JP4865351B2 - LCD display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass substrate having high dimensional accuracy by suppressing the formation of cracks when glass is cut and separated. <P>SOLUTION: The surface of the glass is subjected to masking so as to make a pattern corresponding to a cutting and separating pattern, and thereafter, a groove corresponding to the cutting and separating pattern is formed by subjecting the glass to chemical treatment. Further, the glass is cut and separated by giving a mechanical or thermal stress to the formed groove. This cutting and separating method can be suitably applied to the production of glass substrates for flat panel displays. The glass substrates produced by this method can be suitably used in the flat panel displays. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

The present invention relates to a liquid crystal display characterized by a method for cutting and separating laminated glass .

  A glass substrate used for production of a flat panel display such as a liquid crystal display, a plasma display, and an electroluminescence display is made of a glass plate (hereinafter referred to as “base material”) larger than the glass substrate. The glass substrate is manufactured by a method of cutting and separating a base material. For example, as shown in FIG. 1, a glass substrate for a liquid crystal display used for a 15-inch monitor can take four surfaces from a base material of 550 mm × 650 mm. The glass substrate can be obtained by cutting and separating one base material. It can also be obtained by cutting and separating a glass plate having a film formed on the glass surface as a base material.

  On the other hand, when manufacturing a glass substrate for a small liquid crystal display, a method of directly cutting and separating a bonded glass substrate is an important cutting method. This is because the glass substrate for a liquid crystal display has a structure in which two glasses are bonded together with a sealant. Here, the glass substrate for a liquid crystal display has a cell 1 that can enclose a liquid crystal between two glass substrates.

Non-Patent Documents 1 and 2 disclose the cutting and separating of the base material. The cutting and separation of the base material disclosed in Non-Patent Document 1 and Non-Patent Document 2 includes a scribing process of forming a scribe line on the surface of the base material and a process of applying mechanical or thermal stress to the scribe line. This method of cutting and separating is a method called a scribe break method.
Yasuaki Miyake, Scribe Break Technology, “Monthly FPD Intelligence Extra Number 4th Generation LCD Manufacturing / Inspection Technology”, Press Journal, published on January 20, 2000, p. 85-89 Ken Yamamoto, Optical alignment device and laser-applied glass cutting device enabling use in a clean room, “Monthly FPD Intelligence 1999.4”, Press Journal, p. 28-31

  The cutting and separating method described in Non-Patent Document 1 is a general scribe / break method. The scribe / break method includes a scribe line forming step and a step of applying mechanical stress. The scribe line forming step is a step of forming a scribe line by scratching the surface of the base material with a wheel cutter made of diamond or cemented carbide. The depth of the scribe line formed in this step is about 10 to 15% of the base material plate thickness. The step of forming mechanical stress is a step of applying mechanical stress to the scribe line formation site. In this step, the glass substrate is cut and separated from the base material.

  The cutting and separating method described in Non-Patent Document 2 includes a scribe line forming step and a step of applying thermal stress. This cutting and separating method is a method adopted in a glass cutting apparatus manufactured by ACCUDYNE, USA. The scribe line formation process consists of (1) forming a small scratch on the end of the base metal with metal foil, (2) irradiating the scratch with a linear laser beam, and (3) immediately after laser beam irradiation, helium and water. It consists of each process of spraying mixed gas on a base material and quenching. In this scribe line formation step, a molecular level scribe line is formed on the base material. The step of applying thermal stress is a step of cooling by spraying a mixture of helium and water after irradiating laser on both sides of the scribe line. By this laser irradiation and cooling immediately thereafter, thermal stress is generated in the scribe line, and the glass substrate is cut and separated from the base material.

  However, the cutting and separating method described in Non-Patent Document 1 has the following problems. The first problem is that cracks occur on the base material surface and in the vicinity of the base material surface when the scribe line is formed. Due to the cracks, glass cullet is likely to occur during scribing and cutting separation. The second problem is that many cracks occur at the scribe line intersection when the scribe line is formed. Due to this crack, the base glass is likely to break during cutting and separation. A problem with the glass substrate that has been cut and separated by this crack is that the edge strength of the glass substrate is weak. The third problem is that it is necessary to chamfer the glass substrate in order to improve the edge strength of the glass substrate. In order to remove glass powder or the like generated by chamfering, it is necessary to perform cleaning. That is, as a method for cutting and separating a glass substrate, there is a problem that productivity is low.

