TW201522251A - Cutting method and cutting apparatus - Google Patents

Abstract

A cutting method for cutting a glass substrate and a cutting apparatus implementing the cutting method are provided for forming a plurality of glass products. The glass substrate comprises a first surface and a second surface opposite to the first surface. The cutting method comprises the following steps: (a) scribing the glass substrate on the first surface along a first predetermined cutting line to form a first scribed opening; (b) scribing the glass substrate on the second surface along a second predetermined cutting line to form a second scribed opening, wherein the second predetermined cutting line intersects with the first predetermined cutting line while the second predetermined cutting line is orthographically projected onto the first surface; and (c) breaking the glass substrate along the first scribed opening and breaking the glass substrate along the second scribed opening to produce the glass products.

Description

Cutting method and cutting equipment

The invention relates to a cutting method and a cutting device, in particular to a cutting method and a cutting device for cutting a glass substrate.

At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. In the manufacturing process, the glass substrate needs to be cut into a smaller size glass substrate to meet the application of various devices. In particular, in order to meet the needs of the final product, many glass substrate surfaces must be strengthened to make the cutting process more difficult. The yield is not easy to improve. Therefore, how to cut a glass substrate to avoid defects and cause the glass substrate to split along a predetermined cutting line is an important issue in the industry.

Referring to FIGS. 1A and 1B , the glass substrate 1 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The conventional cutting method feeds inwardly from the edge 14 of the glass substrate 1 to scribe the glass substrate 1 on the first surface 11 along a first predetermined cutting line 311 to form a first scribed opening 321 . However, when the cutting head 391 of the cutting device injects the blade inward from the outside of the edge 14 of the glass substrate 1, it will collide with the edge 14 of the glass substrate 1, causing the cutting head 391 to be unstable and vibrated, thereby causing the glass substrate 1 to The edge 14 defect (as shown in FIG. 1B), the first scribe opening 321 formed by the cutting head 391 on the glass substrate 1 is incomplete, and the time is too deep or too shallow (as shown in FIG. 1B) and the crack is not A number of defects, such as being controlled, not generally along a predetermined cutting line (as shown in Figure 1A).

Please refer to FIG. 2, in which it is necessary to cut the glass substrate 1 along the plural. In the case where the secant line scribes the glass substrate 1, the conventional cutting method first scribes the glass substrate 1 on the first surface 11 from the edge 14 along the plurality of first predetermined cutting lines 311 to form a plurality of first scribe openings 321 (as shown in the figure). 1A and 1B), at this time, the glass substrate has not been broken; the second predetermined cutting line 312 intersecting the first predetermined cutting line 311 is scribed on the same first surface 11 to form a plurality of glass substrates 1 to form a plurality The second scribes the opening to further separate the glass substrate along the first scribe opening 321 and the second scribe opening to form a glass product. However, the conventional cutting method will pass the first predetermined cutting line 311 when the second predetermined cutting line 312 is scored, and therefore, the cutting head must traverse the first scribed opening 321 formed along the first predetermined cutting line 311. This will cause the cutting head 391 to cause the cutting pressure to be unstable at the intersection 313 of the first predetermined cutting line 311 and the second predetermined cutting line 312 when the second predetermined cutting line 312 is scored, and the cutting head 391 hits the first scribe opening 321 The vibration causes the defects to occur near the intersection 313, the incomplete scribing, and the uncontrolled development of the crack to produce a plurality of defects (similar to the case where the cutting head 391 hits the edge 14 of the glass substrate 1 as shown in Figs. 1A and 1B).

In view of this, how to avoid the occurrence of impact phenomenon and incomplete scribing when scribing a glass substrate, and avoiding defects of the glass product is an urgent problem to be solved in the technical field to which the present invention pertains.

An object of the present invention is to provide a cutting method and a cutting device for cutting a glass substrate to form a plurality of glass products, which can avoid the occurrence of impact phenomenon and incomplete scoring when scribing the glass substrate, and reduce the formation of the glass product when breaking. Produce defects. Wherein, the glass substrate comprises a first surface and a second surface opposite to the first surface.

To achieve the above object, the cutting method of the present invention comprises the steps of: (a) scribing the glass substrate on the first surface along a first predetermined cutting line to form a first scribed opening; (b) following a second predetermined The cutting line scribing the glass substrate on the second surface to form a second scribed opening, wherein the second predetermined cutting line intersects the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface; (c) separating the glass substrate along the first scribe opening, and along The second scribe opening breaks the glass substrate to form a glass product.

