TWI351321B - Coating applicator - Google Patents

Description

1351321 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a coating apparatus. This case is based on the Japanese Patent Application No. 2007-178360 filed on July 6, 2007 in Japan. The content is cited here. [Prior Art]

A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed. A known coating device for applying a photoresist film on a substrate is, for example, a slit nozzle fixed to apply a photoresist to each of the glass φ substrates that are moved under the slit nozzle. In order not to cause an error in the thickness of the photoresist film due to the substrate, it is necessary to adjust the slit nozzle. For example, in the method described in Patent Document 1, the simulated discharge (pre-discharge operation) is performed by the slit nozzle, and the discharge amount of the photoresist discharged from the slit nozzle is adjusted to a predetermined amount. According to this method, the photoresist is preliminarily discharged to the upper end of the primer roller having a cylindrical dummy discharge surface, and the primer roller is rotated to move the discharge region, and the primer roller is applied. A solvent for dissolving the photoresist is disposed at the lower end, and the simulated sprayed surface is washed while performing simulated spray. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-236092. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] However, in the method described in Patent Document 1, a large amount of washing is required for the structure of the simulated scattering surface. Clean the solvent of the simulated spray surface. In view of the above circumstances, the object of the present invention is to provide a coating apparatus which can control the amount of use of the cleaning liquid for washing the preliminary discharge surface [means for solving the problem] in order to achieve the above object The coating device includes: a substrate transporting unit that transports the substrate and transports the substrate, a coating unit that applies the liquid material to the substrate that is transported by the substrate transporting unit, and the coating unit; In the preliminary discharge operation, the preliminary discharge portion of the substantially planar preliminary discharge surface of the liquid material is applied from the coating portion. According to the present invention, there is provided a substrate transporting unit that transports a substrate and transports the substrate, a coating portion that applies a liquid material to the substrate that is transported by the substrate transporting unit, and a preliminary discharge operation of the coating unit. At this time, the preliminary discharge portion of the preliminary discharge surface of the liquid material is applied from the coating portion; and the cleaning liquid is not disposed in a large amount, and the preliminary discharge can be performed. In the coating apparatus, in the vicinity of the preliminary discharge unit, a nozzle cleaning mechanism-5-13513321 for cleaning the nozzle provided in the coating unit, and drying prevention for preventing drying of the nozzle are provided. At least one of the institutions. In the present invention, when at least one of a nozzle cleaning mechanism for cleaning the nozzle provided in the application portion and a drying prevention mechanism for preventing the nozzle from being dried is provided in the vicinity of the preliminary discharge portion, The discharge state of the nozzle can be maintained when the preliminary discharge is performed. The coating device includes a management unit that is provided in combination with the preliminary discharge unit, the nozzle cleaning mechanism, and the drying prevention mechanism. In the present invention, the management unit is provided in combination with the preparation of the discharge unit, the nozzle cleaning mechanism, and the drying prevention mechanism, and the preparatory discharge operation “nozzle washing operation and drying prevention operation” can be integrated. Thereby, the discharge state of the nozzle can be maintained efficiently. In the above coating apparatus, the preliminary discharge unit has a plate-like member, and one of the plate-shaped members is used as the preliminary discharge surface. In the present invention, when the preliminary discharge portion has a plate-like member and one of the plate-like members is used as the preliminary discharge surface, the preliminary discharge operation can be performed without moving the discharged portion. Thereby, the large-sized moving mechanism is not required, and the preliminary discharge unit can be miniaturized. In the above coating apparatus, the preliminary discharge surface is disposed at a position overlapping the substrate conveyance portion as viewed from a plan view. In the present invention, when the preliminary discharge surface is disposed at a position overlapping the substrate conveyance portion from the plan view direction, the outer size of the entire coating apparatus can be reduced. -6- 1351321 In the above coating apparatus, the preliminary discharge surface may be disposed on the side of the substrate conveyance unit. In the present invention, when the preliminary discharge surface is disposed on the side of the substrate conveyance unit, The preliminary discharge surface