JP4443353B2 - Substrate mounting stage and substrate adsorption / separation method - Google Patents
Substrate mounting stage and substrate adsorption / separation method Download PDFInfo
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- JP4443353B2 JP4443353B2 JP2004252361A JP2004252361A JP4443353B2 JP 4443353 B2 JP4443353 B2 JP 4443353B2 JP 2004252361 A JP2004252361 A JP 2004252361A JP 2004252361 A JP2004252361 A JP 2004252361A JP 4443353 B2 JP4443353 B2 JP 4443353B2
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- mounting stage
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- 239000000758 substrate Substances 0.000 title claims description 106
- 238000001179 sorption measurement Methods 0.000 title claims description 13
- 238000000926 separation method Methods 0.000 title description 2
- 239000011521 glass Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Jigs For Machine Tools (AREA)
Description
本発明は、例えばガラス基板等の基板表面に塗布液を塗布する際に、当該基板を載置するに基板載置ステージとこの基板載置ステージを用いた基板の吸着・剥離方法に関する。 The present invention relates to a substrate placement stage for placing a substrate and a substrate adsorption / removal method using the substrate placement stage when a coating solution is applied to a substrate surface such as a glass substrate.
ガラス基板表面にレジスト液、ＳＯＧ液或いはカラーフィルタ用塗布液などを塗布するには、従来から基板載置ステージの上面にガラス基板を吸引固定した状態で、ガラス基板表面にスリットノズル、ロールコータなどを用いて塗布液を供給するようにしている。 In order to apply a resist solution, SOG solution, or color filter coating solution to the glass substrate surface, a slit nozzle, a roll coater, or the like is conventionally provided on the glass substrate surface with the glass substrate sucked and fixed on the upper surface of the substrate mounting stage. Is used to supply the coating solution.
上記基板載置ステージの構造としては、特許文献１及び特許文献２に開示されている。特許文献１に開示される基板載置ステージ（テーブル）は、塗布ヘッドに対して相対的に往復動可能とされ、且つその上面には多数の吸引孔が形成されている。また、特許文献２には、孔の径が０．５ｍｍ以下で開口率を１〜２０％とした多孔質体によってステージを形成することが開示されている。
上述した従来の基板載置ステージでガラス基板を吸着して塗布を行なった後、吸引状態を解除してガラス基板をステージから剥離しようとすると、帯電（静電吸着）によってガラス基板がステージから離れず、無理に剥離させようとするとガラス基板が割れてしまうことがある。 After the glass substrate is adsorbed and applied on the conventional substrate mounting stage described above, the glass substrate is separated from the stage by charging (electrostatic adsorption) when the suction state is released and the glass substrate is peeled off from the stage. If the glass substrate is forced to peel off, the glass substrate may be broken.
また、従来の基板載置ステージにあっては、ガラス基板の下面全面を同時に吸着している。このためガラス基板の中央部とステージとの間に空気が介在した状態で、つまりガラス基板の中央部が盛上った状態で吸着固定することがあり、この場合には、均一な厚みの塗膜を形成することができない。 Further, in the conventional substrate mounting stage, the entire lower surface of the glass substrate is sucked at the same time. For this reason, it may be adsorbed and fixed in a state where air is interposed between the central portion of the glass substrate and the stage, that is, in a state where the central portion of the glass substrate is raised. A film cannot be formed.
更に、塗布などの作業を行なっている間、全ての吸引孔によって強く吸着していると、ガラス基板に吸着跡が転写され、均一な塗膜が得られず、ムラが発生することがある。 Furthermore, if the suction is strongly absorbed by all the suction holes during the operation such as coating, the suction mark is transferred to the glass substrate, and a uniform coating film cannot be obtained, and unevenness may occur.
上記の課題を解決すべく、本発明に係る基板載置ステージは、上面に多数の真空源につながる吸引孔及び圧気源につながる噴出孔が形成され、また平面視で複数の同心状領域に分けられ、これら各領域毎に前記吸引孔を介した吸引及び噴出孔を介した噴出が独立して行なわれる構成とした。 In order to solve the above-described problems, the substrate mounting stage according to the present invention has suction holes connected to a number of vacuum sources and ejection holes connected to a pressurized air source formed on the upper surface, and is divided into a plurality of concentric regions in plan view. In each of these regions, suction through the suction holes and ejection through the ejection holes are performed independently.
