KR100953850B1 - Coating apparatus and coating method - Google Patents

Abstract

A coating apparatus including a substrate conveying unit for floating a substrate and conveying the substrate, and an applicator having a nozzle for applying a liquid to the substrate while being conveyed by the substrate conveying unit,

A coating device, characterized in that a plurality of pumps for respectively feeding the liquid body to the nozzle are formed in the application section.

Description

Coating device and coating method {COATING APPARATUS AND COATING METHOD}

The present invention relates to a coating apparatus and a coating method.

Fine patterns, such as a wiring pattern and an electrode pattern, are formed on the glass substrate which comprises display panels, such as a liquid crystal display. Generally, such a pattern is formed by techniques, such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film thereafter are performed.

As an apparatus which apply | coats a resist film on the surface of a board | substrate, the coating apparatus which fixes a slit nozzle, conveys a glass substrate by the robot etc. under the said slit nozzle, and apply | coats a resist to the said glass substrate is known. In recent years, since the size of a board | substrate is enlarged to 2 m x 2 m or more, there exists a problem that processing tact becomes long by conveyance by a robot. For this reason, the coating apparatus which shortens a process tact by blowing a gas on a stage and floating a board | substrate is known (for example, refer patent document 1).

Patent Document 1: Japanese Unexamined Patent Publication No. 2005-236092

However, the demand for shortening the processing tact is stronger, and further shortening of the processing tact is required.

In view of the above circumstances, an object of the present invention is to provide a coating apparatus and a coating method which can shorten the treatment tact.

In order to achieve the above object, the present invention has the following configuration.

[1] A coating apparatus having a substrate conveying unit for lifting and conveying a substrate and a coating unit having a nozzle for applying a liquid to the substrate while being conveyed by the substrate conveying unit, wherein the coating unit is provided with respect to the nozzle. It is characterized in that a plurality of pumps for respectively pumping the liquid body is formed.

According to the apparatus described in [1], since a plurality of pumps for respectively feeding liquids to the nozzles of the coating unit are formed, even if the liquid is being filled by one pump among the plurality of pumps, the time is blank. It is possible to supply the liquid body by another pump without having to.

[2] The applicator according to [1], wherein a plurality of nozzles are formed on the applicator.

According to the apparatus described in [2], since a plurality of nozzles are formed in the application portion, the liquid can be applied by another nozzle while the liquid is filled in one of the plurality of nozzles. Thereby, even if it is a filling period of a liquid body, a liquid body can be supplied on a board | substrate without giving time gap.

[3] The applicator according to [2], in which the pump is formed corresponding to each of the plurality of nozzles.

According to the apparatus described in [3], since the pump is formed corresponding to each of the plurality of nozzles, the liquid body can be filled separately for each of the plurality of nozzles. As a result, the burden on the pump can be reduced.

[4] The applicator according to [2] or [3], wherein the plurality of nozzles are arranged along a substrate conveyance direction of the substrate conveyance unit.

According to the apparatus described in [4], since a plurality of nozzles are arranged along the substrate conveyance direction of the substrate conveyance unit, when discharging a liquid body from each nozzle, it is sufficient to simply move the nozzles in parallel and rotate them. No need to move For this reason, a liquid body can be easily discharged on a board | substrate.

[5] The applicator according to any one of [1] to [4], wherein the lengths of the liquid conveying paths from each of the plurality of pumps to the nozzle are substantially the same.

According to the apparatus described in [5], since the lengths of the liquid conveying paths from each of the plurality of pumps to the nozzles are approximately equal to each other, the conditions of the liquid conveying paths between the pumps and the nozzles can be made substantially the same. Can be. As a result, the liquid can be stably discharged onto the substrate.

[6] The applicator according to any one of [1] to [5], wherein the plurality of pumps are arranged at positions substantially equal to each other with respect to the nozzle.

According to the apparatus described in [6], since the plurality of pumps are arranged at positions substantially equal to each other with respect to the nozzles, the conditions of the liquid conveying path between the pumps and the nozzles can be made substantially the same. have. As a result, the liquid can be stably discharged onto the substrate.

[7] The applicator according to any one of [1] to [6], which is provided in a frame portion for supporting the plurality of pumps so as to freely lift and lower the nozzle.

According to the apparatus described in [7], the pumps can be moved up and down in accordance with the lifting and lowering of the nozzles because the plurality of pumps are provided in the frame portion for supporting the nozzles so that the nozzles can be freely moved up and down. Thereby, since the liquid conveyance path state between a pump and a nozzle can be kept constant, a liquid can be stably discharged on a board | substrate. In addition, since the distance between the pump and the nozzle is shortened, the burden on the pump can be reduced.

[8] The applicator according to [7], wherein the plurality of pumps are provided on an upstream side of the substrate conveyance direction in the frame portion.

According to the apparatus described in [8], since a plurality of pumps are provided on the upstream side of the substrate conveyance direction in the frame portion, each pump can be mounted in a stable state.

[9] The applicator according to [7], wherein the plurality of pumps are provided downstream of the substrate conveyance direction in the frame portion.

According to the apparatus described in [9], since a plurality of pumps are provided on the downstream side of the substrate conveyance direction in the frame portion, each pump can be mounted in a stable state.

[10] The applicator according to [7], wherein the frame portion has a girder member formed over the substrate transfer portion, and a pillar member supporting the girder member, and a plurality of the pumps are attached to the girder member.

According to the apparatus described in [10], since the frame portion has a girder member formed above the substrate conveyance portion and a pillar member supporting the girder member, and a plurality of pumps are mounted on the girder member, each pump is Can be mounted in a stable state.

[11] The applicator according to [10], wherein a plurality of the pumps are attached to a substantially central portion of an upper surface of the girder member.

According to the apparatus described in [11], since the plurality of pumps are attached to the substantially center portion of the upper surface of the girder member, the liquid conveyance path from the nozzle to the pump can be shortened.

