TWI468354B - Cutting method and cutting apparatus for a glass substrate - Google Patents

Description

Cutting method and cutting device for a glass substrate

The invention relates to a cutting method and a cutting device, in particular to a cutting method and a cutting device for cutting a glass substrate.

At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. As shown in FIG. 1, a conventional glass substrate 9 has a cutting surface 90 to be cut, and if it is a tempered glass substrate, it comprises a tensile layer 91 having tensile internal stress, and is formed on the tensile layer 91. At least one compression layer 92 having a compressive internal stress. In this case, the cutting surface 90 is located on the compression layer 92. In the manufacturing process, the glass substrate 9 usually has a large size and needs to be cut into a glass product required for various home appliances or electronic products.

Referring to FIGS. 1 and 2A, a conventional cutting method cuts a glass substrate 9 along a predetermined cutting line 11, and a predetermined cutting line 11 is positioned on the cutting surface 90. The predetermined cutting line 11 is around the edge of the glass product 10 to be cut out from the glass substrate 9. If the conventional cutting method is to cut a glass product 10 having a curved edge from the glass substrate 9, the predetermined cutting line 11 has at least one first curved segment 111. Wherein, the first curved section 111 has a first curvature. After the glass substrate 9 is cut along the predetermined cutting line 11, the glass substrate 9 that has not been broken can be split out of the glass product 10 by a splitting process.

The conventional cutting method comprises the following steps. Referring to FIG. 2A, first, the glass substrate 9 is scribed along an initial feed line 13 from an initial feed point 130 on the cutting surface 90. Wherein, the initial feed line 13 is connected to a predetermined cut at a connection point 110. The first curve segment 111 of the scribe line 11 is slashed, and the initial feed line 13 has a second curved segment 131 adjacent to the connection point 110. The second curved segment 131 has a second curvature. After the glass substrate 9 is scribed along the initial infeed line 130 along the initial infeed line 13 through the second curved segment 131 and the connection point 110, the glass substrate is scribed along the predetermined cutting line 11 toward the lower right of the figure, the predetermined cutting The wire 11 is finally joined to the first curved segment 111, and the glass substrate 9 is scored on the cutting surface 90 to form a closed predetermined cutting line 11.

In the conventional cutting method, the first curvature of the first curved section 111 is multiplied by the second curvature of the second curved section 131 to a negative value, that is, the curvature center C1 and the second curvature of the first curvature of the first curved section 111. The center of curvature C2 of the second curvature of the curved segment 131 is located on the opposite side of the first curved segment 111 from the second curved segment 131.

Please refer to FIG. 2B , which is an enlarged view of the glass substrate 9 adjacent to the connection point 110 after the step of scribing the glass substrate 9 along the initial feed line 13 and along the predetermined cutting line 11 by the conventional cutting method. The shaded area shown in FIG. 2B shows that the conventional cutting method is scribed along the first curved section 111 and the second curved section 131, and the first curved section 111 and the second curved section 131 are relatively close, and the glass substrate 9 is caused. An area of the surface between the first curved section 111 and the second curved section 131 that is partially damaged. As can be seen from FIG. 2B, after the glass substrate 9 is scribed by a conventional cutting method, a region of the lobes 17 as shown in the figure will be formed on the glass substrate 9, and the first curved segment 111 of the predetermined cutting line 11 and the initial feeding will be formed. Between the second curved segments 131 of the line 13 and adjacent the joining point 110, an edge irregular crack 15 is created on the edge of the glass product 10 which is intended to be cut.

In general, when the glass substrate 9 is scribered by a general cutting method, the thickness t of the glass substrate 9 is not cut at one time, and only the depth of formation is less than t. The scribe is opened on the cutting surface 90, and the glass substrate is not immediately broken after being cut, so that a splitting process is required to split the glass substrate 9 out of the glass product 10.

When the glass substrate 9 after the conventional cutting process is split in the subsequent process, the glass product 10 is liable to be broken from the other portions of the glass substrate 9 without being completely split along the predetermined cutting line 11. The glass substrate 9 will be split adjacent to the connection point 110, partially along the outer side of the lobes 17, and a portion of the second curved section 131 of the initial feed line 13 to the junction 110. Therefore, the glass product 10 cut and split using the conventional cutting method tends to have an outwardly convex lobes 17. The use of the lobes 17 produced by conventional cutting methods results in the glass product 10 having to undergo a subsequent process of removing the lobes 17 to achieve the desired product shape, wasting time and cost. If the embossing of the lobes 17 remaining on the glass product 10 is incomplete, the glass product 30 will not be in the desired shape, or the lobes 17 may cause problems in positioning or assembly, thereby causing various yield reductions. problem.

