CN115339231A - Nitrogen oxygen sensor chip side electrode printing clamping device - Google Patents
Nitrogen oxygen sensor chip side electrode printing clamping device Download PDFInfo
- Publication number
- CN115339231A CN115339231A CN202211086728.1A CN202211086728A CN115339231A CN 115339231 A CN115339231 A CN 115339231A CN 202211086728 A CN202211086728 A CN 202211086728A CN 115339231 A CN115339231 A CN 115339231A
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- CN
- China
- Prior art keywords
- bottom plate
- chip
- supporting
- vacuum
- clamping device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims abstract description 23
- 210000000078 claw Anatomy 0.000 claims abstract description 22
- 235000015895 biscuits Nutrition 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
Abstract
The utility model provides a nitrogen oxygen sensor chip side electrode printing clamping device, is provided with the supporting baseplate on the vacuum adsorption seat, is provided with chip splint on the supporting baseplate, chip splint have five claws for equidistant processing on the splint body, and every claw has a vacuum channel with the face middle part of supporting the bottom plate contact along length direction processing, and five vacuum channel roots are linked together, and horizontal equidistant processing is gapped air groove on every claw and the face of supporting the bottom plate contact, the middle part of vacuum adsorption seat is provided with air chamber, side and is provided with the inlet channel who is linked together with the air chamber, processing has evenly distributed's inlet port on the position that the vacuum channel of supporting the chip splint on the bottom plate corresponds, and the inlet port of supporting the bottom plate distributes directly over vacuum adsorption seat air chamber. The invention realizes effective positioning of chip side printing, can realize free replacement, does not need repeated placement, can realize batch circulation and has high working efficiency.
Description
Technical Field
The invention belongs to the technical field of chip processing equipment, and particularly relates to an electrode printing device.
Background
In recent years, nitrogen oxygen sensors are more and more widely applied, because the structure of a nitrogen oxygen sensor chip is complex, the number of test electrodes is large, the electrodes are uniformly distributed on each layer of a multilayer structure, functional electrodes are led out from the side face of the chip, most of the existing side face electrode printing modes are two chips for printing, and the defects of frequent picking and placing, low efficiency and the like exist. In the process of mass production, the production requirements cannot be met, and the problems of unsmooth connection among working procedures and the like exist.
Disclosure of Invention
The invention aims to overcome the defects of the existing electrode printing device and provide the clamping device for the side electrode printing of the nitrogen-oxygen sensor chip, which has the advantages of reasonable design, simple structure, convenience in operation and high working efficiency.
The technical scheme for solving the technical problems is as follows: the utility model provides a nitrogen oxygen sensor chip side electrode printing clamping device, is provided with the supporting baseplate on the vacuum adsorption seat, is provided with chip splint on the supporting baseplate, chip splint have five claws for equidistant processing on the splint body, and every claw has a vacuum channel with the face middle part of supporting the bottom plate contact along length direction processing, and five vacuum channel roots are linked together, and horizontal equidistant processing is gapped air groove on every claw and the face of supporting the bottom plate contact, the middle part of vacuum adsorption seat is provided with air chamber, side and is provided with the inlet channel who is linked together with the air chamber, processing has evenly distributed's inlet port on the position that the vacuum channel of supporting the chip splint on the bottom plate corresponds, and the inlet port of supporting the bottom plate distributes directly over vacuum adsorption seat air chamber.
Preferably, the width of the gap air groove is 1 to 1.5mm.
As a preferred technical scheme, the root of the clearance air groove is provided with a round chamfer.
As a preferable technical scheme, the difference between the distance between two adjacent claws and the thickness of the two chips of the biscuit embryo is 0.1-0.3 mm.
As a preferable technical scheme, handheld grooves are machined on two symmetrical side faces of the bearing bottom plate.
As a preferable technical scheme, a right-angle positioning guide plate for positioning the receiving bottom plate is arranged on the vacuum adsorption seat.
