CN103560104B - Vacuum suction conveyer and substrate convey method - Google Patents
Vacuum suction conveyer and substrate convey method Download PDFInfo
- Publication number
- CN103560104B CN103560104B CN201310542460.2A CN201310542460A CN103560104B CN 103560104 B CN103560104 B CN 103560104B CN 201310542460 A CN201310542460 A CN 201310542460A CN 103560104 B CN103560104 B CN 103560104B
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- 239000000758 substrate Substances 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims abstract description 73
- 230000005540 biological transmission Effects 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 description 4
- 238000013467 fragmentation Methods 0.000 description 4
- 238000006062 fragmentation reaction Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a kind of vacuum suction conveyer and substrate convey method, relate to display fabrication techniques field, improve the reliability when substrate is fixed.This vacuum suction conveyer, comprise: vacuum adsorption plate, described vacuum adsorption plate has hollow cavity and adsorbing plane, described adsorbing plane is provided with the adsorption hole that multiple and described hollow cavity is communicated with, and described vacuum adsorption plate is also provided with the vacuum tube be communicated with described hollow cavity.
Description
Technical field
The present invention relates to display fabrication techniques field, particularly relate to a kind of vacuum suction conveyer and substrate convey method.
Background technology
At present, in the manufacture process of display, need to carry out various technique at glass substrate, need to utilize micro examination machine to carry out microcosmic detection to glass substrate after a lot of technique completes, to avoid bad generation.When carrying out the microcosmic detection of substrate, need by vacuum suction conveyer substrate fixed and drive substrate to move.
As shown in Figure 1, vacuum suction conveyer comprises the multiple vacuum cups 2 for sorbing substrate 1, each vacuum cup 2 is communicated with dynamics factory room pipe separately through a vacuum tube, and multiple vacuum cup 2 is spaced and the side edge being adsorbed on substrate 1 is fixing with what realize substrate 1.But the reliability of existing vacuum suction conveyer when fixing base is lower, is embodied in: stressed different due between binding domain from non-binding domain, substrate edges distortion can be caused, thus cause substrate crushing; In addition, the multiple vacuum cups after long-time use cannot ensure to be in same level, can cause cannot carrying out good fixing to substrate, need to carry out calibration adjustments.
Summary of the invention
The invention provides a kind of vacuum suction conveyer and substrate convey method, improve the reliability when substrate is fixed.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
On the one hand, a kind of vacuum suction conveyer is provided, comprises:
Vacuum adsorption plate, described vacuum adsorption plate has hollow cavity and adsorbing plane, described adsorbing plane is provided with the adsorption hole that multiple and described hollow cavity is communicated with, and described vacuum adsorption plate is also provided with the vacuum tube be communicated with described hollow cavity.
Particularly, described vacuum tube is provided with vacuum control valve.
Particularly, above-mentioned vacuum suction conveyer also comprises:
Transmission device, described vacuum adsorption plate is fixedly installed on described transmission device;
Described transmission device is also provided with fixture, and described fixture has pressure and puts end, and described pressure puts end for close described vacuum adsorption plate to push down the substrate that the adsorbing plane of described vacuum adsorption plate adsorbs.
Particularly, described vacuum adsorption plate is fixedly installed on described transmission device by fixed support.
Particularly, described fixture comprises stiff end and described pressure puts end;
Described fixture is articulated with on described transmission device by described stiff end, described fixture along described stiff end rotate make described pressure put end near or away from described vacuum adsorption plate.
Preferably, described fixture is multiple, and described multiple fixture spaced set is a row.
Preferably, described multiple adsorption hole is evenly arranged on described adsorbing plane.
On the other hand, a kind of substrate convey method is provided, comprises: utilize above-mentioned vacuum suction conveyer to transmit described substrate.
Particularly, the described adsorbing plane in described vacuum suction conveyer and the region of described substrate contacts do not exceed the edge non-display area of described substrate.
