JP5244446B2 - Coating device - Google Patents

Description

  The present invention relates to a coating apparatus.

  On a glass substrate constituting a display panel such as a liquid crystal display, fine patterns such as wirings, electrodes, and color filters are formed. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

  As an apparatus for applying a resist film on the surface of a substrate, there is known an application apparatus that fixes a slit nozzle and applies a resist to a glass substrate that moves under the slit nozzle (see, for example, Patent Document 1). For example, if the resist solidifies and adheres to the tip of the slit nozzle, the coating performance deteriorates, such as uneven coating. Therefore, it is necessary to clean the tip of the slit nozzle during maintenance.

The cleaning of the slit nozzle tip is usually performed by the operator manually wiping off foreign matter adhering to the slit nozzle tip. Since the slit nozzle is provided on the stage for transporting the substrate, conventionally, an operator climbs on the stage to access the slit nozzle.
Japanese Patent Laid-Open No. 2005-236092

  However, the stage is designed for transporting the substrate and is not supposed to be entered by an operator. For this reason, when an operator tries to work safely on the stage, the maintenance process becomes complicated. Further, when an operator climbs directly on the stage, there is a possibility that dust or dirt may adhere to the stage.

  In view of the circumstances as described above, an object of the present invention is to provide a coating apparatus capable of improving the efficiency of maintenance and preventing dust and dirt from adhering to the substrate transport section.

  In order to achieve the above object, a coating apparatus according to the present invention is a coating apparatus including a coating unit that applies a liquid material to a substrate while the substrate is transported by the substrate transport unit, and the coating unit includes the liquid material The substrate transport unit can change between a space forming state in which an operator entry space for accessing the nozzle is formed and a substrate transport state in which the substrate is transported. It has a mechanism.

  According to the present invention, the substrate transport unit can change the space forming state in which the worker entry space for accessing the nozzle for discharging the liquid material is formed and the substrate transport state for transporting the substrate. Since the mechanism is provided, it is possible to perform maintenance on the worker in the worker entry space by setting the substrate transport portion in a space forming state during nozzle maintenance. As a result, it is possible to prevent the operator from directly entering the substrate transfer unit, so that it is possible to improve the efficiency of maintenance and to prevent dust and dirt from adhering to the substrate transfer unit. it can.

In the coating apparatus, the changing mechanism is provided so as to be movable at least a part of the substrate transfer unit.
According to the present invention, since the changing mechanism is provided so that at least a part of the substrate transport unit can be moved, an operator entry space can be efficiently formed in the substrate transport unit by moving the part. Can do.

In the coating apparatus, the change mechanism is provided such that a part of the substrate transport unit and a remaining part of the substrate transport unit are relatively movable in the substrate transport direction.
According to the present invention, the change mechanism is provided so that the part of the substrate transport unit and the remaining part of the substrate transport unit can be moved relative to each other in the substrate transport direction. Can be formed efficiently in the substrate transfer section.

In the coating apparatus, a comb-like stage having a plurality of grooves in a plan view is provided as the part on the substrate carry-in side where the substrate is carried in the substrate carrying unit, and the comb teeth provided on the stage The dimension of the part in the transport direction is smaller than the dimension in the transport direction on the substrate carry-in side of the substrate transport unit.
According to the present invention, a comb-like stage is provided as a part in a plan view having a plurality of grooves on the substrate carry-in side where the substrate is carried in the substrate carrying unit, so that the substrate is placed on the substrate carrying unit. Easy to carry in. Also, since the dimension in the conveyance direction of the comb tooth portion provided on the stage is smaller than the dimension in the conveyance direction on the substrate carry-in side of the substrate conveyance unit, when the stage is moved, or the stage and the remaining part When the two are moved relatively, it is possible to avoid the stage protruding from the remaining portion. Thereby, even if it is a case where an operator entrance space is formed, a stage can be held stably.

The coating apparatus is characterized in that the substrate transport unit has a support mechanism that supports the part.
According to the present invention, since the substrate transport unit has the support mechanism for supporting a part, the part can be stably supported when the part moves.

The coating apparatus is characterized in that the changing mechanism is provided so that at least a part of the substrate transfer section can be deformed.
According to the present invention, since the changing mechanism is provided so that at least a part of the substrate transport unit can be deformed, the worker entry space is efficiently formed by deforming at least a part of the substrate transport unit. be able to.

In the coating apparatus, the change mechanism is provided so that a part of the substrate transport unit can be bent with respect to the remaining part of the substrate transport unit.
According to the present invention, since the changing mechanism is provided so that a part of the substrate transport part can be bent with respect to the remaining part of the substrate transport part, the worker entry space can be efficiently obtained by bending the part. Can be formed.

In the coating apparatus, the substrate transport unit includes a comb-like stage in a plan view having a plurality of grooves, and the comb-tooth portion in the plan view is moved to a predetermined position as the part. It is provided so that it can be collected.
According to the present invention, the substrate transport unit has a comb-like stage in a plan view having a plurality of grooves, and the comb-teeth portion of the stage is provided as a part so as to be gathered at a predetermined place in a plan view. Therefore, an operator entry space can be efficiently formed by gathering the comb-tooth portions of the stage together at a predetermined location.

