T361727 九、發明說明 【發明所屬之技術領域】 本發明是關於塗佈裝置及塗佈方法。 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上，形成 有配線圖案或電極圖案等的細微圖案。一般來說這種圖案 ，是用例如光微影技術等方法所形成。在光微影技術中， 分別進行：在玻璃基板上形成光阻膜的步驟、將該光阻膜 進行圖案曝光的步驟、及之後將該光阻膜予以顯影的步驟 〇 已知的作爲在基板的表面上塗佈光阻膜的塗佈裝置， 是將狹縫噴嘴固定，藉由機械人等將玻璃基板搬運於該狹 縫噴嘴下，對於該玻璃基板塗佈光阻劑。而因爲近年來， 基板的尺寸大型化至2mx 2m以上，所以在機械人所進行 的搬運方面，會有處理作業線變長的問題。因此，已知的 塗佈裝置，是藉由將氣體噴出到載台上，來使基板浮起移 動，而使處理作業線縮短（例如，參考專利文獻1)。 [專利文獻1] 日本特開2005-236092號公報 【發明內容】 [發明欲解決的課題] 可是，處理作業線更加縮短化的需求更多，所以當然 σ -4- 1361727 必須要求處理作業線的縮短化。 鑑於以上的情形，本發明的目的，是要提供一種可將 處理作業線縮短化的塗佈裝置及塗佈方法。 [用以解決課題的手段] 爲了達成上述目的，本發明具有以下的構造。 (1) 是具備有：使基板浮起來進行搬運的基板搬運部、及 具有在藉由該基板搬運部搬運基板的同時對上述基板塗佈 液狀體的噴嘴的塗佈部的塗佈裝置，其特徵爲：在上述塗 佈部，設置有：對於上述噴嘴分別壓送上述液狀體的複數 的泵浦。 藉由（1)的裝置，設置有：對於塗佈部的噴嘴分別壓送 液狀體的複數的泵浦，所以即使在藉由複數的泵浦其中一 個泵浦充塡液狀體的期間，也不會浪費時間，也能藉由其 他泵浦來供給液狀體。 (2) 在（1)的塗佈裝置，在上述塗佈部設置有複數的噴嘴。 藉由（2)的裝置，在塗佈部設置有複數的噴嘴，所以在 複數的噴嘴其中一個噴嘴充塡液狀體的期間，能藉由其他 噴嘴塗佈液狀體。藉此，即使在液狀體的充塡期間也不會 浪費時間，也能對基板上供給液狀體。 (3) 在（2)的塗佈裝置，是對應於複數的上述噴嘴的各個， 來設置上述泵浦。 -5- 1361727 藉由（3)的裝置，是對應於複數的噴嘴的各個，來設置 泵浦，所以對複數的噴嘴的各個能個別充塡液狀體。藉此 能減少泵浦的負擔。 (4) 在（2)或（3)的塗佈裝置，複數的上述噴嘴是沿著上述基 板搬運部的基板搬運方向排列。 藉由（4)的裝置，複數的噴嘴是沿著基板搬運部的基板 搬運方向排列，所以當從各個噴嘴吐出液狀體時，只要使 噴嘴平行移動即可完成，不需要使其旋轉移動。因此，能 將液狀體容易地吐出到基板上。 (5) 在（1)〜（4)其中之一的塗佈裝置，從複數的上述泵浦的 各個到上述噴嘴的液狀體搬運路線的長度，是互相大致相 同。 藉由（5)的裝置，從複數的泵浦的各個到噴嘴的液狀體 搬運路線的長度，是互相大致相同，所以能使各個泵浦〜 噴嘴間的液狀體搬運路線的條件大致相同。藉此，能將液 狀體穩定吐出到基板上。 (6) 在（1)〜（5)其中之一的塗佈裝置，將複數的上述泵浦配 置在：相對於上述噴嘴爲互相大致相等距離的位置。 藉由（6)的裝置，將複數的泵浦配置在：相對於噴嘴爲 互相大致相等距離的位置，所以能使各個泵浦〜噴嘴間的 液狀體搬運路線的條件大致相同。藉此，能將液狀體穩定 -6- Γ361727 吐出到基板上。 (7)在（1)〜（6)其中之一的塗佈裝置’將複數的上述泵浦配 置在：可自由升降地支承上述噴嘴的框架部。 藉由（7)的裝置，將複數的泵浦配置在：可自由升降地 支承噴嘴的框架部，所以能配合噴嘴的升降來使泵浦升降 。藉此，能將泵浦〜噴嘴間的液狀體搬運路線的狀態保持 爲一定，所以能將液狀體穩定吐出到基板上。除此之外’ 能夠縮短泵浦與噴嘴之間的距離，因而能減輕泵浦的負擔 (8) 在（7)的塗佈裝置，將複數的上述泵浦配置在：上述框 架部之中的上述基板搬運方向的上游側。 藉由（8)的裝置，將複數的栗浦配置在：框架部之中的 基板搬運方向的上游側，所以能以穩定的狀態安裝各泵浦 〇 (9) 在（7)的塗佈裝置，將複數的上述泵浦配置在：上述框 架部之中的上述基板搬運方向的下游側。 藉由（9)的裝置，將複數的泵浦配置在：框架部之中的 基板搬運方向的下游側，所以能以穩定的狀態安裝各泵浦 (10)在（7)的塗佈裝置，上述框架部具有：設置在上述基板 1361727 搬運部的上空的樑構件、及支承上述樑構件的柱構件；將 複數的上述泵浦安裝於上述樑構件。 藉由（ίο)的裝置’框架部具有：設置在基板搬運部的 上空的樑構件、及支承該樑構件的柱構件；將複數的泵浦 安裝於樑構件，所以能以穩定的狀態安裝各栗浦。 (11) 在（10)的塗佈裝置’將複數的上述泵浦安裝在上述樑 構件的上面的大致中央部。 藉由（11)的裝置，將複數的泵浦安裝在樑構件的上面 的大致中央部’所以能將從噴嘴到泵浦的液狀體搬運路線 縮短。 (12) 在（7)的塗佈裝置’上述框架部具有：設置在上述基板 搬運部的上空的樑構件、及支承上述樑構件的柱構件；將 複數的上述泵浦安裝於上述框架部的柱構件。 藉由（12)的裝置’框架部具有：設置在基板搬運部的 上空的樑構件、及支承樑構件的柱構件；將複數的栗浦安 裝於框架部的柱構件’所以能以穩定的狀態安裝各泵浦。 (13) 在（1)〜（6)其中之一的塗佈裝置，具備有：支承複數 的上述泵浦的泵浦用框架部，將上述泵浦用框架部相對於 上述噴嘴配置在上述基板搬運方向的前側。 藉由（13)的塗佈裝置，具備有：支承複數的泵浦的栗 浦用框架部，將泵浦用框架部相對於噴嘴配置在基板搬運 -8 - Γ361727 - 方向的前側，所以能使泵浦的振動不易傳達到液狀 後的基板。 (14)在（1)〜（13)其中之一的塗佈裝置，上述基板搬 具備有：在基板載置面具有複數的氣體噴出孔的第 裝置、以及設置成與上述塗佈部相對向，在基板載 有複數的氣體噴出孔及複數的氣體吸入孔的第二載 藉由（14)的裝置，基板搬運部是具備有：在基 面具有複數的氣體噴出孔的第一載台裝置、以及設 塗佈部相對向，在基板載置面具有複數的氣體噴出 數的氣體吸入孔的第二載台裝置：所以在塗佈部能 地調整基板的浮起量。 (15)在（1)〜（14)其中之一的塗佈裝置，具備有預備 ，該預備吐出部具有：當進行上述塗佈部的預備吐 時，從上述塗佈部塗佈上述液狀體的大致平面的預 面。 藉由（15)的裝置，具備有預備吐出部，該預備 具有：當進行塗佈部的預備吐出動作時，從塗佈部 狀體的大致平面的預備吐出面，所以可在基板上塗 良好之液狀體的膜。 (16)是使基板浮起來進行搬運，且同時將藉由泵浦 體塗佈 運部是 一載台 置面具 台裝置 ttr 很載置 置成與 孔及複 更精細 吐出部 出動作 備吐出 吐出部 塗佈液 佈狀態 所壓送 -9- 1361727 的液狀體從噴嘴吐出來塗佈於上述基板的方法，是具有： 將上述液狀體充塡到與吐出上述液狀體的噴嘴連接的第一 泵浦的步驟、將上述基板搬入到上述噴嘴的前面的步驟、 以及從上述第一泵浦將上述液狀體壓送到上述噴嘴，從上 述噴嘴將上述液狀體吐出到上述基板上，且同時將上述液 狀體充塡到與上述噴嘴連接的第二泵浦的步驟。 藉由（16)的塗佈方法，將液狀體充塡到與吐出液狀體 的噴嘴連接的第一泵浦，將基板搬入到噴嘴的前面，從第 一泵浦將液狀體壓送到噴嘴，從噴嘴將液狀體吐出到基板 上，且同時將液狀體充塡到與噴嘴連接的第二泵浦，所以 即使在藉由複數的泵浦其中一個泵浦充塡液狀體的期間， 也不會浪費時間，也能藉由其他泵浦來供給液狀體。 (17) 在（16)的塗佈方法，是具有：接著已塗佈上述液狀體 的第一上述基板’將第二上述基板搬運到上述噴嘴的前面 的步驟、以及從上述第二泵浦將上述液狀體壓送到上述噴 嘴’從上述噴嘴將上述液狀體吐出到上述第二基板上的步 驟。 藉由（17)的塗佈方法，接著已塗佈液狀體的第一基板 ’將第二基板搬運到噴嘴的前面，從第二泵浦將液狀體壓 送到噴嘴’從噴嘴將液狀體吐出到第二基板上，所以能不 會浪費時間地進行塗佈動作。 (18) 在（17)的塗佈方法’在將上述液狀體吐出到上述第二 -10- 1361727 基板上的步驟，將上述液狀體充塡到上述第一泵浦 藉由（18)的塗佈方法，在將液狀體吐出到第二 的步驟，將液狀體充塡到第一泵浦，所以能交互地 一泵浦與第二泵浦。藉此能不會浪費時間而連續地 佈動作。 (19)是使基板浮起來進行搬運，且同時將液狀體塗 述基板的方法，是具有：將上述液狀體充塡到與吐 液狀體的第一噴嘴連接的第一栗浦的步驟、將第一 板搬入到上述第一噴嘴的前面的步驟、從上述第一 上述液狀體壓送到上述第一噴嘴，從上述第一噴嘴 液狀體吐出到上述第一基板上，且同時將上述液狀 到與第二噴嘴連接的第二泵浦的步驟、將第二上述 入到上述第二噴嘴的前面的步驟、以及從上述第二 上述液狀體壓送到上述第二噴嘴，從上述第二噴嘴 液狀體吐出到上述第二基板上的步驟。 藉由（1 9)的塗佈方法，將液狀體充塡到與吐出 的第一噴嘴連接的第一泵浦，將第一基板搬入到第 的前面，從第一泵浦將液狀體壓送到第一噴嘴，從 嘴將液狀體吐出到第一基板上，且同時將液狀體充 第二噴嘴連接的第二泵浦，將第二基板搬入到第二 前面，從第二栗浦將液狀體壓送到第二噴嘴，從第 將液狀體吐出到第二基板上，所以能不會浪費時間 地進行塗佈動作。 基板上 使用第 進行塗 佈於上 出上述 上述基 泵浦將 將上述 體充塡 基板搬 泵浦將 將上述 液狀體 —噴嘴 第一噴 塡到與 噴嘴的 二噴嘴 而連續 -11 - T361727 [發明效果] 藉由本發明，能獲得可將處理作業線縮短化的塗佈裝 置及塗佈方法。 【實施方式】 以下根據圖面來說明本發明的實施方式。 第1圖是本發明的一種實施方式的塗佈裝置1的立體 圖。. 如第1圖所示’本實施方式的塗佈裝置1，是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置，是 以：基板搬運部2、塗佈部3、管理部4，爲主要構成元件 。該塗佈裝置1，是藉由基板搬運部2使基板浮起來進行 搬運，且藉由塗佈部3將光阻劑塗佈於該基板上，藉由管 理部4來管理塗佈部3的狀態。 第2圖是塗佈裝置1的正視圖，第3圖是塗佈裝置1 的俯視圖，第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。 (基板搬運部） 首先來說明基板搬運部2的構造。 基板搬運部2具有：基板搬入區域20、塗佈處理區域 21、基板搬出區域22、搬運機構23、以及支承這些構造 的框架部24。在該基板搬運部2，是藉由搬運機構23將 基板S依序搬運到基板搬入區域20、塗佈處理區域21、 -12- 及基板搬出區域22。基板搬入區域20、塗佈處理區域21 、及基板搬出區域22，是以該順序從基板搬運方向的上游 側排列到下游側。搬運機構23，爲了要涵蓋基板搬入區域 20、塗佈處理區域21、及基板搬出區域22的各部分，而 設置在該各部分的其中一側。 以下在說明塗佈裝置1的構造時，爲了容易表示，使 用XYZ座標系來說明圖中的方向。將基板搬運部2的長 軸方向也就是基板的搬運方向記爲X方向。將從俯視方向 觀察與X方向（基板搬運方向）垂直相交的方向記爲Y方向 。將與包含X方向軸及Y方向軸的平面垂直的方向記爲Z 方向。分別在X方向、Y方向及Z方向，圖中箭頭的方向 爲+方向，與箭頭的方向相反的方向爲-方向。T361727 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a coating apparatus and a coating method. [Prior Art] A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film later are known as being on the substrate. The coating device for applying a photoresist film on the surface is a slit nozzle fixed, and a glass substrate is conveyed under the slit nozzle by a robot or the like, and a photoresist is applied to the glass substrate. In recent years, the size of the substrate has been increased to 2 mx 2 m or more. Therefore, there is a problem that the processing line becomes long in the transportation by the robot. Therefore, the known coating apparatus shortens the processing line by ejecting the gas onto the stage to float the substrate (for example, refer to Patent Document 1). [Patent Document 1] JP-A-2005-236092 [Summary of the Invention] [Problems to be Solved by the Invention] However, there is a greater demand for a shorter processing line, so of course, σ -4- 1361727 must require a processing line. Shorten. In view of the above circumstances, an object of the present invention is to provide a coating apparatus and a coating method which can shorten a processing line. [Means for Solving the Problem] In order to achieve the above object, the present invention has the following structure. (1) A substrate transporting unit that transports a substrate and transports the substrate, and a coating device that has a coating portion that applies a liquid to the substrate while the substrate is transported by the substrate transporting unit. The coating unit is provided with a plurality of pumps that pressurize the liquid material to the nozzles. According to the apparatus of (1), a plurality of pumps for pumping the liquid to the nozzles of the application portion are provided, so that even when one of the pumps is filled with the liquid by a plurality of pumps, It also does not waste time, and can also supply liquid by other pumps. (2) In the coating device of (1), a plurality of nozzles are provided in the coating portion. According to the apparatus of (2), a plurality of nozzles are provided in the coating portion. Therefore, while one of the plurality of nozzles is filled with the liquid, the liquid can be applied by the other nozzles. Thereby, the liquid can be supplied to the substrate without wasting time even during the filling of the liquid. (3) In the coating device of (2), the pump is provided corresponding to each of the plurality of nozzles. -5- 1361727 The device of (3) is provided with a pump corresponding to each of the plurality of nozzles, so that each of the plurality of nozzles can be individually filled with the liquid. This can reduce the burden of pumping. (4) In the coating apparatus of (2) or (3), the plurality of nozzles are arranged along the substrate conveyance direction of the substrate conveyance unit. According to the apparatus of (4), the plurality of nozzles are arranged along the substrate conveyance direction of the substrate conveyance portion. Therefore, when the liquid material is discharged from each nozzle, the nozzles can be moved in parallel without being rotated. Therefore, the liquid can be easily discharged onto the substrate. (5) In the coating apparatus according to any one of (1) to (4), the lengths