TWI507371B - Cutting method and cutting apparatus - Google Patents
Cutting method and cutting apparatus Download PDFInfo
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本發明係關於一種切割方法及切割設備,特別關於一種切割一玻璃基板之切割方法及切割設備。The invention relates to a cutting method and a cutting device, in particular to a cutting method and a cutting device for cutting a glass substrate.
目前玻璃基板廣泛運用在電子產品之各種零件中,如螢幕、外殼等。在製造過程中,玻璃基板均需切割為較小尺寸之玻璃基板以配合各式裝置之應用,尤其,為適應最終產品使用之需要,許多玻璃基板表面必須經過強化處理,使得切割製程更加困難、良率不易提升。因此,如何切割玻璃基板避免缺陷產生,並使玻璃基板沿預定切割線分裂,為此一業界之重要課題。At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. In the manufacturing process, the glass substrate needs to be cut into a smaller size glass substrate to meet the application of various devices. In particular, in order to meet the needs of the final product, many glass substrate surfaces must be strengthened to make the cutting process more difficult. The yield is not easy to improve. Therefore, how to cut a glass substrate to avoid defects and cause the glass substrate to split along a predetermined cutting line is an important issue in the industry.
請參考圖1A及1B,玻璃基板1包含一第一表面11及與第一表面11相對之一第二表面12。習知切割方法自玻璃基板1之邊緣14向內進刀以沿一第一預定切割線311於第一表面11上刻劃玻璃基板1,以形成一第一刻劃開口321。然而,於切割設備的切割頭391自玻璃基板1之邊緣14外部向內進刀時會碰撞玻璃基板1之邊緣14,而使得切割頭391發生切割壓力不穩定及震動,進而造成玻璃基板1之邊緣14缺陷(如圖1B所示)、切割頭391於玻璃基板1刻劃形成之第一刻劃開口321不完整而有時刻劃過深或過淺(如圖1B所示)及龜裂不受控制地、未大致沿預定切割線發展(如圖1A所示)等諸多缺陷。Referring to FIGS. 1A and 1B , the glass substrate 1 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The conventional cutting method feeds inwardly from the edge 14 of the glass substrate 1 to scribe the glass substrate 1 on the first surface 11 along a first predetermined cutting line 311 to form a first scribed opening 321 . However, when the cutting head 391 of the cutting device injects the blade inward from the outside of the edge 14 of the glass substrate 1, it will collide with the edge 14 of the glass substrate 1, causing the cutting head 391 to be unstable and vibrated, thereby causing the glass substrate 1 to The edge 14 defect (as shown in FIG. 1B), the first scribe opening 321 formed by the cutting head 391 on the glass substrate 1 is incomplete, and the time is too deep or too shallow (as shown in FIG. 1B) and the crack is not A number of defects, such as being controlled, not generally along a predetermined cutting line (as shown in Figure 1A).
請參考圖2,於需要將玻璃基板1沿複數相互相交之不同預定切 割線刻劃玻璃基板1之情況下,習知切割方法首先沿複數第一預定切割線311自邊緣14於第一表面11上刻劃玻璃基板1,以形成複數第一刻劃開口321(如圖1A及1B所示),此時玻璃基板尚未分斷;爾後沿複數與第一預定切割線311相交之第二預定切割線312於相同之第一表面11上刻劃玻璃基板1,以形成複數第二刻劃開口,進而沿第一刻劃開口321及第二刻劃開口分斷玻璃基板以形成玻璃產品。然而,習知切割方法在刻劃第二預定切割線312時將經過第一預定切割線311,因此,切割頭必須橫越過沿著第一預定切割線311刻劃形成之第一刻劃開口321,此將使切割頭391在刻劃第二預定切割線312時於第一預定切割線311與第二預定切割線312之交點313發生切割壓力不穩定、切割頭391撞擊第一刻劃開口321而震動,而使得交點313附近發生缺陷、刻劃不完整及龜裂不受控制地發展而產生諸多缺陷(類似於圖1A及1B所示切割頭391撞擊玻璃基板1之邊緣14之情況)。Please refer to FIG. 2, in which it is necessary to cut the glass substrate 1 along the plural. In the case where the secant line scribes the glass substrate 1, the conventional cutting method first scribes the glass substrate 1 on the first surface 11 from the edge 14 along the plurality of first predetermined cutting lines 311 to form a plurality of first scribe openings 321 (as shown in the figure). 1A and 1B), at this time, the glass substrate has not been broken; the second predetermined cutting line 312 intersecting the first predetermined cutting line 311 is scribed on the same first surface 11 to form a plurality of glass substrates 1 to form a plurality The second scribes the opening to further separate the glass substrate along the first scribe opening 321 and the second scribe opening to form a glass product. However, the conventional cutting method will pass the first predetermined cutting line 311 when the second predetermined cutting line 312 is scored, and therefore, the cutting head must traverse the first scribed opening 321 formed along the first predetermined cutting line 311. This will cause the cutting head 391 to cause the cutting pressure to be unstable at the intersection 313 of the first predetermined cutting line 311 and the second predetermined cutting line 312 when the second predetermined cutting line 312 is scored, and the cutting head 391 hits the first scribe opening 321 The vibration causes the defects to occur near the intersection 313, the incomplete scribing, and the uncontrolled development of the crack to produce a plurality of defects (similar to the case where the cutting head 391 hits the edge 14 of the glass substrate 1 as shown in Figs. 1A and 1B).
