CN113394154B - Suction device and method for detector chip - Google Patents
Suction device and method for detector chip Download PDFInfo
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- CN113394154B CN113394154B CN202110539828.4A CN202110539828A CN113394154B CN 113394154 B CN113394154 B CN 113394154B CN 202110539828 A CN202110539828 A CN 202110539828A CN 113394154 B CN113394154 B CN 113394154B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a suction device and a suction method for a detector chip, wherein a base of a supporting component is connected with a support, a horizontal mover of a moving component is provided with a first cylinder, a first sliding block is connected with a telescopic rod of the first cylinder, a vacuum pump of the suction component is arranged at one side of the support, a connecting pipe of a suction head is fixed with the first sliding block, a rubber column, a sliding rod and a suction plate are sequentially arranged on the connecting pipe, an adjusting ring is in threaded connection with the connecting pipe, and a buffer spring is arranged between the adjusting ring and the suction plate. Rotate the holding power that the regulating ring provided the suction disc to buffer spring and adjust to can be so that the contact force that produces when contacting the chip is gentler, can absorb the impact of horizontal direction through the rubber ring in addition, through crooked and absorption impact, can resume the normal position after the impact is eliminated, thereby can protect the chip well, avoid the chip to damage at the removal in-process, solve current chip easy atress when absorbing and the problem that damages.
Description
Technical Field
The invention relates to the field of chip manufacturing, in particular to a suction device and a suction method for a detector chip.
Background
The chip is used as a core component of electronic products and widely applied to the fields of Internet of things, smart cards and the like. The production and processing of the chips are mostly carried out in a production line mode, a plurality of processing stations such as detection stations, burning stations and laser coding stations are distributed on the production line, chip carrying devices are correspondingly arranged between every two adjacent processing stations, and during working, the chip carrying devices are responsible for transferring tasks of the chips between every two adjacent processing stations.
The existing device is easy to be damaged by over-stress during the absorption in the transportation process.
Disclosure of Invention
The invention aims to provide a suction device and a suction method for a detector chip, and aims to solve the problem that the existing chip is easily damaged due to over-stress during suction.
In order to achieve the above object, in a first aspect, the present invention provides an absorption apparatus for a probe chip, including a support assembly, an absorption assembly and a moving assembly, where the support assembly includes a base and a support, the base is fixedly connected to the support and located at one side of the support, the moving assembly includes a horizontal mover, a first cylinder and a first slider, the horizontal mover is fixedly connected to the support and located at one side of the support, the first cylinder is fixedly connected to the horizontal mover and located at one side of the horizontal mover, the first slider is fixedly connected to a telescopic rod of the first cylinder and located at one side of the first cylinder, the absorption assembly includes a vacuum pump and a suction head, the vacuum pump is fixedly connected to the support and located at one side of the support, and the suction head includes a rubber column, Connecting pipe, adjustable ring, slide bar, buffer spring and suction disc, the connecting pipe with first slider fixed connection, and be located in the first slider, and with the vacuum pump intercommunication, the rubber column with the connecting pipe intercommunication is located one side of connecting pipe, the slide bar with rubber column sliding connection, and be located the rubber column is kept away from one side of connecting pipe, the suction disc with slide bar fixed connection, and be located one side of slide bar, the adjustable ring with connecting pipe threaded connection, the connecting pipe passes the slide bar, buffer spring with suction disc fixed connection, and be located the suction disc with between the adjustable ring.
The suction head further comprises a sealing ring, and the sealing ring is fixedly connected with the suction plate and is positioned on one side of the suction plate.
The suction head comprises a connecting rod, the connecting rod is fixedly connected with the connecting pipe and is positioned on one side of the connecting pipe, the suction heads are multiple in number and are connected in a sliding mode through the connecting rod, and the suction heads are positioned on one side of the sliding rod.
The connecting rod comprises a supporting rod, a rotating rod and a sliding block, the supporting rod is fixedly connected with the connecting pipe and is located on one side of the connecting pipe, the sliding block is connected with the supporting rod in a sliding mode and is located on one side of the supporting rod, and the rotating rod is connected with the supporting rod in a rotating mode and is in threaded connection with the sliding block.
The rubber column comprises a rubber ring, an air pipe and a plurality of supporting columns, the supporting columns are fixedly connected with the rubber ring and located in the rubber ring, and the air pipe is fixedly connected with the supporting columns and located in the rubber ring.
The rubber column further comprises two connecting rings, and the two connecting rings are fixedly connected with the rubber ring and located on two sides of the rubber ring.
