TW201008856A - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

Info

Publication number
TW201008856A
TW201008856A TW098119238A TW98119238A TW201008856A TW 201008856 A TW201008856 A TW 201008856A TW 098119238 A TW098119238 A TW 098119238A TW 98119238 A TW98119238 A TW 98119238A TW 201008856 A TW201008856 A TW 201008856A
Authority
TW
Taiwan
Prior art keywords
substrate
coating
holding
coating apparatus
auxiliary mechanism
Prior art date
Application number
TW098119238A
Other languages
Chinese (zh)
Other versions
TWI481540B (en
Inventor
Yoshiaki Masu
Shinji Takase
Akihiro Shimizu
Tsuneo Tanimoto
Naonobu Tatsuma
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tazmo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW201008856A publication Critical patent/TW201008856A/en
Application granted granted Critical
Publication of TWI481540B publication Critical patent/TWI481540B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like

Abstract

The coating apparatus includes a transferring part is provided with a transferring unit having a holding part for holding a substrate and transferring the substrate while holding the substrate, and an auxiliary unit for thrusting the substrate towards the holding part, so that the substrate can be held with both the holding part and the auxiliary unit. Therefore, the substrate can be held firmly, and hence, displacement of the substrate can be suppressed. As a result, coating defects caused by the displacement of the substrate can be prevented, and the upper face of the transferring part can be maintained clean.

