TW201509544A - Substrate coating device and coating method - Google Patents
Substrate coating device and coating method Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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Description
本發明是有關於一種塗佈裝置及塗佈方法，特別是指一種基板塗佈裝置及塗佈方法。 The present invention relates to a coating apparatus and a coating method, and more particularly to a substrate coating apparatus and a coating method.
參閱圖1、圖2及圖3，習知的一種基板塗佈裝置1主要包含一承載台11、一取放單元12、一氣泵13、一塗佈單元14及一控制單元15。該承載台11包括一供一基板10設置的吸附區111及至少一空氣通道112，該空氣通道112於該吸附區111的表面形成多數個間隔設置的開口113。該取放單元12用以將該基板10放置或取出於該承載台11的吸附區111。該氣泵13藉由一管路16連通該空氣通道112。該塗佈單元14用以於該基板10上形成一塗佈層17。該控制單元15電連接該取放單元12、該氣泵13及該塗佈單元14。 Referring to FIG. 1 , FIG. 2 and FIG. 3 , a conventional substrate coating apparatus 1 mainly includes a loading platform 11 , a pick-and-place unit 12 , an air pump 13 , a coating unit 14 , and a control unit 15 . The loading platform 11 includes an adsorption zone 111 for a substrate 10 and at least one air channel 112. The air channel 112 forms a plurality of spaced openings 113 on the surface of the adsorption zone 111. The pick-and-place unit 12 is configured to place or take the substrate 10 into the adsorption zone 111 of the loading platform 11 . The air pump 13 communicates with the air passage 112 by a line 16. The coating unit 14 is configured to form a coating layer 17 on the substrate 10 . The control unit 15 is electrically connected to the pick and place unit 12, the air pump 13, and the coating unit 14.
然而上述基板塗佈裝置1的塗佈流程為：經由該控制單元15控制該取放單元12將一基板10置放於該承載台11的吸附區111後，該控制單元15控制該氣泵13對於該承載台11的空氣通道112進行抽氣，使得該空氣通道112的空氣壓力小於外界空氣壓力，藉此，該基板10透過該等開口113受該空氣通道112吸附而固定於該承載台11 的吸附區111；接著，該控制單元15控制該塗佈單元14於該基板10上形成一塗佈層17；之後，該控制單元15控制該氣泵13停止對於該通氣通道112抽氣而轉為進行供氣，使得該空氣通道112的空氣壓力大於外界空氣壓力，藉此，該基板10透過該等開口113受該空氣通道112的空氣壓力向外推而不被吸附固定於該承載台11的吸附區111；最後，該控制單元15控制該取放單元12將形成有該塗佈層17的基板10取出該承載台11的吸附區111。 However, the coating process of the substrate coating apparatus 1 is: after the control unit 15 controls the pick-and-place unit 12 to place a substrate 10 on the adsorption area 111 of the stage 11, the control unit 15 controls the air pump 13 to The air passage 112 of the carrying platform 11 is evacuated such that the air pressure of the air passage 112 is smaller than the outside air pressure, whereby the substrate 10 is fixed to the carrying platform 11 through the openings 113 and adsorbed by the air passage 112. The adsorption unit 111; then, the control unit 15 controls the coating unit 14 to form a coating layer 17 on the substrate 10; afterwards, the control unit 15 controls the air pump 13 to stop pumping the ventilation passage 112 to The air supply is performed such that the air pressure of the air passage 112 is greater than the external air pressure, whereby the substrate 10 is pushed outward through the openings 113 by the air pressure of the air passage 112 without being adsorbed and fixed to the loading platform 11. The adsorption zone 111; finally, the control unit 15 controls the pick-and-place unit 12 to take out the substrate 10 on which the coating layer 17 is formed, and take out the adsorption zone 111 of the stage 11.