ここで、前記複数の同心状領域は、物理的に分離されているのではなく、ステージの上面を複数の同心状領域に仮想的に分け、各領域毎に吸引孔（噴出孔）による吸引（噴出）を制御するということである。 Here, the plurality of concentric regions are not physically separated, but the upper surface of the stage is virtually divided into a plurality of concentric regions, and suction by suction holes (ejection holes) for each region ( Is to control (spout).
また前記吸引孔及び噴出孔は同一の孔を共用せしめることで、ステージに対する孔明け作業も半分で済み、剛性が低下することもない。また孔を共用した場合には配管の途中に切替弁を設け、真空源と圧気源とに選択的に接続するようにする。 Further, since the suction hole and the ejection hole are made to share the same hole, the drilling operation for the stage can be halved, and the rigidity is not lowered. When the hole is shared, a switching valve is provided in the middle of the pipe so as to be selectively connected to the vacuum source and the pressure source.
また、吸引孔（噴出孔）の密度は前記複数の同心状領域のうち最中心部の領域における密度を他の領域の密度よりも大きくすることが好ましい。このようにすることで、最中心部の領域のみを用いて吸着する場合に効果的である。 Further, it is preferable that the density of the suction holes (spout holes) is higher than the density of the other regions in the most central region among the plurality of concentric regions. By doing in this way, it is effective when attracting | sucking using only the area | region of the most center part.
また、孔に限らずチャック表面に格子状に溝を形成し、この溝に真空源につながる吸引孔と圧気源につながる噴出孔を開口せしめてもよい。溝を形成することで、孔よりも基板裏面に接触する面積（吸引又は剥離に関与する面積）が広くなるので、溝を介した吸引及び噴出の方が吸引及び噴出にかかる時間が短くなる。ここで、溝の寸法（幅×深さ）としてはあまり大きくするとムラの原因となるので、１．０ｍｍ×１．０ｍｍ以下、好ましくは０．２ｍｍ×０．２ｍｍ以下である。尚、溝を形成する場合も、中心部における溝の間隔を外側部における溝の間隔よりも密にする。 In addition to the holes, grooves may be formed in a lattice shape on the chuck surface, and suction holes connected to a vacuum source and ejection holes connected to a pressure air source may be opened in the grooves. By forming the groove, the area in contact with the back surface of the substrate (area related to suction or peeling) is larger than the hole, so that the time required for suction and ejection through the groove is shortened. Here, if the dimension (width × depth) of the groove is too large, unevenness is caused. Therefore, it is 1.0 mm × 1.0 mm or less, preferably 0.2 mm × 0.2 mm or less. In addition, also when forming a groove | channel, the space | interval of the groove | channel in a center part is made closer than the space | interval of the groove | channel in an outer side part.
また、基板載置ステージに対する基板の載置および剥離をリフトピンを用いて行なう場合には、ステージの中心部に近いリフトピンよりも外側のリフトピンの高さを高くし、中央部が撓んだ状態で基板を支持することで、基板の割れなどを効果的に防止できる。 In addition, when the substrate is placed and peeled from the substrate placement stage using the lift pins, the height of the lift pins outside the lift pins close to the center of the stage is increased, and the center is bent. Supporting the substrate can effectively prevent cracking of the substrate.
また、上記の基板載置ステージを用いた基板の吸着方法は、先ず基板載置ステージの複数の同心状領域のうち最中心部の領域の吸引孔によって基板を吸着した後、順次外側の同心状領域の吸引孔によって吸着する。このように最中心部を先に吸着し、順次外側を吸着することで、中心部にエアを介在させたまま吸着することを防げる。 In addition, the substrate suction method using the substrate placement stage described above is such that the substrate is first suctioned by the suction hole in the central region among the plurality of concentric regions of the substrate placement stage, and then the outer concentric shape is sequentially formed. Adsorbed by suction holes in the area. In this way, by adsorbing the most central portion first and adsorbing the outside sequentially, it is possible to prevent adsorption while air is interposed in the central portion.
更に、上記の基板の吸着方法にあっては、一旦全部の同心状領域で基板を吸着したならば、外側領域の吸着状態を解除し、最中心部の領域によってのみ吸着状態を維持するようにしてもよい。このようにすることで、吸着跡（ムラ）のない塗膜をガラス基板の表面に形成することができる。 Further, in the above-described substrate adsorption method, once the substrate is adsorbed in all the concentric regions, the adsorption state of the outer region is canceled and the adsorption state is maintained only by the most central region. May be. By doing in this way, the coating film without an adsorption trace (nonuniformity) can be formed on the surface of a glass substrate.