Description

201008856 六、發明說明: 【發明所屬之技術領域】 本發明是關於塗佈裝置及塗佈方法。 本案是根據於2008年06月26日在日本所申請的日 本特願2008- 1 67362號案來主張優先權,在此引用其內容 φ 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上,形成 有配線或電極、彩色濾光片等的細微圖案。一般來說這種 圖案,是用例如光微影技術等的方法所形成。在光微影技 術中,分別進行:在玻璃基板上形成光阻膜的光阻膜形成 步驟、將該光阻膜進行圖案曝光的曝光步驟、及之後將該 光阻膜予以顯像的顯像步驟。 在光阻膜形成步驟,所使用的塗佈裝置,是在玻璃基 Q 板的表面上塗佈光阻膜。已知的塗佈裝置(例如參考專利 文獻1))的構造,例如使玻璃基板浮起於台部上進行搬 運,在藉由與台部相對向設置的狹縫噴嘴而上浮移動的玻 璃基板的表面塗佈光阻劑。如專利文獻1的記載,搬運玻 璃基板的搬運機構,往往設置於台部的側部。 在搬運機構設置有:用來保持玻璃基板的側緣部的基 板保持部,是在藉由該基板保持部保持住側緣部的狀態來 搬運玻璃基板。基板保持部,是保持玻璃基板,所以通常 設置得較搬運機構的其他部分更朝台部側突出。 -5- 201008856 〔專利文獻1〕 日本特開2005-236092號公報 【發明內容】 〔發明欲解決的課題〕 可是,當要使玻璃基板移動時,尤其是玻璃基板開始 移動時或停止移動時,會施加與玻璃基板的加速方向相反 的方向的力量,而可能會因爲該相反的力量讓玻璃基板的 保持位置偏移。例如若當玻璃基板開始移動時,保持位置 偏移的話,則光阻劑的塗佈區域就會相對於原來的塗佈區 域偏移。如果保持位置的偏移情形較大的話,則也可能將 光阻劑塗佈到從玻璃基板偏離的區域,而讓光阻劑附著於 台部上。 如果將基板保持部設置成較搬運機構的其他部分更朝 台部側突出的話’則當搬運機構移動時,可能會與塗佈裝 置的其他組成構件碰撞或接觸’而成爲搬運機構或該組成 構件損壞、故障等的缺點的原因。 鑑於以上情形,本發明的目的要提供—種塗佈裝置及 塗佈方法’可以防止不良塗佈的情形,且可將基板搬運部 上保持潔淨。而且本發明的目的要提供一種塗佈裝置,可 避免裝置的組成構件的損壞、故障等的缺點。 〔用以解決課題的手段〕 爲了達成上述目的,本發明的塗佈裝置,是具備有: -6- 201008856 使基板浮起來進行搬運的基板搬運部、以及在藉由該基板 搬運部進行搬運的同時,將液狀體塗佈於上述基板的塗佈 部,之塗佈裝置,其特徵爲:是具備有:設置於上述基板 搬運部,具有將上述基板予以保持的保持部,在保持上述 基板的狀態將其進行搬運的搬運機構、以及將上述基板按 壓於上述保持部的輔助機構。 藉由本發明,在基板搬運部設置有:具有將基板予以 Φ 保持的保持部,且在保持基板的狀態將其進行搬運的搬運 機構,而具備有將該基板按壓於保持部的輔助機構,所以 除了搬運機構的保持部之外,也能藉由輔助機構來保持基 板。因此,能夠更堅固地保持基板,藉此能抑制基板的偏 移情形。且可防止因爲基板的偏移導致的不良塗佈情形, 可將基板搬運部上保持潔淨。 上述塗佈裝置,上述搬運機構,將上述基板之中沿著 該基板的搬運方向的其中一側部予以保持。 Φ 藉由本發明,在搬運機構,將基板之中沿著該基板的 搬運方向的其中一側部予以保持的情況,也能更堅固地保 持基板。藉此,不會加寬保持區域,而能穩定保持住基板 上述塗佈裝置,上述輔助機構設置在上述基板的搬運 開始位置。 藉由本發明,在將輔助機構設置在基板的搬運開始位 置的情況,可以防止在基板的搬運開始位置的基板偏移情 形。 201008856 上述塗佈裝置,上述輔助機構設置成可朝上述基板的 搬運方向移動。 藉由本發明,在將輔助機構設置成可朝基板的搬運方 向移動的情況,可以配合基板的移動使輔助機構移動。因 此,例如只要在基板移動期間,可以將基板按壓於保持部 。藉此,可以穩定保持住基板。 上述塗佈裝置,上述輔助機構搭載於上述搬運機構。 藉由本發明,在將輔助機構搭載於搬運機構的情況, 可以使搬運機構與輔助機構一體移動。藉此,不用將搬運 機構的移動速度與輔助機構的移動速度進行調整,而能防 止兩機構的位置偏移,所以能更容易達成基板的穩定保持 上述塗佈裝置,上述輔助機構具有退避機構。 藉由本發明,在輔助機構具有退避機構的情況,例如 若在移動路線上設置有其他組成構件等,則可以迴避該其 他組成構件。藉此,則可以避免輔助機構與該組成構件之 間的碰撞或接觸,而能避免裝置損壞、故障等的缺點。 上述塗佈裝置,上述輔助機構,將上述基板之中的與 上述搬運機構所保持的面部不同的面部予以按壓。 藉由本發明,在輔助機構,將基板之中的與搬運機構 所保持的面部不同的面部予以按壓的情況,會藉由搬運機 構與輔助機構來保持住基板的表背兩面。藉此能讓基板更 不會偏移。 上述塗佈裝置,上述輔助機構,具有將上述基板予以 -8- 201008856 按壓的按壓部,上述按壓部,是由:將上述基板的按壓面 的狀態予以保持的材質所構成。 藉由本發明,在輔助機構具有將基板予以按壓的按壓 部,按壓部,是由:將基板的按壓面的狀態予以保持的材 質所構成的情況,當藉由輔助機構按壓基板時,能夠抑制 基板的按壓面的狀態產生變化。一般來說,往往會因爲按 壓面的狀態(溫度、有無傷痕等)的變化,而讓塗佈於基 ^ 板上的液狀體的狀態變化。相對於此,在本發明可以抑制 這種按壓面的狀態變化情形,所以能使液狀體的狀態穩定 〇 上述塗佈裝置,上述輔助機構,按壓從俯視方向觀察 與上述保持部重疊的位置。 藉由本發明,在輔助機構,按壓從俯視方向觀察與保 持部重疊的位置的情況,則可以藉由輔助機構與保持部精 確定位地夾持基板。藉此能讓基板更不會偏移。 Φ 上述塗佈裝置,上述輔助機構具有朝上述基板噴出氣 體的氣體噴出部,藉由上述氣體的噴出而以非接觸方式按 壓上述基板。 藉由本發明,輔助機構具有朝基板噴出氣體的氣體噴 出部,藉由氣體的噴出而以非接觸方式按壓基板,則可以 減少對於基板機械性的接觸。藉此,則可抑制基板的變形 或傷痕的產生等。 上述塗佈裝置,於上述基板的搬運方向設置有複數個 上述氣體噴出部》 -9- 201008856 藉由本發明,於基板的搬運方向設置有複數個氣體噴 出部的情況,在搬運基板的移動路線上,也能以非接觸方 式按壓基板。藉此,能更穩定地保持基板。 上述塗佈裝置,上述輔助機構,將上述基板之中與上 述搬運機構所保持的面部相同的面部予以吸引。 藉由本發明,在輔助機構,將基板之中與搬運機構所 保持的面部相同的面部予以吸引的情況,藉此在基板所保 持的面部相反的面部上可以確保空間。 上述塗佈裝置,上述輔助機構具有:接觸上述基板將 其吸引的吸引部,上述吸引部是由:將上述基板的吸引面 的狀態予以保持的材質所構成。 藉由本發明,在輔助機構具有:接觸基板將其吸引的 吸引部,吸引部是由:將基板的吸引面的狀態予以保持的 材質所構成的情況,當藉由輔助機構吸引基板時,可以抑 制基板的吸引面的狀態變化。藉此,可以使基板上塗佈的 液狀體的狀態穩定化。 上述塗佈裝置,上述輔助機構具有:吸附於上述基板 的吸附部。 藉由本發明,輔助機構具有:吸附於基板的吸附部, 所以可以藉由該吸附部穩定保持基板。 上述塗佈裝置,上述輔助機構具有將其與上述基板之 間的氣體予以吸引的氣體吸引部,藉由上述氣體的吸引, 以非接觸方式吸引上述基板。 藉由本發明,在輔助機構具有將其與基板之間的氣體 -10- 201008856 予以吸引的氣體吸引部,藉由氣體的吸引,以非接觸方式 吸引基板的情況,可以減少對於基板的機械性的接觸。藉 此可以抑制基板的變形或傷痕的產生等情形。 上述塗佈裝置,在上述塗佈部的上游側及下游側其中 至少一方,設置有台部,該台部具備有使上述基板浮起的 浮起機構,上述台部具有從俯視方向觀察大致正方形的形 狀。 @ 藉由本發明,在上述塗佈部的上游側及下游側其中至 少一方,設置有台部,該台部具備有使基板浮起的浮起機 構的情況,在台部上搬運基板時可以確實防止基板的偏移 。而在台部具有從俯視方向觀察大致正方形的形狀的情況 ,則不管基板具有長軸或短軸方向,在該基板的長軸及短 軸方向的任何方向都能進行搬運。 本發明的塗佈方法,是使基板浮起來進行搬運的同時 ,對上述基板塗佈液狀體的塗佈方法,其特徵爲:藉由將 q 上述基板進行搬運的搬運機構的保持部,來保持上述基板 ,將被上述保持部所保持的上述基板朝向上述保持部按壓 ,在保持住上述基板的狀態,搬運該基板而塗佈上述液狀 體。 藉由本發明,藉由將基板進行搬運的搬運機構的保持 部,來保持基板,將被保持部所保持的基板朝向保持部按 壓,在保持住基板的狀態,搬運該基板而塗佈液狀體,所 以與只藉由保持部來保持基板的情況相比,可以更堅固地 保持住基板,藉此能抑制基板的偏移情形。且可防止因爲 -11 - 201008856 基板的偏移導致的不良塗佈情形,可將基板搬運部上保持 潔淨。 上述塗佈方法,在按壓住上述基板的狀態來搬運上述 基板。 藉由本發明,在按壓住基板的狀態來搬運該基板的情 況,能更確實地防止基板的保持位置偏移。 上述塗佈方法,在搬運上述基板之前,解除對上述基 板的上述保持部的按壓。 藉由本發明,在搬運基板之前,解除對基板的保持部 的按壓的情況,則能容易進行基板搬運的控制。 在上述塗佈方法,當搬運上述基板時,解除對上述基 板的上述保持部的按壓。 藉由本發明,當搬運基板時,解除對基板的保持部的 按壓的情況,藉此能容易進行基板搬運的控制。因此能容 易防止基板保持位置的偏移,容易進行基板搬運的控制。 在上述塗佈方法,在塗佈上述液狀體之前,解除對上 述基板的上述保持部的按壓。 藉由本發明,在塗佈液狀體之前,解除對基板的保持 部的按壓的情況,能容易避免基板的偏移,容易進行塗佈 時的基板搬運的控制。 本發明的塗佈裝置,是具備有:將基板進行搬運的基 板搬運部、以及在藉由該基板搬運部進行搬運的同時,將 液狀體塗佈於上述基板的塗佈部,之塗佈裝置,其特徵爲 :是具備有:設置於上述基板搬運部,具有將上述基板予 -12- 201008856 以保持的保持部,在保持上述基板的狀態將其進行搬運的 搬運機構;上述搬運機構,設置成可朝上述基板的搬運方 向移動,上述保持部,設置成可朝與上述搬運方向不同的 方向移動。 藉由本發明,搬運基板的搬運機構,設置成可朝該基 板的搬運方向移動,設置於搬運機構的保持部,設置成可 朝與搬運方向不同的方向移動,所以即使在針對保持部的 ^ 搬運方向的移動區域上設置有其他組成構件的情況,可以 迴避該組成構件。藉此,可以避免裝置的組成構件的損壞 、故障等的缺失。 上述塗佈裝置,上述基板搬運部具備有使上述基板浮 起的浮起機構。 藉由本發明,在基板搬運部具備有使基板浮起的浮起 機構的情況,則即使當使基板浮起進行搬運時,在保持部 的移動區域上設置有其他組成構件的情況,也能迴避該組 0 成構件。當使基板浮起而使其移動時,作爲保持部是必須 要有更精密的構造,所以避免與其他組成構件碰撞或接觸 是有很大的意義。 上述塗佈裝置,上述保持部,具備有:在搬運基板後 ,以退避的狀態回到基板搬運部的退避機構。 藉由本發明,在保持部,具備有:在搬運基板後,以 退避的狀態回到基板搬運部的退避機構的情況,則即使當 回到基板搬運部時,在保持部的移動區域上設置有其他組 成構件的情況,也能以避開其他組成構件的方式移動。 -13- 201008856 上述塗佈裝置,在上述塗佈部的上游側及下游側其中 至少一方,設置有台部,該台部具備有使上述基板浮起的 浮起機構,上述台部具有從俯視方向觀察大致正方形的形 狀。 藉由本發明,在上述塗佈部的上游側及下游側其中至 少一方,設置有台部,該台部具備有使基板浮起的浮起機 構的情況,在台部上搬運基板時可以確實防止基板的偏移 。而在台部具有從俯視方向觀察大致正方形的形狀的情況 ,則不管基板具有長軸或短軸方向,在該基板的長軸及短 軸方向的任何方向都能進行搬運。 〔發明效果〕 藉由本發明,在基板搬運部設置有:具有將基板予以 保持的保持部,且在保持基板的狀態將其進行搬運的搬運 機構,而具備有將該基板按壓於保持部的輔助機構,所以 除了搬運機構的保持部之外,也能藉由輔助機構來保持基 板。因此,能夠更堅固地保持基板,藉此能抑制基板的偏 移情形。且可防止因爲基板的偏移導致的不良塗佈情形, 可將基板搬運部上保持潔淨。 藉由本發明,搬運基板的搬運機構,設置成可朝該基 板的搬運方向移動,設置於搬運機構的保持部,設置成可 朝與搬運方向不同的方向移動,所以即使在針對保持部的 搬運方向的移動區域上設置有其他組成構件的情況,可以 迴避該組成構件。藉此,可以避免裝置的組成構件的損壞 -14- 201008856 、故障等的缺失。 【實施方式】 根據圖面來說明本發明的第一實施方式。 第1圖是本實施方式的塗佈裝置1的立體圖。 如第1圖所示,本實施方式的塗佈裝置1,是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置,是 0 以:基板搬運部2、塗佈部3、管理部4,爲主要構成元件 。該塗佈裝置1,是在藉由基板搬運部2使基板浮起的狀 態來進行搬運,且藉由塗佈部3將光阻劑塗佈於該基板上 ,藉由管理部4來管理塗佈部3的狀態。 第2圖是塗佈裝置1的正視圖,第3圖是塗佈裝置1 的俯視圖,第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。以下在說明塗佈裝置1的 構造時,爲了容易表示,使用XYZ座標系統來說明圖中 _ 的方向。將基板搬運部2的長軸方向也就是基板的搬運方 向記爲X方向。將從俯視方向觀察與X方向(基板搬運 方向)垂直相交的方向記爲Y方向。將與包含X方向軸 及Y方向軸的平面垂直的方向記爲Z方向。分別在X方 向、Y方向及Z方向,圖中箭頭的方向爲+方向,與箭頭 的方向相反的方向爲-方向。 (基板搬運部) 首先說明基板搬運部2的構造。 -15- 201008856 基板搬運部2具有:框架21、台部22、搬運機構23 、輔助機構24。在基板搬運部2,藉由本實施方式的特徵 構成元件也就是搬運機構23及輔助機構24,將基板S於 台部22上朝+X方向搬運。 框架21,是例如載置於地面上,並且用來支承台部 22及搬運機構23的支承構件。框架21是分割爲三個部分 ,該三個部分排列於Y方向上。框架中央部21a,是分割 的三個部分之中配置於Y方向的中央的部分,來支承台部 22。框架側部21b’配置於框架中央部21a的-Y方向側, 支承著搬運機構23。在框架側部21b與框架中央部21a之 間設置有間隙。框架側部21c,配置在框架中央部21a的 + Y方向側’支承著搬運機構23。在框架側部21c與框架 中央部2 1 a之間設置有間隙。框架中央部2 1 a、框架側部 21b及框架側部21c’在X方向爲長軸方向,各部分在X 方向的尺寸大致相同。 台部22’具有:搬入側台25、處理台27、與搬出側 台28。搬入側台25、處理台27以及搬出側台28,是在框 架中央部21a上,以該順序從基板搬運方向的上游側排列 到下游側(朝+X方向)。 搬入側台25 ’是由例如SUS等所構成,是從俯視方 向觀察大致正方形的板狀構件。藉由將搬入側台25的形 狀形成爲俯視方向觀察爲大致正方形,則即使在搬運具有 長軸及短軸方向的基板的情況,也可朝任何方向搬運該基 板。在本實施方式,搬入側台25上的區域爲基板搬入區 -16- 201008856 域25S。基板搬入區域25S,是將從裝置外部搬運過來的 基板S進行搬入的區域。 在搬入側台25,分別設有複數的空氣噴出孔25a、與 複數的升降銷出沒孔25b。空氣噴出孔25a及升降銷出沒 孔2 5b,是設置成分別貫穿搬入側台25。 空氣噴出孔25a,是將空氣噴出到搬入側台25的台表 面2 5c上的孔,配置成從俯視方向觀察爲矩陣狀。空氣噴 A 出孔25a連接著沒有圖示的空氣供給源。在搬入側台25, ❹ 藉由從空氣噴出孔25a所噴出的空氣而能使基板S朝+Z 方向浮起。 升降銷出沒孔2 5b,是設置在搬入側台25的基板搬入 位置。升降銷出沒孔25b,讓供給到台表面25c的空氣不 會漏出。 在搬入側台25之中的Y方向的兩端部,各設置有一 個校準裝置25d。校準裝置25d,是將搬入到搬入側台25 φ 的基板S予以定位的裝置。各校準裝置25d具有:長孔部 、與設在該長孔部內的定位構件,藉由將搬入到搬入側台 25的基板從兩側機械性地予以夾持,來定位基板的位置。 在搬入側台25的-Z方向側,也就是在搬入側台25的 背面側,設置有升降機構26。升降機構26,設置成從俯 視方向觀察重疊於搬入側台25的基板搬入位置25L (參 考第6圖)。升降機構26具有:升降構件26a、與複數的 升降銷26b。升降構件26a,連接於沒有圖示的驅動機構 ,藉由該驅動機構的驅動而讓升降構件26a朝Z方向移動 -17- 201008856 。複數的升降銷26b,從升降構件26a的上面部朝向搬入 側台25豎立設置。各升降銷26b,是配置在:從俯視方向 觀察分別與上述升降銷出沒孔25b重疊的位置。藉由讓升 降構件26a朝Z方向移動,則各升降銷26b會從升降銷出 沒孔25b出沒於台表面25c上。各升降銷26b的+Z方向 的端部是設置成分別與Z方向上的位置一致,而能將從裝 置外部搬運過來的基板S保持爲水平的狀態。 處理台27,是以例如硬質氧化鋁膜爲主成分的光吸收 材料來覆蓋台表面27c的從俯視方向觀察爲矩形的板狀構 件,是設置在相對於搬入側台25的+X方向側。在處理台 27之中以光吸收材料覆蓋的部位,會抑制雷射光等的光線 反射。該處理台27,Y方向爲長軸。處理台27的Y方向 的尺寸,與搬入側台25的Y方向尺寸大致相同。在本實 施方式,處理台27上的區域爲進行光阻劑塗佈的塗佈處 理區域27S。 在處理台27設置有:將空氣噴出到台表面27c上的 複數的空氣噴出孔27a、與將台表面27c上的空氣予以吸 引的複數的空氣吸引孔27b。這些空氣噴出孔27a及空氣 吸引孔27b,設置成貫穿處理台27。在處理台27的內部 ,設置有:用來對通過於空氣噴出孔27a及空氣吸引孔 2 7b的氣體的壓力施加阻力的沒有圖示的複數個溝部。該 複數個溝部,在台部內部連接於空氣噴出孔27a及空氣吸 引孔27b 。 在處理台27,空氣噴出孔27a的間距,是相較於設置 -18- 201008856 在搬入側台25的空氣噴出孔25a的間距更狹窄,與搬入 側台25相比,將空氣噴出孔27a設置得較緊密。因此, 與其他的台部相比,在該處理台27能以較高精確度來調 節基板的浮起量,基板的浮起量例如可控制爲l〇〇//m以 下,而5〇em以下較佳。 搬出側台28,設置在相對於處理台27的+X方向側, 由與設置在基板搬入區域25S的搬入側台25大致相同的 φ 材質、尺寸所構成。針對搬出側台28的形狀,也是從俯 視方向觀察爲大致正方形。在本實施方式,搬出側台28 上的區域爲基板搬出區域28S。基板搬出區域28S,是將 塗佈好光阻劑的基板S搬出到裝置外部的基板搬出區域 28S = 與搬入側台25同樣地,在搬出側台28設置有:空氣 噴出孔28a及升降銷出沒孔28b。升降機構29設置在:搬 出側台28的-Z方向側,也就是搬出側台28的背面側。升 ❹ 降機構29’設置成從俯視方向觀察重疊於搬出側台28的 基板搬出位置。升降機構29的升降構件29a及升降銷29b ,與設置在搬入側台25的升降機構26的各部位爲相同的 構造。該升降機構29,當將搬出側台28上的基板S搬出 到外部裝置時,能藉由基板S交接用的升降銷29b來將基 板S抬起。 搬運機構23’具有保持住基板S將其朝+X方向搬運 的機構,且在框架側部21b及框架側部21c上設置有一對 。該一對搬運機構23,是相對於台部22的Y方向中央呈 -19- 201008856 線對稱的構造,除了該線對稱之外爲相同的構造。於是, 以下舉例來說明設置於框架側部21b的搬運機構23。 搬運機構23,具有:搬運機23a、基板保持部23b、 軌道23c。搬運機23a的構造是在內部設置有例如線性馬 達,藉由驅動該線性馬達,讓搬運機23a可於軌道23c上 移動。201008856 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a coating apparatus and a coating method. The present application claims priority based on Japanese Patent Application No. 2008-1671362, filed on Jun. 26, 2008, the content of which is hereby incorporated by reference. On top, a fine pattern of wiring, electrodes, color filters, or the like is formed. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a photoresist film forming step of forming a photoresist film on a glass substrate, an exposure step of patterning the photoresist film, and a subsequent image development of the photoresist film are respectively performed. step. In the photoresist film forming step, the coating device used is coated with a photoresist film on the surface of the glass-based Q plate. A structure of a known coating apparatus (for example, refer to Patent Document 1)), for example, a glass substrate that is floated on a table top and transported, and is moved by a slit nozzle that is provided to face the stage portion The surface is coated with a photoresist. As described in Patent Document 1, the transport mechanism for transporting the glass substrate is often provided on the side portion of the table portion. In the transporting mechanism, the substrate holding portion for holding the side edge portion of the glass substrate is provided, and the glass substrate is transported while the side edge portion is held by the substrate holding portion. Since the substrate holding portion holds the glass substrate, it is usually provided to protrude toward the land portion more than the other portion of the conveying mechanism. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-236092 [Draft of the Invention] [Problems to be Solved by the Invention] However, when the glass substrate is to be moved, especially when the glass substrate starts moving or stops moving, A force in a direction opposite to the acceleration direction of the glass substrate is applied, and the holding position of the glass substrate may be shifted due to the opposite force. For example, when the glass substrate starts to move and the position is shifted, the coated area of the photoresist is shifted from the original coating area. If the offset of the holding position is large, it is also possible to apply the photoresist to the region deviated from the glass substrate and allow the photoresist to adhere to the land. If the substrate holding portion is disposed to protrude toward the table side more than other portions of the conveying mechanism, then when the conveying mechanism moves, it may collide or contact with other constituent members of the coating device to become a conveying mechanism or the constituent member. The cause of defects such as damage, malfunction, etc. In view of the above circumstances, it is an object of the present invention to provide a coating apparatus and a coating method which can prevent a poor coating and keep the substrate carrying portion clean. Moreover, it is an object of the present invention to provide a coating apparatus which can avoid the disadvantages of damage, malfunction, and the like of the constituent members of the apparatus. [Means for Solving the Problems] In order to achieve the above object, the coating apparatus of the present invention includes: -6-201008856 A substrate transporting unit that transports a substrate and transports the substrate, and transported by the substrate transporting unit At the same time, the coating apparatus is characterized in that the coating apparatus is provided in the substrate conveying unit, and includes a holding unit that holds the substrate, and holds the substrate. In the state, the transport mechanism that transports the transport mechanism and the auxiliary mechanism that presses the substrate to the holding portion. According to the present invention, the substrate transporting portion is provided with a transporting mechanism that holds the substrate in a state where the substrate is held by the Φ, and the auxiliary mechanism that presses the substrate to the holding portion is provided. In addition to the holding portion of the transport mechanism, the substrate can be held by the auxiliary mechanism. Therefore, the substrate can be held more firmly, whereby the deflection of the substrate can be suppressed. Further, it is possible to prevent the poor coating from being caused by the offset of the substrate, and it is possible to keep the substrate carrying portion clean. In the above coating apparatus, the transport mechanism holds one of the substrates along one of the conveyance directions of the substrate. Φ According to the present invention, in the case where the transport mechanism holds the one side portion of the substrate along the transport direction of the substrate, the substrate can be held more firmly. Thereby, the substrate can be stably held without widening the holding area, and the auxiliary mechanism is provided at the conveyance start position of the substrate. According to the present invention, when the auxiliary mechanism is disposed at the conveyance start position of the substrate, the substrate offset at the conveyance start position of the substrate can be prevented. 201008856 In the above coating apparatus, the auxiliary mechanism is provided to be movable in a conveyance direction of the substrate. According to the present invention, when the auxiliary mechanism is provided to be movable in the conveyance direction of the substrate, the auxiliary mechanism can be moved in accordance with the movement of the substrate. Therefore, for example, the substrate can be pressed against the holding portion during the movement of the substrate. Thereby, the substrate can be stably held. In the above coating apparatus, the auxiliary mechanism is mounted on the transport mechanism. According to the present invention, when the auxiliary mechanism is mounted on the transport mechanism, the transport mechanism and the auxiliary mechanism can be integrally moved. Thereby, the positional deviation of the two mechanisms can be prevented without adjusting the moving speed of the transport mechanism and the moving speed of the auxiliary mechanism, so that the substrate can be more stably maintained. The above-described auxiliary device has a retracting mechanism. According to the present invention, in the case where the assisting mechanism has the retracting mechanism, for example, if other constituent members or the like are provided on the moving route, the other constituent members can be avoided. Thereby, collision or contact between the auxiliary mechanism and the constituent member can be avoided, and the disadvantages of device damage, malfunction, and the like can be avoided. In the above coating apparatus, the auxiliary mechanism presses a surface of the substrate different from a surface held by the transport mechanism. According to the present invention, when the auxiliary mechanism presses a face different from the face held by the transport mechanism among the substrates, the front and back sides of the substrate are held by the transport mechanism and the auxiliary mechanism. This allows the substrate to be less offset. In the above-mentioned coating device, the auxiliary mechanism includes a pressing portion that presses the substrate -8-201008856, and the pressing portion is made of a material that holds the pressing surface of the substrate. According to the present invention, the auxiliary mechanism has a pressing portion for pressing the substrate, and the pressing portion is formed of a material that holds the pressing surface of the substrate. When the substrate is pressed by the auxiliary mechanism, the substrate can be suppressed. The state of the pressing surface changes. In general, the state of the liquid applied to the substrate is often changed by the change in the state of the pressed surface (temperature, presence or absence of scratches, etc.). On the other hand, in the present invention, the state of the pressing surface can be suppressed, so that the state of the liquid material can be stabilized. The coating device can press the position overlapping the holding portion as viewed from the plan view. According to the present invention, when the auxiliary mechanism presses the position overlapping the holding portion in the plan view direction, the auxiliary mechanism and the holding portion can hold the substrate in a precise position. This allows the substrate to be less offset. Φ In the above coating apparatus, the auxiliary mechanism has a gas ejecting portion that ejects a gas toward the substrate, and the substrate is pressed in a non-contact manner by the ejecting of the gas. According to the invention, the auxiliary mechanism has the gas ejecting portion that ejects the gas toward the substrate, and the substrate is pressed in a non-contact manner by the ejection of the gas, whereby the mechanical contact with the substrate can be reduced. Thereby, deformation of the substrate, generation of scratches, and the like can be suppressed. In the above-described coating apparatus, a plurality of the gas ejecting units are provided in the transport direction of the substrate. -9- 201008856 According to the present invention, a plurality of gas ejecting portions are provided in the transport direction of the substrate, and the moving path of the transporting substrate is performed. The substrate can also be pressed in a non-contact manner. Thereby, the substrate can be held more stably. In the above coating apparatus, the auxiliary mechanism attracts the same surface of the substrate as the face held by the transport mechanism. According to the present invention, in the assisting mechanism, the same surface portion of the substrate as the face held by the transport mechanism is attracted, whereby the space can be secured on the face opposite to the face held by the substrate. In the above coating apparatus, the auxiliary mechanism includes a suction portion that contacts the substrate to attract the suction portion, and the suction portion is formed of a material that holds the suction surface of the substrate. According to the present invention, the auxiliary mechanism includes a suction portion that contacts the substrate to attract the suction portion, and the suction portion is formed of a material that holds the state of the suction surface of the substrate. When the substrate is attracted by the auxiliary mechanism, it can be suppressed. The state of the attraction surface of the