1353894 九、發明說明 【發明所屬之技術領域】 本發明係關於塗佈裝置及塗佈方法。 本發明根據2007年8月30日於日本提出申請之特願 2007-224692號專利申請案來主張優先權，於此處援用其 內容。 【先前技術】 於液晶顯示器等之構成顯示面板的玻璃基板上，被形 成配線圖案或電極圖案等細微的圖案。 —般而言這樣的圖案例如藉由光蝕刻等手法來形成。 在光蝕刻法，分別進行在玻璃基板上形成光阻膜的步 驟、圖案曝光此光阻膜的步驟，於其後進行顯影該光阻膜 的步驟。 作爲在基板之表面上塗佈光阻膜之裝置，已知有固定 狹縫噴嘴，對移動於該狹縫噴嘴下的玻璃基板塗佈光阻劑 之塗佈裝置。 其中已知有在台座上噴出氣體以使基板浮起移動之塗 佈裝置（例如參見專利文獻1 )。 [專利文獻1]日本專利特開2005 -23 6092號公報 【發明內容】 [發明所欲解決之課題] 然而，在台座上被噴出的氣體若被吹到噴嘴的話，會 -4- 1353894 發生噴嘴內的光阻劑的黏度增加，或者噴嘴內乾燥而成爲 塞住的原因。 有鑑於以上的情形，本發明之目的在於提供可以抑制 塗佈於基板的液狀體之高黏度化，抑制塗佈部之乾燥的塗 佈裝置及塗佈方法。 [供解決課題之手段]1353894 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a coating apparatus and a coating method. The present invention claims priority based on Japanese Patent Application No. 2007-224692, filed on Jan. [Prior Art] A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Such a pattern is generally formed by, for example, photolithography. In the photolithography method, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed. As a device for applying a photoresist film on the surface of a substrate, a coating device in which a slit nozzle is fixed and a photoresist is applied to a glass substrate which is moved under the slit nozzle is known. There is known a coating device which ejects gas on a pedestal to cause the substrate to float and move (see, for example, Patent Document 1). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-236092. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] However, if a gas ejected on a pedestal is blown to a nozzle, a nozzle will be generated -4- 1353894 The viscosity of the photoresist inside is increased, or the inside of the nozzle is dried to cause plugging. In view of the above, it is an object of the present invention to provide a coating apparatus and a coating method which can suppress the high viscosity of a liquid material applied to a substrate and suppress drying of the coating portion. [Means for solving the problem]
爲達成前述目的，相關於本發明之第1態樣（aspect) 之塗佈裝置，係具備：使基板浮起而搬送的基板搬送部、 及藉由該基板搬送部持續搬送而對前述基板塗佈液狀體的 塗佈部之塗佈裝置，其特徵爲：具備：被設置於前述塗佈 部，吐出前述液狀體之噴嘴、及前述基板搬送部之中在對 應於前述噴嘴的區域設置複數個，進行供使前述基板浮起 之用的氣體噴出之氣體噴出孔；前述噴嘴，係以在其前端 俯視時重疊的前述氣體噴出孔的數目成爲最少的方式被配 置。 根據此態樣，具備：被設於塗佈部吐出液狀體之噴嘴 ，及基板搬送部之中對應於噴嘴的區域內被設至複數供使 基板浮起之進行氣體噴出的氣體噴出孔；噴嘴係其前端以 俯視重疊的氣體噴出孔的數目成爲最小的方式被配置，所 以從氣體噴出孔直接吹到噴嘴的氣體的量被抑制於最小限 度。 藉此，可以抑制液狀體之高黏度化，可以抑制噴嘴的 乾燥 -5-In order to achieve the above object, a coating apparatus according to a first aspect of the present invention includes: a substrate transporting unit that transports a substrate and transports the substrate, and a substrate transporting unit that is continuously transported by the substrate transporting unit A coating apparatus for a coating portion of a liquid material, comprising: a coating unit provided in the coating unit, a nozzle for discharging the liquid material, and a substrate conveying unit disposed in a region corresponding to the nozzle A plurality of gas ejection holes for ejecting the gas for floating the substrate are disposed, and the nozzles are disposed such that the number of the gas ejection holes that overlap when viewed from the front end thereof is minimized. According to this aspect of the invention, the nozzle that discharges the liquid material in the application portion and the gas ejection hole that is provided in the region corresponding to the nozzle in the substrate transfer portion to discharge the plurality of substrates to eject the gas are provided; Since the number of nozzles whose front ends are overlapped in the plan view is minimized, the amount of gas directly blown from the gas discharge holes to the nozzle is suppressed to a minimum. Thereby, the high viscosity of the liquid can be suppressed, and the drying of the nozzle can be suppressed.
