TW201446675A - Cutting method and cutting apparatus - Google Patents

Abstract

A cutting method and cutting apparatus for cutting a glass substrate to form a plurality of glass products are provided. The glass substrate has a first surface and a second surface opposite to the first surface. The cutting method comprises the following steps: (a) scribing the glass substrate discontinuously along a predetermined cutting line on the first surface of the glass substrate to form a plurality of scribed openings disconnected from one another; and (b) making the glass substrate split into the glass products along the predetermined cutting line. The cutting apparatus comprises a cutting head and a breaking device. The cutting head is used for scribing the glass substrate discontinuously along a predetermined cutting line on the first surface of the glass substrate to form a plurality of scribed openings disconnected from one another. The breaking device is used for making the glass substrate split into the glass products along the predetermined cutting line.

Description

Cutting method and cutting equipment

The invention relates to a cutting method and a cutting device, in particular to a cutting method and a cutting device for cutting a glass substrate.

At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. In order to prevent the glass substrate from being easily scratched or broken, the glass substrate is usually reinforced. In the manufacturing process, the glass substrate needs to be cut into a smaller size glass substrate to match the application of various devices. However, since the tempered glass substrate has high hardness and cracks generated in the cutting process are difficult to control, how to cut the tempered glass substrate and split the glass substrate along a predetermined dicing line is an important issue in the industry.

Referring to FIGS. 1 to 2, the conventional cutting method uses a cutting blade 21 to perform a continuous scoring step on the glass substrate 1 to produce a continuous scribed opening 203. After the glass substrate 1 is scribed using the conventional cutting method, the following phenomenon occurs on the first surface 11 of the glass substrate 1 directly contacting the cutting blade 21:

1): Plastic core zone 204: The cutting cutter wheel 21 is pressed downward to cause plastic destruction of the glass substrate 1, and the plastic damage zone 204 is generated around the scribe opening 203, and is accompanied by a smash line (Wallner Line) 205.

2): Median crack 206: A crack in the vertical direction is generated downward.

3): Lateral crack 207: a crack extending in a substantially horizontal direction along the first surface 11.

4): surface collapse 208: characterization caused by the lateral crack 207 extending to the first surface 11 The edge of the opening collapses.

After the scribing produces a continuous scribed opening 203, the conventional cutting method can break the glass substrate 1 by applying mechanical stress. Or, the conventional cutting method utilizes scribing to create a continuous scribed opening 203 whose depth of the downward vertical crack 206 reaches more than 80% of the thickness of the glass substrate, sufficient to cause the glass substrate 1 to naturally split. However, it is conventionally known that the quality of the section 209 of the glass product cut by the cutting method for the glass substrate 1 is not good, and the strength of the glass substrate 1 which can withstand an external force after cutting is thus lowered. Since the first surface 11 of the glass substrate 1 is scribed by the cutter wheel 21, the first surface 11 is subjected to surface collapse 208, thereby generating chipping. If the scribe openings 203 created after scoring cross each other, there will be a serious surface collapse 208 at the intersection, which will result in more severe chipping and crack conditions. All of the above problems cause the cutting quality of the glass substrate 1 to be low. In addition, another serious disadvantage is that the verticality of the downward vertical crack 206 generated when the conventional cutting method scores the glass substrate 1 is rather poor. If the glass product of a smaller size is cut, even if the scribe opening 203 is scored, the glass substrate 1 is warped.

Referring to Figures 2 and 3, the characterization of a good glass substrate 1 produces three important requirements for the quality of the scribe opening 203. First, the depth of the vertical crack 206 is deep. The deeper the depth of the vertical crack 206, the easier the glass substrate 1 is to be broken. Second, the occurrence of lateral cracks 207 must be suppressed. When the condition of the lateral crack 207 is severe, it causes a surface collapse 208 near the scribe opening 203. When the surface collapse 208 occurs, the quality of the cut surface section 209 of the glass substrate 1 is affected. Third, the surface of the glass substrate 1 after cutting needs to be flat; the surface damage accompanying the scribe opening 203 affects the quality of the first surface 11, and also affects the strength of the glass substrate 1 after the cutting.

