JP2018136492A - Liquid crystal panel manufacturing method and protection glass plate to be used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal panel manufacturing method capable of dispensing with masking processing for protecting an electrode terminal part accompanied by etching processing, and minimizing an influence of side etching.SOLUTION: A liquid crystal panel manufacturing method includes at least: a modified line formation step; a groove formation step; an etching step; and a cutting step. The modified line formation step includes forming a modified line formed by a laser beam along a scheduled shape cutting line corresponding to a shape of a liquid crystal panel with respect to an array substrate and a color filter substrate, that is, a modified line having a property of being more easily etched than the other parts. The groove formation step includes forming a groove along a scheduled terminal part cutting line for eliminating an area opposite to an electrode terminal part of the array substrate on the color filter substrate with respect to the color filter substrate.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-chatting for multi-chatting a liquid crystal panel formed by laminating an array substrate and a color filter substrate, and protection used therein Regarding glass plates.

  Generally, when manufacturing liquid crystal panels, a method (so-called multi-sided) is widely used in which a plurality of liquid crystal panels are manufactured simultaneously with a pair of glass base materials, and then the glass base material is divided into a single liquid crystal panel. It has been. And when dividing | segmenting a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were often used.

  However, when a scribe break is employed, it is difficult to form a panel having a rounded outline. In laser ablation processing, problems such as slow processing speed and contamination due to ablation debris are likely to occur. Furthermore, in the etching process, it is necessary to separately perform an appropriate masking process in order to protect the electrode terminal portion of the array substrate from the etching solution, and thus it may be difficult to improve the production efficiency.

  Therefore, some conventional techniques employ an etching process that is devised so that the electrode terminal portion is also masked at the same time when the etchant is applied to the color filter substrate (see, for example, Patent Document 1). ). By adopting such a configuration, a separate process is not required for protecting the electrode terminal portion, and the electrode terminal portion is reliably protected.

Japanese Unexamined Patent Publication No. 2016-224201

  However, in the above-described prior art, it is no longer necessary to independently perform the process for protecting the electrode terminal portion, but it is still necessary to perform masking processing for protecting the electrode terminal portion on the glass base material in the etching process. There was a need to peel it off after the etching process. In addition, in consideration of the influence of side etching that proceeds in a direction perpendicular to the thickness direction of the glass base material, it is necessary to provide a space between the liquid crystal panels in the glass base material. It was.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid crystal panel manufacturing method capable of minimizing the influence of side etching, and a protective glass plate used therefor, which eliminates the need for masking processing for protecting electrode terminal portions accompanying etching processing. It is to be.

  The liquid crystal panel manufacturing method according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a multi-chamfering glass base material for multi-plying a liquid crystal panel formed by bonding an array substrate and a color filter substrate. The liquid crystal panel manufacturing method includes at least a modified line forming step, a groove forming step, an etching step, and a cutting step.

  In the modified line forming step, the modified line formed by the laser beam along the planned cutting line corresponding to the shape of the liquid crystal panel with respect to the array substrate and the color filter substrate, which is etched more than other portions. A reforming line having the property of being easily formed is formed. As a typical example of the method for forming the modified line, filament processing by a picosecond laser or a femtosecond laser can be cited. The width of the reforming line is preferably set to approximately 10 μm or less.

  In the groove forming step, a groove is formed on the color filter substrate along a terminal portion cutting planned line for removing a region of the color filter substrate facing the electrode terminal portion of the array substrate. Examples of the method for forming the groove include a scribing process using a wheel cutter and a laser processing process in which a focus is set so as to cut only the color filter substrate.

  In the etching step, the array substrate and the color filter substrate are etched while being prevented from being cut at the shape cutting planned line and the terminal portion cutting planned line. As the etching process proceeds, the cutting groove and the like may penetrate in the thickness direction in the shape cutting planned line and the terminal portion cutting planned line, so the shape cutting planned line and the terminal at a slow etching rate of 3 μm / min or less. It is preferable to perform the etching process while confirming the state of the partial cutting planned line.

  In the cutting step, cutting is performed at the shape cutting planned line and the terminal portion cutting planned line after the etching process. After the etching process, the shape cutting planned line and the terminal section cutting planned line are substantially cut, so that complete cutting can be realized by applying a slight mechanical pressure or thermal stress. Is possible. By applying a minute pressing force, applying a minute ultrasonic vibration, or heating, it is possible to realize complete cutting without fouling the glass substrate for multiple surfaces.

