CN108067746A - The processing method of substrate - Google Patents

The processing method of substrate Download PDF

Info

Publication number
CN108067746A
CN108067746A CN201711120517.4A CN201711120517A CN108067746A CN 108067746 A CN108067746 A CN 108067746A CN 201711120517 A CN201711120517 A CN 201711120517A CN 108067746 A CN108067746 A CN 108067746A
Authority
CN
China
Prior art keywords
substrate
layer
mark
glass substrate
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711120517.4A
Other languages
Chinese (zh)
Other versions
CN108067746B (en
Inventor
市川健
市川健一
立石薰
伊藤靖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Mechanics Ltd filed Critical Via Mechanics Ltd
Publication of CN108067746A publication Critical patent/CN108067746A/en
Application granted granted Critical
Publication of CN108067746B publication Critical patent/CN108067746B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/04—Devices, e.g. scribers, for marking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/32—After-treatment
    • C03C2218/328—Partly or completely removing a coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention relates to the processing method of substrate, it is intended that when using glass substrate as the substrate of constituent material positive and negative formed as target mark when, make to be not likely to produce crackle on glass substrate.The processing method of the substrate of the present invention is for including the substrate of first layer and the second layer, the mark as target is formed on each second layer, the first layer is made of glass substrate, the second layer is separately positioned on the obverse and reverse of the first layer, and material is different from the first layer, it is characterized in that, the second layer can be processed from the one side irradiation of the substrate but cannot process the laser of the energy density of the first layer, so as to be formed simultaneously the mark at the position corresponding positive and negative of the substrate.