  On the other hand, the cutting / separating method described in Non-Patent Document 2 is expected to have an effect that a clean process, high productivity, and chamfering after cutting / separation are unnecessary. However, low cutting accuracy and slow cutting / separation processing speed are problems. Also, the ACCUDYNE cutting device disclosed in Non-Patent Document 2 is expensive and cannot be used in general.

  By the way, the glass crack is caused from a fine scratch existing on the surface of the base material from the beginning. Therefore, if the scratches on the surface of the glass substrate itself are reduced as compared with the base material, the glass strength can be improved and the glass can be prevented from cracking. When a polishing process for removing scratches on the surface of the glass substrate is provided, the productivity of cutting and separating the glass substrate is lowered. On the other hand, if the scratches on the glass surface can be reduced during the base material cutting and separating step, the productivity of the glass substrate cutting and separating is not lowered. It is expected to provide a technique for reducing scratches on the surface of the base material during such a cutting and separating step.

An object of the present invention is to provide a liquid crystal display having a laminated glass that suppresses the occurrence of glass cullet and glass breakage and makes the glass substrate dimension highly accurate. Indirectly, provide a method for cutting and separating glass that can remove plane cracks during scribe line formation, or provide a method for cutting and separating glass that performs scribe line formation without cracking. With the goal.

The present invention relates to a plurality of liquid crystal displays manufactured by cutting and separating a single laminated glass base material formed by laminating two glass substrates on which a color filter layer or the like is formed. peripheral edge component section, in the cutting surface of each glass substrate, and the chemical groove of the formed surface side by performing an etching process after forming a scribe line in wheel cutter, mechanical in the groove portion A straight boundary line corresponding to a scribe line formed at a predetermined depth is formed at a boundary portion between the groove portion and the cut portion, and is divided into a cut portion without cracks formed by applying stress. It is formed in the length direction .

  According to this method, even when the base material is cut and separated by applying mechanical stress or thermal stress, the stress is concentrated on the scribe line. As a result, glass cullet generation and glass breakage during cutting and separation can be suppressed. Moreover, if this method is used, the necessity of a cut surface treatment process after cutting and separation is small. This means that the cutting and separation of the glass substrate can be made inexpensive, and the productivity of cutting and separating the glass is improved. Further, the scratches on the surface of the base material not masked are reduced by the chemical treatment, so that the strength of the glass substrate can be improved.

  The chemical treatment should be performed by bringing a chemical treatment liquid into contact with the glass surface. Preferably, the glass is immersed in the chemical treatment liquid. In the chemical treatment, when the base material is immersed in the chemical treatment liquid, it is preferable to generate bubbles or jets in the chemical treatment liquid. In this case, the effect of stirring the chemical treatment liquid can be obtained. When bubbles are generated, it is possible to prevent the product generated in the chemical treatment liquid from adhering to the glass.

  In the chemical treatment, the chemical treatment solution may flow along the glass surface. For example, the chemical treatment liquid can be caused to flow along the glass surface by causing the bubbles or jets to flow along the glass surface. In this case, the effect of reducing scratches existing on the surface of the base material is great.

  Further, the chemical treatment may be one in which a chemical treatment liquid is caused to flow into the scribe line forming portion. For example, the chemical treatment liquid can be caused to flow into the scribe line forming portion by causing the bubbles or jets to flow into the scribe line forming portion. When the chemical treatment liquid is caused to flow into the scribe line forming portion, the effect of increasing the depth of the scribe line is great.

  The chemical treatment may be performed by spraying a chemical treatment liquid on the glass surface, spraying a chemical treatment liquid vapor on the glass surface, or exposing the glass surface to the chemical treatment liquid vapor.

In the present invention, after the masking corresponding to the cutting separation pattern is performed on the glass surface, chemical treatment is performed by immersing the glass in a chemical treatment liquid in which bubbles or jets are generated, and the cutting separation pattern is supported. A method of forming grooves on the glass surface can also be adopted.

