CN106277733A - Cutting method and cutting equipment - Google Patents
Cutting method and cutting equipment Download PDFInfo
- Publication number
- CN106277733A CN106277733A CN201510296846.9A CN201510296846A CN106277733A CN 106277733 A CN106277733 A CN 106277733A CN 201510296846 A CN201510296846 A CN 201510296846A CN 106277733 A CN106277733 A CN 106277733A
- Authority
- CN
- China
- Prior art keywords
- delineation
- glass substrate
- predetermined cuts
- cutting
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
The present invention relates to the cutting method of a kind of glass-cutting substrate and use the cutting equipment of cutting method of the present invention, in order to form multiple glass product.Described glass substrate includes first surface and the second surface relative with first surface.Cutting method of the present invention comprises the following steps: (a) delineates described glass substrate along the first predetermined cuts line on described first surface, to form the first delineation opening；B () delineates described glass substrate along the second predetermined cuts line on described second surface, to form the second delineation opening, wherein when the second predetermined cuts line orthographic projection is to described first surface, described second predetermined cuts line intersects with described first predetermined cuts line；And (c) is along glass substrate described in described first delineation opening disjunction, and along described second delineation opening disjunction glass substrate, to form glass product.
Description
Technical field
The present invention relates to a kind of cutting method and cutting equipment, particularly to a kind of glass-cutting substrate cutting method and
Cutting equipment.
Background technology
Glass substrate is widely used in the various parts of electronic product, such as screen, shell etc. at present.In the fabrication process,
Glass substrate is both needed to the glass substrate the being cut into reduced size application with cooperation various devices, especially, for adapting to final producing
The needs that product use, many glass substrate surfaces have to pass through intensive treatment so that cutting technique is more difficult, yield not
Easily promote.Therefore, how glass-cutting substrate avoids defect to produce, and makes glass substrate divide along predetermined cuts line, for
The important topic of this industry.
Refer to Figure 1A and 1B, glass substrate 1 includes first surface 11 and the second surface relative with first surface 11
12.Conventional cutting method from the inside feed in edge 14 of glass substrate 1 with along the first predetermined cuts line 311 in the first table
Glass substrate 1 is delineated, to form the first delineation opening 321 on face 11.But, in cutting equipment cutting head 391 from
The edge 14 of glass substrate 1 can be collided during the outside inwardly feed in the edge 14 of glass substrate 1, and make cutting head 391
Occur cutting pressure unstable and vibrations, in turn result in edge 14 defect (as shown in Figure 1B) of glass substrate 1, cutting
391 the first delineation openings 321 formed in glass substrate 1 delineation are imperfect and the most scored deep or the most shallow (as schemed
Shown in 1B) and be full of cracks uncontrollably, approximately along predetermined cuts line development many defects such as (as shown in Figure 1A).
Refer to Fig. 2, in needing glass substrate 1 along the multiple different predetermined cuts lines mutually intersected delineation glass substrate
In the case of 1, conventional cutting method first along multiple first predetermined cuts lines 311 from edge 14 in first surface 11
Delineation glass substrate 1, to form multiple first delineation opening 321 (as illustrated by figures 1 a and 1b), now glass substrate is still
Non-disjunction；Thereafter along multiple the second predetermined cuts lines 312 intersected with the first predetermined cuts line 311 in the first identical table
Glass substrate 1 is delineated, to form multiple second delineation opening, and then along the first delineation opening 321 and the second quarter on face 11
Scratch mouthful disjunction glass substrate to form glass product.But, conventional cutting method is at delineation the second predetermined cuts line 312
Time will be through the first predetermined cuts line 311, therefore, cutting head had to travel across to be delineated along the first predetermined cuts line 311
The the first delineation opening 321 formed, this will make cutting head 391 make a reservation in first when delineating the second predetermined cuts line 312
The intersection point 313 of line of cut 311 and the second predetermined cuts line 312 occurs that cutting pressure is unstable, cutting head 391 clashes into the
Scratch mouth 321 a moment and shake, and make defect to occur near intersection point 313, delineates imperfect and chap uncontrollably
Develop and produce many defects and (be similar to the feelings that cutting head 391 shown in Figure 1A and 1B clashes into the edge 14 of glass substrate 1
Condition).
In view of this, how to avoid impingement phenomenon occurring and delineating imperfect in time delineating glass substrate, and avoid glass to produce
The defect of product produces, the problem that actually the technical field of the invention is urgently to be resolved hurrily.
