200918175 九、發明說明 【發明所屬之技術領域】 本發明是關於塗佈裝置及塗佈方法。 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上，形成 有配線圖案或電極圖案等的細微圖案。一般來說這種圖案 ，是用例如光微影技術等方法所形成。在光微影技術中， 分別進行：在玻璃基板上形成光阻膜的步驟、將該光阻膜 進行圖案曝光的步驟、及之後將該光阻膜予以顯影的步驟 〇 已知的作爲在基板的表面上塗佈光阻膜的塗佈裝置， 是將狹縫噴嘴固定，藉由機械人等將玻璃基板搬運於該狹 縫噴嘴下，對於該玻璃基板塗佈光阻劑。而因爲近年來， 基板的尺寸大型化至2 m X 2 m以上，所以在機械人所進行 的搬運方面，會有處理作業線變長的問題。因此，已知的 塗佈裝置，是藉由將氣體噴出到載台上，來使基板浮起移 動，而使處理作業線縮短（例如，參考專利文獻1 )。 [專利文獻1 ] 日本特開2005-236092號公報 【發明內容】 [發明欲解決的課題] 可是，處理作業線更加縮短化的需求更多，所以當然 -4 - 200918175 必須要求處理作業線的縮短化。 鑑於以上的情形’本發明的目的，是要提供一種可將 處理作業線縮短化的塗佈裝置及塗佈方法。 [用以解決課題的手段] 爲了達成上述目的’本發明具有以下的構造。 (1) 是具備有：使基板浮起來進行搬運的基板搬運部、及 具有在藉由該基板搬運部搬運基板的同時對上述基板塗佈 液狀體的噴嘴的塗佈部的塗佈裝置，其特徵爲：在上述塗 佈部，設置有：對於上述噴嘴分別壓送上述液狀體的複數 的泵浦。 藉由（1)的裝置，設置有：對於塗佈部的噴嘴分別壓送 液狀體的複數的泵浦，所以即使在藉由複數的泵浦其中一 個泵浦充塡液狀體的期間，也不會浪費時間，也能藉由其 他泵浦來供給液狀體。 (2) 在（1)的塗佈裝置，在上述塗佈部設置有複數的噴嘴。 藉由（2)的裝置，在塗佈部設置有複數的噴嘴，所以在 複數的噴嘴其中一個噴嘴充塡液狀體的期間，能藉由其他 噴嘴塗佈液狀體。藉此’即使在液狀體的充塡期間也不會 浪費時間，也能對基板上供給液狀體。 (3) 在（2)的塗佈裝置，是對應於複數的上述噴嘴的各個， 來設置上述泵浦。 -5- 200918175 藉由（3 )的裝置，是對應於複數的噴嘴的各個’來設置 泵浦，所以對複數的噴嘴的各個能個別充塡液狀體。藉此 能減少泵浦的負擔。 (4) 在（2)或（3)的塗佈裝置，複數的上述噴嘴是沿著上述基 板搬運部的基板搬運方向排列。 藉由（4)的裝置’複數的噴嘴是沿著基板搬運部的基板 搬運方向排列，所以當從各個噴嘴吐出液狀體時’只要使 噴嘴平行移動即可完成，不需要使其旋轉移動。因此’能 將液狀體容易地吐出到基板上。 (5) 在（1)〜（4)其中之一的塗佈裝置’從複數的上述泵浦的 各個到上述噴嘴的液狀體搬運路線的長度，是互相大致相 同。 藉由（5)的裝置，從複數的泵浦的各個到噴嘴的液狀體 搬運路線的長度，是互相大致相同，所以能使各個泵浦〜 噴嘴間的液狀體搬運路線的條件大致相同。藉此，能將液 狀體穩定吐出到基板上。 (6) 在（1)〜（5)其中之一的塗佈裝置，將複數的上述泵浦配 置在：相對於上述噴嘴爲互相大致相等距離的位置。 藉由（6)的裝置，將複數的泵浦配置在：相對於噴嘴爲 互相大致相等距離的位置，所以能使各個栗浦〜噴嘴間的 液狀體搬運路線的條件大致相同。藉此，能將液狀體穩定 -6- 200918175 吐出到基板上。 (7)在（1)〜（6)其中之一的塗佈裝置，將複數的上述泵浦配 置在：可自由升降地支承上述噴嘴的框架部。 藉由（7)的裝置’將複數的泵浦配置在：可自由升降地 支承噴嘴的框架部，所以能配合噴嘴的升降來使栗浦升降 。藉此，能將栗浦〜噴嘴間的液狀體搬運路'線的狀態保1持 爲一定，所以能將液狀體穩定吐出到基板上。除此之外’ 能夠縮短泵浦與噴嘴之間的距離’因而能減輕栗浦的負擔 (8)在（7)的塗佈裝置，將複數的上述泵浦配置在：上述框 架部之中的上述基板搬運方向的上游側。 藉由（8)的裝置，將複數的泵浦配置在：框架部之中的 基板搬運方向的上游側，所以能以穩定的狀態安裝各杲浦 (9)在（7)的塗佈裝置，將複數的上述泵浦配置在：上述框 架部之中的上述基板搬運方向的下游側。 藉由（9)的裝置，將複數的泵浦配置在：框架部之中的 基板搬運方向的下游側，所以能以穩定的狀態安裝各栗浦 (10)在（7)的塗佈裝置，上述框架部具有：設置在上述基板 200918175 搬運部的上空的樑構件、及支承上述樑構件的柱構件；將 複數的上述泵浦安裝於上述樑構件。 藉由（ίο)的裝置，框架部具有：設置在基板搬運部的 上空的樑構件、及支承該樑構件的柱構件；將複數的泵浦 安裝於樑構件，所以能以穩定的狀態安裝各栗浦。 (11)在（10)的塗佈裝置，將複數的上述泵浦安裝在上述樑 構件的上面的大致中央部。 藉由（1 1)的裝置，將複數的泵浦安裝在樑構件的上面 的大致中央部，所以能將從噴嘴到泵浦的液狀體搬運路線 縮短。 (12) 在（7)的塗佈裝置，上述框架部具有：設置在上述基板 搬運部的上空的樑構件、及支承上述樑構件的柱構件；將 複數的上述泵浦安裝於上述框架部的柱構件。 藉由（12)的裝置，框架部具有：設置在基板搬運部的 上空的樑構件、及支承樑構件的柱構件；將複數的泵浦安 裝於框架部的柱構件，所以能以穩定的狀態安裝各泵浦。 (13) 在（1)〜（6)其中之一的塗佈裝置，具備有：支承複數 的上述泵浦的泵浦用框架部，將上述泵浦用框架部相對於 上述噴嘴配置在上述基板搬運方向的前側。 藉由（13)的塗佈裝置，具備有：支承複數的栗浦的泵 浦用框架部，將泵浦用框架部相對於噴嘴配置在基板搬運 -8- 200918175 方向的前側，所以能使泵浦的振動不易傳達到液狀體塗佈 後的基板。 (14) 在（1)〜（13)其中之一的塗佈裝置’上述基板搬運部是 具備有：在基板載置面具有複數的氣體噴出孔的第一載台 裝置、以及設置成與上述塗佈部相對向’在基板載置面具 有複數的氣體噴出孔及複數的氣體吸入孔的第二載台裝置 〇 藉由（14)的裝置，基板搬運部是具備有：在基板載置 面具有複數的氣體噴出孔的第一載台裝置、以及設置成與 塗佈部相對向，在基板載置面具有複數的氣體噴出孔及複 數的氣體吸入孔的第二載台裝置；所以在塗佈部能更精細 地調整基板的浮起量。 (15) 在（1)〜（14)其中之一的塗佈裝置，具備有預備吐出部 ，該預備吐出部具有：當進行上述塗佈部的預備吐出動作 時，從上述塗佈部塗佈上述液狀體的大致平面的預備吐出 面。 藉由（15)的裝置，具備有預備吐出部，該預備吐出部 具有：當進行塗佈部的預備吐出動作時’從塗佈部塗佈液 狀體的大致平面的預備吐出面，所以可在基板上塗佈狀態 良好之液狀體的膜。 (16)是使基板浮起來進行搬運，且同時將藉由泵浦所壓送 -9 - 200918175 的液狀體從噴嘴吐出來塗佈於上述基板的方法，是 將上述液狀體充塡到與吐出上述液狀體的噴嘴連接 泵浦的步驟、將上述基板搬入到上述噴嘴的前面的 以及從上述第一泵浦將上述液狀體壓送到上述噴嘴 述噴嘴將上述液狀體吐出到上述基板上，且同時將 狀體充塡到與上述噴嘴連接的第二泵浦的步驟。 藉由（16)的塗佈方法，將液狀體充塡到與吐出 的噴嘴連接的第一泵浦，將基板搬入到噴嘴的前面 一泵浦將液狀體壓送到噴嘴，從噴嘴將液狀體吐出 上，且同時將液狀體充塡到與噴嘴連接的第二泵浦 即使在藉由複數的泵浦其中一個泵浦充塡液狀體的 也不會浪費時間，也能藉由其他泵浦來供給液狀體 (17)在（16)的塗佈方法，是具有：接著已塗佈上述 的第一上述基板，將第二上述基板搬運到上述噴嘴 的步驟、以及從上述第二泵浦將上述液狀體壓送到 嘴，從上述噴嘴將上述液狀體吐出到上述第二基板 驟。 藉由（I7)的塗佈方法，接著已塗佈液狀體的第 ，將第二基板搬運到噴嘴的前面，從第二泵浦將液 送到噴嘴，從噴嘴將液狀體吐出到第二基板上，所 會浪費時間地進行塗佈動作。 (1 8 )在（1 7)的塗佈方法，在將上述液狀體吐出到上 具有： 的第一 步驟、 ，從上 上述液 液狀體 ，從第 到基板 ，所以 期間， 液狀體 的前面 上述噴 上的步 一基板 狀體壓 以能不 述第二 -10- 200918175 基板上的步驟’將上述液狀體充塡到上述第一泵浦 藉由（1 8)的塗佈方法，在將液狀體吐出到第二 的步驟’將液狀體充塡到第一泵浦，所以能交互地 一栗浦與第二泵浦。藉此能不會浪費時間而連續地 佈動作。 (19)是使基板浮起來進行搬運，且同時將液狀體塗 述基板的方法，是具有··將上述液狀體充塡到與吐 液狀體的第一噴嘴連接的第一泵浦的步驟、將第一 板搬入到上述第一噴嘴的前面的步驟、從上述第一 上述液狀體壓送到上述第一噴嘴，從上述第一噴嘴 液狀體吐出到上述第一基板上，且同時將上述液狀 到與第二噴嘴連接的第二泵浦的步驟、將第二上述 入到上述第二噴嘴的前面的步驟、以及從上述第二 上述液狀體壓送到上述第二噴嘴，從上述第二噴嘴 液狀體吐出到上述第二基板上的步驟。 藉由（1 9)的塗佈方法，將液狀體充塡到與吐出 的第一噴嘴連接的第一泵浦，將第一基板搬入到第 的前面，從第一栗浦將液狀體壓送到第一噴嘴’從 嘴將液狀體吐出到第一基板上，且同時將液狀體充 第二噴嘴連接的第二泵浦，將第二基板搬入到第二 前面，從第二泵浦將液狀體壓送到第二噴嘴，從第 將液狀體吐出到第二基板上’所以能不會浪費時間 地進行塗佈動作。 基板上 使用第 進行塗 佈於上 出上述 上述基 泵浦將 將上述 體充塡 基板搬 泵浦將 將上述 液狀體 一噴嘴 第一噴 塡到與 噴嘴的 二噴嘴 而連續 -11 - 200918175 [發明效果] 藉由本發明，能獲得可將處理作業線縮短化的塗佈裝 置及塗佈方法。 【實施方式】 以下根據圖面來說明本發明的實施方式。 第1圖是本發明的一種實施方式的塗佈裝置1的立體 圖。 如第1圖所示，本實施方式的塗佈裝置1，是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置，是 以：基板搬運部2、塗佈部3、管理部4，爲主要構成元件 。該塗佈裝置1，是藉由基板搬運部2使基板浮起來進行 搬運，且藉由塗佈部3將光阻劑塗佈於該基板上，藉由管 理部4來管理塗佈部3的狀態。 第2圖是塗佈裝置1的正視圖，第3圖是塗佈裝置1 的俯視圖，第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。 (基板搬運部） 首先來說明基板搬運部2的構造。 基板搬運部2具有：基板搬入區域20、塗佈處理區域 21、基板搬出區域22、搬運機構23、以及支承這些構造 的框架部24。在該基板搬運部2，是藉由搬運機構23將 基板S依序搬運到基板搬入區域20、塗佈處理區域21、 -12- 200918175 及基板搬出區域22。基板搬入區域20、塗佈處理區域21 、及基板搬出區域22，是以該順序從基板搬運方向的上游 側排列到下游側。搬運機構23，爲了要涵蓋基板搬入區域 20、塗佈處理區域21、及基板搬出區域22的各部分，而 設置在該各部分的其中一側。 以下在說明塗佈裝置1的構造時，爲了容易表示，使 用XYZ座標系來說明圖中的方向。將基板搬運部2的長 軸方向也就是基板的搬運方向記爲X方向。將從俯視方向 觀察與X方向（基板搬運方向）垂直相交的方向記爲Y方向 。將與包含X方向軸及Y方向軸的平面垂直的方向記爲Z 方向。分別在X方向、Y方向及Z方向，圖中箭頭的方向 爲+方向，與箭頭的方向相反的方向爲-方向。200918175 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a coating apparatus and a coating method. [Prior Art] A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film later are known as being on the substrate. The coating device for applying a photoresist film on the surface is a slit nozzle fixed, and a glass substrate is conveyed under the slit nozzle by a robot or the like, and a photoresist is applied to the glass substrate. In recent years, the size of the substrate has been increased to 2 m X 2 m or more. Therefore, there is a problem that the processing line becomes long in the transportation by the robot. Therefore, the known coating apparatus shortens the processing line by causing the substrate to be ejected onto the stage to move the substrate (for example, refer to Patent Document 1). [Patent Document 1] JP-A-2005-236092 [Summary of the Invention] [Problems to be Solved by the Invention] However, there is a greater demand for a shorter processing line, so of course - 4 - 200918175 requires a shortening of the processing line. Chemical. In view of the above circumstances, it is an object of the present invention to provide a coating apparatus and a coating method which can shorten a processing line. [Means for Solving the Problem] In order to achieve the above object, the present invention has the following structure. (1) A substrate transporting unit that transports a substrate and transports the substrate, and a coating device that has a coating portion that applies a liquid to the substrate while the substrate is transported by the substrate transporting unit. The coating unit is provided with a plurality of pumps that pressurize the liquid material to the nozzles. According to the apparatus of (1), a plurality of pumps for pumping the liquid to the nozzles of the application portion are provided, so that even when one of the pumps is filled with the liquid by a plurality of pumps, It also does not waste time, and can also supply liquid by other pumps. (2) In the coating device of (1), a plurality of nozzles are provided in the coating portion. According to the apparatus of (2), a plurality of nozzles are provided in the coating portion. Therefore, while one of the plurality of nozzles is filled with the liquid, the liquid can be applied by the other nozzles. Thereby, the liquid can be supplied to the substrate even if no time is wasted during the filling of the liquid. (3) In the coating device of (2), the pump is provided corresponding to each of the plurality of nozzles. -5- 200918175 With the device of (3), the pump is provided corresponding to each of the plurality of nozzles, so that each of the plurality of nozzles can be individually filled with the liquid. This can reduce the burden of pumping. (4) In the coating apparatus of (2) or (3), the plurality of nozzles are arranged along the substrate conveyance direction of the substrate conveyance unit. According to the apparatus of (4), the plurality of nozzles are arranged along the substrate transport direction of the substrate transporting portion. Therefore, when the liquid material is discharged from each of the nozzles, the nozzles can be moved in parallel without moving them. Therefore, the liquid can be easily discharged onto the substrate. (5) The length of the liquid conveyance path of each of the plurality of pumping units to the nozzles in the coating apparatus of one of (1) to (4) is substantially the same as each other. According