  In the present invention, masking for selectively etching only the shape cutting planned line and the terminal portion cutting planned line is performed in order to perform the etching process after making the shape cutting planned line and the terminal portion cutting planned line easy to cut in advance. No processing is required. In addition, since the shape cutting planned line and the terminal section cutting planned line are easily cut in advance, the etching amount can be significantly reduced compared with the case where the entire thickness direction is etched, so that the influence of side etching is minimized. Can be suppressed. As a result, it is possible to use the glass substrate for multi-chamfering with the liquid crystal panels arranged close together, and the chamfering efficiency is improved.

  In the liquid crystal panel manufacturing method described above, it is preferable that the modification line has a perforated shape having a plurality of through holes or a plurality of modification holes formed by a pulse laser beam. Because the planned cutting line of the liquid crystal panel is processed by a pulse laser, even if the contour of the liquid crystal panel contains complicated, curved or minute curved parts, or an opening is formed in the liquid crystal panel It becomes possible to realize appropriate processing.

  Moreover, it is preferable to use the protective glass plate for preventing the scattering of the gas which may generate | occur | produce at the time of the process of the glass base material for multiple chamfering in the modification line formation step of the above-mentioned liquid crystal panel manufacturing method. This protective glass plate is configured to be able to be placed on a multi-surface glass substrate for multi-surface processing of a liquid crystal panel formed by bonding an array substrate and a color filter substrate. And this protective glass plate is provided with the recessed part formed in the area | region corresponding to the arrangement | positioning area | region of the liquid crystal panel in the glass substrate for multiple faces, and the edge part arrange | positioned around the recessed part, and there are many edge parts. It is comprised so that it can mount in the edge part of the glass base material for chamfering.

  The area corresponding to the arrangement area of the liquid crystal panel in the glass substrate for multi-faces is the area where the laser beam is actually irradiated for cutting out the liquid crystal panel, and the lens of the laser device may be contaminated from this area. Some gas can be generated. If the protective glass plate is brought into close contact with the liquid crystal panel placement area, there will be no escape from the generated gas or heat, and the gas will accumulate at a position where it will adversely affect laser irradiation, or there may be adverse effects due to heat such as the generation of bubbles. However, the occurrence of such a problem is prevented by forming a space in the region corresponding to the region where the liquid crystal panel is disposed, thereby creating a space.

  It is preferable that the above-mentioned protective glass plate is provided with a taper portion at the edge portion, and the taper portion can be placed on the end portion of the multi-face glass substrate. By adopting such a configuration, the protective glass plate is less likely to be displaced on the multi-chamfered glass base material, and problems such as dropping during processing and conveyance are less likely to occur.

  According to the present invention, in the manufacture of a liquid crystal panel, the masking process for protecting the electrode terminal portion accompanying the etching process is unnecessary, and the influence of side etching can be suppressed to the minimum.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfering containing a some liquid crystal panel. It is a figure which shows the outline of the laser processing with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the scribe break process with respect to the multi-chamfer glass base material. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel. It is a figure which shows the other example of the laser processing with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the protective glass plate which concerns on one Embodiment of this invention. It is a figure which shows the outline of the protective glass plate which concerns on other embodiment of this invention. It is a figure which shows an example of the production method of a protective glass plate.

  FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with a liquid crystal layer interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.

  The array substrate 12 has an electrode terminal portion 122 provided so as to extend from a region bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, so that, for example, a smartphone 100 as shown in FIG. Composed.

  Next, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2A and 2B, the liquid crystal panel 10 is generally manufactured as a multi-chamfering glass base material 50 including a plurality of them, and the multi-chamfering glass base material 50 is divided. By doing so, a single liquid crystal panel 10 is obtained. In this embodiment, for the sake of convenience, a description will be given of processing for a multi-chamfer glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns. However, the liquid crystal panel included in the multi-chamfer glass base material 50 The number of 10 can be increased or decreased as appropriate.

  First, as shown in FIGS. 3 (A) to 3 (C), the glass substrate 50 for multi-faces has a modified line 20 along a shape cutting planned line corresponding to the shape (contour) of the liquid crystal panel 10. It is formed. The modification line 20 includes a plurality of filaments formed by a light beam pulse (beam diameter is about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser (wavelength 515 nm) or a femtosecond laser (1030 nm). It is a filament array in which layers are arranged. The light beam from the pico laser has a depth of focus deeper than a range including at least both the array substrate 12 and the color filter substrate 14. For this reason, the modification line 20 for dividing the liquid crystal panel 10 is formed simultaneously on both the array substrate 12 and the color filter substrate 14.

