TW201314372A - Coating device - Google Patents

Coating device Download PDF

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Publication number
TW201314372A
TW201314372A TW101121521A TW101121521A TW201314372A TW 201314372 A TW201314372 A TW 201314372A TW 101121521 A TW101121521 A TW 101121521A TW 101121521 A TW101121521 A TW 101121521A TW 201314372 A TW201314372 A TW 201314372A
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Taiwan
Prior art keywords
substrate
stage
adsorption
coating
disposed
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TW101121521A
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Chinese (zh)
Inventor
Yasuhiro Kawaguchi
Koichi Jono
Yoshinori Takagi
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Dainippon Screen Mfg
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Priority claimed from JP2011208738A external-priority patent/JP2013066868A/en
Priority claimed from JP2011208737A external-priority patent/JP5941644B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW201314372A publication Critical patent/TW201314372A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

The present invention provides a coating device which still can accurately apply the coating liquid to the substrate even in situation where the substrate to be coated has large warpage. In this invention, substrates are transferred to the stage (12) by the substrate transfer mechanism (14) and adsorbed and held on the holding surfaces (30). Then, under the state that the slit for spitting coating liquid in the slit nozzle (41) approaches and contacts the surface of the substrate which is adsorbed and held on the holding surfaces (30) of the stage (12), the slit nozzle (41) moves relative to the substrate. As such, the coating liquid is coated onto the substrate surface. During the period of slit nozzle (41) applying the coating liquid to the substrate, a plurality of suction disks (71) is used to adsorb and hold the back surface of the substrate at several positions to press the substrate against the holding surfaces (30) of the stage (12).

Description

塗佈裝置 Coating device

本發明係有關用以對有機EL顯示裝置用玻璃基板、液晶顯示裝置用玻璃基板、太陽能電池用面板基板、PDP用玻璃基板、光罩用玻璃基板、及光碟用基板等基板塗佈塗佈液之塗佈裝置。 The present invention relates to a coating liquid for coating a substrate such as a glass substrate for an organic EL display device, a glass substrate for a liquid crystal display device, a panel substrate for a solar cell, a glass substrate for a PDP, a glass substrate for a photomask, and a substrate for an optical disk. Coating device.

於此一塗佈裝置中,採用在將基板載置於載台上,同時使狹縫噴嘴中的塗佈液吐出用狹縫接近載置於載台上之基板表面的狀態下,使此狹縫噴嘴沿基板表面移動,藉此將塗佈液塗佈於基板表面之構造。 In the coating apparatus, the substrate is placed on the stage, and the coating liquid discharge slit in the slit nozzle is brought close to the surface of the substrate placed on the stage, thereby making the narrow portion The slit nozzle is moved along the surface of the substrate, whereby the coating liquid is applied to the surface of the substrate.

於此一塗佈裝置中,在將基板搬入至載台上、或將基板自載台上搬出時,使用有可於載台上昇降地配置之昇降銷、以及於此昇降銷間轉送基板之搬送機器人(參照日本專利特開2007-287914號公報)。 In the above coating apparatus, when the substrate is carried onto the stage or the substrate is carried out from the stage, a lift pin that can be placed on the stage to be lifted and lowered, and a transfer substrate between the lift pins are used. The transfer robot (refer to Japanese Laid-Open Patent Publication No. 2007-287914).

又,亦提案有一邊藉由滾輪搬送基板,一邊自狹縫噴嘴將塗佈液塗佈於基板表面之構造的塗佈裝置(參照日本專利特開2009-61380號公報)。 In addition, a coating apparatus having a structure in which a coating liquid is applied to a surface of a substrate from a slit nozzle while the substrate is being conveyed by a roller is proposed (see Japanese Patent Laid-Open Publication No. 2009-61380).

又,亦提案有為了將基板吸附保持於載台上,在藉由吸附墊吸附基板的狀態下,使此吸附墊朝載台方向移動,在藉由吸附墊將基板全面壓抵於載台的狀態下,將此基板吸附保持於載台上,然後解除由吸附墊所產生之壓抵力之基板固定方 法(參照日本專利特開2004-179399號公報)。 Further, in order to adsorb and hold the substrate on the stage, the adsorption pad is moved toward the stage in a state in which the substrate is adsorbed by the adsorption pad, and the substrate is entirely pressed against the stage by the adsorption pad. In the state, the substrate is adsorbed and held on the stage, and then the substrate fixed by the pressure pad generated by the adsorption pad is released. The method (refer to Japanese Patent Laid-Open Publication No. 2004-179399).

在使用較厚、翹曲大的太陽能電池用面板基板作為基板的情形時,存在有無法將基板完全吸附保持於載台上的情形。亦即,如日本專利特開2004-179399號公報所記載,即使一旦將基板吸附保持於載台上,但由於基板的厚度大且翹曲亦劇烈,因此,存在有基板之一部分區域與載台間會形成間隙的情形。在發生此一現象的情況下,無法使基板與狹縫噴嘴間之距離成為一定,從而使塗佈液之塗佈精度惡化。又,在基板之翹曲較大的情況下,亦存在基板與狹縫噴嘴碰撞的危險。而且,這一現象於厚度在1.7 mm以上之太陽能電池用面板基板中,是特別容易發生的現象。 When a panel substrate for a solar cell having a large thickness and a large warpage is used as a substrate, there is a case where the substrate cannot be completely adsorbed and held on the stage. In other words, as described in Japanese Laid-Open Patent Publication No. 2004-179399, even if the substrate is adsorbed and held on the stage, the thickness of the substrate is large and the warpage is severe. Therefore, there is a portion of the substrate and the stage. A situation in which a gap is formed. When this phenomenon occurs, the distance between the substrate and the slit nozzle cannot be made constant, and the coating accuracy of the coating liquid is deteriorated. Moreover, when the warpage of the substrate is large, there is a risk that the substrate collides with the slit nozzle. Moreover, this phenomenon is particularly likely to occur in a panel substrate for a solar cell having a thickness of 1.7 mm or more.

為對應此一問題,雖然亦可藉由噴灑塗佈方式、真空蒸鍍法、或化學汽相成長法等,於基板表面進行成膜,但成膜材料之使用效率卻不佳,而且,製造成本亦會變高。 In order to cope with this problem, although film formation can be performed on the surface of the substrate by a spray coating method, a vacuum vapor deposition method, or a chemical vapor phase growth method, the use efficiency of the film forming material is not good, and manufacturing is also performed. The cost will also become higher.

本發明係為了解決上述問題所完成者,其目的在於提供一種塗佈裝置,例如即使在對如太陽能電池用面板基板般翹曲大的基板塗佈塗佈液的情況下,仍可高精度地塗佈塗佈液。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a coating apparatus which can accurately apply a coating liquid, for example, even when a coating liquid is applied to a substrate having a large warpage like a panel substrate for a solar cell. The coating liquid was applied.

第1發明係一種塗佈裝置,其藉由在使狹縫噴嘴中的塗佈液吐出用狹縫在接近載置於載台上之基板表面的狀態下,使 其相對於該基板沿水平方向進行相對移動,將塗佈液塗佈於基板表面,其特徵在於,具備複數個吸附構件,其在藉由上述狹縫噴嘴將塗佈液塗佈上述基板的期間,於吸附保持上述基板背面的複數個位置狀態下,將上述基板壓抵於上述載台之表面,相對於上述載台平坦地保持上述基板。 According to a first aspect of the invention, a coating apparatus is provided in a state in which a coating liquid discharge slit in a slit nozzle is brought close to a surface of a substrate placed on a stage. The coating liquid is applied to the surface of the substrate relative to the substrate, and the coating liquid is applied to the surface of the substrate. The coating liquid is provided with a plurality of adsorption members, and the coating liquid is applied to the substrate by the slit nozzle. In a state in which a plurality of positions on the back surface of the substrate are adsorbed and held, the substrate is pressed against the surface of the stage, and the substrate is held flat with respect to the stage.

如第1發明之第2發明,上述吸附構件具備由彈性材料所構成之盤狀吸附部以及與減壓手段連通之基部,在形成於上述載台之孔部內,吸附部之前端在自上述載台之表面突出的狀態下,其基部係由固定於上述載台之吸盤所構成;藉由在上述吸附部之前端與上述基板之背面抵接的狀態下,使由上述吸附部及上述基板所形成之空間內部進行排氣,利用上述吸附部彈性變形之作用,將上述基板之背面壓抵於上述載台之表面。 According to a second aspect of the invention, the adsorption member includes a disk-shaped adsorption portion made of an elastic material and a base portion that communicates with the decompression means, and is formed in the hole portion of the stage, and the front end of the adsorption portion is from the above In a state in which the surface of the stage is protruded, the base portion is constituted by a suction cup fixed to the stage; and the adsorption unit and the substrate are provided in a state in which the front end of the adsorption unit is in contact with the back surface of the substrate. The inside of the formed space is evacuated, and the back surface of the substrate is pressed against the surface of the stage by the action of elastic deformation of the adsorption portion.

如第2發明之第3發明,其進一步具備外周部按壓構件,其將載置於上述載台上之基板之外周部壓抵於上述載台之表面。 According to a third aspect of the invention, the outer peripheral portion pressing member is configured to press the outer peripheral portion of the substrate placed on the stage against the surface of the stage.