  Even in this method, even when mechanical or thermal stress is applied to the base material, the stress is concentrated in a groove corresponding to the scribe line (hereinafter simply referred to as “groove”). Generation of glass cullet and glass breakage can be suppressed. Moreover, the necessity for the cut surface treatment after the cutting and separation is small, the cutting and separating of the glass substrate can be made inexpensive, and the productivity of cutting and separating the glass is improved. In addition, scratches on the unmasked base material surface are reduced by chemical treatment, and the strength of the glass substrate is improved. Furthermore, since no external stress is applied to the base material when the groove is formed, the glass is not cracked or cracked when the groove is formed. In addition, since any groove can be formed, a glass substrate with high dimensional accuracy is provided. When bubbles are generated in the chemical treatment liquid, it is possible to prevent the product generated in the chemical treatment liquid from adhering to the glass.

  Examples of the masking method include a screen printing method, a laminate film processing method, and a resist coating photolithography method. Masking is preferably performed by using a masking agent that is chemically resistant to the chemical treatment liquid. When bubbles are generated, it is possible to prevent the product generated in the chemical treatment liquid from adhering to the glass.

  In the cutting and separating method in which masking is performed, the chemical treatment is preferably such that the chemical treatment liquid flows along the glass surface. In this case, the effect of reducing scratches existing on the surface of the base material is great. Further, a chemical treatment liquid may be allowed to flow into the groove forming portion. For example, the chemical treatment liquid can be caused to flow into the groove forming portion by causing the bubbles or jets to flow into the groove forming portion. When the chemical treatment liquid is caused to flow into the groove forming portion, the effect of increasing the depth of the groove is great.

In the present invention, after masking corresponding to the cutting separation pattern on the glass surface, the chemical treatment liquid is sprayed on the glass surface, the chemical treatment liquid vapor is sprayed on the glass surface, or the glass surface is exposed to the chemical treatment liquid vapor. A groove corresponding to the cut and separated pattern may be formed on the glass surface by chemical treatment.

  After the chemical treatment, the glass may be cut and separated by applying mechanical or thermal stress to a scribe line or the like.

  In order to cut and separate the glass by applying the mechanical stress, the glass may be cut and separated by pulling the glass around a scribe line or the like on the glass surface after the chemical treatment.

  Further, in order to cut and separate the glass by applying the mechanical stress, after the chemical treatment, pressure is applied from the direction of the formation surface such as the scribe line on the glass surface or the direction opposite the surface of the formation surface, to the scribe line or the like. It is preferable to cut and separate the glass by applying mechanical stress. Of these, it is preferable to apply pressure from the direction of the formation surface such as a scribe line.

  In order to cut and separate the glass by applying the thermal stress, the glass is preferably cut and separated by irradiating laser on both sides of the scribe line or the like on the glass surface after the chemical treatment.

  ADVANTAGE OF THE INVENTION According to this invention, the crack of glass by the cutting | disconnection separation of a glass substrate can be suppressed. As a result, it is possible to increase the dimensional accuracy of the liquid crystal display glass substrate. Moreover, glass substrate intensity | strength can be improved by reducing the damage | wound of the glass surface which was not masked.

Embodiments of the cutting and separating method for realizing the present invention will be described below. The glass cutting and separating method for realizing the present invention includes a scribe line forming step on the surface of a base material, a chemical treatment step, and a base material cutting and separating step. In addition, the glass separation and separation of the present invention can be performed by performing a groove forming step instead of the scribe line forming step and the chemical treatment step. The groove forming step is performed by performing chemical treatment after masking corresponding to the cut separation pattern on the surface of the base material.

When manufacturing the glass substrate of the liquid crystal display of this invention , the glass substrate which bonded two glass substrates together with the sealing material is used for a base material. In this laminated glass, a color filter layer and the like necessary for a liquid crystal display glass substrate are formed.

  In order to form a scribe line on the surface of the base material, it can be formed by a diamond cutter or a cemented carbide wheel cutter, as in the prior art. The scribe line is formed by scoring a line on the surface of the base material with a diamond cutter or a cemented carbide wheel cutter.