The coating apparatus further includes an alignment mechanism that aligns a position between the part and the remaining part.
According to the present invention, since the alignment mechanism for aligning the position between the part and the remaining part is further provided, the shape of the substrate transfer unit is changed to the original shape when switching from the space forming state to the substrate transfer state. It is possible to prevent the shift.

In the coating apparatus, the substrate transport unit includes a coating region for coating the liquid material on the substrate, and the part is a substrate in the transport direction of the substrate with respect to the coating region in the substrate transport unit. It is a portion provided on at least one of the carry-in side and the substrate carry-out side.
If the state of the application area where the liquid material is applied to the substrate changes, the state of the liquid material applied on the substrate changes greatly, and the application state becomes unstable. According to the present invention, the substrate transport unit has a coating region for applying the liquid material to the substrate, and a part of the substrate transport unit is at least one of the substrate carry-in side and the substrate carry-out side in the substrate transport direction with respect to the coating region. Since it is a portion provided on one side, it is possible to avoid providing the worker entry space directly in the application region. Thereby, the application state can be stabilized.

In the coating apparatus, the coating unit is movable to at least one of a substrate carry-in side and a substrate carry-out side in the substrate carrying direction.
According to the present invention, since the coating unit is movable to at least one of the substrate carry-in side and the substrate carry-out side in the substrate transport direction, the coating unit is set to a desired position according to the formation position of the worker entry space. Can be moved to a position. Thereby, the maintenance efficiency can be further increased.

In the coating apparatus, a plurality of the coating units are provided.
According to the present invention, since a plurality of application portions are provided, nozzle maintenance is performed on the remaining application portions while, for example, one of the plurality of application portions is applying the liquid material. It can be carried out. Thereby, a processing tact can be shortened, a coating device having high coating performance and good maintainability can be obtained.

In the coating apparatus, a part of the plurality of coating units is provided to be movable toward the substrate carry-in side, and the rest is provided to be movable toward the substrate carry-out side.
According to the present invention, some of the plurality of coating units are provided so as to be movable toward the substrate carry-in side, and the rest are provided so as to be movable toward the substrate carry-out side. Maintenance of the nozzles can be performed simultaneously on both sides of the side and the substrate carry-out side. Thereby, the time required for maintenance can be shortened. In addition, since the maintenance can be performed by sharing the plurality of application units, the burden on the operator can be reduced. In this case, it is preferable to form worker entry spaces on the substrate carry-in side and the substrate carry-out side, respectively.

The coating apparatus further includes a management unit that manages the state of the nozzle on the substrate transport unit, and the management unit extends in the substrate transport direction across the part and the remaining part of the substrate transport unit. It is possible to move along at least one of the substrate carry-in side and the substrate carry-out side.
The liquid material discharged from the nozzle may adhere to the nozzle in a solidified state, and there is a possibility that the solidified liquid material may adhere to the substrate transport unit during maintenance of the nozzle by an operator. According to the present invention, the apparatus further includes a management unit that manages the state of the nozzles on the substrate transfer unit, the management unit extending over a part of the substrate transfer unit and the remaining part of the substrate transfer unit along the substrate transfer direction, and Since it is possible to move to at least one of the substrate carry-out sides, the management unit can be moved directly below the nozzle according to the position of the nozzle, so that foreign matters such as solidified liquid can be transferred to the substrate transfer unit. It can be prevented from adhering to the top. Furthermore, since there is a worker entry space, the management unit can be maintained in the same manner as the nozzle.

In the coating apparatus, the substrate transport unit further includes a levitation mechanism that levitates the substrate.
When an operator climbs directly onto the substrate transport unit and performs work, dust or dust easily adheres to the substrate transport unit. In the case where the substrate transport unit includes a levitation mechanism that levitates the substrate, the dust or dust may adhere to the substrate, which may degrade the quality of the substrate. According to the present invention, since it is not necessary for the operator to climb directly onto the substrate transport unit to perform work, it is possible to prevent dust and dirt from adhering to the substrate transport unit. Thereby, the deterioration of the quality of the substrate can be avoided.

  According to the present invention, the substrate transport unit can change the space forming state in which the worker entry space for accessing the nozzle for discharging the liquid material is formed and the substrate transport state for transporting the substrate. Since the mechanism is provided, it is possible to perform maintenance on the worker in the worker entry space by setting the substrate transport portion in a space forming state during nozzle maintenance. As a result, it is possible to prevent the operator from directly entering the substrate transfer unit, so that it is possible to improve the efficiency of maintenance and to prevent dust and dirt from adhering to the substrate transfer unit. it can.

[First Embodiment]
A first embodiment of the present invention will be described based on the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment.
As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In the coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so. In addition, the coating apparatus 1 includes a space forming state in which an operator entry space for an operator to access a nozzle (see FIG. 2 and the like) provided in the coating unit 3 is formed, and a substrate for transporting the substrate. A change mechanism 5 that can change the transport state is provided.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings. Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the drawing will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

The substrate carry-in area 20 is an area for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25 and a lift mechanism 26.
The carry-in stage 25 is provided at the center in the Y direction on the frame portion 24, and is a rectangular plate-like member made of, for example, SUS or the like in plan view. The carry-in stage 25 has a long X direction. The carry-in stage 25 is provided with a plurality of air ejection holes 25a and a plurality of elevating pin retracting holes 25b. The air ejection holes 25 a and the lifting pin retracting holes 25 b are provided so as to penetrate the carry-in stage 25.