Summary of the invention
One purpose of the present invention is to provide a kind of glass-cutting substrate form the cutting method of multiple glass product and cut
Cutting equipment, it can avoid impingement phenomenon occurring when delineating glass substrate and delineating imperfect, and decrease in disjunction and form glass
Defect is produced during glass product.Wherein, glass substrate includes first surface and the second surface relative with first surface.
For reaching above-mentioned purpose, cutting method of the present invention comprises the following steps: (a) along the first predetermined cuts line on first surface
Delineation glass substrate, to form the first delineation opening；B () delineates glass substrate along the second predetermined cuts line on second surface,
With formed second delineation opening, wherein when the second predetermined cuts line orthographic projection is to first surface, the second predetermined cuts line and
First predetermined cuts line intersects；And (c) is along the first delineation opening disjunction glass substrate, and along the second delineation opening disjunction glass
Substrate, to form glass product.
For reaching above-mentioned purpose, cutting equipment of the present invention includes the first cutting head, the second cutting head and break-up device.First cuts
Cut head in order to delineate glass substrate on first surface along the first predetermined cuts line, to form the first delineation opening.Second cuts
Cut head in order to delineate glass substrate on second surface along the second predetermined cuts line, to form the second delineation opening.When second
When predetermined cuts line orthographic projection is to first surface, the second predetermined cuts line and the first predetermined cuts line intersect.Break-up device is used
Along the first delineation opening on first surface and to delineate opening disjunction glass substrate along second on second surface, with
Form glass product.
Accompanying drawing explanation
Figure 1A is the conventional cutting method schematic perspective view from glass substrate edge delineation glass substrate；
Figure 1B is the conventional cutting method section signal along actual delineation opening from glass substrate edge delineation glass substrate
Figure；
Fig. 2 is the conventional cutting method schematic diagram along multiple crossing predetermined cuts lines delineation glass substrate；
Fig. 3 is cutting method of the present invention and the cutting equipment schematic diagram along multiple predetermined cuts lines delineation glass substrate；
Fig. 4 A to 4C is cutting method of the present invention and cutting equipment be initially formed the first initial notch after again delineation formed for the first quarter
Scratch the schematic diagram of mouth；And
Fig. 5 A to 5C is cutting method of the present invention and cutting equipment be initially formed the second initial notch after again delineation formed for the second quarter
Scratch the schematic diagram of mouth.
Detailed description of the invention
Refer to Fig. 3, glass substrate 1 includes first surface 11 and the second surface 12 relative with first surface 11.This
Invention glass-cutting substrate comprises the following steps with the cutting method forming multiple glass products.Step (a): make a reservation for along first
Line of cut 511 delineates glass substrate 1 on first surface 11, to form the first delineation opening 521 (as shown in Figure 4 C).
Step (b): delineate glass substrate 1 on second surface 12 along the second predetermined cuts line 512, opens forming the second delineation
522 (as shown in Figure 5 C) of mouth.Wherein, when the second predetermined cuts line 512 orthographic projection is to first surface 11, second is pre-
Projection line and the first predetermined cuts line 511 of determining line of cut 512 intersect.Step (c): along the first delineation opening 521 disjunction
Glass substrate 1, and along the second delineation opening 522 disjunction glass substrate 1, to form multiple glass product.Such as Fig. 3 institute
Showing, for general embodiments, when the second predetermined cuts line 512 orthographic projection is to first surface 11, second makes a reservation for cut
Secant 512 is vertical with the first predetermined cuts line 511, but this not necessarily constitutes the restriction to embodiment of the present invention.In
In step (c), the conventional method for dividing disjunction glass substrate 1 of such as curved glass substrate 1 grade can be used, multiple to be formed
Glass product.
Refer to Fig. 3.Step (a) can delineate glass substrate along multiple first predetermined cuts lines 511 on first surface 11
1, to form multiple first delineation opening 521.Step (b) is can be along multiple second predetermined cuts lines 512 in second surface
Glass substrate 1 is delineated, to form multiple second delineation opening 522, and when the second predetermined cuts line 512 is just thrown on 12
When shadow is to first surface 11, the projection line of multiple second predetermined cuts lines 512 and multiple first predetermined cuts line 511 phases
Hand over.