of the liquid conveyance paths from the plurality of pumps to the nozzles are substantially the same as each other. According to the apparatus of (5), the lengths of the liquid conveyance paths from the respective pumps to the nozzles are substantially the same, so that the conditions of the liquid conveyance route between the respective pumps and nozzles are substantially the same. . Thereby, the liquid can be stably discharged onto the substrate. (6) In the coating apparatus according to any one of (1) to (5), the plurality of pumps are disposed at positions substantially equal to each other with respect to the nozzles. According to the apparatus of (6), the plurality of pumps are disposed at positions substantially equal to each other with respect to the nozzles, so that the conditions of the liquid conveyance route between the respective pumps and nozzles can be made substantially the same. Thereby, the liquid can be stably -6- Γ 361727 and discharged onto the substrate. (7) The coating device of one of (1) to (6), wherein the plurality of pumps are disposed to support the frame portion of the nozzle so as to be freely movable. According to the apparatus of (7), the plurality of pumps are arranged to support the frame portion of the nozzle so as to be freely movable and lowered, so that the pump can be lifted and lowered in accordance with the elevation of the nozzle. Thereby, the state of the liquid conveyance path between the pump and the nozzle can be kept constant, so that the liquid can be stably discharged onto the substrate. In addition, the distance between the pump and the nozzle can be shortened, so that the load on the pump can be reduced. (8) In the coating device of (7), the plurality of pumps are disposed in the frame portion. The upstream side of the substrate transport direction. According to the apparatus of (8), the plurality of pump pumps are disposed on the upstream side of the substrate conveyance direction in the frame portion, so that the pumping unit (9) can be mounted in a stable state. The plurality of pumps are disposed on the downstream side of the substrate conveyance direction in the frame portion. According to the device of (9), the plurality of pumps are disposed on the downstream side in the substrate conveyance direction of the frame portion, so that the pumping device of each pump (10) in (7) can be mounted in a stable state. The frame portion includes a beam member that is disposed above the transport portion of the substrate 1361727, and a column member that supports the beam member, and the plurality of pumps are attached to the beam member. The frame portion of the device has a beam member that is disposed above the substrate transport portion and a column member that supports the beam member, and a plurality of pumps are attached to the beam member, so that each of the frame members can be mounted in a stable state. Lipu. (11) In the coating device of (10), a plurality of the pumps are attached to substantially the center of the upper surface of the beam member. According to the apparatus of (11), a plurality of pumps are attached to the substantially central portion of the upper surface of the beam member, so that the liquid conveyance path from the nozzle to the pump can be shortened. (12) The coating device of (7), wherein the frame portion includes: a beam member provided above the substrate conveying portion; and a column member that supports the beam member; and the plurality of pumps are attached to the frame portion Column member. The device 'frame portion of (12) includes: a beam member provided above the substrate conveyance portion and a column member that supports the beam member; and a plurality of chestnuts attached to the column member of the frame portion, so that the frame member can be stabilized Install each pump. (13) The coating device according to any one of (1) to (6), further comprising: a pumping frame portion that supports the plurality of pumps, wherein the pumping frame portion is disposed on the substrate with respect to the nozzle The front side of the conveying direction. In the coating device of (13), the frame portion for the pump that supports a plurality of pumps is provided, and the pump frame portion is disposed on the front side in the direction of substrate conveyance -8 - Γ 361727 - with respect to the nozzle. The vibration of the pump is not easily transmitted to the liquid substrate. (14) The coating apparatus according to any one of (1) to (13), wherein the substrate transfer device includes: a first device having a plurality of gas ejection holes on the substrate mounting surface; and a device disposed opposite to the coating portion The second carrier (14) carrying a plurality of gas ejection holes and a plurality of gas suction holes on the substrate, wherein the substrate conveying portion is provided with a first stage device having a plurality of gas ejection holes on the base surface In addition, the second stage device in which the application portion faces the gas suction hole having a plurality of gas discharge numbers on the substrate placement surface is provided so that the amount of floating of the substrate can be adjusted in the application portion. (15) The coating device according to any one of (1) to (14), wherein the preliminary discharge portion has a liquid sprayed from the application portion when the preliminary ejection of the application portion is performed A generally planar preface of the body. The device according to (15) is provided with a preliminary discharge portion that can be applied to the substrate from the substantially planar preliminary discharge surface of the coated portion when the preparatory discharge operation of the application portion is performed. a film of liquid. (16) The substrate is floated and transported, and at the same time, the pump body coating unit is a loading table, and the mask unit ttr is placed on the hole and the finer discharge portion is ready to be discharged. The method of applying the liquid material of -9 to 1361727 from the nozzle to the substrate in the state of the coating liquid cloth is: the method of charging the liquid body to the nozzle that discharges the liquid material a step of pumping the substrate onto the front surface of the nozzle, and pressing the liquid material from the first pump to the nozzle, and discharging the liquid material onto the substrate from the nozzle At the same time, the liquid is charged to the second pump connected to the nozzle. By the coating method of (16), the liquid is filled into the first pump connected to the nozzle of the discharge liquid, the substrate is carried into the front of the nozzle, and the liquid is pumped from the first pump. To the nozzle, the liquid body is discharged from the nozzle onto the substrate, and at the same time, the liquid body is charged to the second pump connected to the nozzle, so even if one of the pumps is filled with liquid by a plurality of pumps During the period, no time is wasted, and the liquid can be supplied by other pumps. (17) The coating method according to (16), comprising: a step of transporting the second substrate to a front surface of the nozzle, and a second pump from the first substrate on which the liquid material is applied The liquid material is pressure-fed to the nozzle 'step of discharging the liquid material from the nozzle onto the second substrate. By the coating method of (17), the first substrate of the liquid-coated body is then transported to the front surface of the nozzle, and the liquid is pressed from the second pump to the nozzle. Since the body is discharged onto the second substrate, the coating operation can be performed without wasting time. (18) In the coating method of (17), in the step of discharging the liquid body onto the second -10-361727 substrate, the liquid is filled to the first pump by (18) In the coating method, the liquid is discharged to the second step, and the liquid is charged to the first pump, so that the pump can be alternately pumped and the second pump. Thereby, it