JP2011088121A - Application device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an application device which prevents a transfer imprint from occurring on an applied film and reduces the cost. <P>SOLUTION: The application device 1 includes a substrate transfer part 2 for transferring a substrate S by levitating the substrate S, and an applying section 3 for applying liquid material on the substrate S transferred by the substrate transfer part 2. The substrate transfer part 2 includes a substrate carry-in range 20 into which the substrate S is carried, and a substrate carry-out range 22 out of which the substrate S is carried. Out of the substrate carry-in range 20 and the substrate carry-out range 22, at least the substrate carry-out range 22 extends in the transfer direction of the substrate S, and has a plurality of substrate facing part 52 facing the substrate S and a plurality of gas ejecting openings 28a for ejecting gas so as to levitate the substrate S. The gas ejecting openings 28a are disposed in the transfer direction of the substrate S in each substrate facing part 52 and at least one of them is shifted in the direction orthogonal to the transfer direction of the substrate S. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a coating apparatus.

  On a glass substrate constituting a display panel such as a liquid crystal display, fine patterns such as wirings, electrodes, and color filters are formed. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film are performed.

  As an apparatus for applying a resist film on the surface of a substrate, there is known an application apparatus for fixing a slit nozzle and applying a resist to a glass substrate that moves under the slit nozzle. Among them, a coating apparatus that moves a substrate up and down by jetting gas onto a stage is known. In such a coating apparatus, lift pins are provided in the substrate carry-in area and the substrate carry-out area, and when the substrate is transferred to and from the outside of the apparatus, the lift pins lift the substrate to the lower side of the substrate. A configuration is known in which delivery is performed by providing a space in which the external transport mechanism can be moved.

JP 2005-244155 A

  However, when the substrate is lifted and moved by injecting gas onto the stage, the substrate on which the applied resist is not dried and solidified is transported, particularly at the stage on the substrate carry-out side. When the arrangement of the injection ports for injecting the injection gas is linear, there is a problem that a transfer mark (film thickness unevenness) occurs due to the gas being intensively injected onto a predetermined region of the resist film. In addition, when using the lifting pins as described above, a large-scale mechanism such as a lifting mechanism for the lifting pins must be mounted on the coating apparatus, which increases costs such as power consumption when operating the lifting mechanism. . There is also a problem that a space for delivering the substrate is required.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a coating apparatus that suppresses generation of a transfer mark on a coating film and achieves cost reduction.

  In order to achieve the above object, a coating apparatus according to the present invention includes a substrate transport unit that floats and transports a substrate, and a coating unit that applies a liquid material to the substrate while transporting the substrate by the substrate transport unit. The substrate transport unit is provided with a substrate carry-in region for carrying the substrate and a substrate carry-out region for carrying out the substrate, and at least the substrate among the substrate carry-in region and the substrate carry-out region The carry-out region has a plurality of substrate facing portions that extend in the substrate transport direction and oppose the substrate, and a plurality of gas ejection ports that eject gas for levitation of the substrate. The mouth is disposed along each of the substrate facing portions along the transport direction of the substrate, and at least one of the ports is shifted in a direction orthogonal to the transport direction of the substrate.

  According to the coating apparatus of the present invention, at least one of the substrate carry-in region and the substrate carry-out region is disposed along the substrate carrying direction in each of the substrate facing portions in the substrate carry-out region, and at least one is orthogonal to the substrate carrying direction. Since the gas injection port is arranged in a state shifted in the direction, the gas injection region with respect to the substrate is prevented from being linear. Therefore, compared to the case where the gas injection ports are arranged in a straight line, it is possible to suppress the generation of transfer marks on the coating film on the substrate.

Moreover, in the said coating device, it is preferable that at least one part of the said gas injection port is arrange | positioned at zigzag form.
According to this structure, the gas injected from the gas injection port arrange | positioned in zigzag form will be injected favorably with respect to a board | substrate. Therefore, it is possible to more favorably prevent the transfer mark from being generated on the coating film on the substrate.

Moreover, in the said coating device, it is preferable that in each said board | substrate opposing part, the said gas injection port is arranged in multiple rows along the orthogonal direction of the conveyance direction of the said board | substrate.
According to this configuration, since the gas injection ports are arranged in a plurality of rows along the direction orthogonal to the transport direction of the substrate, the gas can be injected more uniformly from the gas injection port to the substrate.