Whereby, the cutting method of the present invention can avoid conventional cutting method to traverse when delineating the second predetermined cuts line 312
The the first delineation opening 321 formed along the first predetermined cuts line 311 delineation, therefore the first predetermined cuts line 311 will not be betided
Clash at delineation with there is cutting pressure instability, cutting head 391 at the intersection point 313 of the second predetermined cuts line 312
Vibrations, cause delineation near intersection point 313 imperfect and be full of cracks develop uncontrollably and produces many defects.
The present invention can implement the most as follows: refer to Fig. 4 A to 4C, in step (a), delineates glass in starting
During substrate, it is all edges 14 1 segment distance leaving glass substrate 1, first predetermined cuts line on first surface 11
First initial position 531 as shown in Figure 4 A of 511 forms the first initial notch 541 as shown in Figure 4 C, the most such as
Glass substrate 1 is delineated from the first initial notch 541 along the first predetermined cuts line 511 on the be shown in first surface of Fig. 4 B 11
To form the first delineation opening 521 as shown in Figure 4 C.
Refer to Fig. 5 A to 5C, in step (b), in time starting the second surface 12 delineating glass substrate, be to leave glass
All edges 14 of glass substrate 1, on second surface 12 as shown in Figure 5A the second of second predetermined cuts line 512
Initial position 532 forms the second initial notch 542 as shown in Figure 5 C, and as shown in Figure 5 B on second surface 12
Glass substrate 1 is delineated to form second as shown in Figure 5 C along the second predetermined cuts line 512 from the second initial notch 542
Delineation opening 522.
Whereby, the cutting method of the present invention can avoid conventional cutting method inwardly to enter from outside, the edge 14 of glass substrate 1
Graduating with cutter cut a piece of glass substrate 1 time, cutting head 391 collides the edge 14 of glass substrate 1, and cutting head 391 is cut
Cut pressure transient and vibrations, in turn result in edge 14 defect of glass substrate 1, cutting head 391 delineates glass substrate 1
Imperfect and the many defects such as development uncontrollably that chap.
Refer to Fig. 4 C and 5C, when glass substrate 1 is for strengthening glass substrate, glass substrate 1 includes a tensile layer 101
And it is formed on tensile layer 101 and defines two compression layers 102 of first surface 11 and second surface 12.Tensile layer 101
There is stretching internal stress, and compression layer 102 has compression internal stress and has thickness t.Now, step (a) and step (b)
The first initial notch 541 formed and degree of depth d of the second initial notch 542 are less than the thickness t of compression layer 102, with
Anti-terminate in formation the first initial notch 541 and the second initial notch 542 after, be full of cracks extend in tensile layer 101 immediately into
And cause glass substrate 1 not divide or other defect along the first predetermined cuts line 511 or the second predetermined cuts line 512.Again
Person, degree of depth D of the first delineation opening 521 and the second delineation opening 522 is then more than the thickness t of compression layer 102, and portion
Divide and enter tensile layer 102, develop along the first delineation opening 521 and the second delineation opening 522 in order to be full of cracks during disjunction operation.
In step (a) and step (b), the cutting method of the present invention can be irradiated with laser, grinding stone grinds, diamond cutter delineation
Or cutting wheel is cut to the first initial notch 541 and the second initial notch 542, and can irradiate with laser, grind
Stone grinds, diamond cutter is delineated or cutting wheel is cut to the first delineation opening 521 and the second delineation opening 522.
Refer to Fig. 3, cutting equipment of the present invention includes first cutting head the 591, second cutting head 592 and break-up device (figure
Do not show, can use such as by making the conventional break-up devices such as its disjunction along predetermined cuts line curved glass substrate 1).The
One cutting head 591 is in order to delineate glass substrate 1 along the first predetermined cuts line 511 on first surface 11, to be formed such as figure
The first delineation opening 521 shown in 4C.Second cutting head 592 in order to along the second predetermined cuts line 512 in second surface
Glass substrate 1 is delineated, to form the second delineation opening 522 as shown in Figure 5 C on 12.Wherein, make a reservation for cut when second
When secant 512 orthographic projection is to first surface 11, the projection line of the second predetermined cuts line 512 and the first predetermined cuts line 511
Intersect.As it is shown on figure 3, in general when the second predetermined cuts line 512 orthographic projection is to first surface 11, second is pre-
Determine line of cut 512 vertical with the first predetermined cuts line 511.Break-up device is in order to along the first quarter on first surface 11
Scratch mouth 521 and along the second delineation opening 522 disjunction glass substrate 1 on second surface 11, to form glass product.
