TW202226330A - Cleaning table for electronic device laminated body, cleaning device, and cleaning method - Google Patents

Abstract

Provided is a cleaning table for an electronic device laminated body for cleaning a transparent base material without wetting an electronic device side. A cleaning table 10 according to the present invention is configured to clean a transparent base material 52 of an electronic device laminated body 50, wherein the cleaning table comprises a placement surface 11 on which the electronic device laminated body is placed with the transparent base material as a front surface, and has a groove 20 formed on the placement surface and formed at a position facing a back-side outer peripheral part 54 of an outer peripheral edge side 53 of the electronic device laminated body, an outer peripheral wall 22 constituting an outer periphery of the groove and extending to the outer peripheral edge side of the electronic device laminated body, and a gas supply means 24 that communicates with the groove and supplies purge gas to the groove. The outer peripheral wall is separated by a gap 23 from the back-side outer peripheral part of the electronic device laminated body. The purge gas supplied by the gas supply means to the groove is blown out from the gap between the outer peripheral edge side of the electronic device laminated body and the outer peripheral wall.

Description

Cleaning station, cleaning device and cleaning method for transparent substrate of electronic device laminate

The present invention relates to a cleaning station, a cleaning apparatus, and a cleaning method for cleaning a transparent substrate of an electronic device laminate formed by laminating a transparent substrate on an electronic device such as an organic EL display panel.

Generally speaking, in electronic devices such as organic EL displays (OLEDs) and liquid crystal panels (LCDs), a light-emitting layer is sandwiched between a hole transport layer and an electron transport layer, and the electrodes are further sandwiched between them, and then placed on a conductive substrate constituted above. Since the conductive substrate is a flexible substrate, when manufacturing an electronic device, it is in the form of an electronic device laminate in which the electronic device is laminated on a transparent substrate made of hard and highly flat glass or plastic. Then, in a subsequent step, the transparent base material is peeled off from the electronic device laminate by LLO (laser lift off) or the like to produce electronic devices such as an OLED panel.

In the case of LLO, the transparent substrate is irradiated with a laser to peel off the transparent substrate. At this time, if there is foreign matter on the transparent substrate, the laser will be shielded, so that the transparent substrate cannot be peeled off smoothly. Therefore, cleaning or polishing for removing foreign matter existing on the surface of the transparent substrate is required. Patent Document 1 lists the cleaning method of the transparent substrate in paragraph 0060, but does not disclose a specific cleaning method. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 6492140

(The problem that the invention intends to solve)

In order to efficiently clean the transparent substrate, water cleaning by high-pressure water jet is suitable. However, since performance will be degraded if the electronic device side is wetted with water, it is required to perform cleaning without the electronic device side being wetted.

An object of the present invention is to provide a cleaning station, a cleaning device, and a cleaning method for an electronic device laminate for performing water cleaning on a transparent substrate without the electronic device side being wetted. (Technical means to solve problems)

The cleaning station for the transparent substrate of the electronic device laminate of the present invention is a A cleaning station for cleaning the transparent substrate for an electronic device laminate including an electronic device and a transparent substrate mounted on one surface of the electronic device; The cleaning table is provided with a placing surface on which the electronic device laminate is placed so that the transparent substrate is the surface; The washing station also has: a groove, which is formed on the outer periphery of the mounting surface, and is formed at a position facing the outer peripheral edge portion of the back side of the outer peripheral edge of the electronic device laminate; an outer peripheral wall, which constitutes the outer periphery of the groove and extends to the outer peripheral edge of the electronic device laminate; and A gas conveying means, which is communicated with the above-mentioned grooves, and conveys the purging gas to the above-mentioned grooves; in, The said outer peripheral wall is arrange|positioned so that a clearance may exist between the said back surface side outer peripheral edge part of the said electronic device laminated body; The purging gas fed from the gas feeding means to the groove is blown against the outer peripheral edge portion of the back surface side of the electronic device laminate, and is blown between the outer peripheral edge of the electronic device laminate and the outer peripheral wall. of the above-mentioned gap blown out.

