KR100924083B1 - Scribing apparatus, apparatus and method for cutting substrate using the same - Google Patents

Abstract

The present invention discloses a scribing apparatus and a substrate cutting apparatus and method using the same, wherein a scribe line is formed along the arrangement direction of the unit substrates without rotating the parent substrate.

According to this aspect, it is possible to provide a scribing apparatus and a substrate cutting apparatus and method using the same, which can improve productivity through shortening of the process time.

Board, Scribing

Description

Scribing device and substrate cutting device and method using same {SCRIBING APPARATUS, APPARATUS AND METHOD FOR CUTTING SUBSTRATE USING THE SAME}

The present invention relates to an apparatus and method for use in the manufacture of a flat panel display panel, and more particularly, to a scribing apparatus for forming a scribe line on a mother substrate formed with a plurality of unit substrates and an apparatus for cutting the mother substrate using the same. And to a method.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. Such information processing apparatus has a display for displaying the activated information. Conventionally, a cathode ray tube monitor is mainly used as a display, but recently, a light and space-saving thin film transistor-liquid crystal display panel or organic light emitting diodes display The use of such flat panel displays is greatly increasing.

In general, a panel used for a flat panel display or the like is usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.

Since the bonded substrate is processed into small and various sizes, such as a panel for a liquid crystal display of a mobile phone, to a large size such as a panel such as a TV or a display, the bonded substrate is cut into a unit substrate having a predetermined size from a large parent substrate, Used as a panel.

As a method of cutting a mother substrate, there is a method of cutting using a laser beam or a method of cutting using a scribe wheel embedded with fine diamond.

A method of cutting a mother substrate using a laser beam includes a scribing process of irradiating a scribe laser beam along a cutting line of the mother substrate to form a scribe line and quenching the heated scribe line, and a brake along the scribe line. It is made of a braking step of cutting the parent substrate into a unit substrate by irradiating a laser beam for.

A method of cutting a mother substrate using a scribe wheel includes a scribing process of contacting a scribe wheel with a cutting target line of the mother substrate and forming a scribe line having a predetermined depth along the cutting target line, and a mother substrate. A cracking process propagates along a scribe line by applying a physical impact to the breaker to break the parent substrate into a unit substrate.

An object of the present invention is to provide a scribing apparatus capable of forming scribe lines on a mother substrate along an arrangement direction of the unit substrate without rotating the mother substrate, and a substrate cutting apparatus and method using the same.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a scribing apparatus according to the present invention is a device for performing a scribing process for separating a mother substrate on which a plurality of unit substrates are formed into a unit substrate, wherein the mother substrate is placed and A support member that is linearly movable in one direction; A plurality of scribing units provided on a path along which the support member is moved, the scribing units forming a scribe line on the parent substrate, wherein the scribing units are scribe lines in the first direction on the parent substrate. A first scribing unit for forming a; And a second scribing unit for forming a scribe line in a second direction perpendicular to the first direction on the mother substrate.

In the scribing apparatus according to the present invention having the configuration as described above, a plurality of first scribing units may be provided side by side in the second direction.

The second scribing unit may be provided on one side of the first scribing units along the first direction.

The apparatus may further include a first moving unit configured to move the plurality of first scribing units in the second direction such that the plurality of first scribing units are aligned with a cutting schedule line in the first direction on the mother substrate. Can be.

The first mobile unit includes first brackets connected to the first scribing units, respectively; First lead screws inserted into all of the first brackets, the first lead screws being disposed in an axial direction parallel to the second direction; A first female screw including first drivers for rotating the first lead screws, respectively, wherein the first bracket may be formed in the first bracket to be screwed with the first lead screw of any one of the first lead screws.

And a second moving unit for moving the second scribing unit along a cutting line in the second direction on the mother substrate, wherein the second moving unit is connected to the second scribing unit. Brackets; A second lead screw inserted into the second bracket and arranged in an axial direction parallel to the second direction; It includes a second driver for rotating the second lead screw, the second bracket may be formed with a second female screw portion to be screwed with the second lead screw.

It may further include a guide member disposed in parallel with the first lead screws and the second lead screw, the guide member for guiding the linear movement of the first bracket and the second bracket.

Each of the first scribing units and the second scribing unit includes two scribers arranged side by side in the second direction, wherein the scribers of the first scribing units are the first A scribe line may be formed in a direction opposite to each other along a direction, and the scribers of the second scribing unit may form a scribe line in a direction opposite to each other along the second direction.