However, the conventional cutting method has the following disadvantages that cannot be overcome. Details are as follows:

1) As shown in FIG. 2, the first surface 11 of the glass substrate 1 has a large flaw and even occurs. The surface collapses 208, causing debris: When the conventional cutting method is used, even if the sharp-cutting cutter wheel 21 is used, the first surface 11 directly contacting the cutter wheel 21 still has an unintended flaw. Moreover, the surface flaws at the intersection of the scribe openings 203 may result in larger surface scratches due to repeated cutting twice, thereby affecting the surface quality after cutting.

2) As shown in Figures 2 and 3, the vertical crack 206 has a poor verticality: although the conventional cutting method produces a vertical crack 206, the perpendicularity of the vertical crack 206 is not good and there is considerable error. The section after the glass substrate 1 is cut is not vertical, and the requirements for the quality of the section cannot be satisfied.

2) The bending strength is low: since the glass substrate 1 is scribed by the cutting blade 21, vertical cracks 206, lateral cracks 207, surface damage, and even surface cracking 208 are generated in the vicinity of the scribe opening 203, so the quality of the section 209 is not it is good. In the case where the quality of the cross section is not good, when the glass substrate 1 is subjected to bending after the cutting, the pressing force inside the glass substrate 1 is liable to cause damage to the above defects, so that the strength of the glass substrate 1 after cutting is very poor.

Therefore, how to cut the glass substrate to avoid or slow down the defects caused by the glass substrate after the conventional cutting method has been etched is an important issue in the industry.

It is an object of the present invention to provide a cutting method and a cutting apparatus which are suitable for avoiding or slowing down defects caused by a glass substrate which has been scribed by a conventional cutting method.

To achieve the above object, the present invention is suitable for cutting a glass substrate to form a plurality of glass products, comprising the steps of: (a) discontinuously scribing the glass substrate along a predetermined cutting line on one of the first surfaces of the glass substrate, Forming an opening by forming a plurality of unconnected plurality; and (b) splitting the glass substrate into a glass product along a predetermined cutting line.

To achieve the above object, the cutting apparatus suitable for cutting a glass substrate to form a plurality of glass products comprises a cutting head and a breaking device. The cutting head is for discontinuously scribing the glass substrate along the predetermined cutting line on the first surface of the glass substrate to form a plurality of scribed openings that are not connected. The breaking device is used to split the glass substrate into a plurality of glass products along a predetermined cutting line Product

1‧‧‧ glass substrate

11‧‧‧ first surface

12‧‧‧ second surface

21‧‧‧Cutting cutter wheel

203‧‧‧ scribing openings

204‧‧‧Plastic damage zone

205‧‧‧渥勒线

206‧‧‧ vertical crack

207‧‧‧lateral cracks

208‧‧‧ surface collapse

209‧‧‧ Section

301‧‧‧Predetermined cutting line

303‧‧‧ scribing openings

305‧‧‧ Section

31‧‧‧Cutting cutter wheel

311‧‧‧ cutting blade

313‧‧‧Cutting trough

33‧‧‧ Breaking device

331‧‧‧Central clamping parts

333‧‧‧ side clamps

A‧‧‧Axial

c‧‧‧Weighing

D‧‧‧ groove depth

D‧‧‧OD

I‧‧‧ interval

W‧‧‧ Length

R‧‧‧radial

T‧‧‧thickness

T‧‧‧knife wheel thickness

Θ‧‧‧ cutting angle

1 is a schematic cross-sectional view of a conventional cutting method; FIG. 2 is a schematic view showing a defect formed on a glass substrate after being scribed by a conventional cutting method; and FIG. 3 is a cross section of the glass substrate after being cut by a conventional cutting method. 4A is a schematic perspective view of a cutting method according to the present invention; FIG. 4B is a schematic cross-sectional view showing a cutting method according to the present invention; FIG. 5 is a schematic view showing a glass substrate cut along a plurality of predetermined cutting lines according to the cutting method of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7A to FIG. 7C are schematic views of a cutting wheel of a cutting device of the present invention; and FIG. 8 is a schematic view showing a section of a glass substrate after cutting by the cutting method of the present invention.