  In addition, the scribe line can be formed by the same method as that employed by the cutting and separating apparatus of ACCUDYNE, which is used in the prior art. That is, (1) A scratch is formed on the end of the base material with a metal foil or the like. (2) Next, a linear laser beam is irradiated onto the scratch. (3) Immediately after this, a mixed gas of helium and water is sprayed on the base material to rapidly cool the base material. A scribe line can also be formed on the surface of the base material by the operations (1) to (3).

  The groove on the surface of the base material is formed by masking the surface of the base material and then performing chemical treatment. This masking uses a masking agent to perform masking corresponding to the cutting separation pattern. It is preferable to use a masking agent that is not corroded by the chemical treatment liquid. The masking method includes a screen printing method, a laminate film processing method, a resist coating photolithography method, and the like.

  The screen printing method is a method in which a screen having a portion through which the masking agent passes and a portion through which the masking agent does not pass is brought into contact with the surface of the base material, and the masking agent is extruded from the portion through which the masking agent passes to mask the glass surface. The laminate film processing method is a method in which a film having an adhesive layer formed on one side is used as a masking agent, and this masking agent is applied to the surface of the base material. The resist coating photolitho method is a method in which a photoresist is used as a masking agent, and this is applied to the surface of a base material and then masked by irradiating light.

  In addition, when a scribe line or a groove (hereinafter referred to as “scribe line etc.”) is formed on one side of the bonded glass substrate, the formation of the scribe line etc. on the other glass substrate is formed immediately below the scribe line etc. It is normal to do. In the case where it is not formed directly below, the laminated glass substrate after cutting has a stepwise shape in the longitudinal section. If this step-like shape is taken, the lower step portion of the step shape can be used as a joint fixing portion between the glass substrate and another member.

  The chemical treatment is performed by bringing the base glass into contact with the chemical treatment liquid.

  As the chemical treatment liquid, a liquid containing a glass-soluble chemical should be used. The chemical treatment liquid is preferably an aqueous solution containing hydrofluoric acid. It is preferable to further contain one or more of hydrofluoric acid salt, inorganic acid and organic acid in this hydrofluoric acid aqueous solution.

  Examples of hydrofluoric acid salts include ammonium fluoride, potassium fluoride, and sodium fluoride. Examples of inorganic acids include hydrochloric acid, sulfuric acid, phosphoric acid, and nitric acid. Examples of the organic acid include acetic acid and succinic acid. One or more of an anionic surfactant and an amphoteric surfactant may be added to the chemical treatment liquid. Examples of the anionic surfactant include a sulfonate surfactant. Examples of amphoteric surfactants include amine surfactants.

  The main actions of each chemical in the chemical treatment liquid are as follows. Hydrofluoric acid and hydrofluoric acid salt are chemically etching glass. An inorganic acid, an organic acid, an anionic surfactant, and an amphoteric surfactant are to prevent a product generated in the chemical treatment liquid from adhering to the glass surface.

  The time for bringing the base material into contact with the chemical treatment liquid and the temperature of the chemical treatment liquid are appropriately changed depending on the composition of the base glass and the thickness of the glass.

In order to bring the chemical liquid into contact with the base material, for example, the following methods (1) to (4) may be mentioned.
(1) A base material is immersed in a chemical treatment solution.
(2) Spray chemical treatment liquid onto the base material.
(3) Spray chemical treatment liquid vapor onto the base material.
(4) Exposure of the base material into the chemical treatment liquid vapor.

  When the base material is immersed in the chemical treatment liquid, it is preferable to generate bubbles or a jet of the chemical treatment liquid in the chemical treatment liquid. In order to generate a jet of the bubbles or the chemical treatment liquid, it is preferable to provide a bubble generation device or a chemical treatment liquid injection device at the bottom of the chemical treatment liquid storage tank. In this case, the effect of stirring the chemical treatment liquid can be obtained. When the bubble generating device is provided, the product in the chemical treatment liquid can be raised to the chemical treatment liquid surface, and the product can be prevented from adhering to the glass.