substrate changes. Thereby, the state of the liquid applied on the substrate can be stabilized. In the above coating apparatus, the auxiliary mechanism includes an adsorption unit that is adsorbed on the substrate. According to the invention, the auxiliary mechanism has the adsorption portion that is adsorbed on the substrate, so that the substrate can be stably held by the adsorption portion. In the above coating apparatus, the auxiliary mechanism has a gas suction portion that sucks gas between the substrate and the substrate, and sucks the substrate in a non-contact manner by suction of the gas. According to the present invention, in the assisting mechanism, the gas suction portion that sucks the gas -10-201008856 between the substrate and the substrate can attract the substrate in a non-contact manner by suction of the gas, thereby reducing the mechanical properties of the substrate. contact. Thereby, deformation or damage of the substrate can be suppressed. In the coating device, at least one of the upstream side and the downstream side of the application portion is provided with a table portion provided with a floating mechanism for floating the substrate, and the table portion has a substantially square shape as viewed from a plan view. shape. According to the present invention, at least one of the upstream side and the downstream side of the application portion is provided with a table portion provided with a floating mechanism for floating the substrate, and the substrate can be reliably transported when the substrate is transported on the table portion. Prevent the offset of the substrate. On the other hand, when the table portion has a substantially square shape as viewed in a plan view, the substrate can be transported in any direction in the long axis and the short axis direction of the substrate regardless of whether the substrate has a long axis or a short axis direction. In the coating method of the present invention, the substrate is coated with a liquid, and the method of applying the liquid to the substrate is characterized in that the holding portion of the transport mechanism that transports the substrate is The substrate is held, and the substrate held by the holding portion is pressed toward the holding portion, and the liquid substrate is applied while the substrate is held while the substrate is held. According to the present invention, the substrate is held by the holding portion of the transport mechanism that transports the substrate, and the substrate held by the holding portion is pressed toward the holding portion, and the substrate is transported while the substrate is held to apply the liquid material. Therefore, the substrate can be held more firmly than in the case where the substrate is held only by the holding portion, whereby the offset of the substrate can be suppressed. It also prevents the poor coating from -11 - 201008856 substrate, and keeps the substrate handling part clean. In the above coating method, the substrate is conveyed while the substrate is pressed. According to the present invention, when the substrate is transported while the substrate is being pressed, the holding position of the substrate can be more reliably prevented from shifting. In the above coating method, the pressing of the holding portion of the substrate is released before the substrate is conveyed. According to the present invention, the control of the substrate conveyance can be easily performed by releasing the pressing of the holding portion of the substrate before the substrate is conveyed. In the above coating method, when the substrate is conveyed, the pressing of the holding portion of the substrate is released. According to the present invention, when the substrate is transported, the pressing of the holding portion of the substrate is released, whereby the control of the substrate transport can be easily performed. Therefore, it is possible to easily prevent the substrate holding position from shifting, and it is easy to control the substrate conveyance. In the above coating method, before the application of the liquid material, the pressing of the holding portion of the substrate is released. According to the present invention, the pressing of the holding portion of the substrate is released before the application of the liquid material, and the deviation of the substrate can be easily avoided, and the control of the substrate transportation during coating can be easily performed. The coating apparatus of the present invention includes a substrate conveying unit that conveys a substrate, and a coating unit that applies a liquid to the substrate while being conveyed by the substrate conveying unit. In the apparatus, the apparatus further includes: a transport unit provided in the substrate transport unit and having a holding unit for holding the substrate -12-201008856, and transporting the substrate while holding the substrate; It is provided to be movable in the conveyance direction of the substrate, and the holding portion is provided to be movable in a direction different from the conveyance direction. According to the present invention, the transport mechanism for transporting the substrate is provided so as to be movable in the transport direction of the substrate, and is provided in the holding portion of the transport mechanism so as to be movable in a direction different from the transport direction. In the case where the moving component of the direction is provided with other constituent members, the constituent member can be avoided. Thereby, it is possible to avoid the loss of damage, malfunction, and the like of the constituent members of the device. In the above coating apparatus, the substrate conveying unit includes a floating mechanism that floats the substrate. According to the present invention, when the substrate transporting portion is provided with a floating mechanism for floating the substrate, even when the substrate is floated and transported, if other components are provided in the moving region of the holding portion, it is possible to avoid This group of 0 components. When the substrate is floated and moved, it is necessary to have a more precise structure as the holding portion, so it is of great significance to avoid collision or contact with other constituent members. In the above-described coating device, the holding portion includes a retracting mechanism that returns to the substrate conveying portion in a retracted state after the substrate is conveyed. According to the present invention, the holding portion is provided with a retracting mechanism that returns to the board conveying portion in a retracted state after the substrate is transported, and even when returning to the board conveying portion, the moving portion of the holding portion is provided In the case of other component members, it is also possible to move in a manner that avoids other component members. -13-201008856 The coating device is provided with at least one of an upstream side and a downstream side of the application portion, and a table portion is provided, and the table portion includes a floating mechanism for floating the substrate, and the table portion has a top view Observe the shape of a roughly square in the direction. According to the invention, at least one of the upstream side and the downstream side of the application portion is provided with a table portion provided with a floating mechanism for floating the substrate, and the substrate can be reliably prevented when the substrate is transported on the table portion. The offset of the substrate. On the other hand, when the table portion has a substantially square shape as viewed in a plan view, the substrate can be transported in any direction in the long axis and the short axis direction of the substrate regardless of whether the substrate has a long axis or a short axis direction. According to the present invention, the substrate transporting portion is provided with a transporting mechanism that holds the substrate and holds the substrate, and the carrier is transported to the holding portion. Since the mechanism is provided, the substrate can be held by the auxiliary mechanism in addition to the holding portion of the transport mechanism. Therefore, the substrate can be held more firmly, whereby the deflection of the substrate can be suppressed. Further, it is possible to prevent the poor coating from being caused by the offset of the substrate, and it is possible to keep the substrate carrying portion clean. According to the present invention, the transport mechanism for transporting the substrate is provided so as to be movable in the transport direction of the substrate, and is provided in the holding portion of the transport mechanism so as to be movable in a direction different from the transport direction. Therefore, even in the transport direction with respect to the transport portion In the case where other constituent members are provided on the moving area, the constituent members can be avoided. Thereby, it is possible to avoid the damage of the components of the device -14-201008856, the absence of faults, and the like. [Embodiment] A first embodiment of the present invention will be described based on the drawings. Fig. 1 is a perspective view of the coating device 1 of the present embodiment. As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate transport unit 2 and a coating unit 3 . The management unit 4 is a main constituent element. The coating device 1 is transported while the substrate is being lifted by the substrate transport unit 2, and the photoresist is applied to the substrate by the coating unit 3, and the coating unit manages the coating. The state of the cloth portion 3. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. Hereinafter, in explaining the structure of the coating apparatus 1, the direction of _ in the drawing will be described using an XYZ coordinate system for ease of display. The longitudinal direction of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction. (Substrate conveyance unit) First, the structure of the board conveyance unit 2 will be described. -15- 201008856 The substrate transport unit 2 includes a frame 21, a table portion 22, a transport mechanism 23, and an auxiliary mechanism 24. In the substrate conveyance unit 2, the substrate S is transported in the +X direction on the stage portion 22 by the transporting means 23 and the auxiliary mechanism 24, which are characteristic components of the present embodiment. The frame 21 is, for example, a support member that is placed on the ground and is used to support the table portion 22 and the transport mechanism 23. The frame 21 is divided into three sections which are arranged in the Y direction. The frame center portion 21a is a portion disposed at the center in the Y direction among the divided three portions, and supports the table portion 22. The frame side portion 21b' is disposed on the -Y direction side of the frame center portion 21a, and supports the transport mechanism 23. A gap is provided between the frame side portion 21b and the frame center portion 21a. The frame side portion 21c is disposed on the +Y direction side of the frame center portion 21a to support the transport mechanism 23. A gap is provided between the frame side portion 21c and the frame center portion 2 1 a. The frame center portion 2 1 a, the frame side portion 21b, and the frame side portion 21c' are in the long axis direction in the X direction, and the dimensions of the respective portions in the X direction are substantially the same. The table portion 22' has a loading side table 25, a processing table 27, and a carry-out side table 28. The loading side table 25, the processing table 27, and the unloading side table 28 are arranged in the frame center portion 21a from the upstream side in the substrate conveyance direction to the downstream side (in the +X direction). The loading side table 25' is made of, for example, SUS, and is a substantially square plate-like member viewed from a plan view. By forming the shape of the loading side table 25 into a substantially square shape in plan view, the substrate can be conveyed in any direction even when the substrate having the long axis and the short axis direction is conveyed. In the present embodiment, the area on the loading side table 25 is the substrate loading area -16 - 201008856 field 25S. The substrate carrying-in area 25S is a region into which the substrate S transported from the outside of the apparatus is carried. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of lifting pin insertion holes 25b. The air ejection hole 25a and the lift pin exit hole 25b are provided so as to penetrate the loading side table 25, respectively. The air ejection hole 25a is a hole that ejects air to the table surface 25c of the loading side table 25, and is arranged in a matrix shape as viewed in a plan view. The air spray A outlet hole 25a is connected to an air supply source (not shown). At the loading side table 25, the substrate S can be floated in the +Z direction by the air ejected from the air ejection hole 25a. The lift pin exit hole 25b is a substrate loading position provided on the carry-in side table 25. The lift pin exits the hole 25b so that the air supplied to the table surface 25c does not leak. A calibration device 25d is provided at each of both end portions of the loading side table 25 in the Y direction. The calibration device 25d is a device that positions the substrate S carried into the loading side table 25φ. Each of the aligning devices 25d has a long hole portion and a positioning member provided in the long hole portion, and the position of the substrate is positioned by mechanically sandwiching the substrate carried into the loading side table 25 from both sides. The elevating mechanism 26 is provided on the -Z direction side of the loading side table 25, that is, on the back side of the loading side table 25. The elevating mechanism 26 is provided so as to be superposed on the substrate loading position 25L of the loading side table 25 from the downward direction (refer to Fig. 6). The elevating mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The elevating member 26a is connected to a drive mechanism (not shown), and the elevating member 26a is moved in the Z direction by the drive of the drive mechanism -17-201008856. The plurality of lift pins 26b are erected from the upper surface portion of the elevating member 26a toward the carry-in side table 25. Each of the lift pins 26b is disposed at a position overlapping the lift pin exit hole 25b as viewed in plan view. When the lift member 26a is moved in the Z direction, the lift pins 26b are ejected from the lift pin exit holes 25b on the table surface 25c. The end portions of the respective lift pins 26b in the +Z direction are provided so as to be aligned with the positions in the Z direction, and the substrate S conveyed from the outside of the device can be kept horizontal. The processing table 27 is a plate-like member that is rectangular in plan view when the light-absorbing material having a hard aluminum oxide film as a main component is applied to cover the land surface 27c, and is provided on the +X direction side with respect to the loading side table 25. The portion of the processing table 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing table 27 has a long axis in the Y direction. The size of the processing table 27 in the Y direction is substantially the same as the size of the loading side table 25 in the Y direction. In the present embodiment, the region on the processing table 27 is a coating treatment region 27S on which a photoresist is applied. The processing table 27 is provided with a plurality of air ejection holes 27a for discharging air onto the table surface 27c, and a plurality of air suction holes 27b for sucking air on the table surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. Inside the processing table 27, a plurality of groove portions (not shown) for applying a resistance to the pressure of the gas passing through the air ejection hole 27a and the air suction hole 27b are provided. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the table. In the processing table 27, the pitch of the air ejection holes 27a is narrower than the distance between the air ejection holes 25a of the loading side table 25 compared with the installation -18-201008856, and the air ejection holes 27a are provided in comparison with the loading side table 25. Closer. Therefore, compared with other stages, the processing table 27 can adjust the floating amount of the substrate with higher accuracy, and the floating amount of the substrate can be controlled, for example, to be less than 10 〇〇 / / m, and 5 〇 em The following is preferred. The unloading side table 28 is provided on the +X direction side with respect to the processing table 27, and is composed of substantially the same material and size as the loading side table 25 provided in the substrate loading area 25S. The shape of the carry-out side table 28 is also substantially square as viewed from the downward direction. In the present embodiment, the area on the carry-out side stand 28 is the substrate carry-out area 28S. The substrate carrying-out area 28S is a substrate carrying-out area 28S that carries the substrate S on which the photoresist is applied to the outside of the apparatus. Similarly to the loading-side stage 25, the carrying-out side table 28 is provided with an air ejection hole 28a and an elevating pin. Hole 28b. The elevating mechanism 29 is provided on the -Z direction side of the carry-out side stand 28, that is, the back side of the carry-out side stand 28. The rising and lowering mechanism 29' is provided so as to be viewed from the plan view in a direction in which the substrate is carried out and superimposed on the carry-out side table 28. The elevating member 29a and the elevating pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided on the loading side table 25. When the substrate S on the carry-out side table 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate S. The transport mechanism 23' has a mechanism for holding the substrate S and transporting it in the +X direction, and a pair is provided on the frame side portion 21b and the frame side portion 21c. The pair of transport mechanisms 23 have a structure that is symmetrical with respect to the center of the base portion 22 in the Y direction from -19 to 201008856, and has the same structure except for the line symmetry. Therefore, the transport mechanism 23 provided to the frame side portion 21b will be described below by way of example. The transport mechanism 23 includes a transporter 23a, a substrate holding portion 23b, and a rail 23c. The transporter 23a is constructed such that a linear motor is provided inside, and the linear motor is driven to move the transporter 23a on the rail 23c.

