CN208352282U - A kind of ICP substrate etching upper piece machine for sapphire chip draws structure - Google Patents
A kind of ICP substrate etching upper piece machine for sapphire chip draws structure Download PDFInfo
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- CN208352282U CN208352282U CN201821129194.5U CN201821129194U CN208352282U CN 208352282 U CN208352282 U CN 208352282U CN 201821129194 U CN201821129194 U CN 201821129194U CN 208352282 U CN208352282 U CN 208352282U
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Abstract
The utility model relates to chip preparation technical fields, and it discloses a kind of ICP substrate for etching upper piece machine for sapphire chip and draws structure, including supporting leg and crossbeam, workbench is fixedly connected at the top of the supporting leg, the upper surface at the workbench both ends offers sliding slot, the internal activity of the sliding slot is connected with sliding block, the side of the workbench is fixedly connected with mounting plate, and the side of mounting plate is fixedly connected with the first cylinder, the output end of first cylinder is fixedly connected with First piston bar.This etches the ICP substrate absorption structure of a machine for sapphire chip; booster air pump; so as to so that sucker suction lives substrate is transported; solve the problems, such as that man-handling of materials substrate be easy to cause chip to pollute; it ensure that the quality of production of chip; contact dynamics between sucker and substrate can be buffered, so as to avoid the problem that between component because caused by dynamics is excessive substrate surface damage, achieve the purpose that protect component.
Description
Technical field
It is specially a kind of to etch upper piece machine for sapphire chip the utility model relates to chip preparation technical field
ICP substrate draws structure.
Background technique
Chip, also known as microcircuit, microchip, integrated circuit, refer to the silicon wafer for including integrated circuit, volume very little, usually
It is computer or a part of other electronic equipments, the carrier and integrated circuit that chip generally refers to integrated circuit are by setting
After meter, manufacture, encapsulation, test as a result, the usually one independent entirety that can be used immediately, Sapphire Substrate is for system
Which kind of make for chip, the problem of selection of substrate material is overriding concern, it should suitable substrate used, is needed according to equipment
Requirement with device is selected, general on the market to can be used as substrate there are three types of material, is respectively as follows: sapphire, silicon, silicon carbide,
And sapphire chip has preferable usability, Sapphire Substrate does not absorb visible light, price its advantage is that chemical stability is good
Moderate, manufacturing technology relative maturity, sapphire chip need to separate the silicon wafer of stacking in the fabrication process, more commonly used side
Formula is manually directly to separate the silicon wafer of stacking by hand, single silicon wafer is directly placed on process equipment, or manually by heap
Folded silicon wafer is separated in dedicated load basket by hand, then silicon wafer is delivered to technique from dedicated load basket by automation equipment and is set
In standby, such mode is easy to increase to reduce the product quality of silicon wafer, and manual operation speed manually to the pollution of silicon wafer
Slowly, existing some chip pick-up structures cannot mostly protect substrate, when transporting chip so that substrate is easy to produce
It is damaged.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of ICP that upper piece machine is etched for sapphire chip
Substrate draws structure, has the good advantage of using effect, solves the problems, such as manually to transfer substrate existing defects.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: one kind etches piece for sapphire chip
The ICP substrate of machine draws structure, including supporting leg and crossbeam, is fixedly connected with workbench, the work at the top of the supporting leg
The upper surface for making platform both ends offers sliding slot, and the internal activity of the sliding slot is connected with sliding block, and the side of the workbench is solid
Surely it is connected with mounting plate, and the side of mounting plate is fixedly connected with the first cylinder, the output end of first cylinder is fixedly connected
There is First piston bar, the one end of the First piston bar far from the first cylinder is fixedly connected with the side of sliding block, and the crossbeam is just
Guide groove is offered in the middle part of face, and air pump, one end of the crossbeam have been bolted to connection at the top of the one end of the beam
Slide opening is offered, and the internal activity of slide opening is socketed with guide rod, the bottom end of the guide rod passes through the table of link block and sliding block
Face is fixedly connected, and the crossbeam is fixedly connected with telescopic rod far from the bottom of guide rod one end, and one end of the telescopic rod is fixed
It is connected with hydraulic cylinder, the bottom of the hydraulic cylinder is fixedly connected by link block with the surface of sliding block, and the crossbeam is close to hydraulic
One end of cylinder is fixedly connected with the second cylinder, and the output end of second cylinder is fixedly connected with second piston bar, and described second
Piston rod is fixedly connected with drive block far from one end of the second cylinder, and the drive block is flexibly connected with guide groove, the driving
The surface of block is fixedly connected with supporting block, and the bottom of the supporting block is fixedly connected with connecting rod, and one end of connecting rod is fixed
It is connected with fixed block, the inside of fixed block two sides offers loose slot, and the internal activity of the loose slot is connected with motion bar,
One end of the motion bar is fixedly connected with the limited block inside loose slot, and the surface activity of the motion bar, which is socketed with, to be stretched
Contracting spring, the motion bar are fixedly connected with disk far from one end of limited block, and the surface of the disk is fixedly connected with total gas
Pipe, the one end of the gas main far from disk is fixedly connected with the output end of air pump, and the surface of the disk is fixedly connected with point
Tracheae, and one end of gas-distributing pipe is fixedly connected with sucker.