The sucking assembly further comprises a protective cover, and the protective cover is fixedly connected with the horizontal moving device and is positioned on one side of the horizontal moving device.
In a second aspect, the present invention further provides a method for sucking a probe chip, which is suitable for the sucking device for the probe chip as described in the first aspect, and comprises: conveying the chip to the lower part of the suction head, and adjusting the supporting force of a buffer spring through an adjusting plate; starting a first air cylinder to enable the suction plate to be close to the chip; the suction plate contacts the chip under the support of the buffer spring; starting a vacuum pump to suck the chip;
the impact in the moving process is absorbed through the rubber ring and the buffer spring; the chip is placed at a designated position by the horizontal shifter and the first cylinder.
The invention relates to a suction device and a method for a detector chip, wherein a base is fixedly connected with a support, other components are supported by the base and the support, a horizontal shifter is fixedly connected with the support, the horizontal shifter can comprise a rotating motor to perform rotating motion, a horizontal shifting mechanism is used for performing horizontal shifting, assembly can be performed according to needs, a first air cylinder is fixedly connected with the horizontal shifter and can drive the first air cylinder to move through the horizontal shifter, the first air cylinder can drive a first sliding block to move up and down, a vacuum pump is fixedly connected with the support and can provide negative pressure through the vacuum pump, so that the chip can be sucked, a connecting pipe is fixedly connected with the first sliding block, a rubber column is communicated with the connecting pipe, and the rubber column is provided with a flexible rubber supporting rod, the inner part of the rubber column is provided with a gas channel which can be bent, the slide rod is in sliding connection with the rubber column, so that the slide rod can slide relative to the rubber column, the suction plate is fixedly connected with the slide rod, the chip can be contacted through the suction plate, the chip is sucked through the negative pressure generated in the connecting pipe, the adjusting ring is in threaded connection with the connecting pipe, the connecting pipe passes through the slide rod, the buffer spring is fixedly connected with the suction plate, the supporting force provided for the suction plate by the buffer spring can be adjusted through rotating the adjusting ring, so that the contact force generated when the chip is contacted can be gentler, in addition, the rubber ring can absorb the impact in the horizontal direction, the impact can be absorbed through bending, the original position can be restored after the impact is eliminated, the chip can be well protected, and the chip is prevented from being damaged in the moving process, thereby solve the problem that the current chip is easy to be stressed excessively and damaged when absorbing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a left side view of an embodiment of an aspiration device for a probe chip of the present invention;
FIG. 2 is a right side structural view of an adsorbing device for a probe chip of the present invention;
FIG. 3 is a schematic cross-sectional view of an extraction device for a detector chip according to the present invention;
FIG. 4 is a partial enlarged view A of FIG. 3;
FIG. 5 is a flow chart of a method of the present invention for suction of a detector chip.
1-a supporting component, 2-a sucking component, 3-a moving component, 11-a base, 12-a bracket, 13-a limiting piece, 21-a vacuum pump, 22-a sucking head, 23-a protective cover, 31-a horizontal shifter, 32-a first cylinder, 33-a first sliding block, 121-a scale mark, 221-a rubber column, 222-a connecting pipe and 223-an adjusting ring, 224-slide bar, 225-buffer spring, 226-suction plate, 227-sealing ring, 228-connecting bar, 331-first slide block body, 332-sliding seat, 333-second spring, 334-spacing column, 2211-rubber ring, 2212-air tube, 2213-supporting column, 2214-connecting ring, 2281-supporting bar, 2282-rotating bar and 2283-sliding block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 4, the present invention provides an absorption apparatus for a probe chip, including:
supporting component 1, suction component 2 and removal subassembly 3, supporting component 1 includes base 11 and support 12, base 11 with support 12 fixed connection, and be located one side of support 12, removal subassembly 3 includes horizontal shifter 31, first cylinder 32 and first slider 33, horizontal shifter 31 with support 12 fixed connection, and be located one side of support 12, first cylinder 32 with horizontal shifter 31 fixed connection, and be located one side of horizontal shifter 31, first slider 33 with the telescopic link fixed connection of first cylinder 32, and be located one side of first cylinder 32, suction component 2 includes vacuum pump 21 and suction head 22, vacuum pump 21 with support 12 fixed connection, and be located one side of support 12, suction head 22 includes rubber column 221, connecting pipe 222, The connecting pipe 222 is fixedly connected with the first slider 33 and is located in the first slider 33 and is communicated with the vacuum pump 21, the rubber column 221 is communicated with the connecting pipe 222 and is located on one side of the connecting pipe 222, the sliding rod 224 is slidably connected with the rubber column 221 and is located on one side of the rubber column 221 away from the connecting pipe 222, the suction plate 226 is fixedly connected with the sliding rod 224 and is located on one side of the sliding rod 224, the adjusting ring 223 is in threaded connection with the connecting pipe 222, the connecting pipe 222 penetrates through the sliding rod 224, and the buffer spring 225 is fixedly connected with the suction plate 226 and is located between the suction plate 226 and the adjusting ring 223.
