TWI398417B - Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacturing substrate - Google Patents

Description

Cutting unit, device for cutting panel using the same, cutting method, and method of manufacturing substrate

This invention relates to apparatus and methods for making a panel. More specifically, the present invention is directed to a cutting unit for cutting a panel forming a plurality of unit substrates, a cutting device having a cutting unit, and a cutting method and a method for manufacturing the substrate using the cutting method.

Recently, data processing devices have been rapidly developed with multiple functions and higher data processing speeds. Each of these data processing devices includes a display that is provided to display operational information. Although a cathode ray tube (CRT) is conventionally used as a display, flat panel displays such as a thin film transistor liquid crystal display (TFT-LCD) or an organic light emitting diode display (OLED) have been increasingly used in recent years.

Typically, a plurality of unit substrates for use in a monitor or television (TV) machine are provided at a large size panel. Therefore, a process of separating a unit substrate from a large-sized panel is required.

The process of dividing a large-sized panel into a unit substrate includes: a cutting process in which a vertical crack is formed at a panel by using a diamond grinding wheel; and a braking process in which a force is applied to the crack-forming portion by using a fracture bar to divide the panel into a plurality of panels Unit substrate.

However, if a cutting process is performed using a typical device, the edge of the fracture surface of the unit substrate becomes rough. Therefore, it is necessary to grind the grinding process of the edge of the fracture surface of the unit substrate so that the fracture surface is smooth. The grinding process causes an increase in the time required.

An exemplary embodiment of the present invention is directed to a cutting unit for cutting a workpiece. In an exemplary embodiment, the cutting unit may include a cutter that contacts the workpiece to form a crack in a surface of the workpiece, a bracket configured to support the cutter, and a vibrator configured to provide vibration To the cutter.

An exemplary embodiment of the present invention is directed to a panel cutting apparatus for performing a cutting process before separating a unit substrate from a panel in which a unit substrate is formed. In an exemplary embodiment, a device can include: a support member on which the panel is placed; a cutting unit configured to cut a panel placed on the support member; a first mobile unit configured to Moving the cutting unit or support member linearly in a first direction; and a second moving unit configured to linearly move the cutting unit in a second direction perpendicular to the first direction, wherein the cutting unit comprises: a cutter that contacts The workpiece forms a crack in the surface of the workpiece; a bracket configured to support the cutter; and a vibrator configured to provide vibration to the cutter.

An exemplary embodiment of the present invention is directed to a method for cutting a workpiece. In an exemplary embodiment, the method can include: contacting the cutter with the workpiece; and performing relative movement between the workpiece and the cutter, wherein the vibration is applied to the cutter during the cutting process.

An exemplary embodiment of the invention is directed to a method for fabricating a substrate. In an exemplary embodiment, the method may include: performing a cutting process in which a panel forming a unit substrate is cut by means of a cutter; performing a fracture process in which the unit substrate is separated from the cut panel; and performing a cleaning of each unit substrate Cleaning process in which the cutting process is performed while cutting the panel The vibration is applied to the cutter to perform; and wherein the cleaning process is performed between the fracture process and the cleaning process without performing a grinding process of grinding the fracture surface of the unit substrate.

The invention will now be described more fully hereinafter with reference to the accompanying drawings However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity.

Although the embodiment of the present invention defines the panel 10 for a flat panel display as cutting the workpiece, the present invention is not limited thereto and can be applied to other kinds of workpieces.

FIG. 1 illustrates an example of a panel 10, and FIG. 2 illustrates a device 1 for dividing the panel 10 illustrated in FIG. 1 into a plurality of unit substrates 10a. The panel 10 may be a panel for a thin film transistor liquid crystal display (TFT-LCD) or a panel for an organic light emitting diode display (OLED), which is a panel for a flat panel display. As illustrated in FIG. 1, the panel 10 roughly shows the shape of a rectangular plate, and a plurality of unit substrates 10a are formed at the panel 10. The apparatus 1 shown in Fig. 2 divides the panel 10 into a plurality of unit substrates 10a.