Preferably, the bottom end of the supporting leg is fixedly connected with cushion block, and the bottom of cushion block is provided with anti-skid chequer.
Preferably, the guide rod is fixedly connected with block close to one end of crossbeam, and block is rectangular shape.
Preferably, the two sides of the fixed block bottom offer circular hole, and the size of circular hole matches with motion bar.
Preferably, one end of the adjustable spring is fixedly connected with the surface of disk, the other end of the adjustable spring with
The one side of fixed block is fixedly connected.
Preferably, the quantity of the sucker is five, and the surface of disk is arranged in five sucker circular arrays.
(3) beneficial effect
Compared with prior art, the utility model provides a kind of ICP substrate that upper piece machine is etched for sapphire chip
Draw structure, have it is following the utility model has the advantages that
This etches the ICP substrate absorption structure of a machine, booster air pump, so that air pump is taken out for sapphire chip
Gas, so as to solve the problems, such as that man-handling of materials substrate be easy to cause chip to pollute so that sucker suction lives substrate is transported,
It ensure that the quality of production of chip, the movement of motion bar and the elastic reaction of adjustable spring, it can be between sucker and substrate
Contact dynamics is buffered, so as to avoid the problem that between component because caused by dynamics is excessive substrate surface damage, reach guarantor
Protect the purpose of component.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is utility model works platform structure top view；
Fig. 3 is the utility model fixed block attachment structure schematic diagram；
Fig. 4 is the utility model disk attachment structure schematic diagram.
In figure: 1 supporting leg, 2 crossbeams, 3 workbench, 4 sliding slots, 5 sliding blocks, 6 first cylinders, 7 First piston bars, 8 guide grooves,
9 air pumps, 10 guide rods, 11 telescopic rods, 12 hydraulic cylinders, 13 second cylinders, 14 second piston bars, 15 drive blocks, 16 supporting blocks, 17
Fixed block, 18 loose slots, 19 motion bars, 20 limited blocks, 21 adjustable springs, 22 disks, 23 gas mains, 24 suckers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-4, a kind of ICP substrate etching upper piece machine for sapphire chip draws structure, including supporting leg 1
With crossbeam 2, the bottom end of supporting leg 1 is fixedly connected with cushion block, and the bottom of cushion block is provided with anti-skid chequer, is conducive to increase friction
Power, can be improved the stability of the structure, and the top of supporting leg 1 is fixedly connected with workbench 3, the upper surface at 3 both ends of workbench
Sliding slot 4 is offered, the internal activity of sliding slot 4 is connected with sliding block 5, and the side of workbench 3 is fixedly connected with mounting plate, and installs
The side of plate is fixedly connected with the first cylinder 6, and the output end of the first cylinder 6 is fixedly connected with First piston bar 7, First piston bar
7 one end far from the first cylinder 6 are fixedly connected with the side of sliding block 5, and the positive middle part of crossbeam 2 offers guide groove 8, crossbeam 2
Air pump 9 is bolted to connection at the top of one end, one end of crossbeam 2 offers slide opening, and the internal activity socket of slide opening
There is guide rod 10, is conducive to the direction of motion for controlling crossbeam 2, guide rod 10 is fixedly connected with block close to one end of crossbeam 2, and
Block is rectangular shape, and crossbeam 2 is prevented to be detached from guide rod 10, and the bottom end of guide rod 10 is solid by the surface of link block and sliding block 5
Fixed connection, crossbeam 2 are fixedly connected with telescopic rod 11 far from the bottom of 10 one end of guide rod, and one end of telescopic rod 11 is fixedly connected with
The bottom of hydraulic cylinder 12, hydraulic cylinder 12 is fixedly connected by link block with the surface of sliding block 5, crossbeam 2 close to hydraulic cylinder 12 one
End is fixedly connected with the second cylinder 13, and the output end of the second cylinder 13 is fixedly connected with second piston bar 14, second piston bar 14
One end far from the second cylinder 13 is fixedly connected with drive block 15, and drive block 15 is flexibly connected with guide groove 8, the table of drive block 15
Face is fixedly connected with supporting block 16, and the bottom of supporting block 16 is fixedly connected with connecting rod, and one end of connecting rod is fixedly connected with
Fixed block 17 drives First piston bar 7 flexible using the first cylinder 6, so that sliding block 5 drives guide rod 10 to move, so that
Crossbeam 2 moves, and drives second piston bar 14 flexible using the second cylinder 13, so that drive block 15 drives the horizontal fortune of supporting block 16
It is dynamic so that fixed block 17 can horizontal movement, convenient for transferring substrate, the two sides of 17 bottom of fixed block offer circular hole,
And the size of circular hole matches with motion bar 19, the inside of 17 two sides of fixed block offers loose slot 18, loose slot 18 it is interior
Portion is connected with motion bar 19, and one end of motion bar 19 is fixedly connected with the limited block 20 inside loose slot 18, prevents
Motion bar 19 is detached from fixed block 17, and the surface activity of motion bar 19 is socketed with adjustable spring 21, one end of adjustable spring 21 and circle
The surface of disk 22 is fixedly connected, and the other end of adjustable spring 21 is fixedly connected with the one side of fixed block 17,21 energy of adjustable spring