  In principle, it is possible to process both the array substrate 12 and the color filter substrate 14 with one laser at the same time. However, if this causes a problem in the liquid crystal layer, the array substrate 12 is viewed from the array substrate 12 side. By forming the reforming line 20 only on the color filter substrate 14 and forming the reforming line 20 only on the color filter substrate 14 from the color filter substrate 14 side, the occurrence of defects in the liquid crystal layer can be easily suppressed.

  In this embodiment, the reforming line 20 has a perforated shape having a plurality of through holes or modified layers as shown in FIG. The reforming line 20 has a property that it is more easily etched than other portions of the multi-chamfer glass base material 50. Of course, the shape of the reforming line 20 is not limited to the shape as shown in FIG. 3 (C), and may have other shapes.

  Subsequently, in order to remove a region facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14, as shown in FIGS. The process of forming the terminal part cutting groove 30 is performed. In this embodiment, the scribe wheel (wheel cutter) 250 forms the terminal portion cutting groove 30 inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12. The terminal portion cutting groove 30 is formed along a terminal portion cutting planned line in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

  When the formation of the terminal portion cutting groove 30 by the scribe wheel 250 is finished, as shown in FIG. 5, the multi-chamfered glass base material 50 is introduced into the etching apparatus 300 and etched with an etching solution containing hydrofluoric acid and hydrochloric acid. Is given. In the etching apparatus 300, the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

  As an example of a method of bringing the etching solution into contact with the multi-chamfer glass base material 50, as shown in FIG. 6A, the etchant is applied to the multi-chamfer glass base material 50 in each etching chamber 302 of the etching apparatus 300. Spray etching for spraying. Further, instead of spray etching, as shown in FIG. 6 (B), in the overflow type etching chamber 304, a structure in which the glass substrate 50 for multi-faces is conveyed while contacting the overflowed etching solution is adopted. Is also possible.

  Furthermore, as shown in FIG. 6 (C), dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.

  In any case, it is important that the shape cutting planned line and the terminal portion cutting planned groove penetrate in the thickness direction and the multi-chamfer glass base material 50 is not divided during the etching process. It is. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow rate of 3 μm / min or less with a thin hydrofluoric acid of 2% by weight or less, but is not limited to this method.

  If the etching rate is not slowed down in the whole etching process but is gradually reduced while adopting a faster etching rate at the beginning, it is possible to shorten the etching process time. For example, a configuration in which the hydrofluoric acid concentration in the etching solution is lowered as the process proceeds to the subsequent stage of the etching apparatus 300 may be employed.

  When the multi-chamfer glass base material 50 passes through the etching apparatus 300, the reforming line 20 and the terminal portion cutting groove 30 are etched. In the reforming line 20, the etching solution penetrates faster than other portions, and the glass is melted along this line, so that the color filter substrate can be easily cut by the reforming line 20. Further, even if a scratch or the like is generated at the time of laser irradiation, the scratch is easily lost.

  In the multi-chamfer glass base material 50, the modified line 20 is formed by laser filament processing, and the modified line is further etched to modify the multi-chamfer glass base material 50 with a slight mechanical pressure. The quality line 20 can be divided. For example, by applying a minute pressing force to the multi-chamfering glass base material 50 or applying microscopic ultrasonic vibration, the multi-chamfering glass base material 50 is not soiled as shown in FIG. It is possible to divide.

  Since the etching process does not completely cut it, it is possible to prevent the occurrence of a problem such that the end faces of the liquid crystal panel 10 separated during the etching collide and are damaged. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.

  FIG. 8A to FIG. 8C show a schematic configuration of the liquid crystal panel 10 after division. As shown in the figure, the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L4 in FIG. 8C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm is set to 50 μm or less (many 20 to 35 μm).

  As described above, when the liquid crystal panel 10 is manufactured, the influence of side etching hardly occurs. Therefore, it is possible to design the multi-chamber glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.

  In the above-described embodiment, for the convenience of explanation, the outline of the process has been described for the liquid crystal panel 10 in which the overcoat (OC) film and the ITO film are not formed on the array substrate 12 and the color filter substrate 14. Alternatively, the liquid crystal panel 10 can be properly separated even when an overcoat (OC) film or ITO film is formed on at least one of the color filter substrates 14 or other film forming processes are performed. It is.

  However, when there is a film on at least one of the array substrate 12 and the color filter substrate 14, it is preferable to use protective glass plates (60, 70) described later. The reason is as follows. When processing the multi-chamfered glass base material 50 on which any film is formed, it is necessary to prevent damage to the film in the etching process after laser processing. For this reason, a protective film such as an etching resistant film for protecting the film is attached. Examples of the protective film include acid-resistant films made of organic materials such as polyethylene, polypropylene, and polyvinyl chloride, and materials containing pigments such as carbon black. When laser processing is performed with the protective film attached, the protective film is sublimated by ablation or the like, and there is a risk that the gas generated thereby will contaminate the optical system such as the objective lens of the laser device. Since the contamination of the optical system reduces the ability of the laser device, it is necessary to deal with this. Hereinafter, a specific description will be given with reference to FIGS.