Referring to Fig. 2, the apparatus 1 includes a loading portion 12, a cutting portion 14, a breaking portion 16, and an unloading portion 18 which are arranged in a column in a specified order. The panel 10 is placed in the device 1 via the loading portion 12. The panel 10 is divided into a plurality of unit substrates while passing through the cutting portion 14 and the breaking portion 16. After 10a, the unit substrate 10a is placed outside via the unloading portion 18. The cutting portion 14 forms a vertical crack at the panel 10 by using the cutter 420. The fracture portion 16 is applied to the crack forming portion of the panel 10 by using a breaking bar (not shown) to separate the panel 10 from the separation unit 10a.

Figure 3 is a perspective view of the cutting device 14a provided at the cutting portion 14 shown in Figure 2. As shown in FIG. 3, the cutting device 14a includes a table 100, a first moving unit 200, a second moving unit 300, a cutting unit 400, and a rotating unit 500. Panel 10 is placed on stage 100 during the cutting process.

The table 100 includes a top surface that is flat and roughly shows the shape of a rectangle. The top surface of the table 100 has the same or larger area than the panel 10. A plurality of holes connected to the vacuum line are formed at the top surface of the stage 100 to fix the panel 10 to the stage 100 by vacuum pressure. A clamp (not shown) can be mounted at the table 100 to additionally secure the panel 10 to the table 100.

The cutting unit 400 is scribed at the panel 10 placed on the stage 100 to form a crack. As illustrated in FIG. 4, the cutting unit 400 includes a cutter 420, a bracket 440, a vibrator 460, and a pressing member 480. The cutter 420 is in direct contact with the panel 10 during the cutting process. A grinding wheel made of diamond is used as the cutter 420. A through hole 424 is formed at the center of the grinding wheel 420. The edges of the grinding wheel 420 are sharply provided. As depicted in Figure 5A, the edges of the grinding wheel 420 can be provided circularly. If desired, teeth 422a may be formed at the edge 422 of the grinding wheel 420 along the circumference of the grinding wheel 420, as depicted in FIG. 5B. In the case of using the grinding wheel 420 illustrated in Fig. 5B, the cutting process is more efficient.

The grinding wheel 420 is supported to the bracket 440. Figure 6 shows the grinding wheel 420 mounted on A cross-sectional view of the structure at bracket 440. As shown in FIG. 6, the bracket 440 includes a body 442 and a pivot pin 444. A groove 442a is formed at the bottom surface of the body 442 to penetrate the body 442 in one direction. The pin 444 shows the shape of a long rod having a circular cross section. The shaft pin 444 is disposed in the recess 442a in a direction perpendicular to the longitudinal direction of the recess 442a. Both ends of the axle pin 444 are mounted to be fixed to the body 442. The shaft pin 444 penetrates the through hole 424 formed at the grinding wheel 420. When the grinding wheel 420 is supported by means of the axle pin 444, one portion of the grinding wheel 420 is disposed within the recess 442a and other portions project downwardly from the bracket 440.

The pressing member 480 pressurizes the grinding wheel 420 to allow the grinding wheel 420 to press the panel 10 with a constant force when the grinding wheel 420 and the panel 10 are in contact with each other. In the exemplary embodiment, the pressurizing member 480 is disposed over the bracket 440 and presses the bracket 440 downward using air pressure to pressurize the grinding wheel 420. The pressing member 480 may be provided with a structure including a rod (not shown) that is raised or lowered by air pressure. The pressing member 480 may be provided with a structure in which air directly presses the body 442 of the grinding wheel 420, as needed.

The vibrator 460 is fitted within the body 442 and applies vibration to the grinding wheel 420 during the cutting process. An ultra high frequency acoustic wave sensor can be used as the vibrator 460. The vibrator 460 can apply vibration to the grinding wheel 420 up and down. If the grinding wheel 420 forms a crack at the panel 10, the rupture surface of the panel 10 generally becomes rough. Therefore, after the unit substrate 10a is separated from the panel 10 by the breaking process, the edge of the fracture surface of the unit substrate 10a is polished using a grindstone before the cleaning process. However, if vibration is applied to the grinding wheel 420 when the grinding wheel 420 forms a crack at the panel 10, the rupture surface of the panel 10 becomes smooth. Therefore, the grinding can be omitted before cleaning the unit substrate 10a. The process of the unit substrate 10a.

The first mobile unit 200 allows the station 100 to move linearly in the first direction 22. The first moving unit 200 includes a first guide 220, a first bracket 240, and a first driver (not shown). The first introducer 220 is longitudinally provided in the first direction 22 and is mounted at the center on the base 600. The first introducer 220 has the same width in the longitudinal direction. The top surface of the first guide 220 is provided to be flat. The grooves 222 are formed at both sides of the first guide 220 in the longitudinal direction, respectively.