In this embodiment, the supporting assembly 1 includes a base 11 and a bracket 12, the base 11 is fixedly connected to the bracket 12 and is located at one side of the bracket 12, and the other components are supported by the base 11 and the bracket 12, the moving assembly 3 includes a horizontal mover 31, a first cylinder 32 and a first slider 33, the horizontal mover 31 is fixedly connected to the bracket 12 and is located at one side of the bracket 12, the horizontal mover 31 may include a rotating motor to perform a rotating motion, a horizontal moving mechanism to perform a horizontal movement, and may be selectively assembled as required, the first cylinder 32 is fixedly connected to the horizontal mover 31 and is located at one side of the horizontal mover 31, the first cylinder 32 may be driven by the horizontal mover 31 to move, and the first slider 33 is fixedly connected to an extension rod of the first cylinder 32, and is located on one side of the first cylinder 32, the first cylinder 32 can drive the first slider 33 to move up and down, the suction assembly 2 includes a vacuum pump 21 and a suction head 22, the vacuum pump 21 is fixedly connected with the bracket 12 and located on one side of the bracket 12, a negative pressure is provided by the vacuum pump 21, so that a chip can be sucked, the suction head 22 includes a rubber column 221, a connection pipe 222, an adjustment ring 223, a slide rod 224, a buffer spring 225 and a suction plate 226, the connection pipe 222 is fixedly connected with the first slider 33, located in the first slider 33, and communicated with the vacuum pump 21, the rubber column 221 is communicated with the connection pipe 222 and located on one side of the connection pipe 222, the rubber column 221 is provided with a flexible rubber support rod 2281, a gas channel is arranged inside and can be bent, and the slide rod 224 is slidably connected with the rubber column 221, and is located at a side of the rubber column 221 far from the connection pipe 222 so that the slide bar 224 can slide with respect to the rubber column 221, the suction plate 226 is fixedly connected to the slide bar 224 and is located at a side of the slide bar 224, the suction plate 226 can contact a chip, the chip is sucked by a negative pressure generated in the connection pipe 222, the adjustment ring 223 is screw-connected to the connection pipe 222, the connection pipe 222 passes through the slide bar 224, the buffer spring 225 is fixedly connected to the suction plate 226 and is located between the suction plate 226 and the adjustment ring 223, the support force provided to the suction plate 226 by the buffer spring 225 can be adjusted by rotating the adjustment ring 223, so that the contact force generated when contacting the chip can be made more gentle, and in addition, the rubber ring 2211 can absorb an impact in a horizontal direction and absorb an impact by bending, the original position can be restored after the impact is eliminated, so that the chip can be well protected, the damage of the chip in the moving process is avoided, and the problem that the existing chip is damaged due to excessive stress when being sucked is solved.
Further, the suction head 22 further comprises a sealing ring 227, wherein the sealing ring 227 is fixedly connected with the suction plate 226 and is located on one side of the suction plate 226.
In this embodiment, the sealing ring 227 is provided at the bottom of the suction plate 226 to improve sealing performance when contacting a chip, so that the chip can be more easily sucked.
Further, the suction head 22 includes a connection pipe 228, the connection pipe 228 is fixedly connected to the connection pipe 222 and is located at one side of the connection pipe 222, a plurality of suction heads 22 are provided, and a plurality of suction heads 22 are slidably connected through the connection pipe 228 and are located at one side of the slide rod 224.
In the present embodiment, by providing a plurality of the suction heads 22, a plurality of chips can be sucked at the same time, and the work efficiency can be improved.
Further, the connecting pipe 228 includes a supporting rod 2281, a rotating rod 2282 and a sliding block 2283, the supporting rod 2281 is fixedly connected to the connecting pipe 222 and is located at one side of the connecting pipe 222, the sliding block 2283 is slidably connected to the supporting rod 2281 and is located at one side of the supporting rod 2281, the rotating rod 2282 is rotatably connected to the supporting rod 2281 and is threadedly connected to the sliding block 2283.