The groove is preferably formed at a position opposite to the outer peripheral edge portion on the back side that is further inward than the outer peripheral edge of the laminate body of the electronic device.

The above-mentioned groove system may be configured to make one turn around the above-mentioned placement surface.

Preferably, the groove is provided with a protruding concave portion extending outward at a position opposite to the corner portion of the electronic device laminate.

It is preferable that the said outer peripheral wall is comprised so that the height adjustment of the said clearance may be possible to approach/separate the said back surface side outer peripheral edge part of the said electronic device laminated body.

It can be further configured to have: 1 or a plurality of adsorption holes, which are opened on the above-mentioned mounting surface; and The gas suction means sucks the suction gas from the above-mentioned adsorption hole.

Furthermore, the cleaning device for the transparent substrate of the electronic device laminate of the present invention is provided with: the wash station as mentioned above; and A blowing means for blowing a cleaning solution against the transparent base material of the electronic device laminate placed on the cleaning table.

In addition to the blowing means, there is also a polishing device; the polishing device is configured to perform the polishing of the transparent base material while blowing the cleaning solution by the blowing means, or to firstly blow the cleaning liquid by the blowing means. After the cleaning solution is applied, the transparent substrate is polished by the polishing device, and then the cleaning solution is blown again.

Furthermore, the cleaning method of the transparent substrate of the electronic device laminate of the present invention is A cleaning method for cleaning the transparent substrate for an electronic device laminate including an electronic device and a transparent substrate mounted on one surface of the electronic device; On a cleaning table having a mounting surface and a groove formed on the outer periphery of the mounting surface, the electronic device laminate is mounted so that the transparent substrate is the surface; In a state where the purging gas is blown against the outer peripheral edge portion on the back side of the peripheral edge of the electronic device laminate from the groove, and is blown out from the outer peripheral edge of the electronic device laminate, The above-mentioned transparent substrate is blown against the cleaning solution and washed.

The groove is formed at a position where the outer peripheral edge of the back side is opposite to the outer peripheral edge of the electronic device laminate, and the purge gas can be blown out from the outer peripheral edge of the electronic device laminate. Effective cleaning is performed in a state where there is no residual cleaning solution.

In the cleaning method, it is preferable that the electronic device laminate is adsorbed on the cleaning table at an inner side of the outer peripheral edge portion on the back side during cleaning.

The step of blowing the cleaning solution on the transparent substrate and washing it may be performed as follows: grinding the transparent substrate while blowing the cleaning solution; or, after blowing the cleaning solution first, The above-mentioned steps of polishing the transparent base material and then blowing the above-mentioned cleaning solution are performed again. (Compared to the efficacy of the prior art)

According to the cleaning table of the present invention, the electronic device laminate is placed on the mounting surface, and the transparent substrate can be appropriately cleaned by blowing the cleaning solution against the transparent substrate. At this time, by blowing out forced air from the outer peripheral edge of the electronic device laminate, the cleaning solution blown against the transparent substrate is blown away, and does not adhere or refill to the electronic device located on the back side of the transparent substrate. , which can prevent the electronic device from being wetted by water. In addition, by sucking the suction gas from the adsorption holes formed on the mounting surface to adsorb the electronic device laminate, the electronic device laminate does not float from the mounting surface or shift in position due to forced air.

According to the cleaning device and the cleaning method of the electronic device laminate of the present invention, the transparent substrate can be cleaned with the cleaning solution under the condition that the electronic device is prevented from being wetted by water.

Hereinafter, the cleaning table 10 according to an embodiment of the present invention will be described with reference to the drawings.

1 is a perspective view showing the electronic device laminate 50 placed on the cleaning table 10 of the present invention, FIG. 2 is a cross-sectional view showing the vicinity of the outer peripheral edge, and FIG.

As shown in FIGS. 1 and 2 , the cleaning table 10 of the present invention is a platform on which the electronic device laminate 50 is placed. As described above, the electronic device laminate 50 is an electronic device 51 such as an organic EL display (OLED), a liquid crystal panel (LCD), and the like, and is formed as a flexible substrate, for example. Then, the flexible electronic device 51 is disposed on a transparent substrate 52 made of high flatness glass (carrier glass) or plastic in order to prevent flexural deformation during the manufacturing process and facilitate handling.