基板保持部23b,是將基板S之中-Y方向側的側緣部 Sa予以保持的保持部。 基板S的該側緣部Sa,是相對於台部22露出的部分 ,是沿著基板搬運方向的一個側部。在搬運機23a的+X 方向側的面上是沿著 Y方向設置有例如四個基板保持部 23b,分別隔介著安裝構件23d安裝於搬運機23a。The substrate holding portion 23b is a holding portion that holds the side edge portion Sa on the -Y direction side of the substrate S. The side edge portion Sa of the substrate S is a portion exposed to the land portion 22 and is a side portion along the substrate conveyance direction. On the surface on the +X direction side of the transporter 23a, for example, four substrate holding portions 23b are provided along the Y direction, and are attached to the transporter 23a via the mounting member 23d.

軌道23c,設置於框架側部21b上,是在:搬入側台 25、處理台27、及搬出側台28的側方涵蓋各台部地延伸 著,藉由滑動於該軌道23c而能讓搬運機23a沿著上述各 台部移動。 在框架側部21b及框架側部21c處設置的各搬運機構 23,能夠獨立搬運基板S。例如,如第3圖所示,能夠以 :設置在框架側部21b的搬運機構23、與設置在框架側部 21c的搬運機構23,來保持不同的基板S,在該情況’可 藉由各搬運機構23交互地搬運基板,所以能讓生產能力 提升。 而在要將具有上述基板S的一半程度的面積的基板進 行搬運的情況,例如以兩個搬運機構23各保持一枚’藉 -20- 201008856 由使兩個搬運機構23朝+X方向一同行進,則能同時搬運 兩枚基板。 參考第5(a)圖及第5(b)圖,來說明搬運機構23 的詳細構造。第5(a)圖是顯示搬運機構23的構造的俯 視圖,第5 ( b )圖是顯示搬運機構23的構造的側視圖。 如第5(a)圖及第5(b)圖所示,基板保持部23b 具有:襯墊按壓構件23e、吸附襯墊23f、軸構件23g。 U 襯墊按壓構件23e,是由具有剛性的材料所構成的板 狀構件。襯墊按壓構件23e的-Y方向側的端部(基端部) ,是被軸構件23g所支承,隔介著該軸構件23g安裝在安 裝構件23d。襯墊按壓構件2 3e的+Y方向側的端部(前端 部),與基端部相較其X軸方向的寬度較寬。 在襯墊按壓構件23e的前端部設置有複數個吸附襯墊 23f。吸附襯墊23f的表面爲吸附面。吸附襯墊23f是設置 成讓吸附面抵接於基板S的背面,藉由讓該吸附面抵接於 φ 基板S的背面進行吸附,則可保持基板S。吸附襯墊23f 的吸附量是設置成可改變的,藉由變化吸附量則可調節例 如基板S的保持高度。構成吸附襯墊23 f的材料,例如 SUS、陶瓷吸盤、橡膠' FRP、全氟類人造橡膠等的材料 。在本實施方式,例如在襯墊按壓構件23e的前端部沿著 X方向排列有三個。 將軸構件23g支承在安裝構件23d的例如+X方向側 的側壁,在軸構件23 g安裝有沒有圖示的致動器,藉由該 致動器,在被側壁所支承的狀態可將X軸作爲旋轉軸旋轉 -21 - 201008856 。如第5(b)圖所示’藉由讓軸構件23g旋轉而讓襯墊按 壓構件23e的前端部以該軸構件23g爲中心進行圓運動。 則藉由軸構件23g的旋轉,而可讓襯墊按壓構件23e朝向 與基板S的搬運方向(+X方向)不同的方向移動。 輔助機構24安裝在:於框架側部21d及框架側部21c 處設置的各搬運機構23的安裝構件23d,具有將基板s 的表面予以按壓的構造。針對輔助機構24,爲相對於台部 22的Y方向中央爲線對稱的構造,除了該線對稱之外則 爲相同的構造。以下舉例來說明設置於框架側部21b的輔 助機構24。 參考第5(a)圖及第5(b)圖,來說明輔助機構24 的詳細構造。 輔助機構24,是具有:支承構件24a、襯墊保持構件 24b、按壓襯墊24c、軸構件24d、支承板24e。 支承構件24a爲具有預定長度的棒狀構件,其中一方 的端部(基端部)被軸構件24d支承,在另一方的端部( 前端部)安裝有襯墊保持構件24b。襯墊保持構件24b從 俯視方向觀察爲矩形,可將Z軸作爲旋轉軸而相對於支承 構件24a獨立旋轉。 按壓襯墊24c,配置在襯墊保持構件24b的-Z方向側 的面部上。按壓襯墊24c的-Z方向側爲平坦面,在該平坦 面按壓基板S。按壓襯墊24c從俯視方向觀察的形狀,與 吸附襯墊23 f爲大致相同的形狀。構成按壓襯墊24c的材 料,爲對基板S按壓時不會傷到基板S的表面,或不會使 201008856 基板S的表面溫度急遽變化的材料,例如與基板s相同的 材料或硬度低於基板S的材料較佳。 軸構件24d是藉由支承板24e所支承,隔介著該支承 板24e安裝於安裝構件23d。在軸構件24d安裝有沒有圖 示的致動器’藉由該致動器則可將Z軸作爲中心旋轉。 如第5(a)圖所示,藉由讓軸構件24d旋轉,讓支承 構件24a的前端部將該軸構件24d作爲中心進行圓運動。 0 在軸構件24d,設置有:使支承構件24a朝Z方向移動的 沒有圖示的移動機構。藉由該移動機構,則能使支承構件 24a朝士Z方向移動。 (塗佈部) 回到第2圖〜第4圖來說明塗佈部3的構造。 塗佈部3,是用來在基板S上塗佈光阻劑的部分,具 有:門型框架31、與噴嘴32。 門型框架31,具有:支柱構件31a、與架橋構件31b ,是設置成在Y方向跨越處理台27。支柱構件31a,在處 理台27的Y方向側各設置有一個,各支柱構件31a分別 支承於框架側部21b及框架側部21c。各支柱構件31a, 是設置成讓其上端部的高度位置一致。架橋構件31b,是 架橋於各支柱構件31a的上端部之間,相對於該支柱構件 3 1a可進行升降。 該門型框架31是連接於移動機構34,移動機構34, 具有框架構件35及驅動機構36。而在框架側部21b及框 -23- 201008856 架側部2 1 c的溝部2 1 d內例如各設置有一條軌道構件3 5, 分別朝X方向延伸。各軌道構件35,分別設置成較管理 部4更朝-X方向側延伸。驅動機構36,是連接於門型框 架31,且使塗佈部3沿著軌道構件35移動的致動器。而 該門型框架31,藉由沒有圖示的移動機構讓其也可朝Z 方向移動。 噴嘴32,是作成其中一方向爲長軸的長條狀,是設置 在門型框架31的架橋構件31b的-Z方向側的面部。在該 噴嘴32之中的-Z方向的前端,沿著本身的長軸方向設置 有狹縫狀的開口部32a,從該開口部32a將光阻劑吐出。 噴嘴32,其開口部32a的長軸方向與Y方向平行,並且 該開口部32a配置成與處理台27相對向。開口部32a的 長軸方向的尺寸是較基板S的Y方向的尺寸更小’而不會 將光阻劑塗佈到基板S的周邊區域。在噴嘴32的內部設 置有使光阻劑流通到開口部32a的沒有圖示的流通路。在 該流通路連接著沒有圖示的光阻劑供給源。該光阻劑供給 源例如具有沒有圖示的泵浦,藉由以該泵浦將光阻劑推出 到開口部32a,則從開口部32a將光阻劑吐出。在支柱構 件31a設置有沒有圖示的移動機構,藉由該移動機構’讓 在架橋構件31b所保持的噴嘴32可朝Z方向移動。在噴 嘴32設置有沒有圖示的移動機構,藉由該移動機構讓噴 嘴32可相對於架橋構件31b朝Z方向移動。在門型框架 31的架橋構件31b下面安裝:用來將噴嘴32的開口部 32a,也就是噴嘴32的前端32c以及與該噴嘴前端32〇相 -24- 201008856 對向的相對向面之間的Z方向上的距離予以測定的感應器 33。沿著Y方向設置有例如三個該感應器33。 (管理部) 來說明管理部4的構造。 管理部4,是爲了讓吐出到基板S的光阻劑(液狀體 )的吐出量爲定量而將噴嘴32進行管理的部位,是設置 I 在:基板搬運部2之中的相對於塗佈部3的-X方向側。 〇 該管理部4,具有:預備吐出機構41、浸漬槽42、噴嘴洗 淨裝置43、將這些構造予以收容的收容部44、以及用來 保持該收容部的保持構件45。 預備吐出機構41、浸漬槽42、及噴嘴洗淨裝置43, 是以該順序朝-X方向側排列。預備吐出機構41,是預備 性地將光阻劑吐出的部分,該預備吐出機構41是在將塗 佈部3配置於塗佈處理區域27S上的狀態,設置在最接近 φ 噴嘴32的位置,浸漬槽42,是在內部儲存有稀釋劑等的 溶劑的液體槽。噴嘴洗淨裝置43,是用來將噴嘴32的開 口部32a附近予以沖洗的裝置,是具有:朝Y方向移動的 沒有圖示的洗淨機構、以及使該洗淨機構移動的沒有圖示 的移動機構。該移動機構,設置在較上述洗淨機構更靠 近-X方向側。噴嘴洗淨裝置43,藉由設置有移動機構的 部分,與預備吐出機構41及浸漬槽42相比,其X方向的 尺寸較,大。而針對預備吐出機構41、浸漬槽42、噴嘴洗 淨裝置43的配置方式’並不限於本實施方式的配置方式 -25- 201008856 ,也可以用其他的配置方式。 收容部44的Y方向的尺寸,較上述門型框架31的支 柱構件3 1 a之間的距離更小,上述門型框架31能超過收 容部44朝X方向移動。門型框架31,針對於在收容部44 內處設置的預備吐出機構41、浸漬槽42及噴嘴洗淨裝置 43,能夠跨越該各部分來接達。 保持構件45連接於管理部移動機構46。管理部移動 機構46,具有軌道構件47及驅動機構48。軌道構件47 分別設置在框架側部2 1 b及框架側部2 1 c的溝部2 1 e內, 分別朝X方向延伸。各軌道構件47,是配置在:與塗佈 部3的門型框架31連接的軌道構件35之間。各軌道構件 47的-X方向的端部,設置至例如框架側部21b及框架側 部21c的-X方向的端部。驅動機構48,是連接於保持構 件45而使管理部4沿著軌道構件47上移動的致動器。 (塗佈動作) 接著來說明如上述構造的塗佈裝置1的動作。 第6圖,是顯示塗佈裝置1的動作過程的俯視圖。參 考各圖來說明將光阻劑R塗佈在基板S的動作。在該動作 ,以讓短軸方向平行於搬運方向的方式,將基板S搬入到 基板搬入區域25S,使該基板S浮起而進行搬運,且在塗 佈處理區域27S塗佈光阻劑,將已塗佈好該光阻劑的基板 S從基板搬出區域28S搬出。在第6圖省略管理部4的圖 示’是要容易判斷搬入側台2 5的構造。以破線顯示門型 -26- 201008856 框架31,而容易判斷噴嘴32及感應器33的構造。以下來 說明各部分的詳細動作。 在將基板搬入到基板搬入區域25 S之前,使塗佈裝置 1待機。具體來說,在搬入側台25的基板搬入位置25L 的-Y方向側配置搬運機23a,將吸附襯墊23f的高度位置 定位在基板S的浮起高度位置,並且從搬入側台25的空 氣噴出孔25a、處理台27的空氣噴出孔27a、空氣吸引孔 _ 2 7b及搬出側台28的空氣噴出孔28a分別將空氣噴出或吸 引,成爲將空氣供給到讓基板浮起於台部22的表面的程 度的狀態。 在該狀態,例如藉由沒有圖示的搬運臂等,如第6圖 所示,若從外部將基板S搬運到基板搬入位置25L,則使 升降構件26a朝+Z方向移動,將升降銷26b從升降銷出 沒孔25b突出到台表面25c。而藉由該升降構件26a的動 作,升降銷26b將基板S抬起,進行該基板S的交接動作 _ 。而從校準裝置25d的上述長孔使上述定位構件突出於台 表面25c。 在接收基板S之後,使升降構件26a下降將升降銷 26b收容於升降銷出沒孔25b內。此時,由於在台表面 25c形成有空氣層,所以基板S藉由該空氣而保持爲相對 於台表面2 5c浮起的狀態。當基板S到達空氣層的表面時 ,藉由校準裝置25 d的定位構件來進行基板S的定位。在 定位之後,將在基板搬入位置的-Y方向側處配置的各吸 附襯墊23f吸附於基板S的背面,同時藉由按壓襯墊24 c -27- 201008856 將基板S朝-Z方向按壓。 當使吸附襯墊23f吸附於基板S時,旋轉軸構件23g ,以使襯墊按壓構件23e的前端部及吸附襯墊23f接近基 板S。藉由軸構件23g的旋轉,讓吸附襯墊23f以軸構件 23g爲中心進行圓運動,抵接於基板S的背面。一旦使吸 附襯墊23f抵接於基板S的背面,則調節吸附襯墊23f的 吸附量且同時吸附住基板S。在將吸附襯墊23f吸附於基 板S的背面的狀態(保持狀態),將基板保持部23b配置 在第5(a)圖及第5(b)圖所示的保持位置23P。 當藉由按壓襯墊24c按壓基板S時,旋轉軸構件24d 以使按壓襯墊24c配置在從俯視方向觀察重叠於:三個吸 附襯墊23f之中例如配置在X方向中央的吸附襯墊23 f的 位置。而使該襯墊保持構件24b旋轉成:讓襯墊保持構件 2 4b的長軸方向與基板S的長軸方向一致。 在該狀態,將輔助機構24配置在第5(b)圖所示的 上升位置24R。然後,使支承構件24a朝-Z方向移動以使 按壓襯墊24c抵接於基板S,按壓基板S。在藉由按壓襯 墊24 c按壓基板S的狀態,將輔助機構24配置在第5(a )圖及第5 ( b)圖所示的按壓位置24P。 藉由吸附襯墊23f吸附基板S的背面,在藉由按壓襯 墊24c按壓住基板S的表面之後,則使搬運機23a沿著軌 道23c移動。則伴隨著搬運機23a的移動而讓基板S開始 朝+X方向的移動。當基板S開始移動時,朝向與移動方 向相反方向的力量會作用於該基板S,所以基板S處於位 -28- 201008856 置容易偏移的狀態。相對的,在本實施方式,是以吸附襯 墊23f吸附基板S’並且藉由按壓襯墊24c按壓基板S, 所以當開始移動時,即使力量作用於基板S,位置也不易 偏移。 在基板S開始移動之後,例如在基板S的移動速度大 致成爲一定之後,則解除按壓襯墊24c對基板S的按壓。 具體來說,以按壓襯墊24c離開基板S的方式,使支承構 件24a朝+Z方向移動。在使支承構件24a朝+Z方向移動 的狀態,如第5 ( b )圖所示,再配置於上升位置24R。在 使按壓襯墊24c從基板S離開之後,使軸構件24d旋轉成 將襯墊保持構件24b配置於安裝構件23d內。而使襯墊保 持構件24b旋轉,將位置調整成將該襯墊保持構件24b收 容於安裝構件23d的框內。在襯墊保持構件24b收容於安 裝構件23d的框內的狀態(退避狀態),輔助機構24配 置在第5 ( a)圖所示的退避位置24Q。軸構件24d及沒有 ©圖示的致動器,其功能是作爲使輔助機構24退避的退避 機構。這些動作,是在藉由搬運機23a搬運基板S的期間 進行的。 一旦基板S的搬運方向前端到達噴嘴32的開口部3 2a 的位置,如第6圖所示,則從噴嘴32的開口部32a朝向 基板S吐出光阻劑。光阻劑的吐出動作,是使噴嘴3 2的 位置固定,藉由搬運機23a —邊搬運基板S —邊來進行。 伴隨著基板S的移動,則如第6圖所示在基板S上塗佈光 阻膜R。藉由讓基板S通過,吐出光阻劑的開口部32a下 -29- 201008856 面,而在基板s的預定區域形成光阻膜R。 形成了光阻膜R的基板s’是藉由搬運機23a將其朝 向搬出側台2 8搬運。在搬出側台2 8 ’在相對於台表面 2 8c浮起的狀態,如第6圖所示將基板S搬運到基板搬出 位置2 8 U。 一旦基板S到達基板搬出位置28U,則解除吸附襯墊 23f的保持狀態。具體來說,是使軸構件23g朝相反方向 旋轉成:使襯墊按壓構件23e的前端部及吸附襯墊23f遠 離基板S。藉由軸構件23 g的旋轉,則成爲將襯墊按壓構 件23e及吸附襯墊23f收容於相對於安裝構件23d在+Y 方向不會露出的位置的狀態(退避狀態)。在基板保持部 23b的退避狀態,該基板保持部23b是配置在第5(a)圖 及第5(b)圖所示的退避位置23 Q。軸構件23 g及沒有圖 示的致動器,其功能是作爲使基板保持部23b退避的退避 機構。 在讓基板保持部23 b成爲退避狀態之後,使升降機構 29的升降構件29a朝向+Z方向移動。藉由升降構件29a 的移動’升降銷29b從升降銷出沒孔28b朝向基板S的背 面突出’藉由升降銷2 9b將基板S抬起。在該狀態,例如 在搬出側台28的+X方向側處設置的外部的搬運臂,會接 達於搬出側台28’而接收基板S。在將基板S交接到搬運 臂之後’將搬運機23a再回到搬入側台25的基板搬入位 置25L,待機直到要搬運下個基板S。 此時’由於基板保持部23b成爲退避狀態,所以在襯 201008856 墊按壓構件23e或吸附襯墊23f相對於安裝構件23d在+Υ 方向不會露出的狀態,讓搬運機構23移動。因此,襯墊 按壓構件23e或吸附襯墊23f不會與塗佈裝置1的其他組 成構件等碰撞或接觸,而搬運機構23回到基板搬入位置 25L。 當進行下側基板S的搬運時,例如藉由設置於框架側 部21c上的搬運機構23,保持住基板S將其進行搬運。在 ^ 尙未要搬運下個基板S的期間,在塗佈部3,進行用來保 〇 持噴嘴32的吐出狀態的預備吐出動作。如第7圖所示, 藉由軌道構件35使門型框架31朝-X方向移動到管理部4 的位置。 在使門型框架31移動到管理部4的位置之後,調整 門型框架31的位置將噴嘴32的前端接達到噴嘴洗淨裝置 43,藉由該噴嘴洗淨裝置43來將噴嘴前端3 2c洗淨。 在噴嘴前端32c洗淨後,將該噴嘴32接達到預備吐 φ 出機構41。在預備吐出機構41,會一邊將開口部32a與 預備吐出面之間的距離予以測定,一邊將噴嘴32的前端 的開口部32a移動到Z方向上的預定位置,一邊使噴嘴 32朝-X方向移動,一邊從開口部3 2a預備吐出光阻劑。 在預備吐出動作之後,將門型框架31回到原來位置 。當藉由設置於框架側部21c上的搬運機構23要搬運下 個基板S時,使噴嘴32移動到Z方向上的預定位置。藉 由對基板S反覆進行塗佈光阻膜R的塗佈動作與預備吐出 動作,則在基板S形成優質的光阻膜R。 -31 - 201008856 而也可因應需要,例如每預定次數接達到管理部4後 ,則將上述噴嘴32接達到浸漬槽42內。在浸漬槽42,是 藉由將噴嘴32的開口部3 2a暴露於,儲存於浸漬槽42的 溶劑(稀釋劑)的蒸氣環境,來防止噴嘴32乾燥。 藉由本實施方式,具有用來保持基板S的基板保持部 23b而在保持基板S的狀態將其搬運的搬運機構23,設置 在基板搬運部2,且具備有將該基板S按壓於保持部的輔 助機構24,所以除了搬運機構23的基板保持部23b之外 ,也能藉由輔助機構24來保持基板S。因此,能夠更堅 固地保持基板S,藉此能抑制基板S的偏移情形。且可防 止因爲基板S的偏移導致的不良塗佈情形,可將基板搬運 部2的台部22上保持潔淨。 如本實施方式,在藉由基板搬運部23b的吸附襯墊 23f吸附保持著基板S的情況,藉由讓輔助機構24按壓基 板S,則可讓吸附襯墊23f的吸附更確實,所以能更堅固 地保持基板S,所以能更確實地防止基板S的保持位置的 偏移。 藉由本實施方式,由於輔助機構24設置成可在基板 S的搬運方向移動,所以可配合基板S的移動使輔助機構 24移動。 在本實施方式,由於輔助機構24搭載於搬運機構23 的安裝構件23d,所以能使搬運機構23與輔助機構24 — 體地移動。藉此,則不用調整搬運機構23的移動速度與 輔助機構24的移動速度,而能防止兩機構的位置偏移, -32- 201008856 所以更容易能達成基板S的穩定保持。 藉由本實施方式,由於輔助機構24具有作爲退避機 構的軸構件24d,所以在例如於移動路線上設置有其他組 成構件等的情況,則可以迴避其他組成構件。藉此,則可 避免輔助機構24與該組成構件之間的碰撞或接觸,則可 避免塗佈裝置1的損壞、故障等的缺點。 藉由本實施方式,用來搬運基板S的搬運機構23設 置成可朝該基板S的搬運方向移動,設置於搬運機構23 的基板保持部23b設置成可朝與搬運方向相反的方向移動 ,所以即使在基板保持部23b的搬運方向的移動區域上設 置有其他組成構件的情況,也能迴避該組成構件。藉此, 則可避免塗佈裝置1的組成構件的損壞、故障等的缺點。 〔第二實施方式〕 接著說明本發明的第二實施方式。 與第一實施方式同樣的,在以下的圖面,由於作成可 辨識各構件的大小,所以適當變更了尺寸比例。針對與第 一實施方式相同的組成元件,使用相同的圖號而省略其說 明。在本實施方式,輔助機構的構造與第一實施方式不同 ,以這方面爲中心來說明。 第8(a)圖是顯示本實施方式的塗佈裝置1〇1的局部 構造的側視圖’第8(b)圖是顯示塗佈裝置1〇1的局部構 造的俯視圖。 如第8(a)圖及第8(b)圖所示,本實施方式的塗 -33- 201008856 佈裝置101,不是輔助機構124接觸基板S來按壓該基板 S的構造,是藉由對基板S噴出氣體’以非接觸方式按壓 基板S。 具體來說,輔助機構124連接於例如沒有圖示的的氣 體供給部,沿著基板S的側緣部Sa設置有複數個。輔助 機構124不是搭載於搬運機構23,與搬運機構23獨立設 置。在輔助機構124設置有氣體噴出口 124a。氣體噴出口 124a在基板S的表面側配置成與側緣部Sa相對向。其他 構造與第一實施方式相同。 在上述構造,藉由使連接於輔助機構124的氣體供給 部驅動,而將氣體從氣體噴出口 124a噴出,對基板S的 + Z方向側的面部(表面)噴射氣體。藉由該氣體的噴射 ,將基板S朝-Z方向側按壓。基板S的-Z方向側的面部 (背面),是被搬運機構23的基板保持部23b所支承, 藉由氣體的負壓力來將基板S朝基板保持部23b側按壓。 藉由本實施方式,輔助機構124具有朝基板S噴出氣 體的氣體噴出口 124a,由於藉由氣體噴出以非接觸方式按 壓基板S,所以可減少對基板S的接觸。藉此,可以防止 基板S的變形或傷痕的產生等情形。 藉由本實施方式,由於在基板S的搬運方向設置有複 數個氣體噴出口 124a,所以在搬運基板S的移動路線上, 能在所希望的位置以非接觸的方式按壓基板S。藉此,可 更穩定地保持基板S。 也可作成將上述輔助機構124設置成可沿著基板S的 -34- 201008856 搬運方向移動。藉由將移動機構124作成可移動’則即使 輔助機構124的數量沒有很多例如爲單數的,則在搬運基 板S的期間的所希望的時機,可將基板S朝向基板保持部 23b側按壓。 〔第三實施方式〕 接著說明本發明的第三實施方式。 與第一實施方式同樣的,在以下的圖面,由於作成可 辨識各構件的大小,所以適當變更了尺寸比例。針對與第 一實施方式相同的組成元件,使用相同的圖號而省略其說 明。在本實施方式,輔助機構的構造與第一實施方式不同 ,以這方面爲中心來說明。 第9(a)圖是顯示本實施方式的塗佈裝置201的局部 構造的側視圖,第9(b)圖是顯示塗佈裝置201的局部搆 造的俯視圖。 如第9(a)圖及第9(b)圖所示’本實施方式的塗 佈裝置201,不是輔助機構124接觸基板S來按壓該基板 S的構造,是藉由吸引基板S的背面側(台部22側)的 空間,以非接觸方式來吸引基板S的構造。藉由將基板S 朝台部22側吸引,則將基板S按壓朝向用來保持基板S 的背面側的基板保持部23b。 輔助機構224不是搭載於搬運機構23’與搬運機構 23獨立設置。輔助機構224,是連接於例如泵浦等的沒有 圖示的吸引機構,是沿著基板S的側緣部Sa設置有複數 -35- 201008856 個。在輔助機構224設置有吸引口 224a。吸引口 224a配 置在基板S的背面側成爲與側緣部Sa相對向,設置成與 基板S之間隔著間隔。其他構造與第一實施方式相同。 在上述構造,是使連接於輔助機構2 24的吸引機構驅 動,藉由吸引口 224a來吸引基板S的-Z方向側的空間。 藉由該吸引力來將基板S朝-Z方向側吸引。藉由搬運機構 23的基板保持部23b來保持基板S的-Z方向側的面部( 背面),藉由以吸引力來吸引基板S,則將該基板S朝向 基板保持部23b側按壓。 藉由本實施方式,輔助機構2 24將基板S之中與搬運 機構23所保持的面部(背面)相同的面部予以吸引,所 以藉此在與基板S被保持的面部相反的面部上能確保空間 在本實施方式,也可在輔助機構224的吸引口 224a 設置有吸附口,使該吸附部接觸基板S的背面來進行吸引 。在該情況,作爲接觸於基板S的吸附部的構成材料,最 好是使用能保持基板S的狀態(溫度、有無傷痕等)的材 料、例如在第一實施方式所舉例的材料等。 也可作成將上述輔助機構224設置成可沿著基板S的 搬運方向移動。藉由將移動機構224作成可移動,則即使 輔助機構224的數量沒有很多例如爲單數的,則在搬運基 板S的期間的所希望的時機,可將基板S朝向基板保持部 23b側按壓。 本發明的技術範圍並不限於上述實施方式,在不脫離 -36- 201008856 本發明的主旨的範圍可以進行適當變更。 例如,在上述第一實施方式,雖然作成將輔助機構24 搭載於搬運機構23的安裝構件23d的構造,而並不限於 此’也可將輔助機構24設置成獨立於搬運機構23。在該 情況,也可使輔助機構24可伴隨搬運機構23的移動而移 動。 而也不限於輔助機構24可伴隨搬運機構23的移動而 0 移動,例如也可不使輔助機構24移動而將其固定。例如 ,也可以固定在:台部22與框架側部21b之間、或台部 2 2與框架側部2 1 c之間等。針對台部2 2,不僅是搬入側 台25,也可適用於處理台27或搬出側台28。 在上述實施方式,雖然作成在基板S開始搬運時,藉 由輔助機構24將基板S朝基板保持部23b按壓,而並不 限於此,例如,也可在基板S的搬運完成時將基板S朝基 板保持部2 3b側按壓。當基板S搬運完成時,也就是使基 _ 板S的移動停止時,將力量施加於基板S的移動方向。也 考慮到如果因爲該力量讓基板S的保持位置偏移,會對基 板S的搬出造成妨礙的情況。相對於此,在基板S的搬運 完成時也藉由輔助機構24按壓基板S,藉由抑制基板S 的保持位置的偏移情形,則優點是可以順暢進行基板S的 搬出動作。 在基板S的搬運中,例如從搬入側台25朝處理台27 移動的時機、或從處理台27朝搬出側台28移動的時機等 ,移動速度變化的情況,則每次也可藉由輔助機構24來 -37- 201008856 按壓基板S。藉此,可更確實地抑制基板S的保持位置的 偏移。 作爲藉由輔助機構24按壓基板S的時機,例如,也 可在始終藉由輔助機構24按壓基板S的狀態,來搬運該 基板S。藉此,可更確實地防止基板S的保持位置的偏移 在將基板S搬入之後藉由輔助機構24按壓基板S, 在搬運基板S之前解除該按壓也可以。例如如上述實施方 式,在藉由吸附襯墊23 f吸附保持著基板S的情況等,藉 由讓輔助機構24按壓基板S,則可確保吸附襯墊23 f所進 行的吸附,則可更堅固地保持基板S。 也可在基板S的搬運中解除該基板S的按壓。藉此, 可防止基板S的保持位置的偏移,而能容易進行基板S的 搬運控制。 也可在光阻劑R的塗佈之前解除按壓。藉此,則可避 免基板S的保持位置的偏移情形,且能容易進行塗佈時的 基板搬運的控制。 在上述各實施方式,雖如是共同具有搬運機構23的 退避機構(例如軸構件23 g)與輔助機構24,而該退避機 構及輔助機構24是發揮了獨立的效果。所以只要具備有 搬運機構3的退避機構及輔助機構24的其中一方的構造 ,則可得到對應上述實施方式的其中一方的效果。 在上述實施方式,雖然將搬運機構23配置在框架側 部21b及框架側部21c的兩側,而並不限於此,也可僅在 -38- 201008856 例如框架側部21b及框架側部21<;的其中一方配置搬運機 構23。 在上述實施方式,雖然舉例說明使基板S浮起進行搬 運的塗佈裝置1’而在具備有搬運機構23的退避機構的情 況,沒有這種限制,只要是使基板搬運且進行塗佈的塗佈 裝置,本發明也可適用於:浮起搬運型以外的塗佈裝置, 例如藉由搬運輥子等的搬運機構來搬運基板的塗佈裝置。 在上述各實施方式,使搬運機構23的基板保持部23b 以軸構件23g的中心進行迴旋,使吸附襯墊23f與基板S 接觸’而並不限於此,也可例如使基板保持部23b於Z軸 方向升降而接觸吸附襯墊23f。 【圖式簡單說明】 第1圖是顯示本發明的第一實施方式的塗佈裝置的構 造的立體圖。 第2圖是顯示本實施方式的塗佈裝置的構造的正視圖 〇 第3圖是顯示本實施方式的塗佈裝置的構造的俯視圖 〇 第4圖是顯示本實施方式的塗佈裝置的構造的側視圖 〇 第5圖是本實施方式的塗佈裝置的搬運機構的構造的 顯示圖。 第6圖是本實施方式的塗佈裝置的動作的顯示圖。 -39- 201008856 第7圖是本實施方式的塗佈裝置的動作的顯示圖。 第8圖是本發明的第二實施方式的塗佈裝置的局部構 造的顯示圖。 第9圖是本發明的第三實施方式的塗佈裝置的局部構 造的顯示圖。 【主要元件符號說明】 S :基板 Sa :側緣部 R :光阻劑 1、101、201:塗佈裝置 2 :基板搬運部 3 :塗佈部 22 :台部 23 :搬運機構 23b :基板保持部 23P :保持位置 23Q :退避位置 24、124、224 :輔助機構 24a :支承構件 24b :襯墊保持構件 24c :按壓襯墊 24d :軸構件 24e :支承板 -40- 201008856The rail 23c is provided on the frame side portion 21b, and extends on the side of the loading side table 25, the processing table 27, and the unloading side table 28, and can be transported by sliding on the rail 23c. The machine 23a moves along each of the above stages. Each of the transport mechanisms 23 provided at the frame side portion 21b and the frame side portion 21c can independently transport the substrate S. For example, as shown in Fig. 3, the transport mechanism 23 provided in the frame side portion 21b and the transport mechanism 23 provided in the frame side portion 21c can hold different substrates S. In this case, Since the transport mechanism 23 carries the substrates interactively, the production capacity can be improved. On the other hand, in the case where the substrate having the area of half of the substrate S is to be transported, for example, the two transport mechanisms 23 each hold one 'borrow -20-201008856, and the two transport mechanisms 23 are moved in the +X direction. , can carry two substrates at the same time. The detailed structure of the transport mechanism 23 will be described with reference to the fifth (a) and fifth (b) drawings. Fig. 5(a) is a plan view showing the structure of the transport mechanism 23, and Fig. 5(b) is a side view showing the structure of the transport mechanism 23. As shown in FIGS. 5(a) and 5(b), the substrate holding portion 23b includes a pad pressing member 23e, an adsorption pad 23f, and a shaft member 23g. The U-pad pressing member 23e is a plate-like member made of a material having rigidity. The end portion (base end portion) on the -Y direction side of the pad pressing member 23e is supported by the shaft member 23g, and is attached to the mounting member 23d via the shaft member 23g. The end portion (front end portion) on the +Y direction side of the pad pressing member 2 3e is wider than the base end portion in the X-axis direction. A plurality of suction pads 23f are provided at the front end portion of the pad pressing member 23e. The surface of the adsorption pad 23f is an adsorption surface. The suction pad 23f is provided so that the adsorption surface abuts against the back surface of the substrate S, and the substrate S can be held by causing the adsorption surface to contact the back surface of the φ substrate S for adsorption. The adsorption amount of the adsorption pad 23f is set to be changeable, and the holding height of the substrate S such as the substrate S can be adjusted by changing the adsorption amount. The material constituting the adsorption pad 23 f is, for example, SUS, a ceramic chuck, a rubber 'FRP, a perfluoro-based elastomer or the like. In the present embodiment, for example, three of the front end portions of the pad pressing members 23e are arranged in the X direction. The shaft member 23g is supported by, for example, a side wall on the +X direction side of the attachment member 23d, and an actuator (not shown) is attached to the shaft member 23g, and by the actuator, the X can be supported by the side wall. The shaft rotates as a rotary axis - 21 - 201008856. As shown in Fig. 5(b), the front end portion of the spacer pressing member 23e is circularly moved around the shaft member 23g by rotating the shaft member 23g. By the rotation of the shaft member 23g, the pad pressing member 23e can be moved in a direction different from the conveying direction (+X direction) of the substrate S. The auxiliary mechanism 24 is attached to a mounting member 23d of each of the transport mechanisms 23 provided at the frame side portion 21d and the frame side portion 21c, and has a structure for pressing the surface of the substrate s. The auxiliary mechanism 24 has a structure that is line symmetrical with respect to the center of the table portion 22 in the Y direction, and has the same configuration except for the line symmetry. The auxiliary mechanism 24 provided to the frame side portion 21b will be described below by way of example. The detailed structure of the assist mechanism 24 will be described with reference to Figs. 5(a) and 5(b). The auxiliary mechanism 24 has a support member 24a, a spacer holding member 24b, a pressing pad 24c, a shaft member 24d, and a support plate 24e. The support member 24a is a rod-shaped member having a predetermined length, and one end portion (base end portion) is supported by the shaft member 24d, and a pad holding member 24b is attached to the other end portion (front end portion). The pad holding member 24b has a rectangular shape as viewed in plan view, and can independently rotate the Z-axis as a rotation axis with respect to the support member 24a. The pressing pad 24c is placed on the surface of the pad holding member 24b on the -Z direction side. The -Z direction side of the pressing pad 24c is a flat surface, and the substrate S is pressed against the flat surface. The shape of the pressing pad 24c as viewed in a plan view is substantially the same as that of the suction pad 23f. The material constituting the pressing pad 24c is a material that