As it is shown on figure 3, the first cutting head 591 can be delineated on first surface 11 along multiple first predetermined cuts lines 511
Glass substrate 1, to form multiple first delineation opening 521, and the second cutting head 592 can be along multiple second predetermined cuts
Glass substrate 1 delineated on second surface 12 by line 512, to form multiple second delineation opening 522, and when multiple the
When two predetermined cuts line 512 orthographic projections are to first surface 11, the projection line of multiple second predetermined cuts lines 512 is with multiple
First predetermined cuts line 511 intersects.
Refer to Fig. 4 A to 4C, the first cutting head 591 can leave all edges 14 1 segment distance of glass substrate 1,
On first surface 11, first initial position 531 as shown in Figure 4 A of the first predetermined cuts line 511 is formed such as Fig. 4 C
The first shown initial notch 541, and as shown in Figure 4 B on first surface 11 from the first initial notch 541 along first
Predetermined cuts line 511 delineates glass substrate 1 to form the first delineation opening 521 as shown in Figure 4 C.
Refer to Fig. 5 A to 5C, the second cutting head 592 can leave all edges 14 1 segment distance of glass substrate 1,
On second surface 12, second initial position 532 as shown in Figure 5A of the second predetermined cuts line 512 is formed such as Fig. 5 C
Shown second initial notch 542, and pre-along second from the second initial notch 542 on second surface 12 as shown in Figure 5 B
Determine line of cut 512 and delineate glass substrate 1 to form the second delineation opening 522 as shown in Figure 5 C.
Refer to Fig. 4 C and 5C, when glass substrate 1 is for strengthening glass substrate, glass substrate 1 includes a tensile layer 101
And it is formed on tensile layer 101 and defines two compression layers 102 of first surface 11 and second surface 12.Tensile layer 101
There is stretching internal stress, and compression layer 102 has compression internal stress and has thickness t.Now, the first cutting head 591
And second cutting head 592 delineated formed the first initial notch 541 and the second initial notch 542 degree of depth d less than pressure
The thickness t of contracting layer 102, after preventing from forming the first initial notch 541 and the second initial notch 542, chaps in stretching
Layer 101 extends, in turn results in glass substrate 1 not along the first predetermined cuts line 511 or 512 points of the second predetermined cuts line
Split or other defect.Furthermore, the first cutting head 591 and the second cutting head 592 are delineated the first delineation opening 521 formed
And second degree of depth D of delineation opening 522 then more than the thickness t of compression layer 102, and be partially into tensile layer 102, with
Profit be full of cracks develops along the first delineation opening 521 and the second delineation opening 522.
First cutting head 591 of cutting equipment of the present invention and the second cutting head 592 can irradiate with laser, grinding stone grinds,
Diamond cutter delineation or cutting wheel are cut to the first initial notch 541 and the second initial notch 542, can also shine by laser
Penetrate, grinding stone grinds, diamond cutter is delineated or cutting wheel is cut to the first delineation opening 521 and the second delineation opening 522.
Whereby, the cutting method and the cutting equipment that use the present invention can avoid conventional cutting method, when cutting, cutter occur
Head or laser are first-class because crossing the opening previously delineated, and produce and the phenomenon such as clash into, focus point is inconsistent and cause cutting pressure
Power or put on the energy instability of substrate, vibrations etc., and then produce and delineate imperfect and many defects of glass product.
Claims (16)
1. a cutting method for glass-cutting substrate, in order to form multiple glass product, wherein said glass substrate includes
One surface and the second surface relative with described first surface, described cutting method comprises the following steps:
A () delineates described glass substrate along the first predetermined cuts line on described first surface, open forming the first delineation
Mouthful；
B () delineates described glass substrate along the second predetermined cuts line on described second surface, open forming the second delineation
Mouthful, wherein when described second predetermined cuts line orthographic projection is to described first surface, described second predetermined cuts line
Projection line intersects with described first predetermined cuts line；And
(c) along glass substrate described in the described first delineation opening disjunction on described first surface, and along in described the
Glass substrate described in described second delineation opening disjunction on two surfaces, to form described glass product.
Cutting method the most according to claim 1, wherein:
Step (a) is to leave all edges of described glass substrate, described first predetermined cuts on described first surface
First initial position of line forms the first initial notch, and from described first initial notch edge on described first surface
Described first predetermined cuts line delineates described glass substrate to form described first delineation opening；And
Step (b) is to leave all edges of described glass substrate, described second predetermined cuts on described second surface
Second initial position of line forms the second initial notch, and from described second initial notch edge on described second surface
Described second predetermined cuts line delineates described glass substrate to form described second delineation opening.