有鑑於此,如何於刻劃一玻璃基板時避免發生撞擊現象及刻劃不完整,而避免玻璃產品之缺陷產生,實為本發明所屬技術領域亟待解決之課題。In view of this, how to avoid the occurrence of impact phenomenon and incomplete scribing when scribing a glass substrate, and avoiding defects of the glass product is an urgent problem to be solved in the technical field to which the present invention pertains.
本發明之一目的在於提供一種切割一玻璃基板形成複數玻璃產品之切割方法及切割設備,其可避免在刻劃玻璃基板時發生撞擊現象及刻劃不完整,而減少於分斷形成玻璃產品時產生缺陷。其中,玻璃基板包含一第一表面及與第一表面相對之一第二表面。An object of the present invention is to provide a cutting method and a cutting device for cutting a glass substrate to form a plurality of glass products, which can avoid the occurrence of impact phenomenon and incomplete scoring when scribing the glass substrate, and reduce the formation of the glass product when breaking. Produce defects. Wherein, the glass substrate comprises a first surface and a second surface opposite to the first surface.
為達上述目的,本發明切割方法包含以下步驟:(a)沿一第一預定切割線於第一表面上刻劃玻璃基板,以形成一第一刻劃開口;(b)沿一第二預定切割線於第二表面上刻劃玻璃基板,以形成一第二刻劃開口,其中當第二預定切割線正投影至第一表面時,第二預定切割線與第一預定切割線相交;及(c)沿第一刻劃開口分斷玻璃基板,及沿 第二刻劃開口分斷玻璃基板,以形成玻璃產品。To achieve the above object, the cutting method of the present invention comprises the steps of: (a) scribing the glass substrate on the first surface along a first predetermined cutting line to form a first scribed opening; (b) following a second predetermined The cutting line scribing the glass substrate on the second surface to form a second scribed opening, wherein the second predetermined cutting line intersects the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface; (c) separating the glass substrate along the first scribe opening, and along The second scribe opening breaks the glass substrate to form a glass product.
為達上述目的,本發明切割設備包含一第一切割頭、一第二切割頭及一分斷裝置。第一切割頭用以沿一第一預定切割線於第一表面上刻劃玻璃基板,以形成一第一刻劃開口。第二切割頭用以沿一第二預定切割線於第二表面上刻劃玻璃基板,以形成一第二刻劃開口。當第二預定切割線正投影至第一表面時,第二預定切割線與第一預定切割線相交。分斷裝置用以沿於第一表面上之第一刻劃開口及沿於第二表面上之第二刻劃開口分斷玻璃基板,以形成玻璃產品。To achieve the above object, the cutting apparatus of the present invention comprises a first cutting head, a second cutting head and a breaking device. The first cutting head is configured to scribe the glass substrate on the first surface along a first predetermined cutting line to form a first scribed opening. The second cutting head is configured to scribe the glass substrate on the second surface along a second predetermined cutting line to form a second scribe opening. The second predetermined cutting line intersects the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface. The breaking device is configured to break the glass substrate along the first scribe opening on the first surface and the second scribe opening on the second surface to form a glass product.