The cleaning table 10 is used by placing the electronic device laminate 50 with the transparent substrate 52 as the surface. For example, the cleaning device (not shown) is shown in FIG. 2, and the cleaning table 10 is directly below the cleaning liquid 40 blown from the blowing means (similarly not shown) such as jet nozzles. The surface of the transparent base material 52 is cleaned by self-propelling, or being placed on a belt conveyor, etc. and moving, and being blown against the cleaning liquid 40 from above. As the cleaning liquid system, for example, pure water, a lotion, and an organic solvent (including alcohol and acetone) to which a surfactant is added can be exemplified.

In the cleaning table 10 of the present invention, the electronic device laminate 50 is placed, and the cleaning liquid dropped on the outer peripheral edge of the electronic device laminate 50 is blown away by blowing the purge gas 25 from the peripheral surface. As shown in FIG. 2 , in the related electronic device laminate 50 , the outer peripheral edge (end surface) is designated by reference numeral 53 , and the area belonging to the back side of the electronic device laminate 50 and having a certain width of the outer peripheral edge 53 is referred to as The rear side outer peripheral edge portion 54 .

The cleaning table 10 will be described in detail. As shown in FIG. 1 , the cleaning table 10 can be set to have the same shape as the electronic device laminate 50 . One embodiment of the cleaning table 10 includes a mounting surface 11 slightly smaller than the electronic device laminate 50 , a groove 20 formed on the outer periphery of the mounting surface 11 , and an outer peripheral wall 22 constituting the groove 20 , and the outer periphery is The outer shape of the wall 22 is approximately the same as the outer shape of the electronic device laminate 50 . For example, as shown in FIG. 2 , the cleaning table 10 may be configured such that the placing surface 11 is the first base body 12 , the groove structure 13 is arranged on the outer periphery of the first base body 12 , and the second base body is arranged below the first base body 12 . 14. In addition, the structure of the cleaning table 10 is not limited to this, It may be comprised by an integral body, or it may be comprised by the base body other than illustration, etc.. FIG.

In the cleaning table 10 , the groove 20 is formed at a position facing the outer periphery of the mounting surface 11 , that is, the outer peripheral edge portion 54 on the back side of the electronic device laminate 50 . The groove 20 is preferably formed at a position facing the inner side of the outer peripheral edge portion 54 on the back side of the electronic device laminate 50 . Compressed purge gas 25 (eg, air: indicated by the arrow in FIG. 2 ) is delivered to the groove 20 from one or more locations by means of gas delivery means 24 such as a blower. The groove 20 and the gas conveying means 24 are appropriately connected by piping or the like. It is preferable that the groove 20 is formed around the outer peripheral edge portion 54 on the back side of the electronic device laminate 50 once. In addition, it is preferable to set the four corners of the groove 20, that is, at the position facing the corners of the electronic device laminate 50, as shown in FIG. The shape of the recessed portion 21 .

The outer peripheral wall 22 of the trench 20 forms a gap 23 for blowing out the purge gas 25 as shown in FIG. In the illustrated embodiment, the groove 20 has the inner peripheral wall as the outer peripheral surface of the first base body 12, and the bottom portion of the groove structure body 13 constituted by a substantially L-shaped frame in cross-section surrounding the outer periphery of the first base body 12. The trench bottom is formed, and the outer peripheral wall 22 of the trench 20 is formed by the vertical portion. In addition, as a preferred embodiment, the outer peripheral wall 22 of the groove 20, that is, the groove structure 13 is shown in the direction of the arrow 26 in FIG. 2, and the height can be adjusted up and down. As will be described later, this is used to adjust the amount or pressure of the forced gas blown out from the gap 23 . The height adjustment of the groove structure 13 can be performed by, for example, adjusting the locking amount of a bolt, or using a spring and a spacer. In addition, since the groove structure body 13 is an elongated rod body, it is preferable not to use resin but to use aluminum or stainless steel.