如第1至第3發明中任一發明之第4發明,其進一步具備:基板搬送機構,係相對於上述載台水平地搬送基板;以及複數個基板搬送構件,其配設於上述載台,可昇降於藉由至少使其一部分配置在較上述載台表面上方而將基板在上述基板搬送機構間搬送之搬送位置、及與藉由使其全部配置在較上述載台表面下方而用以將上述基板吸附保持於上述 載台表面之退避位置之間。 According to a fourth aspect of the present invention, the fourth aspect of the invention, further comprising: a substrate transfer mechanism that horizontally transports the substrate with respect to the stage; and a plurality of substrate transfer members disposed on the stage Elevating and lowering the transport position by transporting the substrate between the substrate transport mechanisms by at least partially disposing them over the surface of the stage, and by placing all of them below the surface of the stage The substrate adsorption is maintained above Between the retracted positions of the surface of the stage.

如第4發明之第5發明,上述複數個基板搬送構件係在形成於載台之孔部內,配設成可相互同步昇降之複數個滾輪或皮帶。 According to a fifth aspect of the invention, the plurality of substrate transfer members are disposed in the hole portion formed in the stage, and are disposed in a plurality of rollers or belts that can be simultaneously raised and lowered.

如第4發明之第6發明,上述狹縫噴嘴係相對於上述載台沿第1方向往返移動,同時,上述基板搬送機構及上述複數個基板搬送構件係沿與上述第1方向正交之第2方向搬送基板, According to a sixth aspect of the invention, the slit nozzle is reciprocated in the first direction with respect to the stage, and the substrate transfer mechanism and the plurality of substrate transfer members are orthogonal to the first direction. Transfer the substrate in 2 directions,

如第6發明之第7發明,上述基板搬送機構係往返移動於接近上述載台進行轉送基板之轉送位置、與在上述載台與上述基板搬送機構之間使上述狹縫噴嘴可沿上述第1方向往返移動之分離位置之間。 According to a seventh aspect of the invention, the substrate transfer mechanism is configured to reciprocate a transfer position of the transfer substrate adjacent to the stage, and to cause the slit nozzle to be along the first between the stage and the substrate transfer mechanism The direction moves back and forth between the separated positions.

如第1至第3發明中任一發明之第8發明,上述基板係太陽能電池用面板基板。 According to an eighth aspect of the invention of the invention of the first aspect of the invention, the substrate for a solar cell panel.

如第8發明之第9發明,上述基板之厚度在1.7 mm以上之塗佈裝置。 According to a ninth invention of the eighth aspect of the invention, the substrate has a thickness of 1.7 mm or more.

第1發明,由於在塗佈塗佈液之期間,藉由複數個吸附構件,將基板壓抵於載台表面,因此,即便是翹曲大的基板,仍可藉由在塗佈動作中積極矯正基板之翹曲,為精度地將塗佈液塗佈於基板。 According to the first aspect of the invention, since the substrate is pressed against the surface of the stage by a plurality of adsorption members during the application of the coating liquid, even a substrate having a large warpage can be positively caused by the coating operation. The warpage of the substrate is corrected, and the coating liquid is applied to the substrate in an accurate manner.

第2發明,可不設置用來使吸盤相對於載台昇降之特別機 構,將基板之背面壓抵於載台表面。 According to the second aspect of the invention, there is no special machine for lifting the suction cup relative to the stage The bottom surface of the substrate is pressed against the surface of the stage.

第3發明,可將容易發生翹曲之基板之外周部壓抵於載台表面。 According to the third aspect of the invention, the outer peripheral portion of the substrate which is likely to be warped can be pressed against the surface of the stage.

第4及第5發明,由於在將藉由基板搬送構件搬送至載台上之基板吸附保持於載台後,可藉由狹縫噴嘴塗佈塗佈液,因此可不必增大裝置成本,而在較短的處理時間內,高精度地塗佈塗佈液。 According to the fourth and fifth aspects of the invention, since the substrate that has been transported to the stage by the substrate transfer member is adsorbed and held on the stage, the coating liquid can be applied by the slit nozzle, so that it is not necessary to increase the device cost. The coating liquid is applied with high precision in a short processing time.

第6發明,可一邊藉由基板搬送機構及複數個基板搬送構件沿一方向搬送基板,一邊藉由狹縫噴嘴沿與其正交之方向塗佈塗佈液,可有效率地執行塗佈動作。 According to the sixth aspect of the invention, the substrate can be efficiently transported by applying the coating liquid in the direction orthogonal thereto by the slit nozzle while the substrate is conveyed in one direction by the substrate transfer mechanism and the plurality of substrate transfer members.

第7發明,可確實地進行基板對載台之搬送,並且防止與一面沿與基板搬送方向正交之方向往返移動一面進行塗佈處理之狹縫噴嘴相干涉。藉此,可進行穩定之塗佈液的塗佈。 According to the seventh aspect of the invention, the substrate can be reliably transported to the stage, and the slit nozzle that performs the coating process while reciprocating in the direction orthogonal to the substrate transfer direction can be prevented from interfering with each other. Thereby, application of a stable coating liquid can be performed.

第8及第9發明,可對較厚、翹曲大的太陽能電池用面板基板正確地塗佈塗佈液。 According to the eighth and ninth aspects of the invention, the coating liquid can be accurately applied to the panel substrate for a solar cell which is thick and warped.

以下,根據圖式說明本發明之實施形態。圖1係本發明第1實施形態之塗佈裝置之立體圖。 Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a perspective view of a coating apparatus according to a first embodiment of the present invention.

此塗佈裝置係用來對太陽能電池用面板基板(以下簡稱為「基板」)塗佈塗佈液之裝置,主要具備配設於本體11上之載台12、以及相對於此載台12之保持面30沿水平方向往返移動之狹縫噴嘴41。該塗佈裝置亦可具備:基板搬送機 構14,其將基板搬入至載台12;以及基板搬送機構15,其自載台12搬出基板。而且,藉由此塗佈裝置塗佈塗佈液之基板,一般具有1.7 mm以上之厚度,且大多會產生大的翹曲。又,例如可採用奈米金屬油墨或光阻液作為塗佈液。 This coating apparatus is a device for applying a coating liquid to a solar cell panel substrate (hereinafter simply referred to as "substrate"), and mainly includes a stage 12 disposed on the main body 11 and a stage 12 opposite to the stage 12 The slit nozzle 41 that reciprocates the surface 30 in the horizontal direction is held. The coating device may further include: a substrate transfer machine The structure 14 carries the substrate onto the stage 12, and the substrate transfer mechanism 15 carries out the substrate from the stage 12. Further, the substrate on which the coating liquid is applied by the coating device generally has a thickness of 1.7 mm or more, and often causes large warpage. Further, for example, a nano metallic ink or a photoresist liquid can be used as the coating liquid.

因此,於此塗佈裝置中,基板係藉由基板搬送機構14搬送至載台12上,而吸附保持於其保持面30。而且,藉由在使狹縫噴嘴41中的塗佈液吐出用狹縫接近吸附保持於載台12之保持面30上之基板表面的狀態下,使此狹縫噴嘴41相對於基板沿水平方向移動,將塗佈液塗佈於基板表面。然後,藉由基板搬送機構15自載台12上搬出塗佈有塗佈液之基板。 Therefore, in this coating apparatus, the substrate is transferred to the stage 12 by the substrate transfer mechanism 14, and is adsorbed and held on the holding surface 30. In the state in which the coating liquid discharge slit in the slit nozzle 41 is brought close to the surface of the substrate held by the holding surface 30 of the stage 12, the slit nozzle 41 is horizontally oriented with respect to the substrate. Moving, the coating liquid is applied to the surface of the substrate. Then, the substrate on which the coating liquid is applied is carried out from the stage 12 by the substrate transfer mechanism 15.

上述基板搬送機構14係配設於載台12之一側。基板搬送機構14具備一對驅動軸96,其軸支於一對側板97之兩端部,藉由未圖示之馬達之驅動而旋轉。此驅動軸96各具備3個滑輪,於此等滑輪間捲繞有3條皮帶95。此等3條皮帶95係隨著一對驅動軸96之旋轉,相互同步轉動,並將載置於皮帶95上部之基板水平地搬入至載台12上。再者,一對側板97係沿可滑動地支持此等側板97之支持部98,可往返移動於各皮帶95等接近載台12,可將載置於皮帶95上之基板轉送至載台12之轉送位置、與離開載台12而可使後述移動件50b移動之分離位置之間。 The substrate transfer mechanism 14 is disposed on one side of the stage 12 . The substrate transfer mechanism 14 includes a pair of drive shafts 96 that are axially supported at both end portions of the pair of side plates 97 and that are rotated by driving of a motor (not shown). Each of the drive shafts 96 has three pulleys, and three belts 95 are wound between the pulleys. These three belts 95 are rotated in synchronization with each other as the pair of drive shafts 96 rotate, and the substrates placed on the upper portion of the belt 95 are horizontally carried onto the stage 12. Further, the pair of side plates 97 are slidably supported by the support portions 98 of the side plates 97, and are reciprocally movable to the respective stages of the belts 95 and the like, and the substrates placed on the belts 95 can be transferred to the stage 12 The transfer position is between the transfer position and the separation position of the moving member 50b which will be described later.