1‧‧‧玻璃基板1‧‧‧ glass substrate
101‧‧‧拉伸層101‧‧‧Stretch layer
102‧‧‧壓縮層102‧‧‧Compression layer
11‧‧‧第一表面11‧‧‧ first surface
12‧‧‧第二表面12‧‧‧ second surface
14‧‧‧邊緣14‧‧‧ edge
311‧‧‧第一預定切割線311‧‧‧First scheduled cutting line
312‧‧‧第二預定切割線312‧‧‧Second scheduled cutting line
313‧‧‧交點313‧‧‧ intersection
321‧‧‧第一刻劃開口321‧‧‧ first scribe opening
391‧‧‧切割頭391‧‧‧ cutting head
511‧‧‧第一預定切割線511‧‧‧First scheduled cutting line
512‧‧‧第二預定切割線512‧‧‧second scheduled cutting line
521‧‧‧第一刻劃開口521‧‧‧ first scribe opening
522‧‧‧第二刻劃開口522‧‧‧second scribe opening
531‧‧‧第一初始位置531‧‧‧First initial position
532‧‧‧第二初始位置532‧‧‧ second initial position
541‧‧‧第一初始缺口541‧‧‧ first initial gap
542‧‧‧第二初始缺口542‧‧‧ second initial gap
591‧‧‧第一切割頭591‧‧‧First cutting head
592‧‧‧第二切割頭592‧‧‧Second cutting head
D‧‧‧深度D‧‧‧Deep
D‧‧‧深度D‧‧‧Deep
t‧‧‧厚度T‧‧‧thickness
圖1A係習知切割方法自玻璃基板邊緣刻劃玻璃基板之一立體示意圖;圖1B係習知切割方法自玻璃基板邊緣刻劃玻璃基板之沿實際刻劃開口之一剖面示意圖;圖2係習知切割方法沿複數相交預定切割線刻劃玻璃基板之一示意圖;圖3係本發明切割方法及切割設備沿複數預定切割線刻劃玻璃基板之一示意圖;圖4A至4C係本發明切割方法及切割設備先形成第一初始缺口後再刻劃形成第一刻劃開口之示意圖;及圖5A至5C係本發明切割方法及切割設備先形成第二初始缺口後再刻劃形成第二刻劃開口之示意圖。1A is a schematic perspective view of a conventional glass cutting substrate from a glass substrate edge; FIG. 1B is a schematic cross-sectional view of a conventional dicing opening from a glass substrate edge along the edge of the glass substrate; FIG. FIG. 3 is a schematic view showing a cutting glass substrate of the present invention along a plurality of predetermined cutting lines; FIG. 3 is a schematic view showing a cutting method of the present invention; The cutting device first forms a first initial notch and then scribes a first scribed opening; and FIGS. 5A to 5C show that the cutting method and the cutting device of the present invention first form a second initial notch and then scribe to form a second scribed opening Schematic diagram.
請參考圖3,玻璃基板1包含一第一表面11及與第一表面11相對之一第二表面12。本發明切割玻璃基板以形成複數玻璃產品之切割方法包含以下步驟。步驟(a):沿一第一預定切割線511於第一表面11上刻劃玻璃基板1,以形成一第一刻劃開口521(如圖4C所示)。步驟(b): 沿一第二預定切割線512於第二表面12上刻劃玻璃基板1,以形成一第二刻劃開口522(如圖5C所示)。其中,當第二預定切割線512正投影至第一表面時11,第二預定切割線512之投影線與第一預定切割線511相交。步驟(c):沿第一刻劃開口521分斷玻璃基板1,及沿第二刻劃開口522分斷玻璃基板1,以形成複數玻璃產品。如圖3所示,就一般實施例而言,當第二預定切割線512正投影至第一表面11時,第二預定切割線512與第一預定切割線511垂直,然此不必然構成對本發明實施方式之限制。於步驟(c)中,可使用例如彎曲玻璃基板1等之習知分斷方法分斷玻璃基板1,以形成複數玻璃產品。Referring to FIG. 3 , the glass substrate 1 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The cutting method of the present invention for cutting a glass substrate to form a plurality of glass products comprises the following steps. Step (a): the glass substrate 1 is scribed on the first surface 11 along a first predetermined cutting line 511 to form a first scribed opening 521 (as shown in FIG. 4C). Step (b): The glass substrate 1 is scribed on the second surface 12 along a second predetermined cutting line 512 to form a second scribed opening 522 (shown in Figure 5C). Wherein, when the second predetermined cutting line 512 is projected onto the first surface 11, the projection line of the second predetermined cutting line 512 intersects the first predetermined cutting line 511. Step (c): the glass substrate 1 is separated along the first scribe opening 521, and the glass substrate 1 is separated along the second scribe opening 522 to form a plurality of glass products. As shown in FIG. 3, in the case of the general embodiment, when the second predetermined cutting line 512 is projected onto the first surface 11, the second predetermined cutting line 512 is perpendicular to the first predetermined cutting line 511, which does not necessarily constitute a pair. Limitations of embodiments of the invention. In the step (c), the glass substrate 1 can be separated by a conventional breaking method such as bending the glass substrate 1 to form a plurality of glass products.