In order to achieve the above object, a substrate cutting apparatus according to the present invention includes a loading unit in which a mother substrate on which a plurality of unit substrates are formed is loaded; A scribing unit generating a scribe line on the mother substrate received from the loading unit; Breaking unit for separating the parent substrate into a unit substrate along the scribe line generated in the parent substrate; A unloading part for unloading the separated unit substrates, wherein the scribing part includes a support member on which the mother substrate is placed and which is linearly movable in a first direction; A plurality of first scribing units disposed side by side in a second direction perpendicular to the first direction on a path along which the support member is moved, and forming a scribe line in the first direction on the mother substrate; ; And a second scribing unit provided on one side of the first scribing units along the first direction and forming a scribe line in the second direction on the mother substrate.

In the apparatus for cutting a substrate according to the present invention having the configuration as described above, the plurality of first scribing units such that the plurality of first scribing units are aligned with a cutting schedule line in the first direction on the mother substrate. A first moving unit for moving the units in the second direction may be further included.

The first mobile unit includes first brackets connected to the first scribing units, respectively; First lead screws inserted into all of the first brackets, the first lead screws being disposed in an axial direction parallel to the second direction; A first female screw including first drivers for rotating the first lead screws, respectively, wherein the first bracket may be formed in the first bracket to be screwed with the first lead screw of any one of the first lead screws.

And a second moving unit for moving the second scribing unit along a cutting line in the second direction on the mother substrate, wherein the second moving unit is connected to the second scribing unit. Brackets; A second lead screw inserted into the second bracket and arranged in an axial direction parallel to the second direction; It includes a second driver for rotating the second lead screw, the second bracket may be formed with a second female screw portion to be screwed with the second lead screw.

It may further include a guide member disposed in parallel with the first lead screws and the second lead screw, the guide member for guiding the linear movement of the first bracket and the second bracket.

Each of the first scribing units and the second scribing unit includes two scribers arranged side by side in the second direction, the scribers of the first scribing units being the first A scribe line may be formed in a direction opposite to each other along a direction, and the scribers of the second scribing units may form a scribe line in a direction opposite to each other along the second direction.

The parent substrate may be a flat panel display substrate.

In order to achieve the above object, the substrate cutting according to the present invention provides a plurality of scribing units to separate a mother substrate on which unit substrates are formed into a unit substrate, wherein the plurality of scribing units are the mother substrate. First scribing units arranged side by side in a second direction perpendicular to the first direction in which the substrate is linearly moved; A second scribing unit disposed on either side of the first scribing units along the first direction, and using the first scribing units in the first direction on the mother substrate; And forming a scribe line, and forming a scribe line in the second direction on the mother substrate using the second scribing unit.

In the apparatus for cutting a substrate according to the present invention having the characteristics as described above, when the scribe line is formed in the first direction, the first scribing units are fixed and the parent substrate is linearly moved in the first direction. When the scribe line is formed in the second direction, the mother substrate may be fixed and the second scribing unit may be linearly moved in the second direction.

A plurality of scribe lines in the first direction may be formed at the same time.

A scribe line in the first direction may be formed on the mother substrate by adjusting the distance between the first scribing units.

A scribe line in the second direction is formed on the mother substrate while the mother substrate is moved in steps along the first direction so that the second scribing unit is aligned with cutting lines in the second direction on the mother substrate. can do.

According to the present invention, scribe lines can be formed on the mother substrate along the arrangement direction of the unit substrate without rotating the mother substrate.

Moreover, according to this invention, productivity can be improved through shortening of a process time.

Hereinafter, a scribing apparatus and a substrate cutting apparatus and method using the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

(Example)

1 is a diagram illustrating an example of a mother substrate.

Referring to FIG. 1, the mother substrate 1 may be a panel for a thin film transistor-liquid crystal display (TFT-LCD). The mother board | substrate 1 consists of the 1st mother board | substrate 2 which has a substantially rectangular plate shape, and the 2nd mother board | substrate 3. As shown in FIG. The first mother substrate 2 and the second mother substrate 3 are stacked up and down. A plurality of unit substrates 2a and 3a are formed on the first and second mother substrates 2 and 3, and the unit substrates 2a and 3a are planes of the first and second mother substrates 2 and 3. It may be arranged in a grid shape on the phase. The first mother substrate 2 is a substrate on which a thin film transistor substrate is formed, and the second mother substrate 3 is a substrate on which a color filter substrate is formed. The mother substrate 1 may be a panel for organic light emitting diodes (OLED) display, which is a kind of panel for a flat panel display.

2 is a view schematically showing the configuration of a substrate cutting device 10 according to the present invention.

Referring to FIG. 2, the substrate cutting apparatus 10 is for cutting a parent substrate (reference numeral 1 of FIG. 1) into a plurality of unit substrates, and includes a loading unit 11, a scribing unit 12, and a braking unit. The unit 13 and the unloading unit 14 is included. The loading unit 11, the scribing unit 12, the breaking unit 13, and the unloading unit 14 may be sequentially arranged in a line. The mother substrate 1 flows into the substrate cutting device 10 through the loading unit 11, and is separated into a plurality of unit substrates sequentially through the scribing unit 12 and the breaking unit 13, and unloading. It flows out of the substrate cutting device 10 through the portion 14.