[12] The applicator according to [7], wherein the frame portion has a girder member formed above the substrate transfer portion and a pillar member supporting the girder member, and a plurality of the pumps are attached to the pillar member of the frame.

According to the apparatus described in [12], since the frame portion has a girder member and a pillar member for supporting the girder member formed above the substrate conveyance portion, a plurality of pumps are attached to the pillar member of the frame, Can be mounted in a stable state.

[13] The applicator according to [1] to [6], wherein the pump frame portion supporting the plurality of pumps is provided, and the pump frame portion is disposed in front of the substrate conveyance direction with respect to the nozzle.

According to the coating apparatus as described in [13], since the pump frame part which supports a some pump is provided, and the pump frame part is arrange | positioned in the front side of a board | substrate conveyance direction with respect to a nozzle, it applies to the board | substrate after liquid application | coating. The vibration of the pump can be less transmitted.

[14] The substrate conveying unit is formed so as to face a first stage device having a plurality of gas ejection holes on the substrate mounting surface, and the coating part, and has a plurality of gas ejection holes and a plurality of gas intake holes on the substrate mounting surface. The coating device in any one of [1]-[13] provided with a 2nd stage apparatus.

According to the apparatus described in [14], the substrate conveying unit has a plurality of gas ejection holes and a plurality of gases in a first stage device having a plurality of gas ejection holes in the substrate mounting surface, and a substrate mounting surface formed to face the coating unit. Since the 2nd stage apparatus which has a suction hole was provided, the floating amount of a board | substrate in a coating part can be adjusted more finely.

[15] The applicator according to any one of [1] to [14], comprising a preliminary ejection section having a substantially planar preliminary ejection surface to which the liquid body is applied from the applicator at the time of preliminary ejection of the applicator.

According to the apparatus described in [15], the preliminary ejection section having a substantially flat preliminary ejection surface to which the liquid is applied from the applicator during the preliminary ejection operation of the applicator is provided. The film can be applied.

[16] A method of discharging a liquid conveyed by a pump from a nozzle and applying it to the substrate while floating and conveying the substrate, wherein the liquid is discharged and filled in the first pump connected to the nozzle. And bringing the substrate into the front surface of the nozzle, and pressurizing the liquid body from the first pump to the nozzle to discharge the liquid body from the nozzle onto the substrate and to connect to the nozzle. Characterized in that it comprises the step of filling the liquid in the second pump.

According to the coating method described in [16], the liquid is filled into the first pump connected to the nozzle for discharging the liquid, the substrate is loaded onto the front of the nozzle, the liquid is fed into the nozzle from the first pump, and the nozzle Since the liquid is discharged from the substrate onto the substrate and the liquid is filled in the second pump connected to the nozzle, even if the liquid is filled by one of the plurality of pumps, no time gap is allowed. Instead, the liquid can be supplied by another pump.

[17] Following the first substrate to which the liquid is applied, conveying the second substrate to the front surface of the nozzle, and pressurizing the liquid to the nozzle from the second pump to the The coating method as described in [16] which has the process of discharging the said liquid body on a 2nd board | substrate.

According to the application | coating method as described in [17], following a 1st board | substrate with which the liquid body was apply | coated, a 2nd board | substrate is conveyed to the front surface of a nozzle, a liquid body is conveyed to a nozzle from a 2nd pump, and a nozzle is carried out on a 2nd board | substrate from a nozzle. Since the liquid body is to be discharged, the coating operation can be performed without leaving a time gap.

[18] The coating method according to [17], wherein the liquid is filled in the first pump in the step of discharging the liquid on the second substrate.

According to the coating method described in [18], in the step of discharging the liquid on the second substrate, the liquid is filled in the first pump, so that the first pump and the second pump can be used alternately. . Thereby, application | coating operation | movement can be performed continuously, without leaving time gap.

[19] A method of coating a liquid on the substrate while floating and conveying the substrate, the method comprising: filling the liquid with a first pump connected to a first nozzle for discharging the liquid; Transporting the liquid to the front surface of the first nozzle, discharging the liquid body from the first pump to the first nozzle and discharging the liquid body from the first nozzle onto the first substrate; Filling the liquid into a second pump connected to two nozzles, bringing the second substrate onto the front surface of the second nozzle, and feeding the liquid from the second pump to the second nozzle. And discharging the liquid body onto the second substrate from the second nozzle.

According to the application | coating method as described in [19], this liquid body is filled in the 1st pump connected to the 1st nozzle which discharges a liquid body, the 1st board | substrate is carried in the front surface of a 1st nozzle, and it is made from a 1st pump. Transporting the liquid to the first substrate by conveying the liquid to the first nozzle, filling the second pump connected to the second nozzle, and filling the second substrate with the second nozzle; Carrying out the coating operation continuously without leaving a time gap, because the step of bringing the liquid to the second nozzle from the second pump was performed by transferring the liquid to the second nozzle from the second pump. can do.

According to this invention, the coating apparatus and coating method which can shorten processing tact can be obtained.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a perspective view of a coating device 1 according to one embodiment of the present invention.

As shown in FIG. 1, the coating device 1 which concerns on one Embodiment of this invention is a coating device which apply | coats a resist on the glass substrate used for a liquid crystal panel etc., for example, The board | substrate conveyance part 2 and The application part 3 and the management part 4 are main components. In the coating device 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transfer unit 2, and the application unit 3 is applied by the management unit 4. State is managed.

2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. With reference to these drawings, the detailed structure of the coating device 1 is demonstrated.

(Substrate conveying part)

First, the structure of the board | substrate conveyance part 2 is demonstrated.

The board | substrate conveyance part 2 has the board | substrate loading area | region 20, the coating process area | region 21, the board | substrate carrying out area | region 22, the conveyance mechanism 23, and the frame part 24 which supports these. have. In this board | substrate conveyance part 2, the board | substrate S is conveyed by the conveyance mechanism 23 to the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22 in order. The board | substrate loading area | region 20, the coating process area | region 21, and the board | substrate carrying out area | region 22 are arrange | positioned in this order from the upstream to the downstream side of a board | substrate conveyance direction. The conveyance mechanism 23 is formed in one side of each said part so that it may apply to each part of the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22. As shown in FIG.