また、同心状領域の中心部と外側領域とで、孔または溝の密度の違いによる吸引力の差によってムラが生じないようにするために、中心部よりも外側領域の圧力を低く設定してもよい。 Also, in order to prevent unevenness due to the difference in suction force due to the difference in the density of the holes or grooves between the central portion and the outer region of the concentric region, the pressure in the outer region is set lower than the central portion. Also good.
また、上記の基板載置ステージを用いた基板の剥離方法は、先ず基板載置ステージの複数の同心状領域のうち最中心部の領域の噴出孔から気体を噴出した後、順次外側の同心状領域の噴出孔から気体を噴出して行なう。このように内側から剥離することで、基板に無理な力が作用することがなく、基板の割れを防止できる。 Further, the substrate peeling method using the substrate mounting stage described above is such that the gas is first ejected from the ejection hole of the central region among the plurality of concentric regions of the substrate mounting stage, and then the outer concentric shapes are sequentially formed. This is performed by ejecting gas from the ejection holes in the region. By peeling from the inside in this way, an excessive force does not act on the substrate, and the substrate can be prevented from cracking.
本発明にあっては上記したように吸着及び剥離の何れにおいても、常に基板の中心から外側に向かって行う。つまり、吸着の際は中心部を先に吸着して外側部に向かって準じ吸着していき、剥離の際は中心部に先にエアを入れて中心部を持ち上げ外側に向かって隙間を広げるようにする。 In the present invention, as described above, both adsorption and separation are always performed from the center of the substrate toward the outside. That is, at the time of adsorption, the central part is first adsorbed and adsorbed toward the outer part, and at the time of peeling, air is first introduced into the central part, the central part is lifted, and the gap is widened outward. To.
本発明に係る基板載置ステージによれば、ガラス基板などの基板を、ステージとの間にエアを介在させずに、水平に固定することができる。また、剥離する場合にもガス（空気または窒素ガス）を噴出するため、基板がステージ表面に帯電によって吸着されている場合でも容易に剥離することができる。 According to the substrate mounting stage according to the present invention, a substrate such as a glass substrate can be horizontally fixed without interposing air between the substrate and the stage. Further, since gas (air or nitrogen gas) is ejected even when peeling, it can be easily peeled even when the substrate is adsorbed on the stage surface by charging.
更に、孔だけでなく溝を形成し、この溝内に孔を開口することで、基板裏面に対する吸着及び剥離用の溝に対する接触面積が広くなるので、基板の吸着及び剥離にかかる時間を短くすることができ、タクトタイムが速くなる。 Furthermore, by forming a groove as well as a hole and opening the hole in the groove, the contact area with the adsorption and peeling groove on the back surface of the substrate is widened, so the time required for adsorption and peeling of the substrate is shortened. And the takt time is faster.
また、複数のリフトピンの高さを変更して、基板を中央部が撓んだ状態で保持するようにすれば、最初に基板の中央部がステージ上面に接触するので、ステージとの間にエアが入り込むことが無く、また剥離する場合も無理なくステージ上面から基板を剥離することができる。 In addition, if the height of the plurality of lift pins is changed so that the substrate is held in a state where the central portion is bent, the central portion of the substrate first comes into contact with the upper surface of the stage. The substrate can be peeled off from the upper surface of the stage without difficulty even when it is peeled off.
以下に本発明の実施の形態を添付図面に基づいて説明する。図１は本発明に係る基板載置ステージの平面図、図２は同基板載置ステージの要部拡大断面図であり、基板載置ステージ１は自然石、ステンレスなどからなり、上面は平坦面に仕上げられ、多数の吸引孔と噴出孔を兼ねる孔２…とリフトピン挿通孔３…が形成されている。 Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of a substrate mounting stage according to the present invention. FIG. 2 is an enlarged cross-sectional view of the main part of the substrate mounting stage. The substrate mounting stage 1 is made of natural stone, stainless steel, etc., and the upper surface is a flat surface. A plurality of holes 2 serving as suction holes and ejection holes and lift pin insertion holes 3 are formed.
基板載置ステージ１は平面視で複数の同心状領域１ａ，１ｂ，１ｃ，１ｄ，１ｅに分けられ、最中心部の領域１ａに形成した吸引件噴出孔２…の密度を外側の領域１ｂ〜１ｅの密度よりも高くしている。尚、最中心部の領域１ａ全体において孔２の密度を高めずに、一部のみ密度を高めるようにしてもよい。 The substrate mounting stage 1 is divided into a plurality of concentric regions 1a, 1b, 1c, 1d, and 1e in plan view, and the density of the suction ejection holes 2 formed in the most central region 1a is set to the outer region 1b to 1b. It is higher than the density of 1e. In addition, the density of the holes 2 may not be increased in the entire region 1a at the center, but the density may be increased only partially.