The scribing unit 12 forms a scribe line along the arrangement direction of the unit substrates on the first mother substrate 2 or the second mother substrate 3 using the scribing apparatus 12a to be described later. do. The breaking part 13 cuts the unit substrates from the mother substrate 1 by applying a force to a scribe line portion formed in the mother substrate 1 using a break bar (not shown). In addition, an inverting unit 15 may be disposed on one side of the scribing unit 12. The inverting unit 15 serves to change the position of one surface on which the scribe line is formed and the position of the other surface on which the scribe line is not formed. That is, when a scribe line is first formed on the first mother substrate 2 of the mother substrate 1, the first mother substrate 2 and the second mother substrate are formed to form a scribe line on the second mother substrate 3. Change the position of (3).

3 is a perspective view illustrating an example of a scribing apparatus according to the present invention provided in the scribing unit of FIG. 2, FIG. 4 is a plan view of the scribing apparatus of FIG. 3, and FIG. 5 is a support member of FIG. 3. Side view.

Hereinafter, the first direction I is a linear movement direction of the supporting member 100 to be described later, and the second direction II is a direction perpendicular to the first direction I in the planar arrangement structure of the scribing apparatus 12a. The third direction III is a direction perpendicular to the first direction I and the second direction II. The first direction I and the second direction II correspond to any one of the arrangement directions of the unit substrates 2a and 3a arranged in a lattice shape on the mother substrate 1, respectively.

3 to 5, the scribing apparatus 12a includes the support member 100, the scribing units 200: 200a-1, 200a-2, 200b, and the moving units 300: 300a, 300b. ). The supporting member 100 supports the mother substrate 1, and linearly moves the mother substrate 1 along the first direction I. The scribing units 200 are in contact with the mother substrate 1 on the support member 100 to form a scribe line in the first direction (I) and a scribe line in the second direction (II). The moving units 300 linearly move the scribing units 200 in the second direction II.

The moving unit 300a moves the scribing units 200a-1 and 200a-2 in the second direction II to adjust the gap between the scribing units 200a-1 and 200a-2. The spacing of the scribe line in the first direction I is adjusted by adjusting the spacing between the scribing units 200a-1 and 200a-2. In forming the scribe line in the first direction (I), the scribing units 200a-1 and 200a-2 are fixed, and the mother substrate 1 is moved in the first direction (I).

The moving unit 300b linearly moves the scribing unit 200b in the second direction (II). When the second direction (II) scribe line is formed, the mother substrate 1 is fixed, and the scribing unit 200b is linearly moved in the second direction (II) by the moving unit 300b. The spacing of the scribe lines in the second direction (II) is controlled by the movement of the first direction (I) of the parent substrate 1.

The support member 100 includes a table 120 and a drive unit 140. The mother substrate 1 is placed on the table 120. The drive unit 140 linearly moves the table 120 in the first direction (I).

Table 120 has an upper plate 122 and a lower plate 124. The upper plate 122 and the lower plate 124 are flat and generally rectangular in shape, and the upper plate 122 is located above the lower plate 124. The parent substrate 1 is placed on the upper plate 122. Top plate 122 has an area that is similar to or greater than the parent substrate 1. The upper surface of the upper plate 124 is formed with a plurality of holes (not shown) connected to the vacuum line (not shown), the mother substrate 1 may be fixed to the upper plate 124 by vacuum. In addition, the upper plate 122 or the lower plate 124 may additionally be provided with a clamp (not shown) for fixing the parent substrate 1 to the upper plate 122.

The drive unit 140 linearly moves the table 120 in the first direction (I). The drive unit 140 has a guide 142, a bracket 144, and a driver (not shown). The guide 142 is elongated along the first direction I and is mounted at the center on the base B. The guide 142 has the same width along the longitudinal direction. The upper surface of the guide 142 is provided flat, and each side of the guide 142 is provided with a groove 141 elongated in the longitudinal direction.

The table 120 is coupled to the guide 142 by the bracket 144. The bracket 144 has a bottom plate 145, a support plate 147, and a coupling plate 149. The bottom plate 145 has a flat rectangular plate shape and is located on the guide 142. The support plate 147 is vertically fixed to the upper surface of the bottom plate 145 and fixedly coupled to the lower plate 124 of the table 120 to support the table 120. Two support plates 147 are provided, and are arranged side by side on both sides of the top surface of the bottom plate 145. The coupling plate 149 has a side plate 149a vertically coupled to the bottom of the bottom plate 145 and an insertion plate 149b extending vertically inwardly from the bottom of the side plate 149a. The insertion plate 149b is inserted into the groove 141 formed on the side of the guide 142. Two coupling plates 149 are provided to face each other.