is arranged to be easier to perform maintenance than the position in which the position is overlapped with the substrate conveyance portion when viewed from the plan view. For example, the height position of the preliminary discharge surface can be made substantially equal to the height position of the substrate. By this, the preliminary Φ discharge operation can be performed in a state closer to the environment in which the actual discharge operation is performed. In the above coating apparatus, the preliminary discharge surface may be disposed on the side of the substrate conveyance direction of the substrate conveyance unit. In the present invention, when the preliminary discharge surface is disposed on the side of the substrate conveyance portion in the substrate conveyance direction, the application portion is more easily accessed. The coating device includes a moving mechanism that relatively moves the application portion and the preliminary discharge surface. In the present invention, when the moving mechanism that allows the application portion and the preliminary discharge portion to move relative to each other φ, the application portion can be easily moved between the application portion and the preliminary discharge surface. In the above coating apparatus, the preliminary discharge unit is provided with a preliminary discharge surface cleaning mechanism for cleaning the preliminary discharge surface. In the present invention, when the preliminary discharge portion is used, the preliminary discharge surface cleaning mechanism for cleaning the preliminary discharge surface is provided. Then, for example, after the preliminary discharge has been performed, the preliminary discharge surface can be washed. Thereby, the preliminary discharge operation can be repeatedly performed on the preliminary discharge surface. In the above-described coating apparatus, the preliminary discharge surface cleaning mechanism includes: a cleaning liquid supply unit that supplies the cleaning liquid to the preliminary discharge surface by using 1353321, and the liquid state that the cleaning liquid and the preliminary discharge surface are The scraping part that is scraped together. In the present invention, the preliminary discharge surface cleaning mechanism includes a cleaning liquid supply unit for supplying the cleaning liquid to the preliminary discharge surface, and the cleaning liquid is scraped together with the liquid material on the preliminary discharge surface. When the scraping portion is used, the amount of the cleaning liquid can be reduced as much as possible, and the preliminary discharge surface can be efficiently washed. [Embodiment] Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a perspective view of the coating device 1 of the present embodiment. The main structure of the coating apparatus 1 of the present invention will be described with reference to the drawings. As shown in Fig. 1, the coating apparatus 1 of the present embodiment is, for example, coated with a photoresist on a glass substrate used for a liquid crystal panel or the like. The coating device is a substrate conveying unit 2, a coating unit 3, and a management unit 4, and is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. 1351321 (Substrate conveyance unit) _ First, the structure of the board conveyance unit 2 will be described. The substrate conveyance unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22' conveyance mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate carry-in region 20, the coating processing region 21, and the substrate carry-out region 22 by the transport mechanism 23. The substrate carrying-in region 20, the coating processing region 21_, and the substrate carrying-out region 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 23 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22. Hereinafter, in explaining the structure of the coating apparatus 1, the directions in the drawings will be described using XYZ coordinates for ease of display. The direction of the long axis of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) observed from the plan view is referred to as the Y direction. Φ The direction perpendicular to the plane including the X-axis and Y-axis is denoted as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction. The substrate loading area 20 is a portion into which the substrate S conveyed from the outside of the apparatus is carried, and includes a loading side table 25 and a lifting mechanism 26. The loading side table 2 5 ′ is provided in the upper portion of the frame portion 24, and is, for example, a plate-like member which is formed of SUS or the like and has a rectangular shape as viewed in a plan view. The moving side table 2 5 ' has a long axis in the X direction. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of lifting pin insertion holes 25b. The 1351321 air ejection hole 25a and the lift pin exit hole 25b are provided as a through-side table 2 5 » air ejection hole 25a, and are holes for ejecting air onto the loading side table 25 surface 25c, for example, in the loading side table 25. The substrate S is disposed in a matrix shape as viewed in plan view. The air ejection hole is followed by an air supply source (not shown). The loading side table 25 allows the substrate S to face the +Z side by the air ejected from the air ejection hole 25a.