To achieve the above object, the cutting apparatus of the present invention comprises a first cutting head, a second cutting head and a breaking device. The first cutting head is configured to scribe the glass substrate on the first surface along a first predetermined cutting line to form a first scribed opening. The second cutting head is configured to scribe the glass substrate on the second surface along a second predetermined cutting line to form a second scribe opening. The second predetermined cutting line intersects the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface. The breaking device is configured to break the glass substrate along the first scribe opening on the first surface and the second scribe opening on the second surface to form a glass product.

1‧‧‧ glass substrate

101‧‧‧Stretch layer

102‧‧‧Compression layer

11‧‧‧ first surface

12‧‧‧ second surface

14‧‧‧ edge

311‧‧‧First scheduled cutting line

312‧‧‧Second scheduled cutting line

313‧‧‧ intersection

321‧‧‧ first scribe opening

391‧‧‧ cutting head

511‧‧‧First scheduled cutting line

512‧‧‧second scheduled cutting line

521‧‧‧ first scribe opening

522‧‧‧second scribe opening

531‧‧‧First initial position

532‧‧‧ second initial position

541‧‧‧ first initial gap

542‧‧‧ second initial gap

591‧‧‧First cutting head

592‧‧‧Second cutting head

D‧‧‧Deep

D‧‧‧Deep

T‧‧‧thickness

1A is a schematic perspective view of a conventional glass cutting substrate from a glass substrate edge; FIG. 1B is a schematic cross-sectional view of a conventional dicing opening from a glass substrate edge along the edge of the glass substrate; FIG. FIG. 3 is a schematic view showing a cutting glass substrate of the present invention along a plurality of predetermined cutting lines; FIG. 3 is a schematic view showing a cutting method of the present invention; The cutting device first forms a first initial notch and then scribes a first scribed opening; and FIGS. 5A to 5C show that the cutting method and the cutting device of the present invention first form a second initial notch and then scribe to form a second scribed opening Schematic diagram.

Referring to FIG. 3 , the glass substrate 1 includes a first surface 11 and a second surface 12 opposite to the first surface 11 . The cutting method of the present invention for cutting a glass substrate to form a plurality of glass products comprises the following steps. Step (a): the glass substrate 1 is scribed on the first surface 11 along a first predetermined cutting line 511 to form a first scribed opening 521 (as shown in FIG. 4C). Step (b): The glass substrate 1 is scribed on the second surface 12 along a second predetermined cutting line 512 to form a second scribed opening 522 (shown in Figure 5C). Wherein, when the second predetermined cutting line 512 is projected onto the first surface 11, the projection line of the second predetermined cutting line 512 intersects the first predetermined cutting line 511. Step (c): the glass substrate 1 is separated along the first scribe opening 521, and the glass substrate 1 is separated along the second scribe opening 522 to form a plurality of glass products. As shown in FIG. 3, in the case of the general embodiment, when the second predetermined cutting line 512 is projected onto the first surface 11, the second predetermined cutting line 512 is perpendicular to the first predetermined cutting line 511, which does not necessarily constitute a pair. Limitations of embodiments of the invention. In the step (c), the glass substrate 1 can be separated by a conventional breaking method such as bending the glass substrate 1 to form a plurality of glass products.

Please refer to Figure 3. In step (a), the glass substrate 1 may be scribed on the first surface 11 along the plurality of first predetermined cutting lines 511 to form a plurality of first scribe openings 521. Step (b) may scribe the glass substrate 1 on the second surface 12 along the plurality of second predetermined cutting lines 512 to form a plurality of second scribe openings 522, and when the second predetermined cutting line 512 is projected onto the first surface At 11 o'clock, the projection line of the plurality of second predetermined cutting lines 512 intersects the plurality of first predetermined cutting lines 511.

Therefore, the cutting method of the present invention can prevent the conventional cutting method from traversing the first scribe opening 321 formed along the first predetermined cutting line 311 when the second predetermined cutting line 312 is scribed, and thus does not occur in the first The cutting pressure is unstable at the intersection 313 of a predetermined cutting line 311 and the second predetermined cutting line 312, and the cutting head 391 strikes the scribed portion to vibrate, resulting in incomplete scribe along the intersection 313 and uncontrolled development of the crack. There are many defects.