2A and 2B, in the case where the glass substrate 9 is a tempered glass substrate and the thickness t is substantially 0.7 mm, the first curved line 111 of the predetermined cutting line 11 is rounded and the radius R1 is between 2 mm and 100 mm. When the second curved section 131 of the initial infeed line 13 is rounded and its radius R2 is 5 mm, the scoring speed of the initial infeed line 13 is 30 to 50 mm per second (mm/s), and scribing The cutting pressure of the initial feed line 13 is equal to the minimum cutting pressure of the predetermined cutting line 31, and the height h of one of the above-mentioned lobes 17 produced by the conventional cutting method is substantially about 300 micrometers (μm), and The length of the crack 15 is more significantly greater than the height of the lobes 17.

Therefore, how to cut the glass substrate, avoid or slow down the glass substrate after the conventional cutting method has been scribed, and easily leave defects in the glass product after splitting, is an important issue in the industry.

It is an object of the present invention to provide a cutting method and a cutting apparatus to which the cutting method of the present invention is applied. The glass product produced by the cutting method and the cutting glass device of the cutting device of the present invention will not have the lobes caused by the conventional cutting method, avoid the problems caused by the lobes, and the cracks on the glass product. It is also smaller than the conventional cutting method.

To achieve the above object, the cutting method and cutting apparatus of the present invention are for cutting a glass substrate along a predetermined cutting line. The glass substrate has a cutting surface. The predetermined cutting line is located on the cutting surface and has a first curved section, and the first curved section has a first curvature. The cutting method can be applied to a cutting device and comprises the steps of: (a) scribing the glass substrate along an initial infeed line from an initial infeed point on the cutting surface, wherein the initial infeed line is connected to the predetermined cut at a joint point a first curved section of the line, the initial infeed line having a second curved section adjacent to the connecting point, the second curved section having a second curvature, and the first curvature multiplied by the second curvature to a positive value; and (b) After step (a), the glass substrate is scribed on the cutting surface along a first curved segment of the predetermined cutting line. The cutting apparatus includes a cutting tool, and the cutting apparatus is adapted to perform the above steps of the cutting method using a cutting tool.

Referring to Figures 1, 3A and 3C, the cutting method of the present invention is used to cut a glass substrate 9 along a predetermined cutting line 31. The glass substrate 9 has a cutting surface 90, and the predetermined cutting line 31 is located on the cutting surface 90 and has a first curved section 311. The first curved segment 311 has a first curvature. The glass substrate 9 can be a tempered glass substrate and includes a stretch layer 91 and at least one compression layer 92 formed on the stretch layer 91, as shown in FIG. In this case, the cutting surface 90 is located on the compression layer 92.

The predetermined cutting line 31 is around the edge of the glass product 30 to be cut out from the glass substrate 9 by the cutting method of the present invention, so that after the glass substrate 9 is to be scored along the predetermined cutting line 31, the glass substrate 9 can be split by the splitting process. Out of the glass product 30. 3C shows a predetermined cutting line 31 on a glass substrate 9, and a piece of glass product 10 can be cut; but a plurality of predetermined cutting lines can also be formed, and the glass is scored on the cutting surface 90 along a plurality of predetermined cutting lines 31. The substrate 9 is thereby cut into a plurality of glass products 30.

The cutting method applicable to the cutting apparatus of the present invention comprises the following steps. First, in step (a), the glass substrate 9 is scored along an initial infeed line 33 from an initial infeed point 330 on the cutting surface 90. The initial feed line 33 is connected to the first curved section 311 of the predetermined cutting line 31 at a connection point 310, and the initial feed line 33 has a second curved section 331 adjacent to the connection point 310. The second curved section 331 has a second curvature. It should be noted that the first curvature of the first curved section 311 of the present invention is multiplied by the second curvature of the second curved section 331 to a positive value, that is, the curvature center C3 and the second curvature of the first curvature of the first curved section 311. The center of curvature C4 of the second curvature of the curved segment 331 is located on the same side of the first curved segment 311 and the second curved segment 331.

In step (a), after the glass substrate 9 is scored from the initial infeed point 330 along the initial infeed line 33, through the second curved segment 331 and the connection point 310, in the step In (b), the glass substrate 9 is scribed on the cutting surface 90 along the first curved section 31 of the predetermined cutting line 31.