Moreover, in the said coating device, it is preferable that the said gas injection port is arrange | positioned at random in each of the said board | substrate opposing part.
According to this configuration, since the gas is ejected from the gas ejection ports arranged at random, the gas can be ejected in a substantially uniform state with respect to the substrate surface.

In the coating apparatus, it is preferable that the same number of the gas injection ports per unit area be disposed in each of the substrate facing portions.
According to this configuration, since the same number of the gas injection ports per unit area is arranged in each of the substrate facing portions, the amount of gas injected around the unit area of the substrate can be made substantially the same.

Moreover, in the said coating device, it is preferable that the said board | substrate carrying-in area | region has the said several board | substrate opposing part and the said several gas injection port.
According to this configuration, since a plurality of substrate facing portions and a plurality of gas injection ports are also provided in the substrate carry-in area, high reliability can be achieved by jetting gas to the substrate in the substrate carry-in area. Transport can be performed.

Moreover, in the said coating device, arrangement | positioning of the said gas injection port differs between the carrying-in board | substrate opposing part in the said board | substrate carrying-in area | region, and the carrying-out board | substrate opposing part in the said board | substrate carrying-out area | region corresponding to this carrying-in board | substrate opposing part. It is preferable.
According to this configuration, since the position at which the gas is injected onto the substrate on the substrate carry-in area side is different from the position at which the gas is injected onto the substrate on the substrate carry-out side, the temperature distribution generated on the substrate by the gas injection is uniform. Can be Therefore, a coating film having a uniform thickness can be formed on the substrate.

Moreover, in the said coating device, the carrying-in board | substrate opposing part in the said board | substrate carrying-in area | region and the carrying-out board | substrate opposing part in the said board | substrate carrying-out area | region are arrange | positioned in the state shifted | deviated to the orthogonal direction of the said board | substrate conveyance direction. Is preferred.
According to this configuration, since the loading-side substrate facing portion and the unloading-side substrate facing portion are arranged in a state shifted in a direction orthogonal to the substrate transport direction, the position at which gas is jetted onto the substrate on the substrate loading region side And the position at which the gas is ejected onto the substrate on the substrate carry-out side is different. Therefore, the temperature distribution generated in the substrate by gas injection can be made uniform. Therefore, a coating film having a uniform thickness can be formed on the substrate.

In the coating apparatus, at least one of the substrate carry-out region and the substrate carry-in region is provided with a recess that separates adjacent substrate facing portions, and the recess is provided between the external transfer mechanism and the substrate transfer region. It is preferable to form an accommodating portion for accommodating a part of the external transport mechanism when the substrate is delivered.
According to this configuration, at least one of the substrate carry-out region and the substrate carry-in region is provided with a recess that forms a housing portion that houses a part of the external transport mechanism when the substrate is transferred to and from the external transport mechanism. Therefore, the substrate can be delivered when a part of the external transport mechanism is accommodated. Thereby, since a board | substrate can be delivered without providing a raising / lowering pin, the cost can be reduced. In addition, since the substrate can be transferred without providing the lifting pins, the processing tact can be shortened. Further, since the substrate can be directly transferred in the substrate carry-in area or the substrate carry-out area, the space on the substrate carrying portion can be used efficiently. Thereby, a coating device can be reduced in size.

  According to the present invention, it is possible to suppress the generation of transfer marks on the coating film on the substrate.

It is a perspective view of a coating device. It is a front view of a coating device. It is a top view of a coating device. It is a side view of a coating device. It is a figure which shows operation | movement of the coating device which concerns on this embodiment. FIG. FIG. FIG. FIG. FIG. It is a figure which shows operation | movement of the nozzle cleaning apparatus which concerns on this embodiment. FIG. It is a figure which shows the structure of the coating device which concerns on a 1st modification. It is a figure which shows the structure of the coating device which concerns on a 2nd modification. It is a figure which shows another form of the arrangement pattern of an air ejection hole. It is a figure which shows another form of the arrangement pattern of an air ejection hole.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a coating apparatus 1 according to this embodiment. As shown in FIG. 1, a coating apparatus 1 according to the present embodiment is a coating apparatus that coats a resist on a glass substrate used for a liquid crystal panel, for example, and includes a substrate transport unit 2, a coating unit 3, and a management unit. 4 is the main component. In this coating apparatus 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted and transported by the substrate transport unit 2, and the state of the coating unit 3 is managed by the management unit 4. It has become so.