Furthermore, as shown in FIG. 2 , the mounting surface 11 of the cleaning table 10 is formed to be slightly smaller than the electronic device laminate 50 . As shown in FIGS. 2 and 3 , the placement surface 11 is provided with one or a plurality of suction holes 30 . These adsorption holes 30 are connected to gas suction means 32 such as a pump by piping or the like, as shown in FIG. 2 . Then, the electronic device laminate 50 on the mounting surface 11 is sucked by the suction gas 33 , and is adsorbed and fixed to the mounting surface 11 . In the embodiment shown in the figure, the adsorption holes 30 penetrate through the first base body 12 in a substantially vertical manner, and are connected to the gas suction means 32 by the communication grooves 31 recessed on the upper surface of the second base body 14 . The first base body 12 constituting the placement surface 11 is preferably made of resin in order to prevent the electronic device laminate 50 from being scratched or the like.

Then, the cleaning table 10 configured as described above is attached to the mounting surface 11, and as shown in FIG. As shown in FIG. 2 , the electronic device laminate 50 is placed so that the outer peripheral edge portion 54 on the back side faces the trench 20 and the outer peripheral wall 22 of the trench 20 , and the inner peripheral side faces the suction hole 30 .

In this state, the purge gas 25 is delivered from the gas delivery means 24 , and the suction gas 33 is sucked from the gas suction means 32 . As shown in FIG. 2 , the purge gas 25 delivered from the gas delivery means 24 is directed from the groove 20 toward the gap 23 formed between the outer peripheral wall 22 of the groove 20 and the outer peripheral edge portion 54 on the back side of the electronic device laminate 50 . was blown out. In addition, since the four corners of the groove 20 are curved, the blowing amount of the purging gas 25 may decrease. However, as shown in FIG. It can increase the forced cleaning gas 25a from the four corners, and can achieve a constant blowing amount.

Due to the forced net gas pressure, the electronic device laminate 50 may float from the cleaning table 10 or be displaced. On the other hand, in the present embodiment, the mounting surface 11 is provided with the adsorption holes 30 , and the electronic device laminate 50 is adsorbed on the mounting surface 11 by the suction gas pressure sucked from the adsorption holes 30 by the gas suction means 32 . Therefore, the electronic device laminate 50 can be prevented from being lifted or displaced.

In this state, as indicated by the arrow direction 40 in FIG. 2 , the cleaning liquid is blown against the transparent substrate 52 from the blowing means of the cleaning device. The cleaning liquid 40 is preferably blown out from the blowing means by high-pressure jet. Thereby, the foreign matter adhering to the transparent base material 52 is removed. The causes of foreign matter are, for example, adhered paste (glue), resin, and other roller marks during transportation. The water pressure and water volume of the cleaning solution 40 can be increased or decreased according to the adhered foreign matter. In addition to the blowing means, the cleaning device may add a polishing device (a device that rotates and presses a brush, a pad mixed with abrasives, etc.) to polish the transparent substrate 52, which is more effective. to remove foreign matter. The polishing system can grind the transparent substrate 52 by blowing out the cleaning solution 40 by means of blowing, or blowing the cleaning solution 40 first, then polishing the transparent substrate 52, and then blowing again. The cleaning solution 40 and the like are applied.

The cleaning solution 40 blown against the transparent substrate 52 moves toward the outer periphery of the transparent substrate 52 and drops on the outer peripheral edge 53 of the electronic device laminate 50 . In the present invention, the cleaning station 10 is configured to blow the forced cleaning gas 25 from the back side of the electronic device laminate 50 toward the outer periphery, so that the dripping cleaning liquid 40 does not reach the electronic device 51 and does not refill the electronic device 51 . The device 51 is blown away (reference numeral 40a in FIG. 2). Therefore, the transparent substrate 52 can be cleaned with the cleaning solution in a state where the electronic device 51 is not wetted by water.