The stage 100 is coupled to the first introducer 220 by a first bracket 240. The first bracket 240 includes a bottom plate 242, a support plate 244, and a coupling plate 246. The bottom plate 242 is a rectangular flat plate that is disposed on the first guide 220. Support plate 244 is fixed and coupled to stage 100 to support the stage 100 from below. Two support plates 244 are provided and placed facing each other. The coupling plate 246 includes a side plate 246a and an insertion plate 246b. The side panels 246a are disposed to be perpendicular to the bottom surface of the bottom panel 242 and are fixed and coupled to the bottom surface of the bottom panel 242. The insertion plate 246b extends from the bottom end of the inner side surface of the side plate 246a in a direction perpendicular to the side plate 246a to be inserted into the groove 222 formed at the side of the first guide 220. Two coupling insertion plates 246b are provided to face each other.

The first driver provides a driving force to allow the table 100 to travel straight. The first driver may be an assembly including a motor, a belt, and a pulley, as needed. The first driver may be an assembly including a linear motor, as needed. The above is always well known in the art and its detailed configuration will not be described.

The second moving unit 300 allows the cutting unit 400 to move linearly in a second direction 24 that is perpendicular to the first direction 22 . The second mobile unit 300 includes A vertical support 320, a horizontal support 340, a second guide 360 and a second bracket 380, and a second driver (not shown). The vertical supports 320 are fixed and mounted on the base 600 so as to be spaced apart from each other at regular intervals. The vertical support 320 is positioned to allow the panel 10 to pass between the vertical supports 320 as the panel 10 moves in the first direction 22. The horizontal support 340 is fixed and mounted at the top end of the vertical support 320. The second guide 360 is provided at one side of the horizontal support 340 in the longitudinal direction of the horizontal support 340. Grooves are provided in the longitudinal direction of the second introducer 360 at the top and bottom surfaces of the second introducer 360. The second introducer 360 and the horizontal support 340 can be provided in one piece.

The cutting unit 400 is coupled to the horizontal support 340 by a second bracket 380. The second bracket 380 includes a support plate 382 and a coupling plate 384. The support plate 382 is a rectangular flat plate that is disposed on the second guide 360. The coupling plate 384 includes a side plate 384a and an insertion plate 384b. The side plate 384a vertically protrudes from the top surface and the bottom surface of the support plate 382 to the support plate 382, and the insertion plate 384b is inserted into the groove 362 formed at the second guide 360. The second driver provides a driving force to allow the cutting unit 400 to travel straight along the second guide 360. The second drive can have a configuration similar to the first drive.

The cutting unit 400 is mounted above the support plate 382 to be movable up and down. In the exemplary embodiment, the slit guide groove 386 is formed in the third direction 384 at the support plate 382 and the cutting unit 400 and the support shaft (not shown) inserted into the introducer groove 386 coupling. The third direction 384 is perpendicular to the first direction 22 and the second direction 24. In Figure 3, the third direction 384 It is vertical up and down. A third driver (not shown) provides a driving force to allow the cutting unit 400 to travel straight. A motor or cylinder can be used as the third drive.

The rotating unit 500 rotates the panel 10 to provide a crack in a direction at right angles to the panel 10. In the exemplary embodiment, stage 100 includes a top plate 120 and a bottom plate 140. The bottom plate 140 is fixed to the first bracket 240, and the top plate 120 is coupled to the bottom plate 140 to be rotatable relative to the bottom plate 140 in a horizontal plane. A rotating shaft 520 coupled to the motor 500 is fixedly mounted at the bottom surface of the top plate 120.