is possible to continuously operate without wasting time. (19) A method of coating a liquid substrate by transporting the substrate and transporting the liquid material to the first lip pump connected to the first nozzle of the liquid discharge body a step of loading the first plate into the front surface of the first nozzle, and pressing the first liquid material from the first liquid nozzle to the first nozzle, and discharging the liquid from the first nozzle liquid onto the first substrate, and Simultaneously, the step of flowing the liquid to the second pump connected to the second nozzle, the step of introducing the second into the front surface of the second nozzle, and the step of pumping the liquid from the second liquid to the second nozzle a step of discharging from the second nozzle liquid to the second substrate. By the coating method of (19), the liquid is filled to the first pump connected to the discharged first nozzle, the first substrate is carried into the front face, and the liquid is pumped from the first pump Pressing to the first nozzle, discharging the liquid body from the nozzle to the first substrate, and simultaneously charging the liquid to the second pump connected to the second nozzle, and moving the second substrate to the second front side, from the second Lipu presses the liquid to the second nozzle, and discharges the liquid from the first liquid to the second substrate, so that the coating operation can be performed without wasting time. The substrate is coated on the substrate to apply the above-mentioned base pump to pump the body-filled substrate, and the liquid-jet nozzle is first squirted to the nozzle with the nozzle continuously -11 - T361727 [ Advantageous Effects of Invention According to the present invention, a coating apparatus and a coating method capable of shortening a processing line can be obtained. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a perspective view of a coating device 1 according to an embodiment of the present invention. In the coating device 1 of the present embodiment, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like is a substrate conveying unit 2 and a coating unit 3. The management unit 4 is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. (Substrate conveyance unit) First, the structure of the board conveyance unit 2 will be described. The substrate transporting unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate carry-in region 20, the coating processing regions 21, -12-, and the substrate carry-out region 22 by the transport mechanism 23. The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 23 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22. Hereinafter, in explaining the structure of the coating apparatus 1, the direction in the drawing will be described using an XYZ coordinate system for ease of display. The longitudinal direction of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.
基板搬入區域20，是將從裝置外部搬運過來的基板S 予以搬入的部位，具有：搬入側載台25、與升降機構26 〇 搬入側載台2 5，設置在框架部24的上部，是例如由 SUS等所構成的從俯視方向觀察爲矩形的板狀構件。該搬 入側載台25，其X方向爲長軸。在搬入側載台25，分別 設有複數的空氣噴出孔25a、與複數的升降銷出沒孔25b 。該空氣噴出孔25a及升降銷出沒孔25b，是設置成貫穿 搬入側載台25。 空氣噴出孔25a，是將空氣噴出到搬入側載台25的載 台表面25c上的孔，例如在搬入側載台25之中基板S通 過的區域配置成從俯視方向觀察爲矩陣狀。該空氣噴出孔 -13- 1361727 25a連接著沒有圖示的空氣供給源。在該搬入側】 藉由從空氣噴出孔25a所噴出的空氣而能使基技 方向浮起。 升降銷出沒孔25b，是設置在搬入側載台25 S搬入的區域。該升降銷出沒孔25b，讓供給到 25c的空氣不會漏出。 在該搬入側載台25之中的Y方向的兩端部 有一個校準裝置25d。校準裝置25d，是將搬入 載台25的基板S予以定位的裝置。各校準裝置 :長孔、與設在該長孔內的定位構件，將搬入到 台25的基板從兩側機械性地予以夾持。 升降機構26，是設置在搬入側載台25的基 置的背面側。該升降機構26具有：升降構件26a 的升降銷26b。升降構件26a，連接於沒有圖示 構，藉由該驅動機構的驅動而讓升降構件26a朝 動。複數的升降銷26b，從升降構件26a的上面 入側載台25豎立設置。各升降銷26b，是配置在 方向觀察分別與上述升降銷出沒孔25b重疊的位 讓升降構件26a朝Z方向移動，則各升降銷26b 銷出沒孔25b出沒於載台表面25c上。各升降銷 方向的端部是設置成分別與Z方向上的位置一致 從裝置外部搬運過來的基板S保持爲水平的狀態 塗佈處理區域2 1，是進行光阻劑的塗佈處理 設置有：將基板S浮起支承的處理載台27。 K 台 25， i S 朝+Z 之中基板 載台表面 ，各設置 到搬入側 25d具有 搬入側載 板搬入位 、與複數 的驅動機 Z方向移 部朝向搬 :從俯視 置。藉由 會從升降 26b 的 +Z ，而能將 〇 的部位， • 14 - 136172?- 處理載台27，是以例如硬質氧化鋁膜爲主成分的光吸 收材料來覆蓋載台表面27c的從俯視方向觀察爲矩形的板 狀構件，是設置在相對於搬入側載台25的+X方向側。在 處理載台27之中以光吸收材料覆蓋的部位，會抑制雷射 光等的光線反射。該處理載台27，Y方向爲長軸。處理載 台27的Y方向的尺寸，與搬入側載台25的Y方向尺寸 大致相同。在處理載台27設置有：將空氣噴出到載台表 面27c上的複數的空氣噴出孔27a、與將載台表面27c上 的空氣予以吸引的複數的空氣吸引孔27b。這些空氣噴出 孔27a及空氣吸引孔27b，設置成貫穿處理載台27。 在處理載台27，空氣噴出孔27a的間距，是相較於設 置在搬入側載台25的空氣噴出孔25a的間距更狹窄，與 搬入側載台25相比，將空氣噴出孔27a設置得較緊密。 因此’與其他的載台相比，在該處理載台27能以較高精 確度來調節基板的浮起量，基板的浮起量例如可控制爲 ΙΟΟμιη以下，而50μιη以下較佳。 基板搬出區域22，是用來將塗佈有光阻劑的基板S 搬出到裝置外部的部位，具有：搬出側載台28、與升降機 構29 °該搬出側載台28，設置在相對於處理載台27的+χ 方向側’由與設置在基板搬入區域20的搬入側載.台25大 致相同的材質、尺寸所構成。與搬入側載台2 5同樣地， 在搬出側載台28設置有：空氣噴出孔28a及升降銷出沒 孔28b。升降機構29，設置在搬出側載台28的基板搬出 位置的背面側’例如以框架部24來支承。升降機構29的 -15- 1361727 升降構件29a及升降銷29b，與設置在基板搬入區域20的 升降機構26的各部位爲相同的構造。該升降機構29，當 將搬出側載台28上的基板S搬出到外部裝置時，能藉由 基板S交接用的升降銷2 9b來將基板S抬起。 搬運機構23，具有：搬運機23a、真空襯墊23b'軌 道23c。搬運機23a的構造是在內部設置有例如線性馬達 ，藉由驅動該線性馬達，讓搬運機23a可於軌道23c上移 動。 該搬運機23a是配置成：在俯視方向觀察讓預定的部 分23 d重疊於基板S的-Y方向端部。與該基板S重疊的 部分23d，是設置在：較當使基板S浮起時的基板背面的 高度位置更低的位置。 真空襯墊23b，是有複數個排列在搬運機23a之中與 上述基板S重疊的部分23d。該真空襯墊23b，具有用來 真空吸附基板S的吸附面，配置成讓該吸附面朝向上方。 真空襯墊23b，藉由讓吸附面吸附住基板S的背面端部， 則可保持住該基板S。各真空襯墊23b，其從搬運機23a 的上面部起算的高度位置是可調節的，例如可因應基板S 的浮起量而將真空襯墊23b的高度位置上下調整。軌道 23c是在：搬入側載台25、處理載台27 '及搬出側載台 28的側方涵蓋各載台地延伸著，藉由滑動於該軌道23c而 能讓搬運機23 a沿著該各載台移動。 (塗佈部） -16- 接著來說明塗佈部3的構造。 塗佈部3，是用來在基板S上塗佈光阻劑的部分，具 有：門型框架31'噴嘴32、與泵浦33。 門型框架31，具有：支柱構件31a、與架橋構件31b ’是設置成在Y方向跨越處理載台27。支柱構件31a，在 處理載台27的Y方向側各設置有一個，各支柱構件31a 分別支承於框架部24的Y方向側的兩側面。各支柱構件 31a’是設置成讓其上端部的高度位置一致。架橋構件31b ’是架橋於各支柱構件3 1 a的上端部之間，相對於該支柱 構件3 1 a可進行升降。 該門型框架31是連接於移動機構31c，可朝X方向 移動。藉由該移動機構31c讓門型框架31可在其與管理 部4之間移動。也就是說，設置於門型框架31的噴嘴32 可在其與管理部4之間移動。 噴嘴32’是作成其中一方向爲長軸的長條狀，是設置 在門型框架31的架橋構件31b的-Z方向側的面部。在該 噴嘴32之中的-Z方向的前端，沿著本身的長軸方向設置 有狹縫狀的開口部32a，從該開口部32a將光阻劑吐出。 噴嘴32，其開口部32a的長軸方向與噴嘴32本身的長軸 方向（Y方向）平行，並且該開口部32a配置成與處理載台 27相對向。開口部32a的長軸方向的尺寸是較所搬運的基 板S的Y方向的尺寸更小，而不會將光阻劑塗佈到基板s 的周邊區域。在噴嘴3 2的內部設置有使光阻劑流通到開 口部3 2 a的沒有圖示的流通路。在支柱構件3 1 a設置有沒 -17- 1361727 有圖示的移動機構，藉由該移動機構，讓在架橋構件31b 所保持的噴嘴32可朝z方向移動。而也可在門型框架31 的架橋構件31b下面安裝：用來將噴嘴32的開口部32a， 也就是噴嘴32的前端以及與該噴嘴前端相對向的相對向 面之間的Z方向上的距離予以測定的感應器34。 泵浦3 3，是將光阻劑供給到噴嘴3 2的流通路的光阻 劑供給手段。該泵浦3 3 ’如第1圖〜第4圖所示，在門型 框架31的架橋構件31b上面沿著噴嘴32的長軸方向配置 有兩個，該兩個泵浦33配置在相對於噴嘴32互相爲大致 相同距離的位置。這裡是分別將泵浦3 3配置在例如在Y 方向將架橋構件31b大致分成三等分的位置。 作爲該泵浦，適合使用例如膜片栗 '高精度定量吐出 泵浦（tubephragm Pump)、手動活塞泵浦等。在這些泵浦之 中，高精度定量吐出泵浦（tubephragm Pump)最適合。 (管理部） 以下說明管理部4的構造。 管理部4，是爲了讓吐出到基板S的光阻劑（液狀體） 的吐出量爲定量而將噴嘴32進行管理的部位，是設置在 :基板搬運部2之中的相對於塗佈部3的-X方向側（基板 搬運方向的上游側）。該管理部4，具有：預備吐出機構 41、浸漬槽42、噴嘴洗淨裝置43、將這些構造予以收容 的收容部44、以及用來保持該收容部的保持構件45。保 持構件45與移動機構45a連接。藉由該移動機構45a讓 -18- 1361727 收容部44可朝X方向移動。 預備吐出機構41、浸漬槽42、及噴嘴洗淨裝置43, 是以該順序朝-X方向側排列。該等預備吐出機構4 1、浸 漬槽42、及噴嘴洗淨裝置43的Y方向的各尺寸，是較上 . 述門型框架3 1的支柱構件3 1 a之間的距離更小，上述門 - 型框架31是跨越各部分來接達。 - 預備吐出機構41，是預備性地將光阻劑吐出的部分。 該預備吐出機構41設置成最接近噴嘴32。浸漬槽42，是 ® 在內部儲存有稀釋劑或光阻劑等的液體槽。噴嘴洗淨裝置 43，是用來將噴嘴32的開口部32a附近予以沖洗的裝置 ，是具有：朝Y方向移動的沒有圖示的洗淨機構、以及使 • 該洗淨機構移動的沒有圖示的移動機構。該移動機構，設 ' 置在較洗淨機構更靠-X方向側。噴嘴洗淨裝置43，由於 設置有移動機構，與預備吐出機構41及浸漬槽42相比， 其X方向的尺寸較大。 0 當將該噴嘴洗淨裝置43配置在接近噴嘴32的位置 (+ X方向側）時，則將其他部位配置到距離噴嘴32較遠的 ； 位置（-X方向側）。在這種情況，當噴嘴32接達到收容部 44內的其他部位時會需要通過移動機構，藉此讓噴嘴32 的移動距離變長。 本實施方式的噴嘴洗淨裝置43是設置在較預備吐出 機構41及浸漬槽42更靠-X方向側的位置，並且噴嘴洗 淨裝置43的移動機構是設置在較該噴嘴洗淨裝置43的洗 淨機構更靠-X方向側，所以噴嘴32不會通過移動機構， -19- 1361727 配置成盡量縮短噴嘴32的移動距離。而當然針對預 出機構41、浸漬槽42、噴嘴洗淨裝置43的配置方式 不限於本實施方式的配置方式，也可以用其他的配置 (塗佈裝置的動作） 接著來說明如上述構造的塗佈裝置1的動作。 第5圖是塗佈裝置1的動作的時序圖。如第5圖 ，在塗佈裝置1，進行：基板搬入、光阻劑塗佈、基 出、預備吐出、光阻劑充塡（泵浦充塡）的各個動作。 說明將光阻劑塗佈到基板S的動作》 第6圖〜第9圖，是顯示塗佈裝置1的基板搬入 阻劑塗佈、基板搬出的各動作的俯視圖。將基板S搬 基板搬入區域20，使該基板S浮起而進行搬運，且 佈處理區域21塗佈光阻劑，將已塗佈好該光阻劑的 S從基板搬出區域22搬出。第7圖〜第9圖僅以虛 示門型框架31的輪廓，而容易判斷噴嘴32及處理載 的構造。以下來說明各部分的詳細動作。 在將基板搬入到基板搬入區域20之前，使塗佈裝 待機。具體來說，在搬入側載台25的基板搬入位置 方向側配置搬運機23a，將真空襯墊23b的高度位置 在基板的浮起高度位置，並且從搬入側載台25的空 出孔25a、處理載台27的空氣噴出孔27a、空氣吸 27b及搬出側載台28的空氣噴出孔28a分別將空氣噴 備吐 ，並 方式 所示 板搬 以下 '光 入到 在塗 基板 線顯 台27 置1 的-Y 定位 氣噴 引孔 出或 -20- 1361727 吸引，成爲將空氣供給到讓基板浮起於各載台表面的程度 的狀態。而預先將光阻劑充塡到泵浦3 3內。具體來說， 是預先將在預備吐出動作及該預備吐出動作後的光阻劑塗 佈所需要的分量的光阻劑，分別充塡在兩個泵浦33內。 (1)基板搬入 在該狀態，例如藉由沒有圖示的搬運臂等，如第6圖 所示，若從外部將基板S搬運到基板搬入位置，則使升降 構件26a朝+Z方向移動，將升降銷26b從升降銷出沒孔 25b突出到載台表面25c。而藉由升降銷26b將基板S抬 起，進行該基板S的交接動作。而從校準裝置25d的長孔 使定位構件突出於載台表面25c。 在接收基板S之後，使升降構件26a下降將升降銷 26b收容於升降銷出沒孔25b內。此時，由於在載台表面 25c形成有空氣層，所以基板S藉由該空氣而保持爲相對 於載台表面25c浮起的狀態。當基板S到達空氣層的表面 時，藉由校準裝置2 5d來進行基板S的定位，將在基板搬 入位置的-Y方向側處配置的搬運機23a的真空襯墊23b真 空吸附於基板S的-Y方向側端部。在第7圖顯示吸附住 基板S的-Y方向側端部的狀態》 (2)預備吐出 在將光阻劑塗佈到基板S之前，在塗佈部3，進行用 來保持噴嘴32的吐出狀態的預備吐出動作。該預備吐出 -21 - 1361727 動作，與開始搬入基板大致同時進行。首先如第ι〇圖所 示，藉由移動機構31c(顯示於第4圖）使門型框架31朝-X 方向移動到管理部4的位置。 