  The bubble or jet flow is the same as the chemical treatment liquid flow. Further, since the scratched portion of the glass surface is concave, the chemical treatment liquid in the concave portion is not easily exposed to the flow of the chemical treatment liquid. Therefore, the chemical treatment liquid in the concave portion is in a stationary state, and the etching reaction rate tends to be slow. As a result, portions other than the recesses are etched in advance, thereby producing an effect of reducing scratches on the glass surface. Therefore, if the chemical treatment liquid flows along the glass surface, the effect of reducing scratches on the glass surface is great. As the flow of the chemical treatment liquid approaches a flow that is substantially parallel to the glass surface, the effect of reducing scratches on the glass surface increases.

  In addition, the effect of chamfering the corners of the glass substrate occurs. This effect is obtained by performing a chemical treatment. When the chemical treatment liquid flows substantially parallel to the glass surface, the effect of chamfering the corners of the glass substrate is particularly great.

  On the other hand, when the chemical treatment liquid is caused to flow into the formation part such as the scribe line, the chemical treatment liquid in the formation part is in a fluid state and the etching reaction speed is increased, so that the depth of the scribe line and the like is increased. growing. When the chemical treatment liquid is caused to flow into the scribe line or the like from a direction substantially perpendicular to the glass surface, the effect of increasing the depth of the scribe line or the like is further increased. Further, even when the chemical treatment liquid is caused to flow into a scribe line or the like, the effect of chamfering the corners of the glass substrate is produced.

  When the bubble generating device or the chemical processing liquid jetting device is provided at the bottom of the chemical processing liquid storage tank, the method of immersing the base material in the chemical processing liquid is selected from the following viewpoint.

  In order to increase the effect of reducing scratches on the glass surface, the base glass plate is immersed perpendicular to the liquid surface of the chemical treatment liquid. In order to increase the effect of increasing the depth of the scribe line or the like, the base glass plate is immersed in parallel with the liquid surface of the chemical treatment liquid. Further, the base material may be immersed obliquely with respect to the liquid surface of the chemical treatment liquid.

  After the chemical treatment, the base material is cut and separated. As this cutting and separating method, it is preferable to apply mechanical or thermal stress to cut and separate the glass.

  As a method of cutting and separating by mechanical stress, there is a method of cutting and separating by pulling or pressing. The method of cutting and separating glass by pulling is a method of cutting and separating glass by pulling the glass around a scribe line or the like. On the other hand, the pressurizing method is a method of pressurizing a scribe line or the like to cut and separate. This pressurizing method is preferred as a method for cutting and separating.

  In the case of the pressurizing method, pressurization may be performed from either the direction of the formation surface such as a scribe line or the direction of the surface facing the formation surface. Preferably, pressure is applied from the direction of the forming surface such as a scribe line. FIG. 2 illustrates an example of a state in which pressure is applied from the formation surface direction of a scribe line or the like. The base material 2 is installed so as to be bridged between the two mounting tables 4. Next, the base material can be cut and separated by pressing with a pressing jig 5 directly above the scribe line 3 or the like.

  When the base material is cut and separated from the forming surface direction of the scribe line or the like, the base material can be cut and separated with a smaller pressure than when pressing from the surface direction facing the scribe line forming surface. Further, even if the scribe line has a shallow depth, the base material can be cut and separated while maintaining the smoothness of the cut surface. For example, when cutting and separating a 40 mm × 60 mm × 0.7 mm aluminoborosilicate glass in which a groove having a depth of 200 μm is formed by chemical treatment, if the pressure is applied from the direction opposite to the surface on which the groove is formed, 3000 g It has been confirmed that the above pressurization is necessary. On the other hand, when pressurizing from the surface direction in which the groove is formed, it has been confirmed that the glass is cut and separated at a pressure of 1500 to 2000 g or less.

  That is, since only a small pressure is required, rapid cutting and separation can be performed. Further, since the pressure is hardly dispersed other than the scribe line or the like, it is possible to prevent the glass from cracking during the cutting and separation.

  In addition, the pressurization jig | tool contact | abutted with glass is good in it being a flat plate. Preferably, a plate having a thinner plate thickness is used.