A method of cutting the panel 10 using the cutting device 14a illustrated in Fig. 3 will now be described in detail. The aligned panels 10 are placed on the table 100. Stage 100 travels straight in a first direction 22 . When the station 100 reaches the previously set first position, the movement of the station 100 is stopped. Thereafter, the cutting unit 400 travels straight in the second direction 24. When the cutting unit 400 reaches the predetermined position, the movement of the cutting unit 400 is stopped. Thereafter, the cutting unit 400 travels downward and the grinding wheel 420 comes into contact with the panel 10. The grinding wheel 420 is pressurized by the pressing member 480 to press the panel 10. When the grinding wheel 420 presses the panel 10, the ultra-high frequency sound wave vibration is applied to the grinding wheel 420. The stage 100 travels straight in a first direction 22 to a second position. When the panel 10 is pressed, the grinding wheel 420 rotates on the axle pin 444. Cracks are formed linearly at the panel 10. If a crack is formed from one end of the panel 10 to the other end, the cutting unit 400 travels upward and the stage 100 returns to the first position. The cutting unit 400 travels straight a predetermined distance in the second direction 24, and the cutting unit 400 travels downward. When the stage 100 is moved to the second position, cracks are formed at the panel 10. Repeat these steps. Thereafter, the stage 100 is rotated by 90 degrees and the above steps are repeated.

FIG. 7A is a photograph showing a state of a fracture surface when a cutting process is performed without providing ultra-high frequency sound wave vibration to the grinding wheel 420. FIG. 7B is a photograph showing the state of the fracture surface when the cutting process is performed by supplying the ultra-high frequency sound wave vibration to the grinding wheel 420. As shown in FIGS. 7A and 7B, the rupture surface is smoother in the case where the ultra-high frequency sound wave vibration is supplied to the grinding wheel 420.

Figure 8 illustrates a method of manufacturing a flat panel display using the cutting device 14a shown in Figure 3. Referring to Figure 8, panel 10 is loaded (S10). The cutting process and the breaking process are sequentially performed on the loading panel 10 (S20 and S30). When the panel 10 is divided into a plurality of unit substrates 10a, each unit substrate 10a is unloaded (S40). In the case where there is no grinding process, the cleaning process is directly performed on the unit substrate 10a (S50). Since the UHF sound wave vibration is applied during the cutting process, the fracture surface becomes significantly smooth. Therefore, it is not necessary to perform the grinding process.

Various modified embodiments will now be briefly described below.

The above embodiment provides that the first drive unit 200 allows the stage 100 to travel straight in the first direction 22. However, the table 100 can be stationary and the cutting unit 400 can travel straight in the first direction 22 during the cutting process. In this situation, the vertical support 320 can travel straight in the first direction 22.

Additionally, the above embodiments provide that a cutting unit 400 is coupled to the horizontal support shaft to cut the panel 10 only when the panel 10 is advanced from the first position to the second position. However, the two cutting units 400 can be mounted at the horizontal support 364. In this case, the first cutting unit performs the cutting process while the panel 10 travels from the first position to the second position and the second cutting unit is in the panel The cutting process is performed while traveling from the second position to the first position. The above method makes it possible to reduce the time required to perform the cutting process.

Additionally, the above embodiments provide that the cutting device 14a is configured to perform a cutting process on the top surface of the panel 10. In the case where it is desired to perform a cutting process on the back side of the panel 10, the cutting device 14a may include units for reversing the top and bottom surfaces of the panel 10. Two horizontal supports 364 may be mounted to the vertical support 320 as needed; the top cutting unit may be mounted on an overlying horizontal support 364 to perform a cutting process on the top surface of the panel 10; and the bottom cutting unit may Mounted on an underlying horizontal support 364 to perform a cutting process on the underside of the panel 10. This approach makes it possible to reduce the time required to perform the cutting process.

In addition, the above embodiment specifies a process of performing the cleaning process without grinding the fracture surface of the unit substrate 10a. However, in the case where a smoother fracture surface is required, the process of grinding the fracture surface of the unit substrate 10a can be performed before the cleaning process is performed.

In addition, the above embodiment specifies that the stage 100 for supporting the entire bottom surface of the panel 10 serves as a supporting member for supporting the panel 10. However, the support member may have various configurations such as a configuration to support only the two edges of the panel 10.

According to the present invention, a relatively smooth fracture surface is achieved when the panel is divided into a plurality of unit substrates. In addition, after the panel is divided into a plurality of unit substrates, the cleaning process is directly performed without the need for a grinding process to reduce the time required for the entire process time and the area of the device is reduced since the unit for performing the grinding process is not required.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