The invention has the following beneficial effects:
according to the invention, the combination of vacuum adsorption and fixation of the green chip blanks and mechanical positioning of the bearing bottom plate by the right-angle positioning guide plate is realized through the gap air grooves on the supporting claws, so that the effective positioning of chip side printing is realized, free replacement can be realized, and repeated placement is not needed; the root of the gap air groove is provided with the round chamfer, so that the electrode formed by coating the slurry can be effectively connected and conducted with the side lead; the gap air groove is convenient to process relative to the adsorption air hole, does not need to consider the thickness and the width of a workpiece, and has the same use effect; the chip clamping plate and the receiving bottom plate are connected into a whole to form the clamping mechanism, the clamping mechanism is independent of printing equipment, the vacuum pump is directly connected with the vacuum adsorption seat, when the clamping mechanism is formed by dismounting and mounting, the influence caused by a vacuum air pipe is not considered, one-time printing of a plurality of formed clamping mechanisms can be realized, and batch circulation is realized.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.
Fig. 3 is a sectional view B-B of fig. 1.
Fig. 4 is a schematic structural view of the chip splint 1 according to the present invention.
Fig. 5 is a schematic structural view of the receiving substrate 2 of the present invention.
Wherein: the device comprises a chip clamping plate 1, a carrying bottom plate 2, a vacuum adsorption seat 3, a right-angle positioning guide plate 4, a vacuum channel 1-1, a gap air groove 1-2, a supporting claw 1-3, an air inlet 2-1, a handheld groove 2-2, an air inlet channel 3-1 and an air chamber 3-2;
Detailed Description
The present invention will be described in further detail below with reference to the drawings and examples, but the present invention is not limited to the embodiments described below.
In fig. 1-5, the clamping device for printing electrodes on the side of a chip of an oxynitride sensor in this embodiment is formed by connecting a vacuum adsorption seat 3, a receiving base plate 2 and a chip clamp plate 1, the receiving base plate 2 is placed on the vacuum adsorption seat 3, the chip clamp plate 1 is connected to the receiving base plate 2 by a threaded fastener to form a clamping mechanism, five support claws 1-3 are machined on a clamp plate body at equal intervals, the difference between the distance between two adjacent support claws 1-3 and the thickness of two green chips is 0.2mm, also can be 0.1mm, also can be 0.3mm, the support claws 1-3 are used for clamping the green chips, a vacuum channel 1-1 is machined in the middle of the surface of each support claw 1-3 contacting the receiving base plate 2 along the length direction, the roots of the five vacuum channels 1-1 are communicated, A gap air groove 1-2 is transversely and equidistantly processed on the surface of each supporting claw 1-3 contacted with a receiving bottom plate 2, the gap air groove 1-2 is communicated with a vacuum channel 1-1, a chip blank is tightly adsorbed on the side surface of each supporting claw 1-3 through the gap air groove 1-2, the width of the gap air groove 1-2 is 1mm or 1.5mm, the root part of the gap air groove 1-2 is provided with a round chamfer angle, an electrode formed by coating slurry can be effectively connected and communicated with a side lead, a rectangular groove is processed in the middle of a vacuum adsorption seat 3 and is an air chamber 3-2, an air inlet channel 3-1 communicated with the air chamber 3-2 is processed on the side surface, air inlets 2-1 are uniformly distributed on the position corresponding to the vacuum channel 1-1 of a chip clamping plate 1 on the receiving bottom plate 2, handheld grooves 2-2 are processed on the left side surface and the right side surface of the receiving bottom plate 2, thus being convenient for an operator to disassemble and install, the vacuum adsorption seat 3 is fixedly provided with a right-angle positioning guide plate 4 for positioning the bearing bottom plate 2, and is used for ensuring that the air inlet holes 2-1 of the bearing bottom plate 2 are distributed right above the air chamber 3-2 of the vacuum adsorption seat 3, and the air chamber 3-2 is communicated with the vacuum channel 1-1 through the air inlet holes 2-1.