The driver provides a driving force so that the table 120 is guided by the guide 142 to move linearly in the first direction (I). As a driver, an assembly including a motor and a screw can be used. Optionally an assembly comprising a combination of a motor, belt and pulley or an assembly including a linear motor can be used as the driver. Detailed configurations of the various assemblies described above are well known to those skilled in the art, and thus detailed descriptions thereof will be omitted.

The scribing units 200 include first scribing units 200a-1 and 200a-2 and a second scribing unit 200b. The first scribing units 200a-1 and 200a-2 are provided side by side in the second direction (II) on the path along which the support member 100 is moved, and the second scribing unit 200b is formed in the first direction. It may be provided on one side of the first scribing units 200a-1, 200a-2 along the first direction (I). The first scribing units 200a-1 and 200a-2 form a scribe line in the first direction I on the mother substrate 1, and the second scribing unit 200b is the mother substrate 1. Scribe lines in the second direction (II).

In the present embodiment, a case where two scribing units 200a-1 and 200a-2 are provided as the first scribing units 200a-1 and 200a-2 will be described as an example. Of course, critical units can be deployed. The first scribing units 200a-1 and 200a-2 are moved in the second direction II by the first mobile unit 300a to be described later to adjust the spacing.

As shown in FIG. 6, the first scribing unit 200a-1 has two scribers 220a-1 and 240a-1 arranged side by side in the second direction (II), and the first scribing unit 200a-1. The criving unit 200a-2 has two scribers 220a-2 and 240a-2 arranged side by side in the second direction (II), and the second scribing unit 200b has the second direction It has two scribers 220b and 240b arranged side by side in (II). Since the scribers 220a-1, 240a-1, 220a-2, 240a-2, 220b, 240b have the same configuration, the following describes the scribers 220a-1 of one of them. The description of 240a-1,220a-2,240a-2,220b, 240b will be omitted.

FIG. 8 is a perspective view of the scriber of FIG. 6, FIG. 9 is a partial cross-sectional view of the lower end of the scriber of FIG. 8, and FIG. 10 is a plan view of the scribing wheel of FIG. 9.

8 to 10, the scriber 220a-1 has a scribing wheel 222, a support 224, a pressing member 226, and a vibrator 228. The scribing wheel 222 is rotated in contact with the mother substrate 1 during the scribing process to form a scribe line on the mother substrate 1. As the scribing wheel 222, a wheel made of diamond may be used. A circular through hole 222a is formed in the center of the scribing wheel 222, and the edge 222b of the scribing wheel 222 is sharply provided.

The scribing wheel 222 is supported on the support 224. The support 224 has a body 224a and a shaft pin 224b. The lower surface of the body 224a is formed with a groove 225 penetrating the body 224a in one direction. The shaft pin 224b has a long rod shape having a circular cross section. The axial pin 224b is located in the groove 225 in a direction perpendicular to the longitudinal direction of the groove 225. Both ends of the shaft pin 224b are fixed to the body 224a. The shaft pin 224b passes through the through hole 222b formed in the scribing wheel 222. When the scribing wheel 222 is supported by the shaft pin 224b, the scribing wheel 222 is partly located in the groove 225, and part of it protrudes below the support 224.

The pressing member 226 may press the scribing wheel 222 such that the scribing wheel 222 may press the mother substrate 1 with a predetermined force when the scribing wheel 222 contacts the mother substrate 1. Pressurize. In one example, the pressing member 226 is positioned above the support 224 and presses the scribing wheel 222 by pressing the support 224 downward using pneumatic pressure.

The vibrator 228 applies vibration to the scribing wheel 222 during the scribing process. The vibrator 228 is mounted inside the body 224a, and an ultrasonic vibrator may be used as the vibrator 228.

3 to 5 again, the mobile unit 300 includes a first mobile unit 300a and a second mobile unit 300b. The first moving unit 300a moves the first scribing units 200a-1, 200a-2 in the second direction (II), so as to cut the first direction (I) on the parent substrate 1. Align the first scribing units 200a-1, 200a-2. The second moving unit 300b moves the second scribing unit 200b along a cutting direction line in the second direction (II) on the mother substrate 1. The linear movement of the first scribing units 200a-1 and 200a-2 and the linear movement of the second scribing unit 200b are guided by the guide member 370.

The first moving unit 300a includes first vertical supports 310, first brackets 330-1, 330-2, and a first driving member 350. The first vertical supports 310 are disposed to be spaced apart by a predetermined distance in the second direction (II). The first vertical supports 310 are disposed such that the parent substrate 1 may pass between the first vertical supports 310 when the parent substrate 1 linearly moves along the first direction I. FIG. The guide member 370 is fixedly installed on the upper ends of the first vertical supports 310, and the length direction of the guide member 370 is aligned in the second direction (II). The upper and lower surfaces of the guide member 370 are provided with grooves 372 and 374 extending along the length direction.