  FIG. 9A shows a state where the overcoat film 15 is formed at a position corresponding to each liquid crystal panel 10 in the multi-chamfer glass base material 50. Since the overcoat film 15 is eroded by an etching solution containing hydrofluoric acid or hydrochloric acid, the overcoat film 15 is covered with an etching resistant film 16 as shown in FIG. A portion corresponding to the contour of each liquid crystal panel 10 in this etching-resistant film 16 (a portion corresponding to the above-mentioned shape cutting planned line) is removed by laser processing to form a pattern as shown in FIG. The In this embodiment, polyethylene is adopted as the etching resistant film 16, but the configuration of the etching resistant film 16 is not limited to this. For example, polypropylene, polyvinyl chloride, olefin resin, or the like can be used as the etching resistant film 16.

  FIGS. 10A to 10C schematically show a protective glass plate 60 for preventing the lens of the laser device from being soiled by the sublimation gas of the etching resistant film 16. The protective glass plate 60 is configured so as to cover the upper surface of the multi-chamfer glass base material 50. The protective glass plate 60 is configured to have a main surface that is slightly wider than the main surface of the multi-chamfered glass base material 50. As long as the protective glass plate 60 has sufficient transparency to transmit the laser beam without being attenuated, various types of glass such as quartz glass, alkali glass, and alkali-free glass can be used. is there.

  The protective glass plate 60 includes a concave portion 62 formed in a concave shape, and a side edge portion 64 disposed around the concave portion 62. The edge part 64 has a taper part comprised so that it may stand up from the boundary with the recessed part 62 gradually. In this embodiment, the protective glass plate 60 is placed on the main surface on the upper side of the multi-face glass base material 50 with the recess 62 facing downward.

  When the protective glass plate 60 is placed on the multi-faced glass base material 50, it is preferable that the tapered portion of the side edge part 64 of the protective glass plate 60 abuts on the edge of the multi-faced glass base material 50. The reason is that the protective glass plate 60 is less likely to be displaced in a direction parallel to the main surface in a state where the tapered portion of the peripheral edge portion 64 of the protective glass plate 60 is in contact with the peripheral edge of the glass substrate 50 for multi-faces. This is because it is difficult for problems such as slipping off the multi-chamfer glass base material 50 to occur.

  As shown in FIG. 10C, when laser processing is performed in a state where the protective glass plate 60 is placed on the multi-chamfering glass base material 50, the gas generated by sublimation of the etching resistant film 16 is multi-chamfered. It is confined in the space between the glass base material 50 and the recess 62. That is, gas generated by sublimation of the etching resistant film 16 is prevented from reaching an optical system such as a lens of the laser device. Moreover, since the protective glass plate 60 can be disposed as long as a distance corresponding to the plate thickness is provided between the lens of the laser device and the glass substrate 50 for multi-faces, the lens of the laser device. Can be used without any problem even when the glass substrate 50 is disposed close to the multi-chamfer glass base material 50.

  Before the laser processing is performed on the multi-chamfering glass base material 50, a protective glass plate 60 is set on the multi-chamfering glass base material 50, and the multi-chamfering glass base material 50 is protected when the laser processing is finished. The glass plate 60 can be collected. Since the protective glass plate 60 has chemical resistance, the protective glass plate 60 can be cleaned using an optimal chemical solution as appropriate, and can be recycled and reused any number of times.

  FIG. 11A and FIG. 11B show an outline of a protective glass plate 70 according to another embodiment. The protective glass plate 70 is configured so as to be able to cover the upper surface of the multi-chamfered glass base material 50, similarly to the protective glass plate 60 described above. The protective glass plate 70 is configured to have a main surface that is slightly wider than the main surface of the multi-chamfered glass base material 50. As for the protective glass plate 70, various types of glass such as quartz glass, alkali glass, and non-alkali glass can be used as long as they have sufficient transparency to transmit the laser beam without being attenuated. It is.

  The protective glass plate 70 includes a concave portion 72 formed in a concave shape and an edge portion 74 disposed around the concave portion 72. The edge part 74 has a taper part comprised so that it may stand up from the boundary with the recessed part 72 gradually. And the step part is formed in the middle of this taper part. When the protective glass plate 70 is placed on the multi-chamfering glass base material 50, the taper portion or the stepped portion of the side edge part 74 of the protective glass plate 70 abuts on the edge of the multi-chamfering glass base material 50. Is preferred.