1353894 少的方式被配置。 根據此態樣，噴嘴係以在其前端俯視重疊的氣 孔及抽吸孔的數目成爲最少的方式被配置，所以由 出孔噴出的氣體以及由抽吸孔抽吸的氣體對噴嘴的 以抑制於最小限度。 藉此，可以抑制液狀體之高黏度化，可以抑制 乾燥。 前述之塗佈裝置，較佳者爲前述噴嘴，在俯視 置在離開前述氣體噴出孔及前述抽吸孔的位置。 根據此實施型態，噴嘴在俯視時被配置於離開 出孔及抽吸孔的位置，所以由氣體噴出孔吹到噴嘴 的氣體的影響以及由抽吸孔抽吸的氣體的影響可以 最小限度。 藉此，可以更確實地抑制液狀體之高黏度化， 確實地抑制噴嘴的乾燥。 本發明之相關於第3態樣之塗佈裝置，係具備 板浮起而搬送的基板搬送部、及藉由該基板搬送部 送而對前述基板塗佈液狀體的塗佈部之塗佈裝置， 爲：具備：被設置於前述塗佈部，吐出前述液狀體 、及前述基板搬送部之中在對應於前述噴嘴的區域 數個，進行供使前述基板浮起之用的氣體噴出之氣 孔、以及在前述基板搬送布之中對應於前述噴嘴的 置複數個，進行抽吸之抽吸孔；前述噴嘴，其前端 於前述氣體噴出孔及前述抽吸孔所導致的影響最少 體噴出 氣體噴 影響可 噴嘴的 時被配 氣體噴 的前端 抑制於 可以更 =使基 持續搬 其特徵 之噴嘴 設置複 體噴出 部分設 被配置 的位置 -8- 1353894 根據此態樣，因爲噴嘴係被設置在其前端所受到氣體 噴出孔及抽吸孔所導致的影響變成最少的位置，所以可以 確實抑制起因於氣體噴出孔及抽吸孔所導致的影響之液狀 體的高黏度化及噴嘴的乾燥。 前述第1、第2及第3態樣之塗佈裝置，較佳者爲前 述噴嘴的前端，沿著交叉於前述基板的搬送方向之方向設 爲狹縫狀。 噴嘴的前端沿著交叉於基板的搬送方向之方向設爲狹 縫狀的場合，氣體的影響透過狹縫會及於噴嘴的內部。 根據此實施型態的話，該氣體的影響被抑制於最小限 度，所以可確實抑制液狀體的高黏度化及噴嘴的乾燥。 前述第1、第2及第3態樣之塗佈裝置，較佳者爲在 前述噴嘴的前端，設置吐出前述液狀體之複數吐出部，前 述複數吐出部，係沿著交叉於前述基板的搬送方向之方向 排列的。 於噴嘴的前端設置吐出液狀體的複數吐出部，而複數 吐出部沿著交叉於基板的搬送方向之方向排列著的場合’ 氣體的影響透過狹縫會及於噴嘴的內部。 根據此實施型態的話，該氣體的影響被抑制於最小限 度，所以可確實抑制液狀體的高黏度化及噴嘴的乾燥。 相關於本發明之塗佈方法’係以基板搬送部使基板浮 起持續搬送而藉由噴嘴於前述基板上塗佈液狀體之塗佈方 法，其特徵爲：在前述基板搬送部之中對應於前述噴嘴的 -9- 1353894 面圖、圖4係塗佈裝置1之側面圖。 參照這些圖，說明塗佈裝置1之詳細構成。 (基板搬送部） 首先，說明基板搬送部2之構成》 基板搬送部2，具有基板搬入區域20'塗佈處理區域 21、基板搬出區域22、搬送機構23、及支撐這些之框架 部24。 在此基板搬送部2，基板S藉由搬送機構23依序被 搬送往基板搬入機構20、塗佈處理區域21及基板搬出區 域22。 基板搬入區域20、塗佈處理區域21及基板搬出區域 2〇 ’係由基板搬送方向之上游側往下游側一此順序排列著 〇 搬送機構23，以跨過基板搬入區域20、塗佈處理區 域21及基板搬出區域22的各部的方式設於該各部之一側 〇 以下’於說明塗佈裝置1的構成時，爲了標示的簡化 ’使用XYZ座標系來說明圖中的方向。 基板搬送部2之長邊方向且爲基板之搬送方向標示爲 X方向》 俯視直交於X方向（基板搬送方向）的方向標示爲γ 方向。 垂直於包含X方向軸及Y方向軸的平面之方向標示 -11 - 1353894 爲z方向。 又，X方向、方向及z方向分別以圖中的箭頭方向爲 正（+)方向，與箭頭相反的方向爲負（-)方向。 基板搬入區域20，係搬入從裝置外部搬送而來的基 板S的部位，具有搬入側台座25、與抬升機構26 ^ 搬入側台座25被設於框架部24的上部，例如由SUS 等所構成的俯視爲矩形的板狀構件。 此搬入側台座25，X方向爲長邊方向。 於搬入側台座25，設有複數升降栓出沒孔25b。 這些空氣噴出孔25a及升降栓出沒孔25b，以貫通搬 入側台座25的方式設置。 空氣噴出孔25a，係對搬入側台座25之台座表面25c 上噴出氣體之孔，例如在被配置於搬入側台座25之中基 板S通過的區域上俯視配置爲矩陣狀。 於此空氣噴出孔25 a被連接著未圖示之空氣供給源。 在此搬入側台座25，藉由從空氣噴出孔25a噴出的 空氣可以使基板S往+Z方向浮起。 升降栓出沒孔25b，設於搬入側台座25之中基板S 被搬入的區域。 該升降栓出沒孔25b，係使對台座表面25c供給的空 氣不漏出之構成。 此搬入側台座25之中於Y方向之兩端部，分別設置 1個對準裝置25d。1353894 Less way is configured. According to this aspect, the nozzle is disposed in such a manner that the number of the air holes and the suction holes that overlap in the front end of the nozzle is minimized, so that the gas ejected from the outlet hole and the gas sucked by the suction hole are suppressed to the nozzle. Minimal. Thereby, the high viscosity of the liquid can be suppressed, and drying can be suppressed. In the above coating apparatus, preferably, the nozzle is disposed at a position apart from the gas ejection hole and the suction hole in plan view. According to this embodiment, the nozzle is disposed at a position away from the outlet hole and the suction hole in plan view, so that the influence of the gas blown to the nozzle by the gas discharge hole and the influence of the gas sucked by the suction hole can be minimized. Thereby, the high viscosity of the liquid material can be more reliably suppressed, and the drying of the nozzle can be surely suppressed. In the coating apparatus according to the third aspect of the present invention, the substrate transporting unit that transports the sheet is transported, and the coating portion of the substrate coating liquid is applied by the substrate transport unit. The device is provided in the application unit, and discharges the liquid material and the substrate transfer unit in a plurality of regions corresponding to the nozzles, and ejects a gas for floating the substrate. a gas hole, and a suction hole for sucking a plurality of the nozzles corresponding to the plurality