As described above, the water pressure and the water volume of the cleaning solution 40 are increased or decreased in accordance with the adhered foreign matter. In addition, the amount of water to be used and the like are also increased or decreased in accordance with the area of the electronic device laminate 50 to be cleaned. On the other hand, by increasing or decreasing the forced purge gas pressure and the forced purge gas amount sent from the gas delivery means 24, the cleaning liquid 40 can be appropriately blown away. On the other hand, by adjusting the gap 23 between the outer peripheral wall 22 of the groove 20 into which the purging gas 25 is blown and the outer peripheral edge 54 on the back side of the electronic device laminate 50, the blown purging gas can be pressed and forced. Adjustment of net gas volume. For example, the fine adjustment that cannot be completely adjusted by the forced net gas pressure and the forced net gas amount delivered from the gas delivery means 24 is preferably controlled by the height of the adjustment gap 23 .

After cleaning, the electronic device laminate 50 is placed on the cleaning table 10 , or after being transferred from the cleaning table 10 , and then moved to subsequent steps such as draining, drying, or LLO of the electronic device laminate 50 . You can.

According to the present invention, the cleaning liquid 40 utilizes the forced cleaning gas 25 blown out from the cleaning table 10, so that the electronic device 51 can be prevented from being wetted by water. Therefore, the transparent base material 52 can be washed with the cleaning solution 40, and the foreign matter of the transparent base material 52 can be efficiently removed. Therefore, when the transparent base material 52 is peeled off by LLO or the like in the subsequent step, lightning due to foreign matter can be prevented. If the shot is blocked, the accuracy of the product can be improved.

The above description is only for describing the present invention, and should not be construed as limiting the invention described in the scope of the application, or limiting the scope. In addition, the configuration of each part of the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various changes can be made within the technical scope described in the scope of the patent application.

As an embodiment, the width and depth of the groove 20 are 3 to 10 mm, the thickness of the outer peripheral wall 22 is 5 to 30 mm, and the gap 23 is 0.01 to 5 mm. In addition, the diameter of the adsorption hole 30 is 0.1 to 1 mm, and the pitch is 10 to 30 mm. These are appropriately adjusted using the area of the electronic device laminate 50 and the water pressure and water volume of the cleaning solution 40 . In addition, the adsorption hole 30 may be configured to increase the diameter of the outer peripheral side affected by the purging gas 25 to increase the adsorption force. In addition, by setting the portion that becomes the display surface of the electronic device 51 to have a smaller diameter and the portion that is not the display surface to have a larger diameter, it is possible to reduce the amount of gas 33 on the display surface due to the suction gas 33 of the adsorption hole 30 . There is a bad situation, and it has the expected adsorption force.

10: Washing station 11: Mounting surface 12: 1st Matrix 13: Groove Construct 14: 2nd matrix 20: Groove 21: Extend the recess 22: Peripheral wall 23: Gap 24: Gas delivery means 25: Force net gas 26: Arrow direction 30: adsorption hole 31: Connecting grooves 32: Gas suction means 33: suction gas 40: Cleaning solution (direction of arrow) 40a: Direction of cleaning liquid blowing 50: Electronic device laminate 51: Electronic Devices 52: Transparent substrate 53: Outer peripheral edge 54: Back side outer periphery

FIG. 1 is a perspective view showing a state in which an electronic device laminate is placed on a cleaning table according to an embodiment of the present invention. 2 is a cross-sectional view of the vicinity of the outer peripheral edge portion of the cleaning table on which the electronic device laminate is placed. Fig. 3 is a plan view of the vicinity of the corner portion of the cleaning table.

10: Washing station

11: Mounting surface

12: 1st Matrix

13: Groove Construct

14: 2nd matrix

20: Groove

22: Peripheral wall

23: Gap

24: Gas delivery means

25: Force net gas

26: Arrow direction

30: adsorption hole

31: Connecting grooves

32: Gas suction means

33: suction gas

40: Cleaning solution (direction of arrow)

40a: Direction of cleaning liquid blowing

50: Electronic device laminate

51: Electronic Devices

52: Transparent substrate

53: Outer peripheral edge

54: Back side outer periphery

Claims (12)