Particularly, describedly utilize above-mentioned vacuum suction conveyer to transmit described substrate to comprise:
Transporting described substrate makes the vacuum adsorption plate in described vacuum suction conveyer be positioned at the lower surface edge of described substrate;
Described substrate is made to be fixed on described vacuum adsorption plate by adsorption hole by absorption after being vacuumized by the vacuum tube in described vacuum suction conveyer;
Control described vacuum adsorption plate to move to transmit described substrate.
Vacuum suction conveyer provided by the invention and substrate convey method, by the vacuum adsorption plate with flat surface, substrate is fixed, flat board between multiple adsorption hole is played a supporting role to substrate, thus makes the stressed more even of substrate, decreases the possibility of substrate distortion fragmentation; And due to the as a whole structure of vacuum adsorption plate, the state of adsorbing plane can be remained, without the need to carrying out horizontal alignment adjustment.Therefore improve the reliability when substrate is fixed.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of traditional a kind of vacuum suction conveyer;
Fig. 2 is the structural representation of a kind of vacuum suction conveyer in the embodiment of the present invention;
Schematic diagram when Fig. 3 is vacuum suction conveyer sorbing substrate in Fig. 2;
Fig. 4 is the structural representation of another kind of vacuum suction conveyer in the embodiment of the present invention;
Schematic diagram when Fig. 5 is vacuum suction conveyer sorbing substrate in Fig. 4;
Fig. 6 is the flow chart of a kind of substrate convey method in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 2, embodiments provide a kind of vacuum suction conveyer, comprise: vacuum adsorption plate 3, vacuum adsorption plate 3 has hollow cavity and adsorbing plane 31, adsorbing plane 31 is provided with multiple adsorption hole 32 be communicated with this hollow cavity, vacuum adsorption plate 3 is also provided with the vacuum tube 4 be communicated with this hollow cavity, vacuum tube 4, for being communicated with dynamics factory room pipe, is vacuumized by vacuum tube 4.
Particularly, as shown in Figure 3, vacuum adsorption plate 3 is positioned over the lower surface edge place of substrate 1, and adsorbing plane 31 is attached at substrate 1 lower surface, is vacuumized by vacuum tube 4, and substrate 1 is fixed on vacuum adsorption plate 3 by absorption by adsorption hole 32.Afterwards namely can by the transmission realizing substrate 1 of Mobile vacuum adsorption plate 3.
Vacuum suction conveyer in the present embodiment, by the vacuum adsorption plate with flat surface, substrate is fixed, flat board between multiple adsorption hole is played a supporting role to substrate, thus makes the stressed more even of substrate, decreases the possibility of substrate distortion fragmentation; And due to the as a whole structure of vacuum adsorption plate, the state of adsorbing plane can be remained, without the need to carrying out horizontal alignment adjustment.Therefore improve the reliability when substrate is fixed.
Particularly, vacuum tube 4 is provided with vacuum control valve, and because vacuum tube 4 is communicated with dynamics factory room pipe, power factory building can provide power to vacuumize always, only vacuum control valve need be set on vacuum tube 4, thus whether control vacuum adsorption plate 3 works easily.
Particularly, as shown in Figure 4, above-mentioned vacuum suction conveyer also comprises: transmission device 5, and vacuum adsorption plate 3 is fixedly installed on transmission device 5 by fixed support 34; Transmission device 5 is also provided with fixture 6, fixture 6 has pressure and puts end 61, pressure puts end 61 for close vacuum adsorption plate 3 to push down the substrate that the adsorbing plane 31 of vacuum adsorption plate 3 adsorbs, owing to needing to carry out contraposition adjustment by other devices to the edge of substrate, the length that therefore can arrange vacuum adsorption plate is slightly less than the length of side of substrate.
Particularly, fixture 6 comprises stiff end 62 and pressure puts end 61; Fixture 6 is articulated with on transmission device 5 by stiff end 62, fixture 6 along stiff end 62 rotate make pressure put end 61 near or away from vacuum adsorption plate 3.