在使門型框架31移動到管理部4的位置之後’調整 門型框架31的位置將噴嘴32接達到噴嘴洗淨裝置43。在 噴嘴洗淨裝置43，朝向噴嘴32的開口部32a附近而吐出 稀釋劑等的洗淨液，並且因應需要將氮氣與稀釋劑同時吐 出到噴嘴32的開口部32a，且同時藉由將沒有圖示的洗淨 機構朝向噴嘴32的長軸方向掃描，將噴嘴32洗淨。 在洗淨好噴嘴32之後，將該噴嘴32接達到預備吐出 單元41。在預備吐出單元41，會一邊將開口部32a與預 備吐出面之間的距離予以測定，一邊將噴嘴32的開口部 3 2a移動到Z方向上的預定位置，一邊使噴嘴32朝-X方 向移動，一邊從開口部3 2a預備吐出光阻劑。在該預備吐 出動作，在設置有兩個的泵浦33之中，在充塡有光阻劑 的其中一方的泵浦33，將內部的光阻劑壓送到噴嘴32的 流通路。 在進行了預備吐出動作之後，將門型框架31回到原 來位置，當要搬運下個基板S時，如第11圖所示，藉由 移動機構31b使噴嘴32移動到Z方向上的預定位置。. 而也可因應需要，例如每預定次數接達到管理部4， 則使該噴嘴32接達到浸漬槽42內。在浸漬槽42，藉由將 噴嘴32的開口部32a暴露於：儲存於浸漬槽42的溶劑（ 稀釋劑）的蒸氣環境中，來防止噴嘴32乾燥。 -22- Ί3 61727 — (塗佈） 在藉由真空襯墊23b吸附住基板S的-Υ 之後，使搬運機23a沿著軌道23c移動。由於 起的狀態，所以即使搬運機2 3 a的驅動力較小 能沿著軌道23 c順利移動。當基板S從搬入俱 處理載台27移動時，在處理載台27該基板 ΙΟΟμιη，而50μηι以下較佳。 一旦基板S的搬運方向前端到達噴嘴32庄 的位置，則進行將光阻劑塗佈到基板S上。在 動作，在設置有兩個的泵浦33之中，在預備 行壓送的泵浦3 3，再次將泵浦3 3內的光阻劑 3 2的流通路。所壓送的光阻劑，如第7圖所示 32a(顯示於第4圖）朝向基板S吐出。該光阻劑 ，是使噴嘴32的位置固定，藉由搬運機23a 板S —邊來進行。伴隨著基板S的移動，則如 在基板S上塗佈光阻膜R。藉由讓基板S通過 劑的開口部32a下面，而在基板S的預定區域 R。 形成了光阻膜R的基板S，是藉由搬運機 向搬出側載台2 8搬運。在搬出側載台2 8，在 表面28C浮起的狀態，如第9圖所示將基板s 搬出位置。 (4)基板搬出 方向側端部 基板S爲浮 ’基板S也 1載台25朝 的浮起量爲 J開口部32a 光阻劑塗佈 吐出動作進 壓送到噴嘴 ，從開口部 的吐出動作 —邊搬運基 第8圖所示 ，吐出光阻 形成光阻膜 2 3 a將其朝 相對於載台 搬運到基板 •23- 1361727 一旦基板S到達基板搬出位置，則解除真空襯墊23b 的吸附。解除基板S的吸附之後，搬運機23 a再回到搬入 側載台25的基板搬入位置。而解除吸附後，使升降機構 29的升降構件29a朝向+Z方向移動。伴隨著升降構件 29a的移動，升降銷29b從升降銷出沒孔28b朝向基板S 的背面突出，藉由升降銷29 b將基板S抬起。在該狀態， 例如在搬出側載台28的+X方向側處設置的外部的搬運臂 ’會接達於搬出側載台28，而接收基板S。以這種方式進 行基板S的搬出。 (5)泵浦充塡 泵浦充塡動作，在光阻劑的吐出完成之瞬後開始。在 吐出光阻劑之瞬後，在該光阻劑的吐出所使用的泵浦3 3 的光阻劑保持部33a變空。在光阻劑充塡動作，該泵浦33 會作動’將光阻劑充塡到變空的內部。在充塡光阻劑的途 中，將基板S搬運到搬出側載台28，進行基板S的搬出 動作。 (6)下個基板搬入 上述基板的下個基板（以下稱爲「下個基板」）S2的搬 入’是與上述基板S的搬出動作的開始時間大致同時來進 行。針對搬入動作，與上述基板S的搬入動作一樣，利用 升降銷2 6b來接收下個基板S2之後，將其浮起保持於搬 入側載台25上’進行校準動作。在上述基板s搬出時已 -24- 1361727" 回到基板搬入位置的搬運機23 a，在下個基板S2的校準動 作完成之前，會回到基板搬入位置。下個基板S2’會被 回到基板搬入位置的搬運機23a的吸附襯墊23b所吸附。 (7) 下個基板的預備吐出 在上述（3)所說明的基板搬運、光阻劑塗佈動作完成之 後，進行將光阻劑吐出到下個基板S2的預備吐出動作。 針對該預備吐出動作的內容，是與上述（2)所說明的內容相 同。在該預備吐出動作，是藉由在兩個泵浦33之中與在 上述（2)、（3)進行壓送的泵浦33不同的泵浦33來進行壓 送。當下個基板的預備吐出動作開始時，在上述（2)及（3) 已進.行壓送的泵浦33會處於進行光阻劑充塡動作的狀態 。與下個基板S2的搬入動作完成的時機大致相同的時機 ，下個基板的預備吐出動作也完成。於是，該下個基板預 備吐出動作，會與上述基板S的搬出動作、下個基板S2 的搬入動作、及光阻劑充塡動作一起進行。 (8) 下個基板的塗佈 將下個基板S2搬入到搬入側載台25，藉由吸附襯墊 2 3b將其吸附之後，則將該下個基板S2朝處理載台27搬 運。將下個基板S2搬運到處理載台27之後，則將光阻劑 塗佈到該下個基板S2。針對該下個基板S2的搬運動作及 塗佈動作的內容，與在上述（2)及（3)所說明的內容相同。 在該塗佈動作中，是藉由在兩個泵浦33之中當上述（7)的 -25- Ι36Γ727 預備吐出動作時進行壓送的泵浦33來進行光阻劑的壓送 (9) 下個基板的搬出 在下個基板S到達基板搬出位置之後’則進行該下個 基板S2的搬出動作。該動作的內容’與上述（4)的內容相 同。 (10) 下個泵浦的充塡 該泵浦充塡動作，在對於下個基板S2所進行的光阻 劑吐出動作完成之瞬後開始。在該光阻劑充塡動作，與在 上述（5)說明的光阻劑充塡動作一樣，該泵浦33會作動， 在將光阻劑吐出至下個基板52之瞬後在成空的內部充塡 光阻劑。在進行光阻劑之充塡的途中，將下個基板S 2搬 運到搬出側載台28，進行該下個基板S2的搬出動作。 以下反覆進行上述（6)〜（10)的動作。 第12圖是當安裝於噴嘴的泵浦爲一個的情況的塗佈 裝置的處理時序圖。 如該圖所示，泵浦爲一個時，在充塡光阻劑的期間就 不能進行預備吐出動作，藉此會讓每一枚基板的處理時間 變長。 相對的’藉由本發明的一種實施方式，由於設置有： 對於塗佈部3的噴嘴32分別壓送光阻劑的複數的泵浦33 ’所以即使藉由複數的泵浦33的其中一個泵浦充塡光阻 -26- 1361727 '劑的期間，也不會浪費時間，能藉由其他泵浦3 3將光阻 劑供給到基板上。藉此，可減少每一枚基板的處理時間。 則藉由本發明的一種實施方式的構造，可使處理作業線縮 短化。 藉由本發明的一種實施方式，將複數的泵浦33_配置 成：相對於噴嘴3 2互相爲大致相等距離的位置，所以能 使各個泵浦33與噴嘴32之間的光阻劑搬運路線的條件大 致相同。藉此能將光阻劑穩定吐出到基板上。 藉由本發明的一種實施方式，將複數的泵浦33設置 在：可自由升降地支承噴嘴32的門型框架31，所以能配 合噴嘴32的升降來使泵浦33升降。藉此，能將各個泵浦 33與噴嘴32之間的光阻劑搬運路線的狀態保持爲一定， 所以能將光阻劑穩定吐出到基板上。除此之外，讓泵浦3 3 與噴嘴3 2之間的距離很短即可完成，所以能減輕泵浦3 3 的負擔。 藉由本發明的一種實施方式，將複數的泵浦33安裝 在門型框架31的架橋構件3 1 b，所以能以穩定狀態安裝各 栗浦3 3。 本發明的技術範圍並不限於上述實施方式，在不脫離 本發明主旨的範圍可以作適當變更。 、 針對塗佈裝置1的全體構造，在上述實施方式，雖然 是將搬運機構23配置在各載台的-Y方向側，而並不限於 此。例如，也可將搬運機構23配置在各載台的+Y方向側 °而如第13圖所示’也可在各載台的_γ方向側配置上述 -27- 1361727 搬運機構23(搬運機23a、真空襯墊23b、軌道23c)，在 + Y方向側配置與該搬運機構23爲相同構造的搬運機構 53 (搬運機5 3a、真空襯墊53b、軌道53 c)，而能以搬運機 構23與搬運機構53來搬運不同的基板。例如，如該圖所 示，在搬運機構23搬運基板S1，在搬運機構53搬運基 板S2 »在該情況，則能以搬運機構23與搬運機構53來 交互搬運基板，讓生產能力提升》而在要將具有上述基板 S、SI、S2的一半程度的面積的基板進行搬運的情況，例 如以搬運機構23與搬運機構53各保持一枚，藉由使搬運 機構23與搬運機構53朝+X方向一同行進，則能同時搬 運兩枚基板。藉由這種構造，則能讓生產能力提升。 在上述實施方式，將泵浦33配置在門型框架31的架 橋構件31b上面將該架橋構件31b在長軸方向予以三等分 的位置，而並不限於此，也可配置在其他位置。 例如，如第14圖所示，也可在架橋構件31b上面分 別將泵浦33配置在該架橋構件31b的長軸方向的兩端部 。也可在架橋構件31b上面分別將泵浦33配置在該架橋 構件31b的長軸方向中央部。藉由將泵浦33配置在架橋 構件31b的長軸方向中央部，則可將連接於泵浦33與噴 嘴3 2之間的配管的長度予以縮短，所以能減輕泵浦33的 負擔。 在該情況，如第1 5圖所示，也可爲將兩個泵浦3 3沿 著架橋構件31b的長軸方向配置的構造，如第16圖所示 ，也可爲將兩個泵浦33沿著基板搬運方向（架橋構件31b -28 - 1361727 向 兩 框 示 y 裝 兩 ， 板 框 在 對 個 下 與 在 32 的 的短軸方向）配置的構造。在將泵浦33沿著基板搬運方 配置的構造中，尤其可將配管的長度縮短’而且也可將 個泵浦33安裝在架橋構件31b的上面以外的面部。 如第17圖所示，也可爲將兩個泵浦33安裝在門型 架31的支柱構件31a的構造。在該情況，如第17圖所 ，也可爲在各支柱構件31a各安裝一個泵浦33的構造 雖然省略圖示，而也可爲在其中一方的支柱構件31a安 複數的泵浦33的構造。 如第18圖所示，也可形成爲另外設置：用來安裝 個栗浦33的泵浦安裝框架60的構造。如第18圖所示 也可將栗浦安裝框架60配置在相對於門型框架31的基 搬運方向的上游側（-X方向側），也可配置在相對於門型 架3 1的基板搬運方向的下游側（+ X方向側），可爲配置 基板搬運方向的上游側及下游側兩方的構造。 也可配置複數的噴嘴32，將該複數的噴嘴32分別 於泵浦33 —對一地配置。在第19圖，是顯示了將各一 噴嘴32配置在門型框架31的基板搬運方向的上游側及 游側的例子。兩個噴嘴32的長軸方向，是配置成沿著 基板搬運方向垂直相交的方向。 藉由該構造’每一枚基板可交互使用不同的噴嘴32 所以在藉由其中一方的噴嘴3 2進行塗佈動作的期間， 另一方的噴嘴32可充塡光阻劑。而藉由具有複數噴嘴 ，則可交互地塗佈不同種類的光阻劑。而也可設置複數 管理部4。 •29- 1361727 在第19圖的構造，雖然顯示了將各一個噴嘴32配置 在門型框架31的基板搬運方向的上游側及下游側的例子 ，而並不限於此，也可配置複數的門型框架31，相對於該 複數的門型框架31，將各一個的噴嘴32的長軸方向設置 成沿著與基板搬運方向垂直相交的方向。而此時也可設置 複數的管理部4。藉由該構造，對每一枚基板，能交互地 使用：在獨立控制的複數的門型框架31處設置的噴嘴32 ，所以在藉由其中一方的噴嘴32進行塗佈動作的期間， 可在另一方的噴嘴32充塡光阻劑。而藉由具有複數的噴 嘴3 2，則可交互地塗佈不同種類的光阻劑。 在第19圖的構造，藉由讓各噴嘴32可獨立移動，則 在光阻劑充塡後也可進行預備吐出動作。藉此，可使處理 作業線更縮短化。在各噴嘴32獨立進行預備吐出動作的 情況，也可設置複數的管理部4。 在該情況，將噴嘴32、以及與該噴嘴32連接的泵浦 33配置成一體較佳。作爲這種構造，可舉出：例如將泵浦 33直接安裝在噴嘴32的構造、或將噴嘴32 —體地安裝於 移動構件，並且將泵浦33安裝在該移動構件的構造等》 藉此，讓噴嘴32與泵浦33 —體地移動，所以能避免 因噴嘴32的移動讓兩者的位置變化。藉此，則能保持噴 嘴32與泵浦33之間的光阻搬運路線的環境，所以能使噴 嘴3 2的光阻劑吐出穩定化。 在上述各構造，作爲複數泵浦3 3，例如說明配置有兩 個泵浦33的例子，而並不限於此，例如也可設置三個以 -30- 1361727 上的泵浦33。在上述實施方式，是對於一個噴嘴32設置 —個泵浦33，而並不限於此，例如也可對於一個噴嘴32 使用兩個泵浦33。 [產業上的可利用性] 本發明提供一種可縮短處理作業線的塗佈裝置及塗佈 方法，在產業上非常有用。 【圖式簡單說明】 第1圖是顯示本發明的一種實施方式的塗佈裝置的構 造的立體圖。 第2圖是顯示本發明的一種實施方式的塗佈裝置的構 造的正視圖。 第3圖是顯示本發明的一種實施方式的塗佈裝置的構 造的俯視圖。 第4圖是顯示本發明的一種實施方式的塗佈裝置的構 造的側視圖。 第5圖是顯示本發明的一種實施方式的塗佈裝置的動 作的時序圖。 第6圖是本發明的一種實施方式的塗佈裝置的動作的 顯示圖。 第7圖是本發明的一種實施方式的塗佈裝置的動作的 顯示圖。 第8圖是本發明的一種實施方式的塗佈裝置的動作的 -31 - 1361727 顯不圖。 第9圖是本發明的一種實施方式的塗佈裝置的動作的 顯不圖。 第10圖是本發明的一種實施方式的塗佈裝置的動作 的顯不圖。 第11圖是本發明的一種實施方式的塗佈裝置的動作 的顯示圖。 第12圖是當泵浦爲一個的情況而顯示塗佈裝置的動 作的時序圖。 第13圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第14圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第15圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第16圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第17圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第18圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第19圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 -32- 1361727 【主要元件符號說明】 1 ： 2 : 3 : 塗佈裝置 基板搬運部 塗佈部 , 4 ： 管理部 27 :處理載台 . 3 1 :門型框架 32 :噴嘴 Φ 33 :泵浦 S : 基板 R : 光阻膜 • -33The substrate loading area 20 is a portion into which the substrate S transported from the outside of the apparatus is carried, and includes a loading side stage 25 and a lifting mechanism 26 〇 carrying the side stage 25, and is provided on the upper portion of the frame unit 24, for example. A plate-like member which is formed of SUS or the like and has a rectangular shape as seen in plan view. The loading side stage 25 has a long axis in the X direction. The loading side loading table 25 is provided with a plurality of air ejection holes 25a and a plurality of lifting pin insertion holes 25b. The air ejection hole 25a and the lift pin exit hole 25b are provided to penetrate the carry-in side stage 25. The air ejection hole 25a is a hole that ejects air to the stage surface 25c of the loading-side stage 25, and is disposed in a matrix shape as viewed from a plan view, for example, in a region where the substrate S passes through the loading-side stage 25. The air ejection hole -13 - 1361727 25a is connected to an air supply source (not shown). On the loading side, the direction of the basic technique can be floated by the air ejected from the air ejection hole 25a. The lift pin exit hole 25b is an area provided in the carry-in stage 25S. The lift pin exits the hole 25b so that the air supplied to the 25c does not leak. A calibration device 25d is provided at both ends of the loading-side stage 25 in the Y direction. The calibration device 25d is a device for positioning the substrate S loaded into the stage 25. Each of the calibration devices: a long hole and a positioning member provided in the elongated hole, mechanically sandwiches the substrate carried into the table 25 from both sides. The elevating mechanism 26 is provided on the back side of the base of the loading side stage 25. The elevating mechanism 26 has a lift pin 26b of the elevating member 26a. The elevating member 26a is connected to a non-illustrated structure, and the elevating member 26a is moved by the driving of the driving mechanism. A plurality of lift pins 26b are erected from the upper surface of the elevating member 26a to the side stage 25. Each of the lift pins 26b is disposed in a direction in which the lift pins 26b are overlapped with each other. When the lift members 26a are moved in the Z direction, the lift pins 26b are not shown on the stage surface 25c. The end portion of each of the lift pins is provided in a state in which the substrate S conveyed from the outside of the apparatus is horizontally aligned with the position in the Z direction. The coating processing region 2 1 is provided with a coating process of the photoresist: The processing stage 27 is supported by the substrate S. The K stage 25, i S is placed on the surface of the substrate stage in the +Z, and each of the loading side 25d is provided with the loading side carrier loading position, and the plurality of driving machines Z direction shifting direction: from the top. By the +Z of the lift 26b, the portion of the crucible, the 14-136172?