同樣地,上述基板搬送機構15係配設於載台12之另一 側。基板搬送機構15具備一對驅動軸92,其軸支於一對側板93之兩端部,藉由未圖示之馬達之驅動而旋轉。此驅動軸92各具備3個滑輪,於此等滑輪間捲繞有3條皮帶91。此等3條皮帶91係隨著一對驅動軸92之旋轉,相互同步轉動,並自載台12將載置於皮帶91上部之基板S水平地搬出。再者,一對側板93係沿可滑動地支持此等側板93之支持部94,可往返移動於各皮帶91等接近載台12,可將載置於載台12之基板轉送至皮帶91之轉送位置、與離開載台12而可使後述移動件50b移動之分離位置之間。 Similarly, the substrate transfer mechanism 15 is disposed on the other of the stage 12 side. The substrate transfer mechanism 15 includes a pair of drive shafts 92 that are axially supported by both end portions of the pair of side plates 93 and that are rotated by driving of a motor (not shown). Each of the drive shafts 92 is provided with three pulleys, and three belts 91 are wound between the pulleys. These three belts 91 rotate in synchronization with each other as the pair of drive shafts 92 rotate, and the substrate S placed on the upper portion of the belt 91 is carried out horizontally from the stage 12 . Further, the pair of side plates 93 are slidably supported by the support portions 94 of the side plates 93, and are reciprocally movable to the respective stages of the belts 91 and the like, and the substrates placed on the stage 12 can be transferred to the belt 91. The transfer position is between the transfer position and the separated position at which the mover 50b can be moved away from the stage 12.

因此,由於基板搬送機構14及基板搬送機構15可往返移動於可相對於載台12將基板轉送至載台12之轉送位置、與可離開載台12而使後述移動件50b移動之分離位置之間,所以在搬送基板時,可藉由接近載台12而確實地將基板搬送至載台12。又,在後述狹縫噴嘴41進行塗佈液塗佈時,可藉由與載台12分離,防止與狹縫噴嘴41相干涉,從而進行穩定的塗佈液塗佈。 Therefore, the substrate transfer mechanism 14 and the substrate transfer mechanism 15 can be reciprocated to a transfer position at which the substrate can be transferred to the stage 12 with respect to the stage 12, and a separated position at which the movable member 50b can be moved away from the stage 12. Therefore, when the substrate is transferred, the substrate can be reliably transferred to the stage 12 by approaching the stage 12 . Further, when the coating liquid is applied to the slit nozzle 41 to be described later, it can be separated from the stage 12 to prevent interference with the slit nozzle 41, thereby performing stable coating liquid application.

再者,對載台12進行基板之搬送之基板搬送機構14、15不限於此一形態,亦可藉由其他手段將基板搬送至載台12。例如,亦可使用索引機器人,將基板搬送至載台12。 Further, the substrate transfer mechanisms 14 and 15 that transport the substrate to the stage 12 are not limited to this embodiment, and the substrate may be transferred to the stage 12 by other means. For example, the index robot can also be used to transport the substrate to the stage 12.

上述狹縫噴嘴41係藉由噴嘴支持部40所支持,該噴嘴支持部40具有以跨越載台12之方式所設置之架橋構造。亦即,狹縫噴嘴41係附設於噴嘴支持部40之下表面。另一方 面,於載台12之兩側部分配設有分別具備定子(stator)50a及移動件50b之一對AC(交流;alternating current)無鐵心線性馬達(以下簡稱為「線性馬達」)50。而且,噴嘴支持部40之兩端係固定於一對移動件50b。再者,於此移動件50b內配設有與噴嘴支持部40之兩端連結之未圖示的左右一對昇降機構。因此,狹縫噴嘴41係構成為藉由線性馬達50之作用而沿載台12之表面往返移動,並且藉由未圖示之昇降機構對載台12進行昇降。再者,此狹縫噴嘴41之往返移動方向係與基板搬送機構14、15之基板搬送方向正交之方向。 The slit nozzle 41 is supported by a nozzle support portion 40 having a bridge structure provided to extend across the stage 12 . That is, the slit nozzle 41 is attached to the lower surface of the nozzle support portion 40. The other side On the both sides of the stage 12, a pair of AC (alternating current) coreless linear motors (hereinafter simply referred to as "linear motors") 50 each having a stator 50a and a moving member 50b are disposed. Further, both ends of the nozzle support portion 40 are fixed to the pair of movable members 50b. Further, a pair of right and left lifting mechanisms (not shown) that are coupled to both ends of the nozzle support portion 40 are disposed in the movable member 50b. Therefore, the slit nozzle 41 is configured to reciprocate along the surface of the stage 12 by the action of the linear motor 50, and the stage 12 is raised and lowered by an elevating mechanism (not shown). Further, the reciprocating direction of the slit nozzles 41 is a direction orthogonal to the substrate transporting directions of the substrate transfer mechanisms 14 and 15.

圖2係示意性地表示狹縫噴嘴41之塗佈液供給動作之說明圖。圖3係局部剖斷地表示狹縫噴嘴41之前視圖。 FIG. 2 is an explanatory view schematically showing a supply operation of the coating liquid of the slit nozzle 41. Fig. 3 is a partially cutaway front view showing the slit nozzle 41.

此狹縫噴嘴41具有沿其長邊方向(圖2中垂直於紙面之方向且為圖3中之左右方向)延伸之狹縫狀吐出用狹縫44。此吐出用狹縫44之長邊方向之長度係大於等於基板S之矩形狀的元件形成部分之短邊之長度。如圖2所示,藉由塗佈液供給配管46所供給之塗佈液45係經由接近基板S表面而配置之狹縫狀吐出用狹縫44,供給至基板S的表面。然後,於基板S的表面形成塗佈膜。 The slit nozzle 41 has a slit-like discharge slit 44 extending in the longitudinal direction thereof (the direction perpendicular to the paper surface in FIG. 2 and in the left-right direction in FIG. 3). The length of the slit 44 in the longitudinal direction is greater than or equal to the length of the short side of the rectangular element-forming portion of the substrate S. As shown in FIG. 2, the coating liquid 45 supplied by the coating liquid supply pipe 46 is supplied to the surface of the substrate S via the slit-shaped discharge slit 44 which is disposed close to the surface of the substrate S. Then, a coating film is formed on the surface of the substrate S.

再次參照圖1。於上述載台12之表面形成有用以吸附保持基板S之吸附槽72。而且,作為基板搬送構件之複數個滾輪81呈2行狀地配設於載台12之表面。此等滾輪81可相互同步地昇降於其一部分配置於較載台12之保持面30 之表面上方之搬送位置、與其全部配置於較載台12之保持面30之表面下方之退避位置之間。又,作為吸附構件之多個吸盤71係以使其一部分突出載台12之保持面30之表面之狀態配設於載台12之表面。再者,滾輪81亦可呈2列以上排列地配設。 Referring again to Figure 1. An adsorption groove 72 for adsorbing and holding the substrate S is formed on the surface of the stage 12 described above. Further, a plurality of rollers 81 as substrate transfer members are disposed on the surface of the stage 12 in two rows. The rollers 81 can be raised and lowered in synchronization with each other, and a part thereof is disposed on the holding surface 30 of the comparison stage 12 The transport position above the surface is disposed between the retracted positions below the surface of the holding surface 30 of the stage 12. Moreover, the plurality of suction cups 71 as the adsorption members are disposed on the surface of the stage 12 in such a manner that a part thereof protrudes from the surface of the holding surface 30 of the stage 12. Further, the roller 81 may be arranged in two or more rows.

圖4係表示滾輪81之昇降機構之概要圖。 4 is a schematic view showing a lifting mechanism of the roller 81.

排成列之複數個滾輪81係藉由支持構件82可旋轉地支持。而且,支持構件82係藉由一對氣壓缸83之驅動而昇降。因此,如圖4所示,複數個滾輪81係藉由一對氣壓缸83之驅動,相互同步地昇降於其一部分配置於較圖4中以假想線所示載台12之保持面30表面上方之搬送位置、與其全部配置於較載台12之保持面30表面下方之退避位置之間。 The plurality of rollers 81 arranged in a row are rotatably supported by the support member 82. Further, the support member 82 is raised and lowered by the driving of a pair of pneumatic cylinders 83. Therefore, as shown in Fig. 4, a plurality of rollers 81 are driven by a pair of pneumatic cylinders 83, and are moved up and down in synchronization with each other, and a part thereof is disposed above the surface of the holding surface 30 of the stage 12 shown by an imaginary line in Fig. 4; The transport position is disposed between the retracted positions below the surface of the holding surface 30 of the stage 12 .

圖5A及圖5B係吸盤71之剖視圖。又,圖6A及圖6B係表示配設在形成於載台12之凹形狀孔部33內之吸盤71之說明圖。再者,圖5A及圖6A係表示應力或吸附力未作用於吸盤71之狀態。圖5B及圖6B係表示藉由吸盤71吸附保持基板S之狀態。 5A and 5B are cross-sectional views of the suction cup 71. 6A and 6B are explanatory views showing the suction cup 71 disposed in the concave hole portion 33 formed in the stage 12. 5A and 6A show a state in which stress or adsorption force does not act on the suction cup 71. 5B and 6B show a state in which the substrate S is held by the suction pad 71.