The first scribing unit 200a-1 is coupled to the guide member 370 by the first bracket 330-1, and the first scribing unit 200a-2 is the first bracket 330-2. Is coupled to the guide member 370. Since the first brackets 330-1 and 330-2 have the same structure, only the first bracket 330-1 will be described below. As shown in FIG. 6, the first bracket 330-1 has a supporting plate 332 and a coupling plate 334. The support plate 332 has a flat rectangular plate shape and is located on one side of the guide member 370. The coupling plate 334 includes a side plate 334a protruding perpendicularly to the support plate 332 from above and below the support plate 332, and an insertion plate 334b inserted into the groove 372 formed in the guide member 370. Have

The first driving member 350 provides a driving force so that the first brackets 330-1 and 330-2 move linearly along the guide member 370. The first drive member 350 has first lead screws 352 and 354 disposed parallel to the guide member 370. As shown in FIG. 7A, the first bracket 330-1 is mounted on the first lead screw 352 so as to be linearly movable, and the first bracket 330-2 is straight on the first lead screw 354. It is mounted to be movable. That is, although the first lead screws 352 and 354 are inserted into the first bracket 330-1, the first lead screw 352 is engaged with the female screw part 335-1 formed in the bracket 330-1. The first lead screw 354 penetrates without contacting the hole 336-1 formed in the first bracket 330-1. Similarly, although the first lead screws 352 and 354 are inserted into the first bracket 330-2, the first lead screw 352 contacts the hole 336-2 formed in the first bracket 330-2. While not penetrating through, the first lead screw 354 meshes with the female screw portion 335-2 formed in the bracket 330-2.

When the first lead screw 352 is driven, the first bracket 330-1 is linearly moved, but the first bracket 330-2 is not moved, and when the first lead screw 354 is driven, the first bracket 330 is driven. -1) is not moved but the first bracket 330-2 is linearly moved. By this driving method, the first scribing unit 200a-1 connected to the first bracket 330-1 and the first scribing unit 200a-2 connected to the first bracket 330-2 are formed. It is moved along the two directions (II), the distance between the first scribing units (200a-1, 200a-2) can be adjusted.

One end of the first lead screw 352 is connected to the first driver 353 to provide a rotational force, and one end of the first lead screw 354 is connected to the first driver 355 to provide the rotational force. As the first and second drivers 353 and 355, a driver such as a motor may be used. Although the assembly including the motor and the lead screw as the first driving member 350 has been described as an example, various drivers capable of providing linear driving power to the first brackets 330-1 and 330-2, such as a cylinder, are also described. Can be used.

As shown in FIG. 6, the first scribing unit 200a-1 is mounted on the support plate 332 of the first bracket 330-1 so as to be movable upward and downward. According to one example, the support plate 332 is formed with slit-shaped guide grooves 331 in the third direction (III), the scribers 220a-1, 240a- of the first scribing unit 200a-1. 1) are respectively coupled to a support shaft (not shown) inserted into the guide grooves 331. The first scribing unit 200a-2 is also connected to the first bracket 330-2 so as to be movable up and down, and the connection structure is the same as that of the first scribing unit 200a-1. Description is omitted.

The second moving unit 300b includes second vertical supports 310 ', a second bracket 330', and a second driving member 350 '. The second vertical supports 310 ′ are disposed to be spaced apart by a predetermined distance in the second direction II. The second vertical supports 310 ′ are disposed such that the parent substrate 1 may pass between the second vertical supports 310 ′ when the parent substrate 1 linearly moves along the first direction I. FIG. In addition, the second vertical supports 310 ′ are disposed such that an upper end thereof may be fixedly coupled to the guide member 370 fixed to the upper ends of the first vertical supports 310.

The second scribing unit 200b is coupled to the guide member 370 by a second bracket 330 '. Since the second bracket 330 'has the same structure as the first bracket 330-1 described above, a description thereof will be omitted.

As shown in FIG. 4, the second driving member 350 ′ provides driving force so that the second brackets 330 ′ linearly move along the guide member 370. The second drive member 350 ′ has a second lead screw 352 ′ disposed parallel to the guide member 370. As shown in FIG. 7B, the second bracket 330 'is mounted on the second lead screw 352' so as to be linearly movable. That is, the female thread part 335 'and the second lead screw 352' formed in the second bracket 330 'are engaged. By this driving method, the second scribing unit 200b connected to the second bracket 330 'is moved along the second direction II.