When the device is used, the vacuum adsorption seat 3 is fixed on a Y-axis working table of side printing equipment, a vacuum pump is connected to an air inlet channel 3-1 of the vacuum adsorption seat 3, the front surfaces of two chip blank blanks are oppositely placed between two supporting claws 1-3, one chip blank is respectively placed on the outer sides of the supporting claws 1-3 on the left side and the right side, ten chip blank blanks are placed in total, the vacuum pump is started, each chip blank is tightly adsorbed on the side surfaces of the supporting claws 1-3 under the action of vacuum suction force, a printing start button is clicked, a silica gel scraper can coat slurry on the side surfaces of the chip blanks, a clamping mechanism fixed with chips can be directly dismounted after one surface is printed, and the chip blanks are placed in an oven for drying. According to the invention, batch circulation can be realized by using a plurality of sets of clamping mechanisms consisting of the receiving bottom plate 2 and the chip clamping plates 1 according to the number of the actually produced blocks, 10 blocks can be printed at a time, the printing time is 3S, two-sided coating can be completed by printing 40 blocks of the blocks for 8 times, effective connection between two blocks can be realized by using 8 clamping mechanisms, the first four clamping mechanisms are directly put into an oven for drying after 40 blocks of the single side of the block are printed, the last four clamping mechanisms are used for placing and printing the next block of the chip, and the other side of the dried block is printed after the printing is completed.
Claims (6)
1. The utility model provides a nitrogen oxygen sensor chip side electrode printing clamping device which characterized in that: the vacuum adsorption base (3) is provided with a bearing bottom plate (2), the bearing bottom plate (2) is provided with a chip clamping plate (1), the chip clamping plate (1) is a clamping plate body, five supporting claws (1-3) are machined at equal intervals, the middle part of the surface, in contact with the bearing bottom plate (2), of each supporting claw (1-3) is machined with a vacuum channel (1-1) along the length direction, the roots of the five vacuum channels (1-1) are communicated, a gap air groove (1-2) is machined at equal intervals on the surface, in contact with the bearing bottom plate (2), of each supporting claw (1-3), the middle part of the vacuum adsorption base (3) is provided with an air chamber (3-2), the side surface of the vacuum adsorption base is provided with an air inlet channel (3-1) communicated with the air chamber (3-2), air inlets (2-1) of the chip clamping plate (1) on the bearing bottom plate (2) are machined at positions corresponding to the vacuum channels (1-1) and uniformly distributed with the air inlets (2-1) of the bearing bottom plate (2) directly above the vacuum adsorption base (3).
2. The nitrogen-oxygen sensor chip side electrode printing clamping device as claimed in claim 1, wherein: the width of the gap air groove (1-2) is 1-1.5 mm.
3. The clamping device for printing the side electrode of the oxynitride sensor chip according to claim 1 or 2, wherein: the root of the clearance air groove (1-2) is provided with a round chamfer.
4. The nitrogen-oxygen sensor chip side electrode printing clamping device as claimed in claim 1, wherein: the difference between the distance between the two adjacent claws (1-3) and the thickness of the two chips of the biscuit is 0.1-0.3 mm.
5. The clamping device for printing the side electrode of the nitrogen-oxygen sensor chip according to claim 1, which is characterized in that: and handheld grooves (2-2) are processed on two symmetrical side surfaces of the bearing bottom plate (2).
