CN202888138U - Panel of wafer sucker for glass diode - Google Patents
Panel of wafer sucker for glass diode Download PDFInfo
- Publication number
- CN202888138U CN202888138U CN 201220067231 CN201220067231U CN202888138U CN 202888138 U CN202888138 U CN 202888138U CN 201220067231 CN201220067231 CN 201220067231 CN 201220067231 U CN201220067231 U CN 201220067231U CN 202888138 U CN202888138 U CN 202888138U
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- Prior art keywords
- hole
- concave station
- diode
- bench
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A panel of a wafer sucker for a glass diode has an upper bottom face provided with a recessed bench. The periphery of the recessed bench is provided with limiting holes and connecting holes penetrating a lower bottom face along the side. The lower bottom face is provided with a recessed bench concentric to the recessed bench on the upper bottom face. A plurality of sucking holes arranged in a square array are penetrating the bottom of the recessed bench on the lower bottom face. A pipe screwed hole is arranged on the side surface and communicated with the recessed bench on the lower bottom face. The upper part of each sucking hole is a rectangular hole. The shape of the rectangular hole is similar to the electrode surface of the diode while the size is slightly larger than that of the electrode surface. In this way, a diode chip sucked inside the hole can easily block the small hole on the hole bottom center and prevent another chip from being sucked by the sucking hole. The problem that a conventional panel can suck two diode chips in the hole simultaneously is thus thoroughly solved. A severe waste of materials and manpower generated due to the above-mentioned problem is prevented. Furthermore, the production efficiency is improved.
Description
Technical field:
The utility model relates to the diode production field, relates in particular to the panel that a kind of glass sealed diode is used chuck.
Background technology:
Glass sealed diode refers to encapsulate with the tube core of glass tube to diode, has one blanking procedure, this operation need to use a kind of particular tool that is referred to as in the industry " chuck " in the process of this encapsulation.
Described " chuck " is by panel, base plate and hollow handle consist of, with reference to figure 1, Fig. 2, Fig. 1 is the longitudinal section view of existing panel, Fig. 2 is the enlarged drawing of the interior part of circle A among Fig. 1, as shown in FIG., the upper bottom surface of panel is provided with concave station 2, being provided with spacing hole along the limit around the concave station (does not draw among the figure with the connecting hole that runs through bottom surface, spacing hole 6 among its situation such as Fig. 5, connecting hole 5 is cylinder mutually), bottom surface is provided with the concave station 7 concentric with concave station described in the upper bottom surface 2, has some suckers 9 by the square array setting to run through described concave station 2,7 bottom; Being provided with a gas thread hole on the side communicates with concave station 7 on the bottom surface and (does not draw among the figure, gas thread hole 1 among its situation such as Fig. 5 is identical), the section of tying of described sucker 9 is that cylindrical hole 13 and described concave station section 2 communicate, the center has aperture 8 to communicate with the top of the suction hole 10 of below at the bottom of the hole of cylindrical hole 13, the bottom of suction hole 10 communicates with concave station 7, and described cylindrical hole 13 is used for placing and the catching diode chip; Base plate is connected on the bottom surface of panel its concave station 7 sealings; Described hollow handle is connected with a tracheae, be connected with described gas thread hole, an end of its tracheae communicates with described concave station 7 after connecting, the other end is connected with air exhauster, during use, by the attraction of air-flow, the some diode chip for backlight unit that are deposited in advance on the described concave station 2 are drawn onto respectively in the cylindrical hole 13, reach utilize this instrument in advance diode chip for backlight unit is placed and positioning panel in the purpose of 13 li of cylindrical holes, in order to once these chips are placed in the glass tube of equal number.