As shown in Figures 4A and 4B, the cutting method of the present invention is adapted to cut a glass substrate 1 to form a plurality of glass products. The glass substrate 1 can be a tempered glass substrate or an unreinforced glass and has a first surface 11 and a second surface 12 opposite the first surface 11. The dicing method of the present invention comprises the steps of: (a), discontinuously scribing the glass substrate 1 along a predetermined cutting line 301 on the first surface 11 of the glass substrate 1 to form a plurality of scribed openings 303. In step (b), the glass substrate 1 is split into a plurality of glass products along a predetermined cutting line 301.

With the cutting method of the present invention, the perpendicularity of the fracture line of the scribe opening 303 is high, so that the section 305 of the glass substrate 1 after dicing is smooth (as shown in FIG. 8), and the surface and the number of the opening 303 are scribed. The surface collapse and chipping at the intersection of the predetermined cutting line 301 can be effectively suppressed. Preferably, the cutting method of the present invention uses a special cutting cutter wheel 31 and a pressure-control cutter wheel holder (not shown) to score the glass substrate 1 to make the glass substrate 1 The discontinuous scribe opening 303 is created and, compared to the prior art, it is less prone to produce a downward vertical crack. After the scribe is formed to form a discontinuous scribed opening 303, the glass substrate 1 is separated by mechanical stress.

In addition, referring to FIG. 5, in the step (a) of the cutting method of the present invention, the glass substrate 1 may be discontinuously scored on the first surface 11 of the glass substrate 1 along different predetermined cutting lines 301 which are parallel or intersect with each other. And forming a scribed opening 303 in which the complex array is not connected. Thereafter, in the step (b) of the cutting method of the present invention, the glass substrate 1 is further split into a plurality of glass products along different predetermined cutting lines 301, respectively.

As shown in Fig. 4A, in the step (a) of the cutting method of the present invention, the scribed openings 303 are formed to form an interval i between each other along a predetermined cutting line 301. Preferably, the interval i is substantially It is 1 to 3 μm, and the scribe opening 303 is formed to have a length w along the predetermined cutting line 301, preferably substantially 5 to 15 μm.

As shown in FIG. 6, step (b) of the cutting method of the present invention preferably pressurizes the glass substrate 1 along the predetermined cutting line 301 on the second surface 12 (refer to the position of the scribed opening 303 in the middle). And preferably on the first surface 11 parallel to the predetermined cutting line 301 (please refer to the position of the scribed opening 303 in the middle) and pressurize the glass substrate 1 adjacent to the opposite sides of the predetermined cutting line 301 to make the glass substrate 1 splits into a plurality of glass products along a predetermined cutting line 301.

In the step (a) of the cutting method of the present invention, the glass substrate 1 is preferably discontinuously scored on the first surface 11 of the glass substrate 1 along a predetermined cutting line 301 using a cutting blade 31.

The cutting apparatus of the present invention is adapted to cut a glass substrate 1 to form a plurality of glass products. As shown in FIGS. 4A and 4B and FIG. 6, the cutting apparatus includes a cutting head and a breaking device 33. The cutting head preferably includes a cutting wheel 31. The cutting head is used to discontinuously score the glass substrate 1 along a predetermined cutting line 301 on the first surface 11 of the glass substrate 1 to form a plurality of scribed openings 303 that are not connected. The breaking device 33 serves to split the glass substrate 1 into a plurality of glass products along a predetermined cutting line 301.

As shown in FIG. 4A, the interval ii of the disconnected scribe openings 303 formed along the predetermined cutting line 301 is preferably substantially 1 to 3 μm, and the unconnected scribe openings 303 are formed along the predetermined cutting line 301. The length w is preferably substantially 5 to 15 μm.

As shown in FIG. 6, the breaking device 33 includes a center holding member 331 and a pair of side holding members 333. The central clamping member 331 presses the glass substrate 1 along the predetermined cutting line 301 on the second surface 12 (refer to the position of the scribed opening 303 in the middle), and the side clamping members 333 are preferably respectively on the first surface 11. Parallel to the predetermined cutting line 301 (please refer to the position of the scribed opening 303 in the middle), and pressurize the glass substrate 1 adjacent to and at a position opposite to the predetermined cutting line 301 to make the glass substrate 1 along a predetermined cutting line. The 301 split into multiple glass products.