如圖5A及圖5B所示,此吸盤71係由彈性材料所構成,並由可藉由應力、吸附力彈性變形之盤狀吸附部71a、及形成有與減壓手段連通之連通孔71c之基部71b所構成。作為彈性材可採用矽膠、氟樹脂等樹脂材料。如圖6A及圖6B所示,此吸盤71在形成於載台12之孔部33內,以吸附部 71a之前端自載台12之保持面30突出之狀態配設。而且,於吸盤71之基部71b附設有螺絲部74。此螺絲部74係固定於配設在載台12下表面之支持板34。而且,吸附部71a之前端自載台12之保持面30突出之量可藉由螺絲35調整。再者,螺絲部74具有中空構造,圖5A及圖5B所示之連通孔71c係經由圖6A及圖6B所示之配管73連通於風扇或真空泵等減壓手段。 As shown in FIG. 5A and FIG. 5B, the suction cup 71 is made of an elastic material, and is formed of a disk-shaped adsorption portion 71a elastically deformable by stress and adsorption force, and a communication hole 71c formed to communicate with the decompression means. The base portion 71b is formed. As the elastic material, a resin material such as silicone rubber or fluororesin may be used. As shown in FIG. 6A and FIG. 6B, the suction cup 71 is formed in the hole portion 33 of the stage 12 to be the adsorption portion. The front end of the 71a is disposed in a state in which the holding surface 30 of the stage 12 is protruded. Further, a screw portion 74 is attached to the base portion 71b of the suction cup 71. The screw portion 74 is fixed to the support plate 34 disposed on the lower surface of the stage 12. Further, the amount by which the front end of the adsorption portion 71a protrudes from the holding surface 30 of the stage 12 can be adjusted by the screw 35. Further, the screw portion 74 has a hollow structure, and the communication hole 71c shown in FIGS. 5A and 5B communicates with a decompression means such as a fan or a vacuum pump via a pipe 73 shown in FIGS. 6A and 6B.

在藉由此吸盤71吸附保持基板S之情況下,吸盤71係自圖5A及圖6A所示之狀態,轉變為圖5B及圖6B所示彈性變形之狀態。此時,在吸盤71之基部71b被固定之情況下,吸盤71之吸附部71a與基板S之抵接面之位置係移動至基部71b側,伴隨於此,產生使吸附保持於該處之基板S移動至基部71b側之作用。 In the case where the holding substrate S is sucked and held by the suction cup 71, the suction cup 71 is changed from the state shown in Figs. 5A and 6A to the state of elastic deformation shown in Figs. 5B and 6B. At this time, when the base portion 71b of the suction cup 71 is fixed, the position of the abutting surface of the suction portion 71a of the suction cup 71 and the substrate S is moved to the side of the base portion 71b, and accordingly, the substrate for holding and holding the substrate is generated. S moves to the side of the base 71b.

亦即,在吸盤71之吸附部71a之前端與基板S之背面抵接的狀態下,藉由利用減壓手段之作用,經由連通孔71c,將由吸附部71a與基板S所形成之空間內部排氣,如圖5B及6B所示,藉此使由彈性材所構成之吸附部71a利用將空間內之氣體排出所產生之應力而彈性變形。亦即,吸附部71a之開口部側之開口面積會變大,而自有深度之盤狀變成平坦之盤狀。換言之,吸附部71a與基板S抵接之抵接面的面積變大。藉此,使吸附部71a對基板S之吸附力變大,而可確實地吸附基板S。 In other words, in a state where the front end of the suction portion 71a of the suction cup 71 abuts against the back surface of the substrate S, the space inside the space formed by the adsorption portion 71a and the substrate S is discharged through the communication hole 71c by the action of the decompression means. As shown in Figs. 5B and 6B, the gas is elastically deformed by the stress generated by discharging the gas in the space by the adsorption portion 71a made of the elastic material. In other words, the opening area of the opening portion side of the adsorption portion 71a becomes large, and the disc shape having its own depth becomes a flat disk shape. In other words, the area of the abutting surface where the adsorption portion 71a abuts on the substrate S becomes large. Thereby, the adsorption force of the adsorption unit 71a to the substrate S is increased, and the substrate S can be surely adsorbed.

此時,由於吸盤71之基部71b係固定於支持板34,因此在吸附部71a彈性變形時,吸附保持於該處之基板S亦被吸引至支持板34側。因此,藉由使吸盤71之吸附部71a之高度位置成為吸附部71a之前端較上述載台12之保持面30突出之狀態,在基板S之吸附保持時,即使在基板S翹曲的情況下,吸附部71a仍可吸附基板S,並利用吸附部71a彈性變形之作用,將基板S之背面壓抵於載台12之保持面30。因此,即使在基板S之翹曲相對較大的情況下,吸附部71a仍可確實地吸附基板S,而且,藉由吸附部71a彈性變形,可相對於載台12平坦地保持基板S。再者,於本發明中,將基板S對載台12之壓抵亦包含基板S藉由來自載台12側之吸引力,而使基板S壓抵於載台12。 At this time, since the base portion 71b of the suction cup 71 is fixed to the support plate 34, when the adsorption portion 71a is elastically deformed, the substrate S adsorbed and held therein is also attracted to the support plate 34 side. Therefore, the height position of the suction portion 71a of the suction cup 71 is such that the front end of the adsorption portion 71a protrudes from the holding surface 30 of the stage 12, and the substrate S is warped, even when the substrate S is warped. The adsorption portion 71a can still adsorb the substrate S, and the back surface of the substrate S is pressed against the holding surface 30 of the stage 12 by the elastic deformation of the adsorption portion 71a. Therefore, even when the warpage of the substrate S is relatively large, the adsorption portion 71a can reliably adsorb the substrate S, and the substrate S can be held flat with respect to the stage 12 by elastic deformation of the adsorption portion 71a. Further, in the present invention, the pressing of the substrate S against the stage 12 also includes the substrate S being pressed against the stage 12 by the attraction force from the stage 12 side.

其次,針對藉由上述塗佈裝置將塗佈液塗佈於基板S之塗佈動作進行說明。 Next, the coating operation of applying the coating liquid onto the substrate S by the above coating apparatus will be described.

在開始對基板S塗佈時,藉由圖4所示氣壓缸83之作用,將複數個滾輪81配置於用來搬送基板S之搬送位置。亦即,各滾輪81之上端係配置在基板搬送機構14中與3條皮帶95之上端相同高度位置。此時,基板搬送機構14亦移動至接近載台12之位置即轉送位置。 When the application of the substrate S is started, a plurality of rollers 81 are disposed at the transfer position for transporting the substrate S by the action of the pneumatic cylinder 83 shown in FIG. That is, the upper end of each of the rollers 81 is disposed at the same height position as the upper ends of the three belts 95 in the substrate transfer mechanism 14. At this time, the substrate transport mechanism 14 also moves to a position that is close to the stage 12, that is, the transfer position.

於此狀態下,隨著一對驅動軸96之旋轉,使3條皮帶95相互同步地轉動。又,使各滾輪81與皮帶95之轉動同步地旋轉。然後,藉由此等皮帶95及滾輪81之作用,將基板S 自基板搬送機構14搬送至載台12之保持面30上。 In this state, as the pair of drive shafts 96 rotate, the three belts 95 are rotated in synchronization with each other. Further, each of the rollers 81 is rotated in synchronization with the rotation of the belt 95. Then, by the action of the belt 95 and the roller 81, the substrate S is The substrate transfer mechanism 14 is transported to the holding surface 30 of the stage 12 .

若基板S移動至載台12之上部,則停止皮帶95及滾輪81。然後,如圖4所示,藉由氣壓缸83之作用,將各滾輪81自滾輪81之上端部配置於較載台12之保持面30上方之基板S搬送位置,移動至滾輪81之上端部配置於較載台12之保持面30下方之退避位置。換言之,使滾輪81整體配置於較載台12之保持面30下方。藉此,基板S係抵接於吸盤71之吸附部71a之前端附近。 When the substrate S moves to the upper portion of the stage 12, the belt 95 and the roller 81 are stopped. Then, as shown in FIG. 4, the respective rollers 81 are disposed from the upper end portion of the roller 81 to the substrate S transport position above the holding surface 30 of the stage 12 by the action of the pneumatic cylinder 83, and are moved to the upper end of the roller 81. The retracted position is disposed below the holding surface 30 of the stage 12 . In other words, the entire roller 81 is disposed below the holding surface 30 of the stage 12 . Thereby, the substrate S is in contact with the vicinity of the front end of the adsorption portion 71a of the chuck 71.

又,在將基板S移動至載台12上部之後,移動基板搬送機構14的一對側板97,自使各皮帶95接近載台12之轉送位置,移動至與載台12分開而可使移動件50b移動之分離位置。再者,亦將基板搬送機構15事先配置於與載台12分開而可使移動件50b移動之分離位置。 Further, after the substrate S is moved to the upper portion of the stage 12, the pair of side plates 97 of the substrate transfer mechanism 14 are moved, and the respective belts 95 are moved to the transfer position of the stage 12, and moved to separate from the stage 12 to move the parts. The separation position of the 50b movement. Further, the substrate transfer mechanism 15 is also disposed in advance at a separation position from the stage 12 to move the movable member 50b.

又,將於載台12上經過塗佈處理之基板S、與要開始進行塗佈處理之基板S同時搬入及搬出之情形時,使基板搬送機構14及基板搬送機構15以移動至接近載台12之位置即轉送位置,將基板S自載台12朝基板搬送機構15搬出,同時將基板S自基板搬送機構14搬入載台12之方式動作即可。然後,在進行塗佈處理之際,可將基板搬送機構14及基板搬送機構15配置於與載台12隔離之分離位置。 Further, when the substrate S subjected to the coating process on the stage 12 and the substrate S to be subjected to the coating process are simultaneously carried in and out, the substrate transfer mechanism 14 and the substrate transfer mechanism 15 are moved to approach the stage. The position of 12 is the transfer position, and the substrate S may be carried out from the stage 12 to the substrate transfer mechanism 15, and the substrate S may be moved from the substrate transfer mechanism 14 to the stage 12. Then, when the coating process is performed, the substrate transfer mechanism 14 and the substrate transfer mechanism 15 can be disposed at a separated position from the stage 12 .