One end of the second lead screw 352 'is connected with a second driver 353' providing a rotational force. As the second driver 353 ', a driver such as a motor may be used. Although the assembly including the motor and the lead screw as the second driving member 350 ′ has been described as an example, various drivers capable of providing a linear driving force to the second bracket 330 ′, such as a cylinder, may be used.

The second scribing unit 200b is connected to the second bracket 330 'to be movable up and down, and the connection structure is the same as the connection structure of the first scribing unit 200a-1 described above. Is omitted.

The operation of the first and second mobile units 300a and 300b described above is controlled by the controller 400. The controller 400 controls the operations of the first drivers 353 and 355 of the first mobile unit 300a and the second driver 353 'of the second mobile unit 300b. Under the control of the first drivers 353 and 355, the first scribing units 200a-1 and 200a-2 are moved in the second direction II and the first scribing units 200a-1 and 200a are moved. The spacing between -2) can be adjusted. In addition, the second scribing unit 200b may be moved in the second direction II by the control of the second driver 353 '.

Referring to the process of manufacturing a flat panel display panel using the substrate cutting device according to the present invention having the configuration as described above are as follows.

11 is a flowchart sequentially illustrating a process of manufacturing a flat panel display using a substrate cutting apparatus according to the present invention.

Referring to FIG. 11, a mother substrate is loaded (S10), and then a scribing process is performed on the first mother substrate (S20). After forming a scribe line on the first mother substrate, the mother substrate is removed. Inverting (S30) to form a scribe line on the second mother substrate. (S40) As described above, the scribing process is performed on the first and second mother substrate and then the braking process is performed (S50). When the parent substrate 1 is separated into a plurality of unit substrates by the braking process, the unit substrates are unloaded (S60), and the cleaning process is performed on the unit substrates.

Next, a process of performing a scribing process on the mother substrate 1 using the scribing apparatus 12a according to the present invention will be described.

12A to 12K illustrate a process of generating a scribe line on a mother substrate using a scribing apparatus according to the present invention.

The parent substrate 1 lies on the top plate 122 of the table 120. The table 120 is linearly moved in the first direction I by a driver (not shown). (FIG. 12A) The table 120 is at a predetermined position (i.e., the first cutting schedule line of the parent substrate 1). When (a) is moved to the position aligned with the second scribing unit 200b, the movement of the table 120 stops (FIG. 12B).

Then, the second of the second moving unit 300b in a state where the second scribing unit 200b is aligned with the first cutting schedule line a of the mother substrate 1 along the second direction II. The driver 353 'is driven to move the second scribing unit 200b in one direction of the mother substrate 1. At this time, one of the scribers 220b and 240b of the scribers 220b and 240b of the second scribing unit 200b is moved downward so as to be positioned at a height capable of contacting the mother substrate 1. (FIG. 12C)

In this state, the second driver 353 'of the second moving unit 300b is driven to move the second scribing unit 200b across the mother substrate 1 along the second direction II. . At this time, a scriber contacting the mother substrate 1 among the scribers 220b and 240b of the second scribing unit 200b forms a crack on the mother substrate 1. A scribing line is formed on the mother substrate 1 by forming cracks continuously along the cutting schedule line a. After the formation of the scribe line, the scribers 220b and 240b of the second scribing unit 200b are moved upwards (FIG. 12D).

The table 120 is linearly moved in the first direction I by a driver (not shown). When the table 120 is moved to a predetermined position (that is, the position where the second cutting plan line b of the parent substrate 1 is aligned with the second scribing unit 200b), the movement of the table 120 is Stop Then, one of the scribers 220b and 240b of the scribers 220b and 240b of the second scribing unit 200b moves in a downward direction so as to be positioned at a height that can be in contact with the mother substrate 1. (FIG. 12E)

Thereafter, the second driver 353 ′ of the second moving unit 300b is driven to move the second scribing unit 200b across the mother substrate 1 along the second direction II. At this time, a scriber contacting the mother substrate 1 among the scribers 220b and 240b of the second scribing unit 200b forms a crack on the mother substrate 1. A scribing line is formed on the mother substrate 1 by forming cracks continuously along the cutting schedule line b. After the formation of the scribe line, the scribers 220b and 240b of the second scribing unit 200b are moved upwards (FIG. 12F).

By repeating the processes as described above, a scribe line is formed on the mother substrate 1 along the remaining cutting lines c and d, and then the table 120 is first driven by a driver (not shown). It is linearly moved in the direction (I). When the table 120 is moved to a preset position, the movement of the table 120 is stopped (FIG. 12G).

