the plurality of non-contact sensors calculates a distance between the surface of the substrate at the end of the substrate in a direction orthogonal to the transport direction and the tip of the nozzle.
The non-contact sensor is a laser sensor having a laser emitting part and a laser light receiving part,
The laser sensor is provided such that an emission direction of laser light from the laser emission unit is inclined with respect to a normal direction of the substrate surface of the substrate,
Said laser emitting unit and said laser light receiver, is rather equal positions in the direction orthogonal to the surface of the substrate,
The nozzle is a predetermined surface facing the surface of the substrate among the nozzle support portion, and is arranged at the center in the substrate transport direction,
The non-contact sensor is disposed on the predetermined surface and upstream of the nozzle in the substrate transport direction . The substrate transport unit has a coating treatment region in which the liquid material is coated on the surface of the substrate by the coating unit,
The coating apparatus according to claim 1, wherein a reflection suppressing unit that suppresses reflection of laser light from the laser sensor toward the laser sensor is provided in the coating processing region. The coating apparatus according to claim 2, wherein the reflection suppressing unit is made of a material containing hard alumite. A coating method in which a liquid is applied to the surface of the substrate by a nozzle while the substrate is levitated and conveyed by jetting gas toward the substrate,
A non-contact sensor for calculating a distance between the surface of the substrate and the tip of the nozzle is provided;
The substrate transport unit has a coating processing region in which the liquid material is applied to the surface of the substrate by the coating unit, and the non-contact sensor includes the surface of the substrate and the nozzle transported to the coating processing region. To calculate the distance from the tip,
The non-contact sensor is provided on the surface side of the substrate,
Further comprising a nozzle support for supporting the nozzle, the non-contact sensor is provided integrally with the nozzle support,
A plurality of the non-contact sensors are provided, the nozzle has a nozzle opening that is long in one direction, and the plurality of non-contact sensors are arranged along the longitudinal direction of the nozzle opening,
At least one of the plurality of non-contact sensors is for calculating a distance between the surface of the substrate at a central portion in a direction orthogonal to the transport direction of the substrate and the tip of the nozzle,
At least one of the plurality of non-contact sensors calculates a distance between the surface of the substrate at the end of the substrate in a direction orthogonal to the transport direction and the tip of the nozzle.
The non-contact sensor is a laser sensor having a laser emitting part and a laser light receiving part,
The laser sensor is provided such that an emission direction of laser light from the laser emission unit is inclined with respect to a normal direction of the substrate surface of the substrate,
The laser emitting portion and the laser light receiving portion are equally positioned in a direction orthogonal to the surface of the substrate,
The nozzle is a predetermined surface facing the surface of the substrate among the nozzle support portion, and is arranged at the center in the substrate transport direction,
The non-contact sensor is disposed on the predetermined surface on the upstream side in the substrate transport direction with respect to the nozzle,
A coating method, wherein the distance between the surface of the substrate and the tip of the nozzle is calculated by the non-contact sensor, and the distance is adjusted to a predetermined value based on the calculation result.

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