在該基板10形成該塗佈層17的過程中，該氣泵13是持續對於該空氣通道112進行抽氣，該基板10則持續受該空氣通道112的該等開口113所產生的吸附力的吸附(該基板10的底面非整面均勻受力，則是對應該等開口113的部分區域受到吸附力)。通常該基板10的厚度約幾百微米厚而具有延展性且易變形，因此該基板10在上述非均勻的受力下會產生暫時形變，進而造成形成於其上的塗佈層17厚度不均勻。除此之外，由於存在於該基板10的底面與該吸附區111的表面間的微粒(particle)(圖未示)呈單點頂撐該基板的底面，在該基板10受到該等開口113強大的負壓吸力時，該基板10因具有延展性則順應該微粒突起彎曲(bending)，因此也會造成形成於其上的塗佈層17厚度不均勻。 During the formation of the coating layer 17 by the substrate 10, the air pump 13 continuously draws air for the air passage 112, and the substrate 10 continues to be adsorbed by the adsorption force generated by the openings 113 of the air passage 112. (The bottom surface of the substrate 10 is not uniformly applied to the entire surface, and the partial region corresponding to the opening 113 is subjected to an adsorption force). Generally, the substrate 10 has a thickness of about several hundred micrometers and is malleable and easily deformed. Therefore, the substrate 10 is temporarily deformed under the above-mentioned non-uniform stress, thereby causing uneven thickness of the coating layer 17 formed thereon. . In addition, since particles (not shown) existing between the bottom surface of the substrate 10 and the surface of the adsorption region 111 are uniaxially supported by the bottom surface of the substrate, the substrate 10 receives the openings 113. In the case of strong negative pressure suction, the substrate 10 is conformed to the grain protrusion due to its ductility, and thus the thickness of the coating layer 17 formed thereon is also uneven.
然而在現今微奈米製程條件需求下，該塗佈層17的厚度均勻控制更是錙銖必較，因此如何在該塗佈層17形成過程中盡可能排除造成該塗佈層17厚度不均勻的因素 是業界共同努力的目標。 However, under the current requirements of the micro-nano process conditions, the uniform control of the thickness of the coating layer 17 is even more important. Therefore, how to make the thickness of the coating layer 17 uneven during the formation of the coating layer 17 is excluded as much as possible. factor It is the goal of the industry to work together.
因此，本發明之目的，即在提供一種塗佈層厚度均勻的基板塗佈裝置及塗佈方法。 Accordingly, it is an object of the present invention to provide a substrate coating apparatus and a coating method having a uniform coating layer thickness.
於是本發明基板塗佈裝置，包含一承載台、一取放單元、一氣泵單元、一塗佈單元，及一控制單元。 Therefore, the substrate coating apparatus of the present invention comprises a carrying platform, a pick-and-place unit, an air pump unit, a coating unit, and a control unit.
該承載台包括一供一基板設置的吸附區及至少一空氣通道。該空氣通道於該吸附區的表面形成多數個間隔設置的開口。 The carrying platform includes an adsorption zone for a substrate and at least one air channel. The air passage forms a plurality of spaced apart openings in the surface of the adsorption zone.
該取放單元用以將該基板放置或取出於該承載台的吸附區。 The pick-and-place unit is configured to place or take the substrate into an adsorption zone of the carrier.
該氣泵單元包括一氣泵及一三通電磁閥。該三通電磁閥的其中二端口分別藉由一管路連通該空氣通道及該氣泵，另一端口與外界大氣相連通。 The air pump unit includes an air pump and a three-way solenoid valve. The two ports of the three-way solenoid valve respectively communicate with the air passage and the air pump through a pipeline, and the other port communicates with the outside atmosphere.
該塗佈單元用以於該基板上形成一塗佈層。 The coating unit is configured to form a coating layer on the substrate.
該控制單元電連接該取放單元、該氣泵、該三通電磁閥及該塗佈單元。 The control unit is electrically connected to the pick and place unit, the air pump, the three-way solenoid valve, and the coating unit.
