JP5779074B2 - Method for scribing tempered glass substrate - Google Patents

Description

The present invention relates to a method for scribing a glass substrate made of tempered glass.
Here, the “tempered glass” is a compressive stress layer in which a compressive stress remains on a substrate surface layer of a glass substrate (a depth of about 5 μm to 50 μm from the substrate surface) by chemical treatment by ion exchange during the manufacturing process. It refers to glass that is formed and manufactured so that tensile stress remains inside the substrate.
The feature of tempered glass is that it is difficult to crack against external force due to the effect of the compressive stress layer.On the other hand, once the crack has occurred on the substrate surface and the residual tensile stress is present, the crack is deepened. It has the property of easily penetrating.

In general, in the process of cutting a glass substrate, a method is adopted in which a scribe line of a finite depth is first formed on the substrate surface, and then a break is applied by pressing with a break bar or break roller along the scribe line from the back side of the substrate. ing.
In the former step of forming a scribe line, there is known a method of scribing by pressing and rolling a disk-shaped cutter wheel (also referred to as a scribing wheel) with respect to the substrate surface, which is disclosed in Patent Document 1, for example. ing.

FIG. 10 shows a cross scribing process performed when a glass substrate M (mother substrate) is divided into unit substrates each serving as a product. First, the scribe line S ₁ in the X direction is formed by the cutter wheel against the surface of the substrate M, then to form a Y-direction of the scribe line S ₂ intersecting the X direction. After forming a plurality of scribe lines intersecting in the XY direction in this way, the substrate M is sent to the breaking device, and is divided into unit substrates by being bent from the back side along each scribe line.

  By the way, the method of scribing a glass substrate with a cutter wheel includes “outer cutting” and “inner cutting”. There has been disclosed a scribing apparatus that can selectively use outer cutting and inner cutting depending on the type and application of the substrate (see Patent Document 2).

  As shown in FIG. 11 (a), the former outer cutting is performed in a state where the lower end of the cutter wheel is lowered slightly below the surface (upper surface) of the substrate M and the outer position (scribe) of the one end portion of the substrate M. Set to start position P1). Scribing is performed by horizontally moving the cutter wheel while moving it horizontally from the set position, colliding with the end of the substrate M and riding on the substrate M while pressing it with a predetermined scribe pressure.

  In the outer cutting, the problem that the cutter wheel slips at the end of the substrate M does not occur, and the formed scribe line reaches the end of the substrate M, so that the break in the next process can be performed easily and accurately. On the other hand, since the cutting edge collides with the end portion of the substrate M, chipping occurs at the end portion of the substrate M, and there is a possibility that the end portion is fully cut due to the tensile stress inside the substrate M. Easily consumed by collision with the edge.

  As shown in FIG. 11B, the latter inner cutting is performed by lowering the cutter wheel from above at an inner side (scribe start position Q1) of about 2 mm to 10 mm from the edge of the substrate M to apply a predetermined scribe pressure to the substrate M. The scribing is performed by causing the cutter wheel to move horizontally while pressing and pressing.

In the inward cutting, the cutter wheel does not collide with the edge portion of the end portion of the substrate M. Therefore, there is no possibility that the end portion of the substrate M is chipped, and the wear of the cutting edge can be suppressed as compared with the outer cutting. . However, since the scribe line is not formed from the edge of the substrate M to the scribe start position Q1, it tends to be difficult to break compared to the outer cutting. Further, when the cutter wheel is moved in the horizontal direction from the state in which the cutter wheel is in contact with the substrate M, the cutting edge of the blade may be poorly slipped, and scribing may not be possible.
As described above, since the outer cutting and the inner cutting each have advantages and disadvantages, the outer cutting and the inner cutting are selectively used depending on the type and use of the substrate.

Japanese Patent No. 3074143 JP 2009-208237 A

  In recent years, use of so-called tempered glass (also referred to as chemically tempered glass) has been desired among glass products used for cover glasses of mobile phones and the like. As described above, the tempered glass is manufactured so that a compressive stress remains in the substrate surface layer, and thus a glass that is difficult to break can be obtained even though the glass is thin.

  Accordingly, the use of tempered glass is excellent in that a thin, light and durable cover glass can be produced. On the other hand, in order to obtain a cover glass, it is necessary to cut out a unit product having a desired size and a desired shape from a mother substrate having a large area.

However, when a scribe line is formed by cutting outside the tempered glass, if the scribing is deeper than the surface compressive stress layer when the blade edge collides at the edge of the substrate, it will be affected by the residual tensile stress inside the substrate. There is a risk that a problem of being completely divided will occur.
Therefore, for tempered glass, scribing with an inner cut is considered preferable to an outer cut.

