JP2018081242A - Method for manufacturing liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal panel, by which a liquid crystal panel can be divided and processed into an irregular shape with high production efficiency by etching.SOLUTION: The method for manufacturing a liquid crystal panel includes a division step of cutting a glass preform for multi-patterning into a strip where liquid crystal panels are to be arranged in line; a terminal formation step of exposing an electrode terminal portion on a color filter substrate side; a protection step of applying an anti-etching agent on the strip-like glass preform and the exposed electrode terminal portion; a patterning step of patterning the anti-etching agent into a shape of the liquid crystal panel; an etching step of bringing the glass preform into contact with an etching solution to divide into a plurality of liquid crystal panels in a predetermined shape; and a removal step of removing the anti-etching agent from the liquid crystal panel. In the dividing step, the cutting position of the electrode terminal portion is set to be outside at a distance corresponding to at least the thickness of the glass preform from the final dimension of the liquid crystal panel.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-chamfering for multi-chamfering of the liquid crystal panel, and in particular, appropriately dividing the glass substrate for multi-chamfering using etching. The present invention relates to a liquid crystal panel manufacturing method.

  In recent years, with the spread of smartphones and tablets, the efficiency of mass production of liquid crystal panels used for liquid crystal displays is required. Conventionally, a method of widely obtaining a plurality of liquid crystal panels by forming a glass substrate for multiple chamfering for multi-paneling, thinning it by etching or physical polishing, and then dividing by scribing is widely used. Has been. By such a method, it has been said that the liquid crystal panel can be appropriately thinned and the liquid crystal panel can be mass-produced efficiently.

  However, when the above-described method is used, there is a concern that the strength of the liquid crystal panel may be reduced due to scratches generated during scribing. In particular, the thinner the liquid crystal panel is, the higher the risk of breakage and chipping of the panel, making it difficult to perform efficient processing. Therefore, in the prior art, there is a technique for thinning and dividing the multi-chamfering glass base material by etching after forming a scribe line on the multi-chamfering glass base material (for example, Patent Document 1). reference.). According to this technique, it is said that the yield can be improved by etching, and the liquid crystal panel can be thinned and mass-produced.

JP 2009-047875 A

  However, since a separate process for protecting the electrode terminal portion from the etching solution is required, it cannot be said that the production efficiency is necessarily high. It is necessary to increase the number of processes in the manufacturing stage of the liquid crystal panel and to make new capital investment. For this reason, there has been a demand for a method that can be divided by etching without drastically changing the manufacturing process of the liquid crystal panel.

  Furthermore, recently, improvement in design has been demanded, and there is an increasing demand for liquid crystal panels having circular shapes, polygonal shapes, and other irregular shapes other than the conventional rectangular shapes. However, none of the conventional techniques can meet such a demand for profile processing. In the technique according to Patent Document 1, it can be said that only a liquid crystal panel having a shape suitable for scribing can be produced, and it is substantially difficult to produce a liquid crystal panel other than a rectangle. Moreover, in practice, it is difficult to allow the etching solution to enter the formed scribe line, and it is assumed that it is necessary to divide the multi-face glass member by applying physical or thermal stress.

  An object of the present invention is to provide a method for manufacturing a liquid crystal panel, which can perform a cutting process and a deforming process of the liquid crystal panel with high productivity by etching.

  The method for producing a liquid crystal panel according to the present invention is a method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multiple chamfering for chamfering a liquid crystal panel. The present invention includes a cutting step, a terminal formation step, a protection step, a patterning step, an etching step, and a removal step.

  The dividing step is a process of dividing the multi-face glass base material into strip-shaped glass base materials in which liquid crystal panels are arranged in a line. In the dividing step, the electrode terminal portions arranged in the respective liquid crystal panels are divided so as to be arranged around one outer periphery of the strip-shaped glass base material. Further, the cutting position of the strip-shaped glass base material in the dividing step is set to the outside by at least the plate thickness of the glass base material with respect to the final dimension of the liquid crystal panel.

  The terminal forming step is a step of exposing the electrode terminal portion to the color filter substrate side by removing a region facing the electrode terminal portion of the array substrate in the color filter substrate of the strip-shaped glass base material. As an example of this step, there is a technique in which a region facing the electrode terminal portion of the array substrate is divided and removed by scribing a predetermined position of the color filter substrate.

  The protection step is a step of covering the electrode terminal portions exposed on both main surfaces of the strip-shaped glass base material and the color filter substrate side with an etching resistant agent. Examples of the anti-etching agent include a protective film having resistance to the etching solution used in the etching step, a resist material, or a sealing agent.