  The air ejection holes 25a are holes for ejecting air onto the stage surface 25c of the carry-in side stage 25. For example, the air ejection holes 25a are arranged in a matrix in a plan view in a region of the carry-in side stage 25 through which the substrate S passes. An air supply mechanism 25e is connected to the air ejection hole 25a. The carry-in stage 25 and the air supply mechanism 25e are integrally provided. In the carry-in stage 25, the substrate S can be lifted in the + Z direction by the air ejected from the air ejection holes 25a.

  The elevating pin retracting hole 25b is provided in an area of the loading side stage 25 where the substrate S is loaded. The elevating pin retracting hole 25b is configured such that air supplied to the stage surface 25c does not leak out.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member provided in the long hole, and mechanically holds the substrate loaded into the loading side stage 25 from both sides.

  The lift mechanism 26 is provided on the back side of the substrate loading position of the loading stage 25. The lift mechanism 26 includes an elevating member 26a and a plurality of elevating pins 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by driving the driving mechanism. The plurality of elevating pins 26b are erected from the upper surface of the elevating member 26a toward the carry-in stage 25. Each raising / lowering pin 26b is arrange | positioned in the position which overlaps with said raising / lowering pin retracting hole 25b, respectively by planar view. As the elevating member 26a moves in the Z direction, each elevating pin 26b appears and disappears on the stage surface 25c from the elevating pin appearing hole 25b. Ends in the + Z direction of the lift pins 26b are provided so that their positions in the Z direction are aligned, so that the substrate S transported from the outside of the apparatus can be held in a horizontal state. .

  The frame portion 24 includes a frame side portion 24a disposed on the + X direction side, a frame side portion 24b disposed on the −X direction side, and a frame center portion 24c disposed on the center portion. A carry-in stage 25 is provided. The changing mechanism 5 is provided on the frame center portion 24c. The change mechanism 5 is, for example, a rail-like member provided along the X direction on the frame center portion 24c, and two change mechanisms 5 are provided in the Y direction. The change mechanism 5 is in a state of being fitted in a groove 25g provided on the lower surface 25f of the carry-in stage 25 (FIG. 4).

  The carry-in stage 25 is movable in the −X direction along the change mechanism 5. The carry-in stage 25 may be configured to be moved by an operator's hand, or may be configured to be automatically moved by attaching a drive mechanism (not shown), for example. As a drive mechanism, for example, it may be moved by a servo, positioning may be performed by an encoder (linear scale), and a limit sensor may be added. When the drive mechanism is attached, the drive mechanism and the rail-like member are included in the change mechanism 5. When the carry-in stage 25 moves in the −X direction, the carry-in stage 25 and the remaining part of the substrate transport unit 2 (the processing stage 27 and the carry-out stage) move relatively in the X direction. ing. 1 to 4, the entire carry-in stage 25 is supported on the frame center portion 24 c, and the substrate S can be transported. This state is a substrate transfer state in which the substrate is transferred.

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27. In addition, a plurality of grooves (not shown) are provided inside the processing stage 27 to give resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b. The plurality of grooves are connected to the air ejection holes 27a and the air suction holes 27b inside the stage.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. Therefore, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible.

  The substrate carry-out area 22 is a part where the substrate S coated with resist is carried out of the apparatus, and includes a carry-out stage 28 and a lift mechanism 29. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with an air ejection hole 28a and a lift pin retracting hole 28b. The lift mechanism 29 is provided on the back side of the substrate carry-out position of the carry-out stage 28 and is supported by the frame unit 24, for example. The lift member 29 a and the lift pin 29 b of the lift mechanism 29 have the same configuration as each part of the lift mechanism 26 provided in the substrate carry-in area 20. The lift mechanism 29 can lift the substrate S by lift pins 29b for transferring the substrate S when the substrate S on the unloading stage 28 is unloaded to an external device.

  The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven. The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. .

  The rail 23c is provided on the frame side portion 24a and extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28. The conveyor 23a can move along the respective stages by sliding the rail 23c.

(Applying part)
Next, the configuration of the application unit 3 will be described.
The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.

  The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 34. The moving mechanism 34 includes a rail member 35 and a drive mechanism 36. One rail member 35 is provided on each of the frame side portion 24a and the frame side portion 24b and extends in the X direction. The rail member 35 is provided so as to straddle the carry-in stage 25, the processing stage 27, and the carry-out stage 28. For this reason, the application unit 3 is movable along the rail member 35 across the carry-in stage 25, the processing stage 27, and the carry-out stage 28. The drive mechanism 36 is an actuator that is connected to the portal frame 31 and moves the application unit 3 along the rail member 35. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

  The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The support member 31a is provided with a moving mechanism (not shown), and the nozzle 32 held by the bridging member 31b is movable in the Z direction by the moving mechanism. The nozzle 32 is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 to move in the Z direction with respect to the bridging member 31b. On the lower surface of the bridging member 31b of the portal frame 31, a sensor that measures the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip 32c of the nozzle 32 and the facing surface facing the nozzle tip 32c. 33 is attached. For example, three sensors 33 are provided along the Y direction.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzle 32 so that the discharge amount of the resist (liquid material) discharged onto the substrate S is constant, and the −X direction side with respect to the coating unit 3 in the substrate transport unit 2. Is provided. The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores them, and a holding member 45 that holds the storage unit.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary ejection mechanism 41 is provided at a position closest to the nozzle 32 in a state where the coating unit 3 is disposed on the coating processing region 21. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device for rinsing and cleaning the vicinity of the opening 32a of the nozzle 32, and includes a cleaning mechanism (not shown) that moves in the Y direction and a moving mechanism (not shown) that moves the cleaning mechanism. This moving mechanism is provided on the −X direction side of the cleaning mechanism. The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided. In addition, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle washing | cleaning apparatus 43, it is not restricted to arrangement | positioning of this embodiment, Other arrangement | positioning may be sufficient.