  However, even when trying to scribe by internal cutting, because the glass is tempered when it is brought into contact with the cutting edge, the cutting edge is difficult to bite into the substrate surface due to the residual compressive stress of the substrate surface layer. Since the hooking was very bad, slip occurred and it was impossible to scribe. Therefore, the problem that the scribing process becomes difficult is caused.

  As described above, unlike scribe processing for a soda glass substrate that has been conventionally used for tempered glass, it was difficult to form a scribe line well by both outer cutting and inner cutting. . This tendency becomes more prominent as the compressive stress layer on the substrate surface is thicker and the residual stress is larger.

  Therefore, an object of the present invention is to provide a scribing method capable of reliably forming a scribe line by internal cutting even if it is a glass substrate made of tempered glass that is difficult to process.

In order to achieve the above object, the present invention takes the following technical means.
That is, in the scribing method of the present invention, the tempered glass substrate on which the compressive stress layer is formed on the substrate surface, the tempered glass substrate scribe method for forming a scribe line,
(A) A scribing member having a dot-like tip or a linear tip at a position that goes inward from one edge of the substrate is caused to collide with the substrate so as to descend from above, and the depth of the collision mark is reduced. A peeling step of peeling the compressive stress layer on the substrate surface by forming a collision mark so as to be smaller than the thickness of the compression stress layer, and forming the collision mark as a trigger groove serving as a starting point of scribe;
(B) A scribing process for forming a scribe line by abutting and rolling the cutter wheel against the trigger groove.

According to the scribing method of the present invention, when “inner cutting” is performed from a position entering the inner side of one edge of the substrate, first, the scribing member is caused to collide with the substrate so as to descend from above, thereby causing a collision mark. Form. If the contact portion of the marking member to be used is a pointed tip, a minute dot-like collision trace is formed, and if it is a linear tip, a linear minute collision mark is formed. The pressure applied to the surface at the time of collision is optimized with a dummy substrate made of the same material in advance, so that the pressure at the time of collision is too strong and does not break, and it is too weak to form a collision mark. By doing so, the collision trace can be formed reliably.
That is, in the peeling step (a), the scribing member is caused to collide so that the depth of the collision mark is smaller than the thickness of the compressive stress layer. Moreover, since the information on the thickness of the compressive stress layer (usually about 5 to 50 μm) can be obtained from the substrate manufacturer in advance, the relationship between the impact pressure and the depth of the impact mark is obtained in a preliminary experiment, and the thickness information of the compressive stress layer is obtained. With reference to, the scribing member is made to collide so that the collision trace becomes shallower than the thickness of the compressive stress layer by adjusting to an appropriate collision pressure. As a result, only the compressive stress layer can be peeled off, and the occurrence of a malfunction that breaks by mistake can be reliably prevented.
Since the compressive stress layer on the substrate surface can be peeled off by the formation of the collision trace, the portion of the collision trace is used as a trigger groove that is the starting point of the scribe. A scribe line can be formed without slipping by bringing the cutter wheel into contact with the formed trigger groove and rolling while applying a predetermined scribe pressure.

  According to the present invention, the tempered glass, which has been difficult to form the scribe line by the inner cutting until now with the cutter wheel, uses the cutter wheel without causing the tip to slip and causing the substrate to break. Thus, a scribe line having a finite depth can be formed.

  Here, the scribing member is a pointer having a pointed tip (for example, a diamond pointer or a cemented carbide pointer), or a fixed blade (for example, a cemented carbide straight blade cutter) having a straight blade formed at the tip. You may use and a rotary blade like a cutter wheel may be sufficient. A dot-like collision trace can be formed with the pointer, and a linear collision trace corresponding to the cutting edge length can be formed with a fixed blade. Moreover, in a cutter wheel, the linear collision trace along the ridgeline of a wheel can be formed. In addition, in the case of a cutter wheel, it can also serve as the cutter wheel used for the scribe of the next process.

In the peeling process, the scribing member may be expanded and expanded to a trigger groove having a length of 1 mm to 3 mm by moving the scribing member horizontally from the collision mark .

The trigger groove can be expanded by moving the scribing member horizontally from the collision mark, which facilitates the alignment, and therefore, it can be easily used as a trigger groove during the scribe in the next process.

