CN103594409A - Device for absorbing silicon wafers in batches - Google Patents
Device for absorbing silicon wafers in batches Download PDFInfo
- Publication number
- CN103594409A CN103594409A CN201310500266.8A CN201310500266A CN103594409A CN 103594409 A CN103594409 A CN 103594409A CN 201310500266 A CN201310500266 A CN 201310500266A CN 103594409 A CN103594409 A CN 103594409A
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- Prior art keywords
- pawl
- absorbing
- air vent
- vent hole
- clamping part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a device for absorbing silicon wafers in batches. The device for absorbing the silicon wafers in batches comprises a top plate and a plurality of absorbing claws under the top plate, wherein the absorbing claws are consistent in structure and size, end plates are installed at the two ends of the top plate, one end surface of each absorbing claw is a vertical surface, the upper portion of each absorbing claw is a connecting part, the lower portion of each absorbing claw is a clamping part, the bottom of each connecting part is connected with the top of the corresponding clamping part, the thickness of each connecting part is larger than that of each clamping part, a connecting mechanism is arranged to fix the absorbing claws between the end plates in an overlapped mode in the direction perpendicular to the thickness direction of the absorbing claws, the distance between the clamping parts of adjacent absorbing claws is larger than the thickness of each silicon wafer, and the device is further provided with a vacuum absorbing mechanism used for absorbing the silicon wafers. The device can well absorb the silicon wafers in batches, absorb a large number of the silicon wafers at the same time, absorb a small number of the silicon wafers at the same time and even absorb one silicon wafer independently through one absorbing claw. Meanwhile, the device is quite compact in structure, can directly absorb the silicon wafers from a silicon wafer basket box or quartz boat in batches, and improves conveying efficiency.
Description
Technical field
The present invention relates to a kind of batch silicon wafer holding device.
Background technology
In domestic current existing solar cell slice assembly line, great majority adopt artificial load mode, production efficiency is subject to certain limitation, and silicon chip automatic mounting unloading piece equipment replaces manual operation, reduces the manual contact with silicon chip, adopt the mode of carrying in batches simultaneously, can enhance productivity.
Automatic mounting unloading piece equipment key is to want to realize batch silicon wafer carrying, therefore must design more reliable, more effective batch silicon wafer holding mechanism, otherwise cannot realize silicon chip carrying effectively reliably.
Mainly there is the problem of two aspects in existing silicon chip holding mechanism, or be difficult to realize larger amt (particularly more than 25) time absorption, or can adsorb the silicon chip of larger amt simultaneously but must be that the overwhelming majority is inhaled pawls and all contacted with silicon chip, such as: under operating state, 50 can be adsorbed simultaneously, but 25 cannot be only adsorbed.In addition, the suction pawl size of existing holding mechanism is partially thick, and the spacing of inhaling between pawl is bigger than normal, can not directly from silicon chip flower basket box or quartz boat, get sheet, in use needs to increase transition apparatus, has reduced handling efficiency.
Summary of the invention
The object of the invention is to, for the deficiencies in the prior art, a kind of batch silicon wafer holding device is provided, can realize the batch silicon wafer sticking in automatic mounting unloading piece process, quantity sticking silicon chip simultaneously greatly, also can smallest number the even single suction pawl of sticking independence sticking silicon chip simultaneously, can directly from silicon chip flower basket box or quartz boat, get in batches sheet.
Technical scheme of the present invention is, a kind of batch silicon wafer holding device comprises a plurality of structures, the suction pawl of the same size of top board and top board below, and end plate is installed at the two ends of described top board; An end face of described suction pawl is vertical plane, the top of inhaling pawl is that the bottom that connecting portion is inhaled pawl is clamping part, the bottom of connecting portion is connected with the top of clamping part, the thickness of connecting portion is greater than the thickness of clamping part, and being provided with bindiny mechanism along each suction pawl stack being fixed between two end plates perpendicular to inhaling pawl thickness direction, the gap between the clamping part of adjacent suction pawl is greater than the thickness of silicon chip; This holding device is also provided with the vacuum adsorption mechanism of absorption silicon chip.
By bindiny mechanism, a plurality of suction pawl overlapped in series are got up, two end plates are inhaled pawl and are sternly compressed each, guarantee that all suction pawls gap is even, the thickness of inhaling pawl clamping part is exactly the arrangement pitches of absorption silicon chip, can make the thickness of inhaling pawl clamping part according to the arrangement pitches of silicon chip in silicon chip flower basket box or quartz boat, can from silicon chip flower basket box or quartz boat, get in batches sheet; For guaranteeing sticking effect, also at clamping part, a plurality of concentric grooves for vacuum suction are set; The suction pawl that the present invention arranges, can guarantee that each inhales pawl and can get separately sheet, therefore can realize large quantity sticking silicon chip simultaneously, also can smallest number the even single suction pawl of sticking independence sticking silicon chip simultaneously.