  As a method of applying thermal stress, for example, there is a method of cutting and separating a base material by irradiating a laser on both sides of a scribe line or the like. In this case, laser heating below the glass melting temperature is performed.

  Next, specific examples of the present invention will be specifically shown based on examples. The present invention is not limited to the following examples.

  Two pieces of glass for liquid crystal display of 400 mm × 500 mm × 0.7 mm were bonded together with a sealing material. A scribe line having a depth of about 0.05 mm was formed on both sides with a diamond cutter. One scribe line was formed directly below the other scribe line. Next, the thickness of the bonded glass was reduced by about 0.4 mm by chemical treatment.

The chemical treatment was performed under the following conditions.
Chemical treatment solution: An aqueous solution of 5% hydrofluoric acid, 10% hydrochloric acid, and 5% nitric acid.
Immersion of laminated glass in chemical treatment liquid: Immerse the glass vertically with the chemical treatment liquid surface.
Bubble generation in the chemical treatment liquid: Bubbles are generated from the bottom of the chemical treatment liquid storage tank (the bubbles flowed substantially parallel to the glass surface).

After the chemical treatment, pressure was applied from directly above the scribe line to cut the laminated glass.
[Comparative Example 1]
The laminated glass not subjected to chemical treatment was cut and separated. The procedure was the same as Example 1 except that no chemical treatment was performed.

  The glass substrates obtained in Example 1 and Comparative Example 1 were observed with a microscope. FIGS. 3 and 4 are schematic views of observing the square shape of the glass substrate around the scribe line intersection. 5 and 6 are schematic views of observing a cross section obtained by dividing a glass plate. 3 and 5 are observations of a glass substrate (Example 1) subjected to chemical treatment. 4 and 6 are observations of a glass substrate not subjected to chemical treatment (Comparative Example 1).

  3 and 4, the black portion is the glass substrate 3. The square shape of the glass substrate 6 shown in FIG. 3 is not in a state where the glass is not chipped at all. On the other hand, in the square shape of the glass substrate 7 shown in FIG. From this, it can be seen that no glass chipping was observed at the corners of the glass substrate of Example 1 subjected to chemical treatment. On the other hand, it can be seen that glass chipping was observed at the corners of the glass substrate of Comparative Example 1 that was not subjected to chemical treatment. Therefore, it was confirmed that cracking of the glass substrate was prevented by performing chemical treatment in cutting and separating the glass substrate.

  In FIG. 5, the glass cut surface 9 was in a smooth state. On the other hand, in FIG. 6, the glass cut surface 11 is not smooth but has a crack 13.

  Moreover, in FIG. 5, the scribe line 10 on the glass surface has a linear shape. On the other hand, in FIG. 6, the deepened recess is shown in black. That is, the scribe line 12 on the glass surface has a shape with severe irregularities. The severity of the unevenness indicates that glass breakage or chipping occurred during cutting and separation of the glass substrate. Therefore, it was confirmed that the cracks in the glass generated during the scribe line formation were removed by performing the chemical treatment.

  Moreover, in the glass plate of Example 1, it was confirmed that the square shape of the scribe line forming portion is chamfered (not shown). On the other hand, in the glass plate of Comparative Example 1, it was confirmed that the square shape of the scribe line forming portion was a right angle or an acute angle shape (not shown).

Furthermore, the strength of the glass substrate obtained in Example 1 and Comparative Example 1 was measured. The glass substrate strength was measured under the following conditions. FIG. 7 illustrates the measurement method.
(1) Two 40 mm (L2) × 40 mm (L3) × 8.4 mm (L4) glass plate mounting tables 15 were installed in parallel at an interval (L1) of 49 mm.
(2) The sample glass plate 14 was placed on the mounting table 15.
(3) A stainless steel pressure jig 16 (50 mm (L5) × 2.0 mm (L6) × 10 mm (L7)) was pressed from the direction perpendicular to the center line of the sample glass plate. The speed of the pressing jig is 0.5 mm / min. Met.
(4) The maximum pressurization until the sample broke was measured.
(5) The maximum pressure is the strength of the glass substrate.