Description

The processing method of substrate
Technical field
The present invention relates to form the base as the mark of target in the positive and negative using glass substrate as the substrate of constituent material The processing method of plate.
Background technology
Resin bed is set by pasting resin sheet etc. in the positive and negative of glass substrate, is wanted sometimes on the resin layer Formation is as in processing for mark as the alignment mark of contraposition during substrate.
On the other hand, as the method that alignment mark is formed on substrate, existing it has been known that there is by public in such as patent document 1 Machinery processing apparatus as the drill bit opened is come the method that carries out.When being formed by this method on the resin bed of aforesaid substrate pair Fiducial mark clocks, there are the following problems point：At alignment mark forming position, it can be cracked on glass substrate.
Patent document 1：Japanese Unexamined Patent Publication 2007-7776 publications.
The content of the invention
Therefore, it is an object of the present invention to when using glass substrate as the substrate of constituent material positive and negative formed as During the mark of target, make to be not likely to produce crackle on glass substrate.
The processing method of representative substrate disclosed herein is for including the substrate of first layer and the second layer, each The mark as target is formed on a second layer, the first layer is made of glass substrate, and the second layer is set respectively In the obverse and reverse of the first layer, and the material of the second layer is different from the material of the first layer, the substrate Processing method be characterized in that, can process the second layer from the irradiation of the one side of the substrate but can not process described the The laser of one layer of energy density, so as to be formed simultaneously the mark at the position corresponding positive and negative of the substrate.
According to the present invention, when using glass substrate as the substrate of constituent material positive and negative formed as target mark When, make to be not likely to produce crackle on glass substrate, and can simultaneously positive and negative each on form pattern as target.
Description of the drawings
Fig. 1 is the sectional view for showing the state after according to embodiments of the present invention 1 processing.
Fig. 2 is for illustrating the figure of the embodiment of the present invention 1, and (a) of Fig. 2 is the plan view of the workpiece before processing, Fig. 2's (b) be Fig. 2 (a) Section A-A figure.
Fig. 3 is the plan view for showing the state after according to embodiments of the present invention 2 processing.
Fig. 4 is for illustrating the figure of the embodiment of the present invention 2, and (a) of Fig. 4 is the plan view of the workpiece before processing, Fig. 4's (b) be work in-process way Fig. 4 (a) section B-B figure.
Reference sign
1st, 21 substrate；2nd, 22 workbench；3rd, 23 glass substrate；4th, 5,24,25 resin sheet；The formation position of 6 alignment marks It puts；7th, 27 laser via；8th, 9 alignment mark；10th, 20UV laser；The forming position that 26 severings are marked with notch；28th, 29 slot；30 Severing is marked with notch.
Specific embodiment
Embodiment
In the following, using attached drawing, embodiments of the present invention will be described.
First, to laser is used to form the embodiment of alignment mark on the resin bed of positive and negative for being arranged at glass substrate 1 illustrates, but in the following description, at multiple, the same reference numbers in the drawings refer to identical things.
Fig. 2 is for illustrating the figure of the embodiment of the present invention 1, and (a) of Fig. 2 is the plan view of the workpiece before processing, Fig. 2's (b) be Fig. 2 (a) Section A-A figure.In fig. 2,1 is the substrate as workpiece, and 2 be for loading the workbench of substrate 13 It is the glass substrate as the constituent material of substrate 1,4 be the positive resin sheet for being attached to glass substrate 3, and 5 be to be attached to glass The resin sheet of the reverse side of substrate 3.At this time it is also possible to by the other methods such as coating processing replace pasting resin sheets 4,5 come Resin bed is set.6 represent the forming position of circular alignment mark to be formed on resin sheet 4, with alignment mark The big laser via of the diameter of alignment mark of the diameter than being formed is provided on the position of 6 corresponding workbench 2 of forming position 7, for avoiding the laser irradiation to workbench 2.
In the state of (a), (b) in Fig. 2, as shown in arrow 10, to the formation position of each alignment mark of resin sheet 4 6 are put successively from upper irradiation UV laser.The UV laser such as energy density is set to 20mJ/mm2, it is that can process resin but cannot process The energy of glass.
Through positive resin sheet 4 UV laser do not damage 3 ground of glass substrate through glass substrate 3 and reach reverse side Resin sheet 5.Therefore, Fig. 1 shows the sectional view in the processing metacoxal plate 1, completes the resin at the forming position 6 of alignment mark The part of sheet material 4 and 5 is removed and is respectively formed the substrate 1 of circular alignment mark 8,9.
At this point, even if the influence of stimulated light processing characteristics and the diameter of the alignment mark 9 of 5 side of resin sheet compares resin sheet The center that the diameter of the alignment mark 8 of 4 sides is slightly smaller but mutual is located at upper and lower corresponding position each other, therefore as alignment mark It has no problem.
According to the above embodiments 1, the influence to glass substrate 3 can be reduced, and can be on resin sheet 4 and 5 Alignment mark 8 and 9 is formed simultaneously, and its center is located at correct correspondence position up and down.
It should be noted that in above embodiment, if can drill out big straight the drilling of minor diameter is repeated The irradiation of UV laser is carried out in perforate (the ト レ パ ニ Application グ) processing in the hole in footpath, then can increase the diameter of alignment mark 8,9.
Then, severing is carried out with by the base to laser is used to be formed on the resin bed of positive and negative for being arranged at glass substrate Plate is divided into the embodiment 2 of severing notch mark during the small substrate of multiple rectangles to illustrate.The severing notch marks Resin bed, which is attached on the blade of guillotine, in order to prevent hinders severing and removes the mark of the cut out portion of resin bed.
Fig. 4 is for illustrating the figure of the embodiment of the present invention 2, and (a) of Fig. 4 is the plan view of the workpiece before processing, Fig. 4's (b) be work in-process way Fig. 4 (a) section B-B figure.In Fig. 4,21 be the substrate as workpiece, and 22 be for loading The workbench of substrate 21,23 be the glass substrate as the constituent material of substrate 21, and 24 be attached to glass substrate 23 positive Resin sheet, 25 be the resin sheet for the reverse side for being attached to glass substrate 23.At this time it is also possible to pass through other methods such as coating processing Instead of pasting resin sheet 24,25, resin bed is set.26 severings for representing to be formed on resin sheet 24 are marked with notch Forming position, on the position of the 26 corresponding workbench 22 of forming position marked with severing with notch being provided with area compares institute The severing of the formation big laser via 27 of the area that notch marks, for avoiding the laser irradiation to workbench 22.
It should be noted that in order to which substrate 21 is divided into four small substrates of rectangle, the severing in this is marked with notch It is crosswise but it is also possible to be other shapes.
In the state of (a), (b) in Fig. 4, as shown in arrow 20, while the forming position marked on to severing with notch 26 irradiation UV laser, while relatively moving workbench 22, so that UV laser is moved along the direction of arrow 31.The UV laser is with implementing The same during example 1, energy density is set to 20mJ/mm2, it is the energy that can be processed resin but glass cannot be processed.
UV laser through positive resin sheet 24 does not damage 23 ground of glass substrate and is reached anti-through glass substrate 23 The resin sheet 25 in face.Therefore, the part 28,29 of the resin sheet 24 and 25 after UV laser passes through is removed, and after processing, is completed The substrate 21 of slot 28,29 is formed at the forming position 26 marked in the severing of resin sheet 24 and 25 with notch.By substrate 21 Positive one side be shown in Fig. 3,30 be that the severing being made of slot 28 is marked with notch, is also formed on the correspondence position of reverse side There is the severing being made of slot 29 to be marked with notch.
At this point, even if the influence of stimulated light processing characteristics and make the slot 29 that the severing of 25 side of resin sheet marked with notch Width is more slightly smaller with the width of the slot 28 of notch mark 30 than the severing of 24 side of resin sheet, if but in the width of the blade with guillotine There is more than needed the width of slot, then in the relation of degree since mutual center is located at each other on upper and lower corresponding position, so as to as sanction It is disconnected also to be had no problem with notch mark.
According to the above embodiments 2, the influence to glass substrate 23 can be reduced, and can be same on resin sheet 24 and 25 When form severing and marked with notch, and its center is located at correct correspondence position up and down.
More than, although the description of laser is used alignment mark is formed on the resin bed of positive and negative for being arranged at glass substrate Embodiment when being marked with severing with notch, but it will be apparent that the present invention can also be applied to be arranged at glass substrate just The situation of other marks is formed on the resin bed of reverse side.