  The dimension of the accommodating portion 44 in the Y direction is smaller than the distance between the support members 31a of the portal frame 31 so that the portal frame 31 can move in the X direction beyond the accommodating portion 44. . Further, the portal frame 31 can access the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 provided in the accommodating portion 44 so as to straddle these portions.

  The holding member 45 is connected to the management unit moving mechanism 46. The management unit moving mechanism 46 includes a rail member 47 and a drive mechanism 48. One rail member 47 is provided on each of the frame side part 24a and the frame side part 24b and extends in the X direction. Each rail member 47 is disposed between two rail members 35 connected to the portal frame 31 of the application unit 3. The rail member 47 is provided so as to straddle the carry-in stage 25, the processing stage 27, and the carry-out stage 28. For this reason, the management unit 4 is movable along the rail member 47 across the carry-in side stage 25, the processing stage 27, and the carry-out side stage 28. The drive mechanism 48 is an actuator that is connected to the holding member 45 and moves the management unit 4 along the rail member 47. Further, since each rail member 47 is disposed between the rail members 35, the management unit 4 moves so as to pass through the portal frame 31 of the application unit 3.

(Coating operation)
Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.
5-8 is a top view which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in region 20, a resist is applied in the coating treatment region 21 while the substrate S is floated and conveyed, and the substrate S coated with the resist is carried out from the substrate carry-out region 22. . In FIGS. 5 to 8, only the outlines of the portal frame 31 and the management unit 4 are indicated by broken lines so that the configurations of the nozzle 32 and the processing stage 27 can be easily distinguished. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is matched with the flying height position of the substrate, and the loading side stage 25 is also positioned. The air is ejected or sucked from the air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out stage 28, so that the air floats to the surface of each stage. Leave as supplied.

  In this state, for example, when the substrate S is transferred from the outside to the substrate carry-in position shown in FIG. 5 by a transfer arm (not shown), the elevating member 26a is moved in the + Z direction to move the elevating pin 26b from the elevating pin retracting hole 25b. Project to the surface 25c. By the operation of the elevating member 26a, the substrate S is lifted by the elevating pins 26b, and the substrate S is received. Further, an alignment member is projected from the long hole of the alignment device 25d to the stage surface 25c.

  After receiving the board | substrate S, the raising / lowering member 26a is lowered | hung and the raising / lowering pin 26b is accommodated in the raising / lowering pin retracting hole 25b. At this time, since the air layer is formed on the stage surface 25c, the substrate S is held in a state of being floated with respect to the stage surface 25c by the air. When the substrate S reaches the surface of the air layer, the alignment member 25d aligns the substrate S, and the vacuum pad 23b of the transfer device 23a disposed on the −Y direction side of the substrate loading position is used as the substrate. Vacuum adsorption is performed on the end portion of S in the −Y direction. FIG. 5 shows a state in which the −Y direction side end of the substrate S is adsorbed. After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transporter 23a is moved along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small.

  When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a. As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released, and the elevating member 29a of the lift mechanism 29 is moved in the + Z direction. Due to the movement of the elevating member 29a, the elevating pins 29b protrude from the elevating pin retracting holes 28b to the back surface of the substrate S, and the substrate S is lifted by the elevating pins 29b. In this state, for example, an external transfer arm provided on the + X direction side of the carry-out stage 28 accesses the carry-out stage 28 and receives the substrate S. After the substrate S is transferred to the transport arm, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 9, the gate frame 31 is moved in the −X direction to the position of the management unit 4 by the rail member 35.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted so that the tip of the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle tip 32 c is cleaned by the nozzle cleaning device 43. To do.

  After cleaning the nozzle tip 32 c, the nozzle 32 is accessed to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, while measuring the distance between the opening 32a and the preliminary discharge surface, the opening 32a at the tip of the nozzle 32 is moved to a predetermined position in the Z direction, and the nozzle 32 is moved in the −X direction. The resist is preliminarily discharged from the opening 32a.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip layer 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

(maintenance)
Next, the maintenance of the nozzle 32 will be described. In the present embodiment, cleaning of the nozzle 32 in the maintenance of the nozzle 32 will be described. Cleaning of the nozzle 32 is performed by an operator wiping off the nozzle 32 manually.