  2 is a front view of the coating apparatus 1, FIG. 3 is a plan view of the coating apparatus 1, and FIG. The detailed configuration of the coating apparatus 1 will be described with reference to these drawings.

(Substrate transport section)
First, the structure of the board | substrate conveyance part 2 is demonstrated.
The substrate transport unit 2 includes a substrate carry-in region 20, a coating processing region 21, a substrate carry-out region 22, a transport mechanism 23, and a frame unit 24 that supports them. In the substrate transport unit 2, the transport mechanism 23 transports the substrate S sequentially to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22. The substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate carrying direction. The transport mechanism 23 is provided on one side of each part so as to straddle each part of the substrate carry-in area 20, the coating treatment area 21, and the substrate carry-out area 22.

  Hereinafter, in describing the configuration of the coating apparatus 1, for simplicity of description, directions in the figure will be described using an XYZ coordinate system. The substrate transport direction is the longitudinal direction of the substrate transport unit 2 and the substrate transport direction is referred to as the X direction. A direction orthogonal to the X direction (substrate transport direction) in plan view is referred to as a Y direction. A direction perpendicular to the plane including the X direction axis and the Y direction axis is referred to as a Z direction. In each of the X direction, the Y direction, and the Z direction, the arrow direction in the figure is the + direction, and the direction opposite to the arrow direction is the-direction.

The substrate carry-in area 20 is a part for carrying the substrate S carried from the outside of the apparatus, and has a carry-in stage 25.
The carry-in stage 25 is provided on the upper portion of the frame portion 24, and is a rectangular plate-like member made of, for example, SUS or the like in plan view. The carry-in stage 25 has a long X direction. A plurality of substrate facing portions (loading side substrate facing portions) 51 that extend along the substrate transport direction and oppose the substrate S and a plurality of air jets for floating the substrate S are ejected to the loading side stage 25. Air ejection holes (gas ejection ports) 25a.

  The plurality of air ejection holes 25a are provided in a region (including the substrate facing portion 51) through which the substrate S passes in the carry-in stage 25. In particular, the plurality of air ejection holes 25a provided in each of the substrate facing portions 51 are arranged along the transport direction of the substrate S in a plan view and at least one of them is displaced in a direction perpendicular to the transport direction of the substrate S. It is in a state. In each of the substrate facing portions 51 according to the present embodiment, two rows of air ejection holes 25a are arranged, and the air ejection holes 25a in adjacent rows are shifted from each other in the transport direction of the substrate S. Yes. That is, in each substrate facing portion 51, a plurality of air ejection holes 25a are arranged in a staggered manner in a plan view. In addition, the arrangement pattern of the air ejection holes 25a in the passage region of the substrate S excluding the substrate facing portion 51 is not particularly limited, but it is desirable that they are arranged uniformly so that the substrate S can be arranged satisfactorily.

  Moreover, the several board | substrate opposing part 51 is made into the state separated by the accommodating part 25b. The housing portion 25b is a recess that houses a part of the external transport mechanism when receiving the substrate S from the external transport mechanism. The accommodating portion 25b is provided on substantially the entire surface from the end portion in the −X direction toward the + X direction in the loading region of the substrate S of the loading side stage 25. A plurality of accommodating portions 25b are provided along the Y direction.

  The air ejection hole 25 a is provided so as to penetrate the carry-in stage 25. An air supply source (not shown) is connected to the air ejection hole 25a. In the carry-in stage 25, the substrate S can be floated in the + Z direction by the air ejected from the air ejection holes 25a.

  One alignment device 25d is provided at each end of the carry-in stage 25 in the Y direction. The alignment device 25d is a device that aligns the position of the substrate S carried into the carry-in stage 25. Each alignment device 25d has a long hole and an alignment member (not shown) provided in the long hole, and mechanically holds the substrate loaded into the loading side stage 25 from both sides. Yes.

The coating processing region 21 is a portion where resist coating is performed, and a processing stage 27 that floats and supports the substrate S is provided.
The processing stage 27 is a rectangular plate-like member in a plan view in which the stage surface 27 c is covered with a light absorbing material mainly composed of hard anodized, for example, and is provided on the + X direction side with respect to the loading side stage 25. . In the portion of the processing stage 27 covered with the light absorbing material, reflection of light such as laser light is suppressed. The processing stage 27 has a longitudinal Y direction. The dimension of the processing stage 27 in the Y direction is substantially the same as the dimension of the loading stage 25 in the Y direction. The processing stage 27 is provided with a plurality of air ejection holes 27a for ejecting air onto the stage surface 27c and a plurality of air suction holes 27b for sucking air on the stage surface 27c. The air ejection holes 27 a and the air suction holes 27 b are provided so as to penetrate the processing stage 27.