Cutting method the most according to claim 2, wherein said glass substrate is strengthening glass substrate, and includes drawing
Stretch layer and be formed on described tensile layer and define two compression layers of described first surface and described second surface, institute
Stating tensile layer and have stretching internal stress, described compression layer has compression internal stress and has thickness, and described first
The degree of depth of initial notch and described second initial notch is less than the described thickness of described compression layer.
Cutting method the most according to claim 3, wherein said first delineation opening and described second delineates the deep of opening
Degree is more than the described thickness of described compression layer, and is partially into described tensile layer.
Cutting method the most according to claim 2, wherein when described second predetermined cuts line orthographic projection is to described first table
During face, described second predetermined cuts line is vertical with described first predetermined cuts line.
Cutting method the most according to claim 2, wherein step (a) is in described along multiple described first predetermined cuts lines
Delineating described glass substrate on first surface, to form multiple described first delineation opening, step (b) is along multiple
Described glass substrate delineated on described second surface by described second predetermined cuts line, to form multiple described second quarter
Scratch mouth, and when described second predetermined cuts line orthographic projection is to described first surface, described second predetermined cuts
The projection line of line intersects with described first predetermined cuts line.
Cutting method the most according to claim 2, wherein step (a) and step (b) are to grind with laser irradiation, grinding stone
The delineation of mill, diamond cutter or cutting wheel are cut to described first initial notch and described second initial notch.
Cutting method the most according to claim 2, wherein step (a) and step (b) are to grind with laser irradiation, grinding stone
The delineation of mill, diamond cutter or cutting wheel are cut to described first delineation opening and described second delineation opening.
9. a cutting equipment for glass-cutting substrate, it is in order to form multiple glass product, and wherein said glass substrate includes
First surface and the second surface relative with described first surface, described cutting equipment includes:
First cutting head, in order to delineate described glass substrate along the first predetermined cuts line, with shape on described first surface
Become the first delineation opening；
Second cutting head, in order to delineate described glass substrate along the second predetermined cuts line, with shape on described second surface
Become the second delineation opening, wherein when described second predetermined cuts line orthographic projection is to described first surface, described second
The projection line of predetermined cuts line intersects with described first predetermined cuts line；And
Break-up device, in order to along the described first delineation opening on described first surface and along on described second surface
Described second delineation opening disjunction described in glass substrate, to form described glass product.
Cutting equipment the most according to claim 9, wherein:
Described first cutting head leaves all edges of described glass substrate, and on described first surface, described first makes a reservation for
First initial position of line of cut forms the first initial notch, and initially lacks from described first on described first surface
First predetermined cuts line described in opening's edge delineates described glass substrate to form described first delineation opening；And
Described second cutting head leaves all edges of described glass substrate, and on described second surface, described second makes a reservation for
Second initial position of line of cut forms the second initial notch, and initially lacks from described second on described second surface
Second predetermined cuts line described in opening's edge delineates described glass substrate to form described second delineation opening.
11. cutting equipments according to claim 10, wherein said glass substrate is strengthening glass substrate, and includes one
Tensile layer and be formed on described tensile layer and define two compression layers of described first surface and described second surface,
Described tensile layer has stretching internal stress, and described compression layer has a compression internal stress have thickness, and described the
The degree of depth of one initial notch and described second initial notch is less than the described thickness of described compression layer.
12. cutting equipments according to claim 11, wherein said first delineation opening and described second delineation opening
The degree of depth is more than the described thickness of described compression layer, and is partially into described tensile layer.
13. cutting equipments according to claim 10, wherein when described second predetermined cuts line orthographic projection is to described first
During surface, described second predetermined cuts line is vertical with described first predetermined cuts line.
14. cutting equipments according to claim 10, wherein said first cutting head is along multiple described first predetermined cuts
Described glass substrate delineated on described first surface by line, to form multiple described first delineation opening, and described second
Cutting head delineates described glass substrate along multiple described second predetermined cuts lines on described second surface, many to be formed
Individual described second delineation opening, and when described second predetermined cuts line orthographic projection is to described first surface, described
The projection line of the second predetermined cuts line intersects with described first predetermined cuts line.
15. cutting equipments according to claim 10, wherein said first cutting head and described second cutting head are with laser
Irradiate, grinding stone grinds, diamond cutter is delineated or cutting wheel is cut to described first initial notch and described second
Initial notch.