In this embodiment, the position of the slide block 2283 can be adjusted by rotating the rotary rod 2282, and another suction head 22 is provided on the slide block 2283, so that the distance between the two suction heads 22 can be adjusted to accommodate the suction of different chip sizes.
Further, the rubber column 221 includes a rubber ring 2211, an air tube 2212 and a plurality of struts 2213, wherein the plurality of struts 2213 are fixedly connected to the rubber ring 2211 and are located in the rubber ring 2211, and the air tube 2212 is fixedly connected to the plurality of struts 2213 and are located in the rubber ring 2211.
In this embodiment, the gas pipe 2212 is supported by the plurality of columns 2213 through the rubber ring 2211, so that when a chip is subjected to an impact, the gas pipe 2212 follows the movement of the chip to compress the columns 2213 and can be bent, thereby absorbing the lateral impact to protect the chip from being damaged, and after the external force is lost, the chip can be returned to a vertical state by the restoring force of the columns 2213.
Further, the rubber column 221 further includes two connection rings 2214, and the two connection rings 2214 are fixedly connected to the rubber ring 2211 and located at two sides of the rubber ring 2211.
In this embodiment, the rubber ring 2211 and the connection tube 222 can be connected to the sliding rod 224 through the two connection rings 2214 to seal the connection, thereby preventing air leakage at the connection.
Further, the suction assembly 2 further comprises a protection cover 23, and the protection cover 23 is fixedly connected with the horizontal mover 31 and is located on one side of the horizontal mover 31.
In this embodiment, the protective cover 23 is connected to the horizontal shifter 31, so that the lifted chip can be protected from being collided by foreign objects during the shifting process.
Further, the first slider 33 includes a first slider body 331, a sliding seat 332 and a second spring 333, the sliding seat 332 is slidably connected to the first slider body 331 and is fixedly connected to the connecting tube 222, and the second spring 333 is fixedly connected to the sliding seat 332 and is located between the first slider body 331 and the sliding seat 332.
In this embodiment, the sliding seat 332 can slide relative to the first slider body 331, and the second spring 333 is provided to play a role of buffering between the first slider body 331 and the sliding seat 332, so that the sliding seat 332 can absorb the impact caused by the first air cylinder 32 during the moving process, and the connecting tube 222 can move more stably.
Further, the supporting component 1 further includes a limiting piece 13, the limiting piece 13 is connected to the bracket 12 in a sliding manner, and is located on one side of the bracket 12, the first sliding block 33 further includes a limiting post 334, the limiting post 334 is fixedly connected to the sliding seat 332, and is located on one side of the sliding seat 332 close to the limiting piece 13.
In this embodiment, since the first cylinder 32 may have an error in operation, when contacting a chip, the chip may be damaged due to excessive displacement, and therefore, the limiting plate 13 is added, and the limiting plate 13 and the limiting post 334 cooperate to limit the minimum moving distance of the first cylinder 32, thereby preventing the chip from being damaged.
Further, the bracket 12 has a scale mark 121, and the scale mark 121 is located on one side of the bracket 12 close to the limiting sheet 13.
In this embodiment, the position of the limiting piece 13 can be accurately adjusted by the scale marks 121, so that the position adjustment is more convenient.
Referring to fig. 5, the present invention further provides a method for sucking a probe chip, including:
s101, the chip is conveyed to the lower part of the suction head 22, and the supporting force of the buffer spring 225 is adjusted through an adjusting plate.
The conveying line can be arranged on the base 11 to convey the chip, so that conveying is more convenient, and the supporting force of the buffer spring 225 can be adjusted by rotating the adjusting plate, so that adjustment is more convenient.
S102 activates the first cylinder 32 to bring the suction plate 226 close to the chip.
S103 the suction plate 226 contacts the chip under the support of the buffer spring 225.
The suction plate 226 gradually contacts the chip so that the buffer spring 225 can be gradually compressed to reduce an impact generated at the time of contact to protect the chip.
S104, starting the vacuum pump 21 to suck the chip.
The vacuum pump 21 is activated to generate a negative pressure in the connection pipe 222 so that the chip can be sucked through the suction plate 226.
S105 absorbs the impact during the movement by the rubber ring 2211 and the buffer spring 225.
Horizontal impact and longitudinal impact during the moving process can be absorbed by the rubber ring 2211 and the buffer spring 225, respectively, so that the moving process is safer.