  In the processing stage 27, the pitch of the air ejection holes 27 a is narrower than the pitch of the air ejection holes 25 a provided in the carry-in side stage 25, and the air ejection holes 27 a are provided more densely than the carry-in stage 25. In the processing stage 27, air suction holes 27b are densely provided together with the air ejection holes 27a. As a result, in this processing stage 27, the flying height of the substrate can be adjusted with higher accuracy than in the other stages, and the flying height of the substrate is controlled to be, for example, 100 μm or less, preferably 50 μm or less. Is possible. A stage surface in which air ejection holes are formed on the entire surface may be set between the carry-in stage 25 and the processing stage 27. If it does in this way, it can be conveyed to processing stage 27 in the state where the floating state of substrate P was stabilized. Further, it is possible to suppress the floating amount of the substrate P from changing when moving from the carry-in stage 25 to the processing stage 27, and it is possible to perform resist coating stably. Similarly, a stage surface in which air ejection holes are formed on the entire surface may be set between the processing stage 27 and the carry-out stage 28. In this way, the substrate after resist coating is in a stable state. Can be carried to the carry-out stage 28.

  The substrate carry-out area 22 is a part for carrying the substrate S coated with a resist out of the apparatus, and has a carry-out stage 28. The carry-out stage 28 is provided on the + X direction side with respect to the processing stage 27, and is composed of substantially the same material and dimensions as the carry-in stage 25 provided in the substrate carry-in region 20. Similarly to the carry-in stage 25, the carry-out stage 28 is provided with a substrate facing portion (carrying-side substrate facing portion) 52, an air ejection hole 28a, and a housing portion 28b.

  The plurality of air ejection holes 28 a are provided in a region (including the substrate facing portion 52) through which the substrate S passes in the unloading side stage 28, similarly to the loading side stage 25. In particular, the plurality of air ejection holes 28a provided in each of the substrate facing portions 52 are arranged along the transport direction of the substrate S in a plan view and at least one of them is displaced in a direction perpendicular to the transport direction of the substrate S. It is in a state. Therefore, in each of the substrate facing portions 52, the plurality of air ejection holes 28a are arranged in a staggered manner in a plan view. In addition, the arrangement pattern of the air ejection holes 28a in the passage region of the substrate S excluding the substrate facing portion 52 is not particularly limited, but it is desirable that they are arranged uniformly so that the substrate S can be arranged satisfactorily.

  The plurality of substrate facing portions 52 are separated by the accommodating portion 28b. The accommodating portion 28b is a recess that accommodates a part of the external transport mechanism when receiving the substrate S from the external transport mechanism. The accommodating portion 28b is provided in the carry-out area of the substrate S in the carry-out stage 28 with a certain width from the end in the + X direction toward the −X direction. A plurality of accommodating portions 28b are provided along the Y direction.

The transport mechanism 23 includes a transport machine 23a, a vacuum pad 23b, and a rail 23c. The conveyor 23a has a configuration in which, for example, a linear motor is provided therein, and the conveyor 23a can move on the rail 23c when the linear motor is driven.
The transporter 23a is arranged such that the predetermined portion 23d overlaps the end portion of the substrate S in the −Y direction in plan view. The portion 23d overlapping the substrate S is provided at a position lower than the height position of the back surface of the substrate when the substrate S is lifted.

  A plurality of vacuum pads 23b are arranged in a portion 23d overlapping the substrate S in the transport machine 23a. The vacuum pad 23b has a suction surface for vacuum-sucking the substrate S, and is arranged so that the suction surface faces upward. The vacuum pad 23b can hold the substrate S by the suction surface adsorbing the back surface end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the transfer machine 23a can be adjusted. For example, the height position of the vacuum pad 23b can be raised or lowered according to the flying height of the substrate S. . The rail 23c extends across the stages on the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyor 23a slides along the respective stages by sliding on the rail 23c. Can move.

(Applying part)
Next, the configuration of the application unit 3 will be described. The application unit 3 is a part for applying a resist on the substrate S, and includes a portal frame 31 and a nozzle 32.
The portal frame 31 includes a support member 31a and a bridging member 31b, and is provided so as to straddle the processing stage 27 in the Y direction. One support member 31 a is provided on the Y direction side of the processing stage 27, and each support member 31 a is supported on both side surfaces of the frame portion 24 on the Y direction side. Each strut member 31a is provided so that the height positions of the upper end portions are aligned. The bridging member 31b is bridged between the upper end portions of the respective column members 31a, and can be moved up and down with respect to the column members 31a.