16. cutting equipments according to claim 10, wherein said first cutting head and described second cutting head are to swash
Light irradiates, grinding stone grinds, diamond cutter delineation or cutting wheel are cut to described first delineation opening and described the
Two delineation openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510296846.9A CN106277733A (en) | 2015-06-03 | 2015-06-03 | Cutting method and cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510296846.9A CN106277733A (en) | 2015-06-03 | 2015-06-03 | Cutting method and cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106277733A true CN106277733A (en) | 2017-01-04 |
Family
ID=57656216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510296846.9A Withdrawn CN106277733A (en) | 2015-06-03 | 2015-06-03 | Cutting method and cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106277733A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599752A (en) * | 2019-02-20 | 2020-08-28 | 中芯国际集成电路制造(上海)有限公司 | Cutting method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101525211A (en) * | 2008-03-05 | 2009-09-09 | 细美事有限公司 | Marking apparatus and apparatus and method for cutting substrate by same |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
| CN102531369A (en) * | 2010-12-13 | 2012-07-04 | 三星钻石工业股份有限公司 | Breaking method for bonding substrate |
| CN102557421A (en) * | 2010-11-05 | 2012-07-11 | 三星钻石工业股份有限公司 | Method for scribing laminated substrate |
| KR20140049169A (en) * | 2012-10-16 | 2014-04-25 | 동우 화인켐 주식회사 | Method of cutting strengthened glass |
| TW201446675A (en) * | 2013-06-10 | 2014-12-16 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Cutting method and cutting apparatus |
-
2015
- 2015-06-03 CN CN201510296846.9A patent/CN106277733A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101525211A (en) * | 2008-03-05 | 2009-09-09 | 细美事有限公司 | Marking apparatus and apparatus and method for cutting substrate by same |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
| CN102557421A (en) * | 2010-11-05 | 2012-07-11 | 三星钻石工业股份有限公司 | Method for scribing laminated substrate |
| CN102531369A (en) * | 2010-12-13 | 2012-07-04 | 三星钻石工业股份有限公司 | Breaking method for bonding substrate |
| KR20140049169A (en) * | 2012-10-16 | 2014-04-25 | 동우 화인켐 주식회사 | Method of cutting strengthened glass |
| TW201446675A (en) * | 2013-06-10 | 2014-12-16 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Cutting method and cutting apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599752A (en) * | 2019-02-20 | 2020-08-28 | 中芯国际集成电路制造(上海)有限公司 | Cutting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6906538B2 (en) | A method for processing the end face of a glass element, and the glass element processed by that method. | |
| JP6101468B2 (en) | Wafer processing method | |
| EP3274306B1 (en) | Laser cutting and processing of display glass compositions | |
| TWI278027B (en) | Substrate slicing method | |
| US10941069B2 (en) | Processing a plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer | |
| JP6778883B2 (en) | Manufacturing method of 3D shaped object | |
| JP5991860B2 (en) | Glass substrate processing method | |
| US9583391B2 (en) | Wafer processing method | |
| TWI676604B (en) | Method of scribing thick plate glass, and scribing wheel for scribing thick plate glass | |
| KR20180016048A (en) | Method for dividing glass substrate including pre-cracking process | |
| TWI644873B (en) | Scoring wheel and scoring device | |
| US20140094019A1 (en) | Wafer processing method | |
| CN108067746A (en) | The processing method of substrate | |
| KR20190016527A (en) | Method for dividing round planar plate formed of brittle material into a plurality of individual plates by using laser | |
| CN106277733A (en) | Cutting method and cutting equipment | |
| JP2016003181A (en) | Scribing method and scribing device of brittle material substrate | |
| CN103776669B (en) | The preparation method of TEM sample | |
| JP6598702B2 (en) | Wafer processing method | |
| JP5833968B2 (en) | Glass substrate cutting method | |
| JPH0434931A (en) | Semiconductor wafer and processing method therefor | |
| JP5416381B2 (en) | Method for dividing brittle material substrate | |
| KR20130101763A (en) | Window glass manufacturing methods for mobile devices | |
| DE102020202005A1 (en) | WAFER PROCESSING PROCESS | |
| CN107017336B (en) | Processing method for forming quadrangular prism | |
| TW201315693A (en) | Method for cutting a strengthened glass substrate accompanying control of compressive stress |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170104 |