-processing stage 27, is covered with a light absorbing material containing, for example, a hard alumina film as a main component to cover the stage surface 27c. The plate-shaped member which is rectangular in a plan view is provided in the +X direction side with respect to the carrying-in stage 25. The portion of the processing stage 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing stage 27 has a long axis in the Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading side stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for discharging air onto the stage surface 27c, and a plurality of air suction holes 27b for sucking air on the stage surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing stage 27. In the processing stage 27, the pitch of the air ejection holes 27a is narrower than the pitch of the air ejection holes 25a provided in the loading side stage 25, and the air ejection hole 27a is provided in comparison with the loading side stage 25. Closer. Therefore, the processing stage 27 can adjust the floating amount of the substrate with higher precision than the other stages, and the floating amount of the substrate can be controlled to, for example, ΙΟΟμη or less, and preferably 50 μm or less. The substrate carry-out area 22 is a portion for carrying out the substrate S coated with the photoresist to the outside of the device, and includes a carry-out side stage 28 and a lift-off mechanism 29° on the carry-out side stage 28, and are disposed in relation to the processing. The +χ direction side of the stage 27 is composed of substantially the same material and size as the loading side stage 25 provided in the substrate loading area 20. Similarly to the loading side stage 2 5, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin exit hole 28b. The elevating mechanism 29 is supported by the frame portion 24, for example, on the back side of the substrate carrying-out position of the carry-out side stage 28. The -15-1361727 lifting member 29a and the lifting pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided in the substrate loading area 20. When the substrate S on the carry-out side stage 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate S. The transport mechanism 23 has a transporter 23a and a vacuum pad 23b' track 23c. The transporter 23a is constructed such that a linear motor is provided inside, and the linear motor is driven to move the transporter 23a on the rail 23c. The conveyor 23a is disposed so that a predetermined portion 23d is superposed on the end portion in the -Y direction of the substrate S as viewed in a plan view. The portion 23d overlapping the substrate S is disposed at a position lower than the height position of the back surface of the substrate when the substrate S is floated. The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23b can hold the substrate S by allowing the adsorption surface to adsorb the rear end portion of the substrate S. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends over the side of the loading side stage 25, the processing stage 27', and the carry-out stage 28, and slides on the rail 23c to allow the transporter 23a to follow each other. The stage moves. (Coating portion) -16- Next, the structure of the coating portion 3 will be described. The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 31' nozzle 32 and a pump 33. The portal frame 31 has a strut member 31a and a bridging member 31b' disposed across the processing stage 27 in the Y direction. Each of the pillar members 31a is provided on the Y-direction side of the processing stage 27, and each of the pillar members 31a is supported by both side surfaces of the frame portion 24 on the Y-direction side. Each of the strut members 31a' is disposed such that the height positions of the upper end portions thereof coincide. The bridging members 31b' are bridged between the upper end portions of the respective strut members 31a, and are movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided to the portal frame 31 is movable between it and the management portion 4. The nozzle 32' is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 31b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a is provided along the longitudinal direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. In the nozzle 32, the longitudinal direction of the opening 32a is parallel to the longitudinal direction (Y direction) of the nozzle 32 itself, and the opening 32a is disposed to face the processing stage 27. The dimension of the opening portion 32a in the longitudinal direction is smaller than the dimension of the substrate S to be conveyed in the Y direction, and the photoresist is not applied to the peripheral region of the substrate s. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening portion 3 2 a is provided. The strut member 3 1 a is provided with a moving mechanism not shown in -17 to 1361727, and the moving mechanism allows the nozzle 32 held by the bridging member 31b to move in the z direction. Alternatively, it may be mounted under the bridging member 31b of the portal frame 31: a distance in the Z direction between the opening portion 32a of the nozzle 32, that is, the front end of the nozzle 32 and the opposite surface facing the nozzle leading end. The sensor 34 to be measured. The pump 3 3 is a photoresist supply means for supplying a photoresist to the flow path of the nozzle 3 2 . The pump 3 3 ′ is disposed on the upper surface of the bridge member 31 b of the portal frame 31 along the longitudinal direction of the nozzle 32 as shown in FIGS. 1 to 4 , and the two pumps 33 are disposed in relation to The nozzles 32 are at substantially the same distance from each other. Here, the pump 3 3 is disposed at a position where the bridging member 31b is roughly divided into three equal parts, for example, in the Y direction. As the pump, for example, a membrane chestnut 'high-precision quantitative pumping pump (tubephragm pump), manual piston pumping, or the like is suitably used. Among these pumps, a high-accuracy quantitative pumping pump (tubephragm pump) is most suitable. (Management Unit) The structure of the management unit 4 will be described below. The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is provided in the substrate transport unit 2 with respect to the application unit. The -X direction side of 3 (the upstream side of the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45a. The -18-1361727 accommodating portion 44 is movable in the X direction by the moving mechanism 45a. The preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 are arranged in the -X direction side in this order. The sizes of the preliminary discharge mechanism 4 1 , the immersion tank 42 , and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the pillar members 31 1 a of the door frame 3 1 . - The frame 31 is accessed across the sections. - The preliminary discharge mechanism 41 is a portion that preliminarily discharges the photoresist. The preliminary