該基板塗佈裝置的塗佈流程為：該控制單元控制該取放單元將一基板置放於該承載台的吸附區後，該控制單元控制該三通電磁閥只連通該氣泵及該空氣通道且控制該氣泵對於該空氣通道進行抽氣，使得該空氣通道的空氣壓力小於外界空氣壓力，藉此，該基板透過該等開口受該空氣通道吸附而固定於該承載台的吸附區；之後，該控制單元控制該三通電磁閥只連通該空氣通道及外界空氣， 使得該空氣通道的空氣壓力等於外界空氣壓力；接著，該控制單元控制該塗佈單元於該基板上形成一塗佈層；之後，該控制單元控制該三通電磁閥只連通該氣泵及該空氣通道且控制該氣泵停止對於該空氣通道抽氣而轉為進行供氣，使得該空氣通道的空氣壓力非小於外界空氣壓力，藉此，該基板不被吸附固定於該承載台的吸附區；最後，該控制單元控制該取放單元將形成有該塗佈層的基板取出該承載台的吸附區。 The coating process of the substrate coating device is: the control unit controls the pick-and-place unit to place a substrate on the adsorption area of the loading platform, and the control unit controls the three-way electromagnetic valve to communicate only the air pump and the air passage And controlling the air pump to pump the air passage such that the air pressure of the air passage is smaller than the outside air pressure, whereby the substrate is fixed to the adsorption zone of the loading platform through the openings through the openings; The control unit controls the three-way solenoid valve to communicate only the air passage and the outside air. The air pressure of the air passage is equal to the outside air pressure; then, the control unit controls the coating unit to form a coating layer on the substrate; afterwards, the control unit controls the three-way solenoid valve to communicate only the air pump and the air Channel and controlling the air pump to stop pumping for the air passage to supply air, so that the air pressure of the air passage is not less than the outside air pressure, whereby the substrate is not adsorbed and fixed to the adsorption zone of the loading platform; And the control unit controls the pick-and-place unit to take out the substrate on which the coating layer is formed and take out the adsorption area of the loading platform.
本發明塗佈方法，包含以下步驟：一步驟(A)將一基板設置於一承載台的一吸附區上的表面上，該承載台具有至少一空氣通道，該空氣通道於該吸附區的表面形成多數個間隔設置的開口；一步驟(B)對於該空氣通道進行抽氣，使得該空氣通道的空氣壓力小於外界空氣壓力，藉此，該基板透過該等開口受該空氣通道吸附而固定於該承載台的吸附區；一步驟(C)於該步驟(B)之後，停止對該空氣通道進行抽氣，且使得該空氣通道的空氣壓力等於外界空氣壓力；及一步驟(D)於該步驟(C)之後，於該基板上形成一塗佈層。 The coating method of the present invention comprises the following steps: a step (A) of disposing a substrate on a surface of an adsorption zone of a loading platform, the carrier having at least one air passage, the air passage being on the surface of the adsorption zone Forming a plurality of spaced openings; a step (B) pumping the air passage such that the air pressure of the air passage is less than the outside air pressure, whereby the substrate is fixed to the air passage through the openings The adsorption zone of the carrier; a step (C) after the step (B), stopping pumping the air passage, and making the air pressure of the air passage equal to the outside air pressure; and a step (D) After the step (C), a coating layer is formed on the substrate.
較佳地，該塗佈方法還包含一步驟(E)：於該步驟(D)後，對於該空氣通道進行供氣，使得該空氣通道的空 氣壓力非小於外界空氣壓力，藉此，該基板不固定於該承載台的吸附區。 Preferably, the coating method further comprises a step (E): after the step (D), supplying air to the air passage, so that the air passage is empty The gas pressure is not less than the outside air pressure, whereby the substrate is not fixed to the adsorption zone of the stage.
本發明基板塗佈裝置及塗佈方法的功效在於藉由該氣泵單元的三通電磁閥及氣泵相配合來達到將該基板固定於該承載台的吸附區，主要是先對於該空氣通道進行抽氣，藉此，該基板吸附固定於該承載台的吸附區，接著再使得該空氣通道的空氣壓力等於外界的空氣壓力，由於在抽氣過程中，流動空氣摩擦該基板及該吸附區而分別於該基板及該吸附區形成不同電性的電荷累積，然而該基板可藉由上述累積電荷所形成的靜電吸引力固定於該吸附區，然而該基板是均勻受靜電力而固定於該吸附區，因此不會造成該基板的變形，進而使得形成於該基板上的塗佈層厚度是均勻的。 The effect of the substrate coating device and the coating method of the present invention is that the three-way electromagnetic valve of the air pump unit and the air pump cooperate to fix the substrate to the adsorption zone of the loading platform, mainly for pumping the air passage. Gas, whereby the substrate is adsorbed and fixed to the adsorption zone of the loading platform, and then the air pressure of the air passage is equal to the external air pressure, because the flowing air rubs the substrate and the adsorption zone during the pumping process, respectively Different electrical charge accumulation is formed on the substrate and the adsorption region, but the substrate can be fixed to the adsorption region by the electrostatic attraction force formed by the accumulated charge, but the substrate is uniformly electrostatically fixed to the adsorption region. Therefore, the deformation of the substrate is not caused, and the thickness of the coating layer formed on the substrate is uniform.