Preferably, above-mentioned fixture 6 is multiple, and multiple fixture 6 spaced set is a row.
Preferably, above-mentioned multiple adsorption hole 32 is evenly arranged on adsorbing plane 31.
The concrete course of work is: pressure puts end 61 away from vacuum adsorption plate 3, transporting substrate makes vacuum adsorption plate 3 be positioned at the lower surface edge of substrate, vacuum control valve is opened, substrate is made to be fixed on vacuum adsorption plate 3 by adsorption hole 32 by absorption after being vacuumized by vacuum tube 4, as shown in Figure 5, rotate make pressure put end 61 near vacuum adsorption plate 3 to clamp the top surface edge of substrate 1 by controlling fixture 6 afterwards, the dry gas that board simultaneously below substrate 1 continues upwards to produce certain pressure makes substrate 1 be in suspended state, when negative pressure of vacuum value when detecting that vacuum adsorption plate 3 adsorbs exceedes preset value, namely being fixed well to substrate 1 is shown, now can control transmission device 5 carry out move operation thus make vacuum adsorption plate 3 drive substrate 1 to move, realize the transmission of substrate 1 and substrate 1 is detected.
Vacuum suction conveyer in the present embodiment, by the vacuum adsorption plate with flat surface, substrate is fixed, flat board between multiple adsorption hole is played a supporting role to substrate, thus makes the stressed more even of substrate, decreases the possibility of substrate distortion fragmentation; And due to the as a whole structure of vacuum adsorption plate, the state of adsorbing plane can be remained, without the need to carrying out horizontal alignment adjustment; Meanwhile, by fixture and suction suction attached plate, substrate is clamped, prevent substrate slippage further.Therefore improve the reliability when substrate is fixed.
The embodiment of the present invention also provides a kind of substrate convey method, comprising: utilize above-mentioned vacuum suction conveyer to transmit described substrate.The concrete structure of this vacuum suction conveyer, principle and substrate transport process are same as the previously described embodiments, do not repeat them here.
Particularly, as shown in Figure 3, the region that the adsorbing plane 31 in described vacuum suction conveyer contacts with substrate 1 does not exceed the edge non-display area of substrate 1.
Particularly, as shown in Figure 6, above-mentionedly utilize above-mentioned vacuum suction conveyer to transmit described substrate specifically to comprise:
Step 101, transport described substrate and make the vacuum adsorption plate in described vacuum suction conveyer be positioned at the lower surface edge of described substrate;
Step 102, vacuumized by the vacuum tube in described vacuum suction conveyer after make described substrate be fixed on described vacuum adsorption plate by adsorption hole by absorption;
Step 103, control described vacuum adsorption plate and move to transmit described substrate.
Substrate convey method in the present embodiment, by the vacuum adsorption plate with flat surface, substrate is fixed, flat board between multiple adsorption hole is played a supporting role to substrate, thus makes the stressed more even of substrate, decreases the possibility of substrate distortion fragmentation; And due to the as a whole structure of vacuum adsorption plate, the state of adsorbing plane can be remained, without the need to carrying out horizontal alignment adjustment.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (8)
1. a vacuum suction conveyer, is characterized in that, comprising:
Vacuum adsorption plate, transmission device and board, described vacuum adsorption plate has hollow cavity and adsorbing plane, described adsorbing plane is provided with the adsorption hole that multiple and described hollow cavity is communicated with, and described vacuum adsorption plate is also provided with the vacuum tube be communicated with described hollow cavity; Described vacuum adsorption plate is fixedly installed on described transmission device;
Described transmission device is also provided with fixture, and described fixture has pressure and puts end, and described pressure puts end for close described vacuum adsorption plate to push down the substrate that the adsorbing plane of described vacuum adsorption plate adsorbs; Described fixture comprises stiff end and described pressure puts end; Described fixture is articulated with on described transmission device by described stiff end, described fixture along described stiff end rotate make described pressure put end near or away from described vacuum adsorption plate;
Described board continues upwards to produce dry gas in the below of described substrate makes substrate be in suspended state, when negative pressure of vacuum value when detecting that described vacuum adsorption plate adsorbs exceedes preset value, transmission device moves described vacuum adsorption plate, makes described vacuum adsorption plate drive described substrate to move.
