CN108307587B - Working method of coating adsorption device of BGA substrate - Google Patents
Working method of coating adsorption device of BGA substrate Download PDFInfo
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- CN108307587B CN108307587B CN201810096518.8A CN201810096518A CN108307587B CN 108307587 B CN108307587 B CN 108307587B CN 201810096518 A CN201810096518 A CN 201810096518A CN 108307587 B CN108307587 B CN 108307587B
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- bga substrate
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- air suction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a working method of a coating adsorption device of a BGA substrate, which comprises a bottom plate, wherein four bearing adsorption mechanisms are arranged on the bottom plate and are respectively arranged on one side of four edges of the upper end surface of the bottom plate; and a supporting block protruding upwards is formed in the middle of the upper end face of the bottom plate, the upper end face of the supporting block is connected with a plurality of second air suction pipelines, and the second air suction pipelines are connected with the vacuum pump. The invention is not easy to break the BGA substrate, can avoid the middle part of the BGA substrate from protruding, and ensures the coating precision and quality of the soldering paste.
Description
This application is a divisional application of the patent application with application number 201610131263.5.
The technical field is as follows:
the invention relates to the technical field of BGA equipment, in particular to a working method of an adsorption device used when a BGA substrate is coated with soldering paste.
background art:
the BGA is a packaging method of the integrated circuit using an organic carrier board, and has the advantages of reduced packaging area, easy tin application, high reliability, good electrical performance, low overall cost, etc., and is popular with consumers. In mass production, a worker usually prints (i.e., applies solder paste) by using a fully automatic printer, and the BGA substrate is fixed in the printer before entering the printer and being applied with solder paste. For a thinner and breakable BGA substrate, when the BGA substrate is placed on the transfer rails of the printer into position, the two transfer rails will clamp the BGA substrate towards each other, which causes the middle portion of the BGA substrate to bulge slightly; on the one hand, the clamping force is easy to break the BGA substrate; on the other hand, since the center of the BGA substrate is protruded, the coating surface of the solder paste on the BGA substrate is uneven, thereby affecting the coating quality of the solder paste, and there is a need for improvement.
The invention content is as follows:
the invention aims to solve the problems in the prior art, and provides a coating adsorption device for a BGA substrate, which is not easy to break the BGA substrate, can avoid the middle part of the BGA substrate from protruding and ensures the coating precision and quality of soldering paste.
The invention relates to a coating adsorption device of a BGA substrate, which comprises a bottom plate, wherein four bearing adsorption mechanisms are arranged on the bottom plate, the four bearing adsorption mechanisms are respectively arranged on one side of four edges of the upper end surface of the bottom plate, each bearing adsorption mechanism comprises a linear slide rail arranged on the upper end surface of the bottom plate, a carrier plate arranged on the linear slide rail in a sliding manner, a vertical plate fixed on the carrier plate and a bearing plate fixed on the vertical plate, adsorption grooves distributed along the longitudinal direction of the bearing plate are formed on the upper end surface of the bearing plate, the inner wall of the bottom of each adsorption groove is connected with a plurality of first air suction pipelines, and the first air suction pipelines are connected with a vacuum pump;
The middle part of the upper end face of the bottom plate is provided with a supporting block protruding upwards, the upper end face of the supporting block and the upper end face of the bearing plate are positioned on the same horizontal plane, the upper end face of the supporting block is connected with a plurality of second air suction pipelines, adsorption ports of the second air suction pipelines are uniformly distributed on the upper end face of the supporting block, and the second air suction pipelines are connected with the vacuum pump.
By means of the technical scheme, when the BGA substrate vacuum sucking device is used, firstly, the BGA substrate to be coated is placed on the supporting block on the bottom plate, the middle of the bottom surface of the BGA substrate is pressed on the supporting block, and the vacuum pump works to suck air through the second air suction pipeline, so that the middle of the BGA substrate is adsorbed on the supporting block; after the BGA base plate is adsorbed on the supporting shoe, according to the specific position of BGA base plate size regulation bearing adsorption apparatus's support plate on linear slide rail, thereby make four bearing plate boards of four bearing adsorption apparatus construct hold up the edge all around of BGA base plate, when the bearing plate board holds up the BGA base plate, the adsorption tank of bearing plate is arranged in on the four sides of bearing plate board, the first suction pipe of being connected with the adsorption tank passes through the effect of vacuum pump and produces the adsorption affinity, make the adsorption tank produce the adsorption tank to the BGA base plate, fore-and-aft adsorption tank can make the four sides of BGA base plate effectively adsorb, the supporting shoe at bottom plate middle part adsorbs the middle part of BGA base plate in addition, be difficult for making the BGA base plate fracture like this, and can avoid the middle part arch of BGA base plate, the precision and the quality of soldering paste coating have been guaranteed.