然後,藉由減壓手段之作用,經由連通孔71c將由吸附部71a與基板S所形成之空間內部進行排氣。藉此,如圖5B 及圖6B所示,使吸附部71a彈性變形,並使基板S之背面壓抵於載台12之保持面30。又,與此並行地,藉由自吸附槽72亦進行排氣,使基板S之背面側相對於大氣壓力成為負壓,而將基板S吸附保持於保持面30。因此,即使在使用相對較厚且翹曲大的太陽能電池用面板基板作為基板S的情況下,仍可將此基板S壓抵於載台12之保持面30,從而矯正基板S之翹曲。 Then, the inside of the space formed by the adsorption portion 71a and the substrate S is exhausted via the communication hole 71c by the action of the decompression means. Thereby, as shown in Figure 5B As shown in FIG. 6B, the adsorption portion 71a is elastically deformed, and the back surface of the substrate S is pressed against the holding surface 30 of the stage 12. Further, in parallel with this, the back side of the substrate S is brought to a negative pressure with respect to the atmospheric pressure by the exhaust from the adsorption tank 72, and the substrate S is adsorbed and held on the holding surface 30. Therefore, even when a relatively thick and warped panel substrate for a solar cell is used as the substrate S, the substrate S can be pressed against the holding surface 30 of the stage 12, thereby correcting the warpage of the substrate S.

於此狀態中,在使狹縫噴嘴41之吐出用狹縫44接近被吸附保持於載台12之保持面30之基板S表面的狀態下,藉由線性馬達50之驅動使狹縫噴嘴41沿基板S之表面移動。然後,如圖2所示,將藉由塗佈液供給配管46所供給之塗佈液45供給至基板S之表面。藉此,於基板S之表面形成塗佈液45之薄膜。 In this state, the slit nozzle 41 is driven by the linear motor 50 in a state where the discharge slit 44 of the slit nozzle 41 is brought close to the surface of the substrate S that is adsorbed and held by the holding surface 30 of the stage 12. The surface of the substrate S moves. Then, as shown in FIG. 2, the coating liquid 45 supplied by the coating liquid supply pipe 46 is supplied to the surface of the substrate S. Thereby, a film of the coating liquid 45 is formed on the surface of the substrate S.

此時,亦繼續藉由吸盤71對基板S之吸附保持,基板S之背面係藉由吸盤71之作用,而壓抵於載台12之保持面30。因此,即使於使用厚度為1.7 mm以上,具有相對較大翹曲之太陽能電池用面板基板作為基板S的情況下,仍可在繼續塗佈動作中,隨時將此基板S壓抵於載台12之保持面30,從而矯正基板S之翹曲。因此,可使基板S與狹縫噴嘴41間之距離成為固定,可提高塗佈液45之塗佈精度,並且,即使在基板S之翹曲較大的情況下,仍可避免基板S與狹縫噴嘴41發生碰撞的危險。 At this time, the suction and holding of the substrate S by the suction pad 71 is continued, and the back surface of the substrate S is pressed against the holding surface 30 of the stage 12 by the action of the suction pad 71. Therefore, even when a panel substrate for a solar cell having a relatively large warpage of 1.7 mm or more is used as the substrate S, the substrate S can be pressed against the stage 12 at any time during the continuous coating operation. The face 30 is held to correct the warpage of the substrate S. Therefore, the distance between the substrate S and the slit nozzle 41 can be made constant, the coating precision of the coating liquid 45 can be improved, and the substrate S and the slit can be avoided even when the warpage of the substrate S is large. There is a danger that the slit nozzle 41 will collide.

若塗佈液對基板S之塗佈結束,即經由連通孔71c,將由吸附部71a與基板S所形成之空間內部連通至大氣。藉此,使吸盤71恢復為圖5A及圖6A所示的狀態。又,上昇至複數個滾輪81之上端部係配置於較載台12之保持面30表面上方之搬送位置。而且,將基板搬送機構15移動至各皮帶91接近載台12之轉送位置。然後,隨著一對驅動軸92之旋轉使3條皮帶91相互同步地轉動。又,使各滾輪81與皮帶91之轉動同步地旋轉。然後,藉由此等皮帶91及滾輪81之作用,將基板S自載台12上朝向基板搬送機構15搬出。 When the application of the coating liquid to the substrate S is completed, that is, the inside of the space formed by the adsorption portion 71a and the substrate S is communicated to the atmosphere via the communication hole 71c. Thereby, the suction cup 71 is returned to the state shown in FIG. 5A and FIG. 6A. Further, the upper end portion of the plurality of rollers 81 is disposed at a transport position above the surface of the holding surface 30 of the stage 12 . Further, the substrate transfer mechanism 15 is moved to a transfer position where each of the belts 91 approaches the stage 12. Then, the three belts 91 are rotated in synchronization with each other as the pair of drive shafts 92 rotate. Further, each of the rollers 81 is rotated in synchronization with the rotation of the belt 91. Then, by the action of the belt 91 and the roller 81, the substrate S is carried out from the stage 12 toward the substrate transfer mechanism 15.

其次,針對本發明之其他實施形態進行說明。圖7係本發明第2實施形態之塗佈裝置之立體圖。再者,對與上述實施形態相同之構件,標示相同元件符號從而省略詳細說明。 Next, other embodiments of the present invention will be described. Fig. 7 is a perspective view of a coating device according to a second embodiment of the present invention. It is to be noted that the same reference numerals are given to members that are the same as those in the above embodiment, and the detailed description is omitted.

雖然於上述第1實施形態之塗佈裝置中,採用藉由呈2列狀所配設之複數個滾輪81來搬送基板S之構造,於此第2實施形態之塗佈裝置中具有藉由一對皮帶84來搬送基板S之構造。此等一對皮帶84係與圖4所示滾輪81之昇降機構相同地,藉由氣壓缸等,可相互同步地昇降於其一部分配置於較載台12之保持面30之表面上方之轉送位置、與其全部配置於較載台12之保持面30表面下方之退避位置之間。 In the coating apparatus according to the first embodiment, the substrate S is transported by a plurality of rollers 81 arranged in two rows, and the coating device according to the second embodiment has one The structure of the substrate S is conveyed to the belt 84. Similarly to the elevating mechanism of the roller 81 shown in FIG. 4, the pair of belts 84 can be raised and lowered in synchronization with each other by a pneumatic cylinder or the like in a transfer position in which a part thereof is disposed above the surface of the holding surface 30 of the stage 12 And all of them are disposed between the retracted positions below the surface of the holding surface 30 of the stage 12 .

由於即使在此第2實施形態之塗佈裝置中,亦無須利用昇降銷或搬送機器人來搬送基板S,因此可簡化裝置構造,並 且可縮短塗佈所需的時間。 Further, in the coating apparatus of the second embodiment, the substrate S does not need to be transported by the lift pins or the transfer robot, so that the structure of the apparatus can be simplified. And the time required for coating can be shortened.

再者,於上述第1、第2實施形態中,基板搬送機構14、15為了避免與構成架橋構造之狹縫噴嘴41之支持機構相干涉,可往返移動於各皮帶91、95等接近載台12之轉送位置、和與載台12分開之分離位置之間。然而,在基板S之剛性較高的情況下,亦可在載台12與基板搬送機構14之間、以及載台12與基板搬送機構15之間,設置移動件50b可通過之間隙,而固定基板搬送機構14、15。 Further, in the above-described first and second embodiments, the substrate transfer mechanisms 14 and 15 can be moved back and forth to the respective stages such as the belts 91 and 95 in order to avoid interference with the support mechanism of the slit nozzle 41 constituting the bridge structure. The transfer position of 12 is separated from the separated position from the stage 12. However, when the rigidity of the substrate S is high, the gap between the stage 12 and the substrate transfer mechanism 14 and between the stage 12 and the substrate transfer mechanism 15 may be fixed by the gap between the movable member 50b. Substrate transfer mechanisms 14 and 15.

又,雖然於上述第1、第2實施形態中,採用藉由基板搬送機構14將基板S搬入至載台12上,並且藉由基板搬送機構15自載台12上將基板S搬出之構造,亦可藉由單一基板搬送機構,執行將基板S朝載台12搬入及搬出。於此情況下,亦可使用如上述各實施形態般,取代使狹縫噴嘴41之往返移動方向與利用基板搬送機構14、15之基板S之搬送方向成為正交之方向,而是沿與狹縫噴嘴41之移動方向相同之方向搬送(搬入/搬出)基板S之基板搬送機構。 In addition, in the above-described first and second embodiments, the substrate S is carried into the stage 12 by the substrate transfer mechanism 14, and the substrate S is carried out from the stage 12 by the substrate transfer mechanism 15. The substrate S can be carried in and out of the stage 12 by a single substrate transfer mechanism. In this case, as in the above-described embodiments, instead of the direction in which the slit nozzle 41 reciprocates and the direction in which the substrate S of the substrate transport mechanisms 14 and 15 are transported, the direction is orthogonal to each other. The substrate transfer mechanism of the substrate S is transported (loading/removing) in the same direction of movement of the slit nozzles 41.

