WO2019239889A1

WO2019239889A1 - Liquid crystal panel manufacturing method

Info

Publication number: WO2019239889A1
Application number: PCT/JP2019/021217
Authority: WO
Inventors: 真吾茅野; 康宏柏原; 寛之山内; 哲孝堂園; 恵太家原; 聡向原; 守鎌苅
Original assignee: 株式会社Ｎｓｃ; シャープ株式会社
Priority date: 2018-06-13
Filing date: 2019-05-29
Publication date: 2019-12-19
Also published as: CN112105984B; TW202006431A; CN112105984A; JP6578533B1; TWI804634B; JP2019215439A

Abstract

This liquid crystal panel manufacturing method according to the present invention comprises at least: a laser emission step for forming a readily etchable modified line (20) by emitting a laser beam along a line that is on a glass base material (50) for multi-chamfering and is to be cut in a shape corresponding to a liquid crystal panel; and a scribe groove formation step for forming a scribe groove on a color filter substrate (14), the scribe groove being formed along a line to be cut in a region of a terminal part. The laser emission step comprises a normal operation mode for emitting a laser beam onto a place not adjacent to an electrode terminal part, and a light collection region adjustment mode for emitting a laser beam onto a place adjacent to the electrode terminal part. In the light collection region adjustment mode, a light collection region is adjusted so that the light collection region does not reach an intermediate layer.

Description

Liquid crystal panel manufacturing method

The present invention relates to a liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a desired shape from a multi-chamfer glass base material.

Generally, when a glass panel such as a liquid crystal panel or a cover glass is manufactured, a process for obtaining a plurality of glass panels having a desired shape from a glass substrate for multiple chamfering is performed. For example, in the manufacture of liquid crystal panels, a technique (so-called multi-sided) is widely adopted in which a plurality of liquid crystal panels are manufactured simultaneously with a set of glass base materials, and then the glass base material is divided into a single liquid crystal panel. I came. And when dividing | segmenting a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were often used.

However, when a scribe break is employed, it is difficult to form a glass panel having a rounded outline. In laser ablation processing, problems such as slow processing speed and contamination due to ablation debris are likely to occur.

Therefore, conventionally, a technique for obtaining a plurality of glass panels by dividing a multi-chamfer glass base material by etching treatment has been attracting attention. Etching has come to be used to obtain a cover glass having a desired shape, and recently, a predetermined number of glass substrates for multi-surfaces for multi-sided liquid crystal panels formed by bonding an array substrate and a color filter substrate are used. Etching is also used to obtain a plurality of liquid crystal panels having a shape (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-224201

However, in the etching process, in addition to the etching progressing in the thickness direction of the glass panel, side etching occurs in which the etching progresses in a direction orthogonal to the etching. For this reason, in the etching process, it becomes difficult to form the cut surface of the glass panel so as to be substantially perpendicular to the main surface. For example, when liquid crystal panels are chamfered by etching, it is necessary to provide a space between each liquid crystal panel in the glass base material in consideration of the influence of side etching that proceeds in a direction perpendicular to the thickness direction of the glass base material. As a result, the multi-chamfering efficiency may deteriorate.

An object of the present invention is to provide a liquid crystal panel manufacturing method capable of minimizing the influence of side etching accompanying an etching process.

The present invention relates to a method for manufacturing a liquid crystal panel for obtaining a plurality of liquid crystal panels of a predetermined shape from a glass substrate for multi-cavity for multi-planarizing a liquid crystal panel in which an array substrate and a color filter substrate are arranged to face each other with an intermediate layer interposed therebetween. It is. A typical example of the intermediate layer is a liquid crystal layer, but void regions that are not filled with liquid crystal are also included in the intermediate layer.

This liquid crystal panel manufacturing method includes at least a laser irradiation step and a scribe groove forming step. In the laser irradiation step, the multi-chamfered glass base material is etched along the shape cutting planned line by irradiating the laser light along the shape cutting planned line corresponding to the shape of the liquid crystal panel in the multi-faced glass base material. An easily modified line is formed.