When the glass substrate 9 is scribed along the initial feed line 33 and the predetermined cutting line 31, the cutting method of the present invention does not cut the thickness t of the glass substrate 9 at one time, but only scribes the scribe opening with a depth less than t. The glass substrate 9 is ruptured along the initial feed line 33 and the predetermined cutting line 31 in the subsequent process. If the glass substrate 9 is a tempered glass substrate, the depth of the scribed opening generally exceeds the thickness of the compression layer 92 and reaches the tensile layer 91.

In the conventional cutting method, the difference from the present invention is that the first curvature of the first curved section 111 is multiplied by the second curvature of the second curved section 131 to a negative value, that is, the first curvature of the first curved section 111. The center of curvature C2 of the second curvature of the center of curvature C1 and the second curve segment 131 is located on the opposite side of the first curve segment 111 and the second curve segment 131. Therefore, the glass substrate 9 which has been scribed by the conventional cutting method tends to leave the lobes 17 in the glass product 10 after being split, which causes many problems, but the present invention does not have the problems of the above conventional cutting method.

In one aspect of the glass product 30, the glass product 30 has a rounded corner so that the first curved section 311 of the predetermined cutting line 31 of the present invention is correspondingly rounded and has a radius R3. The radius R3 may vary from 2 mm to 100 mm depending on the design of the glass product 30. The second curved section 331 of the initial feed line 33 is also generally rounded and has a radius R4. The radius R4 is usually between 10 mm and 10,000 mm. Furthermore, in an embodiment of the present invention, the initial infeed point 330 may be located on one edge of the glass substrate 9 (as shown in FIG. 3C), that is, the cutting method of the present invention may be fed from one edge of the glass substrate 9. And scribing Glass substrate 9.

If the corner of one of the glass products 30 is a convex corner, as shown in FIGS. 3A and 3C, the radius R4 of the second curved section 331 of the initial feed line 33 needs to be larger than the predetermined cutting line 31. The radius R3 of a curved segment 311. If the fillet of one of the glass products 30 is a recessed notch, as shown in FIG. 3D, the radius R4 of the second curved section 331 of the initial feed line 33 needs to be smaller than the first curved section of the predetermined cutting line 31. Radius R3 of 311. The relationship between the radius R4 of the second curved section 331 of the initial feed line 33 and the radius R3 of the first curved section 311 of the predetermined cutting line 31, the second curved section 331 of the initial feed line 33 and the predetermined cutting line 31 The first curve segment 311 is also not rounded but only for other curves (eg, an irregular arc whose radius varies with the length of the line).

In a preferred embodiment of the cutting method of the present invention, the predetermined cutting line 31 surrounds the edge of the glass product 30 and is connected back to the attachment point 310, as shown in Figure 3C. Therefore, after the step (b), the cutting method of the present invention further comprises the steps of: (c) scribing the glass substrate 9 on the cutting surface 90 along the predetermined cutting line 31 back to the connection point 310; and (d) at the connection point 310 The scribing of the glass substrate 9 is stopped.

After the above steps, an embodiment of the cutting method may further comprise the following steps after the step (d): (e) splitting the glass substrate 9 along the predetermined cutting line 31 into a plurality of portions to produce the glass product 30. In the above step (e), a process such as bending the glass substrate 9, non-uniformly heating the glass substrate 9, and rapidly cooling the glass substrate 9 after rapid heating may be employed to promote the cracking of the glass substrate 9 to be formed along the predetermined cutting line 31 and the like. The scribed opening formed by the scribe line is developed in the glass substrate 9 and penetrates through the thickness t of the glass substrate 9, thereby making the glass substrate 9 The plurality of portions are split along the predetermined cutting line 31, and the glass product 30 is produced.

However, the cutting method of the present invention may not include the above step (e) because the crack formed by the glass substrate 9 is scratched, and under certain conditions, it is naturally formed along the predetermined cutting line 31 and other cutting lines. The scribed openings are developed in the glass substrate 9, and penetrate the thickness t of the glass substrate 9, thereby causing the glass substrate 9 to split itself into a plurality of portions along the predetermined cutting line 31, and produce the glass product 30. In particular, in the case where the glass substrate 9 is a tempered glass substrate, the scribed openings formed by the dicing along the predetermined cutting line 31 and other cutting lines in the stretched layer 91 of the tempered glass substrate tend to develop naturally. obvious.

