JP2002338285A - Glass cutter and glass cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glass cutter capable of suppressing the degradation in the yield in a glass cutting process step by preventing the rotation defect of wheel cutters in cutting glass substrates by using the wheel cutters, and a glass cutting method. SOLUTION: In cutting the glass substrates 1 and 2 by using the wheel cutters, the wheel cutters are lowered onto the surfaces of the glass substrates and scores 4 are given to the glass substrates, and thereafter, the glass substrates are scribed so as to pass the scores 4 given to the glass substrates from near the scores given to the glass substrates.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a glass cutting device for cutting a liquid crystal panel.

[0002]

2. Description of the Related Art Generally, an individual liquid crystal panel is cut out from a wafer state by scribing using a glass cutter wheel cutter to form a cut on the wafer surface along a line to be separated. A uniform pressure (bending stress exceeding the maximum yield stress of the wafer) is applied from the back side along the cut notch (referred to as break),
It is performed by a method of cutting the glass along the cuts formed. A liquid crystal panel having a structure in which two pieces of glass are bonded together is performed by repeating the above-described glass cutting step twice on the front and back surfaces of the panel.

FIG. 2 is an explanatory diagram for explaining a scribe type in which a wheel cutter rides on the glass end surface. In FIG. 2, 6 and 7 are glass substrates, 8 is a passage path of a wheel cutter, and 9 is an end surface of the glass substrate through which the wheel cutter passes. Scribing by a wheel cutter is usually performed as shown in FIG. 2, and adopts a method in which the wheel cutter rides over the glass substrate end face 9.

However, when scribing a glass substrate by a method in which a wheel cutter rides on the glass substrate end face 9, the wheel cutter is driven by the glass substrate end face 9.
At the moment, a large resistance is generated, so that the glass substrate end face 9 has a problem that the glass chipping of about 1 mm occurs in almost all cases.

[0005] Usually, chipping of the wafer end face due to the method in which the wheel cutter is mounted on the glass substrate end face 9 is as follows.
By providing a blank portion of glass outside the liquid crystal panel, the appearance of the panel is not affected, but in the case where a blank portion cannot be provided on the outside portion, the problem as described above has been solved. There is a problem that dots are generated and affect the appearance of the panel.

Therefore, in order to solve such a problem, scribing using a wheel cutter as shown in FIG. 3 has been proposed. FIG. 3 is an explanatory diagram for explaining a conventional scribing method in which a wheel cutter is lowered onto a glass surface at a predetermined distance from an end surface of the glass.

In FIG. 3, 6 and 7 are glass substrates, 8 is a passage path of a wheel cutter, and 10 is a blade lowering point of the wheel cutter. In the scribing by the wheel cutter shown in FIG. 3, the wheel cutter is lowered onto the glass surface 10 at a fixed distance from the end face, and scribing is started from that point.

[0008]

However, in the scribing by the wheel cutter shown in FIG. 3, since the initial cutting amount is zero, the force for rotating the wheel cutter is difficult to work, and the wheel cutter has poor rotation. . As a result, in the glass substrate from which good cuts could not be obtained, there was a problem that a defect that the glass was cut in a shape that did not follow the cut line during the break occurred.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has an object to prevent a rotation failure of a wheel cutter,
It is an object of the present invention to provide a glass cutting apparatus and a glass cutting method for suppressing a decrease in yield in a glass cutting step.

[0010]

In order to solve the above-mentioned problems, a glass cutting apparatus according to the present invention is directed to a glass cutting apparatus for cutting a glass substrate using a wheel cutter. After the glass substrate is lowered and scratched, scribing is performed from the vicinity of the scratch on the glass substrate so as to pass through the scratch on the glass substrate.

Further, the glass cutting method according to the present invention comprises:
Using a wheel cutter, in a glass cutting method of cutting a glass substrate, a step of lowering the wheel cutter on the surface of the glass substrate to scratch the glass substrate, and using the wheel cutter to remove the scratches applied to the glass substrate. Scribing from the vicinity so as to pass through a scratch made on the glass substrate.

[0012]

(Embodiment 1) A glass cutting apparatus and a glass cutting method according to Embodiment 1 of the present invention will be described below with reference to FIG. FIG. 1 is an explanatory diagram illustrating a glass cutting device according to a first embodiment of the present invention.