請參考圖3。步驟(a)中可沿複數第一預定切割線511於第一表面11上刻劃玻璃基板1,以形成複數第一刻劃開口521。步驟(b)係可沿複數第二預定切割線512於第二表面12上刻劃玻璃基板1,以形成複數第二刻劃開口522,並且當第二預定切割線512正投影至第一表面11時,複數第二預定切割線512之投影線與複數第一預定切割線511相交。Please refer to Figure 3. In step (a), the glass substrate 1 may be scribed on the first surface 11 along the plurality of first predetermined cutting lines 511 to form a plurality of first scribe openings 521. Step (b) may scribe the glass substrate 1 on the second surface 12 along the plurality of second predetermined cutting lines 512 to form a plurality of second scribe openings 522, and when the second predetermined cutting line 512 is projected onto the first surface At 11 o'clock, the projection line of the plurality of second predetermined cutting lines 512 intersects the plurality of first predetermined cutting lines 511.
藉此,本發明之切割方法可避免習知切割方法在刻劃第二預定切割線312時橫越過沿第一預定切割線311刻劃形成之第一刻劃開口321,故不會發生於第一預定切割線311與第二預定切割線312之交點313處發生切割壓力不穩定、切割頭391撞擊已刻劃處而震動,造成交點313附近刻劃不完整及龜裂不受控制地發展而產生諸多缺陷。Therefore, the cutting method of the present invention can prevent the conventional cutting method from traversing the first scribe opening 321 formed along the first predetermined cutting line 311 when the second predetermined cutting line 312 is scribed, and thus does not occur in the first The cutting pressure is unstable at the intersection 313 of a predetermined cutting line 311 and the second predetermined cutting line 312, and the cutting head 391 strikes the scribed portion to vibrate, resulting in incomplete scribe along the intersection 313 and uncontrolled development of the crack. There are many defects.
本發明可進一步以如下方式實施:請參考圖4A至4C,步驟(a)中,於開始刻劃玻璃基板時,係離開玻璃基板1之所有邊緣14一段距離,於第一表面11上第一預定切割線511之如圖4A所示之一第一初始位置531形成如圖4C所示之一第一初始缺口541,然後如圖4B所示於第一表面11上自第一初始缺口541沿第一預定切割線511刻劃玻璃基板1以形成如圖4C所示之第一刻劃開口521。The present invention can be further implemented in the following manner: Referring to FIG. 4A to FIG. 4C, in step (a), when the glass substrate is initially scribed, it is separated from all edges 14 of the glass substrate 1 by a distance, first on the first surface 11. The first initial position 531 of the predetermined cutting line 511 as shown in FIG. 4A forms a first initial gap 541 as shown in FIG. 4C, and then along the first initial gap 541 on the first surface 11 as shown in FIG. 4B. The first predetermined cutting line 511 scribing the glass substrate 1 to form a first scribed opening 521 as shown in FIG. 4C.
請參考圖5A至5C,步驟(b)中,於開始刻劃玻璃基板之第二表面12時,係離開玻璃基板1之所有邊緣14,於第二表面12上第二預定切割線512之如圖5A所示之一第二初始位置532形成如圖5C所示之一第二初始缺口542,並如圖5B所示於第二表面12上自第二初始缺口542沿第二預定切割線512刻劃玻璃基板1以形成如圖5C所示之第二刻劃開口522。Referring to FIGS. 5A to 5C, in step (b), when the second surface 12 of the glass substrate is first scribed, all edges 14 of the glass substrate 1 are removed, and the second predetermined cutting line 512 is removed from the second surface 12. A second initial position 532 shown in FIG. 5A forms a second initial notch 542 as shown in FIG. 5C, and along the second predetermined cut line 512 from the second initial notch 542 on the second surface 12 as shown in FIG. 5B. The glass substrate 1 is scribed to form a second scribed opening 522 as shown in FIG. 5C.
