CN202816897U - Vacuum suction nozzle for transferring semiconductor electronic elements - Google Patents
Vacuum suction nozzle for transferring semiconductor electronic elements Download PDFInfo
- Publication number
- CN202816897U CN202816897U CN 201220440075 CN201220440075U CN202816897U CN 202816897 U CN202816897 U CN 202816897U CN 201220440075 CN201220440075 CN 201220440075 CN 201220440075 U CN201220440075 U CN 201220440075U CN 202816897 U CN202816897 U CN 202816897U
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- chip
- suction nozzle
- vacuum chamber
- sucker
- vacuum
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Abstract
The utility model relates to the technical field of processing and manufacturing semiconductor elements, and specifically relates to a vacuum suction nozzle for transferring semiconductor electronic elements. The vacuum suction nozzle comprises a suction pipe, a sucker is connected with a lower end of the suction pipe, a communicated vacuum chamber is arranged in the sucker and the suction pipe, and an opening of the vacuum chamber is arranged at a lower terminal of the sucker; the chamber diameter of the vacuum chamber is 0.9-1.1mm. When a chip needs to be transferred, the sucker is aligned to the chip, and the vacuum chamber is vacuumized, such that the chip is sucked by the sucker and kept being fixed on the sucker under the action of atmospheric pressure. Besides, the chamber diameter of the vacuum chamber ensures that a sufficient suction can be generated by the sucker to absorb the chip during the process, thereby ensuring that the chip is not shifted because of insufficient suction of the sucker during the transfer process of the chip, and improving the accuracy of chip transfer.
Description
Technical field
The utility model relates to semiconductor components and devices processing and manufacturing technical field, particularly a kind of vacuum slot for transferring the semi-conductor electricity sub-element.
Background technology
Along with the progress of society, the development of science and technology, semiconductor integrated circuit chip is little because of its volume, and disposal ability obtains using more and more widely by force.And in the production process of semiconductor integrated circuit chip, it is encapsulated is important work, because that encapsulation can be played is fixing, sealing, protection chip and strengthen the effect of the aspects such as its electric heating property.
In the encapsulation process of semiconductor integrated circuit chip, because a plurality of different operations are arranged, so must there be a kind of instrument accurately semiconductor integrated circuit chip to be transplanted on the different stations.Because semiconductor integrated circuit chip is accurate device, so that its handover instrument also must need is more accurate, and can not be to the semiconductor integrated circuit chip injury in the handover process, and vacuum slot can just satisfy this demand.But exist in existing technology, suction nozzle is generally less to the absorption affinity of semiconductor integrated circuit chip, thereby easy because the effect of inertia causes its position to produce skew in the process of transferring semiconductor integrated circuit chip.
Therefore, for solving weak point of the prior art, provide a kind of vacuum slot that is used for the handover semiconductor product with larger absorption affinity to seem particularly important.
Summary of the invention
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and a kind of vacuum slot of be used for transferring the semi-conductor electricity sub-element with larger suction is provided.
The purpose of this utility model is achieved through the following technical solutions:
A kind of vacuum slot for transferring semiconductor product is provided, has included suction pipe, the lower end of described suction pipe is connected with suction nozzle, is provided with the vacuum chamber of connection in described suction pipe and the suction nozzle, and an accent of described vacuum chamber is arranged at the bottom of described suction nozzle; The chamber of described vacuum chamber directly is 0.9mm ~ 1.1mm.
Wherein, another accent of described vacuum chamber is arranged at the side of described suction pipe.
Wherein, described suction pipe upper end is connected with linking arm, and described linking arm upper end is provided with fixed part.
Wherein, the cross section of described suction nozzle is the rectangle with straight chamfering.
Wherein, described suction nozzle is made by elastomeric material.
Wherein, the chamber of described vacuum chamber directly is 1mm.
The beneficial effects of the utility model: the utility model provides a kind of vacuum slot for transferring the semi-conductor electricity sub-element, include suction pipe, the lower end of described suction pipe is connected with suction nozzle, be provided with the vacuum chamber of connection in described suction pipe and the suction nozzle, an accent of described vacuum chamber is arranged at the bottom of described suction nozzle; The chamber of described vacuum chamber directly is 0.9mm ~ 1.1mm.When needs were transferred chip, suction nozzle was aimed at chip, and vacuum chamber is pumped to vacuum, and suction nozzle can hold chip and under the effect of atmospheric pressure chip be remained fixed on the suction nozzle at this moment.And the chamber of vacuum chamber footpath size guarantees also that suction nozzle can produce enough attractions in this process chip is adsorbed, thereby guarantee in the process of transferring chip, can too littlely owing to the attraction of suction nozzle not cause the chip generation biased, improved the accuracy of transferring chip.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the internal structure schematic diagram of the embodiment of a kind of vacuum slot for transferring the semi-conductor electricity sub-element of the utility model.
Fig. 2 is the structural representation at a visual angle of the embodiment of a kind of vacuum slot for transferring the semi-conductor electricity sub-element of the utility model.
Fig. 3 is the structural representation at another visual angle of the embodiment of a kind of vacuum slot for transferring the semi-conductor electricity sub-element of the utility model.