而且,雖然於上述第1、第2實施形態中,基板搬送機構14及基板搬送機構15係藉由皮帶91、95將基板S搬入或搬出載台12,但並不限於此實施形態。於本發明中,只要相對於載台12水平地搬送基板S即可,例如,亦可由使用滾輪之滾輪搬送、使用沿水平方向往返移動之梭(shuttle)之梭搬送、或藉由對基板S之背面噴吹空氣使其浮起而進行搬 送之懸浮搬送等所構成。 Further, in the above-described first and second embodiments, the substrate transport mechanism 14 and the substrate transport mechanism 15 carry the substrate S into or out of the stage 12 by the belts 91 and 95, but the present invention is not limited to this embodiment. In the present invention, the substrate S may be conveyed horizontally with respect to the stage 12, and may be, for example, transported by a roller using a roller, shuttled using a shuttle that reciprocates in a horizontal direction, or by a substrate S. The back side blows air to make it float and move It is composed of suspension and transportation.

其次,針對本發明之又一實施形態進行說明。圖8係本發明第3實施形態之塗佈裝置之立體圖,圖9係其側視圖。而且,圖10係載台3之保持面30之立體圖。再者,於圖8中省略吸盤71及吸附槽72、與後述預分配(pre-dispense)機構2及噴嘴洗淨裝置6等之圖示。又,於圖9中省略後述載架(carriage)4等之圖示。 Next, still another embodiment of the present invention will be described. Fig. 8 is a perspective view of a coating apparatus according to a third embodiment of the present invention, and Fig. 9 is a side view thereof. Further, Fig. 10 is a perspective view of the holding surface 30 of the stage 3. In addition, in FIG. 8, the suction cup 71 and the adsorption tank 72, the pre-dispensing mechanism 2, the nozzle cleaning apparatus 6, etc. which are mentioned later, are abbreviate|omitted. In addition, in FIG. 9, the illustration of the carrier 4 etc. which are mentioned later is abbreviate|omitted.

此第3實施形態之塗佈裝置具備有載台3。此載台3係長方體形狀且為石製,其上表面為水平面,構成基板S之保持面30。與上述實施形態相同地,於此保持面30形成有凹形狀之孔部,於此孔部內配設有與圖5A及圖6A相同之吸盤71。又,如圖10所示,於保持面30形成有具有既定長度之孔部33b,於此孔部33b內亦配設有吸盤71。配設於此孔部33b內之吸盤71係成為可根據基板S之大小,調整其位置之構造。 The coating device of the third embodiment includes a stage 3 . The stage 3 has a rectangular parallelepiped shape and is made of stone, and its upper surface is a horizontal surface, and constitutes a holding surface 30 of the substrate S. Similarly to the above-described embodiment, the holding surface 30 is formed with a concave hole portion, and the same suction cup 71 as that of Figs. 5A and 6A is disposed in the hole portion. Further, as shown in FIG. 10, a hole portion 33b having a predetermined length is formed on the holding surface 30, and a suction cup 71 is also disposed in the hole portion 33b. The chuck 71 disposed in the hole portion 33b has a structure in which the position of the substrate S can be adjusted according to the size of the substrate S.

又,於保持面30,省略圖示之複數個昇降銷係隔著適當之間隔設置。此昇降銷係於基板S之搬入、搬出時,自下方支持基板S,並上昇至載台3較保持面30之表面上方。 Further, on the holding surface 30, a plurality of lifting pins (not shown) are provided at appropriate intervals. When the substrate S is loaded or unloaded, the lift pin supports the substrate S from below and rises above the surface of the stage 3 from the holding surface 30.

於載台3之上方設置有自此載台3之兩側部分大致水平地搭架之載架4。此載架4具備有用以支持狹縫噴嘴41之噴嘴支持部40、以及支持此噴嘴支持部40之兩端的左右一對昇降機構43。又,於載台3之兩端部配設有沿大致水平方 向延伸之一對移行軌道31。此等移行軌道31係藉由導引載架4之兩端部,使載架4沿圖8所示之X方向往返移動。 Above the stage 3, a carrier 4 that is substantially horizontally stacked from both side portions of the stage 3 is disposed. The carrier 4 includes a nozzle support portion 40 for supporting the slit nozzle 41, and a pair of right and left lift mechanisms 43 for supporting both ends of the nozzle support portion 40. Moreover, the two ends of the stage 3 are arranged along a substantially horizontal One of the extensions is a pair of transition rails 31. These traveling rails 31 reciprocate the carrier 4 in the X direction shown in Fig. 8 by guiding both ends of the carrier 4.

於載台3及載架4之兩側部分,沿載台3之兩側之邊緣側配設分別具備定子50a及移動件50b之一對線性馬達50。又,於載台3及載架4之兩側部分固設有分別具備刻度部及檢測件之一對線性編碼器52。線性編碼器52係檢測載架4之位置。 On both sides of the stage 3 and the carrier 4, one pair of the stator 50a and the movable member 50b are provided on the edge side of the both sides of the stage 3, respectively. Further, a pair of linear encoders 52 each having a scale portion and a detecting member are fixed to both side portions of the stage 3 and the carrier 4. The linear encoder 52 detects the position of the carrier 4.

又,如圖9所示,於載台3之保持面30之側面配設有噴嘴洗淨裝置6。此噴嘴洗淨裝置6具備有洗淨塊組61及待機槽(pod)62。於此塗佈裝置中,在執行塗佈動作之前或在執行之後,利用此噴嘴洗淨裝置6洗淨狹縫噴嘴41。 Further, as shown in FIG. 9, a nozzle cleaning device 6 is disposed on the side surface of the holding surface 30 of the stage 3. The nozzle cleaning device 6 includes a cleaning block group 61 and a standby pod 62. In the coating apparatus, the slit nozzle 41 is washed by the nozzle cleaning device 6 before or after the execution of the coating operation.

又,如圖9所示,於載台3之保持面30之側面,配設有預分配機構2。此預分配機構2具備有浸漬其一部分在貯存於貯存槽21內之洗淨液中的預分配滾輪22、以及刮刀23。預分配滾輪22及刮刀23具有相對於Y方向,與狹縫噴嘴41相同或以上之長度。又,預分配滾輪22係藉由未圖示之馬達之驅動而旋轉。於此塗佈裝置中,在執行處理動作之前,藉由自移動至預分配滾輪22上方之狹縫噴嘴41吐出少量塗佈液,執行自狹縫噴嘴41內除去在藉由噴嘴洗淨裝置6洗淨時含有洗淨液之塗佈液的步驟。 Further, as shown in FIG. 9, a pre-distribution mechanism 2 is disposed on the side surface of the holding surface 30 of the stage 3. The pre-distribution mechanism 2 is provided with a pre-distribution roller 22 that immerses a part of the cleaning liquid stored in the storage tank 21, and a scraper 23. The pre-distribution roller 22 and the scraper 23 have the same length or more as the slit nozzle 41 with respect to the Y direction. Further, the pre-distribution roller 22 is rotated by driving of a motor (not shown). In the coating apparatus, before the processing operation is performed, a small amount of the coating liquid is ejected from the slit nozzle 41 that has moved to the upper portion of the pre-distribution roller 22, and the removal from the slit nozzle 41 is performed by the nozzle cleaning device 6. The step of containing the coating liquid of the cleaning liquid at the time of washing.

在利用此第3實施形態之塗佈裝置執行塗佈動作時,與上述第1實施形態相同地,藉由減壓手段之作用,經由連通孔 71c將吸附部71a與基板S所形成之空間內部進行排氣。藉此,與圖5B及圖6B所示之情形相同地,使吸附部71a彈性變形,從而使基板S之背面壓抵於載台3之保持面30。又,與此並行地,自吸附槽72亦進行排氣,使基板S之背面側相對於大氣壓力成為負壓,藉此將基板S吸附保持於保持面30。因此,即使在使用相對較厚且翹曲較大的太陽能電池用面板基板作為基板S的情況下,仍可將此基板S壓抵於載台3之保持面30,矯正基板S之翹曲。 When the coating operation is performed by the coating apparatus of the third embodiment, the operation of the decompression means is performed via the communication hole as in the first embodiment. 71c exhausts the inside of the space formed by the adsorption portion 71a and the substrate S. Thereby, similarly to the case shown in FIGS. 5B and 6B, the adsorption portion 71a is elastically deformed, and the back surface of the substrate S is pressed against the holding surface 30 of the stage 3. Further, in parallel with this, the self-adsorption groove 72 is also evacuated, and the back surface side of the substrate S is brought to a negative pressure with respect to the atmospheric pressure, whereby the substrate S is adsorbed and held on the holding surface 30. Therefore, even when a relatively thick and warped panel substrate for a solar cell is used as the substrate S, the substrate S can be pressed against the holding surface 30 of the stage 3 to correct the warpage of the substrate S.