Hereinafter, in explaining the structure of the coating device 1, in order to simplify notation, the direction in drawing is demonstrated using an XYZ coordinate system. As a longitudinal direction of the board | substrate conveyance part 2, the conveyance direction of a board | substrate is described with an X direction. In the plan view, the direction orthogonal to the X direction (substrate conveyance direction) is described as the Y direction. The direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as the Z direction. In each of the X, Y and Z directions, the direction of the arrow in the figure is the + direction and the direction opposite to the direction of the arrow is the-direction.

The board | substrate loading area | region 20 is a site | part which carries in the board | substrate S conveyed from the exterior of the apparatus, and has the carry-in side stage 25 and the lift mechanism 26. As shown in FIG.

The carrying-in side stage 25 is formed in the upper part of the frame part 24, and is a rectangular plate-shaped member when it sees from the plane which consists of SUS etc., for example. The carry-in side stage 25 has a long X direction. In the carry-in side stage 25, the air blowing hole 25a and the lifting pin projection hole 25b are each formed in multiple numbers. These air blowing holes 25a and the lifting pin dropping-out holes 25b are formed to penetrate the carrying-in side stage 25.

The air blowing hole 25a is a hole for blowing air onto the stage surface 25c of the carry-in stage 25. For example, the air blowing hole 25a is a plane in the region where the substrate S passes in the carry-in stage 25. When viewed, they are arranged in a matrix. An air supply source (not shown) is connected to this air blowing hole 25a. In this carry-in side stage 25, the board | substrate S can be made to float to + Z direction by the air which blows out from the air blowing hole 25a.

The lifting pin projection holes 25b are formed in a region into which the substrate S is loaded in the carry-in stage 25. The lifting pin projection hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

The alignment apparatus 25d is formed in each of the both ends of the Y direction among these loading side stages 25 one by one. The alignment device 25d is a device for aligning the position of the substrate S carried in the carry-in side stage 25. Each alignment device 25d has a long hole and a positioning member (not shown) formed in the long hole, and mechanically sandwiches the substrate carried in the loading stage 25 from both sides.

The lift mechanism 26 is formed in the back surface side of the board | substrate carrying in position of the carry-in side stage 25. As shown in FIG. This lift mechanism 26 has a lifting member 26a and a plurality of lifting pins 26b. The lifting member 26a is connected to a drive mechanism (not shown), and the lifting member 26a moves in the Z direction by the drive of the drive mechanism. The plurality of lifting pins 26b are vertically formed from the upper surface of the lifting member 26a toward the carrying-in side stage 25. Each elevating pin 26b is arrange | positioned in the position which overlaps with said elevating pin outgoing hole 25b in planar view, respectively. As the elevating member 26a moves in the Z direction, each elevating pin 26b is projected from the elevating pin recessed holes 25b onto the stage surface 25c. The edge part of the + Z direction of each lifting pin 26b is formed so that the position on a Z direction may be aligned, respectively, and can hold | maintain the board | substrate S conveyed from the apparatus exterior in the horizontal state.

In the application | coating process area | region 21, the process stage 27 which floats and supports the board | substrate S as a site | part to which application | coating of a resist is given is formed.

The processing stage 27 is a rectangular plate-shaped member when the stage surface 27c is covered with, for example, a light absorbing material containing hard alumite as a main component, and is formed in the + X direction with respect to the carry-in stage 25. It is. In the part covered with the light absorbing material in the processing stage 27, reflection of light such as laser light is suppressed. This processing stage 27 is long in the Y direction. The dimension of the Y direction of the processing stage 27 is made substantially the same as the dimension of the Y direction of the carry-in side stage 25. The process stage 27 is provided with the some air blowing hole 27a which blows off air on the stage surface 27c, and the some air suction hole 27b which sucks air on the stage surface 27c. . These air blowing holes 27a and air suction holes 27b are formed to penetrate through the processing stage 27.

In the air stage 27, the pitch of the air jet holes 27a is narrower than the pitch of the air jet holes 25a formed in the carry-in stage 25, and the air jet holes 27a are smaller than those of the carry-in stage 25. It is densely formed. For this reason, in this processing stage 27, the floating amount of a board | substrate can be adjusted with high precision compared with another stage, and it becomes possible to control so that the floating amount of a board | substrate may be 100 micrometers or less, for example, 50 micrometers preferably. have.

The board | substrate carrying out area | region 22 is a site | part which carries out the board | substrate S to which the resist was apply | coated to the exterior of the apparatus, and has the carrying-out side stage 28 and the lift mechanism 29. As shown in FIG. This carrying-out stage 28 is formed in the + X direction side with respect to the process stage 27, and is comprised by the material and dimension substantially the same as the carrying-in side stage 25 formed in the board | substrate carrying-in area 20. FIG. In the carrying out side stage 28, the air blowing hole 28a and the lifting pin falling-out hole 28b are formed similarly to the carrying in side stage 25. As shown in FIG. The lift mechanism 29 is formed in the back surface side of the board | substrate carrying out position of the carrying-out stage 28, and is supported by the frame part 24, for example. The elevating member 29a and the elevating pin 29b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 formed in the substrate loading area 20. When carrying out the board | substrate S on the carrying-out stage 28 to an external apparatus, this lift mechanism 29 can lift the board | substrate S by the lifting pin 29b for sending and receiving board | substrate S. It is supposed to be.

The conveyance mechanism 23 has the conveyer 23a, the vacuum pad 23b, and the rail 23c. The conveyer 23a has a structure in which a linear motor is formed, for example, and the conveyer 23a can move on the rail 23c by driving the linear motor.

This conveyer 23a is arrange | positioned so that the predetermined part 23d may overlap with the edge part of the board | substrate S at the -Y direction when it sees in plan view. The part 23d which overlaps with this board | substrate S is formed in the position lower than the height position of the back surface of the board | substrate at the time of making the board | substrate S float.