  When performing maintenance, the substrate transfer unit 2 is switched from the substrate transfer state to the space forming state. Hereinafter, the switching operation to the space formation state will be described. As shown in FIG. 11, the support base 60 is installed on the −X direction side of the frame center portion 24 c. The support base 60 is provided such that the dimension in the Y direction is at least larger than the dimension in the Y direction of the carry-in stage 25, and is installed in a range that covers the carry-in stage 25 in the Y direction. The dimension of the support base 60 in the Z direction is designed to be the same as the dimension of the frame central portion 24c in the Z direction. The support base 60 may be arranged in advance in any of the frame portions 24 and may be made to appear and disappear as necessary, or may be carried from the outside and installed.

  After the support base 60 is installed, the carry-in stage 25 is moved in the −X direction along the change mechanism 5 as shown in FIG. Due to the movement of the carry-in stage 25, a space 6 is formed between the + X direction end of the carry-in stage 25 and the coating processing stage 27. This space 6 becomes a worker entry space where a worker who accesses the nozzle 32 enters. Further, due to the movement of the loading side stage 25, the end portion in the −X direction of the loading side stage 25 protrudes from the frame portion 24 in the −X direction. The protruding portion is supported by the support base 60, and the entire carry-in stage 25 is stably supported. Thus, the state in which the worker entry space 6 is formed on the substrate transport unit 2 is a space forming state.

  After moving the carry-in side stage 25, as shown in FIG. 12, the worker P enters the worker entry space 6 formed on the frame central portion 24c. At this time, for example, when the management unit 4 is arranged on the worker entry space 6 and the worker P cannot enter the worker entry space 6, the management unit 4 is moved in the + X direction or the -X direction to perform work. A space is opened on the entrance space 6. After entering the worker entry space 6, the worker P accesses the nozzle 32 and performs the work of wiping the nozzle tip. Further, when the worker P cannot access the nozzle 32, for example, when the hand of the worker P does not reach the nozzle 32, the nozzle 32 is moved to a position where the hand of the worker P can reach. When wiping the nozzle tip, it is preferable to move the management unit 4 below the nozzle 32 in order to prevent the solidified resist from adhering to the substrate transport unit 2. The position of the nozzle 32 may be adjusted in advance before the worker P enters the worker entry space 6.

  After the work is completed, the worker P leaves the worker entry space 6. After the worker P leaves, the carry-in stage 25 is moved in the + X direction so that the carry-in stage 25 is returned to the position during substrate transfer. After returning the position of the carry-in stage 25, the support base 60 is removed or accommodated, and the coating apparatus 1 is returned to the substrate transport state. After the coating apparatus 1 is returned to the substrate transport state, the coating operation shown in FIGS.

  Thus, according to the present embodiment, the substrate transport unit 2 has a space forming state in which the worker entry space 6 for accessing the nozzle 32 is formed and a substrate transport state in which the substrate S is transported. Since the change mechanism 5 that can be changed is provided, the maintenance of the worker P can be performed in the worker entry space 6 by setting the substrate transport unit 2 in a space forming state when the nozzle 32 is maintained. As a result, it is possible to avoid the operator P from directly entering the carry-in side stage 25 of the substrate transport unit 2, so that the efficiency of maintenance can be improved and dust, dust, etc. on the substrate transport unit 2. Can be prevented.

  Further, according to the present embodiment, since the changing mechanism 5 is provided so as to be able to move at least the carry-in side stage 25 of the substrate transfer unit 2, the worker entry space 6 can be efficiently formed in the substrate transfer unit 2. Can do. Further, the change mechanism 5 is provided so as to be relatively movable in the X direction between the carry-in stage 25 of the substrate transport unit 2 and the remaining part of the substrate transport unit 2 (the processing stage 27 and the carry-out stage 28). Therefore, the worker entry space 6 can be efficiently formed in the substrate transport unit 2.

  Further, according to the present embodiment, the portion that can be moved by the changing mechanism 5 is the carry-in side stage 25 provided on the substrate carry-in side with respect to the coating treatment region 21 in the substrate transport unit 2. The operator entry space 6 can be formed without moving the processing region 21. Thereby, the change of the state of the application | coating process area | region 21 can be prevented, and an application state can be stabilized.

  Moreover, according to this embodiment, since the application part 3 was movable to at least one of + X direction and -X direction, the application part 3 was made desired according to the formation position of the worker entrance space 6. Can be moved to a position. Thereby, even when there is a variation in the reach of the worker P, the maintenance can be reliably performed.

  Further, according to the present embodiment, since the management unit 4 is movable in the X direction across the carry-in stage 25, the processing stage 27, and the carry-out stage 28, the management unit 4 is adjusted according to the position of the nozzle 32. 4 can be moved directly below the nozzle 32. Thereby, it is possible to prevent foreign matters such as a solidified resist from adhering to the substrate transport unit 2. In addition, when the worker entry space 6 is formed at a position overlapping the management unit 4 due to the movement of the carry-in stage 25, a space on the worker entry space 6 can be made by moving the management unit 4. .

[Second Embodiment]
Next, a second embodiment of the present invention will be described. Similar to the first embodiment, in the following drawings, the scale is appropriately changed to make each member a recognizable size. Moreover, about the component same as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. In the present embodiment, since the shape of the carry-in stage 25 is different from that of the first embodiment, this point will be mainly described.