discharge mechanism 41 is disposed closest to the nozzle 32. The dipping tank 42 is a liquid tank in which a diluent, a photoresist, or the like is stored. The nozzle cleaning device 43 is a device for flushing the vicinity of the opening 32a of the nozzle 32, and has a cleaning mechanism (not shown) that moves in the Y direction, and a non-illustration that moves the cleaning mechanism. Mobile agency. The moving mechanism is set to be placed on the -X direction side of the cleaning mechanism. The nozzle cleaning device 43 is provided with a moving mechanism, and has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42. When the nozzle cleaning device 43 is disposed at a position close to the nozzle 32 (+X direction side), the other portion is disposed at a position (-X direction side) far from the nozzle 32. In this case, when the nozzle 32 is connected to other portions in the accommodating portion 44, it is necessary to pass the moving mechanism, thereby making the moving distance of the nozzle 32 long. The nozzle cleaning device 43 of the present embodiment is provided at a position closer to the -X direction than the preliminary discharge mechanism 41 and the immersion tank 42, and the moving mechanism of the nozzle cleaning device 43 is provided in the nozzle cleaning device 43. The cleaning mechanism is further on the -X direction side, so the nozzle 32 does not pass the moving mechanism, and -19-1361727 is configured to minimize the moving distance of the nozzle 32. Of course, the arrangement of the pre-fetching mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements (operation of the coating device) may be used. The operation of the cloth device 1. Fig. 5 is a timing chart showing the operation of the coating device 1. As shown in Fig. 5, in the coating device 1, each operation of substrate loading, photoresist application, base discharge, preliminary discharge, and photoresist charge (pump charge) is performed. The operation of applying the photoresist to the substrate S will be described in a plan view showing the respective operations of the substrate carrying the resist application and the substrate unloading. The substrate S is carried into the substrate 20, the substrate S is floated and transported, and the photoresist is applied to the cloth processing region 21, and the S to which the photoresist has been applied is carried out from the substrate carrying-out region 22. Figs. 7 to 9 only show the outline of the door frame 31, and it is easy to judge the configuration of the nozzle 32 and the processing load. The detailed operation of each part will be described below. The coating is put on standby before the substrate is carried into the substrate loading area 20. Specifically, the transporter 23a is disposed on the side of the substrate loading position of the loading-side stage 25, and the height position of the vacuum pad 23b is at the floating height position of the substrate, and the vacant hole 25a of the loading-side stage 25 is The air ejection hole 27a of the processing stage 27, the air suction 27b, and the air ejection hole 28a of the carry-out side stage 28 respectively spout the air jet, and the plate is moved as follows to the coated substrate line display 27 The -Y positioning of the gas jet hole or the attraction of -20-1361727 is a state in which air is supplied to the extent that the substrate floats on the surface of each stage. The photoresist is pre-charged into the pump 3 3 . Specifically, the photoresists which are required to apply the photoresist after the preliminary discharge operation and the preliminary discharge operation are charged in the two pumps 33, respectively. (1) The substrate is carried in this state, for example, by a transport arm (not shown), as shown in Fig. 6, when the substrate S is transported to the substrate loading position from the outside, the elevating member 26a is moved in the +Z direction. The lift pin 26b protrudes from the lift pin exit hole 25b to the stage surface 25c. On the other hand, the substrate S is lifted by the lift pins 26b, and the substrate S is transferred. On the other hand, the positioning member protrudes from the long hole of the aligning device 25d to the stage surface 25c. After receiving the substrate S, the elevating member 26a is lowered to accommodate the lift pin 26b in the lift pin exit hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is maintained in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the positioning of the substrate S is performed by the calibration device 25d, and the vacuum pad 23b of the carrier 23a disposed on the -Y direction side of the substrate loading position is vacuum-adsorbed to the substrate S. - Y side end. Fig. 7 shows a state in which the end portion of the substrate S in the -Y direction is adsorbed. (2) Pre-discharge Before the application of the photoresist to the substrate S, the coating portion 3 performs the discharge for holding the nozzle 32. Pre-discharge action of the state. The preliminary discharge -21 - 1361727 operation is performed substantially simultaneously with the start of loading the substrate. First, as shown in the figure, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the moving mechanism 31c (shown in Fig. 4). After the door frame 31 is moved to the position of the management unit 4, the position of the door frame 31 is adjusted to connect the nozzle 32 to the nozzle cleaning device 43. In the nozzle cleaning device 43, a cleaning liquid such as a diluent is discharged toward the vicinity of the opening 32a of the nozzle 32, and if necessary, nitrogen gas and a diluent are simultaneously discharged to the opening 32a of the nozzle 32, and at the same time, there is no drawing. The cleaning mechanism shown is scanned toward the long axis direction of the nozzle 32, and the nozzle 32 is washed. After the nozzle 32 is cleaned, the nozzle 32 is connected to the preliminary discharge unit 41. In the preliminary discharge unit 41, the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is moved to the -X direction while the opening 32 2a of the nozzle 32 is moved to a predetermined position in the Z direction. The photoresist is prepared to be discharged from the opening 3 2a. In the preliminary discharge operation, among the two pumps 33 provided, one of the pumps 33 filled with the photoresist presses the internal photoresist to the flow path of the nozzle 32. After the preparatory discharge operation is performed, the portal frame 31 is returned to the original position. When the next substrate S is to be transported, as shown in Fig. 11, the nozzle 32 is moved to a predetermined position in the Z direction by the moving mechanism 31b. Alternatively, if necessary, for example, the management unit 4 is connected every predetermined number of times, the nozzle 32 is brought into the dipping tank 42. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening 32a of the nozzle 32 to a vapor atmosphere of a solvent (diluent) stored in the immersion tank 42. -22- Ί 3 61727 - (Coating) After the substrate S is sucked by the vacuum pad 23b, the carrier 23a is moved along the rail 23c. Due to the state of the lift, even if the driving force of the transporter 2 3 a is small, it can smoothly move along the rail 23 c. When the substrate S is moved from the loading stage 27, the substrate 27 is ΙΟΟμηη in the processing stage 27, and preferably 50 μm or less. Once the leading end of the substrate S in the conveyance direction reaches the position of the nozzle 32, the photoresist is applied onto the substrate S. In the operation, among the two pumps 33 provided, the pump 3 3 which is pumped in the preliminary line is again pumped to the flow path of the photoresist 3 2 in the pump 3 3 . The pressure-transmitted photoresist is discharged toward the substrate S as shown in Fig. 7 (shown in Fig. 4). This photoresist is formed by fixing the position of the nozzle 32 by the side S of the carrier 23a. The photoresist film R is applied onto the substrate S along with the movement of the substrate S. The substrate S is passed through the opening 32a of the agent to be in a predetermined region R of the substrate S. The substrate S on which the photoresist film R is formed is transported to the carry-out side stage 28 by the transporter. In the state where the carry-out side stage 2 8 is floated on the surface 28C, the substrate s is carried out as shown in Fig. 9. (4) In the substrate carrying-out direction, the end substrate S is the floating 'substrate S. The floating amount of the mounting table 25 is the J opening 32a. The photoresist coating and discharging operation is sent to the nozzle, and the discharge operation is performed from the opening. - As shown in Fig. 8, the photoresist is formed to form a photoresist film 2 3 a and transported to the substrate with respect to the stage. 