  When the step part in the edge part 74 of the protective glass plate 70 contact | abuts to the edge of the glass substrate 50 for multi-chamfering, the horizontal state of the protective glass plate 70 is easy to be maintained. For this reason, the protective glass plate 70 is less likely to affect the laser beam. In addition, since the tapered portions are provided on both sides of the stepped portion, it is possible to correspond to the multiple-size glass substrate 50 for multiple faces. In this embodiment, a configuration in which one step portion is provided is shown, but two or more step portions can be formed as necessary. However, since the thickness of the protective glass plate 70 tends to increase as the number of stepped portions increases, the number of stepped portions is determined in consideration of the distance between the multi-chamfered glass base material 50 and the lens of the laser device. There is a need to.

  FIG. 12A to FIG. 12D show an example of a method for manufacturing the protective glass plate 60 and the protective glass plate 70 described above. The protective glass plate 60 is produced by etching a plate-shaped raw glass. At that time, as shown in FIG. 12A, an etching process is performed after applying a masking film 65 having an etching resistance so as to expose only a portion of the protective glass plate 60 where the recess 62 is formed. The masking film 65 can be made of the same material as the etching resistant film 16 described above. By applying the masking film 65, only the portions that come into contact with the etching solution are etched, and therefore, as shown in FIG. A protective glass plate 60 having a rim 64 is generated.

  Further, as shown in FIG. 12C, the protective glass plate 70 is subjected to an initial etching process after applying a masking film 75 having etching resistance so as to expose only the deepest position of the recess 72. Done. Subsequently, a part of the inner edge portion of the masking film 75 is removed so that the entire recess 72 is exposed, and a finishing etching process is performed. When one step is provided, the etching process is performed in two steps, and when two steps are provided, the etching process is performed in three steps. Good.

  As described above, by using the protective glass plate 60 and the protective glass plate 70, lens contamination caused by gas due to ablation at the time of laser processing is reduced with respect to a laser device having a short distance between the lens and the workpiece. It is possible to prevent suitably. This is particularly effective in an apparatus in which the distance between the lens and the workpiece is short. Moreover, it is easier to keep the protective glass clean than the configuration in which the protective glass is arranged as a lens-side unit or the configuration in which the protective glass is arranged as an independent unit on the laser beam path, and the laser that passes through. Hard to adversely affect the beam. Furthermore, when the organic substance is sublimated, the ablation gas does not reach the lens, so that it is not necessary to separately provide a device for blowing off the sublimation gas.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 20-Modified line 30-Terminal cutting groove 50-Multiple glass substrate 60,70-Protective glass plate 62,72-Recess 64,74-Edge Part 100-Smartphone 122-Electrode terminal part 250-Scribe wheel 300-Etching apparatus 302, 304-Etching chamber 306-Etching tank

Claims (3)

A protective glass plate configured to be able to be placed on a glass substrate for multiple surfaces for multi-sided liquid crystal panels formed by laminating an array substrate and a color filter substrate,
A concave portion formed in a region corresponding to the arrangement region of the liquid crystal panel in the multi-chamfered glass base material;
An edge disposed around the recess;
With
A protective glass plate, wherein the edge portion is configured to be placed on an end portion of the multi-chamfered glass base material. A taper portion is provided on the edge portion,
2. The protective glass plate according to claim 1, wherein the tapered portion is configured to be placed on an end portion of the multi-chamfered glass base material. A method for producing a liquid crystal panel for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multiple chamfering for multi-planarizing a liquid crystal panel formed by laminating an array substrate and a color filter substrate,
A modified line formed by a laser along a planned cutting line corresponding to the shape of the liquid crystal panel with respect to the array substrate and the color filter substrate, and has a property of being more easily etched than other portions. A reforming line forming step for forming a quality line;
A groove forming step for forming a groove along a terminal portion cutting planned line for removing a region facing the electrode terminal portion of the array substrate in the color filter substrate with respect to the color filter substrate;
An etching step for performing an etching process while preventing the array substrate and the color filter substrate from being cut at the shape cutting planned line and the terminal portion cutting planned line,
After the etching process, a cutting step for cutting at the shape cutting planned line and the terminal portion cutting planned line;
A liquid crystal panel manufacturing method comprising at least
A method for producing a liquid crystal panel, wherein, in the reforming line forming step, the protective glass plate according to claim 1 or 2 is placed on the glass substrate for multiple faces.

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