Thereafter, the drivers 353 and 355 of the first mobile unit 300a are driven to adjust the distance between the first scribing units 200a-1 and 200a-2. The first scribing unit 200a-1 is moved to the predetermined position (that is, the first scribing unit 200a-1 is to be cut by the first moving unit 300a of the mother substrate 1. ), And the first scribing unit 200a-2 is moved to the predetermined position (that is, the first scribing unit 200a-2 is to be cut to the cutting line of the parent substrate 1). position f)). In this case, one of the scribers 220a-1 and 240a-1 of the scribers 220a-1 and 240a-1 of the first scribing units 200a-1 may contact the mother substrate 1. The scribers 220a-2, 240a-2 of one of the scribers 220a-2, 240a-2 of the first scribing units 200a-2 are moved downward to be positioned at a height of the first scribe unit 200a-2. It is moved downward to be at a height that can be in contact with the substrate 1 (FIG. 12H).

With the first scribing units 200a-1, 200a-2 aligned with the cutting schedule lines e and f of the parent substrate 1 along the first direction I, the table 120 is driven by the driver. It moves linearly to a 1st direction I by (not shown). When the table 120 is moved to a predetermined position (that is, a position where a scribe line is formed on the mother substrate 1 along cutting lines e and f of the mother substrate 1), the movement of the table 120 is reduced. Stop (Fig. 12 i)

Thereafter, the first scribing units 200a-1 and 200a-2 are driven to drive the drivers 353 and 355 of the first mobile unit 300a so that the first scribing units 200a-1 and 200a-2 are aligned with the cutting lines g and h. Move the units 200a-1 and 200a-2. By the first moving unit 300a, the first scribing unit 200a-1 has a predetermined position (i.e., the first scribing unit 200a-1 has a cut line g of the mother substrate 1). ), And the first scribing unit 200a-2 is moved to the predetermined position (that is, the first scribing unit 200a-2 is to be cut to the cutting line of the parent substrate 1). position), which is aligned to h). In this case, one of the scribers 220a-1 and 240a-1 of the scribers 220a-1 and 240a-1 of the first scribing units 200a-1 may contact the mother substrate 1. Is moved downward to be positioned at a height, and one of the scribers 220a-2 and 240a-2 of the first scribing units 200a-2 is connected to the mother substrate. It is moved downward to be at a height that can be in contact with (1) (FIG. 12J).

With the first scribing units 200a-1 and 200a-2 aligned with the cutting lines g and h of the mother substrate 1 along the first direction I, the table 120 is driven by the driver. It moves linearly to a 1st direction I by (not shown). When the table 120 is moved to a predetermined position (that is, a position where a scribe line is formed on the parent substrate 1 along cutting lines g and h of the parent substrate 1), the movement of the table 120 is decreased. Stop (Fig. 12k)

As described above, the scribing apparatus and the substrate cutting apparatus according to the present invention form scribe lines in any one direction of the arrangement direction of the unit substrates, for example, the second direction (II), on the plane of the mother substrate. After that, the scribe lines in the first direction (I) perpendicular to the second direction (II) may be formed without rotating the mother substrate. Here, the order of forming the scribe lines is merely an example, and first, the scribe lines in the first direction (I) may be formed, and the scribe lines in the second direction (II) perpendicular to the first direction (I) may be formed. have.

As such, by not rotating the substrate during the formation of the scribe line, the overall process time can be shortened, thereby improving the productivity of the scribing process.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.

1 is a view showing an example of a mother substrate,

2 is a view schematically showing the configuration of a substrate cutting device according to the present invention;

3 is a perspective view showing an example of a scribing apparatus according to the present invention provided in the scribing unit of FIG.

4 is a plan view of the scribing apparatus of FIG.

5 is a side view of the supporting member of FIG. 3, FIG.

6 is an enlarged view of a portion “A” of FIG. 3,

7A and 7B are cross-sectional views illustrating a coupling relationship between the brackets and lead screws of FIG. 6;

8 is a perspective view of the scriber of FIG.

9 is a partial cross-sectional view of the lower end of the scriber of FIG. 8, FIG.

10 is a plan view of the scribing wheel of FIG. 9;

11 is a flowchart sequentially illustrating a process of manufacturing a flat panel display using a substrate cutting apparatus according to the present invention;

12A to 12K illustrate a process of generating a scribe line on a mother substrate using a scribing apparatus according to the present invention.