23 - 1361727. Once the substrate S reaches the substrate carry-out position, the vacuum pad 23b is released. . After the adsorption of the substrate S is released, the transporter 23a is returned to the substrate loading position of the loading-side stage 25. After the adsorption is released, the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. As the elevating member 29a moves, the elevating pin 29b protrudes from the elevating pin exit hole 28b toward the rear surface of the substrate S, and the substrate S is lifted by the lift pin 29b. In this state, for example, the external transport arm ′ provided on the +X direction side of the carry-out side stage 28 is connected to the carry-out side stage 28 to receive the substrate S. The substrate S is carried out in this manner. (5) Pump charging The pump charging action starts after the completion of the discharge of the photoresist. After the photoresist is ejected, the photoresist holding portion 33a of the pump 3 3 used for the discharge of the photoresist is made empty. When the photoresist is charged, the pump 33 will act to fill the photoresist into the empty interior. In the middle of charging the photoresist, the substrate S is transported to the carry-out side stage 28, and the substrate S is carried out. (6) The loading of the next substrate (hereinafter referred to as "next substrate") S2 of the substrate is performed at substantially the same time as the start time of the substrate S. In the loading operation, similarly to the loading operation of the substrate S, the lower substrate S2 is received by the lift pins 26b, and then held up on the carry-in stage 25 to perform a calibration operation. When the substrate s is carried out, the transporter 23a that has returned to the substrate loading position returns to the substrate loading position before the calibration operation of the next substrate S2 is completed. The next substrate S2' is sucked by the suction pad 23b of the carrier 23a which is returned to the substrate loading position. (7) Preparation of the next substrate After the substrate transfer and the photoresist application operation described in the above (3), the preliminary discharge operation for discharging the photoresist onto the next substrate S2 is performed. The content of the preliminary discharge operation is the same as that described in the above (2). In the preliminary discharge operation, the pumping is performed by a pump 33 different from the pump 33 that is pressure-fed in the above (2) and (3) among the two pumps 33. When the preliminary discharge operation of the next substrate is started, the pump 33 that has been pumped in the above (2) and (3) is in a state in which the photoresist is charged. At the same timing as when the loading operation of the next substrate S2 is completed, the preliminary discharge operation of the next substrate is also completed. Then, the next substrate is prepared for the discharge operation, and is carried out together with the carry-out operation of the substrate S, the loading operation of the next substrate S2, and the photoresist filling operation. (8) Application of the next substrate The next substrate S2 is carried into the carry-in stage 25, and is adsorbed by the suction pad 23b, and then the next substrate S2 is transported to the process stage 27. After the next substrate S2 is transferred to the processing stage 27, a photoresist is applied to the next substrate S2. The contents of the transport operation and the coating operation for the next substrate S2 are the same as those described in the above (2) and (3). In the coating operation, the pumping of the photoresist is performed by the pump 33 that is pressure-fed during the pre-discharge operation of the above-mentioned (7) -25-Ι36Γ727 among the two pumps 33 (9) When the next substrate is carried out and the next substrate S reaches the substrate carry-out position, the next substrate S2 is carried out. The content ' of this action' is the same as that of the above (4). (10) Charging of the next pump This pumping operation starts after the completion of the photoresist discharge operation for the next substrate S2. In the charging operation of the photoresist, the pump 33 is actuated as in the charging operation of the photoresist described in the above (5), and is emptied after the photoresist is discharged to the next substrate 52. Internally filled with photoresist. While the photoresist is being charged, the next substrate S 2 is transported to the carry-out side stage 28, and the next substrate S2 is carried out. The above operations (6) to (10) are repeated as follows. Fig. 12 is a timing chart showing the processing of the coating apparatus in the case where the pump installed in the nozzle is one. As shown in the figure, when the pump is one, the preliminary discharge operation cannot be performed while the photoresist is being charged, and the processing time per substrate is made longer. In contrast, by way of one embodiment of the present invention, it is provided that: a plurality of pumps 33' of the photoresist are respectively pumped to the nozzles 32 of the coating portion 3, so even if one of the plurality of pumps 33 is pumped During the period of filling the photoresist -26 - 1361727 'the agent, no time is wasted, and the photoresist can be supplied to the substrate by the other pump 3 3 . Thereby, the processing time of each substrate can be reduced. By the configuration of an embodiment of the present invention, the processing line can be shortened. According to an embodiment of the present invention, the plurality of pumps 33_ are arranged at positions substantially equal to each other with respect to the nozzles 3 2, so that the photoresist transfer route between the respective pumps 33 and the nozzles 32 can be The conditions are roughly the same. Thereby, the photoresist can be stably discharged onto the substrate. According to one embodiment of the present invention, the plurality of pumps 33 are provided in the door frame 31 which can support the nozzle 32 so as to be freely movable, so that the pump 33 can be moved up and down by the lifting and lowering of the nozzles 32. Thereby, the state of the photoresist transport path between the respective pumps 33 and the nozzles 32 can be kept constant, so that the photoresist can be stably discharged onto the substrate. In addition to this, the distance between the pump 3 3 and the nozzle 3 2 is short, so that the burden of the pump 3 3 can be reduced. According to an embodiment of the present invention, the plurality of pumps 33 are attached to the bridge members 31b of the portal frame 31, so that the respective pumps 3 3 can be mounted in a stable state. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention. In the above-described embodiment, the entire structure of the coating apparatus 1 is such that the transport mechanism 23 is disposed on the -Y direction side of each stage, and is not limited thereto. For example, the transport mechanism 23 may be disposed on the +Y direction side of each stage, and as shown in Fig. 13, the transport mechanism 23 may be disposed on the _γ direction side of each stage. 