2. vacuum suction conveyer according to claim 1, is characterized in that,
Described vacuum tube is provided with vacuum control valve.
3. vacuum suction conveyer according to claim 1, is characterized in that,
Described vacuum adsorption plate is fixedly installed on described transmission device by fixed support.
4. vacuum suction conveyer according to claim 1, is characterized in that,
Described fixture is multiple, and described multiple fixture spaced set is a row.
5. vacuum suction conveyer according to claim 1, is characterized in that,
Described multiple adsorption hole is evenly arranged on described adsorbing plane.
6. a substrate convey method, comprising: utilize substrate as described in the vacuum suction conveyer transmission according to any one of claim 1-5.
7. method according to claim 6, is characterized in that, the described adsorbing plane in described vacuum suction conveyer and the region of described substrate contacts do not exceed the edge non-display area of described substrate.
8. method according to claim 7, is characterized in that, as described in the vacuum suction conveyer of described utilization according to any one of claim 1-5 transmits, substrate comprises:
Transporting described substrate makes the vacuum adsorption plate in described vacuum suction conveyer be positioned at the lower surface edge of described substrate;
Described substrate is made to be fixed on described vacuum adsorption plate by adsorption hole by absorption after being vacuumized by the vacuum tube in described vacuum suction conveyer;
Control described vacuum adsorption plate to move to transmit described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310542460.2A CN103560104B (en) | 2013-11-05 | 2013-11-05 | Vacuum suction conveyer and substrate convey method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310542460.2A CN103560104B (en) | 2013-11-05 | 2013-11-05 | Vacuum suction conveyer and substrate convey method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103560104A CN103560104A (en) | 2014-02-05 |
| CN103560104B true CN103560104B (en) | 2016-01-20 |
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| CN201310542460.2A Expired - Fee Related CN103560104B (en) | 2013-11-05 | 2013-11-05 | Vacuum suction conveyer and substrate convey method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097633A (en) * | 2015-06-24 | 2015-11-25 | 合肥京东方光电科技有限公司 | Carrying mechanism for offline vacuum adsorption substrate and substrate transferring method |
| US20210245335A1 (en) * | 2016-05-31 | 2021-08-12 | Sakai Display Products Corporation | Substrate holding apparatus |
| CN106494889A (en) * | 2016-12-23 | 2017-03-15 | 合肥欣奕华智能机器有限公司 | A kind of base board delivery device and its control method |
| CN106597708B (en) * | 2016-12-28 | 2019-11-22 | 武汉华星光电技术有限公司 | A kind of substrate detection apparatus |
| CN108872005A (en) * | 2018-07-03 | 2018-11-23 | 京东方科技集团股份有限公司 | A kind of testing agency and transmission equipment |
| CN108861578A (en) * | 2018-08-13 | 2018-11-23 | 深圳市宝德自动化精密设备有限公司 | A kind of vacuum suction transmission device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203254434U (en) * | 2013-05-23 | 2013-10-30 | 河南职业技术学院 | Glass substrate conveying mechanical arm |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002128269A (en) * | 2000-10-27 | 2002-05-09 | Kondo Seisakusho:Kk | Finger for conveying semiconductor substrate |
| KR101032340B1 (en) * | 2004-11-22 | 2011-05-06 | 엘지디스플레이 주식회사 | substrate transporting robot for flat panel display device |
| JP2007260862A (en) * | 2006-03-29 | 2007-10-11 | Nachi Fujikoshi Corp | Robot |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203254434U (en) * | 2013-05-23 | 2013-10-30 | 河南职业技术学院 | Glass substrate conveying mechanical arm |
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Granted publication date: 20160120 |