The patterning step is a step of patterning the etchant so as to correspond to the shape of the liquid crystal panel. The patterning process can be performed by using a laser device such as a CO ₂ laser or an IR laser having a required output. In addition, when a resist material is used as the etchant, patterning can be formed by exposure processing.

  The etching step is a process of dividing the strip-shaped glass base material into a plurality of liquid crystal panels having a predetermined shape by bringing the strip glass base material into contact with an etching solution. By the etching process, the liquid crystal panels of the strip-shaped glass base material are divided and the outer periphery is formed. The removing step is a step of removing the etchant from the liquid crystal panel after the etching process. The removal of the etchant is performed by means such as heating, light irradiation, or reaction with a release agent.

  In the method for manufacturing a liquid crystal panel according to the present invention, since the electrode terminal portion can be exposed by the dividing step and the terminal forming step, the electrode terminal portion can be efficiently protected. Furthermore, by setting the cutting position in the dividing step outside the final dimension, all the outer peripheral end faces of the liquid crystal panel can be formed by etching. When the region formed by the dividing step and the region formed by the etching step exist on the outer peripheral end surface of the liquid crystal panel, there is a possibility that the etching is not performed according to the dimension at the intersection. In the present invention, by setting the cutting position to the outside by at least the plate thickness, even if side etching by the etching process proceeds, all contours can be formed by etching. For this reason, even if the glass base material is divided for forming the electrode terminal portion, it is possible to perform the outer shape processing without causing the above-described problems.

  Moreover, it is preferable that the liquid crystal panel manufactured by this invention contains a curve part or a broken line part in an outline. Since the present invention divides the liquid crystal panel using an etching process, it is prominent in liquid crystal panels having irregular shapes such as a polygonal shape, a circular shape, and an elliptical shape in which the contour of the liquid crystal panel includes a curved portion or a broken line portion. Has an effect. Further, since the etching failure at the intersection of the above-described dividing step and the etching step is likely to occur particularly in the curved portion, the present invention can also prevent a defect in the etching processing in the curved portion.

  According to the present invention, it is possible to cut and deform a liquid crystal panel with high production efficiency by etching.

It is a figure which shows an example of a structure of the glass base material for multiple chamfering. It is a figure shown about the division | segmentation to a strip-shaped glass base material, and the cutting | disconnection of an electrode terminal part area | region. It is a figure shown about the protection process of a strip-shaped glass base material. It is a figure shown about the division | segmentation to a liquid crystal panel from a strip-shaped glass base material. It is a schematic side view of an etching apparatus. It is a figure which shows the comparative example about the etching of a strip-shaped glass base material.

  Hereinafter, an embodiment of a liquid crystal panel manufacturing method of the present invention will be described with reference to the drawings. FIG. 1A and FIG. 1B show an example of a schematic configuration of a multi-chamfering glass base material 10 for multi-chamfering a liquid crystal panel. As shown in FIG. 1A, the multi-chamfer glass base material 10 is configured to obtain a plurality of liquid crystal panels 12 having a predetermined shape. The liquid crystal panel 12 can form a desired shape. In the present embodiment, a glass base material in which a substantially circular liquid crystal panel 12 composed of arcs and straight lines is arranged in a matrix of 4 × 4 is used as the multi-surface glass base material 10. The shape and quantity are not limited to this.

  FIG. 1B is a schematic cross-sectional view of a part of the multi-chamfer glass base material 10. The multi-surface glass base material 10 is configured such that the liquid crystal layer 18 is sandwiched between two glass substrates, a color filter substrate 14 and an array substrate 16. As the color filter substrate 14 and the array substrate 16, it is preferable to use non-alkali glass, and the thickness of each substrate is about 100 to 700 μm. Further, before the liquid crystal panel 12 is divided, a thinning process such as etching may be performed to adjust the plate thickness of the glass substrate 10 for multiple surfaces.

  The color filter substrate 14 has a color filter layer formed on the main surface facing the array substrate 16. The color filter layer can be formed by a known sputtering process or the like. In the array substrate 16, functional layers such as a transparent electrode layer and a liquid crystal driving element are formed on the main surface facing the color filter substrate 14. The liquid crystal layer 18 is sandwiched between the color filter substrate 14 and the array substrate 16. Further, the liquid crystal layer 18 is sealed at the periphery by a sealing material 20. As the sealing material 20, a known thermosetting or ultraviolet curable sealing agent can be used.

  Furthermore, an electrode terminal portion 22 is formed outside the sealing material 20. The electrode terminal portion 22 is formed on the main surface of the array substrate 16 and is a terminal for electrically connecting the liquid crystal panel 12 and the product when the liquid crystal panel 12 is mounted as a display.