to the apparatus of (5), the lengths of the liquid conveyance paths from the respective pumps to the nozzles are substantially the same, so that the conditions of the liquid conveyance route between the respective pumps and nozzles are substantially the same. . Thereby, the liquid can be stably discharged onto the substrate. (6) In the coating apparatus according to any one of (1) to (5), the plurality of pumps are disposed at positions substantially equal to each other with respect to the nozzles. According to the apparatus of (6), the plurality of pumps are disposed at positions substantially equal to each other with respect to the nozzles, so that the conditions of the liquid conveyance route between the respective pump and nozzle can be made substantially the same. Thereby, the liquid can be stably -6-200918175 spit out onto the substrate. (7) The coating apparatus according to any one of (1) to (6), wherein the plurality of pumps are disposed to support the frame portion of the nozzle so as to be freely movable. Since the plurality of pumps are arranged by the device of (7) to support the frame portion of the nozzle so as to be freely movable, the pump can be lifted and lowered in accordance with the lifting and lowering of the nozzle. Thereby, the state of the liquid conveyance path ' between the chestnut and the nozzle can be kept constant, so that the liquid can be stably discharged onto the substrate. In addition, 'the distance between the pump and the nozzle can be shortened', so that the burden on the pump can be reduced. (8) In the coating device of (7), the plurality of pumps are disposed in the frame portion. The upstream side of the substrate transport direction. According to the device of (8), the plurality of pumps are disposed on the upstream side in the substrate conveyance direction of the frame portion, so that the coating device of each of the pumps (9) in (7) can be mounted in a stable state. The plurality of pumps are disposed on the downstream side of the substrate conveyance direction in the frame portion. According to the device of (9), the plurality of pumps are disposed on the downstream side of the substrate conveyance direction in the frame portion, so that the coating device of each of the pump (10) in (7) can be mounted in a stable state. The frame portion includes a beam member that is disposed above the transport portion of the substrate 200918175, and a column member that supports the beam member, and a plurality of the pumps are attached to the beam member. According to the device of the present invention, the frame portion includes: a beam member provided above the substrate conveying portion and a column member for supporting the beam member; and a plurality of pumps are attached to the beam member, so that each of the frame members can be mounted in a stable state Lipu. (11) In the coating apparatus of (10), the plurality of pumps are attached to substantially the center of the upper surface of the beam member. According to the device of (1 1), a plurality of pumps are attached to the substantially central portion of the upper surface of the beam member, so that the liquid conveyance path from the nozzle to the pump can be shortened. (12) The coating device according to (7), wherein the frame portion includes: a beam member provided above the substrate conveying portion; and a column member that supports the beam member; and the plurality of pumps are attached to the frame portion Column member. According to the apparatus of (12), the frame portion includes: a beam member provided above the substrate conveying portion and a column member that supports the beam member; and a plurality of pumps are attached to the column member of the frame portion, so that the frame member can be stabilized Install each pump. (13) The coating device according to any one of (1) to (6), further comprising: a pumping frame portion that supports the plurality of pumps, wherein the pumping frame portion is disposed on the substrate with respect to the nozzle The front side of the conveying direction. In the coating device of (13), the pump frame portion that supports a plurality of pump pumps is provided, and the pump frame portion is disposed on the front side in the direction of substrate conveyance -8-200918175 with respect to the nozzle, so that the pump can be used. The vibration of the pump is not easily transmitted to the substrate after the liquid coating. (14) The coating device of any one of (1) to (13), wherein the substrate conveying unit includes a first stage device having a plurality of gas ejection holes on the substrate mounting surface, and is provided in the above The application unit is provided with a second stage device having a plurality of gas ejection holes and a plurality of gas suction holes on the substrate mounting surface, and the substrate conveying unit is provided on the substrate mounting surface. a first stage device having a plurality of gas ejection holes, and a second stage device provided to face the application portion and having a plurality of gas ejection holes and a plurality of gas suction holes on the substrate mounting surface; The cloth portion can finely adjust the amount of floating of the substrate. (15) The coating device according to any one of (1) to (14), further comprising a preliminary discharge portion that is coated from the coating portion when performing the preliminary discharge operation of the application portion A substantially planar preliminary discharge surface of the liquid material. According to the apparatus of (15), the preliminary discharge unit includes a preliminary discharge surface that applies a substantially flat surface of the liquid material from the application portion when the preparatory discharge operation of the application portion is performed. A film of a liquid state in a good state is applied to the substrate. (16) is a method in which a substrate is floated and transported, and a liquid material which is pumped by pumping -9 - 200918175 is discharged from a nozzle and applied to the substrate, and the liquid is filled a step of connecting the pump to the nozzle for discharging the liquid material, loading the substrate into the front surface of the nozzle, and pressing the liquid material from the first pump to the nozzle nozzle to discharge the liquid material to the nozzle The step of charging the body onto the substrate and simultaneously charging the second pump to the nozzle. By the coating method of (16), the liquid is filled to the first pump connected to the discharge nozzle, and the substrate is carried into the front of the nozzle, and the pump presses the liquid to the nozzle, and the nozzle will The liquid is discharged, and at the same time, the liquid is filled to the second pump connected to the nozzle, and even if it is pumped by a plurality of pumps, the liquid is not wasted, and the borrowing can be borrowed. The method of applying the liquid material (17) to (16) by another pump, comprising: applying the first substrate described above, and transferring the second substrate to the nozzle; and The second pump presses the liquid body to the nozzle, and discharges the liquid body from the nozzle to the second substrate. By the coating method of (I7), the second substrate is transported to the front side of the nozzle, and the liquid is sent to the nozzle from the second pump, and the liquid is discharged from the nozzle to the first step. On the two substrates, the coating operation is wasted time. (1) The coating method of (17), wherein the liquid material is discharged onto the first step, and the liquid liquid is applied to the liquid crystal from the first to the substrate, so that the liquid is in a liquid state. The step of spraying the substrate-shaped body on the front side of the substrate can be used to apply the coating method of the first pump to the first pump (18) without the step of the second-10-200918175 substrate. In the step of discharging the liquid to the second step, the liquid is filled to the first pump, so that the Lipu and the second pump can be interactively exchanged. Thereby, it is possible to continuously operate without wasting time. (19) A method of coating a liquid substrate by transporting a substrate