The front view which shows one Example of the scribing apparatus used for the scribing method of this invention. The enlarged view which shows an example of the diamond pointer of FIG. The front view and left view which show the cutter wheel of FIG. The top view which shows the procedure of the scribing method by the scribing apparatus of FIG. The front view which shows another example of the scribing apparatus used for the scribing method of this invention. The figure which shows the fixed blade in FIG. The top view which shows the procedure of the scribing method by the scribing apparatus of FIG. The front view which shows another example of the scribing apparatus used for the scribing method of this invention. The top view which shows the procedure of the scribing method by the scribing apparatus of FIG. The figure which shows the cross scribe process of a mother board | substrate. The figure which shows the conventional scribing method by a cutter wheel.

(Embodiment 1)
Details of the scribing method according to the present invention will be described below in detail with reference to the drawings.
FIG. 1 is a front view showing an example of a scribing device used when carrying out the method of the present invention. In the scribing device SC1, a diamond pointer is used as a scribing member.
The scribing device SC1 holds the tempered glass substrate M on the upper surface, and has a table 4 having a horizontal rotation mechanism, a rail 5 that holds the table 4 so as to be movable in one direction (perpendicular to the paper surface), and a table 4 and a guide bar 6 bridged in a direction perpendicular to the rail 5 (left and right direction in FIG. 1).
The guide bar 6 includes two scribing heads 7a and 7b provided so as to be movable in the horizontal direction, and holders 8a and 8b attached to lower ends of the scribing heads 7a and 7b so as to be movable up and down. Among these, the diamond pointer 11 which is a scribing member for forming a collision trace is attached to one holder 8a, and the cutter wheel 12 is attached to the other holder 8b.

  FIG. 2 is an enlarged view showing an example of the diamond pointer 11. In the diamond pointer 11, a diamond piece 11b having a sharp tip is fixed to the tip of a cylindrical rod 11a whose one end is formed in a conical shape, and the diamond piece 11b collides with the tempered glass substrate M to cause a point-like shape. A collision mark is formed.

  FIG. 3 is a diagram illustrating an example of the cutter wheel 12. A ridge line 12b serving as a cutting edge is formed on a disc disk 12a made of cemented carbide having a diameter of about 2 mm to 6 mm. In this example, a grooveless wheel (also referred to as a normal wheel) in which no groove is formed in the ridge line is used, but a grooved wheel in which a groove is formed in the ridge line (for example, manufactured by Samsung Diamond Industrial Co., Ltd.). Apio (APIO (registered trademark)) cutter wheel) may be used.

Next, a scribing method using this scribing apparatus SC1 will be described.
First, as shown in FIGS. 4A to 4C, a diamond pointer 11 is preliminarily reserved at a position on the inside of the edge of the substrate M (for example, 3 mm inside) on the planned scribe line assumed for the substrate M. in impact pressure determined experimentally, it is lowered to strike lightly the surface of the glass substrate M from above, then by increasing, to form a point-like impact tracks T _1. This collision mark is also referred to as “trigger groove T ₁ ” because it is used as a starting point for scribing in the next step. When increasing the impact tracks T ₁ is then as shown in FIG. 4 (d), is brought into contact again with the collision mark T ₁ of diamonds pointer 11 extends by horizontal movement in the direction of the line to be scribed, the length The trigger groove T ₁ ′ has a length of about ₁ mm to 3 mm. By forming the extended trigger groove T ₁ ′, the cutting edge of the cutter wheel 12 can be easily aligned.

Next, as shown in FIG. 4E, the cutter wheel 12 is lowered and brought into contact with the position where the trigger groove T ₁ ′ is formed, and as shown in FIG. The scribe line S is formed by rolling while rolling. That is, the scribe line S is formed by the above-described inner cutting method. Since the cutter wheel 12 can bite into the trigger groove T ₁ ′ formed in advance, the scribe line S can be formed without slipping.

(Embodiment 2)
FIG. 5 is a schematic front view showing another example of the scribing apparatus used when carrying out the method of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. In the scribing device SC2, a straight fixed blade 13 is used as a scribing member.
6A is a front view of the fixed blade 13, and FIG. 6B is a side view. The fixed blade 13 is formed with a straight blade 13b at one end of a cemented carbide cylindrical rod 13a. Cutting edge length a of the straight edge 13b is Yes in the 1 mm to 3 mm, when colliding cutting edge substrate M, linear impact tracks T ₂ of the cutting edge length a is formed (see FIG. 7). In addition, the cutting edge length a of the straight blade 13b is shortened, and the collision mark is expanded by horizontally moving in a state in which the cutting edge of the straight blade 13b is in contact with the blade 1b after the collision, as in the first embodiment described above. It may be ˜3 mm. The collision mark T ₂ formed in this way forms the trigger groove T ₂ .
Next, a scribing method using this scribing apparatus SC2 will be described.