  The portal frame 31 is connected to a moving mechanism 31c and is movable in the X direction. The portal frame 31 is movable between the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided in the portal frame 31 can move between the management unit 4. Further, the portal frame 31 can be moved in the Z direction by a moving mechanism (not shown).

The nozzle 32 is formed in a long and long shape in one direction, and is provided on the surface on the −Z direction side of the bridging member 31 b of the portal frame 31. A slit-like opening 32a is provided along the longitudinal direction of the nozzle 32 at the tip in the -Z direction, and a resist is discharged from the opening 32a. The nozzle 32 is disposed so that the longitudinal direction of the opening 32 a is parallel to the Y direction and the opening 32 a faces the processing stage 27. The dimension in the longitudinal direction of the opening 32a is smaller than the dimension in the Y direction of the substrate S to be transported, so that the resist is not applied to the peripheral region of the substrate S. A flow passage (not shown) through which the resist flows through the opening 32a is provided inside the nozzle 32, and a resist supply source (not shown) is connected to the flow passage. The resist supply source has a pump (not shown), for example, and the resist is discharged from the opening 32a by pushing the resist to the opening 32a with the pump. The nozzle 32 is provided with a moving mechanism, and the column member 31a is provided with a moving mechanism (not shown), so that the nozzle 32 held by the bridging member 31b can move in the Z direction by the moving mechanism. Yes.
A sensor 33 is attached to the bridging member 31b for measuring the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip of the nozzle 32 and the facing surface facing the tip of the nozzle 32.

(Management Department)
The configuration of the management unit 4 will be described.
The management unit 4 is a part that manages the nozzles 32 so that the discharge amount of the resist (liquid material) discharged to the substrate S is constant, and the management unit 4 overlaps the coating unit 3 so as to overlap the substrate transport unit 2 in plan view. The -X direction side (upstream side in the substrate transport direction). The management unit 4 includes a preliminary discharge mechanism 41, a dip tank 42, a nozzle cleaning device 43, a storage unit 44 that stores them, and a holding member 45 that holds the storage unit. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a.

  The preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order in the −X direction side. The dimensions of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the columnar members 31a of the portal frame 31, and the portal frame 31 straddles each part. It can be accessed at.

  The preliminary ejection mechanism 41 is a part that ejects the resist preliminary. The preliminary discharge mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which a solvent such as thinner is stored. The nozzle cleaning device 43 is a device that rinses and cleans the nozzle 32.

  The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 because the moving mechanism is provided. When the nozzle cleaning device 43 is arranged at a position close to the nozzle 32 (+ X direction side), another part is arranged at a position far from the nozzle 32 (−X direction side) instead. In this case, when the nozzle 32 accesses another part in the accommodating portion 44, it is necessary to pass through the moving mechanism, and the moving distance of the nozzle 32 is increased accordingly.

  The nozzle cleaning device 43 of the present embodiment is provided at a position on the −X direction side from the preliminary discharge mechanism 41 and the dip tank 42, and the moving mechanism of the nozzle cleaning device 43 is more than the cleaning mechanism of the nozzle cleaning device 43. Since the nozzle 32 is provided on the −X direction side, the nozzle 32 does not pass through the moving mechanism, and the moving distance of the nozzle 32 is as short as possible. Of course, the arrangement of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used.

(Applicator operation)
Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated. 5-10 is a figure which shows the operation | movement process of the coating device 1. FIG. With reference to each figure, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is carried into the substrate carry-in area 20 by the external carrying mechanism, the resist is applied in the coating treatment area 21 while the substrate S is floated and carried, and the substrate S coated with the resist is applied to the substrate carry-out area. Unload from 22. 6 to 9 show only the outlines of the portal frame 31 and the management unit 4 so that the configurations of the nozzle 32 and the processing stage 27 can be easily discriminated. Hereinafter, detailed operations in each part will be described.

  Before the substrate is carried into the substrate carry-in area 20, the coating apparatus 1 is put on standby. Specifically, the transfer machine 23a is arranged on the −Y direction side of the substrate loading position of the loading side stage 25, the height position of the vacuum pad 23b is matched with the flying height position of the substrate, and the loading side stage 25 is also positioned. The air is ejected or sucked from the air ejection hole 25a, the air ejection hole 27a of the processing stage 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out stage 28, so that the air floats to the surface of each stage. Leave as supplied.