and transporting the liquid material to the first pump connected to the first nozzle of the liquid discharge body a step of loading the first plate into the front surface of the first nozzle, pressing the first liquid material from the first liquid nozzle to the first nozzle, and discharging the liquid from the first nozzle liquid onto the first substrate And simultaneously, the step of fluidly flowing to the second pump connected to the second nozzle, the step of introducing the second into the front surface of the second nozzle, and the step of transferring the liquid from the second liquid to the second a nozzle is discharged from the second nozzle liquid to the second substrate. The liquid is filled into the first pump connected to the discharged first nozzle by the coating method of (19), and the first substrate is carried into the front surface, and the liquid is discharged from the first pump Pressing to the first nozzle 'discharges the liquid from the nozzle onto the first substrate, and simultaneously fills the liquid to the second pump connected to the second nozzle, and carries the second substrate into the second front, from the second The pump presses the liquid to the second nozzle and discharges the liquid to the second substrate. Therefore, the coating operation can be performed without wasting time. The substrate is coated on the substrate to apply the above-mentioned base pump to pump the substrate to the substrate, and the first nozzle of the liquid body is first squirted to the nozzle with the nozzle continuously -11 - 200918175 [ Advantageous Effects of Invention According to the present invention, a coating apparatus and a coating method capable of shortening a processing line can be obtained. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a perspective view of a coating device 1 according to an embodiment of the present invention. As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate conveying unit 2 and a coating unit 3 . The management unit 4 is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. (Substrate conveyance unit) First, the structure of the board conveyance unit 2 will be described. The substrate transporting unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transporting unit 2, the substrate S is sequentially transported to the substrate loading area 20, the coating processing area 21, the -12-200918175, and the substrate carrying-out area 22 by the transport mechanism 23. The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 23 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22. Hereinafter, in explaining the structure of the coating apparatus 1, the direction in the drawing will be described using an XYZ coordinate system for ease of display. The longitudinal direction of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.
基板搬入區域20，是將從裝置外部搬運過來的基板S 予以搬入的部位，具有：搬入側載台25、與升降機構26 〇 搬入側載台25，設置在框架部24的上部，是例如由 SUS等所構成的從俯視方向觀察爲矩形的板狀構件。該搬 入側載台25，其X方向爲長軸。在搬入側載台25，分別 設有複數的空氣噴出孔2 5 a、與複數的升降銷出沒孔2 5 b 。該空氣噴出孔25a及升降銷出沒孔25b，是設置成貫穿 搬入側載台25。 空氣噴出孔25a，是將空氣噴出到搬入側載台25的載 台表面25c上的孔，例如在搬入側載台25之中基板S通 過的區域配置成從俯視方向觀察爲矩陣狀。該空氣噴出孔 -13- 200918175 2 5 a連接著沒有圖示的空氣供給源。在該搬入側載台 藉由從空氣噴出孔25a所噴出的空氣而能使基板S 方向浮起。 升降銷出沒孔2 5 b，是設置在搬入側載台2 5之中 S搬入的區域。該升降銷出沒孔2 5 b，讓供給到載台 25c的空氣不會漏出。 在該搬入側載台25之中的Y方向的兩端部’各 有一個校準裝置25d。校準裝置25d，是將搬入到搬 載台25的基板S予以定位的裝置。各校準裝置25d :長孔、與設在該長孔內的定位構件，將搬入到搬入 台2 5的基板從兩側機械性地予以夾持。 升降機構26，是設置在搬入側載台25的基板搬 置的背面側。該升降機構26具有：升降構件26a、與 的升降銷26b。升降構件26a，連接於沒有圖示的驅 構，藉由該驅動機構的驅動而讓升降構件26a朝Z方 動。複數的升降銷26b，從升降構件26a的上面部朝 入側載台25豎立設置。各升降銷26b，是配置在：從 方向觀察分別與上述升降銷出沒孔25b重疊的位置。 讓升降構件26a朝Z方向移動，則各升降銷26b會從 銷出沒孔25b出沒於載台表面25c上。各升降銷26b 方向的端部是設置成分別與Z方向上的位置一致，而 從裝置外部搬運過來的基板S保持爲水平的狀態。 塗佈處理區域2 1 ’是進行光阻劑的塗佈處理的部 設置有：將基板S浮起支承的處理載台27。 25， 朝+Z 基板 表面 設置 入側 具有 側載 入位 複數 動機 向移 向搬 俯視 藉由 升降 的+ Z 能將 位， -14- 200918175 處理載台2 7，是以例如硬質氧化鋁膜爲主成分的光吸 收材料來覆蓋載台表面2 7c的從俯視方向觀察爲矩形的板 狀構件，是設置在相對於搬入側載台25的+X方向側。在 處理載台2 7之中以光吸收材料覆蓋的部位，會抑制雷射 光等的光線反射。該處理載台27，Y方向爲長軸。處理載 台27的Y方向的尺寸，與搬入側載台25的Y方向尺寸 大致相同。在處理載台27設置有：將空氣噴出到載台表 面27c上的複數的空氣噴出孔27a、與將載台表面27c上 的空氣予以吸引的複數的空氣吸引孔27b。這些空氣噴出 孔27a及空氣吸引孔27b，設置成貫穿處理載台27。 在處理載台27，空氣噴出孔27a的間距，是相較於設 置在搬入側載台25的空氣噴出孔25a的間距更狹窄，與 搬入側載台25相比，將空氣噴出孔27a設置得較緊密。 因此，與其他的載台相比，在該處理載台2 7能以較高精 確度來調節基板的浮起量，基板的浮起量例如可控制爲 ΙΟΟμπι以下，而50μιη以下較佳。 基板搬出區域2 2，是用來將塗佈有光阻劑的基板8 搬出到裝置外部的部位，具有：搬出側載台2 8、與升降機 構2 9。該搬出側載台2 8，設置在相對於處理載台2 7的+ X 方向側，由與設置在基板搬入區域2 0的搬入側載台2 5大 致相同的材質、尺寸所構成。與搬入側載台2 5同樣地， 在搬出側載台2 8設置有：空氣噴出孔2 8 a及升降銷出 '沒 孔2 8b。升降機構29，設置在搬出側載台28的基板搬出 位置的背面側，例如以框架部2 4來支承。升降機構2 9的 •15- 200918175 升降構件29a及升降銷29b，與設置在基板搬入區域20的 升降機構26的各部位爲相同的構造。該升降機構29，當 將搬出側載台2 8上的基板S搬出到外部裝置時，能藉由 基板S交接用的升降銷2 9b來將基板S抬起。 搬運機構23，具有：搬運機23a、真空襯墊23b、軌 道23c。搬運機23a的構造是在內部設置有例如線性馬達 ，藉由驅動該線性馬達，讓搬運機2 3 a可於軌道2 3 c上移 動。 該搬運機23a是配置成：在俯視方向觀察讓預定的部 分23 d重疊於基板S的-Y方向端部。與該基板S重疊的 部分23d，是設置在：較當使基板S浮起時的基板背面的 高度位置更低的位置。 真空襯墊23b，是有複數個排列在搬運機23a之中與 上述基板S重疊的部分23d。該真空襯墊23b，具有用來 真空吸附基板S的吸附面，配置成讓該吸附面朝向上方。 真空襯墊23 b，藉由讓吸附面吸附住基板s的背面端部， 則可保持住該基板S。各真空襯墊23b，其從搬運機23a 的上面部起算的高度位置是可調節的，例如可因應基板S 的浮起量而將真空襯墊23b的高度位置上下調整。軌道 23c是在：搬入側載台25、處理載台27、及搬出側載台 2 8的側方涵蓋各載台地延伸著，藉由滑動於該軌道2 3 c而 能讓搬運機23 a沿著該各載台移動。 (塗佈部） -16- 200918175 接著來說明塗佈部3的構造。 塗佈部3，是用來在基板S上塗佈光阻劑的部分，具 有：門型框架31、噴嘴32、與泵浦33。 門型框架3 1，具有：支柱構件3 1 a、與架橋構件3 1 b ，是設置成在Y方向跨越處理載台27。支柱構件31a，在 處理載台27的Y方向側各設置有一個，各支柱構件31a 分別支承於框架部24的Y方向側的兩側面。各支柱構件 3 1 a，是設置成讓其上端部的高度位置一致。架橋構件3 1 b ，是架橋於各支柱構件3 1 a的上端部之間，相對於該支柱 構件3 1 a可進行升降。 該門型框架31是連接於移動機構31c，可朝X方向 移動。藉由該移動機構31c讓門型框架31可在其與管理 部4之間移動。也就是說，設置於門型框架31的噴嘴32 可在其與管理部4之間移動。 噴嘴32，是作成其中一方向爲長軸的長條狀，是設置 在門型框架31的架橋構件31b的-Z方向側的面部。在該 噴嘴32之中的-Z方向的前端，沿著本身的長軸方向設置 有狹縫狀的開口部32a，從該開口部32a將光阻劑吐出。 噴嘴3 2，其開口部3 2 a的長軸方向與噴嘴3 2本身的長軸 方向（Y方向）平行，並且該開口部32a配置成與處理載台 27相對向。開口部32a的長軸方向的尺寸是較所搬運的基 板S的Y方向的尺寸更小，而不會將光阻劑塗佈到基板s 的周邊區域。在噴嘴3 2的內部設置有使光阻劑流通到開 口部3 2 a的沒有圖示的流通路。在支柱構件3 1 a設置有·沒 -17- 200918175 有圖示的移動機構，藉由該移動機構，讓在架橋構件31b 所保持的噴嘴32可朝Z方向移動。而也可在門型框架31 的架橋構件31b下面安裝：用來將噴嘴32的開口部32a ’ 也就是噴嘴3 2的前端以及與該噴嘴前端相對向的相對向 面之間的Z方向上的距離予以測定的感應器3 4。 泵浦3 3，是將光阻劑供給到噴嘴3 2的流通路的光阻 劑供給手段。該泵浦3 3，如第1圖〜第4圖所示，在門型 框架31的架橋構件31b上面沿著噴嘴32的長軸方向配置 有兩個，該兩個泵浦3 3配置在相對於噴嘴3 2互相爲大致 相同距離的位置。這裡是分別將泵浦3 3配置在例如在Y 方向將架橋構件31b大致分成三等分的位置。 作爲該泵浦，適合使用例如膜片泵、高精度定量吐出 栗浦（tubephragm Pump)、手動活塞泵浦等。在這些栗浦之 中，高精度定量吐出泵浦（tubephragm Pump)最適合。 (管理部） 以下說明管理部4的構造。 管理部4，是爲了讓吐出到基板S的光阻劑（液狀體） 的吐出量爲定量而將噴嘴32進行管理的部位，是設置在 :基板搬運部2之中的相對於塗佈部3的-X方向側（基板 搬運方向的上游側）。該管理部4，具有：預備吐出機構 41、浸漬槽42、噴嘴洗淨裝置43、將這些構造予以收容 的收容部44、以及用來保持該收容部的保持構件45。保 持構件45與移動機構45a連接。藉由該移動機構45a讓 -18- 200918175 收容部44可朝X方向移動。 浸 上 門 〇 是 置 置 使 設 於 置 的 部 3 2 出 洗 洗 預備吐出機構4 1 '浸漬槽4 2、及噴嘴洗淨裝置4 3 是以該順序朝-X方向側排列。該等預備吐出機構4 1、 漬槽42、及噴嘴洗淨裝置43的Y方向的各尺寸，是較 述門型框架3 1的支柱構件3 1 a之間的距離更小，上述 型框架3 1是跨越各部分來接達。 預備吐出機構4 1，是預備性地將光阻劑吐出的部分 該預備吐出機構4 1設置成最接近噴嘴32。浸漬槽42， 在內部儲存有稀釋劑或光阻劑等的液體槽。噴嘴洗淨裝 43，是用來將噴嘴32的開口部32a附近予以沖洗的裝 ，是具有：朝γ方向移動的沒有圖示的洗淨機構、以及 該洗淨機構移動的沒有圖示的移動機構。該移動機構， 置在較洗淨機構更靠-X方向側。噴嘴洗淨裝置43，由 設置有移動機構，與預備吐出機構4 1及浸漬槽42相比 其X方向的尺寸較大。 當將該噴嘴洗淨裝置43配置在接近噴嘴32的位 (+ X方向側）時，則將其他部位配置到距離噴嘴3 2較遠 位置（-X方向側）。在這種情況，當噴嘴3 2接達到收容 44內的其他部位時會需要通過移動機構，藉此讓噴嘴 的移動距離變長。 本實施方式的噴嘴洗淨裝置43是設置在較預備吐 機構41及浸漬槽42更靠-X方向側的位置，並且噴嘴 淨裝置43的移動機構是設置在較該噴嘴洗淨裝置43的 淨機構更靠-X方向側，所以噴嘴32不會通過移動機構 -19- 200918175 配置成盡量縮短噴嘴32的移動距離。而當然針對預備吐 出機構41、浸漬槽42、噴嘴洗淨裝置43的配置方式，並 不限於本實施方式的配置方式’也可以用其他的配置方式 (塗佈裝置的動作） 接著來說明如上述構造的塗佈裝置1的動作。 第5圖是塗佈裝置1的動作的時序圖。如第5圖所示 ，在塗佈裝置1，進行：基板搬入、光阻劑塗佈、基板搬 出、預備吐出、光阻劑充塡（泵浦充塡）的各個動作。以下 說明將光阻劑塗佈到基板S的動作。 第6圖〜第9圖，是顯不塗佈裝置1的基板搬入、光 阻劑塗佈、基板搬出的各動作的俯視圖。將基板S搬入到 基板搬入區域20，使該基板S浮起而進行搬運，且在塗 佈處理區域2 1塗佈光阻劑，將已塗佈好該光阻劑的基板 S從基板搬出區域22搬出。第7圖〜第9圖僅以虛線顯 示門型框架3 1的輪廓，而容易判斷噴嘴32及處理載台27 的構造。以下來說明各部分的詳細動作。 在將基板搬入到基板搬入區域20之前，使塗佈裝置1 待機。具體來說，在搬入側載台25的基板搬入位置的-Y 方向側配置搬運機23a，將真空襯墊23b的高度位置定位 在基板的浮起高度位置，並且從搬入側載台2 5的空氣噴 出孔25a、處理載台27的空氣噴出孔27a、空氣吸引孔 2 7 b及搬出側載台2 8的空氣噴出孔2 8 a分別將空氣噴出或 -20- 200918175 吸引’成爲將空氣供給到讓基板浮起於各載台表面 的狀態。而預先將光阻劑充塡到泵浦3 3內。具體 是預先將在預備吐出動作及該預備吐出動作後的光 佈所需要的分量的光阻劑，分別充塡在兩個泵浦3 3 (1)基板搬入 在該狀態’例如藉由沒有圖示的搬運臂等，如彳 所示’若從外部將基板S搬運到基板搬入位置，則 構件2 6 a朝+ Z方向移動，將升降銷2 6 b從升降銷 25b突出到載台表面25c。而藉由升降銷26b將基;| 起，進行該基板S的交接動作。而從校準裝置25d 使定位構件突出於載台表面25c。 在接收基板S之後，使升降構件2 6 a下降將 2 6 b收容於升降銷出沒孔2 5 b內。此時，由於在載 25c形成有空氣層，所以基板S藉由該空氣而保持 於載台表面25c浮起的狀態。當基板s到達空氣層 時’藉由校準裝置25d來進行基板S的定位，將在 入位置的-Y方向側處配置的搬運機2 3 a的真空襯墊 空吸附於基板s的-Y方向側端部。在第7圖顯示 基板S的-Y方向側端部的狀態。 (2)預備吐出 在將光阻劑塗佈到基板S之前，在塗佈部3， 來保持噴嘴3 2的吐出狀態的預備吐出動作。該預 的程度 來說， 阻劑塗 內。 第6圖 使升降 出沒孔 反S抬 的長孔 升降銷 台表面 爲相對 的表面 基板搬 23b真 吸附住 進行用 備吐出 -21 - 200918175 動作，與開始搬入基板大致同時進行。首先如第1 0圖所 示，藉由移動機構31c(顯示於第4圖）使門型框架31朝-X 方向移動到管理部4的位置。 在使門型框架3 1移動到管理部4的位置之後，調整 門型框架3 1的位置將噴嘴32接達到噴嘴洗淨裝置43。在 噴嘴洗淨裝置43，朝向噴嘴32的開口部32a附近而吐出 稀釋劑等的洗淨液，並且因應需要將氮氣與稀釋劑同時吐 出到噴嘴3 2的開口部3 2 a，且同時藉由將沒有圖示的洗淨 機構朝向噴嘴3 2的長軸方向掃描，將噴嘴3 2洗淨。 在洗淨好噴嘴3 2之後，將該噴嘴3 2接達到預備吐出 單元41。