The cutting method of the present invention can scribe the glass substrate 9 by a laser irradiation, a grinding stone grinding, a diamond knife scribe, a cutting wheel cutting or other processes. Furthermore, when the cutting method of the present invention scribes the glass substrate 9 along the predetermined cutting line 31 or the initial feeding line 33, it is not necessary to perform one scribe, but may be engraved along the predetermined cutting line 31 or the initial feeding line 33 in multiple times. The glass substrate 9 is drawn.

In one embodiment of the cutting method of the present invention, the predetermined cutting line 31 may be connected back to the connection point 310 without being connected back to the edge of the glass substrate 9. One of the embodiments of this cutting method may be applied to retain a portion of one of the edges of the glass substrate 9 directly as part of the edge of the glass product 30.

Please refer to FIG. 3B, which is the step (b) of scribing the glass substrate 9 along the initial infeed line 33 and the step (b) of continuing to trace the glass substrate 9 along the first curved line 311 of the predetermined cutting line 31. An enlarged view of one of the glass substrates 9 adjacent to the connection point 310. The shaded area shown in FIG. 3B is shown along the first curved section 311 and After the second curved section 331 is scored, the first curved section 311 and the second curved section 331 are relatively close, and the surface of the glass substrate 9 where the surface between the first curved section 311 and the second curved section 331 is damaged is caused. FIG. 3B shows that after the glass substrate 9 is scribed by the cutting method of the present invention, the lobes 17 generated by the conventional cutting method are not formed on the glass substrate 9, but only the first curved segment 311 of the predetermined cutting line 31 and the initial Between the second curved segments 331 of the feed line 33 and adjacent the joint 310, a crack 35 is created on the edge of the glass product 30 that is intended to be cut. Therefore, after the glass substrate 9 delineated by the cutting method of the present invention is split in the subsequent process, the glass product 30 produced by the glass substrate 9 does not have the conventional lobes 17 and is suitable to be completely along the predetermined cutting line 31. The first curve segment 31 splits. Thereby, the cutting method of the present invention can avoid the problems caused by the lobes 17 of the conventional cutting method.

The glass substrate 9 is a tempered glass substrate and has a thickness t of substantially 0.7 mm, a radius R3 of the first curved portion 311 of the predetermined cutting line 31 is between 2 mm and 100 mm, and a second curved portion 331 of the initial infeed line 33 The radius R4 is between 10 mm and 10,000 mm, the scoring speed of the initial infeed line 33 is 10 to 30 mm per second (mm/s), and the cutting pressure for scoring the initial infeed line 33 is scheduled for scoring Under the condition of the minimum cutting pressure of the cutting line 31, the length d of one of the cracks 35 produced by the cutting method of the present invention is substantially about 100 micrometers (μm). Comparing Figures 1B and 3B, the cracks 35 produced by the cutting method of the present invention are substantially smaller than the cracks 15 produced by conventional cutting methods.

Referring to Figures 3A and 4, the cutting apparatus 3 of the present invention is adapted to apply the cutting method of the present invention and to cut the glass substrate 9 along a predetermined cutting line 31. The cutting device 3 of the present invention comprises a cutting tool 39, and the cutting device 3 is adapted The following steps of the cutting method of the present invention are performed by the cutting tool 39. In step (a), the glass substrate 9 is scored along the initial feed line 33 from the initial feed point 330 on the cutting surface 90. The initial feed line 33 is connected to the first curved section 311 of the predetermined cutting line 31 at the connection point 310, and the initial feed line 33 has a second curved section 331 adjacent to the connection point 310. It should be noted that the first curvature of the first curved section 311 of the present invention is multiplied by the second curvature of the second curved section 331 to a positive value, that is, the curvature center C3 of the first curvature of the first curved section 311 and the first The center of curvature C4 of the second curvature of the two curved segments 331 is located on the same side of the first curved segment 311 and the second curved segment 331.

In step (a), after the glass substrate 9 is scribed along the initial infeed line 33 along the initial infeed line 33, through the second curved section 331 and the connection point 310, in step (b), the predetermined cutting line is continued. The first curved section 311 of 31 scribes the glass substrate 9 on the cutting surface 90.

In the conventional cutting method, the difference from the present invention is that the first curvature of the first curved section 111 is multiplied by the second curvature of the second curved section 131 to a negative value, that is, the first curvature of the first curved section 111. The center of curvature C2 of the second curvature of the center of curvature C1 and the second curve segment 131 is located on the opposite side of the first curve segment 111 and the second curve segment 131. Therefore, the glass substrate 9 which has been scribed by the conventional cutting method tends to leave the lobes 17 in the glass product 10 after being split, which causes many problems, but the present invention does not have the problems of the above-described conventional cutting method.