Preferably, the number of the first air suction pipes connected with the bearing plate is four, the four first air suction pipes are longitudinally distributed along the adsorption tank, the four first air suction pipes are respectively provided with a stop valve, and the four stop valves are linkage stop valves. According to the scheme, when the bearing plate does not support the BGA substrate, the stop valves are in the closed state, the adsorption grooves in the bearing plate do not have adsorption force, when the bearing plate supports the four sides of the BGA substrate, one of the stop valves is opened, the other stop valves are all opened in a linkage mode, the first air suction pipeline sucks air, and therefore the adsorption grooves adsorb the BGA substrate.
Preferably, the number of the linear slide rails in the four supporting and adsorbing mechanisms is four, each group has two linear slide rails, and the carrier plate spans over the two linear slide rails.
Preferably, the supporting plate is horizontally and fixedly arranged in the middle of the vertical plate, and the edge of the BGA substrate can be clamped in a right-angle area formed by the supporting plate and the vertical plate.
preferably, the vacuum pump is arranged on the bottom plate, and the second suction pipeline penetrates through the side wall of the supporting block and is connected with the vacuum pump.
preferably, the cross section of the bottom plate is rectangular or square.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Description of the drawings:
the drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention. Wherein:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial cross-sectional view of FIG. 1;
FIG. 3 is a partial side view of FIG. 1;
fig. 4 is a schematic view of the working state of the present invention.
The specific implementation mode is as follows:
the following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
referring to fig. 1 to 3, the BGA substrate coating and adsorbing device of the present invention includes a base plate 10, the cross section of the base plate is rectangular or square, four supporting and adsorbing mechanisms 20 are disposed on the base plate 10, the four supporting and adsorbing mechanisms are respectively disposed on four sides of the upper end surface of the base plate 10, each supporting and adsorbing mechanism 20 includes a linear guide rail 21 disposed on the upper end surface of the base plate 10, a carrier plate 22 slidably disposed on the linear guide rail, a vertical plate 23 fixed on the carrier plate, and a supporting plate 24 fixed on the vertical plate, the number of the linear guide rails 21 in the four supporting and adsorbing mechanisms 20 is four, each group includes two linear guide rails 21, the carrier plate 22 crosses over the two linear guide rails 21, the supporting plate 24 is horizontally fixed in the middle of the vertical plate 23, the edge of the BGA substrate 90 can be clamped in a right-angle region enclosed by the supporting plate 24 and the vertical plate 23, an adsorption groove 241 longitudinally distributed along the bearing plate 24 is formed on the upper end surface of the bearing plate 24, a plurality of first air suction pipelines 30 are connected to the inner wall of the bottom of the adsorption groove 241, and the first air suction pipelines are connected with a vacuum pump 40.
referring to fig. 1, a supporting block 11 protruding upwards is formed in the middle of the upper end surface of the base plate 10, the upper end surface of the supporting block 11 and the upper end surface of the supporting plate 24 are located on the same horizontal plane, the upper end surface of the supporting block 11 is connected with a plurality of second air suction pipes 50, the suction ports of the second air suction pipes are uniformly distributed on the upper end surface of the supporting block 11, the second air suction pipes 50 are connected with the vacuum pump 40, the vacuum pump 40 is arranged on the base plate 10, and the second air suction pipes 50 penetrate through the side wall of the supporting block 11 and are connected with the vacuum pump 40.
Referring to fig. 2, the number of the first suction pipes 30 connected to the one support plate 24 is four, four first suction pipes 30 are longitudinally distributed along the suction groove 241, the four first suction pipes 30 are respectively provided with one stop valve 60, and the four stop valves 60 are linkage stop valves.