<Description of Symbols for Main Parts of Drawings>

1: parent substrate 100: support member

200a-1,200a-2,200b: scribing unit 300a, 300b: mobile unit

400: control unit

Claims (20)

An apparatus for performing a scribing process for separating a parent substrate having a plurality of unit substrates formed into a unit substrate, A support member on which the mother substrate is placed and which is linearly movable in a first direction; A plurality of scribing units provided on a path through which the support member is moved, and forming a scribe line on the parent substrate, The scribing units, A first scribing unit for forming a scribe line in the first direction on the mother substrate; A scribe line in the second direction is formed on the mother substrate by being provided on one side of the first scribing unit along the first direction and linearly moving in a second direction perpendicular to the first direction. And a second scribing unit. The method of claim 1, And a plurality of first scribing units are provided side by side in the second direction. delete The method of claim 2, And a first moving unit for moving the plurality of first scribing units in the second direction such that the plurality of first scribing units are aligned with a cutting schedule line in the first direction on the mother substrate. Scribing device, characterized in that. The method of claim 4, wherein The first mobile unit, First brackets connected to the first scribing units, respectively; First lead screws inserted into all of the first brackets, the first lead screws being disposed in an axial direction parallel to the second direction; A first driver for rotating the first lead screws, respectively, And a first female screw portion formed on the first brackets so as to be screwed with the first lead screw of any one of the first lead screws. The method of claim 5, wherein And a second moving unit for moving the second scribing unit along a cutting line in the second direction on the mother substrate, The second mobile unit, A second bracket connected to the second scribing unit; A second lead screw inserted into the second bracket and arranged in an axial direction parallel to the second direction; Including a second driver for rotating the second lead screw, And a second female screw portion is formed on the second bracket to be screwed to the second lead screw. The method of claim 6, And a guide member arranged to be parallel to the first lead screws and the second lead screw, and configured to guide linear movement of the first brackets and the second brackets. The method of claim 2, Each of the first scribing units and the second scribing unit includes two scribers arranged side by side in the second direction, The scribers of the first scribing units form a scribe line in opposite directions along the first direction, And the scribers of the second scribing unit form scribe lines in opposite directions along the second direction. A loading unit to which a mother substrate on which a plurality of unit substrates are formed is loaded; A scribing unit generating a scribe line on the mother substrate received from the loading unit; Breaking unit for separating the parent substrate into a unit substrate along the scribe line generated in the parent substrate; Including an unloading unit for unloading the separated unit substrate, The scribing unit, A support member on which the mother substrate is placed and which is linearly movable in a first direction; A plurality of first scribing units disposed side by side in a second direction perpendicular to the first direction on a path along which the support member is moved, and forming a scribe line in the first direction on the mother substrate; ; A second scribing provided on one side of the first scribing units along the first direction and linearly moving along the second direction to form a scribe line in the second direction on the mother substrate Substrate cutting device comprising a unit. The method of claim 9, And a first moving unit for moving the plurality of first scribing units in the second direction such that the plurality of first scribing units are aligned with a cutting schedule line in the first direction on the mother substrate. Substrate cutting device, characterized in that. The method of claim 10, The first mobile unit, First brackets connected to the first scribing units, respectively; First lead screws inserted into all of the first brackets, the first lead screws being disposed in an axial direction parallel to the second direction; A first driver for rotating the first lead screws, respectively, The first bracket has a first female screw portion is formed to be screwed with the first lead screw of any one of the first lead screw. The method of claim 11, And a second moving unit for moving the second scribing unit along a cutting line in the second direction on the mother substrate, The second mobile unit, A second bracket connected to the second scribing unit; A second lead screw inserted into the second bracket and arranged in an axial direction parallel to the second direction; Including a second driver for rotating the second lead screw, Substrate cutting device, characterized in that the second bracket is formed on the second bracket to be screwed with the second lead screw. The method of claim 12, And a guide member disposed to be parallel to the first lead screws and the second lead screw, and configured to guide linear movement of the first brackets and the second brackets. The method of claim 9, Each of the first scribing units and the second scribing unit includes two scribers arranged side by side in the second direction, The scribers of the first scribing units form a scribe line in opposite directions along the first direction, Wherein the scribers of the second scribing units form a scribe line in opposite directions along the second direction. The method of claim 9, And the parent substrate is a flat panel display substrate. In the method of providing a plurality of scribing unit to separate the parent substrate on which the unit substrates are formed into a unit substrate, The plurality of scribing units, First scribing units arranged side by side in a second direction perpendicular to a first direction in which the mother substrate is linearly moved; A second scribing unit disposed on either side of the first scribing units along the first direction, Forming a scribe line in the first direction on the mother substrate using the first scribing units and forming a scribe line in the second direction on the mother substrate using the second scribing unit But When the scribe line is formed in the first direction, the first scribing units are fixed and the parent substrate is linearly moved in the first direction. The mother substrate is fixed and the second scribing unit is linearly moved in the second direction when the scribe line is formed in the second direction. delete The method of claim 16, And a plurality of scribe lines in the first direction are formed at the same time. The method of claim 18, And adjusting the distance between the first scribing units to form a scribe line in the first direction on the mother substrate. The method of claim 16, A scribe line in the second direction is formed on the mother substrate while the mother substrate is moved in steps along the first direction so that the second scribing unit is aligned with cutting lines in the second direction on the mother substrate. Substrate cutting method characterized in that.

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