The lift pin exit hole 25b is an area that is placed in the carry-in side table 25. The lift pin has a hole 25b so that the air supplied to the table does not leak. Each of the loading side tables 25 has a calibration device 25d at both ends in the Y direction. The calibration device 25d is a device for positioning the substrate S carried into the transport 25. Each of the aligning devices 25d has a hole portion and a positioning member (not shown) provided in the long hole portion, and φ is mechanically sandwiched from both sides of the substrate of the loading side table 25. The elevating mechanism 26 is provided on the back side of the substrate on which the loading side table 25 is carried. The elevating mechanism 26 has a lifting member 26a and a lift pin 26b. The elevating member 26a is connected to a drive (not shown), and the elevating member 26a is directed toward the Z by the driving of the drive mechanism. A plurality of lift pins 26b are erected from the upper surface of the elevating member 26a toward the side table 25. Each of the lift pins 26b is disposed at a position overlapping with the lift pin exit hole 25b from the downward view. When the borrowing and lowering member 26a is moved in the Z direction, the lift pins 26b are connected from the space 25a that is lifted up and loaded by the table to the surface of the substrate S. The moving mechanism is moved to the moving direction by the lifting pin -10- 1351321 and the hole 25b is absent on the table surface 25c. The ends of the respective lifting pins 26b in the +Z direction are set to the positions in the Z direction, respectively. In agreement, the substrate S transported from the outside of the apparatus can be kept in a horizontal state. The coating treatment region 21 is a portion where the coating process of the photoresist is performed, and a processing table 27 that floats and supports the substrate S is provided.

The processing table 27' is a plate-like member that is rectangular in plan view when the light-absorbing material having a hard aluminum oxide film as a main component is applied to cover the land surface 27c, and is provided on the +X direction side with respect to the loading side table 25. A portion (reflection suppressing portion) covered with the light absorbing material in the processing table 27 suppresses reflection of light such as laser light. In the processing table 27, the Y-direction is the long axis. The dimension of the processing table 27 in the Y direction is substantially the same as the dimension of the loading-side table 25 in the Y direction. The processing table 27 is provided with a plurality of air ejection holes 27a and a plurality of air suction holes 27b. In the processing table 27, the air ejection holes 27a and the air suction holes 27b are alternately arranged in the X direction and the Y direction so as to be arranged in a matrix shape in plan view, and one air ejection hole 27a is provided adjacent to one air suction hole 27b. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. An air supply source (not shown) is connected to the air ejection hole 27a. The air supply source is provided with an adjustment mechanism (not shown) for adjusting the pressure or flow rate of the air ejected from the air ejection hole 27a. A pump (not shown) is connected to the air suction hole 27b. By adjusting the suction force of the pump, the suction pressure of the air supplied to the processing table 27 can be adjusted. In the processing table 27, the pitch of the air ejection holes 27a is narrower than the distance between the air ejection holes 25a of the loading side table 25 in the installation -11 - 1351321, and the air ejection holes 27a are provided in comparison with the loading side table 25. Closer. Therefore, the amount of floating of the substrate can be adjusted at a higher accuracy than the other stages, and the amount of floating of the substrate can be controlled to, for example, 1 μm or less, and preferably 50 μm or less.

The substrate carry-out area 22 is a portion for carrying out the substrate S coated with the photoresist to the outside of the apparatus, and has a carry-out side table 28 and an elevating mechanism 29. The carry-out side stand 28 is provided on the +X direction side with respect to the processing table 27, and is composed of substantially the same material and size as the carry-in side stand 25 provided in the substrate carry-in area 20. Similarly to the loading side table 2 5, the unloading side table 28 is provided with an air ejection hole 28a and a lift pin exit hole 28b. The elevating mechanism 29 is provided on the back side of the substrate carrying-out position of the carry-out side stand 28, for example, supported by the frame portion 24. The elevating member 29a and the lift pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided in the substrate loading area 20. When the substrate S on the carry-out side table 28 is carried out to the external device, the lift mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate s. The transport mechanism 23 has a transporter 23a and a vacuum. Pad 23b, track 23c. The carrier 23a has a structure in which, for example, a linear motor is provided, and the linear motor is driven to move the transporter 23a on the rail 23c. The transporter 23a is configured to view a predetermined portion 23d in a plan view. It overlaps the end of the substrate S in the -Y direction. The portion 2 3d overlapping the substrate S is disposed at a position lower than the height position of the back surface of the substrate -12-1351321 when the substrate S is floated.