23a, vacuum pad 23b, rail 23c), and a transport mechanism 53 (transporter 53a, vacuum pad 53b, track 53c) having the same structure as the transport mechanism 23 is disposed on the +Y direction side, and a transport mechanism can be used. 23 and the transport mechanism 53 transport different substrates. For example, as shown in the figure, the substrate S1 is transported by the transport mechanism 23, and the substrate S2 is transported by the transport mechanism 53. In this case, the transport mechanism can be transported by the transport mechanism 23 and the transport mechanism 53 to increase the throughput. When the substrate having the area of about half of the substrates S, SI, and S2 is transported, for example, the transport mechanism 23 and the transport mechanism 53 are held one by one, and the transport mechanism 23 and the transport mechanism 53 are oriented in the +X direction. When you walk in, you can carry two substrates at the same time. With this configuration, productivity can be improved. In the above embodiment, the pump 33 is disposed on the upper surface of the bridge member 31b of the portal frame 31, and the bridge member 31b is equally divided in the longitudinal direction. The present invention is not limited thereto, and may be disposed at another position. For example, as shown in Fig. 14, the pump 33 may be disposed on both ends of the bridging member 31b in the longitudinal direction of the bridging member 31b. The pump 33 may be disposed on the upper portion of the bridge member 31b in the longitudinal direction of the bridge member 31b. By arranging the pump 33 in the central portion in the longitudinal direction of the bridge member 31b, the length of the pipe connected between the pump 33 and the nozzle 3 2 can be shortened, so that the load on the pump 33 can be reduced. In this case, as shown in Fig. 15, a configuration may be adopted in which the two pumps 3 3 are arranged along the longitudinal direction of the bridge member 31b. As shown in Fig. 16, two pumps may be used. 33 is arranged along the substrate conveyance direction (the bridge members 31b-28 - 1361727 are shown in two frames, and the frame is placed in the opposite direction of the short axis of 32). In the configuration in which the pump 33 is disposed along the substrate conveyance side, in particular, the length of the pipe can be shortened' and the pumps 33 can be attached to the face other than the upper surface of the bridge member 31b. As shown in Fig. 17, a configuration in which the two pumps 33 are attached to the strut members 31a of the portal frame 31 may be employed. In this case, as shown in FIG. 17, a structure in which one pump 33 is attached to each of the pillar members 31a may be a structure of the pump 33 in which one of the pillar members 31a is provided in a plurality of pillar members 31a. . As shown in Fig. 18, it is also possible to form a configuration in which the pump mounting frame 60 for mounting the Lipu 33 is additionally provided. As shown in Fig. 18, the Lipu mounting frame 60 may be disposed on the upstream side (the -X direction side) with respect to the base conveyance direction of the door frame 31, or may be disposed on the substrate conveyance with respect to the portal frame 31. The downstream side (+X direction side) of the direction may be a structure in which both the upstream side and the downstream side of the substrate conveyance direction are arranged. A plurality of nozzles 32 can also be disposed, and the plurality of nozzles 32 are disposed separately from the pump 33. In Fig. 19, an example in which each of the nozzles 32 is disposed on the upstream side and the side of the substrate in the substrate conveyance direction of the door frame 31 is shown. The long axis directions of the two nozzles 32 are arranged to intersect perpendicularly in the substrate conveyance direction. With this configuration, the different nozzles 32 can be used interchangeably for each of the substrates. Therefore, during the coating operation by one of the nozzles 32, the other nozzle 32 can be filled with the photoresist. By having a plurality of nozzles, different types of photoresist can be applied interactively. Alternatively, the plurality of management units 4 may be provided. In the structure of Fig. 19, the example in which each of the nozzles 32 is disposed on the upstream side and the downstream side in the substrate conveyance direction of the door frame 31 is shown, but the present invention is not limited thereto, and a plurality of doors may be disposed. The frame 31 has a longitudinal direction of the nozzle 32 of each of the plurality of gate frames 31 in a direction perpendicular to the substrate conveyance direction. In this case, a plurality of management units 4 can be provided. According to this configuration, the nozzles 32 provided at the plurality of gate frames 31 that are independently controlled can be used interchangeably for each of the substrates. Therefore, during the coating operation by one of the nozzles 32, The other nozzle 32 is filled with a photoresist. By having a plurality of nozzles 3 2, different kinds of photoresists can be alternately applied. In the structure of Fig. 19, by allowing each nozzle 32 to move independently, the preliminary discharge operation can be performed even after the photoresist is charged. Thereby, the processing line can be shortened. In the case where the respective nozzles 32 independently perform the preliminary discharge operation, a plurality of management units 4 may be provided. In this case, it is preferable to arrange the nozzle 32 and the pump 33 connected to the nozzle 32 integrally. As such a configuration, for example, a structure in which the pump 33 is directly attached to the nozzle 32, or a structure in which the nozzle 32 is integrally attached to the moving member, and the pump 33 is attached to the moving member, etc. The nozzle 32 is moved integrally with the pump 33, so that the position of both of them can be prevented from changing due to the movement of the nozzle 32. Thereby, the environment of the photoresist conveyance path between the nozzle 32 and the pump 33 can be maintained, so that the photoresist discharge of the nozzle 32 can be stabilized. In each of the above configurations, as the plurality of pumps 3, for example, an example in which two pumps 33 are disposed will be described, but the present invention is not limited thereto. For example, three pumps 33 on -30-1361727 may be provided. In the above embodiment, a pump 33 is provided for one nozzle 32, and is not limited thereto. For example, two pumps 33 may be used for one nozzle 32. [Industrial Applicability] The present invention provides a coating apparatus and a coating method capable of shortening a processing line, and is very useful industrially. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 3 is a plan view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 4 is a side view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 5 is a timing chart showing the operation of the coating apparatus of one embodiment of the present invention. Fig. 6 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 7 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention -31 - 1361727. Fig. 9 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 10 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 11 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 12 is a timing chart showing the operation of the coating device when the pump is one. Fig. 13 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 14 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 15 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 16 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 17 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 18 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 19 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. -32- 1361727 [Description of main component symbols] 1 : 2 : 3 : Coating unit substrate conveying unit application unit, 4 : Management unit 27 : Processing stage. 3 1 : Portal frame 32 : Nozzle Φ 33 : Pump S : Substrate R : Photoresist film • -33