In Fig. 1 to Fig. 3, include:
1---suction pipe, 2---suction nozzle, 3---vacuum chamber, 4---linking arm, 5---fixed part.
Embodiment
With the following Examples the utility model is further described.
The embodiment of a kind of vacuum slot for transferring the semi-conductor electricity sub-element of the utility model, as shown in Figure 1 to Figure 3, include suction pipe 1, the lower end of described suction pipe 1 is connected with suction nozzle 2, be provided with the vacuum chamber 3 of connection in described suction pipe 1 and the suction nozzle 2, an accent of described vacuum chamber 3 is arranged at the bottom of described suction nozzle 2; Footpath, the chamber 1mm of described vacuum chamber 3.When needs were transferred chip, suction nozzle was aimed at chip, and vacuum chamber 3 is pumped to vacuum, and suction nozzle can hold chip and under the effect of atmospheric pressure chip be remained fixed on the suction nozzle at this moment.And the chamber of vacuum chamber 3 directly is of moderate size, can guarantee effectively that suction nozzle can produce enough attractions in this process adsorbs chip, thereby guarantee in the process of transferring chip, can too littlely owing to the attraction of suction nozzle not cause the chip generation biased, improved the accuracy of transferring chip.Certainly, also can be any numerical value among 0.9mm ~ 1.1mm according to the footpath, chamber of the big or small described vacuum chamber 3 of concrete chip, as long as can effectively adsorb chip.
In the present embodiment, another accent of described vacuum chamber 3 is arranged at the side of described suction pipe 1.Because another accent of described vacuum chamber 3 need to be connected with air extractor, so that vacuum chamber 3 interior air can be taken away at the needs absorption chip.And the setting that the side that this accent is arranged on suction pipe 1 is conducive to air extractor be connected.
In the present embodiment, described suction pipe 1 upper end is connected with linking arm 4, and described linking arm 4 upper ends are provided with fixed part 5.In operation process, fixed part 5 is connected with transfer device, transfer so that transfer device can drive linking arm 4, and then drive the suction nozzle handover that absorption has chip, chip is transplanted on the required station.This apparatus structure is simple, is convenient to simultaneously safeguard in the function that realizes the handover suction nozzle.
In the present embodiment, the cross section of described suction nozzle 2 is the rectangle with straight chamfering.This shape and chip form are comparatively approaching, can better adsorb chip and avoid displacement.Certainly, according to the shape of chip in fact, the cross section of this suction nozzle 2 also can be circle or other shape.
In the present embodiment, described suction nozzle 2 is made by elastomeric material, can produce a buffering to chip when absorption chip, further protects chip.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (6)
1. vacuum slot of be used for transferring the semi-conductor electricity sub-element, include suction pipe (1), the lower end of described suction pipe (1) is connected with suction nozzle (2), it is characterized in that: be provided with the vacuum chamber (3) of connection in described suction pipe (1) and the suction nozzle (2), an accent of described vacuum chamber (3) is arranged at the bottom of described suction nozzle (2); The chamber of described vacuum chamber (3) directly is 0.9mm ~ 1.1mm.
2. a kind of vacuum slot for transferring the semi-conductor electricity sub-element as claimed in claim 1, it is characterized in that: another accent of described vacuum chamber (3) is arranged at the side of described suction pipe (1).
3. a kind of vacuum slot for transferring the semi-conductor electricity sub-element as claimed in claim 1, it is characterized in that: described suction pipe (1) upper end is connected with linking arm (4), and described linking arm (4) upper end is provided with fixed part (5).
4. a kind of vacuum slot for transferring the semi-conductor electricity sub-element as claimed in claim 1, it is characterized in that: the cross section of described suction nozzle (2) is the rectangle with straight chamfering.
5. a kind of vacuum slot for transferring the semi-conductor electricity sub-element as claimed in claim 1, it is characterized in that: described suction nozzle (2) is the elasticity suction nozzle.
6. a kind of vacuum slot for transferring the semi-conductor electricity sub-element as claimed in claim 1, it is characterized in that: the chamber of described vacuum chamber (3) directly is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440075 CN202816897U (en) | 2012-08-31 | 2012-08-31 | Vacuum suction nozzle for transferring semiconductor electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440075 CN202816897U (en) | 2012-08-31 | 2012-08-31 | Vacuum suction nozzle for transferring semiconductor electronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816897U true CN202816897U (en) | 2013-03-20 |
Family
ID=47875738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220440075 Expired - Fee Related CN202816897U (en) | 2012-08-31 | 2012-08-31 | Vacuum suction nozzle for transferring semiconductor electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106179978A (en) * | 2015-12-31 | 2016-12-07 | 桂林斯壮微电子有限责任公司 | A kind of suction nozzle of testing, sorting machine |
-
2012
- 2012-08-31 CN CN 201220440075 patent/CN202816897U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106179978A (en) * | 2015-12-31 | 2016-12-07 | 桂林斯壮微电子有限责任公司 | A kind of suction nozzle of testing, sorting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20130831 |