Referring to fig. 4, in use, the BGA substrate 90 to be coated is first placed on the supporting block 11 of the base plate 10 such that the middle portion of the bottom surface of the BGA substrate 90 is pressed against the supporting block 11, and the vacuum pump 40 is operated to suck the air through the second suction pipe 50, so that the middle portion of the BGA substrate 90 is sucked onto the supporting block 11; after the BGA substrate 90 is adsorbed on the supporting block 11, the specific position of the carrier plate 22 supporting the adsorption mechanism 20 on the linear slide rail 21 is adjusted according to the size of the BGA substrate 90, so that the four support plates 24 supporting the suction mechanisms 20 lift up the peripheral edges of the BGA substrate 90, when the BGA substrate 90 is lifted by the support plate 24, four sides of the support plate 24 are placed on the suction grooves 241 of the support plate 24, the first suction pipe 30 connected to the adsorption tank 241 generates an adsorption force by the action of the vacuum pump 40, so that the adsorption groove 241 generates an adsorption force to the BGA substrate 90, the longitudinal adsorption groove 241 can effectively adsorb the four sides of the BGA substrate 90, and the support block 11 at the middle part of the bottom plate 10 adsorbs the middle part of the BGA substrate 90, thereby preventing the BGA substrate 90 from being broken, and the middle part of the BGA substrate 90 can be prevented from being protruded, and the accuracy and quality of solder paste coating can be ensured.
The coating and adsorbing device for BGA substrates provided by the present invention is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the scope of the present invention, and all such changes and substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (4)
1. A working method of a coating adsorption device of a BGA substrate comprises the following steps: firstly, placing a BGA substrate (90) to be coated on a supporting block (11) on a bottom plate (10) to enable the middle part of the bottom surface of the BGA substrate (90) to be pressed on the supporting block (11), and enabling a vacuum pump (40) to work to enable a second air suction pipeline (50) to suck air so as to enable the middle part of the BGA substrate (90) to be adsorbed on the supporting block (11); after the BGA substrate (90) is adsorbed on the supporting block (11), the specific position of the carrier plate (22) for supporting the adsorption mechanism (20) on the linear slide rail (21) is adjusted according to the size of the BGA substrate (90), so that the four supporting plates (24) for supporting the adsorption mechanism (20) support the peripheral edge of the BGA substrate (90), when the supporting plates (24) support the BGA substrate (90), the four sides of the supporting plates (24) are placed on the adsorption grooves (241) of the supporting plates (24), the first air suction pipeline (30) connected with the adsorption grooves (241) generates adsorption force through the action of the vacuum pump (40), so that the adsorption grooves (241) generate adsorption force on the BGA substrate (90), the longitudinal adsorption grooves (241) can effectively adsorb the four sides of the BGA substrate (90), and the supporting block (11) in the middle of the bottom plate (10) adsorbs the middle of the BGA substrate (90), thus, the BGA substrate (90) is not easy to break, the middle part of the BGA substrate (90) can be prevented from being protruded, and the coating precision and quality of the soldering paste are ensured;
The vacuum adsorption device is characterized in that four bearing adsorption mechanisms (20) are arranged on the base plate (10), the four bearing adsorption mechanisms are respectively arranged on one side of four edges of the upper end face of the base plate (10), each bearing adsorption mechanism (20) comprises a linear slide rail (21) arranged on the upper end face of the base plate (10), a carrier plate (22) arranged on the linear slide rail in a sliding mode, a vertical plate (23) fixed on the carrier plate (22) and a bearing plate (24) fixed on the vertical plate, adsorption grooves (241) longitudinally distributed along the bearing plate (24) are formed in the upper end face of the bearing plate, the inner wall of the bottom of each adsorption groove is connected with a plurality of first air suction pipelines (30), and the first air suction pipelines are connected with a vacuum pump (40);
A supporting block (11) which protrudes upwards is formed in the middle of the upper end face of the bottom plate (10), the upper end face of the supporting block and the upper end face of the bearing plate (24) are located on the same horizontal plane, the upper end face of the supporting block (11) is connected with a plurality of second air suction pipelines (50), adsorption ports of the second air suction pipelines are uniformly distributed on the upper end face of the supporting block (11), and the second air suction pipelines (50) are connected with the vacuum pump (40);
the number of the first air suction pipelines (30) connected with one supporting plate (24) is four, the four first air suction pipelines (30) are distributed along the longitudinal direction of the adsorption groove (241), the four first air suction pipelines (30) are respectively provided with a stop valve (60), and the four stop valves (60) are linkage stop valves;
The vacuum pump (40) is arranged on the bottom plate (10), and the second air suction pipeline (50) penetrates through the side wall of the supporting block (11) and is connected with the vacuum pump (40).
2. The method of claim 1, further comprising the steps of: the number of the linear slide rails (21) in the four bearing and adsorbing mechanisms (20) is four, each group is provided with two linear slide rails (21), and the carrier plate (22) stretches across the upper parts of the two linear slide rails (21).