of nozzles in the substrate transfer cloth; and the nozzle has a front end of the gas discharge hole and the suction hole to affect a minimum of gas ejection When the spray affects the nozzle, the front end of the gas spray is suppressed to a position where the nozzle can be configured to continuously move the nozzle. The position of the split portion is set to be arranged. -8 - 1353894 According to this aspect, since the nozzle system is set at The influence of the gas ejection hole and the suction hole at the front end becomes the minimum position, so that the influence caused by the gas ejection hole and the suction hole can be surely suppressed. High viscosity of the liquid and drying of the nozzle. Preferably, the coating apparatus of the first, second, and third aspects is a tip end of the nozzle, and is formed in a slit shape along a direction crossing the conveying direction of the substrate. When the tip end of the nozzle is formed in a slit shape in a direction intersecting the conveying direction of the substrate, the influence of the gas is transmitted through the slit to the inside of the nozzle. According to this embodiment, the influence of the gas is suppressed to a minimum, so that it is possible to surely suppress the high viscosity of the liquid and the drying of the nozzle. Preferably, in the coating device of the first, second, and third aspects, a plurality of discharge portions for discharging the liquid material are provided at a tip end of the nozzle, and the plurality of discharge portions are formed along the substrate. Arranged in the direction of the transport direction. When a plurality of discharge portions for discharging the liquid material are provided at the tip end of the nozzle, and the plurality of discharge portions are arranged in a direction intersecting the conveyance direction of the substrate, the influence of the gas is transmitted through the slit to the inside of the nozzle. According to this embodiment, the influence of the gas is suppressed to a minimum, so that it is possible to surely suppress the high viscosity of the liquid and the drying of the nozzle. The coating method according to the present invention is a method of applying a liquid material by spraying a substrate on a substrate by a substrate transfer unit, and applying a liquid material to the substrate by a nozzle, wherein the substrate transfer unit corresponds to the substrate transfer unit. FIG. 4 is a side view of the nozzle 1 and FIG. 4 is a side view of the coating apparatus 1. The detailed configuration of the coating device 1 will be described with reference to these figures. (Substrate transport unit) First, the structure of the substrate transport unit 2 will be described. The substrate transport unit 2 includes a substrate carry-in area 20' coating processing area 21, a substrate carry-out area 22, a transport mechanism 23, and a frame portion 24 that supports these. In the substrate transfer unit 2, the substrate S is sequentially transported to the substrate loading mechanism 20, the coating processing region 21, and the substrate carry-out region 22 by the transport mechanism 23. The substrate carrying-in region 20, the coating processing region 21, and the substrate carrying-out region 2' are arranged in this order from the upstream side to the downstream side in the substrate transporting direction, so as to straddle the substrate carrying-in region 20 and the coating processing region. 