The present invention can be further implemented in the following manner: Referring to FIG. 4A to FIG. 4C, in step (a), when the glass substrate is initially scribed, it is separated from all edges 14 of the glass substrate 1 by a distance, first on the first surface 11. The first initial position 531 of the predetermined cutting line 511 as shown in FIG. 4A forms a first initial gap 541 as shown in FIG. 4C, and then along the first initial gap 541 on the first surface 11 as shown in FIG. 4B. The first predetermined cutting line 511 scribing the glass substrate 1 to form a first scribed opening 521 as shown in FIG. 4C.

Referring to FIGS. 5A to 5C, in step (b), when the second surface 12 of the glass substrate is first scribed, all edges 14 of the glass substrate 1 are removed, and the second predetermined cutting line 512 is removed from the second surface 12. A second initial position 532 shown in FIG. 5A forms a second initial notch 542 as shown in FIG. 5C, and along the second predetermined cut line 512 from the second initial notch 542 on the second surface 12 as shown in FIG. 5B. The glass substrate 1 is scribed to form a second scribed opening 522 as shown in FIG. 5C.

Thereby, the cutting method of the present invention can prevent the conventional cutting method from scratching the glass substrate 1 from the outside of the edge 14 of the glass substrate 1, and the cutting head 391 collides with the edge 14 of the glass substrate 1, so that the cutting head 391 occurs. The cutting pressure is unstable and vibrates, which in turn causes defects such as defects in the edge 14 of the glass substrate 1, incomplete etching of the glass substrate 1 by the cutting head 391, and uncontrolled development of cracks.

4C and 5C, when the glass substrate 1 is a tempered glass substrate, the glass substrate 1 includes a tensile layer 101 and two compression layers formed on the tensile layer 101 and defining the first surface 11 and the second surface 12. 102. The stretched layer 101 has a tensile internal stress, and the compressed layer 102 has a compressive internal stress and has a thickness t. At this time, the depth d of one of the first initial gap 541 and the second initial gap 542 formed by the steps (a) and (b) is smaller than the thickness t of the compression layer 102 to prevent the first initial gap 541 and the second from being formed. Immediately after the initial gap 542, the crack propagates in the stretched layer 101 to cause the glass substrate 1 to not split along the first predetermined cut line 511 or the second predetermined cut line 512 or other defects. Furthermore, the depth D of the first scribe opening 521 and the second scribe opening 522 is greater than the thickness t of the compression layer 102, and partially enters the tensile layer 102 to facilitate the crack along the first scribe during the breaking operation. The opening 521 and the second scoring opening 522 develop.

In the steps (a) and (b), the cutting method of the present invention may be a laser irradiation, a grinding stone grinding, a diamond knife scribing or a cutting wheel cutting to form a first initial gap 541 and a second initial gap. 542, and may be a laser irradiation, a grinding stone grinding, a diamond knife scoring or a cutting wheel cutting to form a first scoring opening 521 and a second scoring opening 522.

Referring to FIG. 3, the cutting apparatus of the present invention comprises a first cutting head 591 and a second cutting. The cutting head 592 and a breaking device (not shown, for example, a conventional breaking device such as being bent by bending the glass substrate 1 along a predetermined cutting line) can be used. The first cutting head 591 is used to scribe the glass substrate 1 on the first surface 11 along a first predetermined cutting line 511 to form a first scribe opening 521 as shown in FIG. 4C. The second cutting head 592 is used to scribe the glass substrate 1 on the second surface 12 along a second predetermined cutting line 512 to form a second scribed opening 522 as shown in FIG. 5C. Wherein, when the second predetermined cutting line 512 is projected onto the first surface 11, the projection line of the second predetermined cutting line 512 intersects the first predetermined cutting line 511. As shown in FIG. 3, generally, when the second predetermined cutting line 512 is projected onto the first surface 11, the second predetermined cutting line 512 is perpendicular to the first predetermined cutting line 511. The breaking device is configured to break the glass substrate 1 along the first scribe opening 521 on the first surface 11 and the second scribe opening 522 on the second surface 11 to form a glass product.