2‧‧‧承載台 2‧‧‧bearing station
21‧‧‧吸附區 21‧‧‧Adsorption zone
22‧‧‧空氣通道 22‧‧‧Air passage
221‧‧‧開口 221‧‧‧ openings
23‧‧‧頂針 23‧‧‧ thimble
3‧‧‧取放單元 3‧‧‧ pick and place unit
4‧‧‧氣泵單元 4‧‧‧Air pump unit
41‧‧‧氣泵 41‧‧‧Air pump
42‧‧‧三通電磁閥 42‧‧‧Three-way solenoid valve
43‧‧‧管路 43‧‧‧pipe
5‧‧‧塗佈單元 5‧‧‧ Coating unit
6‧‧‧感測單元 6‧‧‧Sensor unit
61‧‧‧塗佈起始感測器 61‧‧‧ Coating Start Sensor
62‧‧‧塗佈結束感測器 62‧‧‧ Coating End Sensor
7‧‧‧控制單元 7‧‧‧Control unit
8‧‧‧基板 8‧‧‧Substrate
80‧‧‧塗佈層 80‧‧‧coating layer
A‧‧‧塗佈路徑 A‧‧‧Coating path
本發明之其他的特徵及功效，將於參照圖式的較佳實施例詳細說明中清楚地呈現，其中：圖1是一示意圖，說明習知一基板塗佈裝置的組成構件；圖2是一剖視圖，說明習知該基板塗佈裝置的一氣泵對於一承載台的一空氣通道進行抽氣；圖3是一示意圖，說明習知該基板塗佈裝置的一控制單元電連接一取放單元、該氣泵及一塗佈單元；圖4是一示意圖，說明本發明基板塗佈裝置的組成構件； 圖5是一示意圖，說明本較佳實施例的一控制單元與其他構件的電連接關係；圖6是一剖視圖，說明該較佳實施例的其中一塗佈流程；圖7是一剖視圖，說明該較佳實施例的其中一塗佈流程；圖8是一剖視圖，說明該較佳實施例的其中一塗佈流程；圖9是一剖視圖，說明該較佳實施例的其中一塗佈流程；及圖10是一剖視圖，說明該較佳實施例的其中一塗佈流程。 Other features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, wherein: FIG. 1 is a schematic diagram illustrating the components of a conventional substrate coating apparatus; FIG. The cross-sectional view shows that a gas pump of the substrate coating apparatus is used for pumping an air passage of a loading platform; FIG. 3 is a schematic view showing that a control unit of the substrate coating apparatus is electrically connected to a pick-and-place unit, The air pump and a coating unit; FIG. 4 is a schematic view showing the constituent members of the substrate coating apparatus of the present invention; Figure 5 is a schematic view showing the electrical connection relationship between a control unit and other components of the preferred embodiment; Figure 6 is a cross-sectional view showing one of the coating processes of the preferred embodiment; Figure 7 is a cross-sectional view illustrating One of the coating processes of the preferred embodiment; FIG. 8 is a cross-sectional view showing one of the coating processes of the preferred embodiment; FIG. 9 is a cross-sectional view showing one of the coating processes of the preferred embodiment; And Figure 10 is a cross-sectional view showing one of the coating processes of the preferred embodiment.
參閱圖4、圖5及圖6，本發明基板塗佈裝置的一較佳實施例，包含一承載台2、一取放單元3、一氣泵單元4、一塗佈單元5、一感測單元6，及一控制單元7。 Referring to FIG. 4, FIG. 5 and FIG. 6, a preferred embodiment of the substrate coating apparatus of the present invention comprises a carrying platform 2, a pick-and-place unit 3, a gas pump unit 4, a coating unit 5, and a sensing unit. 6, and a control unit 7.