Connecting portion accounts for inhales 1/3rd of pawl length, and clamping part accounts for 2/3rds of suction pawl length, when guaranteeing stable connection, can also guarantee the effect of clamping.
Described vacuum adsorption mechanism comprise be located at inhale pawl clamping part surface a plurality of concentric grooves, the groove air vent hole in concentric grooves, be located at and inhale pawl connecting portion the suction pawl air vent hole being connected with each groove air vent hole, be arranged on end plate outside and to suction pawl air vent hole, pass into the pipe joint of negative pressure of vacuum; Described each groove air vent hole is connected with suction pawl air vent hole is inhaled pawl inside venting channels by being located at.
When the work of described batch silicon wafer holding device, to inhaling in pawl air vent hole, pass into a negative pressure of vacuum (for example 45 kPas of left and right), each is inhaled groove part on pawl and all obtains any negative pressure of vacuum of a relative mistake like this, can enough stablize and adsorb single silicon chip.
Described each groove air vent hole and suction pawl air vent hole, are inhaled pawl air vent hole the shortest to the distance of each groove air vent hole point-blank, reduce transmission range, assurance adsorption effect.
Described bindiny mechanism comprises being located at inhales the connecting hole of pawl connecting portion and through the connecting rod of connecting hole, according to embodiments of the invention, is arranged with 4 connecting holes and 4 connecting rods and will inhales pawl and fix.
Described suction pawl is made by ceramic material, can not pollute silicon chip.
In the present invention, the quantity of inhaling pawl can be 25 also can 50 or other quantity, inhale the concrete quantity of pawl and determine according to the needs of reality carrying.
The vacuum passage requirement of whole silicon chip holding device, inhales pawl air vent hole and wants enough large, and groove air vent hole is relatively little simultaneously.When carrying out batch while inhaling sheet, peripheral mechanical arm or similar movement device are placed whole silicon chip holding device direction along silicon chip is slowly inserted between some adjacent silicon chips, then mobile silicon chip holding device makes to inhale pawl and contacts with silicon chip, open vacuum adsorption mechanism, like this, the silicon chip contacting with suction pawl is all adsorbed, and can be moved to assigned address.
Compared with prior art, useful result of the present invention is: by batch silicon wafer holding mechanism of the present invention, can well realize sticking silicon chip in batches, quantity sticking silicon chip simultaneously greatly, also can smallest number the even single suction pawl of sticking independence sticking silicon chip simultaneously, structure is very compact simultaneously, can directly from silicon chip flower basket box or quartz boat, get in batches sheet, improves handling efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of the present invention;
Fig. 2 is for inhaling the structural representation of pawl.
Embodiment
As Fig. 1, shown in Fig. 2, a kind of batch silicon wafer holding device, 50 structures that comprise top board 4 and top board 4 belows, suction pawl of the same size, end plate 2 is installed at the two ends of top board 4, an end face inhaling pawl is vertical plane, in Fig. 1, the right side of inhaling pawl is vertical plane, the top of inhaling pawl is that the bottom that connecting portion 11 is inhaled pawl is clamping part 1, the bottom of connecting portion 11 is connected with the top of clamping part 1, the thickness of connecting portion 11 is greater than the thickness of clamping part 1, and be provided with bindiny mechanism along perpendicular to inhaling pawl thickness direction, each suction pawl stack being fixed between two end plates 2, gap between the clamping part 1 of adjacent suction pawl is greater than the thickness of silicon chip, this holding device is also provided with the vacuum adsorption mechanism of absorption silicon chip.
Vacuum adsorption mechanism comprise be located at inhale pawl clamping part 1 surface a plurality of concentric grooves 6, the groove air vent hole 7 in concentric grooves 6, be located at and inhale pawl connecting portion 11 the suction pawl air vent hole 10 being connected with each groove air vent hole 7, be arranged on end plate 2 outsides and to suction pawl air vent hole 10, pass into the pipe joint 5 of negative pressure of vacuum; Each groove air vent hole 7 and suction pawl air vent hole 10 point-blank, are provided with and imbed the venting channels 8 of inhaling pawl inside between groove air vent hole 7 and suction pawl air vent hole 10.
Bindiny mechanism comprises that symmetry is located at 4 connecting holes 9 inhaling pawl connecting portion 11 and 4 connecting rods 3 that pass connecting hole 9.
Inhaling pawl is made by ceramic material.
Claims (6)
1. a batch silicon wafer holding device, comprises and it is characterized in that a plurality of structures, the suction pawl of the same size of top board (4) and top board (4) below, end plate (2) is installed at the two ends of described top board (4); An end face of described suction pawl is vertical plane, the top of inhaling pawl is that the bottom that connecting portion (11) is inhaled pawl is clamping part (1), the bottom of connecting portion (11) is connected with the top of clamping part (1), the thickness of connecting portion (11) is greater than the thickness of clamping part (1), and being provided with bindiny mechanism along each suction pawl stack being fixed between two end plates (2) perpendicular to inhaling pawl thickness direction, the gap between the clamping part of adjacent suction pawl (1) is greater than the thickness of silicon chip; This holding device is also provided with the vacuum adsorption mechanism of absorption silicon chip.