於此狀態中,在使狹縫噴嘴41之吐出用狹縫44接近被吸附保持於載台3之保持面30之基板S表面的狀態下,藉由線性馬達50之驅動,使狹縫噴嘴41沿基板S之表面移動。然後,如圖9所示,將藉由塗佈液供給配管46所供給之塗佈液45,供給至基板S之表面。藉此,於基板S之表面形成塗佈液45之薄膜。 In this state, the slit nozzle 41 is driven by the linear motor 50 while the discharge slit 44 of the slit nozzle 41 is brought close to the surface of the substrate S that is adsorbed and held by the holding surface 30 of the stage 3. Move along the surface of the substrate S. Then, as shown in FIG. 9, the coating liquid 45 supplied from the coating liquid supply pipe 46 is supplied to the surface of the substrate S. Thereby, a film of the coating liquid 45 is formed on the surface of the substrate S.

此時,亦繼續利用吸盤71之基板S之吸附保持,基板S之背面係藉由吸盤71之作用,而壓抵於載台3之保持面30。因此,即使於使用厚度為1.7 mm以上且具有較大之翹曲之太陽能電池用面板基板作為基板S的情況下,亦可在繼續塗佈動作中,隨時將此基板S壓抵於載台3之保持面30,從而矯正基板S之翹曲。因此,可使基板S與狹縫噴嘴41間之距離成為固定,可提高塗佈液45之塗佈精度,並且即使在基板S之翹曲較大的情況下,仍可避免基板S與狹縫 噴嘴41發生碰撞的危險。 At this time, the suction holding of the substrate S of the suction cup 71 is continued, and the back surface of the substrate S is pressed against the holding surface 30 of the stage 3 by the action of the suction pad 71. Therefore, even when a panel substrate for a solar cell having a thickness of 1.7 mm or more and having a large warpage is used as the substrate S, the substrate S can be pressed against the stage 3 at any time during the continuous coating operation. The face 30 is held to correct the warpage of the substrate S. Therefore, the distance between the substrate S and the slit nozzle 41 can be made constant, the coating precision of the coating liquid 45 can be improved, and the substrate S and the slit can be avoided even when the warpage of the substrate S is large. There is a danger that the nozzle 41 will collide.

圖11A及圖11B係表示配設在形成於載台3之孔部33內之吸盤71之另一實施形態之說明圖。再者,圖11A係表示應力及吸附力未作用於吸盤71之狀態。圖11B係表示藉由吸盤71吸附保持基板S之狀態。 11A and 11B are explanatory views showing another embodiment of the suction cup 71 disposed in the hole portion 33 formed in the stage 3. In addition, FIG. 11A shows a state in which stress and adsorption force do not act on the suction cup 71. Fig. 11B shows a state in which the substrate S is held by the suction pad 71.

本實施形態之吸盤71具有與圖5A、圖5B以及圖6A、圖6B所示吸盤71相同之構造。而且,此實施形態之吸盤71之基部71b係連結氣壓缸36之缸桿37,並藉由氣壓缸36之驅動,可相對於載台3之保持面30昇降。再者,於吸盤71形成有圖5A及圖5B所示之連通孔71c,此連通孔71c係經由未圖示之配管而連通於風扇或真空泵等減壓手段。 The suction cup 71 of the present embodiment has the same structure as the suction cup 71 shown in Figs. 5A and 5B and Figs. 6A and 6B. Further, the base portion 71b of the suction cup 71 of this embodiment is coupled to the cylinder rod 37 of the pneumatic cylinder 36, and is driven by the pneumatic cylinder 36 to be movable up and down with respect to the holding surface 30 of the stage 3. Further, the communication hole 71c shown in FIG. 5A and FIG. 5B is formed in the suction cup 71, and the communication hole 71c is connected to a decompression means such as a fan or a vacuum pump via a pipe (not shown).

於上述實施形態中,在基板S之吸附保持時,利用吸附部71a彈性變形之作用,將基板S之背面壓抵於載台3之保持面30。相對於此,在本實施形態中,藉由氣壓缸36之驅動而昇降驅動吸盤71,積極地將吸附保持於吸盤71之基板S壓抵於載台3之保持面30。 In the above embodiment, when the substrate S is adsorbed and held, the back surface of the substrate S is pressed against the holding surface 30 of the stage 3 by the action of the elastic deformation of the adsorption portion 71a. On the other hand, in the present embodiment, the suction cup 71 is driven up and down by the driving of the pneumatic cylinder 36, and the substrate S adsorbed and held by the suction cup 71 is positively pressed against the holding surface 30 of the stage 3.

再者,在此一構成為使吸盤71可相對於載台3之保持面30昇降之情況下,可省略用來於基板S之搬入、搬出時,自下方支持基板S並上昇至載台3之較保持面30之表面上方之昇降銷。 Further, in the case where the suction cup 71 can be moved up and down with respect to the holding surface 30 of the stage 3, the substrate S can be supported from the lower side and raised to the stage 3 when the substrate S is carried in and out. The lift pins above the surface of the retaining surface 30.

圖12係表示本發明之塗佈裝置之又一實施形態之說明圖。 Fig. 12 is an explanatory view showing still another embodiment of the coating apparatus of the present invention.

在本實施形態中,具有進一步具備外周部按壓構件85之構成,該外周部按壓構件85係將吸附保持於上述第1、第3實施形態之載台12、3之保持面30的基板S之外周部壓抵於保持面30。此外周部按壓構件85係構成可藉氣壓缸86昇降。在本實施形態中,藉由利用外周部按壓構件85之作用,將特別容易受翹曲影響之基板S之外周部附近壓抵於保持面30,可遍及基板S全域地矯正翹曲。 In the present embodiment, the outer peripheral portion pressing member 85 is further provided, and the outer peripheral portion pressing member 85 is attached to the substrate S of the holding surfaces 30 of the stages 12 and 3 of the first and third embodiments. The outer peripheral portion is pressed against the holding surface 30. Further, the peripheral pressing member 85 is configured to be movable up and down by the pneumatic cylinder 86. In the present embodiment, by the action of the outer peripheral portion pressing member 85, the vicinity of the outer peripheral portion of the substrate S which is particularly susceptible to warpage is pressed against the holding surface 30, and the warpage can be corrected over the entire substrate S.

雖然於上述各實施形態中,採用一對AC無鐵心線性馬達作為線性馬達50,但不限於此,亦可根據所要求之塗佈精度採用有鐵心線性馬達等。又,雖然線性馬達50係配置於載台12之兩側部分,但不限於此,亦可構成為配置於載台12之單側。 In the above embodiments, a pair of AC coreless linear motors are used as the linear motor 50. However, the present invention is not limited thereto, and a core linear motor or the like may be employed depending on the required coating accuracy. Further, although the linear motor 50 is disposed on both side portions of the stage 12, the present invention is not limited thereto, and may be disposed on one side of the stage 12.

2‧‧‧預分配機構 2‧‧‧Pre-distribution agency

3‧‧‧載台 3‧‧‧ stage

4‧‧‧載架 4‧‧‧Carriage

6‧‧‧噴嘴洗淨裝置 6‧‧‧Nozzle cleaning device

11‧‧‧本體 11‧‧‧Ontology

12‧‧‧載台 12‧‧‧ stage

14‧‧‧基板搬送機構 14‧‧‧Substrate transport mechanism

15‧‧‧基板搬送機構 15‧‧‧Substrate transport mechanism

21‧‧‧貯存槽 21‧‧‧ storage tank

22‧‧‧預分配滾輪 22‧‧‧Pre-allocation wheel

23‧‧‧刮刀 23‧‧‧Scraper

30‧‧‧保持面 30‧‧‧ Keep face

31‧‧‧移行軌道 31‧‧‧Travel track

33‧‧‧孔部 33‧‧‧ Hole Department

33b‧‧‧孔部 33b‧‧‧孔部

34‧‧‧支持板 34‧‧‧Support board

35‧‧‧螺絲 35‧‧‧ screws

36‧‧‧氣壓缸 36‧‧‧Pneumatic cylinder

37‧‧‧缸桿 37‧‧‧Cylinder rod

40‧‧‧噴嘴支持部 40‧‧‧Nozzle Support

41‧‧‧狹縫噴嘴 41‧‧‧Slit nozzle

43‧‧‧昇降機構 43‧‧‧ Lifting mechanism

44‧‧‧吐出用狹縫 44‧‧‧Slit slit

45‧‧‧塗佈液 45‧‧‧ Coating solution

46‧‧‧塗佈液供給配管 46‧‧‧ Coating liquid supply piping

50‧‧‧線性馬達 50‧‧‧Linear motor

50a‧‧‧定子 50a‧‧‧stator

50b‧‧‧移動件 50b‧‧‧Mobile parts

52‧‧‧線性編碼器 52‧‧‧Linear encoder

61‧‧‧洗淨塊組 61‧‧‧Clean block group

62‧‧‧待機槽 62‧‧‧Standby slot

71‧‧‧吸盤 71‧‧‧Sucker

71a‧‧‧吸附部 71a‧‧‧Adsorption Department

71b‧‧‧基部 71b‧‧‧ base

71c‧‧‧連通孔 71c‧‧‧Connected holes

72‧‧‧吸附槽 72‧‧‧Adsorption tank

73‧‧‧配管 73‧‧‧Pipe

74‧‧‧螺絲部 74‧‧‧ Screw Department

81‧‧‧滾輪 81‧‧‧Roller

82‧‧‧支持構件 82‧‧‧Support components

83‧‧‧氣壓缸 83‧‧‧ pneumatic cylinder

84‧‧‧皮帶 84‧‧‧Land

85‧‧‧外周部按壓構件 85‧‧‧External pressing member

86‧‧‧氣壓缸 86‧‧‧ pneumatic cylinder

91‧‧‧皮帶 91‧‧‧Land

92‧‧‧驅動軸 92‧‧‧Drive shaft

93‧‧‧側板 93‧‧‧ side panels

94‧‧‧支持部 94‧‧‧Support Department

95‧‧‧皮帶 95‧‧‧Land

96‧‧‧驅動軸 96‧‧‧ drive shaft

97‧‧‧側板 97‧‧‧ side panels

98‧‧‧支持部 98‧‧‧Support Department

S‧‧‧基板 S‧‧‧Substrate

圖1係本發明第1實施形態之塗佈裝置之立體圖。 Fig. 1 is a perspective view of a coating apparatus according to a first embodiment of the present invention.