  In this state, as shown in FIG. 5A, the substrate S is transferred from the outside to the substrate loading position by an external transfer mechanism such as a transfer arm 60, for example. When the substrate S is carried onto the carry-in stage 25, as shown in FIG. 5B, the transfer arm 60 is moved in the -Z direction, and a part of the carry arm 60 is moved into the carry-in stage 25. Is housed in the housing portion 25b provided in the housing. When the transfer arm 60 passes through the stage surface 25 c of the carry-in stage 25, the substrate S is held by the air supplied onto the stage surface 25 c and is separated from the transfer arm 60. Thereafter, the transfer arm 60 in the storage unit 25b is moved to the −X direction side, and the transfer arm 60 is moved out of the storage unit 25b.

  The substrate S held in a state of being floated with respect to the stage surface 25c by air is aligned with the alignment member of the alignment device 25d. In this alignment, the position in the Y direction is particularly adjusted so as to be a position corresponding to the nozzle 32 of the application unit 3. Thereafter, the vacuum pad 23b of the transfer device 23a arranged on the −Y direction side of the substrate carry-in position is vacuum-adsorbed on the −Y direction side end portion of the substrate S. FIG. 6 shows a state in which the −Y direction side end portion of the substrate S is adsorbed. After the end of the −Y direction side of the substrate S is adsorbed by the vacuum pad 23b, the transporter 23a is moved along the rail 23c. Since the substrate S is in a floating state, the substrate S moves smoothly along the rail 23c even if the driving force of the transporter 23a is relatively small.

When the front end of the substrate S in the transport direction reaches the position of the opening 32a of the nozzle 32, the resist is discharged from the opening 32a of the nozzle 32 toward the substrate S as shown in FIG. The resist is discharged while the position of the nozzle 32 is fixed and the substrate S is transported by the transport machine 23a.
As the substrate S moves, a resist film R is applied onto the substrate S as shown in FIG. As the substrate S passes under the opening 32a for discharging the resist, a resist film R is formed in a predetermined region of the substrate S.

  The substrate S on which the resist film R is formed is transported to the unloading stage 28 by the transport machine 23a. In the carry-out stage 28, the substrate S is transported to the substrate carry-out position shown in FIG.

  By the way, on the carry-out stage 28, the substrate S in a state where the applied resist film R is not dried and solidified is being conveyed. For this reason, if the air ejection holes 28a for ejecting air for levitating the substrate S are arranged, for example, in a straight line, the air is intensively ejected onto the substrate S in a certain region, and the resist film R may not be dried uniformly, and transfer marks (film thickness unevenness) may occur.

  On the other hand, in the present embodiment, as described above, a configuration in which the plurality of air ejection holes 28a are arranged in a staggered manner in a plan view in each of the substrate facing portions 52 is adopted. As a result, air is jetted substantially uniformly onto the substrate S transported on the substrate facing portion 52 (the carry-out side stage 28). Therefore, it is possible to prevent a problem that the resist film R applied on the substrate R is dried and solidified in a non-uniform state by air jetting.

  When the substrate S reaches the substrate carry-out position, the suction of the vacuum pad 23b is first released. Thereafter, as shown in FIG. 10A, for example, a part of the external transport mechanism such as the transport arm 61 is moved into the accommodating portion 28b, and then the transport arm 61 is moved in the + Z direction. The substrate S is received. After receiving the substrate S, the transfer arm 61 is moved to the + X direction side. In this way, the substrate S is transferred to the transfer arm 61. After the substrate S is transferred to the transport arm 61, the transport machine 23a is returned to the substrate loading position of the carry-in stage 25 again and waits until the next substrate S is transported.

  Until the next substrate S is transported, the application unit 3 performs preliminary discharge for maintaining the discharge state of the nozzles 32. As shown in FIG. 11, the portal frame 31 is moved in the −X direction to the position of the management unit 4 by the moving mechanism 31 c.

  After the portal frame 31 is moved to the position of the management unit 4, the position of the portal frame 31 is adjusted, the nozzle 32 is accessed to the nozzle cleaning device 43, and the nozzle 32 is cleaned by the nozzle cleaning device 43.