藉此,本發明之切割方法可避免習知切割方法自玻璃基板1之邊緣14外部向內進刀刻劃玻璃基板1時,切割頭391碰撞玻璃基板1之邊緣14,而使得切割頭391發生切割壓力不穩定及震動,進而造成玻璃基板1之邊緣14缺陷、切割頭391刻劃玻璃基板1不完整及龜裂不受控制地發展等諸多缺陷。Thereby, the cutting method of the present invention can prevent the conventional cutting method from scratching the glass substrate 1 from the outside of the edge 14 of the glass substrate 1, and the cutting head 391 collides with the edge 14 of the glass substrate 1, so that the cutting head 391 occurs. The cutting pressure is unstable and vibrates, which in turn causes defects such as defects in the edge 14 of the glass substrate 1, incomplete etching of the glass substrate 1 by the cutting head 391, and uncontrolled development of cracks.
請參考圖4C及5C,當玻璃基板1係一強化玻璃基板時,玻璃基板1包含一拉伸層101及形成於拉伸層101上並界定第一表面11及第二表面12之二壓縮層102。拉伸層101具有拉伸內應力,而壓縮層102具有壓縮內應力並具有一厚度t。此時,步驟(a)及步驟(b)所形成之第一初始缺口541及第二初始缺口542之一深度d小於壓縮層102之厚度t,以防止於形成第一初始缺口541及第二初始缺口542後,龜裂立即在拉伸層101中延展進而造成玻璃基板1未沿第一預定切割線511或第二預定切割線512分裂或其他缺陷。再者,第一刻劃開口521及第二刻劃開口522之一深度D則大於壓縮層102之厚度t,而部分進入拉伸層102,以利分斷作業時龜裂沿第一刻劃開口521及第二刻劃開口522發展。4C and 5C, when the glass substrate 1 is a tempered glass substrate, the glass substrate 1 includes a tensile layer 101 and two compression layers formed on the tensile layer 101 and defining the first surface 11 and the second surface 12. 102. The stretched layer 101 has a tensile internal stress, and the compressed layer 102 has a compressive internal stress and has a thickness t. At this time, the depth d of one of the first initial gap 541 and the second initial gap 542 formed by the steps (a) and (b) is smaller than the thickness t of the compression layer 102 to prevent the first initial gap 541 and the second from being formed. Immediately after the initial gap 542, the crack propagates in the stretched layer 101 to cause the glass substrate 1 to not split along the first predetermined cut line 511 or the second predetermined cut line 512 or other defects. Furthermore, the depth D of the first scribe opening 521 and the second scribe opening 522 is greater than the thickness t of the compression layer 102, and partially enters the tensile layer 102 to facilitate the crack along the first scribe during the breaking operation. The opening 521 and the second scoring opening 522 develop.
於步驟(a)及步驟(b)中,本發明之切割方法可以一雷射照射、一研磨石研磨、一鑽石刀刻劃或一切割輪切割以形成第一初始缺口541及第二初始缺口542,並且可以一雷射照射、一研磨石研磨、一鑽石刀刻劃或一切割輪切割以形成第一刻劃開口521及第二刻劃開口522。In the steps (a) and (b), the cutting method of the present invention may be a laser irradiation, a grinding stone grinding, a diamond knife scribing or a cutting wheel cutting to form a first initial gap 541 and a second initial gap. 542, and may be a laser irradiation, a grinding stone grinding, a diamond knife scoring or a cutting wheel cutting to form a first scoring opening 521 and a second scoring opening 522.