The vacuum pad 23b is arranged in multiple numbers in the part 23d which overlaps with the said board | substrate S in the conveyer 23a. This vacuum pad 23b has the adsorption surface which vacuum-adsorbs the board | substrate S, and is arrange | positioned so that the said adsorption surface may face upward. The vacuum pad 23b can hold | maintain the said board | substrate S by the adsorption surface attracting the back surface edge part of the board | substrate S. As shown in FIG. Each vacuum pad 23b can adjust the height position from the upper surface of the conveyer 23a, and can move the height position of the vacuum pad 23b up and down according to the floating amount of the board | substrate S, for example. It is supposed to be. The rail 23c extends over each stage to the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyer 23a is made by sliding the said rail 23c. It is possible to move along each said stage.

(Application department)

Next, the structure of the application part 3 is demonstrated.

The application part 3 is a part which apply | coats a resist on the board | substrate S, and has the sentence frame 31, the nozzle 32, and the pump 33. As shown in FIG.

The sentence frame 31 has the support column member 31a and the bridge | crosslinking member 31b, and is formed so that the process stage 27 may span the Y direction. One support column member 31a is formed on the Y-direction side of the processing stage 27, and each support column member 31a is supported on both side surfaces of the frame portion 24 on the Y-direction side, respectively. Each support pillar member 31a is formed so that the height position of an upper end part may be aligned. The bridge | crosslinking member 31b is bridge | crosslinked between the upper end parts of each support pillar member 31a, and it is possible to raise / lower the said support pillar member 31a.

This door-shaped frame 31 is connected to the moving mechanism 31c, and can move to an X direction. This moving mechanism 31c allows the door frame 31 to move between the management part 4. That is, the nozzle 32 formed in the door frame 31 is able to move between the management part 4.

The nozzle 32 is comprised in the elongate shape which one direction is length, and is formed in the surface of the cross-sectional member 31b of the sentence frame 31 at the side of the -Z direction. The slit-shaped opening part 32a is formed in the front-end | tip of the -Z direction among this nozzle 32 along the longitudinal direction, and the resist is discharged from the said opening part 32a. The nozzle 32 is arrange | positioned so that the longitudinal direction of the opening part 32a may become parallel to the longitudinal direction (Y direction) of the nozzle 32 itself, and the said opening part 32a opposes the processing stage 27. As shown in FIG. The dimension of the longitudinal direction of the opening part 32a is smaller than the dimension of the Y direction of the board | substrate S to be conveyed, and the resist is not apply | coated to the peripheral area of the board | substrate S. FIG. Inside the nozzle 32, a flow path (not shown) for flowing a resist through the opening 32a is formed. A moving mechanism (not shown) is formed in the support column member 31a, and the nozzle 32 held by the crosslinking member 31b can move in the Z direction by the moving mechanism. Furthermore, the sensor 34 which measures the distance in the Z direction between the opening part 32a of the nozzle 32, ie, the front end of the nozzle 32, and the opposing surface which opposes the said nozzle front end, You may attach to the lower surface of the crosslinking member 31b.

The pump 33 is a resist supply means which supplies a resist to the flow path of the nozzle 32. As shown in FIGS. 1-4, two pump 33 is arrange | positioned along the longitudinal direction of the nozzle 32 in the upper surface of the bridge | crosslinking member 31b of the sentence frame 31, and the said two pumps ( 33 are disposed at positions that are substantially equal to each other with respect to the nozzle 32. Here, the pump 33 is arrange | positioned at the position which divides the bridge | crosslinking member 31b into substantially 3 equal parts, for example here.

As such a pump, a diaphragm pump, a tube pram pump, a syringe pump, etc. are used preferably, for example. Of these pumps tube tube pumps are particularly preferred.

(Management)

The structure of the management part 4 is demonstrated.

The management part 4 is a site | part which manages the nozzle 32 so that the discharge amount of the resist (liquid body) discharged to the board | substrate S may become constant, and -X with respect to the application | coating part 3 in the board | substrate conveyance part 2 is -X. It is formed in the direction side (upstream side of a board | substrate conveyance direction). This management part 4 includes the preliminary discharge mechanism 41, the dip tank 42, the nozzle cleaning device 43, the accommodation part 44 which accommodates them, and the holding member 45 which holds the said accommodation part. Have The holding member 45 is connected to the moving mechanism 45a. By the said movement mechanism 45a, the accommodating part 44 is able to move to a X direction.

The preliminary ejection mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order on the -X direction side. Each dimension of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the support column members 31a of the sentence frame 31, and the sentence frame (31) It is possible to access over each site | part.

The preliminary ejection mechanism 41 is a part which ejects a resist preliminarily. The preliminary ejection mechanism 41 is formed nearest to the nozzle 32. The dip tank 42 is a liquid tank in which thinners, resists and the like are stored therein. The nozzle cleaning device 43 is a device for rinsing the vicinity of the opening portion 32a of the nozzle 32, and has a cleaning mechanism (not shown) moving in the Y direction and a moving mechanism (not shown) for moving the cleaning mechanism. have. This movement mechanism is formed in the -X direction side rather than the washing | cleaning mechanism. The nozzle cleaning device 43 has a larger X-direction dimension than the preliminary discharge mechanism 41 and the dip tank 42 as long as the moving mechanism is formed.

When the said nozzle cleaning apparatus 43 is arrange | positioned in the position (+ X direction side) close to the nozzle 32, another site | part is arrange | positioned in the position (-X direction side) far from the nozzle 32 instead. In this case, when the nozzle 32 accesses another part in the accommodating part 44, it is necessary to pass through a moving mechanism, and the movement distance of the nozzle 32 becomes long by that much.