A cleaning station for a transparent substrate of an electronic device laminate, for cleaning the transparent substrate for an electronic device laminate including an electronic device and a transparent substrate mounted on one surface of the electronic device washing table; The cleaning table is provided with a mounting surface on which the above-mentioned electronic device laminate is placed on the above-mentioned transparent substrate. placed for the purpose of being superficial; The washing station also has: a groove, which is formed on the mounting surface and is formed at a position facing the outer peripheral edge portion on the back side of the outer peripheral edge of the electronic device laminate; an outer peripheral wall, which constitutes the outer periphery of the groove and extends to the outer peripheral edge of the electronic device laminate; and A gas conveying means, which is communicated with the above-mentioned groove, and conveys the purging gas to the above-mentioned groove; The said outer peripheral wall is arrange|positioned so that a clearance may exist between the said back surface side outer peripheral edge part of the said electronic device laminated body; The purging gas fed from the gas feeding means to the groove is blown against the outer peripheral edge portion of the back surface side of the electronic device laminate, and is blown between the outer peripheral edge of the electronic device laminate and the outer peripheral wall. of the above-mentioned gap blown out. The cleaning table for the transparent base material of the electronic device laminate according to claim 1, wherein the groove is formed at a position facing the outer peripheral edge portion on the back side that is further inward than the outer peripheral edge of the electronic device laminate. . The cleaning table for the transparent base material of the electronic device laminate according to claim 1 or 2, wherein the grooves are formed around the mounting surface once. The cleaning table for the transparent base material of the electronic device laminate according to any one of claims 1 to 3, wherein the groove is provided with a position facing outward at a position facing the corner of the electronic device laminate. The protruding recesses that extend out. The cleaning station for the transparent substrate of the electronic device laminate according to any one of claims 1 to 4, wherein the outer peripheral wall is capable of approaching/separating from the outer peripheral edge portion on the back side of the electronic device laminate, And the height adjustment of the said clearance gap is performed. The cleaning station for the transparent substrate of the electronic device laminate according to any one of claims 1 to 5, further comprising: 1 or a plurality of adsorption holes, which are opened on the above-mentioned mounting surface; and The gas suction means sucks the suction gas from the above-mentioned adsorption hole. A cleaning device for a transparent substrate of an electronic device laminate, comprising: A washing station, which is the washing station of any one of Claims 1 to 6; and A blowing means for blowing a cleaning solution against the transparent base material of the electronic device laminate placed on the cleaning table. The cleaning device for the transparent base material of the electronic device laminate according to claim 7, further comprising a polishing device in addition to the blowing means; the polishing device blows the cleaning liquid by the blowing means, While polishing the transparent base material, or firstly blowing the cleaning solution with the blowing means, then polishing the transparent base material with the polishing device, and then blowing the cleaning solution again. A method for cleaning a transparent substrate of an electronic device laminate, comprising cleaning the transparent substrate for an electronic device laminate including an electronic device and a transparent substrate mounted on one surface of the electronic device. cleaning method; The above-mentioned electronic device laminate is placed on a cleaning table having a placing surface and a groove formed on the outer periphery of the placing surface so that the transparent substrate is the surface; In a state where the purging gas is blown against the outer peripheral edge portion on the back side of the outer peripheral edge of the electronic device laminate from the groove, and is blown out from the outer peripheral edge of the electronic device laminate, The above-mentioned transparent substrate is blown against the cleaning solution and washed. The method for cleaning a transparent substrate of an electronic device laminate according to claim 9, wherein the groove is formed at an outer peripheral edge portion on the back side further inward than the outer peripheral edge of the electronic device laminate, and the grooves are formed from the electronic device laminate. The purging gas is blown out from the outer peripheral edge of the device layered body. The method for cleaning a transparent substrate of an electronic device laminate according to claim 9 or 10, wherein, in the cleaning, the electronic device laminate is adsorbed to the cleaning at an inner side of the outer peripheral portion on the back side. tower. The method for cleaning a transparent substrate of an electronic device laminate according to any one of claims 9 to 11, wherein the step of blowing the cleaning solution on the transparent substrate and cleaning is performed while blowing the cleaning solution on the transparent substrate. The polishing of the transparent substrate is carried out with the liquid, or the step of firstly blowing the cleaning liquid, polishing the transparent substrate, and then blowing the cleaning liquid again.

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