FIG. 13A is a plan view showing the configuration of the coating apparatus 1 according to this embodiment. FIG. 13B is a front view showing a partial configuration of the coating apparatus 1 according to the present embodiment.
As shown to Fig.13 (a), in this embodiment, the shape of the carrying-in side stage 25 is a comb-tooth shape by planar view. Specifically, a plurality of groove portions 25b are provided in the carry-in stage 25, and the stage member 25i is provided independently so as to sandwich the groove portions 25b. In the groove 25b, when receiving the substrate S from the external transport mechanism, a part of the external transport mechanism can be accommodated, for example, a transport roller or the like can be disposed. The groove portion 25b is provided on almost the entire surface from the end portion in the −X direction toward the + X direction in the carry-in region of the substrate S of the carry-in stage 25, and a plurality of the groove portions 25b are provided in the Y direction.

  Further, as shown in FIG. 13A, the dimension in the X direction of the carry-in stage 25 is smaller than the dimension in the X direction of the frame center part 24c in the substrate carry-in area, and the −X direction of the frame part 24. Is configured to protrude beyond the −X direction end of the carry-in stage 25 toward the −X direction. The two rail-like change mechanisms 5 provided on the frame central portion 24 c are also provided up to the end portion in the −X direction of the central portion 24 c and are in a state of protruding from the carry-in stage 25. In such a configuration, the carry-in stage 25 is movable in the X direction along the change mechanism 5, and the carry-in stage 25 is moved by the movement to the remaining part of the substrate transport unit 2 (the processing stage 27 and the carry-out side). It moves relative to the stage 28).

  FIG. 13B shows a state where the carry-in stage 25 has moved to the −X direction end of the frame central portion 24c. As shown in the figure, an operator entry space 6 is formed between the carry-in stage 25 and the processing stage 27 in a state where the carry-in stage 25 has moved. Further, the entire carry-in stage 25 is supported by the end portion in the −X direction of the frame center portion 24c.

  Thus, according to this embodiment, since the carry-in stage 25 has a comb-like configuration in a plan view having a plurality of grooves 25b, it is easy to carry the substrate S onto the carry-in stage 25. Can do. In addition, since the dimension in the X direction of the carry-in stage 25 in which the groove 25b is formed is smaller than the dimension in the X direction of the substrate carry-in area in the substrate transport unit 2, the carry-in stage 25 is moved relatively. Even in this case, the entire carry-in stage 25 is supported by the frame center portion 24c. Thereby, even if it is a case where the worker entrance space 6 is formed, the carrying-in side stage 25 can be hold | maintained stably.

  In the present embodiment, the carry-in stage 25 is provided so as to be movable with respect to the remaining area of the substrate transport unit 2, and the X-direction dimension of the carry-in stage 25 is the frame center portion 24 c in the substrate carry-in area 20. However, the present invention is not limited to this. For example, the unloading stage 28 may be configured to be movable with respect to the remaining area of the substrate transfer unit 2. In addition, the X-direction dimension of the carry-out stage 28 may be smaller than the X-direction dimension of the frame central portion 24c in the substrate carry-out area 21. In this case, the operator entry space 6 is formed between the carry-out stage 28 and the processing stage 27 by moving the carry-out stage 28 in the + X direction. Even in this case, the same effect as described above can be obtained.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. Similar to the first embodiment, in the following drawings, the scale is appropriately changed to make each member a recognizable size. Moreover, about the component same as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. In the present embodiment, as in the second embodiment, the carry-in stage 25 is formed in a comb-like shape in plan view, but the configuration of the changing mechanism 5 is different from that in the second embodiment.

  FIG. 14A and FIG. 14B are plan views showing the configuration of the coating apparatus 1 according to this embodiment. As shown in these drawings, in the present embodiment, the carry-in stage 25 has a comb-like configuration in a plan view having the groove 25b, and the dimension in the X direction of the frame part 24 on the substrate carry-in region 20 side is as follows. The dimension of the carry-in stage 25 in the X direction is almost the same.

  In the present embodiment, a rail-like change mechanism 5 is provided along the Y direction on the frame central portion 24c, and each stage member 25i of the carry-in stage 25 can move independently on the change mechanism 5. Has been placed. In this configuration, the stage members 25 i can be gathered at one place in the Y direction in the substrate carry-in area 20. In FIG. 14B, the stage members 25i are brought together at the end in the + Y direction. In addition, for example, each stage member 25i can be brought together at the end in the −Y direction, or each stage member 25i can be brought together at the center in the Y direction. is there.

  As described above, according to the present embodiment, the change mechanism 5 is provided so as to be able to deform the carry-in side stage 25 of the substrate transfer unit 2 and further has a plurality of grooves 25b in a comb-like carry-in side stage in plan view. 25, the comb-teeth portion (each stage member 25i) in plan view is provided so as to be gathered at a predetermined location in the Y direction, so that the operator entry space 6 can be efficiently placed on the substrate transport unit 2. Can be formed.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described. Similar to the first embodiment, in the following drawings, the scale is appropriately changed to make each member a recognizable size. Moreover, about the component same as 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. In the present embodiment, the configuration of the carry-in stage 25 and the configuration of the change mechanism 5 are different from those of the first embodiment, and thus this point will be mainly described.