The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23 b can hold the substrate S by allowing the adsorption surface to adsorb the back end portion of the substrate S. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 2 3 c is extended on the side of the loading side table 25, the processing table 27, and the unloading side table 28, and the carrier 23a can be moved along the rail 23c by sliding on the side of each of the stages. The movement of each of the stages (applicator) Next, the structure of the application unit 3 will be described. The application portion 3' is a portion for applying a photoresist on the substrate S, and has a gate frame 31 and a nozzle 32. The portal frame 31 has a pillar member 3ia and a bridge member 31b that are disposed to straddle the processing table 27 in the Y direction. Each of the pillar members 31a is provided on the Y-direction side of the processing table 27, and each of the pillar members 31a is supported by both side faces of the frame portion 24 on the Y-direction side. Each of the strut members 31a' is disposed such that the height positions of the upper end portions thereof coincide. The bridging member 31b is bridged between the upper end portions of the respective strut members 31a, and is movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction -13 - 1351321. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided to the portal frame 31 can be moved between it and the management portion 4. The door frame 31 can also be moved in the Z direction by a moving mechanism (not shown).

The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 31b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a' is provided along the long axis direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. In the nozzle 32, the longitudinal direction of the opening 32a is parallel to the Y direction, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the longitudinal direction is smaller than the dimension of the substrate S to be transported in the Y direction, and the photoresist is not applied to the peripheral region of the substrate S. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening 3 2 a is provided, and a flow of the photoresist (not shown) is connected to the flow path. The photoresist supply source has, for example, a pump (not shown), and the photoresist is discharged from the opening portion 3 2a by pushing the photoresist φ agent to the opening portion 3 2a by the pump. The column member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridge member 31b is moved in the Z direction by the moving mechanism. Alternatively, the bridge member 31b may be mounted with an induction for measuring the distance in the Z direction between the opening portion 32a of the nozzle 32, that is, the front end of the nozzle 32 and the opposing surface facing the nozzle tip. 3 3 . (Management Department) Explain the structure of the management unit 4 -14 - 1351321

The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is provided in the substrate transport unit 2 with respect to the application unit. The -X direction side of 3 (the upstream side of the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41 as a preliminary discharge unit, a immersion tank 42 as a drying prevention mechanism for preventing nozzle drying, and a nozzle cleaning device 43 as a nozzle cleaning mechanism, and accommodates these structures. The accommodating portion 44 and the holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a. Fig. 5 is a cross-sectional view showing the structure inside the housing member 44 of the management unit 4. As shown in the figure, the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 are arranged in the _X direction side in this order. The sizes of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance Φ between the pillar members 31a of the door frame 31, and the door frame 31 is spanned. Partial access. The preliminary discharge mechanism 4 1 is a portion that preliminarily discharges the photoresist, and has a preliminary discharge plate 41a and a preliminary discharge surface cleaning unit 41b. The preliminary discharge mechanism 41 is disposed closest to the nozzle 32, and can immediately move to the coating operation after the preliminary discharge operation. The immersion tank 42 is a liquid tank "nozzle cleaning device 43 in which a solvent such as a diluent is stored therein, and is a device for rinsing the vicinity of the opening 32a of the nozzle 32, and has a pattern that moves in the Y direction. The cleaning mechanism shown and the moving mechanism (not shown) for moving the cleaning mechanism. The moving mechanism is disposed on the side of the -X direction of the washing machine -15 - 1351321. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42 by the portion in which the moving mechanism is provided. Of course, the arrangement of the nozzle discharge device 43 and the immersion tank 42' nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used. Fig. 6 is a plan view showing the structure of the preliminary discharge mechanism 41.