図２に示すように、前記各孔２には吸引兼噴出用ノズル４が挿入され、このノズル４は基板載置ステージ１の背面側において配管５，６に接続されている。これら配管５，６は図示しない切替弁を介して真空ポンプ或いはエアーラインに選択的につながっている。 As shown in FIG. 2, suction and ejection nozzles 4 are inserted into the holes 2, and the nozzles 4 are connected to pipes 5 and 6 on the back side of the substrate placement stage 1. These pipes 5 and 6 are selectively connected to a vacuum pump or an air line via a switching valve (not shown).
また、配管５は例えば最中心部の領域１ａにおける吸引または噴出を行なうためのものであり、配管６は例えば領域１ｂにおける吸引または噴出を行なうためのものである。本発明ではこのように各領域毎に配管を配置し、各領域毎に吸引または噴出を制御できるようにしている。 Further, the pipe 5 is for performing suction or jetting in the central area 1a, for example, and the pipe 6 is for performing suction or jetting in the area 1b, for example. In the present invention, piping is arranged for each region in this way, so that suction or ejection can be controlled for each region.
また、図３に示すように、本発明に係る基板載置ステージ１は基板Ｗを載置・剥離するリフトピンを備えている。リフトピン７は前記挿通孔３を貫通するとともに、下端部が支持板８に取り付けられ、一体的に昇降動する。 As shown in FIG. 3, the substrate mounting stage 1 according to the present invention includes lift pins for mounting and peeling the substrate W. The lift pin 7 penetrates the insertion hole 3 and has a lower end attached to the support plate 8 and moves up and down integrally.
また、リフトピン７はステージ１の中央部に近いリフトピン７の高さを外側のリフトピン７の高さよりも低く設定し、基板Ｗを中央部が撓んだ状態に倣って保持する。この状態を図３（ａ）に示している。 The lift pins 7 set the height of the lift pins 7 near the center of the stage 1 lower than the height of the outer lift pins 7, and hold the substrate W following the state where the center is bent. This state is shown in FIG.
次いで、図３（ｂ）に示すように、リフトピン７が下降すると、基板Ｗの中央部下面が基板載置ステージ１の最中心部の領域１ａに接触する。そしてこの状態で配管５を介し最中心部の領域１ａの孔２から吸引し、基板Ｗの中央部を吸引固定する。 Next, as shown in FIG. 3B, when the lift pins 7 are lowered, the lower surface of the central portion of the substrate W comes into contact with the region 1 a at the most central portion of the substrate mounting stage 1. Then, in this state, suction is performed from the hole 2 in the region 1a at the most central portion through the pipe 5, and the central portion of the substrate W is suction fixed.
上記の状態から更にリフトピン７を下げる。そして、これと並行して吸引領域を最中心部の領域１ａから順次外側の領域１ｂ〜１ｅに拡大し、最終的に図３（ｃ）に示すように、基板Ｗをフラットな状態で基板載置ステージ１の上面に吸引固定する。この吸引固定が完了したら、最中心部の領域１ａにおける吸引のみを継続し、他の領域の吸引を解除し、スリットノズル９を相対的に水平移動させつつ基板表面に塗布液を塗布する。 The lift pin 7 is further lowered from the above state. In parallel with this, the suction area is sequentially expanded from the central area 1a to the outer areas 1b to 1e, and finally the substrate W is mounted in a flat state as shown in FIG. Suction and fixed to the upper surface of the mounting stage 1. When this suction fixation is completed, only the suction in the central area 1a is continued, the suction in the other areas is released, and the coating liquid is applied to the substrate surface while the slit nozzle 9 is relatively moved horizontally.
図３（ｄ）に示すように、上記塗布作業が完了したら、配管のバルブを圧気源側に切替え、最中心部の同心状領域１ａから先ず窒素ガスなどを噴出し、順次外側の同心状領域１ａ〜１ｄに噴出領域を広げ、ステージ１表面から基板Ｗを剥離し、更に図３（ｅ）に示すように、リフトピン７を上昇させて基板Ｗを持ち上げ、次工程のロボットなどに受け渡す。 As shown in FIG. 3D, when the application operation is completed, the valve of the piping is switched to the pressure air source side, and nitrogen gas or the like is first ejected from the concentric region 1a at the center, and the outer concentric regions are sequentially formed. The ejection area is expanded to 1a to 1d, the substrate W is peeled off from the surface of the stage 1, and as shown in FIG. 3 (e), the lift pins 7 are lifted to lift the substrate W and delivered to the next process robot or the like.