As shown in FIG. 3, the first cutting head 591 can scribe the glass substrate 1 on the first surface 11 along the plurality of first predetermined cutting lines 511 to form a plurality of first scribe openings 521, and the second cutting head 592 can be along The plurality of second predetermined cutting lines 512 scribing the glass substrate 1 on the second surface 12 to form a plurality of second scribe openings 522, and when the plurality of second predetermined cutting lines 512 are projected onto the first surface 11, plural The projection line of the predetermined cutting line 512 intersects the plurality of first predetermined cutting lines 511.

Referring to FIGS. 4A to 4C, the first cutting head 591 can be separated from all the edges 14 of the glass substrate 1 by a distance from the first predetermined cutting line 511 on the first surface 11 to form a first initial position 531 as shown in FIG. 4A. A first initial gap 541 is shown in FIG. 4C, and the glass substrate 1 is scribed on the first surface 11 from the first initial gap 541 along the first predetermined cutting line 511 as shown in FIG. 4B to form a metal substrate 1 as shown in FIG. 4C. The first scribes the opening 521.

Referring to FIGS. 5A through 5C, the second cutting head 592 can be separated from all edges 14 of the glass substrate 1 by a distance from the second predetermined cutting line 512 on the second surface 12 to form a second initial position 532 as shown in FIG. 5A. A second initial gap 542 as shown in FIG. 5C, and scribed on the second surface 12 from the second initial gap 542 along the second predetermined cutting line 512 as shown in FIG. 5B The glass substrate 1 is formed to form a second scribed opening 522 as shown in FIG. 5C.

4C and 5C, when the glass substrate 1 is a tempered glass substrate, the glass substrate 1 includes a tensile layer 101 and two compression layers formed on the tensile layer 101 and defining the first surface 11 and the second surface 12. 102. The stretched layer 101 has a tensile internal stress, and the compressed layer 102 has a compressive internal stress and has a thickness t. At this time, the depth d of the first initial gap 541 and the second initial gap 542 formed by the first cutting head 591 and the second cutting head 592 is smaller than the thickness t of the compression layer 102 to prevent the formation of the first initial gap 541. After the second initial gap 542, the crack propagates in the stretched layer 101, thereby causing the glass substrate 1 not to split along the first predetermined cutting line 511 or the second predetermined cutting line 512 or other defects. Moreover, the depth D of the first scribe opening 521 and the second scribe opening 522 formed by the first cutting head 591 and the second cutting head 592 is greater than the thickness t of the compression layer 102, and the portion enters the stretching. The layer 102 is developed to facilitate cracking along the first scribe opening 521 and the second scribe opening 522.

The first cutting head 591 and the second cutting head 592 of the cutting apparatus of the present invention may be laser-irradiated, abraded stone, a diamond knife or a cutting wheel to form a first initial gap 541 and a second initial gap 542. Alternatively, a laser irradiation, a grinding stone grinding, a diamond knife scoring or a cutting wheel cutting may be performed to form a first scoring opening 521 and a second scoring opening 522.

Thereby, the cutting method and the cutting device of the invention can be used to avoid the phenomenon that the cutting head or the laser head, etc., are caused by the traversing of the previously scribed opening, causing impact, inconsistent focus points, etc. during cutting. The cutting pressure or the energy applied to the substrate is unstable, vibrating, etc., which leads to incomplete scribes and many defects of the glass product.

1‧‧‧ glass substrate

11‧‧‧ first surface

12‧‧‧ second surface

14‧‧‧ edge

511‧‧‧First scheduled cutting line

512‧‧‧second scheduled cutting line

591‧‧‧First cutting head

592‧‧‧Second cutting head

Claims (16)