In a preferred embodiment of the cutting apparatus 3 of the present invention, as shown in FIG. 3C, the predetermined cutting line 31 surrounds the edge of the glass product 30 and is connected back to the connection point 310. Therefore, after the step (b), the cutting device 3 is more suitable to utilize the cutting tool 39. The following steps are performed: (c) scribing the glass substrate 9 on the cutting surface 90 along the predetermined cutting line 31 back to the connection point 310; and (d) stopping the scribed glass substrate 9 at the connection point 310.

After performing the step (d), the cutting device 3 is preferably adapted to perform the step (e) of splitting the glass substrate 9 along the predetermined cutting line 31 into a plurality of portions to produce the glass product 30. As described above in the cutting method of the present invention, the above step (e) may employ various methods for promoting the development of the cracking of the glass substrate 9, so that the glass substrate 9 is split into a plurality of portions along the predetermined cutting line 31, and the glass product 30 is produced. Further, the cutting apparatus 3 of the present invention is also incapable of performing the above step (e), and the glass substrate 9 is naturally split into a plurality of portions along the predetermined cutting line 31, and the glass product 30 is produced.

The cutting tool 31 of the cutting apparatus 3 of the present invention can scribe the glass substrate 9 by a laser irradiation, a grinding stone polishing, a diamond knife dicing, a cutting wheel cutting or the like as described above. The cutting device 3 of the present invention applies the details of the cutting method of the present invention as described above, and details are not described herein again.

With the cutting method and cutting apparatus 3 of the present invention, the glass product 30 cut and split by the glass substrate 9 will not have the lobes 17 caused by the conventional cutting method, and the cracks 35 on the glass product 30 are also smaller than Know the crack caused by the cutting method. Therefore, the cutting method and cutting apparatus 3 of the present invention can eliminate the time and cost of the subsequent process of removing the lobes 17. Further, the cutting method and the cutting apparatus of the present invention can avoid various problems caused by incomplete grinding of the lobes 17, for example, the glass product 30 does not achieve the desired shape, or the positioning or assembly is caused by the lobes 17. , in turn, causes various problems of yield decline. Furthermore, the crack on the glass product 30 35 It is also possible to make the glass product 30 more capable of achieving the desired shape and having a higher yield.

The above embodiments are merely illustrative of preferred embodiments of the invention and are not intended to limit the invention. Those skilled in the art can easily refer to other embodiments with reference to the above embodiments. The patent scope of this case shall be subject to the scope of the patent application.

10‧‧‧glass products

11‧‧‧Predetermined cutting line

110‧‧‧ Connection point

111‧‧‧First curve segment

13‧‧‧Initial feed line

130‧‧‧Initial infeed point

131‧‧‧second curve segment

15‧‧‧ crack

17‧‧‧ lobes

3‧‧‧Cutting equipment

30‧‧‧glass products

31‧‧‧Predetermined cutting line

310‧‧‧ Connection point

311‧‧‧First curve segment

33‧‧‧Initial feed line

330‧‧‧Initial infeed point

331‧‧‧second curve segment

35‧‧‧ crack

39‧‧‧Cutting tools

9‧‧‧ glass substrate

90‧‧‧ cutting surface

91‧‧‧Stretching layer

92‧‧‧Compressed layer

C1‧‧‧ Curvature Center

C2‧‧‧ Curvature Center

C3‧‧‧ Curvature Center

C4‧‧‧ Curvature Center

D‧‧‧ length

H‧‧‧height

Radius of R1‧‧

Radius of R2‧‧

Radius of R3‧‧

Radius of R4‧‧

T‧‧‧thickness

1 is a schematic cross-sectional view of a conventional tempered glass substrate; FIG. 2A is a schematic view showing a scribed path of a conventional cutting method; FIG. 2B is an enlarged schematic view of a glass substrate along a cutting path of a conventional cutting method; 3A is a schematic diagram of a scribed path of the cutting method of the present invention; FIG. 3B is an enlarged schematic view of the glass substrate after the cutting path of the cutting method of the present invention; FIG. 3C is a predetermined cutting line of the cutting method of the present invention surrounding the glass product A schematic view of one of the edges; FIG. 3D is a schematic view showing a scribed path of the cutting method of the present invention when the rounded corners of the glass product are a recessed notch; and FIG. 4 is a schematic view of one of the cutting devices of the present invention.