Because during encapsulation, a glass tube can only be put into a chip, and the chip that requires to put into keeps flat on the lead-in wire plane of glass tube, the setting situation can not be arranged, so during blanking, require to have in each cylindrical hole on the panel chip to be attracted to the inside, with reference to figure 3, Fig. 3 is the schematic diagram that has adsorbed a diode chip for backlight unit in the existing sucker, and among Fig. 3, diode chip for backlight unit 12 is attracted in the cylindrical hole 13 on the sucker 9 with the state that keeps flat, this is a kind of desirable adsorption effect, but in actual use, the probability that a chip is advanced in a this hole is not high, and the phenomenon of 2 chips of hole absorption occurs usually, with reference to figure 4,5, Fig. 4, Fig. 5 all is the schematic diagrames that adsorbed 2 diode chip for backlight unit in the existing sucker, Fig. 4, in 5, respectively there are 2 diode chip for backlight unit 12 being tilted and are adsorbed in the cylindrical hole 13.The reason that causes is to be used in the described sucker 9 to place the structure with the cylindrical hole 13 of catching diode chip 12, because this hole is circular, diode chip for backlight unit then is the positive foursquare thin slice that is, so only have when diode chip for backlight unit is being put down in the inspiration hole, could effectively block described aperture 8, make this sucker lose the suction that adsorbs again the another one chip, otherwise, Fig. 4 or phenomenon shown in Figure 5 just occur.
This shows, the panel of existing chuck exists same sucker to adsorb easily the deficiency of 2 diode chip for backlight unit, this deficiency not only causes produces defective products, raw material have been wasted, also affected production efficiency, because at present in blanking procedure, chuck spends time of 10 minutes to get rid of the problem in many in a hole with regard to needs.According to statistics, because of above-mentioned deficiency, the production line of glass sealed diode enterprise in per month causes about about 140,000 yuan material and manpower loss.
The utility model content:
In order to solve the deficiency that panel exists in the existing chuck, the utility model is to provide a kind of new glass sealed diode panel of chuck, it is the new technical scheme that proposes on the basis of existing technology, and compared with prior art, the top of sucker is oblong aperture in the described panel.Its technical scheme is as follows:
A kind of glass sealed diode panel of chuck, its upper bottom surface is provided with concave station, be provided with spacing hole around the concave station along the limit and run through the connecting hole of bottom surface, bottom surface is provided with the concave station concentric with concave station described in the upper bottom surface, has some suckers by the square array setting to run through the bottom of described concave station; Being provided with a gas thread hole on the side communicates with concave station on the bottom surface, the top of described sucker is that slot and described concave station section communicate, the center has aperture to communicate with the top of the suction hole of below at the bottom of the hole of slot, the bottom of suction hole communicates with concave station, described slot is used for placing and the catching diode chip, and its shape becomes approximation relation with the electrode surface of diode chip for backlight unit.
Length and the roomy 3-5mm of the length of described slot and wide thick section than diode chip for backlight unit.
The beneficial effects of the utility model are: because glass sealed diode is slot with the panel of chuck, and the shape of described slot becomes approximation relation with the electrode surface of diode, and size is bigger, described electrode surface is the face of welding electrode on the diode chip for backlight unit, so be sucked into the aperture that diode chip for backlight unit in the hole is very easily blocked center at the bottom of its hole, make this sucker lose the suction that adsorbs again the another one chip, thoroughly solve existing panel and adsorbed simultaneously 2 diode chip for backlight unit in the hole, caused material and manpower serious waste and the low problem of production efficiency.
Description of drawings:
1, Fig. 1 is the longitudinal section view of existing panel;
2, Fig. 2 is the enlarged drawing of the interior part of circle A among Fig. 1;
3, Fig. 3 is the schematic diagram that has adsorbed a diode chip for backlight unit in the existing sucker;
4, the schematic diagram (example 1) that has adsorbed 2 diode chip for backlight unit in the existing sucker of Fig. 4;
5, the schematic diagram (example 2) that has adsorbed 2 diode chip for backlight unit in the existing sucker of Fig. 5;
6, Fig. 6 is the structural representation of panel described in the utility model;
7, Fig. 7 is the profile of B-B among Fig. 6;
8, Fig. 8 is the enlarged drawing of C among Fig. 6;
9, Fig. 9 is the enlarged drawing of D among Fig. 7.
Embodiment:
Below in conjunction with accompanying drawing the panel of glass sealed diode described in the utility model with chuck is further elaborated.