The preliminary discharge plate 41a is a plate-like member made of a material such as stone or the like, and its longitudinal direction (Y direction) coincides with the longitudinal direction of the nozzle 32. The surface on the +Z direction side of the preliminary discharge plate 41a is a preliminary discharge surface 41c from which a photoresist is discharged. The preliminary discharge surface 41c is formed in a flat shape and is parallel to the XY plane in the drawing. The preliminary discharge surface cleaning unit 41b is a portion for washing the preliminary discharge surface 41c, and is provided so as to be movable in the Y direction by a moving mechanism (not shown). As shown in Fig. 7, the preliminary discharge surface cleaning unit 41b has a cleaning liquid supply unit 4 1 e and a squeegee (scraping unit) 4 1 f. Cleaning liquid 0 The supply unit 4 1 e is for supplying the cleaning liquid to the preliminary discharge surface 4 1 c, and the squeegee 41f is slid together with the cleaning liquid to the preliminary discharge surface 41c. The squeegee 41f is inclined at a predetermined angle with respect to the preliminary discharge surface 41c by, for example, about 45 degrees. Next, the operation of the coating apparatus 1 having the above configuration will be described. Figs. 8 to 11 are plan views showing the operation of the coating device 1. The action of applying a photoresist to the substrate S will be described with reference to the respective drawings. In this operation, the substrate S is carried into the substrate loading area 20, the substrate S is floated and transported, and a photoresist is applied to the coating processing region 21 to apply the substrate S to which the photoresist has been applied. The substrate carry-out area 22 is carried out. No. -16-

1351321 8 to 11 show the configuration of the wheel judging nozzle 32 and the processing table 27 of the gantry frame 3i only by broken lines. The following is a detailed description of the fine action. Stand by before loading the substrate into the substrate loading area 20. Specifically, the transporter 23a is disposed on the substrate loading side of the loading side table 25, and the height of the height of the vacuum pad 23b is raised, and the air ejecting hole 27a of the processing table 27 is taken from the loading side table 25a. The air blowing holes 28 8 a of the air suction side table 28 are respectively ejected from the air to supply the air to the surface on which the substrate is floated on the surface of each of the table portions, for example, by a transport arm or the like (not shown). When the substrate S is transported from the outside to the lift member 26a shown in the substrate loading position map, the lift pin 26b is lifted from the lift pin exit hole 25b to the table by the lift pin 26b. The substrate S is lifted up to perform the substrate S. On the other hand, the positioning member protrudes from the long hole of the aligning device 25d so as to be received by the receiving substrate S, and the lowering member 26a is lowered into the lifting pin opening hole 25b. Since there is an air layer on the stage, the substrate S is maintained in a state where the phase 25c is floated by the air. When the substrate S reaches the positioning member of the surface leveling device 25d of the air layer to position the substrate S, the vacuum of the carrier 23a disposed at the -Y direction side of the in-position position is adsorbed to the -Y-direction side end portion of the substrate S. In Fig. 8, the position of the -Y side of the detailed coating device 1 & is positioned in the air ejection hole 27b and the state of being moved or sucked. As shown in Fig. 8, the i-plane 2 5 c shown in the second and second figures is made. When the transfer operation surface 25c is formed to form the lift pin surface 25c on the surface of the table, the substrate-loading pad 23b is shown to be in a state in which the -Y direction side end portion of the substrate S is adsorbed. After the suction side of the substrate S is sucked by the vacuum pad 23b, the carrier 23a is moved along the rail 23c. Since the substrate S is in a floating state, even if the driving force of the carrier 23a is small, the substrate S can smoothly move along the track 2 3 c.