該承載台2包括一供一基板8設置的吸附區21、至少一空氣通道22，及多數間隔設置於該吸附區21的頂針23。該吸附區21的表面為一平面，該空氣通道22於該吸附區21的表面形成多數個間隔設置的開口221。該等頂針23可向上凸伸於該吸附區21的表面外而相配合頂撐該基板8遠離該吸附區21的表面，也可向下縮藏於該吸附區21的表面之下。 The loading platform 2 includes an adsorption zone 21 for a substrate 8, at least one air channel 22, and a plurality of thimbles 23 spaced apart from the adsorption zone 21. The surface of the adsorption zone 21 is a plane, and the air channel 22 forms a plurality of spaced openings 221 on the surface of the adsorption zone 21. The thimbles 23 may protrude upwardly from the surface of the adsorption zone 21 to cooperate with the surface of the substrate 8 away from the adsorption zone 21, or may be constricted downward below the surface of the adsorption zone 21.
該取放單元3用以將該基板8放置或取出於該 承載台2的吸附區21。在本較佳實施例中，該取放單元3包括至少一用於抓取該基板8的機械手臂。 The pick-and-place unit 3 is configured to place or remove the substrate 8 The adsorption zone 21 of the loading platform 2. In the preferred embodiment, the pick and place unit 3 includes at least one robotic arm for grasping the substrate 8.
該氣泵單元4包括一氣泵41及一三通電磁閥42。該三通電磁閥42的其中二端口分別藉由一管路43連通該空氣通道22及該氣泵41，另一端口與外界大氣相連通。 The air pump unit 4 includes an air pump 41 and a three-way solenoid valve 42. The two ports of the three-way solenoid valve 42 are respectively connected to the air passage 22 and the air pump 41 through a line 43, and the other port is in the atmosphere of the outside.
該塗佈單元5沿著一塗佈路徑A對於該基板8進行塗佈以形成一塗佈層80。 The coating unit 5 coats the substrate 8 along a coating path A to form a coating layer 80.
該感測單元6包括一塗佈起始感測器61及一塗佈結束感測器62。該塗佈起始感測器61及該塗佈結束感測器62分別設置於鄰近該塗佈單元5的塗佈路徑A的起始端及結束端處。 The sensing unit 6 includes a coating start sensor 61 and a coating end sensor 62. The coating start sensor 61 and the coating end sensor 62 are respectively disposed at the start end and the end end of the coating path A adjacent to the coating unit 5.
該控制單元7電連接該等頂針23、該取放單元3、該氣泵41、該三通電磁閥42、該塗佈單元5及該感測單元6。 The control unit 7 electrically connects the thimble 23, the pick and place unit 3, the air pump 41, the three-way solenoid valve 42, the coating unit 5 and the sensing unit 6.
該基板塗佈裝置的塗佈流程為：首先，配合參閱圖6，該控制單元7控制驅動該等頂針23向上凸伸於該承載台2的吸附區21的表面；接著，該控制單元7控制該取放單元3將一基板8置放該等頂針23的頂緣後，配合參閱圖7，該控制單元7控制該等頂針23向下縮藏於該吸附區21的表面下而使得該基板8的底面抵靠於該吸附區21的表面；接著，配合參閱圖7，該控制單元7控制該三通電磁閥42只連通該氣泵41及該空氣通道22且控制該氣泵 41對於該空氣通道22進行抽氣，使得該空氣通道22的空氣壓力小於外界空氣壓力，藉此，該基板8透過該等開口221受該空氣透道22吸附而固定於該承載台2的吸附區21；再接著，配合參閱圖7，該控制單元7控制該塗佈單元5沿著該塗佈路徑A開始於該基板8上形成一塗佈層80，配合參閱圖8，當該塗佈起始感測器61感測到該塗佈單元5移經該塗佈路徑A的起始端時，該控制單元7控制該三通電磁閥42只連通該空氣通道22及外界空氣，使得該空氣通道22的空氣壓力等於外界空氣壓力，此時由於在前段抽氣過程中，流動空氣摩擦該基板8及該吸附區21的表面而分別於該基板8及該吸附區21形成不同電性的電荷累積，然而該基板8可藉由上述累積電荷所形成的靜電吸引力固定於該吸附區21。配合參閱圖9，當該塗佈結束感測器62感測到該塗佈單元5移經該塗佈路徑A的結束端時，該控制單元7控制該三通電磁閥42只連通該氣泵41及該空氣通道22且控制該氣泵41停止對於該空氣通道22抽氣而轉為進行供氣，使得該空氣通道22的空氣壓力大於外界空氣壓力，藉此，該基板8透過該等開口221受該空氣通道22的空氣壓力向外推而不被吸附固定於該承載台2的吸附區21；最後，配合參閱圖10，該控制單元7控制該等頂針23再次向上凸伸於該承載台2的吸附區21的表面將該基板8的底面頂離該吸附區21的表面後，該控制單元7控制該取放單元3將形成有該塗佈層80的基板8取出該承 載台2的吸附區21。 