JP2018083228A - Processing method of substrate - Google Patents

Processing method of substrate Download PDF

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Publication number
JP2018083228A
JP2018083228A JP2017171782A JP2017171782A JP2018083228A JP 2018083228 A JP2018083228 A JP 2018083228A JP 2017171782 A JP2017171782 A JP 2017171782A JP 2017171782 A JP2017171782 A JP 2017171782A JP 2018083228 A JP2018083228 A JP 2018083228A
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Prior art keywords
substrate
mark
layer
glass substrate
cutting
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JP6986393B2 (en
Inventor
市川　健一
Kenichi Ichikawa
健一 市川
薫 立石
Kaori Tateishi
薫 立石
伊藤　靖
Yasushi Ito
靖 伊藤
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Via Mechanics Ltd
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Via Mechanics Ltd
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Priority to US15/793,754 priority Critical patent/US10414685B2/en
Priority to KR1020170144718A priority patent/KR102345170B1/en
Priority to CN201711120517.4A priority patent/CN108067746B/en
Priority to TW106139374A priority patent/TWI794192B/en
Publication of JP2018083228A publication Critical patent/JP2018083228A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/04—Devices, e.g. scribers, for marking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/32—After-treatment
    • C03C2218/328—Partly or completely removing a coating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent, as much as possible, generation of a crack in a glass substrate, when forming a mark on front/rear surfaces of the substrate using the glass substrate as a component.SOLUTION: In a processing method of a substrate for forming a mark on each of second layers, to the substrate containing a first layer comprising a glass substrate, and the second layer made of a material different from the first layer and provided on each of a front surface and a rear surface of the first layer, a laser having energy density capable of processing the second layer and incapable of processing the first layer is irradiated from one surface of the substrate, to thereby form simultaneously each mark on each spot corresponding to the front and the rear of the substrate.SELECTED DRAWING: Figure 1

Description

本発明は、ガラス基板を構成材料とする基板の表裏面に目的とするマークを形成する基板の加工方法に関するものである。   The present invention relates to a substrate processing method for forming a target mark on the front and back surfaces of a substrate having a glass substrate as a constituent material.

ガラス基板の表裏面に樹脂シートを貼ること等によって樹脂層が設けられており、このような基板の加工の際の位置合わせに用いるアライメントマークの如きマークを樹脂層に形成したい場合がある。
一方、アライメントマークを基板に形成する方法として、従来、特許文献１に開示されているようなドリルの如き機械加工手段によって行う方法が知られている。この方法により、上記基板の樹脂層にアライメントマークを形成する場合、アライメントマーク形成位置で、ガラス基板にクラックが発生するという問題点がある。 A resin layer is provided by sticking a resin sheet on the front and back surfaces of a glass substrate, and in some cases, a mark such as an alignment mark used for alignment during processing of such a substrate is desired to be formed on the resin layer.
On the other hand, as a method for forming alignment marks on a substrate, a method performed by a machining means such as a drill as disclosed in Patent Document 1 is conventionally known. When an alignment mark is formed on the resin layer of the substrate by this method, there is a problem that a crack is generated in the glass substrate at the alignment mark formation position.

特開2007-7776号公報JP 2007-7776 A

そこで本発明は、ガラス基板を構成材料とする基板の表裏面に目的とするマークを形成する場合において、ガラス基板においてクラックを発生しにくくすることを目的とする。   Therefore, an object of the present invention is to make it difficult for cracks to occur in the glass substrate when the target mark is formed on the front and back surfaces of the substrate made of the glass substrate.

本願において開示される代表的な基板の加工方法は、ガラス基板から成る第一の層と当該第一層の表面と裏面の各々に設けられた前記第一層とは異なる材質の第二の層を含む基板に対し、前記第二層の各々に目的とするマークを形成する基板の加工方法において、前記第二層は加工できるが前記第一層は加工できないエネルギー密度のレーザを前記基板の一方の面から照射し、前記基板の表裏対応する箇所に前記マークを同時に形成することを特徴とする。   A representative substrate processing method disclosed in the present application includes a first layer made of a glass substrate, and a second layer made of a material different from the first layer provided on each of the front and back surfaces of the first layer. In the substrate processing method for forming a target mark on each of the second layers, a laser having an energy density that can process the second layer but cannot process the first layer is applied to one of the substrates. The mark is simultaneously formed at locations corresponding to the front and back of the substrate.