1‧‧‧ device

10‧‧‧ panel

10a‧‧‧unit substrate

12‧‧‧Loading section

14‧‧‧cutting section

16‧‧‧Fracture

18‧‧‧Unloading section

22‧‧‧First direction

24‧‧‧second direction

100‧‧‧

120‧‧‧ top board

140‧‧‧floor

200‧‧‧First mobile unit/first drive unit

220‧‧‧First introducer

222‧‧‧ Groove

240‧‧‧First bracket

246‧‧‧ coupling plate

246a‧‧‧ side panels

246b‧‧‧ insert board

300‧‧‧Second mobile unit

320‧‧‧Vertical support

340‧‧‧ horizontal support

360‧‧‧Second introducer

362‧‧‧ Groove

380‧‧‧second bracket

382‧‧‧Support board

384‧‧‧ coupling plate

384a‧‧‧ side panels

384b‧‧‧ insert board

386‧‧‧guide groove

400‧‧‧Cutting unit

420‧‧‧Cutter/grinding wheel

422‧‧‧ edge

422a‧‧‧ teeth

424‧‧‧through hole

440‧‧‧ bracket

442‧‧‧ body

442a‧‧‧ Groove

444‧‧‧ axle pin

460‧‧‧ vibrator

480‧‧‧ Pressurized parts

500‧‧‧Rotating unit

600‧‧‧Base

1 is a perspective view showing an example of a panel of a flat panel display forming a plurality of unit substrates.

2 illustrates an apparatus for dividing a panel into a plurality of unit substrates in accordance with the present invention.

3 is a perspective view showing a cutting device in accordance with an embodiment of the present invention.

Figure 4 is a perspective view of the cutting unit shown in Figure 3.

5A and 5B are front elevational views showing respective examples of the grinding wheel shown in Fig. 4.

Figure 6 is a partial cross-sectional view of the cutting unit shown in Figure 3.

7A and 7B comparatively illustrate the fracture surface of the unit substrate in the case where the cutting process is performed without applying the ultra-high frequency sound wave vibration, and the crack of the unit substrate in the case where the cutting process is performed when the ultrasonic wave vibration is applied. surface.

FIG. 8 is a flow chart showing a method of manufacturing a flat panel display according to an embodiment of the present invention.

22‧‧‧First direction

24‧‧‧second direction

100‧‧‧

120‧‧‧ top board

140‧‧‧floor

200‧‧‧First mobile unit/first drive unit

220‧‧‧First introducer

222‧‧‧ Groove

240‧‧‧First bracket

246‧‧‧ coupling plate

246a‧‧‧ side panels

246b‧‧‧ insert board

300‧‧‧Second mobile unit

320‧‧‧Vertical support

340‧‧‧ horizontal support

360‧‧‧Second introducer

362‧‧‧ Groove

380‧‧‧second bracket

382‧‧‧Support board

384‧‧‧ coupling plate

384a‧‧‧ side panels

384b‧‧‧ insert board

386‧‧‧guide groove

400‧‧‧Cutting unit

500‧‧‧Rotating unit

600‧‧‧Base

Claims (5)

A panel cutting device for performing a cutting process before separating the unit substrate from a panel formed with a unit substrate, the device comprising: a support member on which the panel is placed; and a cutting unit To cut the panel placed on the support member; a first moving unit configured to linearly move the cutting unit or the support member in a first direction; and a second moving unit Configuring to linearly move the cutting unit in a second direction perpendicular to the first direction, wherein the cutting unit is coupled to the second moving unit by a bracket, the guide groove being in a third direction Formed in the bracket, the third direction being perpendicular to the first direction and the second direction, the cutting unit being coupled to a support shaft inserted into the introducer groove, wherein the cutting The unit includes a cutter that contacts the panel to form a crack in a surface of the panel, a bracket configured to support the cutter, and a vibrator configured to provide vibration to the Cutter. The panel cutting device of claim 1, wherein the cutter comprises a rotatable grinding wheel; and wherein the bracket comprises a body, a groove is formed in a bottom surface of the body; and a shaft pin, A shaft pin is mounted to be secured to the body within the recess, Wherein one of the grinding wheels is partially inserted into the groove and the shaft pin is inserted into an opening formed at the grinding wheel to rotatably support the grinding wheel. The panel cutting device of claim 2, wherein the vibrator is an ultra-high frequency sonic vibrator disposed in the body. The panel cutting device of claim 2, wherein the cutting unit further comprises a pressing member disposed above the bracket and configured to pressurize the bracket using air pressure. The panel cutting device of claim 2, wherein the support member comprises a table on which the panel is placed; and wherein the cutting unit further comprises a rotating unit configured to rotate the table .