30‧‧‧glass products

31‧‧‧Predetermined cutting line

310‧‧‧ Connection point

311‧‧‧First curve segment

33‧‧‧Initial feed line

330‧‧‧Initial infeed point

331‧‧‧second curve segment

9‧‧‧ glass substrate

C3‧‧‧ Curvature Center

C4‧‧‧ Curvature Center

Radius of R3‧‧

Radius of R4‧‧

Claims (18)

A cutting method for cutting a glass substrate along a predetermined cutting line, wherein the glass substrate has a cutting surface, the predetermined cutting line is located on the cutting surface and has a first curved section, the first curved section has a first a curvature, and the cutting method comprises the steps of: (a) scribing the glass substrate along an initial infeed line from an initial infeed point, wherein the initial infeed line is connected to the connection point at a connection point Determining the first curved segment of the cutting line, and the initial infeed line has a second curved segment adjacent to the connecting point, the second curved segment having a second curvature, the first curvature being multiplied by the second curvature a positive value; and (b) after step (a), continuing the first curved section along the predetermined cutting line to scribe the glass substrate on the cutting surface. The cutting method of claim 1, wherein the predetermined cutting line is connected back to the connecting point, and after the step (b), the cutting method further comprises the step of: (c) following the predetermined cutting line on the cutting surface Marking the glass substrate back to the connection point; and (d) stopping marking the glass substrate at the connection point. The cutting method according to claim 2, wherein after the step (d), the cutting method further comprises the step of: (e) splitting the glass substrate into a plurality of portions along the predetermined cutting line. The cutting method of claim 1, wherein the first curved section of the predetermined cutting line is a rounded corner. The cutting method of claim 4, wherein the rounded corner of the first curved section It has a radius of between 2 mm and 100 mm. The cutting method of claim 1, wherein the second curved section of the initial infeed line is a rounded corner. The cutting method of claim 6, wherein the rounded corner of the second curve has a radius of between 10 mm and 10,000 mm. The cutting method of claim 1, wherein the glass substrate is a tempered glass substrate comprising a tensile layer and a compression layer formed on the tensile layer, and the cutting surface is located in the compression On the floor. The cutting method of claim 1, wherein the cutting method is performed by laser irradiation, a grindstone grinding, a diamond knife scribing or a cutting wheel cutting to scribe the glass substrate. A cutting apparatus for cutting a glass substrate along a predetermined cutting line, wherein the glass substrate has a cutting surface, the predetermined cutting line is located on the cutting surface and has a first curved section, the first curved section has a first a curvature, and the cutting apparatus includes a cutting tool, and the cutting apparatus is adapted to perform the following steps by using the cutting tool: (a) scribing the glass along an initial infeed line from an initial infeed point on the cutting surface a substrate, wherein the initial feed line is connected to the first curved segment of the predetermined cutting line at a connection point, and the initial feed line has a second curved segment adjacent to the connection point, the second curved segment having a a second curvature, the first curvature multiplied by the second curvature to a positive value; and (b) after the step (a), continuing to mark the first curved section along the predetermined cutting line on the cutting surface glass substrate. The cutting device of claim 10, wherein the predetermined cutting line is surrounded by Returning to the connection point, after the step (b), the cutting device is adapted to perform the following steps by using the cutting tool: (c) scribing the glass substrate on the cutting surface along the predetermined cutting line and returning to the connection point And (d) stop scoring the glass substrate at the connection point. The cutting apparatus of claim 11, wherein the cutting apparatus is adapted to perform the following steps after the step (d): (e) splitting the glass substrate into a plurality of portions along the predetermined cutting line. The cutting apparatus of claim 10, wherein the first curved section of the predetermined cutting line is a rounded corner. The cutting apparatus of claim 13, wherein the rounded corner of the first curved section has a radius of between 2 mm and 100 mm. The cutting apparatus of claim 10, wherein the second curved section of the initial infeed line is a rounded corner. The cutting apparatus of claim 15, wherein the rounded corner of the second curve has a radius between 10 mm and 10,000 mm. The cutting device of claim 10, wherein the glass substrate is a tempered glass substrate comprising a tensile layer and a compression layer formed on the tensile layer, and the cutting surface is located in the compression On the floor. The cutting apparatus of claim 10, wherein the cutting tool is scribed with a laser, a grindstone, a diamond knife scribe or a cutting wheel to scribe the glass substrate.