本発明によれば、ガラス基板を構成材料とする基板の表裏面に目的とするマークを形成する場合において、ガラス基板においてクラックが発生しにくくなるとともに、表裏面の各々に目的とするパターンを同時に形成することができる。   According to the present invention, when a target mark is formed on the front and back surfaces of a substrate made of a glass substrate, cracks are less likely to occur in the glass substrate, and a target pattern is simultaneously formed on each of the front and back surfaces. Can be formed.

本発明の実施例１による加工後の状態を示す断面図である。It is sectional drawing which shows the state after the process by Example 1 of this invention. 本発明の実施例１を説明するための図で、（ａ）は加工前のワークの平面図、（ｂ）は（ａ）のＡ−Ａ断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating Example 1 of this invention, (a) is a top view of the workpiece | work before a process, (b) is AA sectional drawing of (a). 本発明の実施例２による加工後の状態を示す平面図である。It is a top view which shows the state after the process by Example 2 of this invention. 本発明の実施例２を説明するための図で、（ａ）は加工前のワークの平面図、（ｂ）は加工途中における（ａ）のＢ−Ｂ断面図である。It is a figure for demonstrating Example 2 of this invention, (a) is a top view of the workpiece | work before a process, (b) is BB sectional drawing of (a) in the middle of a process.

以下、本発明の実施の形態について図面を用いて説明する。
先ず、ガラス基板の表裏面に設けられた樹脂層にレーザを用いてアライメントマークを形成する実施例１について説明するが、以下の説明においては、複数の図で同じ参照番号のものは同じものを示すものとする。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, Example 1 in which alignment marks are formed on a resin layer provided on the front and back surfaces of a glass substrate by using a laser will be described. In the following description, the same reference numerals are used for the plurality of drawings. Shall be shown.

図２は、本発明の実施例１を説明するための図で、（ａ）は加工前のワークの平面図、（ｂ）は（ａ）のＡ−Ａ断面図である。図２において、１はワークとなる基板、２は基板１を載置するためのテーブル、３は基板１の構成材となるガラス基板、４はガラス基板３の表面に貼られた樹脂シート、５はガラス基板３の裏面に貼られた樹脂シートである。この場合、樹脂シート４、５が貼られる代わりに、コーティング処理等の他の方法によって樹脂層が設けられていてもよい。６は樹脂シート４に形成すべき円形のアライメントマークの形成位置を示し、、アライメントマーク形成位置６に対応するテーブル２の位置には、形成するアライメントマークの径より大きい径のレーザ通し孔７が、テーブル２へのレーザ照射を避けるために設けられている。   2A and 2B are diagrams for explaining the first embodiment of the present invention, in which FIG. 2A is a plan view of a workpiece before processing, and FIG. 2B is a cross-sectional view taken along line AA in FIG. In FIG. 2, 1 is a substrate to be a workpiece, 2 is a table for placing the substrate 1, 3 is a glass substrate which is a constituent material of the substrate 1, 4 is a resin sheet affixed to the surface of the glass substrate 3, 5 Is a resin sheet affixed to the back surface of the glass substrate 3. In this case, the resin layer may be provided by other methods such as a coating process instead of attaching the resin sheets 4 and 5. Reference numeral 6 denotes a formation position of a circular alignment mark to be formed on the resin sheet 4, and a laser through hole 7 having a diameter larger than the diameter of the alignment mark to be formed is provided at the position of the table 2 corresponding to the alignment mark formation position 6. The table 2 is provided in order to avoid laser irradiation.

図２（ａ）、（ｂ）の状態において、矢印１０に示すように、樹脂シート４のアライメントマーク形成位置６の各々に順次上からＵＶレーザを照射する。このＵＶレーザは、例えばエネルギー密度を２０ｍＪ／ｍｍ２とし、樹脂は加工できるがガラスは加工できないエネルギーとなっている。
表面の樹脂シート４を通過したＵＶレーザは、ガラス基板３に損傷を与えずにガラス基板３を通過して裏面の樹脂シート５に到達する。従って、この加工後は、基板１の断面図を図１に示すが、アライメントマーク形成位置６において樹脂シート４と５の部分が除去され、それぞれ円形のアライメントマーク８、９となった基板１が完成する。
この場合、レーザ加工特性との関係で、樹脂シート５側のアライメントマーク９の方の径が樹脂シート４側のアライメントマーク８の径より若干小さくなったとしても、互いの中心同士が上下の対応位置にあるので、アライメントマークとして不都合はない。 2A and 2B, as indicated by an arrow 10, each of the alignment mark forming positions 6 of the resin sheet 4 is sequentially irradiated with a UV laser from above. This UV laser has an energy density of, for example, 20 mJ / mm 2 and is energy that can process resin but cannot process glass.
The UV laser that has passed through the resin sheet 4 on the front surface passes through the glass substrate 3 without damaging the glass substrate 3 and reaches the resin sheet 5 on the back surface. Therefore, after this processing, the cross-sectional view of the substrate 1 is shown in FIG. 1, but the portions of the resin sheets 4 and 5 are removed at the alignment mark forming position 6 so that the substrate 1 having circular alignment marks 8 and 9 is obtained. Complete.
In this case, even if the diameter of the alignment mark 9 on the resin sheet 5 side is slightly smaller than the diameter of the alignment mark 8 on the resin sheet 4 side in relation to the laser processing characteristics, the centers of each other correspond vertically. Since it is in position, there is no inconvenience as an alignment mark.

以上の実施例１によれば、ガラス基板３に与える影響を小さくして、樹脂シート４と５にアライメントマーク８と９を同時に、しかもその中心が上下の正しい対応位置に形成できる。
なお、以上の実施例において、ＵＶレーザの照射を、小さな径の穴あけを繰り返して大きな径の穴をあけるトレパニング加工で行えば、アライメントマーク８、９の径を大きくすることができる。 According to the first embodiment described above, the influence on the glass substrate 3 can be reduced, and the alignment marks 8 and 9 can be formed on the resin sheets 4 and 5 at the same time, and the centers thereof can be formed at the correct corresponding positions.
In the above embodiment, the diameter of the alignment marks 8 and 9 can be increased if the irradiation of the UV laser is performed by trepanning which repeats drilling with a small diameter to make a large diameter hole.

次に、ガラス基板の表裏面に設けられた樹脂層に当該基板を複数の矩形状小基板に分割するために裁断する場合の裁断用切り込みマークをレーザを用いて形成する実施例２について説明する。この裁断用切り込みマークは、裁断機の刃に樹脂層が付着して裁断に支障を来すのを防ぐため、樹脂層の切り込み部分を除去するものである。   Next, a description will be given of a second embodiment in which a cutting mark for cutting is formed by using a laser when the substrate is cut to divide the resin layer provided on the front and back surfaces of the glass substrate into a plurality of small rectangular substrates. . The cutting mark for cutting is used to remove the cut portion of the resin layer in order to prevent the resin layer from adhering to the blade of the cutting machine and hindering cutting.

図４は、本発明の実施例２を説明するための図で、（ａ）は加工前のワークの平面図、（ｂ）は加工途中における（ａ）のＢ−Ｂ断面図である。図４において、２１はワークとなる基板、２２は基板２１を載置するためのテーブル、２３は基板２１の構成材となるガラス基板、２４はガラス基板２３の表面に貼られた樹脂シート、２５はガラス基板２３の裏面に貼られた樹脂シートである。この場合、樹脂シート２４、２５が貼られる代わりに、コーティング処理等の他の方法によって樹脂層が設けられていてもよい。２６は樹脂シート２４に形成すべき裁断用切り込みマークの形成位置を示し、裁断用切り込みマーク形成位置２６に対応するテーブル２２の位置には、形成する裁断用切り込みマークの面積より広い面積のレーザ通し孔２７が、テーブル２２へのレーザ照射を避けるために設けられている。
なお、この例における裁断用切り込みマークは、基板２１を４個の矩形状小基板に分割するため十字状になっているが、他の形状であってもよい。 4A and 4B are diagrams for explaining a second embodiment of the present invention, in which FIG. 4A is a plan view of a workpiece before machining, and FIG. 4B is a cross-sectional view taken along line BB in FIG. In FIG. 4, 21 is a substrate to be a workpiece, 22 is a table on which the substrate 21 is placed, 23 is a glass substrate to be a constituent material of the substrate 21, 24 is a resin sheet affixed to the surface of the glass substrate 23, 25 Is a resin sheet affixed to the back surface of the glass substrate 23. In this case, the resin layer may be provided by another method such as a coating process instead of attaching the resin sheets 24 and 25. Reference numeral 26 denotes a forming position of a cutting notch mark to be formed on the resin sheet 24. A laser beam having an area larger than the area of the cutting notch mark to be formed is placed at the position of the table 22 corresponding to the cutting notch mark forming position 26. A hole 27 is provided to avoid laser irradiation of the table 22.
The cutting cut mark in this example has a cross shape to divide the substrate 21 into four rectangular small substrates, but may have other shapes.

図４（ａ）、（ｂ）の状態において、矢印２０に示すように、裁断用切り込みマーク形成位置２６に上からＵＶレーザを照射しながら、ＵＶレーザが矢印３１の方向に移動するようテーブル２２を相対移動させる。このＵＶレーザは、実施例１の場合と同様、エネルギー密度を２０ｍＪ／ｍｍ２とし、樹脂は加工できるがガラスは加工できないエネルギーとなっている。
表面の樹脂シート２４を通過したＵＶレーザは、ガラス基板２３に損傷を与えずにガラス基板２３を通過して裏面の樹脂シート２５に到達する。従って、ＵＶレーザが通過した後の樹脂シート２４と２５の部分２８、２９は除去され、加工後は、樹脂シート２４と２５の裁断用切り込みマーク形成位置２６において溝２８、２９が形成された基板２１が完成する。基板２１の表面側を図３に示すが、３０は溝２８による裁断用切り込みマークであり、裏面側の対応位置にも溝２９による裁断用切り込みマークが形成されている。
この場合、レーザ加工特性との関係で、樹脂シート２５側の裁断用切り込みマークの溝２９の幅が樹脂シート２４側の裁断用切り込みマーク３０の溝２８の幅より若干小さくなったとしても、裁断機の刃の幅との関係で溝の幅に余裕を持たせておけば、互いの中心同士が上下の対応位置にあるので、裁断用切り込みマークとして不都合はない。 4A and 4B, as shown by an arrow 20, the table 22 is moved so that the UV laser moves in the direction of the arrow 31 while irradiating the cutting cut mark forming position 26 with the UV laser from above. Relative movement. As in the case of Example 1, this UV laser has an energy density of 20 mJ / mm 2 and is energy that can process resin but cannot process glass.
The UV laser that has passed through the resin sheet 24 on the front surface passes through the glass substrate 23 without damaging the glass substrate 23 and reaches the resin sheet 25 on the back surface. Therefore, the portions 28 and 29 of the resin sheets 24 and 25 after the UV laser passes are removed, and after processing, the substrate on which the grooves 28 and 29 are formed at the cutting mark forming position 26 for the cutting of the resin sheets 24 and 25. 21 is completed. The front side of the substrate 21 is shown in FIG. 3, and 30 is a cutting cut mark by the groove 28, and a cutting cut mark by the groove 29 is also formed at a corresponding position on the back surface side.
In this case, even if the width of the groove 29 of the cutting cut mark on the resin sheet 25 side is slightly smaller than the width of the groove 28 of the cutting cut mark 30 on the resin sheet 24 side in relation to the laser processing characteristics, the cutting is performed. If an allowance is provided for the width of the groove in relation to the width of the blade of the machine, since the centers of the grooves are in the upper and lower corresponding positions, there is no inconvenience as a cutting mark for cutting.

以上の実施例２によれば、ガラス基板２３に与える影響を小さくして、樹脂シート２４と２５に裁断用切り込みマーク２６を同時に、しかもその中心が上下の正しい対応位置に形成できる。   According to the second embodiment described above, the influence on the glass substrate 23 can be reduced, and the cutting marks 26 for cutting can be formed on the resin sheets 24 and 25 at the same time, and the center thereof can be formed at the correct upper and lower corresponding positions.

以上、ガラス基板の表裏面に設けられた樹脂層にレーザを用いてアライメントマークと裁断用切り込みマークを形成する場合の実施例を説明したが、本発明は他のマークをガラス基板の表裏面に設けられた樹脂層に形成する場合にも適用できることは明らかである。   As mentioned above, although the Example in the case of forming the alignment mark and the cutting mark for cutting on the resin layer provided in the front and back of the glass substrate using a laser was described, the present invention puts other marks on the front and back of the glass substrate. It is apparent that the present invention can be applied to the case where the resin layer is formed.

１、２１：基板 ２、２２：テーブル ３，２３：ガラス基板
４、５、２４、２５：樹脂シート ６：アライメントマーク形成位置
７、２７：レーザ通し孔 ８、９：アライメントマーク １０、２０：ＵＶレーザ
２６：裁断用切り込みマーク形成位置 ２８、２９：溝
３０：裁断用切り込みマーク
1, 2: 1: Substrate 2, 22: Table 3, 23: Glass substrate
4, 5, 24, 25: Resin sheet 6: Alignment mark formation position
7, 27: Laser through hole 8, 9: Alignment mark 10, 20: UV laser
26: Cutting mark formation position for cutting 28, 29: Groove
30: Cutting mark for cutting

Claims (4)

ガラス基板から成る第一の層と当該第一層の表面と裏面の各々に設けられた前記第一層とは異なる材質の第二の層を含む基板に対し、前記第二層の各々に目的とするマークを形成する基板の加工方法において、前記第二層は加工できるが前記第一層は加工できないエネルギー密度のレーザを前記基板の一方の面から照射し、前記基板の表裏対応する箇所に前記マークを同時に形成することを特徴とする基板の加工方法。   For each of the second layers, the substrate includes a first layer composed of a glass substrate and a second layer made of a material different from the first layer provided on each of the front and back surfaces of the first layer. In the substrate processing method for forming the mark, the laser beam having an energy density that can be processed by the second layer but cannot be processed by the first layer is irradiated from one surface of the substrate, and the front and back surfaces of the substrate are exposed. A method of processing a substrate, wherein the marks are formed simultaneously. 請求項１に記載の基板の加工方法において、前記マークは当該基板の加工の際の位置合わせに用いるアライメントマークであることを特徴とするガラス基板の加工方法。 2. The method for processing a glass substrate according to claim 1, wherein the mark is an alignment mark used for alignment in processing the substrate. 請求項２に記載の基板の加工方法において、前記レーザの照射をトレパニング加工で行うことを特徴とする基板の加工方法。 3. The substrate processing method according to claim 2, wherein the laser irradiation is performed by trepanning. 請求項１に記載の基板の加工方法において、前記マークは当該基板を裁断する際の切り込みマークであることを特徴とする基板の加工方法。
2. The substrate processing method according to claim 1, wherein the mark is a cut mark when the substrate is cut.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110202538A (en) * 2019-06-24 2019-09-06 张其斌 Marking tool is used in a kind of production of laminated glass
CN113620585A (en) * 2021-08-26 2021-11-09 宁波舜宇奥来技术有限公司 Picosecond laser cutting method for glass

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7119233B2 (en) * 2019-08-07 2022-08-16 株式会社カネカ Large film-formed substrate and manufacturing method thereof, divided film-formed substrate and manufacturing method thereof, production control method and production control system for divided film-formed substrate
CN110482851A (en) * 2019-09-03 2019-11-22 拓米(成都)应用技术研究院有限公司 Grid is covered black spray finishing jig and is covered the cutting process method of black spray finishing jig based on grid
CN114425655A (en) * 2020-10-29 2022-05-03 大族激光科技产业集团股份有限公司 Laser marking method and laser marking system for brittle material

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216820A (en) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd Laser beam machining method, laser processing apparatus and crystallization apparatus
JP2008140130A (en) * 2006-12-01 2008-06-19 Alps Electric Co Ltd Input device and method for manufacturing the same
JP2013109460A (en) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd Transparent wiring sheet
JP3185747U (en) * 2012-03-05 2013-09-05 アップル インコーポレイテッド Partially laser ablation sensor processing device and touch sensitive device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8268704B2 (en) * 2002-03-12 2012-09-18 Hamamatsu Photonics K.K. Method for dicing substrate
JP4048873B2 (en) 2002-08-08 2008-02-20 松下電器産業株式会社 Positioning method
JP2007007776A (en) 2005-06-30 2007-01-18 Alps Engineering Co Ltd Alignment mark forming method
JP5332238B2 (en) * 2007-03-29 2013-11-06 三星ダイヤモンド工業株式会社 Laser processing equipment
JP2009063692A (en) * 2007-09-05 2009-03-26 Seiko Epson Corp Method and device for manufacturing electro-optical device
JP2011098381A (en) * 2009-11-06 2011-05-19 Sumitomo Bakelite Co Ltd Glass fiber reinforced resin film and cutting method thereof, and glass fiber reinforced resin panel and manufacturing method thereof
US8048778B1 (en) * 2010-12-10 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of dicing a semiconductor structure
KR20120096699A (en) * 2011-02-23 2012-08-31 스템코 주식회사 Method for drilling to form via hole in flexible metal clad laminate by using uv laser
US20130005139A1 (en) * 2011-06-30 2013-01-03 Guardian Industries Corp. Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same
TW201339111A (en) * 2012-03-29 2013-10-01 Global Display Co Ltd Method for cutting tempered glass
CN103567642B (en) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 Sapphire cutter sweep
CN102815863A (en) * 2012-10-17 2012-12-12 黄石瑞视光电技术股份有限公司 Film-bearing cutting method of touch screen ITO (indium tin oxide) glass
CN102955201B (en) * 2012-11-28 2015-04-15 索尔思光电（成都）有限公司 Optoisolator with expanded beam buffer area and manufacturing method thereof
GB2509985A (en) * 2013-01-22 2014-07-23 M Solv Ltd Method of forming patterns on coatings on opposite sides of a transparent substrate
KR102107766B1 (en) * 2013-07-09 2020-05-27 삼성디스플레이 주식회사 Sealing apparatus and method for fabricating a display device using the same
TWM479450U (en) * 2013-11-21 2014-06-01 Emerging Display Tech Corp Bilayer single-board type touch panel to resist laser etching damage
US20150305166A1 (en) * 2014-04-22 2015-10-22 Carestream Health, Inc. Laser patterning of dual sided transparent conductive films
KR20160126175A (en) * 2015-04-22 2016-11-02 삼성디스플레이 주식회사 Method of cutting a substrate and method of manufacturing a display apparatus
CN108136543A (en) * 2015-10-07 2018-06-08 康宁股份有限公司 The laser pre-treated method of the base material by coating that will be cut by laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216820A (en) * 2005-02-04 2006-08-17 Advanced Lcd Technologies Development Center Co Ltd Laser beam machining method, laser processing apparatus and crystallization apparatus
JP2008140130A (en) * 2006-12-01 2008-06-19 Alps Electric Co Ltd Input device and method for manufacturing the same
JP2013109460A (en) * 2011-11-18 2013-06-06 Shin Etsu Polymer Co Ltd Transparent wiring sheet
JP3185747U (en) * 2012-03-05 2013-09-05 アップル インコーポレイテッド Partially laser ablation sensor processing device and touch sensitive device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110202538A (en) * 2019-06-24 2019-09-06 张其斌 Marking tool is used in a kind of production of laminated glass
CN113620585A (en) * 2021-08-26 2021-11-09 宁波舜宇奥来技术有限公司 Picosecond laser cutting method for glass
CN113620585B (en) * 2021-08-26 2023-03-14 宁波舜宇奥来技术有限公司 Method for picosecond laser cutting of glass

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