  The strength of the glass substrate of Example 1 was 1500 g. On the other hand, the strength of the glass substrate of Comparative Example 1 was 1000 g. That is, it can be seen that the glass substrate strength has been improved.

    Two pieces of glass for liquid crystal display of 400 mm × 500 mm × 0.7 mm were bonded together with a sealing material. Masking was performed on both sides and side surfaces of the laminated glass. A laminate film was used for this masking. Next, the masked laminate film was peeled into a strip having a width of 0.2 mm. A peeling part is a part which forms a groove | channel. This laminate film peeling was performed on the upper surface and the lower surface of the laminated glass. The lower surface laminate film was peeled directly under the upper surface laminate film peeled portion.

  Next, chemical treatment was performed. The chemical treatment liquid and the conditions for generating bubbles in the chemical treatment liquid were the same as in Example 1. The laminated glass was immersed in the chemical treatment liquid so that the surface of the chemical treatment liquid and the surface of the laminated glass were parallel. That is, the bubbles were immersed so as to collide with the laminated glass from the vertical direction. The chemical treatment was performed until a groove having a depth of 0.05 mm was formed.

  Thereafter, the pressure was applied to cut and separate the laminated glass. The glass substrate obtained by the above operation was observed with a microscope. As a result, it was confirmed that there was no crack in the end surface of the glass substrate. Moreover, it was confirmed that a dividing surface is smooth.

  In the same manner as in Example 1, the strength of the glass substrate obtained in Example 2 was measured. The glass substrate strength was 1500 g.

  The glass substrate was cut and separated by a method different from that in Example 2 only in the laminate film peeling method. The laminate film peeling of the upper surface and the lower surface of the bonded glass substrate was made parallel. In addition, the laminate film was peeled from the upper surface and the lower surface of the bonded glass substrate so that the peel interval when the bonded glass was viewed from the vertical direction was 0.2 mm.

  The glass substrate obtained in Example 3 was observed with a microscope. As a result, it was confirmed that the cracks on the end face of the glass substrate and the cracks on the sectional surface were suppressed. It was confirmed that the sectional surface was smooth. Further, the side surface of the glass substrate was observed with a microscope. FIG. 7 is a schematic diagram showing the side surface of the glass substrate. It can be seen that the glass cut portion forms a staircase shape.

The figure shows a glass plate capable of chamfering four 15-inch liquid crystal display glass substrates. It is the figure which illustrated the pressure cutting process of the present invention. It is a schematic diagram when the glass substrate surface shape obtained by the cutting | disconnection separation method of this invention is observed with a microscope (50 magnifications). It is a schematic diagram when the glass substrate surface shape cut | disconnected and separated without performing a chemical process after scribe line formation is observed with a microscope (50 magnifications). It is a schematic diagram when the cross-sectional shape of the glass substrate obtained by the cutting and separating method of the present invention is observed with a microscope (50 magnifications). It is a schematic diagram when the glass substrate part cross-sectional shape cut | disconnected and separated without performing a chemical process after scribe line formation is observed with a microscope (50 magnifications). The glass plate strength measurement method is illustrated. It is a schematic diagram when the bonded glass substrate cut and separated by the cutting and separating method of the present invention is observed from the side by a microscope (50 magnifications).

Explanation of symbols

2 Glass plate 3 Scribe line or groove 4 Pressure jig 5 Mounting table 6, 7 Glass substrate 8 Glass chip 9, 11 Divided section 10, 12 Scribe line 13 Crack 17 Bonded glass substrate

Claims (1)

In a plurality of liquid crystal displays manufactured by cutting and separating one bonded glass base material formed by bonding two glass substrates on which a color filter layer or the like is formed,
Circumferential edge component section of the individual liquid crystal display, in divided surfaces of each glass substrate, and the chemical groove portion of the surface side that is formed by performing an etching process after forming the scribe lines by the wheel cutter,
The groove portion is formed by applying mechanical stress, and is divided into a cut portion having no crack ,
A liquid crystal display, wherein a linear boundary line corresponding to a scribe line formed at a predetermined depth is formed in a length direction at a boundary portion between the groove portion and the cut portion.

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