does not damage the surface of the substrate S when the substrate S is pressed, or does not cause the surface temperature of the 201008856 substrate S to change rapidly, for example, the same material or hardness as the substrate s is lower than the substrate. The material of S is preferred. The shaft member 24d is supported by the support plate 24e, and is attached to the attachment member 23d via the support plate 24e. An actuator (not shown) is attached to the shaft member 24d. By this actuator, the Z-axis can be rotated as a center. As shown in Fig. 5(a), the front end portion of the support member 24a is circularly moved around the shaft member 24d by rotating the shaft member 24d. 0 The shaft member 24d is provided with a moving mechanism (not shown) that moves the support member 24a in the Z direction. With this moving mechanism, the support member 24a can be moved in the direction of the Z direction. (Coating portion) The structure of the coating portion 3 will be described with reference to Figs. 2 to 4 . The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 31 and a nozzle 32. The portal frame 31 has a pillar member 31a and a bridge member 31b that are disposed to cross the processing table 27 in the Y direction. The pillar members 31a are provided one on each side in the Y direction of the processing table 27, and each of the pillar members 31a is supported by the frame side portion 21b and the frame side portion 21c. Each of the strut members 31a is disposed such that the height positions of the upper end portions thereof coincide. The bridging member 31b is bridged between the upper end portions of the respective strut members 31a, and is movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 34, and has a moving mechanism 34, and has a frame member 35 and a drive mechanism 36. On the other hand, in the frame side portion 21b and the groove portion 2 1 d of the frame side portion 2 1 c of the frame -23 - 201008856, for example, a rail member 35 is provided to extend in the X direction. Each of the rail members 35 is provided to extend toward the -X direction side from the management portion 4, respectively. The drive mechanism 36 is an actuator that is coupled to the door frame 31 and that moves the coating portion 3 along the rail member 35. The door frame 31 is also movable in the Z direction by a moving mechanism (not shown). The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 31b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a is provided along the longitudinal direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. In the nozzle 32, the longitudinal direction of the opening 32a is parallel to the Y direction, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the long-axis direction is smaller than the dimension of the substrate S in the Y direction', and the photoresist is not applied to the peripheral region of the substrate S. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening 32a is provided. A photoresist supply source (not shown) is connected to the flow path. The photoresist supply source has, for example, a pump (not shown), and when the photoresist is pushed out to the opening 32a by the pump, the photoresist is discharged from the opening 32a. The strut member 31a is provided with a moving mechanism (not shown), and the moving mechanism θ allows the nozzle 32 held by the bridging member 31b to move in the Z direction. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. Installed under the bridging member 31b of the portal frame 31: between the opening 32a of the nozzle 32, that is, the front end 32c of the nozzle 32, and the opposing surface opposite to the nozzle front end 32-201008856 The sensor 33 is measured by the distance in the Z direction. For example, three of the inductors 33 are disposed along the Y direction. (Management Unit) The structure of the management unit 4 will be described. The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is the coating I in the substrate transport unit 2 The -X direction side of the portion 3. The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 are arranged in the -X direction side in this order. The preliminary discharge mechanism 41 is a portion for preliminarily discharging the photoresist, and the preliminary discharge mechanism 41 is disposed at a position closest to the φ nozzle 32 in a state where the application portion 3 is placed on the coating processing region 27S. The immersion tank 42 is a liquid tank in which a solvent such as a diluent is stored inside. The nozzle cleaning device 43 is a device for flushing the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction, and a cleaning mechanism that moves the cleaning mechanism. Mobile agency. The moving mechanism is disposed closer to the X-direction side than the above-described cleaning mechanism. The nozzle cleaning device 43 has a larger size in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42 by the portion in which the moving mechanism is provided. The arrangement of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment -25 to 201008856, and other arrangements may be used. The dimension of the accommodating portion 44 in the Y direction is smaller than the distance between the pillar members 31a of the door frame 31, and the portal frame 31 can move in the X direction beyond the accommodating portion 44. The door frame 31 is capable of being received across the respective portions of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 provided in the accommodating portion 44. The holding member 45 is connected to the management unit moving mechanism 46. The management unit moving mechanism 46 has a rail member 47 and a drive mechanism 48. The rail members 47 are respectively disposed in the frame side portion 2 1 b and the groove portion 2 1 e of the frame side portion 2 1 c, and respectively extend in the X direction. Each of the rail members 47 is disposed between the rail members 35 connected to the portal frame 31 of the coating portion 3. The end portion of each of the rail members 47 in the -X direction is provided, for example, to the end portion of the frame side portion 21b and the frame side portion 21c in the -X direction. The drive mechanism 48 is an actuator that is coupled to the holding member 45 to move the management portion 4 along the rail member 47. (Coating Operation) Next, the operation of the coating device 1 having the above configuration will be described. Fig. 6 is a plan view showing the operation of the coating device 1. The operation of applying the photoresist R to the substrate S will be described with reference to the drawings. In this operation, the substrate S is carried into the substrate loading region 25S so that the short axis direction is parallel to the conveyance direction, the substrate S is floated and transported, and the photoresist is applied to the coating treatment region 27S. The substrate S to which the photoresist has been applied is carried out from the substrate carry-out area 28S. The illustration of the management unit 4 is omitted in Fig. 6, which is a structure for easily determining the loading side table 25. The door type -26-201008856 frame 31 is displayed in a broken line, and the configuration of the nozzle 32 and the sensor 33 can be easily judged. The detailed actions of each part are explained below. The coating device 1 is placed on standby before the substrate is carried into the substrate carrying-in area 25 S. Specifically, the transporter 23a is disposed on the -Y direction side of the substrate loading position 25L of the loading side table 25, and the height position of the suction pad 23f is positioned at the floating height position of the substrate S, and the air is carried from the loading side table 25. The discharge hole 25a, the air ejection hole 27a of the processing table 27, the air suction hole _ 27b, and the air ejection hole 28a of the carry-out side table 28 respectively eject or suck air, and supply air to the table portion 22 to float the substrate. The state of the degree of the surface. In this state, as shown in FIG. 6, when the substrate S is transported to the substrate loading position 25L from the outside, the lifting member 26a is moved in the +Z direction, and the lift pin 26b is lifted, for example, as shown in FIG. The lifting pin exit hole 25b protrudes from the table surface 25c. On the other hand, the lift pin 26b lifts the substrate S by the movement of the elevating member 26a, and performs the transfer operation of the substrate S. On the other hand, the long hole from the aligning device 25d causes the positioning member to protrude from the table surface 25c. After receiving the substrate S, the elevating member 26a is lowered to accommodate the lift pin 26b in the lift pin exit hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is maintained in a state of being floated with respect to the table surface 25c by the air. When the substrate S reaches the surface of the air layer, the positioning of the substrate S is performed by the positioning member of the calibration device 25d. After the positioning, each of the absorbing pads 23f disposed at the -Y direction side of the substrate loading position is attracted to the back surface of the substrate S, and the substrate S is pressed in the -Z direction by pressing the spacers 24 c -27 - 201008856. When the suction pad 23f is attracted to the substrate S, the shaft member 23g is rotated so that the tip end portion of the pad pressing member 23e and the suction pad 23f approach the substrate S. By the rotation of the shaft member 23g, the suction pad 23f is circularly moved around the shaft member 23g to abut against the back surface of the substrate S. Once the suction pad 23f is brought into contact with the back surface of the substrate S, the adsorption amount of the adsorption pad 23f is adjusted while the substrate S is adsorbed. In a state (holding state) in which the suction pad 23f is adsorbed to the back surface of the substrate S, the substrate holding portion 23b is placed at the holding position 23P shown in Figs. 5(a) and 5(b). When the substrate S is pressed by the pressing pad 24c, the rotating shaft member 24d is disposed such that the pressing pad 24c is disposed so as to be superimposed on the three adsorption pads 23f from the top view direction, for example, the adsorption pad 23 disposed in the center in the X direction. The location of f. The pad holding member 24b is rotated such that the long axis direction of the pad holding member 24b coincides with the long axis direction of the substrate S. In this state, the assist mechanism 24 is placed at the rising position 24R shown in Fig. 5(b). Then, the supporting member 24a is moved in the -Z direction so that the pressing pad 24c abuts against the substrate S, and the substrate S is pressed. The auxiliary mechanism 24 is placed at the pressing position 24P shown in Figs. 5(a) and 5(b) while the substrate S is pressed by pressing the pad 24c. The back surface of the substrate S is adsorbed by the suction pad 23f, and after the surface of the substrate S is pressed by the pressing pad 24c, the carrier 23a is moved along the track 23c. Then, the substrate S starts moving in the +X direction in accordance with the movement of the carrier 23a. When the substrate S starts moving, a force directed in the opposite direction to the moving direction acts on the substrate S, so that the substrate S is in a state in which the position -28 - 201008856 is easily shifted. On the other hand, in the present embodiment, the substrate S' is adsorbed by the adsorption pad 23f and the substrate S is pressed by the pressing pad 24c. Therefore, when the movement starts, even if a force acts on the substrate S, the position is not easily displaced. After the substrate S starts moving, for example, after the moving speed of the substrate S is substantially constant, the pressing of the substrate S by the pressing pad 24c is released. Specifically, the support member 24a is moved in the +Z direction so that the pressing pad 24c is separated from the substrate S. The state in which the support member 24a is moved in the +Z direction is placed in the raised position 24R as shown in Fig. 5(b). After the pressing pad 24c is separated from the substrate S, the shaft member 24d is rotated to dispose the pad holding member 24b in the mounting member 23d. While the pad holding member 24b is rotated, the position is adjusted to accommodate the pad holding member 24b in the frame of the mounting member 23d. In the state (retracted state) in which the pad holding member 24b is housed in the frame of the mounting member 23d, the assisting mechanism 24 is disposed at the retracted position 24Q shown in Fig. 5(a). The shaft member 24d and the actuator not shown in Fig. are functions as a retracting mechanism for retracting the assist mechanism 24. These operations are performed while the substrate S is being transported by the transporter 23a. When the leading end of the substrate S in the conveyance direction reaches the position of the opening portion 3 2a of the nozzle 32, as shown in Fig. 6, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 and transporting the substrate S while the transporter 23a is being transported. As the substrate S moves, the photoresist film R is applied onto the substrate S as shown in Fig. 6. By passing the substrate S, the opening portion 32a of the photoresist is discharged under the surface -29-201008856, and the photoresist film R is formed in a predetermined region of the substrate s. The substrate s' on which the photoresist film R is formed is transported toward the carry-out side table 28 by the transporter 23a. The substrate S is transported to the substrate carry-out position 2 8 U as shown in Fig. 6 in a state where the carry-out side table 28' is floated with respect to the table surface 28c. When the substrate S reaches the substrate carry-out position 28U, the holding state of the suction pad 23f is released. Specifically, the shaft member 23g is rotated in the opposite direction so that the front end portion of the pad pressing member 23e and the suction pad 23f are far from the substrate S. By the rotation of the shaft member 23g, the pad pressing member 23e and the suction pad 23f are accommodated in a state (retracted state) in which the mounting member 23d is not exposed in the +Y direction. In the retracted state of the substrate holding portion 23b, the substrate holding portion 23b is disposed at the retracted position 23Q shown in Figs. 5(a) and 5(b). The shaft member 23g and an actuator (not shown) function as a retracting mechanism for retracting the substrate holding portion 23b. After the substrate holding portion 23b is brought into the retracted state, the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. The substrate S is lifted by the lift pin 29b by the movement of the elevating member 29a, the lift pin 29b projecting from the lift pin exit hole 28b toward the back surface of the substrate S. In this state, for example, the external transfer arm provided at the +X direction side of the carry-out side table 28 is received by the carry-out side stand 28' to receive the substrate S. After the substrate S is transferred to the transport arm, the transporter 23a is returned to the substrate loading position 25L of the loading side table 25, and stands by until the next substrate S is to be transported. At this time, since the substrate holding portion 23b is in the retracted state, the transport mechanism 23 is moved in a state where the pad pressing member 23e or the suction pad 23f is not exposed in the +? direction with respect to the attachment member 23d. Therefore, the pad pressing member 23e or the suction pad 23f does not collide or come into contact with other components or the like of the coating device 1, and the transport mechanism 23 returns to the substrate loading position 25L. When the lower substrate S is transported, the substrate S is held by the transport mechanism 23 provided on the frame side portion 21c, for example. While the next substrate S is not being transported, the application portion 3 performs a preliminary discharge operation for maintaining the discharge state of the nozzle 32. As shown in Fig. 7, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the rail member 35. After the door frame 31 is moved to the position of the management unit 4, the position of the door frame 31 is adjusted to connect the front end of the nozzle 32 to the nozzle cleaning device 43, and the nozzle cleaning device 43 is used to wash the nozzle front end 32c. net. After the nozzle tip end 32c is cleaned, the nozzle 32 is connected to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the tip end of the nozzle 32 is moved to a predetermined position in the Z direction while the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is oriented in the -X direction. When moving, the photoresist is prepared to be discharged from the opening 3 2a. After the preliminary ejection operation, the portal frame 31 is returned to the original position. When the next substrate S is to be transported by the transport mechanism 23 provided on the frame side portion 21c, the nozzle 32 is moved to a predetermined position in the Z direction. By applying the coating operation of the photoresist film R and the preliminary discharge operation to the substrate S, a high-quality photoresist film R is formed on the substrate S. -31 - 201008856 It is also possible to connect the nozzle 32 to the dipping tank 42 after the control unit 4 is reached, for example, every predetermined number of times. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening portion 32a of the nozzle 32 to the vapor atmosphere of the solvent (diluent) stored in the immersion tank 42. According to the present embodiment, the transport mechanism 23 that holds the substrate holding portion 23b of the substrate S and transports the substrate S in the state in which the substrate S is held is provided in the substrate transport unit 2, and the substrate S is pressed against the holding portion. Since the auxiliary mechanism 24 is provided, the substrate S can be held by the auxiliary mechanism 24 in addition to the substrate holding portion 23b of the transport mechanism 23. Therefore, the substrate S can be held more firmly, whereby the offset of the substrate S can be suppressed. Further, it is possible to prevent the poor coating of the substrate S due to the offset of the substrate S, and to keep the top portion 22 of the substrate carrying portion 2 clean. In the present embodiment, when the substrate S is sucked and held by the suction pad 23f of the substrate conveying portion 23b, the auxiliary mechanism 24 is pressed against the substrate S, so that the suction of the suction pad 23f can be made more reliable. Since the substrate S is firmly held, the offset of the holding position of the substrate S can be more surely prevented. According to the present embodiment, since the auxiliary mechanism 24 is provided to be movable in the conveyance direction of the substrate S, the auxiliary mechanism 24 can be moved in accordance with the movement of the substrate S. In the present embodiment, since the auxiliary mechanism 24 is mounted on the attachment member 23d of the transport mechanism 23, the transport mechanism 23 and the auxiliary mechanism 24 can be integrally moved. Thereby, the movement speed of the conveyance mechanism 23 and the movement speed of the auxiliary mechanism 24 are not adjusted, and the positional deviation of the two mechanisms can be prevented, and -32-201008856, it is easier to achieve stable holding of the substrate S. According to the present embodiment, since the auxiliary mechanism 24 has the shaft member 24d as the retracting mechanism, for example, when other components or the like are provided on the movement route, the other component members can be avoided. Thereby, collision or contact between the auxiliary mechanism 24 and the constituent member can be avoided, and the disadvantages of damage, malfunction, and the like of the coating device 1 can be avoided. According to the present embodiment, the transport mechanism 23 for transporting the substrate S is provided to be movable in the transport direction of the substrate S, and the substrate holding portion 23b provided in the transport mechanism 23 is provided to be movable in a direction opposite to the transport direction, so that even In the case where the other component members are provided in the moving region of the substrate holding portion 23b in the conveyance direction, the constituent members can be avoided. Thereby, the disadvantages of damage, malfunction, and the like of the constituent members of the coating device 1 can be avoided. [Second Embodiment] Next, a second embodiment of the present invention will be described. Similarly to the first embodiment, in the following drawings, since the size of each member can be identified, the size ratio is appropriately changed. The same reference numerals are used for the same constituent elements as those of the first embodiment, and the description thereof is omitted. In the present embodiment, the configuration of the auxiliary mechanism is different from that of the first embodiment, and this point will be mainly described. Fig. 8(a) is a side view showing a partial structure of the coating device 1A of the present embodiment. Fig. 8(b) is a plan view showing a partial configuration of the coating device 1A1. As shown in FIGS. 8(a) and 8(b), the coating-33-201008856 cloth apparatus 101 of the present embodiment is not a structure in which the auxiliary mechanism 124 contacts the substrate S to press the substrate S by the counter substrate. The S ejected gas 'presses the substrate S in a non-contact manner. Specifically, the auxiliary mechanism 124 is connected to, for example, a gas supply unit (not shown), and is provided along the side edge portion Sa of the substrate S. The auxiliary mechanism 124 is not mounted on the transport mechanism 23, and is provided separately from the transport mechanism 23. The auxiliary mechanism 124 is provided with a gas discharge port 124a. The gas discharge port 124a is disposed on the surface side of the substrate S so as to face the side edge portion Sa. Other configurations are the same as those of the first embodiment. In the above-described configuration, the gas is supplied from the gas supply port 124a by driving the gas supply unit connected to the auxiliary unit 124, and the gas is ejected to the surface (surface) on the +Z direction side of the substrate S. The substrate S is pressed toward the -Z direction side by the ejection of the gas. The surface (back surface) on the -Z direction side of the substrate S is supported by the substrate holding portion 23b of the transport mechanism 23, and the substrate S is pressed toward the substrate holding portion 23b by the negative pressure of the gas. According to the present embodiment, the auxiliary mechanism 124 has the gas discharge port 124a that ejects the gas toward the substrate S, and the substrate S is pressed in a non-contact manner by the gas ejection, so that the contact with the substrate S can be reduced. Thereby, it is possible to prevent the deformation of the substrate S or the occurrence of scratches. According to the present embodiment, since the plurality of gas discharge ports 124a are provided in the conveyance direction of the substrate S, the substrate S can be pressed in a non-contact manner at a desired position on the movement path of the conveyance substrate S. Thereby, the substrate S can be held more stably. It is also possible to provide the above-described auxiliary mechanism 124 so as to be movable in the carrying direction of -34 - 201008856 of the substrate S. By making the moving mechanism 124 movable, even if the number of the auxiliary mechanisms 124 is not singular, for example, the substrate S can be pressed toward the substrate holding portion 23b at a desired timing during the conveyance of the substrate S. [Third Embodiment] Next, a third embodiment of the present invention will be described. Similarly to the first embodiment, in the following drawings, since the size of each member can be identified, the size ratio is appropriately changed. The same reference numerals are used for the same constituent elements as those of the first embodiment, and the description thereof is omitted. In the present embodiment, the configuration of the auxiliary mechanism is different from that of the first embodiment, and this point will be mainly described. Fig. 9(a) is a side view showing a partial structure of the coating device 201 of the present embodiment, and Fig. 9(b) is a plan view showing a partial configuration of the coating device 201. As shown in FIGS. 9( a ) and 9 ( b ), the coating device 201 of the present embodiment does not have the structure in which the auxiliary mechanism 124 contacts the substrate S and presses the substrate S, and the back side of the substrate S is attracted. The space (on the side of the stage portion 22) attracts the structure of the substrate S in a non-contact manner. By sucking the substrate S toward the table portion 22 side, the substrate S is pressed toward the substrate holding portion 23b for holding the back surface side of the substrate S. The auxiliary mechanism 224 is not mounted on the transport mechanism 23' and is provided separately from the transport mechanism 23. The auxiliary mechanism 224 is a suction mechanism (not shown) connected to, for example, a pump, and is provided with a plurality of -35 - 201008856 along the side edge portion Sa of the substrate S. A suction port 224a is provided in the auxiliary mechanism 224. The suction port 224a is disposed on the back side of the substrate S so as to face the side edge portion Sa, and is spaced apart from the substrate S. Other configurations are the same as those of the first embodiment. In the above configuration, the suction mechanism connected to the auxiliary mechanism 24 is driven, and the space on the -Z direction side of the substrate S is attracted by the suction port 224a. The substrate S is attracted to the -Z direction side by the attraction force. By holding the surface (back surface) on the -Z direction side of the substrate S by the substrate holding portion 23b of the transport mechanism 23, and sucking the substrate S by the suction force, the substrate S is pressed toward the substrate holding portion 23b side. According to the present embodiment, the auxiliary mechanism 24 absorbs the same surface of the substrate S as the face (back surface) held by the transport mechanism 23, so that the space can be secured on the face opposite to the face on which the substrate S is held. In the present embodiment, the suction port 224a of the auxiliary mechanism 224 may be provided with an adsorption port, and the adsorption portion may be in contact with the back surface of the substrate S to perform suction. In this case, as a constituent material of the adsorption portion that is in contact with the substrate S, a material capable of holding the substrate S (temperature, presence or absence of scratches, etc.), for example, a material exemplified in the first embodiment, or the like is preferably used. It is also possible to provide the above-described auxiliary mechanism 224 so as to be movable in the conveyance direction of the substrate S. By making the moving mechanism 224 movable, even if the number of the auxiliary mechanisms 224 is not large, for example, the substrate S can be pressed toward the substrate holding portion 23b at a desired timing during the conveyance of the substrate S. The technical scope of the present invention is not limited to the above-described embodiments, and the scope of the present invention can be appropriately changed without departing from the scope of the invention. For example, in the first embodiment described above, the structure in which the auxiliary mechanism 24 is mounted on the attachment member 23d of the transport mechanism 23 is not limited thereto. The auxiliary mechanism 24 may be provided independently of the transport mechanism 23. In this case as well, the assist mechanism 24 can be moved in conjunction with the movement of the transport mechanism 23. The auxiliary mechanism 24 is not limited to being movable by 0 along with the movement of the transport mechanism 23. For example, the auxiliary mechanism 24 may be fixed without being moved. For example, it may be fixed between the table portion 22 and the frame side portion 21b, or between the table portion 22 and the frame side portion 2 1 c. The table portion 22 is applied not only to the loading table 25 but also to the processing table 27 or the carrying-out table 28. In the above-described embodiment, the substrate S is pressed by the auxiliary mechanism 24 to the substrate holding portion 23b when the substrate S starts to be transported, and the substrate S is not limited thereto. For example, the substrate S may be turned toward when the substrate S is transported. The substrate holding portion 2 3b is pressed. When the substrate S is conveyed, that is, when the movement of the substrate S is stopped, a force is applied to the moving direction of the substrate S. It is also considered that if the holding position of the substrate S is shifted due to the force, the carrying out of the substrate S may be hindered. On the other hand, when the substrate S is pressed while the substrate S is being transported, the substrate S is pressed by the auxiliary mechanism 24, and by suppressing the shift of the holding position of the substrate S, it is advantageous in that the substrate S can be smoothly carried out. In the conveyance of the substrate S, for example, the timing of moving from the loading side table 25 toward the processing table 27, or the timing of moving from the processing table 27 to the carry-out side table 28, etc., the movement speed may be changed by assisting each time. The mechanism 24 comes to -37- 201008856 to press the substrate S. Thereby, the offset of the holding position of the substrate S can be more reliably suppressed. As a timing at which the auxiliary mechanism 24 presses the substrate S, for example, the substrate S may be transported while the substrate S is always pressed by the auxiliary mechanism 24. Thereby, it is possible to more reliably prevent the displacement of the holding position of the substrate S. After the substrate S is carried in, the substrate S is pressed by the assist mechanism 24, and the pressing may be released before the substrate S is transported. For example, in the above-described embodiment, when the substrate S is pressed and held by the suction pad 23 f, the auxiliary mechanism 24 is pressed against the substrate S, whereby the adsorption by the suction pad 23 f can be ensured, and the adhesion can be made stronger. The substrate S is held in place. It is also possible to release the pressing of the substrate S during the conveyance of the substrate S. Thereby, the shift of the holding position of the substrate S can be prevented, and the conveyance control of the substrate S can be easily performed. It is also possible to release the pressing before the application of the photoresist R. Thereby, it is possible to avoid the shift of the holding position of the substrate S, and it is possible to easily control the substrate conveyance at the time of coating. In each of the above embodiments, the retracting mechanism (e.g., the shaft member 23g) and the assisting mechanism 24 having the transport mechanism 23 are provided together, and the retracting mechanism and the assisting mechanism 24 exert an independent effect. Therefore, as long as the structure of one of the evacuation mechanism and the auxiliary mechanism 24 of the transport mechanism 3 is provided, the effect corresponding to one of the above embodiments can be obtained. In the above embodiment, the transport mechanism 23 is disposed on both sides of the frame side portion 21b and the frame side portion 21c, and is not limited thereto, and may be only -38 to 201008856, for example, the frame side portion 21b and the frame side portion 21 < One of them is provided with a transport mechanism 23. In the above-described embodiment, the coating device 1' for transporting the substrate S and transporting the substrate is exemplified, and the retracting mechanism including the transport mechanism 23 is not limited thereto, and the coating is carried out by applying the substrate. In the present invention, the present invention is also applicable to a coating device other than the floating transport type, for example, a coating device that transports a substrate by a transport mechanism such as a transport roller. In each of the above embodiments, the substrate holding portion 23b of the transport mechanism 23 is rotated at the center of the shaft member 23g, and the suction pad 23f is brought into contact with the substrate S. The present invention is not limited thereto, and the substrate holding portion 23b may be, for example, Z. The axial direction is raised and lowered to contact the adsorption pad 23f. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to a first embodiment of the present invention. 2 is a front view showing a structure of a coating device according to the present embodiment. FIG. 3 is a plan view showing a structure of the coating device according to the embodiment. FIG. 4 is a view showing a structure of the coating device according to the embodiment. Side view FIG. 5 is a view showing a structure of a transport mechanism of the coating device of the present embodiment. Fig. 6 is a view showing the operation of the coating device of the embodiment. -39- 201008856 Fig. 7 is a view showing the operation of the coating device of the present embodiment. Fig. 8 is a view showing a partial configuration of a coating apparatus according to a second embodiment of the present invention. Fig. 9 is a view showing a partial configuration of a coating apparatus according to a third embodiment of the present invention. [Description of main component symbols] S: Substrate Sa: Side edge portion R: Photoresist 1, 101, 201: Coating device 2: Substrate transfer portion 3: Application portion 22: Table portion 23: Transport mechanism 23b: Substrate retention Part 23P: holding position 23Q: retracted position 24, 124, 224: auxiliary mechanism 24a: support member 24b: pad holding member 24c: pressing pad 24d: shaft member 24e: support plate - 40 - 201008856