The coating process of the substrate coating device is: first, referring to FIG. 6, the control unit 7 controls driving the thimbles 23 to protrude upwardly on the surface of the adsorption zone 21 of the loading platform 2; then, the control unit 7 controls After the pick-and-place unit 3 places a substrate 8 on the top edge of the ejector pins 23, referring to FIG. 7, the control unit 7 controls the ejector pins 23 to be constricted downward under the surface of the adsorption region 21 to make the substrate. The bottom surface of the base 8 abuts against the surface of the adsorption zone 21; then, referring to FIG. 7, the control unit 7 controls the three-way solenoid valve 42 to communicate only with the air pump 41 and the air passage 22 and control the air pump. The air passage 22 is evacuated such that the air pressure of the air passage 22 is smaller than the outside air pressure, whereby the substrate 8 is adsorbed by the air passage 22 through the openings 221 to be fixed to the loading platform 2 for adsorption. And then, referring to FIG. 7, the control unit 7 controls the coating unit 5 to form a coating layer 80 on the substrate 8 along the coating path A. Referring to FIG. 8, when the coating is performed, When the start sensor 61 senses that the coating unit 5 moves through the beginning end of the coating path A, the control unit 7 controls the three-way solenoid valve 42 to communicate only with the air passage 22 and the outside air, so that the air The air pressure of the channel 22 is equal to the external air pressure. At this time, the flowing air rubs the surface of the substrate 8 and the adsorption region 21 during the first pumping process to form different electrical charges on the substrate 8 and the adsorption region 21, respectively. It is accumulated, however, the substrate 8 can be fixed to the adsorption region 21 by the electrostatic attraction force formed by the above accumulated charges. Referring to FIG. 9 , when the coating end sensor 62 senses that the coating unit 5 moves past the end end of the coating path A, the control unit 7 controls the three-way solenoid valve 42 to communicate only with the air pump 41. And the air passage 22 and controlling the air pump 41 to stop pumping the air passage 22 to supply air, so that the air pressure of the air passage 22 is greater than the outside air pressure, whereby the substrate 8 is received through the openings 221 The air pressure of the air passage 22 is pushed outwardly without being adsorbed and fixed to the adsorption zone 21 of the loading platform 2; finally, with reference to FIG. 10, the control unit 7 controls the thimbles 23 to protrude upward again to the loading platform 2 After the surface of the adsorption zone 21 lifts the bottom surface of the substrate 8 away from the surface of the adsorption zone 21, the control unit 7 controls the pick-and-place unit 3 to take out the substrate 8 on which the coating layer 80 is formed. The adsorption zone 21 of the stage 2.
然而本發明塗佈方法的一較佳實施例是利用上述基板塗佈裝置對於一基板8進行塗佈形成一塗佈層80，因此本較佳實施例的詳細步驟流程為上述基本塗佈裝置的塗佈流程。 However, in a preferred embodiment of the coating method of the present invention, a substrate 8 is coated by the substrate coating device to form a coating layer 80. Therefore, the detailed step flow of the preferred embodiment is the basic coating device. Coating process.