圖2係示意地表示狹縫噴嘴41之塗佈液供給動作之說明圖。 FIG. 2 is an explanatory view schematically showing an operation of supplying the coating liquid to the slit nozzle 41.

圖3係局部剖斷地表示狹縫噴嘴41之前視圖。 Fig. 3 is a partially cutaway front view showing the slit nozzle 41.

圖4係表示滾輪81之昇降機構之概要圖。 4 is a schematic view showing a lifting mechanism of the roller 81.

圖5A係吸盤71之剖視圖。 Figure 5A is a cross-sectional view of the suction cup 71.

圖5B係吸盤71之剖視圖。 Figure 5B is a cross-sectional view of the suction cup 71.

圖6A係表示配設在形成於載台12之孔部33內之吸盤71之說明圖。 FIG. 6A is an explanatory view showing the suction cup 71 disposed in the hole portion 33 formed in the stage 12.

圖6B係表示配設在形成於載台12之孔部33內之吸盤71之說明圖。 FIG. 6B is an explanatory view showing the suction cup 71 disposed in the hole portion 33 formed in the stage 12.

圖7係本發明第2實施形態之塗佈裝置之立體圖。 Fig. 7 is a perspective view of a coating device according to a second embodiment of the present invention.

圖8係本發明第3實施形態之塗佈裝置之立體圖。 Fig. 8 is a perspective view of a coating apparatus according to a third embodiment of the present invention.

圖9係本發明第3實施形態之塗佈裝置之側視圖。 Fig. 9 is a side view of a coating apparatus according to a third embodiment of the present invention.

圖10係保持面30之立體圖。 Figure 10 is a perspective view of the retaining surface 30.

圖11A係表示配設在形成於載台3之孔部33內之吸盤71之說明圖。 FIG. 11A is an explanatory view showing the suction cup 71 disposed in the hole portion 33 formed in the stage 3.

圖11B係表示配設在形成於載台3之孔部33內之吸盤71之說明圖。 FIG. 11B is an explanatory view showing the suction cup 71 disposed in the hole portion 33 formed in the stage 3.

圖12係表示本發明之塗佈裝置之又一實施形態之說明圖。 Fig. 12 is an explanatory view showing still another embodiment of the coating apparatus of the present invention.

11‧‧‧本體 11‧‧‧Ontology

12‧‧‧載台 12‧‧‧ stage

14‧‧‧基板搬送機構 14‧‧‧Substrate transport mechanism

15‧‧‧基板搬送機構 15‧‧‧Substrate transport mechanism

30‧‧‧保持面 30‧‧‧ Keep face

40‧‧‧噴嘴支持部 40‧‧‧Nozzle Support

41‧‧‧狹縫噴嘴 41‧‧‧Slit nozzle

50a‧‧‧定子 50a‧‧‧stator

50‧‧‧線性馬達 50‧‧‧Linear motor

50b‧‧‧移動件 50b‧‧‧Mobile parts

71‧‧‧吸盤 71‧‧‧Sucker

72‧‧‧吸附槽 72‧‧‧Adsorption tank

81‧‧‧滾輪 81‧‧‧Roller

91‧‧‧皮帶 91‧‧‧Land

92‧‧‧驅動軸 92‧‧‧Drive shaft

93‧‧‧側板 93‧‧‧ side panels

94‧‧‧支持部 94‧‧‧Support Department

95‧‧‧皮帶 95‧‧‧Land

96‧‧‧驅動軸 96‧‧‧ drive shaft

97‧‧‧側板 97‧‧‧ side panels

98‧‧‧支持部 98‧‧‧Support Department

Claims (9)

一種塗佈裝置,其藉由在使狹縫噴嘴中的塗佈液吐出用狹縫在接近載置於載台上之基板表面的狀態下,使其相對於該基板沿水平方向進行相對移動,而將塗佈液塗佈於上述基板的表面者,其特徵在於,其具備複數個吸附構件,在藉由上述狹縫噴嘴將塗佈液塗佈於上述基板的期間,於吸附保持上述基板背面的複數個位置的狀態下,將上述基板壓抵至上述載台之表面,相對於上述載台平坦地保持上述基板。 A coating apparatus which relatively moves in a horizontal direction with respect to a substrate in a state in which a coating liquid discharge slit in a slit nozzle is brought close to a surface of a substrate placed on a stage, The coating liquid is applied to the surface of the substrate, and is characterized in that it has a plurality of adsorption members, and the coating liquid is applied to the substrate by the slit nozzle, and the back surface of the substrate is adsorbed and held. In a state of a plurality of positions, the substrate is pressed against the surface of the stage, and the substrate is held flat with respect to the stage. 如申請專利範圍第1項之塗佈裝置,其中,上述吸附構件具備由彈性材料所構成之盤狀吸附部以及與減壓手段連通之基部,在形成於上述載台之孔部內,吸附部之前端在自上述載台之表面突出的狀態下,其基部係由固定於上述載台之吸盤所構成;藉由在上述吸附部之前端與上述基板之背面抵接的狀態下,使由上述吸附部及上述基板所形成之空間內部進行排氣,利用上述吸附部彈性變形之作用,將上述基板之背面壓抵於上述載台之表面。 The coating device according to claim 1, wherein the adsorption member includes a disk-shaped adsorption portion made of an elastic material and a base portion that communicates with the decompression means, and is formed in a hole portion of the stage, and the adsorption portion is The front end is formed by a suction cup fixed to the stage in a state in which the front end protrudes from the surface of the stage; and the adsorption is performed by a state in which the front end of the adsorption unit is in contact with the back surface of the substrate. The inside of the space formed by the substrate and the substrate is exhausted, and the back surface of the substrate is pressed against the surface of the stage by the elastic deformation of the adsorption portion. 如申請專利範圍第2項之塗佈裝置,其中,進一步具備外周部按壓構件,其將載置於上述載台上之基板之外周部壓抵於上述載台之表面。 The coating device according to claim 2, further comprising an outer peripheral portion pressing member that presses a peripheral portion of the substrate placed on the stage against the surface of the stage. 如申請專利範圍第1至3項中任一項之塗佈裝置,其中,進一步具備: 基板搬送機構,係相對於上述載台水平地搬送上述基板;以及複數個基板搬送構件,其配設於上述載台,可昇降於藉由至少使其一部分配置在較上述載台表面上方而將上述基板在與上述基板搬送機構之間搬送之搬送位置、及藉由使其全部配置在較上述載台表面下方而用以將上述基板吸附保持於與上述載台表面之退避位置之間。 The coating device according to any one of claims 1 to 3, further comprising: The substrate transfer mechanism horizontally transports the substrate with respect to the stage; and the plurality of substrate transfer members are disposed on the stage, and are movable up and down so that at least a part thereof is disposed above the surface of the stage The substrate is transported between the transfer mechanism and the substrate transfer mechanism, and is disposed between the substrate and the retracted position of the surface of the stage by being disposed below the surface of the stage. 如申請專利範圍第4項之塗佈裝置,其中,上述複數個基板搬送構件係在形成於載台之孔部內,配設成可相互同步昇降之複數個滾輪或皮帶。 The coating apparatus according to claim 4, wherein the plurality of substrate transfer members are disposed in the hole portion formed in the stage, and are disposed in a plurality of rollers or belts that can be simultaneously raised and lowered. 如申請專利範圍第4項之塗佈裝置,其中,上述狹縫噴嘴係相對於上述載台沿第1方向往返移動,並且,上述基板搬送機構及上述複數個基板搬送構件係沿與上述第1方向正交之第2方向搬送基板。 The coating device of claim 4, wherein the slit nozzle reciprocates in a first direction with respect to the stage, and the substrate transfer mechanism and the plurality of substrate transfer members are along with the first The substrate is transported in the second direction orthogonal to the direction. 如申請專利範圍第6項之塗佈裝置,其中,上述基板搬送機構係往返移動於接近上述載台進行轉送基板之轉送位置、與在上述載台和上述基板搬送機構之間使上述狹縫噴嘴可沿上述第1方向往返移動之分離位置之間。 The coating apparatus according to claim 6, wherein the substrate transfer mechanism reciprocates to a transfer position of the transfer substrate adjacent to the stage, and the slit nozzle is provided between the stage and the substrate transfer mechanism It can be moved back and forth between the separated positions along the first direction. 如申請專利範圍第1至3項中任一項之塗佈裝置,其中,上述基板係太陽能電池用面板基板。 The coating apparatus according to any one of claims 1 to 3, wherein the substrate is a panel substrate for a solar cell. 如申請專利範圍第8項之塗佈裝置,其中,上述基板之厚度在1.7 mm以上。 The coating apparatus of claim 8, wherein the substrate has a thickness of 1.7 mm or more.
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