21 and the respective portions of the substrate carrying-out region 22 are provided in the side of each of the respective portions. When the configuration of the coating device 1 is described, the direction in the drawing will be described using the XYZ coordinate system for the sake of simplicity of the labeling. In the longitudinal direction of the substrate transport unit 2, the transport direction of the substrate is indicated by the X direction. The direction orthogonal to the X direction (substrate transport direction) is indicated as the γ direction. The direction perpendicular to the plane containing the X-axis and the Y-axis is -11 - 1353894 in the z direction. Further, the X direction, the direction, and the z direction are the positive (+) direction in the direction of the arrow in the figure, and the negative (-) direction in the opposite direction to the arrow. The substrate loading area 20 is a portion where the substrate S conveyed from the outside of the apparatus is carried, and the loading side pedestal 25 and the lifting mechanism 26 are mounted on the upper portion of the frame portion 24, for example, made of SUS or the like. A plate-shaped member that is rectangular in plan view. The loading side pedestal 25 has a longitudinal direction in the X direction. The loading and unloading hole 25b is provided in the loading side pedestal 25. These air ejection holes 25a and the lifting/lowering hole 25b are provided so as to penetrate the loading side pedestal 25. The air ejection hole 25a is a hole in which a gas is ejected from the pedestal surface 25c of the loading-side pedestal 25, and is arranged in a matrix shape in a plan view, for example, in a region where the substrate S passes through the loading-side pedestal 25. The air ejection hole 25a is connected to an air supply source (not shown). Here, the loading side pedestal 25 can float the substrate S in the +Z direction by the air ejected from the air ejection hole 25a. The lift pin exit hole 25b is provided in a region where the substrate S is carried in the carry-in side pedestal 25. The elevating pin is provided with the hole 25b so that the air supplied to the pedestal surface 25c does not leak. One of the alignment means 25d is provided at each of the two sides of the loading-side pedestal 25 in the Y direction.
對準裝置25d，係對準被搬入搬入側台座25的基板S -12- 1353894 的位置之裝置。 各對準裝置25 d具有長孔與設於該長孔內的位置對準 構件，由兩側機械性地挾持被搬入搬入台座25的基板。 抬升機構26，設於搬入側台座25之基板搬入位置之 內面側。 此抬升機構26，具有升降構件26a，及複數之升降栓 26b ° 升降構件26a，被連接於未圖示之驅動機構，藉由該 驅動機構的驅動使升降構件26a移動於Z方向。 複數之升降栓26b，由升降構件26a之上面往搬入側 台座25立起設置。 各升降栓26b，分別被配置於俯視重疊於前述升降栓 出沒孔2 5 b的位置。 升降構件2 6a藉由移動於Z方向，使各升降栓2 6b由 升降栓出沒孔25b出沒於台座表面25c上。 各升降栓26b之+Z方向的端部分別之位置排列整齊 於Z方向上，使由裝置外部搬送而來的基板s可以保持於 水平的狀態。 塗佈處理區域2 1，係進行光阻劑的塗佈之部位，設 有使基板S浮起支撐之處理台座27。 處理台座27，係台座表面27c例如以硬質的耐酸鋁 (alumite )爲主成分之吸光材料所覆蓋之俯視爲矩形的 板狀構件，對搬入側台座25設於+X方向側。 在處理台座27之中以光吸收材料覆蓋的部分，抑制 -13- 1353894 雷射光等光之反射。 此處理台座27，Y方向爲長邊方向。 處理台座27之Y方向的尺寸，與搬入側台座25之Y 方向的尺寸幾乎相同。 處理台座27，設有對台座表面27c噴出空氣之複數 空氣噴出孔27a、及抽吸台座表面27c上的空氣之複數空 氣抽吸孔27b。 這些空氣噴出孔27a及抽吸孔27b，以貫通處理台座 27的方式設置。 此外，於處理台座27的內部，設有複數供對通過空 氣噴出孔27a及空氣抽吸孔27b之氣體的壓力賦予阻力之 用的未圖示之溝。 此複數之溝，於台座內部被連接於空氣噴出孔27a及 空氣抽吸孔27b。 在處理台座27，空氣噴出孔27a之間距比被設於搬 入側台座2 5的空氣噴出孔2 5 a的間距更窄，與搬入側台 座25相比空氣噴出孔27a被設爲較密。 因此，在此處理台座27與其他之台座相比可以高精 度地調節基板的浮起量，基板之浮起量例如控制在爲100 以下，較佳者爲50#111以下。 基板搬出區域22，係把塗佈光阻劑的基板S往裝置 外部搬出的部位，具有搬出側台座28、與抬升機構29。 此搬出側台座2 8，對處理台座2 7設於+Χ方向側， 由與被設於基板搬入區域20的搬入側台座25幾乎相同的 -14 - 1353894 材質、尺寸所構成。 於搬出側台座28’與搬入側台座25同樣，設有空氣 噴出孔28a與升降栓出沒孔28b。 升降機構29設於搬出側台座28之基板搬出位置的表 面側，例如支撐於框架部2 4。 升降機構29的升降構件29a及升降栓2 9b，成爲與 被設於基板搬入區域2〇的抬升機構26之各部位相同的構 成。 此抬升機構29，在將搬出側台座28上的基板S往外 部裝置搬出時’因爲供基板S之交付接收之用而可以藉由 升降栓29b抬起基板S。 搬送機構23 ’具有搬送機23a、真空襯塾（pad)23b、 軌道23c 。 搬送機23 a爲內部設有例如線性馬達的構成，藉由該 線性馬達進行驅動，搬送機23a可移動於軌道23c上。 此搬送機23a以特定的部分23d俯視重疊於基板S 之-Y方向端部的方式被配置。 