The nozzle cleaning device 43 of the present embodiment is formed at a position on the -X direction side of the preliminary discharge mechanism 41 and the dip tank 42, and the moving mechanism of the nozzle cleaning device 43 is the nozzle cleaning device. Since it is formed in the -X direction side rather than the washing | cleaning mechanism of 43, the nozzle 32 is arrange | positioned so that the movement distance of the nozzle 32 may be made as short as possible without passing through a movement mechanism. Of course, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not limited to the arrangement | positioning of this embodiment and may be another arrangement | positioning.

(Operation of Coating Device)

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.

5 is a timing chart of the operation of the coating device 1. As shown in FIG. 5, in the coating device 1, each operation | movement of board | substrate loading, resist coating, board | substrate carrying out, preliminary discharge, and resist filling (pump filling) is performed. Hereinafter, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated.

6-9 is a top view which shows each operation | movement of operation | movement carrying in of the coating device 1, resist coating, and board | substrate carrying out. The board | substrate S is carried in to the board | substrate carrying-in area | region 20, the resist is apply | coated in the coating process area | region 21, floating and conveying the said board | substrate S, and the board | substrate S which apply | coated this resist was apply | coated to the board | substrate carrying out area | region. It carries out from (22). 7-9, only the outline of the sentence frame 31 was shown with the broken line, and the structure of the nozzle 32 and the processing stage 27 was made easy to distinguish. The detailed operation in each part is described below.

Before carrying in a board | substrate to the board | substrate carrying-in area 20, the coating device 1 is standby. Specifically, the conveyer 23a is arranged on the −Y direction side of the substrate loading position of the carry-in stage 25, and the carry position is aligned with the floating height position of the substrate while bringing in the height position of the vacuum pad 23b. Air is blown out from the air blowing hole 25a of the side stage 25, the air blowing hole 27a of the processing stage 27, the air suction hole 27b, and the air blowing hole 28a of the carrying out side stage 28, respectively. Blowing off or aspirating is performed in the state where air is supplied to the extent that the substrate floats on the surface of each stage. In addition, a resist is filled in the pump 33. Specifically, the two pumps 33 are filled with the amount of resist necessary for the preliminary ejection operation and the resist coating after the preliminary ejection operation.

(1) Board import

In this state, when the board | substrate S is conveyed from the exterior to the board | substrate carrying-in position shown in FIG. 8 by the conveyance arm etc. which are not shown in figure, for example, the lifting member 26a shown in FIG. 2 is moved to + Z direction, FIG. The lifting pin 26b shown in 2 is projected from the lifting pin projection hole 25b to the stage surface 25c. And the board | substrate S is lifted by the lifting pin 26b, and the said board | substrate S is received. Moreover, the positioning member protrudes from the elongate hole of the alignment apparatus 25d to the stage surface 25c.

After receiving the board | substrate S, the lifting member 26a is lowered and the lifting pin 26b is accommodated in the lifting pin projection hole 25b. At this time, since the layer of air is formed in the stage surface 25c, the board | substrate S is hold | maintained in the state which floated with respect to the stage surface 25c by the said air. When the substrate S reaches the surface of the air layer, the substrate S is aligned by the alignment member of the alignment device 25d, and the conveying machine (positioned at the -Y direction side of the substrate loading position) The vacuum pad 23b of 23a) is vacuum-suctioned to the edge part at the side of -Y direction of the board | substrate S. FIG. The state in which the edge part at the side of the -Y direction of the substrate S is adsorbed is shown in FIG. 7.

(2) preliminary discharge

Before the application of the resist to the substrate S, the application portion 3 is subjected to preliminary ejection for maintaining the ejection state of the nozzle 32. This preliminary ejection operation is performed at substantially the same time as the substrate loading start. First, as shown in FIG. 10, the moving frame 31c (this is shown in FIG. 4) moves the sentence frame 31 to the position of the management part 4 in the -X direction.

After moving the sentence frame 31 to the position of the management part 4, the position of the sentence frame 31 is adjusted, and the nozzle 32 is made to access the nozzle cleaning apparatus 43. FIG. In the nozzle cleaning device 43, a cleaning liquid such as thinner is discharged toward the opening 32a of the nozzle 32, and nitrogen gas is discharged to the opening 32a of the nozzle 32 simultaneously with the thinner as necessary. The nozzle 32 is cleaned by scanning a washing mechanism (not shown) in the longitudinal direction of the nozzle 32.

After the nozzle 32 is cleaned, the nozzle 32 is made to access the preliminary discharge unit 41. In the preliminary ejection unit 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary ejection surface, and the nozzle 32 is moved in the -X direction. The resist is preliminarily ejected from the opening 32a while moving to. In this preliminary discharge, in one pump 33 filled with a resist among the two pumps 33 formed, the internal resist is sent to the flow path of the nozzle 32.

After performing preliminary discharge, when the sentence frame 31 is returned to the original position and the next board | substrate S is conveyed, as shown in FIG. 11, the nozzle 32 will be prescribed | regulated in the Z direction by the moving mechanism 31b. Move to the position of.

If necessary, the nozzle 32 may be accessed in the dip tank 42 whenever the manager 4 accesses the predetermined number of times, for example. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32a of the nozzle 32 to the vapor atmosphere of the solvent (thinner) stored in the dip tank 42.

(3) application

After the -Y direction side edge part of the board | substrate S is attracted by the vacuum pad 23b, the conveyer 23a is moved along the rail 23c. Since the board | substrate S has floated, even if the drive force of the conveyer 23a is made relatively small, the board | substrate S will move smoothly along the rail 23c. When the substrate S moves from the carry-in side stage 25 to the processing stage 27, the floating amount of the substrate S in the processing stage 27 is 100 μm, preferably 50 μm or less.