In FIG. 1, reference numerals 1 and 2 denote glass substrates, 3 denotes a passage path of a wheel cutter, and 4 and 5 denote blade lowering points of the wheel cutter. As shown in FIG. 1, in a liquid crystal panel having a structure in which two sheets of glass are bonded to each other, a wafer cutter is cut into individual panels by first setting a wheel cutter at a predetermined position 4 on the surface of the glass substrate 1. , For example, at a pressure of about 1 kg / cm ² , to make small scratches on the surface of the glass substrate 1, and then raise the wheel cutter as it is. The predetermined pressure for scratching the glass substrate can be arbitrarily set by the user, and can be optimized from various conditions such as the strength of the glass substrate.

Then, the wheel cutter is moved a predetermined distance, for example, about 1
2 mm, the cutter was lowered again between the glass end face and the scratch made on the surface position 4 of the glass substrate 1 in the vicinity of the scratch made on the glass substrate, and the cutter was put on the surface position 4 of the glass substrate 1. Scribing is performed in the traveling direction while applying a constant pressure so as to pass over the wound. The predetermined distance for moving the wheel cutter in the direction opposite to the traveling direction can be arbitrarily set by the user, and can be optimized from various conditions such as the size of the wheel cutter.

Next, a uniform pressure (bending stress exceeding the maximum yield stress of the wafer) is applied from the back side along the formed cut, and the glass substrate 1 is cut along the formed cut.

Then, the above-described cutting operation of the glass substrate 1 is similarly performed for the glass substrate 2 so that the liquid crystal panel is cut out.

As described above, when scribing, the wheel cutter is instantaneously lowered to apply an impact to the glass surface to make a small scratch, and then the scribing is performed so as to pass over the scratch again. The function of assisting the rotation of the wheel cutter when the wheel cutter passes through the scratched part works, improving the poor rotation of the wheel cutter, making it possible to scribe accurately, and suppressing the reduction in the yield of the glass cutting process can do.

[0018]

As described above, according to the glass cutting apparatus of the present invention, after the wheel cutter is lowered onto the surface of the glass substrate to scratch the glass substrate, from the vicinity of the scratch made on the glass substrate, By performing scribing so as to pass through the scratches on the glass substrate, when the wheel cutter passes through the scratched part, the function of assisting the rotation of the wheel cutter works, improving the poor rotation of the wheel cutter However, it is possible to obtain an effect that a reduction in the yield when cutting out the liquid crystal panel from the wafer state can be suppressed.

Further, according to the glass cutting method of the present invention, a step of lowering a wheel cutter on the glass substrate surface to damage the glass substrate, and using the wheel cutter to cut a scratch made on the glass substrate. From the vicinity, a step of scribing so as to pass through the scratches attached to the glass substrate, by having a function of assisting the rotation of the wheel cutter when the wheel cutter passes through the scratched portion In addition, it is possible to improve the rotation failure of the wheel cutter and suppress a decrease in the yield in the glass cutting process.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining a glass cutting device according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram for explaining a conventional scribing method in which a wheel cutter rides on a glass end surface.

FIG. 3 is an explanatory view for explaining a conventional scribing method in which a wheel cutter is lowered onto a glass surface at a predetermined distance from a glass end face.

[Explanation of symbols]

 1, 2, 6, 7 Glass substrate 3, 8 Passage path of wheel cutter 4 Position of flaw to be applied on glass substrate 5, 10 Blade removal point of wheel cutter 9 End surface of glass substrate through which wheel cutter passes

Claims (2)

[Claims] 1. A glass cutting apparatus for cutting a glass substrate using a wheel cutter, wherein the wheel cutter is lowered onto the surface of the glass substrate to damage the glass substrate, and the vicinity of the scratch formed on the glass substrate. A scribing device for performing scribing so as to pass through a scratch made on the glass substrate. 2. A glass cutting method for cutting a glass substrate using a wheel cutter, wherein the step of lowering the wheel cutter on the surface of the glass substrate to scratch the glass substrate, and the step of cutting the glass substrate using the wheel cutter Performing a scribe so as to pass through the flaws attached to the glass substrate from the vicinity of the flaws applied.