  FIG. 15 is a front view illustrating a partial configuration of the coating apparatus 1 according to the present embodiment. As shown in the figure, the + X direction end of the carry-in stage 25 is provided so as to be bent in the −Z direction. Specifically, a bent portion 25h is provided at the end portion in the + X direction of the carry-in stage 25, and the bent portion 25h is attached to the stage main body 25k of the carry-in stage 25 via the changing mechanism 5. ing. The change mechanism 5 includes, for example, a hinge mechanism having a rotation axis in the Y direction, and the bending portion 25h is bent in the −Z direction with the change mechanism 5 as an axis. In addition, in a state where the bent portion 25 h is bent, an operator entry space 6 is formed between the carry-in stage 25 and the processing stage 27.

  Thus, according to the present embodiment, the changing mechanism 5 is provided so that the bending portion 25h that is a part of the carry-in stage 25 can be bent with respect to the stage main body 25k that is the remaining part. Thus, an operator entry space can be formed. In the present embodiment, the rotation axis of the change mechanism 5 is set to the Y direction. However, the present invention is not limited to this, and for example, a configuration having a rotation axis in the X direction may be used. In addition, although the bending direction of the bending portion 25h is the -Z direction, a structure in which the bending portion 25h is bent in the + Z direction may be employed.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, as shown in FIG. 16, it may be configured to have an alignment mechanism for moving the carry-in stage 25 in the + X direction to return to the substrate transport state after the maintenance is completed. Specifically, as shown in the figure, a configuration is possible in which a convex portion 25j is provided on the end surface in the + X direction of the carry-in stage 25 and a concave portion 27j is provided on the end surface in the −X direction of the processing stage 27. In this configuration, inclined surfaces having the same angle are formed on the convex portions 25j and the concave portions 27j. When the carry-in stage 25 is moved, the position between the processing stage 27 can be accurately adjusted by fitting the convex portion 25j and the concave portion 27j so that the inclined surfaces coincide with each other.

  Moreover, in the said embodiment, although it was set as the structure provided with the one application part 3, it is not restricted to this, The structure which arrange | positions the application part 3 in multiple numbers may be sufficient. For example, FIG. 17 shows a configuration in which two application units 3 are provided (application unit 3a and application unit 3b). When providing a plurality of application parts, it is preferable to move a part of the application parts to the substrate carry-in area 20 side and move the remaining application parts to the substrate carry-out area 22 side. In FIG. 17, the application part 3a of the two application parts can be moved to the substrate carry-in area 20 side, and the application part 3b can be moved to the substrate carry-out area 22 side.

  In the above embodiment, the rail member 35 of the moving mechanism 34 and the rail member 47 of the moving mechanism 46 are provided on the upper surfaces of the side portions 24a and 24b of the frame 24. However, the present invention is not limited to this. For example, as shown in FIG. 21, a rail member 35 and a rail member 47 may be provided inside the side portions 24a and 24b of the frame 24, respectively.

  For example, in FIG. 18, the groove 24c and the groove 24d are provided along the X direction in the side portions 24a and 24b of the frame 24, the rail member 35 is provided in the groove 24c, and the rail member 47 is provided in the groove 24d. It has become. Further, the column member 31a is arranged on the rail 35 in a state where the end of the column member 31a of the application unit 3 in the −Z direction is inserted into the groove 24c, and the −Z direction of the holding member 45 of the management unit 4 The holding member 45 is disposed on the rail member 47 in a state in which the end portion thereof is inserted into the groove portion 24d.

  In FIG. 18, the dimension in the Z direction of the groove part 24c is larger than the dimension in the Z direction of the groove part 24d, but of course not limited to this. For example, the dimension in the Z direction of the groove part 24d is the groove part 24c. It may be larger than the dimension in the Z direction, and the dimension in the Z direction may be the same for the groove 24c and the groove 24d.

  Further, in the above embodiment, the entire configuration of the coating apparatus 1 is configured such that the transport mechanism 23 is disposed on the −Y direction side of each stage, but is not limited thereto. For example, the transport mechanism 23 may be arranged on the + Y direction side of each stage. Further, as shown in FIG. 19, the transport mechanism 23 (transport machine 23a, vacuum pad 23b, rail 23c) is arranged on the −Y direction side of each stage, and the same as the transport mechanism 23 on the + Y direction side. The transport mechanism 53 (the transport machine 53a, the vacuum pad 53b, and the rail 53c) having the configuration described above may be arranged so that different substrates can be transported by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the transport mechanism 23 transports the substrate S1, and the transport mechanism 53 transports the substrate S2. In this case, since the substrate can be alternately conveyed by the conveyance mechanism 23 and the conveyance mechanism 53, the throughput is improved. When transporting a substrate having an area about half that of the substrates S1 and S2, the transport mechanism 23 and the transport mechanism 53 hold the substrates one by one, for example, and the transport mechanism 23 and the transport mechanism 53 are held in the + X direction. Can be transferred simultaneously. With such a configuration, throughput can be improved.

  In the above embodiment, the coating apparatus 1 that floats and transports the substrate S has been described as an example. However, the present invention is not limited to this, and any coating apparatus that performs coating while transporting the substrate floats. The present invention can also be applied to a coating apparatus other than the transport type, such as a coating apparatus that transports a substrate by a transport mechanism such as a transport roller.