図示例では、孔２が吸引孔と噴出孔とを兼ねるようにして配管の簡素化、製作の効率アップを図っているが、吸引孔と噴出孔とを別々に形成してもよい。
また、図示していないが、チャック表面に格子状の溝を設け、この溝に吸引孔と噴出孔を兼ねる孔２を形成してもよい。
In the illustrated example, the hole 2 serves as both a suction hole and a jet hole to simplify the piping and increase the manufacturing efficiency. However, the suction hole and the jet hole may be formed separately.
Although not shown, a lattice-like groove may be provided on the chuck surface, and the hole 2 serving as the suction hole and the ejection hole may be formed in the groove.
本発明の基板載置ステージはガラス基板にスリットノズルを用いて、レジスト液やカラーフィルタ用塗布液を塗布する際に、ガラス基板を固定するために利用することができる。 The substrate mounting stage of the present invention can be used for fixing a glass substrate when a resist solution or a color filter coating solution is applied to the glass substrate using a slit nozzle.
１…基板載置ステージ、１ａ，１ｂ，１ｃ，１ｄ，１ｅ…同心状領域、２…吸引孔と噴出孔を兼ねる孔、３…リフトピン挿通孔、４…吸引兼噴出用ノズル、５，６…配管、７…リフトピン、８…支持板、９…スリットノズル、Ｗ…基板。
DESCRIPTION OF SYMBOLS 1 ... Board | substrate mounting stage, 1a, 1b, 1c, 1d, 1e ... Concentric area | region, 2 ... Hole which serves as a suction hole and an ejection hole, 3 ... Lift pin insertion hole, 4 ... Nozzle for suction and ejection, 5, 6 ... Piping, 7 ... lift pins, 8 ... support plate, 9 ... slit nozzle, W ... substrate.
Claims (7)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004252361A JP4443353B2 (en) | 2004-08-31 | 2004-08-31 | Substrate mounting stage and substrate adsorption / separation method |
| TW094129776A TWI404574B (en) | 2004-08-31 | 2005-08-30 | Stage for mounting substrate and method for attracting and separating substrate |
| CNB2005100976734A CN100553797C (en) | 2004-08-31 | 2005-08-31 | The absorption of substrate-placing platform and substrate, stripping means |
| KR20050080570A KR101488933B1 (en) | 2004-08-31 | 2005-08-31 | Stage for mounting substrate and method for attracting and separating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004252361A JP4443353B2 (en) | 2004-08-31 | 2004-08-31 | Substrate mounting stage and substrate adsorption / separation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006068592A JP2006068592A (en) | 2006-03-16 |
| JP4443353B2 true JP4443353B2 (en) | 2010-03-31 |
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| JP2004252361A Expired - Lifetime JP4443353B2 (en) | 2004-08-31 | 2004-08-31 | Substrate mounting stage and substrate adsorption / separation method |
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| Country | Link |
|---|---|
| JP (1) | JP4443353B2 (en) |
| KR (1) | KR101488933B1 (en) |
| CN (1) | CN100553797C (en) |
| TW (1) | TWI404574B (en) |
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| TW593087B (en) * | 2003-05-30 | 2004-06-21 | Au Optronics Corp | Turnover carrier platform |
-
2004
- 2004-08-31 JP JP2004252361A patent/JP4443353B2/en not_active Expired - Lifetime
-
2005
- 2005-08-30 TW TW094129776A patent/TWI404574B/en active
- 2005-08-31 KR KR20050080570A patent/KR101488933B1/en active IP Right Grant
- 2005-08-31 CN CNB2005100976734A patent/CN100553797C/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101796593B1 (en) * | 2010-12-30 | 2017-11-10 | 주식회사 탑 엔지니어링 | Array test apparatus |
| KR101854880B1 (en) * | 2016-06-28 | 2018-05-04 | 주식회사 휴템 | Silicon substrate direct bonding method and apparatus system thereof, silicon substrate direct bonding apparatus align parts verification method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060050860A (en) | 2006-05-19 |
| KR101488933B1 (en) | 2015-02-03 |
| TW200618868A (en) | 2006-06-16 |
| CN1754629A (en) | 2006-04-05 |
| CN100553797C (en) | 2009-10-28 |
| TWI404574B (en) | 2013-08-11 |
| JP2006068592A (en) | 2006-03-16 |
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