  After cleaning the nozzle 32, the nozzle 32 is accessed to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary discharge surface, and the nozzle 32 is moved in the −X direction. A resist is preliminarily discharged from the opening 32a.

  After performing the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is transported, the nozzle 32 is moved to a predetermined position in the Z direction as shown in FIG. In this way, a high-quality resist film R is formed on the substrate S by repeatedly performing the coating operation for applying the resist film R on the substrate S and the preliminary ejection operation.

  If necessary, for example, each time the management unit 4 is accessed a predetermined number of times, the nozzle 32 may be accessed in the dip tank 42. In the dip tank 42, drying of the nozzle 32 is prevented by exposing the opening 32 a of the nozzle 32 to a vapor atmosphere of a solvent (thinner) stored in the dip tank 42.

  In addition, according to the present embodiment, when the substrate S is delivered to the carry-in stage 25 and the carry-out stage 28 of the substrate carrying unit 2 between the external carrying mechanism, the containing unit accommodates a part of the external carrying mechanism. Since 25b and 28b are provided, the substrate S can be transferred when accommodating a part of the external transport mechanism. Thereby, since the board | substrate S can be delivered even if it does not provide a raising / lowering pin, the cost can be reduced. In addition, since the substrate S can be directly transferred in the substrate carry-in area or the substrate carry-out area, the space on the substrate transfer unit 2 can be used efficiently. Thereby, the coating device 1 can be reduced in size. In addition, since the substrate can be transferred without providing the lifting pins, the processing tact can be shortened.

(Modification)
Next, a modified example related to the coating apparatus will be described. In the modification described later, the configurations of the substrate facing portion 51 and the substrate facing portion 52 are different, and the other configurations are the same as those in the above embodiment. Therefore, in the following description, for simplicity, only the substrate facing portions 51 and 52 where the air ejection holes 25a and 28a are arranged are illustrated. 13 and 14 are diagrams showing the configuration of the coating apparatus according to the first and second modified examples.

(First modification)
In this modification, the arrangement of the air ejection holes 25a in the substrate facing portion 51 of the carry-in stage 25 and the air ejection holes 28a in the substrate facing portion 52 of the carry-out stage 28 corresponding to the substrate facing portion 51 are different. Yes. Here, the substrate facing portion 52 corresponding to the substrate facing portion 51 means that the positional relationship is arranged so as to be arranged in a straight line along the transport direction of the substrate S.

  Specifically, in the present modification, as shown in FIG. 13, the air ejection holes 25 a disposed in a staggered pattern in the substrate facing portion 51 and the air ejection holes 28 a disposed in a staggered pattern in the substrate facing portion 52 are provided. The substrate S is shifted in the direction (Y direction) orthogonal to the transport direction (X direction) of the substrate S.

  According to this configuration, the position at which air is ejected onto the substrate S in the carry-in stage 25 is different from the position at which air is ejected onto the substrate S in the carry-out stage 28. The temperature distribution generated in the substrate S by air injection can be made uniform. Therefore, the resist film applied on the substrate S can be dried and solidified with a uniform film thickness.

(Second modification)
In this modification, the substrate facing portion 51 of the carry-in stage 25 and the substrate facing portion 52 of the carry-out stage 28 are shifted in a direction (Y direction) orthogonal to the transport direction (X direction) of the substrate S. It has become.

  Specifically, in this modification, as shown in FIG. 14, the number of substrate facing portions 51 and the number of substrate facing portions 52 are different. The substrate facing portion 51 is arranged at a position aligned in a straight line along the carrying direction of the accommodating portion 28b on the carry-out stage 28 side and the substrate S. On the other hand, the substrate facing portion 52 is arranged at a position aligned in a straight line along the carrying direction of the accommodation portion 25b on the carry-in stage 25 side and the substrate S. In addition, the board | substrate opposing part 51 and the board | substrate opposing part 52 are the same structures (for example, the number or arrangement | positioning etc. of the air ejection holes 25a and 28a) except that each position has shifted | deviated and arrange | positioned in the Y direction in the same figure. It has become.

  According to this configuration, since the substrate facing portion 51 and the substrate facing portion 52 are arranged in a state shifted in a direction orthogonal to the substrate transport direction, air is jetted onto the substrate S in the loading side stage 25. Since the position and the position at which the air is ejected onto the substrate S in the carry-out stage 28 are different from each other, the temperature distribution generated in the substrate S by the air ejection in the carry-in stage 25 is the same as the configuration according to the first modification. Can be made uniform. Therefore, the resist film applied on the substrate S can be dried and solidified with a uniform film thickness.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the plurality of air ejection holes 25a are also arranged along the transport direction of the substrate S in the state in plan view at the substrate facing portion 51 in the carry-in stage 25, and at least one of the substrate S transports the substrate S. In the present invention, only the air ejection holes 28a of the carry-out stage 28 need only be arranged as described above.