請參考圖3,本發明切割設備包含一第一切割頭591、一第二切 割頭592及一分斷裝置(圖未示,可使用例如藉由沿著預定切割線彎曲玻璃基板1使其分斷等習知之分斷裝置)。第一切割頭591用以沿一第一預定切割線511於第一表面11上刻劃玻璃基板1,以形成如圖4C所示之一第一刻劃開口521。第二切割頭592用以沿一第二預定切割線512於第二表面12上刻劃玻璃基板1,以形成如圖5C所示之一第二刻劃開口522。其中,當第二預定切割線512正投影至第一表面11時,第二預定切割線512之投影線與第一預定切割線511相交。如圖3所示,一般而言當第二預定切割線512正投影至第一表面11時,第二預定切割線512與第一預定切割線511垂直。分斷裝置用以沿於第一表面11上之第一刻劃開口521及沿於第二表面11上之第二刻劃開口522分斷玻璃基板1,以形成玻璃產品。Referring to FIG. 3, the cutting apparatus of the present invention comprises a first cutting head 591 and a second cutting. The cutting head 592 and a breaking device (not shown, for example, a conventional breaking device such as being bent by bending the glass substrate 1 along a predetermined cutting line) can be used. The first cutting head 591 is used to scribe the glass substrate 1 on the first surface 11 along a first predetermined cutting line 511 to form a first scribe opening 521 as shown in FIG. 4C. The second cutting head 592 is used to scribe the glass substrate 1 on the second surface 12 along a second predetermined cutting line 512 to form a second scribed opening 522 as shown in FIG. 5C. Wherein, when the second predetermined cutting line 512 is projected onto the first surface 11, the projection line of the second predetermined cutting line 512 intersects the first predetermined cutting line 511. As shown in FIG. 3, generally, when the second predetermined cutting line 512 is projected onto the first surface 11, the second predetermined cutting line 512 is perpendicular to the first predetermined cutting line 511. The breaking device is configured to break the glass substrate 1 along the first scribe opening 521 on the first surface 11 and the second scribe opening 522 on the second surface 11 to form a glass product.
如圖3所示,第一切割頭591可沿複數第一預定切割線511於第一表面11上刻劃玻璃基板1,以形成複數第一刻劃開口521,而第二切割頭592可沿複數第二預定切割線512於第二表面12上刻劃玻璃基板1,以形成複數第二刻劃開口522,並且當複數第二預定切割線512正投影至第一表面11時,複數第二預定切割線512之投影線與複數第一預定切割線511相交。As shown in FIG. 3, the first cutting head 591 can scribe the glass substrate 1 on the first surface 11 along the plurality of first predetermined cutting lines 511 to form a plurality of first scribe openings 521, and the second cutting head 592 can be along The plurality of second predetermined cutting lines 512 scribing the glass substrate 1 on the second surface 12 to form a plurality of second scribe openings 522, and when the plurality of second predetermined cutting lines 512 are projected onto the first surface 11, plural The projection line of the predetermined cutting line 512 intersects the plurality of first predetermined cutting lines 511.
請參考圖4A至4C,第一切割頭591可離開玻璃基板1之所有邊緣14一段距離,於第一表面11上第一預定切割線511之如圖4A所示之一第一初始位置531形成如圖4C所示之一第一初始缺口541,並如圖4B所示於第一表面11上自第一初始缺口541沿第一預定切割線511刻劃玻璃基板1以形成如圖4C所示之第一刻劃開口521。Referring to FIGS. 4A to 4C, the first cutting head 591 can be separated from all the edges 14 of the glass substrate 1 by a distance from the first predetermined cutting line 511 on the first surface 11 to form a first initial position 531 as shown in FIG. 4A. A first initial gap 541 is shown in FIG. 4C, and the glass substrate 1 is scribed on the first surface 11 from the first initial gap 541 along the first predetermined cutting line 511 as shown in FIG. 4B to form a metal substrate 1 as shown in FIG. 4C. The first scribes the opening 521.
請參考圖5A至5C,第二切割頭592可離開玻璃基板1之所有邊緣14一段距離,於第二表面12上第二預定切割線512之如圖5A所示之一第二初始位置532形成如圖5C所示之一第二初始缺口542,並如圖5B所示於第二表面12上自第二初始缺口542沿第二預定切割線512刻劃玻 璃基板1以形成如圖5C所示之第二刻劃開口522。Referring to FIGS. 5A through 5C, the second cutting head 592 can be separated from all edges 14 of the glass substrate 1 by a distance from the second predetermined cutting line 512 on the second surface 12 to form a second initial position 532 as shown in FIG. 5A. A second initial gap 542 as shown in FIG. 5C, and scribed on the second surface 12 from the second initial gap 542 along the second predetermined cutting line 512 as shown in FIG. 5B The glass substrate 1 is formed to form a second scribed opening 522 as shown in FIG. 5C.