2 4 R :上升位置 24P :按壓位置 24Q :退避位置 124a :氣體噴出口 -41 -2 4 R : raised position 24P : pressed position 24Q : retracted position 124a : gas discharge port -41 -

Claims (1)

201008856 七、申請專利範圍: 1· 一種塗佈裝置,是具備有:使基板浮起來進行搬 運的基板搬運部、以及在藉由該基板搬運部一面進行搬運 的同時’一面將液狀體塗佈於上述基板的塗佈部,之塗佈 裝置,其特徵爲: 具備有: 設置於上述基板搬運部,具有將上述基板予以保持的 保持部,在保持住上述基板的狀態將其搬運的搬運機構、 以及將上述基板按壓於上述保持部的輔助機構。 2. 如申請專利範圍第1項的塗佈裝置,其中上述搬 運機構,係將上述基板之中沿著該基板的搬運方向的其中 一側部予以保持。 3. 如申請專利範圍第1項的塗佈裝置,其中上述輔 助機構,是設置在上述基板的搬運開始位置。 4. 如申請專利範圍第1項的塗佈裝置,其中上述輔 助機構,是設置成可朝上述基板的搬運方向移動。 5. 如申請專利範圍第4項的塗佈裝置,其中上述輔 助機構,係搭載於上述搬運機構。 6. 如申請專利範圍第4項的塗佈裝置,其中上述輔 助機構,係具有退避機構。 7. 如申請專利範圍第1項的塗佈裝置,其中上述輔 助機構,係將上述基板之中與上述搬運機構所保持的面部 不同的面部予以按壓。 8. 如申請專利範圍第6項的塗佈裝置,其中上述輔 -42- 201008856 助機構,具有將上述基板予以按壓的按壓部, 上述按壓部,是由可將上述基板的按壓面的狀態予以 保持的材質所構成。 9.如申請專利範圍第7項的塗佈裝置,其中上述輔 助機構,係按壓從俯視方向觀察與上述保持部重疊的位置 〇 10·如申請專利範圍第1項的塗佈裝置,其中上述輔 Φ 助機構,係具有朝上述基板噴出氣體的氣體噴出部,並藉 由上述氣體的噴出而以非接觸方式按壓上述基板。 11. 如申請專利範圍第10項的塗佈裝置,其中上述 氣體噴出部,是於上述基板的搬運方向設置有複數個。 12. 如申請專利範圍第1項的塗佈裝置,其中上述輔 助機構,是將上述基板之中與上述搬運機構所保持的面部 相同的面部予以吸引。 13. 如申請專利範圍第12項的塗佈裝置,其中上述 Q 輔助機構,係具有:接觸上述基板而將其吸引的吸引部, 上述吸引部是由可將上述基板的吸引面的狀態予以保 持的材質所構成。 14. 如申請專利範圍第12項的塗佈裝置,其中上述 輔助機構,係具有吸附於上述基板的吸附部。 15. 如申請專利範圍第12項的塗佈裝置,其中上述 輔助機構,係具有將其與上述基板之間的氣體予以吸引的 氣體吸引部,並藉由上述氣體的吸引,以非接觸方式吸引 上述基板。 -43- 201008856 16. 如申請專利範圍第1項的塗佈裝置,其中在上述 塗佈部的上游側及下游側其中至少一方,設置有台部,該 台部具備有使上述基板浮起的浮起機構, 上述台部具有從俯視方向觀察大致正方形的形狀。 17. —種塗佈方法,是使基板浮起來一面進行搬運的 同時,一面對上述基板塗佈液狀體的塗佈方法,其特徵爲 藉由將上述基板進行搬運的搬運機構的保持部,來保 持上述基板, 將被上述保持部所保持的上述基板朝向上述保持部按 壓, 在保持住上述基板的狀態,搬運該基板而塗佈上述液 狀體。 18. 如申請專利範圍第17項的塗佈方法,其中在按 壓住上述基板的狀態來搬運上述基板。 19. 如申請專利範圍第17項的塗佈方法,其中在搬 運上述基板之前,解除上述基板之朝向上述保持部的按壓 〇 20. 如申請專利範圍第19項的塗佈方法,其中當搬 運上述基板時,解除上述基板之朝向上述保持部的按壓。 21·如申請專利範圍第20項的塗佈方法,其中在塗 佈上述液狀體之前,解除上述基板之朝向上述保持部的按 壓。 22. —種塗佈裝置,是具備有:將基板進行搬運的基 -44 - 201008856 板搬運部、以及藉由該基板搬運部一面進行搬運的同時, 一面將液狀體塗佈於上述基板的塗佈部,之塗佈裝置,其 特徵爲: 具備有:設置於上述基板搬運部,具有將上述基板予 以保持的保持部,在保持住上述基板的狀態將其搬運的搬 運機構; 上述搬運機構,設置成可朝上述基板的搬運方向移動 上述保持部,設置成可朝與上述搬運方向不同的方向 移動。 23. 如申請專利範圍第22項的塗佈裝置,其中上述 基板搬運部,係具備使上述基板浮起的浮起機構。 24. 如申請專利範圍第22項的塗佈裝置,其中上述 保持部,具備:在搬運基板後,以退避的狀態回到基板搬 運部的退避機構。 2 5.如申請專利範圍第22項的塗佈裝置,其中在上 述塗佈部的上游側及下游側其中至少一方,設置有台部’ 該台部具備使上述基板浮起的浮起機構, 上述台部具有從俯視方向觀察大致正方形的形狀。 -45-201008856 VII. Patent application scope: 1. A coating apparatus comprising: a substrate conveying unit that floats a substrate and transports the substrate, and conveys the liquid body while being conveyed by the substrate conveying unit; In the application unit of the above-described substrate, the coating device is provided with a holding unit that holds the substrate and holds the substrate, and transports the substrate while holding the substrate. And an auxiliary mechanism that presses the substrate against the holding portion. 2. The coating apparatus according to claim 1, wherein the transporting means holds one of the substrates along a direction in which the substrate is conveyed. 3. The coating apparatus according to claim 1, wherein the auxiliary mechanism is provided at a conveyance start position of the substrate. 4. The coating apparatus according to claim 1, wherein the auxiliary mechanism is provided to be movable in a conveyance direction of the substrate. 5. The coating apparatus according to claim 4, wherein the auxiliary mechanism is mounted on the transport mechanism. 6. The coating device of claim 4, wherein the auxiliary mechanism has a retracting mechanism. 7. The coating apparatus according to claim 1, wherein the auxiliary mechanism presses a surface of the substrate different from a surface held by the transport mechanism. 8. The coating apparatus according to claim 6, wherein the auxiliary-42-201008856 assisting mechanism has a pressing portion that presses the substrate, and the pressing portion is configured to be capable of pressing a pressing surface of the substrate The material is kept. 9. The coating device according to claim 7, wherein the auxiliary mechanism presses a position overlapping with the holding portion when viewed from a plan view. The coating device according to claim 1, wherein the auxiliary device The Φ assisting mechanism has a gas ejecting portion that ejects a gas toward the substrate, and the substrate is pressed in a non-contact manner by the ejecting of the gas. 11. The coating apparatus according to claim 10, wherein the gas ejecting portion is provided in plural in a conveying direction of the substrate. 12. The coating device according to claim 1, wherein the auxiliary mechanism attracts a face other than a face held by the transport mechanism among the substrates. 13. The coating apparatus according to claim 12, wherein the Q auxiliary mechanism has a suction portion that contacts the substrate and attracts the suction portion, and the suction portion holds the suction surface of the substrate. Made up of materials. 14. The coating apparatus according to claim 12, wherein the auxiliary mechanism has an adsorption portion adsorbed to the substrate. 15. The coating apparatus according to claim 12, wherein the auxiliary mechanism has a gas suction portion that attracts gas between the substrate and the substrate, and attracts in a non-contact manner by suction of the gas. The above substrate. The coating apparatus according to the first aspect of the invention, wherein at least one of an upstream side and a downstream side of the coating unit is provided with a table portion provided with a floating portion of the substrate The floating mechanism has a substantially square shape as viewed from a plan view. 17. The coating method is a coating method of the substrate coating liquid body while the substrate is floated and transported, and is characterized by a holding portion of a transport mechanism that transports the substrate In order to hold the substrate, the substrate held by the holding portion is pressed toward the holding portion, and the substrate is conveyed while the substrate is held, and the liquid material is applied. 18. The coating method according to claim 17, wherein the substrate is carried in a state in which the substrate is pressed. The coating method of claim 17, wherein the coating method of the above-mentioned substrate is released before the substrate is transported. At the time of the substrate, the pressing of the substrate toward the holding portion is released. The coating method according to claim 20, wherein the pressing of the substrate toward the holding portion is released before the liquid material is applied. 22. A coating apparatus comprising: a base-44 - 201008856 board conveying unit for transporting a substrate; and a liquid material applied to the substrate while being conveyed by the substrate conveying unit The application unit of the coating unit, comprising: a holding unit provided in the substrate conveying unit, and having a holding unit for holding the substrate, and transporting the substrate while holding the substrate; The holding portion is movable in a conveyance direction of the substrate, and is provided to be movable in a direction different from the conveyance direction. 23. The coating apparatus according to claim 22, wherein the substrate conveying unit is provided with a floating mechanism for floating the substrate. 24. The coating apparatus according to claim 22, wherein the holding portion includes a retracting mechanism that returns to the substrate transporting unit in a retracted state after the substrate is transported. [2] The coating device according to claim 22, wherein at least one of the upstream side and the downstream side of the coating portion is provided with a table portion', and the table portion includes a floating mechanism for floating the substrate. The table portion has a substantially square shape as viewed in plan view. -45-
TW098119238A 2008-06-26 2009-06-09 Coating apparatus and coating method TWI481540B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008167362A JP5563752B2 (en) 2008-06-26 2008-06-26 Coating apparatus and coating method