When the leading end of the substrate S in the conveyance direction reaches the position of the opening portion 3 2a of the nozzle 32, as shown in Fig. 9, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 and transporting the substrate S while transporting the substrate 23a. With the movement of the substrate S, the photoresist film R is applied onto the substrate S as shown in Fig. 1 . The resist film R is formed in a predetermined region of the substrate S by passing the substrate S through the lower surface of the opening 32a of the photoresist. The substrate S on which the photoresist film R is formed is conveyed toward the carry-out side table 28 by the transporter 23a. In the state in which the carry-out side table 28 is floated on the table surface 28c, the substrate S is transported to the substrate carry-out position as shown in Fig. 11 . When the substrate S reaches the substrate carrying-out position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. Then, the lift pin 29b protrudes from the lift pin exit hole 28b toward the back surface of the substrate S, and the substrate S is lifted by the lift pin 29b. In this state, for example, the external transfer arm provided at the +X direction side of the carry-out side table 28 is received by the carry-out side stand 28 to receive the substrate S. After the substrate S is transferred to the transport arm, the transporter 23a is returned to the substrate loading position of the loading side table 25, and stands by until the next substrate S is to be transported. In the application unit 3, a preliminary discharge operation for holding the discharge state of the nozzle 32 is performed while the next substrate S is not being conveyed. As shown in Fig. 12, the portal frame 31 is moved to the position of the management unit 4 in the -X direction.

After the door frame 31 is moved to the position of the management unit 4, as shown in Fig. 14, the position of the door frame 31 is adjusted to connect the nozzle 32 to the nozzle cleaning device 43. In the nozzle cleaning device 43, the cleaning liquid such as the diluent is discharged toward the vicinity of the opening 32a of the nozzle 32, and if necessary, the nitrogen gas and the diluent are simultaneously discharged to the opening 32a of the nozzle 32, and at the same time, the management unit is 4 is scanned toward the long axis direction of the nozzle 32, and the photoresist adhering to the nozzle 32 is removed. After the nozzle 3 2 is cleaned, as shown in Fig. 14, the nozzle 3 2 is connected to the dipping tank 42. In the dipping tank 42, the nozzle 32 is prevented from drying by exposing the opening portion 32a of the nozzle 32 to the vapor environment of the solvent (diluent) stored in the dipping tank 42. On the other hand, the drying prevention processing does not need to be performed every time the preliminary discharge operation is performed, and the processing can be skipped and moved to the next processing. After the drying prevention process of the nozzle 32 is performed (after the nozzle 32 is not connected, the nozzle 32 is cleaned), as shown in Fig. 14, the nozzle 32 is connected to the preliminary discharge mechanism 41. . In the preliminary discharge mechanism 41, the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is moved in the -X direction while moving the opening 32a of the nozzle 32 to a predetermined position in the Z direction. The photoresist R is prepared to be discharged from the opening portion 32a toward the preliminary discharge surface 41c. After the preliminary discharge operation, the preliminary discharge surface 41c is washed by the preliminary discharge surface cleaning unit 41b-19-135121. Specifically, the squeegee 41f is brought into contact with the preliminary discharge surface 41c, and the cleaning liquid supply unit 41e is supplied with the cleaning liquid, and the preliminary discharge surface cleaning unit 41b is oriented in the +Y direction of the preliminary discharge surface 41c or Scan in the Y direction. The photoresist is removed from the preliminary discharge surface 41c by the cleaning liquid, and the removed photoresist and the cleaning liquid are scraped off the outside of the preliminary discharge surface 4 1 c by the squeegee 41f. At the same timing as the start washing operation of the preliminary discharge surface cleaning unit 41b, the portal frame 31 is returned to the original position. When the next substrate S is to be transported, as shown in Fig. 13, the nozzle 32 is moved to a predetermined position in the Z direction by a moving mechanism (not shown). By applying the coating operation of the photoresist film R and the preliminary discharge operation to the substrate S, a favorable photoresist film R is formed on the substrate S. According to the present embodiment, the substrate transport unit 2 that transports the substrate S and transports the coated portion 3 that applies the liquid material to the substrate S that is transported by the substrate transport unit 2, and the coated portion 3 In the preparation φ of the cloth portion 3, the preliminary discharge mechanism 41 of the preliminary discharge surface 41c of the liquid surface is applied from the application portion 3 during the discharge operation; and the cleaning liquid is not disposed in a large amount, so that the preliminary discharge can be performed. The preliminary discharge mechanism 41 has a preliminary discharge plate 41a formed of a plate-like member, and one of the preliminary discharge plates 41a is used as the preliminary discharge surface 41c, so that the discharge area of the preliminary discharge plate 41a can be moved without being moved. action. Thereby, the large-sized moving mechanism is not required, and the preliminary discharge mechanism 41 can be downsized. Since the preliminary discharge surface 41c is disposed at a position overlapping the substrate conveyance unit 3 as viewed in a plan view, the overall size of the coating apparatus 1 can be reduced. -20- 1351321 According to the present embodiment, as shown in Fig. 5, a management unit 4 is provided which is provided in the vicinity of the preliminary discharge mechanism 41: nozzle washing for cleaning the nozzle 32 Since the cleaning device 43 and the immersion tank 42 for preventing the nozzle 32 from drying are integrated, the preliminary discharge operation, the cleaning operation of the nozzle 32, and the drying prevention operation of the nozzle 32 can be integrated. Thereby, the discharge state of the nozzle 3 2 can be maintained efficiently.