When the conveyance direction front-end | tip of the board | substrate S reaches the position of the opening part 32a of the nozzle 32, application | coating of a resist is performed on the board | substrate S. FIG. In the resist coating operation, in the pump 33 which pumped in the preliminary discharge operation among the two pumps 33 formed, the resist in the pump 33 is again fed to the flow path of the nozzle 32. As shown in FIG. 7, the pressurized resist is discharged toward the substrate S from the opening 32a (this is shown in FIG. 4). Discharge of this resist is performed, fixing the position of the nozzle 32, and conveying the board | substrate S by the conveyer 23a. With the movement of the board | substrate S, the resist film R is apply | coated on the board | substrate S as shown in FIG. The resistive film R is formed in the predetermined area | region of the board | substrate S by the board | substrate S passing under the opening part 32a which discharges a resist.

The board | substrate S in which the resist film R was formed is conveyed to the carrying out side stage 28 by the conveyer 23a. In the carrying out side stage 28, the board | substrate S is conveyed to the board | substrate carrying out position shown in FIG. 9 in the state floated with respect to the stage surface 28c.

(4) Take out board

When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released. After the adsorption of the board | substrate S is canceled | released, the conveyer 23a returns to the board | substrate loading position of the loading side stage 25 again. Moreover, the lifting member lifting member 29a of the lift mechanism 29 moves to + Z direction after suction release. With the movement of the elevating member 29a, the elevating pin 29b protrudes from the elevating pin concave hole 28b to the back surface of the board | substrate S, and the board | substrate S is lifted by the elevating pin 29b. . In this state, the external conveyance arm formed in the + X direction side of the carrying out stage 28, for example, accesses the carrying out stage 28, and receives the board | substrate S. FIG. Thus, carrying out of the board | substrate S is performed.

(5) pump filling

The pump filling operation is started immediately after discharging the resist. Immediately after discharging the resist, the resist holding part 33a of the pump 33 used for discharging the resist is emptied. In the resist filling operation, this pump 33 is operated and the resist is filled into the emptied interior. In the middle of the filling of the resist, the substrate S is conveyed to the carrying out stage 28, and the carrying out operation of the substrate S is performed.

(6) bringing in the next board

The loading of the next substrate (hereinafter referred to as "next substrate") of the substrate is performed at substantially the same time as the start of the carrying out operation of the substrate S. The carrying-in operation is the same as the carrying-in operation of the said board | substrate S, after receiving the next board | substrate S2 by the lifting pin 26b, it floats and holds on the carrying-in stage 25, and alignment is performed. The conveyer 23a returned to the board | substrate carrying-in position at the time of carrying out of the said board | substrate S returns to a board | substrate carrying-in position before alignment of the next board | substrate S2 is complete | finished. Next, the board | substrate S2 is adsorbed by the adsorption pad 23b of the conveyer 23a which returned to the board | substrate loading position.

(7) preliminary ejection of the next substrate

When the substrate conveyance and resist coating operation described in the above (3) is completed, a preliminary ejection operation for ejecting a resist to the next substrate S2 is performed. The content of this preliminary ejection operation is the same as that described in (2) above. In this preliminary discharge operation, the pumping is performed by a pump 33 which is different from the pump 33 which is pumped in the above (2) and (3) among the two pumps 33. At the start of the next substrate preliminary ejection operation, the pump 33 subjected to the pressure feeding in (2) and (3) is in a state of performing a resist filling operation. Further, the next substrate preliminary ejection operation is also terminated at a timing substantially equal to the timing at which the loading operation of the next substrate S2 is finished. Therefore, this next substrate preliminary ejection operation is performed in parallel with the carrying out operation of the substrate S, the carrying in operation of the next substrate S2 and the resist filling operation.

(8) next substrate coating

When the next substrate S2 is loaded into the carrying-in stage 25 and adsorbed by the adsorption pad 23b, the next substrate S2 is conveyed to the processing stage 27. When the next substrate S2 is conveyed to the processing stage 27, a resist is applied to the next substrate S2. The contents of the transfer operation and the coating operation of the next substrate S2 are the same as those described in the above (2) and (3). In this application | coating operation | movement, the resist 33 is pumped by the pump 33 which carried out the pressure feeding at the time of the preliminary discharge operation | movement of said 7 among two pumps 33. As shown in FIG.

(9) take out the next substrate

When the next substrate S2 reaches the substrate unloading position, the carrying out operation of the next substrate S2 is performed. The contents of this operation are the same as those of the above (4).

10.then pump charge

This pump filling operation is started immediately after the discharge of the resist to the next substrate S2 is finished. Also in this resist filling operation, the pump 33 operates in the same manner as the resist filling operation described in the above (5), and the resist is filled into the vacant interior immediately after discharging the resist to the next substrate S2. While the resist is being filled, the next substrate S2 is conveyed to the carrying out stage 28, and the carrying out operation of the next substrate S2 is performed.

Hereinafter, the above operations (6) to (10) are repeated.

12 is a processing timing chart of the coating device when there is one pump attached to the nozzle.

As shown in the figure, in the case of one pump, since the preliminary ejection operation cannot be performed during the period of filling the resist, the processing time per substrate is longer.

On the other hand, according to one Embodiment of this invention, since it was supposed that the some pump 33 which presses the resist with respect to the nozzle 32 of the application part 3 is formed, the some pump 33 is carried out. Even while the resist is being filled by one pump in the middle, the resist can be supplied onto the substrate by another pump 33 without any time gap. Thereby, the processing time with respect to one board | substrate is suppressed. Thus, the structure of one Embodiment of this invention can shorten processing tact.

In addition, according to one embodiment of the present invention, since the plurality of pumps 33 are arranged at positions that are substantially equal to each other with respect to the nozzles 32, the respective pumps 33 and the nozzles 32 The conditions of the resist conveyance path | route between ()) can be made substantially the same. Thereby, the resist can be stably discharged onto the substrate.

Moreover, according to one embodiment of the present invention, since the plurality of pumps 33 are provided in the door frame 31 which supports the nozzle 32 so that the nozzle 32 can freely move, the lifting and lowering of the nozzle 32 is performed. The pump 33 can be raised and lowered accordingly. Thereby, since the state of the resist conveyance path between each pump 33 and the nozzle 32 can be kept constant, resist can be discharged stably on a board | substrate. In addition, since the distance between the pump 33 and the nozzle 32 becomes short, the burden on the pump 33 can be reduced.