In the scribe groove forming step, a scribe groove is formed on the color filter substrate along a terminal portion region cutting planned line for removing a region of the color filter substrate facing the electrode terminal portion of the array substrate.

The laser irradiation step includes a normal operation mode when irradiating a laser beam to a position not adjacent to the electrode terminal portion, and a condensing region adjustment mode when irradiating the laser beam to a position adjacent to the electrode terminal portion. In the light collection region adjustment mode, the light collection region is adjusted so that the light collection region does not reach the intermediate layer. In the condensing region adjustment mode, for example, an optical system such as a lens may be adjusted so that the condensing region becomes short, or the condensing region may be displaced so as to move away from the intermediate layer.

By adopting the method as described above, for example, the etching solution can easily penetrate along the modification line, and the etching process can be easily performed in a short time, thereby minimizing the influence of side etching. It becomes possible to do.

Further, when the laser beam is irradiated to a position adjacent to the electrode terminal portion, the laser beam condensing region does not reach the intermediate layer, so that the energy of the laser beam is not transmitted to the intermediate layer. As a result, it is possible to prevent the terminal wiring pattern disposed in the electrode terminal portion from being melted and scattered by the energy of the laser, or causing trouble due to heat in other portions of the electrode terminal portion.

In the above-described liquid crystal panel manufacturing method, it is preferable that the method further includes an etching step of etching the modified line by bringing the multi-chamfered glass base material into contact with an etching solution. By etching the modified line, it becomes possible to form a cutting groove along the planned cutting line. For example, by applying a physical stress or a thermal stress to the cut groove, the liquid crystal panel is divided along the shape cutting planned line, so that the liquid crystal panel can be multi-faceted.

In particular, since the laser light condensing region does not reach the intermediate layer at a position adjacent to the electrode terminal portion, the terminal wiring of the electrode terminal portion corrodes due to excessive penetration of the etching solution in the vicinity of the electrode terminal portion. The occurrence of defects is suppressed.

When a functional film that can be corroded by etching is formed on the array substrate or the color filter substrate, the functional film is covered with an etching-resistant protective film or an etching-resistant layer, and then the protective film is covered. It is preferable to add a step of providing an opening that exposes a portion that needs to be etched such as a shape cutting planned line by patterning.

A functional film (for example, a protective film such as an overcoat or a transparent conductive film such as ITO or an organic conductive film) is formed by forming an opening in a portion corresponding to the shape cutting planned line in the etching resistant film or etching resistant layer. It is possible to etch the modified line in the glass substrate for multi-faces while protecting.

According to the present invention, the influence of side etching accompanying the etching process can be minimized in the liquid crystal panel manufacturing method. Furthermore, it is possible to suppress the occurrence of problems such that the terminal wiring pattern is scattered near the electrode terminal portion or the terminal wiring is corroded due to excessive penetration of the etching solution.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfering containing a some liquid crystal panel. It is a figure which shows the process included in one Embodiment of a liquid crystal panel manufacturing method. It is a figure which shows the process included in one Embodiment of a glass panel manufacturing method. It is explanatory drawing of the normal operation mode at the time of laser irradiation, and a condensing area | region adjustment mode. It is a figure which shows the process included in one Embodiment of a liquid crystal panel manufacturing method. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the outline of the scribe break process with respect to the multi-chamfer glass base material. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel.

Hereinafter, an embodiment of a method for manufacturing a liquid crystal panel according to the present invention will be described with reference to the drawings. FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that an array substrate 12 and a color filter substrate 14 are bonded together with an intermediate layer such as a liquid crystal layer interposed therebetween. Since the configurations of the array substrate 12 and the color filter substrate 14 can be the same as known configurations, the description thereof is omitted here.

The array substrate 12 has an electrode terminal portion 122 provided so as to extend from a region bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and these electric circuits are housed in a housing, so that, for example, a smartphone 100 as shown in FIG. Composed.