According to the present embodiment, as shown in FIG. 6, the preliminary discharge mechanism 41 is provided with a preliminary discharge surface cleaning unit 41b for cleaning the preliminary discharge surface 41c. Therefore, for example, after the preliminary discharge operation is performed, The preliminary discharge surface 41c can be washed. Thereby, the preliminary discharge operation can be reversed on the preliminary discharge surface 41c. As shown in Fig. 7, the preliminary discharge surface cleaning unit 41b includes a cleaning liquid supply unit 41e that supplies the cleaning liquid to the preliminary discharge surface 41c, and a cleaning liquid and a preliminary discharge surface 41c. Since the squeegee 4 1 f is scraped together with the liquid, the amount of the cleaning liquid can be reduced as much as possible, and the preliminary discharge surface 4 1 c can be efficiently washed. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention. In the above-described embodiment, the management unit 4 is disposed at a position overlapping the substrate transport unit 2 as viewed from a plan view. The present invention is not limited thereto. For example, as shown in FIG. 15, the management unit 4 may be disposed at + Side 4a in the X direction. As shown in the figure, it may be disposed on the side 4 b ' 4 c of the board conveying portion 2 in the Y direction. In the entire configuration of the coating apparatus 1, in the above-described embodiment, the transport mechanism 23 is disposed on the -Y direction side of each of the stages, and is not limited to -21 - 1351321. For example, the transport mechanism 23 may be disposed on the +Y direction side of each of the stages. On the other hand, as shown in Fig. 16, the transport mechanism 23 (the transporter 23a, the vacuum cushion 23b, and the rail 23c) may be disposed on the side of the cymbal direction, and the transport mechanism 23 may be disposed on the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum cushion 53b, and the rail 53c) having the same structure can transport different substrates by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the substrate S1 is transported by the transport mechanism 23, and the base φ plate S2 is transported by the transport mechanism 53. In this case, the substrate can be transported by the transport mechanism 23 and the transport mechanism 53 to increase the productivity. On the other hand, when the substrate having the area of half of the substrates S, SI, and S2 is to be transported, for example, the transport mechanism 23 and the transport mechanism 53 are each held one by one, and the transport mechanism 23 and the transport mechanism 53 are moved toward the + When the X direction is in the same direction, it is possible to carry two substrates at the same time. With this configuration, productivity can be improved. In the above-described embodiment, the position of the preliminary discharge surface 41c is fixed when the preliminary discharge is performed, and the nozzle 32 is moved toward the X side φ by the moving mechanism 31c. The present invention is not limited thereto, and the nozzle 32 and the preliminary discharge surface 41c are If you move relatively, you can use other actions. For example, the nozzles 3 2 may be fixed, and the accommodating members 44 accommodating the preliminary discharge plates 41a may be moved. The nozzles 32 and the accommodating members 44 may be moved. In the above-described embodiment, the surface on the +Z direction side of the preliminary discharge plate 41a is used as the preliminary discharge surface 41c. The front discharge surface 41c is not limited thereto, and the preliminary discharge surface 41c may have a substantially flat surface and may have another structure. For example, the preliminary discharge plate 41a is not provided, and the bottom surface of the storage member accommodating the respective components of the management unit 4 is used as a preliminary discharge surface, and the bottom surface of the accommodating member may be directly discharged. In the above-described embodiment, the respective portions of the nozzle cleaning device 43, the immersion tank 42, and the preliminary discharge mechanism 41 are arranged as the management unit 4, and the present invention is not limited thereto, and the respective portions may be disposed separately. For example, only the preparatory discharge mechanism 41 may be disposed in the vicinity of the nozzle 32, and the nozzle cleaning device 43 and the immersion tank 42 may be disposed in the management unit 4. In this case, for example, a plurality of preliminary discharge operations are continuously performed, and the cleaning and drying prevention processing of the nozzles 32 are performed every time the plurality of discharge operations φ are performed. Thereby, the preliminary discharge operation can be performed quickly. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the configuration of the coating apparatus of the above embodiment of the present invention. Fig. 3 is a plan view showing the configuration of the coating apparatus of the above embodiment of the present invention. * Fig. 4 is a side view showing the construction of the coating apparatus of the above embodiment of the present invention. Fig. 5 is a cross-sectional view showing a partial structure of a coating apparatus according to the above embodiment of the present invention. Fig. 6 is a plan view showing a partial structure of a coating apparatus according to the above embodiment of the present invention. Fig. 7 is a cross-sectional view showing the structure of the portion -23-1351321 of the coating apparatus of the above-described embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 9 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 10 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 11 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 12 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 13 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 14 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 15 is a schematic plan view showing another structure of a coating apparatus according to another embodiment of the present invention. Fig. 16 is a plan view showing another structure of a coating apparatus according to another embodiment of the present invention. [Explanation of main component symbols] 1 : Coating apparatus 2 : Substrate conveying section 3 : Coating section - 241-353321 4 : Management section 2 1 : Coating processing zone 23 : Transporting mechanism 2 7 : Processing station 3 1 : Gate type Frame 32: Nozzle 41: Pre-discharge mechanism