在預備吐出單元41，會一邊將開口部32a與預 備吐出面之間的距離予以測定，一邊將噴嘴3 2的開口部 3 2a移動到Z方向上的預定位置，一邊使噴嘴32朝-X方 向移動，一邊從開口部3 2a預備吐出光阻劑。在該預備吐 出動作，在設置有兩個的泵浦33之中，在充塡有光阻劑 的其中一方的泵浦3 3，將內部的光阻劑壓送到噴嘴3 2的 流通路。 在進行了預備吐出動作之後，將門型框架3 1回到原 來位置，當要搬運下個基板S時，如第11圖所示，藉由 移動機構3 1 b使噴嘴3 2移動到Z方向上的預定位置。. 而也可因應需要，例如每預定次數接達到管理部4， 則使該噴嘴3 2接達到浸漬槽42內。在浸漬槽42，藉由將 噴嘴32的開口部32a暴露於：儲存於浸漬槽42的溶劑（ 稀釋劑）的蒸氣環境中，來防止噴嘴3 2乾燥。 -22- 200918175 (塗佈） 在藉由真空襯墊23b吸附住基板s的-Y方向側端部 之後，使搬運機23a沿著軌道23c移動。由於基板S爲浮 起的狀態，所以即使搬運機2 3 a的驅動力較小，基板s也 能沿著軌道23 C順利移動。當基板S從搬入側載台25朝 處理載台27移動時’在處理載台27該基板的浮起量爲 ΙΟΟμιη，而50μπι以下較佳。 —旦基板S的搬運方向前端到達噴嘴32的開口部32a 的位置，則進行將光阻劑塗佈到基板S上。在光阻劑塗佈 動作，在設置有兩個的泵浦33之中，在預備吐出動作進 行壓送的泵浦3 3，再次將泵浦3 3內的光阻劑壓送到噴嘴 3 2的流通路。所壓送的光阻劑，如第7圖所示，從開口部 3 2a(顯示於第4圖）朝向基板S吐出。該光阻劑的吐出動作 ，是使噴嘴32的位置固定，藉由搬運機23a —邊搬運基 板S —邊來進行。伴隨著基板S的移動，則如第8圖所示 在基板S上塗佈光阻膜R。藉由讓基板S通過，吐出光阻 劑的開口部32a下面，而在基板S的預定區域形成光阻膜 R。 形成了光阻膜R的基板S，是藉由搬運機23a將其朝 向搬出側載台2 8搬運。在搬出側載台2 8，在相對於載台 表面28C浮起的狀態，如第9圖所示將基板S搬運到基板 搬出位置。 (4)基板搬出 -23- 200918175 一旦基板S到達基板搬出位置，則解除真空襯墊23b 的吸附。解除基板S的吸附之後，搬運機23a再回到搬入 側載台25的基板搬入位置。而解除吸附後，使升降機構 29的升降構件29a朝向+Z方向移動。伴隨著升降構件 29a的移動，升降銷29b從升降銷出沒孔28b朝向基板S 的背面突出，藉由升降銷2 9 b將基板S抬起。在該狀態， 例如在搬出側載台2 8的+X方向側處設置的外部的搬運臂 ，會接達於搬出側載台28，而接收基板S。以這種方式進 行基板S的搬出。 (5)泵浦充塡 泵浦充塡動作，在光阻劑的吐出完成之瞬後開始。在 吐出光阻劑之瞬後，在該光阻劑的吐出所使用的泵浦3 3 的光阻劑保持部3 3 a變空。在光阻劑充塡動作，該泵浦3 3 會作動，將光阻劑充塡到變空的內部。在充塡光阻劑的途 中’將基板S搬運到搬出側載台2 8，進行基板S的搬出 動作。 (6)下個基板搬入 上述基板的下個基板（以下稱爲「下個基板」）S2的搬 入’是與上述基板S的搬出動作的開始時間大致同時來進 行。針對搬入動作，與上述基板S的搬入動作一樣，利用 升降銷2 6 b來接收下個基板s 2之後，將其浮起保持於搬 入側載台25上，進行校準動作。在上述基板S搬出時已 -24- 200918175 回到基板搬入位置的搬運機23a，在下個基板S2的校準動 作完成之前，會回到基板搬入位置。下個基板S2，會被 回到基板搬入位置的搬運機2 3 a的吸附襯墊2 3 b所吸附。 (7) 下個基板的預備吐出 在上述（3 )所說明的基板搬運、光阻劑塗佈動作完成之 後，進行將光阻劑吐出到下個基板S 2的預備吐出動作。 針對該預備吐出動作的內容，是與上述（2)所說明的內容相 同。在該預備吐出動作，是藉由在兩個泵浦33之中與在 上述（2)、（3)進行壓送的栗浦33不同的泵浦33來進行壓 送。當下個基板的預備吐出動作開始時，在上述（2)及（3) 已進行壓送的泵浦3 3會處於進行光阻劑充塡動作的狀態 。與下個基板S2的搬入動作完成的時機大致相同的時機 ’下個基板的預備吐出動作也完成。於是，該下個基板預 備吐出動作，會與上述基板S的搬出動作、下個基板S2 的搬入動作、及光阻劑充塡動作一起進行。 (8) 下個基板的塗佈 將下個基板S2搬入到搬入側載台25，藉由吸附襯墊 23b將其吸附之後，則將該下個基板S2朝處理載台27搬 運。將下個基板S2搬運到處理載台27之後，則將光阻劑 塗佈到該下個基板S 2。針對該下個基板S 2的搬運動作及 塗佈動作的內容，與在上述（2)及（3)所說明的內容相同。 在該塗佈動作中，是藉由在兩個泵浦33之中當上述（7)的 -25- 200918175 預備吐出動作時進行壓送的泵浦33來進行光阻劑的壓送 (9)下個基板的搬出 在下個基板S到達基板搬出位置之後，則進行該下個 基板S2的搬出動作。該動作的內容，與上述（4)的內容相 同。 (1 〇 )下個泵浦的充塡 該泵浦充塡動作，在對於下個基板S2所進行的光阻 劑吐出動作完成之瞬後開始。在該光阻劑充塡動作，與在 上述（5 )說明的光阻劑充塡動作一樣，該泵浦3 3會作動， 在將光阻劑吐出至下個基板52之瞬後在成空的內部充塡 光阻劑。在進行光阻劑之充塡的途中，將下個基板S2搬 運到搬出側載台2 8，進行該下個基板S 2的搬出動作。 以下反覆進行上述（6)〜（10)的動作。 第1 2圖是當安裝於噴嘴的泵浦爲一個的情況的塗佈 裝置的處理時序圖。 如該圖所示，泵浦爲一個時，在充塡光阻劑的期間就 不能進行預備吐出動作，藉此會讓每一枚基板的處理時間 變長。 相對的，藉由本發明的一種實施方式，由於設置有： 對於塗佈部3的噴嘴3 2分別壓送光阻劑的複數的泵浦3 3 ，所以即使藉由複數的泵浦33的其中一個泵浦充塡光阻 -26- 200918175 劑的期間，也不會浪費時間，能藉由其他泵浦3 3將光阻 劑供給到基板上。藉此，可減少每一枚基板的處理時間。 則藉由本發明的一種實施方式的構造，可使處理作業線縮 短化。 藉由本發明的一種實施方式，將複數的泵浦33配置 成：相對於噴嘴3 2互相爲大致相等距離的位置，所以能 使各個泵浦3 3與噴嘴3 2之間的光阻劑搬運路線的條件大 致相同。藉此能將光阻劑穩定吐出到基板上。 藉由本發明的一種實施方式，將複數的泵浦3 3設置 在：可自由升降地支承噴嘴32的門型框架31’所以能配 合噴嘴3 2的升降來使泵浦3 3升降。藉此，能將各個泵浦 3 3與噴嘴3 2之間的光阻劑搬運路線的狀態保持爲一定， 所以能將光阻劑穩定吐出到基板上。除此之外’讓泵浦3 3 與噴嘴3 2之間的距離很短即可完成’所以能減輕泵浦3 3 的負擔。 藉由本發明的一種實施方式，將複數的泵浦33安裝 在門型框架31的架橋構件3 1 b ’所以能以穩定狀態安裝各 泵浦33。 本發明的技術範圍並不限於上述實施方式’在不脫離 本發明主旨的範圍可以作適當變更。 針對塗佈裝置1的全體構造’在上述實施方式’雖然 是將搬運機構23配置在各載台的-Y方向側’而並不限於 此。例如，也可將搬運機構23配置在各載台的+Y方向側 。而如第1 3圖所示，也可在各載台的-γ方向側配置上述 -27- 200918175 搬運機構23(搬運機23a、真空襯墊23b、軌道23c)，在 + Y方向側配置與該搬運機構23爲相同構造的搬運機構 53(搬運機53a、真空襯墊53b、軌道53c)，而能以搬運機 構23與搬運機構53來搬運不同的基板。例如，如該圖所 示，在搬運機構23搬運基板S1，在搬運機構53搬運基 板S2。在該情況，則能以搬運機構23與搬運機構53來 交互搬運基板，讓生產能力提升。而在要將具有上述基板 S、S 1、S2的一半程度的面積的基板進行搬運的情況，例 如以搬運機構23與搬運機構53各保持一枚，藉由使搬運 機構2 3與搬運機構5 3朝+X方向一同行進，則能同時搬 運兩枚基板。藉由這種構造，則能讓生產能力提升。 在上述實施方式，將泵浦33配置在門型框架31的架 橋構件31b上面將該架橋構件31b在長軸方向予以三等分 的位置，而並不限於此，也可配置在其他位置。 例如，如第1 4圖所示，也可在架橋構件3 1 b上面分 別將泵浦3 3配置在該架橋構件3 1 b的長軸方向的兩端部 。也可在架橋構件31b上面分別將泵浦33配置在該架橋 構件31b的長軸方向中央部。藉由將泵浦33配置在架橋 構件31b的長軸方向中央部，則可將連接於泵浦33與噴 嘴3 2之間的配管的長度予以縮短，所以能減輕泵浦3 3 的 負擔。 在該情況，如第1 5圖所示，也可爲將兩個泵浦3 3沿 著架橋構件3 1 b的長軸方向配置的構造，如第1 6圖所示 ’也可爲將兩個泵浦33沿著基板搬運方向（架橋構件31b -28- 200918175 的短軸方向）配置的構造。在將泵浦33沿著基板搬運方 配置的構造中，尤其可將配管的長度縮短’而且也可將 個泵浦33安裝在架橋構件31b的上面以外的面部。 如第17圖所示，也可爲將兩個泵浦33安裝在門型 架31的支柱構件3 1 a的構造。在該情況，如第1 7圖所 ，也可爲在各支柱構件31a各安裝一個泵浦33的構造 雖然省略圖示，而也可爲在其中一方的支柱構件31a安 複數的泵浦3 3的構造。 如第18圖所示，也可形成爲另外設置：用來安裝 個泵浦3 3的泵浦安裝框架60的構造。如第1 8圖所示 也可將泵浦安裝框架6 0配置在相對於門型框架3 1的基 搬運方向的上游側（-X方向側），也可配置在相對於門型 架3 1的基板搬運方向的下游側（+ X方向側），可爲配置 基板搬運方向的上游側及下游側兩方的構造。 也可配置複數的噴嘴3 2，將該複數的噴嘴3 2分別 於菜浦33 —對一地配置。在第19圖，是顯示了將各一 噴嘴3 2配置在門型框架3 1的基板搬運方向的上游側及 游側的例子。兩個噴嘴3 2的長軸方向，是配置成沿著 基板搬運方向垂直相交的方向。 藉由該構造，每一枚基板可交互使用不同的噴嘴32 所以在藉由其中一方的噴嘴3 2進行塗佈動作的期間， 另一方的噴嘴32可充塡光阻劑。而藉由具有複數噴嘴 ，則可交互地塗佈不同種類的光阻劑。而也可設置複數 管理部4。 向 兩 框 示 裝 兩 » 板 框 在 對 個 下 與 ， 在 3 2 的 -29- 200918175 在第19圖的構造，雖然顯示了將各一個噴嘴32配置 在門型框架31的基板搬運方向的上游側及下游側的例子 ，而並不限於此，也可配置複數的門型框架3 1，相對於該 複數的門型框架31，將各一個的噴嘴32的長軸方向設置 成沿著與基板搬運方向垂直相交的方向。而此時也可設置 複數的管理部4。藉由該構造’對每一枚基板’能交互地 使用：在獨立控制的複數的門型框架3 1處設置的噴嘴3 2 ，所以在藉由其中一方的噴嘴32進行塗佈動作的期間’ 可在另一方的噴嘴32充塡光阻劑。而藉由具有複數的噴 嘴3 2，則可交互地塗佈不同種類的光阻劑。 在第1 9圖的構造，藉由讓各噴嘴3 2可獨立移動，則 在光阻劑充塡後也可進行預備吐出動作。藉此，可使處理 作業線更縮短化。在各噴嘴32獨立進行預備吐出動作的 情況，也可設置複數的管理部4。 在該情況，將噴嘴32、以及與該噴嘴32連接的栗浦 3 3配置成一體較佳。作爲這種構造，可舉出：例如將泵浦 33直接安裝在噴嘴32的構造、或將噴嘴32 —體地安裝於 移動構件，並且將泵浦3 3安裝在該移動構件的構造等。 藉此，讓噴嘴3 2與泵浦3 3 —體地移動，所以能避免 因噴嘴3 2的移動讓兩者的位置變化。藉此，則能保持噴 嘴3 2與泵浦3 3之間的光阻搬運路線的環境，所以能使噴 嘴32的光阻劑吐出穩定化。 在上述各構造’作爲複數泵浦33，例如說明配置有兩 個杲浦3 3的例子，而並不限於此，例如也可設置三個以 -30- 200918175 上的泵浦33。在上述實施方式，是對於一個噴嘴32設置 一個泵浦33，而並不限於此，例如也可對於〜個噴嘴32 使用兩個泵浦33。 [產業上的可利用性] 本發明提供一種可縮短處理作業線的塗佈裝置及塗佈 方法，在產業上非常有用。 【圖式簡單說明】 第1圖是顯示本發明的一種實施方式的塗佈裝置的構 造的立體圖。 第2圖是顯示本發明的一種實施方式的塗佈裝置的構 造的正視圖。 第3圖是顯示本發明的一種實施方式的塗佈裝置的構 造的俯視圖。 第4圖是顯示本發明的一種實施方式的塗佈裝置的構 造的側視圖。 第5圖是顯示本發明的一種實施方式的塗佈裝置的動 作的時序圖。 第6圖是本發明的一種實施方式的塗佈裝置的動作的 顯示圖。 第7圖是本發明的一種實施方式的塗佈裝置的動作的 顯示圖。 第8圖是本發明的一種實施方式的塗佈裝置的動作的 -31 - 200918175 顯示圖。 第9圖是本發明的一種實施方式的塗佈裝置的動作的 顯示圖。 第10圖是本發明的一種實施方式的塗佈裝置的動作 的顯示圖。 第11圖是本發明的一種實施方式的塗佈裝置的動作 的顯示圖。 第〗2圖是當泵浦爲一個的情況而顯示塗佈裝置的動 作的時序圖。 第13圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第14圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第15圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第16圖疋本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第17圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯不圖。 第18圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯示圖。 第19圖是本發明的一種實施方式的塗佈裝置的其他 構造的顯不圖。 -32- 200918175 【主要元件符號說明】 1 :塗佈裝置 2 :基板搬運部 3 :塗佈部 4 :管理部 2 7 :處理載台 3 1 :門型框架 3 2 :噴嘴 3 3 :泵浦 5 :基板 R :光阻膜 -33The substrate loading area 20 is a portion into which the substrate S transported from the outside of the apparatus is carried, and includes a loading side stage 25, a lifting mechanism 26, and a loading side stage 25, and is provided on the upper portion of the frame unit 24, for example, A plate-shaped member which is formed in a rectangular shape as viewed from a plan view, such as SUS. The loading side stage 25 has a long axis in the X direction. The loading side loading table 25 is provided with a plurality of air ejection holes 2 5 a and a plurality of lifting pin insertion holes 2 5 b. The air ejection hole 25a and the lift pin exit hole 25b are provided to penetrate the carry-in side stage 25. The air ejection hole 25a is a hole that ejects air to the stage surface 25c of the loading-side stage 25, and is disposed in a matrix shape as viewed from a plan view, for example, in a region where the substrate S passes through the loading-side stage 25. The air ejection hole -13- 200918175 2 5 a is connected to an air supply source (not shown). The loading side stage can float in the direction of the substrate S by the air ejected from the air ejection hole 25a. The lift pin exit hole 2 5 b is an area that is placed in the carry-in stage 2 5 and carried in. The lift pin has a hole 2 5 b so that the air supplied to the stage 25c does not leak. Each of the two ends of the loading-side stage 25 in the Y direction has a calibration device 25d. The calibration device 25d is a device that positions the substrate S carried into the loading table 25. Each of the aligning devices 25d: a long hole and a positioning member provided in the long hole, mechanically sandwiches the substrate carried into the loading table 25 from both sides. The elevating mechanism 26 is provided on the back side of the substrate on which the loading side stage 25 is placed. The elevating mechanism 26 has a lifting member 26a and a lifting pin 26b. The elevating member 26a is connected to a drive (not shown), and the elevating member 26a is moved toward the Z by the driving of the drive mechanism. A plurality of lift pins 26b are erected from the upper surface of the elevating member 26a toward the side loading table 25. Each of the lift pins 26b is disposed at a position overlapping the lift pin exit hole 25b as viewed in the direction. When the elevating member 26a is moved in the Z direction, the lift pins 26b are ejected from the pin exit holes 25b on the stage surface 25c. The end portions in the direction of the lift pins 26b are provided so as to coincide with the positions in the Z direction, and the substrate S conveyed from the outside of the apparatus is kept horizontal. The coating treatment region 2 1 ' is a portion for performing a coating treatment of the photoresist. A processing stage 27 for supporting and supporting the substrate S is provided. 