With reference to figure 6～9, as shown in these figures, the described glass sealed diode panel of chuck, its upper bottom surface is provided with concave station 2, be provided with spacing hole 6 around the concave station 2 along the limit and run through the connecting hole 5 of bottom surface, bottom surface is provided with the concave station 7 concentric with concave station described in the upper bottom surface 2, has some suckers 9 by the square array setting to run through described concave station 2,7 bottom; Being provided with a gas thread hole 1 on the side communicates with concave station 7 on the bottom surface, the top of described sucker 9 is that slot 3 and 2 ones of described concave stations communicate, the center has aperture 8 to communicate with the top of the suction hole 10 of below at the bottom of the hole of slot 3, the bottom of suction hole 10 communicates with concave station 7, described slot 3 is used for placing and the catching diode chip, and its shape becomes approximation relation with the electrode surface of diode chip for backlight unit.
The shape of described slot becomes approximation relation with the electrode surface of diode chip for backlight unit, be length and wide length and the roomy 3-5mm than diode chip for backlight unit electrode surface of slot, its objective is and make diode chip for backlight unit easily by in the described slot of air-flow inspiration, and can not tilt after entering, so that chip is blocked aperture 8 fully, make the air-flow that no longer forms absorption in this hole.
Here need to prove, when using panel blanking described in the utility model, although being inhaled into diode chip for backlight unit in the described slot 3 is standing and is being positioned in the hole, but as everybody knows, because the silicon chip of chip partly is foursquare thin slice, and the front center of silicon chip has the silver point of projection, so the center of gravity of whole chip not in silicon chip in the heart, but move to a lateral deviation of silver point, the chip of adding in the described slot 3 is held by air-flow, so when sucker vertically covers on glass tube, after turning off air valve, chip falls naturally with regard to losing suction, in the process that falls, a side of silver point is arranged because of the center of gravity deflection of chip, so naturally topple over to that face that silver point is arranged, that that silver point namely arranged faces down and falls in glass tube, therefore moves the chip that is put in the glass tube and keeps flat, and meets the requirement of encapsulation.
Claims (2)
1. glass sealed diode is with the panel of chuck, its upper bottom surface is provided with concave station (2), be provided with spacing hole (6) around the concave station (2) along the limit and run through the connecting hole (5) of bottom surface, bottom surface is provided with the concave station (7) concentric with concave station described in the upper bottom surface (2), has some suckers (9) that arrange by square array to run through the bottom of described concave station (2,7); Being provided with a gas thread hole (1) on the side communicates with concave station (7) on the bottom surface, it is characterized in that: the top of described sucker (9) is that slot (3) and described concave station (2) section communicate, the center has aperture (8) to communicate with the top of the suction hole (10) of below at the bottom of the hole of slot (3), and the bottom of suction hole (10) communicates with concave station (7).
2. glass sealed diode according to claim 1 is characterized in that with the panel of chuck: length and the roomy 3-5mm of the length of described slot (3) and wide electrode surface than diode chip for backlight unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220067231 CN202888138U (en) | 2012-02-28 | 2012-02-28 | Panel of wafer sucker for glass diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220067231 CN202888138U (en) | 2012-02-28 | 2012-02-28 | Panel of wafer sucker for glass diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888138U true CN202888138U (en) | 2013-04-17 |
Family
ID=48079533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220067231 Expired - Fee Related CN202888138U (en) | 2012-02-28 | 2012-02-28 | Panel of wafer sucker for glass diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888138U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346114A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | Vacuum suction pen not linked to dust of concentrating photovoltaic battery piece |
| CN104392951A (en) * | 2014-10-09 | 2015-03-04 | 昆山诃德新能源科技有限公司 | Concentrating solar cell dust-proof vacuum WAND |
| CN106881512A (en) * | 2017-04-17 | 2017-06-23 | 如皋市大昌电子有限公司 | A kind of bulk quantity of chips welds detent mechanism |
-
2012
- 2012-02-28 CN CN 201220067231 patent/CN202888138U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103346114A (en) * | 2013-06-15 | 2013-10-09 | 成都聚合科技有限公司 | Vacuum suction pen not linked to dust of concentrating photovoltaic battery piece |
| CN104392951A (en) * | 2014-10-09 | 2015-03-04 | 昆山诃德新能源科技有限公司 | Concentrating solar cell dust-proof vacuum WAND |
| CN106881512A (en) * | 2017-04-17 | 2017-06-23 | 如皋市大昌电子有限公司 | A kind of bulk quantity of chips welds detent mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20150228 |
|
| EXPY | Termination of patent right or utility model |