4 1 a : Prepared spit plate 4 3 : Nozzle cleaning mechanism 43c: Prepared discharge surface 5 : Substrate R : Photoresist film

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Claims (1)

1351321. Patent Application No. 1. A coating apparatus characterized by having: a substrate conveying unit that floats a substrate and transports the liquid, and applies a liquid material to the substrate conveyed by the substrate conveying unit; The application portion and the preliminary discharge portion that applies the substantially planar preliminary discharge surface of the liquid material from the coating portion when the application portion is in the preliminary discharge operation. 2. The coating device according to claim 1, wherein a nozzle cleaning mechanism for cleaning a nozzle provided in the coating portion and a nozzle for preventing drying of the nozzle are provided in the vicinity of the preliminary discharge portion. At least one of the drying prevention mechanisms. 3. The coating apparatus according to claim 2, further comprising: a management unit that is provided in combination with the preliminary discharge unit, the nozzle cleaning mechanism, and the drying prevention mechanism. 4. The coating apparatus according to claim 1, wherein the preparation-discharging portion has a plate-like member. One of the plate-shaped yak is used as the preliminary discharge surface. 5. The coating apparatus according to claim 1, wherein the preliminary discharge surface is disposed at a position overlapping the substrate conveyance portion as viewed in a plan view. 6. The coating apparatus according to claim 1, wherein the preliminary discharge surface is disposed on a side of the substrate conveyance unit. The coating apparatus according to the first aspect of the invention, wherein the preliminary discharge surface is disposed on a side of the substrate conveyance unit in the substrate conveyance direction. 8. The coating apparatus according to claim 1, comprising: a moving mechanism capable of relatively moving the coating portion and the preliminary discharge surface; 9. The coating device according to claim 1, wherein The preliminary discharge unit is provided with a preliminary discharge surface cleaning mechanism that cleans the preliminary discharge surface. 10. The coating apparatus according to claim 9, wherein the preliminary discharge surface cleaning mechanism includes: a cleaning liquid supply unit that supplies the cleaning liquid to the preliminary discharge surface; and the cleaning liquid and the A scraping portion that scrapes off the liquid body on the discharge surface together. -27-