25, the surface of the +Z substrate is placed on the side with the side loading position. The multiple motives move toward the top of the moving plane by lifting the + Z energy. The -14- 200918175 processing stage 27 is based on, for example, a hard aluminum oxide film. The light absorbing material of the main component covers the surface of the stage surface 27c which is rectangular in plan view, and is provided on the +X direction side with respect to the loading side stage 25. The portion of the processing stage 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing stage 27 has a long axis in the Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading side stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for discharging air onto the stage surface 27c, and a plurality of air suction holes 27b for sucking air on the stage surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing stage 27. In the processing stage 27, the pitch of the air ejection holes 27a is narrower than the pitch of the air ejection holes 25a provided in the loading side stage 25, and the air ejection hole 27a is provided in comparison with the loading side stage 25. Closer. Therefore, compared with the other stages, the processing stage 27 can adjust the floating amount of the substrate with high precision, and the floating amount of the substrate can be controlled, for example, to ΙΟΟμπι or less, and preferably 50 μm or less. The substrate carry-out area 22 is a portion for carrying out the substrate 8 coated with the photoresist to the outside of the apparatus, and has a carry-out stage 28 and an elevator mechanism 29. The carry-out stage 2, 8 is provided on the +X direction side with respect to the process stage 27, and is made of the same material and size as the carry-side stage 25 provided in the substrate carry-in area 20. Similarly to the loading side stage 2 5, the carrying side stage 28 is provided with an air ejection hole 28 8 a and a lifting pin out of the 'no hole 2 8b'. The elevating mechanism 29 is provided on the back side of the substrate carrying-out position of the carry-out side stage 28, and is supported by, for example, the frame portion 24. The lifting member 29a and the lifting pin 29b of the elevating mechanism 29 have the same structure as the respective portions of the elevating mechanism 26 provided in the substrate loading area 20. When the substrate S on the carry-out side stage 28 is carried out to the external device, the elevating mechanism 29 can lift the substrate S by the lift pins 29b for the transfer of the substrate S. The transport mechanism 23 has a transporter 23a, a vacuum cushion 23b, and a rail 23c. The carrier 23a is constructed such that a linear motor is provided inside, and the linear motor is driven to move the transporter 2 3 a on the rail 2 3 c. The conveyor 23a is disposed so that a predetermined portion 23d is superposed on the end portion in the -Y direction of the substrate S as viewed in a plan view. The portion 23d overlapping the substrate S is disposed at a position lower than the height position of the back surface of the substrate when the substrate S is floated. The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23 b can hold the substrate S by allowing the adsorption surface to adsorb the back end portion of the substrate s. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends on the side of the loading side stage 25, the processing stage 27, and the carry-out side stage 28, and covers the respective stages. By sliding on the rail 2 3 c, the carrier 23 a can be moved along The stages are moved. (Coating part) -16- 200918175 Next, the structure of the coating part 3 is demonstrated. The coating portion 3 is a portion for applying a photoresist to the substrate S, and includes a gate frame 31, a nozzle 32, and a pump 33. The portal frame 3 1 has a strut member 3 1 a and a bridging member 3 1 b that are disposed to span the processing stage 27 in the Y direction. Each of the pillar members 31a is provided on the Y-direction side of the processing stage 27, and each of the pillar members 31a is supported by both side surfaces of the frame portion 24 on the Y-direction side. Each of the strut members 3 1 a is disposed such that the height positions of the upper end portions thereof coincide. The bridging members 3 1 b are bridged between the upper end portions of the respective strut members 31a, and are movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided to the portal frame 31 is movable between it and the management portion 4. The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 31b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a is provided along the longitudinal direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. In the nozzle 3 2, the long axis direction of the opening portion 3 2 a is parallel to the long axis direction (Y direction) of the nozzle 3 2 itself, and the opening portion 32 a is disposed to face the processing stage 27 . The dimension of the opening portion 32a in the longitudinal direction is smaller than the dimension of the substrate S to be conveyed in the Y direction, and the photoresist is not applied to the peripheral region of the substrate s. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening portion 3 2 a is provided. The column member 3 1 a is provided with a moving mechanism as shown in Fig. -17-200918175, and the nozzle 32 held by the bridge member 31b is movable in the Z direction by the moving mechanism. Alternatively, it may be mounted under the bridging member 31b of the portal frame 31 for the Z direction between the opening 32a of the nozzle 32, that is, the front end of the nozzle 32 and the opposing surface facing the nozzle leading end. The distance measured by the sensor 34. The pump 3 3 is a photoresist supply means for supplying a photoresist to the flow path of the nozzle 3 2 . The pump 3 3 is disposed on the upper surface of the bridge member 31b of the portal frame 31 along the longitudinal direction of the nozzle 32 as shown in Figs. 1 to 4, and the two pumps 3 3 are disposed in opposite directions. The nozzles 3 2 are at substantially the same distance from each other. Here, the pump 3 3 is disposed at a position where the bridging member 31b is roughly divided into three equal parts, for example, in the Y direction. As the pump, for example, a diaphragm pump, a high-precision quantitative discharge, a tubephragm pump, a manual piston pump, or the like is suitably used. Among these Lipu, the high-precision quantitative pumping pump (tubephragm pump) is most suitable. (Management Unit) The structure of the management unit 4 will be described below. The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is provided in the substrate transport unit 2 with respect to the application unit. The -X direction side of 3 (the upstream side of the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45a. By the moving mechanism 45a, the -18-200918175 accommodating portion 44 can be moved in the X direction. The immersed door 〇 is placed so that the portion 3 2 that is disposed is washed, the pre-discharging mechanism 4 1 'dip tank 4 2, and the nozzle cleaning device 4 3 are arranged in the order toward the -X direction. The sizes of the preliminary discharge mechanism 4 1 , the stain groove 42 , and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the pillar members 31 1 a of the portal frame 3 1 , and the frame 3 is formed. 