  Moreover, in the said embodiment, although the several air ejection holes 25a and 28a were each demonstrated to the board | substrate opposing part 51 and 52 as an example of the structure arrange | positioned (staggered arrangement | positioning), this invention is not limited to this. For example, as shown in FIG. 15, a plurality of air ejection holes 25a, 28a may be arranged in each of the substrate facing portions 51, 52, and each may be arranged in a staggered manner. Alternatively, a configuration in which a part of the air ejection holes 25a and 28a arranged in a plurality of rows is arranged in a staggered manner may be employed. According to this configuration, since the air ejection holes 25a, 28a are arranged in a plurality of rows along the width direction (Y direction in the figure) of the substrate facing portions 51, 52, air is supplied from the air ejection holes 25a, 28a to the substrate S. More uniformly.

  Moreover, as shown in FIG. 16, in each of the board | substrate opposing parts 51 and 52, you may make it arrange | position the air ejection holes 25a and 28a at random, respectively. Thereby, air can be injected with respect to the board | substrate S in a substantially uniform state. Furthermore, it is more desirable that the same number of air ejection holes 25a and 28a be arranged per unit area in each of the substrate facing portions 51 and 52. In this way, the amount of air injected around the unit area of the substrate S can be made substantially the same, and the occurrence of film thickness unevenness in the resist film R can be further suppressed.

DESCRIPTION OF SYMBOLS 1 ... Application | coating apparatus, 2 ... Substrate conveyance part, 3 ... Application | coating part, 4 ... Management part, 20 ... Substrate carrying-in area | region, 22 ... Substrate carrying-out area | region, 25 ... Carry-in side stage, 25a ... Air ejection hole (gas ejection port), 25b ... accommodating part, 28 ... carrying-out stage, 28a ... air ejection hole (gas ejection port), 28b ... accommodating part, 51 ... substrate facing part (carrying side substrate facing part), 52 ... substrate facing part (carrying side substrate facing) Part), S ... substrate

Claims (9)

A coating apparatus comprising a substrate transport unit that floats and transports a substrate, and an application unit that applies a liquid material to the substrate while being transported by the substrate transport unit,
The substrate transport unit is provided with a substrate carry-in area for carrying in the substrate and a substrate carry-out area for carrying out the substrate,
At least the substrate carry-out region of the substrate carry-in region and the substrate carry-out region extends in the substrate carrying direction and jets a gas for floating the substrate and a plurality of substrate facing portions facing the substrate. A plurality of gas outlets,
The gas injection port is disposed along the substrate transport direction in each of the substrate facing portions, and at least one of the gas ejection ports is shifted in a direction orthogonal to the substrate transport direction.   The coating apparatus according to claim 1, wherein at least a part of the gas injection ports are arranged in a staggered manner.   3. The coating apparatus according to claim 1, wherein in each of the substrate facing portions, the gas injection ports are arranged in a plurality of rows along a direction orthogonal to a transport direction of the substrate.   The coating apparatus according to claim 1, wherein the gas injection ports are randomly arranged in each of the substrate facing portions.   The coating apparatus according to claim 4, wherein the same number of the gas injection ports are arranged per unit area in each of the substrate facing portions.   The coating apparatus according to claim 1, wherein the substrate carry-in region includes the plurality of substrate facing portions and the plurality of gas ejection ports.   The arrangement of the gas injection ports is different between a carry-in substrate facing portion in the substrate carry-in region and a carry-out substrate facing portion in the substrate carry-out region corresponding to the carry-in substrate facing portion. Item 7. The coating apparatus according to Item 6.   The carry-in substrate facing portion in the substrate carry-in region and the carry-out substrate facing portion in the substrate carry-out region are arranged in a state shifted in a direction orthogonal to the substrate carrying direction. The coating apparatus as described in.   At least one of the substrate carry-out region and the substrate carry-in region is provided with a recess that separates adjacent substrate facing portions, and the recess is used when the substrate is transferred to and from an external transfer mechanism. The coating device according to any one of claims 6 to 8, wherein the coating device forms a housing portion that houses a part of the transport mechanism.

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