2. batch silicon wafer holding device according to claim 1, it is characterized in that, described vacuum adsorption mechanism comprise be located at inhale pawl clamping part (1) surface a plurality of concentric grooves (6), the groove air vent hole (7) in concentric grooves (6), be located at and inhale pawl connecting portion (11) the suction pawl air vent hole (10) being connected with each groove air vent hole (7), be arranged on end plate (2) outside and to suction pawl air vent hole (10), pass into the pipe joint (5) of negative pressure of vacuum.
3. batch silicon wafer holding device according to claim 2, is characterized in that, described each groove air vent hole (7) is connected with the venting channels (8) of inhaling pawl air vent hole (10) and inhale by being located at pawl inside.
4. batch silicon wafer holding device according to claim 2, is characterized in that, described each groove air vent hole (7) with inhale pawl air vent hole (10) point-blank.
5. according to batch silicon wafer holding device described in claim 1 or 2, it is characterized in that, described bindiny mechanism comprises the connecting hole (9) that is located at suction pawl connecting portion (11) and the connecting rod (3) that passes connecting hole (9).
6. according to batch silicon wafer holding device described in claim 1 or 2, it is characterized in that, described suction pawl is made by ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310500266.8A CN103594409A (en) | 2013-10-23 | 2013-10-23 | Device for absorbing silicon wafers in batches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310500266.8A CN103594409A (en) | 2013-10-23 | 2013-10-23 | Device for absorbing silicon wafers in batches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103594409A true CN103594409A (en) | 2014-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310500266.8A Pending CN103594409A (en) | 2013-10-23 | 2013-10-23 | Device for absorbing silicon wafers in batches |
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| Country | Link |
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| CN (1) | CN103594409A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107342257A (en) * | 2017-07-18 | 2017-11-10 | 罗博特科智能科技股份有限公司 | A kind of not damaged silicon wafer sucking disc |
| CN107481964A (en) * | 2017-07-18 | 2017-12-15 | 罗博特科智能科技股份有限公司 | A kind of silicon chip batch suction means |
| CN115339231A (en) * | 2022-09-07 | 2022-11-15 | 西安创研电子科技有限公司 | Nitrogen oxygen sensor chip side electrode printing clamping device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002517088A (en) * | 1998-05-27 | 2002-06-11 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | Batch type end effector for semiconductor wafer handling |
| CN1754629A (en) * | 2004-08-31 | 2006-04-05 | 东京応化工业株式会社 | Base board platform and base board adsorption and peel off method |
| CN1891589A (en) * | 2005-07-04 | 2007-01-10 | 东芝机械株式会社 | Method and apparatus for carrying a plate-shaped part |
| CN101114604A (en) * | 2006-07-24 | 2008-01-30 | 细美事有限公司 | Apparatus and method for transferring substrate |
| CN102753312A (en) * | 2010-07-02 | 2012-10-24 | 富创得工程公司 | Thin substrate, mass-transfer bernoulli end-effector |
| CN103354216A (en) * | 2013-07-02 | 2013-10-16 | 中国电子科技集团公司第四十八研究所 | Atmosphere manipulator terminal holder transferring solar cell pieces in batch |
-
2013
- 2013-10-23 CN CN201310500266.8A patent/CN103594409A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002517088A (en) * | 1998-05-27 | 2002-06-11 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | Batch type end effector for semiconductor wafer handling |
| CN1754629A (en) * | 2004-08-31 | 2006-04-05 | 东京応化工业株式会社 | Base board platform and base board adsorption and peel off method |
| CN1891589A (en) * | 2005-07-04 | 2007-01-10 | 东芝机械株式会社 | Method and apparatus for carrying a plate-shaped part |
| CN101114604A (en) * | 2006-07-24 | 2008-01-30 | 细美事有限公司 | Apparatus and method for transferring substrate |
| CN102753312A (en) * | 2010-07-02 | 2012-10-24 | 富创得工程公司 | Thin substrate, mass-transfer bernoulli end-effector |
| CN103354216A (en) * | 2013-07-02 | 2013-10-16 | 中国电子科技集团公司第四十八研究所 | Atmosphere manipulator terminal holder transferring solar cell pieces in batch |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107342257A (en) * | 2017-07-18 | 2017-11-10 | 罗博特科智能科技股份有限公司 | A kind of not damaged silicon wafer sucking disc |
| CN107481964A (en) * | 2017-07-18 | 2017-12-15 | 罗博特科智能科技股份有限公司 | A kind of silicon chip batch suction means |
| CN107481964B (en) * | 2017-07-18 | 2023-08-25 | 罗博特科智能科技股份有限公司 | Silicon wafer batch sucking device |
| CN115339231A (en) * | 2022-09-07 | 2022-11-15 | 西安创研电子科技有限公司 | Nitrogen oxygen sensor chip side electrode printing clamping device |
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Application publication date: 20140219 |