7A to 7C, the cutting head 31 included in the cutting head has a maximum outer diameter D, an axial direction A (ie, a direction along the axis of rotation of the cutter wheel), and a radial direction r (ie, a direction along the diameter of the cutter wheel). ), a circumferential direction to c (ie, in the direction of the outer circumference of the cutter wheel) and a thickness T of the cutter wheel in the axial direction A. The outer circumference of the cutter wheel 31 is tapered inwardly from the maximum outer diameter D in the radial direction r to form a cutting edge 311 having a cutting angle θ. A plurality of cutting grooves 313 which are not parallel to the circumferential direction c are formed on the cutting blade edge 311, and the cutting groove 313 has a groove depth d. In one embodiment, the thickness t of one of the glass substrates 1 is substantially between 0.05 and 1.1 mm, and the cutting angle θ of the cutting blade edge 311 is substantially between 90° and 150°, and the groove depth d of the cutting groove 313 is substantially smaller than At 3 μm, the number of cutting grooves 313 is substantially greater than 200, and one of the pressing forces when the scoring opening 303 is scored is substantially less than 15 Newtons (N).

In a preferred embodiment of the cutter wheel 31, when the thickness t of the glass substrate 1 is substantially 0.4 mm, the outer diameter D of the cutter wheel 31 is 2 mm, and the cutting angle θ of the cutting blade 311 is substantially It is 125°, and the scribe force that is pressed when scribing the scribe opening 303 is substantially between 0.6 and 2.5 N.

The cutting method and the cutting device of the present invention are characterized in that the glass substrate 1 is discontinuously scored along the predetermined cutting line 301 on the first surface 11 of the glass substrate 1 to form a plurality of scribed openings 303 which are not connected, and can be used in combination with a special Cutting cutter wheel 31 with special controllable pressure The cutter wheel holder is mounted to precisely control the scribe force that is pressed when forming the scribe opening 303. The plurality of scribed openings 303 along the predetermined cutting line 301 which are generated on the first surface 11 of the glass substrate 1 by the cutting method and the cutting device of the present invention are not easily generated by the conventional cutting method. The crack 206 and the lateral crack 207 and the surface collapse 208. The cutting method and cutting device of the invention have the following advantages:

1. There is almost no occurrence of surface collapse 208 and chipping: since the glass substrate 1 has only a discontinuous plurality of scribe openings 303, there is no surface collapse 208 and debris generation. In particular, when the complex array of scribe openings 303 are created along the plurality of predetermined cut lines 301, the first surface 11 does not have serious defects at the intersection of the complex array scribe openings 303. The cutting method and cutting apparatus of the present invention can maintain the surface integrity of the glass substrate 1.

2. It is not easy to generate vertical cracks 206: The advantage of having no vertical cracks 206 is that the perpendicularity of the section 305 after the glass substrate 1 is cut can be controlled by the breaking device 33. As long as the breaking device 33 as shown in Fig. 6 is pressed along the predetermined cutting line 301, a good vertical section 305 as shown in Fig. 8 can be obtained.

3. The bending strength of the glass substrate 1 is increased: since there are no lateral cracks 207, vertical cracks 206, surface collapses 208 and debris, the glass product after cutting and cutting has a good section 305 (as shown in Fig. 8). The good section 305 allows the glass product formed after cutting the glass substrate 1 to withstand high bending stress, and does not break from the defects of the cut surface when bent.