In addition, according to one embodiment of the present invention, since the plurality of pumps 33 are attached to the crosslinking member 31b of the door-shaped frame 31, the respective pumps 33 can be mounted in a stable state. have.

The technical scope of the present invention is not limited to the above embodiment, and modifications can be appropriately added without departing from the spirit of the present invention.

About the whole structure of the coating device 1, although the conveyance mechanism 23 was arrange | positioned in the -Y direction side of each stage in the said embodiment, it is not limited to this. For example, the structure which arrange | positions the conveyance mechanism 23 to the + Y direction side of each stage may be sufficient. Moreover, as shown in FIG. 13, the said conveyance mechanism 23 (transfer machine 23a, vacuum pad 23b, rail 23c) is arrange | positioned at the -Y direction side of each stage, and the said conveyance at the + Y direction side The conveyance mechanism 53 (conveyor 53a, vacuum pad 53b, rail 53c) of the same structure as the mechanism 23 is arrange | positioned, and the board | substrate different from the conveyance mechanism 23 and the conveyance mechanism 53 is arrange | positioned. You may comprise so that conveyance may be carried out. For example, as shown to the same figure, the conveyance mechanism 23 is made to convey the board | substrate S1, and the conveyance mechanism 53 is made to convey the board | substrate S2. In this case, since the substrate can be alternately conveyed by the transfer mechanism 23 and the transfer mechanism 53, throughput is improved. Moreover, when conveying the board | substrate which has an area of about half of said board | substrate S, S1, S2, it hold | maintains one by one in the conveyance mechanism 23 and the conveyance mechanism 53, for example, and conveyance mechanism 23 ) And the conveyance mechanism 53 can be conveyed at the same time by advancing side by side in the + X direction. By such a configuration, the throughput can be improved.

Moreover, in the said embodiment, although the pump 33 was arrange | positioned in the position which divided | segmented the said crosslinking member 31b in the longitudinal direction on the upper surface of the crosslinking member 31b of the sentence frame 31, it is not limited to this, You may place it in another place.

For example, as shown in FIG. 14, you may arrange | position the pump 33 in the both ends of the longitudinal direction of the said bridge | crosslinking member 31b as an upper surface of the bridge | crosslinking member 31b, respectively.

Moreover, you may arrange | position the pump 33 in the center part of the longitudinal direction of the said bridge | crosslinking member 31b as an upper surface of the bridge | crosslinking member 31b, respectively. By arrange | positioning the pump 33 in the center part of the longitudinal direction of the bridge | crosslinking member 31b, since the length of the piping which connects between the pump 33 and the nozzle 32 can be shortened, the burden of the pump 33 is reduced. You can.

In addition, in this case, as shown in FIG. 15, the structure which arrange | positions two pump 33 along the longitudinal direction of the bridge | crosslinking member 31b may be sufficient, and as shown in FIG. 16, two pump 33 is board | substrate. The structure arrange | positioned along a conveyance direction (short direction of the crosslinking member 31b) may be sufficient. In the structure which arrange | positions the pump 33 along a board | substrate conveyance direction, it becomes possible especially to shorten the length of piping, and you may mount two pump 33 on the surface other than the upper surface of the bridge | crosslinking member 31b. .

Moreover, as shown in FIG. 17, the structure which attached the two pump 33 to the support member 31a of the door frame 31 may be sufficient. In this case, as shown in FIG. 17, the structure which mounts the pump 33 one by one in each support member 31a may be sufficient, although the illustration is abbreviate | omitted, but the some pump 33 is provided in one support member 31a. It may be a configuration for mounting.

Moreover, as shown in FIG. 18, you may be the structure which forms the pump mounting frame 60 for attaching the two pumps 33 separately. In this case, as shown in FIG. 18, you may arrange | position the pump installation frame 60 to the upstream side (-X direction side) of a board | substrate conveyance direction with respect to the sentence frame 31, and convey a board | substrate with respect to the sentence frame 31. As shown in FIG. You may arrange | position to the downstream side (+ X direction side) of a direction, and the structure arrange | positioned at both an upstream side and a downstream side of a board | substrate conveyance direction may be sufficient.

Moreover, the structure which arrange | positions a plurality of nozzles 32 and arrange | positions one pump 33 with respect to each of the said some nozzle 32 may be sufficient. In FIG. 19, the example in which the nozzle 32 is arrange | positioned one by one in the upstream and downstream of the board | substrate conveyance direction of the sentence frame 31 is shown. The longitudinal direction of the two nozzles 32 is arrange | positioned so that it may follow the direction orthogonal to a board | substrate conveyance direction.

According to this structure, since the different nozzles 32 can be used alternately for every board | substrate, while the coating operation is performed by one nozzle 32, the other nozzle 32 can fill a resist. have. Moreover, by having two or more nozzles 32, it becomes possible to apply | coat alternately the resist from a different kind. Moreover, you may provide multiple management parts 4.

Moreover, in the structure of FIG. 19, although the example which the nozzle 32 was arrange | positioned one by one on the upstream side and the downstream side of the board | substrate conveyance direction of the sentence frame 31 was shown, it is not limited to these, The sentence frame 31 ) May be provided, and the plurality of door-shaped frames 31 may be provided one by one so that the longitudinal direction of the nozzle 32 is along the direction orthogonal to the substrate conveyance direction. In this case, a plurality of management units 4 may be provided. According to this structure, since the nozzles 32 provided in the several framed frame 31 independently controlled for each board | substrate can be used alternately, while the coating operation is performed by one nozzle 32, In the other nozzle 32, a resist can be filled. Moreover, by having two or more nozzles 32, it becomes possible to apply | coat alternately the resist from a different kind.

In addition, in the structure of FIG. 19, by setting each nozzle 32 to be movable independently, preliminary discharge operation | movement can also be performed after resist filling. As a result, the processing tact can be further shortened. When preliminary ejection operation | movement is performed to each nozzle 32 independently, you may provide multiple management parts 4.