Claims (4)

1. a kind of processing method of substrate for including the substrate of first layer and the second layer, is formed on each second layer As the mark of target, the first layer is made of glass substrate, and the second layer is separately positioned on the front of the first layer And reverse side, and the material of the second layer is different from the material of the first layer, and the feature of the processing method of the substrate exists In,
The second layer can be processed from the one side irradiation of the substrate but can not process the energy density of the first layer Laser, so as to be formed simultaneously the mark at the position corresponding positive and negative of the substrate.
2. the processing method of substrate according to claim 1, which is characterized in that
The mark is for the alignment mark of contraposition when processing the substrate.
3. the processing method of substrate according to claim 2, which is characterized in that
The irradiation of the laser is carried out in perforate processing.
4. the processing method of substrate according to claim 1, which is characterized in that
Notch mark when the mark is substrate described in severing.
CN201711120517.4A 2016-11-15 2017-11-13 Method for processing substrate Active CN108067746B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016221994 2016-11-15
JP2016-221994 2016-11-15
JP2017171782A JP6986393B2 (en) 2016-11-15 2017-09-07 Substrate processing method
JP2017-171782 2017-09-07

Publications (2)

Publication Number Publication Date
CN108067746A true CN108067746A (en) 2018-05-25
CN108067746B CN108067746B (en) 2022-06-03

Family

ID=62236780

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711120517.4A Active CN108067746B (en) 2016-11-15 2017-11-13 Method for processing substrate

Country Status (4)

Country Link
JP (1) JP6986393B2 (en)
KR (1) KR102345170B1 (en)
CN (1) CN108067746B (en)
TW (1) TWI794192B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110482851A (en) * 2019-09-03 2019-11-22 拓米(成都)应用技术研究院有限公司 Grid is covered black spray finishing jig and is covered the cutting process method of black spray finishing jig based on grid
CN114425655A (en) * 2020-10-29 2022-05-03 大族激光科技产业集团股份有限公司 Laser marking method and laser marking system for brittle material

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110202538B (en) * 2019-06-24 2023-07-21 南京万物生长孵化器管理有限公司 Marking tool for laminated glass production
WO2021025052A1 (en) * 2019-08-07 2021-02-11 株式会社カネカ Large-size thin-film deposition substrate and method for manufacturing same, segmented thin-film deposition substrate and method for manufacturing same, and production management method and production management system for segmented thin-film deposition substrate
CN113620585B (en) * 2021-08-26 2023-03-14 宁波舜宇奥来技术有限公司 Method for picosecond laser cutting of glass

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008140130A (en) * 2006-12-01 2008-06-19 Alps Electric Co Ltd Input device and method for manufacturing the same
JP2009063692A (en) * 2007-09-05 2009-03-26 Seiko Epson Corp Method and device for manufacturing electro-optical device
CN102543868A (en) * 2010-12-10 2012-07-04 台湾积体电路制造股份有限公司 Method of dicing semiconductor structure
CN102815863A (en) * 2012-10-17 2012-12-12 黄石瑞视光电技术股份有限公司 Film-bearing cutting method of touch screen ITO (indium tin oxide) glass
CN102955201A (en) * 2012-11-28 2013-03-06 索尔思光电（成都）有限公司 Optoisolator with expanded beam buffer area and manufacturing method thereof
JP2013109460A (en) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd Transparent wiring sheet
CN106064275A (en) * 2015-04-22 2016-11-02 三星显示有限公司 The method of cutting substrate and the method for manufacture display device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1635390B1 (en) * 2002-03-12 2011-07-27 Hamamatsu Photonics K. K. Substrate dividing method
JP4048873B2 (en) 2002-08-08 2008-02-20 松下電器産業株式会社 Positioning method
JP2007007776A (en) 2005-06-30 2007-01-18 Alps Engineering Co Ltd Alignment mark forming method
JP5332238B2 (en) * 2007-03-29 2013-11-06 三星ダイヤモンド工業株式会社 Laser processing equipment
JP2011098381A (en) * 2009-11-06 2011-05-19 Sumitomo Bakelite Co Ltd Glass fiber reinforced resin film and cutting method thereof, and glass fiber reinforced resin panel and manufacturing method thereof
KR20120096699A (en) * 2011-02-23 2012-08-31 스템코 주식회사 Method for drilling to form via hole in flexible metal clad laminate by using uv laser
US20130005139A1 (en) * 2011-06-30 2013-01-03 Guardian Industries Corp. Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same
US9911550B2 (en) * 2012-03-05 2018-03-06 Apple Inc. Touch sensitive device with multiple ablation fluence values
TW201339111A (en) * 2012-03-29 2013-10-01 Global Display Co Ltd Method for cutting tempered glass
CN103567642B (en) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 Sapphire cutter sweep
GB2509985A (en) * 2013-01-22 2014-07-23 M Solv Ltd Method of forming patterns on coatings on opposite sides of a transparent substrate
KR102107766B1 (en) * 2013-07-09 2020-05-27 삼성디스플레이 주식회사 Sealing apparatus and method for fabricating a display device using the same
TWM479450U (en) * 2013-11-21 2014-06-01 Emerging Display Tech Corp Bilayer single-board type touch panel to resist laser etching damage
US20150305166A1 (en) * 2014-04-22 2015-10-22 Carestream Health, Inc. Laser patterning of dual sided transparent conductive films
JP2018529527A (en) * 2015-10-07 2018-10-11 コーニング インコーポレイテッド Method of pre-processing coated substrate to be laser cut with laser