3. The method of claim 2, further comprising the steps of: the supporting plate (24) is horizontally and fixedly arranged in the middle of the vertical plate (23), and the edge of the BGA substrate (90) can be clamped in a right-angle area formed by the supporting plate (24) and the vertical plate (23) in an enclosed mode.
4. The method of claim 1, further comprising the steps of: the cross section of the bottom plate (10) is rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810096518.8A CN108307587B (en) | 2016-03-08 | 2016-03-08 | Working method of coating adsorption device of BGA substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610131263.5A CN105611737B (en) | 2016-03-08 | 2016-03-08 | A kind of coating adsorbent equipment of BGA substrates |
| CN201810096518.8A CN108307587B (en) | 2016-03-08 | 2016-03-08 | Working method of coating adsorption device of BGA substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610131263.5A Division CN105611737B (en) | 2016-03-08 | 2016-03-08 | A kind of coating adsorbent equipment of BGA substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108307587A CN108307587A (en) | 2018-07-20 |
| CN108307587B true CN108307587B (en) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810096518.8A Active CN108307587B (en) | 2016-03-08 | 2016-03-08 | Working method of coating adsorption device of BGA substrate |
| CN201610131263.5A Active CN105611737B (en) | 2016-03-08 | 2016-03-08 | A kind of coating adsorbent equipment of BGA substrates |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610131263.5A Active CN105611737B (en) | 2016-03-08 | 2016-03-08 | A kind of coating adsorbent equipment of BGA substrates |
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| CN (2) | CN108307587B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109383137A (en) * | 2018-09-17 | 2019-02-26 | 宣城凯欧纺织有限公司 | A kind of digit printing device of printed fabric |
| CN110294321A (en) * | 2019-06-27 | 2019-10-01 | 苏州精濑光电有限公司 | A kind of apparatus for fixing substrate |
| CN110634788A (en) * | 2019-10-08 | 2019-12-31 | 重庆电子工程职业学院 | Chip mounting carrier and mounting method |
| CN113539920B (en) * | 2021-07-19 | 2024-04-26 | 天航长鹰(江苏)科技有限公司 | Positioning device for semiconductor chip detection |
| CN114030173A (en) * | 2021-11-26 | 2022-02-11 | 深圳市深科达智能装备股份有限公司 | Turnover jig and automatic attaching equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201800308U (en) * | 2010-10-12 | 2011-04-20 | 东莞市科隆威自动化设备有限公司 | Vacuum suction plate structure for photovoltaic solar printing machine |
| CN105328295A (en) * | 2015-11-20 | 2016-02-17 | 苏州光韵达光电科技有限公司 | BGA (Ball Grid Array) component fixture |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4378301B2 (en) * | 2005-02-28 | 2009-12-02 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and substrate processing program |
| JP2006281729A (en) * | 2005-04-05 | 2006-10-19 | Yamaha Motor Co Ltd | Printing apparatus and printing method |
| TW201509544A (en) * | 2013-09-05 | 2015-03-16 | Rich Chen Automatically Controlled Co Ltd | Substrate coating device and coating method |
| CN205726683U (en) * | 2016-03-08 | 2016-11-23 | 浙江乔兴建设集团湖州智能科技有限公司 | A kind of coating adsorbent equipment of BGA substrate |
-
2016
- 2016-03-08 CN CN201810096518.8A patent/CN108307587B/en active Active
- 2016-03-08 CN CN201610131263.5A patent/CN105611737B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201800308U (en) * | 2010-10-12 | 2011-04-20 | 东莞市科隆威自动化设备有限公司 | Vacuum suction plate structure for photovoltaic solar printing machine |
| CN105328295A (en) * | 2015-11-20 | 2016-02-17 | 苏州光韵达光电科技有限公司 | BGA (Ball Grid Array) component fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105611737A (en) | 2016-05-25 |
| CN105611737B (en) | 2018-08-17 |
| CN108307587A (en) | 2018-07-20 |
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Effective date of registration: 20191115 Address after: 215000 No.138, East Street, Huangqiao street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant after: Suzhou Xiangcheng District Huangqiao Industrial Park Economic Development Co., Ltd Address before: Hu Zhao Cun Zhao Jia Village 330114 Jiangxi city of Nanchang province Xinjian County Xi Xia Town 12 Applicant before: Zhao Lingchen |