Subsequently, an example of a method for manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2 (A) and 2 (B), the liquid crystal panel 10 is generally manufactured as a multi-chamfer glass base material 50 including a plurality of liquid crystal panels 10. And the single liquid crystal panel 10 is obtained by parting this glass substrate 50 for multi-cavity.

In this embodiment, for convenience, six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns, and a transparent thin film (a transparent conductive film such as an ITO film or an organic conductive film or a transparent protective film) is formed on the surface. ) A process for the multi-chamfered glass preform 50 on which 17 is formed will be described. However, the number of the liquid crystal panels 10 included in the multi-chamfer glass base material 50 is not limited to this, and can be appropriately increased or decreased.

First, as shown in FIG. 3A and FIG. 3B, the glass substrate for multi-face 50 has the reforming line 20 along the shape cutting planned line corresponding to the shape (contour) of the liquid crystal panel 10. It is formed. The modification line 20 is a filament array in which a plurality of filament layers formed by a light beam pulse (a beam diameter of about 1 to 5 μm) irradiated from a pulse laser such as a picosecond laser or a femtosecond laser is arranged. (See FIGS. 4A and 4B.) For example, as shown in FIGS. 4A and 4B, the reforming line 20 has a perforated shape having a plurality of through holes or modified layers. The reforming line 20 has a property that it is more easily etched than other portions of the multi-chamfer glass base material 50. Of course, the shape of the reforming line 20 is not limited to this shape, and may have a shape other than this.

If the array substrate 12, the color filter substrate 14, and the transparent thin film 17 are simultaneously processed by one laser beam, a defect may occur in the liquid crystal layer. For this reason, in this embodiment, it becomes possible to suppress generation | occurrence | production of such a malfunction by employ | adopting laser processing as shown in FIG.3 (C) and FIG.3 (D). That is, as shown in FIG. 3 (C), the focus is adjusted and the intensity is adjusted so that the modified line 20 is formed only on the array substrate 12 from the array substrate 12 side, and then the laser is applied to the vicinity of the liquid crystal layer. It is better to make it difficult to transmit energy. If the multi-chamfer glass base material 50 can be divided by applying a physical action or a thermal action in this state, the laser processing ends here.

On the other hand, when it is difficult to divide the glass substrate for multi-face 50 in this state, as shown in FIG. 3 (D), the color filter substrate 14 is changed from the opposite side to the color filter substrate 14 side. Laser irradiation may be performed after adjusting the focus and intensity so as to form the reforming line 20. Although the number of laser processing steps is increased by performing the process shown in FIG. 3D, it is possible to easily divide the glass substrate 50 for multi-faces while suppressing the occurrence of defects in the liquid crystal layer. become.

The light beam from the pico laser is controlled so that the condensing region varies depending on the operation mode. For example, in this embodiment, the normal operation mode is employed when irradiating a laser beam to a position not adjacent to the electrode terminal portion 122, while condensing when irradiating the laser beam to a position adjacent to the electrode terminal portion 122. A region adjustment mode is employed.

FIGS. 5A and 5B show the laser light irradiation state in the normal operation mode, and FIGS. 5C and 5D show the laser light irradiation state in the condensing region adjustment mode. Show. The normal operation mode is an operation mode that is employed when the laser beam is irradiated to a position that is not adjacent to the electrode terminal portion 122. On the other hand, the condensing region adjustment mode is an operation mode that is employed when laser light is irradiated to a position adjacent to the electrode terminal portion 122.

In both the normal operation mode and the light collection region adjustment mode, the focal point of the laser light is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed. Is controlled to fall within the range of the thickness of the substrate being processed. However, even when the focal point of the laser light is located at the center of the array substrate 12 or the color filter substrate 14 in the thickness direction of the substrate being processed, the condensing region of the laser light is the substrate being processed. In some cases, the thickness of the intermediate layer and the other substrate may be exceeded.

Therefore, as shown in FIGS. 5C and 5D, in the light collection region adjustment mode, the light collection region is specially adjusted so that the light collection region does not reach the intermediate layer. As a method for adjusting the condensing region, at least one of an optical system such as a laser head or an objective lens is moved in a direction in which the multi-surface glass base material 50 is separated, or an optical system for narrowing the condensing region. May be selectively placed on the optical path of the laser beam.