1‧‧‧ glass substrate

11‧‧‧ first surface

12‧‧‧ second surface

301‧‧‧Predetermined cutting line

303‧‧‧ scribing openings

I‧‧‧ interval

W‧‧‧ Length

Claims (12)

A cutting method for cutting a glass substrate to form a plurality of glass products, wherein the glass substrate has a first surface and a second surface opposite to the first surface, and the cutting method comprises the steps of: (a) along a predetermined cutting line discontinuously scribing the glass substrate on the first surface of the glass substrate to form a plurality of scribed openings; and (b) splitting the glass substrate into the glass along the predetermined cutting line product. The cutting method according to claim 1, wherein in the step (a), the scribe openings are substantially 1 to 3 μm apart along one of the predetermined cutting lines. The cutting method of claim 2, wherein in step (a) the scribe openings are substantially 5 to 15 μm along the length of the predetermined cutting line. The cutting method of claim 3, wherein in step (b), the glass substrate is pressed along the predetermined cutting line on the second surface, and adjacent to the first surface and opposite to the predetermined cutting line The glass substrate is pressurized at the two side positions to split the glass substrate along the predetermined cutting line into the glass products. The cutting method according to claim 1 or 3, wherein a thickness of one of the glass substrates is substantially between 0.05 and 1.1 mm, and a cutting blade is used in the step (a) along the predetermined cutting line on the glass substrate. The first surface discontinuously scribes the glass substrate, the cutting wheel has a maximum outer diameter, an axial direction, a radial direction, a circumferential direction, and a thickness of the cutter wheel along the axial direction, and the outer circumference of the cutting wheel is The maximum outer diameter is tapered radially inwardly to form a cutting edge having a cutting angle, extending over the cutting blade to form a plurality of cutting grooves not parallel to the circumferential direction, and the cutting grooves have a groove depth, and wherein The cutting angle of the cutting blade is substantially between 90° and 150°; the groove depth of the cutting grooves is substantially less than 3 μm; The number of one of the cutting slots is substantially greater than 200; and one of the scribe forces that are stamped to form the scribe openings is substantially less than 15 Newtons (N). The cutting method of claim 5, wherein the thickness of the glass substrate is substantially 0.4 mm, and in the step (a): the outer diameter of the cutting blade is substantially 2 mm; The cutting angle is substantially 125°; and the scribe force that is pressed when forming the scribe openings is substantially between 0.6 and 2.5 N. A cutting apparatus adapted to cut a glass substrate to form a plurality of glass products, wherein the glass substrate has a first surface and a second surface opposite to the first surface, and the cutting device comprises: a cutting head for Non-continuously scribing the glass substrate along the predetermined surface along the first surface of the glass substrate to form a plurality of scribed openings; and a breaking device for aligning the glass substrate along the predetermined cutting line Split into these glass products. The cutting apparatus of claim 7, wherein the scribe openings are substantially 1 to 3 μm apart along one of the predetermined cutting lines. The cutting device of claim 8, wherein the scribe openings are substantially 5 to 15 μm along the length of the predetermined cutting line. The cutting device of claim 9, wherein the breaking device comprises a central clamping member and a pair of side clamping members, the central clamping member is applied to the glass substrate along the predetermined cutting line on the second surface Pressing, and the side clamping members respectively pressurize the glass substrate adjacent to the first surface and at two sides of the predetermined cutting line, so that the glass substrate is split along the predetermined cutting line into the same Glass products. The cutting device of claim 7 or 9, wherein the thickness of one of the glass substrates is substantially Up to 0.05 to 1.1 mm, and the cutting head includes a cutting wheel that non-continuously scribes the glass substrate along the predetermined cutting line on the first surface of the glass substrate, the cutting wheel having a maximum outer diameter, an axial direction, a radial direction, a circumferential direction, and a thickness of the cutter wheel along the axial direction, the outer circumference of the cutting cutter wheel is tapered radially inward from the maximum outer diameter to form a cutting angle a cutting blade extending over the cutting blade to form a plurality of cutting grooves not parallel to the circumferential direction, and the cutting grooves have a groove depth, and wherein: the cutting edge of the cutting blade is substantially between 90° and 150°; The groove depth of the cutting grooves is substantially less than 3 μm; the number of one of the cutting grooves is substantially greater than 200; and the cutting wheel is formed to form a scribe force substantially when the scribe openings are pressed Less than 15 Newtons (N). The cutting device of claim 11, wherein one of the glass substrates has a thickness of substantially 0.4 mm, and wherein: the outer diameter of the cutting blade is substantially 2 mm; the cutting angle of the cutting blade is substantially 125°; and the scribe force that is pressed when the cutting wheel is scored to form the scribe openings is substantially between 0.6 and 2.5 N.