Enough tentatively to be buffered to the contact dynamics between sucker 24 and substrate, motion bar 19, can in the internal motion of loose slot 18
Play the role of secondary buffer, so as to avoid the problem that between component because caused by dynamics is excessive substrate surface damage, reach
The purpose of component is protected, motion bar 19 is fixedly connected with disk 22 far from one end of limited block 20, and the surface of disk 22 is fixed to be connected
It is connected to gas main 23, the one end of gas main 23 far from disk 22 is fixedly connected with the output end of air pump 9, and the surface of disk 22 is fixed
It is connected with gas-distributing pipe, and one end of gas-distributing pipe is fixedly connected with sucker 24, the quantity of sucker 24 is five, and five suckers 24 are in
The surface of disk 22 is arranged in annular array, and multiple suckers 24 draw substrate, improves the stabilization of substrate in transit
Property, start hydraulic cylinder 12, so that hydraulic cylinder 12 drives crossbeam 2 to move vertically, so that sucker 24 is in contact with substrate, booster air pump 9,
So that air pump 9 is evacuated, so as to solve man-handling of materials substrate and be easy to make so that sucker 24 adsorbs substrate is transported
The problem of polluting at chip ensure that the quality of production of chip.
The electric elements occurred in this article are electrically connected with extraneous main controller and 220V alternating current, and main controller can be meter
Calculation machine etc. plays the conventionally known equipment of control.
In conclusion this is used for the ICP substrate absorption structure that sapphire chip etches a machine, 6 band of the first cylinder is utilized
Dynamic First piston bar 7 is flexible, so that sliding block 5 drives guide rod 10 to move, so that crossbeam 2 moves, utilizes the second cylinder 13
Drive second piston bar 14 flexible, so that drive block 15 drives 16 horizontal movement of supporting block, so that fixed block 17 being capable of water
Flat movement, starts hydraulic cylinder 12, so that hydraulic cylinder 12 drives crossbeam 2 to move vertically, so that sucker 24 is in contact with substrate, starts gas
Pump 9, so that air pump 9 is evacuated, so as to solve man-handling of materials substrate appearance so that sucker 24 adsorbs substrate is transported
The problem of easily causing chip to pollute, ensure that the quality of production of chip, and adjustable spring 21 can be between sucker 24 and substrate
Contact dynamics is tentatively buffered, and motion bar 19 can play the role of secondary buffer in the internal motion of loose slot 18, thus
Can to avoid between component because dynamics it is excessive caused by substrate surface damage the problem of, achieve the purpose that protect component.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of ICP substrate for etching upper piece machine for sapphire chip draws structure, including supporting leg (1) and crossbeam (2),
It is characterized in that: being fixedly connected with workbench (3) at the top of the supporting leg (1), the upper surface at workbench (3) both ends is opened
Equipped with sliding slot (4), the internal activity of the sliding slot (4) is connected with sliding block (5), and the side of the workbench (3) is fixedly connected with
Mounting plate, and the side of mounting plate is fixedly connected with the first cylinder (6), the output end of first cylinder (6) is fixedly connected with
First piston bar (7), the First piston bar (7) are fixedly connected far from the one end of the first cylinder (6) with the side of sliding block (5),
The positive middle part of the crossbeam (2) offers guide groove (8), has been bolted to connection at the top of described crossbeam (2) one end
Air pump (9), one end of the crossbeam (2) offers slide opening, and the internal activity of slide opening is socketed with guide rod (10), the guiding
The bottom end of bar (10) is fixedly connected by link block with the surface of sliding block (5), and the crossbeam (2) is far from guide rod (10) one end
Bottom is fixedly connected with telescopic rod (11), and one end of the telescopic rod (11) is fixedly connected with hydraulic cylinder (12), the hydraulic cylinder
(12) bottom is fixedly connected by link block with the surface of sliding block (5), and the crossbeam (2) is solid close to the one end of hydraulic cylinder (12)
Surely it being connected with the second cylinder (13), the output end of second cylinder (13) is fixedly connected with second piston bar (14), and described
Two piston rods (14) are fixedly connected with drive block (15) far from the one end of the second cylinder (13), the drive block (15) and guide groove
(8) it is flexibly connected, the surface of the drive block (15) is fixedly connected with supporting block (16), and the bottom of the supporting block (16) is fixed
It is connected with connecting rod, and one end of connecting rod is fixedly connected with fixed block (17), the inside of fixed block (17) two sides offers
The internal activity of loose slot (18), the loose slot (18) is connected with motion bar (19), and one end of the motion bar (19) is fixed
It is connected with and is located at loose slot (18) internal limited block (20), the surface activity of the motion bar (19) is socketed with adjustable spring
(21), the motion bar (19) is fixedly connected with disk (22) far from the one end of limited block (20), the surface of the disk (22)
It is fixedly connected with gas main (23), the output end of the gas main (23) one end and air pump (9) far from disk (22) is fixed to be connected
It connects, the surface of the disk (22) is fixedly connected with gas-distributing pipe, and one end of gas-distributing pipe is fixedly connected with sucker (24).