When the laser beam is irradiated to a position adjacent to the electrode terminal portion 122, the light collection region is specially adjusted so that the light collection region does not reach the intermediate layer. Is prevented from melting and scattering. Further, it is possible to prevent the terminal wiring from being corroded due to excessive permeation of the etching solution when etching is performed.

After the reforming line 20 is formed along the shape cutting planned line in the multi-chamfering glass base material 50, the multi-chamfering glass base material 50 is formed as shown in FIGS. 6 (A) and 6 (B). The etching resistant film 16 having etching resistance is attached to both main surfaces. Here, polyethylene having a thickness of 50 to 75 μm is employed as the etching resistant film 16. However, the configuration of the etching resistant film 16 is not limited to this. For example, any material having resistance to an etching solution for etching glass, such as polypropylene, polyvinyl chloride, and olefin resin, can be appropriately selected and employed.

When the application of the etching resistant film 16 is completed, subsequently, as shown in FIG. 6C, the etching resistant film 16 is irradiated with a laser beam along the shape cutting planned line corresponding to the shape of the liquid crystal panel 10 to be taken out. Done. By this laser beam irradiation, the etching resistant film 16 is removed along the planned cutting line. And the opening part of the etching-resistant film 16 will be formed along a shape cutting plan line, As a result, modification | reformation of the glass base material 50 for multi-faces like the structure shown in FIG.3 (C). The formation position of the line 20 is exposed to the outside.

When the above laser processing is completed, as shown in FIG. 7, the multi-chamfered glass base material 50 is introduced into the etching apparatus 300, and is subjected to an etching process with an etching solution containing hydrofluoric acid, hydrochloric acid, and the like. In the etching apparatus 300, the multi-chamfering glass base material 50 is transported by the transport roller, and an etching solution is brought into contact with one or both surfaces of the multi-chamfering glass base material 50 in the etching chamber, whereby the multi-chamfering glass base material 50 is contacted. An etching process for 50 is performed. In addition, since a cleaning chamber for washing away the etchant adhering to the multi-surface glass base material 50 is provided in the subsequent stage of the etching chamber in the etching apparatus 300, the multi-surface glass base material 50 is removed from the etchant. In this state, it is discharged from the etching apparatus 300.

As an example of a method of bringing the etching solution into contact with the multi-chamfering glass base material 50, as shown in FIG. 8A, the etching solution is applied to the multi-chamfering glass base material 50 in each etching chamber 302 of the etching apparatus 300. Spray etching for spraying. Further, instead of spray etching, as shown in FIG. 8 (B), in the overflow type etching chamber 304, a configuration is adopted in which the glass substrate 50 for multi-cavity is conveyed while being in contact with the overflowed etching solution. Is also possible.

Furthermore, as shown in FIG. 8 (C), dip type etching is employed in which one or a plurality of multi-surface glass base materials 50 stored in a carrier are immersed in an etching tank 306 in which an etching solution is stored. It is also possible to do.

In any case, it is important that the shape cutting planned line penetrates in the thickness direction during the etching process and the multi-chamfer glass base material 50 is not divided. For this reason, during the etching process (particularly in the latter half of the etching process), it is necessary to slow the etching rate and accurately control the etching amount. In this embodiment, the etching process proceeds at a slow rate of 3 μm / min or less with a thin hydrofluoric acid of 2% by weight or less, but is not limited to this method.

If the etching rate is not slowed down in the whole etching process but is gradually increased while initially adopting a faster etching rate, it is possible to shorten the etching process time. For example, a configuration in which the hydrofluoric acid concentration in the etching solution is lowered as the process proceeds to the subsequent stage of the etching apparatus 300 may be employed.

When the multi-chamfer glass base material 50 passes through the etching apparatus 300, the modified line 20 is etched. In the reforming line 20, the etching solution penetrates faster than other portions, and the glass is melted along this line, so that the color filter substrate can be easily cut by the reforming line 20. Further, even if a scratch or the like is generated at the time of laser irradiation, the scratch is easily lost.