A cutting method for cutting a glass substrate for forming a plurality of glass products, wherein the glass substrate comprises a first surface and a second surface opposite to the first surface, the cutting method comprising the steps of: (a) along a The first predetermined cutting line scribes the glass substrate on the first surface to form a first scribe opening; (b) scribes the glass substrate on the second surface along a second predetermined cutting line to form a second scribed opening, wherein when the second predetermined cutting line is projected onto the first surface, a projection line of the second predetermined cutting line intersects the first predetermined cutting line; and (c) along the The first scribe opening on a surface breaks the glass substrate, and the second scribe opening on the second surface breaks the glass substrate to form the glass products. The cutting method of claim 1, wherein: step (a) is to leave all edges of the glass substrate, and a first initial position of the first predetermined cutting line on the first surface forms a first initial gap. And dicing the glass substrate along the first predetermined cutting line from the first initial notch on the first surface to form the first scribe opening; and step (b) is to leave all edges of the glass substrate, a second initial position of the second predetermined cutting line on the second surface forms a second initial gap, and the glass substrate is scribed along the second predetermined cutting line from the second initial notch on the second surface to form The second scribe opening. The cutting method of claim 2, wherein the glass substrate is a tempered glass substrate, and comprises a tensile layer and two compression layers formed on the tensile layer and defining the first surface and the second surface, The tensile layer has tensile internal stress, and the compression The layer has a compressive internal stress and has a thickness, and one of the first initial notch and the second initial notch is deeper than the thickness of the compressive layers. The cutting method of claim 3, wherein one of the first scribe opening and the second scribe opening has a depth greater than the thickness of the compression layers and partially enters the tensile layer. The cutting method of claim 2, wherein the second predetermined cutting line is perpendicular to the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface. The cutting method of claim 2, wherein the step (a) is to scribe the glass substrate on the first surface along the plurality of first predetermined cutting lines to form a plurality of the first scribe openings, step (b) The glass substrate is scribed on the second surface along the plurality of second predetermined cutting lines to form a plurality of the second scribe openings, and when the second predetermined cutting lines are projected onto the first surface, A projection line of the second predetermined cutting line intersects the first predetermined cutting lines. The cutting method of claim 2, wherein the steps (a) and (b) are performed by a laser irradiation, a grinding stone grinding, a diamond knife scribing or a cutting wheel to form the first initial gap and The second initial gap. The cutting method of claim 2, wherein the steps (a) and (b) are performed by a laser irradiation, a grinding stone grinding, a diamond knife dicing or a cutting wheel cutting to form the first scribe opening. And the second scribe opening. A cutting device for cutting a glass substrate, wherein the glass substrate comprises a first surface and a second surface opposite to the first surface, the cutting device comprising: a first cutting head, The first glass substrate is scribed on the first surface along a first predetermined cutting line to form a first scribe opening; and a second cutting head is disposed on the second surface along a second predetermined cutting line Marking the glass substrate to form a second scribe opening, wherein the second predetermined cut a projection line of the second predetermined cutting line intersects the first predetermined cutting line when the secant is projected onto the first surface; and a breaking device for the first scribed opening on the first surface And separating the glass substrate along the second scribe opening on the second surface to form the glass products. The cutting device of claim 9, wherein: the first cutting head leaves all edges of the glass substrate, and a first initial position of the first predetermined cutting line on the first surface forms a first initial gap. And dicing the glass substrate along the first predetermined cutting line from the first initial notch on the first surface to form the first scribe opening; and the second cutting head leaves all edges of the glass substrate, a second initial position of the second predetermined cutting line on the second surface forms a second initial gap, and the glass substrate is scribed along the second predetermined cutting line from the second initial notch on the second surface to form The second scribe opening. The cutting device of claim 10, wherein the glass substrate is a tempered glass substrate and comprises a stretched layer and two compression layers formed on the stretched layer and defining the first surface and the second surface, The tensile layer has tensile internal stresses having compressive internal stress and having a thickness, and one of the first initial notch and the second initial notch is less than the thickness of the compressive layers. The cutting device of claim 11, wherein one of the first scoring opening and the second scoring opening has a depth greater than the thickness of the compressive layers and partially enters the tensile layer. The cutting apparatus of claim 10, wherein the second predetermined cutting line is perpendicular to the first predetermined cutting line when the second predetermined cutting line is projected onto the first surface. The cutting device of claim 10, wherein the first cutting head is along the plurality of first The predetermined cutting line scribes the glass substrate on the first surface to form a plurality of the first scribe openings, and the second cutting head scribes the glass substrate on the second surface along the plurality of second predetermined cutting lines, To form a plurality of the second scribe openings, and when the second predetermined scribe lines are projected onto the first surface, the projection lines of the second predetermined dicing lines intersect the first predetermined dicing lines. The cutting device of claim 10, wherein the first cutting head and the second cutting head are cut by a laser, a grinding stone, a diamond knife or a cutting wheel to form the first initial gap. And the second initial gap. The cutting device of claim 10, wherein the first cutting head and the second cutting head are cut by a laser, a grinding stone, a diamond knife or a cutting wheel to form the first moment. The opening and the second scribe opening are drawn.