1 is to access through the various parts. The preliminary discharge mechanism 4 1 is a portion that preliminarily discharges the photoresist. The preliminary discharge mechanism 4 1 is disposed closest to the nozzle 32. The dipping tank 42 stores therein a liquid tank such as a diluent or a photoresist. The nozzle cleaning device 43 is a device for rinsing the vicinity of the opening 32a of the nozzle 32, and has a cleaning mechanism (not shown) that moves in the γ direction, and a movement (not shown) in which the cleaning mechanism moves. mechanism. The moving mechanism is placed on the -X direction side of the cleaning mechanism. The nozzle cleaning device 43 is provided with a moving mechanism, and has a larger dimension in the X direction than the preliminary discharge mechanism 4 1 and the immersion tank 42. When the nozzle cleaning device 43 is disposed close to the position of the nozzle 32 (+X direction side), the other portion is placed at a position farther from the nozzle 3 2 (the -X direction side). In this case, when the nozzle 3 2 is connected to other portions in the housing 44, it is necessary to pass the moving mechanism, thereby making the moving distance of the nozzle longer. The nozzle cleaning device 43 of the present embodiment is provided at a position closer to the -X direction than the preliminary discharge mechanism 41 and the immersion tank 42, and the moving mechanism of the nozzle cleaning device 43 is provided in the cleaner of the nozzle cleaning device 43. The mechanism is further on the -X direction side, so the nozzle 32 is not configured by the moving mechanism -19-200918175 to minimize the moving distance of the nozzle 32. Of course, the arrangement of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement mode of the present embodiment. Other arrangements (operation of the coating device) may be used. The operation of the coating device 1 of the structure. Fig. 5 is a timing chart showing the operation of the coating device 1. As shown in Fig. 5, in the coating device 1, each operation of substrate loading, photoresist application, substrate unloading, preliminary discharge, and photoresist filling (pump charging) is performed. The operation of applying a photoresist to the substrate S will be described below. Fig. 6 to Fig. 9 are plan views showing respective operations of substrate loading, photoresist application, and substrate unloading of the coating apparatus 1. The substrate S is carried into the substrate loading area 20, the substrate S is floated and transported, and a photoresist is applied to the coating processing region 21 to carry out the substrate S to which the photoresist has been applied from the substrate. 22 moved out. 7 to 9 show the outline of the door frame 31 only by a broken line, and it is easy to judge the configuration of the nozzle 32 and the processing stage 27. The detailed operation of each part will be described below. The coating device 1 is placed on standby before the substrate is carried into the substrate loading area 20. Specifically, the transporter 23a is disposed on the -Y direction side of the substrate loading position of the loading-side stage 25, and the height position of the vacuum pad 23b is positioned at the floating height position of the substrate, and from the loading-side stage 25 The air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out side stage 28 respectively suck the air or -20-200918175 to supply air. The state in which the substrate is floated on the surface of each stage. The photoresist is pre-charged into the pump 3 3 . Specifically, the photoresist which is required for the preliminary discharge operation and the component required for the optical cloth after the preliminary discharge operation is charged in the two pumps 3 (1), and the substrate is carried in the state, for example, by no figure. When the substrate S is transported to the substrate loading position from the outside, the member 2 6 a moves in the + Z direction, and the lift pin 2 6 b protrudes from the lift pin 25b to the stage surface 25c. . On the other hand, the transfer operation of the substrate S is performed by the lift pins 26b. On the other hand, the positioning member protrudes from the aligning device 25d on the stage surface 25c. After receiving the substrate S, the elevating member 26 6a is lowered to accommodate 2 6 b in the elevating pin exit hole 2 5 b. At this time, since the air layer is formed on the carrier 25c, the substrate S is maintained in a state where the stage surface 25c is floated by the air. When the substrate s reaches the air layer, the positioning of the substrate S is performed by the calibration device 25d, and the vacuum liner of the carrier 23a disposed at the -Y direction side of the entry position is adsorbed to the -Y direction of the substrate s. Side end. Fig. 7 shows the state of the end portion of the substrate S on the -Y direction side. (2) Pre-discharge Before the application of the photoresist to the substrate S, the application portion 3 maintains the preliminary discharge operation of the discharge state of the nozzle 3 2 . To this extent, the resist is applied. Figure 6: Lifting the hole and lifting the hole. The surface of the lifting pin table is the opposite surface. The substrate is moved. 23b is actually sucked and ready for use. -21 - 200918175 The operation is performed at the same time as the loading of the substrate. First, as shown in Fig. 10, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the moving mechanism 31c (shown in Fig. 4). After the door frame 3 1 is moved to the position of the management unit 4, the position of the door frame 31 is adjusted to connect the nozzle 32 to the nozzle cleaning device 43. In the nozzle cleaning device 43, a cleaning liquid such as a diluent is discharged toward the vicinity of the opening 32a of the nozzle 32, and if necessary, nitrogen gas and a diluent are simultaneously discharged to the opening portion 3 2 a of the nozzle 3 2 while The cleaning mechanism (not shown) is scanned toward the long axis direction of the nozzle 3 2, and the nozzle 32 is washed. After the nozzle 3 2 is cleaned, the nozzle 3 2 is connected to the preliminary discharge unit 41. In the preliminary discharge unit 41, the distance between the opening 32a and the preliminary discharge surface is measured, and the opening 32 2a of the nozzle 3 2 is moved to a predetermined position in the Z direction, and the nozzle 32 is oriented in the -X direction. When moving, the photoresist is prepared to be discharged from the opening 3 2a. In the preliminary discharge operation, among the two pumps 33 provided, one of the pumps 3 3 filled with the photoresist presses the internal photoresist to the flow path of the nozzle 3 2 . After the preliminary ejection operation is performed, the portal frame 3 1 is returned to the original position, and when the next substrate S is to be transported, as shown in Fig. 11, the nozzle 3 2 is moved to the Z direction by the moving mechanism 3 1 b. The intended location. Alternatively, if necessary, for example, the management unit 4 is connected every predetermined number of times, the nozzle 3 2 is brought into the dipping tank 42. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening 32a of the nozzle 32 to a vapor atmosphere of a solvent (diluent) stored in the immersion tank 42. -22-200918175 (Coating) After the end portion on the -Y direction side of the substrate s is sucked by the vacuum pad 23b, the carrier 23a is moved along the rail 23c. Since the substrate S is in a floating state, even if the driving force of the conveyor 2 3 a is small, the substrate s can smoothly move along the rail 23 C. When the substrate S moves from the loading-side stage 25 toward the processing stage 27, the amount of floating of the substrate on the processing stage 27 is ΙΟΟμηη, and preferably 50 μm or less. When the leading end of the substrate S in the conveyance direction reaches the position of the opening 32a of the nozzle 32, the photoresist is applied onto the substrate S. In the photoresist application operation, among the two pumps 33 provided, the pump 3 3 that performs the pressure feed in the preliminary discharge operation again presses the photoresist in the pump 3 3 to the nozzle 3 2 . Flow path. As shown in Fig. 7, the pressure-transmitted photoresist is discharged from the opening portion 3 2a (shown in Fig. 4) toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 and transporting the substrate S by the transporter 23a. As the substrate S