重疊於此基板S的部分2 3d，被設於比使基板S浮起 時之基板內面的高度位置更低的位置。 真空襯墊23b係被複數排列於搬送機23a之中重疊於 前述基板S的部分23d。 此真空襯墊23 b，具有真空吸附基板S之吸附面，以 該吸附面朝向上方的方式被配置。 真空襯墊23b，藉由吸附面吸附基板S之內面端部而 -15- 1353894 可以保持該基板s。 各真空襯墊23b，可以調整由搬送機23a之上面起算 的高度位置，例如可因應於基板S之浮起量而使真空襯墊 23b之高度位置上下調整。 軌道23c，於搬入側台座25、處理台座27以及搬出 側台座28之側方向跨過各台座而延伸，藉由使該軌道 23c滑動可以使搬送機23a沿著各該台座移動。 (塗佈部） 其次，說明塗佈部3之構成。 塗佈部3，係在基板S上塗佈光阻劑之部門，具有門 形框架31、及噴嘴32。 門形框架3 1，具有支柱構件3 1 a，及架橋構件3 1 b， 使處理台座27以跨Y方向的方式設置。 支柱構件31a，於處理台座27之Y方向側1個個地 被設置，各支柱構件3 1 a於框架部24之Y方向側之兩側 面分別被支撐。 各支柱構件31a以上端部的高度位置排列整齊的方式 被設置。 架橋構件3 1b被架橋於各支柱構件31a的上端部之間 ，可對該支柱構件3 1 a升降。 此門形框架31被連接於移動機構31c可於X方向上 移動。 藉由此移動機構31c門形框架31可在與管理部4之 -16- 1353894 部。 對基板S進行光阻劑R的塗佈時，藉由被安裝於架 橋構件31b的2個雷射感測器33測定基板S的Y方向之 兩端部分別之浮起量。 由雷射射出部朝向基板S射出雷射光，在基板S的表 面雷射光被反射而射入雷射光受光部。 處理台座27的台座表面2 7c係以光吸收材料之硬質 耐酸鋁（alum ite )所覆蓋，所以雷射光不會在台座表面 2 7c反射，僅有在基板S的表面反射的光入射至雷射受光 部。 被形成光阻劑膜R的基板S，藉由搬送機23a往搬出 側台座2 8搬送。 在搬出側台座28，在對台座28c浮起的狀態’基板 被搬送至圖9所示之基板搬出位置。 基板S到達基板搬出位置後，解除真空襯墊23b之吸 附，使抬升機構29之升降構件29a移動於+Z方向。 如此一來，升降栓29b由升降栓出沒孔28b往基板S 之內面突出，基板S藉由升降栓2 9b而抬起。 在此狀態，例如被設於搬出側台座2 8的+x方向側的 外部之搬送臂存取操作於搬出側台座28 ’收受基板S。 將基板S遞給搬送臂後，使搬送機23a再度回到搬入 側台座25之基板搬入位置，等待下一個基板S被搬送來 〇 在下一個基板S被搬送來之前’在塗佈部3進行供保 -23- 1353894 在浸泡槽42，藉由使噴嘴32的開口部32a暴露於被 貯留在浸泡槽42的稀釋劑（thinner)或光阻劑之蒸汽氣氛 中以防止噴嘴32的乾燥。 此外，亦可以因應需要，而在比塗佈部3更往基板S 的搬送方向的上游側，以對塗佈部不接觸的狀態下設置檢 測基板S上的異物之異物檢測機構。 藉由此檢測機構，可以檢測基板S上的異物。 此外，例如在維修等時候取下塗佈部3時也沒有取下 該異物檢測機構的必要，可避免重新設定該異物檢測機構 之繁雜。 本發明之技術範圍並不以前述實施型態爲限定，在不 逸脫本發明的趣旨的範圍可加以適當變更。 真對塗佈裝置1之全體構成，在前述實施型態，係將 搬送機構23配置於各台座之-Y方向側之構成，但並不以 此爲限。 例如，亦可以將搬送機構23配置於各台座之+Y方向 側。 此外，如圖12所示，於各台座之-Y方向側配置前述 之搬送機構23(搬送機23a、真空襯墊（pad)23b、軌道 23c )，於+Y方向側配置與該搬送機構23相同的構成的 搬送機構53(搬送機53a、真空襯墊（pad)53b、軌道53c )，以搬送機構23與搬送機構53搬送部同的基板的方式 構成亦可。 例如，如該圖所示可以於搬送機構23搬送基板S 1， -25- 1353894 而於搬送機構53搬送基板S2。 在此場合，因爲可以藉搬送機構23與搬送機構53 互搬送基板，所以可提高生產率。 此外，在搬送具有前述基板S、SI、S2之一半程度 面積之基板的場合，例如以搬送機構23與搬送機構53 別保持1枚基板，而使搬送機構23與搬送機構53並行 進於+X方向，可以同時搬送2枚基板。 藉由這樣的構成，可以提高生產率。 此外，在前述實施型態，例如圖5 B所示噴嘴前 32c是以俯視重疊在各孔的中央部的方式被配置之構成 但並不以此爲限，例如以位在列之間（例如圖5 B之右 第3列與中央列之間等等）的方式配置噴嘴前端32c亦 〇 此外，在前述實施型態，例如圖5A及圖5B所示 空氣噴出孔27 a及空氣抽吸孔2 7b之間隔爲均一（等間 )’但是並不以此爲限，例如重疊於噴嘴3 2的區域（ 5A及圖5B以虛線包圍的區域），與其他的區域相比以 氣噴出孔27a及空氣抽吸孔27b之間隔變大的方式構成 可。 此外’在前述實施型態，係噴嘴前端32c以俯視重 的空氣噴出孔27a的個數成爲最少的方式配置噴嘴的構 ’但並不以此爲限，噴嘴前端3 2c俯視重疊的空氣噴出 27a及空氣抽吸孔27b之雙方個數成爲最少的方式來配 噴嘴32的構成，會使空氣的影響更少，所以更佳。 交 的 分 八 刖 端 起 可 ， 距 圖 空 亦 疊 成 孔 置 -26-The alignment device 25d is a device that is aligned with the position of the substrate S -12 - 1353894 that is carried into the loading-side pedestal 25. Each of the alignment devices 25d has a long hole and a positioning member provided in the long hole, and mechanically holds the substrate loaded into the loading base 25 from both sides. The lifting mechanism 26 is provided on the inner surface side of the substrate loading position of the loading-side pedestal 25. The lifting mechanism 26 includes an elevating member 26a and a plurality of lifting bolts 26b. The elevating member 26a is connected to a driving mechanism (not shown), and the elevating member 26a is moved in the Z direction by the driving of the driving mechanism. The plurality of lifting bolts 26b are erected by the upper surface of the elevating member 26a toward the loading side pedestal 25. Each of the lift pins 26b is disposed at a position overlapping the lift pin exit hole 25b in plan view. The elevating member 26a is moved in the Z direction so that the elevating pins 26b are ejected from the elevating hole 25b on the pedestal surface 25c. The positions of the end portions of the lift pins 26b in the +Z direction are aligned in the Z direction, so that the substrate s conveyed from the outside of the apparatus can be maintained in a horizontal state. The coating treatment region 21 is a portion