In this case, it is preferable to set it as the structure in which the nozzle 32 and the pump 33 connected to the said nozzle 32 are arrange | positioned integrally. In such a configuration, for example, the pump 33 is directly attached to the nozzle 32, or the moving member is integrally attached to the nozzle 32, and the pump 33 is attached to the moving member. The structure etc. to mention are mentioned.

Thereby, since the nozzle 32 and the pump 33 move integrally, it can avoid that the position of both changes by the movement of the nozzle 32. FIG. Thereby, since the environment of the resist conveyance path between the nozzle 32 and the pump 33 is maintained, the resist discharge of the nozzle 32 can be stabilized.

Moreover, in each said structure, although the example which arrange | positioned two pump 33 as the some pump 33 was demonstrated, it is not limited to this, For example, three or more pumps 33 are formed, for example. It does not matter. Moreover, in the said embodiment, although it was the structure which provided one pump 33 with respect to one nozzle 32, it is not limited to this, For example, the pump 33 is provided with respect to one nozzle 32, for example. The structure which uses two may be sufficient.

INDUSTRIAL APPLICABILITY The present invention is very useful industrially because it provides a coating apparatus and a coating method which can shorten the treatment tact.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the structure of the application | coating device which concerns on one Embodiment of this invention.

It is a front view which shows the structure of the coating device which concerns on one Embodiment of this invention.

It is a top view which shows the structure of the application | coating device which concerns on one Embodiment of this invention.

It is a side view which shows the structure of the application | coating device which concerns on one Embodiment of this invention.

5 is a timing chart showing the operation of the coating apparatus according to one embodiment of the present invention.

It is a figure which shows the operation | movement of the coating device which concerns on one Embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on one Embodiment of this invention.

It is a figure which shows the operation | movement of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the operation | movement of the application | coating device which concerns on one Embodiment of this invention.

It is a figure which shows the operation | movement of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on one Embodiment of this invention.

12 is a timing chart in which the pump shows the operation of one coating device.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

It is a figure which shows the other structure of the coating apparatus which concerns on one Embodiment of this invention.

(Explanation of the sign)

1 Coating device 2 Substrate conveying part

3: application part 4: management part

27: processing stage 31: sentence frame

32: nozzle 33: pump

S: substrate R: resist film

Claims (19)

A coating apparatus including a substrate conveying unit for floating a substrate and conveying the substrate, and an applicator having a nozzle for applying a liquid to the substrate while being conveyed by the substrate conveying unit, A coating device, characterized in that a plurality of pumps for respectively feeding the liquid body to the nozzle are formed in the application section. The coating device according to claim 1, wherein a plurality of nozzles are formed in the coating portion. The coating device according to claim 2, wherein the pump is formed corresponding to each of the plurality of nozzles. The coating device according to claim 3, wherein a plurality of the nozzles are arranged along a substrate conveyance direction of the substrate conveyance portion. The coating device according to claim 1, wherein the liquid conveyance paths from each of the plurality of pumps to the nozzles have the same length. The coating device according to claim 4, wherein a plurality of the pumps are arranged at positions equal to each other with respect to the nozzle. The coating device according to claim 1, wherein a plurality of the pumps are provided in a frame portion for supporting the nozzles to freely move the nozzles. The coating device according to claim 7, wherein a plurality of the pumps are provided on an upstream side of the substrate conveyance direction in the frame portion. The coating device according to claim 7, wherein a plurality of the pumps are provided downstream of the substrate conveyance direction in the frame portion. The method of claim 7, wherein The frame portion has a girder member formed over the substrate transfer portion and a pillar member supporting the girder member, And a plurality of the pumps are attached to the girder member. 11. The applicator according to claim 10, wherein a plurality of said pumps are mounted in the central portion of the upper surface of said girder member. The method of claim 7, wherein The frame portion has a girder member formed over the substrate transfer portion and a pillar member supporting the girder member, A coating device in which a plurality of the pumps are attached to the pillar member of the frame portion. The method of claim 1, A pump frame portion for supporting a plurality of the pumps, And the pump frame portion is disposed in front of the substrate conveyance direction with respect to the nozzle. The said board | substrate conveyance part is formed facing the 1st stage apparatus which has a some gas blowing hole in the board | substrate mounting surface, and the said coating part, The some board | substrate is in any one of Claims 1-13, An application device comprising a second stage device having a gas blowing hole and a plurality of gas suction holes. The coating device according to any one of claims 1 to 13, further comprising a preliminary ejection section having a planar preliminary ejection surface to which the liquid body is applied from the applicator at the time of preliminary ejection of the applicator. A method of discharging a liquid conveyed by a pump from a nozzle while applying a substrate to a substrate and conveying the substrate to the substrate, Filling the liquid in a first pump connected to a nozzle for discharging the liquid; Bringing the substrate in front of the nozzle; Compressing the liquid body from the first pump to the nozzle to discharge the liquid body from the nozzle onto the substrate, and filling the liquid body in a second pump connected to the nozzle. Application method to make. The method of claim 16, Conveying the second substrate to the front surface of the nozzle, following the first substrate coated with the liquid; And pressing the liquid body from the second pump to the nozzle to discharge the liquid body from the nozzle onto the second substrate. 18. The coating method according to claim 17, wherein in the step of discharging the liquid body on the second substrate, the liquid is filled in the first pump. As a method of applying a liquid on the substrate while the substrate is floated and conveyed, Filling the liquid in a first pump connected to a first nozzle for discharging the liquid; Bringing the first substrate onto the front surface of the first nozzle; The liquid is pumped from the first pump to the first nozzle to discharge the liquid from the first nozzle onto the first substrate, and the liquid is transferred to a second pump connected to the second nozzle. Charging step, Bringing the second substrate onto the front surface of the second nozzle; And discharging the liquid body from the second pump to the second nozzle to discharge the liquid body from the second nozzle onto the second substrate.

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