  From here, the dividing process of the glass substrate 10 for multi-cavity will be described. The multi-chamfer glass base material 10 is cut along a scribe line 70 shown in FIG. 2A, thereby being divided into strip-shaped glass base materials 100 in which the liquid crystal panels 12 are arranged in a row. In the present embodiment, the panel is divided by a scribe break. However, the panel can be divided by a thermal process using a laser device. This cutting process is performed so that the region where the electrode terminal portion 22 of the liquid crystal panel 12 is disposed is disposed along one outer periphery of the strip-shaped glass base material 100.

  Further, the scribe line 70 is set so as to be at least outside the final dimension line of the liquid crystal panel 12 by the thickness of the strip-shaped glass base material 100. In the present invention, the final dimension of the liquid crystal panel 12 indicates the dimension of the liquid crystal panel 12 after the etching process. In this embodiment, when the strip glass base material is divided, the distance (D) from the end of the electrode terminal portion 22 to the cross section of the strip glass base material 100 is the thickness of the strip glass base material 100. It cut | disconnects so that it may become the same (refer FIG.2 (C)).

  In consideration of the chamfering efficiency of the panel, it is preferable that the strip-shaped glass base material 100 is cut with an interval as long as possible. However, when dividing a liquid crystal panel having a curved portion in the outline as in this embodiment, a problem occurs during the etching process at the intersection of the region formed by scribing and the region formed by etching, so the final dimensions are intentionally Cut outside. When making such a cut, it is necessary to appropriately adjust the arrangement of the liquid crystal panel 12 when the multi-chamfer glass base material 10 is manufactured.

  After dividing into the strip-shaped glass base material 100, the color filter substrate 14 arranged at a position corresponding to the electrode terminal portion 22 is cut in order to expose the electrode terminal portion 22. This cutting process can also be performed using a scribe or a laser device. Since the electrode terminal portion 22 is disposed along one outer periphery of the strip-shaped glass base material 100, the color filter substrate is formed along one side of the strip-shaped glass base material 100 as shown in FIG. By cutting 14, the electrode terminal portion 22 can be exposed.

  Next, the cutting process and the outer shape formation of the liquid crystal panel 12 by etching will be described. The strip-shaped glass base material 100 is protected by a protective material having etching resistance before the etching process. In this embodiment, as shown in FIG. 3 (A), the main surfaces of the color filter substrate 14 and the array substrate 16 are covered with a protective film 30 having etching resistance. Moreover, when covering the protective film 30, it coat | covers so that the protective film 30 may extend from the outer peripheral end surface of the strip-shaped glass base material 100 in which the electrode terminal part 22 is arrange | positioned. The extension distance of the protective film 30 is preferably 1 mm or more. In addition to the film, a resist material having etching resistance can be used as the protective material.

  Then, in order to protect the electrode terminal part 22, the sealing agent 32 is coat | covered to the area | region where the electrode terminal part 22 is exposed. As shown in FIG. 3 (B), by covering the protective film 30 so as to extend, the sealing agent 32 is suitably applied to the space formed by the protective film 30 and the wall surface of the strip-shaped glass base material 100. be able to. In addition, as the sealing agent 32, it is possible to use the sealing agent and resist agent which have etching resistance, and the sealing agent 32 is apply | coated using coating devices, such as a syringe.

  After the protection process of the strip-shaped glass base material 100 is completed, patterning is performed by irradiating the protective film 30 with a laser. In the patterning process, the protective film 30 is removed by irradiating a laser so as to have a shape corresponding to the shape of the liquid crystal panel 12. A pulse laser can be used as the laser device. The patterning process is preferably performed on the color filter substrate 14 and the array substrate 16. As shown in FIG. 4A, the protective film 30 other than the region corresponding to the liquid crystal panel 12 is removed from the strip-shaped glass base material 100 by the patterning process. In the patterning process, in consideration of side etching during the etching process, the patterning is performed so that the protective film 30 covers a predetermined amount outside the final dimension of the liquid crystal panel 12.

  After completion of the patterning process, the strip-shaped glass base material 100 is brought into contact with the etching solution to perform the etching process. By the etching process, unnecessary glass regions that are not covered with the protective film 30 are dissolved by the etching solution and divided into the liquid crystal panel 12. The etching solution used for the etching treatment contains at least hydrofluoric acid, and may contain an inorganic acid such as hydrochloric acid or sulfuric acid, or a surfactant. By performing the etching process, a liquid crystal panel having a desired shape can be manufactured. Further, since fine scratches on the end face of the liquid crystal panel 12 can be removed by the etching process, the panel strength is improved.