S106 places the chip to a designated position through the horizontal mover 31 and the first cylinder 32.
The horizontal mover 31 may be provided with a moving mechanism as needed so that the chip can be placed at a designated position.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A suction device for a detector chip is characterized in that,
comprises a supporting component, an absorbing component and a moving component, wherein the supporting component comprises a base and a bracket, the base is fixedly connected with the bracket and is positioned on one side of the bracket, the moving component comprises a horizontal mover, a first cylinder and a first sliding block, the horizontal mover is fixedly connected with the bracket and is positioned on one side of the bracket, the first cylinder is fixedly connected with the horizontal mover and is positioned on one side of the horizontal mover, the first sliding block is fixedly connected with an expansion link of the first cylinder and is positioned on one side of the first cylinder, the absorbing component comprises a vacuum pump and a suction head, the vacuum pump is fixedly connected with the bracket and is positioned on one side of the bracket, the suction head comprises a rubber column, a connecting pipe, an adjusting ring, a sliding rod, a buffer spring and a suction plate, the connecting pipe is fixedly connected with the first sliding block, and is located in the first slider, and is communicated with the vacuum pump, the rubber column is communicated with the connecting pipe, and is located on one side of the connecting pipe, the slider is slidably connected with the rubber column, and is located on one side of the rubber column away from the connecting pipe, the suction plate is fixedly connected with the slider, and is located on one side of the slider, the adjusting ring is in threaded connection with the connecting pipe, the connecting pipe passes through the slider, the buffer spring is fixedly connected with the suction plate, and is located between the suction plate and the adjusting ring, the first slider comprises a first slider body, a sliding seat and a second spring, the sliding seat is slidably connected with the first slider body, and is fixedly connected with the connecting pipe, the second spring is fixedly connected with the sliding seat, and is located between the first slider body and the sliding seat, the supporting component further comprises a limiting piece, the limiting piece is connected with the support in a sliding mode and located on one side of the support, the first sliding block further comprises a limiting column, the limiting column is fixedly connected with the sliding seat and located on one side of the limiting piece, and the limiting piece is matched with the limiting column to limit the minimum moving distance of the first air cylinder.
2. The suction device for the probe chip according to claim 1,
the suction head further comprises a sealing ring, and the sealing ring is fixedly connected with the suction plate and is positioned on one side of the suction plate.
3. The suction device for the probe chip according to claim 2,
the suction head includes the connecting rod, the connecting rod with connecting pipe fixed connection to be located one side of connecting pipe, the quantity of suction head has a plurality ofly, and is a plurality of the suction head passes through connecting rod sliding connection, and is located one side of slide bar.
4. The suction device for the probe chip according to claim 3,
the connecting rod includes bracing piece, bull stick and sliding block, the bracing piece with connecting pipe fixed connection, and be located one side of connecting pipe, the sliding block with bracing piece sliding connection, and be located one side of bracing piece, the bull stick with the bracing piece rotates to be connected, and with sliding block threaded connection.
5. The suction device for the probe chip according to claim 1,
the rubber column comprises a rubber ring, an air pipe and a plurality of supporting columns, the supporting columns are fixedly connected with the rubber ring and are located in the rubber ring, and the air pipe is fixedly connected with the supporting columns and is located in the rubber ring.
6. The suction device for the probe chip according to claim 5,
the rubber column further comprises two connecting rings, and the two connecting rings are fixedly connected with the rubber ring and located on two sides of the rubber ring.
7. The suction device for the probe chip according to claim 1,
the sucking assembly further comprises a protective cover, and the protective cover is fixedly connected with the horizontal moving device and is positioned on one side of the horizontal moving device.
8. An absorption method for a probe chip, which is applied to the absorption device for the probe chip according to any one of claims 1 to 7,
the method comprises the following steps: conveying the chip to the lower part of the suction head, and adjusting the supporting force of a buffer spring through an adjusting plate;
starting a first air cylinder to enable the suction plate to be close to the chip;
the suction plate contacts the chip under the support of the buffer spring;
starting a vacuum pump to suck the chip;
the impact in the moving process is absorbed through the rubber ring and the buffer spring;
the chip is placed to a designated position by the horizontal shifter and the first cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110539828.4A CN113394154B (en) | 2021-05-18 | 2021-05-18 | Suction device and method for detector chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110539828.4A CN113394154B (en) | 2021-05-18 | 2021-05-18 | Suction device and method for detector chip |
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| CN113394154B true CN113394154B (en) | 2022-08-19 |
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