Publications (2)

Publication Number Publication Date
TW201008856A true TW201008856A (en) 2010-03-01
TWI481540B TWI481540B (en) 2015-04-21

Family

ID=41586606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098119238A TWI481540B (en) 2008-06-26 2009-06-09 Coating apparatus and coating method

Country Status (3)

Country Link
JP (1) JP5563752B2 (en)
KR (2) KR101570880B1 (en)
TW (1) TWI481540B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101353157B1 (en) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 Electrostatic chuck
CN103827655B (en) * 2011-07-22 2018-08-14 罗氏血液诊断股份有限公司 Sample delivery system and method
JP6339341B2 (en) * 2013-10-11 2018-06-06 平田機工株式会社 Processing system and processing method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278243A (en) * 1987-05-08 1988-11-15 Tokyo Electron Ltd Wafer conveyer
JPS6466999A (en) * 1987-09-08 1989-03-13 Hitachi Ltd Component attraction head in electronic component mounting device
JPH04242954A (en) * 1991-01-08 1992-08-31 Fujitsu Ltd Wafer chuck
JPH04279229A (en) * 1991-03-05 1992-10-05 Murata Mach Ltd Work feeding device for sheet metal working machine
JP3245813B2 (en) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 Coating film forming equipment
TW398025B (en) * 1997-03-25 2000-07-11 Tokyo Electron Ltd Processing device and method of the same
JP4447757B2 (en) * 1999-10-01 2010-04-07 東京エレクトロン株式会社 Coating device
JP4394797B2 (en) * 2000-02-23 2010-01-06 大日本印刷株式会社 Substrate transfer device
JP2004146651A (en) * 2002-10-25 2004-05-20 Tokyo Electron Ltd Method and apparatus for coating with resist
JP4780752B2 (en) * 2004-12-28 2011-09-28 Uht株式会社 Cutting device
JP4378301B2 (en) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and substrate processing program
US8733275B2 (en) * 2005-03-11 2014-05-27 Toray Industries, Inc. Application apparatus, application method and method for manufacturing web having coating film
TW200638083A (en) * 2005-04-18 2006-11-01 Shibaura Mechatronics Corp The coating apparatus and method thereof
TW200643517A (en) * 2005-06-14 2006-12-16 Quanta Display Inc Photoresist coating method and apparatus
JP4716509B2 (en) * 2006-06-09 2011-07-06 大日本スクリーン製造株式会社 Coating apparatus and coating method

Also Published As

Publication number Publication date
TWI481540B (en) 2015-04-21
KR20100002134A (en) 2010-01-06
KR101570880B1 (en) 2015-11-20
JP5563752B2 (en) 2014-07-30
JP2010005526A (en) 2010-01-14
KR20150073931A (en) 2015-07-01

Similar Documents

Publication Publication Date Title
JP4896236B2 (en) Substrate transport apparatus and substrate transport method
TWI661505B (en) Transfer device, transfer method, exposure device, and component manufacturing method
TWI261041B (en) Conveying apparatus, application system and inspection system
KR101603343B1 (en) Substrate transportation and processing apparatus
TWI353894B (en) A spreading device and a method for spreading liqu
JP2006237097A (en) Stage apparatus and application processing apparatus
JP2005223119A (en) Apparatus and method for forming coating film
JP2004284698A (en) Workpiece conveyance device
TWI444321B (en) Coating applicator, method of transferring a substrate and method of coating
TW200819734A (en) Substrate inspection apparatus
TWI462215B (en) Substrate processing apparatus, changing method and transferring method
JP5771432B2 (en) Coating device
JP2009011917A (en) Cleaning device, cleaning method, preparatory ejection device, and coating device
JP2009094184A (en) Substrate treatment apparatus and treating method
TWI481540B (en) Coating apparatus and coating method
JP5550882B2 (en) Coating device
JP2009136756A (en) Nozzle cleaning device, nozzle cleaning method, coating device and coating method
JP2009028577A (en) Apparatus and method for coating
JP5303231B2 (en) Coating device
TWI503631B (en) Coating apparatus
JP5244445B2 (en) Coating device
TWI351321B (en) Coating applicator
TWI596018B (en) Removing method, removing apparatus and printing system
JP2009022822A (en) Coating apparatus and coating method
JP5977044B2 (en) Printing apparatus and printing method