2. a kind of ICP substrate for etching upper piece machine for sapphire chip according to claim 1 draws structure, feature
Be: the bottom end of the supporting leg (1) is fixedly connected with cushion block, and the bottom of cushion block is provided with anti-skid chequer.
3. a kind of ICP substrate for etching upper piece machine for sapphire chip according to claim 1 draws structure, feature
Be: the guide rod (10) is fixedly connected with block close to the one end of crossbeam (2), and block is rectangular shape.
4. a kind of ICP substrate for etching upper piece machine for sapphire chip according to claim 1 draws structure, feature
Be: the two sides of fixed block (17) bottom offer circular hole, and the size of circular hole matches with motion bar (19).
5. a kind of ICP substrate for etching upper piece machine for sapphire chip according to claim 1 draws structure, feature
Be: one end of the adjustable spring (21) is fixedly connected with the surface of disk (22), the other end of the adjustable spring (21)
It is fixedly connected with the one side of fixed block (17).
6. a kind of ICP substrate for etching upper piece machine for sapphire chip according to claim 1 draws structure, feature
Be: the quantity of the sucker (24) is five, and five sucker (24) circular array settings are on the surface of disk (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821129194.5U CN208352282U (en) | 2018-07-17 | 2018-07-17 | A kind of ICP substrate etching upper piece machine for sapphire chip draws structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821129194.5U CN208352282U (en) | 2018-07-17 | 2018-07-17 | A kind of ICP substrate etching upper piece machine for sapphire chip draws structure |
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| CN208352282U true CN208352282U (en) | 2019-01-08 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289239A (en) * | 2019-04-12 | 2019-09-27 | 广州市加简派电子科技有限公司 | A kind of chip picking-up apparatus of the anti-tamper with energy-saving effect |
| CN110332896A (en) * | 2019-04-25 | 2019-10-15 | 太仓北新建材有限公司 | A kind of plasterboard thickness monitor device |
| CN112229364A (en) * | 2020-10-30 | 2021-01-15 | 昆山富天达精密金属材料有限公司 | Flatness and appearance size detection device for metal sheet product |
| CN113394154A (en) * | 2021-05-18 | 2021-09-14 | 桂林芯飞光电子科技有限公司 | Suction device and method for detector chip |
-
2018
- 2018-07-17 CN CN201821129194.5U patent/CN208352282U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110289239A (en) * | 2019-04-12 | 2019-09-27 | 广州市加简派电子科技有限公司 | A kind of chip picking-up apparatus of the anti-tamper with energy-saving effect |
| CN110289239B (en) * | 2019-04-12 | 2021-11-02 | 盐城市嘉鸿微电子有限公司 | Chip picking equipment capable of preventing damage |
| CN110332896A (en) * | 2019-04-25 | 2019-10-15 | 太仓北新建材有限公司 | A kind of plasterboard thickness monitor device |
| CN112229364A (en) * | 2020-10-30 | 2021-01-15 | 昆山富天达精密金属材料有限公司 | Flatness and appearance size detection device for metal sheet product |
| CN113394154A (en) * | 2021-05-18 | 2021-09-14 | 桂林芯飞光电子科技有限公司 | Suction device and method for detector chip |
| CN113394154B (en) * | 2021-05-18 | 2022-08-19 | 桂林芯飞光电子科技有限公司 | Suction device and method for detector chip |
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