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008140130A (en) * 2006-12-01 2008-06-19 Alps Electric Co Ltd Input device and method for manufacturing the same
JP2009063692A (en) * 2007-09-05 2009-03-26 Seiko Epson Corp Method and device for manufacturing electro-optical device
CN102543868A (en) * 2010-12-10 2012-07-04 台湾积体电路制造股份有限公司 Method of dicing semiconductor structure
JP2013109460A (en) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd Transparent wiring sheet
CN102815863A (en) * 2012-10-17 2012-12-12 黄石瑞视光电技术股份有限公司 Film-bearing cutting method of touch screen ITO (indium tin oxide) glass
CN102955201A (en) * 2012-11-28 2013-03-06 索尔思光电（成都）有限公司 Optoisolator with expanded beam buffer area and manufacturing method thereof
CN106064275A (en) * 2015-04-22 2016-11-02 三星显示有限公司 The method of cutting substrate and the method for manufacture display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110482851A (en) * 2019-09-03 2019-11-22 拓米(成都)应用技术研究院有限公司 Grid is covered black spray finishing jig and is covered the cutting process method of black spray finishing jig based on grid
CN114425655A (en) * 2020-10-29 2022-05-03 大族激光科技产业集团股份有限公司 Laser marking method and laser marking system for brittle material

Also Published As

Publication number Publication date
JP2018083228A (en) 2018-05-31
KR20180054442A (en) 2018-05-24
TW201819086A (en) 2018-06-01
TWI794192B (en) 2023-03-01
CN108067746B (en) 2022-06-03
KR102345170B1 (en) 2021-12-30
JP6986393B2 (en) 2021-12-22

Similar Documents

Publication Publication Date Title
CN108067746A (en) The processing method of substrate
US9640486B2 (en) Ingot marking for solar cell determination
US7134942B2 (en) Wafer processing method
US9589901B2 (en) Semiconductor wafers including indications of crystal orientation and methods of forming the same
US20030148057A1 (en) Method for producing small, sheet glass plates and larger sheet glass plates as semifinished products for producing the former
US20210060549A1 (en) Droplet actuator fabrication apparatus, systems, and related methods
JP2005086161A (en) Method of working wafer
CN106793587A (en) A kind of rigid-flex combined board with blind slot and preparation method thereof
JP2019056182A (en) Method for manufacturing vapor deposition mask and vapor deposition mask
DE102018205548A1 (en) DIVISIONAL PROCEDURE FOR ONE WORKPIECE
US10414685B2 (en) Substrate processing method
CN113103071A (en) Display panel and edging method thereof
JP2004276386A (en) Splitting ceramic substrate and its manufacturing method
TW202102451A (en) Glass substrate cutting method and light guide plate manufacturing method
CN106992138A (en) Tool and the processing method for having used tool
KR20120009405A (en) Method for dividing round planar plate formed of brittle material into a plurality of individual plates by using laser
KR102102878B1 (en) Method for in-line glass process
CN104409329B (en) Method for forming transparent base material with groove and method for forming element substrate
CN110355823B (en) Method for producing a die-cutting tool
CN104952793A (en) Breaking method for silicon substrate
CN108098165A (en) Laser marking method
KR101726573B1 (en) Multilayer bonding member manufacturing method using laser cutting
KR101370812B1 (en) Method for marking a wafer alignment key
JP2021031372A (en) Dividing method and notch formation method
JPS61195791A (en) Carving method by laser beam

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant