KR101666468B1 - Manufacturing method and manufacturing equipment of plate is composed of translucency - Google Patents

Manufacturing method and manufacturing equipment of plate is composed of translucency Download PDF

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Publication number
KR101666468B1
KR101666468B1 KR1020150091908A KR20150091908A KR101666468B1 KR 101666468 B1 KR101666468 B1 KR 101666468B1 KR 1020150091908 A KR1020150091908 A KR 1020150091908A KR 20150091908 A KR20150091908 A KR 20150091908A KR 101666468 B1 KR101666468 B1 KR 101666468B1
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KR
South Korea
Prior art keywords
plate
laser beam
processing
plasma
focus
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KR1020150091908A
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Korean (ko)
Inventor
박홍진
김종환
서종현
최기철
Original Assignee
주식회사 비에스피
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Priority to KR1020150091908A priority Critical patent/KR101666468B1/en
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Publication of KR101666468B1 publication Critical patent/KR101666468B1/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Abstract

The present invention relates to a method and an apparatus for processing a plate, which is formed of a transparent material. The method and the apparatus for processing a plate of the present invention: prevent energy of laser beam from being reduced while processing a plate formed of a transparent material, such as glass, silicon, etc.; simply remove processing by-products generated in a predetermined processing unit on the plate; stably process the predetermined processing unit; and remove microcracks remaining on a processed surface side. To this end, the plate, used for the method for processing a plate, formed of a transparent material, is made of a transparent material; and the method for processing a plate, for processing the predetermined processing unit on the plate, comprises: a material removal step of defining a focus of laser beam on the surface of the plate from the predetermined processing unit, and moving the focus in a thickness direction of the plate; and an energy addition step of supplying plasma to the surface of the plate where the focus is defined.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of processing a plate made of a translucent material, and a processing apparatus using the translucent material.

The present invention relates to a method of processing a plate made of a transparent material and a processing apparatus, and more particularly, to a method of processing a plate made of a translucent material such as glass or silicon, A method of processing a plate made of a translucent material capable of easily removing machining byproducts generated in a machining portion, stably processing a predetermined machining portion, and removing a micro crack remaining on the machined surface side will be.

Generally, a method of processing a glass using a laser beam has many advantages over a mechanical processing method, and many studies have been made.

Conventionally, micro-cracks are formed on the upper surface (the surface facing the head irradiating the laser beam) of the glass by using a high-density laser beam, and the focus of the laser beam is moved in the depth direction, Respectively. At this time, as the focal point of the laser beam moves in the depth direction, the energy of the laser beam reaching the glass decreases. In addition, since processing by-products that are not removed at the processing site of the glass interfere with the progress of processing, the efficiency of processing becomes low.

Korean Patent Laid-Open Publication No. 2003-0090325 (Title of the Invention: Method and apparatus for cutting glass using laser beam, published on Nov. 28, 2003)

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems of the prior art and to provide a method of manufacturing a plate made of translucent material such as glass or silicon which prevents energy of a laser beam from being reduced, And a processing device and a method of processing a plate made of a translucent material capable of easily removing the substrate, stably processing the predetermined processing part, and removing micro crack remaining on the processing surface side.

According to a preferred embodiment of the present invention, a plate is made of a light-transmitting material, and a plate made of a translucent material for processing a predetermined portion of the plate is processed. A material removing step of forming a focal point of the laser beam on the other side of the plate and moving the focal point of the laser beam from the other side of the plate to one side; And an energy adding step of supplying plasma to the surface of the plate on which the focal point of the laser beam is formed in the step of removing the material to amplify the energy of the laser beam by the interaction of the laser beam and the plasma .

delete

The apparatus for processing a plate made of a light transmitting material according to the present invention is an apparatus for processing a plate made of a translucent material for processing a predetermined processed portion in the plate, the plate being made of a translucent material and having an oscillator for oscillating a laser beam, And an irradiation head which is transmitted from one side of the plate and forms a focal point of the laser beam on the other side of the plate; And a plasma unit for supplying plasma to one side of the plate in a process of forming a focal point of the laser beam on one side of the plate, wherein the laser unit is arranged such that plasma is supplied to one side of the plate And a focus adjusting unit for moving the focus of the laser beam from one side to the other side of the plate.

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According to the method and apparatus for processing a plate made of a translucent material according to the present invention, it is possible to prevent the energy of a laser beam from being reduced during processing of a plate made of a translucent material such as glass or silicon, It is possible to remove the machining by-products easily, to stably process the predetermined machining portion, and to remove the micro crack remaining on the machined surface side.

Particularly, in the present invention, since the laser beam passes through the plate and is processed (punctured or cut) from the other side of the plate, the removal direction of the material and the irradiation direction of the laser beam can be reversed And it is possible to easily remove processing by-products. At this time, as the plasma is supplied from the lower surface side of the other side of the plate, energy required for machining is added.

In other words, the present invention provides a method of punching or cutting a plate by ablation method using a laser beam and a plasma, wherein when the plate is machined (punctured or cut) on the other side of the plate, The energy of the basic laser beam is increased.

Therefore, according to the present invention, the energy threshold value of the laser beam required for machining can be reduced, so that the machining can be performed faster by the energy of the laser beam smaller than the conventional one and the sensitivity of the material to the laser beam is increased . As a result, the resolution of laser processing is improved, and as a result, processing corresponding to a high aspect ratio is facilitated. In addition, micro cracks formed at corner portions of the machining portion as machining by-products can also be removed through the plasma treatment to achieve the strength of relatively high workpieces.

In other words, according to the present invention, it is possible to use a plurality of laser beams by dividing the energy of the laser beam required for machining, and the plate can be processed faster with energy of a small laser beam.

Particularly, the present invention is suitable for perforation of a plate, and it is possible to control the perforation depth with respect to the perforation diameter, which is difficult in the conventional perforation work, and can contribute to improvement of the processing quality and the productivity of the processing.

Further, the present invention can improve the quality of the plate such as the residual stress on the machined surface, the roughness of the machined surface, the strength of the plate after machining, and the like.

1 is a block diagram showing a method of processing a plate made of a light transmitting material according to an embodiment of the present invention.
2 is a plan view showing a state in which a machining portion is marked on a plate made of a light-transmitting material according to an embodiment of the present invention.
3 is a view showing a state in which a laser beam is irradiated onto a plate made of a light-transmitting material according to an embodiment of the present invention.
4 is a view showing a processing state of a plate made of a translucent material according to an embodiment of the present invention.
5 is a view showing a plate that has been processed by a method of processing a plate made of a light transmitting material according to an embodiment of the present invention.

Hereinafter, one embodiment of a method of processing a plate made of a translucent material and a processing apparatus according to the present invention will be described with reference to the accompanying drawings. Here, the present invention is not limited or limited by the examples. Further, in describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

In the embodiment of the present invention, the machining portion on which the plate P made of the light transmitting material is machined is shown as a predetermined machining portion ML. In the figure, .

FIG. 1 is a block diagram showing a method of processing a plate made of a light transmitting material according to an embodiment of the present invention, FIG. 2 is a plan view showing a state where a machining portion is marked on a plate made of a light- And FIG. 3 is a view illustrating a state in which a laser beam is irradiated onto a plate made of a light transmitting material according to an embodiment of the present invention. FIG. 4 is a cross- And FIG. 5 is a view showing a plate that has been processed by a method of processing a plate made of a translucent material according to an embodiment of the present invention.

1 to 5, a method of processing a plate made of a translucent material according to an embodiment of the present invention is characterized in that the plate P is made of a translucent material, And can be carried out by using a plate working apparatus made of a light-transmitting material described later.

In the embodiment of the present invention, a method of puncturing the plate P in the method of processing the plate is described as an embodiment, but the present invention is not limited thereto, but can be applied to a method of cutting the plate P.

A method of processing a plate made of a light transmitting material according to an embodiment of the present invention includes a material removing step (S1) and an energy adding step (S2).

The material removing step S1 forms a focus F of the laser beam on the surface of the plate P in a predetermined processing portion ML. In addition, the material removal step (S1) moves the focal point (F) in the thickness direction of the plate (P). The material removing step S1 may be performed by a laser unit 10 described later.

At this time, in the material removing step S1, a processing crack MC is formed on the surface of the plate P on the predetermined processing part ML corresponding to the focus F. In other words, the material removing step S1 is performed on one side of the plate P to form the focal point F on the other side of the plate P, Thereby forming a machining crack MC. One side of the plate P is an upper surface of the plate P as a surface facing the irradiation head 12 irradiated with a laser beam as described later. The other side of the plate is a lower surface of the plate P as a surface facing the plasma section 31 as described later.

At this time, the irradiated laser beam can be intermittently irradiated along a linear predetermined processing portion ML to form a focus F which is spaced apart from each other for cutting the plate. Accordingly, the machining cracks MC can be formed intermittently along the predetermined machining portion ML corresponding to the irradiation pattern of the laser beam.

Further, the irradiated laser beam can be continuously irradiated along a linear predetermined processing portion ML to form a linear focal point F for cutting. Accordingly, the machining cracks MC are continuously formed along the predetermined machining portion ML corresponding to the irradiation pattern of the laser beam.

The energy addition step S2 supplies plasma to the surface of the plate P on which the focal point F is formed. The energy addition step S2 may be performed by the plasma unit 30 described later.

At this time, the energy application step S2 supplies plasma to the other side of the plate P. [

According to the processing method of the plate described above, the plasma is continuously supplied to the machining cracks MC formed on the other side of the plate P, and the energy of the laser beam is amplified by the interaction of the laser beam and the plasma . Thus, as shown in FIG. 4 or 5, the machined surface MF free of micro cracks is formed. In addition, the corner portion where the machined surface MF and the surface of the plate P intersect can be formed sharply, but it is possible to form the corner portion dullly as shown in FIG. 4 or 5 through plasma have.

Hereinafter, an apparatus for processing a plate made of a translucent material according to an embodiment of the present invention will be described.

The apparatus for processing a plate made of a translucent material according to an embodiment of the present invention is an apparatus for processing a predetermined processed portion ML in the plate P made of a translucent material, A method of processing a plate made of a translucent material can be carried out.

Although the embodiment of the present invention is described with reference to a processing apparatus for processing a plate P for perforating a plate, the present invention is not limited thereto. The apparatus for processing a plate according to an embodiment of the present invention may be a device for cutting a plate P .

The apparatus for cutting a plate made of a translucent material according to an embodiment of the present invention includes a laser unit 10 and a plasma unit 30.

The laser unit 10 irradiates a laser beam whose focus F is formed on the surface of the plate P in a predetermined processing portion ML. Here, the laser unit 10 can be applied to the above-described material removal step (S1).

Then, the laser unit 10 forms a machining crack MC on the predetermined processing portion ML corresponding to the focal point F. In other words, the laser unit 10 is transmitted from one side of the plate P to form the focal point F on the other side of the plate P.

At this time, the irradiated laser beam can be intermittently irradiated along a linear predetermined processing portion ML to form a focus F which is spaced apart from each other for cutting the plate. Accordingly, the machining cracks MC can be formed intermittently along the predetermined machining portion ML corresponding to the irradiation pattern of the laser beam.

Further, the irradiated laser beam can be continuously irradiated along a linear predetermined processing portion ML to form a linear focal point F for cutting. Accordingly, the machining cracks MC are continuously formed along the predetermined machining portion ML corresponding to the irradiation pattern of the laser beam.

The laser unit 10 includes an oscillator 11 for oscillating a laser beam and an irradiation head 12 for irradiating the plate P with a focused laser beam emitted from the oscillator 11.

The laser unit 10 may further include a focusing unit 13 for adjusting a focus F of the laser beam transmitted to the irradiation head 12. [ The focus adjusting unit 13 allows the focus F to be formed on the surface of the plate P. [ The focus adjusting section 13 adjusts the width of the focus F in the longitudinal direction of the imaginary line for displaying the machined portion ML or the focus F (the thickness direction of the plate P), and the like can be adjusted.

The focus adjusting unit 13 adjusts the position of the focus F in at least one of a thickness direction of the plate P and a longitudinal direction with respect to an imaginary line for displaying the processing unit ML You can move. Accordingly, the plate P can be punctured or the plate P can be cut.

The plasma unit 30 supplies plasma to the surface of the plate P on which the focal point F is formed. The plasma unit 30 is applicable to the execution of the energy addition step S2 described above. Then, the plasma unit 30 supplies plasma to the other side of the plate P.

The plasma unit 30 includes a plasma section 31 for generating plasma corresponding to the processing section ML. The plasma section 31 supplies plasma to the processing section ML. The plasma generated in the plasma section 31 or the plasma supplied to the processing section ML can be adjusted through the plasma control section 33.

The plasma unit 30 is provided to face the other side of the plate P to improve machining performance.

According to the aforementioned plate processing apparatus, plasma is continuously supplied to the machining cracks MC formed on the other side of the plate P, and the energy of the laser beam is amplified by the interaction of the laser beam and the plasma . Thus, as shown in FIG. 4 or 5, the machined surface MF free of micro cracks is formed. In addition, the corner portion where the machined surface MF and the surface of the plate P intersect can be formed sharply, but it is possible to form the corner portion dullly as shown in FIG. 4 or 5 through plasma have.

According to the method and apparatus for processing a plate made of the light transmitting material described above, it is possible to prevent the energy of the laser beam from being reduced during the processing of the plate P, It is possible to easily remove machining byproducts to stably process the predetermined machining portion ML and to remove micro cracks remaining on the machined surface MF side.

Particularly, in the present invention, when the plate P is processed, the laser beam passes through the plate P and is processed (punctured or cut) from the lower surface of the other side of the plate P, The removal direction and the irradiation direction of the laser beam can be reversed, and processing byproducts can be easily removed. At this time, as the plasma is supplied from the lower surface side of the other side of the plate P, energy required for machining is added.

In other words, according to the present invention, the plate P is punched or cut by an ablation method using a laser beam and a plasma, and the plate P is processed (punched or cut) at the other side of the plate P, The plasma supplied to the other side of the plate P increases the energy of the fundamental laser beam. Therefore, according to the present invention, the energy threshold value of the laser beam required for machining can be reduced, so that the machining can be performed faster by the energy of the laser beam smaller than the conventional one and the sensitivity of the material to the laser beam is increased . As a result, the resolution of laser processing is improved, and as a result, processing corresponding to a high aspect ratio is facilitated. In addition, microcracks formed at corner portions of the processing region as machining by-products can also be removed through the plasma to achieve the strength of a relatively high workpiece.

In other words, in the present invention, a plurality of laser beams can be used by dividing the energy of the laser beam required for machining, and the plate P can be processed faster with energy of a small laser beam.

Particularly, it is possible to control the perforation depth in relation to the perforation diameter, which is suitable for perforation of the plate (P), which is difficult in the conventional perforating work, and contributes to improvement of the processing quality and productivity. Particularly, it is advantageous for the punch for the high aspect ratio of the plate (P). It is also possible to improve the quality of the plate P such as the residual stress of the machined surface MF, the roughness of the machined surface MF, the strength of the plate P after machining, and the like.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Modify or modify the Software.

S1: material removal step S2: energy addition step
10: Laser unit 11: Oscillator 12: Irradiation head
13: Focus adjustment part 30: Plasma unit 31: Plasma part
33: Plasma control part P: Plate F: Focus
ML: machining portion MF: machining surface MC: machining crack

Claims (4)

A plate processing method of a plate made of a light transmitting material and made of a light transmissive material for processing a predetermined processed portion in the plate,
A material removing step of forming a focal point of the laser beam on the other side of the plate through the one side of the plate and moving the focal point of the laser beam from one side to the other side of the plate; And
And an energy adding step of supplying plasma to the surface of the plate on which the focal point of the laser beam is formed in the step of removing the material to amplify the energy of the laser beam by the interaction between the laser beam and the plasma Wherein the plate is made of a translucent material. delete A plate processing apparatus comprising a transparent material made of a light-transmitting material and made of a light-transmissive material for processing a predetermined processed portion on the plate,
A laser unit having an oscillator for oscillating a laser beam and an irradiation head which is transmitted from one side of the plate and forms a focal point of the laser beam on the other side of the plate; And
And a plasma unit for supplying plasma to one side of the plate in a process of forming a focus of the laser beam on one side of the plate,
Wherein the laser unit further comprises a focus adjusting unit for moving the focus of the laser beam from one side to the other side of the plate in a state in which plasma is supplied to one side of the plate, Device. delete
KR1020150091908A 2015-06-29 2015-06-29 Manufacturing method and manufacturing equipment of plate is composed of translucency KR101666468B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013223886A (en) * 2007-04-05 2013-10-31 Charm Engineering Co Ltd Laser machining method, laser cutting method, and method for dividing structure having multilayer substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013223886A (en) * 2007-04-05 2013-10-31 Charm Engineering Co Ltd Laser machining method, laser cutting method, and method for dividing structure having multilayer substrate

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