moves, the photoresist film R is applied onto the substrate S as shown in Fig. 8. The resist film R is formed in a predetermined region of the substrate S by passing the substrate S through the lower surface of the opening 32a of the photoresist. The substrate S on which the photoresist film R is formed is transported toward the carry-out side stage 28 by the transporter 23a. In the state in which the carry-out side stage 2 8 is floated with respect to the stage surface 28C, the substrate S is transported to the substrate carry-out position as shown in Fig. 9. (4) Substrate carry-out -23- 200918175 When the substrate S reaches the substrate carry-out position, the suction of the vacuum liner 23b is released. After the adsorption of the substrate S is released, the transporter 23a returns to the substrate loading position of the loading-side stage 25. After the adsorption is released, the elevating member 29a of the elevating mechanism 29 is moved in the +Z direction. As the elevating member 29a moves, the elevating pin 29b protrudes from the elevating pin ejecting hole 28b toward the rear surface of the substrate S, and the substrate S is lifted by the elevating pin 2 9 b. In this state, for example, the external transport arm provided at the +X direction side of the carry-out side stage 28 is connected to the carry-out side stage 28 to receive the substrate S. The substrate S is carried out in this manner. (5) Pump charging The pump charging action starts after the completion of the discharge of the photoresist. Immediately after the photoresist is ejected, the photoresist holding portion 3 3 a of the pump 3 3 used for the discharge of the photoresist is emptied. When the photoresist is charged, the pump 3 3 will act to fill the photoresist into the empty interior. In the middle of charging the photoresist, the substrate S is transported to the carry-out side stage 2, and the substrate S is carried out. (6) The loading of the next substrate (hereinafter referred to as "next substrate") S2 of the substrate is performed at substantially the same time as the start time of the substrate S. In the loading operation, similarly to the loading operation of the substrate S, the lower substrate s 2 is received by the lift pins 26b, and then floated and held on the carry-side stage 25 to perform a calibration operation. When the substrate S is carried out, the carrier 23a that has returned to the substrate loading position at -24-200918175 returns to the substrate loading position before the calibration operation of the next substrate S2 is completed. The next substrate S2 is adsorbed by the suction pad 2 3 b of the conveyor 2 3 a which is returned to the substrate loading position. (7) Pre-discharge of the next substrate After the substrate transfer and the photoresist application operation described in the above (3) are completed, the preliminary discharge operation for discharging the photoresist to the next substrate S 2 is performed. The content of the preliminary discharge operation is the same as that described in the above (2). In the preliminary discharge operation, the pump 33 is different from the pump 33 which is pumped in the above (2) and (3) by the two pumps 33. When the preparatory discharge operation of the next substrate is started, the pump 3 3 that has been pressure-fed in the above (2) and (3) is in a state in which the photoresist charging operation is performed. The timing at which the timing of completion of the loading operation of the next substrate S2 is substantially the same. The preparatory discharge operation of the next substrate is also completed. Then, the next substrate is prepared for the discharge operation, and is carried out together with the carry-out operation of the substrate S, the loading operation of the next substrate S2, and the photoresist filling operation. (8) Application of the next substrate After the next substrate S2 is carried into the carry-in stage 25 and adsorbed by the suction pad 23b, the next substrate S2 is transported to the process stage 27. After the next substrate S2 is transported to the processing stage 27, a photoresist is applied to the next substrate S2. The contents of the transport operation and the coating operation for the next substrate S 2 are the same as those described in the above (2) and (3). In the coating operation, the pumping of the photoresist is performed by the pump 33 that is pressure-fed during the preparatory discharge operation of the above-mentioned (7) -25 to 200918175 among the two pumps 33 (9) After the next substrate is carried out and the next substrate S reaches the substrate carry-out position, the next substrate S2 is carried out. The content of this action is the same as that of the above (4). (1 〇) Charge of the next pump This pump charge operation starts after the completion of the photoresist discharge operation for the next substrate S2. In the charging operation of the photoresist, the pump 3 3 is actuated as in the charging operation of the photoresist described in the above (5), and is emptied immediately after the photoresist is discharged to the next substrate 52. The interior is filled with a photoresist. While the photoresist is being charged, the next substrate S2 is transported to the carry-out side stage 2, and the next substrate S2 is carried out. The above operations (6) to (10) are repeated as follows. Fig. 12 is a process timing chart of the coating device in the case where the pump installed in the nozzle is one. As shown in the figure, when the pump is one, the preliminary discharge operation cannot be performed while the photoresist is being charged, and the processing time per substrate is made longer. In contrast, according to an embodiment of the present invention, since a plurality of pumps 3 3 for respectively applying a photoresist to the nozzles 3 2 of the coating portion 3 are provided, even one of the plurality of pumps 33 is provided. During the pumping of the photoresist -26- 200918175, no time is wasted, and the photoresist can be supplied to the substrate by other pumps 3 3 . Thereby, the processing time of each substrate can be reduced. By the configuration of an embodiment of the present invention, the processing line can be shortened. According to one embodiment of the present invention, the plurality of pumps 33 are disposed at positions substantially equal to each other with respect to the nozzles 3 2, so that the photoresist transfer route between the respective pumps 3 3 and the nozzles 3 2 can be made. The conditions are roughly the same. Thereby, the photoresist can be stably discharged onto the substrate. According to one embodiment of the present invention, the plurality of pumps 3 3 are provided in the door frame 31' which can support the nozzle 32 so as to be freely movable and lowered, so that the pump 3 3 can be moved up and down to raise and lower the pump 3 3 . Thereby, the state of the photoresist transport path between each of the pump 3 3 and the nozzle 3 2 can be kept constant, so that the photoresist can be stably discharged onto the substrate. In addition to this, 'the distance between the pump 3 3 and the nozzle 3 2 is short enough to be completed', so that the burden of the pump 3 3 can be alleviated. According to an embodiment of the present invention, the plurality of pumps 33 are mounted to the bridging members 3 1 b ' of the portal frame 31 so that the respective pumps 33 can be mounted in a stable state. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the scope of the present invention. In the above-described embodiment, the entire configuration of the coating apparatus 1 is such that the transport mechanism 23 is disposed on the -Y direction side of each stage, and is not limited thereto. For example, the transport mechanism 23 may be disposed on the +Y direction side of each stage. Further, as shown in Fig. 3, the transport mechanism 23 (transporter 23a, vacuum pad 23b, track 23c) of the above -27-200918175 may be disposed on the -γ direction side of each stage, and arranged in the +Y direction side. The transport mechanism 23 is a transport mechanism 53 (a transporter 53a, a vacuum cushion 53b, and a rail 53c) having the same structure, and the transport mechanism 23 and the transport mechanism 53 can transport different substrates. For example, as shown in the figure, the substrate S1 is transported by the transport mechanism 23, and the substrate S2 is transported by the transport mechanism 53. In this case, the substrate can be transported by the transport mechanism 23 and the transport mechanism 53 to increase the productivity. On the other hand, when the substrate having the area of about half of the substrates S, S1, and S2 is to be transported, for example, the transport mechanism 23 and the transport mechanism 53 are each held one by one, and the transport mechanism 2 and the transport mechanism 5 are moved. 