where the photoresist is applied, and a processing pedestal 27 for supporting the substrate S is provided. In the processing pedestal 27, the pedestal surface 27c is, for example, a rectangular plate-like member which is covered by a light-absorbing material containing a hard alumite as a main component, and is disposed on the +X direction side of the loading-side pedestal 25. The portion of the processing pedestal 27 covered with the light absorbing material suppresses reflection of light such as -13-1353894 laser light. In this processing pedestal 27, the Y direction is the long side direction. The size of the processing pedestal 27 in the Y direction is almost the same as the size of the loading side pedestal 25 in the Y direction. The processing pedestal 27 is provided with a plurality of air ejection holes 27a for ejecting air to the pedestal surface 27c, and a plurality of air suction holes 27b for sucking air on the pedestal surface 27c. These air ejection holes 27a and suction holes 27b are provided so as to penetrate the processing base 27. Further, inside the processing pedestal 27, a plurality of grooves (not shown) for imparting resistance to the pressure of the gas passing through the air ejection holes 27a and the air suction holes 27b are provided. The plurality of grooves are connected to the air ejection hole 27a and the air suction hole 27b inside the pedestal. In the processing pedestal 27, the distance between the air ejection holes 27a is narrower than the distance between the air ejection holes 25a provided in the loading-side pedestal 25, and the air ejection hole 27a is made denser than the loading-side pedestal 25. Therefore, the processing pedestal 27 can adjust the amount of floating of the substrate with higher precision than the other pedestals, and the amount of floating of the substrate is controlled to be 100 or less, preferably 50#111 or less. The substrate carrying-out area 22 is a portion where the substrate S coated with the photoresist is carried out to the outside of the apparatus, and has a carry-out side pedestal 28 and a lifting mechanism 29. The carry-out pedestal 2, 8 is disposed on the +Χ direction side of the processing pedestal 27, and is composed of a material and a size of -14 - 1353894 which are almost the same as the loading-side pedestal 25 provided in the substrate loading area 20. Similarly to the carry-in side pedestal 25, the carry-out side pedestal 28' is provided with an air ejection hole 28a and a lift pin exit hole 28b. The elevating mechanism 29 is provided on the surface side of the substrate carrying-out position of the carry-out side pedestal 28, and is supported by the frame portion 24, for example. The elevating member 29a and the elevating pin 29b of the elevating mechanism 29 are configured in the same manner as the respective portions of the elevating mechanism 26 provided in the substrate carrying-in area 2A. When the substrate S on the carry-out pedestal 28 is carried out to the external device, the lift mechanism 29 can lift the substrate S by the lift pin 29b because the substrate S is delivered and received. The conveying mechanism 23' has a conveyor 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided, and the linear motor is driven, and the conveyor 23a can be moved on the rail 23c. This conveyor 23a is disposed so that the specific portion 23d overlaps the end portion of the substrate S in the -Y direction. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the inner surface of the substrate when the substrate S is floated. The vacuum pad 23b is plurally arranged in a portion 23d of the conveyor 23a which is superposed on the substrate S. The vacuum liner 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23b can hold the substrate s by adsorbing the inner end portion of the substrate S by the adsorption surface -15 - 1353894. Each of the vacuum pads 23b can adjust the height position from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends across the pedestals in the side of the loading side pedestal 25, the processing pedestal 27, and the unloading side pedestal 28. By sliding the rail 23c, the conveyor 23a can be moved along each of the pedestals. (Coating portion) Next, the configuration of the coating portion 3 will be described. The coating unit 3 is a department in which a photoresist is applied onto a substrate S, and has a gate frame 31 and a nozzle 32. The gantry frame 3 1 has a strut member 3 1 a and a bridging member 3 1 b such that the processing pedestal 27 is disposed across the Y direction. The pillar members 31a are provided one by one on the Y-direction side of the processing pedestal 27, and each of the pillar members 31a is supported on both sides of the frame portion 24 on the Y-direction side. The height positions of the upper end portions of the respective strut members 31a are arranged in a neat manner. The bridge member 31b is bridged between the upper end portions of the respective strut members 31a, and the strut members 31a can be raised and lowered. The gate frame 31 is coupled to the moving mechanism 31c to be movable in the X direction. By means of the moving mechanism 31c, the gantry 31 can be in the section from the management section 4 - 16 - 1353894. When the substrate S is coated with the photoresist R, the amount of floating of the both ends of the substrate S in the Y direction is measured by the two laser sensors 33 attached to the bridge member 31b. The laser light is emitted from the laser emitting portion toward the substrate S, and the surface of the substrate S is reflected by the laser light and is incident on the laser light receiving portion. The pedestal surface 27c of the processing pedestal 27 is covered with a hard alumite of the light absorbing material, so that the laser light is not reflected on the pedestal surface 27c, and only the light reflected on the surface of the substrate S is incident on the laser. Light receiving department. The substrate S on which the photoresist film R is formed is transported to the carry-out side pedestal 28 by the transporter 23a. In the state in which the detachment side pedestal 28 is lifted and the pedestal 28c is floated, the substrate is transported to the substrate carry-out position shown in Fig. 9 . After the substrate S reaches the substrate carrying-out position, the vacuum pad 23b is released from the suction, and the lifting member 29a of the lifting mechanism 29 is moved in the +Z direction. As a result, the lift pin 29b protrudes from the lift pin exit hole 28b toward the inner surface of the substrate S, and the substrate S is lifted by the lift pin 29b. In this state, for example, the outer transfer arm of the carry-out side pedestal 28 on the +x direction side is operated by the transfer side pedestal 28' to receive the substrate S. After the substrate S is transferred to the transfer arm, the conveyor 23a is returned to the substrate loading position of the loading-side pedestal 25, and the next substrate S is conveyed and transported to the coating unit 3 before the next substrate S is transported. -23-3353894 In the immersion tank 42, the drying of the nozzle 32 is prevented by exposing the opening portion 32a