請參考圖4C及5C,當玻璃基板1係一強化玻璃基板時,玻璃基板1包含一拉伸層101及形成於拉伸層101上並界定第一表面11及第二表面12之二壓縮層102。拉伸層101具有拉伸內應力,而壓縮層102具有壓縮內應力並具有一厚度t。此時,第一切割頭591及第二切割頭592所刻劃形成之第一初始缺口541及第二初始缺口542之一深度d小於壓縮層102之厚度t,以防止形成第一初始缺口541及第二初始缺口542後,龜裂在拉伸層101中延展,進而造成玻璃基板1未沿第一預定切割線511或第二預定切割線512分裂或其他缺陷。再者,第一切割頭591及第二切割頭592所刻劃形成之第一刻劃開口521及第二刻劃開口522之一深度D則大於壓縮層102之厚度t,而部分進入拉伸層102,以利龜裂沿第一刻劃開口521及第二刻劃開口522發展。4C and 5C, when the glass substrate 1 is a tempered glass substrate, the glass substrate 1 includes a tensile layer 101 and two compression layers formed on the tensile layer 101 and defining the first surface 11 and the second surface 12. 102. The stretched layer 101 has a tensile internal stress, and the compressed layer 102 has a compressive internal stress and has a thickness t. At this time, the depth d of the first initial gap 541 and the second initial gap 542 formed by the first cutting head 591 and the second cutting head 592 is smaller than the thickness t of the compression layer 102 to prevent the formation of the first initial gap 541. After the second initial gap 542, the crack propagates in the stretched layer 101, thereby causing the glass substrate 1 not to split along the first predetermined cutting line 511 or the second predetermined cutting line 512 or other defects. Moreover, the depth D of the first scribe opening 521 and the second scribe opening 522 formed by the first cutting head 591 and the second cutting head 592 is greater than the thickness t of the compression layer 102, and the portion enters the stretching. The layer 102 is developed to facilitate cracking along the first scribe opening 521 and the second scribe opening 522.
本發明切割設備之第一切割頭591及第二切割頭592可以一雷射照射、一研磨石研磨、一鑽石刀刻劃或一切割輪切割以形成第一初始缺口541及第二初始缺口542,亦可以一雷射照射、一研磨石研磨、一鑽石刀刻劃或一切割輪切割以形成第一刻劃開口521及第二刻劃開口522。The first cutting head 591 and the second cutting head 592 of the cutting apparatus of the present invention may be laser-irradiated, abraded stone, a diamond knife or a cutting wheel to form a first initial gap 541 and a second initial gap 542. Alternatively, a laser irradiation, a grinding stone grinding, a diamond knife scoring or a cutting wheel cutting may be performed to form a first scoring opening 521 and a second scoring opening 522.
藉此,使用本發明之切割方法及切割設備可避免習知切割方法在切割時發生切割刀頭或雷射頭等因橫越先前已刻劃之開口,產生撞擊、聚焦點不一致等現象而造成切割壓力或施加於基板之能量不穩定、震動等,進而產生刻劃不完整及玻璃產品之諸多缺陷。Thereby, the cutting method and the cutting device of the invention can be used to avoid the phenomenon that the cutting head or the laser head, etc., are caused by the traversing of the previously scribed opening, causing impact, inconsistent focus points, etc. during cutting. The cutting pressure or the energy applied to the substrate is unstable, vibrating, etc., which leads to incomplete scribes and many defects of the glass product.
1‧‧‧玻璃基板1‧‧‧ glass substrate
11‧‧‧第一表面11‧‧‧ first surface
12‧‧‧第二表面12‧‧‧ second surface
14‧‧‧邊緣14‧‧‧ edge
511‧‧‧第一預定切割線511‧‧‧First scheduled cutting line
512‧‧‧第二預定切割線512‧‧‧second scheduled cutting line
591‧‧‧第一切割頭591‧‧‧First cutting head
592‧‧‧第二切割頭592‧‧‧Second cutting head
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Citations (4)
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CN1486285A (en) * | 2001-01-17 | 2004-03-31 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
JP2012000792A (en) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | Method for scribing brittle material substrate |
TW201306102A (en) * | 2011-07-20 | 2013-02-01 | Mitsuboshi Diamond Ind Co Ltd | Breaking device |
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CN1486285A (en) * | 2001-01-17 | 2004-03-31 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
JP2012000792A (en) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | Method for scribing brittle material substrate |
TW201306102A (en) * | 2011-07-20 | 2013-02-01 | Mitsuboshi Diamond Ind Co Ltd | Breaking device |
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