  When performing the etching process, an etching apparatus 40 as shown in FIG. 5 can be used. The etching apparatus 40 is a single-wafer etching apparatus, and is configured to inject an etching solution from above and below while conveying the strip-shaped glass base material 100 in the horizontal direction. The etching apparatus 40 includes at least a conveyance roller 42 and a jet unit 44. The conveyance rollers 42 are rollers arranged at equal intervals along the length direction of the etching apparatus 40, and are configured to convey the strip-shaped glass base material 100 in the horizontal direction while supporting the glass substrate 100 from below. In addition to the transport rollers, there is no particular limitation as long as the transport mechanism can transport the substrate to be processed in the horizontal direction. The injection unit 44 is provided with a plurality of injection nozzles so that the etching solution can be uniformly injected onto the strip-shaped glass base material 100. By spraying the etching solution, the color filter substrate 14 and the array substrate 16 are dissolved and divided into the liquid crystal panel 12. In this embodiment, the etching process is performed using the single-wafer etching apparatus 40, but the etching method may be changed as appropriate.

  Since each liquid crystal panel 12 divided by the etching process is bonded to the sealant 32, the liquid crystal panel 12 is not separated in the etching apparatus 40 and can be easily managed (see FIG. 4B). .) The protective film 30 and the sealing agent 32 are removed from the liquid crystal panel 12 after the etching process. The protective film 30 can be removed by applying a physical force or immersing it in a stripping solution. The sealing agent 32 can be peeled off without damaging the electrode terminal portion 22 by being immersed in a solution containing a surfactant.

  Here, the division | segmentation step to the strip-shaped glass base material 100 is demonstrated. Usually, in the production of a liquid crystal panel for multi-chamfering, it is preferable to set the interval between adjacent liquid crystal panels as narrow as possible from the viewpoint of chamfering efficiency. Further, the chamfering efficiency is further improved by using the divided cross section of the strip-shaped glass base material 100 as the contour of the liquid crystal panel 12. However, in this embodiment, when dividing into the strip-shaped glass base material 100, the area | region outside the final dimension of the liquid crystal panel 12 is cut | disconnected. The reason for cutting in this way is that there is a possibility that etching is not suitably performed at the intersection of the cross section formed by scribe and the cross section formed by etching. From here, it demonstrates using the comparative example by drawing.

  FIG. 6A is a diagram showing the array substrate 16 side of the strip-shaped glass base material 100 after the patterning process in the comparative example. In FIG. 6A, in order to use the contour portion of the strip-shaped glass base material 100 formed by scribing as the contour of the liquid crystal panel 12, the protective film 30 is in contact with the cut surface of the strip-shaped glass base material 100. Patterning is performed. When such patterning is performed, the etching does not easily progress at the intersection 74 between the region formed by scribe and the region formed by etching during the etching process. When the etching process is performed by such patterning, as shown in FIG. 6B, a protrusion 76 is generated in the array substrate 16, and the etching may not be performed as patterned.

  In the embodiment according to the present invention, when the strip-shaped glass base material 100 is cut from the final dimension of the liquid crystal panel 12, the etching process can be suitably performed by setting a scribe line on the outside by the same amount as the plate thickness. it can. At this time, the reason for setting the outside of the strip-shaped glass base material 100 by the plate thickness is that, since the etching proceeds isotropically in the wet etching process, even in the cutting process in which the etching proceeds in the sheet thickness direction. This is because etching proceeds in the lateral direction. The amount of etching in the lateral direction can be adjusted by the composition of the etchant and the jetting method of the etchant. However, by setting the cutting position to the outside by at least the plate thickness, all the contours of the liquid crystal panel 12 can be obtained. Can be formed by etching.

  The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-multiple glass substrate 12-liquid crystal panel 14-color filter substrate 16-array substrate 18-liquid crystal layer 20-sealing material 22-electrode terminal part 30-protective film 32-sealing agent

Claims (2)

A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi chamfering for chamfering a liquid crystal panel,
A cutting step of cutting the glass substrate for multiple chamfering into a strip-shaped glass base material in which liquid crystal panels are arranged in a row,
A terminal forming step of exposing the electrode terminal portion to the color filter substrate side by removing a region facing the electrode terminal portion of the array substrate in the color filter substrate of the strip-shaped glass base material;
A protection step of covering the electrode terminal portion exposed on both main surfaces of the strip-shaped glass base material and the color filter substrate side with an etching resistance;
A patterning step of patterning the etchant to correspond to the shape of the liquid crystal panel;
An etching step of dividing the strip-shaped glass base material into a plurality of liquid crystal panels having a predetermined shape by contacting the strip-shaped glass base material with an etching solution;
Removing the etchant from the liquid crystal panel;
Including
In the dividing step, the cutting position of the electrode terminal portion is set outside the final dimension of the liquid crystal panel by at least the plate thickness of the glass base material.   The liquid crystal panel manufacturing method according to claim 1, wherein the contour of the liquid crystal panel includes a curved line portion or a broken line portion.

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