  In the above embodiments, the space 6 may be formed after the management unit 4 is first positioned and fixed below the tip 32c of the nozzle 32. Further, in each of the above embodiments, it is assumed that the application unit 3 is fixed and maintenance is performed, but the application unit 3 is first moved onto the carry-in stage 25 and below the nozzle 32c of the application unit 3. The operator P may perform the work after being positioned on the management unit 4. By positioning the management unit 4 below the nozzle 32 as described above, it is possible to prevent the carry-in stage 25, the processing stage 27, and the like from being contaminated even if the resist solidified material falls during maintenance.

  In the above embodiment, only the maintenance of the nozzle 32 in the worker entry space 6 has been described. However, the present invention is not limited to this. For example, the maintenance of the management unit 4 is performed in the worker entry space 6. It doesn't matter. Further, for example, by moving the application unit 3 to the + X direction side of the worker entry space 6 and moving the management unit 4 to the −X direction side of the worker entry space 6, for example, the worker first faces the + X direction. Maintenance of the application unit 3 can be performed, and then the management unit 4 can be maintained in the -X direction. Thereby, the maintenance efficiency of the coating device 1 can be improved.

The perspective view which shows the structure of the coating device which concerns on 1st Embodiment of this invention. The front view which shows the structure of the coating device which concerns on this embodiment. The top view which shows the structure of the coating device which concerns on this embodiment. The side view which shows the structure of the coating device which concerns on this embodiment. The figure which shows operation | movement of the coating device which concerns on this embodiment. FIG. FIG. FIG. FIG. FIG. The figure which shows the process of the maintenance of the coating device which concerns on this embodiment. The process drawing. The figure which shows the structure of the coating device which concerns on 2nd Embodiment of this invention. The figure which shows the structure of the coating device which concerns on 3rd Embodiment of this invention. The figure which shows the structure of the coating device which concerns on 4th Embodiment of this invention. The figure which shows the other structure of the coating device which concerns on this invention. The figure which shows the other structure of the coating device which concerns on this invention. The figure which shows the other structure of the coating device which concerns on this invention. The figure which shows the other structure of the coating device which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coating apparatus 2 ... Board | substrate conveyance part 3 ... Coating | coated part 4 ... Management part 5 ... Change mechanism 6 ... Worker entrance space 24 ... Frame part 24a, 24b ... Side part 25 ... Carry-in side stage 28 ... Carry-out side stage 31 ... Gate Mold frame 34 ... Moving mechanism 45 ... Holding member 46 ... Moving mechanism 60 ... Support stand P ... Worker

Claims (15)

A coating apparatus including a coating unit that applies a liquid material to the substrate while transporting the substrate by the substrate transport unit,
The application unit has a nozzle for discharging the liquid material,
The substrate transport unit includes a changing mechanism capable of changing a space forming state in which an operator entry space for accessing the nozzle is formed and a substrate transport state in which the substrate is transported. Coating device. The coating apparatus according to claim 1, wherein the changing mechanism is provided so as to be movable at least a part of the substrate transfer unit. The said change mechanism is provided so that a part of the said board | substrate conveyance part and the remaining part of the said board | substrate conveyance part can move relatively in the conveyance direction of the said board | substrate. The coating apparatus as described in. On the substrate carry-in side where the substrate is carried out of the substrate carrying unit , a plurality of stage members are arranged so as to sandwich the groove portions in the direction intersecting the carrying direction of the substrate as the part ,
4. The coating apparatus according to claim 2, wherein a dimension of the stage member in the transport direction is smaller than a dimension of the substrate transport unit on the substrate carry-in side in the transport direction. The substrate transport unit has a frame that supports the part,
The coating apparatus according to claim 2 , further comprising a support base that supports a portion of the portion that protrudes from the frame to the upstream side in the transport direction due to the movement . The coating apparatus according to claim 1, wherein the changing mechanism is provided so that at least a part of the substrate transfer unit can be deformed. The coating apparatus according to claim 6, wherein the changing mechanism is provided so that a part of the substrate transport unit can be bent with respect to the remaining part of the substrate transport unit. The substrate transport unit has a comb-like stage in a plan view having a plurality of grooves,
The coating device according to claim 6, wherein a comb-tooth portion of the stage in a plan view is provided so as to be gathered at a predetermined location as the portion. The coating apparatus according to claim 2, further comprising an alignment mechanism that aligns a position between the part and the remaining part. The substrate transport unit has an application region for applying the liquid material to the substrate,
The said part is a part provided in at least one side among the board | substrate carrying-in side and the said board | substrate carrying-out side of the said board | substrate conveyance direction with respect to the said application | coating area | region of the said board | substrate conveyance part. The coating device according to claim 9. The coating device according to any one of claims 1 to 10, wherein the coating unit is movable to at least one of a substrate carry-in side and a substrate carry-out side in the carrying direction of the substrate. . The applicator according to any one of claims 1 to 11, wherein a plurality of the applicators are provided. The coating apparatus according to claim 12, wherein a part of the plurality of coating units is provided to be movable toward the substrate carry-in side, and the rest is provided to be movable toward the substrate carry-out side. A management unit for managing the state of the nozzle on the substrate transport unit;
The management unit is movable to at least one of a substrate carry-in side and a substrate carry-out side along the substrate carrying direction over the part and the remaining part of the substrate carrying unit. The coating apparatus as described in any one of Claims 2-13. The coating apparatus according to claim 1, wherein the substrate transport unit further includes a floating mechanism that floats the substrate.

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