3 When you walk in the +X direction, you can carry two substrates at the same time. With this configuration, productivity can be improved. In the above embodiment, the pump 33 is disposed on the upper surface of the bridge member 31b of the portal frame 31, and the bridge member 31b is equally divided in the longitudinal direction. The present invention is not limited thereto, and may be disposed at another position. For example, as shown in Fig. 14, the pump 3 3 may be disposed on both ends of the bridging member 3 1 b in the longitudinal direction of the bridging member 3 1 b. The pump 33 may be disposed on the upper portion of the bridge member 31b in the longitudinal direction of the bridge member 31b. By arranging the pump 33 in the central portion in the longitudinal direction of the bridge member 31b, the length of the pipe connected between the pump 33 and the nozzle 3 2 can be shortened, so that the load on the pump 3 3 can be reduced. In this case, as shown in Fig. 15, a configuration may be adopted in which the two pumps 3 3 are arranged along the longitudinal direction of the bridge member 3 1 b, as shown in Fig. 16. The configurations of the pumps 33 are arranged along the substrate conveyance direction (the short-axis direction of the bridge members 31b-28-200918175). In the configuration in which the pump 33 is disposed along the substrate conveyance side, in particular, the length of the pipe can be shortened' and the pumps 33 can be attached to the face other than the upper surface of the bridge member 31b. As shown in Fig. 17, a structure in which the two pumps 33 are attached to the strut members 31a of the portal frame 31 may be employed. In this case, as shown in Fig. 17, a structure in which one pump 33 is attached to each of the pillar members 31a may be a pump 3 3 in which one of the pillar members 31a is plural. Construction. As shown in Fig. 18, it is also possible to form a configuration in which the pump mounting frame 60 for mounting the pump 3 3 is additionally provided. The pump mounting frame 60 may be disposed on the upstream side (the -X direction side) with respect to the base conveyance direction of the portal frame 3 1 as shown in FIG. 18, or may be disposed on the door frame 3 1 with respect to the portal frame 3 1 In the downstream side (+X direction side) of the board conveyance direction, it is possible to arrange both the upstream side and the downstream side in the board conveyance direction. A plurality of nozzles 3 2 may also be disposed, and the plurality of nozzles 3 2 may be disposed separately from the kitchen 33. In Fig. 19, an example in which each of the nozzles 3 2 is disposed on the upstream side and the side of the substrate in the substrate conveyance direction of the door frame 3 1 is shown. The long axis directions of the two nozzles 3 2 are arranged to intersect perpendicularly in the substrate transport direction. With this configuration, different nozzles 32 can be used interchangeably for each of the substrates. Therefore, while the coating operation is performed by one of the nozzles 32, the other nozzle 32 can be filled with the photoresist. By having a plurality of nozzles, different types of photoresist can be applied interactively. Alternatively, the plurality of management units 4 may be provided. The two frames are shown in the two frames. The frame is placed in the opposite direction, and the configuration in Fig. 19 in Fig. 19 shows that each nozzle 32 is disposed upstream of the substrate carrying direction of the portal frame 31. Examples of the side and the downstream side are not limited thereto, and a plurality of door frames 3 1 may be disposed, and the long axis direction of each of the nozzles 32 is disposed along the substrate with respect to the plurality of door frames 31 The direction in which the conveying directions intersect perpendicularly. In this case, a plurality of management units 4 can be provided. By this configuration, 'for each of the substrates' can be used interchangeably: the nozzles 3 2 provided at the plurality of gate frames 31 that are independently controlled, so that the coating operation is performed by one of the nozzles 32' The photoresist 32 can be filled on the other side of the nozzle 32. By having a plurality of nozzles 3 2, different kinds of photoresists can be alternately applied. In the structure of Fig. 19, by allowing each nozzle 3 2 to move independently, the preliminary discharge operation can be performed after the photoresist is filled. Thereby, the processing line can be shortened. In the case where the respective nozzles 32 independently perform the preliminary discharge operation, a plurality of management units 4 may be provided. In this case, it is preferable to arrange the nozzle 32 and the pump 3 3 connected to the nozzle 32 integrally. As such a configuration, for example, a structure in which the pump 33 is directly attached to the nozzle 32, a structure in which the nozzle 32 is integrally attached to the moving member, and a configuration in which the pump 3 3 is attached to the moving member can be cited. Thereby, the nozzle 3 2 and the pump 3 3 are integrally moved, so that the position of both of them can be prevented from changing due to the movement of the nozzle 32. Thereby, the environment of the resist conveyance path between the nozzle 3 2 and the pump 3 3 can be maintained, so that the photoresist discharge of the nozzle 32 can be stabilized. In the above-described respective configurations 'as the plurality of pumps 33, for example, an example in which two pumps 3 3 are disposed is described, and the present invention is not limited thereto. For example, three pumps 33 on -30-200918175 may be provided. In the above embodiment, one pump 33 is provided for one nozzle 32, and is not limited thereto. For example, two pumps 33 may be used for the ~ nozzles 32. [Industrial Applicability] The present invention provides a coating apparatus and a coating method capable of shortening a processing line, and is very useful industrially. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 3 is a plan view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 4 is a side view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 5 is a timing chart showing the operation of the coating apparatus of one embodiment of the present invention. Fig. 6 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 7 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention -31 - 200918175. Fig. 9 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 10 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 11 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 2 is a timing chart showing the operation of the coating device when the pump is one. Fig. 13 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 14 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 15 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 16 is a view showing the other structure of the coating apparatus of one embodiment of the present invention. Fig. 17 is a view showing another configuration of a coating apparatus according to an embodiment of the present invention. Fig. 18 is a view showing the other structure of the coating apparatus according to the embodiment of the present invention. Fig. 19 is a view showing another configuration of a coating apparatus according to an embodiment of the present invention. -32- 200918175 [Description of main component symbols] 1 : Coating device 2 : Substrate conveying unit 3 : Coating unit 4 : Management unit 2 7 : Processing stage 3 1 : Portal frame 3 2 : Nozzle 3 3 : Pump 5: substrate R: photoresist film -33