When the etching process is completed, the affixed etching resistant film 16 is peeled off. Subsequently, as shown in FIGS. 9 (A) to 9 (C), a region facing the electrode terminal portion 122 of the array substrate 12 in the color filter substrate 14 is removed from the multi-chamfer glass base material 50. The process of forming the terminal part cutting groove 30 is performed. In this embodiment, the scribe wheel (wheel cutter) 250 forms the terminal portion cutting groove 30 inside the region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12. The terminal portion cutting groove 30 is formed along a terminal portion cutting planned line in order to remove a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12.

When the formation of the terminal part cutting groove 30 by the scribe wheel 250 is finished, the process proceeds to the division of the multi-chamfer glass base material 50 and the removal of the region facing the electrode terminal part 122. In the multi-chamfer glass base material 50, the modified line 20 is formed by laser filament processing, and the modified line is further etched to modify the multi-chamfer glass base material 50 with a slight mechanical pressure. The quality line 20 can be divided. For example, as shown in FIG. 10, the multi-chamfering glass base material 50 is soiled by applying a minute pressing force or pulling force to the multi-chamfering glass base material 50 or applying microscopic ultrasonic vibration. It is possible to divide without.

Since the etching process does not completely cut it, it is possible to prevent the occurrence of a problem such that the end faces of the liquid crystal panel 10 separated during the etching collide with each other and are damaged. Further, the multi-chamfered glass base material 50 in an incompletely cut state after the etching process can be transported as it is (in a large format). Furthermore, since the etching solution does not reach the electrode terminal portion, it is not necessary to protect the electrode terminal portion with a masking agent having etching resistance. In addition, since at least the central portion of the end face of the liquid crystal panel 10 is etched, the strength (for example, bending strength) of the liquid crystal panel is higher than when cutting is performed only by laser processing.

FIG. 11A to FIG. 11C show a schematic configuration of the liquid crystal panel 10 after the division. As shown in the figure, the end surface of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper width (L1 to L4 in FIG. 11C) generated on each end face of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm is 50 μm or less (mostly 20 to 35 μm).

As described above, when the liquid crystal panel 10 is manufactured, the influence of side etching hardly occurs. Therefore, it is possible to design the glass substrate 50 for multi-sided drawing in which the liquid crystal panels 10 are arranged close to each other. For example, if there are gaps of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the glass substrate for multi-face 50 into a single liquid crystal panel 10.

The description of the above-described embodiment is an example in all respects, and should be considered as not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

10-liquid crystal panel 12-array substrate 14-color filter substrate 16-etching resistant film 17-transparent thin film 20-modified line 30-terminal cutting groove 50-multiple glass substrate 100-smartphone 122-electrode terminal 250-scribing wheel 300-etching apparatus 302, 304-etching chamber 306-etching tank

Claims

A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass substrate for multi-cavity for multi-planarizing a liquid crystal panel in which an array substrate and a color filter substrate are arranged opposite to each other with an intermediate layer interposed therebetween,
The property of being easily etched into the multi-chamfering glass base material along the shape cutting planned line by irradiating laser light along the pre-cutting line corresponding to the shape of the liquid crystal panel in the multi-faced glass base material A laser irradiation step for forming a modified line of
For the color filter substrate, a scribe groove forming step of forming a scribe groove along a terminal portion region cutting planned line for removing a region facing the electrode terminal portion of the array substrate in the color filter substrate;
Including at least
The laser irradiation step includes a normal operation mode when irradiating a laser beam to a position not adjacent to the electrode terminal portion and a condensing region adjustment mode when irradiating the laser beam to a position adjacent to the electrode terminal portion. Including
In the condensing region adjustment mode, the condensing region is adjusted so that the condensing region does not reach the intermediate layer.
2. The method of manufacturing a liquid crystal panel according to claim 1, further comprising an etching step of etching the modified line by bringing the glass substrate for multi-cavity contact with an etching solution.