綜上所述，本發明基板塗佈裝置及塗佈方法藉由該氣泵單元4的三通電磁閥42及氣泵41相配合來達到將該基板8固定於該承載台2的吸附區21，主要是先對於該空氣通道22進行抽氣，藉此，該基板8吸附固定於該承載台2的吸附區21，接著再使得該空氣通道22的空氣壓力等於外界的空氣壓力，由於在抽氣過程中，流動空氣摩擦該基板8及該吸附區21而分別於該基板8及該吸附區21形成不同電性的電荷累積，然而該基板8可藉由上述累積電荷所形成的靜電吸引力固定於該吸附區21，且上述的靜電吸引力的大小不會使得該基板8施於其下方的微粒的抵壓力不會過大，因此不會造成該基板8的變形，可使得形成於該基板8上的塗佈層80厚度是均勻的，故確實能達成本發明之目的。 In summary, the substrate coating apparatus and the coating method of the present invention cooperate with the three-way solenoid valve 42 of the air pump unit 4 and the air pump 41 to fix the substrate 8 to the adsorption zone 21 of the stage 2, mainly The air passage 22 is first evacuated, whereby the substrate 8 is adsorbed and fixed to the adsorption zone 21 of the loading platform 2, and then the air pressure of the air passage 22 is equal to the external air pressure due to the pumping process. The flowing air rubs the substrate 8 and the adsorption region 21 to form different electrical charge accumulations on the substrate 8 and the adsorption region 21, respectively. However, the substrate 8 can be fixed by the electrostatic attraction force formed by the accumulated charge. The adsorption zone 21, and the above-mentioned electrostatic attraction force is not so large that the pressing force of the particles applied under the substrate 8 is not excessively large, so that the deformation of the substrate 8 is not caused, and the substrate 8 can be formed on the substrate 8. The thickness of the coating layer 80 is uniform, so that the object of the present invention can be achieved.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.
2‧‧‧承載台 2‧‧‧bearing station
21‧‧‧吸附區 21‧‧‧Adsorption zone
221‧‧‧開口 221‧‧‧ openings
23‧‧‧頂針 23‧‧‧ thimble
3‧‧‧取放單元 3‧‧‧ pick and place unit
4‧‧‧氣泵單元 4‧‧‧Air pump unit
41‧‧‧氣泵 41‧‧‧Air pump
42‧‧‧三通電磁閥 42‧‧‧Three-way solenoid valve
43‧‧‧管路 43‧‧‧pipe
5‧‧‧塗佈單元 5‧‧‧ Coating unit
6‧‧‧感測單元 6‧‧‧Sensor unit
61‧‧‧塗佈起始感測器 61‧‧‧ Coating Start Sensor
62‧‧‧塗佈結束感測器 62‧‧‧ Coating End Sensor
8‧‧‧基板 8‧‧‧Substrate
A‧‧‧塗佈路徑 A‧‧‧Coating path
Claims (7)
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| TW102132015A TW201509544A (en) | 2013-09-05 | 2013-09-05 | Substrate coating device and coating method |
| CN201320604178.8U CN203648808U (en) | 2013-09-05 | 2013-09-27 | Substrate coating device |
| CN201310451376.XA CN104415892A (en) | 2013-09-05 | 2013-09-27 | substrate coating device and coating method |
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| TW102132015A TW201509544A (en) | 2013-09-05 | 2013-09-05 | Substrate coating device and coating method |
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| CN108307587B (en) * | 2016-03-08 | 2019-12-06 | 苏州市相城区黄桥工业园经济发展有限公司 | Working method of coating adsorption device of BGA substrate |
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| JP4443353B2 (en) * | 2004-08-31 | 2010-03-31 | 東京応化工業株式会社 | Substrate mounting stage and substrate adsorption / separation method |
| JP4771893B2 (en) * | 2006-08-24 | 2011-09-14 | 東京応化工業株式会社 | Substrate holding device |
| JP5186161B2 (en) * | 2007-09-06 | 2013-04-17 | 東京応化工業株式会社 | Coating device and cleaning method for coating device |
| JP2009130008A (en) * | 2007-11-21 | 2009-06-11 | Toray Eng Co Ltd | Coater and its substrate holding method |
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| CN203648808U (en) | 2014-06-18 |
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