of the nozzle 32 to a vapor atmosphere of a thinner or a photoresist which is stored in the immersion tank 42. In addition, a foreign matter detecting means for detecting a foreign matter on the substrate S may be provided on the upstream side of the application direction of the substrate S in the direction in which the application portion is not in contact with the application portion. By this detecting means, foreign matter on the substrate S can be detected. Further, for example, when the coating unit 3 is removed at the time of maintenance or the like, it is not necessary to remove the foreign matter detecting mechanism, and the complexity of resetting the foreign matter detecting mechanism can be avoided. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention. In the above-described embodiment, the transport mechanism 23 is disposed on the Y-direction side of each pedestal, but the present invention is not limited thereto. For example, the transport mechanism 23 may be disposed on the +Y direction side of each pedestal. Further, as shown in FIG. 12, the above-described transport mechanism 23 (transporter 23a, vacuum pad 23b, track 23c) is disposed on the Y-direction side of each pedestal, and the transport mechanism 23 is disposed on the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum pad 53b, and the track 53c) having the same configuration may be configured such that the transport mechanism 23 and the transport mechanism 53 transport the same substrate. For example, as shown in the figure, the substrate S 1, -25 - 1353894 can be transported by the transport mechanism 23, and the substrate S2 can be transported by the transport mechanism 53. In this case, since the substrate can be transported by the transport mechanism 23 and the transport mechanism 53, the productivity can be improved. In the case of transporting a substrate having a half area of the substrate S, SI, and S2, for example, the transport mechanism 23 and the transport mechanism 53 hold one substrate, and the transport mechanism 23 and the transport mechanism 53 travel to +X. In the direction, two substrates can be transported at the same time. With such a configuration, productivity can be improved. Further, in the above-described embodiment, for example, the nozzle front portion 32c shown in FIG. 5B is disposed so as to overlap the center portion of each of the holes in a plan view, but is not limited thereto, for example, between the columns (for example, The nozzle front end 32c is disposed in the manner of the third column to the right of FIG. 5B and the center column, etc. Further, in the foregoing embodiment, for example, the air ejection hole 27a and the air suction hole shown in FIGS. 5A and 5B are provided. The interval of 2 7b is uniform (equivalent) 'but not limited thereto, for example, a region overlapping the nozzle 3 2 (a region surrounded by a dotted line in FIG. 5A and FIG. 5B), and an air ejection hole 27a is compared with other regions. The space between the air suction holes 27b and the air suction holes 27b may be increased. Further, in the above-described embodiment, the nozzle tip end 32c is configured such that the number of the air ejection holes 27a in the plan view is minimized, but not limited thereto, and the nozzle tip end 32c overlooks the overlapping air ejection 27a. It is more preferable that the configuration of the nozzle 32 is such that the number of both sides of the air suction hole 27b is the smallest, and the influence of air is less. The intersection of the eight points can be made up, and the space is also folded into holes. -26-