First, as shown in FIGS. 7A to 7C, on the scribe line assumed for the substrate M, the fixed blade 13 is placed on the inside of one edge of the substrate M, and the surface of the glass substrate M from above. Is lowered so as to strike lightly, and then raised to form a linear collision mark T ₂ (trigger groove T ₂ ). Here, it is assumed that the length is formed is triggered groove T ₂ of the order of 2 mm.

Then, as shown in FIG. 7 (d), a cutter wheel 12, lowering the cutter wheel 12 in a position to form a trigger groove T ₂ abuts, as shown in FIG. 7 (e), the line to be scribed A scribe line S is formed by rolling while pressing along. That is, the scribe line S is formed by the above-described inner cutting method. Cutter wheel 12, it is possible to bite into the trigger groove T ₂ which is previously formed, it is possible to form the scribe line S without slipping.

(Embodiment 3)
FIG. 8 is a schematic front view showing still another example of the scribing apparatus used when carrying out the method of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. In the scribing device SC3, the cutter wheel 12 shown in FIG. 3 is used as a scribing member. That is, the cutter wheel 12 is also used as a scribing member that forms a collision mark.
Therefore, only the scribing head 7b in FIG. 1 is used for the guide bar 6, and the scribing head 7a in FIG. 1, the holder 8a attached thereto, and the scribing members 11, 13 (see FIGS. 1 and 5) are used. It is not installed.

Next, a scribing method using this scribing apparatus SC3 will be described.
First, as shown in FIGS. 9A to 9C, on the planned scribe line assumed for the substrate M, the cutter wheel 12 is placed on the inside of one end edge of the substrate M, and the surface of the glass substrate M from above. Is lowered so that it is lightly hit, and then raised to form a linear collision mark T ₃ (trigger groove T ₃ ) corresponding to the ridgeline. Here, it is assumed that the length is formed is triggered grooves T ₃ of about 2 mm.

Then, as shown in FIG. 9 (d), a cutter wheel 12, is again lowered into position to form a trigger grooves T ₃ abuts, as shown in FIG. 9 (e), the along the scribed line pressure The scribe line S is formed by rolling while rolling. That is, the scribe line S is formed by the above-described inner cutting method. Cutter wheel 12, it is possible to bite into the trigger groove T ₃ which is previously formed, it is possible to form the scribe line S without slipping.

In the above embodiment, the example in which one scribe line is formed has been described. However, the present invention can also be applied to a case where a plurality of scribe lines are formed in parallel or a scribe line that intersects the XY direction is formed.
Moreover, in the said embodiment, although the grooveless wheel was used for the cutter wheel 12, you may make it a grooved wheel. By using a grooved wheel, the bite is further improved.
In the above embodiment, the trigger groove which is a collision mark is formed. However, since the position where the collision mark is provided is in the vicinity of the edge of the substrate, this portion is set as an end material region and finally discarded as an end material. By doing so, the product does not have a collision mark, so there is no problem due to the collision mark.
Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

  The scribing method of the present invention can be used when scribing a tempered glass substrate.

M Substrate S Scribe line T ₁ , T ₂ , T ₃ Collision trace (trigger groove)
11 Diamond Pointer 12 Cutter Wheel 13 Fixed Blade

Claims (4)

A tempered glass substrate scribing method for forming a scribe line against a tempered glass substrate having a compressive stress layer formed on the substrate surface,
(A) A scribing member having a dot-like tip or a line-like tip at a position entering inside from one end edge of the substrate is caused to collide with the substrate so as to descend from above, and the depth of the collision mark Peeling step of peeling the compressive stress layer on the substrate surface by forming a collision trace so that the thickness is smaller than the thickness of the compression stress layer, and forming the collision trace as a trigger groove to be a starting point of scribe,
(B) A scribing method for a tempered glass substrate comprising a scribing step of forming a scribe line by abutting and rolling the cutter wheel against the trigger groove. 2. The scribing method for a tempered glass substrate according to claim 1, wherein the scribing member is a pointer having a sharp tip or a fixed blade having a straight blade formed at the tip. The scribing method for a tempered glass substrate according to claim 1, wherein the scribing member is a cutter wheel. The method of scribing a tempered glass substrate according to claim 1 or 2, wherein, in the peeling step, the scribing member is moved horizontally from the collision mark so as to expand to a trigger groove having a length of 1 mm to 3 mm.

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