6. The clamping device for printing the side electrode of the nitrogen-oxygen sensor chip according to claim 1, which is characterized in that: and a right-angle positioning guide plate (4) for positioning the bearing bottom plate (2) is arranged on the vacuum adsorption seat (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211086728.1A CN115339231A (en) | 2022-09-07 | 2022-09-07 | Nitrogen oxygen sensor chip side electrode printing clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211086728.1A CN115339231A (en) | 2022-09-07 | 2022-09-07 | Nitrogen oxygen sensor chip side electrode printing clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115339231A true CN115339231A (en) | 2022-11-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211086728.1A Pending CN115339231A (en) | 2022-09-07 | 2022-09-07 | Nitrogen oxygen sensor chip side electrode printing clamping device |
Country Status (1)
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| CN (1) | CN115339231A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980069658A (en) * | 1997-02-28 | 1998-10-26 | 김광호 | Double sided vacuum chuck |
| CN103594409A (en) * | 2013-10-23 | 2014-02-19 | 中国电子科技集团公司第四十八研究所 | Device for absorbing silicon wafers in batches |
| CN204123160U (en) * | 2014-07-04 | 2015-01-28 | 惠州市兴源自动化设备有限公司 | Tool clamping device |
| CN205310102U (en) * | 2015-12-15 | 2016-06-15 | 上海大道包装隔热材料有限公司 | A vacuum jig for producing quality control surveys |
| CN206259333U (en) * | 2016-12-15 | 2017-06-16 | 乐山新天源太阳能科技有限公司 | Silicon chip suction means |
| CN206402551U (en) * | 2017-02-09 | 2017-08-11 | 东莞市三禾电子材料有限公司 | A kind of paste-tin printing apparatus |
| CN207353217U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Quartz boat loads and unloads piece machine |
| CN110695720A (en) * | 2019-11-02 | 2020-01-17 | 深圳市粤海翔精密科技有限公司 | Two-sided switching vacuum adsorption plate |
| CN111167658A (en) * | 2020-02-19 | 2020-05-19 | 浙江百岸科技有限公司 | Clamping equipment and side coating equipment of nitrogen oxygen sensor chip |
| CN211320077U (en) * | 2019-12-10 | 2020-08-21 | 拉普拉斯(无锡)半导体科技有限公司 | Photovoltaic silicon chip battery piece clamping jaw |
| CN212470652U (en) * | 2020-05-28 | 2021-02-05 | 烟台齐邦精密机械有限公司 | Special clamping instrument of machining center |
| CN215118868U (en) * | 2021-05-07 | 2021-12-10 | 拉普拉斯(无锡)半导体科技有限公司 | Sucker structure |
| CN216389310U (en) * | 2021-10-28 | 2022-04-26 | 北京华卓精科科技股份有限公司 | Wafer adsorption equipment |
| CN216730778U (en) * | 2021-12-27 | 2022-06-14 | 苏州思赢机械设备有限公司 | Side processing adsorption jig for circular parts |
-
2022
- 2022-09-07 CN CN202211086728.1A patent/CN115339231A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980069658A (en) * | 1997-02-28 | 1998-10-26 | 김광호 | Double sided vacuum chuck |
| CN103594409A (en) * | 2013-10-23 | 2014-02-19 | 中国电子科技集团公司第四十八研究所 | Device for absorbing silicon wafers in batches |
| CN204123160U (en) * | 2014-07-04 | 2015-01-28 | 惠州市兴源自动化设备有限公司 | Tool clamping device |
| CN205310102U (en) * | 2015-12-15 | 2016-06-15 | 上海大道包装隔热材料有限公司 | A vacuum jig for producing quality control surveys |
| CN206259333U (en) * | 2016-12-15 | 2017-06-16 | 乐山新天源太阳能科技有限公司 | Silicon chip suction means |
| CN206402551U (en) * | 2017-02-09 | 2017-08-11 | 东莞市三禾电子材料有限公司 | A kind of paste-tin printing apparatus |
| CN207353217U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Quartz boat loads and unloads piece machine |
| CN110695720A (en) * | 2019-11-02 | 2020-01-17 | 深圳市粤海翔精密科技有限公司 | Two-sided switching vacuum adsorption plate |
| CN211320077U (en) * | 2019-12-10 | 2020-08-21 | 拉普拉斯(无锡)半导体科技有限公司 | Photovoltaic silicon chip battery piece clamping jaw |
| CN111167658A (en) * | 2020-02-19 | 2020-05-19 | 浙江百岸科技有限公司 | Clamping equipment and side coating equipment of nitrogen oxygen sensor chip |
| CN212470652U (en) * | 2020-05-28 | 2021-02-05 | 烟台齐邦精密机械有限公司 | Special clamping instrument of machining center |
| CN215118868U (en) * | 2021-05-07 | 2021-12-10 | 拉普拉斯(无锡)半导体科技有限公司 | Sucker structure |
| CN216389310U (en) * | 2021-10-28 | 2022-04-26 | 北京华卓精科科技股份有限公司 | Wafer adsorption equipment |
| CN216730778U (en) * | 2021-12-27 | 2022-06-14 | 苏州思赢机械设备有限公司 | Side processing adsorption jig for circular parts |
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